JP6779206B2 - Viscous fluid printing equipment - Google Patents

Description

The present invention relates to a viscous fluid printing apparatus that prints a viscous fluid on a circuit board by filling the inside of a through hole of a mask with a viscous fluid.

In the viscous fluid printing apparatus, a mask is placed on a circuit board, and the viscous fluid is supplied on the mask by the viscous fluid supply apparatus. Then, the viscous fluid is squeezed by the squeegee, so that the through holes of the mask are filled with the viscous fluid, and the viscous fluid is printed on the circuit board. The following patent documents describe a viscous fluid printing device having a built-in viscous fluid supply device. Specifically, the viscous fluid printing apparatus has a first squeegee that fills the inside of the through hole of the mask with the viscous fluid, and a second squeegee that oscillates so as to be close to and separated from the first squeegee. A viscous fluid supply device for supplying a viscous fluid between the first squeegee and the second squeegee is built in the viscous fluid printing device.

U.S. Pat. No. 6,066,206

In the viscous fluid printing apparatus described in the above patent document, the viscous fluid supplied between the first squeegee and the second squeegee is printed on the circuit board in a state where the second squeegee is separated from the first squeegee. On the other hand, by bringing the second squeegee closer to the first squeegee, the viscous fluid supplied between the first squeegee and the second squeegee is recovered. However, the viscous fluid printing apparatus described in the above patent document has a built-in viscous fluid supply apparatus, which complicates the structure. Further, it is inconvenient because the viscous fluid at a different position between the first squeegee and the second squeegee cannot be printed on the circuit board. Furthermore, it is inconvenient because the viscous fluid at a different location between the first squeegee and the second squeegee cannot be recovered. As described above, the viscous fluid printing apparatus described in the above patent document has various problems, and the practicality of the viscous fluid printing apparatus is improved by solving these various problems. The present invention has been made in view of such circumstances, and an object of the present invention is to improve the practicality of a viscous fluid printing apparatus.

In order to solve the above problems, the viscous fluid printing apparatus of the present invention has a first squeegee that fills the inside of the through hole of the mask with a viscous fluid and a second squeegee that swings so as to be close to and separated from the first squeegee. A working head having a squeegee and a viscous fluid disposed between the first squeegee and the second squeegee and accommodated between the first squeegee and the second squeegee are applied toward the mask. A pressurizing mechanism for pressing, a moving device for moving the work head, and a control device for controlling the operation of the moving device are provided, and the control device keeps the second squeegee away from the first squeegee. By moving the work head, a squeezing work execution unit that performs a squeezing operation after accommodating the viscous fluid on the mask between the first squeegee and the second squeegee, and the second squeegee. To move the working head in a state where the viscous fluid is housed between the first squeegee and the second squeegee, thereby moving the viscous fluid to an arbitrary position. The pressurizing mechanism has a moving portion, the pressurizing mechanism has a piston disposed between the first squeegee and the second squeegee, and the second squeegee is brought close to the first squeegee to obtain the said. It is characterized in that the viscous fluid is pressurized toward the mask by lowering the piston in a state where the viscous fluid is accommodated between the first squeegee and the second squeegee. Further, in the viscous fluid printing apparatus of the present invention, the first squeegee that fills the inside of the through hole of the mask with the viscous fluid, the second squeegee that oscillates so as to approach and separate from the first squeegee, and the first squeegee. A work head having a blade or a piston provided between the squeegee and the second squeegee, a moving device for moving the working head, and a control device for controlling the operation of the moving device are provided. The device accommodated the viscous fluid on the mask between the first squeegee and the second squeegee by moving the work head with the second squeegee separated from the first squeegee. Later, the squeezing work execution unit that performs the squeezing work and the work in a state where the second squeegee is brought close to the first squeegee and a viscous fluid is accommodated between the first squeegee and the second squeegee. By moving the head, the viscous fluid is moved to an arbitrary position, and the viscous fluid contained between the first squeegee and the second squeegee at the arbitrary position is moved on the mask by the blade or the piston. It is characterized by having a viscous fluid moving portion that is extruded into. Further, in the viscous fluid printing apparatus of the present invention, the first squeegee that fills the inside of the through hole of the mask with the viscous fluid, the second squeegee that oscillates so as to approach and separate from the first squeegee, and the first squeegee. A pair of side wall plates provided so that the squeegee and the second squeegee are located between the squeegee and the first squeegee and the second squeegee are arranged between the first squeegee and the second squeegee. A work head having a pressurizing mechanism for pressurizing a viscous fluid housed in a space surrounded by the pair of side wall plates toward the mask, a moving device for moving the working head, and the moving device. A control device for controlling the operation of the device is provided, and the control device moves the work head with the second squeegee separated from the first squeegee to move the viscous fluid on the mask. The first squeegee and the second squeegee are housed between the first squeegee and the second squeegee, and then the squeezing work execution unit that performs the squeezing work and the second squeegee are brought close to the first squeegee. By accommodating the viscous fluid between the squeegee and the work head and raising the work head, the accommodated viscous fluid is raised from the mask, and by moving the work head, the viscous fluid is moved to an arbitrary position. The viscous fluid contained in the space surrounded by the first squeegee, the second squeegee, and the pair of side wall plates in a state where the work head is separated upward from the mask at the arbitrary position. It is characterized by having a viscous fluid moving portion that extrudes the fluid onto the mask by the pressurizing mechanism.

In the viscous fluid printing apparatus of the present invention, by moving the work head with the second squeegee separated from the first squeegee, the viscous fluid on the mask is accommodated between the first squeegee and the second squeegee. To. Then, the contained viscous fluid is printed on the circuit board. This makes it possible to print the viscous fluid at a different location between the first squeegee and the second squeegee on the circuit board. Further, by moving the work head with the second squeegee close to the first squeegee and the viscous fluid being accommodated between the first squeegee and the second squeegee, the viscous fluid moves to an arbitrary position. Will be done. This makes it possible to recover the viscous fluid at a different location between the first squeegee and the second squeegee. Therefore, in the viscous fluid printing apparatus of the present invention, it is not necessary to incorporate the viscous fluid supply apparatus, and the structure of the viscous fluid supply apparatus can be simplified.

It is a top view which shows the solder printing machine. It is a side view which shows the squeegee device of 1st Example. It is a block diagram which shows the control device. It is a side view which shows the squeegee device of 1st Example. It is a side view which shows the squeegee device of 1st Example. It is a side view which shows the squeegee device of 1st Example. It is a side view which shows the conventional squeegee device. It is a top view which shows the metal mask placed on two circuit boards. It is a top view which shows the metal mask placed on two circuit boards. It is an enlarged view which shows the squeegee for printing of the conventional squeegee apparatus. It is a side view which shows the squeegee device of 2nd Example. It is a side view which shows the squeegee device of 2nd Example. It is a side view which shows the squeegee device of 2nd Example. It is a side view which shows the squeegee device of 3rd Example. It is a side view which shows the squeegee device of 3rd Example.

