JP2017226817A - Polyamide resin composition for molding in contact with high-pressure hydrogen, and molding prepared therewith - Google Patents
Polyamide resin composition for molding in contact with high-pressure hydrogen, and molding prepared therewith Download PDFInfo
- Publication number
- JP2017226817A JP2017226817A JP2017039950A JP2017039950A JP2017226817A JP 2017226817 A JP2017226817 A JP 2017226817A JP 2017039950 A JP2017039950 A JP 2017039950A JP 2017039950 A JP2017039950 A JP 2017039950A JP 2017226817 A JP2017226817 A JP 2017226817A
- Authority
- JP
- Japan
- Prior art keywords
- pressure hydrogen
- resin
- polyamide
- resin composition
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000001257 hydrogen Substances 0.000 title claims abstract description 112
- 229910052739 hydrogen Inorganic materials 0.000 title claims abstract description 112
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 57
- 239000011342 resin composition Substances 0.000 title claims abstract description 53
- 238000000465 moulding Methods 0.000 title abstract description 36
- 125000004435 hydrogen atom Chemical class [H]* 0.000 title 1
- 229920005989 resin Polymers 0.000 claims abstract description 108
- 239000011347 resin Substances 0.000 claims abstract description 108
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 94
- 229920002292 Nylon 6 Polymers 0.000 claims abstract description 38
- 150000001408 amides Chemical class 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims description 37
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 27
- 239000004917 carbon fiber Substances 0.000 claims description 27
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 26
- 238000002425 crystallisation Methods 0.000 claims description 25
- 230000008025 crystallization Effects 0.000 claims description 25
- 238000002844 melting Methods 0.000 claims description 21
- 230000008018 melting Effects 0.000 claims description 21
- 150000002431 hydrogen Chemical class 0.000 claims description 20
- 239000010410 layer Substances 0.000 claims description 17
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 14
- 239000005977 Ethylene Substances 0.000 claims description 14
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 14
- 238000002156 mixing Methods 0.000 claims description 13
- 239000004711 α-olefin Substances 0.000 claims description 13
- 230000003014 reinforcing effect Effects 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 6
- 230000007547 defect Effects 0.000 abstract description 20
- 238000000034 method Methods 0.000 description 53
- -1 Aliphatic diamines Chemical class 0.000 description 36
- 239000000047 product Substances 0.000 description 25
- 238000011049 filling Methods 0.000 description 18
- 238000003466 welding Methods 0.000 description 15
- 229920001577 copolymer Polymers 0.000 description 14
- 229920001971 elastomer Polymers 0.000 description 13
- 239000000835 fiber Substances 0.000 description 13
- 239000007789 gas Substances 0.000 description 11
- 239000005060 rubber Substances 0.000 description 11
- 238000001746 injection moulding Methods 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- 229920005992 thermoplastic resin Polymers 0.000 description 10
- 229910000831 Steel Inorganic materials 0.000 description 9
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 238000001816 cooling Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000008188 pellet Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 238000004898 kneading Methods 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 229920005672 polyolefin resin Polymers 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 6
- 229910000975 Carbon steel Inorganic materials 0.000 description 6
- 239000005749 Copper compound Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 6
- 239000010962 carbon steel Substances 0.000 description 6
- 150000001880 copper compounds Chemical class 0.000 description 6
- 150000004985 diamines Chemical class 0.000 description 6
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 6
- 150000007519 polyprotic acids Polymers 0.000 description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000012765 fibrous filler Substances 0.000 description 5
- 239000002667 nucleating agent Substances 0.000 description 5
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 5
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 5
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 5
- 229910000851 Alloy steel Inorganic materials 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910000617 Mangalloy Inorganic materials 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 229920002302 Nylon 6,6 Polymers 0.000 description 4
- 235000021355 Stearic acid Nutrition 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 4
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000008117 stearic acid Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229960002684 aminocaproic acid Drugs 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 150000001733 carboxylic acid esters Chemical class 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000446 fuel Substances 0.000 description 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-N hexanedioic acid Natural products OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 238000005496 tempering Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 3
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- VQOXUMQBYILCKR-UHFFFAOYSA-N 1-Tridecene Chemical compound CCCCCCCCCCCC=C VQOXUMQBYILCKR-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- ADOBXTDBFNCOBN-UHFFFAOYSA-N 1-heptadecene Chemical compound CCCCCCCCCCCCCCCC=C ADOBXTDBFNCOBN-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- PJLHTVIBELQURV-UHFFFAOYSA-N 1-pentadecene Chemical compound CCCCCCCCCCCCCC=C PJLHTVIBELQURV-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229910021595 Copper(I) iodide Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000000071 blow moulding Methods 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 2
- RFKZUAOAYVHBOY-UHFFFAOYSA-M copper(1+);acetate Chemical compound [Cu+].CC([O-])=O RFKZUAOAYVHBOY-UHFFFAOYSA-M 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- LSXDOTMGLUJQCM-UHFFFAOYSA-M copper(i) iodide Chemical compound I[Cu] LSXDOTMGLUJQCM-UHFFFAOYSA-M 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000010097 foam moulding Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
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- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
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- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009787 hand lay-up Methods 0.000 description 1
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- 239000001307 helium Substances 0.000 description 1
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- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
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- 239000003999 initiator Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- FJDUDHYHRVPMJZ-UHFFFAOYSA-N nonan-1-amine Chemical compound CCCCCCCCCN FJDUDHYHRVPMJZ-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229940100684 pentylamine Drugs 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
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- 150000004756 silanes Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229920006345 thermoplastic polyamide Polymers 0.000 description 1
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical group CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- PHYFQTYBJUILEZ-IUPFWZBJSA-N triolein Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CCCCCCCC)COC(=O)CCCCCCC\C=C/CCCCCCCC PHYFQTYBJUILEZ-IUPFWZBJSA-N 0.000 description 1
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- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- 239000010457 zeolite Substances 0.000 description 1
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Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
Abstract
Description
本発明は、ポリアミド6樹脂にアミド系ワックスを特定量配合してなる、高圧水素に触れる成形品用のポリアミド樹脂組成物およびそれを成形してなる成形品に関するものである。 The present invention relates to a polyamide resin composition for a molded article that comes into contact with high-pressure hydrogen, comprising a specific amount of an amide wax mixed with polyamide 6 resin, and a molded article obtained by molding the polyamide resin composition.
近年、石油燃料の枯渇や、有害ガス排出量の削減の要請に対応するために、水素と空気中の酸素を電気化学的に反応させて発電する燃料電池を自動車に搭載し、燃料電池が発電した電気をモータに供給して駆動力とする燃料電池電気自動車が注目されてきている。自動車搭載用の高圧水素用タンクとして、樹脂製のライナーの外側を炭素繊維強化樹脂で補強してなる樹脂製タンクが検討されている。しかしながら、水素は分子サイズが小さいため、比較的分子サイズの大きい天然ガスなどに比べ、樹脂中を透過し易いこと、および、高圧水素は常圧の水素に比べ、樹脂中に蓄積される量が多くなることなどから、これまでの樹脂製タンクでは、高圧水素の充填および放圧を繰り返すと、タンクの変形や破壊が起こる課題があった。また、樹脂製のライナーを成形する際に、離型性が不足する課題があった。 In recent years, fuel cells that generate electricity by electrochemically reacting hydrogen and oxygen in the air have been installed in automobiles in order to meet the demand for petroleum fuel depletion and reduction of harmful gas emissions. 2. Description of the Related Art Fuel cell electric vehicles that use the supplied electricity as a driving force by supplying motors have attracted attention. As a high-pressure hydrogen tank for use in automobiles, a resin tank in which the outside of a resin liner is reinforced with carbon fiber reinforced resin has been studied. However, since hydrogen has a small molecular size, it is easier to permeate through the resin than natural gas with a relatively large molecular size, and high-pressure hydrogen accumulates in the resin compared to atmospheric hydrogen. Because of the increase in the number of conventional resin tanks, there has been a problem that deformation and destruction of the tank occur when high-pressure hydrogen filling and releasing are repeated. In addition, when molding a resin liner, there is a problem that the releasability is insufficient.
ガスバリア性に優れ、低温でも優れた耐衝撃性を有する水素タンクライナー用材料として、例えば、ポリアミド6、共重合ポリアミド、および耐衝撃材を含むポリアミド樹脂組成物からなる水素タンクライナー用材料が検討されている(例えば、特許文献1参照)。 As a hydrogen tank liner material having excellent gas barrier properties and excellent impact resistance even at low temperatures, for example, a hydrogen tank liner material comprising a polyamide resin composition including polyamide 6, copolymerized polyamide, and an impact resistant material has been studied. (For example, refer to Patent Document 1).
また、ガスバリア性に優れたガス貯蔵タンク用ライナーとして、例えば、ポリアミド、成核剤および耐衝撃性改良剤を含むポリマー組成物を含有するガス貯蔵タンク用ライナーが検討されている(例えば、特許文献2参照)。 Further, as a gas storage tank liner having excellent gas barrier properties, for example, a gas storage tank liner containing a polymer composition containing polyamide, a nucleating agent, and an impact resistance improving agent has been studied (for example, Patent Documents). 2).
高圧水素に触れる成形品の製造方法の1つとして、射出成形が挙げられる。例えば樹脂製のガス貯蔵タンク用ライナーを射出成形する際は、大型の成形品を成形することとなるため、離型性不足により成形品の外観不良が発生し、成形品を得ることができない場合がある。そのため、大型の成形品を射出成形するためには高い離型性が求められている。 One of the methods for producing a molded product that comes into contact with high-pressure hydrogen is injection molding. For example, when injection molding a resin gas storage tank liner, a large molded product will be molded. If the molded product has poor appearance due to insufficient releasability, the molded product cannot be obtained. There is. For this reason, high mold releasability is required in order to injection mold a large molded product.
しかしながら、特許文献1に記載された水素タンクライナーは、水素ガスの透過や、水素の樹脂中への溶解が生じやすく、高圧水素の充填および放圧を繰り返すと、水素タンクライナーに欠陥点が生じる課題があった。また、ポリアミド樹脂の離型性が低く、離型性に課題があった。 However, the hydrogen tank liner described in Patent Document 1 is likely to cause permeation of hydrogen gas and dissolution of hydrogen into the resin, and defects are generated in the hydrogen tank liner when repeated filling and releasing of high-pressure hydrogen. There was a problem. Moreover, the releasability of the polyamide resin was low, and there was a problem in the releasability.
また、特許文献2に記載されたガス貯蔵タンク用ライナーは、ヘリウムガス耐透過性には優れるものの、水素ガスの透過や、水素の樹脂中への溶解が生じやすく、高圧水素の充填および放圧を繰り返すと、水素タンクライナーに欠陥点が生じる課題があった。また、ポリアミド樹脂の離型性が低く、離型性に課題があった。 The gas storage tank liner described in Patent Document 2 is excellent in helium gas permeation resistance, but easily permeates hydrogen gas or dissolves hydrogen in a resin. When the process was repeated, there was a problem that defects occurred in the hydrogen tank liner. Moreover, the releasability of the polyamide resin was low, and there was a problem in the releasability.
本発明は、上記従来技術の課題に鑑み、高圧水素の充填および放圧を繰り返しても欠陥点の発生が抑制され、離型性に優れた成形品を得ることのできるポリアミド樹脂組成物を提供することを課題とする。 The present invention provides a polyamide resin composition in which the occurrence of defects is suppressed even after repeated filling and releasing of high-pressure hydrogen, and a molded article having excellent releasability can be obtained in view of the above-described problems of the prior art. The task is to do.
上記目的を達成するために、本発明は以下の構成を有するものである。 In order to achieve the above object, the present invention has the following configuration.
ポリアミド6樹脂(A)100重量部に対して、アミド系ワックス(B)を0.01〜10重量部配合してなる、高圧水素に触れる成形品用のポリアミド樹脂組成物。 A polyamide resin composition for molded articles that comes into contact with high-pressure hydrogen, comprising 0.01 to 10 parts by weight of an amide wax (B) per 100 parts by weight of a polyamide 6 resin (A).
本発明は、上記のポリアミド樹脂組成物からなる、高圧水素に触れる成形品を含む。 This invention includes the molded article which contacts the high pressure hydrogen which consists of said polyamide resin composition.
本発明は、上記のポリアミド樹脂組成物からなる高圧水素用タンクライナーを含む。 The present invention includes a high-pressure hydrogen tank liner comprising the above polyamide resin composition.
本発明は、上記のポリアミド樹脂組成物からなるタンクライナーの表層に、炭素繊維強化樹脂補強層が積層されてなる、高圧水素用タンクを含む。 The present invention includes a high-pressure hydrogen tank in which a carbon fiber reinforced resin reinforcing layer is laminated on the surface layer of a tank liner made of the polyamide resin composition.
