JP6833489B2 - Molding mold for optical element, molding device for optical element and molding method for optical element - Google Patents

Molding mold for optical element, molding device for optical element and molding method for optical element Download PDF

Info

Publication number
JP6833489B2
JP6833489B2 JP2016239433A JP2016239433A JP6833489B2 JP 6833489 B2 JP6833489 B2 JP 6833489B2 JP 2016239433 A JP2016239433 A JP 2016239433A JP 2016239433 A JP2016239433 A JP 2016239433A JP 6833489 B2 JP6833489 B2 JP 6833489B2
Authority
JP
Japan
Prior art keywords
mold
molding
outer peripheral
optical element
molding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016239433A
Other languages
Japanese (ja)
Other versions
JP2018095493A (en
Inventor
亨宜 木島
亨宜 木島
大吾 平田
大吾 平田
紀明 山崎
紀明 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2016239433A priority Critical patent/JP6833489B2/en
Publication of JP2018095493A publication Critical patent/JP2018095493A/en
Application granted granted Critical
Publication of JP6833489B2 publication Critical patent/JP6833489B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Description

本発明は、光学素子用成形型、光学素子の成形装置および光学素子の成形方法に関する。 The present invention relates to a molding die for an optical element, a molding apparatus for an optical element, and a molding method for an optical element.

従来、レンズ(光学素子)の成形方法として、ガラス素材(成形素材)を配置した一対の金型を加熱し、加熱軟化させたガラス素材を金型によってプレスした後、ガラス素材の転移温度近傍まで冷却したレンズを金型から取り出すレンズの成形方法が知られている。 Conventionally, as a method of molding a lens (optical element), a pair of dies in which a glass material (molding material) is placed is heated, and the heated and softened glass material is pressed by the dies, and then the temperature reaches near the transition temperature of the glass material. A method for molding a lens in which a cooled lens is taken out from a mold is known.

このようなレンズの成形方法において、通常、金型の成形面は鏡面加工等によって高度に平坦化されているため、成形直後はレンズの表面(光学機能面)と金型の成形面とが密着した状態となっている。そのため、金型からレンズが剥離せず、容易に取り出せない場合がある。特に、凹レンズの成形では、凸状の成形面を有する上型によりガラス素材に凹面を形成するため、冷却工程で冷却されたガラス素材が熱収縮し、成形後のレンズの凹面が上型の凸状の成形面に張り付いてしまう現象が発生する。 In such a lens molding method, the mold molding surface is usually highly flattened by mirror processing or the like, so that the lens surface (optical functional surface) and the mold molding surface are in close contact immediately after molding. It is in a state of being. Therefore, the lens may not be peeled off from the mold and may not be easily taken out. In particular, in the molding of a concave lens, since a concave surface is formed on the glass material by an upper mold having a convex molding surface, the glass material cooled in the cooling step is heat-shrinked, and the concave surface of the lens after molding is convex on the upper mold. A phenomenon occurs in which the shape sticks to the molded surface.

そこで、このような張り付き不具合を防止するために、例えば特許文献1では、レンズの外周部を規制する外周規制部材を金型とは別体で設け、その外周規制部材の内周に異径部を設けることにより、温度変化に応じて、ガラス素材の外周部との干渉状態を変化させ、レンズを上型から確実に取り出せるようにした成形方法が提案されている。 Therefore, in order to prevent such sticking defects, for example, in Patent Document 1, an outer peripheral regulating member that regulates the outer peripheral portion of the lens is provided separately from the mold, and a different diameter portion is provided on the inner circumference of the outer peripheral regulating member. A molding method has been proposed in which the state of interference with the outer peripheral portion of the glass material is changed according to a temperature change so that the lens can be reliably taken out from the upper mold.

特開2009−143771号公報Japanese Unexamined Patent Publication No. 2009-143771

しかしながら、特許文献1で提案された成形方法では、レンズのレンズ径が小さい場合は効果を発揮しない可能性がある。すなわち、成形するレンズ径が小さい場合、用いる金型や外周規制部材も小さくなるため、熱膨張および熱収縮の変化量も小さくなる。また、成形するレンズ径が小さい場合、外周規制部材の内周に設ける異径部も小さくなってしまう。従って、特許文献1で提案された成形方法では、金型と外周規制部材との熱膨張差を利用した離型の促進が十分に行われず、ガラス素材の上型への張り付きを防止できなくなり、レンズの取り出しが困難となる場合がある。 However, the molding method proposed in Patent Document 1 may not be effective when the lens diameter of the lens is small. That is, when the diameter of the lens to be molded is small, the mold used and the outer circumference regulating member are also small, so that the amount of change in thermal expansion and contraction is also small. Further, when the diameter of the lens to be molded is small, the different diameter portion provided on the inner circumference of the outer peripheral regulating member also becomes small. Therefore, in the molding method proposed in Patent Document 1, the mold release is not sufficiently promoted by utilizing the difference in thermal expansion between the mold and the outer peripheral regulating member, and the glass material cannot be prevented from sticking to the upper mold. It may be difficult to remove the lens.

本発明は、上記に鑑みてなされたものであって、レンズ径に関わらず、プレス成形後の光学素子の金型への張り付きを防止し、光学素子を容易に取り出すことができる光学素子用成形型、光学素子の成形装置および光学素子の成形方法を提供することを目的とする。 The present invention has been made in view of the above, and regardless of the lens diameter, molding for an optical element that prevents the optical element from sticking to a mold after press molding and allows the optical element to be easily taken out. It is an object of the present invention to provide a mold, an optical element molding apparatus, and an optical element molding method.

上述した課題を解決し、目的を達成するために、本発明に係る光学素子用成形型は、加熱軟化された成形素材を一対の金型によって押圧成形することにより光学素子を成形する光学素子用成形型であって、前記成形素材に凹面を転写するための凸状の第1の転写面を有する第1の金型と、前記第1の金型と対向して配置された、前記第1の金型と対をなす第2の金型と、前記第1の金型とは別体で構成され、前記成形素材に前記凹面の外側の端面を転写するための転写面を有する外周転写部材と、を備え、前記外周転写部材は、前記転写面上に周状に、かつ連続的または間欠的に形成され、前記成形素材にアンカー面を転写するアンカー部を備え、前記外周転写部材は、押圧後の前記成形素材を冷却する際に、前記第1の金型との熱膨張差によって前記第1の転写面と前記凹面との間に隙間を形成することを特徴とする。 In order to solve the above-mentioned problems and achieve the object, the mold for an optical element according to the present invention is for an optical element that molds an optical element by pressing and molding a heat-softened molding material with a pair of molds. The first mold, which is a molding mold and has a convex first transfer surface for transferring a concave surface to the molding material, and the first mold, which is arranged to face the first mold. An outer peripheral transfer member which is composed of a second mold paired with the mold and a separate body from the first mold and has a transfer surface for transferring the outer end surface of the concave surface to the molding material. The outer peripheral transfer member is formed radially and continuously or intermittently on the transfer surface, and includes an anchor portion that transfers the anchor surface to the molding material. When the molding material is cooled after being pressed, a gap is formed between the first transfer surface and the concave surface due to a difference in thermal expansion from the first mold.

また、本発明に係る光学素子用成形型は、上記発明において、前記外周転写部材の熱膨張係数は、前記第1の金型の熱膨張係数よりも小さいことを特徴とする。 Further, the molding die for an optical element according to the present invention is characterized in that, in the above invention, the coefficient of thermal expansion of the outer peripheral transfer member is smaller than the coefficient of thermal expansion of the first mold.

また、本発明に係る光学素子用成形型は、上記発明において、前記外周転写部材を前記第1の金型に固定する円筒状の固定部材を備え、前記固定部材は、前記第1の金型の外周に固定されており、前記固定部材は、前記外周転写部材の軸方向の移動を規制し、かつ前記外周転写部材の径方向の移動を許容するように、前記外周転写部材の外周を保持していることを特徴とする。 Further, in the above invention, the molding die for an optical element according to the present invention includes a cylindrical fixing member for fixing the outer peripheral transfer member to the first mold, and the fixing member is the first mold. The fixing member holds the outer periphery of the outer peripheral transfer member so as to restrict the axial movement of the outer peripheral transfer member and allow the outer peripheral transfer member to move in the radial direction. It is characterized by doing.

また、本発明に係る光学素子用成形型は、上記発明において、前記アンカー部は、前記外周転写部材の前記転写面から前記第2の金型の方向に突出した凸部であることを特徴とする。 Further, the molding die for an optical element according to the present invention is characterized in that, in the above invention, the anchor portion is a convex portion protruding from the transfer surface of the outer peripheral transfer member in the direction of the second mold. To do.

