JP6817502B1 - Manufacturing method of electroless plating suppression composition and plated parts - Google Patents

Abstract

Provided is an electroless plating suppressing composition capable of suppressing the formation of an electroless plating film in a portion where the formation of an electroless plating film is not planned and having high dispersion stability. It is an electroless plating suppressing composition and contains a catalytic activity interfering agent which is a compound having at least one of an amide group and an amino group, and a solvent containing glycol ether.

Description

The present invention relates to an electroless plating suppressing composition and a method for producing plated parts.

In recent years, three-dimensional molded circuit parts (MID: Molded Integrated Device) have been put into practical use in smartphones and the like, and their applications in the automobile field are expected to expand in the future. The MID is a device in which a circuit is formed of a metal film on the surface of a resin molded product, and can contribute to weight reduction, thinning of the product, and reduction of the number of parts.

As a method of forming a wiring pattern (electric circuit) on the surface of an insulating base material such as a resin molded body, for example, a method described below has been proposed. First, a metal layer is formed on the entire surface of the base material. Next, the formed metal layer is patterned with a photoresist, and then the metal layer other than the wiring pattern is removed by etching. As a result, the wiring pattern can be formed by the metal layer left on the surface of the base material.

Further, as a method for forming a wiring pattern (electric circuit) that does not use a photoresist, a method that uses a laser beam has been proposed (for example, Patent Document 1). First, the base material is roughened by irradiating the portion where the wiring pattern is to be formed with laser light. Then, when the electroless plating catalyst is applied to the entire base material, the electroless plating catalyst adheres firmly to the laser beam irradiation portion as compared with other portions. Next, when the substrate is washed, the electroless plating catalyst remains only in the laser beam irradiated portion, and the catalyst in the other portion can be easily removed. By performing electroless plating on the base material to which the electroless plating catalyst is attached only to the laser light irradiation portion, a plating film can be formed only on the laser light irradiation portion, that is, a predetermined wiring pattern. The method of forming a wiring pattern using laser light saves the cost and labor of manufacturing a photomask or the like, so that the wiring pattern can be easily changed.

Japanese Patent No. 3222660

However, in the method for forming a wiring pattern (electric circuit) using laser light proposed in Patent Document 1, a portion where an electroless plating film is not planned to be formed, that is, depending on the type and surface condition of the base material, that is, In some cases, an electroless plating film was formed on parts other than the wiring pattern. For example, an electroless plating catalyst easily adheres to a base material containing a filler, a base material having a large surface roughness, a base material having voids, etc. The catalyst cannot be removed and tends to remain. Further, depending on the type of the electroless plating catalyst and the type of the base material, the electroless plating catalyst may permeate into the base material, and it is difficult to remove the electroless plating catalyst that has permeated the base material by cleaning. there were. When the base material in which the electroless plating catalyst remains in the portion other than the predetermined wiring pattern is electroless plated in this way, an electroless plating film is naturally formed in the portion other than the wiring pattern. Therefore, there has been a demand for a technique capable of more reliably suppressing the formation of an electroless plating film in a portion other than a predetermined pattern.

Further, MIDs used in the fields of smartphones, automobiles and the like are usually mass-produced. For this reason, the technique of forming a wiring pattern (electric circuit) on the surface of a resin molded body or the like is also required to have stability that can be used for manufacturing plated parts for a long time.

The present invention solves these problems and suppresses the formation of an electroless plating film in a portion where the formation of an electroless plating film is not planned, regardless of the type, shape and state of the base material. Provided is an electroless plating suppressing composition capable. Further, for example, an electroless plating suppressing composition having high stability is provided so as to be able to cope with a long-time manufacturing process.

According to a first aspect of the present invention, there is provided a non-electrolytic plating inhibiting composition, seen containing a catalytic activity interfering agent is a compound having at least one amide group and amino group, and a solvent containing glycol ether, A composition is provided in which the catalytic activity interfering agent is a hyperbranched polymer .

The electroless plating suppressing composition may further contain alcohol. In the electroless plating suppressing composition, the weight ratio (X / Y) of the blended amount (X) of the glycol ether to the blended amount (Y) of the alcohol is (X / Y) = 2/98 to 80. It may be / 20.

At least one selected from the group consisting of ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, diethylene glycol monoisobutyl ether, dipropylene glycol monomethyl ether, and ethylene glycol dimethyl ether. It may be ethylene glycol monobutyl ether or propylene glycol monomethyl ether.

The alcohols are ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 1-pentanol, 1-hexanol, ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, and 1,2. -It may be at least one selected from the group consisting of hexanediol.

The weight average molecular weight of the catalytically active interfering agent may be 1,000 to 1,000,000 . Prior Symbol electroless plating inhibiting composition, the amount of the catalytically active interference agent may be 0.2 wt% to 5.0 wt%.

According to the second aspect of the present invention, in the method for producing a plated part, the electroless plating suppressing composition of the first aspect is applied to the surface of the base material, and the surface of the base material Partially heated or irradiated with light, an electroless plating catalyst is applied to the surface of the base material irradiated with heating or light, and an electroless plating solution is applied to the surface of the base material to which the electroless plating catalyst is applied. Provided is a method for manufacturing a plated component, which comprises forming an electroless plating film on a heated portion or a light-irradiated portion of the surface.

The electroless plating suppressing composition of the present invention contains an electroless plating inhibitor and does not depend on the type, shape and state of the base material, and the electroless plating film is formed in a portion where the formation of the electroless plating film is not planned. Can be suppressed. Further, the electroless plating suppressing composition of the present invention has high dispersion stability of the catalytic activity interfering agent.

FIG. 1 is a flowchart illustrating a method for manufacturing a plated component according to an embodiment.

[Electroless plating suppression composition]
The electroless plating suppressing composition contains a catalytic activity interfering agent and a solvent. The catalytic activity interfering agent is a compound having at least one of an amide group and an amino group. The solvent contains glycol ether. The catalytically active interfering agent is dispersed in the solvent. That is, the solvent containing glycol ether is a dispersion medium. The electroless plating suppressing composition is used in a method for manufacturing plated parts. For example, the electroless plating suppressing composition is applied to a portion of the base material where the formation of the electroless plating film is not planned in the method for manufacturing a plated part, and suppresses the formation of the electroless plating film.

The catalytic activity interfering agent is not particularly limited as long as it is a compound having at least one of an amide group and an amino group, but a polymer is preferable. When the catalytic activity interfering agent is a polymer having at least one of an amide group and an amino group (hereinafter, appropriately referred to as "amide group / amino group-containing polymer"), the weight average molecular weight thereof is, for example, 1,000 to 1,000. It may be 1,000,000. The amide group / amino group-containing polymer uniformly forms the surface of various types of substrates as a polymer layer (hereinafter, appropriately referred to as “catalytically active interfering layer” or “interfering layer”) in the method for producing plated parts. You can cover it and stay there. As a result, the formation of the electroless plating film can be suppressed regardless of the type, shape and state of the base material. As a result, the range of choices for the base material is widened. The weight average molecular weight of the catalytic activity interfering agent can be measured, for example, by gel permeation chromatography (GPC) in terms of polystyrene.

