JP6860380B2 - A cooling device for a slip seismic isolation device and a seismic isolation structure equipped with the cooling device. - Google Patents

Description

The present invention relates to a cooling device for a slip seismic isolation device.

A seismic isolation structure that supports a building via a seismic isolation device is known. Seismic isolation devices are roughly classified into isolators made of sliding seismic isolation devices, rolling seismic isolation devices, laminated rubber, etc., and dampers made of oil dampers, steel dampers, lead dampers, etc. Generally, a seismic isolation device excluding an oil damper has a lower base plate and an upper base plate, the lower base plate is installed on a reinforced concrete substructure, and the structure is built on the upper base plate. .. The structure is built separately from the ground by a seismic isolation device, and the shaking of the earthquake is attenuated and transmitted to the structure above the upper base plate, so that damage caused by the earthquake can be suppressed.

A sliding seismic isolation device, which is a type of seismic isolation device, has a sliding plate provided on the lower structure side and a bearing portion provided on the structure side, and the bearing portion slides on the sliding plate in the event of an earthquake. As a result, the shaking of the structure is suppressed. Friction heat is generated when the bearing slides on the sliding plate during an earthquake. In a slip seismic isolation device, the slip plate is generally made of a metal material such as stainless steel, and the bearing is made of a rubber-based material. Therefore, the generated frictional heat moves to the slide plate side with a large heat capacity, and the temperature of the slide plate Rise.

Non-Patent Document 1 reports that the sliding friction coefficient decreases as the temperature of the sliding plate rises. Therefore, there is a risk that a large frictional heat will be generated during repeated sliding due to long-period and long-term seismic motion, the sliding friction coefficient will decrease, the seismic isolation displacement will increase, and a retaining wall collision will occur at the seismic isolation portion. Further, since the support portion is always in contact with the central portion of the sliding plate, heat is not dissipated to the air and the temperature does not easily drop. The larger the bearing diameter, the wider the part of the sliding plate that does not come into contact with the air, but in recent years, the bearings used have become larger and larger as the size of the structure has increased. It takes time to dissipate frictional heat, and when a long-period, long-term earthquake or multiple aftershocks occur at short intervals, the temperature of the sliding plate rises and the sliding friction coefficient decreases, resulting in a predetermined value. There is concern that seismic isolation performance cannot be demonstrated.

Therefore, in the slip seismic isolation device, it is required to prevent the temperature rise of the slip plate during an earthquake. Patent Document 1 proposes a seismic isolation device in which a seismic isolation member having a history damping ability is interposed, and a metal heat-dissipating fin extending outward is provided on the outer periphery of the seismic isolation member. There is. However, the slip seismic isolation device has a small outer peripheral surface, and it is difficult to adopt a configuration in which heat radiation fins similar to the method proposed in Patent Document 1 are provided. Further, since it becomes an obstacle to the sliding of the bearing portion, it is not possible to directly provide a cooling fin, a cooling device such as a liquid cooling chamber, a cooling structure, or the like on the upper surface of the sliding plate.

Japanese Unexamined Patent Publication No. 10-339051

Hiroshi Hibino, 5 others, Force experiment of full-scale seismic isolation member for long-period ground motion using large shaking table Part 14: Examination of similarity of elastic sliding bearing (high friction) full-scale / reduction test, Architectural Institute of Japan Abstracts of Academic Lectures, September 2014, pp. 467-468

An object of the present invention is to provide a cooling device for a slip seismic isolation device.

1. 1. A substrate with a circular opening in the center,
With a plurality of fins erected from the substrate,
A cooling device for a slip seismic isolation device, which comprises.
2. It is characterized in that it can be divided in the horizontal direction. The cooling device described in.
3. 3. The substrate is characterized by having a riding portion on the outer periphery. Or 2. The cooling device described in.
4. A slip seismic isolation device equipped with a bearing and a slip plate,
1. It was placed so that the bearing would fit in the opening. ~ 3. With the cooling device described in any of
Have,
A seismic isolation structure characterized in that a substrate of the cooling device is placed on the sliding plate via thermal paste.
5. 4. The head of the fixing member for fixing the sliding plate is covered with a cover. Seismic isolation structure described in.

The cooling device of the present invention can effectively cool the sliding plate whose temperature has risen during an earthquake. The sliding seismic isolation device provided with the cooling device of the present invention can maintain the seismic isolation performance because the temperature of the sliding plate does not easily rise even in a long-period and long-term earthquake. In addition, since the temperature of the slip plate can be lowered quickly, even if multiple aftershocks occur at short intervals, the slip friction coefficient can be returned to the initial value in a short time and the original seismic isolation performance can be exhibited. it can.
The cooling device that can be divided in the horizontal direction can be installed very easily without any additional work on the existing slip seismic isolation device. The cooling device having a riding portion on the outer periphery can prevent interference with a fixing member such as a bolt that fixes the slip seismic isolation device on the lower structure side. Further, even if the cooling device rotates due to the shaking of the earthquake, the cooling device and the fixing member do not interfere with each other.

By placing the substrate of the cooling device on the sliding plate via the thermal grease, the adhesion between the sliding plate and the substrate is increased, and the frictional heat can be transferred to the cooling device more efficiently. Further, the thermal paste can prevent frictional heat from being generated between the substrate of the cooling device and the sliding plate. By covering the head of the fixing member such as the bolt that fixes the sliding seismic isolation device to the substructure side with a cover, the cooling device floats up due to the shaking caused by a large earthquake and slides off naturally even if it rides on the fixing member. The cooling device and the sliding plate are returned to the contact state, so that cooling can be restarted.

