JP6838428B2 - Polyamide resin composition for molded products that come into contact with high-pressure hydrogen and molded products using it - Google Patents
Polyamide resin composition for molded products that come into contact with high-pressure hydrogen and molded products using it Download PDFInfo
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- JP6838428B2 JP6838428B2 JP2017039950A JP2017039950A JP6838428B2 JP 6838428 B2 JP6838428 B2 JP 6838428B2 JP 2017039950 A JP2017039950 A JP 2017039950A JP 2017039950 A JP2017039950 A JP 2017039950A JP 6838428 B2 JP6838428 B2 JP 6838428B2
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- Prior art keywords
- resin
- pressure hydrogen
- acid
- resin composition
- polyamide
- Prior art date
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- 239000001257 hydrogen Substances 0.000 title claims description 113
- 229910052739 hydrogen Inorganic materials 0.000 title claims description 113
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 title claims description 85
- 229920006122 polyamide resin Polymers 0.000 title claims description 55
- 239000011342 resin composition Substances 0.000 title claims description 51
- 229920005989 resin Polymers 0.000 claims description 104
- 239000011347 resin Substances 0.000 claims description 104
- 238000000465 moulding Methods 0.000 claims description 40
- -1 amide compound Chemical class 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 38
- 229920002292 Nylon 6 Polymers 0.000 claims description 37
- 150000001408 amides Chemical class 0.000 claims description 35
- 150000002431 hydrogen Chemical class 0.000 claims description 32
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 28
- 239000004917 carbon fiber Substances 0.000 claims description 28
- 238000002425 crystallisation Methods 0.000 claims description 25
- 230000008025 crystallization Effects 0.000 claims description 25
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 24
- 238000002844 melting Methods 0.000 claims description 23
- 230000008018 melting Effects 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 17
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 14
- 239000005977 Ethylene Substances 0.000 claims description 14
- 239000004711 α-olefin Substances 0.000 claims description 13
- 125000004432 carbon atom Chemical group C* 0.000 claims description 12
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 12
- 230000003014 reinforcing effect Effects 0.000 claims description 9
- 150000004985 diamines Chemical class 0.000 claims description 8
- 150000007519 polyprotic acids Polymers 0.000 claims description 8
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 56
- 239000000047 product Substances 0.000 description 40
- 238000002156 mixing Methods 0.000 description 22
- 230000007547 defect Effects 0.000 description 14
- 238000003466 welding Methods 0.000 description 13
- 229920001971 elastomer Polymers 0.000 description 12
- 239000000835 fiber Substances 0.000 description 12
- 239000007789 gas Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 11
- 239000010959 steel Substances 0.000 description 11
- 229910000831 Steel Inorganic materials 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 10
- 238000001746 injection moulding Methods 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 10
- 229920005992 thermoplastic resin Polymers 0.000 description 10
- 238000011049 filling Methods 0.000 description 9
- 238000004898 kneading Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000008188 pellet Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229920005672 polyolefin resin Polymers 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 6
- 229910000975 Carbon steel Inorganic materials 0.000 description 6
- 239000005749 Copper compound Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 6
- 239000010962 carbon steel Substances 0.000 description 6
- 150000001880 copper compounds Chemical class 0.000 description 6
- 230000002950 deficient Effects 0.000 description 6
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 6
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 5
- 239000012765 fibrous filler Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000002667 nucleating agent Substances 0.000 description 5
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 5
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 4
- 229910000851 Alloy steel Inorganic materials 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 229910000617 Mangalloy Inorganic materials 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 229920002302 Nylon 6,6 Polymers 0.000 description 4
- 235000021355 Stearic acid Nutrition 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 4
- 150000001733 carboxylic acid esters Chemical class 0.000 description 4
- 150000001735 carboxylic acids Chemical class 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000446 fuel Substances 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 4
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 4
- 238000010791 quenching Methods 0.000 description 4
- 230000000171 quenching effect Effects 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000008117 stearic acid Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229960002684 aminocaproic acid Drugs 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 3
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 238000005496 tempering Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 3
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 2
- VQOXUMQBYILCKR-UHFFFAOYSA-N 1-Tridecene Chemical compound CCCCCCCCCCCC=C VQOXUMQBYILCKR-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- PJLHTVIBELQURV-UHFFFAOYSA-N 1-pentadecene Chemical compound CCCCCCCCCCCCCC=C PJLHTVIBELQURV-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229910021595 Copper(I) iodide Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 235000021314 Palmitic acid Nutrition 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000000071 blow moulding Methods 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 2
- RFKZUAOAYVHBOY-UHFFFAOYSA-M copper(1+);acetate Chemical compound [Cu+].CC([O-])=O RFKZUAOAYVHBOY-UHFFFAOYSA-M 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- LSXDOTMGLUJQCM-UHFFFAOYSA-M copper(i) iodide Chemical compound I[Cu] LSXDOTMGLUJQCM-UHFFFAOYSA-M 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010097 foam moulding Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- NHLUYCJZUXOUBX-UHFFFAOYSA-N nonadec-1-ene Chemical compound CCCCCCCCCCCCCCCCCC=C NHLUYCJZUXOUBX-UHFFFAOYSA-N 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001643 poly(ether ketone) Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000012783 reinforcing fiber Substances 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- 235000009518 sodium iodide Nutrition 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- XVOUMQNXTGKGMA-OWOJBTEDSA-N (E)-glutaconic acid Chemical compound OC(=O)C\C=C\C(O)=O XVOUMQNXTGKGMA-OWOJBTEDSA-N 0.000 description 1
- PQEDRASSLOBCRO-HYXAFXHYSA-N (z)-2-[2-(oxiran-2-yl)ethyl]but-2-enedioic acid Chemical compound OC(=O)\C=C(C(O)=O)\CCC1CO1 PQEDRASSLOBCRO-HYXAFXHYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- 229940106006 1-eicosene Drugs 0.000 description 1
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- GRWZFPFQSHTXHM-UHFFFAOYSA-N 11-methyldodec-1-ene Chemical compound CC(C)CCCCCCCCC=C GRWZFPFQSHTXHM-UHFFFAOYSA-N 0.000 description 1
- LPWUGKDQSNKUOQ-UHFFFAOYSA-N 12-ethyltetradec-1-ene Chemical compound CCC(CC)CCCCCCCCCC=C LPWUGKDQSNKUOQ-UHFFFAOYSA-N 0.000 description 1
- 229940114072 12-hydroxystearic acid Drugs 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- ZYIPKNMNGBFPRA-UHFFFAOYSA-N 2-[2-(oxiran-2-yl)ethylidene]butanedioic acid Chemical compound OC(=O)CC(C(O)=O)=CCC1CO1 ZYIPKNMNGBFPRA-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 1
- ZPXGNBIFHQKREO-UHFFFAOYSA-N 2-chloroterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(Cl)=C1 ZPXGNBIFHQKREO-UHFFFAOYSA-N 0.000 description 1
- FROUMWCGMNOSBK-UHFFFAOYSA-N 2-cyclohexylbutanedioic acid Chemical compound OC(=O)CC(C(O)=O)C1CCCCC1 FROUMWCGMNOSBK-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- UFMBOFGKHIXOTA-UHFFFAOYSA-N 2-methylterephthalic acid Chemical compound CC1=CC(C(O)=O)=CC=C1C(O)=O UFMBOFGKHIXOTA-UHFFFAOYSA-N 0.000 description 1
- MKCFZBOBBPYAHP-UHFFFAOYSA-N 2-octacosanoyloxyethyl octacosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCC MKCFZBOBBPYAHP-UHFFFAOYSA-N 0.000 description 1
- GYXGAEAOIFNGAE-UHFFFAOYSA-N 2-propan-2-ylidenebutanedioic acid Chemical compound CC(C)=C(C(O)=O)CC(O)=O GYXGAEAOIFNGAE-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 1
- LBBVUHNMASXJAH-UHFFFAOYSA-N 3-ethylbicyclo[2.2.1]hepta-2,5-diene Chemical compound C1C2C(CC)=CC1C=C2 LBBVUHNMASXJAH-UHFFFAOYSA-N 0.000 description 1
- OLGHJTHQWQKJQQ-UHFFFAOYSA-N 3-ethylhex-1-ene Chemical compound CCCC(CC)C=C OLGHJTHQWQKJQQ-UHFFFAOYSA-N 0.000 description 1
- YPVPQMCSLFDIKA-UHFFFAOYSA-N 3-ethylpent-1-ene Chemical compound CCC(CC)C=C YPVPQMCSLFDIKA-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- SUJVAMIXNUAJEY-UHFFFAOYSA-N 4,4-dimethylhex-1-ene Chemical compound CCC(C)(C)CC=C SUJVAMIXNUAJEY-UHFFFAOYSA-N 0.000 description 1
- KLCNJIQZXOQYTE-UHFFFAOYSA-N 4,4-dimethylpent-1-ene Chemical compound CC(C)(C)CC=C KLCNJIQZXOQYTE-UHFFFAOYSA-N 0.000 description 1
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- BDBZTOMUANOKRT-UHFFFAOYSA-N 4-[2-(4-aminocyclohexyl)propan-2-yl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1C(C)(C)C1CCC(N)CC1 BDBZTOMUANOKRT-UHFFFAOYSA-N 0.000 description 1
- SUWJESCICIOQHO-UHFFFAOYSA-N 4-methylhex-1-ene Chemical compound CCC(C)CC=C SUWJESCICIOQHO-UHFFFAOYSA-N 0.000 description 1
- MBRGOFWKNLPACT-UHFFFAOYSA-N 5-methylnonane-1,9-diamine Chemical compound NCCCCC(C)CCCCN MBRGOFWKNLPACT-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- QNJMAPUHMGDDBE-UHFFFAOYSA-N 9-methyldec-1-ene Chemical compound CC(C)CCCCCCC=C QNJMAPUHMGDDBE-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910000669 Chrome steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 229910021590 Copper(II) bromide Inorganic materials 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Chemical class 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- WJYIASZWHGOTOU-UHFFFAOYSA-N Heptylamine Chemical compound CCCCCCCN WJYIASZWHGOTOU-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- QCTBMLYLENLHLA-UHFFFAOYSA-N aminomethylbenzoic acid Chemical compound NCC1=CC=C(C(O)=O)C=C1 QCTBMLYLENLHLA-UHFFFAOYSA-N 0.000 description 1
- 229960003375 aminomethylbenzoic acid Drugs 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- NIDNOXCRFUCAKQ-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2C(O)=O NIDNOXCRFUCAKQ-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- UORVGPXVDQYIDP-BJUDXGSMSA-N borane Chemical class [10BH3] UORVGPXVDQYIDP-BJUDXGSMSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- VNTLIPZTSJSULJ-UHFFFAOYSA-N chromium molybdenum Chemical compound [Cr].[Mo] VNTLIPZTSJSULJ-UHFFFAOYSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 1
- CMRVDFLZXRTMTH-UHFFFAOYSA-L copper;2-carboxyphenolate Chemical compound [Cu+2].OC1=CC=CC=C1C([O-])=O.OC1=CC=CC=C1C([O-])=O CMRVDFLZXRTMTH-UHFFFAOYSA-L 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- PEVZEFCZINKUCG-UHFFFAOYSA-L copper;octadecanoate Chemical compound [Cu+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O PEVZEFCZINKUCG-UHFFFAOYSA-L 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 229940076286 cupric acetate Drugs 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- LNGJOYPCXLOTKL-UHFFFAOYSA-N cyclopentane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C1 LNGJOYPCXLOTKL-UHFFFAOYSA-N 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- MGPUUXGHLCLLKJ-UHFFFAOYSA-N dodecanedioic acid;terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1.OC(=O)CCCCCCCCCCC(O)=O MGPUUXGHLCLLKJ-UHFFFAOYSA-N 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000009730 filament winding Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009787 hand lay-up Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- FJDUDHYHRVPMJZ-UHFFFAOYSA-N nonan-1-amine Chemical compound CCCCCCCCCN FJDUDHYHRVPMJZ-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229940100684 pentylamine Drugs 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229920006345 thermoplastic polyamide Polymers 0.000 description 1
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical group CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
Landscapes
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、ポリアミド6樹脂にアミド系ワックスを特定量配合してなる、高圧水素に触れる成形品用のポリアミド樹脂組成物およびそれを成形してなる成形品に関するものである。 The present invention relates to a polyamide resin composition for a molded product that comes into contact with high-pressure hydrogen, which is obtained by blending a specific amount of an amide-based wax with a polyamide 6 resin, and a molded product obtained by molding the same.
近年、石油燃料の枯渇や、有害ガス排出量の削減の要請に対応するために、水素と空気中の酸素を電気化学的に反応させて発電する燃料電池を自動車に搭載し、燃料電池が発電した電気をモータに供給して駆動力とする燃料電池電気自動車が注目されてきている。自動車搭載用の高圧水素用タンクとして、樹脂製のライナーの外側を炭素繊維強化樹脂で補強してなる樹脂製タンクが検討されている。しかしながら、水素は分子サイズが小さいため、比較的分子サイズの大きい天然ガスなどに比べ、樹脂中を透過し易いこと、および、高圧水素は常圧の水素に比べ、樹脂中に蓄積される量が多くなることなどから、これまでの樹脂製タンクでは、高圧水素の充填および放圧を繰り返すと、タンクの変形や破壊が起こる課題があった。また、樹脂製のライナーを成形する際に、離型性が不足する課題があった。 In recent years, in order to respond to the depletion of petroleum fuels and the demand for reduction of harmful gas emissions, fuel cells that generate electricity by electrochemically reacting hydrogen with oxygen in the air are installed in automobiles, and the fuel cells generate electricity. Fuel cell electric vehicles, which supply the generated electricity to a motor and use it as a driving force, are attracting attention. As a tank for high-pressure hydrogen for mounting on automobiles, a resin tank in which the outside of a resin liner is reinforced with carbon fiber reinforced resin is being studied. However, since hydrogen has a small molecular size, it is easier to permeate through the resin than natural gas, which has a relatively large molecular size, and high-pressure hydrogen accumulates in the resin more than normal-pressure hydrogen. In the conventional resin tanks, there is a problem that the tank is deformed or destroyed when the high-pressure hydrogen is repeatedly filled and released. Further, when molding a resin liner, there is a problem that the releasability is insufficient.