本発明の高圧水素に触れる成形品用のポリアミド樹脂組成物は、結晶化温度が高く、溶融状態からの結晶化が早く進むので結晶化速度が速くなり、高圧水素の充填および放圧を繰り返しても欠陥点の発生が抑制され、離型性に優れた成形品を提供することができる。本発明の成形品は、高圧水素の充填および放圧を繰り返しても欠陥点が発生しにくく、離型性に優れた特長を活かして、高圧水素に触れる用途に用いられる成形品として有用に展開することが可能となる。 The polyamide resin composition for molded articles that comes into contact with high-pressure hydrogen of the present invention has a high crystallization temperature, and crystallization from a molten state proceeds quickly, so that the crystallization speed increases, and filling and releasing of high-pressure hydrogen are repeated. In addition, generation of defects can be suppressed, and a molded product excellent in releasability can be provided. The molded article of the present invention is usefully developed as a molded article that is used in applications that come into contact with high-pressure hydrogen, taking advantage of its excellent releasability, since defects do not easily occur even after repeated filling and releasing of high-pressure hydrogen. It becomes possible to do.
以下、本発明をさらに詳細に説明する。 Hereinafter, the present invention will be described in more detail.
本発明の高圧水素に触れる成形品用のポリアミド樹脂組成物(以下、「ポリアミド樹脂組成物」と記載する場合がある)はポリアミド6樹脂(A)100重量部に対して、アミド系ワックス(B)を0.01〜10重量部配合してなる。成形性、ガスバリア性、剛性および靱性のバランスに優れるポリアミド6樹脂(A)に、アミド系ワックス(B)を特定量配合することにより、結晶化温度が高く、溶融状態からの結晶化が早く進むので結晶化速度が速くなり、緻密で均一な結晶が形成されることから、水素ガスの透過や、水素の樹脂中への溶解を抑制することができるため、高圧水素の充填および放圧を繰り返しても欠陥点が発生しにくい。また、成形時の離型性が向上し、離型性に優れた成形品を得ることができる。一方、ポリアミド6樹脂(A)と、アミド系ワックス(B)以外の離型剤や有機核剤、無機核剤との組み合わせでは、高圧水素の充填および放圧を繰り返すと、成形品に欠陥点が発生しやすく、また、成形時の離型性は向上せず、成形品の靭性が低下する。 The polyamide resin composition for molded articles that is exposed to high-pressure hydrogen of the present invention (hereinafter sometimes referred to as “polyamide resin composition”) is an amide wax (B) with respect to 100 parts by weight of the polyamide 6 resin (A). ) 0.01 to 10 parts by weight. By blending a specific amount of the amide wax (B) with the polyamide 6 resin (A), which has an excellent balance of moldability, gas barrier properties, rigidity and toughness, the crystallization temperature is high and the crystallization from the molten state proceeds quickly. Therefore, since the crystallization speed is increased and dense and uniform crystals are formed, the permeation of hydrogen gas and the dissolution of hydrogen into the resin can be suppressed, so the filling and releasing of high-pressure hydrogen are repeated. However, it is difficult for defect points to occur. Moreover, the mold release property at the time of shaping | molding improves, and the molded article excellent in the mold release property can be obtained. On the other hand, when a combination of a polyamide 6 resin (A) and a mold release agent, organic nucleating agent, or inorganic nucleating agent other than the amide wax (B) is repeated filling and releasing of high-pressure hydrogen, there is a defect in the molded product. In addition, the releasability at the time of molding does not improve, and the toughness of the molded product decreases.
本発明に用いられるポリアミド6樹脂(A)とは、6−アミノカプロン酸および/またはε−カプロラクタムを主たる原料とするポリアミド樹脂である。本発明の目的を損なわない範囲で、他の単量体が共重合されたものでもよい。ここで、「主たる原料とする」とは、ポリアミド樹脂を構成する単量体単位の合計100モル%中、6−アミノカプロン酸由来の単位またはε−カプロラクタム由来の単位を合計50モル%以上含むことを意味する。6−アミノカプロン酸由来の単位またはε−カプロラクタム由来の単位を70モル%以上含むことがより好ましく、90モル%以上含むことがさらに好ましい。 The polyamide 6 resin (A) used in the present invention is a polyamide resin mainly containing 6-aminocaproic acid and / or ε-caprolactam. Other monomers may be copolymerized as long as the object of the present invention is not impaired. Here, “to be used as a main raw material” means that a unit derived from 6-aminocaproic acid or a unit derived from ε-caprolactam is included in a total of 50 mol% or more in a total of 100 mol% of monomer units constituting the polyamide resin. Means. It is more preferable that the unit derived from 6-aminocaproic acid or the unit derived from ε-caprolactam is contained by 70 mol% or more, and more preferably 90 mol% or more.
共重合される他の単量体としては、例えば、11−アミノウンデカン酸、12−アミノドデカン酸、パラアミノメチル安息香酸などのアミノ酸、ω−ラウロラクタムなどのラクタム;テトラメチレンジアミン、ペンタメチレンジアミン、ヘキサメチレンジアミン、2−メチルペンタメチレンジアミン、ウンデカメチレンジアミン、ドデカメチレンジアミン、2,2,4−/2,4,4−トリメチルヘキサメチレンジアミン、5−メチルノナメチレンジアミンなどの脂肪族ジアミン;メタキシレンジアミン、パラキシリレンジアミンなどの芳香族ジアミン;1,3−ビス(アミノメチル)シクロヘキサン、1,4−ビス(アミノメチル)シクロヘキサン、1−アミノ−3−アミノメチル−3,5,5−トリメチルシクロヘキサン、ビス(4−アミノシクロヘキシル)メタン、ビス(3−メチル−4−アミノシクロヘキシル)メタン、2,2−ビス(4−アミノシクロヘキシル)プロパン、ビス(アミノプロピル)ピペラジン、アミノエチルピペラジンなどの脂環族ジアミン;アジピン酸、スベリン酸、アゼライン酸、セバシン酸、ドデカン二酸などの脂肪族ジカルボン酸;テレフタル酸、イソフタル酸、2−クロロテレフタル酸、2−メチルテレフタル酸、5−メチルイソフタル酸、5−ナトリウムスルホイソフタル酸、ヘキサヒドロテレフタル酸、ヘキサヒドロイソフタル酸などの芳香族ジカルボン酸;1,4−シクロヘキサンジカルボン酸、1,3−シクロヘキサンジカルボン酸、1,2−シクロヘキサンジカルボン酸、1,3−シクロペンタンジカルボン酸などの脂環族ジカルボン酸が挙げられる。これらを2種以上共重合してもよい。 Examples of other monomers to be copolymerized include amino acids such as 11-aminoundecanoic acid, 12-aminododecanoic acid, and paraaminomethylbenzoic acid, lactams such as ω-laurolactam; tetramethylenediamine, pentamethylenediamine, Aliphatic diamines such as hexamethylenediamine, 2-methylpentamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2,4- / 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine; Aromatic diamines such as meta-xylenediamine and paraxylylenediamine; 1,3-bis (aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane, 1-amino-3-aminomethyl-3,5,5 -Trimethylcyclohexane, bis (4-a Alicyclic diamines such as nocyclohexyl) methane, bis (3-methyl-4-aminocyclohexyl) methane, 2,2-bis (4-aminocyclohexyl) propane, bis (aminopropyl) piperazine, aminoethylpiperazine; adipic acid Aliphatic dicarboxylic acids such as suberic acid, azelaic acid, sebacic acid, dodecanedioic acid; terephthalic acid, isophthalic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid, 5-sodium sulfoisophthalic acid , Aromatic dicarboxylic acids such as hexahydroterephthalic acid and hexahydroisophthalic acid; 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 1,3-cyclopentanedicarboxylic acid, etc. The alicyclic dicarbo Examples include acid. Two or more of these may be copolymerized.
ポリアミド6樹脂(A)の重合度には特に制限がないが、樹脂濃度0.01g/mlの98%濃硫酸溶液中、25℃で測定した相対粘度が、1.5〜7.0の範囲であることが好ましい。相対粘度が1.5以上であれば、成形時のポリアミド樹脂組成物の溶融粘度が適度に高くなり、成形時の空気の巻き込みを抑制し、成形性をより向上させることができる。相対粘度は1.8以上がより好ましい。一方、相対粘度が7.0以下であれば、ポリアミド樹脂組成物の成形時の溶融粘度が適度に低くなり、成形性をより向上させることができる。 The degree of polymerization of the polyamide 6 resin (A) is not particularly limited, but the relative viscosity measured at 25 ° C. in a 98% concentrated sulfuric acid solution having a resin concentration of 0.01 g / ml is in the range of 1.5 to 7.0. It is preferable that When the relative viscosity is 1.5 or more, the melt viscosity of the polyamide resin composition at the time of molding becomes moderately high, the air entrainment at the time of molding can be suppressed, and the moldability can be further improved. The relative viscosity is more preferably 1.8 or more. On the other hand, if the relative viscosity is 7.0 or less, the melt viscosity at the time of molding of the polyamide resin composition becomes moderately low, and the moldability can be further improved.
ポリアミド6樹脂(A)のアミノ末端基量には特に制限がないが、1.0×10−5〜10.0×10−5mol/gの範囲であることが好ましい。アミノ末端基量が1.0×10−5〜10.0×10−5mol/gの範囲であれば、十分な重合度が得られ、成形品の機械強度を向上させることができる。ここで、ポリアミド6樹脂(A)のアミノ末端基量は、ポリアミド6樹脂(A)を、フェノール・エタノール混合溶媒(83.5:16.5(体積比))に溶解し、0.02N塩酸水溶液を用いて滴定することにより求めることができる。 There is no particular limitation on the amino end groups of the polyamide 6 resin (A), the it is preferably in the range of 1.0 × 10 -5 ~10.0 × 10 -5 mol / g. When the amino terminal group amount is in the range of 1.0 × 10 −5 to 10.0 × 10 −5 mol / g, a sufficient degree of polymerization can be obtained, and the mechanical strength of the molded product can be improved. Here, the amount of amino terminal groups of the polyamide 6 resin (A) was determined by dissolving the polyamide 6 resin (A) in a phenol / ethanol mixed solvent (83.5: 16.5 (volume ratio)) and adding 0.02N hydrochloric acid. It can be determined by titrating with an aqueous solution.
本発明に用いられるアミド系ワックス(B)とは、モノカルボン酸とジアミンを反応せしめてなるアミド化合物、モノアミンと多塩基酸を反応せしめてなるアミド化合物、モノカルボン酸と多塩基酸とジアミンを反応せしめてなるアミド化合物などが挙げられる。これらは相当するアミンとカルボン酸の脱水反応等により得ることができる。 The amide wax (B) used in the present invention is an amide compound obtained by reacting a monocarboxylic acid and a diamine, an amide compound obtained by reacting a monoamine and a polybasic acid, or a monocarboxylic acid, a polybasic acid and a diamine. Examples thereof include amide compounds obtained by reaction. These can be obtained by dehydration reaction of the corresponding amine and carboxylic acid.
前記モノアミンとしては炭素数5以上のモノアミンが好ましく、その具体例としては、ペンチルアミン、ヘキシルアミン、ヘプチルアミン、オクチルアミン、ノニルアミン、デシルアミン、ドデシルアミン、ステアリルアミン、シクロヘキシルアミン、ベンジルアミンなどが例示でき、これらは2種以上を併用しても良い。中でも炭素数10以上20以下の高級脂肪族モノアミンが特に好ましい。炭素数が20より大きくなると、ポリアミド6樹脂(A)との相溶性が低下し、析出する恐れがある。 The monoamine is preferably a monoamine having 5 or more carbon atoms, and specific examples thereof include pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine, dodecylamine, stearylamine, cyclohexylamine, and benzylamine. These may be used in combination of two or more. Of these, higher aliphatic monoamines having 10 to 20 carbon atoms are particularly preferred. If the carbon number is greater than 20, the compatibility with the polyamide 6 resin (A) is lowered and there is a risk of precipitation.
前記モノカルボン酸は炭素数5以上の脂肪族モノカルボン酸およびヒドロキシカルボン酸が好ましく、その具体例としては、吉草酸、カプロン酸、カプリル酸、ラウリン酸、ミリスチン酸、パルミチン酸、ステアリン酸、オレイン酸、リノール酸、ベヘン酸、モンタン酸、12−ヒドロキシステアリン酸、安息香酸などが挙げられ、これらは2種以上を併用しても良い。中でも炭素数10以上30以下の高級脂肪族モノカルボン酸が特に好ましい。炭素数が30より大きくなると、ポリアミド6樹脂(A)との相溶性が低下し、析出する恐れがある。 The monocarboxylic acid is preferably an aliphatic monocarboxylic acid or hydroxycarboxylic acid having 5 or more carbon atoms. Specific examples thereof include valeric acid, caproic acid, caprylic acid, lauric acid, myristic acid, palmitic acid, stearic acid, olein. Acid, linoleic acid, behenic acid, montanic acid, 12-hydroxystearic acid, benzoic acid and the like may be mentioned, and these may be used in combination of two or more. Of these, higher aliphatic monocarboxylic acids having 10 to 30 carbon atoms are particularly preferred. When the number of carbon atoms is greater than 30, the compatibility with the polyamide 6 resin (A) is lowered and there is a risk of precipitation.