また、本発明に係る光学素子用成形型は、上記発明において、前記凸部の前記転写面からの突出量は、前記第1の転写面の前記転写面からの突出量よりも小さいことを特徴とする。 Further, the molding die for an optical element according to the present invention is characterized in that, in the above invention, the amount of protrusion of the convex portion from the transfer surface is smaller than the amount of protrusion of the first transfer surface from the transfer surface. And.

また、本発明に係る光学素子用成形型は、上記発明において、前記アンカー部は、前記外周転写部材の前記転写面から前記第1の金型の方向に窪んだ凹部であることを特徴とする。 Further, the molding die for an optical element according to the present invention is characterized in that, in the above invention, the anchor portion is a recess recessed in the direction of the first mold from the transfer surface of the outer peripheral transfer member. ..

上述した課題を解決し、目的を達成するために、本発明に係る光学素子の成形装置は、上記発明における光学素子用成形型と、押圧後の成形素材を冷却する際に、前記光学素子用成形型の外周転写部材を加熱することにより、前記外周転写部材に形成されたアンカー部を介して、前記成形素材の前記凹面を径方向外側に押し広げる加熱手段と、を備えることを特徴とする。 In order to solve the above-mentioned problems and achieve the object, the optical element molding apparatus according to the present invention is used for the optical element when cooling the molding die for the optical element and the molding material after pressing. It is characterized by comprising a heating means for spreading the concave surface of the molding material radially outward through an anchor portion formed on the outer peripheral transfer member by heating the outer peripheral transfer member of the molding die. ..

上述した課題を解決し、目的を達成するために、本発明に係る光学素子の成形方法は、加熱軟化された成形素材を一対の金型によって押圧成形することにより光学素子を成形する光学素子の成形方法であって、第1の金型および第2の金型の間に前記成形素材を配置し、前記成形素材を加熱して軟化させる加熱工程と、前記第1の金型および前記第2の金型によって前記成形素材をプレスすることにより、前記第1の金型の第1の転写面によって前記成形素材に凹面を転写し、前記第1の金型とは別体で構成された外周転写部材の転写面によって前記成形素材に前記凹面の外側の端面を転写し、前記転写面上に周状に、かつ連続的または間欠的に形成されたアンカー部によって前記成形素材にアンカー面を転写するプレス転写工程と、前記成形素材を冷却し、その際に、前記外周転写部材と前記第1の金型との熱膨張差によって前記第1の転写面と前記凹面との間に隙間を形成し、成形後の前記光学素子を離型する冷却離型工程と、を含むことを特徴とする。 In order to solve the above-mentioned problems and achieve the object, the method for molding an optical element according to the present invention is an optical element for molding an optical element by pressing and molding a heat-softened molding material with a pair of molds. In the molding method, a heating step of arranging the molding material between the first mold and the second mold and heating and softening the molding material, and the first mold and the second mold. By pressing the molding material with the mold, the concave surface is transferred to the molding material by the first transfer surface of the first mold, and the outer periphery is formed separately from the first mold. The outer end surface of the concave surface is transferred to the molding material by the transfer surface of the transfer member, and the anchor surface is transferred to the molding material by the anchor portion formed circumferentially, continuously or intermittently on the transfer surface. In the press transfer step, the molding material is cooled, and at that time, a gap is formed between the first transfer surface and the concave surface due to the difference in thermal expansion between the outer peripheral transfer member and the first mold. It is characterized by including a cooling mold release step of releasing the optical element after molding.

また、本発明に係る光学素子の成形方法は、上記発明において、前記冷却離型工程において、少なくとも成形後の前記光学素子を離型する前に、前記外周転写部材を加熱することにより、前記アンカー部を介して、前記成形素材の前記凹面を径方向外側に押し広げることを特徴とする。 Further, in the method for molding an optical element according to the present invention, in the above invention, the anchor is formed by heating the outer peripheral transfer member at least before the optical element is molded after molding in the cooling and molding step. It is characterized in that the concave surface of the molding material is expanded outward in the radial direction through the portion.

本発明によれば、押圧後の成形素材を冷却する際に、外周転写部材のアンカー部によって、成形素材の径方向の熱収縮を阻害し、かつ上型転写面と凹面との間に隙間を形成することができるため、レンズ径に関わらず、プレス成形後の光学素子の張り付きを防止し、光学素子を容易に取り出すことができる。 According to the present invention, when the molding material after pressing is cooled, the anchor portion of the outer peripheral transfer member inhibits the thermal shrinkage of the molding material in the radial direction and creates a gap between the upper mold transfer surface and the concave surface. Since it can be formed, it is possible to prevent the optical element from sticking after press molding regardless of the lens diameter, and the optical element can be easily taken out.

図1は、本発明の実施の形態に係る光学素子用成形型の構成を示す断面図である。FIG. 1 is a cross-sectional view showing a configuration of a molding mold for an optical element according to an embodiment of the present invention. 図2は、本発明の実施の形態に係る光学素子用成形型における外周転写部材のアンカー部の一例を示す平面図である。FIG. 2 is a plan view showing an example of an anchor portion of an outer peripheral transfer member in a molding die for an optical element according to an embodiment of the present invention. 図3は、本発明の実施の形態に係る光学素子用成形型における外周転写部材のアンカー部の別の一例を示す平面図である。FIG. 3 is a plan view showing another example of the anchor portion of the outer peripheral transfer member in the molding mold for an optical element according to the embodiment of the present invention. 図4は、本発明の実施の形態に係る光学素子の成形方法を示すフローチャートである。FIG. 4 is a flowchart showing a molding method of an optical element according to an embodiment of the present invention. 図5は、本発明の実施の形態に係る光学素子の成形方法のプレス転写工程を説明するための図である。FIG. 5 is a diagram for explaining a press transfer step of a method for molding an optical element according to an embodiment of the present invention. 図6は、本発明の実施の形態に係る光学素子の成形方法のプレス転写工程を説明するための図である。FIG. 6 is a diagram for explaining a press transfer step of a method for molding an optical element according to an embodiment of the present invention. 図7は、本発明の実施の形態に係る光学素子の成形方法の冷却離型工程を説明するための図である。FIG. 7 is a diagram for explaining a cooling release step of a method for molding an optical element according to an embodiment of the present invention. 図8は、本発明の実施の形態に係る光学素子の成形方法の冷却離型工程を説明するための図である。FIG. 8 is a diagram for explaining a cooling release step of a method for molding an optical element according to an embodiment of the present invention. 図9は、本発明の実施の形態に係る光学素子の成形方法の再加熱工程を説明するための図である。FIG. 9 is a diagram for explaining a reheating step of the method for molding an optical element according to the embodiment of the present invention. 図10は、本発明の実施の形態に係る光学素子用成形型の第1の変形例の構成を示す断面図である。FIG. 10 is a cross-sectional view showing the configuration of a first modification of the molding mold for an optical element according to the embodiment of the present invention. 図11は、本発明の実施の形態に係る光学素子用成形型の第2の変形例の構成を示す断面図である。FIG. 11 is a cross-sectional view showing the configuration of a second modification of the molding mold for an optical element according to the embodiment of the present invention. 図12は、本発明の実施の形態に係る光学素子用成形型の第3の変形例の構成を示す断面図である。FIG. 12 is a cross-sectional view showing the configuration of a third modification of the molding mold for an optical element according to the embodiment of the present invention.

以下、本発明に係る光学素子用成形型、光学素子の成形装置および光学素子の成形方法の実施の形態について、図面を参照しながら説明する。なお、本発明は以下の実施の形態に限定されるものではなく、以下の実施の形態における構成要素には、当業者が置換可能かつ容易なもの、あるいは実質的に同一のものも含まれる。 Hereinafter, embodiments of an optical element molding die, an optical element molding apparatus, and an optical element molding method according to the present invention will be described with reference to the drawings. The present invention is not limited to the following embodiments, and the components in the following embodiments include those that can be easily replaced by those skilled in the art or those that are substantially the same.

[光学素子用成形型]
本実施の形態に係る光学素子用成形型について、図1〜図3を参照しながら説明する。光学素子成形型(以下、「成形型」という)1は、図示しないプレス機に設置され、加熱軟化されたガラス素材等の成形素材を一対の金型によって押圧成形することにより、ガラスレンズ等の光学素子を成形するためのものである。
[Molding mold for optical elements]
The molding mold for an optical element according to the present embodiment will be described with reference to FIGS. 1 to 3. The optical element molding die (hereinafter referred to as “molding die”) 1 is installed in a press machine (not shown), and a molding material such as a heat-softened glass material is press-molded by a pair of dies to form a glass lens or the like. It is for molding an optical element.

