JP6784552B2

JP6784552B2 - Coating method and coating equipment

Info

Publication number: JP6784552B2
Application number: JP2016182804A
Authority: JP
Inventors: 義則谷; 諭圓崎; 俊一岡本; 暁雄鈴木
Original assignee: Toray Industries Inc; Toray Engineering Co Ltd
Current assignee: Toray Industries Inc; Toray Engineering Co Ltd
Priority date: 2016-09-20
Filing date: 2016-09-20
Publication date: 2020-11-11
Anticipated expiration: 2036-09-20
Also published as: JP2018047400A

Description

本発明は、基材の特定領域に塗膜を形成するための塗布方法及び塗布装置に関する。 The present invention relates to a coating method and a coating device for forming a coating film on a specific region of a base material.

シリコンウエハのような基材に塗膜を形成するための塗布装置として、スピンコータが知られている。しかし、スピンコータでは、通常、基材の表面全体にわたって塗膜が形成されるので、基材の特定領域には塗膜を形成するがそれ以外の領域（非特定領域）には塗膜を形成しない場合、スピンコータを採用できない。そこで、基材の特定領域にのみ塗膜を形成することを可能とする塗布装置として、スリットを有する塗布器を備えたスリットコータが用いられている（例えば、特許文献１参照）。 A spin coater is known as a coating device for forming a coating film on a substrate such as a silicon wafer. However, in a spin coater, since a coating film is usually formed over the entire surface of the base material, a coating film is formed in a specific region of the base material but not in other regions (non-specific regions). In that case, the spin coater cannot be adopted. Therefore, as a coating device capable of forming a coating film only in a specific region of a base material, a slit coater provided with a coating device having a slit is used (see, for example, Patent Document 1).

特許文献１では、塗布の対象となる基材は、その表面に親液性の領域と撥液性の領域とを有しており、スリットコータはこの基材上の全体に対して塗布液を吐出する。この吐出を終えた状態では、撥液性の領域にも塗布液は載っている。その後、この基材に対して、表面が親液性であるバー部材を接触させながら移動させる。これにより、バー部材の移動後、撥液性の領域の塗布液はバー部材によって基材外に除去され、親液性の領域にのみ塗布液が残り、基材の特定領域に塗膜を形成することができる。 In Patent Document 1, the base material to be coated has a liquid-soluble region and a liquid-repellent region on the surface thereof, and the slit coater applies the coating liquid to the entire surface of the base material. Discharge. In the state where this discharge is completed, the coating liquid is also placed on the liquid-repellent region. Then, the bar member whose surface is liquid-friendly is moved to this base material while being in contact with the base material. As a result, after the bar member is moved, the coating liquid in the liquid-repellent region is removed from the base material by the bar member, the coating liquid remains only in the liquid-forming region, and a coating film is formed in a specific region of the base material. can do.

特開２００６−１６７６９６号公報Japanese Unexamined Patent Publication No. 2006-167696

特許文献１に記載の技術によれば、基材の特定領域に塗膜を形成するが、それ以外の非特定領域には塗膜を形成しないことが可能となる。しかし、この技術では、最終的に塗膜が不要である非特定領域にも塗布液を吐出しており、つまり、特定領域と非特定領域とを区別することなく基材の全域にわたって塗布液を吐出しており、その後、非特定領域の塗布液をバー部材によって除去するという方法であることから、塗布液の無駄使いが生じている。特に、非特定領域の占める割合が高い基材の場合、基材外に除去する塗布液は多くなり、塗布液の使用効率（歩留まり）が極端に低下してしまう。 According to the technique described in Patent Document 1, it is possible to form a coating film in a specific region of the base material, but not to form a coating film in other non-specific regions. However, in this technique, the coating liquid is finally discharged to the non-specific region where the coating film is unnecessary, that is, the coating liquid is spread over the entire area of the base material without distinguishing between the specific region and the non-specific region. Since the coating liquid is discharged and then the coating liquid in the non-specific region is removed by the bar member, the coating liquid is wasted. In particular, in the case of a base material in which the proportion of the non-specific region is high, the amount of the coating liquid to be removed outside the base material increases, and the usage efficiency (yield) of the coating liquid becomes extremely low.

そこで、本発明の目的は、基材の特定領域に塗膜を形成する場合において、塗布液の使用効率が低下するのを防ぐことにある。 Therefore, an object of the present invention is to prevent a decrease in the efficiency of use of the coating liquid when a coating film is formed on a specific region of the base material.

本発明は、特定領域及び非特定領域を有する基材と、一方向に長いスリットが先端で開口し当該開口から塗布液を吐出可能とする塗布器とを、当該一方向に交差する方向に相対移動させ、前記特定領域に塗膜を形成するための塗布方法であって、前記スリットを有する前記塗布器内の塗布液の圧力を調整することにより当該スリットが開口する前記先端に塗布液の液だまりを形成し、当該液だまりが前記特定領域に接触可能となる位置関係で前記基材と前記塗布器とを相対移動させる塗布動作を行い、前記塗布動作の際、前記特定領域上の前記液だまりの塗布液は当該特定領域に残留させ、かつ、前記非特定領域上の前記液だまりの塗布液は前記先端に留まらせる前記圧力に調整する。 In the present invention, a base material having a specific region and a non-specific region and a coating device in which a long slit in one direction opens at the tip and a coating liquid can be discharged from the opening are relative to each other in a direction intersecting the one direction. A coating method for forming a coating film in the specific region by moving the coating liquid to the tip of the coating liquid in which the slit opens by adjusting the pressure of the coating liquid in the coating device having the slit. A coating operation is performed in which a pool is formed and the base material and the coating device are relatively moved in a positional relationship so that the liquid pool can come into contact with the specific region. During the coating operation, the liquid on the specific region is performed. The coating liquid in the pool is left in the specific region, and the coating liquid in the pool on the non-specific region is adjusted to the pressure to stay at the tip.

この塗布方法の前記塗布動作によれば、基材の特定領域に対しては塗布液を塗布することができ、非特定領域に対しては塗布液を塗布しないようにすることが可能となるので、不要箇所（非特定領域）に塗布液を与えず、塗布液の使用効率（歩留まり）の低下を防ぐことができる。 According to the coating operation of this coating method, the coating liquid can be applied to a specific region of the base material, and the coating liquid can be prevented from being applied to a non-specific region. , The coating liquid is not applied to unnecessary parts (non-specific areas), and it is possible to prevent a decrease in the usage efficiency (yield) of the coating liquid.

また、前記塗布方法は、前記スリットが下向きに開口する状態として行う塗布方法であって、前記スリットの塗布液と前記先端に付着する塗布液とが連続した状態で当該先端に前記液だまりが形成されるように、当該スリットの塗布液と連なる前記塗布器内の塗布液の圧力を調整するのが好ましい。
これにより、塗布器の先端に液だまりが前記の状態で形成され、そして、塗布動作の際、特定領域上の液だまりの塗布液は特定領域に残留させ、かつ、非特定領域上の液だまりの塗布液は先端に留まらせることが可能となる。なお、前記「下向き」には、鉛直方向下向きの場合以外に、鉛直方向に対して傾斜する下向きの場合も含まれる。
また、前記スリットの塗布液を更に前記塗布器内に引く力が、当該スリットの塗布液を前記開口において表面張力により保持させる力と、バランスする前記圧力に調整するのが好ましい。
これにより、塗布器の先端において、スリットの塗布液とこの先端に付着する塗布液とが連続した状態で、液だまりが形成される。 Further, the coating method is a coating method performed in a state where the slit opens downward, and the liquid pool is formed at the tip in a state where the coating liquid of the slit and the coating liquid adhering to the tip are continuous. It is preferable to adjust the pressure of the coating liquid in the coating device, which is connected to the coating liquid of the slit.
As a result, a liquid pool is formed at the tip of the coater in the above-mentioned state, and during the coating operation, the coating liquid of the liquid pool on the specific region remains in the specific region and the liquid pool on the non-specific region. The coating liquid of No. 1 can be retained at the tip. The "downward" includes not only the vertical downward direction but also the downward direction inclined with respect to the vertical direction.
Further, it is preferable that the force for further pulling the coating liquid in the slit into the coating device is adjusted to the pressure that balances with the force for holding the coating liquid in the slit by surface tension at the opening.
As a result, at the tip of the applicator, a liquid pool is formed in a state where the coating liquid of the slit and the coating liquid adhering to the tip are continuous.

