JP6857013B2 - LED curable moisture-proof insulation coating agent - Google Patents

LED curable moisture-proof insulation coating agent Download PDF

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JP6857013B2
JP6857013B2 JP2016225619A JP2016225619A JP6857013B2 JP 6857013 B2 JP6857013 B2 JP 6857013B2 JP 2016225619 A JP2016225619 A JP 2016225619A JP 2016225619 A JP2016225619 A JP 2016225619A JP 6857013 B2 JP6857013 B2 JP 6857013B2
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田代智史
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Aica Kogyo Co Ltd
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Description

本発明は、電子部品を搭載する回路基板で用いられる防湿絶縁コート剤であり、より詳しくは、LED(発光ダイオード)光源により短時間で硬化が可能で絶縁信頼性に優れ、皮膚への刺激性が低い特性を有する組成物と、それを用いて絶縁処理した実装回路基板に関する。 The present invention is a moisture-proof insulating coating agent used in a circuit board on which an electronic component is mounted. More specifically, it can be cured in a short time by an LED (light emitting diode) light source, has excellent insulation reliability, and is irritating to the skin. The present invention relates to a composition having a low characteristic, and a mounting circuit board to which an insulation treatment is performed using the composition.

ガラスエポキシ、紙フェノール、ポリイミド等の基材に代表されるプリント配線板へ半導体等の電子部品を実装する際に、その接続部には接続信頼性を高めるため防湿絶縁コート剤が塗布される場合がある。従来このコート剤には熱硬化樹脂の使用、あるいは有機溶剤に溶解した樹脂を塗布後に乾燥する方法が一般的であった。しかし熱硬化樹脂の場合は樹脂硬化に加熱工程が必要で硬化時間がかかるため生産性に問題があり、有機溶剤を使用する樹脂は塗布時に溶剤を揮発させるため環境への負荷が高いという問題が有った。 When an electronic component such as a semiconductor is mounted on a printed wiring board typified by a base material such as glass epoxy, paper phenol, or polyimide, a moisture-proof insulating coating agent is applied to the connection portion to improve connection reliability. There is. Conventionally, a method of using a thermosetting resin or a method of applying a resin dissolved in an organic solvent and then drying it has been generally used for this coating agent. However, in the case of thermosetting resins, there is a problem in productivity because a heating process is required for resin curing and it takes a long time to cure, and resins using organic solvents have a problem that the load on the environment is high because the solvent is volatilized at the time of application. There was.

こうした問題を解決すべく、短時間で硬化が可能な紫外線硬化性コート剤が開発されてきた。例えば特許文献1では末端がアクリロキシ基またはメタクリロキシ基であるポリブタジエンと、不飽和二重結を有する単量体と重合開始剤を含有する組成物が開示されている。また更に、透湿度が小さく基板材料に対して充分な接着性を持つコート剤として、特許文献2では水添ポリブタジエンジオールから合成したエチレン性不飽和二重結合を有するウレタン化合物と、イソボルニルアクリレートとベンゾフェノンを含む組成物が開示されている。しかしながらこれら組成物は、ON/OFFの応答性が良く、また長寿命であるため近年急増しているLED光源には、硬化性が不十分という課題があった。更に反応性希釈剤やモノマーの種類によっては、皮膚がかぶれる問題があり、改善の余地があった。 In order to solve these problems, an ultraviolet curable coating agent that can be cured in a short time has been developed. For example, Patent Document 1 discloses a composition containing polybutadiene having an acryloxy group or a methacryloxy group at the end, a monomer having an unsaturated double bond, and a polymerization initiator. Furthermore, as a coating agent having low moisture permeability and sufficient adhesiveness to the substrate material, in Patent Document 2, a urethane compound having an ethylenically unsaturated double bond synthesized from hydrogenated polybutadiene diol and isobornyl acrylate And benzophenone-containing compositions are disclosed. However, since these compositions have good ON / OFF responsiveness and long life, there is a problem that the curability of these compositions is insufficient for LED light sources, which have been rapidly increasing in recent years. Further, depending on the type of the reactive diluent and the monomer, there is a problem of skin irritation, and there is room for improvement.

特開2009‐179655号公報JP-A-2009-179655 特許第5162893号公報Japanese Patent No. 5162893

本発明は、電子部品を搭載する回路基板で用いられる防湿絶縁コート剤で、照射する光源がLEDの場合でも短時間に硬化可能で、絶縁信頼性に優れ、また皮膚への刺激性が低い特性を有する組成物であると共に、それを用いて絶縁処理した回路基板を提供することにある。 The present invention is a moisture-proof insulating coating agent used in a circuit board on which electronic components are mounted. Even when the light source to be irradiated is an LED, it can be cured in a short time, has excellent insulation reliability, and has low skin irritation. It is an object of the present invention to provide a circuit board having an insulation treatment using the composition having the above.

