JP6823820B1 - Resist stripper - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resist stripping solution in which undercut of copper or molybdenum is suppressed when a resist hard-baked on a copper / molybdenum laminated film is stripped. SOLUTION: The secondary cyclic amine is 0.5 to 5% by mass based on the total amount of the stripping solution, the basic amino acid is 5 to 10% by mass based on the secondary cyclic amine, and the basic amino acid is used. A resist stripping solution containing 10 to 30% by mass of a protective agent, 10 to 50% by mass of a sugar alcohol with respect to the secondary cyclic amine, an organic polar solvent, and water. [Selection diagram] None

Description

The present invention relates to a resist stripping solution used for stripping a photoresist used in photolithography.

Broadcast transmission formats that can provide high image quality such as 4K and 8K have been proposed, and test broadcasting has also begun. Correspondingly, large screens are being provided for televisions. Liquid crystal televisions are the mainstream of current televisions, and transistors corresponding to pixels are formed on a transparent substrate (glass) for a large screen. Photolithography technology is used for this formation.

Due to the increase in size of the screen, it is necessary to reduce the resistance of the conductive portion formed on the transparent substrate. Therefore, copper has come to be used for the conductive portion. Copper has high conductivity. However, the adhesive force to the transparent substrate is low. Therefore, molybdenum is used as a base layer between the transparent substrate and copper.

Molybdenum is usually a metal that is not easily corroded, but it has been known that molybdenum is significantly corroded when it has a two-layer structure with copper.

In Patent Document 1, secondary or tertiary alkanolamine, a thiol group, and an amide structure are added to a stripping solution for removing the resist layer after etching both layers having a two-layer structure in which a copper layer is arranged on a molybdenum layer. Disclosed is a stripping solution capable of suppressing corrosion of molybdenum and stripping a resist by using an amino acid that does not have and contains two or more nitrogens.

Further, in Patent Document 1, when a copper corrosion protective agent such as benzotriazole is used, precipitates are generated on the copper surface, so that it is not used.

At present, a larger transparent substrate is used than at the time of filing of Patent Document 1. Therefore, when an element is formed on a large screen by photolithography, strict production control is performed in which failure of one element is not allowed. Therefore, it is required that the coated photoresist film does not peel off, which is directly linked to the etching error. As a result, the temperature of the photoresist baking treatment (also called firing treatment) before exposure tends to rise.

International Publication No. 2010/0738887

Amino acids are known as substances that strongly corrode copper. That is, the stripping solution of Patent Document 1 utilizes amino acids that strongly corrode copper together with amines that corrode copper, to a lesser extent, without a protective agent for copper. Nevertheless, the stripping solution of Patent Document 1 suppresses the corrosion of copper and the corrosion of the underlying molybdenum.

The reason for this is considered as follows. When the stripper is used, oxygen is reduced on the surface of the copper. Therefore, electrons are supplied from the copper surface to the stripping liquid side. Here, when amines that do not easily corrode copper are used, electrons are supplied from molybdenum rather than from copper. Therefore, molybdenum is corroded.

On the other hand, here, by simultaneously using amino acids that corrode copper, electrons are also emitted from copper to suppress the corrosion of molybdenum. That is, it is a method in which the resist is peeled off with alkanolamine, which is resistant to corrosion of copper, and electrons used for the reducing action generated on the copper surface are supplied not only from molybdenum but also from copper itself.

In other words, the molybdenum layer is protected by intentionally corroding the copper layer to some extent, and the balance between alkanolamines and amino acids is intended to protect both layers.

However, at present, the firing temperature of the resist at the site is higher than that at the time of filing of Patent Document 1 (hard bake), and the resist itself cannot be peeled off with alkanolamine. Therefore, there is a need for a basic substance that is more suitable for decomposing hard-baked resists than alkanolamines.

Further, while the conductive portion near the pixel has a relatively thin pattern, the conductive portion from each pixel is put together in the portion around the screen, resulting in a wide pattern.

As described above, when a strong alkali is used in a state where a wide pattern and a narrow pattern are mixed, there is a problem that it becomes difficult to adjust the balance between amines and amino acids. That is, in this method, molybdenum is basically corroded when there are few amino acids (more amines), and copper is corroded when there are many amino acids (less amines). However, in both the wide pattern and the narrow pattern, the range in which amino acids and amines can be balanced is very narrow, and it has not been possible to provide a substantially balanced stripping solution.

