JP2019111064A - Game machine - Google Patents

Abstract

To provide a game machine with a suitable board case.SOLUTION: A game machine includes a board case 210 capable of accommodating performance control boards 201, 211 on which a performance control CPU 120 and a ROM 121 are mounted as electronic components. An ejector pin mark 240A among a plurality of ejector pin marks 240A, 240B are formed in a state where a plurality of heat radiation holes 220 are aligned in the horizontal and vertical directions in a cover member 213. In a specific area Z1, more ejector pin marks 240A are provided than in a non-specific area Z2.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a gaming machine capable of playing a game.

In slot machines and pachinko gaming machines represented by gaming machines, for example, there are machines provided with a substrate case capable of housing a circuit board on which electronic components are mounted.

In this type of substrate case, a plurality of heat dissipation holes for discharging the heat in the substrate case to the outside are formed (see, for example, Patent Document 1).

JP 2008-173340 A

In the substrate case provided in the gaming machine described in Patent Document 1, there is room for improvement in the structure related to the heat radiation holes.

The present invention has been made in view of such problems, and it is an object of the present invention to provide a gaming machine provided with a suitable substrate case.

In order to solve the above problems, the gaming machine of means 1 of the present invention is
A gaming machine capable of playing a game (for example, slot machine 1A or pachinko gaming machine 1B),
A substrate case (eg, substrate case 200, 210) capable of housing a circuit board (eg, effect control substrate 201, 211) on which electronic components (eg, effect control CPU 120, ROM 121, etc.) are mounted;
The substrate case is provided with ejector pin marks (e.g., ejector pin marks 240A, 240B) generated when the resin molded product is released from the mold.
In a specific area of the substrate case, a plurality of heat dissipation holes are provided in alignment,
The ejector pin marks of a number greater than that of the specific area are provided (for example, a plurality of heat radiation holes in the cover member 213 for the ejector pin marks 240A among the plurality of ejector pin marks 240A and 240B) The eight 220 are provided in the specific area Z1 formed in a state of being aligned in the horizontal and vertical directions, and three in the non-specific area Z2. That is, the specific area Z1 has more than the non-specific area Z2 The number of ejector pin marks 240A is provided as shown in FIG.
It is characterized by
According to this feature, since it becomes easy to apply an equal force to the specific area which is weakened by the plurality of heat radiation holes, it is possible to suppress the breakage when removing the resin molded product from the mold.

The gaming machine according to means 2 of the present invention is the gaming machine according to means 1;
The substrate case is formed of a transparent synthetic resin material, and a gate mark produced by injection molding is provided on the inner surface side (for example, the gate mark 230A, 230B is injected with the synthetic resin material dissolved during molding) It is a trace formed in a portion, and as shown in FIG. 5, it protrudes inward in a portion corresponding to the recess 231A in the recess 231A formed on the outer surface 213S on the side to which the synthetic resin material is injected and the inner surface 213N. And the convex part 231B formed in this way.)
It is characterized by
According to this feature, it is possible to suppress that the dust or the like adheres to the gate mark and the visibility is disturbed.

The gaming machine according to means 3 of the present invention is the gaming machine according to means 1 or 2, wherein
The substrate case is formed of a transparent synthetic resin material.
The ejector pin marks are provided on the inner surface side (for example, the inner surface 213 of the cover member 213).
A plurality of ejector pin marks 240A and 240B formed by contact of ejector pins (see FIG. 6) for separating the resin molded product from the mold during molding are formed in N. )
It is characterized by
According to this feature, heat can be dissipated suitably.

The gaming machine of means 4 of the present invention is the gaming machine according to any one of means 1 to 3, and
The ejector pin mark is provided at a position separated by a predetermined distance from each of the heat dissipation holes arranged around the plurality of heat dissipation holes (for example, the diameter is R11 (for example, about 10 mm)
The ejector pin mark 240A consisting of the concave portion is formed at a position separated by the same distance from each of the four heat dissipation holes 220 arranged around the plurality of heat dissipation holes 220, for example, in a region surrounded by the four heat dissipation holes 220 It is done. See Figure 4)
It is characterized by
According to this feature, since it becomes easy to apply force evenly, it is possible to suppress damage when removing the resin molded product from the mold.

The gaming machine according to means 5 of the present invention is the gaming machine according to any one of means 1 to 4, and
A plurality of ejector pin marks are provided,
At least one ejector pin mark has a size different from that of the other ejector pin marks (for example, in the specific area Z1, the ejector pin having a small diameter of the projecting surface is not a plurality of heat radiation holes 220 (eg, four heat radiation points) In order to set the region surrounded by the hole 220), an ejector pin mark 240A consisting of a recess having a diameter of R11 (for example, about 10 mm) is formed, and for the nonspecific region Z2, the diameter of the protrusion surface is R12 (for example, In order to set an ejector pin of about 15 mm), ejector pin marks 240B consisting of recesses having a diameter of R12 (for example, about 15 mm) are formed at a plurality of locations in the non-specific area Z2.
It is characterized by
According to this feature, the resin molded product can be pushed out with a suitable force depending on the part.
The damage at the time of removing a resin molded product from a metal mold | die can be suppressed.

