JP6808569B2 - LED socket and LED socket structure - Google Patents

LED socket and LED socket structure Download PDF

Info

Publication number
JP6808569B2
JP6808569B2 JP2017079550A JP2017079550A JP6808569B2 JP 6808569 B2 JP6808569 B2 JP 6808569B2 JP 2017079550 A JP2017079550 A JP 2017079550A JP 2017079550 A JP2017079550 A JP 2017079550A JP 6808569 B2 JP6808569 B2 JP 6808569B2
Authority
JP
Japan
Prior art keywords
led
half body
led socket
mounting hole
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017079550A
Other languages
Japanese (ja)
Other versions
JP2018182061A (en
JP2018182061A5 (en
Inventor
村田 達二郎
達二郎 村田
Original Assignee
株式会社三晃電気
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社三晃電気 filed Critical 株式会社三晃電気
Priority to JP2017079550A priority Critical patent/JP6808569B2/en
Publication of JP2018182061A publication Critical patent/JP2018182061A/en
Publication of JP2018182061A5 publication Critical patent/JP2018182061A5/ja
Application granted granted Critical
Publication of JP6808569B2 publication Critical patent/JP6808569B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

本発明は、LED(Light Emitting Diode)素子をセラミックやアルミニウム基板の上に実装したCOB(Chip On Board)タイプに用いられるLEDソケット及びCOBタイプLEDを保持したLEDソケット構造体に関する。 The present invention relates to an LED socket used for a COB (Chip On Board) type in which an LED (Light Emitting Diode) element is mounted on a ceramic or aluminum substrate, and an LED socket structure holding a COB type LED.

なお、COBタイプは、LED構造体と称されたり、LEDパッケージやCOBタイプLEDパッケージ等と称されている。そこで本明細書では、特許文献1と同様にCOBタイプをLED構造体と称し、LED構造体を保持するホルダ等をLEDソケットと称し、LEDソケットにLED構造体を保持したものをLEDソケット構造体と称する。 The COB type is referred to as an LED structure, an LED package, a COB type LED package, or the like. Therefore, in the present specification, as in Patent Document 1, the COB type is referred to as an LED structure, the holder or the like holding the LED structure is referred to as an LED socket, and the LED socket holding the LED structure is called the LED socket structure. It is called.

COBタイプのLED構造体は、SMD(Surface Mount Device)タイプに比べ給電端子の位置が表面(上面)側になると共に搭載チップ数が多く高出力や高光束の照明用に好適とされ、また、文献1に例示されるようなLEDソケットにLED構造体を保持したLEDソケット構造体として灯具や照明用機器などに組み込まれる。図10と図11は、文献1に開示のLEDソケット構造体の2例を示している。 Compared to the SMD (Surface Mount Device) type, the COB type LED structure has a power supply terminal located on the front surface (upper surface) side and has a large number of mounted chips, making it suitable for high output and high light beam illumination. As an LED socket structure in which an LED structure is held in an LED socket as exemplified in Document 1, it is incorporated into a lighting fixture, a lighting device, or the like. 10 and 11 show two examples of the LED socket structure disclosed in Document 1.

図10(a)はLEDソケット構造体の分解斜視図、(b)はLDEソケット構造体を裏面側より見た図である。符号0210と0110は共に同じLED構造体、符号0200と0100は共に同じLEDソケットである。LED構造体0210は、基板0211、発光部0212、給電パッド(給電部)0213、支承部0214からなる。このうち、発光部0212は、基板上に配置され、樹脂に封入されたLED素子を有している。給電パッド0213は、表面側の2箇所に給電端子を有し、各給電端子に対し外部電源に接続される電線(以下、リード線という)の末端部を給電端子などを介して接続可能にする。支承部0214は、基板上の発光部と給電パッドを除いた基板部分であり、LEDソケットで支承される部分である。LED構造体は、LEDソケットに対し発光部0212を上に向けた状態でLEDソケットの開口0203に裏側から内側に嵌め込んで装着される。 FIG. 10A is an exploded perspective view of the LED socket structure, and FIG. 10B is a view of the LDE socket structure viewed from the back surface side. Reference numerals 0210 and 0110 are both the same LED structure, and reference numerals 0200 and 0100 are both the same LED socket. The LED structure 0210 includes a substrate 0211, a light emitting unit 0212, a power supply pad (power supply unit) 0213, and a support unit 0214. Of these, the light emitting unit 0212 has an LED element arranged on a substrate and sealed in a resin. The power supply pad 0213 has two power supply terminals on the front surface side, and the end portion of an electric wire (hereinafter referred to as a lead wire) connected to an external power supply can be connected to each power supply terminal via a power supply terminal or the like. .. The support portion 0214 is a substrate portion excluding the light emitting portion and the power supply pad on the substrate, and is a portion supported by the LED socket. The LED structure is fitted into the opening 0203 of the LED socket from the back side to the inside with the light emitting portion 0212 facing upward with respect to the LED socket.

すなわち、LEDソケット0200は、略中央の略矩形開口0203、該開口縁部にあって、6箇所の支承受部a、要部である2箇所の片持弾性支持部bを有している。(a)中、符号aとbは原図になく新たに加入しものである。開口0203は発光部を基板上方へ露出させる。6箇所の支承受部aは、(b)から推察されるごとく片持弾性支持部bに隣接しているものを除き、LED構造体の支承部0214が上方へ抜けないよう受け止めて該支承部をソケット肉厚内に嵌合し、片持弾性支持部に隣接している2つの支承受部aは支承部0214の対応側面と嵌合する。各片持弾性支持部bは、基板の対向側面を片持梁構造にて挟持状態に側方弾性支持することで基板を圧着固定する。これにより、LED構造体が破損したり機能障害を起こす虞を大幅に解消可能となるとされる。以上のLEDソケットは、給電機構として給電端子などが組み込まれるため図11のように展開される。 That is, the LED socket 0200 has a substantially rectangular opening 0203 at a substantially central position, six support receiving portions a at the opening edge portion, and two cantilever elastic support portions b which are main portions. In (a), the symbols a and b are not included in the original drawing and are newly added. Aperture 0203 exposes the light emitting portion above the substrate. The six bearing portions a, except for those adjacent to the cantilever elastic support portion b as inferred from (b), receive the bearing portion 0214 of the LED structure so as not to come out upward, and the bearing portion a. Is fitted within the thickness of the socket, and the two bearing receiving portions a adjacent to the cantilever elastic support portion are fitted with the corresponding side surfaces of the bearing portion 0214. Each cantilever elastic support portion b laterally elastically supports the facing side surface of the substrate in a cantilever structure in a sandwiched state to crimp and fix the substrate. It is said that this makes it possible to significantly eliminate the risk of the LED structure being damaged or malfunctioning. The above LED socket is developed as shown in FIG. 11 because a power supply terminal or the like is incorporated as a power supply mechanism.

図11(a)と(b)は、LEDソケット1200にLED構造体1210を装着した状態つまりLEDソケット構造体を表と裏側より見た図である。LDEソケット1200は、第一半体1230と第二半体1240からなる。第一半体1230はLEDソケット0200に対応し、符号1231は支承受部aに対応し、符号1232は片持弾性支持部bに対応している。第二半体1240は、発光部を露出する中央部の上開口、内面側に設けられた給電端子用端子受部及びリード線用ガイド溝などを有している(文献1の図13を参照)。第一半体1230と第二半体1240は、重ねられた状態で複数のクリップ1250により結合される。符号1220は上記給電パッドに給電端子などを介し接続されたリード線である。 11 (a) and 11 (b) are views in which the LED structure 1210 is mounted on the LED socket 1200, that is, the LED socket structure is viewed from the front and back sides. The LDE socket 1200 consists of a first half body 1230 and a second half body 1240. The first half body 1230 corresponds to the LED socket 0200, reference numeral 1231 corresponds to the support receiving portion a, and reference numeral 1232 corresponds to the cantilever elastic support portion b. The second half body 1240 has an upper opening in a central portion that exposes a light emitting portion, a terminal receiving portion for a power feeding terminal provided on the inner surface side, a guide groove for a lead wire, and the like (see FIG. 13 of Document 1). ). The first half body 1230 and the second half body 1240 are joined by a plurality of clips 1250 in a superposed state. Reference numeral 1220 is a lead wire connected to the power feeding pad via a power feeding terminal or the like.

