JP6835160B2 - Glass plate protection resin - Google Patents
Glass plate protection resin Download PDFInfo
- Publication number
- JP6835160B2 JP6835160B2 JP2019148895A JP2019148895A JP6835160B2 JP 6835160 B2 JP6835160 B2 JP 6835160B2 JP 2019148895 A JP2019148895 A JP 2019148895A JP 2019148895 A JP2019148895 A JP 2019148895A JP 6835160 B2 JP6835160 B2 JP 6835160B2
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- JP
- Japan
- Prior art keywords
- component
- mass
- parts
- glass plate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011521 glass Substances 0.000 title claims description 43
- 239000011347 resin Substances 0.000 title claims description 33
- 229920005989 resin Polymers 0.000 title claims description 33
- -1 phosphoric acid compound Chemical class 0.000 claims description 25
- 239000011342 resin composition Substances 0.000 claims description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 13
- 239000000178 monomer Substances 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 6
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- 239000005977 Ethylene Substances 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 5
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims description 5
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 2
- 238000013329 compounding Methods 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 13
- 239000002253 acid Substances 0.000 description 12
- 239000007822 coupling agent Substances 0.000 description 10
- 229910019142 PO4 Inorganic materials 0.000 description 9
- 239000010452 phosphate Substances 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- 239000006087 Silane Coupling Agent Substances 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 239000006059 cover glass Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- SEILKFZTLVMHRR-UHFFFAOYSA-N 2-phosphonooxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(O)=O SEILKFZTLVMHRR-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000005345 chemically strengthened glass Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- YOQPKXIRWPWFIE-UHFFFAOYSA-N ctk4c8335 Chemical compound CC(=C)C(=O)OCCOP(=O)=O YOQPKXIRWPWFIE-UHFFFAOYSA-N 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 150000004053 quinones Chemical class 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- HIQAWCBKWSQMRQ-UHFFFAOYSA-N 16-methylheptadecanoic acid;2-methylprop-2-enoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O HIQAWCBKWSQMRQ-UHFFFAOYSA-N 0.000 description 1
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 1
- GKZPEYIPJQHPNC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GKZPEYIPJQHPNC-UHFFFAOYSA-N 0.000 description 1
- UCSGWEMRGIONEW-UHFFFAOYSA-N 2-(2-chlorophenyl)-4,5-bis(2-methoxyphenyl)-1h-imidazole Chemical class COC1=CC=CC=C1C1=C(C=2C(=CC=CC=2)OC)NC(C=2C(=CC=CC=2)Cl)=N1 UCSGWEMRGIONEW-UHFFFAOYSA-N 0.000 description 1
- NSWNXQGJAPQOID-UHFFFAOYSA-N 2-(2-chlorophenyl)-4,5-diphenyl-1h-imidazole Chemical class ClC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 NSWNXQGJAPQOID-UHFFFAOYSA-N 0.000 description 1
- UIHRWPYOTGCOJP-UHFFFAOYSA-N 2-(2-fluorophenyl)-4,5-diphenyl-1h-imidazole Chemical class FC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 UIHRWPYOTGCOJP-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XIOGJAPOAUEYJO-UHFFFAOYSA-N 2-(2-methoxyphenyl)-4,5-diphenyl-1h-imidazole Chemical class COC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 XIOGJAPOAUEYJO-UHFFFAOYSA-N 0.000 description 1
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical class C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 1
- SNFCQJAJPFWBDJ-UHFFFAOYSA-N 2-(4-methoxyphenyl)-4,5-diphenyl-1h-imidazole Chemical class C1=CC(OC)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 SNFCQJAJPFWBDJ-UHFFFAOYSA-N 0.000 description 1
- KIWRLBQZUHYWJI-UHFFFAOYSA-N 2-[hydroxy(phenoxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOP(=O)(O)OC1=CC=CC=C1 KIWRLBQZUHYWJI-UHFFFAOYSA-N 0.000 description 1
- IXAZNYYEGLSHOS-UHFFFAOYSA-N 2-aminoethanol;phosphoric acid Chemical compound NCCO.OP(O)(O)=O IXAZNYYEGLSHOS-UHFFFAOYSA-N 0.000 description 1
- 125000004182 2-chlorophenyl group Chemical group [H]C1=C([H])C(Cl)=C(*)C([H])=C1[H] 0.000 description 1
- VPCUASPSUAEJFE-UHFFFAOYSA-N 2-diphenoxyphosphoryloxyethyl 2-methylprop-2-enoate Chemical compound C=1C=CC=CC=1OP(=O)(OCCOC(=O)C(=C)C)OC1=CC=CC=C1 VPCUASPSUAEJFE-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical class C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- XESZUVZBAMCAEJ-UHFFFAOYSA-N 4-tert-butylcatechol Chemical compound CC(C)(C)C1=CC=C(O)C(O)=C1 XESZUVZBAMCAEJ-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical class C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- MGXHYQAQEKLYFL-UHFFFAOYSA-N C=CC(OC(COCCOCCOCCO)O)=O.N=C=O Chemical compound C=CC(OC(COCCOCCOCCO)O)=O.N=C=O MGXHYQAQEKLYFL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- 125000000641 acridinyl group Chemical group C1(=CC=CC2=NC3=CC=CC=C3C=C12)* 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N benzo-alpha-pyrone Natural products C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229940072282 cardura Drugs 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229960000956 coumarin Drugs 0.000 description 1
- 235000001671 coumarin Nutrition 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical group [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- VTIXMGZYGRZMAW-UHFFFAOYSA-N ditridecyl hydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)OCCCCCCCCCCCCC VTIXMGZYGRZMAW-UHFFFAOYSA-N 0.000 description 1
- XHWQYYPUYFYELO-UHFFFAOYSA-N ditridecyl phosphite Chemical compound CCCCCCCCCCCCCOP([O-])OCCCCCCCCCCCCC XHWQYYPUYFYELO-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- RUZYUOTYCVRMRZ-UHFFFAOYSA-N doxazosin Chemical compound C1OC2=CC=CC=C2OC1C(=O)N(CC1)CCN1C1=NC(N)=C(C=C(C(OC)=C2)OC)C2=N1 RUZYUOTYCVRMRZ-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- LEVJVKGPFAQPOI-UHFFFAOYSA-N phenylmethanone Chemical compound O=[C]C1=CC=CC=C1 LEVJVKGPFAQPOI-UHFFFAOYSA-N 0.000 description 1
- 125000002270 phosphoric acid ester group Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Macromonomer-Based Addition Polymer (AREA)
- Surface Treatment Of Glass (AREA)
Description
本発明は、光硬化性樹脂組成物及びそれを用いたガラス板保護用樹脂に関する。 The present invention relates to a photocurable resin composition and a glass plate protective resin using the same.