ガスバリア性に優れ、低温でも優れた耐衝撃性を有する水素タンクライナー用材料として、例えば、ポリアミド6、共重合ポリアミド、および耐衝撃材を含むポリアミド樹脂組成物からなる水素タンクライナー用材料が検討されている(例えば、特許文献1参照)。 As a material for a hydrogen tank liner having excellent gas barrier properties and excellent impact resistance even at a low temperature, for example, a material for a hydrogen tank liner composed of a polyamide resin composition containing polyamide 6, a copolymerized polyamide, and an impact resistant material has been studied. (See, for example, Patent Document 1).
また、ガスバリア性に優れたガス貯蔵タンク用ライナーとして、例えば、ポリアミド、成核剤および耐衝撃性改良剤を含むポリマー組成物を含有するガス貯蔵タンク用ライナーが検討されている(例えば、特許文献2参照)。 Further, as a liner for a gas storage tank having excellent gas barrier properties, for example, a liner for a gas storage tank containing a polymer composition containing a polyamide, a nucleating agent and an impact resistance improving agent has been studied (for example, Patent Documents). 2).
高圧水素に触れる成形品の製造方法の1つとして、射出成形が挙げられる。例えば樹脂製のガス貯蔵タンク用ライナーを射出成形する際は、大型の成形品を成形することとなるため、離型性不足により成形品の外観不良が発生し、成形品を得ることができない場合がある。そのため、大型の成形品を射出成形するためには高い離型性が求められている。 Injection molding is one of the methods for manufacturing a molded product that comes into contact with high-pressure hydrogen. For example, when a resin gas storage tank liner is injection-molded, a large-sized molded product is molded. Therefore, the appearance of the molded product may be poor due to insufficient releasability, and the molded product cannot be obtained. There is. Therefore, high mold releasability is required for injection molding of a large molded product.
しかしながら、特許文献1に記載された水素タンクライナーは、水素ガスの透過や、水素の樹脂中への溶解が生じやすく、高圧水素の充填および放圧を繰り返すと、水素タンクライナーに欠陥点が生じる課題があった。また、ポリアミド樹脂の離型性が低く、離型性に課題があった。 However, the hydrogen tank liner described in Patent Document 1 is prone to permeation of hydrogen gas and dissolution of hydrogen in the resin, and repeated filling and releasing of high-pressure hydrogen causes defects in the hydrogen tank liner. There was a challenge. In addition, the releasability of the polyamide resin is low, and there is a problem in releasability.
また、特許文献2に記載されたガス貯蔵タンク用ライナーは、ヘリウムガス耐透過性には優れるものの、水素ガスの透過や、水素の樹脂中への溶解が生じやすく、高圧水素の充填および放圧を繰り返すと、水素タンクライナーに欠陥点が生じる課題があった。また、ポリアミド樹脂の離型性が低く、離型性に課題があった。 Further, although the liner for a gas storage tank described in Patent Document 2 is excellent in helium gas permeation resistance, hydrogen gas permeation and hydrogen dissolution in the resin are likely to occur, and high-pressure hydrogen is filled and released. Repeatedly, there was a problem that a defect point was generated in the hydrogen tank liner. In addition, the releasability of the polyamide resin is low, and there is a problem in releasability.
本発明は、上記従来技術の課題に鑑み、高圧水素の充填および放圧を繰り返しても欠陥点の発生が抑制され、離型性に優れた成形品を得ることのできるポリアミド樹脂組成物を提供することを課題とする。 In view of the above problems of the prior art, the present invention provides a polyamide resin composition capable of obtaining a molded product having excellent mold releasability by suppressing the occurrence of defect points even if high-pressure hydrogen is repeatedly filled and released. The task is to do.
上記目的を達成するために、本発明は以下の構成を有するものである。 In order to achieve the above object, the present invention has the following configuration.
ポリアミド6樹脂(A)100重量部に対して、炭素数10以上30以下の高級脂肪族モノカルボン酸、多塩基酸およびジアミンを反応せしめたアミド化合物であるアミド系ワックス(B)を0.1〜5重量部配合してなる、高圧水素に触れる成形品用のポリアミド樹脂組成物であり、該アミド系ワックス(B)の融点が215℃〜255℃である、高圧水素に触れる成形品用のポリアミド樹脂組成物。 0.1 of the amide wax (B), which is an amide compound obtained by reacting 100 parts by weight of the polyamide 6 resin (A) with a higher aliphatic monocarboxylic acid having 10 or more and 30 or less carbon atoms, a polybasic acid and a diamine. formed by 5 parts by weight blended, Ri polyamide resin composition der for moldings touching high-pressure hydrogen, melting point of the amide-based wax (B) is 215 ° C. to 255 ° C., for moldings to touch the high-pressure hydrogen Polyamide resin composition .
本発明は、上記のポリアミド樹脂組成物からなる、高圧水素に触れる成形品を含む。 The present invention includes a molded product made of the above-mentioned polyamide resin composition that comes into contact with high-pressure hydrogen.
本発明は、上記のポリアミド樹脂組成物からなる高圧水素用タンクライナーを含む。 The present invention includes a tank liner for high-pressure hydrogen made of the above-mentioned polyamide resin composition.
本発明は、上記のポリアミド樹脂組成物からなるタンクライナーの表層に、炭素繊維強化樹脂補強層が積層されてなる、高圧水素用タンクを含む。 The present invention includes a high-pressure hydrogen tank in which a carbon fiber reinforced resin reinforcing layer is laminated on the surface layer of a tank liner made of the above-mentioned polyamide resin composition.
本発明の高圧水素に触れる成形品用のポリアミド樹脂組成物は、結晶化温度が高く、溶融状態からの結晶化が早く進むので結晶化速度が速くなり、高圧水素の充填および放圧を繰り返しても欠陥点の発生が抑制され、離型性に優れた成形品を提供することができる。本発明の成形品は、高圧水素の充填および放圧を繰り返しても欠陥点が発生しにくく、離型性に優れた特長を活かして、高圧水素に触れる用途に用いられる成形品として有用に展開することが可能となる。 The polyamide resin composition for a molded product that comes into contact with high-pressure hydrogen of the present invention has a high crystallization temperature and crystallization from a molten state proceeds quickly, so that the crystallization rate becomes high, and high-pressure hydrogen is repeatedly charged and released. However, the occurrence of defective points is suppressed, and a molded product having excellent mold releasability can be provided. The molded product of the present invention is less likely to cause defects even after repeated filling and releasing of high-pressure hydrogen, and is usefully developed as a molded product used for applications in contact with high-pressure hydrogen by taking advantage of its excellent mold releasability. It becomes possible to do.
以下、本発明をさらに詳細に説明する。 Hereinafter, the present invention will be described in more detail.
本発明の高圧水素に触れる成形品用のポリアミド樹脂組成物(以下、「ポリアミド樹脂組成物」と記載する場合がある)はポリアミド6樹脂(A)100重量部に対して、アミド系ワックス(B)を0.01〜10重量部配合してなる。成形性、ガスバリア性、剛性および靱性のバランスに優れるポリアミド6樹脂(A)に、アミド系ワックス(B)を特定量配合することにより、結晶化温度が高く、溶融状態からの結晶化が早く進むので結晶化速度が速くなり、緻密で均一な結晶が形成されることから、水素ガスの透過や、水素の樹脂中への溶解を抑制することができるため、高圧水素の充填および放圧を繰り返しても欠陥点が発生しにくい。また、成形時の離型性が向上し、離型性に優れた成形品を得ることができる。一方、ポリアミド6樹脂(A)と、アミド系ワックス(B)以外の離型剤や有機核剤、無機核剤との組み合わせでは、高圧水素の充填および放圧を繰り返すと、成形品に欠陥点が発生しやすく、また、成形時の離型性は向上せず、成形品の靭性が低下する。 The polyamide resin composition for molded products that comes into contact with high-pressure hydrogen of the present invention (hereinafter, may be referred to as "polyamide resin composition") is an amide-based wax (B) with respect to 100 parts by weight of the polyamide 6 resin (A). ) Is compounded in an amount of 0.01 to 10 parts by weight. By blending a specific amount of the amide wax (B) with the polyamide 6 resin (A), which has an excellent balance of moldability, gas barrier property, rigidity and toughness, the crystallization temperature is high and crystallization from the molten state proceeds quickly. Therefore, the crystallization rate becomes high and dense and uniform crystals are formed, so that the permeation of hydrogen gas and the dissolution of hydrogen in the resin can be suppressed, so that high-pressure hydrogen is repeatedly filled and released. However, defects are unlikely to occur. In addition, the releasability at the time of molding is improved, and a molded product having excellent releasability can be obtained. On the other hand, in the combination of the polyamide 6 resin (A) with a mold release agent other than the amide wax (B), an organic nucleating agent, and an inorganic nucleating agent, when high-pressure hydrogen is repeatedly filled and released, the molded product has defects. Is likely to occur, and the releasability at the time of molding is not improved, and the toughness of the molded product is lowered.
本発明に用いられるポリアミド6樹脂(A)とは、6−アミノカプロン酸および/またはε−カプロラクタムを主たる原料とするポリアミド樹脂である。本発明の目的を損なわない範囲で、他の単量体が共重合されたものでもよい。ここで、「主たる原料とする」とは、ポリアミド樹脂を構成する単量体単位の合計100モル%中、6−アミノカプロン酸由来の単位またはε−カプロラクタム由来の単位を合計50モル%以上含むことを意味する。6−アミノカプロン酸由来の単位またはε−カプロラクタム由来の単位を70モル%以上含むことがより好ましく、90モル%以上含むことがさらに好ましい。 The polyamide 6 resin (A) used in the present invention is a polyamide resin mainly composed of 6-aminocaproic acid and / or ε-caprolactam. Other monomers may be copolymerized as long as the object of the present invention is not impaired. Here, "as the main raw material" means that the unit derived from 6-aminocaproic acid or the unit derived from ε-caprolactam is contained in a total of 50 mol% or more in a total of 100 mol% of the monomer units constituting the polyamide resin. Means. It is more preferable that the unit derived from 6-aminocaproic acid or the unit derived from ε-caprolactam is contained in an amount of 70 mol% or more, and more preferably 90 mol% or more.
共重合される他の単量体としては、例えば、11−アミノウンデカン酸、12−アミノドデカン酸、パラアミノメチル安息香酸などのアミノ酸、ω−ラウロラクタムなどのラクタム;テトラメチレンジアミン、ペンタメチレンジアミン、ヘキサメチレンジアミン、2−メチルペンタメチレンジアミン、ウンデカメチレンジアミン、ドデカメチレンジアミン、2,2,4−/2,4,4−トリメチルヘキサメチレンジアミン、5−メチルノナメチレンジアミンなどの脂肪族ジアミン;メタキシレンジアミン、パラキシリレンジアミンなどの芳香族ジアミン;1,3−ビス(アミノメチル)シクロヘキサン、1,4−ビス(アミノメチル)シクロヘキサン、1−アミノ−3−アミノメチル−3,5,5−トリメチルシクロヘキサン、ビス(4−アミノシクロヘキシル)メタン、ビス(3−メチル−4−アミノシクロヘキシル)メタン、2,2−ビス(4−アミノシクロヘキシル)プロパン、ビス(アミノプロピル)ピペラジン、アミノエチルピペラジンなどの脂環族ジアミン;アジピン酸、スベリン酸、アゼライン酸、セバシン酸、ドデカン二酸などの脂肪族ジカルボン酸;テレフタル酸、イソフタル酸、2−クロロテレフタル酸、2−メチルテレフタル酸、5−メチルイソフタル酸、5−ナトリウムスルホイソフタル酸、ヘキサヒドロテレフタル酸、ヘキサヒドロイソフタル酸などの芳香族ジカルボン酸;1,4−シクロヘキサンジカルボン酸、1,3−シクロヘキサンジカルボン酸、1,2−シクロヘキサンジカルボン酸、1,3−シクロペンタンジカルボン酸などの脂環族ジカルボン酸が挙げられる。これらを2種以上共重合してもよい。 Other monomers to be copolymerized include, for example, amino acids such as 11-aminoundecanoic acid, 12-aminododecanoic acid and paraaminomethylbenzoic acid, lactams such as ω-laurolactam; tetramethylenediamine, pentamethylenediamine, etc. An aliphatic diamine such as hexamethylenediamine, 2-methylpentamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2,4- / 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine; Aromatic diamines such as metaxylenediamine and paraxylylenediamine; 1,3-bis (aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane, 1-amino-3-aminomethyl-3,5,5 -Trimethylcyclohexane, bis (4-aminocyclohexyl) methane, bis (3-methyl-4-aminocyclohexyl) methane, 2,2-bis (4-aminocyclohexyl) propane, bis (aminopropyl) piperazine, aminoethyl piperazine, etc. Alicyclic diamines; aliphatic dicarboxylic acids such as adipic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid; terephthalic acid, isophthalic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid Aromatic dicarboxylic acids such as acids, 5-sodium sulfoisophthalic acid, hexahydroterephthalic acid, hexahydroisophthalic acid; 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 1 , 3-Cyclopentanedicarboxylic acid and other alicyclic dicarboxylic acids. Two or more kinds of these may be copolymerized.