Hereinafter, examples of the present invention will be described in detail as embodiments for carrying out the present invention with reference to the drawings.

[First Example]
<Structure of solder printing machine>
FIG. 1 shows the solder printing machine 10 of the present invention. The solder printing machine 10 is a device for printing cream solder on a circuit board. The solder printing machine 10 includes a pair of transport devices 20, a moving device 22, a solder supply device 24, and a squeegee device 26.

The conveyor device 20 includes two conveyor devices 30 and 31. The two conveyor devices 30 and 31 are arranged on the base 32 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 30 and 31 conveys the circuit board 36 supported by the respective conveyor devices 30 and 31 by an electromagnetic motor (see FIG. 3) 34 in the X-axis direction. Further, the circuit board 36 is fixedly held by the board holding device (see FIG. 3) 38 at a predetermined position. A metal mask (see FIG. 2) 40 is placed on the upper surface of the circuit board 36.

The moving device 22 is composed of a Y-axis direction slide mechanism 50 and an X-axis direction slide mechanism 52. The Y-axis direction slide mechanism 50 has a Y-axis slider 56 provided on the base 32 so as to be movable in the Y-axis direction. The Y-axis slider 56 moves to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 3) 58. Further, the X-axis direction slide mechanism 52 has an X-axis slider 60 provided on the side surface of the Y-axis slider 56 so as to be movable in the X-axis direction. The X-axis slider 60 moves to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 3) 62.

The solder supply device 24 is a device that supplies cream solder, and a discharge port for discharging cream solder is formed on the lower surface of the solder supply device 24. Further, the solder supply device 24 is detachably attached to the X-axis slider 60. As a result, the solder supply device 24 supplies the cream solder to an arbitrary position on the metal mask 40 placed on the upper surface of the circuit board 36.

The squeegee device 26 is attached to the Y-axis slider 56 above the circuit board 36 held by the conveyor devices 30 and 31. Therefore, the squeegee device 26 moves to an arbitrary position in the Y-axis direction above the circuit board 36 held by the conveyor devices 30 and 31. As shown in FIG. 2, the squeegee device 26 includes a main body 70, a printing mechanism 72, a collecting mechanism 74, and a pressurizing mechanism 76. The main body 70 is arranged on the lower surface of the Y-axis slider 56 in a state of extending downward.

The printing mechanism 72 includes a connecting plate 78, a pair of side wall plates (only one is shown in the drawing) 80, and a printing squeegee 82. The connecting plate 78 has a generally rectangular shape, is fixed to the lower end of the main body 70 at the edge of the long side, and extends downward. The pair of side wall plates 80 are fixed to both edges in the longitudinal direction of the connecting plates 78 so as to intersect the connecting plates 78 at right angles. The pair of side wall plates 80 extend in a direction away from the main body 70. The printing squeegee 82 is fixed to the side surface of the connecting plate 78 so as to be located between the pair of side wall plates 80. The lower end of the printing squeegee 82 extends downward from the lower end of the connecting plate 78. Further, the printing squeegee 82 fixed to the connecting plate 78 is generally in a posture extending in the vertical direction.

The recovery mechanism 74 includes a rocking plate 86, a recovery squeegee 88, and a cylinder 90. The swing plate 86 is generally rectangular and has substantially the same dimensions as the connecting plate 78. The rocking plate 86 is arranged between the pair of side wall plates 80 in a state of facing the connecting plate 78. A shaft 92 is inserted through the upper edge of the rocking plate 86 so as to extend in the longitudinal direction of the rocking plate 86. The swing plate 86 is sandwiched by a pair of side wall plates 80 so as to be able to swing around its shaft 92. Further, the recovery squeegee 88 is fixed to the side surface of the rocking plate 86 on the side facing the connecting plate 78. The lower end of the recovery squeegee 88 extends downward from the lower end of the rocking plate 86.

The cylinder 90 is generally composed of a tubular case 94 and a rod 96 extending from one end of the case 94. At the other end, the case 94 is oscillatedly held by a bracket 98 fixed to the side surface of the main body 70. Further, a shaft 100 is inserted through the side surface of the rocking plate 86 opposite to the side surface on which the recovery squeegee 88 is fixed so as to extend in the longitudinal direction of the rocking plate 86. The tip of the rod 96 is oscillatingly connected to the shaft 100. With such a structure, when the cylinder 90 is extended, the rocking plate 86 swings around the shaft 92 and approaches and separates from the connecting plate 78.

When the rocking plate 86 is closest to the connecting plate 78, the printing squeegee 82 fixed to the connecting plate 78 and the collecting squeegee 88 fixed to the rocking plate 86 are substantially parallel to each other. By the way, when the printing squeegee 82 and the collecting squeegee 88 are parallel to each other, the distance between the printing squeegee 82 and the collecting squeegee 88 is about 5 mm. On the other hand, when the rocking plate 86 is most separated from the connecting plate 78, as shown in FIG. 4, a printing squeegee 82 fixed to the connecting plate 78 and a recovery squeegee 88 fixed to the rocking plate 86 The angle between the two and the squeegee 88 is about 45 degrees, and the lower end of the recovery squeegee 88 rises to a predetermined height according to the swing angle of the rocking plate 86. Specifically, the lower end of the collection squeegee 88 rises to a position about 10 mm higher than the lower end of the printing squeegee 82. That is, the rocking plate 86 swings between the position of the rocking plate 86 shown in FIG. 2 and the position of the rocking plate 86 shown in FIG.

The pressurizing mechanism 76 includes a cylinder 102, an insertion plate 104, and a blade 106. The cylinder 102 is generally composed of a tubular case 108 and a rod 110 extending from one end of the case 108. The case 108 is fixed to the side surface of the main body 70, and the rod 110 extends downward. Below the rod 110, a gap is located between the printing squeegee 82 and the recovery squeegee 88 when the rocking plate 86 is closest to the connecting plate 78.