特開2015−204157号公報JP-A-2015-204157

以上のLEDソケットは、耐久性及び絶縁性と共に放熱性に優れていることが好ましい。放熱性の点は、LED構造体が投入電力に応じた光と熱を発生するため全光束を大きくするほど重要な検討項目となる。ところで、従来のLEDソケットは、材質から大別すると、第一半体及び第二半体が共に樹脂製のタイプと、第一半体が樹脂製、第二半体がアルミ磁器などのセラミック製のタイプとに分けられる。ここで、第一半体は、LED構造体の基板の厚さなどから1.0mm程度と薄くなることに加え、基板の位置決めや支持構造等が複雑な形状となる関係から加工性に優れた樹脂成形品とされる。第二半体は、耐久性や加工性を重視すると樹脂製となり、放熱性及び絶縁性を重視するとセラミック製となる。 It is preferable that the above LED socket is excellent in heat dissipation as well as durability and insulation. The point of heat dissipation becomes an important examination item as the total luminous flux is increased because the LED structure generates light and heat according to the input power. By the way, when the conventional LED sockets are roughly classified according to the material, the first half body and the second half body are both made of resin, the first half body is made of resin, and the second half body is made of ceramic such as aluminum porcelain. It is divided into the types of. Here, the first half body is excellent in workability because the thickness of the substrate of the LED structure is as thin as about 1.0 mm and the positioning of the substrate and the support structure are complicated shapes. It is a resin molded product. The second half is made of resin when durability and workability are emphasized, and ceramic when heat dissipation and insulation are emphasized.

ところが、LEDソケットの材質として、第一半体及び第二半体を共に樹脂製として場合は、板厚が熱により歪んでLED構造体に応力が加わる等して点灯寿命に差がで易くなる。この点は、例えば、樹脂成形品が歪むと、接点圧が小さくなりそれに伴ってさらに温度も上昇し、点灯寿命に影響するからである。 However, when both the first and second halves are made of resin as the material of the LED socket, the plate thickness is distorted by heat and stress is applied to the LED structure, so that the lighting life tends to be different. .. This is because, for example, when the resin molded product is distorted, the contact pressure becomes smaller and the temperature further rises accordingly, which affects the lighting life.

また、LEDソケットの材質として、第一半体を樹脂製で、第二半体をセラミック製とした場合は、第二半体がセラミック製なので力を加えると割れ易いため、例えば、ネジにより灯具等の機器やヒートシンクに取り付ける場合、樹脂製の第一半体側でネジ止めする構成となる。この結果、ネジを通した熱伝導としては、第二半体からの放熱が起き難くなり、ソケット全体の放熱性もあまり期待できないものとなる。また、第一半体が薄いためネジの締め付け力により歪んで接点機構も損なわれ易くなる。 If the first half of the LED socket is made of resin and the second half is made of ceramic, the second half is made of ceramic and is easily broken when force is applied. For example, a lamp is used with a screw. When it is attached to a device such as a heat sink or a heat sink, it is screwed on the resin first half body side. As a result, heat conduction from the second half of the body is less likely to occur as heat conduction through the screw, and heat dissipation of the entire socket cannot be expected so much. Further, since the first half body is thin, it is easily distorted by the tightening force of the screw and the contact mechanism is easily damaged.

本発明の目的は、以上のような背景から、簡単かつ簡明な構造を維持しながら、第一半体及び第二半体を共に樹脂成形品にしても優れた放熱性が得られるようにする。他の目的は以下の内容説明の中で明らかにする。 From the above background, an object of the present invention is to maintain an excellent heat dissipation property even if both the first half body and the second half body are resin molded products while maintaining a simple and simple structure. .. Other purposes will be clarified in the following description.

上記目的を達成するため請求項1の発明は、図面を参照して特定すると、基板7の上面にLED素子等の発光部8及び給電部9a,9bを配置したLED構造体6を支持するためのLEDソケット5において、開口10及び取付穴11と共に前記基板7を略板厚内に取付可能な保持手段15,16を有し、前記発光部8を前記開口10より下から上に突出し、かつ前記基板7を前記保持手段15,16により保持した状態で前記LED構造体6を支持可能な樹脂製の第一半体1と、上開口20及び上取付穴21と共に前記給電部に電気的に接続可能にする接続部材用配置部25を有し、前記上開口に前記発光部を配置し、かつ前記上取付穴を前記取付穴に同軸線上に位置した状態で前記第一半体に連結される樹脂製の第二半体2と、前記第一半体1及び前記第二半体2の間に挟持されると共に、前記上取付穴21から前記取付穴11へ貫通されるネジ等の取付部材Sに当接可能に配置された放熱部材3(3A)とを備えていることを特徴としている。 In order to achieve the above object, the invention of claim 1 is to support an LED structure 6 in which a light emitting portion 8 such as an LED element and feeding portions 9a and 9b are arranged on the upper surface of the substrate 7, as specified with reference to the drawings. In the LED socket 5, the LED socket 5 has holding means 15 and 16 capable of mounting the substrate 7 within a substantially plate thickness together with an opening 10 and a mounting hole 11, and the light emitting portion 8 projects from below the opening 10 to the top. While the substrate 7 is held by the holding means 15 and 16, the first half body 1 made of resin capable of supporting the LED structure 6, the upper opening 20 and the upper mounting hole 21 are electrically connected to the feeding portion. It has a connecting member arranging portion 25 that enables connection, and is connected to the first half body in a state where the light emitting portion is arranged in the upper opening and the upper mounting hole is located on the coaxial line with the mounting hole. A screw or the like that is sandwiched between the resin-made second half body 2 and the first half body 1 and the second half body 2 and penetrates from the upper mounting hole 21 to the mounting hole 11. It is characterized by including a heat radiating member 3 (3A) arranged so as to be in contact with the member S.

以上の本発明において、取付部材としては、ネジやボルトそれらに類似の部材である。材質は、金属や合金等のごとく熱伝導に優れていることが好ましい。放熱部材としては、取付部材と同様に金属や合金等のごとく熱伝導に優れていることが好ましい。形状的には、請求項3のごとく板状、請求項4のごとく線状の何れでもよい。 In the above invention, the mounting member is a member similar to screws and bolts. The material is preferably excellent in heat conduction like a metal or an alloy. As the heat radiating member, it is preferable that the heat conductive member is excellent in heat conduction like a metal or an alloy like the mounting member. The shape may be either a plate shape as in claim 3 or a linear shape as in claim 4.

以上の本発明は、請求項2から5で特定したように具体化されることがより好ましい。
(1)、前記第一半体1又は/及び第二半体は前記放熱部材を配置する窪み部を有していると共に、前記放熱部材は前記第一半体及び第二半体の間にあって一端側に前記取付部材に当接する当接部を有し、他端側が前記接続部材用配置部付近まで延びている構成である(請求項2)。
(2)、前記放熱部材は、板状をなし前記取付部材を前記上取付穴から前記取付穴へ貫通可能にする挿通穴及びその挿通穴の縁部に突設されて前記第二半体の上取付穴に嵌入される筒部を有している構成である(請求項3)。
It is more preferable that the above invention is embodied as specified in claims 2 to 5.
(1), The first half body 1 and / and the second half body have a recess for arranging the heat radiation member, and the heat radiation member is between the first half body and the second half body. A contact portion that comes into contact with the mounting member is provided on one end side, and the other end side extends to the vicinity of the connecting member arranging portion (claim 2).
(2) The heat radiating member has a plate shape and is projected from an insertion hole that allows the mounting member to penetrate from the upper mounting hole to the mounting hole and the edge of the insertion hole of the second half body. It is configured to have a tubular portion to be fitted into the upper mounting hole (claim 3).

