JP6849010B2

JP6849010B2 - Electronic components

Info

Publication number: JP6849010B2
Application number: JP2019089661A
Authority: JP
Inventors: 森　雅弘; 雅弘森; 坂井　孝行; 孝行坂井; 小林　一三; 一三小林
Original assignee: TDK Corp
Current assignee: TDK Corp
Priority date: 2019-05-10
Filing date: 2019-05-10
Publication date: 2021-03-24
Anticipated expiration: 2035-03-03
Also published as: JP2019149570A

Description

本発明は、たとえば金属端子からなる外部端子が接続してある電子部品に関する。 The present invention relates to an electronic component to which an external terminal made of, for example, a metal terminal is connected.

セラミックコンデンサ等の電子部品としては、単体で直接に基板等に面実装する通常のチップ部品の他に、チップ部品に金属端子などの外部端子が取り付けられたものが提案されている。外部端子が取り付けられている電子部品は、実装後において、チップ部品が基板から受ける変形応力を緩和したり、チップ部品を衝撃等から保護する効果を有することが報告されており、耐久性および信頼性等が要求される分野において使用されている。 As electronic components such as ceramic capacitors, in addition to ordinary chip components that are directly surface-mounted on a substrate or the like, those in which external terminals such as metal terminals are attached to the chip components have been proposed. It has been reported that electronic components to which external terminals are attached have the effect of relaxing the deformation stress that the chip components receive from the substrate after mounting and protecting the chip components from impacts, etc., and are durable and reliable. It is used in fields where sex is required.

外部端子を用いた電子部品では、外部端子の一端がチップ部品の端子電極に接続され、他端が回路基板などの実装面に半田などで接続される。最近では、このような外部端子を用いた電子部品が回路基板に実装された状態で、音鳴きという現象が発生することが課題となっている。 In electronic components using external terminals, one end of the external terminal is connected to the terminal electrode of the chip component, and the other end is connected to a mounting surface such as a circuit board by soldering or the like. Recently, it has become a problem that a phenomenon called squealing occurs in a state where an electronic component using such an external terminal is mounted on a circuit board.

特開２００８−１３０９５４号公報Japanese Unexamined Patent Publication No. 2008-130954

本発明は、このような実状に鑑みてなされ、その目的は、音鳴きを低減することができる電子部品を提供することである。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electronic component capable of reducing squealing.

本発明者らは、外部端子付きの電子部品での音鳴きが、端子電極と外部端子との接合領域を制限することで低減できることを見い出し、本発明を完成するに至った。 The present inventors have found that the noise in an electronic component with an external terminal can be reduced by limiting the bonding region between the terminal electrode and the external terminal, and have completed the present invention.

すなわち、本発明に係る電子部品は、
素体の端面に端子電極が形成されたチップ部品と、
前記端子電極に電気的に接続される外部端子とを有する電子部品であって、
前記外部端子が、
前記端子電極の端面電極部に向き合うように配置される端子電極接続部と、
実装面に接続可能な実装接続部と、
前記実装面から最も近い前記素体の一側面を前記実装面から離して前記素体の一側面を支持するように、前記素体の一側面に向き合っている支持部と、を有し、
前記外部端子の端子電極接続部と前記端子電極の端面電極部との間には、接合領域と非接合領域とが形成してあり、
前記非接合領域が、前記端子電極接続部から前記支持部にまで形成してあることを特徴とする。 That is, the electronic component according to the present invention is
Chip parts with terminal electrodes formed on the end faces of the body,
An electronic component having an external terminal electrically connected to the terminal electrode.
The external terminal
A terminal electrode connection portion arranged so as to face the end face electrode portion of the terminal electrode, and a terminal electrode connection portion.
A mounting connection that can be connected to the mounting surface,
It has a support portion facing one side surface of the element body so as to support one side surface of the element body by separating one side surface of the element body closest to the mounting surface from the mounting surface.
A bonded region and a non-bonded region are formed between the terminal electrode connecting portion of the external terminal and the end face electrode portion of the terminal electrode.
The non-junction region is formed from the terminal electrode connection portion to the support portion.

音鳴きは、実装基板が可聴領域の振動数で振動して可聴音が発生する現象であり、その振動の原因は素体の大部分を構成するセラミック層に高周波電圧が印加されたときに電歪効果により振動し、その振動が外部端子および／または実装面に伝わることにより発生するのではないかと考えられている。本発明者等は、非接合領域を、端子電極接続部から前記支持部にまで形成することで、音鳴きを低減できることを見出した。その理由としては、必ずしも明らかではないが、非接合領域が振動の緩和領域となり、チップ部品の電歪振動が実装面に伝わりにくくなるためではないかと考えられる。 Sound squeal is a phenomenon in which the mounting board vibrates at a frequency in the audible region to generate audible sound, and the cause of the vibration is electricity when a high-frequency voltage is applied to the ceramic layer that constitutes most of the element body. It is believed that the vibration is caused by the distortion effect, and the vibration is transmitted to the external terminal and / or the mounting surface. The present inventors have found that squealing can be reduced by forming a non-junction region from the terminal electrode connection portion to the support portion. The reason is not necessarily clear, but it is considered that the non-junction region becomes a vibration relaxation region, and the electrostrictive vibration of the chip component is less likely to be transmitted to the mounting surface.

前記非接合領域では、前記外部端子と前記端子電極との間には隙間が形成されていてもよいし、これらが接触していても良い。非接合領域では、半田や導電性接着剤などによる接続がないことで、振動の緩和領域となり、音鳴きが防止されるのではないかと考えられる。 In the non-junction region, a gap may be formed between the external terminal and the terminal electrode, or these may be in contact with each other. In the non-bonded region, it is considered that the vibration mitigation region and the squealing are prevented because there is no connection by solder or a conductive adhesive.

好ましくは、前記端子電極接続部と前記実装接続部とが連結部により連結され、
前記支持部が、前記端子電極接続部と前記連結部との境界位置で、前記素体の前記一側面に向けて突出して、前記端子電極接続部と一体に成形してある。このように構成することで、支持部の形成が容易になると共に、特に、ハンダや導電性接着剤などによる接合作業前または作業時における外部端子によるチップ部品の保持が確実なものとなる。 Preferably, the terminal electrode connecting portion and the mounting connecting portion are connected by the connecting portion.
The support portion projects toward the one side surface of the element body at a boundary position between the terminal electrode connection portion and the connection portion, and is integrally molded with the terminal electrode connection portion. With such a configuration, the support portion can be easily formed, and in particular, the chip component can be reliably held by the external terminal before or during the joining work with solder or a conductive adhesive.

好ましくは、前記端子電極接続部の幅方向に沿って、前記連結部と前記支持部とは位置ズレしており、前記支持部は、前記端子電極接続部の幅方向に沿った両側から、前記素体の前記一側面に向けて突出する一対の支持部で構成してあり、
前記素体の端面近くでは、前記実装面と垂直方向から見て、前記実装接続部と前記支持部とは重ならない部分を有する。 Preferably, the connecting portion and the supporting portion are displaced from each other along the width direction of the terminal electrode connecting portion, and the supporting portion is formed from both sides along the width direction of the terminal electrode connecting portion. It is composed of a pair of support portions protruding toward the one side surface of the element body.
Near the end surface of the element body, the mounting connection portion and the support portion do not overlap with each other when viewed from the mounting surface in the direction perpendicular to the mounting surface.

このように構成することで、実装接続部の半田が支持部にまで延びることを防止でき、いわゆる半田ブリッジ現象を抑制することができる。半田ブリッジが生じてしまうと、音鳴きが生じやすくなることから、半田ブリッジの低減が望まれている。なお、半田ブリッジの低減が図れるために、実装面とチップ部品との隙間を、たとえば０．２ｍｍ以下にもすることが可能であり、装置全体の薄型化にも寄与する。 With such a configuration, it is possible to prevent the solder of the mounting connection portion from extending to the support portion, and it is possible to suppress the so-called solder bridge phenomenon. If a solder bridge is generated, noise is likely to occur. Therefore, it is desired to reduce the solder bridge. Since the number of solder bridges can be reduced, the gap between the mounting surface and the chip component can be reduced to, for example, 0.2 mm or less, which also contributes to reducing the thickness of the entire device.

好ましくは、前記実装面に平行な方向に沿った前記連結部の幅(Ｗ１)が前記端子電極接続部の幅(Ｗ０)よりも小さくなっている。このように構成することで、チップ部品の電歪振動が実装面に伝わりにくくなるので、さらに音鳴きを低減できる。 Preferably, the width (W1) of the connecting portion along the direction parallel to the mounting surface is smaller than the width (W0) of the terminal electrode connecting portion. With such a configuration, the electric strain vibration of the chip component is less likely to be transmitted to the mounting surface, so that the noise can be further reduced.

好ましくは、前記連結部の幅(Ｗ１)と前記端子電極接続部の幅(Ｗ０)との比率（Ｗ１／Ｗ０）が、０．３〜０．８、さらに好ましくは０．５〜０．７である。このような関係にある時に、音鳴き防止効果が高まると共に、外部端子の十分な機械的強度を確保することができる。 Preferably, the ratio (W1 / W0) of the width (W1) of the connecting portion to the width (W0) of the terminal electrode connecting portion is 0.3 to 0.8, more preferably 0.5 to 0.7. Is. In such a relationship, the effect of preventing squealing is enhanced, and sufficient mechanical strength of the external terminal can be ensured.

非接合領域を形成するための手段としては、特に限定されないが、たとえば半田を用いて接合する場合には、端子電極に向き合う外部端子の表面に、半田付着防止処理を施すことで、非接合領域を形成することができる。半田付着防止処理としては、たとえばレーザー剥離処理、レジスト塗布処理、めっき領域の限定処理、半田溜まり形成処理などが例示される。 The means for forming the non-bonded region is not particularly limited, but for example, in the case of joining using solder, the non-bonded region is formed by applying a solder adhesion prevention treatment to the surface of the external terminal facing the terminal electrode. Can be formed. Examples of the solder adhesion prevention treatment include a laser peeling treatment, a resist coating treatment, a plating region limiting treatment, and a solder pool forming treatment.