スマートフォンやタブレットは大画面化と軽量化を目的として薄型化が進んでいる。それに伴い、使用されるカバーガラスも薄型化が進んでいる。そのためカバーガラスには強度の高い化学強化ガラスが広く採用されている。一般的にガラスは製造工程中の接触や衝撃により端面にクラックが発生することがある。化学強化ガラスではこのクラックにより著しく強度が低下することがある。また、クラックによって割れが発生し、歩留まりが低下することが知られている。そこで、端面に樹脂を塗布することで接触や衝撃からガラスを保護し、クラックの発生を防止する方法が開発されている(例えば、特許文献1,2参照)。 Smartphones and tablets are becoming thinner for the purpose of increasing the screen size and weight. Along with this, the cover glass used is also becoming thinner. Therefore, highly strong chemically strengthened glass is widely used for the cover glass. In general, glass may have cracks on its end face due to contact or impact during the manufacturing process. In chemically strengthened glass, the strength may be significantly reduced due to this crack. It is also known that cracks cause cracks and reduce the yield. Therefore, a method has been developed in which a resin is applied to the end face to protect the glass from contact and impact and prevent the occurrence of cracks (see, for example, Patent Documents 1 and 2).
樹脂をガラスに塗布することでガラスを保護しようとする方法は開発されているが、端面に塗布することで接触や衝撃からガラスを保護する目的に用いて好適な具体的な樹脂の特性や組成は明らかになっていない。
そこで、本発明では、(1)ガラスに対して強固に接着し、(2)作業上の観点からタックが無く、(3)ガラスを衝撃から保護するための硬さを持つという、これら3つの特性を備えた光硬化性樹脂組成物及びこの光硬化性樹脂組成物を用いたガラス板保護用樹脂を提供することを目的とする。
Although methods have been developed to protect the glass by applying the resin to the glass, specific resin properties and compositions suitable for use in protecting the glass from contact and impact by applying the resin to the end face have been developed. Is not clear.
Therefore, in the present invention, these three are (1) firmly adhered to the glass, (2) have no tack from the viewpoint of work, and (3) have hardness for protecting the glass from impact. An object of the present invention is to provide a photocurable resin composition having characteristics and a glass plate protective resin using the photocurable resin composition.
上記目的を達成するために、本発明者らは、以下によって課題を解決することができることを見出した。
即ち、本発明は、[1](A)アクリル基を有する単量体、(B)重量平均分子量が800〜10000の重合性不飽和基を有するアクリルオリゴマー、(C)分子中に二重結合を有するリン酸化合物である単量体及び(D)光重合開始剤を含有してなる光硬化性樹脂組成物に関する。
また、本発明は、[2](B)成分がウレタンオリゴマーを含有する上記[1]に記載の光硬化性樹脂組成物に関する。
更に、本発明は、[3]上記[1]又は[2]に記載の光硬化性樹脂組成物を用いたガラス板保護用樹脂に関する。
In order to achieve the above object, the present inventors have found that the problem can be solved by the following.
That is, in the present invention, [1] (A) a monomer having an acrylic group, (B) an acrylic oligomer having a polymerizable unsaturated group having a weight average molecular weight of 800 to 10,000, and (C) a double bond in the molecule. The present invention relates to a photocurable resin composition containing a monomer which is a phosphoric acid compound having the above and (D) a photopolymerization initiator.
The present invention also relates to the photocurable resin composition according to the above [1], wherein the component [2] (B) contains a urethane oligomer.
Further, the present invention relates to a resin for protecting a glass plate using the photocurable resin composition according to [3] the above [1] or [2].
本発明によれば、ガラスに対して強固に接着し、タックが無いため作業性に優れ、ガラスを衝撃から保護するための硬さを持った光硬化性樹脂組成物及びこの光硬化性樹脂組成物を用いたガラス板保護用樹脂を提供することができる。 According to the present invention, a photocurable resin composition that adheres firmly to glass, has excellent workability because there is no tack, and has hardness for protecting the glass from impact, and the photocurable resin composition. It is possible to provide a resin for protecting a glass plate using an object.