請求項1記載の発明は、水添ポリブタジエンジオールから合成された数平均分子量が1,000〜20,000であるウレタンアクリレート(A)と、少なくとも非環状(メタ)アクリルアミド系モノマーと脂肪族環状骨格を含む(メタ)アクリレートモノマーと直鎖アルキル基を含む(メタ)アクリレートモノマーを含む光重合性単官能モノマー(B)と、380nm以上の波長で吸収帯域を持つ開始剤(C)と、を含む光硬化性樹脂組成物であって、非環状(メタ)アクリルアミド系モノマーの含有量が組成物全体に対し0.5〜8重量%で、(C)成分の含有量が(A)成分と(B)成分の合計100重量に対し9〜15重量%であるLED硬化型防湿絶縁コート剤組成物を提供する。
The invention according to claim 1 comprises a urethane acrylate (A) synthesized from a hydrogenated polybutadiene diol and having a number average molecular weight of 1,000 to 20,000, and at least an acyclic (meth) acrylamide-based monomer and an aliphatic cyclic skeleton. A photopolymerizable monofunctional monomer (B) containing a (meth) acrylate monomer containing a linear alkyl group and a (meth) acrylate monomer containing a linear alkyl group, and an initiator (C) having an absorption band at a wavelength of 380 nm or more. In the photocurable resin composition, the content of the acyclic (meth) acrylamide-based monomer is 0.5 to 8% by weight with respect to the entire composition, and the content of the component (C) is the component (A) and ( B) Provided is an LED curable moisture-proof insulating coating agent composition which is 9 to 15% by weight based on 100% by weight of the total components.

請求項2記載の発明は、前記(B)の配合量が、(A)と(B)の組成物合計に対し60〜75重量%であることを特徴とする請求項1記載のLED硬化型防湿絶縁コート剤組成物を提供する。
The LED curing type according to claim 1, wherein the blending amount of (B) is 60 to 75% by weight based on the total amount of the compositions of (A) and (B). A moisture-proof insulating coating agent composition is provided.

請求項3記載の発明は、請求項1又は2いずれか記載のLED硬化型防湿絶縁コート剤組成物を用いて絶縁処理されることを特徴とする実装回路基板を提供する。
The invention according to claim 3 provides a mounting circuit board, which is subjected to an insulation treatment using the LED curable moisture-proof insulating coating agent composition according to any one of claims 1 or 2.

本発明の防湿絶縁コート剤は、防湿および絶縁特性に優れ、特に照射する光源がLEDの場合でも短時間に硬化可能な紫外線硬化型の樹脂組成物で、皮膚への刺激性が低い特性を有する。 The moisture-proof and insulating coating agent of the present invention is an ultraviolet-curable resin composition that is excellent in moisture-proof and insulating properties, and can be cured in a short time even when the light source to be irradiated is an LED, and has a property of low irritation to the skin. ..

以下本発明について詳細に説明する。 Hereinafter, the present invention will be described in detail.

本発明の組成物の構成は、水添ポリブタジエンジオールから合成されたMn.が1,000〜20,000であるウレタンアクリレート(A)と少なくとも非環状(メタ)アクリルアミド系モノマーを含む光重合性単官能モノマー(B)と380nm以上の波長で吸収帯域を持つ開始剤(C)である。なお、本明細書において(メタ)アクリレートとは、アクリレートとメタクリレートの双方を包含する。 The composition of the composition of the present invention is Mn. Synthesized from hydrogenated polybutadiene diol. A photopolymerizable monofunctional monomer (B) containing a urethane acrylate (A) having a value of 1,000 to 20,000 and at least an acyclic (meth) acrylamide-based monomer, and an initiator (C) having an absorption band at a wavelength of 380 nm or more. ). In addition, in this specification, (meth) acrylate includes both acrylate and methacrylate.

本発明の水添ポリブタジエンジオールから合成されたMn.が1,000〜20,000であるウレタンアクリレート(A)は、防湿絶縁層を構成するベースオリゴマーであり、ポリオールに、複数のイソシアネート基を有する化合物、および水酸基を有する(メタ)アクリレートを反応させて得られる。使用するポリオールは、透湿度が低く絶縁性に優れまた成形皮膜に適度な柔軟性を付与する水添ポリブタジエン系である。Mn.が1,000未満では得られる硬化物の粘着性が強く表面にべとつき感が残り、20,000を超えると組成物の粘度が高くなり、作業性に悪影響を及ぼす。数平均分子量は、ゲル透過クロマトグラフィー法により、スチレンジビニルベンゼン基材のカラムでテトラハイドロフラン展開溶媒を用いて、標準ポリスチレン換算の分子量を測定・算出した。 Mn. Synthesized from the hydrogenated polybutadiene diol of the present invention. The urethane acrylate (A) having a value of 1,000 to 20,000 is a base oligomer constituting a moisture-proof insulating layer, and the polyol is reacted with a compound having a plurality of isocyanate groups and a (meth) acrylate having a hydroxyl group. Can be obtained. The polyol used is a hydrogenated polybutadiene type that has low moisture permeability, excellent insulating properties, and imparts appropriate flexibility to the molded film. Mn. If it is less than 1,000, the obtained cured product has strong adhesiveness and a sticky feeling remains on the surface, and if it exceeds 20,000, the viscosity of the composition becomes high, which adversely affects workability. The number average molecular weight was measured and calculated in terms of standard polystyrene by a gel permeation chromatography method using a tetrahydrofuran developing solvent on a column based on styrenedivinylbenzene.