なお、半田付着防止処理は、端子電極にも行っても良い。また、半田以外で、たとえば導電性接着剤を用いて接合領域を形成する場合には、その導電性接着剤の塗布領域を制限することで、非接合領域を形成することができる。好ましくは、接合領域は、半田を用いて形成する。接合強度を向上させることができると共に、電気抵抗を低減することができるからである。 The solder adhesion prevention treatment may also be performed on the terminal electrodes. Further, when a bonded region is formed by using, for example, a conductive adhesive other than solder, a non-bonded region can be formed by limiting the coating region of the conductive adhesive. Preferably, the bonding region is formed using solder. This is because the joint strength can be improved and the electrical resistance can be reduced.

図１は本発明の一実施形態に係る電子部品の斜視図である。FIG. 1 is a perspective view of an electronic component according to an embodiment of the present invention. 図２は図１に示す電子部品の正面図である。FIG. 2 is a front view of the electronic component shown in FIG. 図３は図１に示す電子部品の平面図である。FIG. 3 is a plan view of the electronic component shown in FIG. 図４は図１に示す電子部品の右側面図（左側面図も同じ形状）である。FIG. 4 is a right side view of the electronic component shown in FIG. 1 (the left side view also has the same shape). 図５は図１に示す電子部品の底面図である。FIG. 5 is a bottom view of the electronic component shown in FIG. 図６は図１に示す外部端子の斜視図である。FIG. 6 is a perspective view of the external terminal shown in FIG. 図７Ａは図６に示す外部端子の正面図である。FIG. 7A is a front view of the external terminal shown in FIG. 図７Ｂは図７Ａに示す外部端子の変形例を示す正面図である。FIG. 7B is a front view showing a modified example of the external terminal shown in FIG. 7A. 図８は図６に示す外部端子の平面図である。FIG. 8 is a plan view of the external terminal shown in FIG. 図９Ａは図６に示す外部端子の右側面図である。9A is a right side view of the external terminal shown in FIG. 図９Ｂは図６に示す外部端子の左側面図である。FIG. 9B is a left side view of the external terminal shown in FIG. 図１０は図６に示す外部端子の底面図である。FIG. 10 is a bottom view of the external terminal shown in FIG. 図１１は図１に示す電子部品を実装した状態を示す概略図である。FIG. 11 is a schematic view showing a state in which the electronic component shown in FIG. 1 is mounted. 図１２は本発明の他の実施形態に係る電子部品の斜視図である。FIG. 12 is a perspective view of an electronic component according to another embodiment of the present invention. 図１３は本発明のさらに他の実施形態に係る電子部品の斜視図である。FIG. 13 is a perspective view of an electronic component according to still another embodiment of the present invention. 図１４は本発明のさらに他の実施形態に係る電子部品の斜視図である。FIG. 14 is a perspective view of an electronic component according to still another embodiment of the present invention. 図１５は図１４に示す外部端子の斜視図である。FIG. 15 is a perspective view of the external terminal shown in FIG. 図１６は本発明の実施例と比較例に係る電子部品の音鳴きの比較を示すグラフである。FIG. 16 is a graph showing a comparison of squealing of electronic components according to an embodiment of the present invention and a comparative example.

以下、本発明を、図面に示す実施形態に基づき説明する。 Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

（第１実施形態）
図１は、本発明の第１実施形態に係る電子部品としてのセラミックコンデンサ１０を示す概略斜視図である。セラミックコンデンサ１０は、チップ部品としてのチップコンデンサ２０と、チップコンデンサ２０のＹ軸方向の両端面にそれぞれ取り付けられた一対の金属端子（外部端子）３０とを有する。 (First Embodiment)
FIG. 1 is a schematic perspective view showing a ceramic capacitor 10 as an electronic component according to the first embodiment of the present invention. The ceramic capacitor 10 has a chip capacitor 20 as a chip component and a pair of metal terminals (external terminals) 30 attached to both end surfaces of the chip capacitor 20 in the Y-axis direction.

なお、各実施形態の説明では、チップコンデンサ２０に一対の金属端子３０が取り付けられたセラミックコンデンサを例に説明を行うが、本発明のセラミック電子部品としてはこれに限らず、コンデンサ以外のチップ部品に金属端子３０が取り付けられたものであっても良い。 In the description of each embodiment, a ceramic capacitor in which a pair of metal terminals 30 are attached to the chip capacitor 20 will be described as an example, but the ceramic electronic component of the present invention is not limited to this, and a chip component other than the capacitor is used. A metal terminal 30 may be attached to the surface.

チップコンデンサ２０は、コンデンサ素体２６と、コンデンサ素体２６のＹ軸方向の両端面にそれぞれ形成してある一対の端子電極２２とを有する。コンデンサ素体２６は、Ｙ軸方向の端面に対して略垂直な４つの側面２６ａ，２６ｂ，２６ｃ，２６ｄを有する。図２に示すように、これらの側面の内、１つの側面２６ａが、回路基板６０の実装面６２に対して最も近づく底側面となる。本実施形態では、底側面２６ａと平行に対向する側面２６ｂが上側面となる。その他の側面２６ｃ，２６ｄは、実装面６２に対して略垂直に配置される。 The chip capacitor 20 has a capacitor body 26 and a pair of terminal electrodes 22 formed on both end faces of the capacitor body 26 in the Y-axis direction. The capacitor body 26 has four side surfaces 26a, 26b, 26c, and 26d that are substantially perpendicular to the end face in the Y-axis direction. As shown in FIG. 2, one of these side surfaces, the side surface 26a, is the bottom side surface closest to the mounting surface 62 of the circuit board 60. In the present embodiment, the side surface 26b facing parallel to the bottom side surface 26a is the upper side surface. The other side surfaces 26c and 26d are arranged substantially perpendicular to the mounting surface 62.

なお、各図面において、Ｘ軸、Ｙ軸およびＺ軸は、相互に垂直であり、実装面６２に対して垂直方向をＺ軸とし、Ｙ軸は、素体２６の端面に垂直な方向であり、Ｘ軸は、側面２６ｃおよび側面２６ｄに垂直な方向である。 In each drawing, the X-axis, the Y-axis, and the Z-axis are perpendicular to each other, the direction perpendicular to the mounting surface 62 is the Z-axis, and the Y-axis is the direction perpendicular to the end surface of the element body 26. , The X-axis is the direction perpendicular to the side surface 26c and the side surface 26d.

コンデンサ素体２６は、内部にセラミック層としての誘電体層と内部電極層とを有し、これらの誘電体層と内部電極層とが交互に積層してある。誘電体層の材質は、特に限定されず、たとえばチタン酸カルシウム、チタン酸ストロンチウム、チタン酸バリウムまたはこれらの混合物などの誘電体材料で構成される。各誘電体層の厚みは、特に限定されないが、数μｍ〜数百μｍのものが一般的である。 The capacitor body 26 has a dielectric layer as a ceramic layer and an internal electrode layer inside, and these dielectric layers and internal electrode layers are alternately laminated. The material of the dielectric layer is not particularly limited, and is composed of a dielectric material such as calcium titanate, strontium titanate, barium titanate, or a mixture thereof. The thickness of each dielectric layer is not particularly limited, but is generally several μm to several hundred μm.

内部電極層に含有される導電体材料は特に限定されないが、誘電体層の構成材料が耐還元性を有する場合には、比較的安価な卑金属を用いることができる。卑金属としては、ＮｉまたはＮｉ合金が好ましい。Ｎｉ合金としては、Ｍｎ，Ｃｒ，ＣｏおよびＡｌから選択される１種以上の元素とＮｉとの合金が好ましく、合金中のＮｉ含有量は９５重量％以上であることが好ましい。なお、ＮｉまたはＮｉ合金中には、Ｐ等の各種微量成分が０．１重量％程度以下含まれていてもよい。また、内部電極層は、市販の電極用ペーストを使用して形成してもよい。内部電極層の厚みは用途等に応じて適宜決定すればよい。 The conductor material contained in the internal electrode layer is not particularly limited, but when the constituent material of the dielectric layer has reduction resistance, a relatively inexpensive base metal can be used. As the base metal, Ni or Ni alloy is preferable. As the Ni alloy, an alloy of one or more elements selected from Mn, Cr, Co and Al and Ni is preferable, and the Ni content in the alloy is preferably 95% by weight or more. The Ni or Ni alloy may contain various trace components such as P in an amount of about 0.1% by weight or less. Further, the internal electrode layer may be formed by using a commercially available electrode paste. The thickness of the internal electrode layer may be appropriately determined according to the application and the like.

端子電極２２の材質も特に限定されず、通常、銅や銅合金、ニッケルやニッケル合金などが用いられるが、銀や銀とパラジウムの合金なども使用することができる。端子電極２２の厚みも特に限定されないが、通常１０〜５０μｍ程度である。なお、端子電極２２の表面には、Ｎｉ、Ｃｕ、Ｓｎ等から選ばれる少なくとも１種の金属被膜が形成されていても良い。特に、Ｃｕ焼付層/Ｎｉめっき層/Ｓｎめっき層とするのが好ましい。 The material of the terminal electrode 22 is not particularly limited, and copper, a copper alloy, nickel, a nickel alloy, or the like is usually used, but silver or an alloy of silver and palladium can also be used. The thickness of the terminal electrode 22 is not particularly limited, but is usually about 10 to 50 μm. The surface of the terminal electrode 22 may be formed with at least one metal film selected from Ni, Cu, Sn, and the like. In particular, a Cu baking layer / Ni plating layer / Sn plating layer is preferable.

また、本実施形態では、好ましくは、端子電極２２は、少なくとも樹脂電極層を有する多層電極膜で構成してある。樹脂電極層が振動を吸収することで、後述する音鳴きをさらに有効に抑制することができる。樹脂電極層を有する端子電極２２としては、たとえば素体２６に接触する側から焼付層／樹脂電極層／Ｎｉめっき層／Ｓｎめっき層からなることが好ましい。 Further, in the present embodiment, preferably, the terminal electrode 22 is composed of a multilayer electrode film having at least a resin electrode layer. By absorbing the vibration by the resin electrode layer, it is possible to more effectively suppress the squealing described later. The terminal electrode 22 having the resin electrode layer is preferably composed of, for example, a baking layer / resin electrode layer / Ni plating layer / Sn plating layer from the side in contact with the element body 26.

