JP6815025B2 - Polyarylate resin - Google Patents
Polyarylate resin Download PDFInfo
- Publication number
- JP6815025B2 JP6815025B2 JP2016210686A JP2016210686A JP6815025B2 JP 6815025 B2 JP6815025 B2 JP 6815025B2 JP 2016210686 A JP2016210686 A JP 2016210686A JP 2016210686 A JP2016210686 A JP 2016210686A JP 6815025 B2 JP6815025 B2 JP 6815025B2
- Authority
- JP
- Japan
- Prior art keywords
- polyarylate resin
- carboxylic acid
- acid residue
- carbon atoms
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 title claims description 61
- 239000011347 resin Substances 0.000 title claims description 61
- 229920001230 polyarylate Polymers 0.000 title claims description 53
- 125000004432 carbon atom Chemical group C* 0.000 claims description 28
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 16
- 125000003118 aryl group Chemical group 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 6
- 229920006395 saturated elastomer Polymers 0.000 claims description 6
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 229920002223 polystyrene Polymers 0.000 claims description 5
- 125000002521 alkyl halide group Chemical group 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- XDOFQFKRPWOURC-UHFFFAOYSA-N 16-methylheptadecanoic acid Chemical group CC(C)CCCCCCCCCCCCCCC(O)=O XDOFQFKRPWOURC-UHFFFAOYSA-N 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical group CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- 150000001735 carboxylic acids Chemical group 0.000 claims 5
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 33
- 238000000034 method Methods 0.000 description 22
- -1 aliphatic diols Chemical class 0.000 description 19
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 238000000465 moulding Methods 0.000 description 12
- 230000009477 glass transition Effects 0.000 description 11
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 239000008346 aqueous phase Substances 0.000 description 7
- 239000012074 organic phase Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 5
- 238000012695 Interfacial polymerization Methods 0.000 description 5
- 239000004305 biphenyl Substances 0.000 description 5
- 235000010290 biphenyl Nutrition 0.000 description 5
- 125000006267 biphenyl group Chemical group 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 235000006708 antioxidants Nutrition 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- VJGNLOIQCWLBJR-UHFFFAOYSA-M benzyl(tributyl)azanium;chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CC1=CC=CC=C1 VJGNLOIQCWLBJR-UHFFFAOYSA-M 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000003158 alcohol group Chemical group 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000002685 polymerization catalyst Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 2
- ZPQOPVIELGIULI-UHFFFAOYSA-N 1,3-dichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1 ZPQOPVIELGIULI-UHFFFAOYSA-N 0.000 description 2
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 2
- LFDKQJVNMJFNGG-UHFFFAOYSA-N 16-methylheptadecanoyl chloride Chemical compound CC(C)CCCCCCCCCCCCCCC(Cl)=O LFDKQJVNMJFNGG-UHFFFAOYSA-N 0.000 description 2
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 2
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical compound ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- PFURGBBHAOXLIO-UHFFFAOYSA-N cyclohexane-1,2-diol Chemical compound OC1CCCCC1O PFURGBBHAOXLIO-UHFFFAOYSA-N 0.000 description 2
- 229940117389 dichlorobenzene Drugs 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- WTBAHSZERDXKKZ-UHFFFAOYSA-N octadecanoyl chloride Chemical compound CCCCCCCCCCCCCCCCCC(Cl)=O WTBAHSZERDXKKZ-UHFFFAOYSA-N 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 239000003643 water by type Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PFTAWBLQPZVEMU-DZGCQCFKSA-N (+)-catechin Chemical compound C1([C@H]2OC3=CC(O)=CC(O)=C3C[C@@H]2O)=CC=C(O)C(O)=C1 PFTAWBLQPZVEMU-DZGCQCFKSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- ZONJATNKKGGVSU-UHFFFAOYSA-M 14-methylpentadecanoate Chemical compound CC(C)CCCCCCCCCCCCC([O-])=O ZONJATNKKGGVSU-UHFFFAOYSA-M 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- HSSYVKMJJLDTKZ-UHFFFAOYSA-N 3-phenylphthalic acid Chemical class OC(=O)C1=CC=CC(C=2C=CC=CC=2)=C1C(O)=O HSSYVKMJJLDTKZ-UHFFFAOYSA-N 0.000 description 1
- LKJWDWUXGCKFPN-UHFFFAOYSA-N 4-(1,1,1,3,3,3-hexafluoropropan-2-yl)phenol Chemical compound OC1=CC=C(C(C(F)(F)F)C(F)(F)F)C=C1 LKJWDWUXGCKFPN-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 1
- BHWMWBACMSEDTE-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclododecyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCCCCCCCC1 BHWMWBACMSEDTE-UHFFFAOYSA-N 0.000 description 1
- VHLLJTHDWPAQEM-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-4-methylpentan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CC(C)C)C1=CC=C(O)C=C1 VHLLJTHDWPAQEM-UHFFFAOYSA-N 0.000 description 1
- NUDSREQIJYWLRA-UHFFFAOYSA-N 4-[9-(4-hydroxy-3-methylphenyl)fluoren-9-yl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(O)=CC=2)=C1 NUDSREQIJYWLRA-UHFFFAOYSA-N 0.000 description 1
- OAHMVZYHIJQTQC-UHFFFAOYSA-N 4-cyclohexylphenol Chemical compound C1=CC(O)=CC=C1C1CCCCC1 OAHMVZYHIJQTQC-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- CIWBSHSKHKDKBQ-DUZGATOHSA-N D-araboascorbic acid Natural products OC[C@@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-DUZGATOHSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002211 L-ascorbic acid Substances 0.000 description 1
- 235000000069 L-ascorbic acid Nutrition 0.000 description 1