成形型1は、図1に示すように、上型(第1の金型)11と、上型11と対をなす下型(第2の金型)12と、外周規制部材20と、外周転写部材30と、固定部材40と、を備えている。なお、本実施の形態では、両凹レンズ成形用の成形型1を一例として説明する。 As shown in FIG. 1, the molding die 1 includes an upper mold (first mold) 11, a lower mold (second mold) 12 paired with the upper mold 11, an outer circumference regulating member 20, and an outer circumference. A transfer member 30 and a fixing member 40 are provided. In this embodiment, the molding die 1 for molding a biconcave lens will be described as an example.

上型11および下型12は、それぞれ段付きの円柱形状(凸状)に形成されており、例えば超硬合金材料によって構成されている。上型11には、成形素材に凹面を転写するための凸状の上型転写面(第1の転写面)11aが、下型12には、成形素材に凹面を転写するための凸状の下型転写面(第2の転写面)12aが形成されている。また、上型11および下型12は、それぞれの転写面(上型転写面11a、下型転写面12a)の中心が中心軸C上で一致するように、対向して配置されている。 The upper mold 11 and the lower mold 12 are each formed in a stepped cylindrical shape (convex shape), and are made of, for example, a cemented carbide material. The upper mold 11 has a convex upper mold transfer surface (first transfer surface) 11a for transferring the concave surface to the molding material, and the lower mold 12 has a convex convex surface for transferring the concave surface to the molding material. The lower transfer surface (second transfer surface) 12a is formed. Further, the upper mold 11 and the lower mold 12 are arranged so as to face each other so that the centers of the respective transfer surfaces (upper mold transfer surface 11a and lower mold transfer surface 12a) coincide with each other on the central axis C.

なお、上型11および下型12の近傍には、後記する光学素子の成形方法の加熱工程および冷却離型工程において、上型11および下型12を加熱および冷却するための加熱手段(例えばヒータ)が設けられている。 In the vicinity of the upper mold 11 and the lower mold 12, heating means (for example, a heater) for heating and cooling the upper mold 11 and the lower mold 12 in the heating step and the cooling release step of the optical element molding method described later. ) Is provided.

外周規制部材20は、後記する光学素子の成形方法のプレス転写工程において、上型11によって押し広げられた成形素材の径方向(中心軸Cと直交する方向)への流動を規制するためのものである。外周規制部材20は、円筒状に形成されている。また、外周規制部材20は、下型12とは別体で構成されており、当該下型12の外周側に形成された段差部分に嵌合・固定されている。 The outer circumference restricting member 20 is for restricting the flow of the molding material expanded by the upper die 11 in the radial direction (direction orthogonal to the central axis C) in the press transfer step of the optical element molding method described later. Is. The outer peripheral regulating member 20 is formed in a cylindrical shape. Further, the outer peripheral regulating member 20 is configured as a separate body from the lower mold 12, and is fitted and fixed to a step portion formed on the outer peripheral side of the lower mold 12.

外周転写部材30は、後記する光学素子の成形方法の冷却離型工程において、押圧後の成形素材を冷却する際に、成形素材の径方向の熱収縮を阻害し、かつ上型11との熱膨張差によって上型転写面11aと成形素材の凹面との間に隙間(後記する図7参照)を形成するためのものである。 The outer peripheral transfer member 30 inhibits thermal shrinkage of the molding material in the radial direction when cooling the molding material after pressing in the cooling and mold release step of the method of molding the optical element described later, and heats the molding material with the upper mold 11. This is for forming a gap (see FIG. 7 described later) between the upper mold transfer surface 11a and the concave surface of the molding material due to the expansion difference.

外周転写部材30は、中心に開口部31が形成された略円盤状に形成されており、例えばセラミックス材料によって構成されている。また、外周転写部材30は、上型11とは別体で構成されており、当該上型11の外周側に形成された段差部分に設置されている。また、外周転写部材30は、後記する固定部材40によって、中心軸C方向への移動が不可能で、かつ径方向への移動が可能なように、上型11に対して固定された状態となっている。 The outer peripheral transfer member 30 is formed in a substantially disk shape with an opening 31 formed in the center, and is made of, for example, a ceramic material. Further, the outer peripheral transfer member 30 is configured as a separate body from the upper mold 11, and is installed at a step portion formed on the outer peripheral side of the upper mold 11. Further, the outer peripheral transfer member 30 is fixed to the upper die 11 by the fixing member 40 described later so that the outer peripheral transfer member 30 cannot move in the central axis C direction and can move in the radial direction. It has become.

外周転写部材30は、後記する光学素子の成形方法のプレス転写工程において、成形素材に凹面の外側の端面を転写するための転写面32を有する。そして、外周転写部材30は、この転写面32上に、成形素材Mにアンカー面33aを転写するためのアンカー部33を備えている。このアンカー部33は、後記する光学素子の成形方法の冷却離型工程において、成形素材の径方向の熱収縮を阻害するためのものである。以下、アンカー部33の詳細について説明する。 The outer peripheral transfer member 30 has a transfer surface 32 for transferring the outer end surface of the concave surface to the molding material in the press transfer step of the optical element molding method described later. The outer peripheral transfer member 30 is provided with an anchor portion 33 for transferring the anchor surface 33a to the molding material M on the transfer surface 32. The anchor portion 33 is for inhibiting thermal shrinkage in the radial direction of the molding material in the cooling and releasing step of the method for molding an optical element described later. The details of the anchor portion 33 will be described below.

アンカー部33は、図1に示すように、外周転写部材30の転写面32から下型12の方向に突出した凸部から構成されている。このアンカー部33を構成する凸部の転写面32からの突出量は、少なくとも上型転写面11aの転写面32からの突出量よりも小さくなるように設定される。 As shown in FIG. 1, the anchor portion 33 is composed of a convex portion protruding from the transfer surface 32 of the outer peripheral transfer member 30 in the direction of the lower mold 12. The amount of protrusion of the convex portion constituting the anchor portion 33 from the transfer surface 32 is set to be at least smaller than the amount of protrusion of the upper transfer surface 11a from the transfer surface 32.

アンカー部33を構成する凸部の転写面32からの具体的な突出量は、光学素子のレンズ有効径との関係で適宜決定することができる。すなわち、アンカー部33が図1に示すような凸部で構成されている場合、後記する図8に示すように、成形後の光学素子Oの上面には、それに対応する凹部Mbが形成される。そして、この凹部Mbの深さ(許容深さ)は、予め設定される光学素子Oのレンズ有効径によって決定されるため、凸部の具体的な突出量も、同様にレンズ有効径に依存することになる。 The specific amount of protrusion of the convex portion forming the anchor portion 33 from the transfer surface 32 can be appropriately determined in relation to the effective lens diameter of the optical element. That is, when the anchor portion 33 is composed of a convex portion as shown in FIG. 1, a concave portion Mb corresponding to the concave portion Mb is formed on the upper surface of the optical element O after molding as shown in FIG. 8 described later. .. Since the depth (allowable depth) of the concave portion Mb is determined by the lens effective diameter of the optical element O set in advance, the specific protrusion amount of the convex portion also depends on the lens effective diameter. It will be.

なお、後記する図8に示すように、成形後の光学素子Oでは、レンズ有効径よりも外側の部分は心取り加工によって除去されるため、アンカー部33によって形成される光学素子Oの凹部Mbが光学素子Oの光学的機能面に影響を与えることはない。また、前記した「レンズ有効径」とは、具体的には図8に示すように、光学素子Oが有する2つの面において、凹面Maの有効径d1と、凹面Maの反対側の面の有効径d2とのことを意味している。 As shown in FIG. 8 described later, in the molded optical element O, the portion outside the effective lens diameter is removed by centering, so that the concave portion Mb of the optical element O formed by the anchor portion 33 is formed. Does not affect the optical functional aspect of the optical element O. Further, the above-mentioned "lens effective diameter" specifically means, as shown in FIG. 8, on the two surfaces of the optical element O, the effective diameter d1 of the concave surface Ma and the effective surface on the opposite side of the concave surface Ma. It means that the diameter is d2.

図2は、外周転写部材30を下型12側から見た平面図である。アンカー部33は、同図に示すように、転写面32の上において、中心軸C周りに周状に、かつ連続的に形成されている。すなわち、アンカー部33は、リング状(円環状)の突起部により構成されている。また、アンカー部33は、同図に示すように、転写面32の径方向において、外周転写部材30の開口部31と外周転写部材30の外周との間の位置に形成されている。 FIG. 2 is a plan view of the outer peripheral transfer member 30 as viewed from the lower mold 12 side. As shown in the figure, the anchor portion 33 is formed on the transfer surface 32 in a circumferential shape and continuously around the central axis C. That is, the anchor portion 33 is composed of a ring-shaped (annular) protrusion. Further, as shown in the figure, the anchor portion 33 is formed at a position between the opening portion 31 of the outer peripheral transfer member 30 and the outer circumference of the outer peripheral transfer member 30 in the radial direction of the transfer surface 32.