本発明で使用される(A)の原料である、複数のイソシアネート基を持つ化合物としては、例えばヘキサメチレンジイソシアネート、ヘプタメチレンジイソシアネート、オクタメチレンジイソシアネート、トリレンジイソシアネート、メチルシクロヘキサンジイソシアネート、ジシクロヘキシルメタンジイソシアネート、イソホロンジイソシアネート、ジフェニルメタンジイソシアネート、キシリレンジイソシアネートがあり、単独または2種類以上を組み合わせて使用できる。これらの中では、イソホロンジイソシアネートが好ましい。また水酸基を有する(メタ)アクリレートとしては、例えば2−ヒドロキシエチルアクリレート、2−ヒドロキシプロピルアクリレート、4−ヒドロキシブチルアクリレート、2−ヒドロキシエチルメタクリレートがあり、これらの中では2-ヒドロキシエチルアクリレート好ましい。 Examples of the compound having a plurality of isocyanate groups, which is the raw material of (A) used in the present invention, include hexamethylene diisocyanate, heptamethylene diisocyanate, octamethylene diisocyanate, tolylene diisocyanate, methylcyclohexane diisocyanate, dicyclohexylmethane diisocyanate, and isophorone. There are diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate, which can be used alone or in combination of two or more. Of these, isophorone diisocyanate is preferable. Examples of the (meth) acrylate having a hydroxyl group include 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, and 2-hydroxyethyl methacrylate, and 2-hydroxyethyl acrylate is preferable among these.

(A)の配合量は、(A)と(B)の組成物合計に対し、硬化物の透湿度と組成物の特性バランスから25〜40重量%が好ましく、30〜35重量%である事がより好ましい。25重量%以上とすることで透湿度を安定して低くすることができ、40重量%以下とすることで粘度が高くなりすぎず作業性が安定する。市販の水添ポリブタジエン骨格を持つウレタンクリレートとしてはExcelateRX71−44(商品名:亜細亜工業社製、数平均分子量3,000)、RX71−67(商品名:亜細亜工業社製、数平均分子量13,000)などがある。 The blending amount of (A) is preferably 25 to 40% by weight, preferably 30 to 35% by weight, based on the moisture permeability of the cured product and the characteristic balance of the composition with respect to the total composition of (A) and (B). Is more preferable. When it is 25% by weight or more, the moisture permeability can be stably lowered, and when it is 40% by weight or less, the viscosity does not become too high and the workability is stable. Commercially available urethane clearates having a hydrogenated polybutadiene skeleton include Excelate RX71-44 (trade name: manufactured by Asia Industries, Ltd., number average molecular weight of 3,000), RX71-67 (trade name: manufactured by Asia Industries, Ltd., number average molecular weight of 13,). 000) and so on.

本発明で使用される少なくとも非環状(メタ)アクリルアミド系モノマーを含む光重合性単官能モノマー(B)は、(A)を希釈すると同時に(A)と反応して皮膜硬度を上げるために配合される。皮膚への刺激性を抑えるため非環状(メタ)アクリルアミド系モノマーを必須成分とし、その他のモノマーとしては基材との密着力、透湿性、(A)との相溶性など観点から、脂肪族環状骨格を含む(メタ)アクリレートモノマーと、直鎖アルキル基を含む(メタ)アクリレートノマーであることが好ましい。また皮膚への刺激性を抑えるためPII値(一次刺激性インデックス)は2.5以下であることが好ましい。 The photopolymerizable monofunctional monomer (B) containing at least an acyclic (meth) acrylamide-based monomer used in the present invention is formulated to dilute (A) and at the same time react with (A) to increase the film hardness. To. An acyclic (meth) acrylamide-based monomer is an essential component to suppress irritation to the skin, and the other monomer is an aliphatic cyclic from the viewpoints of adhesion to the base material, moisture permeability, compatibility with (A), and the like. It is preferably a (meth) acrylate monomer containing a skeleton and a (meth) acrylate nomer containing a linear alkyl group. Further, the PII value (primary irritation index) is preferably 2.5 or less in order to suppress irritation to the skin.