(3)、前記放熱部材は、線状をなし前記取付部材に圧接可能になっている構成である(請求項4)。この放熱部材は図9の変形例の構成を特定したものである。線状とは、細長くなっていればよく、断面が丸形、平形、多角形などのものを含む。
(4)、前記第二半体は前記接続部材用配置部と前記窪み部との間に凹所を設け、前記凹所に配置されたセラミック等からなる絶縁性のチップを有している構成である(請求項5)。
(3) The heat radiating member has a linear shape and can be pressure-contacted with the mounting member (claim 4). This heat radiating member specifies the configuration of the modified example of FIG. The linear shape may be elongated and includes a round cross section, a flat cross section, a polygonal cross section, and the like.
(4) The second half has a recess provided between the connecting member arranging portion and the recess, and has an insulating chip made of ceramic or the like arranged in the recess. (Claim 5).

これに対し、請求項6の発明は、LEDソケット構造体50として、請求項1から4の何れかに記載のLEDソケット5に前記LED構造体6を組み付けていることを特徴としている。 On the other hand, the invention of claim 6 is characterized in that, as the LED socket structure 50, the LED structure 6 is assembled to the LED socket 5 according to any one of claims 1 to 4.

請求項1の発明では、LED構造体を支持する第一半体及び給電端子等の接続部材を配置する配置部を有する第二半体を有したLEDソケットとして、両半体共に樹脂製であるためセラミック製に比べ量産時の加工精度を安定維持したり製造コストを低減できることに加え、両半体で挟持された放熱部材により放熱性に優れたものとなる。すなわち、放熱部材は、発光部及び給電部に接続される電気的接続部材に発生した熱がネジ等の取付部材を通して外部、つまり例えば適用灯具や各種器具側へ効率よく逃がすようにし、それにより樹脂製の両半体にこもり易い熱対策として最良の放熱特性を付与できる。 In the invention of claim 1, both halves are made of resin as an LED socket having a first halves that support the LED structure and a second halves that have an arrangement portion for arranging connection members such as power supply terminals. Therefore, compared to ceramic products, the processing accuracy during mass production can be stably maintained and the manufacturing cost can be reduced, and the heat radiation member sandwiched between the two halves provides excellent heat dissipation. That is, the heat radiating member allows the heat generated in the electrical connecting member connected to the light emitting portion and the feeding portion to be efficiently dissipated to the outside, that is, to the applicable lamp or various fixtures, for example, through the mounting member such as a screw, thereby the resin. The best heat dissipation characteristics can be given to both half bodies of the product as a measure against heat that tends to be trapped.

請求項2の発明では、まず、第一半体又は/及び第二半体が放熱部材用の窪み部を有しているためLEDソケット全体の厚さ寸法を放熱部材のない場合とほぼ同じ厚さに維持できる。同時に、放熱部材が一端側に前記取付部材に当接する当接部を有し、他端側が第二半体の接続部材用配置部付近まで延びているためLEDソケットにおいて熱が最も発生し易い箇所から取付部材側へ効率よく流れ、最終的にネジ等の取付部材を介して上記した適用灯具や各種器具側へ効率よく放熱可能となる。 In the invention of claim 2, first, since the first half body and / and the second half body have a recessed portion for the heat radiating member, the thickness dimension of the entire LED socket is almost the same as that without the heat radiating member. Can be maintained. At the same time, the heat radiating member has a contact portion that abuts on the mounting member on one end side, and the other end extends to the vicinity of the connecting member arranging portion of the second half body, so that the location where heat is most likely to be generated in the LED socket Efficiently flows from the lamp to the mounting member side, and finally heat can be efficiently dissipated to the above-mentioned applicable lamps and various fixtures via the mounting member such as a screw.

請求項3の発明では、放熱部材が板状であり取付部材を貫入される挿通穴及び第二半体の上取付穴に嵌入される筒部を有しているため取付部材により放熱部材を両半体と共締め可能となる。 In the invention of claim 3, since the heat radiating member has a plate shape and has an insertion hole through which the mounting member is inserted and a tubular portion to be fitted into the upper mounting hole of the second half body, both the heat radiating member is provided by the mounting member. It can be tightened together with the half body.

請求項4の発明では、放熱部材が線状をなし取付部材に圧接可能になっているため加工精度も余り要求されず重量的にも軽く実施容易となる。 In the invention of claim 4, since the heat radiating member has a linear shape and can be pressure-welded to the mounting member, processing accuracy is not required so much, the weight is light, and the implementation is easy.

請求項5の発明では、第二半体が接続部材用配置部と窪み部との間に設けられた凹所に配置される絶縁性チップを有しているため、放熱部材がチップの存在により配置部に設けられる前記接続部材と電気的障害を起こさないようにし、更に熱がチップを介在して放熱部材側へ流れ易くして放熱特性を向上する。 In the invention of claim 5, since the second half body has an insulating chip arranged in a recess provided between the connecting member arrangement portion and the recess portion, the heat radiating member is due to the presence of the chip. The connection member provided in the arrangement portion is prevented from causing an electrical failure, and heat is easily flowed to the heat dissipation member side via the chip to improve the heat dissipation characteristics.

請求項6の発明では、LEDソケット構造体として、請求項1から5に挙げたような利点や付加価値を具備できる。 In the invention of claim 6, the LED socket structure can have the advantages and added value as mentioned in claims 1 to 5.

(a)は本発明形態のLEDソケットを上側より見た斜視図、(a)はLEDソケットにLED構造体を組み付けたLEDソケット構造体を上側より見た斜視図である。(A) is a perspective view of the LED socket of the present invention seen from above, and (a) is a perspective view of an LED socket structure in which an LED structure is assembled to an LED socket, as viewed from above. 上記LEDソケット構造体を分解して上側より見た概略分解斜視図である。It is a schematic disassembled perspective view which disassembled the said LED socket structure and looked at from the upper side. 上記LEDソケットを構成している第一半体単品を示し、(a)は内面ないしは上面図、(b)は外面ないしは下面図である。The first half body constituting the LED socket is shown, (a) is an inner surface or a top view, and (b) is an outer surface or a bottom view. (a)は図3(a)のA−A線模式断面図、(b)は第一半体にLED構造体を仮止めした状態を示す説明図である。FIG. 3A is a schematic cross-sectional view taken along the line AA of FIG. 3A, and FIG. 3B is an explanatory view showing a state in which the LED structure is temporarily fixed to the first half body. 上記LEDソケットを構成している第二半体を示し、(a)は内面ないしは下面図、(b)は外面ないしは上面図である。The second half body constituting the LED socket is shown, (a) is an inner surface or a lower surface view, and (b) is an outer surface or a top view. (a)は図5(a)のB−B線模式断面図、(b)は図5(a)のC−C線模式断面図である。(A) is a schematic cross-sectional view taken along the line BB of FIG. 5 (a), and FIG. 5 (b) is a schematic cross-sectional view taken along the line CC of FIG. 5 (a). (a)は第二半体に放熱部材及びチップを配設すると共に、給電端子を組み付ける要領を説明するための模式構成図、(b)はLEDソケットを構成している放熱部材単品の上面図、(c)は(b)のX矢視図である。(A) is a schematic configuration diagram for arranging a heat radiating member and a chip on the second half body and explaining a procedure for assembling the power supply terminal, and (b) is a top view of a single heat radiating member constituting the LED socket. , (C) is the X arrow view of (b). LEDソケットを構成している給電端子(接続部材)単品を示し、(a)は上面図、(b)は(a)のY矢視図である。A single power supply terminal (connecting member) constituting the LED socket is shown, (a) is a top view, and (b) is a Y arrow view of (a). 上記LEDソケットを構成している放熱部材を変更した変形例を示し、(a)は図7(a)に対応して示す構成図、(b)は放熱部材単品の拡大上面図である。A modified example in which the heat radiating member constituting the LED socket is changed is shown, FIG. 7A is a configuration diagram corresponding to FIG. 7A, and FIG. 7B is an enlarged top view of the heat radiating member alone. 特許文献1のLEDソケット及びソケット構造体として、(a)は文献1の図2(a)を示し、(b)は文献1の図1(b)を示している。As the LED socket and socket structure of Patent Document 1, (a) shows FIG. 2 (a) of Document 1, and (b) shows FIG. 1 (b) of Document 1. 特許文献1のLEDソケット及びソケット構造体として、(a)及び(b)は文献1の図12を示している。As the LED socket and socket structure of Patent Document 1, (a) and (b) show FIG. 12 of Document 1.