アンカー部33の径や配置は、当該アンカー部33のアンカー面33aが成形素材に転写可能な径や配置であればよく、成形後の光学素子との関係に基づいて適宜決定することができる。例えば成形型1では、図2に示したアンカー部33を有する外周転写部材30に代えて、図3に示すようなアンカー部33Aを有する外周転写部材30Aを用いてもよい。このアンカー部33Aは、同図に示すように、転写面32上において、中心軸C周りに周状に、かつ間欠的に形成されている。すなわち、アンカー部33Aは、ドーム状の突起部により構成されており、転写面32上に複数配置されている。なお、同図では、合計8個のアンカー部33Aが転写面32上に周状に配置されている例を示しているが、アンカー部33Aは、転写面32上において中心軸Cに対して回転対称の位置に配置されていればよく、同図に示した個数や配置に限定されない。 The diameter and arrangement of the anchor portion 33 may be any diameter and arrangement as long as the anchor surface 33a of the anchor portion 33 can be transferred to the molding material, and can be appropriately determined based on the relationship with the optical element after molding. For example, in the molding die 1, the outer peripheral transfer member 30A having the anchor portion 33A as shown in FIG. 3 may be used instead of the outer peripheral transfer member 30 having the anchor portion 33 shown in FIG. As shown in the figure, the anchor portion 33A is formed radially and intermittently around the central axis C on the transfer surface 32. That is, the anchor portion 33A is composed of dome-shaped protrusions, and a plurality of anchor portions 33A are arranged on the transfer surface 32. Although the figure shows an example in which a total of eight anchor portions 33A are arranged in a circumferential shape on the transfer surface 32, the anchor portions 33A rotate with respect to the central axis C on the transfer surface 32. It suffices to be arranged at symmetrical positions, and is not limited to the number and arrangement shown in the figure.

本実施の形態に係る成形型1は、前記したようなアンカー部33(あるいはアンカー部33A)が形成された外周転写部材30(あるいは外周転写部材30A)を備えることにより、後記する光学素子の成形方法の冷却離型工程において、アンカー部33のアンカー面33aによって冷却中の成形素材を係止し、冷却中の成形素材が中心軸Cに向かって径方向に形状変化する熱収縮を阻害することができる。その結果、上型11への光学素子の張り付き(抱き付き)を防止し、成形型1から光学素子を容易に取り出せるようにすることができる。 The molding die 1 according to the present embodiment includes the outer peripheral transfer member 30 (or outer peripheral transfer member 30A) on which the anchor portion 33 (or the anchor portion 33A) as described above is formed, thereby molding the optical element described later. In the cooling release step of the method, the molding material being cooled is locked by the anchor surface 33a of the anchor portion 33, and the heat shrinkage in which the molding material being cooled changes its shape in the radial direction toward the central axis C is inhibited. Can be done. As a result, it is possible to prevent the optical element from sticking (holding) to the upper mold 11 so that the optical element can be easily taken out from the molding die 1.

なお、外周転写部材30は、上型11を構成する材料の熱膨張係数よりも小さい熱膨張係数を有する材料によって構成することが好ましい。例えば、上型11を構成する材料(超硬合金材料)の熱膨張係数が5.0[×10−6/K]である場合、外周転写部材30は、それよりも小さい熱膨張係数を有するセラミックス材料(熱膨張係数:4.0[×10−6/K])等で構成することが好ましい。 The outer peripheral transfer member 30 is preferably made of a material having a coefficient of thermal expansion smaller than the coefficient of thermal expansion of the material constituting the upper mold 11. For example, when the coefficient of thermal expansion of the material (cemented carbide material) constituting the upper mold 11 is 5.0 [× 10 -6 / K], the outer peripheral transfer member 30 has a coefficient of thermal expansion smaller than that. It is preferably composed of a ceramic material (coefficient of thermal expansion: 4.0 [× 10-6 / K]) or the like.

このように、外周転写部材30の熱膨張係数を上型11の熱膨張係数よりも小さくすることにより、後記する光学素子の成形方法の冷却離型工程において、外周転写部材30の熱収縮量を上型11の熱収縮量よりも小さくすることができる。その結果、外周転写部材30と上型11との間の熱膨張差により、上型転写面11aと成形素材の凹面との間に隙間(後記する図7参照)を形成することが可能となる。 By making the coefficient of thermal expansion of the outer peripheral transfer member 30 smaller than the coefficient of thermal expansion of the upper mold 11 in this way, the amount of heat shrinkage of the outer peripheral transfer member 30 can be reduced in the cooling and releasing step of the method for molding an optical element described later. It can be made smaller than the heat shrinkage amount of the upper mold 11. As a result, the difference in thermal expansion between the outer peripheral transfer member 30 and the upper mold 11 makes it possible to form a gap (see FIG. 7 described later) between the upper mold transfer surface 11a and the concave surface of the molding material. ..

固定部材40は、外周転写部材30を上型11に固定するためのものである。固定部材40は、円筒状に形成されており、上型11、下型12、外周規制部材20および外周転写部材30の周囲を覆うように配置されている。 The fixing member 40 is for fixing the outer peripheral transfer member 30 to the upper mold 11. The fixing member 40 is formed in a cylindrical shape, and is arranged so as to cover the periphery of the upper die 11, the lower die 12, the outer peripheral regulating member 20, and the outer peripheral transfer member 30.

固定部材40には、ネジ孔41が形成され、外周転写部材30には、ネジ孔41と同軸上に貫通孔34が形成されている。そして、このネジ孔41および貫通孔34にネジ部材42が挿入されている。このネジ部材42は、頭部側にネジ部42aを有し、先端側に円柱部(非ネジ部)42bを有している。そして、ネジ部材42のネジ部42aが固定部材40のネジ孔41に挿入され、ネジ部材42の円柱部42bが外周転写部材30の貫通孔34に挿入されている。 A screw hole 41 is formed in the fixing member 40, and a through hole 34 is formed in the outer peripheral transfer member 30 coaxially with the screw hole 41. Then, the screw member 42 is inserted into the screw hole 41 and the through hole 34. The screw member 42 has a screw portion 42a on the head side and a cylindrical portion (non-screw portion) 42b on the tip end side. Then, the screw portion 42a of the screw member 42 is inserted into the screw hole 41 of the fixing member 40, and the cylindrical portion 42b of the screw member 42 is inserted into the through hole 34 of the outer peripheral transfer member 30.

これにより、上型11の外周は、固定部材40によって締め付けられた状態となる。すなわち、固定部材40は、上型11の外周に固定された状態となる。一方、外周転写部材30は、ネジ部材42の円柱部42bが貫通孔34に載置された状態となる。すなわち、外周転写部材30は、中心軸C方向への移動が不可能で、かつ径方向への移動が可能なように、上型11に対して固定された状態となる。 As a result, the outer circumference of the upper die 11 is in a state of being tightened by the fixing member 40. That is, the fixing member 40 is fixed to the outer circumference of the upper die 11. On the other hand, the outer peripheral transfer member 30 is in a state in which the cylindrical portion 42b of the screw member 42 is placed in the through hole 34. That is, the outer peripheral transfer member 30 is fixed to the upper mold 11 so that it cannot move in the central axis C direction and can move in the radial direction.

このように、成形型1は、固定部材40によって、外周転写部材30の軸方向の移動を規制し、かつ外周転写部材30の径方向の移動を許容するように、外周転写部材30の外周を保持することにより、後記する光学素子の成形方法のプレス転写工程および冷却離型工程において、外周転写部材30を熱膨張および熱収縮を阻害しないように構成されている。 In this way, the molding die 1 regulates the axial movement of the outer peripheral transfer member 30 by the fixing member 40, and allows the outer peripheral transfer member 30 to move in the radial direction. By holding the outer peripheral transfer member 30, the outer peripheral transfer member 30 is configured not to inhibit thermal expansion and contraction in the press transfer step and the cooling release step of the method for molding an optical element described later.

[光学素子の成形方法]
成形型1を利用した光学素子の成形方法について、図4〜図9を参照しながら説明する。なお、以下で説明する図4〜図9では、図1で示した固定部材40は図示を省略している。
[Molding method of optical element]
A method of molding an optical element using the molding die 1 will be described with reference to FIGS. 4 to 9. In FIGS. 4 to 9 described below, the fixing member 40 shown in FIG. 1 is not shown.