A gaming machine according to means 6 of the present invention is the gaming machine according to any one of means 1 to 5, wherein
In the substrate case, a heat dissipation hole (for example, a heat dissipation hole 220) communicating with an inner surface (for example, the inner surface 213N) of the substrate case and an outer surface (for example, the outer surface 213S) is formed.
The opening (for example, the first opening 220A) on the inner surface side of the substrate case in the heat dissipation hole is larger than the opening (for example, the second opening 220B) on the outer surface side (R1> R2, see FIG. 5)
It is characterized by
According to this feature, when the opening on the inner surface side of the heat dissipation hole is larger than the opening on the outer surface side, the volume in the substrate case increases and the hot air easily flows in the substrate case, thereby enhancing the heat dissipation effect.

The present invention may have only the invention specific matters described in the claims of the present invention, and the configuration other than the invention specific matters together with the invention specific matters described in the claims of the present invention You may have.

(A) A schematic perspective view showing a slot machine provided with a substrate case as an embodiment of the present invention, (B) is a schematic perspective view showing a pachinko gaming machine provided with a substrate case as an embodiment of the present invention. It is a disassembled perspective view which shows the state which looked at the structure of the production control board case of FIG. 1 (A) from diagonally back. It is a disassembled perspective view which shows the state which looked at the structure of the production control board case of FIG. 1 (B) from diagonally back. It is a rear view which shows a cover member. It is AA sectional drawing of FIG. (A)-(C) are schematic explanatory drawings which show the formation process of a cover member.

  A mode for carrying out a gaming machine according to the present invention will be described below based on an embodiment.

An embodiment of a gaming machine to which the present invention is applied will be described with reference to the drawings. 1A is a schematic perspective view showing a slot machine provided with a substrate case as an embodiment of the present invention, and FIG. 1B is a schematic perspective view showing a pachinko gaming machine provided with a substrate case as an embodiment of the present invention. is there. still,
In the following, the lower left in FIGS. 1A and 1B is the front (front, front) side of the gaming machine, the upper right is the rear (back) side, and the upper and lower sides of the gaming machine viewed from the front Description will be made with reference to the left and right direction. The front side of the gaming machine in the present embodiment is the opposing side facing the player who plays the game on the gaming machine.

As shown in FIG. 1A, a slot machine 1A, which is an example of a gaming machine, has a housing 2 with an open front and an open / close door 3 capable of opening and closing the front opening of the housing 2. Further, the slot machine 1A is provided with a locking device (not shown) so that the open / close door 3 can not be opened unless it is unlocked by a key owned by a salesclerk of the game arcade or the like.

In a space surrounded by the housing 2 and the open / close door 3, a game control means (for example, a game control CPU etc.) for controlling a game and a memory means (for example, memory means capable of storing data used by the game control means) , A game control board case (not shown) containing a game control board (not shown) on which a ROM, a RAM, etc.) is mounted, and effect control means (for example, for effect control) for controlling effects related to a game Storage means (eg, CPU) that can store data used by the effect control means
A presentation control substrate case 200 (abbreviated as a substrate case 200) in which a presentation control substrate 201 having a ROM, a RAM, etc. mounted thereon is accommodated is provided.

That is, in the state where the slot machine 1A is installed on the game island (not shown) of the game arcade, the game control board case (not shown) and the substrate case 200 are touched or removed unless the door 3 is opened. It is prepared to be unable to do.

In addition, the slot machine 1A is capable of identifying a plurality of types of identification information (for example, symbols).
After the variable display unit is variably displayed, the display result is derived by stopping the variable display of the variable display unit, and a winning is made according to the display result (for example, a big bonus It is possible to generate prizes and small part winnings.

As shown in FIG. 1B, a pachinko gaming machine 1B, which is another example of a gaming machine, has an outer frame 12 formed in a square frame shape and a game machine frame capable of opening and closing the front opening of the outer frame 12. 13 and gaming machine frame 13
And an open / close door 14 capable of opening and closing the front of the door. Further, the pachinko gaming machine 1B is provided with a locking device (not shown) so that the gaming machine frame 13 and the open / close door 14 can not be opened unless the unlocking operation is performed by a key owned by a salesclerk of the game arcade.

On the back side of the gaming machine frame 13, gaming control means for controlling gaming (for example, a gaming control CP
Storage means (eg, ROM, RA, etc.) capable of storing data used by the game control means
A game control board case (not shown) in which a game control board (not shown) on which M etc. is mounted is housed, and a production control means (for example, CPU for production control etc.) for controlling effects related to the game And a presentation control substrate case 210 (abbreviated as a substrate case 210) containing a presentation control substrate 211 mounted with storage means (for example, ROM, RAM, etc.) capable of storing data used by the presentation control means. It is done.

That is, in the state where the pachinko gaming machine 1B is installed on the gaming island (not shown) of the game arcade, the gaming machine frame 13 and the opening / closing door 1 can be used.
It is prepared so that it can not be touched or removed unless the 4 is opened.