An insertion plate 104 is fixed to the tip of the rod 110 of the cylinder 102. The insertion plate 104 has a generally rectangular shape, is fixed to the tip of the rod 110 at the center of the edge of the long side, and extends downward. The longitudinal dimension of the insertion plate 104 is substantially the same as the longitudinal dimension of the connecting plate 78 and the swing plate 86. The thickness dimension of the insertion plate 104 is slightly shorter than the distance between the printing squeegee 82 and the recovery squeegee 88 when the rocking plate 86 is closest to the connecting plate 78. Further, the blade 106 has substantially the same dimensions as the insertion plate 104 in the longitudinal direction and the thickness dimension, and is fixed to the lower end portion of the insertion plate 104. With such a structure, when the cylinder 102 is extended, the blade 106 is lowered together with the insertion plate 104 and inserted between the printing squeegee 82 and the collecting squeegee 88. By the way, on the lower end surface of the blade 106, an inclined surface 112 that inclines downward toward the printing squeegee 82 is formed.

When the blade 106 is raised most, the inclined surface 112 of the blade 106 is located slightly below the upper ends of the printing squeegee 82 and the collecting squeegee 88. On the other hand, when the blade 106 is most lowered, the lower end of the inclined surface 112 of the blade 106 is located slightly above the lower end of the printing squeegee 82, as shown in FIG. That is, the blade 106 moves up and down between the position of the blade 106 shown in FIG. 2 and the position of the blade 106 shown in FIG. The distance between the lower end of the inclined surface 112 of the blade 106 and the lower end of the printing squeegee 82 when the blade 106 is most lowered is about 1 mm in the vertical direction.

Further, the squeegee device 26 includes an elevating device (see FIG. 3) 116. The elevating device 116 is provided on the Y-axis slider 56 and elevates the main body 70. As a result, the squeegee device 26 moves in the vertical direction.

Further, the solder printing machine 10 includes a control device 120 as shown in FIG. The control device 120 includes a controller 122 and a plurality of drive circuits 124. The plurality of drive circuits 124 are connected to the electromagnetic motors 34, 58, 62, the holding device 38, the cylinders 90, 102, and the elevating device 116. Further, the controller 122 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to a plurality of drive circuits 124. As a result, the operation of the transfer device 20, the moving device 22, the solder supply device 24, and the squeegee device 26 is controlled by the controller 122.

<Operation of solder printing machine>
In the solder printing machine 10, cream solder is supplied by the solder supply device 24 to the upper surface of the metal mask 40 mounted on the circuit board 36 according to the above-described configuration, and the cream solder is applied by the squeegee device 26. Ru. A pattern hole (see FIG. 4) 130 is formed in the metal mask 40 according to a pattern such as a pad of the circuit board 36, and cream solder is printed on the circuit board 36 through the pattern hole 130.

Specifically, the circuit board 36 is conveyed to a working position, and is fixedly held by the holding device 38 at that position. Then, the solder supply device 24 moves above the predetermined position of the metal mask 40 mounted on the circuit board 36 by the operation of the moving device 22. Subsequently, the solder supply device 24 supplies the cream solder onto the metal mask 40. When the supply of the cream solder by the solder supply device 24 is completed, the squeegee device 26 moves above the supplied cream solder by the operation of the moving device 22. Then, the squeegee device 26 has a main body 70 so that the cream solder is located in the direction on which the printing squeegee 82 of the connecting plate 78 is fixed (hereinafter, may be referred to as “squeezing direction”). To lower. At this time, the squeegee device 26 lowers so that the tip of the squeegee 82 for printing slightly contacts the upper surface of the metal mask 40.

Next, as shown in FIG. 4, the squeegee device 26 contracts the cylinder 90 and separates the swing plate 86 from the connecting plate 78. Further, the squeegee device 26 extends the cylinder 102 and lowers the blade 106. Then, the squeegee device 26 moves in the squeezing direction by the operation of the Y-axis direction slide mechanism 50. At this time, due to the movement of the squeegee device 26, the cream solder 132 on the metal mask 40 passes under the recovery squeegee 88 of the rocking plate 86 that is rising with the rocking, and the pair of side wall plates 80. Get in between.

Then, the cream solder 132 is blocked by the insertion plate 104 and the blade 106. However, since the lower end surface of the blade 106 is an inclined surface 112, the cream solder 132 enters below the inclined surface 112. At this time, the cream solder 132 is pressed toward the metal mask 40 by the inclined surface 112. As a result, the cream solder 132 enters the inside of the pattern hole 130 of the metal mask 40. The cream solder 132 that did not enter the pattern hole 130 is scraped off by the printing squeegee 82. Then, the squeegee device 26 is moved in the squeezing direction in the range where the pattern hole 130 of the metal mask 40 is formed, so that the cream solder 132 corresponding to the pattern of the pad or the like is printed on the circuit board 36.

Further, in the solder printing machine 10, the cream solder 132 is recovered by the operation of the recovery mechanism 74 of the squeegee device 26, and the recovered cream solder 132 can be moved to an arbitrary position in the Y direction. Specifically, when the printing of the cream solder 132 on the circuit board 36 is completed, the squeegee device 26 contracts the cylinder 102 and raises the blade 106, as shown in FIG. At this time, the squeegee device 26 moves in the squeezing direction by the operation of the Y-axis direction slide mechanism 50. As a result, the cream solder 132 is blocked by the printing squeegee 82 and is accumulated on the side of the printing squeegee 82 in the squeezing direction.

Then, the squeegee device 26 extends the cylinder 90 while moving, and brings the rocking plate 86 closer to the connecting plate 78. At this time, the cream solder 132 accumulated on the side of the printing squeegee 82 in the squeezing direction is scraped off toward the printing squeegee 82 by the collecting squeegee 88. As a result, as shown in FIG. 2, the cream solder 132 is accommodated between the printing squeegee 82 and the recovery squeegee 88.

When the cream solder 132 is accommodated between the printing squeegee 82 and the collecting squeegee 88, the squeegee device 26 is raised. At this time, the squeegee device 26 is raised in accordance with the timing at which the swing plate 86 is completed, and the ascending direction of the squeegee device 26 is obliquely upward toward the squeezing direction. This makes it possible to collect the cream solder on the metal mask 40 with almost no residual cream solder. The cream solder 132 housed between the printing squeegee 82 and the collecting squeegee 88 does not fall due to its viscosity. Subsequently, the squeegee device 26 is moved to an arbitrary position by the operation of the Y-axis direction slide mechanism 50 in the raised state. Then, at the arbitrary position, the squeegee device 26 extends the cylinder 102 and lowers the blade 106, as shown in FIG. As a result, the cream solder 132 contained between the printing squeegee 82 and the collecting squeegee 88 is extruded by the blade 106 and resupplied onto the metal mask 40.