The amide group / amino group-containing polymer may be a polymer having only an amide group, a polymer having only an amino group, or a polymer having both an amide group and an amino group. .. Any amide group / amino group-containing polymer can be used, but a polymer having an amide group is preferable, and a branched polymer having a side chain is preferable from the viewpoint of hindering the catalytic activity of the electroless plating catalyst. .. In the branched polymer, the side chain preferably contains at least one of an amide group and an amino group, and more preferably the side chain contains an amide group.

The mechanism by which the amide group / amino group-containing polymer interferes with the catalytic activity of the electroless plating catalyst is not clear, but it is presumed as follows. The amide group and / or the amino group are adsorbed, coordinated, reacted, etc. on the electroless plating catalyst to form a complex, whereby the electroless plating catalyst is trapped in the amide group / amino group-containing polymer. In particular, the amide group and / or amino group contained in the side chain of the branched polymer has a high degree of freedom, and a large number of amide groups and / or amino groups can be contained in one molecule of the branched polymer. Therefore, the branched polymer can efficiently and strongly trap the electroless plating catalyst by a plurality of amide groups and / or amino groups. For example, the branched polymer can act as a polydentate ligand and multiple amide and / or amino groups can coordinate with the electroless plating catalyst to form a chelate structure. The electroless plating catalyst trapped in this way cannot exhibit catalytic activity. For example, when a metal such as palladium is applied onto the interfering layer as an electroless plating catalyst, the amide and / or amino groups of the branched polymer trap palladium in the form of palladium ions. Palladium ions are reduced by a reducing agent contained in the electroless plating solution to become metallic palladium, which exhibits electroless plating catalytic activity. However, the palladium ions trapped in the branched polymer are not reduced by the reducing agent contained in the electroless plating solution, and cannot exhibit catalytic activity. As a result, the formation of the electroless plating film is suppressed on the surface of the catalytically active interfering layer or the formed base material. However, this mechanism is only an estimation, and the present invention is not limited thereto.

The amide group contained in the amide group / amino group-containing polymer is not particularly limited and may be any of a primary amide group, a secondary amide group and a tertiary amide group, and is contained in the amide group / amino group-containing polymer. The amino group is not particularly limited, and may be any of a primary amino group, a secondary amino group, and a tertiary amino group. Only one kind of these amide groups and amino groups may be contained in the polymer, or two or more kinds thereof may be contained.

When a branched polymer is used as the amide group / amino group-containing polymer, the amide group contained in the branched polymer is preferably a secondary amide group from the viewpoint of efficiently interfering with the catalytic activity of the electroless plating catalyst. , It is preferable that an isopropyl group is bonded to the nitrogen of the amide group. The amino group contained in the branched polymer is preferably a primary amino group (-NH ₂ ) or a secondary amino group (-NH-).

The side chain of the branched polymer may have at least one of an amide group and an amino group, and may further have a sulfur-containing group. Sulfur-containing groups tend to adsorb electroless plating catalysts, like the above-mentioned amide groups and amino groups. This promotes the effect of the branched polymer interfering with the catalytic activity of the electroless plating catalyst. The group containing sulfur is not particularly limited, and is, for example, a sulfide group, a dithiocarbamate group, a thiocyanate group, and preferably a dithiocarbamate group. Only one type of these sulfur-containing groups may be contained in the side chain of the branched polymer, or two or more types may be contained.

The branched polymer is preferably a dendritic polymer. A dendritic polymer is a polymer composed of a molecular structure that frequently repeats regular branching, and is classified into a dendrimer and a hyperbranched polymer. A dendrimer is a spherical polymer with a diameter of several nm that has a regular and completely dendritic structure centered on a core molecule, and a hyperbranched polymer is different from a dendrimer that has a complete dendritic structure. It is a polymer with complete dendritic branches. Among the dendritic polymers, the hyperbranched polymer is preferable as the branched polymer of the present embodiment because it is relatively easy to synthesize and inexpensive.

Since the dendritic polymer has many side chain portions having a high degree of freedom, it is easily adsorbed on the electroless plating catalyst and can efficiently interfere with the catalytic activity of the electroless plating catalyst. Therefore, the dendritic polymer efficiently acts as a catalytic activity interfering agent even when it is thinned. Further, since the dispersion liquid of the dendritic polymer has a low viscosity even at a high concentration, it is possible to form an interfering layer having a uniform film thickness even on a substrate having a complicated shape. Furthermore, dendritic polymers have high heat resistance. Therefore, it is suitable for plated parts that require solder reflow resistance.

The dendritic polymer may contain a functional group having a high affinity with the base material in addition to the amide group and / or the amino group. As a result, the adhesion between the base material and the catalytically active interfering layer can be strengthened. A functional group having a high affinity with the base material can be appropriately selected depending on the type of the base material. For example, when the base material is a material having an aromatic ring such as polyphenylene sulfide or a liquid crystal polymer, the dendritic polymer preferably contains an aromatic ring. When the base material is glass, the dendritic polymer preferably contains a silanol group having a high affinity for glass.

The dendritic polymer of the present embodiment is preferably, for example, a polymer represented by the following formula (1) described in International Publication No. 2018/131492. The polymer represented by the following formula (1) acts efficiently as a catalytic activity interfering agent. Further, the polymer represented by the formula (1) is easily dispersed in glycol ether (good initial dispersibility), and further easily maintains the dispersibility for a long period of time (good dispersion stability).

式（１）において、Ａ^１は芳香環を含む基であり、Ａ^２はアミド基を含む基であり、Ａ^３は硫黄を含む基であり、Ｒ^０は、水素又は炭素数１〜１０個の置換若しくは無置換の炭化水素基であり、ｍ１は０．４〜１１であり、ｎ１は５〜１００である。ｍ１は０．５〜１１が好ましい。

In formula (1), A ¹ is a group containing an aromatic ring, A ² is a group containing an amide group, A ³ is a group containing sulfur, and R ⁰ is hydrogen or 1 to 10 carbon atoms. It is a substituted or unsubstituted hydrocarbon group of, m1 is 0.4 to 11, and n1 is 5 to 100. The m1 is preferably 0.5 to 11.

As A ¹ , any group can be used as long as it contains an aromatic ring, but for example, it is preferably a group represented by the following formula (2).

When A ¹ is a group represented by the formula (2), the hyperbranched structure of the hyperbranched polymer of the present embodiment has a styrene skeleton. When the hyperbranched structure has a styrene skeleton, the weather resistance and heat resistance of the hyperbranched polymer are improved.