- 239000012359 Methanesulfonyl chloride Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- ADRVNXBAWSRFAJ-UHFFFAOYSA-N catechin Natural products OC1Cc2cc(O)cc(O)c2OC1c3ccc(O)c(O)c3 ADRVNXBAWSRFAJ-UHFFFAOYSA-N 0.000 description 1
- 235000005487 catechin Nutrition 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229950001002 cianidanol Drugs 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- RLMGYIOTPQVQJR-UHFFFAOYSA-N cyclohexane-1,3-diol Chemical compound OC1CCCC(O)C1 RLMGYIOTPQVQJR-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- QTHQYNCAWSGBCE-UHFFFAOYSA-N docosanoyl chloride Chemical compound CCCCCCCCCCCCCCCCCCCCCC(Cl)=O QTHQYNCAWSGBCE-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000004318 erythorbic acid Substances 0.000 description 1
- 235000010350 erythorbic acid Nutrition 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- KXHFYBWOKFEEMI-UHFFFAOYSA-N hexacosanoyl chloride Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCC(Cl)=O KXHFYBWOKFEEMI-UHFFFAOYSA-N 0.000 description 1
- ARBOVOVUTSQWSS-UHFFFAOYSA-N hexadecanoyl chloride Chemical compound CCCCCCCCCCCCCCCC(Cl)=O ARBOVOVUTSQWSS-UHFFFAOYSA-N 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- BXZBGYJQEFZICM-UHFFFAOYSA-N icosanoyl chloride Chemical compound CCCCCCCCCCCCCCCCCCCC(Cl)=O BXZBGYJQEFZICM-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229940026239 isoascorbic acid Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QARBMVPHQWIHKH-UHFFFAOYSA-N methanesulfonyl chloride Chemical compound CS(Cl)(=O)=O QARBMVPHQWIHKH-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical class C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- DFFZOPXDTCDZDP-UHFFFAOYSA-N naphthalene-1,5-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1C(O)=O DFFZOPXDTCDZDP-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- MAGMAMZGOLLUAU-UHFFFAOYSA-N octacosanoyl chloride Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(Cl)=O MAGMAMZGOLLUAU-UHFFFAOYSA-N 0.000 description 1
- NGBBFNQEPSYETA-UHFFFAOYSA-N octadecanoic acid;hydrochloride Chemical compound Cl.CCCCCCCCCCCCCCCCCC(O)=O NGBBFNQEPSYETA-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PQZWQGNQOVDTRF-UHFFFAOYSA-N pentadecanoyl chloride Chemical compound CCCCCCCCCCCCCCC(Cl)=O PQZWQGNQOVDTRF-UHFFFAOYSA-N 0.000 description 1
- AHWALFGBDFAJAI-UHFFFAOYSA-N phenyl carbonochloridate Chemical compound ClC(=O)OC1=CC=CC=C1 AHWALFGBDFAJAI-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- SQQKMLPDURPFNG-UHFFFAOYSA-N tetracosanoyl chloride Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC(Cl)=O SQQKMLPDURPFNG-UHFFFAOYSA-N 0.000 description 1
- DTQVDTLACAAQTR-DYCDLGHISA-N trifluoroacetic acid-d1 Chemical compound [2H]OC(=O)C(F)(F)F DTQVDTLACAAQTR-DYCDLGHISA-N 0.000 description 1
Landscapes
- Polyesters Or Polycarbonates (AREA)
Description
本発明は、ポリアリレート樹脂本来の耐熱性、透明性、機械物性を維持したまま、従来に比べて、比較的低温で成形可能なポリアリレート樹脂を提供する。 The present invention provides a polyarylate resin that can be molded at a relatively low temperature as compared with the conventional one, while maintaining the original heat resistance, transparency, and mechanical properties of the polyarylate resin.
エンジニアリングプラスチックとして知られるポリアリレート樹脂は、耐熱性、透明性、機械物性に優れていることから、電気電子用途、自動車用途、機械用途等の幅広い分野に使用されている。また、近年では光ファイバーや光学レンズ、液晶パネル、プリズム、光ディスク等の光学用途向けにも展開されている。 Polyarylate resin, which is known as an engineering plastic, is used in a wide range of fields such as electrical and electronic applications, automobile applications, and mechanical applications because it has excellent heat resistance, transparency, and mechanical properties. In recent years, it has also been developed for optical applications such as optical fibers, optical lenses, liquid crystal panels, prisms, and optical disks.
しかしながら、ポリアリレート樹脂は、高い溶融粘度を有するため、溶融流動性を発現させるためには300℃以上の高温で加熱する必要があり、成形加工性が高いとは言い難かった。また、高温下では着色により透明性が損なわれたり、熱劣化により機械物性が低下したりするという問題が生じていた。 However, since the polyarylate resin has a high melt viscosity, it is necessary to heat it at a high temperature of 300 ° C. or higher in order to develop melt fluidity, and it cannot be said that the polyarylate resin has high molding processability. Further, at high temperatures, there have been problems that transparency is impaired due to coloring and mechanical properties are deteriorated due to thermal deterioration.
成形加工性を改善させるために、近年では流動性改質剤を配合させる試みがなされている。例えば、特許文献1では流動性改質剤としてN−フェニルマレイミド−スチレン共重合体を添加させる方法が記載されている。しかしながら、特許文献1のポリアリレート樹脂は、流動性の向上が見られるものの、高温下では添加剤の分解ガスが原因で、表面の外観不良が発生するという問題があった。 In recent years, attempts have been made to add a fluidity modifier in order to improve moldability. For example, Patent Document 1 describes a method of adding an N-phenylmaleimide-styrene copolymer as a fluidity modifier. However, although the polyarylate resin of Patent Document 1 is improved in fluidity, there is a problem that the appearance of the surface is deteriorated due to the decomposition gas of the additive at high temperature.
本発明は、上記課題を解決するものであって、ポリアリレート樹脂本来の耐熱性、透明性、機械物性を維持したまま、従来に比べて、比較的低温で成形可能なポリアリレート樹脂を提供することを目的とする。 The present invention solves the above problems, and provides a polyarylate resin that can be molded at a relatively low temperature as compared with the conventional one while maintaining the original heat resistance, transparency, and mechanical characteristics of the polyarylate resin. The purpose is.
本発明者らは、上記の課題を解決すべく鋭意検討の結果、末端に、特定の一価カルボン酸残基を含有させることにより、上記目的が達成されることを見出し、本発明に到達した。 As a result of diligent studies to solve the above problems, the present inventors have found that the above object can be achieved by containing a specific monovalent carboxylic acid residue at the terminal, and have reached the present invention. ..