(加熱工程)
加熱工程では、成形素材を加熱軟化させる(ステップS1)。加熱工程では、具体的には、上型11および下型12の間に成形素材を配置し、上型11および下型12を図示しない加熱手段によって加熱することにより、成形素材を軟化点近傍まで加熱して軟化させる。
(Heating process)
In the heating step, the molding material is heated and softened (step S1). In the heating step, specifically, the molding material is placed between the upper mold 11 and the lower mold 12, and the upper mold 11 and the lower mold 12 are heated by a heating means (not shown) to bring the molding material to the vicinity of the softening point. Heat to soften.

(プレス転写工程)
プレス転写工程では、成形素材をプレスし、凹面および端面を転写する(ステップS2)。プレス転写工程では、具体的には図5および図6に示すように、上型11および下型12によって成形素材Mをプレスすることにより、上型11の上型転写面11aによって成形素材Mに凹面Maを転写し、上型11とは別体で構成された外周転写部材30の転写面32によって成形素材Mに凹面Maの外側の端面を転写し、さらに、外周転写部材30のアンカー部33によって成形素材Mにアンカー面33aを転写する。
(Press transfer process)
In the press transfer step, the molding material is pressed to transfer the concave surface and the end surface (step S2). In the press transfer step, specifically, as shown in FIGS. 5 and 6, the molding material M is pressed by the upper mold 11 and the lower mold 12, and the molding material M is formed by the upper mold transfer surface 11a of the upper mold 11. The concave surface Ma is transferred, the outer end surface of the concave surface Ma is transferred to the molding material M by the transfer surface 32 of the outer peripheral transfer member 30 formed separately from the upper mold 11, and further, the anchor portion 33 of the outer peripheral transfer member 30 is transferred. The anchor surface 33a is transferred to the molding material M by the method.

プレス転写工程では、上型11および下型12のいずれか一方を相対的に昇降させることにより、下型12の下型転写面12a上に配置された成形素材Mを所定の圧力でプレスする。これにより、軟化した成形素材Mは、図5の白抜き矢印に示すように、径方向に押し広げられ、外周規制部材20と接触する。また、成形素材Mは、図6の白抜き矢印に示すように、外周規制部材20によって径方向への流動が規制され、中心軸C方向へと流動の方向を変える。そして、成形素材Mは、外周転写部材30のアンカー部33に転写される。これにより、成形素材Mには、凸部状のアンカー部33に対応する凹部Mbが形成される。 In the press transfer step, the molding material M arranged on the lower mold transfer surface 12a of the lower mold 12 is pressed with a predetermined pressure by relatively moving one of the upper mold 11 and the lower mold 12 up and down. As a result, the softened molding material M is expanded in the radial direction and comes into contact with the outer peripheral regulating member 20 as shown by the white arrow in FIG. Further, as shown by the white arrow in FIG. 6, the molding material M is regulated in the radial direction by the outer peripheral regulating member 20, and the flow direction is changed in the central axis C direction. Then, the molding material M is transferred to the anchor portion 33 of the outer peripheral transfer member 30. As a result, the molding material M is formed with the concave Mb corresponding to the convex anchor portion 33.

(冷却離型工程)
冷却離型工程では、成形素材Mを冷却し、光学素子を離型する(ステップS3)。冷却離型工程では、具体的には、上型11および下型12を図示しない加熱手段によって冷却することにより、成形素材Mを転移点近傍まで冷却する。これにより、図7に示すように、上型11、外周転写部材30および成形素材Mは、冷却によって中心軸Cに向かって熱収縮する。その際、外周転写部材30のアンカー部33のアンカー面33aによって冷却中の成形素材Mを係止し、冷却中の成形素材Mが中心軸Cに向かって径方向に形状変化する熱収縮を阻害する。従って、同図の白抜き矢印に示すように、冷却中は上型11および外周転写部材30のみが中心軸Cに向かって熱収縮することになる。
(Cooling mold release process)
In the cooling release step, the molding material M is cooled and the optical element is released (step S3). In the cooling release step, specifically, the molding material M is cooled to the vicinity of the transition point by cooling the upper mold 11 and the lower mold 12 by a heating means (not shown). As a result, as shown in FIG. 7, the upper die 11, the outer peripheral transfer member 30, and the molding material M are thermally shrunk toward the central axis C by cooling. At that time, the molding material M being cooled is locked by the anchor surface 33a of the anchor portion 33 of the outer peripheral transfer member 30, and the molding material M being cooled inhibits heat shrinkage in which the shape changes in the radial direction toward the central axis C. To do. Therefore, as shown by the white arrows in the figure, only the upper die 11 and the outer peripheral transfer member 30 are thermally contracted toward the central axis C during cooling.

さらに、外周転写部材30の熱膨張係数は、上型11の熱膨張係数よりも小さく構成されている。そのため、外周転写部材30と上型11との熱膨張差、すなわち両者の熱収縮量の差により、図7に示すように、上型11の上型転写面11aと成形素材Mの凹面Maとの間に、隙間Sが形成される。すなわち、上型11の上型転写面11aの外径が、外周転写部材30の開口部31の径よりも小さくなり、上型11に対する成形素材Mの張り付きが解除される。 Further, the coefficient of thermal expansion of the outer peripheral transfer member 30 is smaller than the coefficient of thermal expansion of the upper die 11. Therefore, as shown in FIG. 7, due to the difference in thermal expansion between the outer peripheral transfer member 30 and the upper mold 11, that is, the difference in the amount of heat shrinkage between the two, the upper mold transfer surface 11a of the upper mold 11 and the concave surface Ma of the molding material M A gap S is formed between the two. That is, the outer diameter of the upper mold transfer surface 11a of the upper mold 11 becomes smaller than the diameter of the opening 31 of the outer peripheral transfer member 30, and the sticking of the molding material M to the upper mold 11 is released.

そして、冷却が完了した後、図8に示すように、成形後の光学素子Oを上型11および下型12(図示省略)から離型する。なお、離型後の光学素子Oは、後段の心取り工程において、同図に示すように、レンズ有効径から外側の部分、すなわち光学素子Oの最終形状で不要となる部分Aが研削される。 Then, after the cooling is completed, as shown in FIG. 8, the molded optical element O is released from the upper mold 11 and the lower mold 12 (not shown). In the post-release optical element O, as shown in the figure, a portion outside the effective diameter of the lens, that is, a portion A that is unnecessary in the final shape of the optical element O is ground in the centering step in the subsequent stage. ..

(再加熱工程)
ここで、前記した冷却離型工程の中で、少なくとも成形後の光学素子Oを離型する前に再加熱工程を行ってもよい。この再加熱工程を行う場合、例えば図9に示すように、成形型1の周囲にビームヒータ(加熱手段)50を設けた成形装置(光学素子の成形装置)100を用いる。なお、同図では図示を省略したが、前記した図1に示す成形型1にビームヒータ50を設ける場合、例えば固定部材40においてビームヒータ50が照射される部分に開口部を形成し、その開口部を通じて各部材の加熱を行う。
(Reheating process)
Here, in the cooling release step described above, a reheating step may be performed at least before the optical element O after molding is released. When this reheating step is performed, for example, as shown in FIG. 9, a molding apparatus (optical element molding apparatus) 100 provided with a beam heater (heating means) 50 around the molding die 1 is used. Although not shown in the figure, when the beam heater 50 is provided in the molding mold 1 shown in FIG. 1, for example, an opening is formed in a portion of the fixing member 40 where the beam heater 50 is irradiated, and the opening is formed. Each member is heated through the part.

再加熱工程では、ビームヒータ50によって、外周転写部材30を加熱する。この場合、例えば図9に示すように、成形型1の周囲に配置されているビームヒータ50のうち、外周転写部材30の近傍に設置されているビームヒータ50のみをONとし、外周転写部材30の近傍以外に設置されているビームヒータ50を全てOFFとする。そして、ビームヒータ50を成形素材Mの転移点以下の温度で昇温し、外周転写部材30に熱エネルギーを集光させる。 In the reheating step, the outer peripheral transfer member 30 is heated by the beam heater 50. In this case, for example, as shown in FIG. 9, among the beam heaters 50 arranged around the molding die 1, only the beam heater 50 installed in the vicinity of the outer peripheral transfer member 30 is turned on, and the outer peripheral transfer member 30 is turned on. All beam heaters 50 installed outside the vicinity of the above are turned off. Then, the beam heater 50 is heated at a temperature equal to or lower than the transition point of the molding material M, and the thermal energy is condensed on the outer peripheral transfer member 30.