このように、スリットの塗布液と塗布器の先端に付着する塗布液とが連続した状態で液だまりが先端に形成された態様として、基材と塗布器とを相対移動させ、この液だまりの塗布液が、非特定領域から特定領域に移行すると、この特定領域に接触し、この接触の後、前記相対移動に伴って、塗布器から特定領域に対して塗布液が供給され、特定領域に対する塗布液の塗布が行われる。
なお、仮に、前記引く力が前記保持させる力よりも強くなりすぎると、スリットの塗布液は塗布器内に引きこまれ、非特定領域から特定領域に移行した際に、特定領域への塗布液の供給が停止されるおそれがある。また、これとは反対に、前記引く力が前記保持させる力よりも弱くなりすぎると、基材への塗布液の供給が過多となってしまう。 In this way, as a mode in which a liquid pool is formed at the tip in a state where the coating liquid in the slit and the coating liquid adhering to the tip of the coating device are continuous, the base material and the coating device are relatively moved to form the liquid pool. When the coating liquid moves from the non-specific region to the specific region, it comes into contact with the specific region, and after this contact, the coating liquid is supplied from the coating device to the specific region with the relative movement, and the coating liquid is supplied to the specific region. The coating liquid is applied.
If the pulling force becomes too strong than the holding force, the slit coating liquid is drawn into the coating device, and when the non-specific region shifts to the specific region, the coating liquid to the specific region is applied. Supply may be stopped. On the contrary, if the pulling force becomes too weak than the holding force, the coating liquid is excessively supplied to the base material.

また、前記基材として、前記特定領域は前記非特定領域と比べて塗布液との親液度が高い領域であり、前記非特定領域は撥液性を有しているものが用いられる。この場合、塗布器の先端の液だまりの一部が親液度の高い特定領域に接することで、この特定領域に対して塗布される。これに対して、塗布器の先端の液だまりの一部が撥液性を有する非特定領域に接しても、この非特定領域に対して塗布されない。
また、前記特定領域は前記非特定領域と比べて前記塗布器の前記先端に近い位置にある領域であり、前記非特定領域に対して前記先端の前記液だまりが非接触となる位置関係で前記塗布器と前記基材とは離れて相対移動するようにしてもよい。この場合、塗布器の先端の液だまりの一部が特定領域に接することで、この特定領域に対して塗布されるが、非特定領域に対しては塗布されない。 Further, as the base material, the specific region is a region having a higher degree of affinity with the coating liquid than the non-specific region, and the non-specific region is used to have liquid repellency. In this case, a part of the liquid pool at the tip of the applicator comes into contact with a specific region having a high degree of parental liquid, so that the coating is applied to this specific region. On the other hand, even if a part of the liquid pool at the tip of the applicator comes into contact with the non-specific area having liquid repellency, it is not applied to this non-specific area.
Further, the specific region is a region located closer to the tip of the applicator than the non-specific region, and the liquid pool at the tip is in non-contact with the non-specific region. The applicator and the base material may be moved relative to each other. In this case, a part of the liquid pool at the tip of the applicator comes into contact with the specific area to be applied to the specific area, but not to the non-specific area.

また、前記塗布動作の際、前記塗布器内の塗布液の圧力を一定に保つように調整する場合の他に、前記塗布動作の際、前記塗布器内の塗布液の圧力を前記相対移動の途中で変更してもよい。これにより、例えば、塗布動作の途中で、特定領域における塗布液の膜厚の変更が可能となる。 Further, in addition to the case where the pressure of the coating liquid in the coating device is adjusted to be kept constant during the coating operation, the pressure of the coating liquid in the coating device is moved relative to the pressure during the coating operation. You may change it on the way. This makes it possible to change the film thickness of the coating liquid in a specific region, for example, during the coating operation.

また、一つの前記特定領域は他の前記特定領域に対して独立して同じ前記基材に設けられていてもよい。この場合であっても、独立した複数の特定領域それぞれに対して塗布が可能である。 Further, one specific region may be provided on the same base material independently of the other specific region. Even in this case, it is possible to apply to each of a plurality of independent specific areas.

また、本発明の塗布装置は、一方向に長いスリットが先端で開口し当該開口から塗布液を吐出可能とする塗布器と、特定領域及び非特定領域を有する基材と前記塗布器とを前記一方向に交差する方向に相対移動させる移動手段と、前記スリットが開口する前記先端に塗布液の液だまりが形成されるように当該スリットを有する前記塗布器内の塗布液の圧力を調整する圧力付与手段と、を備え、前記移動手段によって、前記液だまりが前記特定領域に接触可能となる位置関係で前記相対移動させる際、前記圧力付与手段は、前記特定領域上の前記液だまりの塗布液は当該特定領域に残留させ、かつ、前記非特定領域上の前記液だまりの塗布液は前記先端に留まらせる前記圧力に調整する。 Further, in the coating apparatus of the present invention, a coating device having a long slit in one direction opened at the tip to allow the coating liquid to be discharged from the opening, and a base material having a specific region and a non-specific region and the coating device. A moving means that moves relative to each other in one direction, and a pressure that adjusts the pressure of the coating liquid in the coating device having the slit so that a pool of coating liquid is formed at the tip of the slit opening. When the moving means is provided with the applying means and the moving means relatively moves the liquid pool in a positional relationship so that the liquid pool can come into contact with the specific region, the pressure applying means applies the coating liquid of the liquid pool on the specific region. Remains in the specific region, and the coating liquid in the pool on the non-specific region is adjusted to the pressure to stay at the tip.

この塗布装置によれば、前記相対移動の際、基材の特定領域に対しては塗布液を塗布することができ、非特定領域に対しては塗布液を塗布しないようにすることが可能となるので、不要箇所（非特定領域）に塗布液を与えず、塗布液の使用効率（歩留まり）の低下を防ぐことができる。 According to this coating device, it is possible to apply the coating liquid to a specific area of the base material and not to apply the coating liquid to a non-specific area during the relative movement. Therefore, the coating liquid is not applied to unnecessary parts (non-specific areas), and it is possible to prevent a decrease in the usage efficiency (yield) of the coating liquid.

本発明によれば、基材の不要箇所に塗布液を与えないことから、塗布液の使用効率（歩留まり）の低下を防ぐことができる。 According to the present invention, since the coating liquid is not applied to unnecessary parts of the base material, it is possible to prevent a decrease in the usage efficiency (yield) of the coating liquid.

塗布装置の全体構成を説明する概略図である。It is the schematic explaining the whole structure of a coating apparatus. 基材の平面図である。It is a top view of the base material. 基材の断面図である。It is sectional drawing of the base material. （Ａ）は、塗布器及び基材を示す斜視図であり、（Ｂ）は、塗布器のうち、基材が直下に存在する部分における断面図であり、（Ｃ）は、塗布器のうち、基材が直下に存在していない部分における断面図である。(A) is a perspective view showing a coating device and a base material, (B) is a cross-sectional view of a portion of the coating device in which the base material exists directly below, and (C) is a cross-sectional view of the coating device. , It is sectional drawing in the part where the base material does not exist directly underneath. 塗布器の先端及び液だまりの説明図である。It is explanatory drawing of the tip of a coater and a liquid pool. 塗布方法を説明する説明図である。It is explanatory drawing explaining the coating method. 他の基材に対して行う塗布方法を説明する説明図である。It is explanatory drawing explaining the coating method performed on other base materials. 他の基材の平面図である。It is a top view of another base material.

〔塗布装置の構成について〕
図１は、塗布装置（スリットコータ）５の全体構成を説明する概略図である。この塗布装置５は、基材７に対して塗布液を供給して基材７の表面に対して部分的にかつ一括して塗膜を形成するための装置である。基材７は、ロールトゥロールで送られる帯状の薄い部材であってもよいが、本実施形態では、枚葉状の薄い部材（基板）としている。なお、基材７を枚葉状とする場合、その輪郭形状は、矩形であってもよく、円形であってもよく、又は、その他の形状であってもよい。 [About the configuration of the coating device]
FIG. 1 is a schematic view illustrating the overall configuration of the coating device (slit coater) 5. The coating device 5 is a device for supplying a coating liquid to the base material 7 to partially and collectively form a coating film on the surface of the base material 7. The base material 7 may be a strip-shaped thin member fed by roll-to-roll, but in the present embodiment, it is a single-wafer-shaped thin member (board). When the base material 7 has a single-wafer shape, its contour shape may be rectangular, circular, or any other shape.

図２は、基材７の平面図である。図３は、図２に示す基材７の断面図（Ａ−Ａ矢視の断面図）である。基材７は、特定領域Ｋ１及び非特定領域Ｋ２を有する。図２及び図３に示す基材７の場合、特定領域Ｋ１は、非特定領域Ｋ２と比べて塗布液との親液度が高い領域であり、親液性を有している。これに対して、非特定領域Ｋ２は、塗布液に対して撥液性を有している。つまり、基材７は、塗布特性（塗布液に対する特性）が異なる特定領域Ｋ１及び非特定領域Ｋ２を有しており、特定領域Ｋ１は親液領域であり、非特定領域は撥液領域である。特定領域Ｋ１と非特定領域Ｋ２とは基材７の同じ平面上に設けられている。そして、図１に示す塗布装置５によって行われる塗布方法では、基材７の特定領域Ｋ１には塗布液による塗膜が形成されるが、この特定領域Ｋ１以外の非特定領域Ｋ２には塗膜が形成されない。この塗布方法の具体例については後に説明する。 FIG. 2 is a plan view of the base material 7. FIG. 3 is a cross-sectional view of the base material 7 shown in FIG. 2 (cross-sectional view taken along the line AA). The base material 7 has a specific region K1 and a non-specific region K2. In the case of the base material 7 shown in FIGS. 2 and 3, the specific region K1 is a region having a higher degree of affinity with the coating liquid than the non-specific region K2, and has a lipophilicity. On the other hand, the non-specific region K2 has liquid repellency to the coating liquid. That is, the base material 7 has a specific region K1 and a non-specific region K2 having different coating characteristics (characteristics with respect to the coating liquid), the specific region K1 is a parent liquid region, and the non-specific region is a liquid repellent region. .. The specific region K1 and the non-specific region K2 are provided on the same plane of the base material 7. Then, in the coating method performed by the coating apparatus 5 shown in FIG. 1, a coating film of the coating liquid is formed on the specific region K1 of the base material 7, but the coating film is formed on the non-specific region K2 other than the specific region K1. Is not formed. Specific examples of this coating method will be described later.