The present invention has been conceived in view of the above problems, and can suppress the corrosion of molybdenum and copper in both the wide pattern portion and the narrow pattern portion while sufficiently peeling off the hard-baked photoresist. A resist stripping solution is provided.

Therefore, in the present invention, a protective agent for copper is used after using a cyclic amine and an amino acid. Then, an excess of amino acids is added to the amine to suppress the corrosion of molybdenum, and the degree of corrosion of copper is adjusted with a protective agent.

More specifically, the resist stripping solution according to the present invention is
With 0.5 to 5% by mass of the secondary cyclic amine with respect to the total amount of the stripping solution,
5 to 10% by mass of basic amino acids with respect to the secondary cyclic amine,
With 10 to 30% by mass of the protective agent with respect to the basic amino acid,
10 to 50% by mass of sugar alcohol with respect to the secondary cyclic amine,
With organic polar solvents
Water only contains,
The secondary cyclic amine is characterized by being at least one of hexamethyleneimine and 1-methylpyrrolidine .

The resist stripping solution according to the present invention excessively mixes a basic amino acid that strongly corrodes copper with a secondary cyclic amine that is hard to corrode copper and has strong alkalinity. Therefore, copper will be corroded as it is, but the corrosion of copper is adjusted by the amount of protective agent. That is, rather than balancing the two types of corrosive agents, the effect of one corrosive agent is suppressed by a protective agent. Therefore, even in the case of a wide pattern and a narrow pattern, the corrosion of molybdenum and the corrosion of copper can be suppressed within a practical range.

Further, since sugar alcohol is mixed, corrosion between molybdenum and copper can be suppressed.

Furthermore, since the composition of this stripping solution does not contain an inorganic acid or an inorganic alkali, it does not corrode even the conductive portion of aluminum.

Examples of the resist stripping solution according to the present invention will be described below. The following description illustrates one embodiment and one embodiment of the present invention, and the present invention is not limited to the following description. The following description can be modified without departing from the spirit of the present invention. In addition, "~" may be used to represent a range in the following explanation, but this is from "greater than or equal to (greater than that value including that value) to less than or equal to (less than that value including that value)". It means ".

The resist stripping solution according to the present invention contains a secondary cyclic amine, a basic amino acid, an organic protic solvent, a protective agent, water, and a sugar alcohol.

Further, the object of the present invention is a conductive portion in which copper is laminated on molybdenum. In particular, a conductive portion having a width of about 5 to 15 μm and a conductive portion having a width of 300 to 500 μm are mixed. In addition, there are also conductive parts made of aluminum.

The thickness of molybdenum is about 30 to 50 nm, and the thickness of copper is 400 to 800 nm. The aluminum portion has a thickness of 200 to 400 nm. Regarding these, it is necessary that the undercut of molybdenum, the corrosion of copper, and the corrosion of aluminum are within the range where there is no practical problem.

The resist is a positive photoresist and contains novolak resin and diazonaphthoquinone. Then, those which have been calcined at 150 ° C. or higher are targeted. Usually, photoresists are heat treated at a temperature of about 100 ° C. Therefore, it can be said that the heat treatment at 150 ° C. or higher is a high temperature treatment (hard bake).

As the secondary cyclic amine, hexamethyleneimine (referred to as CAS number 111-49-9) and 1-methylpyrrolidine (CAS number: 120-94-5) can be preferably used. Hexamethyleneimine and 1-methylpyrrolidine can exfoliate hard-baked photoresists. The secondary cyclic amine is preferably contained in an amount of 0.5 to 5% by mass, more preferably 0.7 to 2.0% by mass, based on the total amount of the stripping solution.

As the amino acid, a basic amino acid can be used. Copper can be strongly dissolved. In particular, arginine and lysine can be preferably used. Histidine is classified as a basic amino acid, but the resist stripping solution according to the present invention was not very effective against the anticorrosion of molybdenum.

The amino acid is preferably contained in an amount of 5 to 10% by mass, preferably 6 to 8% by mass, based on the cyclic amine. This corresponds to 0.025 to 0.5% by mass when converted to the total amount of the stripping liquid.

The protective agent is a substance that suppresses the corrosion of amino acids on copper. Specifically, benzotriazole, 5-methyl-1H-benztriazole, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 2-mercapto-5-methylbenzimidazole, 1- [N, N-bis (2-). Ethylhexyl) aminomethyl] -1H-benzotriazole, 2,2'-[[(methyl-1H-benztriazole-1-yl) methyl] imino] bisethanol. Therefore, at least one substance selected from these compound groups is used as the metal surface protectant.