前記ジアミンの具体例としてはエチレンジアミン、1,3−ジアミノプロパン、1,4−ジアミノプロパン、テトラメチレンジアミン、ヘキサメチレンンジアミン、ノナメチレンジアミン、ウンデカメチレンジアミン、ドデカメチレンジアミン、メタキシリレンジアミン、パラキシリレンジアミン、トリレンジアミン、フェニレンジアミン、イソホロンジアミンなどが挙げられ、これらは2種以上を併用しても良い。なかでもエチレンジアミンが特に好適である。 Specific examples of the diamine include ethylenediamine, 1,3-diaminopropane, 1,4-diaminopropane, tetramethylenediamine, hexamethylenediamine, nonamethylenediamine, undecamethylenediamine, dodecamethylenediamine, metaxylylenediamine, Paraxylylenediamine, tolylenediamine, phenylenediamine, isophoronediamine and the like may be mentioned, and two or more of these may be used in combination. Of these, ethylenediamine is particularly preferred.
前記多塩基酸とは、二塩基酸以上のカルボン酸であり、その具体例としてはマロン酸、コハク酸、アジピン酸、セバシン酸、ピメリン酸、アゼライン酸などの脂肪族ジカルボン酸、フタル酸、テレフタル酸、イソフタル酸などの芳香族ジカルボン酸、シクロへキサンジカルボン酸、シクロヘキシルコハク酸などの脂環式ジカルボン酸などが挙げられ、これらは2種以上を併用しても良い。 The polybasic acid is a dicarboxylic acid or higher carboxylic acid, and specific examples thereof include aliphatic dicarboxylic acids such as malonic acid, succinic acid, adipic acid, sebacic acid, pimelic acid, azelaic acid, phthalic acid, terephthalic acid, and the like. Examples thereof include aromatic dicarboxylic acids such as acid and isophthalic acid, and alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid and cyclohexylsuccinic acid. These may be used in combination of two or more.
中でも高級脂肪族モノカルボン酸、多塩基酸およびジアミンを反応せしめたアミド化合物が特に好適であり、例えば、ステアリン酸、セバシン酸およびエチレンジアミンを反応せしめてなるアミド化合物が好ましく挙げられる。その際の各成分の混合割合は、高級脂肪族モノカルボン酸2モルに対し、多塩基酸0.18モル〜1.0モル、ジアミン1.0モル〜2.2モルの範囲が好適であり、高級脂肪族モノカルボン酸2モルに対し、多塩基酸0.5モル〜1.0モル、ジアミン1.5モル〜2.0モルの範囲が更に好適である。 Of these, an amide compound obtained by reacting a higher aliphatic monocarboxylic acid, a polybasic acid and a diamine is particularly suitable. For example, an amide compound obtained by reacting stearic acid, sebacic acid and ethylenediamine is preferred. The mixing ratio of each component is preferably in the range of 0.18 to 1.0 mol of polybasic acid and 1.0 to 2.2 mol of diamine with respect to 2 mol of higher aliphatic monocarboxylic acid. The range of 0.5 mol to 1.0 mol of polybasic acid and 1.5 mol to 2.0 mol of diamine is more suitable for 2 mol of higher aliphatic monocarboxylic acid.
アミド系ワックス(B)の融点には特に制限はないが、DSC測定による融点がポリアミド6樹脂(A)の融点以上であることが好ましい。アミド系ワックス(B)の融点がポリアミド6樹脂(A)の融点以上であると、より成形時の離型性が向上する。
Although there is no restriction | limiting in particular in melting | fusing point of amide type wax (B), It is preferable that melting | fusing point by DSC measurement is more than melting | fusing point of polyamide 6 resin (A). When the melting point of the amide wax (B) is equal to or higher than the melting point of the polyamide 6 resin (A), the releasability during molding is further improved.
ここで、本発明におけるポリアミド6樹脂(A)およびアミド系ワックス(B)のDSC測定による融点は、次の方法により求めることができる。まず、示差走査熱量計(パーキンエルマー社製DSC−7)を用い、2点校正(インジウム、鉛)、ベースライン補正を行う。サンプル量を8〜10mgとして、昇温速度20℃/分の条件で昇温して得られる融解曲線の最大値を示す温度より15℃高い温度で1分間保持した後、20℃/分の降温速度で30℃まで冷却する。さらに、温度30℃で1分間保持した後、20℃/分の速度で、1回目の昇温工程と同様に、2回目の昇温工程を行う。この2回目の昇温工程において観測される融解吸熱ピーク温度を融点とする。 Here, the melting point by DSC measurement of the polyamide 6 resin (A) and the amide wax (B) in the present invention can be determined by the following method. First, using a differential scanning calorimeter (DSC-7 manufactured by Perkin Elmer), two-point calibration (indium, lead) and baseline correction are performed. The sample amount was set to 8 to 10 mg, held for 1 minute at a temperature 15 ° C. higher than the temperature showing the maximum value of the melting curve obtained by heating at a heating rate of 20 ° C./min, and then the temperature was lowered to 20 ° C./min. Cool to 30 ° C at speed. Further, after being held at a temperature of 30 ° C. for 1 minute, the second temperature raising step is performed at a rate of 20 ° C./min, similarly to the first temperature raising step. The melting endothermic peak temperature observed in the second temperature raising step is defined as the melting point.
本発明のポリアミド樹脂組成物におけるアミド系ワックス(B)の配合量は、ポリアミド6樹脂(A)100重量部に対して0.01〜10重量部である。アミド系ワックス(B)の配合量を0.01重量部未満とすると、離型性の向上効果が十分ではなく、また、高圧の水素の充填および放圧を繰り返すことにより欠陥点が発生しやすくなる。アミド系ワックス(B)の配合量は0.05重量部以上が好ましく、0.1重量部以上がさらに好ましい。一方、アミド系ワックス(B)の配合量が10重量部を超えると、靭性が低下し、高圧の水素の充填および放圧を繰り返すことにより欠陥点が発生しやすくなる。アミド系ワックス(B)の配合量は7重量部以下が好ましく、5重量部以下がより好ましい。 The compounding quantity of the amide type wax (B) in the polyamide resin composition of this invention is 0.01-10 weight part with respect to 100 weight part of polyamide 6 resin (A). When the blending amount of the amide wax (B) is less than 0.01 parts by weight, the effect of improving the releasability is not sufficient, and defects are likely to occur due to repeated filling and releasing of high-pressure hydrogen. Become. The amount of the amide wax (B) is preferably 0.05 parts by weight or more, more preferably 0.1 parts by weight or more. On the other hand, when the compounding amount of the amide wax (B) exceeds 10 parts by weight, the toughness is lowered, and defective points are easily generated by repeating filling and releasing of high-pressure hydrogen. The amount of the amide wax (B) is preferably 7 parts by weight or less, and more preferably 5 parts by weight or less.
ポリアミド樹脂組成物は、耐衝撃材(C)をさらに配合してなることが好ましい。耐衝撃材(C)を配合することにより、成形品の耐衝撃性を向上させることができる。また、高圧水素に触れる用途に用いられる成形品は、高圧水素の充填および放圧により、−40℃以下から90℃以上への温度変化(ヒートサイクル)を繰り返し受けるため、例えば、樹脂部と金属部とを有する複合品の場合、樹脂部と金属部との結合部において割れが発生しやすい。耐衝撃材(C)を配合することにより、このようなヒートサイクルの繰り返しにより生じる樹脂部と金属部との結合部における割れを抑制することができ、耐ヒートサイクル性を向上させることができる。 The polyamide resin composition is preferably further blended with an impact resistant material (C). By blending the impact resistant material (C), the impact resistance of the molded product can be improved. In addition, a molded article used for an application that contacts high-pressure hydrogen repeatedly undergoes a temperature change (heat cycle) from −40 ° C. or lower to 90 ° C. or higher due to filling and releasing of high-pressure hydrogen. In the case of a composite product having a part, cracks are likely to occur at the joint between the resin part and the metal part. By mix | blending an impact-resistant material (C), the crack in the junction part of the resin part and metal part which arises by repetition of such a heat cycle can be suppressed, and heat cycle resistance can be improved.
耐衝撃材(C)としては、例えば、オレフィン系樹脂、アクリル系ゴム、シリコーン系ゴム、フッ素系ゴム、スチレン系ゴム、ニトリル系ゴム、ビニル系ゴム、ウレタン系ゴム、ポリアミドエラストマー、ポリエステルエラストマー、アイオノマーなどが挙げられる。これらを2種以上配合してもよい。 Examples of the impact resistant material (C) include olefin resin, acrylic rubber, silicone rubber, fluorine rubber, styrene rubber, nitrile rubber, vinyl rubber, urethane rubber, polyamide elastomer, polyester elastomer, ionomer. Etc. Two or more of these may be blended.
これらの中でも、ポリアミド6樹脂(A)およびアミド系ワックス(B)との相溶性に優れ、耐ヒートサイクル性改良効果が高いことから、オレフィン系樹脂が好ましく用いられる。オレフィン系樹脂は、エチレン、プロピレン、ブテン、イソプレン、ペンテンなどのオレフィン単量体を重合して得られる熱可塑性樹脂である。2種以上のオレフィン単量体の共重合体であってもよいし、これらのオレフィン単量体と他の単量体との共重合体であってもよい。オレフィン系樹脂の具体例としては、ポリエチレン、ポリプロピレン、ポリスチレン、ポリ1−ブテン、ポリ1−ペンテン、ポリメチルペンテンなどの重合体またはこれらの共重合体;エチレン/α−オレフィン共重合体、エチレン/α,β−不飽和カルボン酸エステル共重合体、α−オレフィン/α,β−不飽和カルボン酸エステル共重合体、[(エチレンおよび/またはプロピレン)とビニルアルコールエステルとの共重合体]の少なくとも一部を加水分解して得られるポリオレフィン、(エチレンおよび/またはプロピレン)と(不飽和カルボン酸および/または不飽和カルボン酸エステル)との共重合体、[(エチレンおよび/またはプロピレン)と(不飽和カルボン酸および/または不飽和カルボン酸エステル)との共重合体]のカルボキシル基の少なくとも一部を金属塩化して得られるポリオレフィン、共役ジエンとビニル芳香族炭化水素とのブロック共重合体またはその水素化物などが挙げられる。これらの中でも、エチレン/α−オレフィン共重合体、エチレン/α,β−不飽和カルボン酸エステル共重合体がより好ましく、エチレン/α−オレフィン共重合体がさらに好ましい。 Among these, an olefin resin is preferably used because of excellent compatibility with the polyamide 6 resin (A) and the amide wax (B) and a high effect of improving heat cycle resistance. The olefin resin is a thermoplastic resin obtained by polymerizing olefin monomers such as ethylene, propylene, butene, isoprene, and pentene. The copolymer of 2 or more types of olefin monomers may be sufficient, and the copolymer of these olefin monomers and another monomer may be sufficient. Specific examples of the olefin resin include polymers such as polyethylene, polypropylene, polystyrene, poly 1-butene, poly 1-pentene, polymethyl pentene or copolymers thereof; ethylene / α-olefin copolymer, ethylene / α, β-unsaturated carboxylic acid ester copolymer, α-olefin / α, β-unsaturated carboxylic acid ester copolymer, [copolymer of (ethylene and / or propylene) and vinyl alcohol ester] Polyolefin obtained by partially hydrolyzing, a copolymer of (ethylene and / or propylene) and (unsaturated carboxylic acid and / or unsaturated carboxylic ester), [(ethylene and / or propylene) and (unsaturated) Copolymer of saturated carboxylic acid and / or unsaturated carboxylic acid ester) Polyolefins obtained by at least a portion of the cyclohexyl group and a metal chloride, such as a block copolymer or its hydrogenation product of a conjugated diene and a vinyl aromatic hydrocarbons. Among these, an ethylene / α-olefin copolymer and an ethylene / α, β-unsaturated carboxylic acid ester copolymer are more preferable, and an ethylene / α-olefin copolymer is more preferable.