図１に示す塗布装置５は、基材７よりも上側に位置する塗布器１０（ノズル、スリットダイともいう）を備えており、この塗布器１０から基材７に塗布液が供給（吐出）される。基材７の上面が、塗布液が塗布される被塗布面８となり、この被塗布面８が上向きとなる姿勢で基材７はステージ９上に支持され、その状態で塗布が行われる。
塗布装置５は、塗布器１０の他に、基材７と塗布器１０とを相対的に移動させる移動手段２０と、塗布器１０内の塗布液の圧力を調整する圧力付与手段４０とを備えている。更に、塗布装置５は、各種制御を行うコンピュータからなる制御装置５０と、塗布器１０内の塗布液の圧力を計測するための圧力センサ６０とを備えている。 The coating device 5 shown in FIG. 1 includes a coating device 10 (also referred to as a nozzle or a slit die) located above the base material 7, and a coating liquid is supplied (discharged) from the coating device 10 to the base material 7. Will be done. The upper surface of the base material 7 becomes the surface to be coated 8 to which the coating liquid is applied, and the base material 7 is supported on the stage 9 in a posture in which the surface to be coated 8 faces upward, and coating is performed in that state.
In addition to the coating device 10, the coating device 5 includes a moving means 20 for relatively moving the base material 7 and the coating device 10, and a pressure applying means 40 for adjusting the pressure of the coating liquid in the coating device 10. ing. Further, the coating device 5 includes a control device 50 including a computer that performs various controls, and a pressure sensor 60 for measuring the pressure of the coating liquid in the coating device 10.

塗布器１０について説明する。図４（Ａ）は、塗布器１０及び基材７を示す斜視図であり、図４（Ｂ）は、この塗布器１０のうち、基材７が直下に存在する部分における断面図であり、図４（Ｃ）は、塗布器１０のうち、基材７が直下に存在していない部分における断面図である。塗布器１０は、図４（Ａ）に示すように、一方向に長い直線状のノズルからなり、先端１７が先細りとなった形状を有している。図４（Ｂ）（Ｃ）に示すように、塗布器１０は、塗布液が溜められる溜め部１３と、この溜め部１３と繋がっているスリット（スリット状流路）１２とを有している。スリット１２は、先端１７に有する面１８（以下、先端面１８ともいう）で開口しており、溜め部１３の塗布液がスリット１２を通じて開口１１から基材７に供給される。溜め部１３は、開口１１から供給する塗布液を一旦溜めるために拡大させた領域である。溜め部１３、スリット１２、先端面１８及び開口１１は、一方向（図４（Ｂ）（Ｃ）の紙面に直交する方向）に沿って長く形成されている。 The applicator 10 will be described. FIG. 4A is a perspective view showing the coating device 10 and the base material 7, and FIG. 4B is a cross-sectional view of the portion of the coating device 10 in which the base material 7 is directly below. FIG. 4C is a cross-sectional view of the portion of the applicator 10 in which the base material 7 does not exist directly below. As shown in FIG. 4A, the applicator 10 is composed of a linear nozzle that is long in one direction, and has a shape in which the tip 17 is tapered. As shown in FIGS. 4B and 4C, the coating device 10 has a reservoir 13 in which the coating liquid is stored and a slit (slit-shaped flow path) 12 connected to the reservoir 13. .. The slit 12 is opened by a surface 18 (hereinafter, also referred to as a tip surface 18) having a tip 17, and the coating liquid of the reservoir 13 is supplied from the opening 11 to the base material 7 through the slit 12. The reservoir 13 is an enlarged region for temporarily storing the coating liquid supplied from the opening 11. The reservoir 13, the slit 12, the tip surface 18, and the opening 11 are formed long along one direction (direction orthogonal to the paper surface of FIGS. 4B and 4C).

図４（Ａ）に示すように、本実施形態の基材７（被塗布面８）の輪郭形状は円形であり、開口１１は基材７（被塗布面８）の直径Ｄ（基材７の前記一方向の最大寸法）よりも大きな幅寸法Ｗを有している（Ｗ＞Ｄ）。このため、塗布器１０（開口１１）には、基材７が直下に存在する部分と、基材７が直下に存在しない部分とが生じ、また、これらの部分それぞれの範囲（長さ）は、基材７と塗布器１０（開口１１）との相対的な位置に応じて変化する。
また、本実施形態では、基材７に対して開口１１から塗布液が下向きに吐出される。後述する塗布動作の際、溜め部１３、スリット１２は、塗布液で満たされた状態（つまり、充満状態）となる。 As shown in FIG. 4A, the contour shape of the base material 7 (coated surface 8) of the present embodiment is circular, and the opening 11 is the diameter D (base material 7) of the base material 7 (coated surface 8). It has a width dimension W larger than the above-mentioned maximum dimension in one direction (W> D). Therefore, in the coater 10 (opening 11), there are a portion where the base material 7 exists directly underneath and a portion where the base material 7 does not directly underneath, and the range (length) of each of these portions is set. , It changes according to the relative position between the base material 7 and the applicator 10 (opening 11).
Further, in the present embodiment, the coating liquid is discharged downward from the opening 11 with respect to the base material 7. During the coating operation described later, the reservoir 13 and the slit 12 are in a state of being filled with the coating liquid (that is, in a filled state).

図１において、圧力センサ６０は、塗布器１０に設けられており、塗布器１０内の塗布液の圧力を測定するセンサである。本実施形態では、圧力センサ６０の検出部（センサ部）は溜め部１３において露出しており、溜め部１３の塗布液の圧力（内圧）が測定される。圧力センサ６０の測定結果は制御装置５０に入力される。なお、以下の説明における「塗布器１０内の塗布液の圧力」は、溜め部１３に溜められている塗布液の圧力（内圧）を意味する。 In FIG. 1, the pressure sensor 60 is provided in the coating device 10 and is a sensor for measuring the pressure of the coating liquid in the coating device 10. In the present embodiment, the detection unit (sensor unit) of the pressure sensor 60 is exposed in the reservoir portion 13, and the pressure (internal pressure) of the coating liquid in the reservoir portion 13 is measured. The measurement result of the pressure sensor 60 is input to the control device 50. The "pressure of the coating liquid in the coating device 10" in the following description means the pressure (internal pressure) of the coating liquid stored in the reservoir 13.

塗布装置５は、装置基台６、及び、この装置基台６に搭載され基材７を上に載せるステージ９を更に備えている。ステージ９上の基材７の被塗布面８は水平となる。そして、本実施形態では、ステージ９に対して塗布器１０が移動手段２０によって移動可能となる。
移動手段２０は、装置基台６に設けられているレール２１、このレール２１に沿って水平方向に移動する可動ブロック２２、及び、可動ブロック２２を移動させるリニアアクチュエータ２３を備えている。そして、塗布器１０は可動ブロック２２に搭載されている。この移動手段２０により、固定状態にあるステージ９上の基材７に対して、塗布器１０が水平方向に移動可能となる。なお、移動手段２０は、塗布器１０と基材７とを、前記一方向（スリット１２の長手方向）に交差（直交）する方向に相対移動させる構成であればよく、図示しないが、固定状態にある塗布器１０に対してステージ９（基材７）を移動させる構成であってもよい。また、移動手段２０は、塗布器１０を上下方向に移動させる昇降アクチュエータ２４を備えている。これにより、基材７に対する塗布器１０（開口１１）の高さを変更することが可能である。移動手段２０は、制御装置５０によって制御され、所定の速度（具体的には一定速度）で塗布器１０を水平方向に移動させることができる。 The coating device 5 further includes a device base 6 and a stage 9 mounted on the device base 6 on which the base material 7 is placed. The surface 8 to be coated of the base material 7 on the stage 9 is horizontal. Then, in the present embodiment, the applicator 10 can be moved with respect to the stage 9 by the moving means 20.
The moving means 20 includes a rail 21 provided on the device base 6, a movable block 22 that moves horizontally along the rail 21, and a linear actuator 23 that moves the movable block 22. The applicator 10 is mounted on the movable block 22. The moving means 20 allows the applicator 10 to move horizontally with respect to the base material 7 on the stage 9 in the fixed state. The moving means 20 may have a configuration in which the coating device 10 and the base material 7 are relatively moved in a direction intersecting (orthogonal) in the one direction (longitudinal direction of the slit 12), and although not shown, it is in a fixed state. The stage 9 (base material 7) may be moved with respect to the coating device 10 in the above. Further, the moving means 20 includes an elevating actuator 24 that moves the applicator 10 in the vertical direction. This makes it possible to change the height of the applicator 10 (opening 11) with respect to the base material 7. The moving means 20 is controlled by the control device 50, and can move the applicator 10 in the horizontal direction at a predetermined speed (specifically, a constant speed).