以下に本発明をその好適な実施形態に即して詳細に説明する。
本実施形態の光硬化性樹脂組成物は、(A)アクリル基を有する単量体を含有する。アクリル樹脂は硬化速度が速いことから、アクリル基を有する単量体を含有することで、短時間硬化を必要とする光硬化性樹脂組成物として好適に使用できる。
本実施形態に用いられる(A)アクリル基を有する単量体としては、2−ヒドロオキシエチルメタクリレート、2−ヒドロオキシプロピルメタクリレート、メチルメタクリレート、エチルメタクリレート、ラウリルメタクリレート、メタクリル酸とカージュラE−10(シェルケミカルズ社製、高級脂肪酸のグリシジルエステルの商品名)の反応物等の1官能性のメタクリル酸エステル、エチレングリコールジメタクリレート、ジエチレングリコールジメタクリレート、1,6−ヘキサンジオールジメタクリレート等の2官能性のメタクリル酸エステル、トリメチロールプロパントリメタクリレート等の3官能性のメタクリル酸エステル、メチルアクリレート、エチルアクリレート、ラウリルアクリレート、2−ヒドロオキシエチルアクリレート、2−ヒドロオキシプロピルアクリレート、アクリル酸とカージュラE−10の反応物等の1官能性のアクリル酸エステル、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、1,6−ヘキサンジオールジアクリレート等の2官能のアクリル酸エステル、トリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレート等の3官能性のアクリル酸エステル、ペンタエリスリトールテトラアクリレート等の4官能性のアクリル酸エステル、ペンタエリスリトールヘキサアクリレート等の6官能性のアクリル酸エステルなどが用いられ、これらの2種以上を組み合わせて使用できる。
Hereinafter, the present invention will be described in detail according to the preferred embodiment thereof.
The photocurable resin composition of the present embodiment contains (A) a monomer having an acrylic group. Since the acrylic resin has a high curing rate, it can be suitably used as a photocurable resin composition that requires short-time curing by containing a monomer having an acrylic group.
Examples of the (A) acrylic group-containing monomer used in the present embodiment include 2-hydrooxyethyl methacrylate, 2-hydrooxypropyl methacrylate, methyl methacrylate, ethyl methacrylate, lauryl methacrylate, methacrylic acid and Cardura E-10 ("Acrylate". Bifunctional methacrylic acid ester such as a reaction product of glycidyl ester of higher fatty acid manufactured by Shell Chemicals, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, 1,6-hexanediol dimethacrylate, etc. Trifunctional methacrylic acid esters such as methacrylic acid ester and trimethylolpropane trimethacrylate, methyl acrylate, ethyl acrylate, lauryl acrylate, 2-hydrooxyethyl acrylate, 2-hydrooxypropyl acrylate, acrylic acid and Cadula E-10. Bifunctional acrylic acid esters such as monofunctional acrylic acid esters such as reactants, ethylene glycol diacrylates, diethylene glycol diacrylates, 1,6-hexanediol diacrylates, trimethylol propantriacrylates, pentaerythritol triacrylates, etc. Trifunctional acrylic acid esters, tetrafunctional acrylic acid esters such as pentaerythritol tetraacrylate, and hexafunctional acrylic acid esters such as pentaerythritol hexaacrylate are used, and two or more of these can be used in combination. ..
本実施形態の光硬化性樹脂組成物は、(B)重量平均分子量が800〜10000の重合性不飽和基を有するアクリルオリゴマーを含有する。(A)成分とのバランスにもよるが、硬化速度、樹脂の粘度及び塗膜の可とう性の点から、前記アクリルオリゴマーの重量平均分子量が800〜10000であることが好ましい。
なお、本明細書における重量平均分子量は、ゲルパーミエーションクロマトグラフィー法(GPC)により測定され、標準ポリスチレンを用いて作成した検量線により換算された値である。
本実施形態に用いられる(B)重量平均分子量が800〜10000の重合性不飽和基を有するアクリルオリゴマーとして、例えば、ウレタン結合を有する(メタ)アクリレート化合物のウレタンオリゴマーが例示可能である。これらは1種を単独で又は2種以上を組み合わせて用いることが出来る。硬化物の機械特性のコントロールが容易なこと、ガラスとの密着性が良好であることから、前記(B)成分がウレタンオリゴマーを含有することが好ましい。
ウレタンオリゴマーとしては、β位にOH基を有する(メタ)アクリルモノマーとイソホロンジイソシアネート、2,6−トルエンジイソシアネート、2,4−トルエンジイソシアネート、1,6−ヘキサメチレンジイソシアネート等のジイソシアネート化合物との付加反応物、トリス((メタ)アクリロキシテトラエチレングリコールイソシアネート)ヘキサメチレンイソシアヌレート、EO変性ウレタンジ(メタ)アクリレート、EO又はPO変性ウレタンジ(メタ)アクリレート、カルボキシル基含有ウレタン(メタ)アクリレートなどが挙げられる。これらは1種を単独で又は2種以上を組み合わせて用いることができる。
The photocurable resin composition of the present embodiment contains (B) an acrylic oligomer having a polymerizable unsaturated group having a weight average molecular weight of 800 to 10,000. Although it depends on the balance with the component (A), the weight average molecular weight of the acrylic oligomer is preferably 800 to 10000 from the viewpoint of curing speed, viscosity of resin and flexibility of coating film.