ポリアミド6樹脂(A)の重合度には特に制限がないが、樹脂濃度0.01g/mlの98%濃硫酸溶液中、25℃で測定した相対粘度が、1.5〜7.0の範囲であることが好ましい。相対粘度が1.5以上であれば、成形時のポリアミド樹脂組成物の溶融粘度が適度に高くなり、成形時の空気の巻き込みを抑制し、成形性をより向上させることができる。相対粘度は1.8以上がより好ましい。一方、相対粘度が7.0以下であれば、ポリアミド樹脂組成物の成形時の溶融粘度が適度に低くなり、成形性をより向上させることができる。 The degree of polymerization of the polyamide 6 resin (A) is not particularly limited, but the relative viscosity measured at 25 ° C. in a 98% concentrated sulfuric acid solution having a resin concentration of 0.01 g / ml is in the range of 1.5 to 7.0. Is preferable. When the relative viscosity is 1.5 or more, the melt viscosity of the polyamide resin composition at the time of molding becomes appropriately high, air entrainment at the time of molding can be suppressed, and the moldability can be further improved. The relative viscosity is more preferably 1.8 or more. On the other hand, when the relative viscosity is 7.0 or less, the melt viscosity of the polyamide resin composition at the time of molding is appropriately lowered, and the moldability can be further improved.
ポリアミド6樹脂(A)のアミノ末端基量には特に制限がないが、1.0×10−5〜10.0×10−5mol/gの範囲であることが好ましい。アミノ末端基量が1.0×10−5〜10.0×10−5mol/gの範囲であれば、十分な重合度が得られ、成形品の機械強度を向上させることができる。ここで、ポリアミド6樹脂(A)のアミノ末端基量は、ポリアミド6樹脂(A)を、フェノール・エタノール混合溶媒(83.5:16.5(体積比))に溶解し、0.02N塩酸水溶液を用いて滴定することにより求めることができる。 The amount of amino-terminal groups of the polyamide 6 resin (A) is not particularly limited, but is preferably in the range of 1.0 × 10-5 to 10.0 × 10-5 mol / g. When the amount of amino-terminal groups is in the range of 1.0 × 10-5 to 10.0 × 10-5 mol / g, a sufficient degree of polymerization can be obtained and the mechanical strength of the molded product can be improved. Here, the amount of amino terminal groups of the polyamide 6 resin (A) is such that the polyamide 6 resin (A) is dissolved in a phenol / ethanol mixed solvent (83.5: 16.5 (volume ratio)) and 0.02N hydrochloric acid is used. It can be obtained by titrating with an aqueous solution.
本発明に用いられるアミド系ワックス(B)とは、モノカルボン酸とジアミンを反応せしめてなるアミド化合物、モノアミンと多塩基酸を反応せしめてなるアミド化合物、モノカルボン酸と多塩基酸とジアミンを反応せしめてなるアミド化合物などが挙げられる。これらは相当するアミンとカルボン酸の脱水反応等により得ることができる。 The amide-based wax (B) used in the present invention includes an amide compound obtained by reacting a monocarboxylic acid with a diamine, an amide compound obtained by reacting a monoamine with a polybasic acid, and a monocarboxylic acid with a polybasic acid and a diamine. Examples thereof include amide compounds that are reacted. These can be obtained by a dehydration reaction of the corresponding amine and carboxylic acid.
前記モノアミンとしては炭素数5以上のモノアミンが好ましく、その具体例としては、ペンチルアミン、ヘキシルアミン、ヘプチルアミン、オクチルアミン、ノニルアミン、デシルアミン、ドデシルアミン、ステアリルアミン、シクロヘキシルアミン、ベンジルアミンなどが例示でき、これらは2種以上を併用しても良い。中でも炭素数10以上20以下の高級脂肪族モノアミンが特に好ましい。炭素数が20より大きくなると、ポリアミド6樹脂(A)との相溶性が低下し、析出する恐れがある。 As the monoamine, a monoamine having 5 or more carbon atoms is preferable, and specific examples thereof include pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine, dodecylamine, stearylamine, cyclohexylamine, and benzylamine. , These may be used in combination of two or more. Of these, higher aliphatic monoamines having 10 or more and 20 or less carbon atoms are particularly preferable. When the number of carbon atoms is larger than 20, the compatibility with the polyamide 6 resin (A) is lowered, and there is a risk of precipitation.
前記モノカルボン酸は炭素数5以上の脂肪族モノカルボン酸およびヒドロキシカルボン酸が好ましく、その具体例としては、吉草酸、カプロン酸、カプリル酸、ラウリン酸、ミリスチン酸、パルミチン酸、ステアリン酸、オレイン酸、リノール酸、ベヘン酸、モンタン酸、12−ヒドロキシステアリン酸、安息香酸などが挙げられ、これらは2種以上を併用しても良い。中でも炭素数10以上30以下の高級脂肪族モノカルボン酸が特に好ましい。炭素数が30より大きくなると、ポリアミド6樹脂(A)との相溶性が低下し、析出する恐れがある。 The monocarboxylic acid is preferably an aliphatic monocarboxylic acid having 5 or more carbon atoms and a hydroxycarboxylic acid, and specific examples thereof include valeric acid, caproic acid, capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, and oleic acid. Examples thereof include acid, linoleic acid, bechenic acid, palmitic acid, 12-hydroxystearic acid, benzoic acid and the like, and two or more of these may be used in combination. Of these, higher aliphatic monocarboxylic acids having 10 or more and 30 or less carbon atoms are particularly preferable. When the number of carbon atoms is larger than 30, the compatibility with the polyamide 6 resin (A) is lowered, and there is a risk of precipitation.
前記ジアミンの具体例としてはエチレンジアミン、1,3−ジアミノプロパン、1,4−ジアミノプロパン、テトラメチレンジアミン、ヘキサメチレンンジアミン、ノナメチレンジアミン、ウンデカメチレンジアミン、ドデカメチレンジアミン、メタキシリレンジアミン、パラキシリレンジアミン、トリレンジアミン、フェニレンジアミン、イソホロンジアミンなどが挙げられ、これらは2種以上を併用しても良い。なかでもエチレンジアミンが特に好適である。 Specific examples of the diamine include ethylenediamine, 1,3-diaminopropane, 1,4-diaminopropane, tetramethylenediamine, hexamethylenediamine, nonamethylenediamine, undecamethylenediamine, dodecamethylenediamine, m-xylylenediamine, and the like. Examples thereof include paraxylylenediamine, tolylenediamine, phenylenediamine, isophoronediamine and the like, and two or more of these may be used in combination. Of these, ethylenediamine is particularly preferable.
前記多塩基酸とは、二塩基酸以上のカルボン酸であり、その具体例としてはマロン酸、コハク酸、アジピン酸、セバシン酸、ピメリン酸、アゼライン酸などの脂肪族ジカルボン酸、フタル酸、テレフタル酸、イソフタル酸などの芳香族ジカルボン酸、シクロへキサンジカルボン酸、シクロヘキシルコハク酸などの脂環式ジカルボン酸などが挙げられ、これらは2種以上を併用しても良い。 The polybasic acid is a carboxylic acid of dibasic acid or more, and specific examples thereof include aliphatic dicarboxylic acids such as malonic acid, succinic acid, adipic acid, sebacic acid, pimelic acid, and azelaic acid, phthalic acid, and terephthalic acid. Examples thereof include aromatic dicarboxylic acids such as acid and isophthalic acid, alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid and cyclohexylsuccinic acid, and two or more of these may be used in combination.
中でも高級脂肪族モノカルボン酸、多塩基酸およびジアミンを反応せしめたアミド化合物が特に好適であり、例えば、ステアリン酸、セバシン酸およびエチレンジアミンを反応せしめてなるアミド化合物が好ましく挙げられる。その際の各成分の混合割合は、高級脂肪族モノカルボン酸2モルに対し、多塩基酸0.18モル〜1.0モル、ジアミン1.0モル〜2.2モルの範囲が好適であり、高級脂肪族モノカルボン酸2モルに対し、多塩基酸0.5モル〜1.0モル、ジアミン1.5モル〜2.0モルの範囲が更に好適である。 Among them, an amide compound obtained by reacting a higher aliphatic monocarboxylic acid, a polybasic acid and a diamine is particularly preferable, and for example, an amide compound obtained by reacting stearic acid, sebacic acid and ethylenediamine is preferable. At that time, the mixing ratio of each component is preferably in the range of 0.18 mol to 1.0 mol of polybasic acid and 1.0 mol to 2.2 mol of diamine with respect to 2 mol of higher aliphatic monocarboxylic acid. The range of 0.5 mol to 1.0 mol of polybasic acid and 1.5 mol to 2.0 mol of diamine is more preferable with respect to 2 mol of higher aliphatic monocarboxylic acid.
アミド系ワックス(B)の融点には特に制限はないが、DSC測定による融点がポリアミド6樹脂(A)の融点以上であることが好ましい。アミド系ワックス(B)の融点がポリアミド6樹脂(A)の融点以上であると、より成形時の離型性が向上する。
The melting point of the amide wax (B) is not particularly limited, but it is preferable that the melting point measured by DSC is equal to or higher than the melting point of the polyamide 6 resin (A). When the melting point of the amide wax (B) is equal to or higher than the melting point of the polyamide 6 resin (A), the releasability during molding is further improved.
ここで、本発明におけるポリアミド6樹脂(A)およびアミド系ワックス(B)のDSC測定による融点は、次の方法により求めることができる。まず、示差走査熱量計(パーキンエルマー社製DSC−7)を用い、2点校正(インジウム、鉛)、ベースライン補正を行う。サンプル量を8〜10mgとして、昇温速度20℃/分の条件で昇温して得られる融解曲線の最大値を示す温度より15℃高い温度で1分間保持した後、20℃/分の降温速度で30℃まで冷却する。さらに、温度30℃で1分間保持した後、20℃/分の速度で、1回目の昇温工程と同様に、2回目の昇温工程を行う。この2回目の昇温工程において観測される融解吸熱ピーク温度を融点とする。 Here, the melting points of the polyamide 6 resin (A) and the amide wax (B) in the present invention by DSC measurement can be determined by the following method. First, a differential scanning calorimeter (DSC-7 manufactured by PerkinElmer) is used to perform two-point calibration (indium, lead) and baseline correction. The sample volume is 8 to 10 mg, the temperature is raised at a temperature rising rate of 20 ° C./min, and the temperature is kept at a temperature 15 ° C. higher than the temperature indicating the maximum value of the melting curve for 1 minute, and then the temperature is lowered by 20 ° C./min. Cool to 30 ° C. at a rate. Further, after holding the temperature at 30 ° C. for 1 minute, the second temperature raising step is performed at a rate of 20 ° C./min in the same manner as the first temperature raising step. The melting endothermic peak temperature observed in this second temperature raising step is defined as the melting point.
本発明のポリアミド樹脂組成物におけるアミド系ワックス(B)の配合量は、ポリアミド6樹脂(A)100重量部に対して0.01〜10重量部である。アミド系ワックス(B)の配合量を0.01重量部未満とすると、離型性の向上効果が十分ではなく、また、高圧の水素の充填および放圧を繰り返すことにより欠陥点が発生しやすくなる。アミド系ワックス(B)の配合量は0.05重量部以上が好ましく、0.1重量部以上がさらに好ましい。一方、アミド系ワックス(B)の配合量が10重量部を超えると、靭性が低下し、高圧の水素の充填および放圧を繰り返すことにより欠陥点が発生しやすくなる。アミド系ワックス(B)の配合量は7重量部以下が好ましく、5重量部以下がより好ましい。 The blending amount of the amide wax (B) in the polyamide resin composition of the present invention is 0.01 to 10 parts by weight with respect to 100 parts by weight of the polyamide 6 resin (A). If the blending amount of the amide wax (B) is less than 0.01 parts by weight, the effect of improving the releasability is not sufficient, and defects are likely to occur due to repeated filling and releasing of high-pressure hydrogen. Become. The blending amount of the amide wax (B) is preferably 0.05 parts by weight or more, more preferably 0.1 parts by weight or more. On the other hand, when the blending amount of the amide wax (B) exceeds 10 parts by weight, the toughness is lowered, and defects are likely to occur by repeating filling and releasing pressure of high-pressure hydrogen. The blending amount of the amide wax (B) is preferably 7 parts by weight or less, more preferably 5 parts by weight or less.
ポリアミド樹脂組成物は、耐衝撃材(C)をさらに配合してなることが好ましい。耐衝撃材(C)を配合することにより、成形品の耐衝撃性を向上させることができる。また、高圧水素に触れる用途に用いられる成形品は、高圧水素の充填および放圧により、−40℃以下から90℃以上への温度変化(ヒートサイクル)を繰り返し受けるため、例えば、樹脂部と金属部とを有する複合品の場合、樹脂部と金属部との結合部において割れが発生しやすい。耐衝撃材(C)を配合することにより、このようなヒートサイクルの繰り返しにより生じる樹脂部と金属部との結合部における割れを抑制することができ、耐ヒートサイクル性を向上させることができる。 The polyamide resin composition is preferably further blended with an impact resistant material (C). By blending the impact resistant material (C), the impact resistance of the molded product can be improved. In addition, molded products used for applications that come into contact with high-pressure hydrogen are repeatedly subjected to temperature changes (heat cycles) from -40 ° C or lower to 90 ° C or higher due to the filling and release of high-pressure hydrogen. In the case of a composite product having a portion, cracks are likely to occur at the joint portion between the resin portion and the metal portion. By blending the impact resistant material (C), it is possible to suppress cracking at the joint portion between the resin portion and the metal portion caused by the repetition of such a heat cycle, and it is possible to improve the heat cycle resistance.
耐衝撃材(C)としては、例えば、オレフィン系樹脂、アクリル系ゴム、シリコーン系ゴム、フッ素系ゴム、スチレン系ゴム、ニトリル系ゴム、ビニル系ゴム、ウレタン系ゴム、ポリアミドエラストマー、ポリエステルエラストマー、アイオノマーなどが挙げられる。これらを2種以上配合してもよい。 Examples of the impact resistant material (C) include olefin resin, acrylic rubber, silicone rubber, fluorine rubber, styrene rubber, nitrile rubber, vinyl rubber, urethane rubber, polyamide elastomer, polyester elastomer, and ionomer. And so on. Two or more of these may be blended.