The pachinko gaming machine 1B is a gaming machine capable of providing a value based on the fact that the gaming ball is fired in the gaming area and the gaming ball is won in the winning area provided in the gaming area, for example, the gaming ball Performs variable display by passing through the start area, and an advantageous state (for example, a big hit gaming state, etc.) that is advantageous for the player based on the display result of the variable display becoming a specific display result.
Is controllable.

In addition, "variable display device" which performs variable display of symbols such as "reel" and "liquid crystal display device" in slot machine 1A, and "gaming area" in which gaming balls in pachinko gaming machine 1B can flow
The “variable display device” that performs variable display of special symbols and effect symbols is considered as a gaming unit in which a game is played.

(Board case)
Next, the structure of the substrate case 200 will be described based on FIG. FIG. 2 is a block diagram of FIG.
It is the disassembled perspective view which shows the state which looked at the structure of the presentation control board case of 3) from diagonally back.

As shown in FIG. 2, the substrate case 200 includes a base member 202 (first member) and a cover member 203 (second member), and the base member 202 and the cover member 203 are formed by injection molding (molding) A transparent thermoplastic synthetic resin molded article formed by The base member 202 can cover the front side of the effect control board 201, and the cover member 203 can cover the back side of the effect control board 201, and is assembled so as to hold the effect control board 201 from the front and rear .

The effect control board 201 is composed of a first board 201A, and a second board 201B and a third board 201C connected to the first board 201A. A plurality of electronic components including the effect control CPU 120 are mounted on the back of the first substrate 201A, and an R on the back of the second substrate 201B.
A plurality of electronic components including the OM 121 are mounted, and a plurality of electronic components including a connector connectable to the effect display device are mounted on the back surface of the third substrate 201C.

The first substrate 201A, the second substrate 201B, the third substrate 201C, and the effect control substrate 20
The fan 204 for air cooling 1 is attached to the back surface of the cover member 203 via a screw, and the cover member 203 to which these are attached is assembled to the base member 202 via the screw, so that the inside of the substrate case 200 is formed. Housed in

Next, the structure of the substrate case 210 will be described based on FIG. FIG. 3 is a block diagram of FIG.
It is the disassembled perspective view which shows the state which looked at the structure of the presentation control board case of 3) from diagonally back.

As shown in FIG. 3, the substrate case 210 is composed of a base member 212 (first member) and a cover member 213 (second member), and the base member 212 and the cover member 213 are formed by injection molding (molding) A transparent thermoplastic synthetic resin molded article formed by The base member 212 can cover the front side of the effect control board 211, and the cover member 213 can cover the back side of the effect control board 201, and is assembled so as to hold the effect control board 211 from the front and rear .

The effect control board 211 is composed of a first board 211A and a second board 211B connected to the first board 211A. A plurality of electronic components including the effect control CPU 120 are mounted on the back of the first substrate 211A, and a plurality of electronic components including the ROM 121 are mounted on the back of the second substrate 211B.

The first substrate 211A and the second substrate 211B are attached to the back surface of the cover member 213 via a screw, and the cover member 213 to which these are attached is assembled to the base member 212 via the screw, so that the substrate case 210 is assembled. It is housed inside.

In the substrate case 200, 210 thus configured, the base member 202, 212 and the cover member 203, 213 are assembled with a one-way screw or a locking member while the effect control substrate 201, 211 is stored, or the base The members 202 and 212 and the cover members 203 and 21
In the state where 3 and are assembled, the seal seal is applied so as to straddle the base members 202 and 212 and the cover members 203 and 213, or the like, so that when opened, the seal remains in the sealed state. Can be used to control the CPU 120 and ROM 12 for effect control.
It is possible to prevent fraudulent acts on electronic parts related to control related to games such as 1).

Next, details of the cover member 213 of the substrate case 210 provided in the pachinko gaming machine 1B will be described based on FIGS. 4 and 5. FIG. 4 is a rear view showing the cover member. FIG. 5 is a cross-sectional view taken along line A-A of FIG. The substrate case 20 provided in the slot machine 1A
As for the cover member 203 of 0, although the shape is different from the cover member 213 of the substrate case 210 provided in the pachinko gaming machine 1B, the forming method and the basic configuration are almost the same as the cover member 213. The explanation will be omitted. In addition, the board case 200 provided in the slot machine 1A may be provided in the pachinko gaming machine 1B, or the pachinko gaming machine 1
The substrate case 210 provided in B may be provided in the slot machine 1A.