The weight average molecular weight in the present specification is a value measured by gel permeation chromatography (GPC) and converted by a calibration curve prepared using standard polystyrene.
As the acrylic oligomer (B) having a polymerizable unsaturated group having a weight average molecular weight of 800 to 10,000 used in the present embodiment, for example, a urethane oligomer of a (meth) acrylate compound having a urethane bond can be exemplified. These can be used alone or in combination of two or more. It is preferable that the component (B) contains a urethane oligomer because the mechanical properties of the cured product can be easily controlled and the adhesion to the glass is good.
As the urethane oligomer, an addition reaction between a (meth) acrylic monomer having an OH group at the β-position and a diisocyanate compound such as isophorone diisocyanate, 2,6-toluene diisocyanate, 2,4-toluene diisocyanate, and 1,6-hexamethylene diisocyanate. Examples thereof include tris ((meth) acryloxytetraethylene glycol isocyanate) hexamethylene isocyanurate, EO-modified urethane di (meth) acrylate, EO or PO-modified urethane di (meth) acrylate, and carboxyl group-containing urethane (meth) acrylate. These can be used alone or in combination of two or more.
本実施形態の光硬化性樹脂組成物は、(C)分子中に二重結合を有するリン酸化合物を含有する。前記(C)成分は、分子中に二重結合を有することで樹脂組成物中に含有されるアクリル基と反応し、重合することができる。また、リン酸は高い極性を有するため、基材に対して強固に接着することができる。
本実施形態に用いられる(C)分子中に二重結合を有するリン酸化合物である単量体はリン酸基又はリン酸エステル基を有するエチレン性不飽和単量体、好適にはリン酸基又はリン酸エステル基を有する(メタ)アクリレート、アリル化合物であり、具体的には、モノ(2−アクリロイルオキシエチル)アシッドホスフェート、モノ(2−メタクリロイルオキシエチル)アシッドホスフェート、ジフェニル(2−アクリロイルオキシエチル)ホスフェート、ジフェニル(2−メタクリロイルオキシエチル)ホスフェート、フェニル(2−アクリロイルオキシエチル)ホスフェート、アシッド・ホスホオキシエチルメタクリレート、メタクロイル・オキシエチルアシッドホスフェート・モノエタノールアミン塩、3−クロロ−2−アシッド・ホスホオキシプロピルメタクリレート、アシッド・ホスホオキシポリオキシエチレングリコールモノメタクリレート、アシッド・ホスホオキシポリオキシプロピレングリコールメタクリレート、(メタ)アクリロイルオキシエチルアシッドホスフェート、(メタ)アクリロイルオキシプロピルアシッドホスフェート、(メタ)アクリロイルオキシ−2−ヒドロキシプロピルアシッドホスフェート、(メタ)アクリロイルオキシ−3−ヒドロキシプロピルアシッドホスフェート、(メタ)アクリロイルオキシ−3−クロロ−2−ヒドロキシプロピルアシッドホスフェート、アリルアルコールアシッドホスフェート等が挙げられる。中でも、アシッドホスホオキシエチルメタクリレート、2−メタクリロイロキシエチルアシッドホスフェート、含リンメタクリル酸エステル{例えば、CH2=C(CH3)−COO(RO)n−P(=O)(OH)2}が好適である。これらは1種類を単独で又は2種類以上を組み合わせて使用できる。これら(C)成分の配合割合は安定性とガラスへの密着性の点から前記の(A)成分+(B)成分100質量部に対して0.01〜10質量部が好ましく、0.1〜5質量部の範囲がより好ましい。この配合割合が0.01質量部以上であると、ガラスへの接着性が十分となり、10質量部以下であると、得られる樹脂の安定性が良好である。
The photocurable resin composition of the present embodiment contains (C) a phosphoric acid compound having a double bond in the molecule. By having a double bond in the molecule, the component (C) can react with the acrylic group contained in the resin composition and polymerize. Further, since phosphoric acid has high polarity, it can be firmly adhered to the base material.
The monomer used in the present embodiment (C), which is a phosphoric acid compound having a double bond in the molecule, is an ethylenically unsaturated monomer having a phosphoric acid group or a phosphoric acid ester group, preferably a phosphoric acid group. Alternatively, it is a (meth) acrylate or allyl compound having a phosphate ester group, and specifically, mono (2-acryloyloxyethyl) acid phosphate, mono (2-methacryloyloxyethyl) acid phosphate, or diphenyl (2-acryloyloxyethyl). Ethyl) phosphate, diphenyl (2-methacryloyloxyethyl) phosphate, phenyl (2-acryloyloxyethyl) phosphate, acid phosphooxyethyl methacrylate, metachloroyl oxyethyl acid phosphate monoethanolamine salt, 3-chloro-2-acid -Phonooxypropyl methacrylate, acid-phosphooxypolyoxyethylene glycol monomethacrylate, acid-phosphooxypolyoxypropylene glycol methacrylate, (meth) acryloyloxyethyl acid phosphate, (meth) acryloyloxypropyl acid phosphate, (meth) acryloyloxy Examples thereof include -2-hydroxypropyl acid phosphate, (meth) acryloyloxy-3-hydroxypropyl acid phosphate, (meth) acryloyloxy-3-chloro-2-hydroxypropyl acid phosphate, and allyl alcohol acid phosphate. Among them, acid phosphooxyethyl methacrylate, 2-methacryloyloxyethyl acid phosphate, and phosphorus-containing methacrylic acid ester {for example, CH 2 = C (CH 3 ) -COO (RO) n- P (= O) (OH) 2 } Is preferable. These can be used alone or in combination of two or more. The blending ratio of the component (C) is preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the component (A) + component (B) from the viewpoint of stability and adhesion to glass, and is 0.1. A range of ~ 5 parts by mass is more preferable. When the blending ratio is 0.01 parts by mass or more, the adhesiveness to the glass is sufficient, and when it is 10 parts by mass or less, the stability of the obtained resin is good.