また、端子電極２２は、図２に示すように、素体２６のＹ軸方向の両端面にそれぞれ位置して端面を覆う端面電極部２２ａと、素体２６の端面から当該端面近くの複数の側面２６ａ〜２６ｄを所定被覆幅Ｌ１で被覆するように端面電極部２２ａと一体に形成される側面電極部２２ｂとを有する。 Further, as shown in FIG. 2, the terminal electrode 22 includes an end face electrode portion 22a which is located on both end faces of the element body 26 in the Y-axis direction and covers the end face, and a plurality of terminal electrodes 22 near the end face from the end face of the element body 26. It has a side electrode portion 22b formed integrally with the end face electrode portion 22a so as to cover the side surfaces 26a to 26d with a predetermined coating width L1.

本実施形態では、側面電極部２２ｂは、実質的に形成されていなくとも良く、端子電極２２は、端面電極部２２ａのみで実質的に構成してあることが好ましい。仮に側面電極部２２ｂが形成されているとしても、後述する金属端子３０における支持部３８のＹ軸方向の突出長さＬ２が、側面電極部２２ｂの被覆幅Ｌ１よりも長いことが好ましい。このように構成することで、端子電極２２と実装接続部３４との間での半田ブリッジを効果的に抑制することができる。 In the present embodiment, the side electrode portion 22b does not have to be substantially formed, and it is preferable that the terminal electrode 22 is substantially composed of only the end face electrode portion 22a. Even if the side electrode portion 22b is formed, it is preferable that the protruding length L2 of the support portion 38 in the metal terminal 30 described later in the Y-axis direction is longer than the covering width L1 of the side electrode portion 22b. With such a configuration, the solder bridge between the terminal electrode 22 and the mounting connection portion 34 can be effectively suppressed.

図１〜図１０に示すように、各金属端子３０は、素体２０のＹ軸方向の端面に形成してある端子電極２２の端面電極部２２ａと向き合うように配置される端子電極接続部３２と、実装面６２に接続可能な実装接続部３４と、を有する。図２に示すように、実装面６２から最も近い素体２６の底側面２６ａを実装面６２から所定距離Ｈ５で離すように端子電極接続部３２と実装接続部３４とは、これらと一体に成形してある連結部３６により連結してある。金属端子３０の厚みは、特に限定されないが、好ましくは０．０５〜０．１０ｍｍである。 As shown in FIGS. 1 to 10, each metal terminal 30 is arranged so as to face the end face electrode portion 22a of the terminal electrode 22 formed on the end face of the element body 20 in the Y-axis direction. And a mounting connection portion 34 that can be connected to the mounting surface 62. As shown in FIG. 2, the terminal electrode connecting portion 32 and the mounting connecting portion 34 are integrally molded so that the bottom side surface 26a of the element body 26 closest to the mounting surface 62 is separated from the mounting surface 62 at a predetermined distance H5. It is connected by the connecting portion 36. The thickness of the metal terminal 30 is not particularly limited, but is preferably 0.05 to 0.10 mm.

連結部３６は、実装接続部３４が底側面２６ａに所定距離（所定距離Ｈ５から実装接続部３４の厚みを引いた距離）で向き合うように、端子電極接続部３２から底側面２６ａ方向（内側）に折り曲げられた曲折形状を有する。曲折形状の外側曲げ半径Ｒは、所定距離Ｈ５などとの関係で求められ、所定距離Ｈ５と同程度以下であり、好ましくは所定距離Ｈ５の０．３倍以上である。このように構成することで、部品の小型化に寄与すると共に、音鳴き防止効果が向上する。 The connecting portion 36 is directed from the terminal electrode connecting portion 32 to the bottom side surface 26a (inside) so that the mounting connecting portion 34 faces the bottom side surface 26a at a predetermined distance (distance obtained by subtracting the thickness of the mounting connecting portion 34 from the predetermined distance H5). It has a bent shape that is bent into. The outer bending radius R of the bent shape is determined in relation to the predetermined distance H5 and the like, is about the same as or less than the predetermined distance H5, and is preferably 0.3 times or more the predetermined distance H5. With such a configuration, it contributes to the miniaturization of parts and improves the effect of preventing squealing.

図４に示すように、連結部の幅Ｗ１は端子電極接続部３２の幅Ｗ０よりも小さくなっている。連結部３６の幅Ｗ１と端子電極接続部３２の幅Ｗ０との比率Ｗ１／Ｗ０は、好ましくは、０．３〜０．８、さらに好ましくは０．５〜０．７である。このような関係にある時に、音鳴き防止効果が高まると共に、金属端子の十分な機械的強度を確保することができる。なお、端子電極接続部３２の幅Ｗ０は、素体２６のＸ軸方向幅Ｗ３と略同一か、あるいは少し小さくても良い。Ｗ３／Ｗ０は、好ましくは１．０〜１．４である。 As shown in FIG. 4, the width W1 of the connecting portion is smaller than the width W0 of the terminal electrode connecting portion 32. The ratio W1 / W0 of the width W1 of the connecting portion 36 to the width W0 of the terminal electrode connecting portion 32 is preferably 0.3 to 0.8, and more preferably 0.5 to 0.7. In such a relationship, the effect of preventing squealing is enhanced, and sufficient mechanical strength of the metal terminal can be ensured. The width W0 of the terminal electrode connecting portion 32 may be substantially the same as or slightly smaller than the width W3 in the X-axis direction of the element body 26. W3 / W0 is preferably 1.0 to 1.4.

音鳴きは、素体２６の大部分を構成するセラミック層に高周波電圧が印加されて電歪効果により振動し、その振動が金属端子３０および／または実装面６２に伝わることにより発生すると考えられる。本実施形態では、連結部３６の幅Ｗ１が端子電極接続部３２の幅Ｗ０よりも小さくなっていることから、チップコンデンサ２０の電歪振動が実装面６２に伝わりにくくなり、この点でも音鳴きを低減できる。 It is considered that the squeal is generated when a high frequency voltage is applied to the ceramic layer constituting most of the element body 26 and vibrates due to the electric strain effect, and the vibration is transmitted to the metal terminal 30 and / or the mounting surface 62. In the present embodiment, since the width W1 of the connecting portion 36 is smaller than the width W0 of the terminal electrode connecting portion 32, the electrostrictive vibration of the chip capacitor 20 is less likely to be transmitted to the mounting surface 62, and this point also makes a noise. Can be reduced.

図１に示すように、端子電極接続部３２には、素体２６の端面の一部を覆わない形状の溝３３が形成してあり、溝３３は、連結部３６には達しないように形成してある。溝３３は、図４に示すように、実装面６２とは反対側に位置する素体２６の上側面２６ｂに向けて開口する開口部３３ａを有する。また、好ましくは、溝３３は、端子電極接続部３２のＸ軸方向（幅方向）の中央部に形成してある。さらに、好ましくは、溝３３の両側に位置する端子電極接続部３２には、端面電極部２２ａに接続される一対の接続片３２ａ，３２ａが形成してある。 As shown in FIG. 1, the terminal electrode connecting portion 32 is formed with a groove 33 having a shape that does not cover a part of the end face of the element body 26, and the groove 33 is formed so as not to reach the connecting portion 36. It is done. As shown in FIG. 4, the groove 33 has an opening 33a that opens toward the upper side surface 26b of the element body 26 located on the side opposite to the mounting surface 62. Further, preferably, the groove 33 is formed in the central portion of the terminal electrode connecting portion 32 in the X-axis direction (width direction). Further, preferably, a pair of connecting pieces 32a, 32a connected to the end face electrode portion 22a are formed in the terminal electrode connecting portions 32 located on both sides of the groove 33.

図４に示すように、溝３３のＸ軸方向幅Ｗ４は、端子電極接続部３２の幅Ｗ０に対しての比率（Ｗ４／Ｗ０）が、好ましくは０．３〜０．５である。なお、溝３３のＸ軸方向の両側に形成される接続片３２ａ，３２ａのそれぞれの幅Ｗ５ａ，Ｗ５ｂは、同じでも異なっていても良い。また、溝３３のＺ軸方向の深さＨ１は、特に限定されないが、素体２６のＺ軸方向高さＨ０との関係で決定されることが好ましく、Ｈ１／Ｈ０は、好ましくは０〜１、さらに好ましくは０．１〜０．６である。このような関係にある時に、端子電極２２と金属端子３０との接続が特に容易であると共に、接続強度が向上し、しかも半田ブリッジも抑制できる。 As shown in FIG. 4, the width W4 of the groove 33 in the X-axis direction has a ratio (W4 / W0) of the terminal electrode connecting portion 32 to the width W0, preferably 0.3 to 0.5. The widths W5a and W5b of the connection pieces 32a and 32a formed on both sides of the groove 33 in the X-axis direction may be the same or different. The depth H1 of the groove 33 in the Z-axis direction is not particularly limited, but is preferably determined in relation to the height H0 of the element body 26 in the Z-axis direction, and H1 / H0 is preferably 0 to 1. , More preferably 0.1 to 0.6. In such a relationship, the connection between the terminal electrode 22 and the metal terminal 30 is particularly easy, the connection strength is improved, and the solder bridge can be suppressed.

なお、素体２６の底側面２６ａからの端子電極接続部３２のＺ軸方向高さＨ２は、素体２６のＺ軸方向高さＨ０と同程度が好ましく、または少し小さくても良い。すなわち、Ｈ２／Ｈ０は、好ましくは０．７〜１．０である。 The height H2 of the terminal electrode connecting portion 32 from the bottom side surface 26a of the element body 26 in the Z-axis direction is preferably about the same as the height H0 in the Z-axis direction of the element body 26, or may be slightly smaller. That is, H2 / H0 is preferably 0.7 to 1.0.