Hyperbranched polymers have multiple end groups. In the terminal group of the hyperbranched polymer represented by the above formula (1), A ² is a group containing an amide group, and A ³ is a group containing sulfur. Further, m1 is an average value of the number (repetition number) m of the groups (A ² ) containing the amide group in each terminal group. Therefore, m1 does not have to be an integer. The hyperbranched polymer of the present embodiment may have an average value of m1 of 0.4 to 11, and may have a terminal group having no group (A ² ) containing an amide group. The m1 is preferably 0.5 to 11. The number (repetition number) m of the group (A ² ) containing the amide group in each terminal group is, for example, 0 to 11. M1 in the formula (1) is a quotient obtained by dividing the total number of groups (A ² ) containing an amide group in the molecule (total of m in the molecule) by the number of terminal groups. The value of m1 can be quantified by an NMR method or an elemental analysis method.

In the above formula (1), A ² is not particularly limited as long as it is a group containing an amide group, and the amide group contained in A ² is any of a primary amide group, a secondary amide group and a tertiary amide group. It may be. Further, A ² may be a group containing one amide group or a group containing two or more amide groups. A ² is preferably a group represented by the following formula (3). When A ² is a group represented by the following formula (3), the hyperbranched polymer of the present embodiment has a higher metal trapping ability. As a result, the electroless plating suppressing effect is further enhanced.

式（３）において、Ｒ^１は炭素数が１〜５である置換若しくは無置換のアルキレン基、又は単結合であり、Ｒ^２及びＲ^３は、それぞれ、炭素数が1〜１０である置換若しくは無置換のアルキル基又は水素である。また、式（３）において、Ｒ^１は単結合であることが好ましく、Ｒ^２は水素であることが好ましく、Ｒ^３はイソプロピル基であることが好ましい。

In the formula (3), R ¹ is a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms, or a single bond, and R ² and R ³ are substituted or substituted having 1 to 10 carbon atoms, respectively. It is an unsubstituted alkyl group or hydrogen. Further, in the formula (3), R ¹ is preferably a single bond, R ² is preferably hydrogen, and R ³ is preferably an isopropyl group.

In the above formula (1), A ³ is not particularly limited as long as it is a group containing sulfur, for example, dithiocarbamate group, trithiocarbonate group, a sulfide group, a thiocyanate group and the like, but being, dithiocarbamates It is preferably a group. When A ³ is a dithiocarbamate group, the hyperbranched polymer of the present embodiment, synthesis facilitated and also improves metal trapping capability. Moreover, A ³ is preferably a group represented by the following formula (4).

式（４）において、Ｒ^４及びＲ^５は、それぞれ、炭素数が１〜５である置換若しくは無置換のアルキル基、又は水素である。また、式（４）において、Ｒ^４及びＲ^５はエチル基であることが好ましい。

In formula (4), R ⁴ and R ⁵ are substituted or unsubstituted alkyl groups having 1 to 5 carbon atoms or hydrogen, respectively. Further, in the formula (4), R ⁴ and R ⁵ are preferably ethyl groups.

In the above formula (1), any hydrocarbon group can be used as long as R ⁰ is hydrogen or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms. The hydrocarbon group may be a chain or cyclic saturated aliphatic hydrocarbon group, a chain or cyclic unsaturated aliphatic hydrocarbon group, or an aromatic hydrocarbon group. When R ⁰ is a substituted hydrocarbon group, the substituents are, for example, an alkyl group, a cycloalkyl group, a vinyl group, an allyl group, an aryl group, an alkoxy group, a halogen group, a hydroxy group, an amino group, an imino group, and the like. It may be a nitro group, a silyl group, an ester group or the like. Further, R ⁰ may be an unsubstituted hydrocarbon group, for example, a vinyl group or an ethyl group.

The hyperbranched polymer of the present embodiment may be a mixture of hyperbranched polymers having different ^R0 in the formula (1). For example, when R ⁰ has an unsaturated bond, some addition reaction may occur in a part of the unsaturated bond in the process of synthesizing the hyperbranched polymer, resulting in a saturated bond. In this case, in the above formula (1), a mixture of a hyperbranched polymer in which R ⁰ is an unsaturated hydrocarbon group and a hyperbranched polymer in which R ⁰ is a saturated hydrocarbon group is obtained. The hyperbranched polymer of the present embodiment may be a mixture of a hyperbranched polymer in which R ⁰ is a vinyl group and a hyperbranched polymer in which R ⁰ is an ethyl group in the above formula (1).

The hyperbranched polymer of the present embodiment preferably has a number average molecular weight of 3,000 to 30,000, a weight average molecular weight of 10,000 to 300,000, and a number average molecular weight of 5,000. It is more preferably ~ 30,000 and the weight average molecular weight is 14,000 to 200,000. When the number average molecular weight or the weight average molecular weight is within the above range, the dispersibility and dispersion stability in the electroless plating suppressing composition and the plating suppressing effect are further improved. The weight average molecular weight and the number average molecular weight of the hyperbranched polymer can be measured, for example, by gel permeation chromatography (GPC) in terms of polystyrene.

The method for synthesizing the hyperbranched polymer of the present embodiment is not particularly limited, and can be synthesized by any method. For example, the hyperbranched polymer of the present embodiment may be synthesized using a commercially available hyperbranched polymer as a starting material. Further, the hyperbranched polymer of the present embodiment may be synthesized by sequentially performing monomer synthesis, monomer polymerization, terminal group modification, and the like. The weight average molecular weight and number average molecular weight of the hyperbranched polymer of the present embodiment, m1 and n1 in the formula (1) are predetermined by adjusting the ratio of reagents used for synthesis, synthesis conditions, etc. by any method. Can be adjusted within the range of.

The blending amount of the catalytic activity interfering agent in the electroless plating suppressing composition is not particularly limited, but the above blending amount is from the viewpoint of balancing the dispersibility, dispersion stability, and plating suppressing effect of the catalytic activity interfering agent. , 0.2% by weight to 5.0% by weight, more preferably 0.3% by weight to 2.0% by weight. Further, from the viewpoint of improving the dispersion stability of the catalytic activity interfering agent, the blending amount is more preferably 0.2% by weight to 2.0% by weight, and from the viewpoint of improving the plating suppressing effect, 0.3% by weight. ~ 5.0% by weight is more preferable.

The glycol ether contained in the solvent is not particularly limited as long as it is a monoether of a dihydric alcohol or a diether of a dihydric alcohol. For example, from the viewpoint of improving the dispersibility of the catalytic activity interfering agent, the compound represented by the following formula (G) is preferable.

式（Ｇ）において、
Ｒ¹¹は、炭素数１〜４個である、直鎖又は分岐鎖のアルキル基であり、
Ｒ¹²は、エチレン基又はプロピレン基であり、
Ｒ¹³は、水素原子又は、炭素数１〜４個である、直鎖又は分岐鎖のアルキル基であり、
Ｒ¹¹とＲ¹³は、同一の基であっても異なる基であってもよく、
ｎは、１又は２である。

In formula (G)
R ¹¹ is a linear or branched alkyl group having 1 to 4 carbon atoms.
R ¹² is an ethylene group or a propylene group and
R ¹³ is a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms.
R ¹¹ and R ¹³ may be the same group or different groups.
n is 1 or 2.

