JP6769314B2 - フォトセンサ - Google Patents
フォトセンサ Download PDFInfo
- Publication number
- JP6769314B2 JP6769314B2 JP2017010235A JP2017010235A JP6769314B2 JP 6769314 B2 JP6769314 B2 JP 6769314B2 JP 2017010235 A JP2017010235 A JP 2017010235A JP 2017010235 A JP2017010235 A JP 2017010235A JP 6769314 B2 JP6769314 B2 JP 6769314B2
- Authority
- JP
- Japan
- Prior art keywords
- cable
- pressure contact
- cables
- light receiving
- support portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003466 welding Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 4
- 230000000052 comparative effect Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
- H01R4/183—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section
- H01R4/186—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section using a body comprising a plurality of cable-accommodating recesses or bores
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0271—Housings; Attachments or accessories for photometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/08—Arrangements of light sources specially adapted for photometry standard sources, also using luminescent or radioactive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
- H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
- H01R4/242—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members being plates having a single slot
- H01R4/2425—Flat plates, e.g. multi-layered flat plates
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
- Measuring Fluid Pressure (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Geophysics And Detection Of Objects (AREA)
Description
図2の(a)は、比較例のフォトセンサ100の斜視図である。また図2の(b)は、比較例のフォトセンサ100の上面図である。
実施形態に係るフォトセンサ1のように、圧接部とケーブル端部支持部との間のケーブルが配置されている領域に連結部を配置する形態において、比較例のフォトセンサ100のように、集合ケーブル支持部においてケーブルを垂直に曲げてもよい。
12a,12b,12c,12dケーブル
221 投光支持部
241 受光支持部
30 連結部
34 回路部
36a,36b,36c,36d 圧接部
42 集合ケーブル支持部
46a,46b,46c,46d ケーブル端部支持部
48a,48b,48c,48d ケーブル中間支持部
Claims (5)
- 投光素子および受光素子を備えるフォトセンサであって、
前記投光素子および前記受光素子を制御する回路部と、
複数のケーブルを含む集合ケーブルを支持する集合ケーブル支持部と、
前記複数のケーブルの各々を圧接して固定することによって前記回路部との導通を行う圧接部と、
前記複数のケーブルの各々の端部を支持するケーブル端部支持部と
を備え、
前記複数のケーブルの各々において、前記集合ケーブル支持部から前記圧接部までの長さより、前記圧接部から前記ケーブル端部支持部までの長さの方が長いことを特徴とするフォトセンサ。 - 前記投光素子と前記受光素子とが対向して配置される
ことを特徴とする請求項1に記載のフォトセンサ。 - 前記投光素子を支持する投光支持部と、
前記受光素子を支持する受光支持部と、
前記投光支持部の一端と前記受光支持部の一端とを連結する連結部とをさらに備え、
前記回路部が、前記連結部に設けられている
ことを特徴とする請求項1または2に記載のフォトセンサ。 - 前記ケーブル端部支持部と前記圧接部との間に、前記ケーブルを支持するケーブル中間支持部をさらに設けている
ことを特徴とする請求項1〜3のいずれか一項に記載のフォトセンサ。 - 前記連結部が、前記圧接部と前記ケーブル端部支持部との間に複数のケーブルが配置されている配線領域を形成する面に垂直な方向に配置されているとともに、
前記配線領域を形成する面に垂直な方向から見て、前記圧接部から前記ケーブル端部支持部に向かう方向において、
前記連結部の長さよりも、前記圧接部から前記ケーブル端部支持部までの長さの方が長い
ことを特徴とする請求項3に記載のフォトセンサ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017010235A JP6769314B2 (ja) | 2017-01-24 | 2017-01-24 | フォトセンサ |
US15/726,391 US10386227B2 (en) | 2017-01-24 | 2017-10-06 | Photosensor having a pressure-welding portion to perform conduction with a circuit portion and fixing a plurality of cables |
CN201710957840.0A CN108346864B (zh) | 2017-01-24 | 2017-10-16 | 光传感器 |
DE102017124792.0A DE102017124792B4 (de) | 2017-01-24 | 2017-10-24 | Lichtsensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017010235A JP6769314B2 (ja) | 2017-01-24 | 2017-01-24 | フォトセンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018120911A JP2018120911A (ja) | 2018-08-02 |
JP6769314B2 true JP6769314B2 (ja) | 2020-10-14 |
Family
ID=62812693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017010235A Active JP6769314B2 (ja) | 2017-01-24 | 2017-01-24 | フォトセンサ |
Country Status (4)
Country | Link |
---|---|
US (1) | US10386227B2 (ja) |
JP (1) | JP6769314B2 (ja) |
CN (1) | CN108346864B (ja) |
DE (1) | DE102017124792B4 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5076801A (en) * | 1990-06-22 | 1991-12-31 | Xerox Corporation | Electronic component including insulation displacement interconnect means |
JP2002124312A (ja) | 2000-10-13 | 2002-04-26 | Yazaki Corp | 補機モジュールおよびその製造方法 |
JP5241312B2 (ja) * | 2008-05-09 | 2013-07-17 | コーデンシ株式会社 | フォトセンサ |
JP6097020B2 (ja) | 2012-06-04 | 2017-03-15 | 株式会社キーエンス | 光学センサ |
JP6006108B2 (ja) | 2012-12-20 | 2016-10-12 | 株式会社アルファ | 光センサユニット |
CN203364859U (zh) | 2013-04-24 | 2013-12-25 | 欧姆龙株式会社 | 光电传感器用支架结构 |
JP6094361B2 (ja) | 2013-04-24 | 2017-03-15 | オムロン株式会社 | フォトセンサ |
-
2017
- 2017-01-24 JP JP2017010235A patent/JP6769314B2/ja active Active
- 2017-10-06 US US15/726,391 patent/US10386227B2/en active Active
- 2017-10-16 CN CN201710957840.0A patent/CN108346864B/zh active Active
- 2017-10-24 DE DE102017124792.0A patent/DE102017124792B4/de active Active
Also Published As
Publication number | Publication date |
---|---|
JP2018120911A (ja) | 2018-08-02 |
US10386227B2 (en) | 2019-08-20 |
DE102017124792A1 (de) | 2018-07-26 |
DE102017124792B4 (de) | 2023-11-09 |
CN108346864A (zh) | 2018-07-31 |
US20180209843A1 (en) | 2018-07-26 |
CN108346864B (zh) | 2019-08-27 |
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