JP6861116B2 - 膜厚測定装置、研磨装置、および研磨方法 - Google Patents

膜厚測定装置、研磨装置、および研磨方法 Download PDF

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Publication number
JP6861116B2
JP6861116B2 JP2017138270A JP2017138270A JP6861116B2 JP 6861116 B2 JP6861116 B2 JP 6861116B2 JP 2017138270 A JP2017138270 A JP 2017138270A JP 2017138270 A JP2017138270 A JP 2017138270A JP 6861116 B2 JP6861116 B2 JP 6861116B2
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Japan
Prior art keywords
light receiving
fiber
wafer
light
receiving fiber
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JP2017138270A
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English (en)
Japanese (ja)
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JP2019021748A5 (enExample
JP2019021748A (ja
Inventor
金馬　利文
利文 金馬
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Ebara Corp
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Ebara Corp
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Priority to JP2017138270A priority Critical patent/JP6861116B2/ja
Priority to US16/031,727 priority patent/US10816323B2/en
Publication of JP2019021748A publication Critical patent/JP2019021748A/ja
Publication of JP2019021748A5 publication Critical patent/JP2019021748A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2017138270A 2017-07-14 2017-07-14 膜厚測定装置、研磨装置、および研磨方法 Active JP6861116B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017138270A JP6861116B2 (ja) 2017-07-14 2017-07-14 膜厚測定装置、研磨装置、および研磨方法
US16/031,727 US10816323B2 (en) 2017-07-14 2018-07-10 Film-thickness measuring apparatus, polishing apparatus, and polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017138270A JP6861116B2 (ja) 2017-07-14 2017-07-14 膜厚測定装置、研磨装置、および研磨方法

Publications (3)

Publication Number Publication Date
JP2019021748A JP2019021748A (ja) 2019-02-07
JP2019021748A5 JP2019021748A5 (enExample) 2020-06-18
JP6861116B2 true JP6861116B2 (ja) 2021-04-21

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JP2017138270A Active JP6861116B2 (ja) 2017-07-14 2017-07-14 膜厚測定装置、研磨装置、および研磨方法

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US (1) US10816323B2 (enExample)
JP (1) JP6861116B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102642534B1 (ko) * 2023-09-05 2024-02-29 (주)오로스 테크놀로지 다층 박막 각층의 두께 계측의 정밀도 향상을 위한 처리 장치 및 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置
GB2594980B (en) * 2020-05-14 2025-01-01 Agilent Tech Lda Uk Limited Spectral analysis of a sample
JP7477433B2 (ja) * 2020-11-24 2024-05-01 株式会社荏原製作所 研磨方法
US20220334053A1 (en) * 2021-04-14 2022-10-20 Advanced Growing Resources Inc. Optical spectroscopy scanner

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3506114B2 (ja) * 2000-01-25 2004-03-15 株式会社ニコン モニタ装置及びこのモニタ装置を具えた研磨装置及び研磨方法
JP2002139309A (ja) * 2000-11-02 2002-05-17 Nikon Corp 光学特性測定装置、膜厚測定装置、研磨終点判定装置及び研磨装置
IL145699A (en) * 2001-09-30 2006-12-10 Nova Measuring Instr Ltd Method of thin film characterization
JP5050024B2 (ja) 2009-09-28 2012-10-17 株式会社荏原製作所 基板研磨装置および基板研磨方法
JP5726490B2 (ja) * 2010-11-26 2015-06-03 オリンパス株式会社 光強度測定ユニット、及びそれを備えた顕微鏡
JP5937956B2 (ja) * 2012-11-28 2016-06-22 株式会社堀場製作所 光学分析装置
JP6105371B2 (ja) * 2013-04-25 2017-03-29 株式会社荏原製作所 研磨方法および研磨装置
JP6473050B2 (ja) * 2015-06-05 2019-02-20 株式会社荏原製作所 研磨装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102642534B1 (ko) * 2023-09-05 2024-02-29 (주)오로스 테크놀로지 다층 박막 각층의 두께 계측의 정밀도 향상을 위한 처리 장치 및 방법

Also Published As

Publication number Publication date
US10816323B2 (en) 2020-10-27
US20190017808A1 (en) 2019-01-17
JP2019021748A (ja) 2019-02-07

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