本実施形態では、溝３３を形成することで、小さいチップコンデンサ２０（たとえば１ｍｍ×０．５ｍｍ×１ｍｍ以下）においても、金属端子３０の端子電極接続部３２と端子電極２２の端面電極部２２ａとの半田５０などによる接続が容易となると共に、これらの接続強度も向上する。また、溝３３が形成してあることで、金属端子３０と端子電極２２との接続の確認が容易であり、接続不良を効果的に防止することができる。さらに、溝３３は、連結部３６には達していないために、溝３３による貫通孔が連結部３６には形成されず、その貫通孔に半田が充填されて半田ブリッジが生じるおそれがなくなる。 In the present embodiment, by forming the groove 33, even in a small chip capacitor 20 (for example, 1 mm × 0.5 mm × 1 mm or less), the terminal electrode connection portion 32 of the metal terminal 30 and the end face electrode portion 22a of the terminal electrode 22 The connection with the solder 50 and the like is facilitated, and the connection strength of these is also improved. Further, since the groove 33 is formed, it is easy to confirm the connection between the metal terminal 30 and the terminal electrode 22, and it is possible to effectively prevent the connection failure. Further, since the groove 33 does not reach the connecting portion 36, the through hole formed by the groove 33 is not formed in the connecting portion 36, and there is no possibility that the through hole is filled with solder to form a solder bridge.

図４に示すように、本実施形態では、連結部の幅Ｗ１と同一方向（Ｘ軸）に沿って、実装接続部３４の幅Ｗ２が、連結部３６の幅Ｗ１よりも大きい。このように構成することで、実装接続部３４と実装面６２との接続強度が向上する。また、連結部の幅Ｗ１と同一方向に沿って、実装接続部の幅Ｗ２が、素体２６の幅Ｗ３と略等しいことが好ましいが、素体２６の幅Ｗ３より多少狭くても良い。すなわち、Ｗ２／Ｗ３は、好ましくは０．７〜１．０である。このように構成することで、実装接続部３４と実装面６２との接続強度が向上するとともに、必要以上に実装接続部３４が大きくならず（素体２６のＸ軸方向幅Ｗ３からはみ出さない）、部品の小型化にも寄与する。 As shown in FIG. 4, in the present embodiment, the width W2 of the mounting connection portion 34 is larger than the width W1 of the connecting portion 36 along the same direction (X axis) as the width W1 of the connecting portion. With this configuration, the connection strength between the mounting connection portion 34 and the mounting surface 62 is improved. Further, it is preferable that the width W2 of the mounting connection portion is substantially equal to the width W3 of the element body 26 along the same direction as the width W1 of the connection portion, but it may be slightly narrower than the width W3 of the element body 26. That is, W2 / W3 is preferably 0.7 to 1.0. With this configuration, the connection strength between the mounting connection portion 34 and the mounting surface 62 is improved, and the mounting connection portion 34 does not become larger than necessary (does not protrude from the X-axis direction width W3 of the element body 26). ), It also contributes to the miniaturization of parts.

図２に示すように、実装接続部３４と連結部３６との境界位置と素体２６の端面との間のＹ軸方向距離Ｌ３は、支持部３８の突出長さＬ２などとの関係で決定され、Ｌ３／Ｌ２は、好ましくは０．６〜１．０である。また、実装接続部３４のＹ軸方向長さＬ４は、素体２６のＹ軸方向長さＬ０との関係などにより決定され、Ｌ４／Ｌ０は、好ましくは０．２〜０．４である。 As shown in FIG. 2, the Y-axis direction distance L3 between the boundary position between the mounting connection portion 34 and the connection portion 36 and the end surface of the element body 26 is determined in relation to the protrusion length L2 of the support portion 38 and the like. L3 / L2 is preferably 0.6 to 1.0. Further, the length L4 in the Y-axis direction of the mounting connection portion 34 is determined by the relationship with the length L0 in the Y-axis direction of the element body 26, and L4 / L0 is preferably 0.2 to 0.4.

本実施形態では、端子電極接続部３２と連結部３６との境界位置では、素体２６の底側面２６ａに向けて突出して底側面２６ａを保持する支持部３８が、端子電極接続部３２と一体に成形してある。支持部３８は、端子電極接続部３２の幅方向（Ｘ軸）に沿った両側から、素体２６の底側面２６ａに向けて突出する一対の支持部３８，３８で構成してある。 In the present embodiment, at the boundary position between the terminal electrode connecting portion 32 and the connecting portion 36, the support portion 38 projecting toward the bottom side surface 26a of the element body 26 and holding the bottom side surface 26a is integrated with the terminal electrode connecting portion 32. It is molded into. The support portion 38 is composed of a pair of support portions 38, 38 protruding from both sides along the width direction (X axis) of the terminal electrode connecting portion 32 toward the bottom side surface 26a of the element body 26.

図２に示すように、本実施形態では、金属端子３０の端子電極接続部３２と端子電極２２の端面電極部２２ａとの間には、接合領域５０ａと非接合領域５０ｂとが形成してあり、非接合領域５０ｂが、端子電極接続部３２から支持部３８にまで形成してある。 As shown in FIG. 2, in the present embodiment, a bonded region 50a and a non-bonded region 50b are formed between the terminal electrode connecting portion 32 of the metal terminal 30 and the end face electrode portion 22a of the terminal electrode 22. The non-bonded region 50b is formed from the terminal electrode connecting portion 32 to the supporting portion 38.

接合領域５０ａは、半田５０により、金属端子３０の端子電極接続部３２と端子電極２２の端面電極部２２ａとが機械的および電気的に接合してある領域である。また、非接合領域５０ｂは、半田５０が存在しない領域であり、金属端子３０の端子電極接続部３２と端子電極２２の端面電極部２２ａとがハンダによる接合が成されていない領域である。この非接合領域５０ｂは、端子電極接続部３２から支持部３８にまで連続的に形成してある。 The bonding region 50a is a region in which the terminal electrode connecting portion 32 of the metal terminal 30 and the end face electrode portion 22a of the terminal electrode 22 are mechanically and electrically bonded by the solder 50. The non-bonded region 50b is a region in which the solder 50 does not exist, and is a region in which the terminal electrode connecting portion 32 of the metal terminal 30 and the end face electrode portion 22a of the terminal electrode 22 are not bonded by soldering. The non-bonded region 50b is continuously formed from the terminal electrode connecting portion 32 to the supporting portion 38.

本実施形態では、非接合領域５０ｂを、端子電極接続部３２から支持部３８にまで形成することで、音鳴きを低減できる。その理由としては、必ずしも明らかではないが、非接合領域５０ｂが振動の緩和領域となり、チップコンデンサ２０の電歪振動が実装面６２に伝わりにくくなるためではないかと考えられる。 In the present embodiment, the non-junction region 50b is formed from the terminal electrode connecting portion 32 to the supporting portion 38, so that noise can be reduced. The reason is not necessarily clear, but it is considered that the non-junction region 50b becomes a vibration relaxation region, and the electrostrictive vibration of the chip capacitor 20 is less likely to be transmitted to the mounting surface 62.

接合領域５０ａは、端子電極接続部３２のＺ軸方向上端から下方に向けて所定の高さＨ６の範囲で形成されることが好ましい。この接合領域５０ａが形成される高さＨ６は、端子電極接続部３２のＺ軸方向上端から支持部３８の上表面３８ａまでの高さＨ７よりも小さい。特に限定されないが、Ｈ６／Ｈ７は、好ましくは、０．２以上で１．０未満、さらに好ましくは０．３〜０．９、特に好ましくは０．４〜０．８である。少なくともこのような範囲でＨ６／Ｈ７を変化させても、音鳴き現象を低減することができると共に、金属端子３０と端子電極２２との十分な接合強度が得られることが確認された。 The bonding region 50a is preferably formed in a range of a predetermined height H6 from the upper end of the terminal electrode connecting portion 32 in the Z-axis direction downward. The height H6 at which the joint region 50a is formed is smaller than the height H7 from the upper end of the terminal electrode connecting portion 32 in the Z-axis direction to the upper surface 38a of the supporting portion 38. Although not particularly limited, H6 / H7 is preferably 0.2 or more and less than 1.0, more preferably 0.3 to 0.9, and particularly preferably 0.4 to 0.8. It was confirmed that even if H6 / H7 is changed at least in such a range, the squealing phenomenon can be reduced and sufficient bonding strength between the metal terminal 30 and the terminal electrode 22 can be obtained.

非接合領域５０ｂを、端子電極接続部３２の下方位置（高さＨ６の下端位置）から支持部３８にまで形成するための手段としては、特に限定されないが、たとえば図６に示すように、少なくとも支持部３８の上表面３８ａに半田付着防止領域（図６中の点々によるハッチング部分）を形成すれば良い。半田付着防止領域は、支持部３８の上表面３８ａと共に、その近くに位置する端子電極接続部３２における端面電極部２２ａとの対向面３２ｂにも形成する。さらに、連結部３６の内側面３６ａの少なくとも一部にまで連続して半田付着防止領域を形成しても良い。 The means for forming the non-bonded region 50b from the lower position of the terminal electrode connecting portion 32 (the lower end position of the height H6) to the supporting portion 38 is not particularly limited, but at least as shown in FIG. 6, for example. A solder adhesion prevention region (hatched portion formed by dots in FIG. 6) may be formed on the upper surface 38a of the support portion 38. The solder adhesion prevention region is formed not only on the upper surface 38a of the support portion 38 but also on the facing surface 32b of the terminal electrode connecting portion 32 located near the support portion 38 with the end face electrode portion 22a. Further, a solder adhesion prevention region may be continuously formed up to at least a part of the inner side surface 36a of the connecting portion 36.