In formula (G), R ¹³ may be a hydrogen atom. In this case, the glycol ether represented by the formula (G) is a monoether. Further, in the formula (G), R ¹³ may be an alkyl group instead of a hydrogen atom. In this case, the glycol ether represented by the formula (G) is a diether. When the glycol ether represented by the formula (G) is a diether, it is preferable that the number of carbon atoms contained in the formula (G) is small from the viewpoint of improving the dispersibility of the catalytic activity interfering agent. For example, when the glycol ether represented by the formula (G) is a diether, R ¹¹ and R ¹³ are each a methyl group or an ethyl group, and n is preferably 1.

Further, in the method for producing a plated part, the electroless plating suppressing composition is applied onto a base material and then dried to form a catalytic activity interfering layer. From the viewpoint of improving the dryness of the electroless plating suppressing composition, n is preferably 1 in the formula (G).

Examples of the glycol ether include ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, diethylene glycol monoisobutyl ether, dipropylene glycol monomethyl ether, and ethylene glycol dimethyl ether. Among them, ethylene glycol. Monobutyl ether and propylene glycol monomethyl ether are preferable. By using these glycol ethers, the dispersibility of the catalytic activity interfering agent is further improved. These glycol ethers may be used alone or in combination of two or more.

The solvent may further include alcohol. The alcohol contained in the solvent is a compound different from the glycol ether described above. When the solvent contains alcohol together with glycol ether, the dispersion stability of the catalytic activity interfering agent is improved. Further, from the viewpoint of improving the drying property of the electroless plating suppressing composition in the method for producing plated parts, the number of carbon atoms contained in the alcohol is preferably 2 to 6. From the same viewpoint, the alcohol is preferably a monohydric alcohol or a divalent alcohol, and more preferably a monohydric alcohol.

The alcohol may be composed of a hydrocarbon group and a hydroxyl group. In this case, the alcohol does not contain an oxygen atom other than the oxygen atom contained in the hydroxyl group, and does not contain, for example, an ether bond. The hydrocarbon group contained in the alcohol may be a straight chain or a branched chain. The hydrocarbon group may be a saturated hydrocarbon group or an unsaturated hydrocarbon group.

Alcohols include, for example, ethanol, 1-propanol (n-propanol), 2-propanol (isopropyl alcohol), 1-butanol (n-butanol), 2-butanol, 1-pentanol (n-pentanol), 1- Hexanol (n-hexanol), ethylene glycol, propylene glycol, diethylene glycol, 1,3-butandiol, 1,2-hexanediol can be mentioned, and ethanol, 2-propanol and n-butanol are preferable. By using these alcohols, the dispersion stability of the catalytic activity interfering agent is further improved. These alcohols may be used alone or in combination of two or more.

In the electroless plating suppressing composition, the weight ratio (X / Y) of the blended amount (X) of glycol ether to the blended amount (Y) of the alcohol is not particularly limited, but the dispersibility and dispersion of the catalytic activity interfering agent are not particularly limited. From the viewpoint of balancing the stability and the plating suppressing effect, the weight ratio (X / Y) = 2/98 to 100/0, 2/98 to 80/20, 5/95 to 80/20, or 5 / It is preferably 95 to 49/51. Further, the weight ratio (X / Y) = 5/95 to 100/0 is more preferable from the viewpoint of improving the dispersibility of the catalytically active interfering agent, and the weight ratio is more preferable from the viewpoint of improving the dispersion stability of the catalytically active interfering agent. (X / Y) = 2/98 to 49/51 is more preferable. Further, in the method for manufacturing plated parts, for example, the weight ratio (X / Y) = 40/60 to 60/40 is preferable from the viewpoint of suppressing deformation of the base material due to the solvent and expanding the range of base material selection.

From the viewpoint of improving the dispersibility of the catalytic activity interfering agent, the weight ratio of the catalytic activity interfering agent compounding amount (Z) to the glycol ether compounding amount (X) is, for example, (Z / X) × 100 =. It is preferably 0.4% by weight to 25.0% by weight, more preferably 1.02% by weight to 10.0% by weight.

The solvent may be composed of only glycol ether or only glycol ether and alcohol, and may be composed of other organic solvents in addition to glycol ether and alcohol as long as the effects of the present embodiment are not impaired. May include. Further, the blending amount (X) of glycol ether or the total blending amount (X + Y) of glycol ether and alcohol in the electroless plating suppressing composition is, for example, 90% by weight to 99% by weight, or 95% by weight. ~ 99% by weight.

The electroless plating suppressing composition of the present embodiment may be composed only of a catalytic activity interfering agent and a solvent. Further, the electroless plating suppressing composition of the present embodiment may contain a general-purpose additive such as a wettability adjusting agent in addition to the catalytic activity interfering agent and the solvent.

The electroless plating suppression composition of the present embodiment can be prepared by a general-purpose method. For example, the electroless plating suppressing composition is prepared by mixing a catalytic activity interfering agent, a solvent containing glycol ether, and if necessary, other additives using a general-purpose device such as a stirrer, an ultrasonic disperser, or a mixer. Can be prepared.

The electroless plating suppressing composition of the present embodiment has the following effects, for example. The electroless plating suppressing composition contains a catalytic activity interfering agent. In the method for manufacturing plated parts, by applying the electroless plating suppressing composition of the present embodiment to a portion where the electroless plating film of the base material is not planned to be formed, it depends on the type, shape and state of the base material. It is possible to suppress the formation of the electroless plating film in the portion where the formation of the electroless plating film is not planned. As a result, it is possible to manufacture a plated part having a clear contrast between the portion having the plating film and the portion having no plating film.

Further, the electroless plating suppressing composition uses a solvent containing glycol ether as a dispersion medium for dispersing the catalytic activity interfering agent. Glycol ether is a good dispersion medium that disperses catalytically active interfering agents well. Further, for example, solvents such as methyl ethyl ketone (MEK) and ethyl acetate erode many kinds of resin base materials, but glycol ethers do not easily erode the resin base material. Therefore, by using glycol ether as the dispersion medium, the range of choice of the base material is widened.

