JP6759062B2 - How to collect chips when cutting in water - Google Patents

Description

The present invention relates to a method for efficiently recovering chips generated when a cutting object is cut in water, and in particular, a cyclone type for chips generated by water jet cutting, abrasive water jet cutting, or boring. Involved in how to efficiently collect with a collector.

When the object to be cut is cut in water, some kind of chips are generated by any cutting method. For example, when water jet cutting (hereinafter referred to as "WJ cutting") is used, chips generated from the cutting target float in water, and an abrasive material (abrasive material) is added to the water jet and sprayed. When brazing water jet cutting (hereinafter referred to as "AWJ cutting") is used, the abrasive material floats in water in addition to the chips.

As a known technique for recovering and removing these suspended substances in water, there is a technique for collecting suspended substances by combining a cyclone separator in the first stage and a filter in the second stage. For example, in FIG. 1 and the like of Patent Document 1, by providing a two-stage collecting device of a multi-stage cyclone separator and a filter, a suspended matter (chip) having a small particle size and a suspended matter (abrasive material) having a large particle size are provided. ) Are collected separately, and suspended matter with a small particle size is also collected by the multi-stage cyclone separator in the previous stage to reduce the load on the filter in the latter stage, thereby reducing the filter replacement work and reducing the man-hours. The technique to be attempted is disclosed (such as paragraph 0031 of the same document).

Japanese Patent No. 4919694

In the above-mentioned prior art, a filter is provided on the fluid outlet side of the multi-stage cyclone separator to improve the collection efficiency of suspended matter having a small particle size in the multi-stage cyclone separator in the previous stage, and to collect the filter in the latter stage. The load is reduced. Further, when the differential pressure of the filter becomes large, the differential pressure can be recovered by backwashing, so that the filter replacement work can be postponed. However, in order to recover the performance of the filter, there is a problem that the backwashing work of the filter occurs at predetermined time intervals, and the cutting work is interrupted each time.

An object of the present invention is to provide a chip collecting method at the time of cutting in water, which further improves the collecting efficiency of suspended matter (chips) having a small particle size in a cyclone type collector. As a result of this, it is possible to omit the filter in the latter stage, and when there is a filter in the latter stage, it is an object of the present invention to provide a chip collecting method at the time of cutting in water which can reduce the frequency of replacement of the filter.

In order to solve the above problems, the chip collecting method at the time of cutting in water of the present invention is a method of collecting chips generated when a cutting target is cut in water with a cyclone type collecting machine, and cutting. A coating step of covering the surface of the cutting target with an adsorbent layer having a color different from that of the cutting target before the start, a cutting step of cutting the cutting target covered with the adsorbent layer, and floating matter in water generated in the cutting step. It is assumed that the collection process for collecting the waste is provided.

According to the present invention, the collection efficiency when collecting chips generated by underwater cutting with a cyclone type collector is improved. Further, if there is a filter after the cyclone type collector, the frequency of filter replacement can be reduced.

Explanatory drawing which shows the schematic positional relationship of the primary cutting place and the secondary cutting place of a shroud in a boiling water nuclear power plant. The flow chart which shows the procedure of underwater cutting and chip collection in Example 1. FIG. The explanatory view of the method of covering the surface of the object to be cut with the adsorbent layer in Example 1. The explanatory view which shows the apparatus configuration at the time of cutting and collecting chips in Example 1. FIG. Explanatory drawing which shows the outline structure at the time of starting to cut a seafloor deposit in Example 2. Explanatory drawing explaining the continuation situation of cutting of the seafloor deposit in Example 2. Explanatory drawing explaining the situation in which the surface layer of the submarine deposit cut in Example 2 was collected. Explanatory drawing explaining the situation in which the surface layer of the submarine deposit cut in Example 2 was continuously collected. The explanatory view explaining the work of installing a boring machine on the submarine deposit in Example 3 and covering the surface of the deposit with an adsorbent. Explanatory drawing explaining the work of cutting a deposit with a bit in Example 3. An explanatory view illustrating a state in which a bit is pulled out after cutting to a predetermined depth in the third embodiment. The explanatory view explaining the method of collecting the chips in a boring hole after collecting a core in Example 3. FIG.

Hereinafter, examples of the present invention will be described with reference to the drawings.

The method of collecting chips at the time of cutting in water according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 4. This embodiment is an example of efficiently collecting chips generated when the shroud of a boiling water nuclear power plant is secondarily cut by a cyclone type collector.