As shown in FIG. 4, a specific area Z1 of the cover member 213 (an area surrounded by a two-dot chain line in the figure)
A plurality of heat radiation holes 220 for exhausting the hot air released from the electronic components such as the CPU 120 for effect control are formed in a state of being aligned in the horizontal and vertical directions. Specifically, the radiation hole 2
20 are formed at predetermined intervals in the left-right direction (for example, every about 10 mm), and 12 heat radiation hole groups are formed in the vertical direction at predetermined intervals (for example, every about 10 mm) There are 84 (12 × 7 = 84) in total. The number of heat radiation holes 220 formed is arbitrary and can be changed variously. Since the specific area Z1 is an area including a portion corresponding to the effect control CPU 120 in the first substrate 211A, at least a part of the plurality of heat dissipation holes 220 formed in the specific area Z1 corresponds to the effect control CPU 120 It is formed in the part to be

Each of the heat radiation holes 220 is, as shown in FIG.
And the inner surface 213N of the cover member 213 is in communication with the outer surface 213S so as to penetrate the back wall portion 213A provided substantially parallel to the above. Further, the first opening 220A on the inner surface 213N side and the second opening 220B on the outer surface 213S side of the heat dissipation hole 220 are respectively formed circular, and the diameter R1 (for example, R1 = about 4 mm) of the first opening 220A is 2
It is made larger than diameter R2 (for example, R2 = about 2 mm) of opening 220B (R1> R
2).

More specifically, the inner peripheral surface of the heat dissipation hole 220 is provided on the outer surface 213S side with respect to the first tapered surface 221A and the first tapered surface 221A, the diameter gradually decreasing from the inner surface 213N to the outer surface 213S side. And a second tapered surface 221B having a gradually smaller diameter toward the side.
The first tapered surface 221A is formed to be substantially R-shaped in a longitudinal sectional view of the heat dissipation hole 220, and the second tapered surface 221B is formed to have a substantially linear shape in a longitudinal cross-sectional view of the heat dissipation hole 220. It is done. As described above, the inner peripheral surface of the heat dissipation hole 220 is formed in a tapered shape whose diameter gradually decreases from the inner surface 213N to the outer surface 213S.

Also, a second tapered surface 221 with respect to a perpendicular T perpendicular to the inner surface 213N and the outer surface 213S.
The inclination angle θ2 of B is, for example, an angle (for example, 1 to 2 degrees) larger than an angle (for example, 1 to 2 degrees) generally provided as a draft angle necessary for separating the resin molded product from the mold And the inclination angle θ2 = about 10 degrees). The inner surface 213N and the outer surface 213S
The inclination angle θ1 of the tangent passing through the approximate center position in the thickness direction of the first tapered surface 221A with respect to the perpendicular T perpendicular to the vertical axis is set to be larger (eg, θ1 = approximately 33 degrees) than the inclination angle θ2 (θ1) > Θ 2). As described above, the inner peripheral surface of the heat dissipation hole 220 is constituted by the first tapered surface 221A and the second tapered surface 221B which are different in inclination angle with respect to the perpendicular T, respectively.

Also, the back wall portion 213A and the side wall portion 213 in the non-specific region Z2 different from the specific region Z1
A plurality of slit-shaped heat radiation ports 250 that are open from the back wall portion 213A to the side wall portion 213B are formed at predetermined positions of the corner portions with B. The opening area of these heat radiation ports 250 is the heat radiation hole 22
Larger than 0 opening area.

Thus, the first opening 2 on the inner surface 213 N of each of the heat dissipation holes 220 formed in the specific region Z 1
20A is larger in diameter than the second opening 220B on the outer surface 213S side, the substrate case 210
Since the internal volume increases and hot air easily flows in the substrate case 210, the heat radiation effect is enhanced. In addition, the first tapered surface 221A adjacent to the first opening 220A is formed as a curved surface having a substantially R shape in cross section, so that the heat air stagnating in the substrate case 210 is smoothed in the respective heat radiation holes 220. The heat dissipation effect is enhanced.

Further, the gate mark 230A is formed at the upper vicinity position of the specific area Z1 in the non-specific area Z2 different from the specific area Z1, and the gate mark 230B is formed at the lower position of the specific area Z1 in the non-specific area Z2. It is done. The linear distance L2 from the specific area Z1 to the gate mark 230B is longer than the linear distance L1 from the specific area Z1 to the gate mark 230A (L1 <L2). That is, the gate mark 230A and the gate mark 230B are provided separately in the upper and lower portions of the cover member 213, and one of the gate marks 2A and 2B is provided.
30A is provided closer to the specific region Z1 than the gate mark 230B.

These gate marks 230A and 230B are traces formed on a portion to which a synthetic resin material melted at the time of molding to be described later is injected, and as shown in FIG. 5, the outer surface 213S on the side to which the synthetic resin material is injected. And a convex portion 231B formed to project inward at a portion corresponding to the concave portion 231A in the inner surface 213N. The concave portion 231A and the convex portion 231B are formed in advance by a mold. In addition, the recess 231
Since the protrusion 232 may be formed at the time of mold opening as described later, the protrusion 232 is formed on the outer surface 21 by forming the recess 231A deeper than the protrusion length of the protrusion 232 in advance.
Protruding outward from 3S is prevented.