The protective agent can be adjusted in an amount of 10 to 30% by mass based on the basic amino acid. This corresponds to 0.0025 to 0.15% by mass of the entire stripping solution. If the amount of the protective agent is too large for basic amino acids, the corrosion of copper is suppressed too much and the corrosion of molybdenum increases. However, by containing an amount in the above range, it is possible to preferably balance the corrosion of molybdenum and the corrosion of copper regardless of whether the width of the conductive portion is wide or narrow.

Sugar alcohols can prevent corrosion of the boundary between molybdenum and copper (referred to as "copper undercut"). As the sugar alcohol, glycerol or sorbitol can be preferably used. The sugar alcohol is preferably contained in an amount of 10 to 50% by mass based on the cyclic amine. This corresponds to 0.05 to 2.5% by mass with respect to the total amount of the stripping liquid.

The organic polar solvent is preferably an aprotic organic solvent. Protic and aprotic organic solvents are prone to corrosion of the underlying molybdenum. Specifically, as the organic polar solvent, diethylformamide, N-methylformamide, dimethylformamide, N-methyl-2-pyrrolidone, tetrahydrofuran, dimethylsulfoxide and the like can be preferably used.

Water is preferably 10 to 30% by mass of the entire stripping liquid. Further, the organic polar solvent may be the above-mentioned cyclic amine, water, a protective agent, and the rest of the sugar alcohol.

Examples of the resist stripping solution according to the present invention are shown below. Sample stripping solutions of Examples and Comparative Examples having the compositions shown below were prepared, and a resist stripping test was performed on a resist stripping test piece.

<Test piece for resist peeling>
Molybdenum (Mo) was deposited on a glass substrate to a thickness of 30 nm, and copper (Cu) was laminated on the glass substrate to a thickness of 500 nm. SiN was laminated on it to a thickness of 300 nm. This is called a silicon laminate.

A contact hole having a diameter of 1 μm was formed at a predetermined position on the SiN layer on the silicon laminate. Then, molybdenum (Mo) was further laminated to a thickness of 30 nm, and copper (Cu) was laminated on it to a thickness of 500 nm.

Next, a positive type resist was applied to the uppermost copper layer and fired (baked) at a predetermined temperature. The high-temperature baking was performed at 150 ° C. for about 2 minutes, but in order to confirm the peeling force of the resist stripping solution, the baking was performed at 170 ° C. for 5 minutes. As a result, the resist film is firmly fired. After baking, it was exposed with a gate wire pattern and developed, and then the upper copper layer and molybdenum layer were etched to obtain a copper test piece for resist stripping.

That is, the copper test piece for resist peeling has a molybdenum layer and a copper layer in which a gate wire pattern is etched, and a fired resist film is deposited on the molybdenum layer and a copper layer. The resist film also covers the contact hole portion.

Further, aluminum (Al) was laminated on the silicon laminated piece to a thickness of 500 nm, and the aluminum layer was etched with a gate wire pattern in the same manner as the resist stripping copper test piece. The firing treatment of the resist layer was also carried out at 170 ° C. for 5 minutes. In this way, an aluminum test piece for resist peeling was obtained.

<Evaluation>
As the ability to peel the resist (hereinafter referred to as "peeling force"), each test piece was treated with each sample stripping solution heated to 40 ° C. for 40 seconds, and the residual state of the resist was confirmed with an optical microscope. Then, if the resist clearly remains on the surface, the evaluation is set to "x" (meaning fail or failure), and if the resist is peeled off to a state where there is no problem, "○" (pass or success). It means.).

In addition, as an ability to suppress corrosion of the metal surface (hereinafter referred to as "metal damage"), the corrosion state of the metal film of the test piece after being immersed in a sample stripping solution at 40 ° C. for 4 minutes and treated is SEM (Scanning Electron). It was observed by Microscope). In this observation, the etched portion was observed in the surface magnified field and the cross-sectional field of view.

In the surface magnified field of view, the corrosion state of the surfaces of the copper layer and the aluminum layer was confirmed. In particular, the state of copper on the surface of the gate wire and the edge of the contact hole was confirmed. In the cross-sectional field of view, the rough state of the inclined surface of the etched metal layer, the inclination angle, and the undercut of copper were confirmed.