また、前記ポリオレフィン系樹脂は、不飽和カルボン酸および/またはその誘導体で変性されていてもよい。ここで、不飽和カルボン酸の誘導体とは、不飽和カルボン酸のカルボキシル基のヒドロキシ基部分を他の置換基で置換した化合物であり、不飽和カルボン酸の金属塩、酸ハロゲン化物、エステル、酸無水物、アミドおよびイミドなどである。このような変性ポリオレフィン系樹脂を用いることにより、ポリアミド6樹脂(A)およびアミド系ワックス(B)との相溶性が一層向上し、耐ヒートサイクル性をより向上させることができる。不飽和カルボン酸またはその誘導体としては、例えば、アクリル酸、メタアクリル酸、マレイン酸、フマル酸、イタコン酸、クロトン酸、メチルマレイン酸、メチルフマル酸、メサコン酸、シトラコン酸、グルタコン酸およびこれらカルボン酸の金属塩;マレイン酸水素メチル、イタコン酸水素メチル、アクリル酸メチル、アクリル酸エチル、アクリル酸ブチル、アクリル酸2−エチルヘキシル、アクリル酸ヒドロキシエチル、メタアクリル酸メチル、メタアクリル酸2−エチルヘキシル、メタアクリル酸ヒドロキシエチル、メタアクリル酸アミノエチル、マレイン酸ジメチル、イタコン酸ジメチルなどの不飽和カルボン酸エステル;無水マレイン酸、無水イタコン酸、無水シトラコン酸、エンドビシクロ−(2,2,1)−5−ヘプテン−2,3−ジカルボン酸、エンドビシクロ−(2,2,1)−5−ヘプテン−2,3−ジカルボン酸無水物などの酸無水物;マレイミド、N−エチルマレイミド、N−ブチルマレイミド、N−フェニルマレイミド、アクリル酸グリシジル、メタクリル酸グリシジル、エタクリル酸グリシジル、イタコン酸グリシジル、シトラコン酸グリシジル、5−ノルボルネン−2,3−ジカルボン酸などが挙げられる。これらの中でも、不飽和ジカルボン酸およびその酸無水物が好ましく、マレイン酸または無水マレイン酸が特に好ましい。 The polyolefin resin may be modified with an unsaturated carboxylic acid and / or a derivative thereof. Here, the derivative of unsaturated carboxylic acid is a compound obtained by substituting the hydroxy group portion of the carboxyl group of unsaturated carboxylic acid with another substituent, and includes a metal salt, an acid halide, an ester, an acid of unsaturated carboxylic acid. Anhydrides, amides and imides. By using such a modified polyolefin resin, the compatibility with the polyamide 6 resin (A) and the amide wax (B) can be further improved, and the heat cycle resistance can be further improved. Examples of the unsaturated carboxylic acid or derivative thereof include acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, crotonic acid, methylmaleic acid, methyl fumaric acid, mesaconic acid, citraconic acid, glutaconic acid and carboxylic acids thereof. Metal salts of: methyl hydrogen maleate, methyl itaconate hydrogen, methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, hydroxyethyl acrylate, methyl methacrylate, 2-ethylhexyl methacrylate, meta Unsaturated carboxylic acid esters such as hydroxyethyl acrylate, aminoethyl methacrylate, dimethyl maleate, dimethyl itaconate; maleic anhydride, itaconic anhydride, citraconic anhydride, endobicyclo- (2,2,1) -5 -Heptene- , 3-dicarboxylic acid, acid anhydrides such as endobicyclo- (2,2,1) -5-heptene-2,3-dicarboxylic acid anhydride; maleimide, N-ethylmaleimide, N-butylmaleimide, N-phenyl Examples include maleimide, glycidyl acrylate, glycidyl methacrylate, glycidyl ethacrylate, glycidyl itaconate, glycidyl citraconic acid, and 5-norbornene-2,3-dicarboxylic acid. Among these, unsaturated dicarboxylic acid and its acid anhydride are preferable, and maleic acid or maleic anhydride is particularly preferable.
これらの不飽和カルボン酸またはその誘導体をポリオレフィン系樹脂に導入する方法としては、例えば、オレフィン単量体と、不飽和カルボン酸および/またはその誘導体を共重合する方法、ラジカル開始剤を用いて、未変性ポリオレフィン系樹脂に、不飽和カルボン酸および/またはその誘導体をグラフト導入する方法などを挙げることができる。 As a method for introducing these unsaturated carboxylic acids or derivatives thereof into the polyolefin-based resin, for example, a method of copolymerizing an olefin monomer and an unsaturated carboxylic acid and / or a derivative thereof, using a radical initiator, Examples thereof include a method of grafting an unsaturated carboxylic acid and / or a derivative thereof into an unmodified polyolefin resin.
エチレン/α−オレフィン共重合体としては、エチレンと炭素原子数3〜20のα−オレフィンとの共重合体が好ましい。炭素数3〜20のα−オレフィンとしては、具体的には、プロピレン、1−ブテン、1−ペンテン、1−ヘキセン、1−ヘプテン、1−オクテン、1−ノネン、1−デセン、1−ウンデセン、1−ドデセン、1−トリデセン、1−テトラデセン、1−ペンタデセン、1−ヘキサデセン、1−ヘプタデセン、1−オクタデセン、1−ノナデセン、1−エイコセン、3−メチル−1−ブテン、3−メチル−1−ペンテン、3−エチル−1−ペンテン、4−メチル−1−ペンテン、4−メチル−1−ヘキセン、4,4−ジメチル−1−ヘキセン、4,4−ジメチル−1−ペンテン、4−エチル−1−ヘキセン、3−エチル−1−ヘキセン、9−メチル−1−デセン、11−メチル−1−ドデセン、12−エチル−1−テトラデセンなどが挙げられる。これらを2種以上用いてもよい。これらα−オレフィンの中でも、炭素数3〜12のα−オレフィンが、機械強度の向上の観点から好ましい。さらに、1,4−ヘキサジエン、ジシクロペンタジエン、2,5−ノルボルナジエン、5−エチリデンノルボルネン、5−エチル−2,5−ノルボルナジエン、5−(1’−プロペニル)−2−ノルボルネンなどの非共役ジエンの少なくとも1種が共重合されていてもよい。不飽和カルボン酸および/またはその誘導体で変性されたエチレンと炭素数3〜12のα−オレフィンとの共重合体が、ポリアミド6樹脂(A)およびアミド系ワックス(B)との相溶性を一層向上させ、耐ヒートサイクル性をより向上させることができるので、より好ましい。また、より高圧の水素で充填および放圧を繰り返しても、欠陥点の発生を抑制することができる。エチレン/α−オレフィン共重合体中のα−オレフィン含有量は、好ましくは1〜30モル%、より好ましくは2〜25モル%、さらに好ましくは3〜20モル%である。 As the ethylene / α-olefin copolymer, a copolymer of ethylene and an α-olefin having 3 to 20 carbon atoms is preferable. Specific examples of the α-olefin having 3 to 20 carbon atoms include propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene and 1-undecene. 1-dodecene, 1-tridecene, 1-tetradecene, 1-pentadecene, 1-hexadecene, 1-heptadecene, 1-octadecene, 1-nonadecene, 1-eicosene, 3-methyl-1-butene, 3-methyl-1 -Pentene, 3-ethyl-1-pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl -1-hexene, 3-ethyl-1-hexene, 9-methyl-1-decene, 11-methyl-1-dodecene, 12-ethyl-1-tetradecene and the like.Two or more of these may be used. Among these α-olefins, α-olefins having 3 to 12 carbon atoms are preferable from the viewpoint of improving mechanical strength. Further, non-conjugated dienes such as 1,4-hexadiene, dicyclopentadiene, 2,5-norbornadiene, 5-ethylidenenorbornene, 5-ethyl-2,5-norbornadiene, 5- (1′-propenyl) -2-norbornene At least one of these may be copolymerized. A copolymer of ethylene modified with an unsaturated carboxylic acid and / or a derivative thereof and an α-olefin having 3 to 12 carbon atoms further enhances compatibility with the polyamide 6 resin (A) and the amide wax (B). It is more preferable because the heat cycle resistance can be further improved. Moreover, even if filling and releasing pressure are repeated with higher-pressure hydrogen, generation of defect points can be suppressed. The α-olefin content in the ethylene / α-olefin copolymer is preferably 1 to 30 mol%, more preferably 2 to 25 mol%, and still more preferably 3 to 20 mol%.
耐衝撃材(C)の構造は、特に限定されず、例えば、ゴムからなる少なくとも1つの層と、それとは異種の重合体からなる1つ以上の層からなる、いわゆるコアシェル型と呼ばれる多層構造体であってもよい。多層構造体を構成する層の数は、2層以上であればよく、3層以上または4層以上であってもよいが、内部に1層以上のゴム層(コア層)を有することが好ましい。多層構造体のゴム層を構成するゴムの種類は、特に限定されるものではなく、例えば、アクリル成分、シリコーン成分、スチレン成分、ニトリル成分、共役ジエン成分、ウレタン成分、エチレン成分、プロピレン成分、イソブテン成分などを重合させて得られるゴムが挙げられる。多層構造体のゴム層以外の層を構成する異種の重合体の種類は、熱可塑性を有する重合体であれば特に限定されるものではないが、ゴム層よりもガラス転移温度が高い重合体が好ましい。熱可塑性を有する重合体としては、例えば、不飽和カルボン酸アルキルエステル単位、不飽和カルボン酸単位、不飽和グリシジル基含有単位、不飽和ジカルボン酸無水物単位、脂肪族ビニル単位、芳香族ビニル単位、シアン化ビニル単位、マレイミド単位、不飽和ジカルボン酸単位およびその他のビニル単位などを含有する重合体が挙げられる。 The structure of the impact-resistant material (C) is not particularly limited. For example, a multilayer structure called a so-called core-shell type consisting of at least one layer made of rubber and one or more layers made of a polymer different from the rubber. It may be. The number of layers constituting the multilayer structure may be two or more, and may be three or more or four or more, but preferably has one or more rubber layers (core layers) inside. . The type of rubber constituting the rubber layer of the multilayer structure is not particularly limited. For example, acrylic component, silicone component, styrene component, nitrile component, conjugated diene component, urethane component, ethylene component, propylene component, isobutene Examples thereof include rubber obtained by polymerizing components. The kind of the different polymer constituting the layer other than the rubber layer of the multilayer structure is not particularly limited as long as it is a polymer having thermoplasticity, but there is a polymer having a glass transition temperature higher than that of the rubber layer. preferable. As the polymer having thermoplasticity, for example, an unsaturated carboxylic acid alkyl ester unit, an unsaturated carboxylic acid unit, an unsaturated glycidyl group-containing unit, an unsaturated dicarboxylic acid anhydride unit, an aliphatic vinyl unit, an aromatic vinyl unit, Examples thereof include polymers containing vinyl cyanide units, maleimide units, unsaturated dicarboxylic acid units and other vinyl units.
ポリアミド樹脂組成物における耐衝撃材(C)の配合量は、ポリアミド6樹脂(A)100重量部に対して、1〜50重量部が好ましい。耐衝撃材(C)の配合量を1重量部以上とすることにより、耐ヒートサイクル性をより向上させることができる。耐衝撃材(C)の配合量は、5重量部以上がより好ましく、10重量部以上がさらに好ましい。一方、耐衝撃材(C)の配合量を50重量部以下とすることにより、高圧の水素で充填および放圧を繰り返しても、欠陥点の発生を抑制することができる。耐衝撃材(C)の配合量は、45重量部以下がより好ましく、40重量部以下がさらに好ましく、35重量部以下がさらに好ましい。 The blending amount of the impact resistant material (C) in the polyamide resin composition is preferably 1 to 50 parts by weight with respect to 100 parts by weight of the polyamide 6 resin (A). Heat cycle resistance can be improved more by making the compounding quantity of an impact-resistant material (C) into 1 weight part or more. The amount of the impact resistant material (C) is more preferably 5 parts by weight or more, and still more preferably 10 parts by weight or more. On the other hand, by setting the blending amount of the impact resistant material (C) to 50 parts by weight or less, generation of defect points can be suppressed even when filling and releasing with high-pressure hydrogen are repeated. The amount of the impact resistant material (C) is more preferably 45 parts by weight or less, further preferably 40 parts by weight or less, and further preferably 35 parts by weight or less.
ポリアミド樹脂組成物には、その特性を損なわない範囲で、必要に応じて、前記成分(A)、(B)および(C)以外のその他の成分を配合しても構わない。その他の成分としては、例えば、充填材、前記成分(A)〜(C)以外の熱可塑性樹脂類および各種添加剤類を挙げることができる。 In the polyamide resin composition, other components other than the components (A), (B), and (C) may be blended as necessary within a range that does not impair the characteristics. Examples of other components include a filler, thermoplastic resins other than the components (A) to (C), and various additives.