本実施形態の光硬化性樹脂組成物は、(D)光重合開始剤を含有する。
本実施形態に用いられる(D)光重合開始剤は、増感剤と呼ばれるものも包含される。かかる光重合開始剤としては、アクリジン又は分子内に少なくとも1つのアクリジニル基を有するアクリジン系化合物、ベンゾフェノン、N,N’−テトラメチル−4,4’−ジアミノベンゾフェノン(ミヒラーケトン)等のN,N−テトラアルキル−4,4’−ジアミノベンゾフェノン、2−ベンジル−2−ジメチルアミノ−1−(4−モルホリノフェニル)−ブタノン−1、2−メチル−1−[4−(メチルチオ)フェニル]−2−モルフォリノ−プロパノン−1等の芳香族ケトン、アルキルアントラキノン等のキノン類、ベンゾイルアルキルエーテル等のベンゾインエーテル化合物、ベンゾイン、アルキルベンゾイン等のベンゾイン化合物、ベンジルジメチルケタール等のベンジル誘導体、2−(o−クロロフェニル)−4,5−ジフェニルイミダゾール二量体、2−(o−クロロフェニル)−4,5−ジ(メトキシフェニル)イミダゾール二量体、2−(o−フルオロフェニル)−4,5−ジフェニルイミダゾール二量体、2−(o−メトキシフェニル)−4,5−ジフェニルイミダゾール二量体、2−(p−メトキシフェニル)−4,5−ジフェニルイミダゾール二量体等の2,4,5−トリアリールイミダゾール二量体、N−フェニルグリシン、N−フェニルグリシン誘導体、クマリン系化合物、オニウム塩などが挙げられる。これらは1種類を単独で又は2種類以上を組み合わせて使用できる。
これら(D)光重合開始剤の配合割合は硬化速度と造膜性、及びタック性の点から前記の(A)成分+(B)成分100質量部に対して0.1〜20質量部が好ましく、1〜15質量部の範囲がより好ましい。この配合割合が0.1質量部以上であると、光硬化が十分となり、20質量部以下であると、得られる硬化物の特性(硬化性及び密着性等)が良好である。
The photocurable resin composition of the present embodiment contains (D) a photopolymerization initiator.
The (D) photopolymerization initiator used in the present embodiment also includes what is called a sensitizer. Examples of such a photopolymerization initiator include aclysine, an acrydin-based compound having at least one acridinyl group in the molecule, and N, N- such as benzophenylone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michler ketone). Tetraalkyl-4,4'-diaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2-methyl-1- [4- (methylthio) phenyl] -2- Aromatic ketones such as morpholino-propanone-1, quinones such as alkylanthraquinone, benzoin ether compounds such as benzoylalkyl ether, benzoin compounds such as benzoin and alkylbenzoin, benzyl derivatives such as benzyldimethylketal, 2- (o-chlorophenyl) ) -4,5-Diphenylimidazole dimer, 2- (o-chlorophenyl) 4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) 4,5-diphenylimidazole dimer 2,4,5-Triaryl such as a compound, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer, etc. Examples thereof include imidazole dimer, N-phenylglycine, N-phenylglycine derivative, coumarin compound, onium salt and the like. These can be used alone or in combination of two or more.
The blending ratio of these (D) photopolymerization initiators is 0.1 to 20 parts by mass with respect to 100 parts by mass of the above-mentioned component (A) + component (B) from the viewpoint of curing speed, film forming property, and tackiness. The range of 1 to 15 parts by mass is preferable, and the range is more preferable. When the blending ratio is 0.1 parts by mass or more, photocuring is sufficient, and when it is 20 parts by mass or less, the characteristics (curability, adhesion, etc.) of the obtained cured product are good.
本実施形態のガラス板保護用樹脂は前記(A)、(B)、(C)及び(D)成分を配合し、加熱溶解することによって得られる。 The glass plate protective resin of the present embodiment is obtained by blending the above components (A), (B), (C) and (D) and heating and dissolving them.
また、本実施形態になるガラス板保護用樹脂には、必要に応じてカップリング剤、重合禁止剤、及び着色剤等を添加することができる。 Further, a coupling agent, a polymerization inhibitor, a colorant and the like can be added to the glass plate protective resin according to the present embodiment, if necessary.