Then, in each field of view, the evaluation of the state judged to be unqualified for manufacturing is marked with "x" (meaning fail or failure), and the evaluation of the state judged to be qualified for manufacturing is marked with "○" (passed). Or it means success.)

<Sample release liquid>
The composition of each sample stripping solution is shown. The following abbreviations may also be used to indicate each compound below.
Hexamethylene imine: HMI (CAS Registry Number 111-49-9),
1-Methylpyrrolidine: 1M-PRL (CAS Number: 120-94-5),
Diethyl formamide: DEF (CAS Registry Number: 617-84-5),
Diethylene glycol monobutyl ether: BDG (CAS Registry Number: 112-34-5),
N-Methylformamide: NMF (CAS Registry Number: 123-39-7),
2,2'-[[(Methyl-1H-benzotriazole-1-yl) methyl] imino] Bisethanol: MBET (CAS number: 88477-37-6),
N-Methyl-2-pyrrolidone: NMP (CAS Registry Number: 872-50-4),
Piperazine: PIZ (CAS Number: 110-85-0),
N-Methylethanolamine: MMA (CAS Registry Number: 109-83-1).
5-Methylbenzotriazole: 5M-BTA (CAS Registry Number: 136-85-6),
Arginine: Arg (CAS Number: 74-79-3),
Lysine: Lys (CAS Number: 70-54-2),
Histidine: His (CAS number: 71-00-1)
Glycerol (CAS number: 56-81-5),
Sorbitol: Stol (CAS Registry Number: 50-70-4).

(Example 1)
The sample stripping solution of Example 1 was prepared with the following composition.
1.0 g of HMI as a cyclic amine compound,
0.07 g of Arg as an amino acid (7% by mass based on the cyclic amine compound),
0.01 g of MBET as a protective agent (14.3% by mass based on amino acids),
0.30 g of glycerol as a sugar alcohol (30% by mass based on the cyclic amine compound),
71.62 g of NMP and 27.0 g of water were mixed as a polar solvent to prepare a sample of Example 1.

(Example 2)
The sample stripping solution of Example 2 was prepared with the following composition.
4.0 g of HMI as a cyclic amine compound,
0.32 g of Arg as an amino acid (8% by mass based on the cyclic amine compound),
0.09 g of MBET as a protective agent (28.1% by mass based on amino acids),
1.60 g of glycerol as a sugar alcohol (40% by mass based on the cyclic amine compound),
As a polar solvent, 66.99 g of DEF and 27.0 g of water were mixed to prepare a sample of Example 2.

(Example 3)
The sample stripping solution of Example 3 was prepared with the following composition.
1.0 g of 1M-PRL as a cyclic amine compound,
0.07 g of Arg as an amino acid (7% by mass based on the cyclic amine compound),
0.01 g of MBET as a protective agent (14.3% by mass based on amino acids),
0.30 g of glycerol as a sugar alcohol (30% by mass based on the cyclic amine compound),
71.62 g of DEF and 27.0 g of water were mixed as a polar solvent to prepare a sample of Example 3.

(Example 4)
The sample stripping solution of Example 4 was prepared with the following composition.
4.0 g of 1M-PRL as a cyclic amine compound,
0.32 g of Arg as an amino acid (8% by mass based on the cyclic amine compound),
0.09 g of 5M-BTA as a protective agent (28.1% by mass based on amino acids),
1.60 g of glycerol as a sugar alcohol (40% by mass based on the cyclic amine compound),
66.99 g of NMF and 27.0 g of water were mixed as a polar solvent to prepare a sample of Example 4.

(Example 5)
The sample stripping solution of Example 5 was prepared with the following composition.
3.0 g of 1M-PRL as a cyclic amine compound,
0.21 g of Arg as an amino acid (7% by mass based on the cyclic amine compound),
0.03 g of MBET as a protective agent (14.3% by mass based on amino acids),
0.90 g of sorbitol as a sugar alcohol (30% by mass with respect to the cyclic amine compound),
68.86 g of DEF and 27.0 g of water were mixed as a polar solvent to prepare a sample of Example 5.

(Example 6)
The sample stripping solution of Example 6 was prepared with the following composition.
1.0 g of 1M-PRL as a cyclic amine compound,
0.07 g of Lys as an amino acid (7% by mass based on the cyclic amine compound),
0.01 g of MBET as a protective agent (14.3% by mass based on amino acids),
0.10 g of glycerol as a sugar alcohol (10% by mass based on the cyclic amine compound),
As a polar solvent, 71.82 g of NMP and 27.0 g of water were mixed to prepare a sample of Example 6.