なお、実装接続部３４の上面３４ａと底面３４ｂには、図１１に示すように、半田５２が付着して実装接続部３４を回路基板６０の実装面６２に強固に接続するために、半田付着防止領域を形成しないことが好ましい。また、連結部３６の外表面３６ｂにも、半田５２が付着して実装接続部３４を回路基板６０の実装面６２に強固に接続するために、半田付着防止領域を形成しないことが好ましい。ただし、実装接続部３４の上面３４ａは、必ずしも半田５２が付着しなくても良いことから、そこに半田付着防止領域を、前述した半田付着防止領域に連続して形成しても良い。 As shown in FIG. 11, solder 52 adheres to the upper surface 34a and the bottom surface 34b of the mounting connection portion 34, and solder adheres to the mounting connection portion 34 in order to firmly connect the mounting connection portion 34 to the mounting surface 62 of the circuit board 60. It is preferable not to form a prevention region. Further, in order to adhere the solder 52 to the outer surface 36b of the connecting portion 36 and firmly connect the mounting connecting portion 34 to the mounting surface 62 of the circuit board 60, it is preferable not to form the solder adhesion prevention region. However, since the solder 52 does not necessarily adhere to the upper surface 34a of the mounting connection portion 34, a solder adhesion prevention region may be continuously formed on the solder adhesion prevention region described above.

図６および図７Ａに示す金属端子３０の端子電極接続部３２において、半田付着防止領域が形成されていないＺ軸方向の高さＨ６ａは、図２に示す接合領域５０ａの高さＨ６と略一致するが、半田５０の量などによっては、必ずしも一致しなくても良い。 In the terminal electrode connection portion 32 of the metal terminal 30 shown in FIGS. 6 and 7A, the height H6a in the Z-axis direction in which the solder adhesion prevention region is not formed substantially coincides with the height H6 of the bonding region 50a shown in FIG. However, it does not necessarily have to match depending on the amount of solder 50 and the like.

なお、図２などでは、一対の支持部３８，３８は、素体２６の底側面２６ａに接触するように描いてあるが、実際には必ずしも接触していなくてもよい。また、非接合領域５０ｂにおいて、端面電極部２２ａと端子電極接続部３２との間には、隙間が存在するように描いてあるが、必ずしも隙間が常にある必要はなく、少なくとも一部が接触していても良い。ただし、半田５０により接合ではない。 In FIG. 2 and the like, the pair of support portions 38, 38 are drawn so as to be in contact with the bottom side surface 26a of the element body 26, but they do not necessarily have to be in contact with each other. Further, in the non-bonded region 50b, the gap is drawn so as to exist between the end face electrode portion 22a and the terminal electrode connecting portion 32, but the gap does not necessarily have to be always present, and at least a part of the gap is in contact with each other. You may be. However, it is not joined by the solder 50.

一対の支持部３８，３８のＸ軸方向幅は、それぞれ同じであることが好ましいが、必ずしも同じではなくても良い。本実施形態では、図２に示すように、Ｘ軸方向に沿って、連結部３６と支持部３８とは位置ズレしており、素体２６の底側面２６ａ側に向けて端子電極接続部３２から折り曲げてある。 The widths of the pair of support portions 38, 38 in the X-axis direction are preferably the same, but are not necessarily the same. In the present embodiment, as shown in FIG. 2, the connecting portion 36 and the supporting portion 38 are displaced from each other along the X-axis direction, and the terminal electrode connecting portion 32 is directed toward the bottom side surface 26a side of the element body 26. It is bent from.

本実施形態では、支持部３８を設けることで、特に、半田５０による接合前または半田５０による接合作業に際し、金属端子３０によるチップコンデンサ２０の保持が確実なものとなり、半田の作業が容易になる。半田５０による接合により、金属端子３０は多少変形することがあり、接合後に、支持部３８は、チップコンデンサ２０の底側面２６ａに接触しなくなることもあるが、何ら問題なく、むしろ音鳴き防止の観点からは好ましい。 In the present embodiment, by providing the support portion 38, in particular, before joining with the solder 50 or during the joining work with the solder 50, the holding of the chip capacitor 20 by the metal terminal 30 is ensured, and the soldering work becomes easy. .. The metal terminal 30 may be slightly deformed by joining with the solder 50, and the support portion 38 may not come into contact with the bottom side surface 26a of the chip capacitor 20 after joining. From the point of view, it is preferable.

また、本実施形態では、図５に示すように、素体２６のＹ軸方向の両端面近くでは、実装面と垂直方向（Ｚ軸方向）から見て、実装接続部３４と支持部３８とは重ならない部分を有する。このように構成することで、図１１に示すように、実装面６２に形成してある回路パターン６４と実装接続部３４とを接続する半田５２が支持部３８にまで延びることを有効に防止でき、いわゆる半田ブリッジ現象を抑制することができる。 Further, in the present embodiment, as shown in FIG. 5, near both end faces of the element body 26 in the Y-axis direction, the mounting connection portion 34 and the support portion 38 are viewed from the direction perpendicular to the mounting surface (Z-axis direction). Has non-overlapping parts. With this configuration, as shown in FIG. 11, it is possible to effectively prevent the solder 52 that connects the circuit pattern 64 formed on the mounting surface 62 and the mounting connection portion 34 from extending to the support portion 38. , The so-called solder bridge phenomenon can be suppressed.

半田ブリッジが生じてしまうと、音鳴きが生じやすくなることから、半田ブリッジの低減が望まれている。なお、半田ブリッジの低減が図れるために、実装面６２とチップ部品２０との隙間を、たとえばＨ５＝０．２ｍｍ以下にもすることが可能であり、装置全体の高さＨ３を低減することができ、装置の薄型化にも寄与する。 If a solder bridge is generated, noise is likely to occur. Therefore, it is desired to reduce the solder bridge. Since the number of solder bridges can be reduced, the gap between the mounting surface 62 and the chip component 20 can be set to, for example, H5 = 0.2 mm or less, and the height H3 of the entire device can be reduced. It can also contribute to making the device thinner.

チップコンデンサ２０の形状やサイズは、目的や用途に応じて適宜決定すればよい。チップコンデンサ２０が直方体形状の場合は、通常、縦（０．６〜５．６ｍｍ）×横（０．３〜５．０ｍｍ）×厚み（０．１〜５．６ｍｍ）程度である。 The shape and size of the chip capacitor 20 may be appropriately determined according to the purpose and application. When the chip capacitor 20 has a rectangular parallelepiped shape, it is usually about vertical (0.6 to 5.6 mm) x horizontal (0.3 to 5.0 mm) x thickness (0.1 to 5.6 mm).

セラミックコンデンサ１０の製造方法
以下に、セラミックコンデンサ１０の製造方法について説明する。まず、チップコンデンサ２０を製造する。焼成後に誘電体層となるグリーンシートを形成するために、グリーンシート用塗料を準備する。グリーンシート用塗料は、本実施形態では、誘電体材料の原料と有機ビヒクルとを混練して得られた有機溶剤系ペースト、または水系ペーストで構成される。 Manufacturing Method of Ceramic Capacitor 10 The manufacturing method of the ceramic capacitor 10 will be described below. First, the chip capacitor 20 is manufactured. A paint for a green sheet is prepared in order to form a green sheet that becomes a dielectric layer after firing. In the present embodiment, the green sheet paint is composed of an organic solvent-based paste or an aqueous paste obtained by kneading a raw material of a dielectric material and an organic vehicle.

誘電体材料の原料としては、焼成後にチタン酸カルシウム、チタン酸ストロンチウム、チタン酸バリウムとなる各種化合物、たとえば炭酸塩、硝酸塩、水酸化物、有機金属化合物などから適宜選択され、混合して用いることができる。 As the raw material of the dielectric material, various compounds that become calcium titanate, strontium titanate, and barium titanate after firing are appropriately selected from, for example, carbonates, nitrates, hydroxides, organometallic compounds, etc., and mixed and used. Can be done.

次に、上述のグリーンシート用塗料を用いて、キャリアシート上に、グリーンシートを形成する。次に、グリーンシートの一方の表面に、焼成後に内部電極層となる電極パターンを形成する。電極パターンの形成方法としては、特に限定されないが、印刷法、転写法、薄膜法などが例示される。グリーンシートの上に電極パターンを形成した後、乾燥することにより、電極パターンが形成されたグリーンシートを得る。 Next, a green sheet is formed on the carrier sheet by using the above-mentioned paint for green sheet. Next, an electrode pattern that becomes an internal electrode layer after firing is formed on one surface of the green sheet. The method for forming the electrode pattern is not particularly limited, and examples thereof include a printing method, a transfer method, and a thin film method. An electrode pattern is formed on the green sheet and then dried to obtain a green sheet on which the electrode pattern is formed.

内部電極層用塗料を製造する際に用いる導電体材料としては、ＮｉやＮｉ合金、さらにはこれらの混合物を用いることが好ましい。このような導電体材料は、球状、リン片状等、その形状に特に制限はなく、また、これらの形状のものが混合したものであってもよい。 As the conductor material used in producing the coating material for the internal electrode layer, it is preferable to use Ni, a Ni alloy, or a mixture thereof. The shape of such a conductor material is not particularly limited, such as spherical or flaky, and a mixture of these shapes may be used.

次に、内部電極パターンが形成されたグリーンシートを、キャリアシートから剥離しつつ所望の積層数まで積層し、グリーン積層体を得る。なお、積層の最初と最後には、内部電極パターンが形成されていない外層用グリーンシートを、積層する。 Next, the green sheet on which the internal electrode pattern is formed is laminated to a desired number of layers while being peeled from the carrier sheet to obtain a green laminate. At the beginning and the end of the lamination, the outer layer green sheet on which the internal electrode pattern is not formed is laminated.

その後、このグリーン積層体を最終加圧し、必要に応じて研磨処理を行い、脱バインダ処理を行う。続いて、グリーンチップの焼成を実施する。焼成条件は特に限定されない。焼成後に、必要に応じてアニール処理、研磨等を施すことにより、図１に示すコンデンサ素体２６を得る。 After that, the green laminate is finally pressurized, polished if necessary, and debindered. Subsequently, the green chips are fired. The firing conditions are not particularly limited. After firing, the capacitor body 26 shown in FIG. 1 is obtained by subjecting it to annealing treatment, polishing, or the like as necessary.