以下、本発明の形態例を図面を参照して説明する。この説明では、LEDソケット及びLEDソケット構造体の部材構成を説明した後、その作動特徴、変形例の順に述べる。 Hereinafter, examples of the embodiment of the present invention will be described with reference to the drawings. In this description, the member configurations of the LED socket and the LED socket structure will be described, and then the operating features and the modified examples will be described in this order.

(部材構成)図1及び図2に示したLEDソケット構造体50は、本発明を適用したLEDソケット5にLED構造体6を組み付けたものであり、灯具や照明用機器などの取付部に対し複数のネジSにより装着される。ここで、LED構造体6は、公知の市販品であり、アルミニウム等の基板7の上面にLED素子等の発光部8及び給電部9などを配置したものである。給電部9は、外部電源に接続されるリード線45,46の端末に給電端子4を介して外部電力の供給を受けるためのもので、2箇所設けられている。 (Member Configuration) The LED socket structure 50 shown in FIGS. 1 and 2 is a structure in which the LED structure 6 is assembled to the LED socket 5 to which the present invention is applied, and is attached to a mounting portion such as a lamp or a lighting device. It is attached by a plurality of screws S. Here, the LED structure 6 is a known commercially available product, in which a light emitting portion 8 such as an LED element and a feeding portion 9 are arranged on the upper surface of a substrate 7 made of aluminum or the like. The power supply unit 9 is provided at two locations for receiving external power supply to the terminals of the lead wires 45 and 46 connected to the external power supply via the power supply terminal 4.

また、LEDソケット構造体50を装着する照明用機器側の取付部には、放熱特性に優れるようヒートシンクなどが採用されることもある。ボルト等のネジSは典型的な取付部材であるが、ネジSに代えて金属製の連結棒とナット等の取付手段などであってもよい。なお、図1及び図2には各ネジSに対応してナットNを図示している。このナットNは、便宜的に図示したものであり、実際は取付部にネジSと螺合する雌ネジを形成することで省略したり、取付部に設けられた挿通穴から突出したネジ部分に螺合させるようにしたり、或いは取付部に予め固着しておきそこにネジSを螺合させる。 Further, a heat sink or the like may be adopted for the mounting portion on the lighting device side to which the LED socket structure 50 is mounted so as to have excellent heat dissipation characteristics. A screw S such as a bolt is a typical mounting member, but instead of the screw S, a metal connecting rod and a mounting means such as a nut may be used. Note that FIGS. 1 and 2 show nuts N corresponding to each screw S. This nut N is shown for convenience, and is actually omitted by forming a female screw to be screwed with the screw S in the mounting portion, or screwed into the screw portion protruding from the insertion hole provided in the mounting portion. It is made to fit, or it is fixed to the mounting portion in advance and the screw S is screwed there.

LEDソケット5は、図2に示されるごとくLED構造体6を支持可能な樹脂製の第一半体1と、第一半体1に重ねた状態で連結される樹脂製の第二半体2と、第一半体1及び第二半体2の間に挟持される放熱部材3と、2個の給電端子4及び不図示の板バネと、2個の絶縁性チップ39とを備えている。 As shown in FIG. 2, the LED socket 5 has a resin first half body 1 capable of supporting the LED structure 6 and a resin second half body 2 connected in a state of being overlapped with the first half body 1. A heat radiating member 3 sandwiched between the first half body 1 and the second half body 2, two feeding terminals 4, a leaf spring (not shown), and two insulating chips 39 are provided. ..

このうち、第一半体1は、図2から図4に示されるごとく環状の射出成形品であり、中央部に設けられた開口10、開口10より外周側に設けられて上下に貫通している複数(この例では2つ)の取付穴11、上面1aに突設された複数(この例では2つ)の連結片12及び複数(この例では4つ)のボス13、外周囲の2箇所に設けられた切欠部14、下面1bにあって開口10の縁側に設けられて基板7を位置決め保持可能な保持手段として位置決め部15及び弾性挟持片16などを一体に有している。 Of these, the first half body 1 is an annular injection-molded product as shown in FIGS. 2 to 4, and is provided on the outer peripheral side of the opening 10 provided in the central portion and the opening 10 and penetrates vertically. Multiple (two in this example) mounting holes 11, multiple (two in this example) connecting pieces 12 protruding from the upper surface 1a, multiple (four in this example) bosses 13, and two outer circumferences. A positioning portion 15 and an elastic holding piece 16 are integrally provided as holding means for positioning and holding the substrate 7 provided on the edge side of the opening 10 in the cutout portion 14 provided at the location and the lower surface 1b.

開口10は、発光部8及び給電部9の回りを上面1a側に突出可能な形状となっている。各取付穴11は同心円上に設けられた円形穴である。各連結片12は、上面外周側に設けられて先端内側に突出された爪12aを有している。各ボス13は開口10と外周囲との間に設けられている。切欠部14は、後述する第二半体2に組み込まれる給電端子4に接続されて外部へ引き出されるリード線45,46の引き出し位置に対応した箇所に設けられている。なお、符号19aと19bはLED構造体の給電部9がアノード側かカソード側かを表している。 The opening 10 has a shape capable of projecting around the light emitting portion 8 and the feeding portion 9 toward the upper surface 1a. Each mounting hole 11 is a circular hole provided on a concentric circle. Each connecting piece 12 has a claw 12a provided on the outer peripheral side of the upper surface and protruding inward of the tip. Each boss 13 is provided between the opening 10 and the outer periphery. The notch portion 14 is provided at a position corresponding to the lead-out position of the lead wires 45 and 46 which are connected to the power supply terminal 4 incorporated in the second half body 2 described later and are drawn out to the outside. Reference numerals 19a and 19b indicate whether the feeding portion 9 of the LED structure is on the anode side or the cathode side.

位置決め部15は、下面1bに段差として設けられ、略矩形の基板7において対向した2箇所の角部側を対応する段差で受け止めて基板7を第一半体1の肉厚内に位置決め可能にする。これに対し、弾性挟持片16は、開口10のもう一方の対向した縁部にそれぞれ設けられて下傾斜状態に突出されて、該下傾斜状態から内側方向の押力を受けると水平又は若干内側傾斜状態に切り換えられるようになっている。また、各弾性挟持片16には、基板7を受け止め可能なL形段差16aが先端側に形成されている。 The positioning portion 15 is provided on the lower surface 1b as a step so that the substrate 7 can be positioned within the wall thickness of the first half body 1 by receiving the two opposite corners of the substantially rectangular substrate 7 at the corresponding steps. To do. On the other hand, the elastic holding piece 16 is provided on the other opposite edge of the opening 10 and protrudes in a downwardly inclined state, and when a pushing force in the inward direction is received from the downwardly inclined state, the elastic holding piece 16 is horizontally or slightly inward. It can be switched to the tilted state. Further, each elastic holding piece 16 is formed with an L-shaped step 16a capable of receiving the substrate 7 on the tip side.

図4(b)はLED構造体を第一半体に仮止めした状態を示している。この構造では、例えば、基板7が一端側だけを対応する片側の位置決め部15に当てると共に、両側の段差16aに載せた状態から、基板7の他方側を縦方向に押し込むと、各弾性挟持片16が水平又は若干内側傾斜状態に切り換えられる。その状態において、LED構造体6の基板7は、両段差16aの対向面の間に挟まれて仮止めされる。なお、上記した第二半体に設けた図5(a)の凹部2c1は、各弾性挟持片16が内側傾斜状態に切り換えられた際に不用意に当たらないようにする逃げ用の空間である。 FIG. 4B shows a state in which the LED structure is temporarily fixed to the first half body. In this structure, for example, when the substrate 7 is placed on the corresponding positioning portion 15 on one side and the other side of the substrate 7 is pushed in the vertical direction from the state where the substrate 7 is placed on the steps 16a on both sides, each elastic holding piece 16 is switched to a horizontal or slightly inwardly inclined state. In that state, the substrate 7 of the LED structure 6 is sandwiched between the facing surfaces of both steps 16a and temporarily fixed. The recess 2c1 of FIG. 5A provided in the second half body is a space for escape so that each elastic holding piece 16 does not inadvertently hit when switched to the inward inclined state. ..

