JP6748024B2 - Component mounting device and component mounting system - Google Patents

Description

The present invention relates to a component mounting apparatus and a component mounting system, and more particularly, to a component mounting apparatus and a component mounting system including a static eliminator that emits ions to a static elimination target component.

2. Description of the Related Art Conventionally, there is known a component mounting apparatus including a static eliminator unit (static eliminator) that emits ions to an electronic component (part) that is a target of static eliminator (for example, see Patent Document 1).

The component mounting apparatus described in Patent Document 1 is supplied by a tape feeder (component supply unit) that supplies electronic components, a substrate transport unit that transports a substrate, and a substrate that is transported by the substrate transport unit by the tape feeder. A mounting head (head unit) for mounting electronic components. Further, the component mounting apparatus described in Patent Document 1 includes a neutralization unit that neutralizes and neutralizes static electricity generated on the substrate transported by the substrate transport unit.

In the component mounting apparatus described in Patent Document 1, the substrate transfer speed of the substrate transfer unit is adjusted based on the surface potential of the substrate in order to sufficiently neutralize the static electricity of the substrate transferred to the substrate transfer unit. ing. That is, when the surface potential of the substrate is high, the speed of the substrate transfer unit is low, and when the surface potential of the substrate is low, the speed of the substrate transfer unit is high.

JP, 2006-86338, A

However, in the component mounting apparatus of Patent Document 1 described above, when the surface potential of the substrate is large, there is a problem in that the work time is likely to increase due to the substrate transport speed of the substrate transport unit being slower than usual. is there. For this reason, it is desired to suppress an increase in working time that may occur due to static elimination of the substrate.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a component mounting apparatus and a component mounting system capable of suppressing an increase in working time due to static elimination of a board. Is to provide.

In order to achieve the above object, a component mounting apparatus according to a first aspect of the present invention includes a component supply unit that supplies a plurality of types of components to be mounted on a board, and a plurality of types of components that are mounted on the board from the component supply unit. Head unit, a static eliminator that discharges ions from the substrate by discharging ions, and a static eliminator that eliminates static electricity from the substrate, while static-sensitive components among multiple types of components are mounted on the substrate of other types of components. And a control unit configured to control mounting on a substrate later. Here, the static electricity-sensitive component means a component that is apt to cause electrostatic breakdown when a discharge current flows between the component and the component at a high voltage.

In the component mounting apparatus according to the first aspect of the present invention, as described above, components that are more sensitive to static electricity are mounted on the substrate later in the mounting sequence. Can be implemented. As a result, it is possible to reduce the charge amount of the board when a component susceptible to static electricity is mounted on the board without adjusting the transfer speed of the board. Therefore, it is possible to suppress an increase in the work time due to the charge removal of the board. can do. Further, since the charge amount of the board can be reduced, the electrostatic breakdown of the components mounted on the board can be suppressed accordingly.

In the component mounting apparatus according to the first aspect described above, preferably, the control unit is configured to perform control for mounting the components weak against static electricity on the substrate in order from the component with the highest withstand voltage among the components weak against static electricity. There is. According to this structure, during the period when the static electricity removal time of the board is short, the component with high withstand voltage among the parts weak against static electricity is mounted on the board, and when the static electricity removal time of the board is long, the breakdown voltage among the parts weak against static electricity is increased. Small components can be mounted on the board. In this way, the size of the withstand voltage of the components to be mounted is changed according to the length of the static elimination time of the board, so the discharge current flows at a high voltage between the board and the parts that are sensitive to static electricity. It is possible to effectively suppress electrostatic breakdown of parts that are susceptible to static electricity.

In the component mounting apparatus according to the first aspect described above, preferably, the control unit first mounts a component of a non-countermeasure group that is stronger against static electricity than a component weak against static electricity and does not take measures against static electricity, and then implements countermeasures against static electricity. It is configured to control the mounting of the components of the countermeasure group including the components that are weak against static electricity. According to this structure, the board can be further neutralized by the time required for mounting the parts of the non-countermeasure group that does not take measures against static electricity until the parts susceptible to static electricity are mounted on the board. This can prevent the potential difference between the charge amount of the board and the charge amount of the static-sensitive component from increasing when mounting the static-sensitive component on the board. It is possible to further suppress the electrostatic breakdown of the parts that are weak against static electricity due to the discharge current flowing at the voltage.