As described above, in the solder printing machine 10, the cream solder 132 can be recovered by the operation of the recovery mechanism 74, and the recovered cream solder 132 can be moved to an arbitrary position in the Y direction. As a result, according to the solder printing machine 10, it is possible to shorten the cycle time and ensure the quality of solder printing as compared with the conventional solder printing machine. Specifically, unlike the solder printing machine 10, the conventional solder printing machine has a squeegee device 140 shown in FIG. 7 instead of the squeegee device 26. The squeegee device 140 is composed of a pair of printing mechanisms 142 and 144. Each of the pair of printing mechanisms 142, 144 includes an arm 146, a connecting plate 148, and a printing squeegee 150.

The arm 146 is arranged on the lower surface of the Y-axis slider 56 in a state of extending downward. The connecting plate 148 has a generally rectangular shape, is fixed to the lower end of the arm 146 at the edge of the long side, and extends downward. The printing squeegee 150 is fixed to the side surface of the connecting plate 148, and the lower end portion of the printing squeegee 150 extends downward from the lower end portion of the connecting plate 148. The printing squeegee 150 fixed to the connecting plate 148 is tilted at about 60 degrees. Further, the pair of printing mechanisms 142 and 144 are arranged side by side in the Y-axis direction, and are arranged in contrast so that the printing squeegees 150 face each other.

The operation of the squeegee device 140 when printing cream solder on the circuit board 36 conveyed by the transfer device 20 using the squeegee device 140 will be described. As described above, the conveyor device 20 is composed of two conveyor devices 30 and 31. Therefore, as shown in FIG. 8, one sheet is placed on the two circuit boards 36 in order to efficiently print on the two circuit boards 36 supported by the two conveyor devices 30 and 31. The metal mask 40 is placed. The metal mask 40 has a pattern hole 130 corresponding to a circuit pattern for a circuit board (hereinafter, may be referred to as “circuit board 36a”) supported by the conveyor device 30, and is supported by the conveyor device 31. A pattern hole 130 corresponding to a circuit pattern for the circuit board (hereinafter, may be referred to as “circuit board 36b”) is formed. That is, two patterns of pattern holes 130 are formed in one metal mask 40.

Then, the solder supply device 24 supplies cream solder to the regions 160 and 162 at both ends of the metal mask 40 in the Y-axis direction. After the cream solder is supplied onto the metal mask 40, for example, if the circuit board 36a is conveyed to the work area by the conveyor device 30, the squeegee device 140 is moved above the area 160 and lowered. .. As a result, the tip of the printing squeegee 150 of the printing mechanisms 142 and 144 of the squeegee device 140 comes into contact with the upper surface of the metal mask 40. The squeegee device 140 is lowered so that the cream solder in the region 160 is located between the pair of printing mechanisms 142 and 144.

Next, the squeegee device 140 is moved in the Y-axis direction so as to pass above the circuit board 36a. At this time, the cream solder is printed on the circuit board 36a by one of the pair of printing mechanisms 142 and 144. Then, one of the pair of printing mechanisms 142 and 144 passes over the circuit board 36a to form the central region 164 of the metal mask 40 in the Y-axis direction, that is, the pattern hole 130 for the circuit board 36a. When moving to the area 164 between the area where the pattern hole 130 is formed and the area where the pattern hole 130 for the circuit board 36b is formed, the movement of the squeegee device 140 in the Y-axis direction is stopped. As a result, the cream solder is accumulated in the region 164.

Subsequently, the squeegee device 140 is moved in the Y-axis direction toward the region 160 so as to pass above the circuit board 36a again. At this time, the cream solder is printed on the circuit board 36a by the other of the pair of printing mechanisms 142 and 144. Then, when the other of the pair of printing mechanisms 142 and 144 passes over the circuit board 36a and moves to the region 160, the movement of the squeegee device 140 in the Y-axis direction is stopped. As a result, the cream solder is accumulated in the region 160, and the printing work of the cream solder on the circuit board 36a is completed.

Further, for example, when the circuit board 36b is conveyed to the work area by the conveyor device 31, the squeegee device 140 is moved above the area 162 and lowered. At this time, the squeegee device 140 is lowered so that the cream solder in the region 162 is located between the pair of printing mechanisms 142 and 144. Next, the squeegee device 140 is moved in the Y-axis direction so as to pass above the circuit board 36b. At this time, the cream solder is printed on the circuit board 36b by the other of the pair of printing mechanisms 142 and 144. Then, when the other of the pair of printing mechanisms 142 and 144 passes over the circuit board 36b and moves to the central region 164 of the metal mask 40 in the Y-axis direction, the squeegee device 140 moves in the Y-axis direction. Is stopped. As a result, the cream solder is accumulated in the region 164.

Subsequently, the squeegee device 140 is moved in the Y-axis direction toward the region 162 so as to pass above the circuit board 36b again. At this time, the cream solder is printed on the circuit board 36b by one of the pair of printing mechanisms 142 and 144. Then, when one of the pair of printing mechanisms 142 and 144 passes over the circuit board 36b and moves to the region 162, the movement of the squeegee device 140 in the Y-axis direction is stopped. As a result, the cream solder is accumulated in the region 162, and the printing work of the cream solder on the circuit board 36b is completed.

As described above, in the conventional squeegee device 140, the cream solder is printed on the circuit board 36 by reciprocating the squeegee device 140 on the circuit board 36 to be printed. This is because it is necessary to return the cream solder to the regions 160 and 162 corresponding to each circuit board 36 after the printing work on each circuit board 36 is completed. Specifically, the central region 164 of the metal mask 40 is a shared accumulation point between the cream solder used for the printing work on the circuit board 36a and the cream solder used for the printing work on the circuit board 36b. On the other hand, the area 160 is a dedicated accumulation location for the cream solder used for the printing work on the circuit board 36a, and the region 162 is a dedicated accumulation location for the cream solder used for the printing work on the circuit board 36b. It has become. Therefore, after the printing work on each circuit board 36 is completed, the cream solder is returned to the dedicated areas 160 and 162 corresponding to each circuit board 36.

However, if the squeegee device 140 is reciprocated for each printing operation on one circuit board 36, the cycle time becomes long. Therefore, as shown in FIG. 9, the central portion of the metal mask 40 in the Y-axis direction is defined as two regions 166 and 168. Then, the area 166 is a dedicated accumulation point for the cream solder used for the printing work on the circuit board 36a, and the area 168 is a dedicated accumulation point for the cream solder used for the printing work on the circuit board 36b. As a result, a dedicated accumulation point for the cream solder used for the printing work on each circuit board 36 is provided in the central portion of the metal mask 40, so that the squeegee device 140 reciprocates during the printing work on one circuit board 36. There is no need to move it, and it is possible to shorten the cycle time.