圧力付与手段４０は、タンク４１及び圧力調整器４２を含む。タンク４１は、塗布液を溜めていると共に、配管８２を通じて塗布器１０と接続されている。タンク４１は、塗布器１０よりも高い位置に設けられている。配管８２には開閉切り換えバルブ７２が設けられており、バルブ７２が開状態で、タンク４１と塗布器１０（溜め部１３）との間で塗布液が流通可能となっている。バルブ７２は、塗布器１０とタンク４１とを連通及び遮断可能とする。タンク４１に溜めることができる塗布液の容量は、塗布器１０の溜め部１３の容量（容積）よりも大きい。
圧力調整器４２は、レギュレータからなり、タンク４１の塗布液に作用させる圧力を変化させる。圧力調整器４２は、制御装置５０によって制御され、タンク４１の塗布液の圧力（内圧）を調整する。タンク４１と塗布器１０とは配管８２を通じて接続されていることから、タンク４１の塗布液の圧力を調整することで、塗布器１０（溜め部１３）の塗布液の圧力を所定の値に調整する（つまり制御する）ことができる。例えば、タンク４１の塗布液の圧力（ゲージ圧）を負圧に調整することで、塗布器１０（溜め部１３）の塗布液の圧力（ゲージ圧）を負圧にする。 The pressure applying means 40 includes a tank 41 and a pressure regulator 42. The tank 41 stores the coating liquid and is connected to the coating device 10 through the pipe 82. The tank 41 is provided at a position higher than that of the applicator 10. The pipe 82 is provided with an open / close switching valve 72, and the coating liquid can flow between the tank 41 and the coating device 10 (reservoir 13) when the valve 72 is open. The valve 72 allows the applicator 10 and the tank 41 to communicate with each other and shut off. The capacity of the coating liquid that can be stored in the tank 41 is larger than the capacity (volume) of the storage portion 13 of the coating device 10.
The pressure regulator 42 comprises a regulator and changes the pressure applied to the coating liquid in the tank 41. The pressure regulator 42 is controlled by the control device 50 to adjust the pressure (internal pressure) of the coating liquid in the tank 41. Since the tank 41 and the applicator 10 are connected through the pipe 82, the pressure of the coating liquid in the tank 41 can be adjusted to a predetermined value by adjusting the pressure of the coating liquid in the tank 41 (reservoir 13). Can (ie control). For example, by adjusting the pressure (gauge pressure) of the coating liquid in the tank 41 to a negative pressure, the pressure (gauge pressure) of the coating liquid in the coating device 10 (reservoir 13) is made negative.

本実施形態では、圧力調整器４２は、塗布器１０内の塗布液の圧力を所定の値（負圧）に保つようにタンク４１に溜めている塗布液の圧力を調整する機能を有しており、これら圧力調整器４２及びタンク４１によって、塗布器１０内の塗布液に圧力（負圧）を作用させると共にその圧力（負圧）を調整する圧力付与手段４０が構成されている。
そして、後の塗布方法でも説明するが、前記移動手段２０によって基材７と塗布器１０とを、両者の隙間を一定に保ちつつ、相対移動させる際に、圧力付与手段４０は、塗布器１０内の塗布液の圧力を調整する構成となっている。なお、本実施形態では、塗布動作の際、塗布器１０内の塗布液の圧力は一定値に保たれるように調整される。この調整は、圧力センサ６０の検出結果に基づいて行われる。 In the present embodiment, the pressure regulator 42 has a function of adjusting the pressure of the coating liquid stored in the tank 41 so as to keep the pressure of the coating liquid in the coating device 10 at a predetermined value (negative pressure). The pressure regulator 42 and the tank 41 constitute a pressure applying means 40 for applying a pressure (negative pressure) to the coating liquid in the coating device 10 and adjusting the pressure (negative pressure).
Then, as will be described later in the coating method, when the base material 7 and the coating device 10 are relatively moved by the moving means 20 while keeping the gap between them constant, the pressure applying means 40 uses the coating device 10. It is configured to adjust the pressure of the coating liquid inside. In the present embodiment, the pressure of the coating liquid in the coating device 10 is adjusted so as to be maintained at a constant value during the coating operation. This adjustment is performed based on the detection result of the pressure sensor 60.

〔塗布動作について〕
以上の構成を備えている塗布装置５によって行われる塗布方法について説明する。
ステージ９上に載せた基材７に対して塗布器１０の先端面１８を接近させ、移動手段２０によって塗布器１０を移動させながら、この基材７に対して塗布液の塗布を行うが、この移動開始の前に、圧力付与手段４０は事前処理を行う。つまり、塗布装置５が行う塗布動作には、事前処理と、この事前処理の後に続けて行われる実塗布処理とが含まれる。 [Applying operation]
The coating method performed by the coating apparatus 5 having the above configuration will be described.
The tip surface 18 of the coating device 10 is brought close to the base material 7 placed on the stage 9, and the coating liquid is applied to the base material 7 while moving the coating device 10 by the moving means 20. Prior to the start of this movement, the pressure applying means 40 performs pretreatment. That is, the coating operation performed by the coating device 5 includes a pretreatment and an actual coating treatment performed after the pretreatment.

圧力付与手段４０は事前処理として、図５に示すように、先端面１８に塗布液の液だまり２を形成する。しかも、この液だまり２は、スリット１２の塗布液２ａと、先端面１８に表面張力で付着する塗布液２ｂとが連続した状態とする。これを実現するために、本実施形態の塗布方法は、スリット１２が下向きに開口する状態として行う方法であることから、図１に示すバルブ７２が開の状態で、圧力付与手段４０は、先ず、タンク４１の塗布液の圧力を大気圧よりも高く設定し、塗布器１０内の塗布液の圧力を大気圧よりも一時的に高くして開口１１から塗布液を少量吐出する。その後、圧力付与手段４０は、タンク４１の塗布液の圧力を大気圧よりも低く設定し、塗布器１０内の塗布液の圧力を大気圧よりも低くする。このように、圧力付与手段４０が、塗布器１０内の塗布液の圧力を調整することによって、前記塗布液２ａと前記塗布液２ｂとが連続した状態となって液だまり２は形成され、この液だまり２は先端面１８から下に垂れた状態となり、この状態が維持される。 As a pretreatment, the pressure applying means 40 forms a pool 2 of the coating liquid on the tip surface 18 as shown in FIG. Moreover, the liquid pool 2 is in a state in which the coating liquid 2a of the slit 12 and the coating liquid 2b adhering to the tip surface 18 due to surface tension are continuous. In order to realize this, since the coating method of the present embodiment is a method in which the slit 12 is opened downward, the pressure applying means 40 is first placed in the state where the valve 72 shown in FIG. 1 is open. The pressure of the coating liquid in the tank 41 is set higher than the atmospheric pressure, the pressure of the coating liquid in the coating device 10 is temporarily raised higher than the atmospheric pressure, and a small amount of the coating liquid is discharged from the opening 11. After that, the pressure applying means 40 sets the pressure of the coating liquid in the tank 41 to be lower than the atmospheric pressure, and makes the pressure of the coating liquid in the coating device 10 lower than the atmospheric pressure. In this way, the pressure applying means 40 adjusts the pressure of the coating liquid in the coating device 10, so that the coating liquid 2a and the coating liquid 2b are in a continuous state, and the liquid pool 2 is formed. The liquid pool 2 is in a state of dripping downward from the tip surface 18, and this state is maintained.

前記のとおり、スリット１２の塗布液２ａと先端面１８に表面張力で付着する塗布液２ｂとが連続した状態にある液だまり２を、先端面１８に形成するために、圧力付与手段４０が行う具体的な圧力調整について説明する。
圧力付与手段４０は、塗布器１０内の塗布液（溜め部１３の塗布液）を正圧にした後、塗布器１０内の塗布液（溜め部１３の塗布液）を負圧にすることで、スリット１２の塗布液２ａを更に塗布器１０内の溜め部１３に引く力Ｆ１を生じさせるが、この引く力Ｆ１が、スリット１２の塗布液２ａを開口１１（のエッジ）において表面張力により保持させる力（合力）Ｆ２と、バランスするように、塗布器１０内の塗布液の圧力を調整する（事前処理）。 As described above, the pressure applying means 40 performs the pressure applying means 40 in order to form a liquid pool 2 in a state in which the coating liquid 2a of the slit 12 and the coating liquid 2b adhering to the tip surface 18 due to surface tension are continuous. Specific pressure adjustment will be described.
The pressure applying means 40 makes the coating liquid in the coating device 10 (the coating liquid in the reservoir 13) positive pressure, and then makes the coating liquid in the coating device 10 (the coating liquid in the reservoir 13) negative pressure. A force F1 that further pulls the coating liquid 2a of the slit 12 into the reservoir 13 in the coating device 10 is generated, and the pulling force F1 holds the coating liquid 2a of the slit 12 at the opening 11 (edge) by surface tension. The pressure of the coating liquid in the coating device 10 is adjusted so as to be balanced with the force (resulting force) F2 (pretreatment).