これにより、外周転写部材30のみが局所加熱され、外周転写部材30が径方向へと熱膨張する。同時に、図9の白抜き矢印に示すように、外周転写部材30のアンカー部33を介して、成形素材Mの凹面Maが径方向外側に押し広げられる。従って、再加熱工程を行わない場合(図7参照)と比較して、上型11の上型転写面11aと成形素材Mの凹面Maとの間の隙間Sをさらに拡大することができる。 As a result, only the outer peripheral transfer member 30 is locally heated, and the outer peripheral transfer member 30 thermally expands in the radial direction. At the same time, as shown by the white arrow in FIG. 9, the concave surface Ma of the molding material M is pushed outward in the radial direction via the anchor portion 33 of the outer peripheral transfer member 30. Therefore, as compared with the case where the reheating step is not performed (see FIG. 7), the gap S between the upper mold transfer surface 11a of the upper mold 11 and the concave surface Ma of the molding material M can be further expanded.

なお、図9に示すように、ビームヒータ50によって外周転写部材30を局所加熱した場合であっても、上型11に多少の熱は伝熱するが、再加熱工程を行わない場合と比較して、外周転写部材30と上型11との間に熱膨張差を設けることができるため、隙間Sを拡大することができる。また、同図では、加熱手段の一例としてビームヒータ50を示したが、外周転写部材30を局所加熱できるものであれば、別の加熱手段を用いてもよい。 As shown in FIG. 9, even when the outer peripheral transfer member 30 is locally heated by the beam heater 50, some heat is transferred to the upper die 11, but compared with the case where the reheating step is not performed. Therefore, since a thermal expansion difference can be provided between the outer peripheral transfer member 30 and the upper die 11, the gap S can be expanded. Further, in the figure, the beam heater 50 is shown as an example of the heating means, but another heating means may be used as long as the outer peripheral transfer member 30 can be locally heated.

以上説明したような成形方法によれば、押圧後の成形素材Mを冷却する際に、外周転写部材30のアンカー部33によって、成形素材Mの径方向の熱収縮を阻害し、かつ上型転写面11aと成形素材Mの凹面Maとの間に隙間Sを形成することができるため、レンズ径に関わらず、プレス成形後の光学素子Oの張り付きを防止し、光学素子Oを容易に取り出すことができる。 According to the molding method as described above, when the molding material M after pressing is cooled, the anchor portion 33 of the outer peripheral transfer member 30 inhibits the thermal shrinkage of the molding material M in the radial direction, and the upper mold transfer Since a gap S can be formed between the surface 11a and the concave surface Ma of the molding material M, the optical element O can be prevented from sticking after press molding regardless of the lens diameter, and the optical element O can be easily taken out. Can be done.

以上、本発明に係る光学素子用成形型、光学素子の成形装置および光学素子の成形方法について、発明を実施するための形態により具体的に説明したが、本発明の趣旨はこれらの記載に限定されるものではなく、特許請求の範囲の記載に基づいて広く解釈されなければならない。また、これらの記載に基づいて種々変更、改変等したものも本発明の趣旨に含まれることはいうまでもない。 The molding mold for an optical element, the molding apparatus for an optical element, and the molding method for an optical element according to the present invention have been specifically described above in terms of modes for carrying out the invention, but the gist of the present invention is limited to these descriptions. It must be broadly interpreted based on the description of the scope of claims. Needless to say, various changes, modifications, etc. based on these descriptions are also included in the gist of the present invention.

例えば本発明に係る光学素子用成形型として、前記した外周転写部材30を備える成形型1(図2参照)に代えて、例えば図10〜図12に示すような外周転写部材30B,30C,30Dを備える成形型1B,1C,1Dを用いてもよい。 For example, as the molding die for the optical element according to the present invention, instead of the molding die 1 (see FIG. 2) provided with the outer peripheral transfer member 30, for example, the outer peripheral transfer members 30B, 30C, 30D as shown in FIGS. 10 to 12. Molds 1B, 1C, 1D provided with the above may be used.

図10に示した成形型1Bでは、外周転写部材30Bのアンカー部33Bが、外周転写部材30Bの転写面32から下型12の方向に突出した凸部によって構成されている。そして、このアンカー部33Bは、転写面32上において、外周転写部材30Bの開口部31の近傍、すなわち上型11の上型転写面11aの近傍の位置に形成されている。 In the molding die 1B shown in FIG. 10, the anchor portion 33B of the outer peripheral transfer member 30B is formed by a convex portion protruding from the transfer surface 32 of the outer peripheral transfer member 30B in the direction of the lower die 12. The anchor portion 33B is formed on the transfer surface 32 at a position near the opening 31 of the outer peripheral transfer member 30B, that is, near the upper transfer surface 11a of the upper mold 11.

図11に示した成形型1Cでは、外周転写部材30Cのアンカー部33Cが、外周転写部材30Cの転写面32から上型11の方向に窪んだ凹部によって構成されている。そして、このアンカー部33Cは、転写面32上において、外周転写部材30の開口部31と外周転写部材30Cの外周との間の位置に形成されている。なお、アンカー部33Cが凹部で構成されている場合、成形後の成形素材Mの上面には、それに対応する凸部Mcが形成される。 In the molding die 1C shown in FIG. 11, the anchor portion 33C of the outer peripheral transfer member 30C is formed by a recess recessed in the direction of the upper die 11 from the transfer surface 32 of the outer peripheral transfer member 30C. The anchor portion 33C is formed at a position on the transfer surface 32 between the opening 31 of the outer peripheral transfer member 30 and the outer circumference of the outer peripheral transfer member 30C. When the anchor portion 33C is composed of recesses, a convex portion Mc corresponding to the anchor portion 33C is formed on the upper surface of the molding material M after molding.

図12に示した成形型1Dでは、外周転写部材30Dのアンカー部33Dが、外周転写部材30Dの転写面32から上型11の方向に窪んだ切欠き部によって構成されている。そして、このアンカー部33Dは、転写面32上において、外周転写部材30Dの外周の位置に形成されている。 In the molding die 1D shown in FIG. 12, the anchor portion 33D of the outer peripheral transfer member 30D is formed by a notch portion recessed in the direction of the upper die 11 from the transfer surface 32 of the outer peripheral transfer member 30D. The anchor portion 33D is formed at a position on the outer periphery of the outer peripheral transfer member 30D on the transfer surface 32.

このような成形型1B,1C,1Dによっても、成形型1と同様に、プレス成形後の光学素子Oの張り付きを防止することが可能である。なお、図10〜図12に示したアンカー部33B,33C,33Dは、図2のように、転写面32の上において中心軸C周りに周状に、かつ連続的(リング状)に形成してもよく、あるいは、図3のように、転写面32上において中心軸C周りに周状に、かつ間欠的(ドーム状)に形成してもよい。 Similar to the molding die 1, the molding dies 1B, 1C, and 1D can also prevent the optical element O from sticking after press molding. The anchor portions 33B, 33C, and 33D shown in FIGS. 10 to 12 are formed on the transfer surface 32 in a circumferential shape and a continuous shape (ring shape) around the central axis C as shown in FIG. Alternatively, as shown in FIG. 3, it may be formed on the transfer surface 32 in a circumferential shape and intermittently (dome shape) around the central axis C.

また、図2および図10に示したアンカー部33,33Bは、断面形状が逆台形状に形成されていたが、例えばその他の多角形状または球面状に形成されていてもよい。また、図11に示したアンカー部33Cは、断面形状が台形状に形成されていたが、例えばその他の多角形状または球面状に形成されていてもよい。また、図12に示したアンカー部33Dは、台形状に切り欠かれた形状であったが、例えばその他の多角形状または球面状に切り欠かれた形状であってもよい。 Further, the anchor portions 33 and 33B shown in FIGS. 2 and 10 have an inverted trapezoidal cross-sectional shape, but may be formed in another polygonal shape or a spherical shape, for example. Further, the anchor portion 33C shown in FIG. 11 has a trapezoidal cross-sectional shape, but may be formed in another polygonal shape or a spherical shape, for example. Further, the anchor portion 33D shown in FIG. 12 has a shape notched in a trapezoidal shape, but may have a shape notched in another polygonal shape or a spherical shape, for example.