これらの中でも、ポリアミド6樹脂(A)およびアミド系ワックス(B)との相溶性に優れ、耐ヒートサイクル性改良効果が高いことから、オレフィン系樹脂が好ましく用いられる。オレフィン系樹脂は、エチレン、プロピレン、ブテン、イソプレン、ペンテンなどのオレフィン単量体を重合して得られる熱可塑性樹脂である。2種以上のオレフィン単量体の共重合体であってもよいし、これらのオレフィン単量体と他の単量体との共重合体であってもよい。オレフィン系樹脂の具体例としては、ポリエチレン、ポリプロピレン、ポリスチレン、ポリ1−ブテン、ポリ1−ペンテン、ポリメチルペンテンなどの重合体またはこれらの共重合体;エチレン/α−オレフィン共重合体、エチレン/α,β−不飽和カルボン酸エステル共重合体、α−オレフィン/α,β−不飽和カルボン酸エステル共重合体、[(エチレンおよび/またはプロピレン)とビニルアルコールエステルとの共重合体]の少なくとも一部を加水分解して得られるポリオレフィン、(エチレンおよび/またはプロピレン)と(不飽和カルボン酸および/または不飽和カルボン酸エステル)との共重合体、[(エチレンおよび/またはプロピレン)と(不飽和カルボン酸および/または不飽和カルボン酸エステル)との共重合体]のカルボキシル基の少なくとも一部を金属塩化して得られるポリオレフィン、共役ジエンとビニル芳香族炭化水素とのブロック共重合体またはその水素化物などが挙げられる。これらの中でも、エチレン/α−オレフィン共重合体、エチレン/α,β−不飽和カルボン酸エステル共重合体がより好ましく、エチレン/α−オレフィン共重合体がさらに好ましい。 Among these, an olefin resin is preferably used because it has excellent compatibility with the polyamide 6 resin (A) and the amide wax (B) and has a high effect of improving heat cycle resistance. The olefin resin is a thermoplastic resin obtained by polymerizing an olefin monomer such as ethylene, propylene, butene, isoprene, and pentene. It may be a copolymer of two or more kinds of olefin monomers, or it may be a copolymer of these olefin monomers and other monomers. Specific examples of the olefin resin include polymers such as polyethylene, polypropylene, polystyrene, poly1-butene, poly1-pentene, and polymethylpentene, or polymers thereof; ethylene / α-olefin copolymer, ethylene / At least of α, β-unsaturated carboxylic acid ester copolymer, α-olefin / α, β-unsaturated carboxylic acid ester copolymer, [polymer of (ethylene and / or propylene) and vinyl alcohol ester] Polypolymers obtained by partially hydrolyzing, (ethylene and / or propylene) and (unsaturated carboxylic acid and / or unsaturated carboxylic acid ester), [(ethylene and / or propylene) and (non-saturated carboxylic acid ester). Polymers with saturated carboxylic acids and / or unsaturated carboxylic acid esters)] Polypolymers obtained by metally chloride at least a part of the carboxyl groups, block copolymers of conjugated diene and vinyl aromatic hydrocarbons or blocks thereof. Examples include hydrides. Among these, ethylene / α-olefin copolymers and ethylene / α, β-unsaturated carboxylic acid ester copolymers are more preferable, and ethylene / α-olefin copolymers are even more preferable.
また、前記ポリオレフィン系樹脂は、不飽和カルボン酸および/またはその誘導体で変性されていてもよい。ここで、不飽和カルボン酸の誘導体とは、不飽和カルボン酸のカルボキシル基のヒドロキシ基部分を他の置換基で置換した化合物であり、不飽和カルボン酸の金属塩、酸ハロゲン化物、エステル、酸無水物、アミドおよびイミドなどである。このような変性ポリオレフィン系樹脂を用いることにより、ポリアミド6樹脂(A)およびアミド系ワックス(B)との相溶性が一層向上し、耐ヒートサイクル性をより向上させることができる。不飽和カルボン酸またはその誘導体としては、例えば、アクリル酸、メタアクリル酸、マレイン酸、フマル酸、イタコン酸、クロトン酸、メチルマレイン酸、メチルフマル酸、メサコン酸、シトラコン酸、グルタコン酸およびこれらカルボン酸の金属塩;マレイン酸水素メチル、イタコン酸水素メチル、アクリル酸メチル、アクリル酸エチル、アクリル酸ブチル、アクリル酸2−エチルヘキシル、アクリル酸ヒドロキシエチル、メタアクリル酸メチル、メタアクリル酸2−エチルヘキシル、メタアクリル酸ヒドロキシエチル、メタアクリル酸アミノエチル、マレイン酸ジメチル、イタコン酸ジメチルなどの不飽和カルボン酸エステル;無水マレイン酸、無水イタコン酸、無水シトラコン酸、エンドビシクロ−(2,2,1)−5−ヘプテン−2,3−ジカルボン酸、エンドビシクロ−(2,2,1)−5−ヘプテン−2,3−ジカルボン酸無水物などの酸無水物;マレイミド、N−エチルマレイミド、N−ブチルマレイミド、N−フェニルマレイミド、アクリル酸グリシジル、メタクリル酸グリシジル、エタクリル酸グリシジル、イタコン酸グリシジル、シトラコン酸グリシジル、5−ノルボルネン−2,3−ジカルボン酸などが挙げられる。これらの中でも、不飽和ジカルボン酸およびその酸無水物が好ましく、マレイン酸または無水マレイン酸が特に好ましい。 Further, the polyolefin-based resin may be modified with an unsaturated carboxylic acid and / or a derivative thereof. Here, the derivative of the unsaturated carboxylic acid is a compound in which the hydroxy group portion of the carboxyl group of the unsaturated carboxylic acid is replaced with another substituent, and is a metal salt, an acid halide, an ester, or an acid of the unsaturated carboxylic acid. Such as anhydrides, amides and imides. By using such a modified polyolefin-based resin, the compatibility with the polyamide 6 resin (A) and the amide-based wax (B) can be further improved, and the heat cycle resistance can be further improved. Examples of unsaturated carboxylic acids or derivatives thereof include acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, crotonic acid, methylmaleic acid, methylfumaric acid, mesaconic acid, citraconic acid, glutaconic acid and these carboxylic acids. Metal salts of; methyl hydrogen maleate, methyl hydrogen itaconic acid, methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, hydroxyethyl acrylate, methyl methacrylate, 2-ethylhexyl methacrylate, meta Unsaturated carboxylic acid esters such as hydroxyethyl acrylate, aminoethyl metaacrylate, dimethyl maleate, dimethyl itaconic acid; maleic anhydride, itaconic anhydride, citraconic anhydride, endobicyclo- (2,2,1) -5 Acid anhydrides such as −hepten-2,3-dicarboxylic acid, endobicyclo- (2,2,1) -5-heptene-2,3-dicarboxylic acid anhydride; maleimide, N-ethylmaleimide, N-butylmaleimide , N-Phenylmaleimide, glycidyl acrylate, glycidyl methacrylate, glycidyl etaclilate, glycidyl itaconic acid, glycidyl citraconic acid, 5-norbornene-2,3-dicarboxylic acid and the like. Among these, unsaturated dicarboxylic acids and their acid anhydrides are preferable, and maleic acid or maleic anhydride is particularly preferable.
これらの不飽和カルボン酸またはその誘導体をポリオレフィン系樹脂に導入する方法としては、例えば、オレフィン単量体と、不飽和カルボン酸および/またはその誘導体を共重合する方法、ラジカル開始剤を用いて、未変性ポリオレフィン系樹脂に、不飽和カルボン酸および/またはその誘導体をグラフト導入する方法などを挙げることができる。 As a method for introducing these unsaturated carboxylic acids or derivatives thereof into a polyolefin-based resin, for example, a method for copolymerizing an olefin monomer with an unsaturated carboxylic acid and / or a derivative thereof, or a radical initiator is used. Examples thereof include a method of graft-introducing an unsaturated carboxylic acid and / or a derivative thereof into an unmodified polyolefin resin.
エチレン/α−オレフィン共重合体としては、エチレンと炭素原子数3〜20のα−オレフィンとの共重合体が好ましい。炭素数3〜20のα−オレフィンとしては、具体的には、プロピレン、1−ブテン、1−ペンテン、1−ヘキセン、1−ヘプテン、1−オクテン、1−ノネン、1−デセン、1−ウンデセン、1−ドデセン、1−トリデセン、1−テトラデセン、1−ペンタデセン、1−ヘキサデセン、1−ヘプタデセン、1−オクタデセン、1−ノナデセン、1−エイコセン、3−メチル−1−ブテン、3−メチル−1−ペンテン、3−エチル−1−ペンテン、4−メチル−1−ペンテン、4−メチル−1−ヘキセン、4,4−ジメチル−1−ヘキセン、4,4−ジメチル−1−ペンテン、4−エチル−1−ヘキセン、3−エチル−1−ヘキセン、9−メチル−1−デセン、11−メチル−1−ドデセン、12−エチル−1−テトラデセンなどが挙げられる。これらを2種以上用いてもよい。これらα−オレフィンの中でも、炭素数3〜12のα−オレフィンが、機械強度の向上の観点から好ましい。さらに、1,4−ヘキサジエン、ジシクロペンタジエン、2,5−ノルボルナジエン、5−エチリデンノルボルネン、5−エチル−2,5−ノルボルナジエン、5−(1’−プロペニル)−2−ノルボルネンなどの非共役ジエンの少なくとも1種が共重合されていてもよい。不飽和カルボン酸および/またはその誘導体で変性されたエチレンと炭素数3〜12のα−オレフィンとの共重合体が、ポリアミド6樹脂(A)およびアミド系ワックス(B)との相溶性を一層向上させ、耐ヒートサイクル性をより向上させることができるので、より好ましい。また、より高圧の水素で充填および放圧を繰り返しても、欠陥点の発生を抑制することができる。エチレン/α−オレフィン共重合体中のα−オレフィン含有量は、好ましくは1〜30モル%、より好ましくは2〜25モル%、さらに好ましくは3〜20モル%である。 As the ethylene / α-olefin copolymer, a copolymer of ethylene and an α-olefin having 3 to 20 carbon atoms is preferable. Specific examples of the α-olefin having 3 to 20 carbon atoms include propylene, 1-butene, 1-pentene, 1-hexene, 1-hexene, 1-octene, 1-nonene, 1-decene, and 1-undecene. , 1-dodecene, 1-tridecene, 1-tetradecene, 1-pentadecene, 1-hexadecene, 1-hexene, 1-octadecene, 1-nonadecene, 1-eicosene, 3-methyl-1-butene, 3-methyl-1 -Pentene, 3-ethyl-1-pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl Examples thereof include -1-hexene, 3-ethyl-1-hexene, 9-methyl-1-decene, 11-methyl-1-dodecene, and 12-ethyl-1-tetradecene. Two or more of these may be used. Among these α-olefins, α-olefins having 3 to 12 carbon atoms are preferable from the viewpoint of improving mechanical strength. In addition, non-conjugated diene such as 1,4-hexadiene, dicyclopentadiene, 2,5-norbornadiene, 5-ethylidene norbornene, 5-ethyl-2,5-norbornadiene, 5- (1'-propenyl) -2-norbornene. At least one of the above may be copolymerized. A copolymer of ethylene modified with an unsaturated carboxylic acid and / or a derivative thereof and an α-olefin having 3 to 12 carbon atoms further enhances compatibility with the polyamide 6 resin (A) and the amide wax (B). It is more preferable because it can be improved and the heat cycle resistance can be further improved. Further, even if filling and releasing pressure are repeated with higher pressure hydrogen, the occurrence of defective points can be suppressed. The α-olefin content in the ethylene / α-olefin copolymer is preferably 1 to 30 mol%, more preferably 2 to 25 mol%, still more preferably 3 to 20 mol%.
耐衝撃材(C)の構造は、特に限定されず、例えば、ゴムからなる少なくとも1つの層と、それとは異種の重合体からなる1つ以上の層からなる、いわゆるコアシェル型と呼ばれる多層構造体であってもよい。多層構造体を構成する層の数は、2層以上であればよく、3層以上または4層以上であってもよいが、内部に1層以上のゴム層(コア層)を有することが好ましい。多層構造体のゴム層を構成するゴムの種類は、特に限定されるものではなく、例えば、アクリル成分、シリコーン成分、スチレン成分、ニトリル成分、共役ジエン成分、ウレタン成分、エチレン成分、プロピレン成分、イソブテン成分などを重合させて得られるゴムが挙げられる。多層構造体のゴム層以外の層を構成する異種の重合体の種類は、熱可塑性を有する重合体であれば特に限定されるものではないが、ゴム層よりもガラス転移温度が高い重合体が好ましい。熱可塑性を有する重合体としては、例えば、不飽和カルボン酸アルキルエステル単位、不飽和カルボン酸単位、不飽和グリシジル基含有単位、不飽和ジカルボン酸無水物単位、脂肪族ビニル単位、芳香族ビニル単位、シアン化ビニル単位、マレイミド単位、不飽和ジカルボン酸単位およびその他のビニル単位などを含有する重合体が挙げられる。 The structure of the impact resistant material (C) is not particularly limited, and is, for example, a so-called core-shell type multilayer structure composed of at least one layer made of rubber and one or more layers made of polymers different from the same. It may be. The number of layers constituting the multilayer structure may be two or more, and may be three or more or four or more, but it is preferable to have one or more rubber layers (core layers) inside. .. The type of rubber constituting the rubber layer of the multilayer structure is not particularly limited, and for example, an acrylic component, a silicone component, a styrene component, a nitrile component, a conjugated diene component, a urethane component, an ethylene component, a propylene component, and isobutylene. Examples thereof include rubber obtained by polymerizing components and the like. The type of the heterogeneous polymer constituting the layer other than the rubber layer of the multilayer structure is not particularly limited as long as it is a polymer having thermoplasticity, but a polymer having a glass transition temperature higher than that of the rubber layer is used. preferable. Examples of the polymer having thermoplasticity include unsaturated carboxylic acid alkyl ester units, unsaturated carboxylic acid units, unsaturated glycidyl group-containing units, unsaturated dicarboxylic acid anhydride units, aliphatic vinyl units, and aromatic vinyl units. Polymers containing vinyl cyanide units, maleimide units, unsaturated dicarboxylic acid units and other vinyl units can be mentioned.
