JP6783374B2 - 可変ビーム形状を有するレーザを利用する材料処理 - Google Patents
可変ビーム形状を有するレーザを利用する材料処理 Download PDFInfo
- Publication number
- JP6783374B2 JP6783374B2 JP2019501655A JP2019501655A JP6783374B2 JP 6783374 B2 JP6783374 B2 JP 6783374B2 JP 2019501655 A JP2019501655 A JP 2019501655A JP 2019501655 A JP2019501655 A JP 2019501655A JP 6783374 B2 JP6783374 B2 JP 6783374B2
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- workpiece
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- laser output
- output beam
- optical element
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0734—Shaping the laser spot into an annular shape
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
- G02B5/3083—Birefringent or phase retarding elements
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662362824P | 2016-07-15 | 2016-07-15 | |
| US62/362,824 | 2016-07-15 | ||
| US15/261,096 | 2016-09-09 | ||
| US15/261,096 US11204506B2 (en) | 2014-03-05 | 2016-09-09 | Polarization-adjusted and shape-adjusted beam operation for materials processing |
| PCT/US2017/042089 WO2018013901A2 (fr) | 2016-07-15 | 2017-07-14 | Traitement de matériau mettant en oeuvre un laser doté d'une forme de faisceau variable |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020176654A Division JP7098696B2 (ja) | 2016-07-15 | 2020-10-21 | 可変ビーム形状を有するレーザを利用する材料処理 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019523137A JP2019523137A (ja) | 2019-08-22 |
| JP6783374B2 true JP6783374B2 (ja) | 2020-11-11 |
Family
ID=60953351
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019501655A Active JP6783374B2 (ja) | 2016-07-15 | 2017-07-14 | 可変ビーム形状を有するレーザを利用する材料処理 |
| JP2020176654A Active JP7098696B2 (ja) | 2016-07-15 | 2020-10-21 | 可変ビーム形状を有するレーザを利用する材料処理 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020176654A Active JP7098696B2 (ja) | 2016-07-15 | 2020-10-21 | 可変ビーム形状を有するレーザを利用する材料処理 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6783374B2 (fr) |
| CN (1) | CN109791303A (fr) |
| DE (1) | DE112017003592T5 (fr) |
| WO (1) | WO2018013901A2 (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019108837A1 (de) * | 2019-04-04 | 2020-10-08 | Baosteel Tailored Blanks Gmbh | Verfahren zum Schmelzschweißen eines oder mehrerer Stahlbleche aus presshärtbarem Stahl |
| CN110614446A (zh) * | 2019-09-24 | 2019-12-27 | 上海精测半导体技术有限公司 | 一种切割设备及切割方法 |
| CN114633018A (zh) * | 2020-12-16 | 2022-06-17 | 阳程科技股份有限公司 | 使用于光轴倾斜加工的光学透镜模块 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0627643B1 (fr) * | 1993-06-03 | 1999-05-06 | Hamamatsu Photonics K.K. | Système optique de balayage à laser utilisant un axicon |
| US6192062B1 (en) | 1998-09-08 | 2001-02-20 | Massachusetts Institute Of Technology | Beam combining of diode laser array elements for high brightness and power |
| US6208679B1 (en) | 1998-09-08 | 2001-03-27 | Massachusetts Institute Of Technology | High-power multi-wavelength external cavity laser |
| US6469275B2 (en) * | 1999-01-20 | 2002-10-22 | Lsp Technologies, Inc | Oblique angle laser shock processing |
| ATE192692T1 (de) * | 1999-01-28 | 2000-05-15 | Leister Process Tech | Laserfügeverfahren und vorrichtung zum verbinden von verschiedenen werkstücken aus kunststoff oder kunststoff mit anderen materialien |
| JP2000263257A (ja) * | 1999-03-15 | 2000-09-26 | Hitachi Cable Ltd | 非金属材料のレーザによる割断方法及びその装置 |