すなわち、この構造では、基板7を位置決め部15及び弾性挟持片16を利用して仮止めするが、操作要領として縦方向に押圧しながら仮止めする押し込み方式であり、特許文献1のごとくLED構造体の基板を水平方向に対向した片持弾性支持部(図11(b)の符号1232)により挟持する構造に比べLED構造体の基板7をより的確かつ迅速な動作にて保持できる。そして、この構造では、LEDソケット構造体50が灯具などの機器の取付部に対し複数のネジSにより螺着されることによりLED構造体6も本固定状態となるよう設計されている。 That is, in this structure, the substrate 7 is temporarily fixed by using the positioning portion 15 and the elastic holding piece 16, but the operation procedure is a pushing method in which the substrate 7 is temporarily fixed while being pressed in the vertical direction, and has an LED structure as in Patent Document 1. The substrate 7 of the LED structure can be held more accurately and quickly than the structure in which the substrate of the body is sandwiched by the cantilever elastic support portions (reference numeral 1232 in FIG. 11B) facing each other in the horizontally direction. In this structure, the LED socket structure 50 is designed to be screwed to the mounting portion of a device such as a lamp by a plurality of screws S so that the LED structure 6 is also in the final fixed state.

なお、符号18は2箇所に設けられた浅い凹部である。各凹所18は、第二半体2に組み込まれる対応する給電端子4の上側部分を逃がす。符号19a,19bは第一半体の下面1bに刻印されてLED構造体6を第一半体1に組み付ける際、対応する給電部9の向きが分かるようにして誤組み付けを防ぐ目印である。 Reference numeral 18 is a shallow recess provided at two locations. Each recess 18 allows the upper portion of the corresponding power supply terminal 4 incorporated in the second half body 2 to escape. Reference numerals 19a and 19b are stamped on the lower surface 1b of the first half body to prevent erroneous assembly by making it possible to know the direction of the corresponding power feeding unit 9 when assembling the LED structure 6 to the first half body 1.

第二半体2は、図2及び図5から図7に示されるごとく第一半体1と重ねられる環状の射出成形品であり、中央部に設けられた開口20、下面2aにあって開口20より外周側に設けられて放熱部材3を配置する2箇所の窪み部2c及び窪み部2cと開口20の間に設けられて給電端子4の座部41を受ける台座2dと、窪み部2cにあって上下に貫通している取付穴21及びボス26と、外周囲の2箇所に設けられた切欠部22と、ボス13が嵌合される4箇所の凹部23と、リード線45,46を配置する2箇所の溝24と、溝24に通じている凹所25及び凹所25の奥側の係合溝25a並びに台座2dの周囲に設けられた2つの係合溝25bと、台座2dの凹所25と反対側に設けられた小凹所25c
と、各台座2dと窪み部2cの間に設けられているチップ用凹所29とを備えている。なを、符号2c1は、下面2aのうち、開口20と窪み部2cの間の一部に形成された凹部である。
The second half body 2 is an annular injection-molded product that is overlapped with the first half body 1 as shown in FIGS. 2 and 5 to 7, and is an opening 20 provided in the central portion and an opening in the lower surface 2a. The pedestal 2d and the recess 2c provided between the recesses 2c and the recesses 2c and the opening 20 provided on the outer peripheral side of the 20 and where the heat radiating member 3 is arranged to receive the seat 41 of the power feeding terminal 4. There are mounting holes 21 and bosses 26 that penetrate vertically, cutouts 22 provided at two locations around the outer circumference, four recesses 23 into which the bosses 13 are fitted, and lead wires 45 and 46. Two grooves 24 to be arranged, a recess 25 leading to the groove 24, an engaging groove 25a on the back side of the recess 25, two engaging grooves 25b provided around the pedestal 2d, and a pedestal 2d. Small recess 25c provided on the opposite side of the recess 25
And a chip recess 29 provided between each pedestal 2d and the recess 2c. In addition, reference numeral 2c1 is a recess formed in a part of the lower surface 2a between the opening 20 and the recess 2c.

開口20は発光部8を下から上へ露出する略円形であり、縁部が上傾斜部20aに設けられている。窪み部2cは、外周側に沿って設けられて放熱部材3の厚さに相当する深さである。台座2dは、下面2aより低く、窪み部2cよりも少し高い。取付穴21は取付穴11と同軸線上に設けられている。ボス26は放熱部材の穴34に嵌合される。切欠部22は、下縁に突設したリブ22aを有していると共に、該リブ22aの上面2b側を段差22bに形成している。この段差22bには、連結片12の爪12aが係合する。各凹部23は同心円上に設けられている。 The opening 20 has a substantially circular shape that exposes the light emitting portion 8 from the bottom to the top, and an edge portion is provided on the upward inclined portion 20a. The recessed portion 2c is provided along the outer peripheral side and has a depth corresponding to the thickness of the heat radiating member 3. The pedestal 2d is lower than the lower surface 2a and slightly higher than the recessed portion 2c. The mounting hole 21 is provided on the coaxial line with the mounting hole 11. The boss 26 is fitted into the hole 34 of the heat radiating member. The cutout portion 22 has a rib 22a projecting from the lower edge, and the upper surface 2b side of the rib 22a is formed as a step 22b. The claw 12a of the connecting piece 12 engages with the step 22b. Each recess 23 is provided on a concentric circle.

各溝24は、両半体1,2の積層状態で第一半体の対応する切欠部14と重ねられ、リード線45又は46を半体内から外へ導出可能となる。台座2dは給電端子4を保持する。凹部25は給電端子4のベース40が配置される。係合溝25a,25bは給電端子4の対応する係止部40a,42と係合する。小凹所25cには、給電端子4の接続部43を下から上向きに押圧する図示を省略した板ばねが配置される。凹所29には絶縁性チップ39が嵌合配置される。この凹所29は窪み部2cの一部に接近した設けられる。そして、凹所29に嵌合されるチップ39が窪み部2cに配置される放熱部材3と接触されるようにすることが好ましい。チップ39の材質は、絶縁性に優れたセラミック製が好ましいが、他の絶縁性の素材でもよい。 Each groove 24 is overlapped with the corresponding notch portion 14 of the first half body in a laminated state of both halves 1 and 2, and the lead wire 45 or 46 can be led out from the half body to the outside. The pedestal 2d holds the power feeding terminal 4. The base 40 of the power feeding terminal 4 is arranged in the recess 25. The engaging grooves 25a and 25b engage with the corresponding locking portions 40a and 42 of the feeding terminal 4. In the small recess 25c, a leaf spring (not shown) that presses the connection portion 43 of the power feeding terminal 4 upward from below is arranged. An insulating tip 39 is fitted and arranged in the recess 29. The recess 29 is provided close to a part of the recess 2c. Then, it is preferable that the tip 39 fitted in the recess 29 is brought into contact with the heat radiating member 3 arranged in the recess 2c. The material of the chip 39 is preferably made of ceramic having excellent insulating properties, but other insulating materials may be used.

ここで、放熱部材3は、図7(b),(c)に示されるごとく金属製のプレス品であり、取付穴11,21と同軸線上に配置される挿通穴31と、第二半体のリブ22aが嵌合される切欠部32と、第一半体の対応するボス13が嵌合する貫通穴33と、第二半体のボス26が嵌合する貫通穴34とを有している。また、放熱部材3は、板状をなし、挿通穴31の縁部に突設されて第二半体の上取付穴31に嵌入される筒部30を有している。この筒部30は、バーリング加工により放熱部材3の上面3a側に突出形成されたもので、同7(a)のごとく第二半体の取付穴21に嵌入される。そして、この構造では、LEDソケット5が両半体1,2を連結一体化した状態で、灯具や各種機器に対しネジSなどにより取り付ける場合、放熱部材3が筒部30の存在により両半体1,2と強固に共締め可能となる。 Here, the heat radiating member 3 is a pressed product made of metal as shown in FIGS. 7 (b) and 7 (c), and has an insertion hole 31 arranged on the coaxial line with the mounting holes 11 and 21 and a second half body. It has a notch 32 into which the rib 22a of the first half is fitted, a through hole 33 in which the corresponding boss 13 of the first half is fitted, and a through hole 34 into which the boss 26 of the second half is fitted. There is. Further, the heat radiating member 3 has a plate shape and has a tubular portion 30 which is projected from the edge portion of the insertion hole 31 and is fitted into the upper mounting hole 31 of the second half body. The tubular portion 30 is formed so as to project toward the upper surface 3a side of the heat radiating member 3 by burring, and is fitted into the mounting hole 21 of the second half body as shown in 7 (a). In this structure, when the LED socket 5 is connected and integrated with both halves 1 and 2 and attached to a lamp or various devices with screws S or the like, the heat radiating member 3 is attached to both halves due to the presence of the tubular portion 30. It can be firmly tightened together with 1 and 2.