すなわち、本発明の要旨は以下の通りである。
(1)二価フェノール残基と芳香族二価カルボン酸残基を主成分とし、末端に下記一般式(1)で示される一価カルボン酸残基を有するポリアリレート樹脂(ただし、数平均分子量がポリスチレン換算で10000未満のポリアリレート樹脂は除く。)。
(2)一般式(1)で示される一価カルボン酸残基が、全芳香族二価カルボン酸残基に対して10.0〜18.0モル%である(1)に記載のポリアリレート樹脂。
(3)一般式(1)で示される一価カルボン酸残基が、ステアリン酸残基またはイソステアリン酸残基である(1)または(2)に記載のポリアリレート樹脂。
(4)二価フェノール残基が、下記一般式(2)で示される二価フェノール残基である(1)〜(3)いずれかに記載のポリアリレート樹脂。
(5)ポリアリレート樹脂の重量平均分子量(Mw)が、標準ポリスチレン換算で20000〜90000である(1)〜(4)いずれかに記載のポリアリレート樹脂。
(6)(1)〜(5)いずれかに記載のポリアリレート樹脂からなるフィルム。
That is, the gist of the present invention is as follows.
(1) A polyarylate resin containing a divalent phenol residue and an aromatic divalent carboxylic acid residue as main components and having a monovalent carboxylic acid residue represented by the following general formula (1) at the end (however, the number average molecular weight). Excludes polyarylate resins with a polystyrene equivalent of less than 10,000.)
(2) The polyarylate according to (1), wherein the monovalent carboxylic acid residue represented by the general formula (1) is 10.0 to 18.0 mol% with respect to the total aromatic divalent carboxylic acid residue. resin.
(3) The polyarylate resin according to (1) or (2), wherein the monovalent carboxylic acid residue represented by the general formula (1) is a stearic acid residue or an isostearic acid residue.
(4) The polyarylate resin according to any one of (1) to (3), wherein the divalent phenol residue is a divalent phenol residue represented by the following general formula (2).
(5) The polyarylate resin according to any one of (1) to (4), wherein the weight average molecular weight (Mw) of the polyarylate resin is 20000-90000 in terms of standard polystyrene.
(6) A film made of the polyarylate resin according to any one of (1) to (5).
本発明によれば、ポリアリレート樹脂本来の耐熱性、透明性、機械物性を維持したまま、従来に比べて、比較的低温で成形可能なポリアリレート樹脂を提供することができる。本発明のポリアリレート樹脂やそれからなるフィルムは、成形加工時に着色し難く、特に光ファイバーや光学レンズ、液晶パネル、プリズム、光ディスク等の光学用途向けに好適に用いることができる。 According to the present invention, it is possible to provide a polyarylate resin that can be molded at a relatively low temperature as compared with the conventional one, while maintaining the original heat resistance, transparency, and mechanical properties of the polyarylate resin. The polyarylate resin of the present invention and a film made of the polyarylate resin of the present invention are difficult to be colored during molding, and can be suitably used particularly for optical applications such as optical fibers, optical lenses, liquid crystal panels, prisms, and optical disks.
本発明のポリアリレート樹脂は、末端に特定の一価カルボン酸残基を含み、二価フェノール残基と芳香族二価カルボン酸残基を主成分とする。なお、本発明において、「主成分とする」とは、全モノマー残基に対して、二価フェノール残基と芳香族二価カルボン酸残基の合計が70モル%以上であることをいう。 The polyarylate resin of the present invention contains a specific monovalent carboxylic acid residue at the terminal, and contains a divalent phenol residue and an aromatic divalent carboxylic acid residue as main components. In the present invention, "mainly composed" means that the total of the divalent phenol residue and the aromatic divalent carboxylic acid residue is 70 mol% or more with respect to all the monomer residues.
本発明のポリアリレート樹脂は、末端に、炭素数が14〜27の直鎖状または分岐状の長鎖アルキル基を有する一般式(1)で示される一価カルボン酸残基を含有させることが必要である。一般式(1)で示される残基を含有させることで、機械物性を維持したまま、ガラス転移温度を低下させ、比較的低温での成形加工が可能となる。
Polyarylate resins of the present invention, the terminal, be contained monocarboxylic acid residues carbon atoms represented by the general formula (1) having a linear or branched long chain alkyl group of 14 to 27 is necessary. By containing the residue represented by the general formula (1), the glass transition temperature can be lowered while maintaining the mechanical characteristics, and the molding process at a relatively low temperature becomes possible.
一般式(1)において、Xは、独立して、炭素数が14〜27の直鎖状または分岐状のアルキル基を表す。炭素数が14未満の場合、得られるポリアリレート樹脂のガラス転移温度が高くなり、十分な成形加工性が得られないので好ましくない。一方、炭素数が27を超える場合、耐熱性や機械物性が著しく低下するので好ましくない。
In the general formula (1), X is independently, carbon atoms represents straight-chain or branched alkyl group 14 to 27. When the number of carbon atoms is less than 14 , the glass transition temperature of the obtained polyarylate resin becomes high, and sufficient molding processability cannot be obtained, which is not preferable. On the other hand, when the number of carbon atoms exceeds 27 , heat resistance and mechanical properties are significantly lowered, which is not preferable.
なお、一価カルボン酸残基は、例えば、界面重合法においては、末端封止剤として、一価カルボン酸クロライドを用いることにより導入される。 The monovalent carboxylic acid residue is introduced, for example, by using a monovalent carboxylic acid chloride as an end-capping agent in the interfacial polymerization method.