Top view of the cooling device according to one embodiment. A side view of a cooling device according to an embodiment. A perspective view of a cooling device according to an embodiment. A side view of a seismic isolation structure with a cooling device in which a cooling device is installed, which is one embodiment. A perspective view of a seismic isolation structure with a cooling device in which a cooling device is installed, which is one embodiment.

The present invention relates to a cooling device for a slip seismic isolation device having a substrate having a circular opening in the center and a plurality of fins erected from the substrate.
1 to 3 show a top view, a side view, and a perspective view of one embodiment of the cooling device of the present invention.

The cooling device 100 according to one embodiment has a substrate 110, a plurality of fins 120 erected from the substrate 110, and a riding portion 111 on the outer periphery of the substrate 110.
The cooling device is formed of a material having high thermal conductivity, and for example, a metal material such as gold, silver, copper, aluminum, zinc, iron, and various alloys can be preferably used. Among these, copper or aluminum, which has an excellent balance between cost and thermal conductivity, can be particularly preferably used. Further, the cooling device can be composed of a plurality of kinds of metal materials such as copper for the substrate, aluminum for the fins, or copper for some fins and aluminum for the remaining fins.

The substrate 110 has a ring shape in a plan view and has a circular opening 112 in the center. The cooling device 100 is installed so that the support portion of the seismic isolation device can be accommodated in the opening 112. However, even if the support portion and the cooling device slide on the sliding plate in the event of an earthquake, the support portion and the substrate The opening 112 has a larger diameter than the bearing so that the openings 112 do not interfere with each other.
The cooling device 100 according to one embodiment can be divided in the horizontal direction, and two semicircular annular members having the same structure are connected by a connecting member 130. The cooling device 100 according to one embodiment can be installed by simply placing and connecting two semicircular annular members so as to surround the support portion, and it is not necessary to modify the existing sliding seismic isolation device. Therefore, it is easy to install, and even when it is installed in a large number of slip seismic isolation devices, it can be carried out in a short construction period.

The cooling device 100 according to one embodiment has a riding portion 111 on the outer periphery of the substrate 110. The riding portion 111 is located above the substrate 110 in the vertical direction. This will be described in detail below, but when the cooling device slides on the sliding plate during an earthquake, the head of the fixing member such as a bolt that fixes the sliding seismic isolation device to the substructure interferes with the cooling device. This is to prevent.

The fin 120 increases the surface area of the cooling device to improve the cooling efficiency. In one embodiment of the cooling device 100, the fins 120 extend radially around the opening 112. In the cooling device of the present invention, the shape of the fins is not particularly limited, and may be, for example, concentric circles, protrusions, or the like.

The cooling device of the present invention is installed in a slip seismic isolation device.
FIGS. 4 and 5 show side views and perspective views of a seismic isolation structure with a cooling device in which a cooling device according to an embodiment is installed in a sliding seismic isolation device.
The slip seismic isolation device 200 includes a flange (not shown), a support portion 210, a slip plate 220, and a reinforcing plate 230. The flange is located above the support portion 210 and fixes the support portion 210 to the structure side. The sliding plate 220 is a region where the support portion 210 slides in the event of an earthquake, and is fixed to the reinforcing plate 230. The reinforcing plate 230 fixes and reinforces the sliding plate 210, and is fixed to the lower structure side by a fixing member (bolt) 240. The head of the fixing member 240 is covered with a hemispherical cover 241.

The cooling device 100 is placed so that the support portion 210 fits in the opening 112 and between the substrate 110 and the sliding plate 220 via thermal paste (not shown). The thermal paste enhances the adhesion between the substrate 110 and the sliding plate 220, and can more efficiently transfer the frictional heat generated during an earthquake to the substrate 110 to cool the sliding plate 220. Further, the thermal paste can reduce the friction between the sliding plate 220 and the substrate 110 at the time of an earthquake and suppress the generation of frictional heat. As the heat radiating grease, commercially available grease can be appropriately used.

The riding portion 111 is located above the cover 241. In the event of an earthquake, the cooling device 100 slides on the sliding plate 220, but the riding portion 111 is located above the cover 241 to prevent interference between the cover 241 and the cooling device 100. Further, since the riding portion 111 is provided on the entire outer circumference of the substrate 110, it is possible to prevent the cover 241 from interfering with the cooling device 100 even if the cooling device 100 rotates due to the shaking of the earthquake. Further, since the cover 241 is hemispherical, even if a very large earthquake occurs and the cooling device 100 floats up and rides on the cover 241, the cooling device 100 naturally slides down and slides with the substrate 110. It is possible to return to the state where the plate 220 is in contact with the plate 220.

100 Cooling device 110 Board 111 Riding part 112 Opening 120 Fin 130 Coupling member

200 Slip seismic isolation device 210 Support part 220 Slip plate 230 Reinforcing plate 240 Fixing member 241 Cover

Claims (1)

A cooling device that is placed on a sliding plate so as to surround the support portion of the sliding seismic isolation device and cools the sliding plate.
A substrate having a circular opening larger than the bearing portion of the slip seismic isolation device in the center,
With a plurality of fins erected from the substrate,
A cooling device for a slip seismic isolation device characterized by having.

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