非環状(メタ)アクリルアミド系モノマーの配合量は、組成物全体に対し0.5〜8重量%であり、0.8〜5重量%が更に好ましい。0.5重量%未満では組成物全体の極性が低くなるため剥離強度が低下し、8重量%超では相溶性のバランスが崩れ相分離を引き起こす。更に(B)全体に対する非環状(メタ)アクリルアミド系モノマーは、0.5〜10重量%が好ましく、1〜7重量%が更に好ましい。0.5重量%以上で皮膚への刺激性を低減でき、10重量%以下とすることで他成分との充分な相溶性を確保し、相分離を起こすことなく良好な保存安定性を確保することができる。 The blending amount of the acyclic (meth) acrylamide-based monomer is 0.5 to 8% by weight, more preferably 0.8 to 5% by weight, based on the entire composition. If it is less than 0.5% by weight, the polarity of the entire composition becomes low, so that the peel strength decreases, and if it exceeds 8% by weight, the compatibility balance is lost and phase separation occurs. Further, the acyclic (meth) acrylamide-based monomer with respect to the whole (B) is preferably 0.5 to 10% by weight, more preferably 1 to 7% by weight. Irritation to the skin can be reduced with 0.5% by weight or more, and sufficient compatibility with other components is ensured with 10% by weight or less, and good storage stability is ensured without causing phase separation. be able to.

(B)の配合量は、(A)と(B)の組成物合計に対し、皮膜強度と粘度等の特性バランスから60〜75重量%が好ましく、65〜70重量%が更に好ましい。60重量%以上とすることで作業性に適した粘度を確保する事ができ、75重量%以下とすることで硬化収縮と硬化性の良好なバランスを取ることができる。2官能以上の多官能モノマーについては、硬化皮膜の硬度が高くなりすぎ剥離強度が低下するため好ましくない。 The blending amount of (B) is preferably 60 to 75% by weight, more preferably 65 to 70% by weight, based on the balance of characteristics such as film strength and viscosity with respect to the total composition of (A) and (B). When it is 60% by weight or more, a viscosity suitable for workability can be secured, and when it is 75% by weight or less, a good balance between curing shrinkage and curability can be achieved. A polyfunctional monomer having two or more functionalities is not preferable because the hardness of the cured film becomes too high and the peel strength decreases.

非環状アミノ基を含有する(メタ)アクリレートとしては、例えば(メタ)アクリルアミド、N,N‐ジメチルアクリルアミド、N,N‐ジエチルアクリルアミド、N,N−ジプロピル(メタ)アクリルアミド、N−メチル(メタ)アクリルアミド、N−エチル(メタ)アクリルアミド、N−イソプロピルアクリルアミド、N−ブチル(メタ)アクリルアミド、N−n−ブトキシメチル(メタ)アクリルアミド、N−イソブトキシメチル(メタ)アクリルアミド、N−メトキシメチル(メタ)アクリルアミド、ジアセトンアクリルアミド、ヒドロキシエチルアクリルアミドなどがあげられ、単独または2種類以上を組み合わせて使用できる。これらの中では皮膚刺激性が低く、低臭気のヒドロキシエチルアクリルアミドが好ましい。アクリロイルモルホリンのような環状アミノ基を有する(メタ)アクリレートは、硬化した皮膜が硬くなりすぎ剥離強度が低下するため好ましくない。 Examples of the (meth) acrylate containing an acyclic amino group include (meth) acrylamide, N, N-dimethylacrylamide, N, N-diethylacrylamide, N, N-dipropyl (meth) acrylamide, and N-methyl (meth). Acrylamide, N-ethyl (meth) acrylamide, N-isopropylacrylamide, N-butyl (meth) acrylamide, Nn-butoxymethyl (meth) acrylamide, N-isobutoxymethyl (meth) acrylamide, N-methoxymethyl (meth) ) Acrylamide, diacetoneacrylamide, hydroxyethylacrylamide and the like can be mentioned, and can be used alone or in combination of two or more. Among these, hydroxyethyl acrylamide, which has low skin irritation and low odor, is preferable. A (meth) acrylate having a cyclic amino group such as acryloyl morpholine is not preferable because the cured film becomes too hard and the peel strength decreases.

脂肪族環状骨格を有する(メタ)アクリレートとしては、例えばジシクロペンテニル(メタ)アクリレート、ジシクロペンテニルオキシエチル(メタ)アクリレート、イソボルニル(メタ)アクリレート、アダマンタニル(メタ)アクリレート、シクロヘキシル(メタ)アクリレートなどがあげられ、単独または2種類以上を組み合わせて使用できる。これらの中ではイソボルニルアクリレートが、低粘度で皮膚刺激性や臭気の観点から好ましい。 Examples of the (meth) acrylate having an aliphatic cyclic skeleton include dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, adamantanyl (meth) acrylate, and cyclohexyl (meth) acrylate. Can be used alone or in combination of two or more. Among these, isobornyl acrylate is preferable from the viewpoint of low viscosity, skin irritation and odor.