その後、コンデンサ素体２６に端子電極２２を形成する。端子電極２２は、たとえば端子電極用塗料を焼きつけて下地電極を形成した後、下地電極の表面にめっきによる金属被膜を形成することにより、作製する。なお、端子電極用塗料は、上記した内部電極層用塗料と同様にして調製することができる。 After that, the terminal electrode 22 is formed on the capacitor body 26. The terminal electrode 22 is manufactured, for example, by baking a paint for a terminal electrode to form a base electrode, and then forming a metal film by plating on the surface of the base electrode. The terminal electrode paint can be prepared in the same manner as the internal electrode layer paint described above.

また、樹脂電極層を有する端子電極２２を形成する場合には、たとえば素体２６の端面に焼付層から成る下地電極を形成した後、樹脂電極ペースト膜を塗布して樹脂電極層を形成する。その後に、Ｎｉめっき層およびＳｎめっき層を形成すれば良い。 When the terminal electrode 22 having the resin electrode layer is formed, for example, a base electrode made of a baking layer is formed on the end face of the element body 26, and then a resin electrode paste film is applied to form the resin electrode layer. After that, a Ni plating layer and a Sn plating layer may be formed.

金属端子３０の製造では、まず、平板状の金属板材を準備する。金属板材の材質は、導電性を有する金属材料であれば特に限定されず、例えば鉄、ニッケル、銅、銀等若しくはこれらを含む合金を用いることができる。 In the manufacture of the metal terminal 30, first, a flat metal plate material is prepared. The material of the metal plate material is not particularly limited as long as it is a conductive metal material, and for example, iron, nickel, copper, silver or the like or an alloy containing these can be used.

次に、金属板材を機械加工することにより、図６〜図１０に示す金属端子３０を得る。具体的な加工方法は特に限定されないが、たとえばプレス加工が好ましく用いられる。金属端子３０の表面には、めっきによる金属被膜を形成してもよい。 Next, the metal terminal 30 shown in FIGS. 6 to 10 is obtained by machining the metal plate material. The specific processing method is not particularly limited, but for example, press processing is preferably used. A metal film by plating may be formed on the surface of the metal terminal 30.

めっきに用いる材料としては、特に限定されないが、例えばＮｉ、Ｃｕ、Ｓｎ等が挙げられる。めっき処理の後、またはめっき処理に際して、たとえば後述する方法により、金属端子３０の表面における所定領域には、半田付着防止処理を行い、半田付着防止領域を形成する。 The material used for plating is not particularly limited, and examples thereof include Ni, Cu, Sn, and the like. After the plating treatment or during the plating treatment, for example, a solder adhesion prevention treatment is performed on a predetermined region on the surface of the metal terminal 30 by a method described later to form a solder adhesion prevention region.

上述のようにして得られたチップコンデンサ２０のＹ軸方向の両端面に形成してある端子電極２２に、金属端子３０の端子電極接続部３２を接続する。本実施形態では、これらを半田５０により接続し、図２に示すように、接合領域５０ａと非接合領域５０ｂとを形成する。非接合領域５０ｂは、金属端子３０の所定領域の表面に形成された半田付着防止領域に対応して形成される。 The terminal electrode connection portion 32 of the metal terminal 30 is connected to the terminal electrodes 22 formed on both end faces of the chip capacitor 20 obtained as described above in the Y-axis direction. In the present embodiment, these are connected by the solder 50 to form a bonded region 50a and a non-bonded region 50b as shown in FIG. The non-bonded region 50b is formed corresponding to the solder adhesion prevention region formed on the surface of the predetermined region of the metal terminal 30.

半田付着防止領域は、下記のようにして形成される。たとえば金属端子３０の全表面に対して、錫めっきなどが施されて、半田が付着しやすい表面になっている場合において、金属端子３０における半田付着防止領域を形成したい領域のみに、レーザ照射を行えばよい。レーザ照射により錫めっき層を除去され、半田が付着しにくい表面が露出し、希望とする表面に半田付着防止領域を形成することができる。 The solder adhesion prevention region is formed as follows. For example, when the entire surface of the metal terminal 30 is tin-plated to have a surface on which solder easily adheres, laser irradiation is applied only to the region where the solder adhesion prevention region is desired to be formed on the metal terminal 30. Just do it. The tin plating layer is removed by laser irradiation, the surface on which solder does not easily adhere is exposed, and a solder adhesion prevention region can be formed on the desired surface.

あるいは、半田の付着を防止するレジスト層を、金属端子３０における半田付着防止領域を形成したい領域のみに形成して、希望とする表面に半田付着防止領域を形成しても良い。レジスト層としては、たとえばプリント基板等に用いられる一般的なソルダ―レジストインクが使用可能で、その主成分は硬化性エポキシ樹脂から形成される。または、金属端子３０の表面に、錫めっきを行う際に、そのめっき領域を限定して行うことで、その錫めっきがされない領域に、半田付着防止領域を形成しても良い。 Alternatively, the resist layer for preventing solder adhesion may be formed only in the region where the solder adhesion prevention region is desired to be formed in the metal terminal 30, and the solder adhesion prevention region may be formed on the desired surface. As the resist layer, for example, a general solder-resist ink used for a printed circuit board or the like can be used, and the main component thereof is formed of a curable epoxy resin. Alternatively, when tin plating is performed on the surface of the metal terminal 30, the plating region may be limited to form a solder adhesion prevention region in the region where the tin plating is not performed.

あるいは、図７Ｂに示すように、端子電極接続部３２のＺ軸方向の上端から下方に向けて所定の高さＨ６ａの位置に、半田溜まり用凹部３２ｃを端子電極接続部３２の内面に形成することで、その凹部３２ｃより下方を、半田付着防止領域としても良い。凹部３２ｃは、Ｙ軸方向に連続的に形成してあることが好ましい。この凹部３２ｃに余分な半田が流れ込んで溜まることにより、たとえば図２に示す半田５０が、支持部３８までは到達しなくなり、その手前に、非接合領域５０ｂが形成される。 Alternatively, as shown in FIG. 7B, a solder collecting recess 32c is formed on the inner surface of the terminal electrode connecting portion 32 at a predetermined height H6a from the upper end of the terminal electrode connecting portion 32 in the Z-axis direction downward. Therefore, the area below the recess 32c may be used as a solder adhesion prevention region. The recess 32c is preferably formed continuously in the Y-axis direction. When excess solder flows into and accumulates in the recess 32c, for example, the solder 50 shown in FIG. 2 does not reach the support portion 38, and a non-bonded region 50b is formed in front of the support portion 38.

（第２実施形態）
図１２は、本発明の第２実施形態に係るセラミックコンデンサ１０Ａの斜視図である。本実施形態に係るセラミックコンデンサ１０Ａは、図１〜図１１に示す第１実施形態に係るセラミックコンデンサ１０と下記に示す以外は、同様な構成を有し、同様な作用効果を奏するので、共通する部分には、共通する部材符号を付し、共通する部分の説明は省略する。 (Second Embodiment)
FIG. 12 is a perspective view of the ceramic capacitor 10A according to the second embodiment of the present invention. The ceramic capacitor 10A according to the present embodiment has the same configuration as the ceramic capacitor 10 according to the first embodiment shown in FIGS. 1 to 11 except as shown below, and has the same effect and effect, and thus is common. A common member code is attached to the portion, and the description of the common portion will be omitted.

図１２に示すように、本実施形態では、端子電極３０Ａの端子電極接続部３２Ａには、図１に示す溝３３が形成されていない。本実施形態のセラミックコンデンサ１０Ａは、図１に示す溝３３が形成されていない以外は、第１実施形態のセラミックコンデンサ１０と同様な構成を有し、同様な作用効果を奏する。 As shown in FIG. 12, in the present embodiment, the groove 33 shown in FIG. 1 is not formed in the terminal electrode connecting portion 32A of the terminal electrode 30A. The ceramic capacitor 10A of the present embodiment has the same configuration as the ceramic capacitor 10 of the first embodiment except that the groove 33 shown in FIG. 1 is not formed, and has the same function and effect.

（第３実施形態）
図１３は、本発明の第３実施形態に係るセラミックコンデンサ１０Ｂの斜視図である。本実施形態に係るセラミックコンデンサ１０Ｂは、図１〜図１１に示す第１実施形態に係るセラミックコンデンサ１０と下記に示す以外は、同様な構成を有し、同様な作用効果を奏するので、共通する部分には、共通する部材符号を付し、共通する部分の説明は省略する。 (Third Embodiment)
FIG. 13 is a perspective view of the ceramic capacitor 10B according to the third embodiment of the present invention. The ceramic capacitor 10B according to the present embodiment has the same configuration as the ceramic capacitor 10 according to the first embodiment shown in FIGS. 1 to 11 except as shown below, and has the same effect and effect, and thus is common. A common member code is attached to the portion, and the description of the common portion will be omitted.

図１３に示すように、本実施形態では、チップコンデンサ２０Ｂの素体２６の端面に形成してある端子電極２２の側面電極部２２ｂにおけるＹ軸方向長さが、第１実施形態の端子電極２２における側面電極部２２ｂにおけるＹ軸方向長さよりも長く構成してある。本実施形態のセラミックコンデンサ１０Ｂは、端子電極２２の側面電極部２２ｂにおけるＹ軸方向長さが、第１実施形態の端子電極２２における側面電極部２２ｂにおけるＹ軸方向長さよりも長い以外は、第１実施形態のセラミックコンデンサ１０と同様な構成を有し、同様な作用効果を奏する。 As shown in FIG. 13, in the present embodiment, the length in the Y-axis direction of the side electrode portion 22b of the terminal electrode 22 formed on the end surface of the element body 26 of the chip capacitor 20B is the terminal electrode 22 of the first embodiment. It is configured to be longer than the length in the Y-axis direction of the side electrode portion 22b in the above. In the ceramic capacitor 10B of the present embodiment, the Y-axis direction length of the side electrode portion 22b of the terminal electrode 22 is longer than the Y-axis direction length of the side electrode portion 22b of the terminal electrode 22 of the first embodiment. It has the same configuration as the ceramic capacitor 10 of the first embodiment, and has the same function and effect.