例えば、ポリアミド樹脂組成物に、その他の成分として、充填材を配合することにより、得られる成形品の強度および寸法安定性等を向上させることができる。充填材の形状は、繊維状であっても非繊維状であってもよく、繊維状充填材と非繊維状充填材を組み合わせて用いてもよい。繊維状充填材としては、例えば、ガラス繊維、ガラスミルドファイバー、炭素繊維、チタン酸カリウムウィスカ、酸化亜鉛ウィスカ、硼酸アルミニウムウィスカ、アラミド繊維、アルミナ繊維、炭化珪素繊維、セラミック繊維、アスベスト繊維、石コウ繊維、金属繊維などが挙げられる。非繊維状充填材としては、例えば、ワラステナイト、ゼオライト、セリサイト、カオリン、マイカ、クレー、パイロフィライト、ベントナイト、アスベスト、タルク、アルミナシリケートなどの珪酸塩;アルミナ、酸化珪素、酸化マグネシウム、酸化ジルコニウム、酸化チタン、酸化鉄などの金属酸化物;炭酸カルシウム、炭酸マグネシウム、ドロマイトなどの金属炭酸塩;硫酸カルシウム、硫酸バリウムなどの金属硫酸塩;水酸化マグネシウム、水酸化カルシウム、水酸化アルミニウムなどの金属水酸化物;ガラスビーズ、セラミックビーズ、窒化ホウ素および炭化珪素などが挙げられる。これらは中空であってもよい。また、これら繊維状および/または非繊維状充填材を、カップリング剤で予備処理して使用することは、より優れた機械特性を得る意味において好ましい。カップリング剤としては、例えば、イソシアネート系化合物、有機シラン系化合物、有機チタネート系化合物、有機ボラン系化合物、エポキシ化合物などが挙げられる。 For example, the strength, dimensional stability, and the like of the obtained molded product can be improved by blending the polyamide resin composition with other fillers as other components. The shape of the filler may be fibrous or non-fibrous, or a combination of fibrous filler and non-fibrous filler may be used. Examples of the fibrous filler include glass fiber, glass milled fiber, carbon fiber, potassium titanate whisker, zinc oxide whisker, aluminum borate whisker, aramid fiber, alumina fiber, silicon carbide fiber, ceramic fiber, asbestos fiber, and stone powder. Examples thereof include fibers and metal fibers. Non-fibrous fillers include, for example, silicates such as wollastonite, zeolite, sericite, kaolin, mica, clay, pyrophyllite, bentonite, asbestos, talc, alumina silicate; alumina, silicon oxide, magnesium oxide, oxidation Metal oxides such as zirconium, titanium oxide and iron oxide; metal carbonates such as calcium carbonate, magnesium carbonate and dolomite; metal sulfates such as calcium sulfate and barium sulfate; magnesium hydroxide, calcium hydroxide and aluminum hydroxide Metal hydroxide; glass beads, ceramic beads, boron nitride, silicon carbide and the like. These may be hollow. In addition, it is preferable to use these fibrous and / or non-fibrous fillers after pretreatment with a coupling agent in terms of obtaining superior mechanical properties. Examples of the coupling agent include isocyanate compounds, organic silane compounds, organic titanate compounds, organic borane compounds, and epoxy compounds.
熱可塑性樹脂類としては、例えば、ポリエステル樹脂、ポリフェニレンスルフィド樹脂、ポリフェニレンオキシド樹脂、ポリカーボネート樹脂、ポリ乳酸樹脂、ポリアセタール樹脂、ポリスルホン樹脂、四フッ化ポリエチレン樹脂、ポリエーテルイミド樹脂、ポリアミドイミド樹脂、ポリイミド樹脂、ポリエーテルスルホン樹脂、ポリエーテルケトン樹脂、ポリチオエーテルケトン樹脂、ポリエーテルエーテルケトン樹脂、ポリスチレン樹脂やABS樹脂等のスチレン系樹脂、ポリアルキレンオキサイド樹脂等が挙げられる。かかる熱可塑性樹脂類を2種以上配合することも可能である。 Examples of the thermoplastic resins include polyester resins, polyphenylene sulfide resins, polyphenylene oxide resins, polycarbonate resins, polylactic acid resins, polyacetal resins, polysulfone resins, tetrafluoropolyethylene resins, polyetherimide resins, polyamideimide resins, and polyimide resins. , Polyethersulfone resins, polyetherketone resins, polythioetherketone resins, polyetheretherketone resins, styrene resins such as polystyrene resins and ABS resins, and polyalkylene oxide resins. It is also possible to blend two or more of such thermoplastic resins.
各種添加剤類としては、例えば、着色防止剤、ヒンダードフェノール、ヒンダードアミンなどの酸化防止剤、離型剤、可塑剤、熱安定剤、滑剤、紫外線防止剤、着色剤、難燃剤、発泡剤などが挙げられる。 Various additives include, for example, anti-coloring agents, antioxidants such as hindered phenols and hindered amines, mold release agents, plasticizers, heat stabilizers, lubricants, UV inhibitors, colorants, flame retardants, foaming agents, etc. Is mentioned.
ポリアミド樹脂組成物には、銅化合物を配合することが、長期耐熱性を向上させることができるので好ましい。銅化合物としては、例えば、塩化第一銅、塩化第二銅、臭化第一銅、臭化第二銅、ヨウ化第一銅、ヨウ化第二銅、硫酸第二銅、硝酸第二銅、リン酸銅、酢酸第一銅、酢酸第二銅、サリチル酸第二銅、ステアリン酸第二銅、安息香酸第二銅および前記無機ハロゲン化銅とキシリレンジアミン、2−メルカプトベンズイミダゾール、ベンズイミダゾールなどの錯化合物などが挙げられる。これらを2種以上配合してもよい。なかでも1価の銅化合物、とりわけ1価のハロゲン化銅化合物が好ましく、酢酸第1銅、ヨウ化第1銅などが好ましい。銅化合物の配合量は、ポリアミド6樹脂(A)100重量部に対して0.01重量部以上が好ましく、0.015重量部以上がより好ましい。一方、成形時の金属銅の遊離に起因する着色を抑制する観点から、銅化合物の配合量は、2重量部以下が好ましく、1重量部以下がより好ましい。 It is preferable to add a copper compound to the polyamide resin composition because long-term heat resistance can be improved. Examples of the copper compound include cuprous chloride, cupric chloride, cuprous bromide, cupric bromide, cuprous iodide, cupric iodide, cupric sulfate, cupric nitrate. , Copper phosphate, cuprous acetate, cupric acetate, cupric salicylate, cupric stearate, cupric benzoate and inorganic copper halides and xylylenediamine, 2-mercaptobenzimidazole, benzimidazole And complex compounds. Two or more of these may be blended. Among these, monovalent copper compounds, particularly monovalent copper halide compounds are preferable, and cuprous acetate, cuprous iodide, and the like are preferable. The compounding amount of the copper compound is preferably 0.01 parts by weight or more, more preferably 0.015 parts by weight or more with respect to 100 parts by weight of the polyamide 6 resin (A). On the other hand, the amount of the copper compound is preferably 2 parts by weight or less, and more preferably 1 part by weight or less, from the viewpoint of suppressing coloration due to liberation of metallic copper during molding.
また、銅化合物とともにハロゲン化アルカリを配合してもよい。ハロゲン化アルカリ化合物としては、例えば、塩化リチウム、臭化リチウム、ヨウ化リチウム、塩化カリウム、臭化カリウム、ヨウ化カリウム、臭化ナトリウムおよびヨウ化ナトリウムを挙げることができる。これらを2種以上配合してもよい。ヨウ化カリウムまたはヨウ化ナトリウムが特に好ましい。 Moreover, you may mix | blend an alkali halide with a copper compound. Examples of the alkali halide compound include lithium chloride, lithium bromide, lithium iodide, potassium chloride, potassium bromide, potassium iodide, sodium bromide and sodium iodide. Two or more of these may be blended. Particular preference is given to potassium iodide or sodium iodide.
ポリアミド樹脂組成物のDSC測定による降温結晶化温度は、180℃以上であることが好ましく、183℃以上であることがより好ましい。ポリアミド樹脂組成物の降温結晶化温度が180℃以上であれば、ポリアミド樹脂組成物の溶融状態からの冷却過程において、緻密で均一な結晶が形成されやすくなることで、水素透過性が低くなり、高圧水素の充填および放圧を繰り返しても欠陥点の発生を抑制できるポリアミド樹脂組成物の降温結晶化温度は、180℃以上が好ましく、183℃以上がより好ましい。 The temperature-falling crystallization temperature by DSC measurement of the polyamide resin composition is preferably 180 ° C. or higher, and more preferably 183 ° C. or higher. If the temperature drop crystallization temperature of the polyamide resin composition is 180 ° C. or more, in the cooling process from the molten state of the polyamide resin composition, dense and uniform crystals are likely to be formed, resulting in low hydrogen permeability. The temperature-falling crystallization temperature of the polyamide resin composition capable of suppressing the generation of defect points even when high-pressure hydrogen filling and releasing pressure is repeated is preferably 180 ° C. or higher, and more preferably 183 ° C. or higher.
なお、本発明において、ポリアミド樹脂組成物のDSC測定による降温結晶化温度は、次の方法で求めることができる。まず、示差走査熱量計(パーキンエルマー社製DSC−7)を用い、2点校正(インジウム、鉛)、ベースライン補正を行う。サンプル量を8〜10mgとして、昇温速度20℃/分の条件で昇温して得られる融解曲線の最大値を示す温度より15℃高い温度で1分間保持した後、20℃/分の降温速度で30℃まで冷却したときに観測される結晶化発熱ピーク温度を降温結晶化温度とする。ただし、ピークが2つ以上観測される場合には、結晶化発熱ピークの最も大きいものに対応する温度を、ポリアミド樹脂組成物の降温結晶化温度とする。 In addition, in this invention, the temperature fall crystallization temperature by DSC measurement of a polyamide resin composition can be calculated | required with the following method. First, using a differential scanning calorimeter (DSC-7 manufactured by Perkin Elmer), two-point calibration (indium, lead) and baseline correction are performed. The sample amount was set to 8 to 10 mg, held for 1 minute at a temperature 15 ° C. higher than the temperature showing the maximum value of the melting curve obtained by heating at a heating rate of 20 ° C./min, and then the temperature was lowered to 20 ° C./min. The crystallization exothermic peak temperature observed when cooling at a rate of 30 ° C. is defined as the temperature-falling crystallization temperature. However, when two or more peaks are observed, the temperature corresponding to the largest crystallization exothermic peak is set as the temperature-falling crystallization temperature of the polyamide resin composition.
ポリアミド樹脂組成物の降温結晶化温度を上記範囲にする手段としては、例えば、前述の好ましいポリアミド樹脂組成物を用いる方法などが挙げられる。 Examples of the means for setting the temperature drop crystallization temperature of the polyamide resin composition in the above range include a method using the above-mentioned preferred polyamide resin composition.
次に、本発明のポリアミド樹脂組成物の製造方法について説明する。本発明の熱可塑性ポリアミド樹脂組成物の製造方法としては、特に制限はなく、例えば、ポリアミド6樹脂(A)とアミド系ワックス(B)および必要に応じて耐衝撃材(C)やその他成分を一括混練する方法、ポリアミド6樹脂(A)を溶融した後にアミド系ワックス(B)および必要に応じて耐衝撃材(C)やその他成分を混練する方法、ポリアミド6樹脂(A)とアミド系ワックス(B)を溶融してから必要に応じて耐衝撃材(C)やその他成分を混練する方法などが挙げられる。混練装置としては、例えば、バンバリーミキサー、ロール、押出機等の公知の混練装置を採用することができる。本発明のポリアミド樹脂組成物に耐衝撃材(C)および各種添加剤類などのその他成分を配合する場合、これらを任意の段階で配合することができる。例えば、二軸押出機により本発明のポリアミド樹脂組成物を製造する場合、ポリアミド6樹脂(A)とアミド系ワックス(B)を配合する際に耐衝撃材(C)、その他の成分を同時に配合する方法や、ポリアミド6樹脂(A)とアミド系ワックス(B)を溶融混練中にサイドフィード等の手法により耐衝撃材(C)およびその他の成分を配合する方法や、予めポリアミド6樹脂(A)とアミド系ワックス(B)を溶融混練した後に耐衝撃材(C)およびその他の成分を配合する方法や、予め、ポリアミド6樹脂(A)に耐衝撃材(C)およびその他の成分を配合して溶融混練後、アミド系ワックス(B)を配合する方法などが挙げられる。 Next, the manufacturing method of the polyamide resin composition of this invention is demonstrated. There is no restriction | limiting in particular as a manufacturing method of the thermoplastic polyamide resin composition of this invention, For example, a polyamide 6 resin (A), an amide-type wax (B), and an impact-resistant material (C) and other components as needed are included. A method of kneading together, a method of kneading an amide wax (B) and, if necessary, an impact resistant material (C) and other components after melting the polyamide 6 resin (A), a polyamide 6 resin (A) and an amide wax Examples include a method of kneading the impact resistant material (C) and other components as necessary after melting (B). As a kneading apparatus, for example, a known kneading apparatus such as a Banbury mixer, a roll, or an extruder can be employed. When the polyamide resin composition of the present invention is blended with other components such as the impact resistant material (C) and various additives, these can be blended at any stage. For example, when the polyamide resin composition of the present invention is produced by a twin screw extruder, the impact resistant material (C) and other components are blended simultaneously when the polyamide 6 resin (A) and the amide wax (B) are blended. A method of blending the impact-resistant material (C) and other components by a method such as side feed during the melt-kneading of the polyamide 6 resin (A) and the amide wax (B), or a polyamide 6 resin (A ) And amide wax (B) are melt-kneaded and then the impact resistant material (C) and other components are blended, or the polyamide 6 resin (A) is blended with the impact resistant material (C) and other components in advance. And a method of blending the amide wax (B) after melt-kneading.