また直鎖アルキル構造を有する(メタ)アクリレートとしては、例えばメチル(メタ)アクリレート、エチル(メタ)アクリレート、n-プロピル(メタ)アクリレート、n-ブチル(メタ)アクリレート、n-ペンチル(メタ)アクリレート、n-ヘキシル(メタ)アクリレート、n-オクチル(メタ)アクリレート、ラウリル(メタ)アクリレート、トリデシル(メタ)アクリレート、ステアリル(メタ)アクリレートなどがあり、これらの中では汎用性、良希釈性、低臭気、低アウトガスの観点からn-オクチルアクリレートが好ましい。 Examples of the (meth) acrylate having a linear alkyl structure include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, and n-pentyl (meth) acrylate. , N-hexyl (meth) acrylate, n-octyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, stearyl (meth) acrylate, etc. From the viewpoint of odor and low outgas, n-octyl acrylate is preferable.

本発明で使用される光重合開始剤(C)は、紫外線や電子線などの吸収でラジカルを生じ、そのラジカルが重合反応のきっかけとなるもので、LEDの発光波長である380nm以上で吸収帯域をもつ特性が必要である。配合量は(A)と(B)の組成物合計100重量に対し9〜15重量%であり、9重量%未満では速硬化性が得られず表面にタックが残り、15重量%超では保存安定性で問題が起こる可能性がある。 The photopolymerization initiator (C) used in the present invention generates radicals by absorption of ultraviolet rays, electron beams, etc., and the radicals trigger a polymerization reaction. The absorption band is 380 nm or more, which is the emission wavelength of the LED. It is necessary to have the property of. The blending amount is 9 to 15% by weight based on 100% by weight of the total composition of (A) and (B). If it is less than 9% by weight, quick curing is not obtained and tack remains on the surface, and if it exceeds 15% by weight, it is stored. Stability problems can occur.

380nm以上で吸収帯域をもつ指標としては、アセトニトリルに0.1%溶解した(C)溶液を分光硬度計で各波長の吸収スペクトルを測定した時の380nmにおける吸収量が0.5%以上である事が望ましい。例えば2-ベンジル−2−ジメチルアミノ−1−(4−モルフォリノフェニル)-ブタノン−1、2-ジメチルアミノ−2−(4−メチル-ベンジル)−1−(4−モリフォリン−4−イル−フェニル)−ブタン−1−オン、ビス(2.4.6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド、2.4.6−トリメチルベンゾイル−ジフェニル−フォスフィンオキザイドがあり、単独または2種以上を組み合わせて使用できる。市販品ではIrgacure379、379EG、369および369E、Lucirin TPO、Darocur4265(商品名:BASFジャパン社製)などがある。 As an index having an absorption band at 380 nm or more, the absorption amount at 380 nm when the absorption spectrum of each wavelength is measured with a spectroscopic hardness meter of the solution (C) dissolved in acetonitrile by 0.1% is 0.5% or more. Things are desirable. For example, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, 2-dimethylamino-2- (4-methyl-benzyl) -1- (4-moriphorin-4-yl-) Phenyl) -butane-1-one, bis (2.4.6-trimethylbenzoyl) -phenylphosphine oxide, 2.4.6-trimethylbenzoyl-diphenyl-phosphine oxide, alone or in combination of two or more. Can be used in combination. Commercially available products include Irgacare 379, 379EG, 369 and 369E, Lucirin TPO, and Darocur 4265 (trade name: manufactured by BASF Japan Ltd.).

本組成物には必要に応じ、硬化助剤、シランカップリング剤、可塑剤、増感剤、酸化防止剤、老化防止剤、消泡剤、難燃剤、充填剤、重合禁止剤、着色剤、レベリング剤、分散剤、チクソ付与剤などの添加剤も併用することができる。 The composition may include curing aids, silane coupling agents, plasticizers, sensitizers, antioxidants, antioxidants, defoamers, flame retardants, fillers, polymerization inhibitors, colorants, as needed. Additives such as leveling agents, dispersants, and thixo-imparting agents can also be used in combination.

本発明の実装回路基板は、半導体やフラットパネルディスプレイ、抵抗等の電子デバイスが実装されたプリント配線板に、本組成物を塗布して接合部分の絶縁処理をすることで得られる。本組成物のプリント配線板への塗布方法としては特に指定はなく、刷毛塗り法、スプレー法、浸漬法、ディスペンサーによる塗布法等、公知の方法を使用できる。塗布後はLEDを光源とした紫外線を照射することにより皮膜を硬化し、実装回路基板が得られる。また紫外線照射の光源としては、LEDに限らず高圧水銀灯、メタルハライドランプ等の公知の光源を用いても良い。 The mounting circuit board of the present invention can be obtained by applying the present composition to a printed wiring board on which electronic devices such as semiconductors, flat panel displays, and resistors are mounted, and insulating the joint portion. The method for applying the present composition to the printed wiring board is not particularly specified, and known methods such as a brush coating method, a spray method, a dipping method, and a dispenser coating method can be used. After coating, the film is cured by irradiating ultraviolet rays using an LED as a light source to obtain a mounting circuit board. Further, the light source for ultraviolet irradiation is not limited to the LED, and a known light source such as a high-pressure mercury lamp or a metal halide lamp may be used.