給電端子4は、導電性板材のプレス品であり、図8に示されるごとく縦配置のベース40と、ベース40先端側部に設けられた係止部40aと、ベース40の先端側に連結されて台座2dに受け止められる座部41と、座部41の縁部から折り曲げられた2箇所の係止部42と、座部41の前側より斜め上側に立ち上げられた接続部43と、接続部43の先端裏面にあって両側に突設された規制壁部44とを一体に有している。符号43aは、接続部43の上面側に突出されて給電部9に当接する接点部である。 The power supply terminal 4 is a pressed product of a conductive plate material, and is connected to a vertically arranged base 40, a locking portion 40a provided on the tip side of the base 40, and the tip side of the base 40 as shown in FIG. A seat 41 that is received by the pedestal 2d, two locking portions 42 that are bent from the edge of the seat 41, a connecting portion 43 that is raised diagonally upward from the front side of the seat 41, and a connecting portion. It integrally has a regulation wall portion 44 which is on the back surface of the tip of 43 and is projected on both sides. Reference numeral 43a is a contact portion that protrudes toward the upper surface side of the connecting portion 43 and comes into contact with the feeding portion 9.

ベース部40には、内側面に対しリード線45又は46の先端側芯線が半田等にて結合される。そして、以上の給電端子4は、座部41が台座2dに配置された状態で、係止部40aが係合溝25aに圧入され、各係止部42が対応する係合溝25bに圧入されることで第二半体2に装着される。その際は、小凹所25cに不図示の板ばねが組み込まれる。この板ばねは、下部が小凹所25cに位置決めされると共に、上部が接続部43の裏側に突出された両規制壁部44の間に位置規制された状態で、接続部43を下方へ押圧して接点部43aが給電部9に確実に接触されるようにする。 The leading end side core wire of the lead wire 45 or 46 is bonded to the inner side surface of the base portion 40 by soldering or the like. Then, in the above power supply terminal 4, the locking portion 40a is press-fitted into the engaging groove 25a and each locking portion 42 is press-fitted into the corresponding engaging groove 25b in a state where the seat portion 41 is arranged on the pedestal 2d. By doing so, it is attached to the second half body 2. In that case, a leaf spring (not shown) is incorporated in the small recess 25c. The leaf spring presses the connecting portion 43 downward while the lower portion is positioned at the small recess 25c and the upper portion is positioned between the two restricting wall portions 44 protruding to the back side of the connecting portion 43. This ensures that the contact portion 43a is in contact with the feeding portion 9.

以上のようにして、放熱部材3及び板ばねで付勢した給電端子4を配置した第二半体2には、第一半体1が連結される。すなわち、両半体1,2は、第一半体の複数のボス13と第二半体の対応する凹部23との嵌合、及び第一半体の連結片の爪12aと第二半体の段差22bとの係合により連結される。 As described above, the first half body 1 is connected to the second half body 2 in which the heat radiating member 3 and the power feeding terminal 4 urged by the leaf spring are arranged. That is, both halves 1 and 2 are fitted with the plurality of bosses 13 of the first halves and the corresponding recesses 23 of the second halves, and the claws 12a and the second halves of the connecting pieces of the first halves. It is connected by engaging with the step 22b of.

(作動特徴)以上のLEDソケットやLEDソケット構造体の利点について明らかにする。
(ア)、以上のLEDソケット5ないしはLEDソケット構造体50としては、LED構造体6を支持する第一半体1及び給電端子4を配置する配置部を有する第二半体2からなるタイプにおいて、両半体1,2が共に樹脂製であるためセラミック製に比べ量産時の加工精度を安定維持したり製造コストを低減できる。同時に、両半体1,2で挟持された熱伝導に優れた放熱部材3により優れた放熱特性を有している。すなわち、放熱部材3は、発光部8及び給電部9や給電端子4等に発生した熱がネジSを通して外部、つまり例えば適用灯具や各種器具側へ効率よく逃がすよう作用し、それにより樹脂製の両半体1,2にこもり易い熱対策として最良の放熱特性を付与できる。
(Operating features) The advantages of the above LED socket and LED socket structure will be clarified.
(A) The above LED socket 5 or LED socket structure 50 is a type composed of a first half body 1 that supports the LED structure 6 and a second half body 2 that has an arrangement portion for arranging the power supply terminal 4. Since both halves 1 and 2 are made of resin, the processing accuracy at the time of mass production can be stably maintained and the manufacturing cost can be reduced as compared with those made of ceramic. At the same time, it has excellent heat dissipation characteristics due to the heat dissipation member 3 sandwiched between the two halves 1 and 2 and having excellent heat conduction. That is, the heat radiating member 3 acts so that the heat generated in the light emitting unit 8, the power feeding unit 9, the power feeding terminal 4, etc. is efficiently dissipated to the outside, that is, to the applicable lamp or various fixtures, for example, through the screw S, thereby being made of resin. The best heat dissipation characteristics can be given to both halves 1 and 2 as a measure against heat that tends to be trapped.

(イ)、LEDソケット5ないしはLEDソケット構造体50は、第一半体1が放熱部材3を配置する窪み部2cを有しているため、LEDソケット全体の厚さ寸法を放熱部材3のない場合と同じ厚さに維持できる。同時に、放熱部材3が一端側にネジSに当接する筒部30を有し、他端側が第二半体2側に配置される給電端子4付近まで延びているためLEDソケット構造体50において熱が最も発生し易い箇所から取付用のネジS側へ効率よく流れ、最終的にネジSを介して適用灯具や各種器具側へ効率よく放熱可能となる。 (A) In the LED socket 5 or the LED socket structure 50, since the first half body 1 has a recessed portion 2c in which the heat radiation member 3 is arranged, the thickness dimension of the entire LED socket does not have the heat radiation member 3. Can be maintained at the same thickness as the case. At the same time, since the heat radiating member 3 has a tubular portion 30 that abuts on the screw S on one end side and the other end side extends to the vicinity of the power supply terminal 4 arranged on the second half body 2 side, the LED socket structure 50 heats up. Efficiently flows from the place where is most likely to occur to the mounting screw S side, and finally, heat can be efficiently dissipated to the applicable lamp and various fixtures via the screw S.

(ウ)、LEDソケット5ないしはLEDソケット構造体50は、第一半体1及び第二半体2が略環状であるため照明用として外観見栄えに優れている。同時に、放熱部材3が板状でありネジSを貫入される挿通穴31及び第二半体2の上取付穴21に嵌入される筒部30を有しているためネジSにより放熱部材3を両半体1,2と共締め可能となる。 (C) The LED socket 5 or the LED socket structure 50 has an excellent appearance for lighting because the first half body 1 and the second half body 2 are substantially annular. At the same time, since the heat radiating member 3 has a plate shape and has an insertion hole 31 through which the screw S is inserted and a tubular portion 30 fitted into the upper mounting hole 21 of the second half body 2, the heat radiating member 3 is formed by the screw S. It can be tightened together with both halves 1 and 2.

(エ)、LEDソケット5ないしはLEDソケット構造体50は、第二半体2が給電端子4と窪み部2cとの間に設けられた凹所29に配置される絶縁性チップ39を有しているこのため、放熱部材3がチップ29の存在により電気的障害を起こさないようにし、更に熱がチップ29を介在して放熱部材3側へ流れ易くして放熱特性を向上する。 (D) The LED socket 5 or the LED socket structure 50 has an insulating chip 39 in which the second half body 2 is arranged in a recess 29 provided between the power feeding terminal 4 and the recess 2c. Therefore, the heat radiating member 3 is prevented from causing an electrical failure due to the presence of the chip 29, and heat is easily flowed to the heat radiating member 3 side via the chip 29 to improve the heat radiating characteristics.