本発明のポリアミド樹脂組成物は、任意の方法により成形して成形品を得ることが可能である。成形方法としては、例えば、押出成形、射出成形、中空成形、カレンダ成形、圧縮成形、真空成形、発泡成形、ブロー成形、回転成形等が挙げられる。成形形状としては、例えば、ペレット状、板状、繊維状、ストランド状、フィルムまたはシート状、パイプ状、中空状、箱状等の形状が挙げられる。 The polyamide resin composition of the present invention can be molded by any method to obtain a molded product. Examples of the molding method include extrusion molding, injection molding, hollow molding, calendar molding, compression molding, vacuum molding, foam molding, blow molding, and rotational molding. Examples of the molded shape include shapes such as a pellet shape, a plate shape, a fiber shape, a strand shape, a film or sheet shape, a pipe shape, a hollow shape, and a box shape.
本発明の成形品は、高圧水素の充填および放圧を繰り返しても欠陥点の発生が抑制される優れた特徴を活かして、高圧水素に触れる成形品に用いられる。ここでいう高圧水素に触れる成形品とは、常圧以上の圧力の水素に触れる成形品である。高圧水素の充填および放圧を繰り返したときの欠陥点の発生を抑制する効果を奏することから、圧力20MPa以上の水素に触れる成形品用途に好ましく用いられ、30MPa以上の水素に触れる成形品用途により好ましく用いられる。一方、圧力200MPa以下の水素に触れる成形品用途に好ましく用いられ、150MPa以下の水素に触れる成形品用途により好ましく用いられ、100MPa以下の水素に触れる成形品用途にさらに好ましく用いられる。高圧水素に触れる成形品としては、例えば、高圧水素用開閉バルブ、高圧水素用逆止弁、高圧水素用減圧弁、高圧水素用圧力調整弁、高圧水素用シール、高圧水素用ホース、高圧水素用タンク、高圧水素用タンクライナー、高圧水素用パイプ、高圧水素用パッキン、高圧水素用圧力センサ、高圧水素用ポンプ、高圧水素用チューブ、高圧水素用レギュレーター、高圧水素用フィルム、高圧水素用シート、高圧水素用繊維、高圧水素用継ぎ手等が挙げられる。中でも、高圧水素用開閉バルブ、高圧水素用逆止弁、高圧水素用減圧弁、高圧水素用圧力調整弁、高圧水素用タンク、高圧水素用タンクライナー、高圧水素用パッキン、高圧水素用圧力センサ、高圧水素用ポンプ、高圧水素用レギュレーター、高圧水素用継ぎ手等の高圧水素容器およびその周辺部品に好ましく使用することができる。これらの中でも、高圧水素用タンクに特に好ましく用いることができる。 The molded article of the present invention is used for a molded article that comes into contact with high-pressure hydrogen, taking advantage of the excellent feature that generation of defects is suppressed even when high-pressure hydrogen is repeatedly charged and released. The molded product that is in contact with high-pressure hydrogen here is a molded product that is in contact with hydrogen at a pressure higher than normal pressure. Since it has the effect of suppressing the generation of defect points when repeated filling and releasing of high-pressure hydrogen, it is preferably used for molded products that come into contact with hydrogen at a pressure of 20 MPa or higher, and used for molded products that come into contact with hydrogen at 30 MPa or higher. Preferably used. On the other hand, it is preferably used for molded products that come into contact with hydrogen at a pressure of 200 MPa or less, more preferably used for molded products that come into contact with hydrogen at 150 MPa or less, and more preferably used for molded products that come into contact with hydrogen at 100 MPa or less. Examples of molded products that come into contact with high-pressure hydrogen include high-pressure hydrogen on-off valve, high-pressure hydrogen check valve, high-pressure hydrogen pressure-reducing valve, high-pressure hydrogen pressure regulating valve, high-pressure hydrogen seal, high-pressure hydrogen hose, high-pressure hydrogen Tank, high pressure hydrogen tank liner, high pressure hydrogen pipe, high pressure hydrogen packing, high pressure hydrogen pressure sensor, high pressure hydrogen pump, high pressure hydrogen tube, high pressure hydrogen regulator, high pressure hydrogen film, high pressure hydrogen sheet, high pressure Examples include hydrogen fibers and high-pressure hydrogen joints. Among them, on-off valve for high pressure hydrogen, check valve for high pressure hydrogen, pressure reducing valve for high pressure hydrogen, pressure regulating valve for high pressure hydrogen, tank for high pressure hydrogen, tank liner for high pressure hydrogen, packing for high pressure hydrogen, pressure sensor for high pressure hydrogen, It can be preferably used in high-pressure hydrogen containers such as a high-pressure hydrogen pump, a high-pressure hydrogen regulator, and a high-pressure hydrogen joint and its peripheral parts. Among these, it can be particularly preferably used for a high-pressure hydrogen tank.
高圧水素用タンクライナーは、任意の方法により成形して得ることが可能である。成形方法としては、例えば、押出成形、射出成形、中空成形、カレンダ成形、圧縮成形、真空成形、発泡成形、ブロー成形、回転成形等が挙げられる。 The tank liner for high pressure hydrogen can be obtained by molding by any method. Examples of the molding method include extrusion molding, injection molding, hollow molding, calendar molding, compression molding, vacuum molding, foam molding, blow molding, and rotational molding.
また、高圧水素用タンクライナーを形成する方法は、高圧水素用タンクライナーを構成する2つ以上の分割体を成形によって形成し、これらを溶着により接合することによって形成する方法を挙げることができる。例えば、高圧水素用タンクライナーを半分に縦割りにした形状の成形体2つを溶着により接合することによって高圧水素用タンクライナーを形成する方法、高圧水素用タンクライナーを半分に横割りにした形状の成形体2つを溶着により接合することによって高圧水素用タンクライナーを形成する方法、高圧水素タンクライナーの両端部をふさぐ、半円状・楕円状などの形状をしている鏡板2つと、胴部を溶着により接合することによって高圧水素用タンクライナーを形成する方法等が挙げられるが、これに限定されるものではない。 Moreover, the method of forming the tank liner for high pressure hydrogen can mention the method of forming by forming the 2 or more division body which comprises the tank liner for high pressure hydrogen by shaping | molding, and joining these by welding. For example, a method of forming a high-pressure hydrogen tank liner by joining two molded bodies having a shape of a high-pressure hydrogen tank liner divided in half by welding, and a shape in which the high-pressure hydrogen tank liner is divided in half. A method of forming a tank liner for high-pressure hydrogen by joining two molded bodies by welding, two end plates having a semicircular shape, an elliptical shape, etc., covering both ends of the high-pressure hydrogen tank liner, Although the method of forming the tank liner for high pressure hydrogen by joining a part by welding is mentioned, It is not limited to this.
溶着としては、熱板溶着、超音波溶着、振動溶着、レーザー溶着、赤外線溶着、赤外線にて溶着部を温めた後に振動溶着を行う赤外線/振動溶着等が挙げられる。中でも赤外線溶着、赤外線/振動溶着が好ましい。 Examples of the welding include hot plate welding, ultrasonic welding, vibration welding, laser welding, infrared welding, and infrared / vibration welding in which vibration welding is performed after warming a welding portion with infrared rays. Of these, infrared welding and infrared / vibration welding are preferable.
特に好ましい態様は、樹脂製ライナーの外側を炭素繊維強化樹脂で補強してなる高圧水素用タンクの樹脂製ライナーとして、本発明のポリアミド樹脂組成物からなるタンクライナーを使用する態様である。すなわち、本発明の高圧水素用タンクは、本発明のポリアミド樹脂組成物からなるタンクライナーの表層に、炭素繊維強化樹脂(CFRP)補強層が積層されてなる、高圧水素用タンクである。 A particularly preferable embodiment is an embodiment in which a tank liner made of the polyamide resin composition of the present invention is used as a resin liner for a high-pressure hydrogen tank formed by reinforcing the outside of a resin liner with a carbon fiber reinforced resin. That is, the high pressure hydrogen tank of the present invention is a high pressure hydrogen tank in which a carbon fiber reinforced resin (CFRP) reinforcing layer is laminated on the surface layer of a tank liner made of the polyamide resin composition of the present invention.
タンクライナーの表層に、CFRP補強層を積層していることにより、高圧に耐えうる強度や弾性率を発現させることができるので好ましい。CFRP補強層は、炭素繊維とマトリクス樹脂により構成される。炭素繊維としては、曲げ特性および強度の観点から、炭素繊維単体の引張弾性率が50〜700GPaのものが好ましく、比剛性の観点をも考慮すると、200〜700GPaのものがより好ましく、コストパフォーマンスの観点をも考慮すると200〜450GPaのものが最も好ましい。また、炭素繊維単体の引張強さは、1500〜7000MPaが好ましく、比強度の観点から、3000〜7000MPaが好ましい。また、炭素繊維の密度は、1.60〜3.00が好ましく、軽量化の観点から1.70〜2.00がより好ましく、コストパフォーマンスの面より1.70〜1.90が最も好ましい。さらに、炭素繊維の繊維径は、一本当たり5〜30μmが好ましく、取り扱い性の観点から5〜20μmがより好ましく、さらに軽量化の観点から、5〜10μmが最も好ましい。炭素繊維を単体で用いても良いし、炭素繊維以外の強化繊維を組み合わせて用いてもよい。炭素繊維以外の強化繊維としては、ガラス繊維やアラミド繊維などが挙げられる。また、炭素繊維とマトリックス樹脂の割合を炭素繊維強化樹脂補強層材料中の炭素繊維の体積分率Vfで規定すると、剛性の観点からVfは20〜90%が好ましく、生産性や要求剛性の観点からVfが40〜80%であることが好ましい。 It is preferable to laminate a CFRP reinforcing layer on the surface layer of the tank liner, since strength and elastic modulus that can withstand high pressure can be expressed. The CFRP reinforcing layer is composed of carbon fibers and a matrix resin. The carbon fiber preferably has a tensile elastic modulus of 50 to 700 GPa from the viewpoint of bending properties and strength, and more preferably 200 to 700 GPa in view of the specific rigidity. Considering the viewpoint, the one of 200 to 450 GPa is most preferable. Moreover, 1500-7000 MPa is preferable and the tensile strength of a carbon fiber single-piece | unit is preferable, and 3000-7000 MPa is preferable from a viewpoint of specific strength. The density of the carbon fiber is preferably 1.60 to 3.00, more preferably 1.70 to 2.00 from the viewpoint of weight reduction, and most preferably 1.70 to 1.90 from the viewpoint of cost performance. Furthermore, the fiber diameter of the carbon fiber is preferably 5 to 30 μm per strand, more preferably 5 to 20 μm from the viewpoint of handleability, and most preferably 5 to 10 μm from the viewpoint of weight reduction. Carbon fibers may be used alone or in combination with reinforcing fibers other than carbon fibers. Examples of reinforcing fibers other than carbon fibers include glass fibers and aramid fibers. Further, when the ratio of the carbon fiber to the matrix resin is defined by the volume fraction Vf of the carbon fiber in the carbon fiber reinforced resin reinforcing layer material, Vf is preferably 20 to 90% from the viewpoint of rigidity, and from the viewpoint of productivity and required rigidity. To Vf is preferably 40 to 80%.
CFRP補強層を構成するマトリックス樹脂としては、熱硬化性樹脂であっても熱可塑性樹脂であってもよい。マトリックス樹脂が熱硬化性樹脂の場合、その主材は、エポキシ樹脂、不飽和ポリエステル樹脂、ビニルエステル樹脂、フェノール樹脂、ポリウレタン樹脂、シリコーン樹脂などを例示することができる。これらの1種類だけを使用しても、2種類以上を混合して使用してもよい。エポキシ樹脂が特に好ましい。エポキシ樹脂としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、イソシアネート変性ビスフェノールA型エポキシ樹脂などがあげられる。熱硬化性樹脂をマトリックス樹脂に採用する場合、熱硬化性樹脂成分に適切な硬化剤や反応促進剤を添加することが可能である。 The matrix resin constituting the CFRP reinforcing layer may be a thermosetting resin or a thermoplastic resin. When the matrix resin is a thermosetting resin, examples of the main material include an epoxy resin, an unsaturated polyester resin, a vinyl ester resin, a phenol resin, a polyurethane resin, and a silicone resin. Only one of these may be used, or two or more may be mixed and used. Epoxy resins are particularly preferred. Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, isocyanate modified bisphenol A type epoxy resin and the like. When a thermosetting resin is employed for the matrix resin, it is possible to add an appropriate curing agent or reaction accelerator to the thermosetting resin component.