First, the approximate positional relationship between the primary cutting location and the secondary cutting location of the shroud 1 will be described with reference to FIG. When shroud 1 installed inside the reactor pressure vessel 3, instead of shredding inside the reactor pressure vessel 3, it is moved to the dryer separator pool (DSP) 7 and then WJ cut or A method of shredding by AWJ cutting is adopted. Hereinafter, the cutting that separates the shroud 1 from the reactor pressure vessel 3 is referred to as a primary cutting, and the cutting that shreds the shroud 1 in the DSP 7 is referred to as a secondary cutting.

In order to perform primary cutting, after the reactor is shut down, the reactor pressure vessel 3 is opened, the equipment inside the reactor such as the dryer and separator is taken out, and a cutting processing device for separating the shroud 1 is installed to perform the primary cutting of the shroud 1. Disconnect. After that, the cut shroud 1 is moved to the DSP 7 through the reactor well 5 by the overhead crane 8 and installed on the gantry 9 arranged in the DSP 7. When the shroud 1 is installed in the DSP 7, the gate is closed and the reactor well 5 and the DSP 7 are separated.

Then, in DSP7, the shroud 1 is secondarily cut by using the chip collecting method at the time of underwater cutting of this example described later. Then, the shroud secondarily cut by WJ cutting or AWJ cutting is stored in a transport container having a shielding ability, withdrawn from DSP7, and stored in a sight bunker pool (not shown).

Next, the secondary cutting of this embodiment will be described in detail with reference to the flowchart of FIG. 2 and FIGS. 3 and 4. First, the shroud 1 to be cut is installed at the cutting place (on the gantry 9) (S1), and then a coating step of covering the surface of the shroud 1 with an adsorbent is executed (S2).

FIG. 3 is a perspective view illustrating a step of coating the surface of the shroud 1 with the adsorbent layer 32. As shown here, a thin metallic mold 31 is installed at the upper end of the shroud 1, and an adsorbent layer 32 is formed on the surface of the shroud 1 by pouring a stock solution of the adsorbent into the shroud 1 for reaction. The adsorbent used here is a substance having the property of adsorbing chips that have come into contact with the surface. Further, it is insoluble in water and has a sticky surface, and specifically, it is formed of starch, a slime made of starch and borax, and the like.

FIG. 4 shows an apparatus configuration for secondary cutting work of the shroud 1 in the DSP 7. As shown in FIG. 3, the surface of the cut portion of the shroud 1 installed on the gantry 9 is covered with the adsorbent layer 32. High-pressure water pressurized by the cutting device 21 or high-pressure water to which an abrasive material is added is sprayed from a cutting nozzle 23 attached to the tip of the scanning mechanism 22, and the shroud 1 is WJ-cut or WJ-cut from above the adsorbent layer 32. AWJ disconnection (S3). If the adsorbent layer 32 has a hardness that does not deform due to its own weight, WJ (AWJ) cutting may be performed after removing a part of the mold 31, but from above the mold 31 WJ (AWJ) cutting may be performed.

At this time, a part of the chips generated from the shroud 1 is adsorbed on the cut surface of the adsorbent layer 32, so that it can be recovered together with the adsorbent layer 32. Further, when the adsorbent piece in which the adsorbent layer 32 is shredded is suspended in water, when it comes into contact with chips or other adsorbent pieces also floating in water, the particles are in a state of being bound to each other. A floating substance 24 having a large diameter is generated.

Then, when the pump 28 is driven, the suspended matter 24 having an increased particle size is sucked into the collector 25 together with water, then settled and separated by the cyclone type collector 26, and collected in the lower container 27. To. In the cyclone type collector 26, the larger the particle size of the suspended matter 24, the easier it is to settle. Therefore, as in this embodiment, by promoting the binding of the suspended matter 24 using an adsorbent, the cyclone type collector 26 It is possible to improve the collection efficiency of chips in. That is, even when the filter 29 is arranged after the cyclone type collector 26, the collection load of the filter 29 can be reduced.

When the cutting of a certain part is completed, it is confirmed whether all the planned cuttings are completed (S4). Then, when all the cutting is completed, the cutting work of the shroud 1 is completed, and the shroud 1 is stored in the transport container.

On the other hand, if the shroud 1 remains cut, it is confirmed whether the filter 29 installed after the cyclone type collector 26 can be continuously used (S5), and if it can be continuously used, the next cutting work is performed. If it cannot be used continuously, the filter 29 is replaced (S6), and then the cutting operation is restarted. Since the differential pressure rises when the filter 29 is clogged, it can be determined by monitoring the differential pressure whether or not it can be used continuously.