一般式(1)で表される一価カルボン酸残基を与える一価カルボン酸クロライドとしては、例えば、ペンタデカン酸クロライド(炭素数15)、パルミチン酸クロライド(炭素数16)、イソパルミチン酸クロライド(炭素数16)、マルガリン酸クロライド(炭素数17)、ステアリン酸クロライド(炭素数18)、イソステアリン酸クロライド(炭素数15)、アラキジン酸クロライド(炭素数20)、ベヘン酸クロライド(炭素数22)、リグノセリン酸クロライド(炭素数24)、セロチン酸クロライド(炭素数26)、モンタン酸クロライド(炭素数28)が挙げられる。これらの中でも、工業的に入手し易いことや合成し易いことから、ステアリン酸クロライド、イソステアリン酸クロライドが好ましい。 Examples of the monovalent carboxylic acid chloride giving a monovalent carboxylic acid residue represented by the general formula (1) include pentadecanoic acid chloride (15 carbon atoms), palmitic acid chloride (16 carbon atoms), and isopalmitate chloride (16 carbon atoms). 16 carbon atoms), margaric acid chloride (17 carbon atoms), stearic acid chloride (18 carbon atoms), isostearic acid chloride (15 carbon atoms), arachidic acid chloride (20 carbon atoms), behenic acid chloride (22 carbon atoms), Examples thereof include lignoceric acid chloride (24 carbon atoms), cerotic acid chloride (26 carbon atoms), and montanic acid chloride (28 carbon atoms). Among these, stearate chloride and isostearic acid chloride are preferable because they are industrially easily available and easily synthesized.
一般式(1)で表される一価カルボン酸残基の含有量は、全二価カルボン酸成分に対して、10.0〜18.0モル%とすることが好ましく、13.0〜16.0モル%とすることがより好ましい。前記含有量が10.0モル%未満の場合、得られるポリアリレート樹脂のガラス転移温度が高くなり、十分な成形加工性が得られない場合がある。一方、前記含有量が18.0モル%を超える場合、機械物性が著しく低下するので好ましくない。 The content of the monovalent carboxylic acid residue represented by the general formula (1) is preferably 10.0 to 18.0 mol% with respect to the total divalent carboxylic acid component, and 13.0 to 16 More preferably, it is 0.0 mol%. When the content is less than 10.0 mol%, the glass transition temperature of the obtained polyarylate resin becomes high, and sufficient molding processability may not be obtained. On the other hand, if the content exceeds 18.0 mol%, the mechanical properties are significantly deteriorated, which is not preferable.
本発明のポリアリレート樹脂には、本発明の効果を損なわない範囲で、一般式(1)で表される残基以外の他の一価カルボン酸残基を含有させてもよい。前記他の一価カルボン酸残基を与える一価カルボン酸クロライドとしては、例えば、ベンゾイルクロライド、安息香酸クロライド、メタンスルホニルクロライド、フェニルクロロホルメートが挙げられる。他の一価カルボン酸残基を含有させる場合、その含有量は加工性の観点から、一般式(1)で表される一価カルボン酸残基に対して、5モル%以下とすることが好ましく、3モル%以下とすることが好ましい。 The polyarylate resin of the present invention may contain a monovalent carboxylic acid residue other than the residue represented by the general formula (1) as long as the effect of the present invention is not impaired. Examples of the monovalent carboxylic acid chloride giving the other monovalent carboxylic acid residue include benzoyl chloride, benzoic acid chloride, methanesulfonyl chloride, and phenylchloroformate. When another monovalent carboxylic acid residue is contained, the content thereof may be 5 mol% or less with respect to the monovalent carboxylic acid residue represented by the general formula (1) from the viewpoint of processability. It is preferably 3 mol% or less.
二価フェノール残基を与える二価フェノールとしては、例えば、2,2−ビス(4−ヒドロキシフェニル)ブタン、2,2−ビス(3−メチル−4−ヒドロキシフェニル)プロパン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン、1,1−ビス(4−ヒドロキシフェニル)−1−フェニルエタン、1,1−ビス(4−ヒドロキシフェニル)−3,3,5−トリメチル−シクロヘキサン、9、9−ビス(3−メチル−4−ヒドロキシフェニル)フルオレン、2,2−ビス(4−ヒドロキシフェニル)−4−メチルペンタン、1,1−ビス(4−ヒドロキシフェニル)シクロドデカン、2、2−ビス(4−ヒドロキシフェニル)ヘキサフルオロプロパン、4,4’−(1−フェニルエチリデン)ビスフェノールが挙げられる。 Examples of the divalent phenol that gives a divalent phenol residue include 2,2-bis (4-hydroxyphenyl) butane, 2,2-bis (3-methyl-4-hydroxyphenyl) propane, and 1,1-bis. (4-Hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethyl-cyclohexane, 9,9 -Bis (3-methyl-4-hydroxyphenyl) fluorene, 2,2-bis (4-hydroxyphenyl) -4-methylpentane, 1,1-bis (4-hydroxyphenyl) cyclododecane, 2,2-bis Examples thereof include (4-hydroxyphenyl) hexafluoropropane and 4,4'-(1-phenylethylidene) bisphenol.
これらの中でも、工業的に入手し易いことや合成し易いことから、下記一般式(2)で示される残基を与える二価フェノールであることが好ましい。 Among these, a divalent phenol that gives a residue represented by the following general formula (2) is preferable because it is easily industrially available and easily synthesized.
一般式(2)中、R1およびR2は、独立して、ハロゲン原子、炭素数が1〜6の炭化水素基、ハロゲン化アルキル基またはアリール基を表す。pおよびqは、0または1〜8であり、pおよびqが0であるとき、Yは炭素数が4〜14の飽和もしくは不飽和の鎖状または環状の炭化水素基を表し、pおよびqが1〜8であるとき、Yは炭素数が3〜14の飽和もしくは不飽和の鎖状または環状の炭化水素基を表す。 In the general formula (2), R 1 and R 2 independently represent a halogen atom, a hydrocarbon group having 1 to 6 carbon atoms, an alkyl halide group or an aryl group. p and q are 0 or 1-8, and when p and q are 0, Y represents a saturated or unsaturated chain or cyclic hydrocarbon group with 4-14 carbon atoms, p and q. When is 1 to 8, Y represents a saturated or unsaturated chain or cyclic hydrocarbon group having 3 to 14 carbon atoms.