カップリング剤としては、チタネート系カップリング剤及びシラン系カップリング剤があり、チタネート系カップリング剤としては、少なくとも炭素数1〜60のアルキレート基を有するチタネート系カップリング剤、アルキルホスファイト基を有するチタネート系カップリング剤、アルキルホスフェート基を有するチタネート系カップリング剤もしくはアルキルパイロホスフェート基を有するチタネート系カップリング剤等が挙げられる。具体的には、イソプロピルトリイソステアロイルチタネート、イソプロピルトリオクタノイルチタネート、イソプロピルジメタクリルイソステアロイルチタネート、イソプロピルイソステアロイルジアクリルチタネート、イソプロピルトリス(ジオクチルパイロホスフェート)チタネート、テトラオクチルビス(ジトリデシルホスファイト)チタネート、テトラ(2,2−ジアリルオキシメチル−1−ブチル)ビス(ジトリデシル)ホスファイトチタネート、ビス(ジオクチルパイロホスフェート)オキシアセテートチタネート、ビス(ジオクチルパイロホスフェート)エチレンチタネート等が挙げられる。 Coupling agents include titanate-based coupling agents and silane-based coupling agents, and titanate-based coupling agents include titanate-based coupling agents having at least an alkylate group having 1 to 60 carbon atoms and alkylphosphite groups. Examples thereof include a titanate-based coupling agent having an alkyl phosphate group, a titanate-based coupling agent having an alkyl phosphate group, and a titanate-based coupling agent having an alkyl pyrophosphate group. Specifically, isopropyltriisostearoyl titanate, isopropyltrioctanoyl titanate, isopropyldimethacrylisostearoyl titanate, isopropylisostearoyl dialacrylic titanate, isopropyltris (dioctylpyrophosphate) titanate, tetraoctylbis (ditridecylphosphite) titanate. , Tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, bis (dioctylpyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) ethylene titanate and the like.
また、シラン系カップリング剤としては、アミノ系シランカップリング剤、ウレイド系シランカップリング剤、ビニル系シランカップリング剤、メタクリル系シランカップリング剤、エポキシ系シランカップリング剤、メルカプト系シランカップリング剤及びイソシアネート系シランカップリング剤等が挙げられる。具体的には、γ−アミノプロピルトリエトキシシラン、γ−アミノプロピルトリメトキシシラン、N−β−(アミノエチル)−γ−アミノプロピルトリメトキシシラン、γ−フェニルアミノプロピルトリメトキシシラン、ウレイドプロピルトリエトキシシラン、ビニルトリエトキシシラン、ビニルトリメトキシシラン、ビニルトリス(β−メトキシエトキシ)シラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルメチルジメトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−メルカプトプロピルトリメトキシシラン、γ−イソシアネートプロピルトリメトキシシラン等が挙げられ、これらは単独で又は2種以上を組み合わせて使用できる。 The silane-based coupling agents include amino-based silane coupling agents, ureido-based silane coupling agents, vinyl-based silane coupling agents, methacrylic-based silane coupling agents, epoxy-based silane coupling agents, and mercapto-based silane coupling agents. Examples thereof include agents and isocyanate-based silane coupling agents. Specifically, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-phenylaminopropyltrimethoxysilane, ureidopropyltri. Ethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, β- (3,4-epoxycyclohexyl) Examples thereof include ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-isocyanoxidetrimethoxysilane, and these can be used alone or in combination of two or more.
重合禁止剤としては、ハイドロキノン、ハイドロキノンモノメチルエーテル、ベンゾキノン、p−tert−ブチルカテコール、2,6−ジ−tert−ブチル−4−メチルフェノール、ピロガロール等のキノン類、その他一般に使用されているものが用いられる。
消泡剤としては例えば、シリコーン系オイル、フッ素系オイル、ポリカルボン酸系ポリマー等、一般に使用されているものが挙げられる。
本実施形態のガラス板保護用樹脂は、電子部品用カバーガラス等の端面やその周辺部にディスペンサー装置等で塗布され、高圧水銀灯、メタルハライドランプ等を光源としたランプ方式及びLED方式のUV照射装置を用い、必要量の紫外線を照射し硬化させて用いられる。
Polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, benzoquinone, p-tert-butylcatechol, 2,6-di-tert-butyl-4-methylphenol, quinones such as pyrogallol, and other commonly used agents. Used.
Examples of the defoaming agent include those generally used such as silicone-based oil, fluorine-based oil, and polycarboxylic acid-based polymer.
The glass plate protective resin of the present embodiment is applied to the end face of the cover glass for electronic parts and the periphery thereof by a dispenser device or the like, and is a lamp type or LED type UV irradiation device using a high-pressure mercury lamp, a metal halide lamp or the like as a light source. Is used by irradiating a required amount of ultraviolet rays to cure the glass.
以下、実施例及び比較例に基づいて本発明をより具体的に説明するが、本発明は以下の実施例に制限されるものではない。 Hereinafter, the present invention will be described in more detail based on Examples and Comparative Examples, but the present invention is not limited to the following Examples.