本組成物は皮膚への刺激性が非常に低いと言う特徴がある。反応性のオリゴマーやモノマーには皮膚や粘膜に対し刺激性を持つものがあり、たとえ低い刺激性であっても、長時間の暴露では実際の生産現場で問題となる場合がある。一般に化学物質が皮膚に触れた場合、分子量の小さいものは皮膚への浸透性が高いため影響が大きく、また極性の大きいものの方がより刺激性が高い傾向がある。本発明は、モノマーの一次刺激性インデックス(PII値)を参考にしており、実際の生産ラインで3ヶ月以上の長期間使用しても問題が無い。 This composition is characterized by having very low skin irritation. Some reactive oligomers and monomers are irritating to the skin and mucous membranes, and even low irritation can be problematic in actual production sites with prolonged exposure. Generally, when a chemical substance comes into contact with the skin, a substance having a small molecular weight tends to have a large effect because it has high permeability to the skin, and a substance having a large polarity tends to be more irritating. The present invention refers to the primary irritation index (PII value) of the monomer, and there is no problem even if it is used for a long period of 3 months or more on an actual production line.

以下、本発明を実施例、比較例に基づき詳細に説明するが、具体例を示すものであって特にこれらに限定するものではない。なお表記が無い場合は、室温は25℃相対湿度65%の条件下で測定を行った。 Hereinafter, the present invention will be described in detail based on Examples and Comparative Examples, but specific examples are shown and the present invention is not particularly limited thereto. Unless otherwise specified, the measurement was performed under the conditions of room temperature of 25 ° C. and relative humidity of 65%.

実施例1
水添ポリブタジエンジオールから合成されたMn.が1,000〜20,000であるウレタンアクリレート(A)としてExcelateRX71−44(商品名:亜細亜工業社製、Mn.3,000 )を、光重合性単官能モノマー(B)としてHEAA(商品名:KJケミカルズ社製、ヒドロキシエチルアクリルアミド、PII値0)およびIB−XA(商品名:共栄社化学社製、イソボルニルアクリレート、PII値0.6)およびNOAA(商品名:大阪有機化学工業社製、n−オクチルアクリレート、PII値0.7)を、開始剤(C)としてIrgacure379EG(商品名:BASFジャパン社製、380nmの波長吸収率が1.0%)を用い、表1記載の配合で均一に溶解するまで撹拌し実施例1の防湿絶縁コート剤組成物を調整した。
Example 1
Mn. Synthesized from hydrogenated polybutadiene diol. ExcelateRX71-44 (trade name: manufactured by Asia Industries, Ltd., Mn.3,000) as a urethane acrylate (A) having a value of 1,000 to 20,000, and HEAA (trade name) as a photopolymerizable monofunctional monomer (B). : KJ Chemicals, hydroxyethyl acrylamide, PII value 0) and IB-XA (trade name: Kyoeisha Chemical Co., Ltd., isobornyl acrylate, PII value 0.6) and NOAA (trade name: Osaka Organic Chemical Industry Co., Ltd.) , N-octyl acrylate, PII value 0.7), using Irgacure379EG (trade name: BASF Japan, Inc., 380 nm wavelength absorption rate: 1.0%) as the initiator (C), with the formulation shown in Table 1. The moisture-proof insulating coating composition of Example 1 was prepared by stirring until it was uniformly dissolved.

実施例2〜4
実施例1で用いた材料を用い、配合量を表1のように変更し均一に溶解するまで撹拌し実施例2〜4の防湿絶縁コート剤組成物を調整した。
Examples 2-4
Using the material used in Example 1, the blending amount was changed as shown in Table 1 and stirred until uniformly dissolved to prepare the moisture-proof insulating coating composition of Examples 2-4.