本発明のポリアリレート樹脂には、二価フェノール残基以外の他の二価アルコール残基を含有させてもよい。前記他の二価アルコール残基を与える二価アルコールとしては、例えば、エチレングリコール、プロピレングリコール等の脂肪族ジオールや、1,4−シクロヘキサンジオール、1,3−シクロヘキサンジオール、1,2−シクロヘキサンジオール等の脂環式ジオールが挙げられる。前記他の二価アルコール残基を含有させる場合、その含有量は、機械物性の観点から、全二価フェノール残基に対して、10モル%以下とすることが好ましく、5モル%以下とすることが好ましい。 The polyarylate resin of the present invention may contain a divalent alcohol residue other than the divalent phenol residue. Examples of the dihydric alcohol that gives the other dihydric alcohol residue include aliphatic diols such as ethylene glycol and propylene glycol, 1,4-cyclohexanediol, 1,3-cyclohexanediol, and 1,2-cyclohexanediol. Such as alicyclic diols. When the other divalent alcohol residue is contained, the content thereof is preferably 10 mol% or less, preferably 5 mol% or less, based on the total divalent phenol residue from the viewpoint of mechanical properties. Is preferable.
芳香族二価カルボン酸残基を与える芳香族二価カルボン酸としては、例えば、テレフタル酸、イソフタル酸、オルソフタル酸等のフタル酸類や、4,4’−ビフェニルジカルボン酸、2,2’−ビフェニルジカルボン酸等のビフェニルジカルボン酸類や、1,5−ナフタレンジカルボン酸、2,6−ナフタレンジカルボン酸等のナフタレンジカルボン酸類や、ジフェニルエーテル−2,2’−ジカルボン酸、ジフェニルエーテル−2,3’−ジカルボン酸、ジフェニルエーテル−2,4’−ジカルボン酸、ジフェニルエーテル−3,3’−ジカルボン酸、ジフェニルエーテル−3,4’−ジカルボン酸、ジフェニルエーテル−4,4’−ジカルボン酸等のジフェニルエーテルジカルボン酸類が挙げられる。 Examples of the aromatic divalent carboxylic acid that gives an aromatic divalent carboxylic acid residue include phthalates such as terephthalic acid, isophthalic acid, and orthophthalic acid, 4,4'-biphenyldicarboxylic acid, and 2,2'-biphenyl. Biphenyldicarboxylic acids such as dicarboxylic acids, naphthalenedicarboxylic acids such as 1,5-naphthalenedicarboxylic acid and 2,6-naphthalenedicarboxylic acid, diphenyl ether-2,2'-dicarboxylic acid, diphenyl ether-2,3'-dicarboxylic acid , Diphenyl ether-2,4'-dicarboxylic acid, diphenyl ether-3,3'-dicarboxylic acid, diphenyl ether-3,4'-dicarboxylic acid, diphenyl ether-4,4'-dicarboxylic acid and other diphenyl ether dicarboxylic acids.
本発明のポリアリレート樹脂には、芳香族二価カルボン酸残基以外の他の二価カルボン酸を含有させてもよい。前記他の二価カルボン酸残基を与える二価カルボン酸としては、例えば、アジピン酸やセバシン酸等の脂肪族ジカルボン酸や、1,4−シクロヘキサンジカルボン酸、1,3−シクロヘキサンジカルボン酸、1,2−シクロヘキサンジカルボン酸等の脂環式ジカルボン酸が挙げられる。前記他の二価カルボン酸残基を含有させる場合、その含有量は、機械物性の観点から、全芳香族二価カルボン酸残基に対して、10モル%以下とすることが好ましく、5モル%以下とすることが好ましい。 The polyarylate resin of the present invention may contain a divalent carboxylic acid other than the aromatic divalent carboxylic acid residue. Examples of the divalent carboxylic acid giving the other divalent carboxylic acid residue include aliphatic dicarboxylic acids such as adipic acid and sebacic acid, 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, and 1 , 2-Cyclohexanedicarboxylic acid and other alicyclic dicarboxylic acids. When the other divalent carboxylic acid residue is contained, the content thereof is preferably 10 mol% or less with respect to the total aromatic divalent carboxylic acid residue from the viewpoint of mechanical characteristics, and 5 mol. % Or less is preferable.
本発明のポリアリレート樹脂の重量平均分子量は、機械物性、成形加工性の観点から、重量平均分子量が20000〜90000であることが好ましい。重量平均分子量が20000未満の場合、機械物性が著しく低下する場合がある。一方、重量平均分子量が90000を超える場合、溶融粘度が高すぎて、成形加工性が低下する場合がある。 The weight average molecular weight of the polyarylate resin of the present invention is preferably 20000 to 90000 from the viewpoint of mechanical properties and molding processability. If the weight average molecular weight is less than 20000, the mechanical properties may be significantly reduced. On the other hand, when the weight average molecular weight exceeds 90,000, the melt viscosity may be too high and the molding processability may be lowered.
本発明のポリアリレート樹脂のガラス転移温度は、150℃以下であることが好ましく、140℃以下であることがより好ましく、130℃以下であることがさらに好ましい。 The glass transition temperature of the polyarylate resin of the present invention is preferably 150 ° C. or lower, more preferably 140 ° C. or lower, and even more preferably 130 ° C. or lower.
本発明のポリアリレート樹脂の製造方法としては、例えば、界面重合法や溶液重合法等の有機溶媒中で反応させる方法、または、溶融重合等の溶融状態で反応させる方法が挙げられる。重合性や得られる樹脂の外観の観点から、有機溶媒中での反応、特に低温での反応が可能な界面重合法を用いることが好ましい。 Examples of the method for producing the polyarylate resin of the present invention include a method of reacting in an organic solvent such as an interfacial polymerization method and a solution polymerization method, and a method of reacting in a molten state such as melt polymerization. From the viewpoint of polymerizability and appearance of the obtained resin, it is preferable to use an interfacial polymerization method capable of reacting in an organic solvent, particularly at a low temperature.