1,1B,1C,1D 成形型(光学素子用成形型)
11 上型(第1の金型)
11a 上型転写面(第1の転写面)
12 下型(第2の金型)
12a 下型転写面(第2の転写面)
20 外周規制部材
30,30A,30B,30C,30D 外周転写部材
31 開口部
32 転写面
33,33A,33B,33C,33D アンカー部
33a アンカー面
34 貫通孔
40 固定部材
41 ネジ孔
42 ネジ部材
42a ネジ部
42b 円柱部(非ネジ部)
50 ビームヒータ(加熱手段)
100 成形装置(光学素子の成形装置)
C 中心軸
M 成形素材
Ma 凹面
Mb 凹部
Mc 凸部
O 光学素子
S 隙間
1,1B, 1C, 1D molding mold (molding mold for optical elements)
11 Upper mold (first mold)
11a Upper type transfer surface (first transfer surface)
12 Lower mold (second mold)
12a Lower transfer surface (second transfer surface)
20 Outer circumference regulating member 30, 30A, 30B, 30C, 30D Outer circumference transfer member 31 Opening 32 Transfer surface 33, 33A, 33B, 33C, 33D Anchor part 33a Anchor surface 34 Through hole 40 Fixing member 41 Screw hole 42 Screw member 42a Screw Part 42b Cylindrical part (non-threaded part)
50 Beam heater (heating means)
100 Molding equipment (Optical element molding equipment)
C Central axis M Molding material Ma Concave surface Mb Concave part Mc Convex part O Optical element S Gap

Claims (12)

加熱軟化された成形素材を一対の金型によって押圧成形することにより光学素子を成形する光学素子用成形型であって、
前記成形素材に凹面を転写するための凸状の第1の転写面を有する第1の金型と、
前記第1の金型と対向して配置された、前記第1の金型と対をなす第2の金型と、
前記第1の金型とは別体で構成され、前記成形素材に前記凹面の外側の端面を転写するための転写面を有する外周転写部材と、
を備え、
前記外周転写部材は、前記転写面上に配置され前記第2の金型の方向に突出する凸部から構成され、前記成形素材にアンカー面を転写するアンカー部を備え、
前記外周転写部材は、押圧後の前記成形素材を冷却する際に、前記第1の金型との熱膨張差によって前記第1の転写面と前記凹面との間に隙間を形成することを特徴とする光学素子用成形型。
A molding die for an optical element that forms an optical element by pressing and molding a heat-softened molding material with a pair of dies.
A first mold having a convex first transfer surface for transferring a concave surface to the molding material, and
A second mold paired with the first mold, which is arranged to face the first mold, and
An outer peripheral transfer member which is formed separately from the first mold and has a transfer surface for transferring the outer end surface of the concave surface to the molding material.
With
The outer peripheral transfer member is composed of a convex portion arranged on the transfer surface and projecting in the direction of the second mold, and includes an anchor portion for transferring the anchor surface to the molding material.
The outer peripheral transfer member is characterized in that when the molding material is cooled after being pressed, a gap is formed between the first transfer surface and the concave surface due to a difference in thermal expansion from the first mold. Mold for optical elements.
前記アンカー部は、前記転写面上に周状に、かつ連続的または間欠的に形成されることを特徴とする請求項1に記載の光学素子用成形型。The molding die for an optical element according to claim 1, wherein the anchor portion is formed on the transfer surface in a circumferential shape and continuously or intermittently. 前記外周転写部材の熱膨張係数は、前記第1の金型の熱膨張係数よりも小さいことを特徴とする請求項1または請求項2に記載の光学素子用成形型。 The molding die for an optical element according to claim 1 or 2 , wherein the coefficient of thermal expansion of the outer peripheral transfer member is smaller than the coefficient of thermal expansion of the first mold. 前記外周転写部材を前記第1の金型に固定する円筒状の固定部材を備え、
前記固定部材は、前記第1の金型の外周に固定されており、
前記固定部材は、前記外周転写部材の軸方向の移動を規制し、かつ前記外周転写部材の径方向の移動を許容するように、前記外周転写部材の外周を保持していることを特徴とする請求項1から請求項3のいずれか一項に記載の光学素子用成形型。
A cylindrical fixing member for fixing the outer peripheral transfer member to the first mold is provided.
The fixing member is fixed to the outer periphery of the first mold, and is fixed to the outer circumference of the first mold.
The fixing member is characterized in that it holds the outer periphery of the outer peripheral transfer member so as to regulate the axial movement of the outer peripheral transfer member and allow the outer peripheral transfer member to move in the radial direction. mold for an optical element according to any one of claims 1 to 3.
前記凸部の前記転写面からの突出量は、前記第1の転写面の前記転写面からの突出量よりも小さいことを特徴とする請求項1から請求項4のいずれか一項に記載の光学素子用成形型。 The method according to any one of claims 1 to 4 , wherein the amount of protrusion of the convex portion from the transfer surface is smaller than the amount of protrusion of the first transfer surface from the transfer surface. Mold for optical elements. 加熱軟化された成形素材を一対の金型によって押圧成形することにより光学素子を成形する光学素子用成形型であって、A molding die for an optical element that forms an optical element by pressing and molding a heat-softened molding material with a pair of dies.
前記成形素材に凹面を転写するための凸状の第1の転写面を有する第1の金型と、A first mold having a convex first transfer surface for transferring a concave surface to the molding material, and
前記第1の金型と対向して配置された、前記第1の金型と対をなす第2の金型と、A second mold paired with the first mold, which is arranged to face the first mold, and
前記第1の金型とは別体で構成され、前記成形素材に前記凹面の外側の端面を転写するための転写面を有する外周転写部材と、An outer peripheral transfer member which is formed separately from the first mold and has a transfer surface for transferring the outer end surface of the concave surface to the molding material.
を備え、With
前記外周転写部材は、前記転写面上に周状に、かつ連続的または間欠的に形成され、前記成形素材にアンカー面を転写するアンカー部を備え、The outer peripheral transfer member is formed on the transfer surface in a circumferential manner and continuously or intermittently, and includes an anchor portion that transfers the anchor surface to the molding material.
前記外周転写部材は、押圧後の前記成形素材を冷却する際に、前記第1の金型との熱膨張差によって前記第1の転写面と前記凹面との間に隙間を形成し、When the outer peripheral transfer member cools the molding material after pressing, a gap is formed between the first transfer surface and the concave surface due to the difference in thermal expansion from the first mold.
前記外周転写部材を前記第1の金型に固定する円筒状の固定部材を備え、A cylindrical fixing member for fixing the outer peripheral transfer member to the first mold is provided.
前記固定部材は、前記第1の金型の外周に固定されており、The fixing member is fixed to the outer periphery of the first mold, and is fixed to the outer circumference of the first mold.
前記固定部材は、前記外周転写部材の軸方向の移動を規制し、かつ前記外周転写部材の径方向の移動を許容するように、前記外周転写部材の外周を保持していることを特徴とする光学素子用成形型。The fixing member is characterized in that it holds the outer periphery of the outer peripheral transfer member so as to regulate the axial movement of the outer peripheral transfer member and allow the outer peripheral transfer member to move in the radial direction. Mold for optical elements.
加熱軟化された成形素材を一対の金型によって押圧成形することにより光学素子を成形する光学素子用成形型であって、A molding die for an optical element that forms an optical element by pressing and molding a heat-softened molding material with a pair of dies.
前記成形素材に凹面を転写するための凸状の第1の転写面を有する第1の金型と、A first mold having a convex first transfer surface for transferring a concave surface to the molding material, and
前記第1の金型と対向して配置された、前記第1の金型と対をなす第2の金型と、A second mold paired with the first mold, which is arranged to face the first mold, and
前記第1の金型とは別体で構成され、前記成形素材に前記凹面の外側の端面を転写するための転写面を有する外周転写部材と、An outer peripheral transfer member which is formed separately from the first mold and has a transfer surface for transferring the outer end surface of the concave surface to the molding material.
を備え、With
前記外周転写部材は、前記転写面上に周状に、かつ連続的または間欠的に形成され、前記成形素材にアンカー面を転写するアンカー部を備え、The outer peripheral transfer member is formed on the transfer surface in a circumferential manner and continuously or intermittently, and includes an anchor portion that transfers the anchor surface to the molding material.
前記外周転写部材は、押圧後の前記成形素材を冷却する際に、前記第1の金型との熱膨張差によって前記第1の転写面と前記凹面との間に隙間を形成し、When the outer peripheral transfer member cools the molding material after pressing, a gap is formed between the first transfer surface and the concave surface due to the difference in thermal expansion from the first mold.
前記外周転写部材の熱膨張係数は、前記第1の金型の熱膨張係数よりも小さく、The coefficient of thermal expansion of the outer peripheral transfer member is smaller than the coefficient of thermal expansion of the first mold.
前記外周転写部材を前記第1の金型に固定する円筒状の固定部材を備え、A cylindrical fixing member for fixing the outer peripheral transfer member to the first mold is provided.
前記固定部材は、前記第1の金型の外周に固定されており、The fixing member is fixed to the outer periphery of the first mold, and is fixed to the outer circumference of the first mold.
前記固定部材は、前記外周転写部材の軸方向の移動を規制し、かつ前記外周転写部材の径方向の移動を許容するように、前記外周転写部材の外周を保持していることを特徴とする光学素子用成形型。The fixing member is characterized in that it holds the outer periphery of the outer peripheral transfer member so as to regulate the axial movement of the outer peripheral transfer member and allow the outer peripheral transfer member to move in the radial direction. Mold for optical elements.
請求項1から請求項のいずれか一項に記載の光学素子用成形型と、
押圧後の成形素材を冷却する際に、前記光学素子用成形型の外周転写部材を加熱することにより、前記外周転写部材に形成されたアンカー部を介して、前記成形素材の前記凹面を径方向外側に押し広げる加熱手段と、
を備えることを特徴とする光学素子の成形装置。
The molding die for an optical element according to any one of claims 1 to 7.
When the molding material after pressing is cooled, the outer peripheral transfer member of the molding die for the optical element is heated, so that the concave surface of the molding material is radially formed through the anchor portion formed on the outer peripheral transfer member. A heating means that spreads outward and
An optical element molding apparatus comprising.
加熱軟化された成形素材を一対の金型によって押圧成形することにより光学素子を成形する光学素子の成形方法であって、
第1の金型および第2の金型の間に前記成形素材を配置し、前記成形素材を加熱して軟化させる加熱工程と、
前記第1の金型および前記第2の金型によって前記成形素材をプレスすることにより、前記第1の金型の第1の転写面によって前記成形素材に凹面を転写し、前記第1の金型とは別体で構成された外周転写部材の転写面によって前記成形素材に前記凹面の外側の端面を転写し、前記転写面上に配置され前記第2の金型の方向に突出する凸部から構成されたアンカー部によって前記成形素材にアンカー面を転写するプレス転写工程と、
前記成形素材を冷却し、その際に、前記外周転写部材と前記第1の金型との熱膨張差によって前記第1の転写面と前記凹面との間に隙間を形成し、成形後の前記光学素子を離型する冷却離型工程と、
を含むことを特徴とする光学素子の成形方法。
It is a molding method of an optical element that molds an optical element by pressing and molding a heat-softened molding material with a pair of dies.
A heating step in which the molding material is placed between the first mold and the second mold, and the molding material is heated and softened.
By pressing the molding material with the first mold and the second mold, the concave surface is transferred to the molding material by the first transfer surface of the first mold, and the first mold is transferred. The outer end surface of the concave surface is transferred to the molding material by the transfer surface of the outer peripheral transfer member formed separately from the mold, and the convex portion arranged on the transfer surface and projecting in the direction of the second mold. A press transfer step of transferring the anchor surface to the molding material by an anchor portion composed of
The molding material is cooled, and at that time, a gap is formed between the first transfer surface and the concave surface due to the difference in thermal expansion between the outer peripheral transfer member and the first mold, and the molding material is described. A cooling mold release process that releases the optical element and
A method for molding an optical element, which comprises.
前記アンカー部は、前記転写面上に周状に、かつ連続的または間欠的に形成されることを特徴とする請求項9に記載の光学素子の成形方法。The method for molding an optical element according to claim 9, wherein the anchor portion is formed on the transfer surface in a circumferential shape and continuously or intermittently. 前記冷却離型工程において、少なくとも成形後の前記光学素子を離型する前に、前記外周転写部材を加熱することにより、前記アンカー部を介して、前記成形素材の前記凹面を径方向外側に押し広げることを特徴とする請求項9または請求項10に記載の光学素子の成形方法。 In the cooling release step, at least before the optical element after molding is released, the outer peripheral transfer member is heated to push the concave surface of the molding material radially outward through the anchor portion. The method for molding an optical element according to claim 9 or 10, wherein the optical element is expanded. 加熱軟化された成形素材を一対の金型によって押圧成形することにより光学素子を成形する光学素子の成形方法であって、It is a molding method of an optical element that molds an optical element by pressing and molding a heat-softened molding material with a pair of dies.
第1の金型および第2の金型の間に前記成形素材を配置し、前記成形素材を加熱して軟化させる加熱工程と、A heating step in which the molding material is placed between the first mold and the second mold, and the molding material is heated and softened.
前記第1の金型および前記第2の金型によって前記成形素材をプレスすることにより、前記第1の金型の第1の転写面によって前記成形素材に凹面を転写し、前記第1の金型とは別体で構成された外周転写部材の転写面によって前記成形素材に前記凹面の外側の端面を転写し、前記転写面上に周状に、かつ連続的または間欠的に形成されたアンカー部によって前記成形素材にアンカー面を転写するプレス転写工程と、By pressing the molding material with the first mold and the second mold, the concave surface is transferred to the molding material by the first transfer surface of the first mold, and the first mold is transferred. An anchor formed on the transfer surface in a circumferential manner and continuously or intermittently by transferring the outer end surface of the concave surface to the molding material by a transfer surface of an outer peripheral transfer member formed separately from the mold. A press transfer step of transferring the anchor surface to the molding material depending on the part,
前記成形素材を冷却し、その際に、前記外周転写部材と前記第1の金型との熱膨張差によって前記第1の転写面と前記凹面との間に隙間を形成し、成形後の前記光学素子を離型する冷却離型工程と、The molding material is cooled, and at that time, a gap is formed between the first transfer surface and the concave surface due to the difference in thermal expansion between the outer peripheral transfer member and the first mold, and the molding material is described. A cooling mold release process that releases the optical element and
を含み、Including
前記冷却離型工程において、少なくとも成形後の前記光学素子を離型する前に、前記外周転写部材を加熱することにより、前記アンカー部を介して、前記成形素材の前記凹面を径方向外側に押し広げることを特徴とする光学素子の成形方法。In the cooling release step, at least before the optical element after molding is released, the outer peripheral transfer member is heated to push the concave surface of the molding material radially outward through the anchor portion. A method for molding an optical element, which is characterized by spreading.
JP2016239433A 2016-12-09 2016-12-09 Molding mold for optical element, molding device for optical element and molding method for optical element Active JP6833489B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016239433A JP6833489B2 (en) 2016-12-09 2016-12-09 Molding mold for optical element, molding device for optical element and molding method for optical element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016239433A JP6833489B2 (en) 2016-12-09 2016-12-09 Molding mold for optical element, molding device for optical element and molding method for optical element