Further, on the inner surface 213N of the cover member 213, ejector pin marks 2 formed by being pressed by an ejector pin (see FIG. 6) in order to separate the resin molded product from the mold.
A plurality of 40A and 240B are formed. The ejector pin is set to a part where the mold release resistance (resistance when peeling the product from the mold) is large when the resin molded part is released from the mold, but the fragile part is not damaged by the load applied. As described above, it is preferable that a large number of ejector pins with the largest diameter of the projecting surface be disposed to disperse the load.

However, in the specific region Z1 where the plurality of heat dissipation holes 220 are formed or in a portion where the wall portion is narrow, there is a limit in increasing the diameter of the protruding surface. For example, in the specific region Z1, the ejector with a small diameter of the protruding surface In order to set the pins to a plurality of locations where the heat dissipation holes 220 do not exist (for example, a region surrounded by the four heat dissipation holes 220), the diameter is R11 (for example, about 10 mm)
The ejector pin mark 240A which consists of a recessed part is formed. Ejector pin mark 2
40A is arranged at the same distance from each of the surrounding four heat radiation holes 220.

On the other hand, as in the specific area Z1, the non-specific area Z2 or the like having high strength without the heat dissipation holes 220,
The diameter R of the ejection surface is larger than the diameter R of the ejector pin (for example, about 10 mm)
A plurality of 12 (for example, about 15 mm) ejector pins (R11 <R12) are arranged at wide intervals. Therefore, the diameter of the protruding surface is R12 (for example, about 1) for the non-specific region Z2 having relatively high strength as compared with the specific region Z1 where the plurality of heat dissipation holes 220 are formed and the region where the wall portion is narrow.
In order to set an ejector pin of 5 mm), the diameter is R at a plurality of locations in the non-specific area Z2.
The ejector pin mark 240B which consists of a recessed part of 12 (for example, about 15 mm) is formed.

Of the plurality of ejector pin marks 240A and 240B, eight ejector pin marks 240A are provided in the specific region Z1 formed in the cover member 213 with the plurality of heat radiation holes 220 aligned in the left, right, up, and down directions, Three are provided in the nonspecific region Z2.
That is, the number of ejector pin marks 240A in the specific area Z1 is larger than that of the nonspecific area Z2.
Is provided.

(Method of forming cover member)
Next, the forming process of the cover member 213 will be described based on FIG. Figure 6 (A
]-(C) is a schematic explanatory drawing which shows the formation process of a cover member. Incidentally, in FIG.
03 is illustrated in a schematic shape.

As shown in FIG. 6A, the cover member 213 is filled with a synthetic resin material and cooled in a molded portion 303 formed when the first mold 301 and the second mold 302 are combined. It is molded. Specifically, the molding portion 303 is formed between the convex portion 301A of the first mold 301 and the concave portion 302A of the second mold 302, and the convex portion 301A molds the inner surface of the cover member 213.
01 B shapes the outer surface of the cover member 213.

Further, as shown in the enlarged view in FIG. 6A, the gate 305 in the first mold 301 is
A recess 306B is formed in the portion corresponding to. Since it is easy to cool the vicinity of the nozzle which is the tip of the ejection part, when injecting the resin material from the nozzle at the tip of the ejection part, the temperature of the resin material in the vicinity of the nozzle is low and it is difficult to flow into the molding part 303. By retaining the resin material flowing in at the stage in the concave portion 306B, the resin material having a high temperature can be widely spread in the molding portion 303. And the cover member 2 which is a resin molded product is formed by the concave portion 306B.
Thirteen convex portions 231B are formed. In addition, a plurality of convex portions 307 formed in a columnar shape that gradually tapers toward the tip end are provided in the convex portion 301A of the first mold 301. This convex portion 30
7, the heat radiation holes 220 of the cover member 213 which is a resin molded product are formed. Further, although not particularly illustrated, a plurality of convex portions different from the convex portions 307 are also provided in a protruding manner, and the heat dissipation ports 250 of the cover member 213 which is a resin molded product are formed by the convex portions.

Furthermore, in the first mold 301, the diameter of the protruding surface is R11 (for example, about 10 mm) and R
An ejector mechanism is provided having two types of cylindrical ejector pins 308 (the difference in diameter is not shown) 12 (e.g., about 15 mm). The plurality of ejector pins 308 are provided such that the base end protrudes on the ejector plate 309, and the protruding surface of the tip passes through the convex portion 301A to face the forming portion 303 to constitute a part of the inner surface. The ejector plate 310 is pushed out to the second mold 302 side by the ejector rod 310 so that all the ejector pins 308 can move so as to enter into the forming portion 303. In addition, a portion corresponding to the gate 305 in the concave portion 302A of the second mold 302 is a convex portion 306.
A is formed, and the concave portion 231A of the cover member 213 which is a resin molded product is formed by the convex portion 306A.

When molding the cover member 213 using the first mold 301 and the second mold 302 configured as described above, first, the molding formed between the first mold 301 and the second mold 302 is performed. Part 303
Into the inside, the melted synthetic resin material is injected and filled by an injection unit (not shown). The resin material injected from the nozzle of the injection unit passes through the pipe line 304 (spool) in the second mold 302, branches further, and flows into the forming unit 303 from the two gates 305 (injection units).