比較例1〜7
実施例で用いた材料の他、ポリテトラメチレングリコール骨格のウレタンアクリレートRX8−7(商品名:亜細亜工業社製)を、(B)として4HBA(商品名:大阪有機化学工業社製、4ヒドロキシブチルアクリレート、PII値3.0)およびACMO(商品名:KJケミカルズ社製、アクリロイルモルホリン、PII値0.5)を、開始剤としてIrgacure184(商品名:BASFジャパン社製、380nmの波長吸収率が0.1%以下)およびLucirinTPO(商品名:BASFジャパン社製、380nmの波長吸収率が1.5%)を、光増感剤としてKAYACUREDETX−S(商品名:日本化薬社製、チオキサントン系)用い、表1記載の配合で均一に溶解するまで撹拌し比較例1〜7の防湿絶縁コート剤組成物を調整した。
Comparative Examples 1 to 7
In addition to the materials used in the examples, urethane acrylate RX8-7 (trade name: manufactured by Asia Industries, Ltd.) having a polytetramethylene glycol skeleton was used as (B), and 4HBA (trade name: manufactured by Osaka Organic Chemical Industry Co., Ltd.) was used as 4HBA. Acrylate, PII value 3.0) and ACMO (trade name: KJ Chemicals, acryloylmorpholin, PII value 0.5) as an initiator, Irgacure184 (trade name: BASF Japan, 380 nm wavelength absorption rate is 0). .1% or less) and Lucirin TPO (trade name: manufactured by BASF Japan, 380 nm wavelength absorption rate is 1.5%) as a photosensitizer, KAYACUREDETX-S (trade name: manufactured by Nippon Kayaku Co., Ltd., thioxanthone type) The moisture-proof insulating coating composition of Comparative Examples 1 to 7 was prepared by stirring until the mixture was uniformly dissolved in the formulation shown in Table 1.

表1 (重量部)

Figure 0006857013
Table 1 (weight part)
Figure 0006857013

評価方法は以下の通りとした。 The evaluation method was as follows.

表面硬化性:ガラス板上に厚さ100μmとなるよう防湿絶縁コート剤組成物を塗布し、その上からパナソニック製のLED−UV照射装置UD−40を用い、出力400mW/cm、積算光量が1000mJ/cmとなる様に紫外線照射により硬化させ、皮膜表面のべたつき有無を指触で確認し、べたつき無を○、べたつきは有るが樹脂が指に付かないを△、べたつき有で樹脂が指に付くを×とした。 Surface curability: A moisture-proof insulating coating composition is applied onto a glass plate so as to have a thickness of 100 μm, and a Panasonic LED-UV irradiation device UD-40 is used on the glass plate to achieve an output of 400 mW / cm 2 and an integrated light amount. It is cured by UV irradiation so that it becomes 1000 mJ / cm 2, and the presence or absence of stickiness on the film surface is confirmed by touch. The number attached to is x.

粘度:東機産業製のコーンプレート型粘度計RC−550を用い、コーン角3°×R17.65で25±1℃、回転数20rpmで測定した。作業性の観点から1,000mPa・s未満を○とした、1,000mPa・s以上を×とした。 Viscosity: Using a cone plate type viscometer RC-550 manufactured by Toki Sangyo, the measurement was performed at a cone angle of 3 ° × R17.65 at 25 ± 1 ° C. and a rotation speed of 20 rpm. From the viewpoint of workability, less than 1,000 mPa · s was marked with ◯, and more than 1,000 mPa · s was marked with x.

剥離強度:ガラス板上に厚さ100μmとなるよう防湿絶縁コート剤組成物を塗布し、その上に24mm幅にカットしたPETフィルム(商品名、東洋紡製、A4300、厚み125μm)を重ね合わせ、その上から同上の条件で紫外線照射して硬化させ、当該PETフィルム端部をミネベア製の引張圧縮試験機テクノグラフ TGI-1kNを用いて180度方向にクロスヘッドスピード300mm/分で引張った際の剥離強度を測定し、剥離強度が50N/m以上を○、50N/m未満を×とした。なお紫外線の照射条件は、特別な表記が無い場合は以下も同じとする。 Peeling strength: A moisture-proof insulating coating composition is applied on a glass plate so as to have a thickness of 100 μm, and a PET film (trade name, Toyobo Co., Ltd., A4300, thickness 125 μm) cut to a width of 24 mm is superposed on the glass plate. It is cured by irradiating it with ultraviolet rays from above under the same conditions, and peeling when the end of the PET film is pulled in the 180 degree direction at a crosshead speed of 300 mm / min using a tensile compression tester technograph TGI-1kN manufactured by Minebea. The strength was measured, and a peel strength of 50 N / m or more was evaluated as ◯, and a peel strength of less than 50 N / m was evaluated as x. Unless otherwise specified, the ultraviolet irradiation conditions shall be the same as below.

マイグレーション試験:25×50mmの板ガラス上に0.6×10.2mmのエリアに描画したITO電極基板(アノード/カソード間のライン/スペース=15/15μm)上に、厚さ100μmとなるよう防湿絶縁コート剤を塗布し、同上の条件で紫外線照射して硬化させた試験片を作製し、60℃/90%RHの環境下でDC5Vを印加し、300時間経過後の絶縁抵抗変化と腐食性について評価し、目視で腐食無しを○、腐食有りを×とした。 Migration test: Moisture-proof insulation to a thickness of 100 μm on an ITO electrode substrate (line / space between anode / cathode = 15/15 μm) drawn in an area of 0.6 × 10.2 mm on a 25 × 50 mm plate glass. A test piece was prepared by applying a coating agent and irradiating with ultraviolet rays under the same conditions to cure it. DC5V was applied in an environment of 60 ° C./90% RH, and the change in insulation resistance and corrosiveness after 300 hours had passed. After evaluation, no corrosion was visually evaluated as ◯, and with corrosion was evaluated as x.