[実施例1]
(A−1)成分としてイソボルニルアクリレート37.8質量部、(A−2)成分としてアクリロイルモルホリン4.2質量部、(B−1)成分としてUN−904(根上工業株式会社製、商品名「アートレジンUN−904」、ウレタンアクリレートオリゴマー、重量平均分子量:4900)29質量部、(B−2)成分としてUN−6060S(根上工業株式会社製、商品名「アートレジンUN−6060S」、ウレタンアクリレートオリゴマー、重量平均分子量:6000)29質量部、(C)成分としてエチレンオキサイド変性リン酸ジメタクリレート0.5質量部、(D)成分として(1−ヒドロキシシクロヘキシル)フェニルメタノン10質量部を60℃で加熱攪拌して光硬化性樹脂組成物を得た。
[Example 1]
37.8 parts by mass of isobornyl acrylate as component (A-1), 4.2 parts by mass of acryloylmorpholin as component (A-2), UN-904 (manufactured by Negami Kogyo Co., Ltd.) as component (B-1) Name "Art Resin UN-904", Urethane Acrylate oligomer, Weight Average Molecular Weight: 4900) 29 parts by mass, UN-6060S (manufactured by Negami Kogyo Co., Ltd., Trade Name "Art Resin UN-6060S") as a component (B-2), Urethane acrylate oligomer, weight average molecular weight: 6000) 29 parts by mass, (C) component (C) 0.5 parts by mass of ethylene oxide-modified dimethacrylate, and (D) component (1-hydroxycyclohexyl) 10 parts by mass of phenylmethanone. A photocurable resin composition was obtained by heating and stirring at 60 ° C.
[実施例2]
(B−1)成分としてDPHA−40H(日本化薬株式会社製、商品名、多官能オリゴマー、重量平均分子量:2000)に変えた以外は実施例1と同様にして光硬化性樹脂組成物を得た。
[Example 2]
The photocurable resin composition was prepared in the same manner as in Example 1 except that the component (B-1) was changed to DPHA-40H (manufactured by Nippon Kayaku Co., Ltd., trade name, polyfunctional oligomer, weight average molecular weight: 2000). Obtained.
[比較例1]
実施例1のエチレンオキサイド変性リン酸ジメタクリレート0.5質量部を加えない以外は実施例1と同様にして光硬化性樹脂組成物を得た。
[Comparative Example 1]
A photocurable resin composition was obtained in the same manner as in Example 1 except that 0.5 parts by mass of ethylene oxide-modified dimethacrylate phosphate of Example 1 was not added.
[比較例2]
実施例1のエチレンオキサイド変性リン酸ジメタクリレート0.5質量部をシラン系カップリング剤の3−イソシアネートプロピル−トリエトキシシラン0.5質量部に変更した以外は実施例1と同様にして光硬化性樹脂組成物を得た。
[Comparative Example 2]
Photocuring in the same manner as in Example 1 except that 0.5 part by mass of ethylene oxide-modified dimethacrylate of ethylene oxide of Example 1 was changed to 0.5 part by mass of 3-isocyanatepropyl-triethoxysilane of a silane coupling agent. A sex resin composition was obtained.
[比較例3]
(A)成分として2−ヒドロオキシエチルアクリレート35質量部、ラウリルアクリレート10質量部、(B)成分としてTE−2000(日本曹達株式会社製、商品名、アクリル変性ポリブタジエン樹脂、重量平均分子量:約9000)52質量部、樹脂とガラスの密着性を付与するために(C)成分の代わりにN,N’−テトラエチル−4,4’−ジアミノベンゾフェノン0.2質量部、(D)成分として2−(o−クロロフェニル)−4,5−ジフェニルイミダゾール二量体2.5質量部を60℃で加熱攪拌して光硬化性樹脂組成物を得た。
[Comparative Example 3]
35 parts by mass of 2-hydrooxyethyl acrylate and 10 parts by mass of lauryl acrylate as component (A), TE-2000 (manufactured by Nippon Soda Co., Ltd., trade name, acrylic-modified polybutadiene resin, weight average molecular weight: about 9000) as component (B) ) 52 parts by mass, 0.2 parts by mass of N, N'-tetraethyl-4,4'-diaminobenzophenone instead of component (C) to impart adhesion between resin and glass, 2-as component (D) 2.5 parts by mass of (o-chlorophenyl) -4,5-diphenylimidazole dimer was heated and stirred at 60 ° C. to obtain a photocurable resin composition.
[ガラス接着性]
ソーダガラス(フロートガラス)をベンコット(旭化成せんい株式会社製、商品名(「ベンコット」は、登録商標。))にアセトンを染み込ませたものでよく拭き試験基板1とした(図1(a))。図1(b)に示すようにガラスの面に厚さ25μmのテープを4cmの幅で平行に貼り、ガイド2を形成した。図1(c)に示すようにガイド2を形成した面に樹脂3を垂らし、ガラス棒4で引き伸ばすことで、図1(d)に示すように均一な厚みを持った樹脂膜5を作製した。
アイグラフィックス株式会社製UV照射装置にて上記で作製した樹脂膜の硬化を行った。照射出力は照度計(ウシオ電機株式会社製)にて測定し、照射強度150mW/cm2で総照射量が1000mJ/cm2になるように照射して目的の[樹脂付きガラス板A]を得た。
JIS K−5600の方法に従って塗膜にクロスカットを入れ、100マスの碁盤目を作製した。
上記樹脂付きガラス板をPCT(プレッシャークッカー試験機)に投入し、121℃にて30分間加熱した。PCTより取り出した試験片の水分を拭き取り、80℃の恒温槽に10分間投入することで接着性評価の試験片とした。
上記処理を施した試験片に対し、JIS K−5600−5−6の方法に従ってテープによる剥離試験を行った。ガラス接着性評価は100マス中の残存数で示した。
[Glass adhesiveness]
Soda glass (float glass) was wiped well with Bencot (manufactured by Asahi Kasei Fibers Co., Ltd., product name (“Bencot” is a registered trademark)) soaked with acetone to form test substrate 1 (Fig. 1 (a)). .. As shown in FIG. 1 (b), a tape having a thickness of 25 μm was attached in parallel on the glass surface with a width of 4 cm to form a guide 2. As shown in FIG. 1 (c), the resin 3 was hung on the surface on which the guide 2 was formed and stretched with a glass rod 4 to prepare a resin film 5 having a uniform thickness as shown in FIG. 1 (d). ..