ポリアミド樹脂組成物における耐衝撃材(C)の配合量は、ポリアミド6樹脂(A)100重量部に対して、1〜50重量部が好ましい。耐衝撃材(C)の配合量を1重量部以上とすることにより、耐ヒートサイクル性をより向上させることができる。耐衝撃材(C)の配合量は、5重量部以上がより好ましく、10重量部以上がさらに好ましい。一方、耐衝撃材(C)の配合量を50重量部以下とすることにより、高圧の水素で充填および放圧を繰り返しても、欠陥点の発生を抑制することができる。耐衝撃材(C)の配合量は、45重量部以下がより好ましく、40重量部以下がさらに好ましく、35重量部以下がさらに好ましい。 The amount of the impact-resistant material (C) blended in the polyamide resin composition is preferably 1 to 50 parts by weight with respect to 100 parts by weight of the polyamide 6 resin (A). The heat cycle resistance can be further improved by setting the blending amount of the impact resistant material (C) to 1 part by weight or more. The blending amount of the impact resistant material (C) is more preferably 5 parts by weight or more, further preferably 10 parts by weight or more. On the other hand, by setting the blending amount of the impact resistant material (C) to 50 parts by weight or less, it is possible to suppress the occurrence of defective points even if the filling and releasing pressure are repeated with high-pressure hydrogen. The blending amount of the impact resistant material (C) is more preferably 45 parts by weight or less, further preferably 40 parts by weight or less, and further preferably 35 parts by weight or less.
ポリアミド樹脂組成物には、その特性を損なわない範囲で、必要に応じて、前記成分(A)、(B)および(C)以外のその他の成分を配合しても構わない。その他の成分としては、例えば、充填材、前記成分(A)〜(C)以外の熱可塑性樹脂類および各種添加剤類を挙げることができる。 If necessary, other components other than the above components (A), (B) and (C) may be added to the polyamide resin composition as long as the characteristics are not impaired. Examples of other components include fillers, thermoplastic resins other than the components (A) to (C), and various additives.
例えば、ポリアミド樹脂組成物に、その他の成分として、充填材を配合することにより、得られる成形品の強度および寸法安定性等を向上させることができる。充填材の形状は、繊維状であっても非繊維状であってもよく、繊維状充填材と非繊維状充填材を組み合わせて用いてもよい。繊維状充填材としては、例えば、ガラス繊維、ガラスミルドファイバー、炭素繊維、チタン酸カリウムウィスカ、酸化亜鉛ウィスカ、硼酸アルミニウムウィスカ、アラミド繊維、アルミナ繊維、炭化珪素繊維、セラミック繊維、アスベスト繊維、石コウ繊維、金属繊維などが挙げられる。非繊維状充填材としては、例えば、ワラステナイト、ゼオライト、セリサイト、カオリン、マイカ、クレー、パイロフィライト、ベントナイト、アスベスト、タルク、アルミナシリケートなどの珪酸塩;アルミナ、酸化珪素、酸化マグネシウム、酸化ジルコニウム、酸化チタン、酸化鉄などの金属酸化物;炭酸カルシウム、炭酸マグネシウム、ドロマイトなどの金属炭酸塩;硫酸カルシウム、硫酸バリウムなどの金属硫酸塩;水酸化マグネシウム、水酸化カルシウム、水酸化アルミニウムなどの金属水酸化物;ガラスビーズ、セラミックビーズ、窒化ホウ素および炭化珪素などが挙げられる。これらは中空であってもよい。また、これら繊維状および/または非繊維状充填材を、カップリング剤で予備処理して使用することは、より優れた機械特性を得る意味において好ましい。カップリング剤としては、例えば、イソシアネート系化合物、有機シラン系化合物、有機チタネート系化合物、有機ボラン系化合物、エポキシ化合物などが挙げられる。 For example, by blending a filler as another component in the polyamide resin composition, the strength and dimensional stability of the obtained molded product can be improved. The shape of the filler may be fibrous or non-fibrous, and the fibrous filler and the non-fibrous filler may be used in combination. Examples of the fibrous filler include glass fiber, glass milled fiber, carbon fiber, potassium titanate whisker, zinc oxide whisker, aluminum borate whisker, aramid fiber, alumina fiber, silicon carbide fiber, ceramic fiber, asbestos fiber, and stone wool. Examples include fibers and metal fibers. Non-fibrous fillers include, for example, silicates such as warastenite, zeolite, sericite, kaolin, mica, clay, pyrophyllite, bentonite, asbestos, talc, alumina silicate; alumina, silicon oxide, magnesium oxide, oxidation. Metal oxides such as zirconium, titanium oxide and iron oxide; metal carbonates such as calcium carbonate, magnesium carbonate and dolomite; metal sulfates such as calcium sulfate and barium sulfate; Metal hydroxides; glass beads, ceramic beads, boron nitride, silicon carbide and the like. These may be hollow. Further, it is preferable to use these fibrous and / or non-fibrous fillers after pretreatment with a coupling agent in the sense of obtaining better mechanical properties. Examples of the coupling agent include isocyanate compounds, organic silane compounds, organic titanate compounds, organic borane compounds, epoxy compounds and the like.
熱可塑性樹脂類としては、例えば、ポリエステル樹脂、ポリフェニレンスルフィド樹脂、ポリフェニレンオキシド樹脂、ポリカーボネート樹脂、ポリ乳酸樹脂、ポリアセタール樹脂、ポリスルホン樹脂、四フッ化ポリエチレン樹脂、ポリエーテルイミド樹脂、ポリアミドイミド樹脂、ポリイミド樹脂、ポリエーテルスルホン樹脂、ポリエーテルケトン樹脂、ポリチオエーテルケトン樹脂、ポリエーテルエーテルケトン樹脂、ポリスチレン樹脂やABS樹脂等のスチレン系樹脂、ポリアルキレンオキサイド樹脂等が挙げられる。かかる熱可塑性樹脂類を2種以上配合することも可能である。 Examples of thermoplastic resins include polyester resin, polyphenylene sulfide resin, polyphenylene oxide resin, polycarbonate resin, polylactic acid resin, polyacetal resin, polysulfone resin, tetrafluoride polyethylene resin, polyetherimide resin, polyamideimide resin, and polyimide resin. , Polyether sulfone resin, polyether ketone resin, polythioether ketone resin, polyether ether ketone resin, styrene resin such as polystyrene resin and ABS resin, polyalkylene oxide resin and the like. It is also possible to blend two or more kinds of such thermoplastic resins.
各種添加剤類としては、例えば、着色防止剤、ヒンダードフェノール、ヒンダードアミンなどの酸化防止剤、離型剤、可塑剤、熱安定剤、滑剤、紫外線防止剤、着色剤、難燃剤、発泡剤などが挙げられる。 Examples of various additives include antioxidants, antioxidants such as hindered phenol and hindered amine, mold release agents, plasticizers, heat stabilizers, lubricants, UV inhibitors, colorants, flame retardants, foaming agents and the like. Can be mentioned.
ポリアミド樹脂組成物には、銅化合物を配合することが、長期耐熱性を向上させることができるので好ましい。銅化合物としては、例えば、塩化第一銅、塩化第二銅、臭化第一銅、臭化第二銅、ヨウ化第一銅、ヨウ化第二銅、硫酸第二銅、硝酸第二銅、リン酸銅、酢酸第一銅、酢酸第二銅、サリチル酸第二銅、ステアリン酸第二銅、安息香酸第二銅および前記無機ハロゲン化銅とキシリレンジアミン、2−メルカプトベンズイミダゾール、ベンズイミダゾールなどの錯化合物などが挙げられる。これらを2種以上配合してもよい。なかでも1価の銅化合物、とりわけ1価のハロゲン化銅化合物が好ましく、酢酸第1銅、ヨウ化第1銅などが好ましい。銅化合物の配合量は、ポリアミド6樹脂(A)100重量部に対して0.01重量部以上が好ましく、0.015重量部以上がより好ましい。一方、成形時の金属銅の遊離に起因する着色を抑制する観点から、銅化合物の配合量は、2重量部以下が好ましく、1重量部以下がより好ましい。 It is preferable to add a copper compound to the polyamide resin composition because long-term heat resistance can be improved. Examples of copper compounds include cuprous chloride, cupric chloride, cuprous bromide, cupric bromide, cuprous iodide, cupric iodide, cupric sulfate, and cupric nitrate. , Copper phosphate, cuprous acetate, cupric acetate, cupric salicylate, cupric stearate, cupric benzoate and the inorganic copper halides and xylylene diamine, 2-mercaptobenzimidazole, benzimidazole. Examples include complex compounds such as. Two or more of these may be blended. Among them, a monovalent copper compound, particularly a monovalent copper halide compound is preferable, and cuprous acetate, cuprous iodide and the like are preferable. The blending amount of the copper compound is preferably 0.01 part by weight or more, and more preferably 0.015 part by weight or more with respect to 100 parts by weight of the polyamide 6 resin (A). On the other hand, from the viewpoint of suppressing coloring due to the release of metallic copper during molding, the blending amount of the copper compound is preferably 2 parts by weight or less, and more preferably 1 part by weight or less.
また、銅化合物とともにハロゲン化アルカリを配合してもよい。ハロゲン化アルカリ化合物としては、例えば、塩化リチウム、臭化リチウム、ヨウ化リチウム、塩化カリウム、臭化カリウム、ヨウ化カリウム、臭化ナトリウムおよびヨウ化ナトリウムを挙げることができる。これらを2種以上配合してもよい。ヨウ化カリウムまたはヨウ化ナトリウムが特に好ましい。 Further, an alkali halide may be blended together with the copper compound. Examples of the alkali halide compound include lithium chloride, lithium bromide, lithium iodide, potassium chloride, potassium bromide, potassium iodide, sodium bromide and sodium iodide. Two or more of these may be blended. Potassium iodide or sodium iodide is particularly preferred.
ポリアミド樹脂組成物のDSC測定による降温結晶化温度は、180℃以上であることが好ましく、183℃以上であることがより好ましい。ポリアミド樹脂組成物の降温結晶化温度が180℃以上であれば、ポリアミド樹脂組成物の溶融状態からの冷却過程において、緻密で均一な結晶が形成されやすくなることで、水素透過性が低くなり、高圧水素の充填および放圧を繰り返しても欠陥点の発生を抑制できるポリアミド樹脂組成物の降温結晶化温度は、180℃以上が好ましく、183℃以上がより好ましい。 The temperature-lowering crystallization temperature of the polyamide resin composition measured by DSC is preferably 180 ° C. or higher, more preferably 183 ° C. or higher. When the temperature-lowering crystallization temperature of the polyamide resin composition is 180 ° C. or higher, dense and uniform crystals are easily formed in the cooling process from the molten state of the polyamide resin composition, so that the hydrogen permeability is lowered. The temperature-lowering crystallization temperature of the polyamide resin composition capable of suppressing the occurrence of defect points even when the high-pressure hydrogen is repeatedly filled and released is preferably 180 ° C. or higher, more preferably 183 ° C. or higher.
なお、本発明において、ポリアミド樹脂組成物のDSC測定による降温結晶化温度は、次の方法で求めることができる。まず、示差走査熱量計(パーキンエルマー社製DSC−7)を用い、2点校正(インジウム、鉛)、ベースライン補正を行う。サンプル量を8〜10mgとして、昇温速度20℃/分の条件で昇温して得られる融解曲線の最大値を示す温度より15℃高い温度で1分間保持した後、20℃/分の降温速度で30℃まで冷却したときに観測される結晶化発熱ピーク温度を降温結晶化温度とする。ただし、ピークが2つ以上観測される場合には、結晶化発熱ピークの最も大きいものに対応する温度を、ポリアミド樹脂組成物の降温結晶化温度とする。 In the present invention, the temperature-decreasing crystallization temperature of the polyamide resin composition measured by DSC can be determined by the following method. First, a differential scanning calorimeter (DSC-7 manufactured by PerkinElmer) is used to perform two-point calibration (indium, lead) and baseline correction. The sample volume is 8 to 10 mg, the temperature is raised at a temperature rising rate of 20 ° C./min, and the temperature is kept at a temperature 15 ° C. higher than the temperature indicating the maximum value of the melting curve obtained for 1 minute, and then the temperature is lowered by 20 ° C. The crystallization exothermic peak temperature observed when cooled to 30 ° C. at a rate is defined as the temperature-decreasing crystallization temperature. However, when two or more peaks are observed, the temperature corresponding to the largest exothermic crystallization peak is defined as the temperature-decreasing crystallization temperature of the polyamide resin composition.
ポリアミド樹脂組成物の降温結晶化温度を上記範囲にする手段としては、例えば、前述の好ましいポリアミド樹脂組成物を用いる方法などが挙げられる。 As a means for setting the temperature lowering crystallization temperature of the polyamide resin composition in the above range, for example, a method using the above-mentioned preferable polyamide resin composition can be mentioned.