Then, after injecting the resin material, the resin material is cooled and cooled, and then, as shown in FIG. 6B, the gate 305 is opened by opening the first mold 301 and the second mold 302. Forming unit 30
It is separated from 3. With this separation, the resin material and the molding portion 30 hardened in the conduit 304
Since the resin material hardened in 3 is torn off, the protrusion 232 (so-called burr) may be formed in the recess 231A, but the protrusion 232 is accommodated in the recess 231A, so that the protrusion 2 is formed.
32 is prevented from protruding outward from the outer surface 213S.

The resin molded product shrinks when it is cooled by cooling, so it is relatively easily released from the second mold 302 when the mold is opened, but the convex portion 301A of the first mold 301 is deformed by the force of the shrinkage. The ejector plate 310 is pushed toward the second mold 302 by the ejector rod 310 and the resin molded product is ejected by the plurality of ejector pins 308 so as to be released from the first mold 301. Here, ejector pin marks 240A and 240B are formed on portions corresponding to the ejector pins 308 on the inner surface 213N of the cover member 213 which is a resin molded product, that is, portions pressed by the ejector pins 308. Then, a spool etc. are cut as a finishing process, and one shaping | molding process is complete | finished by taking out a resin molded product.

As described above, in the gaming machine as the embodiment of the present invention, the substrate case 210 (200 that can accommodate the effect control boards 201 and 211 on which the effect control CPU 120 and the ROM 121 as electronic components are mounted. And the substrate case 21 is
A heat radiation hole 220 communicating with the inner surface 213N of 0 and the outer surface 213S is formed, and the first opening 220A on the inner surface side of the substrate case in the heat radiation hole 220 is larger than the second opening 220B on the outer surface side
R1> R2, see FIG. 5).

By doing this, the first opening 220A on the inner surface side of the heat radiation hole 220 is larger than the second opening 220B on the outer surface side, so the volume in the substrate case 210 increases and hot air flows in the substrate case 210. Because it is easy to do, the heat dissipation effect is enhanced. In addition, the heat dissipation hole 220 has a tapered portion (a first tapered surface 221A, a second tapered surface 221B, etc.) whose opening gradually decreases from the inner surface 213N to the outer surface 213S of the substrate case 210. Because the hot air easily enters the heat dissipation holes 220 smoothly, heat can be dissipated suitably.

Furthermore, the diameters R1 and R2 of the first opening 220A on the inner surface side of the heat dissipation hole 220 and the second opening 220B on the outer surface side are substantially the same (R1 = R2), or the diameter R1 of the first opening 220A on the inner surface is the outer surface side In the case where the diameter is smaller than the diameter R2 of the second opening 220B (R1 <R2), foreign matter such as a wire is less likely to enter from the outside of the substrate case 210, so tampering with the electronic component can be suitably suppressed.

Further, the first opening 220A on the inner surface 213N side of the substrate case 210 and the second opening 220B on the outer surface 213S side of the heat dissipation hole 220 are circular. By doing this, the radiation hole 22
Since hot air enters from the periphery of 0 substantially uniformly, it is possible to dissipate heat suitably.

In addition, since a plurality of heat dissipation holes 220 are provided in an aligned state, heat dissipation can be suitably achieved, and since the strength of the entire specific region Z1 can be made uniform, local strength reduction can be suppressed. .

In addition, the heat dissipation holes 220 are for effect control C that performs control related to the game in the specific area Z1.
The heat air released from the effect control CPU 120 can be efficiently dissipated at a close position because the heat air is provided at a portion corresponding to the PU 120.

Moreover, although the form by which the thermal radiation hole 220 was provided in the part corresponding to CPU120 for presentation control in the specific area Z1 was illustrated in the present Example, this invention is not limited to this, It is related to a game It may be provided in a portion different from the portion corresponding to the effect control CPU 120 as effect means for controlling, and the ROM 121 as storage means capable of storing data used by the effect control CPU 120. By doing this, the effect control C from the heat dissipation hole 220
Since the PU 120 and the ROM 121 can be kept away, foreign matter such as a wire can be made to enter from the heat radiation hole 220 without opening the substrate case 210 and the CPU 120 or ROM 1 for effect control
It is possible to suppress fraudulent acts such as modifying 21 illegally.

In addition, ejector pin marks 240A and 240B provided on the portion with which the projecting surface of the ejector pin 308 abuts when the resin molded product is released from the mold are provided on the inner surface 213N of the substrate case 210. By doing so, damage at the time of removing the resin molded product from the mold can be suppressed.

Further, the cover member 213 is provided with ejector pin marks 240A and 240B at the portion where the projecting surface of the ejector pin 308 abuts when the resin molded product is released from the mold.
The specific region Z1 is provided with the plurality of heat radiation holes 220 aligned, and is provided with ejector pin marks 240A in a number greater than that of the non-specific region Z2 different from the specific region Z1. By so doing, it becomes easy to apply an equal force to the specific region Z1 that is weakened by the plurality of heat dissipation holes 220, so it is possible to suppress damage when removing the resin molded product from the mold.