マトリックス樹脂が熱可塑性樹脂の場合、その主材は、ポリエチレン樹脂、ポリプロピレン樹脂、ポリ塩化ビニル樹脂、ABS樹脂、ポリスチレン樹脂、AS樹脂、ポリアミド樹脂、ポリアセタール樹脂、ポリカーボネート樹脂、熱可塑性ポリエステル樹脂、PPS樹脂、フッ素樹脂、ポリエーテルイミド樹脂、ポリエーテルケトン樹脂、ポリイミド樹脂などが例示できる。これら熱可塑性樹脂は、単独でも、2種類以上の混合物でも、共重合体でも良い。混合物の場合には相溶化剤を併用しても良い。また、難燃剤として臭素系難燃剤、シリコン系難燃剤、赤燐などを加えても良い。 When the matrix resin is a thermoplastic resin, the main materials are polyethylene resin, polypropylene resin, polyvinyl chloride resin, ABS resin, polystyrene resin, AS resin, polyamide resin, polyacetal resin, polycarbonate resin, thermoplastic polyester resin, PPS resin Fluorine resin, polyetherimide resin, polyetherketone resin, polyimide resin and the like. These thermoplastic resins may be used alone, as a mixture of two or more kinds, or as a copolymer. In the case of a mixture, a compatibilizer may be used in combination. In addition, brominated flame retardants, silicon-based flame retardants, red phosphorus, and the like may be added as flame retardants.
CFRP補強層を高圧水素用タンクライナーの表層に積層する方法としては、公知のフィラメントワインディング(以下FW)法、テープワインディング(以下TW)法、シートワインディング(以下SW)法、ハンドレイアップ法、RTM(Resin Transfer Molding)法などを例示することができる。これら成形法のうち、単一の方法のみで成形してもよいし、2種類以上の成形法を組み合わせて成形しても良い。特性の発現性や生産性および成形性の観点から、FW法、TW法およびSW法から選ばれた方法が好ましい。これらFW法、SW法およびTW法は、基本的には、ストランド状の炭素繊維にマトリックス樹脂を付与してライナーに積層するという観点では、同一の成形法であり、炭素繊維をライナーに対して、フィラメント(糸)形態、テープ(糸をある程度束ねたテープ状)形態およびシート(テープをある程度束ねたシート状)形態のいずれの形態で巻き付けるかによって名称が異なる。ここでは、最も基本的なFW法に関して詳細を説明するが、TW法やSW法にも適用できる内容である。 As a method of laminating the CFRP reinforcing layer on the surface layer of the high-pressure hydrogen tank liner, known filament winding (hereinafter referred to as FW) method, tape winding (hereinafter referred to as TW) method, sheet winding (hereinafter referred to as SW) method, hand layup method, RTM The (Resin Transfer Molding) method and the like can be exemplified. Of these molding methods, molding may be performed by only a single method, or two or more molding methods may be combined. A method selected from the FW method, the TW method, and the SW method is preferable from the viewpoints of expression of properties, productivity, and moldability. These FW method, SW method and TW method are basically the same molding method from the viewpoint of applying a matrix resin to a strand-like carbon fiber and laminating it on the liner. The name is different depending on whether it is wound in a filament (thread) form, a tape (tape form in which yarns are bundled to some extent) form, or a sheet (sheet form in which tapes are bundled to some extent). Here, the details of the most basic FW method will be described, but the contents can also be applied to the TW method and the SW method.
FW法において、マトリックス樹脂が熱硬化性樹脂の場合、あらかじめ樹脂を塗布した状態(未硬化)の炭素繊維を直接ライナーに巻き付けることも可能であるし、ライナーに巻き付ける直前に炭素繊維に樹脂を塗布することも可能である。これらの場合、ライナーに炭素繊維および未硬化のマトリックス樹脂を巻き付けた後、樹脂を硬化させるためにバッチ炉(オーブン)や連続硬化炉などで使用樹脂に適した条件での樹脂硬化処理を行う必要がある。 In the FW method, when the matrix resin is a thermosetting resin, it is possible to wrap the carbon fiber in a state where the resin has been applied in advance (uncured) directly around the liner, or apply the resin to the carbon fiber immediately before wrapping around the liner. It is also possible to do. In these cases, after wrapping carbon fiber and uncured matrix resin around the liner, it is necessary to perform resin curing treatment under conditions suitable for the resin used in a batch furnace (oven) or continuous curing furnace in order to cure the resin. There is.
FW法において、マトリックス樹脂が熱可塑性樹脂の場合、あらかじめ樹脂が塗布(含浸)された炭素繊維を直接ライナーに巻き付けて高圧水素用タンク形状とすることが可能である。この場合、ライナーに巻き付ける直前に、樹脂が塗布された炭素繊維を、熱可塑性樹脂の融点以上に昇温することが必要である。また、ライナーに巻き付ける直前に、炭素繊維に溶融させた熱可塑性樹脂を塗布することも可能である。この場合、熱硬化性樹脂に適用したような樹脂硬化工程は不要である。 In the FW method, when the matrix resin is a thermoplastic resin, it is possible to wind a carbon fiber previously coated (impregnated) with a resin to form a high-pressure hydrogen tank shape. In this case, it is necessary to raise the temperature of the carbon fiber coated with the resin to a temperature equal to or higher than the melting point of the thermoplastic resin immediately before being wound around the liner. It is also possible to apply a thermoplastic resin melted in carbon fibers immediately before winding around the liner. In this case, the resin curing step as applied to the thermosetting resin is unnecessary.
前記FW法、TW法、SW法などで本発明の高圧水素用タンクを得る場合、最も重要なことは、炭素繊維の繊維配向設計である。FW法、TW法およびSW法では、炭素繊維ストランド(連続繊維)や予め炭素繊維ストランドに樹脂を含浸させたプリプレグなどを、ライナーに巻き付けて成形する。設計時にはライナー胴部における連続繊維方向と積層厚みを設計ファクターとして、要求特性を満足する剛性および強度を満足するように設計することが好ましい。 When obtaining the high-pressure hydrogen tank of the present invention by the FW method, TW method, SW method, etc., the most important thing is the fiber orientation design of the carbon fiber. In the FW method, the TW method, and the SW method, a carbon fiber strand (continuous fiber) or a prepreg in which a carbon fiber strand is impregnated with a resin is wound around a liner and molded. At the time of designing, it is preferable to design so as to satisfy rigidity and strength satisfying the required characteristics, with the continuous fiber direction and the laminated thickness in the liner body as design factors.
また、高圧水素用タンクとしては、バルブがインサート成形によりタンクライナーにインサートされていることが好ましい。インサート成形によりバルブをタンクライナーと一体化することにより、高圧水素の気密性が高まるので好ましい。ここでバルブは、高圧水素の充填口や放出口の役割を成す。バルブとして使用される金属部品の材質としては、炭素鋼、マンガン鋼、クロムモリブデン鋼、ステンレス鋼、アルミニウム合金等を例示できる。炭素鋼として、圧力配管用炭素鋼鋼管、高圧配管用炭素鋼鋼管、低温配管用鋼管、機械構造用炭素鋼鋼材を例示できる。マンガン鋼では、高圧ガス容器用継目無鋼管、機械構造用マンガン鋼鋼材、マンガンクロム鋼鋼材を例示できる。クロムモリブデン鋼や低合金鋼では、高圧ガス容器用継目無鋼管、機械構造用合金鋼鋼管、ニッケルクロムモリブデン鋼鋼材、クロムモリブデン鋼材を例示できる。ステンレス鋼では、圧力用ステンレス鋼鍛鋼品、配管用ステンレス鋼管、ステンレス鋼棒、熱間圧延ステンレス鋼板および鋼帯、冷間圧延ステンレス鋼板および鋼帯を例示できる。アルミニウム合金では、アルミニウムおよびアルミニウム合金の板、条、棒、線、継目無管、鍛造品を例示できる。また、炭素鋼に対しては、焼きなまし、焼きならし、マンガン鋼に対しては、焼きならし、焼き入れ焼きもどし、クロムモリブデン鋼や低合金鋼に対しては、焼き入れ焼きもどし、ステンレス鋼に対しては固溶化処理、アルミニウム合金に対しては、焼き入れ焼きもどしを施した材料を適用しても良い。さらに、アルミニウム合金に対しては、溶体化処理およびT6時効処理を施したものを適用しても良い。 Moreover, as a tank for high pressure hydrogen, it is preferable that the valve is inserted in the tank liner by insert molding. It is preferable to integrate the valve with the tank liner by insert molding since the airtightness of the high-pressure hydrogen is increased. Here, the valve functions as a high-pressure hydrogen filling port and a discharge port. Examples of the material of the metal part used as the valve include carbon steel, manganese steel, chrome molybdenum steel, stainless steel, and aluminum alloy. Examples of carbon steel include carbon steel pipe for pressure piping, carbon steel pipe for high pressure piping, steel pipe for low temperature piping, and carbon steel for machine structure. Examples of manganese steel include seamless steel pipes for high-pressure gas containers, manganese steel materials for machine structures, and manganese chromium steel materials. Examples of chrome molybdenum steel and low alloy steel include seamless steel pipes for high-pressure gas containers, alloy steel pipes for machine structures, nickel chrome molybdenum steel materials, and chrome molybdenum steel materials. Examples of stainless steel include stainless steel forgings for pressure, stainless steel pipes for piping, stainless steel bars, hot rolled stainless steel plates and steel strips, cold rolled stainless steel plates and steel strips. Examples of the aluminum alloy include aluminum and aluminum alloy plates, strips, bars, wires, seamless pipes, and forged products. For carbon steel, annealing, normalizing, for manganese steel, normalizing, quenching and tempering, for chromium molybdenum steel and low alloy steel, quenching and tempering, stainless steel For the aluminum alloy, a material subjected to hardening and tempering may be applied to the aluminum alloy. Furthermore, for the aluminum alloy, a solution subjected to solution treatment and T6 aging treatment may be applied.
本発明の高圧水素用タンクの最も好ましい態様は、本発明のポリアミド樹脂組成物からなるタンクライナーの表層に、CFRP補強層が積層されてなり、かつ該タンクライナーにバルブがインサートされてなる、高圧水素用タンクである。 The most preferred embodiment of the high-pressure hydrogen tank of the present invention is a high-pressure tank in which a CFRP reinforcing layer is laminated on the surface layer of a tank liner comprising the polyamide resin composition of the present invention, and a valve is inserted into the tank liner. It is a tank for hydrogen.
以下、実施例を挙げて本発明の効果をさらに具体的に説明する。なお、本発明は、下記実施例に限定されるものではない。各実施例および比較例における評価は、次の方法で行った。 Hereinafter, the effects of the present invention will be described more specifically with reference to examples. In addition, this invention is not limited to the following Example. Evaluation in each example and comparative example was performed by the following method.
(1)高圧水素の充填および放圧繰り返し特性(欠陥点)
各実施例および比較例により得られたペレットから、住友重機械工業(株)製射出成形機「SU75DUZ−C250」を用いて、シリンダー温度:240℃、金型温度:80℃、射出速度10mm/秒、保圧15MPa、保圧時間15秒、冷却時間15秒の成形条件で、直径29mm、高さ12.6mmの円柱状試験片を射出成形した。
(1) High-pressure hydrogen filling and depressurization repetition characteristics (defects)
From the pellets obtained in each Example and Comparative Example, using an injection molding machine “SU75DUZ-C250” manufactured by Sumitomo Heavy Industries, Ltd., cylinder temperature: 240 ° C., mold temperature: 80 ° C., injection speed 10 mm / A cylindrical test piece having a diameter of 29 mm and a height of 12.6 mm was injection-molded under molding conditions of a second, a holding pressure of 15 MPa, a holding pressure time of 15 seconds, and a cooling time of 15 seconds.
得られた試験片について、ヤマト科学(株)製「TDM1000−IS」を用いてX線CT解析を行い、欠陥点の有無を観察した。欠陥点のない試験片をオートクレーブに入れた後、オートクレーブ中に水素ガスを圧力30MPaまで3分間かけて注入し、2時間保持した後、1分間かけて常圧になるまで減圧した。これを1サイクルとして700サイクル繰り返した。700サイクル繰り返し後の試験片について、ヤマト科学(株)製「TDM1000−IS」を用いてX線CT解析を行い、10μm以上の欠陥点の有無を観察した。 The obtained specimen was subjected to X-ray CT analysis using “TDM1000-IS” manufactured by Yamato Scientific Co., Ltd., and the presence or absence of defect points was observed. After putting a test piece having no defect in the autoclave, hydrogen gas was injected into the autoclave to a pressure of 30 MPa over 3 minutes, held for 2 hours, and then reduced to normal pressure over 1 minute. This was repeated for 700 cycles as one cycle. The test piece after 700 cycles was subjected to X-ray CT analysis using “TDM1000-IS” manufactured by Yamato Scientific Co., Ltd., and the presence or absence of defect points of 10 μm or more was observed.