次に、本発明のポリアミド樹脂組成物の製造方法について説明する。本発明の熱可塑性ポリアミド樹脂組成物の製造方法としては、特に制限はなく、例えば、ポリアミド6樹脂(A)とアミド系ワックス(B)および必要に応じて耐衝撃材(C)やその他成分を一括混練する方法、ポリアミド6樹脂(A)を溶融した後にアミド系ワックス(B)および必要に応じて耐衝撃材(C)やその他成分を混練する方法、ポリアミド6樹脂(A)とアミド系ワックス(B)を溶融してから必要に応じて耐衝撃材(C)やその他成分を混練する方法などが挙げられる。混練装置としては、例えば、バンバリーミキサー、ロール、押出機等の公知の混練装置を採用することができる。本発明のポリアミド樹脂組成物に耐衝撃材(C)および各種添加剤類などのその他成分を配合する場合、これらを任意の段階で配合することができる。例えば、二軸押出機により本発明のポリアミド樹脂組成物を製造する場合、ポリアミド6樹脂(A)とアミド系ワックス(B)を配合する際に耐衝撃材(C)、その他の成分を同時に配合する方法や、ポリアミド6樹脂(A)とアミド系ワックス(B)を溶融混練中にサイドフィード等の手法により耐衝撃材(C)およびその他の成分を配合する方法や、予めポリアミド6樹脂(A)とアミド系ワックス(B)を溶融混練した後に耐衝撃材(C)およびその他の成分を配合する方法や、予め、ポリアミド6樹脂(A)に耐衝撃材(C)およびその他の成分を配合して溶融混練後、アミド系ワックス(B)を配合する方法などが挙げられる。 Next, a method for producing the polyamide resin composition of the present invention will be described. The method for producing the thermoplastic polyamide resin composition of the present invention is not particularly limited, and for example, a polyamide 6 resin (A), an amide-based wax (B), an impact-resistant material (C) and other components as necessary are used. A method of batch kneading, a method of kneading the amide wax (B) and, if necessary, an impact resistant material (C) and other components after melting the polyamide 6 resin (A), a method of kneading the polyamide 6 resin (A) and the amide wax. Examples thereof include a method of melting the (B) and then kneading the impact resistant material (C) and other components as needed. As the kneading device, for example, a known kneading device such as a Banbury mixer, a roll, or an extruder can be adopted. When the polyamide resin composition of the present invention is blended with other components such as the impact resistant material (C) and various additives, these can be blended at any stage. For example, when the polyamide resin composition of the present invention is produced by a twin-screw extruder, the impact-resistant material (C) and other components are simultaneously blended when the polyamide 6 resin (A) and the amide wax (B) are blended. A method of blending the impact-resistant material (C) and other components by a method such as side feeding during melt-kneading of the polyamide 6 resin (A) and the amide wax (B), or a method of blending the polyamide 6 resin (A) and the amide wax (B) in advance. ) And the amide wax (B) are melt-kneaded and then the impact-resistant material (C) and other components are blended, or the polyamide 6 resin (A) is mixed with the impact-resistant material (C) and other components in advance. Then, after melt-kneading, a method of blending the amide wax (B) and the like can be mentioned.
本発明のポリアミド樹脂組成物は、任意の方法により成形して成形品を得ることが可能である。成形方法としては、例えば、押出成形、射出成形、中空成形、カレンダ成形、圧縮成形、真空成形、発泡成形、ブロー成形、回転成形等が挙げられる。成形形状としては、例えば、ペレット状、板状、繊維状、ストランド状、フィルムまたはシート状、パイプ状、中空状、箱状等の形状が挙げられる。 The polyamide resin composition of the present invention can be molded by any method to obtain a molded product. Examples of the molding method include extrusion molding, injection molding, hollow molding, calender molding, compression molding, vacuum molding, foam molding, blow molding, rotary molding and the like. Examples of the molding shape include a pellet shape, a plate shape, a fibrous shape, a strand shape, a film or sheet shape, a pipe shape, a hollow shape, a box shape, and the like.
本発明の成形品は、高圧水素の充填および放圧を繰り返しても欠陥点の発生が抑制される優れた特徴を活かして、高圧水素に触れる成形品に用いられる。ここでいう高圧水素に触れる成形品とは、常圧以上の圧力の水素に触れる成形品である。高圧水素の充填および放圧を繰り返したときの欠陥点の発生を抑制する効果を奏することから、圧力20MPa以上の水素に触れる成形品用途に好ましく用いられ、30MPa以上の水素に触れる成形品用途により好ましく用いられる。一方、圧力200MPa以下の水素に触れる成形品用途に好ましく用いられ、150MPa以下の水素に触れる成形品用途により好ましく用いられ、100MPa以下の水素に触れる成形品用途にさらに好ましく用いられる。高圧水素に触れる成形品としては、例えば、高圧水素用開閉バルブ、高圧水素用逆止弁、高圧水素用減圧弁、高圧水素用圧力調整弁、高圧水素用シール、高圧水素用ホース、高圧水素用タンク、高圧水素用タンクライナー、高圧水素用パイプ、高圧水素用パッキン、高圧水素用圧力センサ、高圧水素用ポンプ、高圧水素用チューブ、高圧水素用レギュレーター、高圧水素用フィルム、高圧水素用シート、高圧水素用繊維、高圧水素用継ぎ手等が挙げられる。中でも、高圧水素用開閉バルブ、高圧水素用逆止弁、高圧水素用減圧弁、高圧水素用圧力調整弁、高圧水素用タンク、高圧水素用タンクライナー、高圧水素用パッキン、高圧水素用圧力センサ、高圧水素用ポンプ、高圧水素用レギュレーター、高圧水素用継ぎ手等の高圧水素容器およびその周辺部品に好ましく使用することができる。これらの中でも、高圧水素用タンクに特に好ましく用いることができる。 The molded product of the present invention is used for a molded product that comes into contact with high-pressure hydrogen, taking advantage of its excellent feature that the generation of defective points is suppressed even when the high-pressure hydrogen is repeatedly filled and released. The molded product that comes into contact with high-pressure hydrogen here is a molded product that comes into contact with hydrogen at a pressure higher than normal pressure. Since it has the effect of suppressing the occurrence of defective points when high-pressure hydrogen is repeatedly filled and released, it is preferably used for molded products that come into contact with hydrogen at a pressure of 20 MPa or more, and depending on the use of molded products that come into contact with hydrogen of 30 MPa or more. It is preferably used. On the other hand, it is preferably used for articles that come into contact with hydrogen at a pressure of 200 MPa or less, preferably for articles that come into contact with hydrogen of 150 MPa or less, and more preferably for articles that come into contact with hydrogen of 100 MPa or less. Molded products that come into contact with high-pressure hydrogen include, for example, an on-off valve for high-pressure hydrogen, a check valve for high-pressure hydrogen, a pressure reducing valve for high-pressure hydrogen, a pressure regulating valve for high-pressure hydrogen, a seal for high-pressure hydrogen, a hose for high-pressure hydrogen, and a hose for high-pressure hydrogen. Tank, tank liner for high pressure hydrogen, pipe for high pressure hydrogen, packing for high pressure hydrogen, pressure sensor for high pressure hydrogen, pump for high pressure hydrogen, tube for high pressure hydrogen, regulator for high pressure hydrogen, film for high pressure hydrogen, sheet for high pressure hydrogen, high pressure Examples include hydrogen fibers and high-pressure hydrogen joints. Among them, on-off valve for high-pressure hydrogen, check valve for high-pressure hydrogen, pressure reducing valve for high-pressure hydrogen, pressure regulating valve for high-pressure hydrogen, tank for high-pressure hydrogen, tank liner for high-pressure hydrogen, packing for high-pressure hydrogen, pressure sensor for high-pressure hydrogen, It can be preferably used for high-pressure hydrogen containers such as high-pressure hydrogen pumps, high-pressure hydrogen regulators, and high-pressure hydrogen joints, and their peripheral parts. Among these, it can be particularly preferably used for a high-pressure hydrogen tank.
高圧水素用タンクライナーは、任意の方法により成形して得ることが可能である。成形方法としては、例えば、押出成形、射出成形、中空成形、カレンダ成形、圧縮成形、真空成形、発泡成形、ブロー成形、回転成形等が挙げられる。 The tank liner for high-pressure hydrogen can be obtained by molding by any method. Examples of the molding method include extrusion molding, injection molding, hollow molding, calender molding, compression molding, vacuum molding, foam molding, blow molding, rotary molding and the like.
また、高圧水素用タンクライナーを形成する方法は、高圧水素用タンクライナーを構成する2つ以上の分割体を成形によって形成し、これらを溶着により接合することによって形成する方法を挙げることができる。例えば、高圧水素用タンクライナーを半分に縦割りにした形状の成形体2つを溶着により接合することによって高圧水素用タンクライナーを形成する方法、高圧水素用タンクライナーを半分に横割りにした形状の成形体2つを溶着により接合することによって高圧水素用タンクライナーを形成する方法、高圧水素タンクライナーの両端部をふさぐ、半円状・楕円状などの形状をしている鏡板2つと、胴部を溶着により接合することによって高圧水素用タンクライナーを形成する方法等が挙げられるが、これに限定されるものではない。 Further, as a method of forming the tank liner for high-pressure hydrogen, a method of forming two or more divided bodies constituting the tank liner for high-pressure hydrogen by molding and joining them by welding can be mentioned. For example, a method of forming a high-pressure hydrogen tank liner by joining two molded bodies having a shape in which a high-pressure hydrogen tank liner is vertically divided in half by welding, and a method in which a high-pressure hydrogen tank liner is horizontally divided in half. A method of forming a tank liner for high-pressure hydrogen by joining two molded bodies of the above, two end plates having a semicircular or elliptical shape that close both ends of the high-pressure hydrogen tank liner, and a body. Examples thereof include, but are not limited to, a method of forming a tank liner for high-pressure hydrogen by joining the portions by welding.
溶着としては、熱板溶着、超音波溶着、振動溶着、レーザー溶着、赤外線溶着、赤外線にて溶着部を温めた後に振動溶着を行う赤外線/振動溶着等が挙げられる。中でも赤外線溶着、赤外線/振動溶着が好ましい。 Examples of the welding include hot plate welding, ultrasonic welding, vibration welding, laser welding, infrared welding, infrared / vibration welding in which the welded portion is warmed by infrared rays and then vibration welding is performed. Of these, infrared welding and infrared / vibration welding are preferable.
特に好ましい態様は、樹脂製ライナーの外側を炭素繊維強化樹脂で補強してなる高圧水素用タンクの樹脂製ライナーとして、本発明のポリアミド樹脂組成物からなるタンクライナーを使用する態様である。すなわち、本発明の高圧水素用タンクは、本発明のポリアミド樹脂組成物からなるタンクライナーの表層に、炭素繊維強化樹脂(CFRP)補強層が積層されてなる、高圧水素用タンクである。 A particularly preferable embodiment is an embodiment in which the tank liner made of the polyamide resin composition of the present invention is used as the resin liner for a high-pressure hydrogen tank in which the outside of the resin liner is reinforced with a carbon fiber reinforced resin. That is, the high-pressure hydrogen tank of the present invention is a high-pressure hydrogen tank in which a carbon fiber reinforced resin (CFRP) reinforcing layer is laminated on the surface layer of a tank liner made of the polyamide resin composition of the present invention.
タンクライナーの表層に、CFRP補強層を積層していることにより、高圧に耐えうる強度や弾性率を発現させることができるので好ましい。CFRP補強層は、炭素繊維とマトリクス樹脂により構成される。炭素繊維としては、曲げ特性および強度の観点から、炭素繊維単体の引張弾性率が50〜700GPaのものが好ましく、比剛性の観点をも考慮すると、200〜700GPaのものがより好ましく、コストパフォーマンスの観点をも考慮すると200〜450GPaのものが最も好ましい。また、炭素繊維単体の引張強さは、1500〜7000MPaが好ましく、比強度の観点から、3000〜7000MPaが好ましい。また、炭素繊維の密度は、1.60〜3.00が好ましく、軽量化の観点から1.70〜2.00がより好ましく、コストパフォーマンスの面より1.70〜1.90が最も好ましい。さらに、炭素繊維の繊維径は、一本当たり5〜30μmが好ましく、取り扱い性の観点から5〜20μmがより好ましく、さらに軽量化の観点から、5〜10μmが最も好ましい。炭素繊維を単体で用いても良いし、炭素繊維以外の強化繊維を組み合わせて用いてもよい。炭素繊維以外の強化繊維としては、ガラス繊維やアラミド繊維などが挙げられる。また、炭素繊維とマトリックス樹脂の割合を炭素繊維強化樹脂補強層材料中の炭素繊維の体積分率Vfで規定すると、剛性の観点からVfは20〜90%が好ましく、生産性や要求剛性の観点からVfが40〜80%であることが好ましい。 By laminating a CFRP reinforcing layer on the surface layer of the tank liner, it is possible to develop strength and elastic modulus that can withstand high pressure, which is preferable. The CFRP reinforcing layer is composed of carbon fibers and a matrix resin. As the carbon fiber, one having a tensile elastic modulus of 50 to 700 GPa is preferable from the viewpoint of bending characteristics and strength, and one having a tensile elastic modulus of 200 to 700 GPa is more preferable from the viewpoint of specific rigidity, and the cost performance is higher. From the viewpoint, the one with 200 to 450 GPa is most preferable. The tensile strength of the carbon fiber alone is preferably 1500 to 7000 MPa, and preferably 3000 to 7000 MPa from the viewpoint of specific strength. The density of carbon fibers is preferably 1.60 to 3.00, more preferably 1.70 to 2.00 from the viewpoint of weight reduction, and most preferably 1.70 to 1.90 from the viewpoint of cost performance. Further, the fiber diameter of each carbon fiber is preferably 5 to 30 μm, more preferably 5 to 20 μm from the viewpoint of handleability, and most preferably 5 to 10 μm from the viewpoint of weight reduction. The carbon fiber may be used alone, or may be used in combination with reinforcing fibers other than the carbon fiber. Examples of reinforcing fibers other than carbon fibers include glass fibers and aramid fibers. Further, when the ratio of the carbon fiber and the matrix resin is defined by the body integral ratio Vf of the carbon fiber in the carbon fiber reinforced resin reinforcing layer material, the Vf is preferably 20 to 90% from the viewpoint of rigidity, and from the viewpoint of productivity and required rigidity. Therefore, it is preferable that Vf is 40 to 80%.