The electroless plating suppressing composition of the present embodiment may further contain alcohol as a solvent. Alcohol also does not easily erode the resin base material. Further, by containing alcohol in addition to glycol ether, the dispersion stability of the catalytic activity interfering agent is further improved, and the dispersed state can be stably maintained for a long period of time. This mechanism is presumed as follows. Glycol ether is a solvent (good dispersion medium) that easily disperses the catalytic activity interfering agent, but since the catalytic activity interfering agent easily spreads in the good dispersion medium, aggregation may occur over time. On the other hand, alcohol is a solvent (poor dispersion medium) that does not disperse or is difficult to disperse the catalytic activity interfering agent. That is, the dispersibility (initial dispersibility) of the catalytically active interfering agent with respect to alcohol is poor. The inventors have found that by mixing glycol ether, which is a good dispersion medium, and alcohol, which is a poor dispersion medium, both dispersibility and dispersion stability can be achieved. It is presumed that this is because the spread of the catalytic activity interfering agent dispersed by the glycol ether in the mixed solvent is appropriately suppressed by the alcohol which is the poor dispersion medium. However, this mechanism is only an estimation, and the present invention is not limited thereto.

From the viewpoint of further enhancing the dispersibility and dispersion stability of the catalytic activity interfering agent, alcohols include ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 1-pentanol, 1-hexanol, and ethylene glycol. At least one selected from the group consisting of propylene glycol, diethylene glycol, 1,3-butanediol, and 1,2-hexanediol, and the glycol ether is ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethylene glycol. It is preferably at least one selected from the group consisting of monomethyl ether, ethylene glycol monoisopropyl ether, diethylene glycol monoisobutyl ether, dipropylene glycol monomethyl ether, and ethylene glycol dimethyl ether. From the same viewpoint, the catalytic activity interfering agent is a polymer, and the weight average molecular weight of the catalytic activity interfering agent is preferably 1,000 to 1,000,000, and in the electroless plating inhibitory composition, The blending amount of the catalytic activity interfering agent is preferably 0.2% by weight to 5.0% by weight. Further, by combining the above-mentioned solvent containing a specific alcohol and a specific glycol with the above-mentioned catalytic activity interfering agent which is a polymer having a specific weight average molecular weight in a specific blending amount, the catalytic activity interfering agent is dispersed. The properties and dispersion stability can be further enhanced.

The electroless plating suppressing composition of the present embodiment has high dispersion stability of the catalytic activity interfering agent. Therefore, for example, in the method for manufacturing plated parts, even if the electroless plating suppressing composition is used for a long period of time, aggregation and precipitation are unlikely to occur in the electroless plating suppressing composition, and the concentration of the catalytic activity interfering agent. Is easy to maintain uniformly. Therefore, the electroless plating suppressing composition of the present embodiment can be used, for example, for mass production of plated parts.

[Manufacturing method of plated parts]
A method for manufacturing the plated parts of the present embodiment will be described with reference to the flowchart shown in FIG. The plated parts manufactured in the present embodiment are plated parts on which a plating film is selectively formed, and an electroless plating film is formed on a part of the surface of the base material (predetermined pattern, predetermined portion). The electroless plating film is not formed on the parts other than the above.

First, the electroless plating suppressing composition of the present embodiment described above is applied to the surface of the base material (step S1 in FIG. 1).

The material of the base material is not particularly limited, but an insulator is preferable from the viewpoint of forming an electroless plating film on the surface, and for example, a thermoplastic resin, a thermosetting resin, a photocurable resin, ceramics, glass or the like may be used. it can. Among them, a resin base material formed of a resin is preferable as the base material because of ease of molding.

Examples of the thermoplastic resin include nylon 6 (PA6), nylon 66 (PA66), nylon 12 (PA12), nylon 11 (PA11), nylon 6T (PA6T), nylon 9T (PA9T), 10T nylon, 11T nylon, and nylon MXD6. Polyamides such as (PAMXD6), nylon 9T / 6T copolymer, and nylon 6.66 copolymer can be used. Resins other than polyamide include polypropylene, polymethylmethacrylate, polycarbonate (PC), amorphous polyolefin, polyetherimide, polyethylene terephthalate, polyetheretherketone, ABS resin, polyphenylene sulfide (PPS), polyamideimide, polylactic acid, and polycaprolactone. , Liquid crystal polymer (LCP), cycloolefin polymer and the like can be used. Among them, polyphenylene sulfide (PPS), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS resin), liquid crystal polymer (LCP), and nylon 6 (PA6) are highly versatile and of the present embodiment. The solvent of the electroless plating suppressing composition is preferable as a material for the base material because there is little possibility of deforming the base material containing these thermoplastic resins. These thermoplastic resins may be used alone or in combination of two or more.

As the thermosetting resin, a silicone resin, an epoxy resin or the like can be used. By using a transparent thermosetting resin, a transparent device (plated part) having solder reflow resistance can be manufactured. As the photocurable resin, acrylic resin, silicone resin, epoxy resin, polyimide and the like can be used. Further, as the ceramics, alumina, aluminum nitride, lead zirconate titanate (PZT), barium titanate, silicon wafer and the like can be used.

The base material used in the present embodiment may be a commercially available product, or may be manufactured from a commercially available material by molding or the like. Further, the base material used in the present embodiment may be a foam molded product having a foam cell inside.

The electroless plating suppressing composition applied on the substrate preferably forms a catalytically active interfering layer (interfering layer) on the substrate. The interfering layer is preferably thin so as not to affect the physical properties such as heat resistance of the base material and the electrical characteristics such as the dielectric constant. The thickness of the interfering layer is, for example, preferably 5000 nm or less, more preferably 1000 nm or less, and even more preferably 300 nm or less. On the other hand, from the viewpoint of interfering with the catalytic activity of the electroless plating catalyst, for example, 10 nm or more is preferable, 30 nm or more is more preferable, and 50 nm or more is even more preferable. From the viewpoint of suppressing the formation of the electroless plating film other than the predetermined pattern, the interfering layer is preferably formed at least in the region of the substrate surface that comes into contact with the electroless plating solution in the electroless plating step described later. , It is more preferable to form it on the entire surface of the base material.

The method for forming the interfering layer on the surface of the base material is not particularly limited. For example, the electroless plating suppressing composition may be applied to the base material, or the base material may be immersed in the electroless plating suppressing composition. Specific examples of the forming method include dip coating, screen coating, spray coating and the like. Above all, a method (dip coating) of immersing the base material in the electroless plating suppressing composition is preferable from the viewpoint of the uniformity of the forming interfering layer and the convenience of work.

The temperature and immersion time of the electroless plating suppressing composition when the base material is immersed in the electroless plating suppressing composition are not particularly limited, and the type of catalytic activity interfering agent, the film thickness of the interfering layer to be formed, and the like are taken into consideration. Can be decided as appropriate. The temperature of the electroless plating suppressing composition is, for example, 0 ° C. to 100 ° C., or 10 ° C. to 50 ° C., and the immersion time is, for example, 1 second to 10 minutes, or 5 seconds to 2 minutes.