界面重合法としては、例えば、二価カルボン酸ハライドを水と相溶しない有機溶媒に溶解させた溶液(有機相)を、二価フェノール、末端封止剤、酸化防止剤および重合触媒を含むアルカリ水溶液(水相)に混合し、50℃以下の温度で1〜8時間撹拌しながら重合反応をおこなう方法が挙げられる。 As an interfacial polymerization method, for example, a solution (organic phase) in which a divalent carboxylic acid halide is dissolved in an organic solvent that is incompatible with water is mixed with an alkali containing a divalent phenol, a terminal sealant, an antioxidant and a polymerization catalyst. Examples thereof include a method of mixing with an aqueous solution (aqueous phase) and carrying out a polymerization reaction while stirring at a temperature of 50 ° C. or lower for 1 to 8 hours.
有機相に用いる溶媒としては、例えば、水と相溶せずポリアリレートを溶解する溶媒が好ましい。このような溶媒としては、例えば、塩化メチレン、クロロホルムが挙げられ、製造上使用しやすいことから、塩化メチレンが好ましい。 As the solvent used for the organic phase, for example, a solvent that is incompatible with water and dissolves polyarylate is preferable. Examples of such a solvent include methylene chloride and chloroform, and methylene chloride is preferable because it is easy to use in production.
水相に用いるアルカリ水溶液としては、例えば、水酸化ナトリウムや水酸化カリウムの水溶液が挙げられる。 Examples of the alkaline aqueous solution used for the aqueous phase include an aqueous solution of sodium hydroxide and potassium hydroxide.
酸化防止剤は、二価フェノール成分の酸化を防止するために用いられる。酸化防止剤としては、例えば、ハイドロサルファイトナトリウム、L−アスコルビン酸、エリソルビン酸、カテキン、トコフェノール、ブチルヒドロキシアニソールが挙げられる。中でも、水溶性に優れていることから、ハイドロサルファイトナトリウムが好ましい。 Antioxidants are used to prevent the oxidation of divalent phenolic components. Examples of the antioxidant include sodium hydrosulfite, L-ascorbic acid, erythorbic acid, catechin, tocophenol, and butylhydroxyanisole. Of these, sodium hydrosulfite is preferable because it has excellent water solubility.
重合触媒としては、例えば、トリ−n−ブチルベンジルアンモニウムハライド、テトラ−n−ブチルアンモニウムハライド、トリメチルベンジルアンモニウムハライド、トリエチルベンジルアンモニウムハライド等の第四級アンモニウム塩や、トリ−n−ブチルベンジルホスホニウムハライド、テトラ−n−ブチルホスホニウムハライド、トリメチルベンジルホスホニウムハライド、トリエチルベンジルホスホニウムハライド等の第四級ホスホニウム塩が挙げられる。中でも、分子量が高く、酸価の低いポリマーを得ることができることから、トリ−n−ブチルベンジルアンモニウムハライド、トリメチルベンジルアンモニウムハライド、テトラ−n−ブチルアンモニウムハライド、トリ−n−ブチルベンジルホスホニウムハライド、テトラ−n−ブチルホスホニウムハライドが好ましい。 Examples of the polymerization catalyst include quaternary ammonium salts such as tri-n-butylbenzylammonium halide, tetra-n-butylammonium halide, trimethylbenzylammonium halide and triethylbenzylammonium halide, and tri-n-butylbenzylphosphonium halide. , Tetra-n-butylphosphonium halide, trimethylbenzylphosphonium halide, quaternary phosphonium salt such as triethylbenzylphosphonium halide and the like. Among them, tri-n-butylbenzylammonium halide, trimethylbenzylammonium halide, tetra-n-butylammonium halide, tri-n-butylbenzylphosphonium halide, and tetra can be obtained because a polymer having a high molecular weight and a low acid value can be obtained. -N-Butylphosphonium halide is preferred.
ポリアリレート樹脂を溶解する有機溶媒としては、例えば、塩化メチレン、1,2−ジクロロエタン、クロロホルム、四塩化炭素、クロロベンゼン、1,1,2,2−テトラクロロエタン、1,1,1−トリクロロエタン、o−ジクロロベンゼン、m−ジクロロベンゼン、p−ジクロロベンゼン、トルエン、ベンゼン、キシレン、テトラヒドロフランが挙げられる。 Examples of the organic solvent for dissolving the polyallylate resin include methylene chloride, 1,2-dichloroethane, chloroform, carbon tetrachloride, chlorobenzene, 1,1,2,2-tetrachloroethane, 1,1,1-trichloroethane, o. Examples thereof include -dichlorobenzene, m-dichlorobenzene, p-dichlorobenzene, toluene, benzene, xylene and tetrahydrofuran.
ポリアリレート樹脂は、流延法や溶融押出法等の方法で加工することによりポリアリレート樹脂のフィルムを得ることができる。流延法とは、樹脂を有機溶剤に溶解した後、その樹脂溶液を基材に塗布し、乾燥した後、基材から剥離してフィルムを作製する方法である。一方、溶融押出法とは、乾燥した樹脂を押出機に投入し、溶融樹脂をTダイ等から冷却ロールに押出し、捲き取る方法である。 The polyarylate resin film can be obtained by processing the polyarylate resin by a method such as a casting method or a melt extrusion method. The casting method is a method in which a resin is dissolved in an organic solvent, the resin solution is applied to a base material, dried, and then peeled off from the base material to prepare a film. On the other hand, the melt extrusion method is a method in which a dried resin is put into an extruder, and the molten resin is extruded from a T-die or the like onto a cooling roll and wound up.
流延法に用いられる有機溶剤としては、例えば、塩化メチレン、1,2−ジクロロエタン、クロロホルム、四塩化炭素、クロロベンゼン、1,1,2,2−テトラクロロエタン、1,1,1−トリクロロエタン、o−ジクロロベンゼン、m−ジクロロベンゼン、p−ジクロロベンゼン、トルエン、ベンゼン、キシレン、テトラヒドロフランが挙げられる。 Examples of the organic solvent used in the casting method include methylene chloride, 1,2-dichloroethane, chloroform, carbon tetrachloride, chlorobenzene, 1,1,2,2-tetrachloroethane, 1,1,1-trichloroethane, o. -Dichlorobenzene, m-dichlorobenzene, p-dichlorobenzene, toluene, benzene, xylene, tetrahydrofuran can be mentioned.