Specifically, for example, when the solder supply device 24 supplies cream solder to the areas 160 and 162 and the circuit board 36a is conveyed to the work area by the conveyor device 30, the squeegee device 140 is in the area 160. Moved up and down. At this time, the squeegee device 140 is lowered so that the cream solder in the area 160 is located between the pair of printing mechanisms 142 and 144. Next, the squeegee device 140 is moved in the Y-axis direction so as to pass above the circuit board 36a. At this time, the cream solder is printed on the circuit board 36a by one of the pair of printing mechanisms 142 and 144. Then, when one of the pair of printing mechanisms 142 and 144 passes over the circuit board 36a and moves to the central region 166 of the metal mask 40, the movement of the squeegee device 140 in the Y-axis direction is stopped. As described above, this region 166 is a dedicated integrated portion of the cream solder used for the printing work on the circuit board 36a, so that the printing work of the cream solder on the circuit board 36a is completed.

Further, when the cream solder is accumulated in the central region 166 of the metal mask 40 and the new circuit board 36a is conveyed to the work area by the conveyor device 30, the squeegee device 140 is moved above the area 166. It is lowered. At this time, the squeegee device 140 is lowered so that the cream solder in the region 166 is located between the pair of printing mechanisms 142 and 144. Next, the squeegee device 140 is moved in the Y-axis direction toward the region 160 so as to pass above the circuit board 36a. At this time, the cream solder is printed on the circuit board 36a by the other of the pair of printing mechanisms 142 and 144. Then, when the other of the pair of printing mechanisms 142 and 144 passes over the circuit board 36a and moves to the area 160, the movement of the squeegee device 140 in the Y-axis direction is stopped. Since this region 160 is also a dedicated integrated portion of the cream solder used for the printing work on the circuit board 36a, the printing work of the cream solder on the circuit board 36a is completed.

Further, when the circuit board 36b is conveyed to the work area by the conveyor device 31, the solder cream printing work is performed in the same manner as the circuit board 36a. Briefly, the cream solder in region 162 is skied onto the circuit board 36b by the other of the pair of printing mechanisms 142, 144, and the cream solder is integrated in the central region 168 of the metal mask 40. As a result, the printing work of the cream solder on the circuit board 36b is completed. Then, when the new circuit board 36b is conveyed to the work area by the conveyor device 31, the cream solder in the area 168 is skied to the circuit board 36b by one of the pair of printing mechanisms 142 and 144, and the cream solder is in the area. It is accumulated in 162. As a result, the printing work of the cream solder on the new circuit board 36b is completed.

In this way, by providing two areas for accumulating the cream solder in the central portion of the metal mask 40, the printing work on one circuit board 36 is completed by moving the squeegee device 140 in one direction. It becomes possible to shorten the cycle time. However, the print quality cannot be guaranteed on the circuit board 36 conveyed by the conveyor devices 30 and 31. Specifically, in the circuit board 36a conveyed by the conveyor device 30, when the printing operation is performed by the cream solder in the region 160, squeezing is performed by one of the pair of printing mechanisms 142 and 144. On the other hand, when the printing operation is performed by the cream solder in the area 166, squeezing is performed by the other of the pair of printing mechanisms 142 and 144. Further, in the circuit board 36b conveyed by the conveyor device 31, when the printing operation is performed by the cream solder in the region 162, squeezing is performed by the other of the pair of printing mechanisms 142 and 144. On the other hand, when the printing operation is performed by the cream solder in the area 168, squeezing is performed by one of the pair of printing mechanisms 142 and 144. That is, in the circuit board 36 conveyed by the conveyor devices 30 and 31, there are cases where the circuit board 36 is skied by the printing mechanism 142 and cases where it is skied by the printing mechanism 144, and the printing conditions in the respective printing mechanisms 142 and 144. Is difficult to make the same.

Here, the printing conditions by the printing mechanisms 142 and 144 will be described. As described above, the printing squeegees 150 of the printing mechanisms 142 and 144 are attached to the connecting plate 148 in an inclined state of about 60 degrees. Then, when skiing by the printing squeegee 150, the tip of the printing squeegee 150 bends as shown in FIG. If the mounting angle θ ₁ (about 60 degrees) of the printing squeegee 150 to the connecting plate 148 and the angle θ ₂ of the tip of the printing squeegee 150 with respect to the metal mask 40 are different, cream solder is applied to the pattern hole 130. The filling force changes. Therefore, the printing condition is the mounting angle θ ₁ of the printing squeegee 150 and the angle θ ₂ of the tip of the printing squeegee 150. Further, the angle θ _{2 at} the tip of the printing squeegee 150 changes depending on the force (pressing pressure) that presses the printing mechanisms 142 and 144 against the metal mask 40. Therefore, the pressing force of the printing mechanisms 142 and 144 is also a printing condition. Further, the moving speed of the squeegee device 140 when skiing by the printing mechanisms 142 and 144 is also a printing condition. As described above, in the printing mechanisms 142 and 144, the mounting angle θ ₁ of the printing squeegee 150, the angle θ ₂ of the tip of the printing squeegee 150, the pressing force of the printing mechanisms 142 and 144, and the moving speed of the squeegee device 140. Is the printing condition.

Therefore, in order to make the printing conditions of the printing mechanism 142 and the printing conditions of the printing mechanism 144 the same, it is necessary to adjust the four printing conditions. Therefore, the printing conditions of the printing mechanism 142 and the printing mechanism 144 It is very difficult to make the same printing conditions as. In particular, since the angle θ _{2 at} the tip of the printing squeegee 150 changes according to the degree of deterioration of the printing squeegee 150, it is not possible to make the printing conditions of the printing mechanism 142 and the printing conditions of the printing mechanism 144 the same. , Very difficult. When the printing conditions of the printing mechanism 142 and the printing conditions of the printing mechanism 144 are different, the printing quality of the printing mechanism 142 and the printing quality of the printing mechanism 144 are different. Therefore, when the cream solder printing work is performed by the conventional squeegee device 140, the print quality cannot be guaranteed.

That is, in the conventional squeegee device 140, it is not possible to achieve both a reduction in the cycle time and a guarantee of print quality. On the other hand, in the squeegee device 26 of the present invention, it is possible to achieve both a reduction in the cycle time and a guarantee of print quality. Specifically, in the squeegee device 26, as described above, the cream solder can be recovered by the operation of the recovery mechanism 74, and the recovered cream solder can be moved to an arbitrary position in the Y direction. Therefore, for example, in the configuration shown in FIG. 8, when the cream solder is supplied to the region 160 and the circuit board 36a is conveyed to the work area by the conveyor device 30, the cream solder in the region 160 is squeezed. The printing mechanism 72 of 26 squeezes the circuit board 36a, and the cream solder is accumulated in the central region 164 of the metal mask 40. As a result, the printing work of the cream solder on the circuit board 36a is completed.