Further, in the gaming machine as the present embodiment of the present invention, the CPU 12 for effect control as an electronic component.
A substrate case 210 (200) capable of storing effect control substrates 201 and 211 on which 0, ROM 121, etc. are mounted, and provided in a specific area Z1 of the substrate case 210 with a plurality of heat dissipation holes 220 aligned In the vicinity of the specific area Z1, a gate mark 230A produced by injection molding is formed. In this way, the resin material is injected from the vicinity of the heat release hole 220, and therefore, the inflow of the resin material is resisted by projecting the plurality of convex portions 307 forming the heat release hole 220 at the time of molding. Also in the specific region Z1, the resin material can be widely spread, so that it is possible to prevent the strength from being lowered because the resin material does not well spread around the respective heat radiation holes 220 at the time of molding.

Further, in the present embodiment, the form in which the gate mark 230A is provided in the vicinity of the specific region Z1 is exemplified, but the present invention is not limited to this, and the gate mark 230A is provided in the specific region Z1. It is also good. Even in this case, since the resin material is injected from the vicinity of the heat radiation hole 220,
Since the resin material can be widely spread even in the specific region Z1 where resistance to the inflow of the resin material is provided by projecting the plurality of convex portions 307 forming the heat dissipation holes 220 at the time of molding, the resin material at the time of molding However, it is possible to prevent the strength from being lowered due to the plate thickness becoming thin and the like because it does not extend around the respective heat radiation holes 220 properly.

When gate mark 230A is provided in specific area Z1, heat dissipation hole 2 is formed in specific area Z1.
It is preferable that 20 be provided in the part where it does not exist. By doing this, the gate 305 can be secured in the vicinity of the heat dissipation hole 220, and therefore, the resin material can be widely spread. In the case where the gate mark 230A is provided in the specific area Z1, for example, one of the heat dissipation holes 220 surrounded by any four heat dissipation holes 220 among the plurality of heat dissipation holes 220 aligned and arranged is closed Region), and the gate mark 230A may be provided on the wall portion. By doing so, it is possible to preferably suppress damage or the like at the time of release due to a reduction in strength.

Further, in the cover member 213, the concave portion 231A of the gate marks 230A and 230B has an outer surface 213.
By being provided on the S side, even when the protrusion 232 is formed at the time of mold opening, the electronic component in the case is brought into contact and damaged, or the wiring pattern of the effect control substrate 211 is damaged and disconnected. Can be suppressed.

Further, in the present embodiment, the cover member 213 is a recess 231 of the gate marks 230A and 230B.
Although A illustrated the form provided in the outer surface 213S side, this invention is not limited to this, the cover member 213 is formed with a transparent synthetic resin material, and gate mark 230A, 230B
The concave portion 231A may be provided on the inner surface 213N side. That is, at the time of molding, the conduit 304 may be formed from the first mold 301 side toward the molding portion 303, and the resin material may be injected from the inner surface 213N side. In this way, it is possible to prevent dust and the like from adhering to the concave portions 231A of the gate marks 230A and 230B and preventing the visibility when checking the substrate and the electronic component provided from the outside of the substrate case 210 inside. Since this can be performed, it is possible to avoid that it becomes difficult to check whether there is a possibility that the electronic component has been tampered with.

Further, the cover member 213 is formed of a transparent synthetic resin material, and the ejector pin marks 240A and 240B generated when the resin molded product is released from the mold are provided on the inner surface 213N side. By doing this, it is possible to suppress that the dust or the like adheres to the concave portions of the ejector pin marks 240A and 240B and the visibility when checking the substrate and the electronic component provided inside from the outside of the substrate case 210 is impeded. Therefore, it can be avoided that it becomes difficult to check whether there is a possibility that the electronic component has been tampered with.

Further, in the gaming machine as the present embodiment of the present invention, the CPU 12 for effect control as an electronic component.
A plurality of board cases 210 (200) capable of storing effect control boards 201 and 211 on which 0, ROM 121, etc. are mounted, and a plurality of ejector pin marks 240A and 240B for the ejector pin marks 240A In the specific area Z1 formed with the heat dissipation holes 220 aligned in the left, right, upper, and lower directions, ejector pin marks 240A in a larger number than the non-specific area Z2 are provided. By doing this, the plurality of heat radiation holes 22
Since it becomes weak by 0 and it becomes easy to apply equal power to specific field Z1 set up to a part corresponding to CPU 120 for production control, the failure at the time of removing a resin-molding article from a metallic mold can be controlled.

In addition, an ejector pin mark 240A consisting of a recess having a diameter of R11 (for example, about 10 mm)
The plurality of heat dissipation holes 220 are formed at positions separated by the same distance from each of the four heat dissipation holes 220 disposed around the periphery, for example, in a region surrounded by the four heat dissipation holes 220. By doing this, it is possible to suppress damage due to a load being concentrated on any of the heat radiation holes 220. Furthermore, as compared with the case where the ejector pin mark 240A is provided between two adjacent heat radiation holes 220, a portion where the ejector pin abuts can be set in a wide space, so the ejection surface of the ejector pin can be made as large as possible.