According to the chip collecting method at the time of underwater cutting of the present embodiment described above, the efficiency of collecting chips by the cyclone type collecting machine 26 is improved, so that the chips are installed after the cyclone type collecting machine 26. It is possible to reduce the frequency of replacement of the filter 29.

Next, the chip collection method at the time of cutting in water according to the second embodiment of the present invention will be described with reference to FIGS. 5A to 5D. This example is an example in which chips containing rare metals are also collected and effectively utilized when mining the submarine deposit 52 containing rare metals while cutting WJ. It should be noted that the points common to the first embodiment will be omitted.

FIG. 5A is a diagram showing an apparatus configuration when WJ cutting the submarine deposit 52. When the seabed deposit 52 containing a rare metal exists at the bottom of the sea 51, the mold 31 is arranged on the seabed deposit 52, and the stock solution of the adsorbent is poured into the mold 31 to form the adsorbent layer 32. The adsorbent of this example is colored orange, for example, so that it has good visibility even in seawater.

After that, high-pressure water pressurized by a cutting device 21 (not shown) is sprayed from a cutting nozzle 23 attached to the tip of the scanning mechanism 22 to form an oblique cut surface on the seabed deposit 52 from above the adsorbent layer 32. .. Next, the scanning mechanism 22 and the cutting nozzle 23 are moved to the positions shown in FIG. 5B to form a cutting surface on the seabed deposit 52 from above the adsorbent layer 32.

At this time, a part of the chips generated from the submarine deposit 52 is adsorbed on the cut surface of the adsorbent layer 32 as in the first embodiment, so if the adsorbent layer 32 is recovered, the chips can also be recovered together. .. Further, when the adsorbent piece in which the adsorbent layer 32 is shredded is suspended in water, when it comes into contact with chips or other adsorbent pieces also floating in water, the particles are in a state of being bound to each other. A floating substance 24 having a large diameter is generated. The suspended matter 24 having an increased particle size is sucked into the collector 25 together with water, then settled and separated by the cyclone type collector 26, and collected in the lower container 27. In the cyclone type collector 26, the larger the particle size of the suspended matter 24, the easier it is to settle. Therefore, as in this embodiment, by promoting the binding of the suspended matter 24 using an adsorbent, the cyclone type collector 26 The efficiency of collecting chips in the above can be improved, and the recovery rate of rare metals can be increased.

FIG. 5C schematically shows a two-dimensional cross-sectional view in which the cut deposit 81 and the cut adsorbent layer 82 above the two cut surfaces are collected. In reality, since the ore deposit spreads three-dimensionally, the submarine deposit 52 and the adsorbent layer 32 above the portion where at least three or more cut surfaces intersect are to be collected.

When the WJ cutting and the collection of the deposit / adsorbent layer shown in FIGS. 5A to 5C are repeated, the uppermost layer of the submarine deposit 52 is collected and the second layer becomes the second layer, as schematically shown in FIG. 5D. It becomes exposed. If the WJ cutting of the second and subsequent layers is continued without the adsorbent layer 32, the efficiency of collecting chips will decrease. Therefore, the adsorbent stock solution is poured into the exposed portion of the seabed deposit 52 to replenish the adsorbent layer 32. Do the work to do. In Example 2, the adsorbent layer 32 is colored orange and has excellent visibility even in seawater. Therefore, the adsorbent layer is collected to confirm the exposed portion of the deposit, and the adsorbent layer is appropriate. It becomes easy to confirm whether or not it has been replenished.

According to the second embodiment described above, in addition to the effect of the first embodiment, the recovery rate of rare metals can be improved.

Next, the chip collection method at the time of cutting in water according to the third embodiment of the present invention will be described with reference to FIGS. 6A to 6D. In this embodiment, when the submarine deposit 52 containing a rare metal is mined by core boring, chips containing a rare metal are also collected and effectively utilized. It should be noted that the points common to the first or second embodiment will be omitted.

FIG. 6A is an explanatory diagram illustrating an operation of installing a boring machine 93 on the submarine deposit 52 and covering the surface of the submarine deposit 52 with an adsorbent. As shown here, when the seabed deposit 52 containing rare metals exists on the seabed of the sea 51, the boring machine 93 is installed by adjusting the inclination of the seating platform 94 to the seabed topography. Then, the mold 31 is extended from the lower part of the boring machine 93 to form a weir, and the stock solution of the adsorbent is poured into the weir to form the adsorbent layer 32.