そして、図６により説明するように、塗布器１０の先端面１８に形成した液だまり２が特定領域Ｋ１に接触可能となる位置関係で、移動手段２０は、基材７と塗布器１０とを、両者の隙間を一定に保ちつつ、相対移動させる（実塗布処理）。この移動の際、圧力付与手段４０が、塗布器１０内の塗布液の圧力をそのまま保つように調整（事前処理の状態を保つように調整）することによって、特定領域Ｋ１上の液だまり２の塗布液はこの特定領域Ｋ１に残留させるが、非特定領域Ｋ２上の液だまり２の塗布液は先端１７（先端面１８）にそのまま留まらせるようにする。 Then, as described with reference to FIG. 6, the moving means 20 connects the base material 7 and the coater 10 in a positional relationship in which the liquid pool 2 formed on the tip surface 18 of the coater 10 can come into contact with the specific region K1. , While keeping the gap between the two constant, move them relative to each other (actual coating process). At the time of this movement, the pressure applying means 40 adjusts so that the pressure of the coating liquid in the coating device 10 is maintained as it is (adjusted so as to maintain the state of pretreatment), so that the liquid pool 2 on the specific region K1 The coating liquid is left in the specific region K1, but the coating liquid in the liquid pool 2 on the non-specific region K2 is left as it is on the tip 17 (tip surface 18).

図６により、実塗布処理の様子を説明する。
図６（Ａ）に示すように、基材７の特定領域Ｋ１上を塗布器１０の先端面１８が通過する際、この先端面１８に形成されている液だまり２の塗布液は、特定領域Ｋ１に接触する。すると、特定領域Ｋ１は親液性を有することから、特定領域Ｋ１に接触している塗布器１０外の塗布液の表面張力が、塗布器１０内での前記引く力Ｆ１よりも大きくなる。これはスリット１２が開口する先端面１８と基材７との間における塗布液の毛細管現象による。このため、前記バランスが崩れ、スリット１２から特定領域Ｋ１へ塗布液が引き出され、特定領域Ｋ１に対して塗布される。 The state of the actual coating process will be described with reference to FIG.
As shown in FIG. 6A, when the tip surface 18 of the coating device 10 passes over the specific region K1 of the base material 7, the coating liquid of the liquid pool 2 formed on the tip surface 18 is in the specific region. Contact K1. Then, since the specific region K1 has a liquidity property, the surface tension of the coating liquid outside the coating device 10 in contact with the specific region K1 becomes larger than the pulling force F1 in the coating device 10. This is due to the capillary phenomenon of the coating liquid between the tip surface 18 where the slit 12 opens and the base material 7. Therefore, the balance is lost, and the coating liquid is drawn from the slit 12 to the specific region K1 and applied to the specific region K1.

前記相対移動が続けて行われ、図６（Ｂ）に示すように、先端面１８の液だまり２の一部が、撥液性を有する非特定領域Ｋ２上に位置しても、更には、図６（Ｃ）に示すように、先端面１８の液だまり２の全部が、撥液性を有する非特定領域Ｋ２上に位置しても、前記引く力Ｆ１は維持されていることから、非特定領域Ｋ２に対して塗布されない。なお、本実施形態では、特定領域Ｋ１と非特定領域Ｋ２とが同一面上に形成されていることから、先端面１８の液だまり２（の一部）は、撥液性を有する非特定領域Ｋ２に接することがあるが、このように接しても、前記引く力Ｆ１は維持されており、非特定領域Ｋ２に対して塗布されない。
これは、塗布器１０の先端面１８で液だまり２の塗布液を保持する力（保持力）が、非特定領域Ｋ２に塗布液が付着しようとする力（付着力）よりも大きいことに依る。本実施形態では、非特定領域Ｋ２は撥液性を有していることから、前記付着力は負の値（斥力）となる。また、前記保持力には、先端面１８における塗布液の表面張力の他に、前記引く力Ｆ１が含まれる。 The relative movement is continuously performed, and as shown in FIG. 6B, even if a part of the liquid pool 2 on the tip surface 18 is located on the non-specific region K2 having liquid repellency, further. As shown in FIG. 6C, even if all of the liquid pool 2 on the tip surface 18 is located on the non-specific region K2 having liquid repellency, the pulling force F1 is maintained, so that the pulling force F1 is not present. It is not applied to the specific area K2. In the present embodiment, since the specific region K1 and the non-specific region K2 are formed on the same surface, the liquid pool 2 (a part of) of the tip surface 18 is a non-specific region having liquid repellency. Although it may come into contact with K2, even if it comes into contact with K2 in this way, the pulling force F1 is maintained and is not applied to the non-specific region K2.
This is because the force (holding force) for holding the coating liquid in the liquid pool 2 on the tip surface 18 of the coating device 10 is larger than the force (adhesive force) for the coating liquid to adhere to the non-specific region K2. .. In the present embodiment, since the non-specific region K2 has liquid repellency, the adhesive force has a negative value (repulsive force). Further, the holding force includes the pulling force F1 in addition to the surface tension of the coating liquid on the tip surface 18.

本実施形態では、前記のとおり、先端面１８における液だまり２は下に垂れた状態として形成されていることから、図６（Ｄ）に示すように、前記相対移動が続けて行われ、先端面１８の液だまり２の一部が、次の特定領域Ｋ１に到達すると、この液だまり２の一部は特定領域Ｋ１に接触し、特定領域Ｋ１に対して塗布される。更に、図６（Ａ）と同様の状態となって、スリット１２から特定領域Ｋ１へ塗布液が自動的に引き出され、特定領域Ｋ１に対して塗布される。 In the present embodiment, as described above, since the liquid pool 2 on the tip surface 18 is formed in a state of hanging downward, as shown in FIG. 6D, the relative movement is continuously performed and the tip is formed. When a part of the liquid pool 2 on the surface 18 reaches the next specific region K1, the part of the liquid pool 2 comes into contact with the specific region K1 and is applied to the specific region K1. Further, in the same state as in FIG. 6A, the coating liquid is automatically drawn from the slit 12 to the specific region K1 and applied to the specific region K1.

ここで、前記引く力Ｆ１が前記保持させる力Ｆ２（図５参照）とバランスしておらず、前記引く力Ｆ１が前記保持させる力Ｆ２に勝っている場合（つまり、塗布器１０内の負圧が強い場合）、図６（Ｂ）に示す状態から図６（Ｃ）に示す状態に移行すると、スリット１２の塗布液２ａが、溜め部１３側に大きく引きこまれてしまい、スリット１２の塗布液２ａが、先端面１８に表面張力で付着する塗布液２ｂと連続しない状態となってしまう場合がある。この場合、図６（Ｄ）に示すように、先端面１８の液だまり２の一部が、次の特定領域Ｋ１に到達し接触しても、先端面１８に表面張力で付着する塗布液２ｂは、特定領域Ｋ１に残留することは可能であるが、スリット１２に大きく引きこまれた塗布液２ａが、開口１１から塗布器１０外へ引き出されず（自動的に供給されず）、特定領域Ｋ１で塗布不良が生じてしまう。
しかし、本実施形態では、塗布器１０内の塗布液の圧力が所定の値（前記バランスをとる値）に調整されていることから、このような塗布不良を防ぐことが可能となる。
また、これとは反対に、前記引く力Ｆ１が前記保持させる力Ｆ２よりも弱くなりすぎると、特定領域Ｋ１への塗布液の供給が過多となってしまう。 Here, when the pulling force F1 is not balanced with the holding force F2 (see FIG. 5) and the pulling force F1 is superior to the holding force F2 (that is, the negative pressure in the coater 10). When the state shown in FIG. 6 (B) is changed to the state shown in FIG. 6 (C), the coating liquid 2a of the slit 12 is largely drawn into the reservoir 13 side, and the slit 12 is coated. The liquid 2a may not be continuous with the coating liquid 2b that adheres to the tip surface 18 due to surface tension. In this case, as shown in FIG. 6D, even if a part of the liquid pool 2 on the tip surface 18 reaches and contacts the next specific region K1, the coating liquid 2b adheres to the tip surface 18 due to surface tension. Can remain in the specific region K1, but the coating liquid 2a largely drawn into the slit 12 is not drawn out of the coating device 10 from the opening 11 (it is not automatically supplied), and the specific region K1 Will cause poor coating.
However, in the present embodiment, since the pressure of the coating liquid in the coating device 10 is adjusted to a predetermined value (the value that balances the above), it is possible to prevent such coating defects.
On the contrary, if the pulling force F1 becomes too weak than the holding force F2, the supply of the coating liquid to the specific region K1 becomes excessive.