Publications (2)

Publication Number Publication Date
JP2018095493A JP2018095493A (en) 2018-06-21
JP6833489B2 true JP6833489B2 (en) 2021-02-24

Family

ID=62631637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016239433A Active JP6833489B2 (en) 2016-12-09 2016-12-09 Molding mold for optical element, molding device for optical element and molding method for optical element

Country Status (1)

Country Link
JP (1) JP6833489B2 (en)

Also Published As

Publication number Publication date
JP2018095493A (en) 2018-06-21

Similar Documents

Publication Publication Date Title
JP4064976B2 (en) Optical lens molding equipment
JP6833489B2 (en) Molding mold for optical element, molding device for optical element and molding method for optical element
JP2015200787A (en) lens fixing method and lens assembly
TWI713699B (en) Stamping mould and manufacturing method of optical element
WO2017064979A1 (en) Method for controlling device for manufacturing optical element, method for manufacturing optical element, and device for manufacturing optical element
JP4786387B2 (en) Method for manufacturing composite optical element and molding die therefor
JP6609422B2 (en) Optical element molding die set and optical element manufacturing method
JP2007001282A (en) Molding die and its manufacturing method
JP2011132096A (en) Forming apparatus and forming method for optical element
JP2012144380A (en) Mold set for molding optical element and method for manufacturing the optical element
JP2010024109A (en) Molding method and molding apparatus for optical device
JP2007238389A (en) Method and apparatus for molding optical component
JP4832939B2 (en) Method for manufacturing optical element molding die
US10233108B2 (en) Optical element shaping mold set and optical element manufacturing method
JP2007297229A (en) Method for manufacturing optical device
JP3537160B2 (en) Optical lens molding die
JP2008156177A (en) Method for manufacturing optical element
JP2007269602A (en) Method for manufacturing optical component, and molding tool therefor
JP2018172248A (en) Mold set for optical element manufacture
JPH0645466B2 (en) Method for molding optical glass parts
JP2006198635A (en) Method and apparatus for cast-forming
JP2006044952A (en) Press mold for glass lens molding and method for producing glass lens by using the same
JP2011173763A (en) Mold for optical element and method of forming optical element
JP2009107893A (en) Manufacturing method of optical device and its mold
JP2005231933A (en) Mold for optical element and method for molding optical element

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190906

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200522

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200707

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200824

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210119

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210203

R151 Written notification of patent or utility model registration

Ref document number: 6833489

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250