JP6829851B2 - 基板及び膜基板生産方法 - Google Patents
基板及び膜基板生産方法 Download PDFInfo
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- JP6829851B2 JP6829851B2 JP2019523394A JP2019523394A JP6829851B2 JP 6829851 B2 JP6829851 B2 JP 6829851B2 JP 2019523394 A JP2019523394 A JP 2019523394A JP 2019523394 A JP2019523394 A JP 2019523394A JP 6829851 B2 JP6829851 B2 JP 6829851B2
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- 239000000758 substrate Substances 0.000 title claims description 56
- 239000012528 membrane Substances 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000843 powder Substances 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 21
- 229910052719 titanium Inorganic materials 0.000 claims description 16
- 230000010287 polarization Effects 0.000 claims description 14
- 239000002131 composite material Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000010936 titanium Substances 0.000 description 47
- 239000010408 film Substances 0.000 description 32
- 239000000463 material Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000002592 echocardiography Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Formation Of Insulating Films (AREA)
- Compositions Of Oxide Ceramics (AREA)
Description
Claims (8)
- 500℃以上840℃以下の温度帯に含まれる少なくとも一つの温度下において、入力波に対する反射波が観測され、並びに/又は、圧力及び/若しくは振動が検出されるゾルゲル複合体の膜を備える基板であって、
前記ゾルゲル複合体は、CaBi2Ta2O9の粉末とゾルゲル溶液の混合体である、基板。 - 前記ゾルゲル溶液は、Pb(Zr,Ti)O3、Bi4Ti3O12、BaTiO3、及び、(Ba・Sr)TiO3の少なくとも1つのゾルゲル溶液である、請求項1記載の基板。
- 500℃以上700℃以下の温度帯に含まれる少なくとも一つの温度下において、入力波に対する反射波が観測され、並びに/又は、圧力及び/若しくは振動が検出されるゾルゲル複合体の膜を備える基板であって、
前記ゾルゲル複合体は、CaBi4Ti4O15の粉末と、Bi4Ti3O12及び/又は(Ba,Sr)TiO3のゾルゲル溶液の混合体である、基板。 - 基板の上に粉末とゾルゲル溶液の混合体を用いて膜を作製して膜基板を生産する作製ステップを含み、
前記混合体は、CaBi2Ta2O9の粉末とゾルゲル溶液との混合体であり、又は、CaBi4Ti4O15の粉末と非鉛ゾルゲル溶液の混合体である、膜基板を生産する膜基板生産方法。 - 前記混合体は、CaBi2Ta2O9の粉末と、Pb(Zr,Ti)O3、Bi4Ti3O12、BaTiO3、及び、(Ba・Sr)TiO3の少なくとも1つのゾルゲル溶液の混合体である、請求項4記載の膜基板生産方法。
- 前記混合体は、CaBi4Ti4O15の粉末と、Bi4Ti3O12及び/又は(Ba,Sr)TiO3のゾルゲル溶液の混合体である、請求項4記載の膜基板生産方法。
- 加熱して600℃以下の温度下において前記膜に対して分極処理を行う分極ステップを含む請求項4から6のいずれかに記載の膜基板生産方法。
- 前記膜は、500℃以上700℃以下の温度帯に含まれる少なくとも一つの温度下において、入力波に対する反射波が観測され、並びに/又は、圧力及び/若しくは振動が検出される、請求項4から7のいずれかに記載の膜基板生産方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017114694 | 2017-06-09 | ||
JP2017114694 | 2017-06-09 | ||
PCT/JP2018/016866 WO2018225415A1 (ja) | 2017-06-09 | 2018-04-25 | 基板及び膜基板生産方法 |
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JPWO2018225415A1 JPWO2018225415A1 (ja) | 2020-04-30 |
JP6829851B2 true JP6829851B2 (ja) | 2021-02-17 |
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JP2019523394A Active JP6829851B2 (ja) | 2017-06-09 | 2018-04-25 | 基板及び膜基板生産方法 |
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WO (1) | WO2018225415A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110335937A (zh) * | 2019-07-02 | 2019-10-15 | 华南理工大学 | 一种铁电体粉体极化装置及其方法 |
WO2023140166A1 (ja) * | 2022-01-19 | 2023-07-27 | 株式会社Cast | 超音波プローブおよび超音波プローブの製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004319995A (ja) * | 2003-03-28 | 2004-11-11 | Seiko Epson Corp | 強誘電体膜およびその製造方法ならびに半導体装置 |
JP5245107B2 (ja) * | 2006-05-09 | 2013-07-24 | キヤノン株式会社 | 圧電素子、圧電アクチュエータ、インクジェット式記録ヘッド |
JP5406881B2 (ja) * | 2011-05-19 | 2014-02-05 | 日立Geニュークリア・エナジー株式会社 | 耐熱超音波センサ及びその設置方法 |
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2018
- 2018-04-25 JP JP2019523394A patent/JP6829851B2/ja active Active
- 2018-04-25 WO PCT/JP2018/016866 patent/WO2018225415A1/ja active Application Filing
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JPWO2018225415A1 (ja) | 2020-04-30 |
WO2018225415A1 (ja) | 2018-12-13 |
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