Subsequently, when the circuit board 36b is conveyed to the work area by the conveyor device 31, the cream solder in the area 164 is squeezed into the circuit board 36b by the printing mechanism 72 of the squeegee device 26, and the cream solder is transferred to the area 162. Accumulate. As a result, the printing work of the cream solder on the circuit board 36b is completed. Further, when the circuit board 36a is conveyed to the work area by the conveyor device 30, the cream solder in the area 162 is collected by the recovery mechanism 74, and the collected cream solder is moved to the area 160. Then, the cream solder moved to the area 160 is skied on the circuit board 36a by the printing mechanism 72, and the cream solder is accumulated in the area 164. As a result, the printing work of the cream solder on the circuit board 36a is completed.

As described above, in the squeegee device 26, the printing work on one circuit board 36 is completed by moving the squeegee device 26 in one direction. This makes it possible to shorten the cycle time. Further, the circuit board 36a held by the conveyor device 30 is printed by the printing mechanism 72, and the moving direction of the squeegee device 26 at the time of printing is the direction from the area 160 to the area 164. On the other hand, the circuit board 36b held by the conveyor device 31 is also printed by the printing mechanism 72, and the moving direction of the squeegee device 26 at the time of printing is the direction from the area 164 to the area 162. That is, the circuit board 36 held by the conveyor devices 30 and 31 is always printed by the printing mechanism 72, and the moving direction of the squeegee device 26 at the time of printing is always constant. Therefore, the printing conditions for the circuit boards 36 held by the conveyor devices 30 and 31 are constant, and the printing quality can be guaranteed. As described above, in the squeegee device 26, both the reduction of the cycle time and the guarantee of the print quality are achieved.

Furthermore, in the conventional squeegee device 140, the force for filling the pattern hole 130 with the cream solder (hereinafter, may be referred to as “filling force”) and the scraping property of the cream solder by the printing squeegee 150. Was set by adjusting two printing conditions, that is, the angle θ ₂ of the tip of the printing squeegee 150 and the pressing force of the printing mechanisms 142 and 144. However, setting an appropriate filling force and scrapability by a combination of the two printing conditions is very complicated, and the setting time takes a very long time. On the other hand, in the squeegee device 26, the filling force is set by the inclination angle of the inclined surface 112 of the blade 106. Further, the scraping property is set by the pressing force of the squeegee device 26. That is, in the squeegee device 26, the filling force is set by adjusting the inclination angle of the inclined surface 112, and the scraping property is set by adjusting the pressing force of the squeegee device 26. As a result, in the squeegee device 26, the filling force and the scraping property can be set independently, and the filling force and the scraping property can be set easily and in a short time.

Further, since the squeegee device 26 can collect and move the cream solder on the metal mask 40, it is necessary for the operator to collect and move the cream solder on the metal mask 40 at the time of setup change. There is no. This makes it possible to reduce the burden on the operator.

Further, in the squeegee device 26, when the cream solder is recovered by the recovery mechanism 74, the cream solder is scraped off by the printing squeegee 82 and the cream solder is scraped off by the recovery squeegee 88, and the cream solder flows. In this state, it is accommodated between the printing squeegee 82 and the collecting squeegee 88. Therefore, when the cream solder is collected, the cream solder is agitated, and it is possible to suppress the solidification of the cream solder.

As shown in FIG. 3, the controller 122 of the control device 120 has a squeezing work execution unit 170 and a cream solder moving unit 172. The squeezing work execution unit 170 is a functional unit for performing squeezing work on the circuit board by the printing mechanism 72 of the squeegee device 26. The cream solder moving unit 172 is a functional unit for collecting and moving the cream solder by the collecting mechanism 74 of the squeegee device 26.

[Second Example]
In the squeegee device 26 of the first embodiment, the printing operation is performed in a state where the rocking plate 86 is separated from the connecting plate 78, that is, in a state where the rocking plate 86 is opened. As shown in FIG. In the squeegee device 180 of the second embodiment, the printing operation is performed in a state where the rocking plate 86 is close to the connecting plate 78, that is, in a state where the rocking plate 86 is closed. The squeegee device 180 of the second embodiment has substantially the same configuration as the squeegee device 26 of the first embodiment except for the pressurizing mechanism 182. Therefore, the pressurizing mechanism 182 will be mainly described, and the description of the components having the same function will be omitted by using the same reference numerals as those of the squeegee device 26 of the first embodiment.

The pressurizing mechanism 182 of the squeegee device 180 includes a cylinder 184, an insertion plate 186, and a piston 188. The cylinder 184 is generally composed of a tubular case 190 and a rod 192 extending from one end of the case 190. The case 190 is fixed to the side surface of the main body 70, and the rod 192 extends downward. Below the rod 192, a gap is located between the printing squeegee 82 and the recovery squeegee 88 when the rocking plate 86 is closest to the connecting plate 78.

An insertion plate 186 is fixed to the tip of the rod 192 of the cylinder 184. The insertion plate 186 has a generally rectangular shape, is fixed to the tip of the rod 192 at the center of the edge of the long side, and extends downward. The longitudinal dimension of the insertion plate 186 is substantially the same as the longitudinal dimension of the connecting plate 78 and the swing plate 86. The thickness dimension of the insertion plate 186 is slightly shorter than the distance between the printing squeegee 82 and the recovery squeegee 88 when the rocking plate 86 is closest to the connecting plate 78. Further, the piston 188 has a dimension slightly larger than the insertion plate 186 in the longitudinal direction and the thickness dimension, and is fixed to the lower end portion of the insertion plate 186. The piston 188 is made of an elastically deformable material. With such a structure, when the cylinder 184 is extended, the piston 188 is lowered together with the insertion plate 186 and inserted between the printing squeegee 82 and the collecting squeegee 88. By the way, when the piston 188 moves in the vertical direction between the printing squeegee 82 and the collecting squeegee 88, the piston 188 is in sliding contact with the printing squeegee 82 and the collecting squeegee 88.

When the piston 188 is raised most, the lower end surface of the piston 188 is at substantially the same position as the upper end of the printing squeegee 82, as shown in FIG. On the other hand, when the piston 188 is most lowered, the lower end surface of the piston 188 is at substantially the same position as the lower end of the printing squeegee 82, as shown in FIG. That is, the piston 188 moves up and down between the position of the piston 188 shown in FIG. 12 and the position of the piston 188 shown in FIG.