| JP3722731B2 (ja) | 2000-09-13 | 2005-11-30 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| US7164152B2 (en) * | 2003-09-16 | 2007-01-16 | The Trustees Of Columbia University In The City Of New York | Laser-irradiated thin films having variable thickness |
| JP2005230834A (ja) * | 2004-02-18 | 2005-09-02 | Campus Create Co Ltd | レーザ光を用いた加工方法および加工装置 |
| JP4350558B2 (ja) | 2004-03-09 | 2009-10-21 | 三菱電機株式会社 | レーザビーム光学系およびレーザ加工装置 |
| JP2005314198A (ja) * | 2004-04-26 | 2005-11-10 | Lemi Ltd | ガラス割断用レーザ装置 |
| JP2006061954A (ja) * | 2004-08-27 | 2006-03-09 | Sony Corp | 基板加工装置および基板加工方法 |
| JP4753048B2 (ja) * | 2007-04-16 | 2011-08-17 | トヨタ自動車株式会社 | 重ね合わせワークのレーザ溶接方法 |
| US8053704B2 (en) * | 2008-05-27 | 2011-11-08 | Corning Incorporated | Scoring of non-flat materials |
| FR2935916B1 (fr) * | 2008-09-12 | 2011-08-26 | Air Liquide | Procede et installation de coupage laser avec modification du facteur de qualite du faisceau laser |
| DE112011100812T5 (de) | 2010-03-05 | 2013-03-07 | TeraDiode, Inc. | System und Verfahren zur Wellenlängenstrahlkombination |
| US8670180B2 (en) | 2010-03-05 | 2014-03-11 | TeraDiode, Inc. | Wavelength beam combining laser with multiple outputs |
| JP2012094591A (ja) * | 2010-10-25 | 2012-05-17 | Disco Abrasive Syst Ltd | ビアホールの加工方法およびレーザー加工装置 |
| EP2478990B1 (fr) * | 2011-01-21 | 2019-04-17 | Leister Technologies AG | Procédé de réglage d'un spot de lumière laser pour le traitement laser de pièces et dispositif destiné à l'exécution du procédé |
| JP2011119026A (ja) * | 2011-03-22 | 2011-06-16 | Panasonic Corp | 光ピックアップ装置及びそれに用いられる対物レンズ |
| US9339890B2 (en) * | 2011-12-13 | 2016-05-17 | Hypertherm, Inc. | Optimization and control of beam quality for material processing |
| US9221118B2 (en) * | 2012-07-26 | 2015-12-29 | General Electric Company | Adaptive control hybrid welding system and methods of controlling |
| US9335551B2 (en) | 2012-11-28 | 2016-05-10 | TeraDiode, Inc. | Welding techniques using multi-wavelength beam combining systems |
| CN105531074B (zh) * | 2013-02-04 | 2019-09-03 | 纽波特公司 | 用于激光切割透明和半透明基底的方法和装置 |
| JP5998968B2 (ja) * | 2013-02-04 | 2016-09-28 | 旭硝子株式会社 | ガラス基板の切断方法、ガラス基板及び近赤外線カットフィルタガラス |
| DE102014200633B3 (de) | 2014-01-15 | 2015-05-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Bearbeitungsvorrichtung und -verfahren zur Laserbearbeitung einer Oberfläche |
| US9889524B2 (en) | 2014-03-05 | 2018-02-13 | TeraDiode, Inc. | Polarization-adjusted beam operation for materials processing |
| US9429849B2 (en) * | 2014-03-07 | 2016-08-30 | Kabushiki Kaisha Toshiba | Adjusting method of pattern transferring plate, laser application machine and pattern transferring plate |
| DE102014108259A1 (de) | 2014-06-12 | 2015-12-17 | Scanlab Ag | Vorrichtung zur Lasermaterialbearbeitung |
-
2017
- 2017-07-14 DE DE112017003592.9T patent/DE112017003592T5/de active Pending
- 2017-07-14 CN CN201780043627.7A patent/CN109791303A/zh active Pending
- 2017-07-14 JP JP2019501655A patent/JP6783374B2/ja active Active
- 2017-07-14 WO PCT/US2017/042089 patent/WO2018013901A2/fr active Application Filing
-
2020
- 2020-10-21 JP JP2020176654A patent/JP7098696B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7098696B2 (ja) | 2022-07-11 |
| CN109791303A (zh) | 2019-05-21 |
| JP2021007985A (ja) | 2021-01-28 |
| WO2018013901A2 (fr) | 2018-01-18 |
| JP2019523137A (ja) | 2019-08-22 |
| WO2018013901A3 (fr) | 2018-07-26 |
| DE112017003592T5 (de) | 2019-03-28 |
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