基材としては、例えば、PETフィルム、ポリイミドフィルム、ガラス板、ステンレス板が挙げられる。塗布方法としては、例えば、ワイヤーバーコーター塗り、フィルムアプリケーター塗り、はけ塗り、スプレー塗りや、グラビアロールコーティング法、スクリーン印刷法、リバースロールコーティング法、リップコーティング、エアナイフコーティング法、カーテンフローコーティング法、浸漬コーティング法が挙げられる。 Examples of the base material include a PET film, a polyimide film, a glass plate, and a stainless steel plate. Examples of the coating method include wire bar coater coating, film applicator coating, brush coating, spray coating, gravure roll coating method, screen printing method, reverse roll coating method, lip coating, air knife coating method, curtain flow coating method, and the like. Immersion coating method can be mentioned.
本発明のポリアリレート樹脂から得られるフィルムの引張破断強さは、機械物性の観点から、50MPa以上であることが好ましく、60MPa以上であることがより好ましい。また、靭性の観点から引張破断伸びは20%以上であることが好ましく、30%以上であることがより好ましい。また、引張弾性率は1.2GPa以上であることが好ましい。 The tensile breaking strength of the film obtained from the polyarylate resin of the present invention is preferably 50 MPa or more, more preferably 60 MPa or more, from the viewpoint of mechanical properties. Further, from the viewpoint of toughness, the tensile elongation at break is preferably 20% or more, and more preferably 30% or more. The tensile elastic modulus is preferably 1.2 GPa or more.
次に、本発明を実施例および比較例によって具体的に説明するが、本発明はこれらによって限定されるものではない。なお、ポリアリレート樹脂の物性測定は、以下の方法によりおこなった。 Next, the present invention will be specifically described with reference to Examples and Comparative Examples, but the present invention is not limited thereto. The physical properties of the polyarylate resin were measured by the following method.
(1)樹脂組成
高分解能核磁気共鳴装置(日本電子社製LA−400 NMR)を用いて、1H−NMR分析することにより、それぞれの共重合成分のピーク面積から樹脂組成を求めた(分解能:400MHz、溶媒:重水素化トリフルオロ酢酸と重水素化テトラクロロエタンとの容量比が1/11の混合溶媒、温度:50℃)。
(1) Resin composition The resin composition was determined from the peak area of each copolymer component by 1 H-NMR analysis using a high-resolution nuclear magnetic resonance apparatus (LA-400 NMR manufactured by JEOL Ltd.) (resolution). : 400 MHz, solvent: mixed solvent with deuterated trifluoroacetic acid and deuterated tetrachloroethane in a volume ratio of 1/11, temperature: 50 ° C.).
(2)数平均分子量(Mn)および重量平均分子量(Mw)
ゲルパーミエーションクロマトグラフィー(GPC)を用いて、以下の条件で標準ポリスチレン換算の数平均分子量および重量平均分子量を測定した。
送液装置:ウォーターズ社製、Isocratic HPLC Pump 1515
検出器:ウォーターズ社製、Refractive Index Detector 2414
カラム:Mixed−D(充填シリカゲル粒径5μm、チューブ長さ300mm、内径7.5mm)
溶媒:クロロホルム
流速:1mL/分
測定温度:35℃
(2) Number average molecular weight (Mn) and weight average molecular weight (Mw)
Using gel permeation chromatography (GPC), the number average molecular weight and weight average molecular weight in terms of standard polystyrene were measured under the following conditions.
Liquid feeder: Isocratic HPLC Pump 1515, manufactured by Waters
Detector: Refractometer Index 2414, manufactured by Waters
Column: Mixed-D (filled silica gel particle size 5 μm, tube length 300 mm, inner diameter 7.5 mm)
Solvent: Chloroform Flow rate: 1 mL / min Measurement temperature: 35 ° C
(3)ガラス転移温度(Tg)
ポリアリレート樹脂10mgをサンプルとして用いて、DSC(示差走査熱量測定)装置(パーキンエルマー社製、DSC7)を用いて昇温速度10℃/分の条件で昇温し、昇温曲線中のガラス転移に由来する2つの折曲点温度の中間値をガラス転移温度とした。
なお、ガラス転移温度は、150℃以下であれば、比較的低温で成形加工することができることから、成形加工性が高いと判断できる。
(3) Glass transition temperature (Tg)
Using 10 mg of polyarylate resin as a sample, the temperature is raised at a temperature rise rate of 10 ° C./min using a DSC (differential scanning calorimetry) device (DSC7 manufactured by Perkin Elmer), and the glass transition in the temperature rise curve. The intermediate value of the two bending point temperatures derived from the above was taken as the glass transition temperature.
If the glass transition temperature is 150 ° C. or lower, the molding process can be performed at a relatively low temperature, so that it can be judged that the molding processability is high.
(4)引張破断強さ、引張破断伸び、引張弾性率
ポリアリレート樹脂10〜15質量部にクロロホルム90〜85質量部を加えて樹脂溶液を得た。得られた樹脂溶液を用いて、PETフィルム上に塗膜を形成した。室温で風乾後、PETフィルムから剥離し、減圧にて150℃で24時間乾燥して、厚さ100μmのフィルムを作製した。得られたフィルムを用いてJIS K7127に準拠し、以下の条件で測定した。
試験装置:株式会社インテスコ製、Model2020
引張速度:50mm/分
試験環境:23℃、60%RH
(4) Tensile breaking strength, tensile elongation at breaking, tensile elastic modulus 90 to 85 parts by mass of chloroform was added to 10 to 15 parts by mass of polyarylate resin to obtain a resin solution. A coating film was formed on the PET film using the obtained resin solution. After air-drying at room temperature, the film was peeled off from the PET film and dried under reduced pressure at 150 ° C. for 24 hours to prepare a film having a thickness of 100 μm. The obtained film was used and measured under the following conditions in accordance with JIS K7127.