With such a structure, when the squeezing operation is performed, the squeegee device 180 lowers the main body 70 so that the cream solder is positioned in the squeezing direction. As a result, the tip of the printing squeegee 82 slightly contacts the upper surface of the metal mask 40. Next, as shown in FIG. 12, the squeegee device 180 contracts the cylinder 90 and separates the swing plate 86 from the connecting plate 78. Further, the squeegee device 180 contracts the cylinder 184 and raises the piston 188. Then, the squeegee device 180 moves in the squeezing direction by the operation of the Y-axis direction slide mechanism 50. At this time, due to the movement of the squeegee device 180, the cream solder 132 on the metal mask 40 passes under the recovery squeegee 88 of the rocking plate 86 that is rising with the rocking, and the pair of side wall plates 80. Get in between. Then, the cream solder 132 is blocked by the printing squeegee 82.

Further, when the squeegee device 180 is moving in the squeezing direction, the cylinder 90 is extended to bring the swing plate 86 closer to the connecting plate 78. At this time, the cream solder 132 accumulated on the side of the printing squeegee 82 in the squeezing direction is scraped off toward the printing squeegee 82 by the collecting squeegee 88. As a result, as shown in FIG. 11, the cream solder 132 is housed in the space 196 surrounded by the printing squeegee 82, the recovery squeegee 88, and the pair of side wall plates 80. When the cream solder 132 is housed inside the space 196, the squeegee device 180 extends the cylinder 184 and lowers the piston 188. As a result, the cream solder 132 housed inside the space 196 is pressurized. At this time, the squeegee device 180 is moved in the squeezing direction. Then, when the printing mechanism 72 reaches the pattern hole 130, the cream solder 132 pressurized inside the space 196 enters the inside of the pattern hole 130. In this way, in the squeegee device 180, the printing operation is performed with the rocking plate 86 closed.

When the printing operation is completed, the squeegee device 180 contracts the cylinder 184 and raises the piston 188. At this time, as the piston 188 rises, the cream solder 132 housed inside the space 196 also rises inside the space 196. Then, the squeegee device 180 is raised, and in the raised state, it is moved to an arbitrary position by the operation of the Y-axis direction slide mechanism 50. Then, at the arbitrary position, the squeegee device 180 extends the cylinder 184 and lowers the piston 188 as shown in FIG. As a result, the cream solder 132 housed inside the space 196 is pushed out by the piston 188 and resupplied onto the metal mask 40.

In this way, also in the squeegee device 180, similarly to the squeegee device 26, the cream solder 132 can be recovered by the operation of the recovery mechanism 74, and the recovered cream solder 132 can be moved to an arbitrary position in the Y direction. ing. As a result, the squeegee device 180 can obtain the same effect as the squeegee device 26.

[Third Example]
In the squeegee devices 26 and 180 of the above embodiment, the cream solder 132 pressurized by the pressurizing mechanisms 76 and 182 fills the pattern holes 130, but as shown in FIG. 14, the squeegee device of the third embodiment. In 200, the cream solder 132 pressurized by the inclination of the squeegee is filled in the pattern hole 130. The squeegee device 200 of the third embodiment has substantially the same configuration as the squeegee devices 26 and 180 of the above embodiment, except that the pressurizing mechanisms 76 and 182 are not provided and the printing mechanism 202 is provided. Therefore, the printing mechanism 202 will be mainly described, and the description of the components having the same function will be omitted by using the same reference numerals as those of the squeegee devices 26 and 180 of the above embodiment.

The printing mechanism 202 of the squeegee device 200 includes a connecting plate 204, a pair of side wall plates (only one is shown in the drawing) 206, and a printing squeegee 208. The connecting plate 204 has a generally rectangular shape, is fixed to the lower end of the main body 70 at the edge of the long side, and extends downward. The pair of side wall plates 206 are fixed to both edges in the longitudinal direction of the connecting plate 204 so as to intersect the connecting plate 204 at right angles. The pair of side wall plates 206 extend in the squeezing direction. The printing squeegee 208 is fixed to the side surface of the connecting plate 204 so as to be located between the pair of side wall plates 206. The lower end of the printing squeegee 208 extends downward from the lower end of the connecting plate 204. The printing squeegee 208 fixed to the connecting plate 204 is tilted at about 60 degrees.

Further, the printing mechanism 202 is not provided with the pressurizing mechanisms 76 and 182, but is provided with a collecting mechanism 74. The swing plate 86 of the recovery mechanism 74 is arranged between the pair of side wall plates 206, similarly to the squeegee devices 26 and 180. The cylinder 90 of the recovery mechanism 74 is not shown for simplification of the figure.

With such a structure, when the squeezing operation is performed, the squeegee device 200 lowers the main body 70 so that the cream solder is positioned in the squeezing direction. The squeegee device 200 contracts the cylinder 90 and separates the swing plate 86 from the connecting plate 204 before the main body 70 is lowered. Then, when the tip of the printing squeegee 208 comes into contact with the upper surface of the metal mask 40 due to the lowering of the main body 70, the squeegee device 200 moves in the squeezing direction by the operation of the Y-axis direction slide mechanism 50. At this time, due to the movement of the squeegee device 200, the cream solder 132 on the metal mask 40 passes under the recovery squeegee 88 of the rocking plate 86 that is rising with the rocking, and the pair of side wall plates 206. Get in between. Then, the cream solder 132 is blocked by the printing squeegee 208. At this time, the cream solder 132 is pressed toward the metal mask 40 by the inclined printing squeegee 208, and the pressed cream solder 132 enters the pattern hole 130. In this way, in the squeegee device 200, the cream solder 132 pressurized by the printing squeegee 208 is filled in the pattern holes 130, and the printing operation is executed.

When the printing operation is completed, the squeegee device 200 extends the cylinder 90 while moving in the squeezing direction, and brings the rocking plate 86 closer to the connecting plate 204. At this time, the cream solder 132 blocked by the printing squeegee 208 is scraped off toward the printing squeegee 208 by the collecting squeegee 88. As a result, as shown in FIG. 15, the cream solder 132 is accommodated between the printing squeegee 208 and the recovery squeegee 88. Next, the squeegee device 200 is raised, and in the raised state, it is moved to an arbitrary position by the operation of the Y-axis direction slide mechanism 50. Then, at the arbitrary position, the squeegee device 200 contracts the cylinder 90 and separates the swing plate 86 from the connecting plate 204. As a result, the cream solder 132 contained between the recovery squeegee 88 and the printing squeegee 208 falls and is resupplied onto the metal mask 40.