皮膚刺激性:モノマーのPII値が2.5以上のものを使用しない場合を○、使用した場合を×とした。 Skin irritation: A case in which a monomer having a PII value of 2.5 or more was not used was evaluated as ◯, and a case in which a monomer having a PII value of 2.5 or more was used was evaluated as x.

評価結果
表2

Figure 0006857013
Evaluation result <br /> Table 2
Figure 0006857013

実施例は表面硬化性、粘度、剥離強度、マイグレーション試験すべての面で問題は無く良好であった。 The examples were good with no problems in all aspects of surface curability, viscosity, peel strength, and migration test.

一方、非環状(メタ)アクリルアミド系モノマーに代えて環状アミドを配合した比較例1及びHEAAが少ない比較例3は剥離強度が劣り、開始剤(C)の配合量が9%未満の比較例2は表面硬化性が劣った。また非環状(メタ)アクリルアミド系モノマーに代えて4HBAを配合した比較例5、6,7は皮膚刺激性で問題があり、更に請求項4に非該当となる(C)を配合した比較例6、(A)以外のウレタンアクリレートを配合した比較例7は表面硬化性も劣った。またHEAAの多い比較例4は相分離を引き起こし評価ができず、いずれも本願発明に適さないものであった。 On the other hand, Comparative Example 1 in which cyclic amide was added instead of the acyclic (meth) acrylamide-based monomer and Comparative Example 3 in which HEAA was small had poor peel strength, and Comparative Example 2 in which the amount of the initiator (C) was less than 9% Was inferior in surface curability. Further, Comparative Examples 5, 6 and 7 in which 4HBA was blended instead of the acyclic (meth) acrylamide-based monomer had a problem in skin irritation, and Comparative Example 6 in which (C), which is not applicable to claim 4, was further blended. Comparative Example 7 in which a urethane acrylate other than (A) was blended was also inferior in surface curability. Further, Comparative Example 4 having a large amount of HEAA caused phase separation and could not be evaluated, and none of them was suitable for the present invention.

本発明は、電子部品を搭載する回路基板で用いられる防湿絶縁コート剤で、照射する光源がLEDの場合でも短時間に硬化可能で、絶縁信頼性および皮膚への低刺激性で優れた組成物として有用である。

The present invention is a moisture-proof insulating coating agent used in a circuit board on which an electronic component is mounted. It can be cured in a short time even when the light source to be irradiated is an LED, and has excellent insulation reliability and low irritation to the skin. It is useful as.

Claims (3)

水添ポリブタジエンジオールから合成された数平均分子量が1,000〜20,000であるウレタンアクリレート(A)と、少なくとも非環状(メタ)アクリルアミド系モノマーと脂肪族環状骨格を含む(メタ)アクリレートモノマーと直鎖アルキル基を含む(メタ)アクリレートモノマーを含む光重合性単官能モノマー(B)と、380nm以上の波長で吸収帯域を持つ開始剤(C)と、を含む光硬化性樹脂組成物であって、非環状(メタ)アクリルアミド系モノマーの含有量が組成物全体に対し0.5〜8重量%で、(C)成分の含有量が(A)成分と(B)成分の合計100重量に対し9〜15重量%であるLED硬化型防湿絶縁コート剤組成物。 Urethane acrylate (A) synthesized from hydrogenated polybutadiene diol having a number average molecular weight of 1,000 to 20,000, and (meth) acrylate monomer containing at least acyclic (meth) acrylamide-based monomer and aliphatic cyclic skeleton. A photocurable resin composition containing a photopolymerizable monofunctional monomer (B) containing a (meth) acrylate monomer containing a linear alkyl group and an initiator (C) having an absorption band at a wavelength of 380 nm or more. The content of the acyclic (meth) acrylamide-based monomer is 0.5 to 8% by weight based on the entire composition, and the content of the component (C) is 100% by weight in total of the component (A) and the component (B). An LED curable moisture-proof insulating coating composition having a weight of 9 to 15% by weight. 前記(B)の配合量が、(A)と(B)の組成物合計に対し60〜75重量%であることを特徴とする請求項1記載のLED硬化型防湿絶縁コート剤組成物。The LED curable moisture-proof insulating coating agent composition according to claim 1, wherein the blending amount of (B) is 60 to 75% by weight based on the total amount of the compositions of (A) and (B). 請求項1又は2いずれか記載のLED硬化型防湿絶縁コート剤組成物を用いて絶縁処理されることを特徴とする実装回路基板。


A mounting circuit board characterized by being insulated using the LED curable moisture-proof insulating coating agent composition according to any one of claims 1 or 2.


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