Next, a part of the surface of the base material to which the electroless plating suppressing composition is applied is heated or irradiated with light (step S2 in FIG. 1). The method of irradiating the light is not particularly limited, and for example, a method of irradiating the surface of the base material with laser light according to a predetermined pattern (laser drawing), or after masking a portion not irradiated with light, the entire surface of the base material is covered. Examples thereof include a method of irradiating light. It is presumed that by irradiating a part of the surface of the base material with light, the light is converted into heat and the surface of the base material is heated. Further, as a method of heating the surface of the base material without irradiating the surface of the base material with light, there is a method of directly heat-pressing the surface of the base material with a simple mold or the like in which a pattern is formed by convex portions. Be done. It is preferable to heat the base material by laser drawing because it is easy to work and the selectivity of the heated portion is excellent, and further, the pattern can be easily changed and miniaturized.

The laser light can be irradiated by using a laser device such as a CO ₂ laser, a YVO ₄ laser, or a YAG laser, and these laser devices can be appropriately selected depending on the type of catalytically active interfering agent used for the interfering layer.

The interfering layer is removed on a part of the surface of the heated or light-irradiated substrate (heated portion). Here, "removal of the disturbing layer" means, for example, that the disturbing layer of the heated portion disappears by evaporation. By performing a laser drawing of a predetermined pattern on the surface of the base material to which the disturbing layer is applied, a disturbing layer removing portion of the predetermined pattern and a disturbing layer remaining portion in which the disturbing layer remains can be formed. In the disturbing layer removing portion which is the heating portion, the surface layer portion of the base material may evaporate and disappear together with the disturbing layer. Further, the “removal of the disturbing layer” includes not only the case where the disturbing layer completely disappears but also the case where the disturbing layer remains to the extent that the progress of the electroless plating treatment in the subsequent step is not affected. Even if the interfering layer remains, if it does not affect the electroless plating treatment in the subsequent step, the action of interfering with the catalytic activity of the electroless plating catalyst disappears. Further, in the present embodiment, the case where the heated portion of the disturbing layer is denatured or deteriorated so as not to act as the disturbing layer is also included in "removal of the disturbing layer". For example, if the catalytic activity interfering agent is an amide / amino group-containing polymer, the amide and / or amino groups are modified or altered, and as a result, the amide / amino group-containing polymer cannot trap the electroless plating catalyst. Can be mentioned. In this case, the heated portion of the interfering layer is not completely eliminated, but a modified product (altered product) remains. This modified product does not interfere with catalytic activity. Therefore, the portion where the disturbing layer is denatured or altered also has the same effect as the portion where the disturbing layer disappears.

Next, an electroless plating catalyst is applied to the surface of the base material that has been heated or irradiated with light (step S3 in FIG. 1). The method of applying the electroless plating catalyst to the surface of the base material is not particularly limited. For example, the electroless plating catalyst may be applied to the base material by a general-purpose method such as a sensitizer / activator method or a catalyzer / accelerator method. Further, for example, an electroless plating catalyst may be applied to the surface of the base material by using a plating catalyst solution containing a metal salt such as palladium chloride disclosed in JP-A-2017-036486. As the plating catalyst solution containing the metal salt, a commercially available activator treatment solution may be used.

Next, the electroless plating solution is brought into contact with the surface of the base material (step S4 in FIG. 1). On the surface of the base material, there are a remaining part of the disturbing layer in which the disturbing layer remains and a portion of removing the disturbing layer having a predetermined pattern in which the disturbing layer is removed by heating or the like. By applying an electroless plating catalyst to the surface of the base material and bringing it into contact with the electroless plating solution, an electroless plating film can be formed only on the part where the disturbing layer is removed in a predetermined pattern.

As the electroless plating solution, any general-purpose electroless plating solution can be used depending on the purpose, but from the viewpoint of high catalytic activity and stable solution, electroless nickel phosphorus plating solution and electroless copper plating solution , Electroless nickel plating solution is preferable.

A different type of electroless plating film may be further formed on the electroless plating film, or an electrolytic plating film may be formed by electrolytic plating. By increasing the total thickness of the plating film on the base material, the electric resistance can be reduced when the plating film having a predetermined pattern is used as an electric circuit. From the viewpoint of reducing the electrical resistance of the plating film, the plating film laminated on the electroless plating film is preferably an electroless copper plating film, an electrolytic copper plating film, an electroless nickel plating film or the like. Further, since electrolytic plating cannot be performed on an electrically isolated circuit, in such a case, it is preferable to increase the total thickness of the plating film on the base material by electroless plating. Further, in order to improve the solder wettability of the plating film pattern so as to correspond to solder reflow, a plating film of tin, gold, silver or the like may be formed on the outermost surface of the plating film pattern.

In the method for manufacturing the plated parts of the present embodiment, by using the electroless plating suppressing composition, the formation of the electroless plating film is not planned in the portion regardless of the type, shape and state of the base material. The formation of electroless plating film can be suppressed. The method for manufacturing a plated part of the present embodiment can manufacture a plated part having a clear contrast between a portion having a plating film and a portion having no plating film.

The electroless plating suppressing composition used in the method for producing plated parts of the present embodiment has high dispersion stability of a catalytic activity interfering agent. Therefore, even if it is used for a long time, aggregation and precipitation are unlikely to occur in the electroless plating suppressing composition, and it is easy to maintain a uniform concentration of the catalytic activity interfering agent. Therefore, the method for manufacturing plated parts of the present embodiment is suitable for mass production of plated parts.

In the method for manufacturing plated parts described above, an electroless plating suppressing composition is applied to a base material (step S1 in FIG. 1), and then a part of the surface of the base material is heated or irradiated with light (FIG. 1). Step S2). However, the present embodiment is not limited to this, and even if a part of the surface of the base material is heated or irradiated with light (step S2 in FIG. 1) and then the electroless plating suppressing composition is applied to the base material. Good. For example, since the surface of the base material drawn by laser drawing (light irradiation) is roughened, even if an electroless plating suppressing composition is applied thereto, a sufficient interfering layer for suppressing electroless plating is not formed. .. Therefore, the plating film can be selectively formed only on the laser drawing portion.

Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples and Comparative Examples.

Samples 1-28 (electroless plating suppressing composition) were prepared by the method described below. The compositions of Samples 1-28 are shown in Tables 1-5. Further, the electroless plating suppressing compositions of Samples 1 to 6 and 8 to 28 correspond to the examples of the present invention, and Sample 7 corresponds to the comparative example of the present invention.

[Sample 1]
As a catalytic activity interfering agent, a hyperbranched polymer represented by the following formula (5) was synthesized by the method disclosed in International Publication No. 2018/131492.

The hyperbranched polymer represented by the formula (5) is a polymer represented by the formula (1), and in the formula (1), A ¹ is a group represented by the formula (2); A ² is a formula. The group represented by (3), R ¹ is a single bond, R ² is hydrogen, R ³ is an isopropyl group; A ³ is a dithiocarbamate group represented by the formula (4). Yes, R ⁴ and R ⁵ are ethyl groups, and R ⁰ is a vinyl or ethyl group.