CFRP補強層を構成するマトリックス樹脂としては、熱硬化性樹脂であっても熱可塑性樹脂であってもよい。マトリックス樹脂が熱硬化性樹脂の場合、その主材は、エポキシ樹脂、不飽和ポリエステル樹脂、ビニルエステル樹脂、フェノール樹脂、ポリウレタン樹脂、シリコーン樹脂などを例示することができる。これらの1種類だけを使用しても、2種類以上を混合して使用してもよい。エポキシ樹脂が特に好ましい。エポキシ樹脂としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、イソシアネート変性ビスフェノールA型エポキシ樹脂などがあげられる。熱硬化性樹脂をマトリックス樹脂に採用する場合、熱硬化性樹脂成分に適切な硬化剤や反応促進剤を添加することが可能である。 The matrix resin constituting the CFRP reinforcing layer may be a thermosetting resin or a thermoplastic resin. When the matrix resin is a thermosetting resin, examples of the main material thereof include epoxy resin, unsaturated polyester resin, vinyl ester resin, phenol resin, polyurethane resin, and silicone resin. Only one of these types may be used, or two or more types may be mixed and used. Epoxy resins are particularly preferred. Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, and isocyanate-modified bisphenol A type epoxy resin. When a thermosetting resin is used as the matrix resin, it is possible to add an appropriate curing agent or reaction accelerator to the thermosetting resin component.
マトリックス樹脂が熱可塑性樹脂の場合、その主材は、ポリエチレン樹脂、ポリプロピレン樹脂、ポリ塩化ビニル樹脂、ABS樹脂、ポリスチレン樹脂、AS樹脂、ポリアミド樹脂、ポリアセタール樹脂、ポリカーボネート樹脂、熱可塑性ポリエステル樹脂、PPS樹脂、フッ素樹脂、ポリエーテルイミド樹脂、ポリエーテルケトン樹脂、ポリイミド樹脂などが例示できる。これら熱可塑性樹脂は、単独でも、2種類以上の混合物でも、共重合体でも良い。混合物の場合には相溶化剤を併用しても良い。また、難燃剤として臭素系難燃剤、シリコン系難燃剤、赤燐などを加えても良い。 When the matrix resin is a thermoplastic resin, the main materials thereof are polyethylene resin, polypropylene resin, polyvinyl chloride resin, ABS resin, polystyrene resin, AS resin, polyamide resin, polyacetal resin, polycarbonate resin, thermoplastic polyester resin, and PPS resin. , Fluororesin, polyetherimide resin, polyetherketone resin, polyimide resin and the like can be exemplified. These thermoplastic resins may be used alone, as a mixture of two or more kinds, or as a copolymer. In the case of a mixture, a compatibilizer may be used in combination. Further, as the flame retardant, a brominated flame retardant, a silicon flame retardant, red phosphorus or the like may be added.
CFRP補強層を高圧水素用タンクライナーの表層に積層する方法としては、公知のフィラメントワインディング(以下FW)法、テープワインディング(以下TW)法、シートワインディング(以下SW)法、ハンドレイアップ法、RTM(Resin Transfer Molding)法などを例示することができる。これら成形法のうち、単一の方法のみで成形してもよいし、2種類以上の成形法を組み合わせて成形しても良い。特性の発現性や生産性および成形性の観点から、FW法、TW法およびSW法から選ばれた方法が好ましい。これらFW法、SW法およびTW法は、基本的には、ストランド状の炭素繊維にマトリックス樹脂を付与してライナーに積層するという観点では、同一の成形法であり、炭素繊維をライナーに対して、フィラメント(糸)形態、テープ(糸をある程度束ねたテープ状)形態およびシート(テープをある程度束ねたシート状)形態のいずれの形態で巻き付けるかによって名称が異なる。ここでは、最も基本的なFW法に関して詳細を説明するが、TW法やSW法にも適用できる内容である。 Known methods for laminating the CFRP reinforcing layer on the surface layer of the tank liner for high-pressure hydrogen include a known filament winding (hereinafter FW) method, tape winding (hereinafter TW) method, sheet winding (hereinafter SW) method, hand layup method, and RTM. (Resin Transfer Molding) method and the like can be exemplified. Of these molding methods, only a single method may be used for molding, or two or more types of molding methods may be combined for molding. From the viewpoint of property expression, productivity and moldability, a method selected from the FW method, the TW method and the SW method is preferable. These FW method, SW method and TW method are basically the same molding method from the viewpoint of applying a matrix resin to strand-shaped carbon fibers and laminating them on a liner, and the carbon fibers are applied to the liner. , The name differs depending on whether it is wound in a filament (thread) form, a tape (tape-like form in which threads are bundled to some extent), or a sheet (sheet-like form in which tapes are bundled to some extent). Here, the most basic FW method will be described in detail, but the contents can also be applied to the TW method and the SW method.
FW法において、マトリックス樹脂が熱硬化性樹脂の場合、あらかじめ樹脂を塗布した状態(未硬化)の炭素繊維を直接ライナーに巻き付けることも可能であるし、ライナーに巻き付ける直前に炭素繊維に樹脂を塗布することも可能である。これらの場合、ライナーに炭素繊維および未硬化のマトリックス樹脂を巻き付けた後、樹脂を硬化させるためにバッチ炉(オーブン)や連続硬化炉などで使用樹脂に適した条件での樹脂硬化処理を行う必要がある。 In the FW method, when the matrix resin is a thermosetting resin, it is possible to directly wind the carbon fiber in a pre-coated state (uncured) around the liner, or to apply the resin to the carbon fiber immediately before winding it around the liner. It is also possible to do. In these cases, after wrapping carbon fiber and uncured matrix resin around the liner, it is necessary to perform resin curing treatment under conditions suitable for the resin used in a batch furnace (oven) or continuous curing furnace in order to cure the resin. There is.
FW法において、マトリックス樹脂が熱可塑性樹脂の場合、あらかじめ樹脂が塗布(含浸)された炭素繊維を直接ライナーに巻き付けて高圧水素用タンク形状とすることが可能である。この場合、ライナーに巻き付ける直前に、樹脂が塗布された炭素繊維を、熱可塑性樹脂の融点以上に昇温することが必要である。また、ライナーに巻き付ける直前に、炭素繊維に溶融させた熱可塑性樹脂を塗布することも可能である。この場合、熱硬化性樹脂に適用したような樹脂硬化工程は不要である。 In the FW method, when the matrix resin is a thermoplastic resin, it is possible to directly wind the carbon fiber coated (impregnated) with the resin around the liner to form a tank shape for high-pressure hydrogen. In this case, it is necessary to raise the temperature of the carbon fiber coated with the resin to a temperature higher than the melting point of the thermoplastic resin immediately before winding it around the liner. It is also possible to apply the melted thermoplastic resin to the carbon fiber immediately before winding it around the liner. In this case, the resin curing step as applied to the thermosetting resin is unnecessary.
前記FW法、TW法、SW法などで本発明の高圧水素用タンクを得る場合、最も重要なことは、炭素繊維の繊維配向設計である。FW法、TW法およびSW法では、炭素繊維ストランド(連続繊維)や予め炭素繊維ストランドに樹脂を含浸させたプリプレグなどを、ライナーに巻き付けて成形する。設計時にはライナー胴部における連続繊維方向と積層厚みを設計ファクターとして、要求特性を満足する剛性および強度を満足するように設計することが好ましい。 When the high-pressure hydrogen tank of the present invention is obtained by the FW method, the TW method, the SW method, or the like, the most important thing is the fiber orientation design of the carbon fibers. In the FW method, the TW method and the SW method, a carbon fiber strand (continuous fiber) or a prepreg in which a carbon fiber strand is impregnated with a resin in advance is wound around a liner to form a liner. At the time of design, it is preferable to design so as to satisfy the rigidity and strength that satisfy the required characteristics, with the continuous fiber direction and the laminated thickness in the liner body as design factors.
また、高圧水素用タンクとしては、バルブがインサート成形によりタンクライナーにインサートされていることが好ましい。インサート成形によりバルブをタンクライナーと一体化することにより、高圧水素の気密性が高まるので好ましい。ここでバルブは、高圧水素の充填口や放出口の役割を成す。バルブとして使用される金属部品の材質としては、炭素鋼、マンガン鋼、クロムモリブデン鋼、ステンレス鋼、アルミニウム合金等を例示できる。炭素鋼として、圧力配管用炭素鋼鋼管、高圧配管用炭素鋼鋼管、低温配管用鋼管、機械構造用炭素鋼鋼材を例示できる。マンガン鋼では、高圧ガス容器用継目無鋼管、機械構造用マンガン鋼鋼材、マンガンクロム鋼鋼材を例示できる。クロムモリブデン鋼や低合金鋼では、高圧ガス容器用継目無鋼管、機械構造用合金鋼鋼管、ニッケルクロムモリブデン鋼鋼材、クロムモリブデン鋼材を例示できる。ステンレス鋼では、圧力用ステンレス鋼鍛鋼品、配管用ステンレス鋼管、ステンレス鋼棒、熱間圧延ステンレス鋼板および鋼帯、冷間圧延ステンレス鋼板および鋼帯を例示できる。アルミニウム合金では、アルミニウムおよびアルミニウム合金の板、条、棒、線、継目無管、鍛造品を例示できる。また、炭素鋼に対しては、焼きなまし、焼きならし、マンガン鋼に対しては、焼きならし、焼き入れ焼きもどし、クロムモリブデン鋼や低合金鋼に対しては、焼き入れ焼きもどし、ステンレス鋼に対しては固溶化処理、アルミニウム合金に対しては、焼き入れ焼きもどしを施した材料を適用しても良い。さらに、アルミニウム合金に対しては、溶体化処理およびT6時効処理を施したものを適用しても良い。 Further, as the high-pressure hydrogen tank, it is preferable that the valve is inserted into the tank liner by insert molding. By integrating the valve with the tank liner by insert molding, the airtightness of high-pressure hydrogen is enhanced, which is preferable. Here, the valve acts as a filling port and a discharge port for high-pressure hydrogen. Examples of the material of the metal part used as the valve include carbon steel, manganese steel, chrome molybdenum steel, stainless steel, and aluminum alloy. Examples of carbon steel include carbon steel pipes for pressure piping, carbon steel pipes for high pressure piping, steel pipes for low temperature piping, and carbon steel materials for machine structure. Examples of manganese steel include seamless steel pipes for high-pressure gas containers, manganese steel materials for machine structures, and manganese chrome steel materials. Examples of chrome molybdenum steel and low alloy steel include seamless steel pipes for high-pressure gas containers, alloy steel pipes for machine structures, nickel chrome molybdenum steel materials, and chrome molybdenum steel materials. Examples of stainless steel include stainless steel forged steel products for pressure, stainless steel pipes for piping, stainless steel rods, hot-rolled stainless steel plates and steel strips, and cold-rolled stainless steel plates and steel strips. Examples of aluminum alloys include aluminum and aluminum alloy plates, strips, rods, wires, seamless pipes, and forged products. For carbon steel, quenching and tempering, for manganese steel, quenching and quenching and tempering, and for chromium molybdenum steel and low alloy steel, quenching and tempering, stainless steel. For solidification treatment, for aluminum alloys, a material that has been quenched and tempered may be applied. Further, for the aluminum alloy, those subjected to solution treatment and T6 aging treatment may be applied.
本発明の高圧水素用タンクの最も好ましい態様は、本発明のポリアミド樹脂組成物からなるタンクライナーの表層に、CFRP補強層が積層されてなり、かつ該タンクライナーにバルブがインサートされてなる、高圧水素用タンクである。 The most preferable aspect of the high-pressure hydrogen tank of the present invention is a high-pressure structure in which a CFRP reinforcing layer is laminated on the surface layer of a tank liner made of the polyamide resin composition of the present invention, and a valve is inserted into the tank liner. It is a tank for hydrogen.
以下、実施例を挙げて本発明の効果をさらに具体的に説明する。なお、本発明は、下記実施例に限定されるものではない。各実施例および比較例における評価は、次の方法で行った。 Hereinafter, the effects of the present invention will be described in more detail with reference to examples. The present invention is not limited to the following examples. The evaluation in each Example and Comparative Example was performed by the following method.
(1)高圧水素の充填および放圧繰り返し特性(欠陥点)
各実施例および比較例により得られたペレットから、住友重機械工業(株)製射出成形機「SU75DUZ−C250」を用いて、シリンダー温度:240℃、金型温度:80℃、射出速度10mm/秒、保圧15MPa、保圧時間15秒、冷却時間15秒の成形条件で、直径29mm、高さ12.6mmの円柱状試験片を射出成形した。
(1) High-pressure hydrogen filling and discharge repeated characteristics (defect points)
From the pellets obtained in each Example and Comparative Example, a cylinder temperature: 240 ° C., a mold temperature: 80 ° C., and an injection speed of 10 mm / using an injection molding machine "SU75DUZ-C250" manufactured by Sumitomo Heavy Industries, Ltd. A columnar test piece having a diameter of 29 mm and a height of 12.6 mm was injection-molded under molding conditions of seconds, holding pressure of 15 MPa, holding time of 15 seconds, and cooling time of 15 seconds.