Moreover, although the form by which the ejector pin mark 240A is formed in the area | region enclosed by the four heat dissipation holes 220 was illustrated in the present Example, this invention is not limited to this, For example,
Of the plurality of aligned heat radiation holes 220, any one of the heat radiation holes 220 surrounded by the other four heat radiation holes 220 is closed to constitute a wall portion, and the ejector pin marks 240A are provided on the wall portion You may By doing so, it is possible to preferably suppress damage or the like at the time of release due to a reduction in strength.

Further, a plurality of ejector pin marks 240A and 240B are provided, and at least one ejector pin mark 240A is different in size from the other ejector pin marks 240B. By doing so, the resin molded product can be extruded with a suitable force according to the part, so that breakage when removing the resin molded product from the mold can be suppressed.

Further, in the present embodiment, the cover member 213 on which the plurality of heat radiation holes 220, the gate marks 230A and 230B, and the ejector pin marks 240A and 240B are formed is made of a transparent synthetic resin material, thereby making the substrate case Even without opening, the gate marks 230A and 230B and the ejector pin marks 240A and 240B can be visually recognized from the outside of the substrate case. That is, since the gate marks 230A and 230B and the ejector pin marks 240A and 240B function as mark portions, for example, the arrangement pattern of the heat radiation holes 220 and the gate marks 230A and 230B and the arrangement pattern of the ejector pin marks 240A and 240B are registered in advance. If the board case is turned back to the illegally forged board case, the arrangement pattern of the heat radiation holes, gate marks and ejector pin marks is checked in comparison with the registered pattern. It becomes possible to specify whether or not it has been turned to a forged board case.

Although the embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to these embodiments, and any changes or additions can be made without departing from the scope of the present invention. Needless to say.

For example, although the form to which substrate cases 200 and 210 which can store effect control substrates 201 and 211 are applied is illustrated as an example of a substrate case in the above-mentioned example, the present invention is not limited to this but a game The present invention can also be applied to a substrate case capable of housing another circuit substrate such as a control substrate or a payout control substrate.

In the above embodiment, the heat dissipation hole 220 has a substantially circular shape in cross section, but the present invention is not limited to this, and the first opening on the inner surface side of the heat dissipation hole and the first opening on the outer surface side The shape of the two openings is not limited to a circle, and can be arbitrarily changed. Further, the shapes of the first opening on the inner surface side and the second opening on the outer surface side may not necessarily be similar.

Further, in the above embodiment, in the substrate case 210, the first opening 220A on the inner side is larger than the second opening 220B on the outer side, the gate marks 230A and 230B, and the ejector pin marks 240A and 240B. However, the present invention is not limited to this, as long as the first opening 220A on the inner surface side is provided with the heat radiation hole 220 larger than the second opening 220B on the outer surface side. The gate marks 230A and 230B and the ejector pin marks 240A and 240B may not be provided. Also, the specific area Z1 or the specific area Z
If gate marks 230A and 230B are provided in the vicinity of 1, the first opening 220A on the inner surface side of the heat dissipation hole 220 may not be larger than the second opening 220B on the outer surface side, and ejector pin marks 240A and 240B. May not be provided. In addition, if the number of ejector pin marks 240A in the specific area Z1 is larger than that of the non-specific area Z2, the heat dissipation holes 22 are formed.
The first opening 220A on the inner surface side of 0 may not be larger than the second opening 220B on the outer surface side, and the gate marks 230A and 230B may not be provided.

Further, in the above embodiment, although a plurality of heat radiation holes 220, gate marks 230A and 230B, and ejector pin marks 240A and 240B are formed in the cover members 203 and 213 of the substrate case 200 and 210, the present invention The plurality of heat radiation holes 220, gate marks 230A and 230B, and ejector pin marks 240A and 240B of the present invention are not limited to this.
The present invention may be applied to the base members 202 and 212 of the substrate cases 200 and 210, or
For example, the present invention may be applied to various substrate cases provided on the back side of the pachinko gaming machine 1B, a cover (not shown) that covers devices, and the like.

Further, the gaming machine of the present invention may be an enclosed type pachinko gaming machine, a slot machine or the like which encloses gaming media and gives a score based on the occurrence of a prize.

1A Slot machine 1B Pachinko gaming machine 120 CPU for effect control
121 ROM
200, 210 Effect control substrate case 201 Effect control substrate 220 Heat dissipation holes 230A, 230B Gate marks 240A, 240B Ejector pin marks 305 Gate 308 Ejector pins

Claims (1)

A gaming machine capable of playing games,
A circuit board on which electronic components are mounted can be accommodated, and a substrate case composed of a resin molded product formed by injection molding is provided.
The substrate case is provided with ejector pin marks generated when the resin molded product is released from the mold;
In a specific area of the substrate case, a plurality of heat dissipation holes are provided in alignment,
A game machine characterized in that the number of ejector pin marks is provided greater than the area different from the specific area.

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