以上のように、基材７と塗布器１０（開口１１）とを上下方向に対向させた状態で、移動手段２０によってこれらを相対的に移動させると、特定領域Ｋ１に対して塗布液が供給されて塗布が可能となる。
一方向に細長い開口１１に対向して、図４（Ｂ）に示すように基材７が存在する部分であってかつその基材７の特定領域Ｋ１に対しては、塗布液が塗布器１０から供給される。これに対して、開口１１に対向して、基材７が存在する部分であっても非特定領域Ｋ２に対しては、塗布液が供給されず、また、図４（Ｃ）に示すように基材７の無い部分では塗布液の吐出がされない。なお、このように、非特定領域Ｋ２に対して塗布液が供給されない場合であっても、また、図４（Ｃ）に示すように基材７の無い部分に対して塗布液の吐出がされない場合であっても、先端面１８には液だまり２が形成された状態にある。
本実施形態の塗布動作は、下向きに開口するスリット１２が形成されている塗布器１０内の塗布液の圧力を、前記のように負圧に調整することで行われるため、図２に示す基材７を塗布の対象とした場合、特定領域Ｋ１に対して塗布がされ、非特定領域Ｋ２に対しては塗布がされず、また、余剰となる塗布液を塗布器１０内に引き込むことができ、塗布液を無駄にすることがない。つまり、基材７の不要箇所（非特定領域Ｋ２）に塗布液を与えず、塗布液の使用効率（歩留まり）の低下を防ぐことができる。 As described above, when the base material 7 and the coating device 10 (opening 11) are opposed to each other in the vertical direction and relatively moved by the moving means 20, the coating liquid is supplied to the specific region K1. It can be applied.
As shown in FIG. 4B, the coating liquid is applied to the portion where the base material 7 exists and the specific region K1 of the base material 7 is opposed to the elongated opening 11 in one direction. Supplied from. On the other hand, the coating liquid is not supplied to the non-specific region K2 even in the portion where the base material 7 exists facing the opening 11, and as shown in FIG. 4C. The coating liquid is not discharged in the portion without the base material 7. In this way, even when the coating liquid is not supplied to the non-specific region K2, the coating liquid is not discharged to the portion without the base material 7 as shown in FIG. 4C. Even in this case, the liquid pool 2 is formed on the tip surface 18.
Since the coating operation of the present embodiment is performed by adjusting the pressure of the coating liquid in the coating device 10 in which the slit 12 that opens downward is formed to a negative pressure as described above, the basis shown in FIG. When the material 7 is targeted for coating, the specific region K1 is coated, the non-specific region K2 is not coated, and the excess coating liquid can be drawn into the coating device 10. , No waste of coating liquid. That is, the coating liquid is not applied to the unnecessary portion (non-specific region K2) of the base material 7, and it is possible to prevent a decrease in the usage efficiency (yield) of the coating liquid.

以上のように、本実施形態の塗布装置５によって実行される塗布方法は、基材７と塗布器１０とを相対移動させ、特定領域Ｋ１のみに塗膜を形成し、この特定領域Ｋ１以外の非特定領域Ｋ２に塗膜を形成しないための塗布方法である。そして、この塗布方法では、塗布動作として、スリット１２を有する塗布器１０内の塗布液（溜め部１３の塗布液）の圧力を調整することにより、このスリット１２が開口する先端１７に塗布液の液だまり２を形成し、この液だまり２が特定領域Ｋ１に接触可能となる位置関係で基材７と塗布器１０とを相対移動させる。この塗布動作の際、圧力付与手段４０が塗布器１０内の塗布液を調整し、下記に定義する調整圧力とする。
〔調整圧力〕：特定領域Ｋ１上の液だまり２の塗布液はこの特定領域Ｋ１に残留させ、かつ、非特定領域Ｋ２上の液だまり２の塗布液は先端１７にそのまま留まらせる圧力 As described above, in the coating method executed by the coating device 5 of the present embodiment, the base material 7 and the coating device 10 are relatively moved to form a coating film only in the specific region K1 and other than the specific region K1. This is a coating method for not forming a coating film on the non-specific region K2. Then, in this coating method, as a coating operation, the pressure of the coating liquid (coating liquid in the reservoir 13) in the coating device 10 having the slit 12 is adjusted, so that the coating liquid is applied to the tip 17 at which the slit 12 opens. A liquid pool 2 is formed, and the base material 7 and the coating device 10 are relatively moved in a positional relationship in which the liquid pool 2 can come into contact with the specific region K1. At the time of this coating operation, the pressure applying means 40 adjusts the coating liquid in the coating device 10 to obtain the adjusting pressure defined below.
[Adjusting pressure]: The pressure at which the coating liquid of the liquid pool 2 on the specific region K1 remains in the specific region K1 and the coating liquid of the liquid pool 2 on the non-specific region K2 remains as it is at the tip 17.

また、本実施形態の塗布方法は（図５参照）、塗布器１０内のスリット１２の塗布液２ａと、先端面１８に表面張力で付着する塗布器１０外の塗布液２ｂとが連続した状態で、先端面１８に液だまり２が形成されるように、このスリット１２の塗布液と連なる塗布器１０内の塗布液（溜め部１３の塗布液）の圧力を、圧力付与手段４０が調整している。これにより、塗布器１０の先端１７に液だまりが図５に示す状態で形成され、そして、塗布動作の際、特定領域Ｋ１上の液だまり２の塗布液は特定領域Ｋ１に残留させ、かつ、非特定領域Ｋ２上の液だまり２の塗布液は先端１７にそのまま留まらせることが可能となる。
そして、前記塗布動作の際、溜め部１３の負圧によりスリット１２の塗布液２ａを更に塗布器１０内に引く力Ｆ１が、スリット１２の塗布液２ａを開口１１において表面張力により保持させる力Ｆ２と、バランスする圧力に、圧力付与手段４０が塗布器１０内の塗布液（溜め部１３の塗布液）の圧力を調整する。これにより、塗布器１０の先端１７において、スリット１２の塗布液２ａとこの先端１７に付着する塗布液２ｂとが連続した状態で、液だまり２が形成される。 Further, in the coating method of the present embodiment (see FIG. 5), the coating liquid 2a in the slit 12 inside the coating device 10 and the coating liquid 2b outside the coating device 10 that adheres to the tip surface 18 by surface tension are continuous. Then, the pressure applying means 40 adjusts the pressure of the coating liquid (coating liquid of the reservoir 13) in the coating device 10 connected to the coating liquid of the slit 12 so that the liquid pool 2 is formed on the tip surface 18. ing. As a result, a liquid pool is formed at the tip 17 of the coating device 10 in the state shown in FIG. 5, and during the coating operation, the coating liquid of the liquid pool 2 on the specific region K1 remains in the specific region K1 and The coating liquid of the liquid pool 2 on the non-specific region K2 can be left as it is at the tip 17.
Then, during the coating operation, the force F1 that further pulls the coating liquid 2a in the slit 12 into the coating device 10 due to the negative pressure of the reservoir 13 causes the coating liquid 2a in the slit 12 to be held by surface tension in the opening 11. The pressure applying means 40 adjusts the pressure of the coating liquid (coating liquid in the reservoir 13) in the coating device 10 to the pressure to be balanced. As a result, at the tip 17 of the coater 10, the liquid pool 2 is formed in a state where the coating liquid 2a in the slit 12 and the coating liquid 2b adhering to the tip 17 are continuous.

このように、スリット１２の塗布液２ａとこの先端１７に付着する塗布液２ｂとが連続した状態で液だまり２が先端１７に形成された態様として、基材７と塗布器１０とを相対移動させ、図６（Ｃ）から（Ｄ）に示すように、この液だまり２の塗布液が、非特定領域Ｋ２から特定領域Ｋ１に移行すると、この特定領域Ｋ１に接触し、この接触の後、塗布器１０の移動に伴って、塗布器１０から特定領域Ｋ１に対して塗布液が表面張力（毛細管現象）によって引き出され、特定領域Ｋ１に対する塗布液の塗布が行われる。塗布器１０から基材７の特定領域Ｋ１に供給されることで不足する塗布液は、タンク４１（図１参照）から自動的に補充される。 In this way, the base material 7 and the coating device 10 are relatively moved as a mode in which the liquid pool 2 is formed at the tip 17 in a state where the coating liquid 2a of the slit 12 and the coating liquid 2b adhering to the tip 17 are continuous. Then, as shown in FIGS. 6 (C) to 6 (D), when the coating liquid of the liquid pool 2 moves from the non-specific region K2 to the specific region K1, it comes into contact with the specific region K1, and after this contact, As the coating device 10 moves, the coating liquid is drawn from the coating device 10 to the specific region K1 by surface tension (capillary phenomenon), and the coating liquid is applied to the specific region K1. The coating liquid that is insufficient by being supplied from the coating device 10 to the specific region K1 of the base material 7 is automatically replenished from the tank 41 (see FIG. 1).