得られた試験片について、ヤマト科学(株)製「TDM1000−IS」を用いてX線CT解析を行い、欠陥点の有無を観察した。欠陥点のない試験片をオートクレーブに入れた後、オートクレーブ中に水素ガスを圧力30MPaまで3分間かけて注入し、2時間保持した後、1分間かけて常圧になるまで減圧した。これを1サイクルとして700サイクル繰り返した。700サイクル繰り返し後の試験片について、ヤマト科学(株)製「TDM1000−IS」を用いてX線CT解析を行い、10μm以上の欠陥点の有無を観察した。 The obtained test piece was subjected to X-ray CT analysis using "TDM1000-IS" manufactured by Yamato Scientific Co., Ltd., and the presence or absence of defective points was observed. After putting the test piece without defects into the autoclave, hydrogen gas was injected into the autoclave to a pressure of 30 MPa over 3 minutes, held for 2 hours, and then depressurized over 1 minute until the pressure became normal. This was set as one cycle and repeated 700 cycles. The test piece after repeating 700 cycles was subjected to X-ray CT analysis using "TDM1000-IS" manufactured by Yamato Scientific Co., Ltd., and the presence or absence of defects of 10 μm or more was observed.
(2)ポリアミド樹脂組成物の降温結晶化温度
各実施例および比較例により得られたペレットについて、示差走査熱量計(パーキンエルマー社製DSC−7)を用い、2点校正(インジウム、鉛)、ベースライン補正を行った後、サンプル量を8〜10mgとして、昇温速度20℃/分の条件で昇温して得られる融解曲線の最大値を示す温度より15℃高い温度で1分間保持した後、降温速度20℃/分の条件で30℃まで冷却した。この冷却工程において観測された結晶化発熱ピーク温度を降温結晶化温度とした。
(2) Temperature-lowering crystallization temperature of the polyamide resin composition For the pellets obtained in each Example and Comparative Example, a two-point calibration (indium, lead) was performed using a differential scanning calorimeter (DSC-7 manufactured by PerkinElmer). After the baseline correction, the sample volume was set to 8 to 10 mg, and the temperature was maintained at a temperature 15 ° C. higher than the temperature indicating the maximum value of the melting curve obtained by raising the temperature at a heating rate of 20 ° C./min for 1 minute. After that, it was cooled to 30 ° C. under the condition of a temperature lowering rate of 20 ° C./min. The peak temperature of exothermic crystallization observed in this cooling step was defined as the temperature-decreasing crystallization temperature.
(3)離型性
各実施例および比較例により得られたペレットから、住友重機械工業(株)製射出成形機「SE75DUZ−C250」を用いて、シリンダー温度:240℃、金型温度:80℃、射出速度:40mm/秒、保圧:20MPa、冷却時間:20秒の成形条件で、80mm×80mm×厚み3mmの角板成形品を射出成形した。射出成形時に金型への引っ付きの有無を確認した。
(3) Releasability From the pellets obtained in each Example and Comparative Example, a cylinder temperature: 240 ° C. and a mold temperature: 80 were used using an injection molding machine "SE75DUZ-C250" manufactured by Sumitomo Heavy Industries, Ltd. A square plate molded product of 80 mm × 80 mm × thickness 3 mm was injection-molded under molding conditions of ° C., injection speed: 40 mm / sec, holding pressure: 20 MPa, and cooling time: 20 seconds. It was confirmed whether or not it was stuck to the mold during injection molding.
(4)耐ヒートサイクル性
各実施例および比較例により得られたペレットを、日精樹脂工業(株)製射出成形機「NEX1000」を用いて、シリンダー温度:240℃、金型温度:80℃、射出速度100mm/秒、冷却時間20秒の成形条件で、47mm×47mm×27mmの金属コアに厚み1.5mmでオーバーモールドした。
(4) Heat cycle resistance The pellets obtained in each Example and Comparative Example were subjected to cylinder temperature: 240 ° C., mold temperature: 80 ° C., using an injection molding machine "NEX1000" manufactured by Nissei Jushi Kogyo Co., Ltd. Under the molding conditions of an injection speed of 100 mm / sec and a cooling time of 20 seconds, the metal core of 47 mm × 47 mm × 27 mm was overmolded with a thickness of 1.5 mm.
得られた金属/樹脂複合成形品3個を、温度−60℃で1時間静置した後、90℃で1時間静置し、複合成形品を目視観察して割れの有無を判断した。この操作を繰り返し、3個の複合成形品が全て割れるサイクル数が500回以上のものをA、200回〜499回のものをB、199回以下のものをCとした。 The three obtained metal / resin composite molded products were allowed to stand at a temperature of −60 ° C. for 1 hour and then allowed to stand at 90 ° C. for 1 hour, and the composite molded products were visually observed to determine the presence or absence of cracks. This operation was repeated, and the number of cycles in which all three composite molded products were broken was designated as A, 200 to 499 times as B, and 199 or less as C.
(5)耐衝撃性
各実施例および比較例により得られたペレットから、住友重機械工業(株)製射出成形機「SE75DUZ−C250」を用いて、シリンダー温度:240℃、金型温度:80℃、射出速度:40mm/秒、保圧:20MPa、冷却時間:20秒の成形条件で、ASTM D256準拠のノッチ付きIzod衝撃成形片を射出成形した。
(5) Impact resistance From the pellets obtained in each Example and Comparative Example, a cylinder temperature: 240 ° C. and a mold temperature: 80 were used using an injection molding machine "SE75DUZ-C250" manufactured by Sumitomo Heavy Industries, Ltd. An ASTM D256 compliant notched Izod impact molded piece was injection molded under the molding conditions of ° C., injection speed: 40 mm / sec, holding pressure: 20 MPa, and cooling time: 20 seconds.
得られたノッチ付きIzod衝撃成形片7本について、ASTM D256に従い、23℃にて耐衝撃性(ノッチ付きIzod衝撃強度)を評価した。7本測定した平均の値を耐衝撃性とした。 The impact resistance (notched Izod impact strength) of the obtained seven notched Izod impact molded pieces was evaluated at 23 ° C. according to ASTM D256. The average value of 7 measurements was taken as the impact resistance.
各実施例および比較例に用いた原料と略号を以下に示す。
PA6:ポリアミド6樹脂(融点223℃、樹脂濃度0.01g/mlの98%濃硫酸溶液中25℃における相対粘度2.70)
PA66:ポリアミド66樹脂(融点263℃、樹脂濃度0.01g/mlの98%濃硫酸溶液中25℃における相対粘度2.70)
PA6/PA66共重合体:ポリアミド6/ポリアミド66共重合体(融点190℃、樹脂濃度0.01g/mlの98%濃硫酸溶液中25℃における相対粘度4.20)
アミド系ワックス1:エチレンジアミン・ステアリン酸・セバシン酸重縮合物「“ライトアマイド ”WH−215」(共栄社化学(株)製、融点215℃)
アミド系ワックス2:エチレンジアミン・ステアリン酸・セバシン酸重縮合物「“ライトアマイド ”WH−255」(共栄社化学(株)製、融点255℃)
脂肪酸エステル:エチレングリコールジモンタネート「“Licowax” E」(クラリアントジャパン(株)製)
有機核剤:N,N’,N”−トリス(2−メチルシクロヘキサン−1−イル)プロパン−1−2−3トリイルカルボキサミド「“リカクリア”(登録商標)PC−1」(新日本理化(株)製)
無機核剤:タルク「“MicroAce”(登録商標)P−6」(日本タルク(株)製、メジアン径(D50)4.0μm)
耐衝撃材1:無水マレイン酸変性エチレン/1−ブテン共重合体「“タフマー”(登録商標)MH7020」(三井化学(株)製)
耐衝撃材2:グリシジルメタクリレート変性ポリエチレン共重合体「“ボンドファースト”(登録商標)7L」(住友化学(株)製)
耐衝撃材3:アイオノマー「“ハイミラン”(登録商標)1706」(デュポン(株)製)。
耐衝撃材4:無水マレイン酸変性エチレン/1−ブテン共重合体「“タフマー”(登録商標)MH5040」(三井化学(株)製)
The raw materials and abbreviations used in each Example and Comparative Example are shown below.
PA6: Polyamide 6 resin (relative viscosity 2.70 at 25 ° C in a 98% concentrated sulfuric acid solution with a melting point of 223 ° C and a resin concentration of 0.01 g / ml)
PA66: Polyamide 66 resin (relative viscosity 2.70 at 25 ° C. in a 98% concentrated sulfuric acid solution having a melting point of 263 ° C. and a resin concentration of 0.01 g / ml)
PA6 / PA66 copolymer: Polyamide 6 / Polyamide 66 copolymer (relative viscosity 4.20 at 25 ° C. in a 98% concentrated sulfuric acid solution having a melting point of 190 ° C. and a resin concentration of 0.01 g / ml).
Amide wax 1: Ethylenediamine / stearic acid / sebacic acid polycondensate "" Light Amide "WH-215" (manufactured by Kyoeisha Chemical Co., Ltd., melting point 215 ° C)
Amide wax 2: Ethylenediamine / stearic acid / sebacic acid polycondensate "" Light Amide "WH-255" (manufactured by Kyoeisha Chemical Co., Ltd., melting point 255 ° C)
Fatty acid ester: Ethylene glycol dimontanate "" Licowax "E" (manufactured by Clariant Japan Co., Ltd.)
Organic nucleating agent: N, N', N "-tris (2-methylcyclohexane-1-yl) Propane-1-2-3 triylcarboxamide""Ricaclear" (registered trademark) PC-1 "(New Japan Chemical Co., Ltd.) Made by Co., Ltd.)
Inorganic nucleating agent: Talc "" MicroAce "(registered trademark) P-6" (manufactured by Japan Talc Co., Ltd., median diameter (D50) 4.0 μm)
Impact-resistant material 1: Maleic anhydride-modified ethylene / 1-butene copolymer "" Toughmer "(registered trademark) MH7020" (manufactured by Mitsui Chemicals, Inc.)
Impact-resistant material 2: Glycidyl methacrylate-modified polyethylene copolymer "" Bond First "(registered trademark) 7L" (manufactured by Sumitomo Chemical Co., Ltd.)
Impact-resistant material 3: Ionomer "" Hymilan "(registered trademark) 1706" (manufactured by DuPont Co., Ltd.).
Impact-resistant material 4: Maleic anhydride-modified ethylene / 1-butene copolymer "" Toughmer "(registered trademark) MH5040" (manufactured by Mitsui Chemicals, Inc.)
[実施例1〜9、比較例1〜7]
表1および表2記載の各原料を、シリンダー温度を240℃に設定し、ニーディングゾーンを1つ設けたスクリューアレンジとし、スクリュー回転数を150rpmとした2軸スクリュー押出機(JSW社製TEX30α−35BW−7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さである))に供給して溶融混練した。20kg/hの速度でダイから吐出されたガットを、10℃に温調した水を満たした冷却バス中を10秒間かけて通過させることにより急冷した後、ストランドカッターでペレタイズし、ペレットを得た。得られたペレットを、真空乾燥機で、温度80℃、12時間真空乾燥し、乾燥後ペレットを用いて、前述の方法により評価した結果を表1および表2に記載した。
[Examples 1 to 9, Comparative Examples 1 to 7]
A twin-screw extruder (JSW TEX30α-) in which the cylinder temperature of each of the raw materials shown in Tables 1 and 2 is set to 240 ° C., a screw arrangement with one kneading zone is provided, and the screw rotation speed is 150 rpm. It was supplied to 35BW-7V) (L / D = 45 (where L is the length from the raw material supply port to the discharge port)) and melt-kneaded. The gut discharged from the die at a speed of 20 kg / h was rapidly cooled by passing it through a cooling bath filled with water whose temperature was adjusted to 10 ° C. for 10 seconds, and then pelletized with a strand cutter to obtain pellets. .. The obtained pellets were vacuum-dried at a temperature of 80 ° C. for 12 hours in a vacuum dryer, and after drying, the pellets were used to evaluate by the above-mentioned method, and the results are shown in Tables 1 and 2.
以上の結果から、ポリアミド6樹脂(A)とアミド系ワックス(B)を配合して得られたポリアミド樹脂組成物は結晶化温度が高く、溶融状態からの結晶化が早く進むので結晶化速度が速くなり、かかるポリアミド樹脂組成物を成形して得られる成形品は、高圧水素の充填および放圧を繰り返しても欠陥点の発生が抑制されており、かつ離型性に優れることがわかった。 From the above results, the polyamide resin composition obtained by blending the polyamide 6 resin (A) and the amide wax (B) has a high crystallization temperature and crystallization from the molten state proceeds quickly, so that the crystallization rate is high. It was found that the molded product obtained by molding the polyamide resin composition became faster, and the occurrence of defect points was suppressed even when the high-pressure hydrogen was repeatedly filled and released, and the mold releasability was excellent.
さらに、耐衝撃材(C)を配合して得られたポリアミド樹脂組成物を成形して得られる成形品は、耐ヒートサイクル性に優れていることがわかった。 Further, it was found that the molded product obtained by molding the polyamide resin composition obtained by blending the impact resistant material (C) has excellent heat cycle resistance.
本発明のポリアミド樹脂組成物は、結晶化温度が高く、溶融状態からの結晶化が早く進むので結晶化速度が速くなり、高圧水素の充填および放圧を繰り返しても欠陥点の発生が抑制され、さらに射出成形で重要である離型性に優れる。本発明のポリアミド樹脂組成物を成形してなる成形品は、これらの特性を活かして高圧水素に触れる成形品に広く用いることができる。
The polyamide resin composition of the present invention has a high crystallization temperature and crystallization from a molten state proceeds quickly, so that the crystallization rate is high, and the occurrence of defect points is suppressed even if high-pressure hydrogen is repeatedly filled and released. Furthermore, it has excellent releasability, which is important in injection molding. The molded product obtained by molding the polyamide resin composition of the present invention can be widely used for a molded product that comes into contact with high-pressure hydrogen by taking advantage of these characteristics.
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