Then, as shown in FIG. 6B, the submarine deposit 52 is cut from above the adsorbent layer 32 with a cylindrical rotating core bit 102. Since a part of the chips generated from the submarine deposit 52 is adsorbed on the cut surface of the adsorbent layer 32, if the adsorbent layer 32 is recovered, the chips can be recovered together. Further, when the adsorbent piece in which the adsorbent layer 32 is shredded is suspended in water, when it comes into contact with chips or other adsorbent pieces also floating in water, the particles are in a state of being bound to each other. A floating substance 24 having a large diameter is generated. The suspended matter 24 having an increased particle size is sucked into the collector 25 together with water, then settled and separated by the cyclone type collector 26, and collected in the lower container 27. In the cyclone type collector 26, the larger the particle size of the suspended matter 24, the easier it is to settle. Therefore, as in this embodiment, by promoting the binding of the suspended matter 24 using an adsorbent, the cyclone type collector 26 The efficiency of collecting chips in the above can be improved, and the recovery rate of rare metals can be increased.

After that, when the core bit is pulled out after cutting to a predetermined depth, a cylindrical core 103 is formed on the surface of the submarine deposit 52 as shown in FIG. 6C. When the core 103 is gripped by a manipulator (not shown) and a lateral force is applied, the root portion of the core 103 is broken, so that the core 103 can be collected from the submarine deposit 52.

FIG. 6D is a diagram showing a method of collecting chips in the boring hole 104 after collecting the core 103. A part of the remaining adsorbent layer 32 is grasped by a manipulator (not shown), and the grasped adsorbent strips are thrown into the boring hole 104. When high-pressure water is injected from the nozzle 105 toward the boring hole 104, an irregular pulsating flow is generated, and the chips remaining in the boring hole 104 start to move along with the pulsating flow. A plurality of chips are adsorbed on the adsorbent strips to form suspended matter having a large particle size, and then fly out of the boring hole 104. The suspended matter that has come out is sucked by the collector 25, settled and separated by the cyclone type collector 26, and collected in the container 27. In this way, chips containing precious rare metals remaining in the boring hole can be efficiently collected by the cyclone type collector 26 and effectively utilized.

The same effect as in Example 2 described above can also be obtained by the present embodiment described above.

The present invention is not limited to the above-described examples, and includes various modifications. For example, the above-described embodiment has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to those having all the described configurations. Further, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. Further, it is possible to add, delete, or replace other configurations with respect to the configurations of each embodiment.

1 ... shroud,
3 ... Reactor pressure vessel,
5 ... Reactor well,
6 ... Fuel pool,
7 ... Dryer separator pool (DSP),
8 ... Overhead crane,
9 ... gantry,
21 ... Cutting device,
22 ... Scanning mechanism,
23 ... Cutting nozzle,
24 ... floating matter,
25 ... Collector,
26 ... Cyclone type collector,
27 ... container,
28 ... Pump,
29 ... filter,
31 ... Formwork,
32 ... Adsorbent layer,
51 ... the sea,
52 ... Undersea deposit,
81 ... Cut deposit,
82 ... Cut adsorbent layer,
93 ... Boring machine,
94 ... Seating table,
102 ... Rotating core bit,
103 ... Core,
104 ... Boring hole,
105 ... Nozzle

Claims (6)

It is a method of collecting chips generated when the object to be cut in water with a cyclone type collector.
A coating step of covering the surface of the object to be cut with an adsorbent layer having a color different from that of the object to be cut before the start of cutting.
A cutting step of cutting the cutting target covered with the adsorbent layer, and
A collection process for collecting suspended matter in water generated in the cutting process, and
A method for collecting chips at the time of cutting in water, which comprises having. In the method for collecting chips at the time of cutting in water according to claim 1.
A method for collecting chips during cutting in water, wherein the adsorbent layer is formed of an adsorbent colored in a color that is easily visible in water. In the method for collecting chips at the time of cutting in water according to claim 1.
The adsorbent layer is
When cut at the same time as the object to be cut, it is shredded into water-insoluble cutting adsorbent pieces.
When the shredded adsorbent piece comes into contact with the chip, the chip adsorbs to the adsorbent piece and
A method for collecting chips during cutting in water, wherein each adsorbent piece is a material that becomes a floating substance in water in a state where a plurality of chips are adsorbed. In the method for collecting chips during underwater cutting according to claim 1 or 3.
A method for collecting chips during underwater cutting, wherein the cutting step is performed by water jet cutting or abrasive water jet cutting. In the method for collecting chips during underwater cutting according to claim 1 or 3.
The cutting step is a method for collecting chips at the time of cutting in water, which is performed by boring. In the method for collecting chips at the time of cutting in water according to claim 5.
A method for collecting chips during underwater cutting, which comprises a step of injecting high-pressure water into the boring hole in order to collect the chips remaining in the boring hole after the cutting step by boring.

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