〔基材７が他の形態である場合の説明〕
前記実施形態では、基材７において、特定領域Ｋ１が親液性を有し、非特定領域Ｋ２が撥液性を有する場合について説明したが、図７（Ａ）に示すように、特定領域Ｋ１は非特定領域Ｋ２と比べて塗布器１０の先端１７に近い位置にある領域であってもよい。そして、塗布動作の際、特定領域Ｋ１は、塗布器１０の先端面１８に形成される液だまり２の一部と接触可能となる位置にあるが、非特定領域Ｋ２は、前記液だまり２と非接触となる位置にある（図７（Ｃ）参照）。つまり、特定領域Ｋ１は、基材７のうちの凸となる部分（凸部）の表面であり、非特定領域Ｋ２は、凹となる部分（凹部）の表面である。これら表面の高さ寸法の差は、例えば５００マイクロメートルである。なお、この基材７の場合、非特定領域Ｋ２は撥液性を有していなくて良く、特定領域Ｋ１と同等の親液性とすることができる。そして、非特定領域Ｋ２に対して塗布器１０の先端１７の液だまり２が非接触となる位置関係で、塗布器１０と基材７とを離して相対移動させる。 [Explanation when the base material 7 is in another form]
In the above embodiment, in the base material 7, the case where the specific region K1 has a liquid-repellent property and the non-specific region K2 has a liquid-repellent property has been described, but as shown in FIG. 7A, the specific region K1 May be a region located closer to the tip 17 of the applicator 10 than the non-specific region K2. Then, during the coating operation, the specific region K1 is in a position where it can come into contact with a part of the liquid pool 2 formed on the tip surface 18 of the coating device 10, but the non-specific region K2 is the liquid pool 2. It is in a non-contact position (see FIG. 7C). That is, the specific region K1 is the surface of the convex portion (convex portion) of the base material 7, and the non-specific region K2 is the surface of the concave portion (concave portion). The difference in height dimension of these surfaces is, for example, 500 micrometers. In the case of this base material 7, the non-specific region K2 does not have to have liquid repellency, and can have the same positivity as the specific region K1. Then, the applicator 10 and the base material 7 are relatively moved apart from each other in a positional relationship in which the liquid pool 2 at the tip 17 of the applicator 10 is not in contact with the non-specific region K2.

このような凹凸形状を有する基材７を塗布の対象とした場合の塗布動作を図７により説明する。
図７（Ａ）に示すように、基材７の特定領域Ｋ１上を先端面１８が通過する際、この先端面１８に形成されている液だまり２の塗布液は、特定領域Ｋ１に接触する。すると、特定領域Ｋ１は親液性を有することから、特定領域Ｋ１に接触している塗布器１０外の塗布液の表面張力が、塗布器１０内での前記引く力Ｆ１よりも大きくなる。これはスリット１２が開口する先端面１８と基材７との間における塗布液の毛細管現象による。このため、前記バランスが崩れ、スリット１２から特定領域Ｋ１へ塗布液が引き出され、特定領域Ｋ１に対して塗布される。 The coating operation when the base material 7 having such an uneven shape is targeted for coating will be described with reference to FIG.
As shown in FIG. 7A, when the tip surface 18 passes over the specific region K1 of the base material 7, the coating liquid of the liquid pool 2 formed on the tip surface 18 comes into contact with the specific region K1. .. Then, since the specific region K1 has a liquidity property, the surface tension of the coating liquid outside the coating device 10 in contact with the specific region K1 becomes larger than the pulling force F1 in the coating device 10. This is due to the capillary phenomenon of the coating liquid between the tip surface 18 where the slit 12 opens and the base material 7. Therefore, the balance is lost, and the coating liquid is drawn from the slit 12 to the specific region K1 and applied to the specific region K1.

前記相対移動が続けて行われ、図７（Ｂ）に示すように、先端面１８の液だまり２の一部が、特定領域Ｋ１よりも凹んでいる非特定領域Ｋ２上に位置しても、更には、図７（Ｃ）に示すように、先端面１８の液だまり２の全部が、非特定領域Ｋ２上に位置しても、液だまり２は非特定領域Ｋ２に接触しないことから、非特定領域Ｋ２に対して塗布されない。 The relative movement is continuously performed, and as shown in FIG. 7B, even if a part of the liquid pool 2 on the tip surface 18 is located on the non-specific region K2 which is recessed from the specific region K1. Further, as shown in FIG. 7C, even if all of the liquid pool 2 on the tip surface 18 is located on the non-specific region K2, the liquid pool 2 does not come into contact with the non-specific region K2. It is not applied to the specific area K2.

本実施形態では、前記のとおり、先端面１８における液だまり２は下に垂れた状態として形成されていることから、図７（Ｄ）に示すように、前記相対移動が続いて行われ、先端面１８の液だまり２の一部が、次の特定領域Ｋ１に到達すると、この液だまり２の一部は特定領域Ｋ１に接触し、特定領域Ｋ１に対して塗布される。更に、図７（Ａ）と同様の状態となって、スリット１２から特定領域Ｋ１へ塗布液が自動的に引き出され、特定領域Ｋ１に対して塗布される。 In the present embodiment, as described above, since the liquid pool 2 on the tip surface 18 is formed in a state of hanging downward, as shown in FIG. 7D, the relative movement is continuously performed and the tip is formed. When a part of the liquid pool 2 on the surface 18 reaches the next specific region K1, the part of the liquid pool 2 comes into contact with the specific region K1 and is applied to the specific region K1. Further, in the same state as in FIG. 7A, the coating liquid is automatically drawn from the slit 12 to the specific region K1 and applied to the specific region K1.

このような表面に凹凸を有する基材７を塗布の対象とする場合であっても、塗布器１０の先端１７の液だまり２の一部が特定領域Ｋ１に接することで、この特定領域Ｋ１に対して塗布されるが、非特定領域Ｋ２に対して塗布されない。この場合の塗布動作も、下向きに開口するスリット１２が形成されている塗布器１０内の塗布液の圧力を、前記のように負圧に調整することで行われる方法による。 Even when the base material 7 having such irregularities on the surface is targeted for coating, a part of the liquid pool 2 at the tip 17 of the coating device 10 comes into contact with the specific region K1 to reach the specific region K1. However, it is not applied to the non-specific area K2. The coating operation in this case is also based on a method performed by adjusting the pressure of the coating liquid in the coating device 10 in which the slit 12 that opens downward is formed to a negative pressure as described above.

〔塗布動作について〕
また、前記各実施形態では、塗布動作の際、塗布器１０の先端１７が特定領域Ｋ１上を通過する場合であっても非特定領域Ｋ２上を通過する場合であっても、塗布器１０内の塗布液の圧力を一定に保つように調整している。しかし、これ以外として、塗布動作の際、塗布器１０内の塗布液の圧力を前記相対移動の途中で変更してもよい。これにより、例えば、塗布動作の途中で、特定領域Ｋ１における塗布液の膜厚の変更が可能となる。つまり、前記相対移動の移動方向の途中から特定領域Ｋ１に形成する塗膜の厚さを、当該途中までの特定領域Ｋ１に形成する塗膜の厚さと相違させることが可能となる。なお、このように途中で圧力を変更する手段は、基材７が親液の領域及び撥液の領域を有する場合（図６に示す形態）及び基材７が凹凸を有する場合（図７に示す形態）の双方に適用可能である。 [Applying operation]
Further, in each of the above-described embodiments, during the coating operation, the tip 17 of the coating device 10 may pass over the specific region K1 or the non-specific region K2 in the coating device 10. The pressure of the coating liquid is adjusted to be constant. However, other than this, the pressure of the coating liquid in the coating device 10 may be changed during the relative movement during the coating operation. This makes it possible to change the film thickness of the coating liquid in the specific region K1 during the coating operation, for example. That is, it is possible to make the thickness of the coating film formed in the specific region K1 from the middle of the relative movement direction different from the thickness of the coating film formed in the specific region K1 up to the middle. The means for changing the pressure on the way in this way is when the base material 7 has a parent liquid region and a liquid repellent region (the form shown in FIG. 6) and when the base material 7 has irregularities (in FIG. 7). It is applicable to both of the forms shown).

〔基材７について〕
図２に示すように、前記各実施形態では、基材７には複数の特定領域Ｋ１が形成されており、各特定領域Ｋ１は島状に形成されている。つまり、一つの特定領域Ｋ１は他の特定領域Ｋ１に対して独立して（離れて）同じ基材７に設けられている。そして、非特定領域Ｋ２が網目状となっている。このような基材７を塗布の対象として前記塗布装置５及び塗布方法によって塗布液の塗布を行えば、独立した複数の特定領域Ｋ１それぞれに対してのみ塗布液の塗布が可能となる。
図２では、特定領域Ｋ１を島状としており、その周囲を非特定領域Ｋ２としているが、これら領域が反対に分布されたものであってもよい。つまり、図８は、他の基材７の平面図である。この図８に示すように、非特定領域Ｋ２を島状としており、その周囲を特定領域Ｋ１としている。この場合、特定領域Ｋ１が網目状となる。そして、このような基材７を対象として前記塗布装置５によって塗布動作を行うことができ、この場合、網目状である特定領域Ｋ１にのみ塗布液が塗布される。例えば塗布液が導電性を有する場合、網目状の電極を有する基材７が得られる。
図２及び図８それぞれに示す基材７の場合、基材７と塗布器１０との相対移動の方向に沿って、特定領域Ｋ１と非特定領域Ｋ２とが交互に配置されるが、本実施形態の塗布装置５及び塗布方法によれば、特定領域Ｋ１のみに対して塗布（パターン塗布）が可能である。 [About base material 7]
As shown in FIG. 2, in each of the above-described embodiments, a plurality of specific regions K1 are formed on the base material 7, and each specific region K1 is formed in an island shape. That is, one specific region K1 is provided on the same base material 7 independently (separately) from the other specific region K1. The non-specific region K2 has a mesh shape. If the coating liquid is applied to such a base material 7 by the coating device 5 and the coating method, the coating liquid can be applied only to each of a plurality of independent specific regions K1.
In FIG. 2, the specific region K1 has an island shape and the surrounding area has a non-specific region K2, but these regions may be distributed in opposite directions. That is, FIG. 8 is a plan view of the other base material 7. As shown in FIG. 8, the non-specific region K2 has an island shape, and the periphery thereof has a specific region K1. In this case, the specific region K1 has a mesh shape. Then, the coating operation can be performed on such a base material 7 by the coating device 5, and in this case, the coating liquid is applied only to the specific region K1 having a mesh shape. For example, when the coating liquid has conductivity, a base material 7 having a mesh-like electrode is obtained.
In the case of the base material 7 shown in FIGS. 2 and 8, the specific region K1 and the non-specific region K2 are alternately arranged along the direction of the relative movement between the base material 7 and the applicator 10. According to the coating device 5 and the coating method of the form, coating (pattern coating) is possible only on the specific region K1.