(Comparative Example 1)
The sample stripping solution of Comparative Example 1 was prepared with the following composition.
1.0 g of HMI as a cyclic amine compound,
0.03 g of Arg as an amino acid (3% by mass based on the cyclic amine compound),
0.006 g of MBET as a protective agent (20% by mass with respect to amino acids),
0.30 g of glycerol as a sugar alcohol (30% by mass based on the cyclic amine compound),
71.664 g of NMP and 27.0 g of water were mixed as a polar solvent to prepare a sample of Comparative Example 1.

(Comparative Example 2)
The sample stripping solution of Comparative Example 2 was prepared with the following composition.
4.0 g of HMI as a cyclic amine compound,
0.60 g of Arg as an amino acid (15% by weight based on the cyclic amine compound),
0.18 g of MBET as a protective agent (30% by mass based on amino acids),
1.60 g of glycerol as a sugar alcohol (40% by mass based on the cyclic amine compound),
66.62 g of DEF and 27.0 g of water as polar solvents. The above was mixed to prepare a sample of Comparative Example 2.

(Comparative Example 3)
The sample stripping solution of Comparative Example 3 was prepared with the following composition.
1.0 g of 1M-PRL as a cyclic amine compound,
0.07 g of Arg as an amino acid (7% by mass based on the cyclic amine compound),
0.003 g of MBET as a protective agent (4.3% by mass based on amino acids),
0.30 g of glycerol as a sugar alcohol (30% by mass based on the cyclic amine compound),
71.627 g of DEF and 27.0 g of water were mixed as a polar solvent to prepare a sample of Comparative Example 3.

(Comparative Example 4)
The sample stripping solution of Comparative Example 4 was prepared with the following composition.
4.0 g of 1M-PRL as a cyclic amine compound,
0.32 g of Arg as an amino acid (8% by mass based on the cyclic amine compound),
0.1 g of 5M-BTA as a protective agent (31% by mass based on amino acids),
1.60 g of glycerol as a sugar alcohol (40% by mass based on the cyclic amine compound),
66.98 g of NMF and 27.0 g of water were mixed as a polar solvent to prepare a sample of Comparative Example 4.

(Comparative Example 5)
The sample stripping solution of Comparative Example 5 was prepared with the following composition.
1.0 g of PIZ as an amine compound,
0.07 g of Arg as an amino acid (7% by mass based on the amine compound),
0.01 g of MBET as a protective agent (14.3% by mass based on amino acids),
0.30 g of glycerol as a sugar alcohol (30% by mass based on the cyclic amine compound),
71.62 g of DEF and 27.0 g of water were mixed as a polar solvent to prepare a sample of Comparative Example 5.

(Comparative Example 6)
The sample stripping solution of Comparative Example 6 was prepared with the following composition.
1.0 g of MMA as an amine compound,
0.07 g of Lys as an amino acid (7% by mass based on the amine compound),
0.01 g of MBET as a protective agent (14.3% by mass based on amino acids),
0.10 g of glycerol as a sugar alcohol (10% by mass based on the cyclic amine compound),
As a polar solvent, 71.82 g of NMP and 27.0 g of water were mixed to prepare a sample of Comparative Example 6.

(Comparative Example 7)
The sample stripping solution of Comparative Example 7 was prepared with the following composition.
3.0 g of HMI as a cyclic amine compound,
0.21 g of Lys as an amino acid (7% by mass based on the cyclic amine compound),
0.03 g of MBET as a protective agent (14.3% by mass based on amino acids),
0.0 g of glycerol as sugar alcohol (does not contain sugar alcohol),
As a polar solvent, 69.76 g of NMP, 27.0 g of water, and the above were mixed to prepare a sample of Comparative Example 7.

(Comparative Example 8)
The sample stripping solution of Comparative Example 8 was prepared with the following composition.
1.0 g of 1M-PRL as a cyclic amine compound,
0.07 g of Arg as an amino acid (7% by mass based on the cyclic amine compound),
0.01 g of MBET as a protective agent (14.3% by mass based on amino acids),
0.30 g of glycerol as a sugar alcohol (30% by mass based on the cyclic amine compound),
As a polar solvent, 71.62 g of BDG and 27.0 g of water were mixed to prepare a sample of Comparative Example 8.