The resin film produced above was cured with a UV irradiation device manufactured by Eye Graphics Co., Ltd. The irradiation output is measured with an irradiance meter (manufactured by Ushio Denki Co., Ltd.), and irradiation is performed so that the total irradiation amount is 1000 mJ / cm 2 with an irradiation intensity of 150 mW / cm 2 to obtain the desired [glass plate A with resin]. It was.
A cross cut was made in the coating film according to the method of JIS K-5600 to prepare a grid of 100 squares.
The glass plate with resin was put into a PCT (pressure cooker tester) and heated at 121 ° C. for 30 minutes. The water content of the test piece taken out from the PCT was wiped off, and the test piece was placed in a constant temperature bath at 80 ° C. for 10 minutes to prepare a test piece for adhesiveness evaluation.
The test piece subjected to the above treatment was subjected to a peeling test with a tape according to the method of JIS K-5600-5-6. The glass adhesiveness evaluation was shown by the number of remaining glass in 100 squares.
[タック性]
ガラス接着性で作製した[樹脂付きガラス板A]について指で触ることでタック性を評価した。べたつきがあるものを「×」べたつきの無いものを「○」で評価した。
[Tackiness]
The tackiness was evaluated by touching the [glass plate A with resin] prepared by glass adhesiveness with a finger. Those with stickiness were evaluated with "x", and those without stickiness were evaluated with "○".
[硬度]
鉛筆硬度試験にて硬さの評価を行った。試験は機械法によってJIS K−5600−5−4に従って行った。本発明においてはガラスの保護効果を認められる鉛筆硬度をHB以上とした。
[hardness]
The hardness was evaluated by a pencil hardness test. The test was carried out according to JIS K-5600-5-4 by the mechanical method. In the present invention, the pencil hardness at which the protective effect of glass is recognized is set to HB or higher.
ガラス接着性、タック性、硬度、硬化時間(液状物である樹脂が硬化によって固化し、流動性がなくなるまでの時間を硬化時間とした。)の評価結果を表1に示した。 Table 1 shows the evaluation results of glass adhesiveness, tackiness, hardness, and curing time (the time until the liquid resin solidifies by curing and loses fluidity is defined as the curing time).
表1に示されるように、実施例に対し比較例ではガラス板保護用樹脂として求められる全ての特性を満たす樹脂が無いことがわかる。 As shown in Table 1, it can be seen that there is no resin satisfying all the characteristics required for the glass plate protective resin in the comparative example as compared with the examples.
上記では、特定の実施形態を示して説明したが、本発明の趣旨及び範囲から逸脱することなく、様々な変更及び置換がなされ得る。したがって、本発明は例示により説明されており、それらには限定されない。 Although the specific embodiments have been described above, various modifications and substitutions can be made without departing from the spirit and scope of the present invention. Therefore, the present invention has been illustrated by way of example and is not limited thereto.
1…試験基板、2…ガイド、3…樹脂、4…ガラス棒、5…樹脂膜。 1 ... test substrate, 2 ... guide, 3 ... resin, 4 ... glass rod, 5 ... resin film.
Claims (5)
前記光硬化性樹脂組成物が、(A)アクリル基を有する単量体、(B)重量平均分子量が800〜10000の重合性不飽和基を有するアクリルオリゴマー、(C)分子中に二重結合を有するリン酸化合物である単量体、及び、(D)光重合開始剤を含有し、
前記(A)成分が、1官能性のアクリル酸エステル及び1官能性のメタクリル酸エステルからなる群より選ばれる少なくとも一種を含み、
前記(B)成分がウレタンオリゴマーを含み、
前記(C)成分の配合割合が、前記(A)成分及び前記(B)成分の合計100質量部に対して0.01〜10質量部であり、
前記(D)成分の配合割合が、前記(A)成分及び前記(B)成分の合計100質量部に対して0.1〜20質量部である、ガラス板保護用樹脂。 A resin for protecting a glass plate using a photocurable resin composition.
The photocurable resin composition has (A) a monomer having an acrylic group, (B) an acrylic oligomer having a polymerizable unsaturated group having a weight average molecular weight of 800 to 10,000, and (C) a double bond in the molecule. It contains a monomer which is a phosphoric acid compound having (D) and (D) a photopolymerization initiator.
The component (A) contains at least one selected from the group consisting of a monofunctional acrylic acid ester and a monofunctional methacrylic acid ester.
The component (B) is seen containing a urethane oligomers,
The blending ratio of the component (C) is 0.01 to 10 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B).
A resin for protecting a glass plate , wherein the compounding ratio of the component (D) is 0.1 to 20 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B).
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Free format text: JAPANESE INTERMEDIATE CODE: R350 |