〔付記〕
今回開示した実施形態はすべての点で例示であって制限的なものではない。本発明の権利範囲は、上述の実施形態に限定されるものではなく、特許請求の範囲に記載された構成と均等の範囲内でのすべての変更が含まれる。
本発明が適用される基材７として、例えば半導体ウエハ（シリコンウエハ）や電極基板等が挙げられるが、その他様々な用途に用いることが可能である。
また、前記実施形態では、塗布器１０の開口１１から塗布液が吐出される方向は、下向きであるが、これに限らず、斜め下向きであってもよく、また、横向き（水平方向向き）、上向き、斜め上向きとする場合もある。 [Additional Notes]
The embodiments disclosed this time are exemplary in all respects and are not restrictive. The scope of rights of the present invention is not limited to the above-described embodiment, and includes all modifications within a range equivalent to the configuration described in the claims.
Examples of the base material 7 to which the present invention is applied include semiconductor wafers (silicon wafers) and electrode substrates, but they can also be used for various other purposes.
Further, in the above-described embodiment, the direction in which the coating liquid is discharged from the opening 11 of the coating device 10 is downward, but the direction is not limited to this, and it may be diagonally downward, or laterally (horizontally). It may be upward or diagonally upward.

２：液だまり５：塗布装置７：基材
１０：塗布器１１：開口１２：スリット
１７：先端１８：面（先端面）２０：移動手段
４０：圧力付与手段Ｋ１：特定領域Ｋ２：非特定領域
Ｆ１：引く力Ｆ２：保持させる力 2: Liquid pool 5: Coating device 7: Base material 10: Coating device 11: Opening 12: Slit 17: Tip 18: Surface (tip surface) 20: Moving means 40: Pressure applying means K1: Specific area K2: Non-specific area F1: Pulling force F2: Holding force

Claims

A base material having a specific region and a non-specific region and a coating device having a long slit in one direction opening at the tip to allow discharge of a coating liquid from the opening are relatively moved in a direction intersecting the one direction. A coating method for forming a coating film on a specific area.
The specific region is a region located closer to the tip of the applicator than the non-specific region.
By adjusting the pressure of the coating liquid in the coating device having the slit, a pool of coating liquid is formed at the tip where the slit opens.
The base material and the coating device are separated from each other in a positional relationship in which the liquid pool is in contact with the specific region and the liquid pool at the tip is not in contact with the non-specific region. Performs a coating operation that moves relative to the coating device,
During the coating operation, the coating liquid in the pool on the specific region remains in the specific region, and the coating liquid in the pool on the non-specific region is adjusted to the pressure to stay at the tip. , Application method.

A base material having a specific region and a non-specific region and a coating device having a long slit in one direction opening downward at the tip to discharge a coating liquid from the opening are relatively moved in a direction intersecting the one direction. , A coating method for forming a coating film in the specific region.
The specific region is a region having a higher degree of affinity with the coating liquid than the non-specific region, and the non-specific region has liquid repellency.
The liquid of the coating liquid to the tip where the slit by adjusting the pressure of the coating liquid in the applicator is open reservoir having a slit, in the liquid accumulation does not contact positional relation to the substrate, pre-forming Process and
After the pretreatment, as an actual coating treatment, a coating operation is performed in which the base material and the coating device are relatively moved in a positional relationship so that the liquid pool can come into contact with the specific region.
During the coating operation, the liquid reservoir coating solution on the specific area is allowed to remain in the specific region, and the coating liquid of the liquid reservoir on the non-specific region in order to remain in the tip prior to Article A coating method in which the pressure is adjusted so as to maintain the state of pretreatment .

A base material having a specific region and a non-specific region and a coating device having a long slit in one direction opening at the tip to allow discharge of a coating liquid from the opening are relatively moved in a direction intersecting the one direction. A coating method for forming a coating film on a specific area.
The specific region is a region having a higher degree of affinity with the coating liquid than the non-specific region, and the non-specific region has liquid repellency.
By adjusting the pressure of the coating liquid in the coating device having the slit, the coating liquid in the coating device is set to a negative pressure in order to form a pool of the coating liquid at the tip where the slit opens. Then, a force for pulling the coating liquid in the slit into the coating device is generated, and the pulling force is balanced with a force for holding the coating liquid in the slit by surface tension at the opening, thereby causing the tip to reach the tip. Adjust the negative pressure so that the puddle is maintained.
A coating operation is performed in which the base material and the coating device are relatively moved in a positional relationship in which the liquid pool can come into contact with the specific area.
During the coating operation, the coating liquid in the pool on the specific region remains in the specific region, and the coating liquid in the pool on the non-specific region is adjusted to the pressure to stay at the tip. , Application method.

A coating method in which the slit opens downward.
The pressure of the coating liquid in the coating device connected to the coating liquid of the slit is adjusted so that the liquid pool is formed at the tip in a state where the coating liquid of the slit and the coating liquid adhering to the tip are continuous. The coating method according to any one of claims 1 to 3 .

The coating method according to any one of claims 1 to 4 , wherein the pressure of the coating liquid in the coating device is changed during the relative movement during the coating operation.

The coating method according to any one of claims 1 to 5 , wherein one specific region is independently provided on the same base material with respect to the other specific region.

An applicator that has a long slit in one direction at the tip to allow the coating liquid to be discharged from the opening.
A moving means for relatively moving a base material having a specific region and a non-specific region and the coating device in a direction intersecting the one direction,
A pressure applying means for adjusting the pressure of the coating liquid in the coating device having the slit so that a pool of the coating liquid is formed at the tip of the slit opening.
With
The specific region is a region located closer to the tip of the applicator than the non-specific region.
By said moving means, said liquid reservoir is the is contactable to a specific area and the non-said tip said liquid reservoir is for a specific region and the substrate in a positional relationship as the non-contact of the tip and said applicator The pressure-applying means causes the coating liquid in the pool on the specific region to remain in the specific region, and the coating liquid in the pool on the non-specific region is said to move away from the specific region. A coating device that adjusts to the pressure that stays at the tip.

A coating device with a long slit in one direction opening downward at the tip to allow the coating liquid to be discharged from the opening.
A moving means for relatively moving a base material having a specific region and a non-specific region and the coating device in a direction intersecting the one direction,
A pressure applying means for adjusting the pressure of the coating liquid in the coating device having the slit so that a pool of the coating liquid is formed at the tip of the slit opening.
With
The specific region is a region having a higher degree of affinity with the coating liquid than the non-specific region, and the non-specific region has liquid repellency.
By the pressure applying means, by adjusting the pressure of the coating liquid in the applicator having said slit, liquid pool of coating liquid to the tip where the slits are open, the liquid reservoir is not in contact with the substrate Pre-processing to form according to the positional relationship
After the pretreatment, as an actual coating treatment, when the moving means relatively moves the liquid pool in a positional relationship so that the liquid pool can come into contact with the specific region, the pressure applying means causes the liquid on the specific region. The pressure is adjusted so as to maintain the pre-treated state so that the coating liquid in the pool remains in the specific region and the coating liquid in the pool on the non-specific region stays at the tip. , Coating device.

An applicator that has a long slit in one direction at the tip to allow the coating liquid to be discharged from the opening.
A moving means for relatively moving a base material having a specific region and a non-specific region and the coating device in a direction intersecting the one direction,
A pressure applying means for adjusting the pressure of the coating liquid in the coating device having the slit so that a pool of the coating liquid is formed at the tip of the slit opening.
With
The specific region is a region having a higher degree of affinity with the coating liquid than the non-specific region, and the non-specific region has liquid repellency.
By making the coating liquid in the coating device negative pressure by the pressure applying means, a force for pulling the coating liquid in the slit into the coating device is generated, and the pulling force causes the coating liquid in the slit to be pulled. The negative pressure is adjusted so that the liquid pool is maintained at the tip by balancing with the force held by the surface tension at the opening.
When the moving means relatively moves the liquid pool in a positional relationship that allows the liquid pool to come into contact with the specific region, the pressure applying means causes the coating liquid of the liquid pool on the specific region to remain in the specific region. A coating device that adjusts the coating liquid in the pool on the non-specific region to the pressure at which it stays at the tip.