（第４実施形態）
図１４は、本発明の第４実施形態に係るセラミックコンデンサ１０Ｃの斜視図である。本実施形態に係るセラミックコンデンサ１０Ｃは、図１〜図１１に示す第１実施形態に係るセラミックコンデンサ１０と下記に示す以外は、同様な構成を有し、同様な作用効果を奏するので、共通する部分には、共通する部材符号を付し、共通する部分の説明は省略する。 (Fourth Embodiment)
FIG. 14 is a perspective view of the ceramic capacitor 10C according to the fourth embodiment of the present invention. The ceramic capacitor 10C according to the present embodiment has the same configuration as the ceramic capacitor 10 according to the first embodiment shown in FIGS. 1 to 11 except as shown below, and has the same function and effect, and thus is common. A common member code is attached to the portion, and the description of the common portion will be omitted.

図１４に示すように、本実施形態では、上述した第１実施形態の金属端子３０の代わりに、金属端子３０Ｃを用いている以外は、第１実施形態のセラミックコンデンサ１０と同様な構成を有し、同様な作用効果を奏する。 As shown in FIG. 14, this embodiment has the same configuration as the ceramic capacitor 10 of the first embodiment except that the metal terminal 30C is used instead of the metal terminal 30 of the first embodiment described above. However, it has the same effect.

図１５に示すように、本実施形態では、端子電極接続部３２ＣのＺ軸方向上端のＸ軸方向の中央部に設けられる溝３３の深さＨ１が、端子電極接続部３２ＣのＺ軸方向上端から支持部３８Ｃの上表面３８ａまでの高さＨ７と略等しくなっている。 As shown in FIG. 15, in the present embodiment, the depth H1 of the groove 33 provided at the center of the upper end of the terminal electrode connecting portion 32C in the Z-axis direction in the X-axis direction is the upper end of the terminal electrode connecting portion 32C in the Z-axis direction. It is substantially equal to the height H7 from the to the upper surface 38a of the support portion 38C.

この溝３３のＸ軸方向の両側には、一対の接続片３２ａ，３２ａが形成してあり、その溝３３のＺ軸方向の底部に、単一の支持部３８Ｃが設けられている。支持部３８Ｃを構成する支持片は、溝３３から内側（図１４に示すチップコンデンサ２０の側）に向けて折り曲げられ、連結部３６Ｃおよび接続片３２ａ，３２ａと一体に形成されている。溝３３の深さＨ１は、図４に示す素体２６のＺ軸方向高さＨ０と同程度が好ましく、Ｈ１／Ｈ０は、約１であることが好ましい。 A pair of connecting pieces 32a, 32a are formed on both sides of the groove 33 in the X-axis direction, and a single support portion 38C is provided at the bottom of the groove 33 in the Z-axis direction. The support piece constituting the support portion 38C is bent inward from the groove 33 (the side of the chip capacitor 20 shown in FIG. 14), and is integrally formed with the connecting portion 36C and the connecting pieces 32a and 32a. The depth H1 of the groove 33 is preferably about the same as the height H0 of the element body 26 shown in FIG. 4 in the Z-axis direction, and H1 / H0 is preferably about 1.

図１４に示すように、本実施形態では、金属端子３０Ｃの端子電極接続部３２Ｃと端子電極２２の端面電極部２２ａとの間には、接合領域５０ａと非接合領域５０ｂとが形成してあり、非接合領域５０ｂが、端子電極接続部３２Ｃから支持部３８Ｃにまで形成してある。 As shown in FIG. 14, in the present embodiment, a bonded region 50a and a non-bonded region 50b are formed between the terminal electrode connecting portion 32C of the metal terminal 30C and the end face electrode portion 22a of the terminal electrode 22. The non-bonded region 50b is formed from the terminal electrode connecting portion 32C to the supporting portion 38C.

接合領域５０ａは、半田５０により、金属端子３０Ｃの端子電極接続部３２Ｃと端子電極２２の端面電極部２２ａとが機械的および電気的に接合してある領域である。また、非接合領域５０ｂは、半田５０が存在しない領域であり、金属端子３０Ｃの端子電極接続部３２Ｃと端子電極２２の端面電極部２２ａとがハンダによる接合が成されていない領域である。この非接合領域５０ｂは、端子電極接続部３２Ｃから支持部３８Ｃにまで連続的に形成してある。 The bonding region 50a is a region in which the terminal electrode connecting portion 32C of the metal terminal 30C and the end face electrode portion 22a of the terminal electrode 22 are mechanically and electrically bonded by the solder 50. The non-bonded region 50b is a region in which the solder 50 does not exist, and is a region in which the terminal electrode connecting portion 32C of the metal terminal 30C and the end face electrode portion 22a of the terminal electrode 22 are not bonded by soldering. The non-bonded region 50b is continuously formed from the terminal electrode connecting portion 32C to the supporting portion 38C.

非接合領域５０ｂを、端子電極接続部３２Ｃの下方位置（支持部３８Ｃの近く）から支持部３８Ｃにまで形成するための手段としては、特に限定されないが、たとえば図１５に示すように、少なくとも支持部３８Ｃの上表面３８ａに半田付着防止領域（図１５中の点々によるハッチング部分）を形成すれば良い。半田付着防止領域は、支持部３８Ｃの上表面３８ａと共に、その近くに位置する端子電極接続部３２Ｃにおける端面電極部２２ａとの対向面３２ｂにも形成する。さらに、連結部３６Ｃの内側面３６ａの少なくとも一部にまで連続して半田付着防止領域を形成しても良い。 The means for forming the non-bonded region 50b from the lower position of the terminal electrode connecting portion 32C (near the supporting portion 38C) to the supporting portion 38C is not particularly limited, but at least as shown in FIG. A solder adhesion prevention region (hatched portion formed by dots in FIG. 15) may be formed on the upper surface 38a of the portion 38C. The solder adhesion prevention region is formed not only on the upper surface 38a of the support portion 38C but also on the facing surface 32b of the terminal electrode connecting portion 32C located near the support portion 38C with the end face electrode portion 22a. Further, a solder adhesion prevention region may be continuously formed up to at least a part of the inner side surface 36a of the connecting portion 36C.

なお、図１５に示す実装接続部３４の上面３４ａと底面３４ｂには、図１１に示す半田５２が付着して実装接続部３４を回路基板６０の実装面６２に強固に接続するために、半田付着防止領域を形成しないことが好ましい。また、図１５に示す連結部３６Ｃの外表面３６ｂにも、図１１に示す半田５２が付着して実装接続部３４を回路基板６０の実装面６２に強固に接続するために、半田付着防止領域を形成しないことが好ましい。ただし、図１５に示す実装接続部３４の上面３４ａおよび支持部３８Ｃの下面３８ｂは、必ずしも図１１に示す半田５２が付着しなくても良いことから、そこに半田付着防止領域を、前述した半田付着防止領域に連続して形成しても良い。 The solder 52 shown in FIG. 11 adheres to the upper surface 34a and the bottom surface 34b of the mounting connection portion 34 shown in FIG. 15, and is soldered in order to firmly connect the mounting connection portion 34 to the mounting surface 62 of the circuit board 60. It is preferable not to form an adhesion prevention region. Further, the solder 52 shown in FIG. 11 also adheres to the outer surface 36b of the connecting portion 36C shown in FIG. 15, and the mounting connection portion 34 is firmly connected to the mounting surface 62 of the circuit board 60. It is preferable not to form. However, since the solder 52 shown in FIG. 11 does not necessarily have to adhere to the upper surface 34a of the mounting connection portion 34 and the lower surface 38b of the support portion 38C shown in FIG. It may be continuously formed in the adhesion prevention region.

図６および図７Ａに示す金属端子３０の端子電極接続部３２において、半田付着防止領域が形成されていないＺ軸方向の高さＨ６ａは、図１４に示す接合領域５０ａのＺ軸方向高さと略一致するが、半田５０の量などによっては、必ずしも一致しなくても良い。 In the terminal electrode connection portion 32 of the metal terminal 30 shown in FIGS. 6 and 7A, the height H6a in the Z-axis direction in which the solder adhesion prevention region is not formed is substantially the height in the Z-axis direction of the joint region 50a shown in FIG. Although they match, they do not necessarily have to match depending on the amount of solder 50 and the like.

（その他の実施形態）
なお、本発明は、上述した実施形態に限定されるものではなく、本発明の範囲内で種々に改変することができる。たとえば本発明では、金属端子３０の端子電極接続部３２に形成する溝３３の形状は、図示する実施形態に示すように底部角部が丸みを帯びた四角形状に限定されず、たとえば半円状、Ｕ字形状、楕円状、逆三角形状、その他の多角形状などであっても良い。 (Other embodiments)
The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention. For example, in the present invention, the shape of the groove 33 formed in the terminal electrode connecting portion 32 of the metal terminal 30 is not limited to a square shape having rounded bottom corners as shown in the illustrated embodiment, and is, for example, a semicircular shape. , U-shaped, elliptical, inverted triangular, or other polygonal shape.

また、上述した実施形態では、接合領域５０ａを、半田５０を用いて形成してあるが、導電性接着剤により形成しても良い。 Further, in the above-described embodiment, the bonding region 50a is formed by using the solder 50, but it may be formed by a conductive adhesive.

以下、本発明を、さらに詳細な実施例に基づき説明するが、本発明は、これら実施例に限定されない。 Hereinafter, the present invention will be described based on more detailed examples, but the present invention is not limited to these examples.

実施例１
Ｗ１／Ｗ０＝０．５である図１〜図１０に示すセラミックコンデンサ１０を作製し、図１１に示すように、回路基板６０の実装面６２に半田５２を用いてコンデンサ１０を実装した。Ｈ６／Ｈ７は、０．５６であった。 Example 1
The ceramic capacitors 10 shown in FIGS. 1 to 10 in which W1 / W0 = 0.5 were produced, and as shown in FIG. 11, the capacitor 10 was mounted on the mounting surface 62 of the circuit board 60 using solder 52. H6 / H7 was 0.56.

