JP6848491B2 - ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物 - Google Patents

ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物 Download PDF

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JP6848491B2
JP6848491B2 JP2017018183A JP2017018183A JP6848491B2 JP 6848491 B2 JP6848491 B2 JP 6848491B2 JP 2017018183 A JP2017018183 A JP 2017018183A JP 2017018183 A JP2017018183 A JP 2017018183A JP 6848491 B2 JP6848491 B2 JP 6848491B2
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general formula
acid
group
resin
resin composition
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JP2018123103A (ja
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優 荘司
優 荘司
有希 増田
有希 増田
奥田　良治
良治 奥田
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Toray Industries Inc
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  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2017018183A 2017-02-03 2017-02-03 ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物 Active JP6848491B2 (ja)

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JP2017018183A JP6848491B2 (ja) 2017-02-03 2017-02-03 ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物

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JP2017018183A JP6848491B2 (ja) 2017-02-03 2017-02-03 ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物

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JP2018123103A JP2018123103A (ja) 2018-08-09
JP2018123103A5 JP2018123103A5 (https=) 2019-12-12
JP6848491B2 true JP6848491B2 (ja) 2021-03-24

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Families Citing this family (6)

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JP7154184B2 (ja) * 2019-04-15 2022-10-17 信越化学工業株式会社 ポジ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
US11333975B2 (en) * 2020-04-14 2022-05-17 International Business Machines Corporation Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component
KR102418193B1 (ko) * 2020-08-28 2022-07-07 주식회사 파이솔루션테크놀로지 감광성 폴리이미드 및 이의 조성물
CN115232017B (zh) * 2021-03-15 2024-06-18 华为技术有限公司 一种化合物、一种树脂及其制备方法和应用
CN114479075B (zh) * 2021-12-28 2023-07-18 阜阳欣奕华材料科技有限公司 聚酰亚胺前驱体树脂、光敏树脂组合物及光敏树脂组合物的用途
JP2025127967A (ja) * 2024-02-21 2025-09-02 太陽ホールディングス株式会社 化合物、ポリヒドロキシアミド化合物、感光性樹脂組成物、ドライフィルム、硬化物および電子部品

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JP5547874B2 (ja) * 2008-05-20 2014-07-16 旭化成イーマテリアルズ株式会社 ポリイミド樹脂
JP2014178400A (ja) * 2013-03-14 2014-09-25 Toray Ind Inc ポジ型感光性樹脂組成物

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