(2)ポリアミド樹脂組成物の降温結晶化温度
各実施例および比較例により得られたペレットについて、示差走査熱量計(パーキンエルマー社製DSC−7)を用い、2点校正(インジウム、鉛)、ベースライン補正を行った後、サンプル量を8〜10mgとして、昇温速度20℃/分の条件で昇温して得られる融解曲線の最大値を示す温度より15℃高い温度で1分間保持した後、降温速度20℃/分の条件で30℃まで冷却した。この冷却工程において観測された結晶化発熱ピーク温度を降温結晶化温度とした。
(2) Decreasing crystallization temperature of polyamide resin composition About pellets obtained in each example and comparative example, using a differential scanning calorimeter (DSC-7 manufactured by Perkin Elmer), two-point calibration (indium, lead), After performing the baseline correction, the sample amount was set to 8 to 10 mg, and held for 1 minute at a temperature 15 ° C. higher than the temperature showing the maximum value of the melting curve obtained by heating at a heating rate of 20 ° C./min. Then, it cooled to 30 degreeC on the conditions of temperature-fall rate 20 degree-C / min. The peak temperature of the crystallization exotherm observed in this cooling step was defined as the cooling crystallization temperature.
(3)離型性
各実施例および比較例により得られたペレットから、住友重機械工業(株)製射出成形機「SE75DUZ−C250」を用いて、シリンダー温度:240℃、金型温度:80℃、射出速度:40mm/秒、保圧:20MPa、冷却時間:20秒の成形条件で、80mm×80mm×厚み3mmの角板成形品を射出成形した。射出成形時に金型への引っ付きの有無を確認した。
(3) Releasability Cylinder temperature: 240 ° C., mold temperature: 80 from pellets obtained in each example and comparative example, using an injection molding machine “SE75DUZ-C250” manufactured by Sumitomo Heavy Industries, Ltd. A square plate molded product of 80 mm × 80 mm × thickness 3 mm was injection molded under the molding conditions of ° C., injection speed: 40 mm / second, holding pressure: 20 MPa, and cooling time: 20 seconds. The presence or absence of sticking to the mold was confirmed during injection molding.
(4)耐ヒートサイクル性
各実施例および比較例により得られたペレットを、日精樹脂工業(株)製射出成形機「NEX1000」を用いて、シリンダー温度:240℃、金型温度:80℃、射出速度100mm/秒、冷却時間20秒の成形条件で、47mm×47mm×27mmの金属コアに厚み1.5mmでオーバーモールドした。
(4) Heat cycle resistance The pellets obtained in each Example and Comparative Example were manufactured using an injection molding machine “NEX1000” manufactured by Nissei Plastic Industry Co., Ltd., cylinder temperature: 240 ° C., mold temperature: 80 ° C., Under molding conditions of an injection speed of 100 mm / second and a cooling time of 20 seconds, a metal core of 47 mm × 47 mm × 27 mm was overmolded with a thickness of 1.5 mm.
得られた金属/樹脂複合成形品3個を、温度−60℃で1時間静置した後、90℃で1時間静置し、複合成形品を目視観察して割れの有無を判断した。この操作を繰り返し、3個の複合成形品が全て割れるサイクル数が500回以上のものをA、200回〜499回のものをB、199回以下のものをCとした。 The obtained three metal / resin composite molded articles were allowed to stand at a temperature of −60 ° C. for 1 hour, and then left at 90 ° C. for 1 hour, and the composite molded article was visually observed to determine the presence or absence of cracks. This operation was repeated, and the number of cycles in which all three composite molded articles were broken was 500 or more, A was 200 to 499, B was 199, and C was 199.
(5)耐衝撃性
各実施例および比較例により得られたペレットから、住友重機械工業(株)製射出成形機「SE75DUZ−C250」を用いて、シリンダー温度:240℃、金型温度:80℃、射出速度:40mm/秒、保圧:20MPa、冷却時間:20秒の成形条件で、ASTM D256準拠のノッチ付きIzod衝撃成形片を射出成形した。
(5) Impact resistance Cylinder temperature: 240 ° C., mold temperature: 80, using an injection molding machine “SE75DUZ-C250” manufactured by Sumitomo Heavy Industries, Ltd. from the pellets obtained in each example and comparative example. An Izod impact molded piece with a notch conforming to ASTM D256 was injection molded under the molding conditions of ° C., injection speed: 40 mm / second, holding pressure: 20 MPa, and cooling time: 20 seconds.
得られたノッチ付きIzod衝撃成形片7本について、ASTM D256に従い、23℃にて耐衝撃性(ノッチ付きIzod衝撃強度)を評価した。7本測定した平均の値を耐衝撃性とした。 The seven notched Izod impact molded pieces obtained were evaluated for impact resistance (notched Izod impact strength) at 23 ° C. according to ASTM D256. The average value of the seven measured was taken as impact resistance.
各実施例および比較例に用いた原料と略号を以下に示す。
PA6:ポリアミド6樹脂(融点223℃、樹脂濃度0.01g/mlの98%濃硫酸溶液中25℃における相対粘度2.70)
PA66:ポリアミド66樹脂(融点263℃、樹脂濃度0.01g/mlの98%濃硫酸溶液中25℃における相対粘度2.70)
PA6/PA66共重合体:ポリアミド6/ポリアミド66共重合体(融点190℃、樹脂濃度0.01g/mlの98%濃硫酸溶液中25℃における相対粘度4.20)
アミド系ワックス1:エチレンジアミン・ステアリン酸・セバシン酸重縮合物「“ライトアマイド ”WH−215」(共栄社化学(株)製、融点215℃)
アミド系ワックス2:エチレンジアミン・ステアリン酸・セバシン酸重縮合物「“ライトアマイド ”WH−255」(共栄社化学(株)製、融点255℃)
脂肪酸エステル:エチレングリコールジモンタネート「“Licowax” E」(クラリアントジャパン(株)製)
有機核剤:N,N’,N”−トリス(2−メチルシクロヘキサン−1−イル)プロパン−1−2−3トリイルカルボキサミド「“リカクリア”(登録商標)PC−1」(新日本理化(株)製)
無機核剤:タルク「“MicroAce”(登録商標)P−6」(日本タルク(株)製、メジアン径(D50)4.0μm)
耐衝撃材1:無水マレイン酸変性エチレン/1−ブテン共重合体「“タフマー”(登録商標)MH7020」(三井化学(株)製)
耐衝撃材2:グリシジルメタクリレート変性ポリエチレン共重合体「“ボンドファースト”(登録商標)7L」(住友化学(株)製)
耐衝撃材3:アイオノマー「“ハイミラン”(登録商標)1706」(デュポン(株)製)。
耐衝撃材4:無水マレイン酸変性エチレン/1−ブテン共重合体「“タフマー”(登録商標)MH5040」(三井化学(株)製)
The raw materials and abbreviations used in each example and comparative example are shown below.
PA6: polyamide 6 resin (melting point 223 ° C., relative viscosity 2.70 at 25 ° C. in 98% concentrated sulfuric acid solution having a resin concentration of 0.01 g / ml)
PA66: polyamide 66 resin (melting point 263 ° C., relative viscosity 2.70 at 25 ° C. in 98% concentrated sulfuric acid solution having a resin concentration of 0.01 g / ml)
PA6 / PA66 copolymer: Polyamide 6 / polyamide 66 copolymer (melting point 190 ° C., relative viscosity 4.20 at 25 ° C. in 98% concentrated sulfuric acid solution having a resin concentration of 0.01 g / ml)
Amide wax 1: ethylenediamine / stearic acid / sebacic acid polycondensate ““ light amide ”WH-215” (manufactured by Kyoeisha Chemical Co., Ltd., melting point 215 ° C.)
Amide wax 2: ethylenediamine / stearic acid / sebacic acid polycondensate ““ light amide ”WH-255” (manufactured by Kyoeisha Chemical Co., Ltd., melting point 255 ° C.)
Fatty acid ester: Ethylene glycol dimontanate “Licowax” E (manufactured by Clariant Japan Co., Ltd.)
Organic nucleating agent: N, N ′, N ″ -tris (2-methylcyclohexane-1-yl) propane-1-3-3 triylcarboxamide ““ Rikaclear ”(registered trademark) PC-1” (New Nippon Rika ( Made by Co., Ltd.)
Inorganic nucleating agent: Talc "" MicroAce "(registered trademark) P-6" (Nippon Talc Co., Ltd., median diameter (D50) 4.0 [mu] m)
Impact-resistant material 1: maleic anhydride-modified ethylene / 1-butene copolymer “Toughmer (registered trademark) MH7020” (manufactured by Mitsui Chemicals, Inc.)
Impact-resistant material 2: Glycidyl methacrylate-modified polyethylene copolymer “Bond First” (registered trademark) 7L (manufactured by Sumitomo Chemical Co., Ltd.)
Impact-resistant material 3: Ionomer “High Milan” (registered trademark) 1706 (manufactured by DuPont).
Impact-resistant material 4: maleic anhydride-modified ethylene / 1-butene copolymer “Toughmer (registered trademark) MH5040” (manufactured by Mitsui Chemicals, Inc.)
[実施例1〜9、比較例1〜7]
表1および表2記載の各原料を、シリンダー温度を240℃に設定し、ニーディングゾーンを1つ設けたスクリューアレンジとし、スクリュー回転数を150rpmとした2軸スクリュー押出機(JSW社製TEX30α−35BW−7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さである))に供給して溶融混練した。20kg/hの速度でダイから吐出されたガットを、10℃に温調した水を満たした冷却バス中を10秒間かけて通過させることにより急冷した後、ストランドカッターでペレタイズし、ペレットを得た。得られたペレットを、真空乾燥機で、温度80℃、12時間真空乾燥し、乾燥後ペレットを用いて、前述の方法により評価した結果を表1および表2に記載した。
[Examples 1-9, Comparative Examples 1-7]
Each raw material described in Table 1 and Table 2 is a screw arrangement in which the cylinder temperature is set to 240 ° C., one kneading zone is provided, and the screw rotational speed is 150 rpm (TEX30α- manufactured by JSW) 35BW-7V) (L / D = 45 (where L is the length from the raw material supply port to the discharge port)) and melt-kneaded. The gut discharged from the die at a rate of 20 kg / h was rapidly cooled by passing through a cooling bath filled with water adjusted to 10 ° C. over 10 seconds, and then pelletized with a strand cutter to obtain pellets. . The obtained pellets were vacuum-dried with a vacuum dryer at a temperature of 80 ° C. for 12 hours, and the results of evaluation using the pellets after drying were described in Tables 1 and 2.
以上の結果から、ポリアミド6樹脂(A)とアミド系ワックス(B)を配合して得られたポリアミド樹脂組成物は結晶化温度が高く、溶融状態からの結晶化が早く進むので結晶化速度が速くなり、かかるポリアミド樹脂組成物を成形して得られる成形品は、高圧水素の充填および放圧を繰り返しても欠陥点の発生が抑制されており、かつ離型性に優れることがわかった。 From the above results, the polyamide resin composition obtained by blending the polyamide 6 resin (A) and the amide wax (B) has a high crystallization temperature, and the crystallization from the molten state proceeds quickly, so the crystallization speed is high. It has been found that a molded product obtained by molding such a polyamide resin composition is fast, and even when high-pressure hydrogen filling and releasing pressure are repeated, generation of defects is suppressed and the mold release property is excellent.
さらに、耐衝撃材(C)を配合して得られたポリアミド樹脂組成物を成形して得られる成形品は、耐ヒートサイクル性に優れていることがわかった。 Furthermore, it turned out that the molded article obtained by shape | molding the polyamide resin composition obtained by mix | blending an impact-resistant material (C) is excellent in heat cycle resistance.
本発明のポリアミド樹脂組成物は、結晶化温度が高く、溶融状態からの結晶化が早く進むので結晶化速度が速くなり、高圧水素の充填および放圧を繰り返しても欠陥点の発生が抑制され、さらに射出成形で重要である離型性に優れる。本発明のポリアミド樹脂組成物を成形してなる成形品は、これらの特性を活かして高圧水素に触れる成形品に広く用いることができる。
The polyamide resin composition of the present invention has a high crystallization temperature, and the crystallization from a molten state progresses quickly, so that the crystallization speed increases, and the occurrence of defect points is suppressed even when high-pressure hydrogen filling and releasing are repeated. In addition, it has excellent mold release, which is important in injection molding. Molded articles formed by molding the polyamide resin composition of the present invention can be widely used for molded articles that come into contact with high-pressure hydrogen utilizing these characteristics.
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