この実施例１のコンデンサ１０について、音鳴きを評価するために、２０Ｈｚ〜２０ｋＨｚの周波数の交流を印加して音圧レベルを測定する試験を行った。結果を図１６に示す。図１６において、縦軸は、音鳴きを示す音圧レベル（ＳＰＬ）を示し、単位はｄＢである。また、横軸は、可聴範囲での音鳴きの周波数を示す。 In order to evaluate the squealing of the capacitor 10 of Example 1, a test was conducted in which an alternating current having a frequency of 20 Hz to 20 kHz was applied to measure the sound pressure level. The results are shown in FIG. In FIG. 16, the vertical axis represents the sound pressure level (SPL) indicating the squeal, and the unit is dB. The horizontal axis indicates the frequency of squealing in the audible range.

比較例１
Ｈ６／Ｈ７は１であり、しかも、支持部３８と端子電極２２との間にも、半田による接合領域１０ａが形成された以外は、実施例１と同様にして、音鳴きを評価するために、２０Ｈｚ〜２０ｋＨｚの周波数の交流を印加して音圧レベルを測定する試験を行った。結果を図１６に示す。 Comparative Example 1
H6 / H7 is 1, and in order to evaluate the sound squeal in the same manner as in Example 1 except that a joint region 10a made of solder is also formed between the support portion 38 and the terminal electrode 22. , A test was conducted in which the sound pressure level was measured by applying an alternating current having a frequency of 20 Hz to 20 kHz. The results are shown in FIG.

比較例２
Ｗ１／Ｗ０＝１とし、支持部３８を設けなかった以外は、実施例１と同様にして、セラミックコンデンサを作製し、同様な試験を行った。結果を図１６に示す。 Comparative Example 2
A ceramic capacitor was produced in the same manner as in Example 1 except that W1 / W0 = 1 and the support portion 38 was not provided, and the same test was performed. The results are shown in FIG.

評価
図１６に示すように、実施例１のコンデンサでは、比較例１および比較例２のコンデンサに比較して、音鳴きが抑制されることが確認できた。 As shown in the evaluation FIG. 16, it was confirmed that the capacitor of Example 1 suppressed the squealing sound as compared with the capacitors of Comparative Example 1 and Comparative Example 2.

実施例２
Ｈ６／Ｈ７を０．３〜０．９の範囲で変化させた以外は、実施例１と同様にして、セラミックコンデンサを作製し、同様な試験を行った。実施例１と同様な結果が得られた。また、接合強度も実施例１と同等に満足できるレベルであることが確認できた。 Example 2
A ceramic capacitor was produced in the same manner as in Example 1 except that H6 / H7 was changed in the range of 0.3 to 0.9, and the same test was performed. The same results as in Example 1 were obtained. In addition, it was confirmed that the joint strength was at a level that was as satisfactory as in Example 1.

１０，１０Ａ，１０Ｂ，１０Ｃ…セラミックコンデンサ
２０，２０Ｂ…チップコンデンサ
２２…端子電極
２２ａ…端面電極部
２２ｂ…側面電極部
２６…素体
２６ａ…底側面
２６ｂ…上側面
２０ｃ…側面
２０ｄ…側面
３０，３０Ａ，３０Ｃ…金属端子
３２，３２Ａ，３２Ｃ…端子電極接続部
３２ａ…接続片
３３…溝
３４…実装接続部
３６，３６Ｃ…連結部
３８，３８Ｃ…支持部
５０，５２…半田
５０ａ…接合領域
５０ｂ…非接合領域
６０…回路基板
６２…実装面 10, 10A, 10B, 10C ... Ceramic capacitors 20, 20B ... Chip capacitors 22 ... Terminal electrodes 22a ... End face electrodes 22b ... Side electrodes 26 ... Element body 26a ... Bottom side surface 26b ... Top side surface 20c ... Side surface 20d ... Side surface 30, 30A, 30C ... Metal terminals 32, 32A, 32C ... Terminal electrode connection 32a ... Connection piece 33 ... Groove 34 ... Mounting connection 36, 36C ... Connection 38, 38C ... Support 50, 52 ... Solder 50a ... Joint area 50b ... Non-junction region 60 ... Circuit board 62 ... Mounting surface

Claims

Chip parts with terminal electrodes formed on the end faces of the body,
An electronic component having an external terminal electrically connected to the terminal electrode.
The external terminal
A terminal electrode connection portion arranged so as to face the end face electrode portion of the terminal electrode, and a terminal electrode connection portion.
A mounting connection that can be connected to the mounting surface,
It has a support portion facing one side surface of the element body so as to support one side surface of the element body by separating one side surface of the element body closest to the mounting surface from the mounting surface.
A bonded region and a non-bonded region are formed between the terminal electrode connecting portion of the external terminal and the end face electrode portion of the terminal electrode.
The non-junction region is formed from the terminal electrode connection portion to the support portion.
The terminal electrode connection portion and the mounting connection portion are connected by a connection portion, and the terminal electrode connection portion is connected to the mounting connection portion.
The connecting portion extends inward on the mounting surface from the surface including the end face of the element body, and the boundary position between the mounting connecting portion and the connecting portion is a predetermined distance from the surface including the end surface of the element body. Only located inside ,
The distance (L3) between the boundary position between the mounting connection portion and the connection portion and the surface including the end surface of the element body is 0. Electronic components that are 6 to 1.0 (L3 / L2).

The electronic component according to claim 1, wherein the support portion is formed so as to project toward the one side surface of the element body at a boundary position between the terminal electrode connecting portion and the connecting portion.

Claim 1 or claim 1 in which the width (W1) of the connecting portion is smaller than the width (W2) of the mounting connecting portion along the direction parallel to the mounting surface at the boundary position between the mounting connecting portion and the connecting portion. The electronic component according to 2.

The width (W1) of the connecting portion along the direction parallel to the mounting surface is the width (W) of the terminal electrode connecting portion.
The electronic component according to any one of claims 1 to 3 , which is smaller than 0).

The electronic component according to claim 4 , wherein the ratio (W1 / W0) of the width (W1) of the connecting portion to the width (W0) of the terminal electrode connecting portion is 0.3 to 0.8.

The inner surface of the terminal electrode connection portion facing the end surface electrode portion of the terminal electrode and the upper surface of the support portion facing one side surface of the element body are surfaces on the same side of the outer terminal.
The electronic component according to any one of claims 1 to 5 , wherein the non-bonded region is formed from the inner surface of the terminal electrode connecting portion to the upper surface of the support portion.

A groove having a shape that does not cover a part of the end surface of the element body is formed in the terminal electrode connection portion, and the groove faces the upper side surface of the element body located on the side opposite to the mounting surface. The electronic component according to any one of claims 1 to 6 , which has an opening that opens.

Chip parts with terminal electrodes formed on the end faces of the body,
An electronic component having an external terminal electrically connected to the terminal electrode.
The external terminal
A terminal electrode connection portion arranged so as to face the end face electrode portion of the terminal electrode, and a terminal electrode connection portion.
A mounting connection that can be connected to the mounting surface,
It has a support portion facing one side surface of the element body so as to support one side surface of the element body by separating one side surface of the element body closest to the mounting surface from the mounting surface.
In the terminal electrode connection portion, an opening in which the end face electrode is exposed and connection pieces located on both sides of the opening in the lateral width direction are formed.
A bonded region and a non-bonded region are formed between the connection piece of the terminal electrode connecting portion and the end face electrode portion of the terminal electrode .
An electronic component having a gap between the upper surface of the support portion and one side surface of the element body closest to the mounting surface and not in contact with each other.

Chip parts with terminal electrodes formed on the end faces of the body,
An electronic component having an external terminal electrically connected to the terminal electrode.
The external terminal
A terminal electrode connection portion arranged so as to face the end face electrode portion of the terminal electrode, and a terminal electrode connection portion.
A mounting connection that can be connected to the mounting surface,
It has a support portion facing one side surface of the element body so as to support one side surface of the element body by separating one side surface of the element body closest to the mounting surface from the mounting surface.
In the terminal electrode connection portion, an opening in which the end face electrode is exposed and connection pieces located on both sides of the opening in the lateral width direction are formed.
A bonded region and a non-bonded region are formed between the connection piece of the terminal electrode connecting portion and the end face electrode portion of the terminal electrode.
An electronic component in which the non-bonded region is also formed on the upper surface of the support portion.

The electronic component according to claim 8 or 9 , wherein the support portion is formed by bending from an edge of the opening on the mounting surface side.

The terminal electrode connection portion and the mounting connection portion are connected by a connection portion, and the terminal electrode connection portion is connected to the mounting connection portion.
The width (W1) of the connecting portion along the direction parallel to the mounting surface is the width (W) of the terminal electrode connecting portion.
The electronic component according to any one of claims 8 to 10 , which is smaller than 0).

The electronic component according to claim 11 , wherein the ratio (W1 / W0) of the width (W1) of the connecting portion to the width (W0) of the terminal electrode connecting portion is 0.3 to 0.8.

The electronic component according to any one of claims 1 to 12 , wherein a gap is formed between the external terminal and the terminal electrode in the non-junction region.

The electronic component according to any one of claims 1 to 13 , wherein in the non-bonded region, the surface of the external terminal facing the terminal electrode is subjected to a solder adhesion prevention treatment.

The joint region is formed at a predetermined height (H6) from the upper end on the side opposite to the mounting surface of the terminal electrode connection portion downward.
The predetermined height (H6) is smaller than the height (H7) from the upper end of the terminal electrode connection portion on the side opposite to the mounting surface to the upper surface of the support portion according to any one of claims 1 to 14. Described electronic components.

The ratio of the predetermined height (H6) of the bonding region to the height (H7) from the upper end of the terminal electrode connection portion on the side opposite to the mounting surface to the upper surface of the support portion is 0.4. The electronic component according to claim 15 , which is ~ 0.8.

The electronic component according to any one of claims 1 to 16 , wherein the distance between the mounting surface and one side surface of the element body closest to the mounting surface is 0.2 mm or less.