(放熱特性)本発明者は、上記LEDソケット5として両半体が樹脂製、給電端子、放熱部材からなる発明構成品a、更に上記チップ39を加えた発明構成品a1、従来のLEDソケットとして両半体が樹脂製、給電端子からなる従来構成品b、従来のLEDソケットとして両半体が樹脂製の第一半体とアルミナ磁器製の第二半体、給電端子からなる従来構成品cについて放熱特性の優劣を調べるため次のような簡単な試験を行った。 (Heat dissipation characteristics) The present inventor uses the LED socket 5 as an invention component a in which both halves are made of resin, a power supply terminal, and a heat radiation member, and an invention component a1 in which the chip 39 is added, as a conventional LED socket. Conventional component b consisting of both halves made of resin and power supply terminal, conventional component c consisting of both halves made of resin, second half body made of alumina porcelain, and power supply terminal as a conventional LED socket The following simple test was conducted to investigate the superiority and inferiority of the heat dissipation characteristics.

試験方法は、給電端子4の下に熱電対の先を押し当て、周囲の温度が15℃前後の時より、無風状態でネジ(M3)Sを指先で摘んで体温(36℃)の伝わり方を調べた。具体的には、ネジSを摘んだときから5分経過後の温度上昇を調べ優劣を比較するようにした。各第一半体、第二半体、給電端子は同じ大きさのものである。各構成品はネジSと給電端子4間の距離を同一に設定し、試験では極力同じ環境を保つようにした。また、樹脂の素材はポリブチレンテレフタレートにガラスファイバー入れ30%のものを使用した。 The test method is to press the tip of the thermocouple under the power supply terminal 4 and pick up the screw (M3) S with your fingertips in a windless state from when the ambient temperature is around 15 ° C to transmit the body temperature (36 ° C). I examined. Specifically, the temperature rise 5 minutes after the screw S was picked was examined and the superiority or inferiority was compared. The first half, the second half, and the power supply terminal are the same size. For each component, the distance between the screw S and the power supply terminal 4 was set to be the same, and the same environment was maintained as much as possible in the test. The resin material used was polybutylene terephthalate with 30% glass fiber.

試験結果は5回の平均値で、発明構成品aでは3.4℃上昇し、発明構成品a1では3.8℃上昇した。これに対し、従来構成品bでは2.0℃上昇し、従来構成品cでは2.8℃上昇した。この結果から、放熱特性ないしは熱伝導特性は、発明構成品a及びa1が従来構成品b及びcよりかなり優れていることが推察され、また、チップ39を追加することがより好ましいことが分かる。 The test result was an average value of 5 times, and the temperature of the invention component a increased by 3.4 ° C and that of the invention component a1 increased by 3.8 ° C. On the other hand, the temperature of the conventional component b increased by 2.0 ° C, and that of the conventional component c increased by 2.8 ° C. From this result, it can be inferred that the invention components a and a1 are considerably superior to the conventional components b and c in terms of heat dissipation characteristics or heat conduction characteristics, and it can be seen that it is more preferable to add the chip 39.

(変形例)図9は上記放熱部材を変更した一例を示している。この説明では、上記形態と同じ部材や部位に同一符号を付して重複説明を省き、変更点だけを詳述する。つまり、変更点は、放熱部材3Aの構成と、第二半体の窪み部2cにボス26と共にもう一つのボス27を追加した構成にある。 (Modification Example) FIG. 9 shows an example in which the heat dissipation member is changed. In this description, the same members and parts as in the above embodiment are designated by the same reference numerals, duplicate explanations are omitted, and only the changes will be described in detail. That is, the changes are in the configuration of the heat radiating member 3A and the configuration in which another boss 27 is added together with the boss 26 to the recessed portion 2c of the second half body.

まず、放熱部材3Aは、トーションバネ等の線材により形成され、一端側に設けられて取付部材Sに圧接する当接部38と、他端側に設けられて前記配置部25付近つまり凹所29に配されたチップ39に当接する当接部37と、当接部37と当接部38の間に設けられた屈曲部36とを有している。そして、この放熱部材3Aは、窪み部2c上にあって、屈曲部36が同図のごとく下面2aとの境目の段差端面の一部と、ボス26及び27とにより位置規制された態様で組み付けられると、当接部37がチップ39に圧接し、かつ、当接部38の一部が挿入穴31の内側に配置される。その後、この変形例では、ネジSが第二半体の取付穴21から第一半体の取付穴11に挿入されると、当接部38の一部に当たり、当接部38が各取付穴より外側へ逃げるよう弾性変位され、最終的にネジSに圧接した状態に維持される。 First, the heat radiating member 3A is formed of a wire rod such as a torsion spring, and has a contact portion 38 provided on one end side and press-contacting with the mounting member S and a contact portion 38 provided on the other end side near the arrangement portion 25, that is, a recess 29. It has an abutting portion 37 that abuts on the tip 39 arranged in the abutting portion 37, and a bent portion 36 provided between the abutting portion 37 and the abutting portion 38. Then, the heat radiating member 3A is assembled on the recessed portion 2c in such a manner that the bent portion 36 is positioned by a part of the stepped end surface at the boundary with the lower surface 2a and the bosses 26 and 27 as shown in the figure. Then, the contact portion 37 is in pressure contact with the chip 39, and a part of the contact portion 38 is arranged inside the insertion hole 31. After that, in this modification, when the screw S is inserted from the mounting hole 21 of the second half body into the mounting hole 11 of the first half body, it hits a part of the contact portion 38, and the contact portion 38 hits each mounting hole. It is elastically displaced so as to escape to the outside, and is finally maintained in a state of being pressed against the screw S.

以上の変形例では、上記(ウ)の後半の記載が次のように変更される。つまり、放熱部材3Aが線状をなし、ネジSに圧接可能になっているため加工精度を緩和したり重量を軽減し、その結果、実施容易となる。 In the above modified example, the description in the latter half of (c) above is changed as follows. That is, since the heat radiating member 3A has a linear shape and can be pressure-welded to the screw S, the processing accuracy is relaxed and the weight is reduced, and as a result, the implementation becomes easy.

なお、本発明は、以上の形態例及び変形例に示したLED構造体、LEDソケット、LEDソケット構造体に何ら制約されるものではない。本発明は、請求項に特定される技術要素を備えておればよく、細部は必要に応じて種々変更可能なものである。その一例として、形態例及び変形例では、全体の厚さが放熱部材によっても増えないようにするため第二半体側に逃げ用の窪み部を設けたが、この窪み部を第一部材側に設けたり、両半体にそれぞれ設けるようにしても差し支えない。 The present invention is not limited to the LED structure, the LED socket, and the LED socket structure shown in the above-mentioned embodiment and modification. The present invention only needs to include the technical elements specified in the claims, and the details can be variously changed as needed. As an example, in the morphological example and the modified example, a recess for escape was provided on the second half body side so that the overall thickness would not be increased by the heat radiation member, but this recess was placed on the first member side. It may be provided or provided on both halves.

また、LED構造体の基板を保持する保持手段としては、形態例に示した保持手段に限られず他の位置決め構造や係合構造、更に接合構造などが適宜採用可能である。絶縁性チップは、省略可能であるが、電気的障害防止と共に放熱特性を向上するため追加することが好ましい。材質は絶縁性であればセラミック以外でもよい。給電端子及び上記板バネについても、例えば、第二半体の形状や給電部との良接触状態を保つため変形可能である。 Further, the holding means for holding the substrate of the LED structure is not limited to the holding means shown in the form example, and other positioning structures, engaging structures, joining structures, and the like can be appropriately adopted. Although the insulating chip can be omitted, it is preferable to add it in order to prevent electrical damage and improve heat dissipation characteristics. The material may be other than ceramic as long as it is insulating. The power feeding terminal and the leaf spring can also be deformed in order to maintain the shape of the second half body and the good contact state with the power feeding portion, for example.