Test equipment: Model2020, manufactured by Intesco Co., Ltd.
Tensile rate: 50 mm / min Test environment: 23 ° C, 60% RH
実施例1
攪拌装置を備えた反応容器中に、二価フェノール成分として2,2-ビス(3-メチル-4-ヒドロキシフェニル)プロパン(BisC)100.00質量部、アルカリとして水酸化ナトリウム(NaOH)40.56質量部、重合触媒としてトリ−n−ブチルベンジルアンモニウムクロライド(TBBAC)の50質量%水溶液を1.63質量部、酸化防止剤としてハイドロサルファイトナトリウム25.00質量部を仕込み、水2500質量部に溶解させた(水相)。また、これとは別に、塩化メチレン2000質量部に、モノカルボン酸成分としてステアリン酸クロライド(Ste)15.98質量部、二価カルボン酸成分としてイソフタル酸クロライド/テレフタル酸クロライド=1/1(モル比)混合物(MPC)73.84質量部を溶解させた(有機相)(BisC:Ste:MPC:TBBAC:NaOH=100.0:13.0:93.5:0.7:260.0(モル比)。水相をあらかじめ攪拌しておき、有機相を水相中に強攪拌下で添加し、15℃で2時間、界面重合法で重合をおこなった。この後、攪拌を停止し、水相と有機相をデカンテーションして分離した。水相を除去した後、塩化メチレン500質量部、純水3000質量部と酢酸10質量部を添加して反応を停止し、15℃で30分間攪拌した。その後、有機相を純水で10回洗浄し、有機相をメタノール中に添加してポリマーを沈殿させた。沈殿させたポリマーを濾過した後、165℃で24時間真空乾燥を行い、ポリアリレート樹脂を得た。
得られたポリアリレート樹脂の樹脂組成を分析したところ、BisC:Ste:MPC=100.0:13.0:93.5(モル比)と、仕込みの組成と同一であった。
Example 1
In a reaction vessel equipped with a stirrer, 100.00 parts by mass of 2,2-bis (3-methyl-4-hydroxyphenyl) propane (BisC) as a divalent phenol component and sodium hydroxide (NaOH) as an alkali 40. 56 parts by mass, 1.63 parts by mass of a 50% by mass aqueous solution of tri-n-butylbenzylammonium chloride (TBBAC) as a polymerization catalyst, 25.00 parts by mass of caustic sodium as an antioxidant, and 2500 parts by mass of water. Dissolved in (aqueous phase). Separately, in 2000 parts by mass of methylene chloride, 15.98 parts by mass of stearic acid chloride (Ste) as a monocarboxylic acid component, and isophthalic acid chloride / terephthalic acid chloride = 1/1 (mol) as a divalent carboxylic acid component. Ratio) 73.84 parts by mass of the mixture (MPC) dissolved (organic phase) (BizC: Ste: MPC: TBBAC: NaOH = 100.0: 13.0: 93.5: 0.7: 260.0 (BisC: Ste: MPC: TBBAC: NaOH = 100.0: 13.0: 93.5: 0.7: 260.0 ( (Molar ratio). The aqueous phase was stirred in advance, the organic phase was added to the aqueous phase under strong stirring, and polymerization was carried out at 15 ° C. for 2 hours by an interfacial polymerization method. After that, stirring was stopped. The aqueous phase and the organic phase were decanted and separated. After removing the aqueous phase, 500 parts by mass of methylene chloride, 3000 parts by mass of pure water and 10 parts by mass of acetic acid were added to stop the reaction, and the reaction was stopped at 15 ° C. for 30 minutes. After stirring, the organic phase was washed 10 times with pure water, and the organic phase was added to methanol to precipitate the polymer. The precipitated polymer was filtered and then vacuum dried at 165 ° C. for 24 hours. A polyarylate resin was obtained.
When the resin composition of the obtained polyarylate resin was analyzed, it was BisC: Ste: MPC = 100.0: 13.0: 93.5 (molar ratio), which was the same as the prepared composition.
実施例2〜8、比較例1〜3
表1に示すように、樹脂組成を変更する以外は実施例1と同様の操作をおこなって、ポリアリレート樹脂を得た。
Examples 2-8, Comparative Examples 1-3
As shown in Table 1, a polyarylate resin was obtained by performing the same operation as in Example 1 except that the resin composition was changed.
実施例1〜8、比較例1〜3で得られたポリアリレート樹脂の評価結果を表1に示す。 Table 1 shows the evaluation results of the polyarylate resins obtained in Examples 1 to 8 and Comparative Examples 1 to 3.
実施例1〜8のポリアリレート樹脂は、末端に一般式(1)で示される一価カルボン酸残基を含有していたため、ガラス転移温度が低く、十分な成形加工性を有していた。 Since the polyarylate resins of Examples 1 to 8 contained a monovalent carboxylic acid residue represented by the general formula (1) at the end, the glass transition temperature was low and the molding processability was sufficient.
比較例1のポリアリレート樹脂は、末端に一般式(1)で示される一価カルボン酸残基を含有していなかったため、ガラス転移温度が高く、成形加工性が不十分であった。
比較例2のポリアリレート樹脂は、一価カルボン酸残基のアルキル基の炭素数が14未満であったため、ガラス転移温度が高く、成形加工性が不十分であった。
比較例3のポリアリレート樹脂は、一価カルボン酸残基のアルキル基の炭素数が27を超えていたため、機械特性が低かった。
Since the polyarylate resin of Comparative Example 1 did not contain the monovalent carboxylic acid residue represented by the general formula (1) at the end, the glass transition temperature was high and the molding processability was insufficient.
Since the polyarylate resin of Comparative Example 2 had less than 14 carbon atoms in the alkyl group of the monovalent carboxylic acid residue, the glass transition temperature was high and the molding processability was insufficient.
The polyarylate resin of Comparative Example 3 had low mechanical properties because the number of carbon atoms of the alkyl group of the monovalent carboxylic acid residue exceeded 27 .
Claims (6)
A film made of the polyarylate resin according to any one of claims 1 to 5.
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