In this way, also in the squeegee device 200, similarly to the squeegee devices 26 and 180, the cream solder 132 can be recovered by the operation of the recovery mechanism 74, and the recovered cream solder 132 can be moved to an arbitrary position in the Y direction. It has become. As a result, the squeegee device 200 can obtain the same effect as the squeegee devices 26 and 180. However, since the squeegee device 200 is not provided with the pressurizing mechanisms 76 and 182, the filling force and the scraping property are set by the angle θ ₂ of the tip of the printing squeegee 208 and the pressing force of the squeegee device 200. It is executed by adjusting two printing conditions.

By the way, in the above embodiment, the solder printing machine 10 is an example of a viscous fluid printing device. The squeegee device 26 is an example of a work head. The metal mask 40 is an example of a mask. The Y-axis direction slide mechanism 50 is an example of a moving device. The pressurizing mechanism 76 is an example of the pressurizing mechanism. The printing squeegee 82 is an example of the first squeegee. The recovery squeegee 88 is an example of a second squeegee. The inclined surface 112 is an example of an inclined surface. The control device 120 is an example of the control device. The cream solder 132 is an example of a viscous fluid. The skiing work execution unit 170 is an example of a skiing work execution unit. The cream solder moving portion 172 is an example of the cream solder moving portion. The squeegee device 180 is an example of a work head. The pressurizing mechanism 182 is an example of the pressurizing mechanism. The piston 188 is an example of a piston. The squeegee device 200 is an example of a work head. The printing squeegee 208 is an example of the first squeegee.

The present invention is not limited to the above examples, and can be carried out in various embodiments with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the tip of the recovery squeegee 88 has a flat shape, but the tip of the recovery squeegee 88 is deformed such as curved or bent toward the printing squeegee 82. It is possible to adopt.

10: Solder printing machine (viscous fluid printing device) 26: Squeegee device (working head) 40: Metal mask (mask) 50: Y-axis direction slide mechanism (moving device) 76: Pressurizing mechanism 82: Printing squeegee (first) Squeegee) 88: Recovery squeegee (second squeegee) 112: Inclined surface 120: Control device 132: Cream solder (viscous fluid) 170: Squeezing work execution unit 172: Cream solder moving unit 180: Squeegee device (work head) 182 : Pressurizing mechanism 188: Piston 200: Squeegee device (working head) 208: Printing squeegee (first squeegee)

Claims (6)

A work head having a first squeegee that fills the inside of the through hole of the mask with a viscous fluid, and a second squeegee that oscillates so as to approach and separate from the first squeegee.
A pressurizing mechanism disposed between the first squeegee and the second squeegee and pressurizing a viscous fluid accommodated between the first squeegee and the second squeegee toward the mask.
A moving device for moving the work head and
A control device for controlling the operation of the moving device is provided.
The control device
By moving the work head with the second squeegee separated from the first squeegee, the viscous fluid on the mask is accommodated between the first squeegee and the second squeegee, and then the ski is skied. The skiing work execution department that performs the singing work and
By bringing the second squeegee close to the first squeegee and moving the work head in a state where the viscous fluid is accommodated between the first squeegee and the second squeegee, the viscous fluid can be moved to an arbitrary position. It has a viscous fluid moving part to move,
The pressurizing mechanism
It has a piston disposed between the first squeegee and the second squeegee, and the second squeegee is brought close to the first squeegee to be viscous between the first squeegee and the second squeegee. A viscous fluid printing apparatus, characterized in that a viscous fluid is pressurized toward the mask by lowering the piston while containing the fluid. A first squeegee that fills the inside of the through hole of the mask with a viscous fluid, a second squeegee that oscillates so as to approach and separate from the first squeegee, and a second squeegee provided between the first squeegee and the second squeegee. With a working head, which has a blade or piston,
A moving device for moving the work head and
A control device for controlling the operation of the moving device is provided.
The control device
By moving the work head with the second squeegee separated from the first squeegee, the viscous fluid on the mask is accommodated between the first squeegee and the second squeegee, and then the ski is skied. The skiing work execution department that performs the singing work and
By bringing the second squeegee close to the first squeegee and moving the work head in a state where the viscous fluid is accommodated between the first squeegee and the second squeegee, the viscous fluid can be moved to an arbitrary position. It is characterized by having a viscous fluid moving portion which is moved and pushes a viscous fluid contained between the first squeegee and the second squeegee at the arbitrary position onto the mask by the blade or the piston. Viscous fluid printing equipment. The work head
Having a pressurizing mechanism arranged between the first squeegee and the second squeegee and pressurizing a viscous fluid accommodated between the first squeegee and the second squeegee toward the mask. The viscous fluid printing apparatus according to claim 2. The first squeegee that fills the inside of the through hole of the mask with a viscous fluid, the second squeegee that oscillates so as to approach and separate from the first squeegee, and the first squeegee and the second squeegee are located between A pair of side wall plates provided so as to be arranged between the first squeegee and the second squeegee, and surrounded by the first squeegee, the second squeegee, and the pair of side wall plates. A work head having a pressurizing mechanism that pressurizes the viscous fluid contained in the space toward the mask.
A moving device for moving the work head and
A control device for controlling the operation of the moving device is provided.
The control device
By moving the work head with the second squeegee separated from the first squeegee, the viscous fluid on the mask is accommodated between the first squeegee and the second squeegee, and then the ski is skied. The skiing work execution department that performs the singing work and
By bringing the second squeegee close to the first squeegee, accommodating the viscous fluid between the first squeegee and the second squeegee, and raising the work head, the accommodating viscous fluid is brought into the said. By raising the work head from the mask and moving the work head, the viscous fluid is moved to an arbitrary position, and the work head is separated upward from the mask at the arbitrary position, and the first squeegee and the first squeegee are separated . 2 A viscous fluid printing apparatus comprising a viscous fluid moving portion that pushes a viscous fluid housed in a space surrounded by a squeegee and the pair of side wall plates onto the mask by the pressurizing mechanism. The pressurizing mechanism
Having an inclined surface that is continuous with the first squeegee and descends toward the first squeegee, and that the viscous fluid comes into contact with the inclined surface when the squeezing operation is performed by the first squeegee. The viscous fluid printing apparatus according to claim 3 or 4, wherein the viscous fluid is pressurized toward the mask. The pressurizing mechanism
It has a piston disposed between the first squeegee and the second squeegee, and the second squeegee is brought close to the first squeegee to be viscous between the first squeegee and the second squeegee. The viscous fluid printing apparatus according to claim 3 or 4, wherein the viscous fluid is pressurized toward the mask by lowering the piston in a state of containing the fluid.

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