The molecular weight of the synthesized hyperbranched polymer was measured by GPC (gel permeation chromatography). The molecular weights were number average molecular weight (Mn) = 9,946 and weight average molecular weight (Mw) = 24,792, and the number average molecular weight (Mn) peculiar to the hyperbranched structure and the weight average molecular weight (Mw) were significantly different. It was a value.

After mixing the synthesized hyperbranched polymer represented by the formula (5), the wettability adjusting agent, and glycol ether at the composition ratio shown in Table 1, the mixture is stirred and dispersed using a tornado stirrer manufactured by AS ONE Corporation for about 30 minutes. Then, Sample 1 (electroless plating suppressing composition) was prepared.

[Samples 2-6]
Samples 2 to 6 are samples except that they further contain alcohol and the weight ratio (X / Y) of the glycol ether compounding amount (X) to the alcohol compounding amount (Y) is set to the value shown in Table 1. It was prepared by the same method as in 1.

[Sample 7]
Sample 7 was prepared by the same method as that of Sample 1 except that it did not contain glycol ether and instead contained alcohol.

[Samples 8-23]
Samples 8 to 23 were prepared in the same manner as in Sample 1 except that they further contained alcohol and the compounds shown in Tables 2 and 3 were used as glycol ether and alcohol.

[Samples 24-28]
Samples 24 to 28 were prepared in the same manner as in Sample 1 except that they further contained alcohol and the blending amounts of glycol ether and catalytic activity interfering agent were set to the values shown in Table 4.

[Evaluation method]
The following evaluations were performed on Samples 1 to 28. The evaluation results are shown in Tables 1 to 5. The evaluation results of Sample 4 are shown in Tables 1, 4 and 5 in an overlapping manner.

(1) Dispersibility The average particle size of the catalytic activity interfering agent contained in the prepared samples 1-28 (electroless plating suppressing composition) was measured using a particle size distribution measuring device (manufactured by BECKMAN COULTER, N4 Plus). The dispersibility of the sample was evaluated based on the following evaluation criteria. It can be judged that the smaller the measured average particle size, the better the dispersibility of the catalytic activity interfering agent in the sample.

<Evaluation criteria for dispersibility>
◯: The average particle size of the catalytic activity interfering agent was less than 150 nm.
Δ: The average particle size of the catalytic activity interfering agent was 150 nm or more and less than 250 nm.
X: The average particle size of the catalytic activity interfering agent was 250 nm or more.

(2) Dispersion stability The prepared samples 1 to 28 (electroless plating suppressing composition) were housed in closed containers, and the whole closed container was stored in a constant temperature bath at 60 ° C. for 1 month. The average particle size of the catalytic activity interfering agent contained in each sample was measured before and after storage by the same method as the evaluation of dispersibility. The rate of change R (%) of the average particle size of the catalytically active interfering agent before and after storage was calculated by the following formula. The dispersion stability of the sample was evaluated based on the following evaluation criteria. It can be judged that the smaller the rate of change R (%) of the average particle size of the catalytic activity interfering agent, the better the storage stability of the sample.

R (%) = (AB) / B × 100

A: Average particle size (nm) of catalytically active interfering agent after storage
B: Average particle size (nm) of catalytically active interfering agent before storage

<Evaluation criteria for dispersion stability>
◯: The rate of change R of the average particle size of the catalytic activity interfering agent was less than 10%.
Δ: The rate of change R of the average particle size of the catalytic activity interfering agent was 10% or more and less than 15%.
X: The rate of change R of the average particle size of the catalytic activity interfering agent was 15% or more.

(3) Plating suppressing effect The plating suppressing effect of the sample (electroless plating suppressing composition) was evaluated by the method shown below.

First, polyphenylene sulfide (PPS) was molded into a plate-like body of 5 cm × 8 cm × 0.2 cm using a general-purpose injection molding machine. This plate-like body was used as a base material.

The substrate was immersed in each of the samples 1 to 28 at room temperature for 1 second, and then dried in an 85 ° C. dryer for 5 minutes. As a result, a catalytically active interfering layer having a film thickness of about 70 nm was formed on the surface of the base material immersed in the samples 1 to 23. On the surface of the base material immersed in the samples 24, 25, 26, 27 and 28, catalytic activity interfering layers having film thicknesses of about 20 nm, about 40 nm, about 120 nm, about 250 nm and about 600 nm were formed, respectively. An electroless plating catalyst was applied to the surface of the base material on which the catalytic activity interfering layer was formed by a general-purpose method using a commercially available electroless plating catalyst solution (manufactured by Okuno Pharmaceutical Co., Ltd., sensitizer, activator) (sensitizer. Activator method). Next, the base material to which the electroless plating catalyst was applied was immersed in an electroless nickel phosphorus plating solution (manufactured by Okuno Pharmaceutical Co., Ltd., Top Nicolon LPH-L, pH 6.5) adjusted to 60 ° C. for 10 minutes.

The substrate subjected to the above treatment was visually observed, and the plating suppressing effect of the sample was evaluated based on the following evaluation criteria. Regarding sample 4, in addition to the base material of PPS, the base material of polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS resin), liquid crystal polymer (LCP), and nylon 6 (PA6), respectively. Also evaluated. Table 5 shows the evaluation results of the plating suppressing effect of Sample 4 other than the PPS substrate.

<Evaluation criteria for plating suppression effect>
◯: The electroless plating film was not formed on the surface of the base material.
Δ: An electroless plating film was formed on an area of less than 1% of the surface of the base material.
X: An electroless plating film was formed on an area of 1% or more of the surface of the base material.

In Tables 1 to 5, the types of glycol ethers, alcohols and substrates are listed using the following abbreviations.
<Glycol ether>
BG: Ethylene glycol monobutyl ether (SP: 9.8)
PM: Propylene glycol monomethyl ether (SP: 10.4)
MG: Ethylene glycol monomethyl ether (SP: 11.6)
i-PG: Ethylene glycol monoisopropyl ether (SP: 9.2)
i-BDG: Diethylene glycol monoisobutyl ether (SP: 8.7)
MFDG: Dipropylene glycol monomethyl ether (SP: 9.6)
DMG: Ethylene glycol dimethyl ether (SP: 8.6)
<Alcohol>
EtOH: Ethanol NPA: 1-propanol (n-propanol)
IPA: 2-propanol (isopropyl alcohol)
NBA: 1-butanol (n-butanol)
IBA: 2-butanol PeOH: 1-pentanol (n-pentanol)
HxOH: 1-hexanol (n-hexanol)
EG: Ethylene glycol PG: Propylene glycol DEG: Diethylene glycol 1,3-BD: 1,3-Butanediol 1,2-HD: 1,2-Hexanediol <Base material>
PPS: Polyphenylene sulfide (manufactured by Teijin Limited, glass fiber reinforced PPS 1040G, black)
PC: Polycarbonate (manufactured by Idemitsu Kosan, glass fiber reinforced polycarbonate Tafflon GZ2530)
ABS: Acrylonitrile-butadiene-styrene copolymer (Toray Industries, Inc., Toyorak)
LCP: Liquid crystal polymer (Sumitomo Chemical Co., Ltd., Sumika Super LCP)
PA6: Nylon 6 (Ube Industries, Ltd., UBE Nylon (registered trademark) GC1015GC9)

As shown in Tables 1 to 5, all of Samples 1 to 6 and 8 to 28 (electroless plating suppressing composition) had good evaluation results of dispersibility, dispersion stability, and plating suppressing effect. .. On the other hand, as shown in Table 1, the sample 7 containing no glycol ether had poor evaluation results of dispersibility and plating suppressing effect. Since the sample 7 has poor dispersibility, it is presumed that the catalytic activity interfering agent was not uniformly dispersed in the catalytic activity interfering layer in the evaluation of the plating suppressing effect, and therefore the formation of the plating film could not be sufficiently suppressed. Will be done. Since the sample 7 had poor dispersibility, the dispersion stability was not evaluated.