(Comparative Example 9)
The sample stripping solution of Comparative Example 9 was prepared with the following composition.
1.0 g of 1M-PRL as a cyclic amine compound,
0.07 g of His as an amino acid (7% by mass based on the cyclic amine compound),
0.01 g of MBET as a protective agent (14.3% by mass based on amino acids),
0.30 g of glycerol as a sugar alcohol (30% by mass based on the cyclic amine compound),
71.62 g of DEF and 27.0 g of water were mixed as a polar solvent to prepare a sample of Comparative Example 9.

The above sample stripping solution was prepared and a stripping test was conducted. The composition of the sample stripping solution and the result of the peeling test for the examples are shown in Table 1, and the composition of the sample stripping solution and the result of the peeling test for the comparative example are shown in Tables 2 and 3.

With reference to Table 1, in Examples 1 to 6 which are the compositions of the present invention, the resist film which has been heat-treated at 170 ° C. for 5 minutes can be peeled off under the treatment conditions of 40 ° C. for 40 seconds. It was. Therefore, the evaluation of the peeling force was "○". In addition, in the observation by SEM, the state of the copper film in the gate wire and the contact hole was also good, and the evaluation of metal damage was also "◯". In addition, the undercut due to the corrosion of molybdenum and the undercut of copper between molybdenum and copper were also evaluated as "○". Furthermore, the evaluation of the peeling force in the aluminum layer was also "○". Regarding aluminum, there was no problem in both Examples and Comparative Examples.

On the other hand, in Comparative Example 1 and Comparative Example 2, the amino acids are too few (Comparative Example 1) and too many (Comparative Example 2). Too few amino acids caused molybdenum undercuts. This is because the copper film could not be corroded properly. On the other hand, too much amino acid corroded the copper surface.

Further, in Comparative Example 3 and Comparative Example 4, the amount of the protective agent is too small (Comparative Example 3) and too large (Comparative Example 4). If the amount of protective agent is too small, the corrosion of the copper film by amino acids cannot be prevented. On the other hand, if too much protective agent was used, the copper surface could not be corroded, resulting in molybdenum corrosion (undercut).

Comparative Example 5 uses an amine as piperazine. Although piperazine is a cyclic amine, it was unable to exfoliate the hard-baked resist film. Comparative Example 6 is a case where the amine was replaced with N-methylethanolamine (alkanolamine), but in this case as well, the hard-baked resist film could not be peeled off.

Comparative Example 7 is a case where no sugar alcohol was added. In this case, corrosion occurred between molybdenum and copper, resulting in copper undercut (denoted as "Cu U.C." in the table).

Comparative Example 8 is a case where the polar solvent is diethylene glycol monobutyl ether, which is a protic organic solvent. When the organic polar solvent was made protonic, molybdenum undercut was likely to occur.

Comparative Example 9 is a case where histidine is used as an amino acid. Histidine is classified as a basic amino acid, but undercut of molybdenum occurred. In the composition of the stripping solution according to the present invention, it is considered that histidine was less corrosive to copper than lysine and arginine.

As described above, the resist stripping solution according to the present invention can suppress surface roughness and undercut due to corrosion of molybdenum and copper when forming wiring made of molybdenum, copper and aluminum by photolithography.

The present invention can be suitably used in a resist stripping step in a manufacturing process of a large-area display device.

Claims (4)

With 0.5 to 5% by mass of the secondary cyclic amine with respect to the total amount of the stripping solution,
5 to 10% by mass of basic amino acids with respect to the secondary cyclic amine,
With 10 to 30% by mass of the protective agent with respect to the basic amino acid,
10 to 50% by mass of sugar alcohol with respect to the secondary cyclic amine,
With organic polar solvents
Water only contains,
The resist stripping solution is characterized in that the secondary cyclic amine is at least one of hexamethyleneimine and 1-methylpyrrolidine . The resist stripping solution according to claim 1, wherein the basic amino acid contains at least one of arginine and lysine. The protective agent is benzotriazole, 5-methyl-1H-benztriazole, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 2-mercapto-5-methylbenzimidazole, 1- [N, N-bis (2-). A claim characterized by being at least one selected from ethylhexyl) aminomethyl] -1H-benzotriazole and 2,2'-[[(methyl-1H-benztriazole-1-yl) methyl] imino] bisethanol. resist stripping solution as claimed in any Kano claims 1 or 2. The resist stripping solution according to any one of claims 1 to 3 , wherein the sugar alcohol is at least one of glycerol and sorbitol.