1・・・・・第一半体(10は開口、11は取付穴)
2・・・・・第二半体(20は上開口、21は上取付穴、25は配置部)
3・・・・・放熱部材(30は当接部である筒部、31は挿通穴)
3A・・・・放熱部材(36,37規制部、38は当接部)
4・・・・・給電端子(接続部材)
5・・・・・LEDソケット
6・・・・・LED構造体
7・・・・・基板
8・・・・・発光部
9・・・・・給電部
12・・・・連結片(連結手段)
16・・・・弾性挟持片(保持手段)
2c・・・・窪み部
29・・・・チップ用凹所
39・・・・絶縁性チップ
50・・・・LEDソケット構造体
S・・・・・ネジ(取付部材)
1 ... First half (10 is an opening, 11 is a mounting hole)
2 ... Second half (20 is the upper opening, 21 is the upper mounting hole, 25 is the placement part)
3 ... Heat dissipation member (30 is the cylinder part that is the contact part, 31 is the insertion hole)
3A ... Heat dissipation member (36, 37 regulation part, 38 is contact part)
4 ・ ・ ・ ・ ・ Power supply terminal (connecting member)
5 ・ ・ ・ ・ ・ LED socket 6 ・ ・ ・ ・ ・ LED structure 7 ・ ・ ・ ・ ・ Board 8 ・ ・ ・ ・ ・ Light emitting part 9 ・ ・ ・ ・ ・ Power supply part 12 ・ ・ ・ ・ ・ ・ Connecting piece (connecting means) )
16 ... Elastic holding piece (holding means)
2c ・ ・ ・ ・ Recessed part 29 ・ ・ ・ ・ Recessed part for chip 39 ・ ・ ・ ・ Insulating chip 50 ・ ・ ・ ・ LED socket structure S ・ ・ ・ Screw (mounting member)

Claims (6)

基板の上面にLED素子等の発光部及び給電部を配置したLED構造体を支持するためのLEDソケットにおいて、
開口及び取付穴と共に前記基板を略板厚内に取付可能な保持手段を有し、前記発光部を前記開口より下から上に突出し、かつ前記基板を前記保持手段により保持した状態で前記LED構造体を支持可能な樹脂製の第一半体と、
上開口及び上取付穴と共に前記給電部に電気的に接続可能にする接続部材用配置部を有し、前記上開口に前記発光部を配置し、かつ前記上取付穴を前記取付穴に同軸線上に位置した状態で前記第一半体に連結される樹脂製の第二半体と、
前記第一半体及び前記第二半体の間に挟持されると共に、前記上取付穴から前記取付穴へ貫通されるネジ等の取付部材に当接可能に配置された放熱部材とを備えていることを特徴とするLEDソケット。
In an LED socket for supporting an LED structure in which a light emitting portion such as an LED element and a feeding portion are arranged on the upper surface of a substrate.
The LED structure has a holding means capable of mounting the substrate within a substantially plate thickness together with an opening and a mounting hole, the light emitting portion protrudes from the bottom to the top of the opening, and the substrate is held by the holding means. The first half of the resin that can support the body,
It has an arrangement part for a connecting member that can be electrically connected to the power feeding part together with the upper opening and the upper mounting hole, the light emitting part is arranged in the upper opening, and the upper mounting hole is coaxially connected to the mounting hole. The resin-made second half that is connected to the first half while being located in
It is provided with a heat radiating member that is sandwiched between the first half body and the second half body and is arranged so as to be in contact with a mounting member such as a screw that penetrates from the upper mounting hole to the mounting hole. An LED socket characterized by being present.
前記第一半体又は/及び第二半体は前記放熱部材を配置する窪み部を有していると共に、前記放熱部材は前記第一半体及び第二半体の間にあって一端側に前記取付部材に当接する当接部を有し、他端側が前記接続部材用配置部付近まで延びていることを特徴とする請求項1に記載のLEDソケット。 The first half body and / and the second half body have a recess for arranging the heat radiation member, and the heat radiation member is located between the first half body and the second half body and is attached to one end side. The LED socket according to claim 1, wherein the LED socket has a contact portion that comes into contact with the member, and the other end side extends to the vicinity of the connecting member arrangement portion. 前記放熱部材は、板状をなし前記取付部材を前記上取付穴から前記取付穴へ貫通可能にする挿通穴及びその挿通穴の縁部に突設されて前記第二半体の上取付穴に嵌入される筒部を有しているとを特徴とする請求項1又は2に記載のLEDソケット。 The heat radiating member has a plate shape and is projected from an insertion hole that allows the mounting member to penetrate from the upper mounting hole to the mounting hole and an edge portion of the insertion hole into the upper mounting hole of the second half body. The LED socket according to claim 1 or 2, wherein the LED socket has a tubular portion to be fitted. 前記放熱部材は、線状をなし前記取付部材に圧接可能になっていることを特徴とする請求項1又は2に記載のLEDソケット。 The LED socket according to claim 1 or 2, wherein the heat radiating member has a linear shape and can be pressure-contacted with the mounting member. 前記第二半体は、前記接続部材用配置部と前記窪み部との間に凹所を設け、前記凹所に配置されたセラミック等からなる絶縁性チップを有していることを特徴とする請求項2に記載のLEDソケット。
The second half body is characterized in that a recess is provided between the connecting member arranging portion and the recessed portion, and the second half body has an insulating chip made of ceramic or the like arranged in the recess. The LED socket according to claim 2 .
請求項1から5の何れかに記載のLEDソケットに前記LED構造体を組み付けていることを特徴とするLEDソケット構造体。 An LED socket structure according to any one of claims 1 to 5, wherein the LED structure is assembled to the LED socket.
JP2017079550A 2017-04-13 2017-04-13 LED socket and LED socket structure Active JP6808569B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017079550A JP6808569B2 (en) 2017-04-13 2017-04-13 LED socket and LED socket structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017079550A JP6808569B2 (en) 2017-04-13 2017-04-13 LED socket and LED socket structure

Publications (3)

Publication Number Publication Date
JP2018182061A JP2018182061A (en) 2018-11-15
JP2018182061A5 JP2018182061A5 (en) 2019-09-19
JP6808569B2 true JP6808569B2 (en) 2021-01-06

Family

ID=64275874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017079550A Active JP6808569B2 (en) 2017-04-13 2017-04-13 LED socket and LED socket structure

Country Status (1)

Country Link
JP (1) JP6808569B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7041417B2 (en) * 2019-08-06 2022-03-24 株式会社三晃電気 LED socket and LED socket structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014203575A (en) * 2013-04-02 2014-10-27 東芝ライテック株式会社 Lighting device
EP3108178B1 (en) * 2014-01-02 2017-11-15 TE Connectivity Nederland B.V. Led socket assembly
JP6320141B2 (en) * 2014-04-11 2018-05-09 株式会社新光電気 LED socket, LED socket structure, LED lighting device, and LED lamp

Also Published As

Publication number Publication date
JP2018182061A (en) 2018-11-15

Similar Documents

Publication Publication Date Title
JP2011082141A (en) Light emitting device and lighting system
KR20120106799A (en) Led device, manufacturing method thereof, and light-emitting device
US9890933B2 (en) Holder of light-emitting module, and lighting apparatus
JP2012129155A (en) Led lamp
JP2016126931A (en) Lamp device and illuminating device
TW201239260A (en) Lamp assembly
JP6808569B2 (en) LED socket and LED socket structure
JP2017117736A (en) Lamp device and luminaire
JP2015185389A (en) Lamp device and lighting fixture
US10816181B2 (en) Light module providing positioning and fixation of a circuit board in a housing
JP2013239286A (en) Lighting-up device and lighting fixture having the same
JP5534216B2 (en) Lamp device and lighting device
JP5605966B1 (en) LED bulb and lighting fixture
US20160123542A1 (en) Lighting Device
JP2011204653A (en) Lamp device, socket device, and lighting system
JP2014093170A (en) Light source module, lamp, and luminaire
JP7041417B2 (en) LED socket and LED socket structure
JP6222466B2 (en) Lamp apparatus and lighting apparatus
JP2013239287A (en) Lighting fixture
JP6171215B2 (en) LED lamp
JP5717495B2 (en) LED lighting fixtures
JP2016066500A (en) Lamp device and lighting system
JP5690692B2 (en) Light bulb type lighting device
JP6803545B2 (en) lighting equipment
JP2016181429A (en) Lamp device and lighting device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190705

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190806

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200907

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200908

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20201208

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20201209

R150 Certificate of patent or registration of utility model

Ref document number: 6808569

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150