Samples 1 to 7 having different weight ratios (X / Y) shown in Table 1 are compared. Samples 1 to 6 having a weight ratio (X / Y) in the range of 2/98 to 100/0 had good evaluation results of dispersibility, dispersion stability, and plating suppressing effect. Among them, the samples 1 to 5 having a weight ratio (X / Y) in the range of 5/95 to 100/0 are compared with the samples 6 and 7 having a weight ratio (X / Y) outside the above range. , The dispersibility of the catalytic activity interfering agent was better. Further, the samples 4 to 6 having a weight ratio (X / Y) in the range of 2/98 to 49/51 are compared with the samples 1 to 3 and 7 having a weight ratio (X / Y) outside the above range. Therefore, the dispersion stability was better. Further, the samples 3 to 5 having a weight ratio (X / Y) in the range of 5/95 to 80/20 are the samples 1, 2, 6 and 7 having a weight ratio (X / Y) outside the above range. In comparison, the dispersibility and the plating suppressing effect were better. Further, the samples 3 to 6 having a weight ratio (X / Y) in the range of 2/98 to 80/20 are compared with the samples 1 to 2 and 7 having a weight ratio (X / Y) outside the above range. Therefore, the plating suppressing effect was better. Further, the samples 4 and 5 having a weight ratio (X / Y) in the range of 5/95 to 49/51 are samples 1 to 3, 6 and 7 having a weight ratio (X / Y) outside the above range. The dispersibility, dispersion stability, and plating suppressing effect were all better than those of the above.

Samples 24 to 25 and 4 and 26 to 28 shown in Table 4 in which the amounts of the catalytically active interfering agents are different are compared. Samples 24 to 25, 4 and 26 to 28 in which the amount of the catalytic activity interfering agent is in the range of 0.2% by weight to 5.0% by weight are all dispersibility, dispersion stability, and plating suppressing effect. The evaluation result was good. Among them, the samples 24 to 25, 4 and 26 to 27 in which the amount of the catalytic activity interfering agent is in the range of 0.2% by weight to 2.0% by weight has a compounding amount of the catalytic activity interfering agent of 5.0% by weight. The dispersion stability was better than that of sample 28, which was%. Further, in Samples 25, 4 and 26 to 28 in which the amount of the catalytic activity interfering agent is in the range of 0.3% by weight to 5.0% by weight, the amount of the catalytic activity interfering agent is 0.2% by weight. The plating suppressing effect was better than that of a certain sample 24. Further, the samples 25, 4 and 26 to 27 in which the amount of the catalytic activity interfering agent is in the range of 0.3% by weight to 2.0% by weight are the samples in which the amount of the catalytic activity interfering agent is out of the above range. Compared with 24 and 28, the dispersion stability and the plating suppressing effect were both better.

The electroless plating suppressing composition of the present invention has high stability and can be used for a long manufacturing process, for example. Therefore, it can be used for manufacturing mass-produced plated parts such as MIDs used in the fields of smartphones and automobiles.

Claims (11)

An electroless plating suppression composition
A catalytic activity interfering agent, which is a compound having at least one of an amide group and an amino group,
A solvent containing a glycol ether, only including,
An electroless plating suppressing composition in which the catalytic activity interfering agent is a hyperbranched polymer . The electroless plating suppressing composition according to claim 1, wherein the solvent further contains alcohol. In the electroless plating suppressing composition, the weight ratio (X / Y) of the blended amount (X) of the glycol ether to the blended amount (Y) of the alcohol is (X / Y) = 2/98 to 80. The electroless plating suppressing composition according to claim 2, which is / 20. The alcohols are ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 1-pentanol, 1-hexanol, ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, and 1,2. The electroless plating inhibitory composition according to claim 2 or 3, which is at least one selected from the group consisting of -hexanediol. The glycol ether is at least one selected from the group consisting of ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, diethylene glycol monoisobutyl ether, dipropylene glycol monomethyl ether, and ethylene glycol dimethyl ether. The electroless plating inhibitory composition according to any one of claims 1 to 4. The alcohols are ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 1-pentanol, 1-hexanol, ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, and 1,2. -At least one selected from the group consisting of hexanediol,
The glycol ether is at least one selected from the group consisting of ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, diethylene glycol monoisobutyl ether, dipropylene glycol monomethyl ether, and ethylene glycol dimethyl ether. The electroless plating suppressing composition according to claim 2 or 3. Before Symbol weight average molecular weight of catalytic activity interfering agent is 1,000 to 1,000,000, electroless plating inhibiting composition according to any one of claims 1-6. The weight average molecular weight before Symbol catalytic activity interfering agent is from 1,000 to 1,000,000,
The alcohols are ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 1-pentanol, 1-hexanol, ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, and 1,2. -At least one selected from the group consisting of hexanediol,
The glycol ether is at least one selected from the group consisting of ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, diethylene glycol monoisobutyl ether, dipropylene glycol monomethyl ether, and ethylene glycol dimethyl ether. The electroless plating suppressing composition according to claim 2 or 3. The electroless plating according to any one of claims 1 to 8 , wherein the blending amount of the catalytic activity interfering agent in the electroless plating suppressing composition is 0.2% by weight to 5.0% by weight. Inhibition composition. In the electroless plating suppressing composition, the blending amount of the catalytic activity interfering agent is 0.2% by weight to 5.0% by weight.
The electroless plating suppressing composition according to any one of claims 1 to 6, wherein the catalytic activity interfering agent has a weight average molecular weight of 1,000 to 1,000,000. It is a manufacturing method of plated parts.
To impart the electroless plating suppressing composition according to any one of claims 1 to 10 to the surface of the base material.
By heating or irradiating a part of the surface of the base material,
Applying an electroless plating catalyst to the surface of the base material that has been heated or irradiated with light,
A method for manufacturing an electroless plating component, which comprises bringing an electroless plating solution into contact with the surface of the base material to which the electroless plating catalyst is applied to form an electroless plating film on a heated portion or a light irradiation portion of the surface.

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