In this case, preferably, the control unit sets the mounting order of the plurality of types of components in the non-countermeasure group so that the mounting work time is the shortest, and the control unit within the countermeasure group is arranged so that the lower the withstand voltage is, the later. It is configured to set the mounting order of the parts sensitive to static electricity. With this configuration, it is possible to minimize the mounting work time when multiple types of components in the non-countermeasure group are mounted on the board, and to further suppress electrostatic breakdown of static-sensitive components in the countermeasure group. You can

In the component mounting apparatus according to the first aspect described above, which is provided with a static eliminator that removes static electricity from the board, preferably, the controller removes static electricity from the board by the static remover and removes static electricity from a plurality of types of components before mounting on the board. It is configured to perform control. According to this structure, not only is the charge eliminating unit neutralized the electric charge of the substrate to reduce the charge amount of the substrate, but also the charge eliminating unit is used to neutralize the charge of the plural types of components and the charge amount of the plural types of components. Can be made smaller. As a result, the difference between the charge amount of the board and the charge amount of the multiple types of components can be made smaller, so that when mounting multiple types of components on the substrate, electrostatic breakdown of the multiple types of components can be further suppressed. can do.

In this case, preferably, further comprises a static elimination station unit arranged at a position where the ions emitted from the static elimination unit are more likely to hit than the component supply unit, and the control unit, before mounting the component weak against static electricity on the substrate, It is configured to perform control so that parts that are sensitive to static electricity are moved to the static elimination station in advance. With this configuration, it is possible to eliminate static electricity-sensitive components in advance in the static elimination station portion where the static elimination portion is more likely to perform static elimination than the component supply portion. You can As a result, it is possible to further reduce the deviation of the charge amount of the static-sensitive component, so that when the static-sensitive component is mounted on the substrate, the electrostatic breakdown of the static-sensitive component can be further suppressed.

A component mounting system according to a second aspect of the present invention includes a plurality of component mounting apparatuses including at least one component mounting apparatus that shares a plurality of types of components and mounts the components on a substrate, and discharges ions to neutralize the substrate. A component mounting device and a control device for controlling each of the plurality of component mounting devices are provided. The control device removes static electricity from the substrate by the static elimination unit while mounting a component weak to static electricity on the substrate in the component mounting device on the downstream side. It is configured to perform control. Here, the component mounting device on the downstream side is a concept indicating a component mounting device arranged downstream of the component mounting device in which the board is first loaded.

In the component mounting apparatus according to the second aspect of the present invention, as described above, it is possible to mount a component that is weak against static electricity on a board that has been neutralized by the neutralization unit until being conveyed to the downstream component mounting apparatus. As a result, it is possible to reduce the charge amount of the board when mounting a component that is susceptible to static electricity on the board without adjusting the transfer speed of the board. Therefore, it is possible to suppress an increase in the work time due to the charge removal of the board. You can

In the component mounting system device according to the second aspect, preferably, the control device eliminates static electricity in the component mounting device on the upstream side of the component mounting device that mounts a component that is sensitive to static electricity, while discharging the substrate by the static elimination unit. It is configured to control that a component that is more resistant to static electricity than a weak component is mounted on the board. With this configuration, in the component mounting device on the upstream side where the charge removal of the board has not progressed, components that are resistant to static electricity are mounted, and in the component mounter on the downstream side where the charge removal of the substrate has progressed, components that are weak to static electricity are mounted. Can be implemented. As a result, when mounting components that are sensitive to static electricity on the board, it is possible to suppress an increase in the difference between the charge amount of the substrate and the charge amount of components that are sensitive to static electricity. can do.

In the component mounting system device according to the second aspect, preferably, the controller has the largest standby time for waiting the substrate to be carried out to the next component mounting device among the plurality of component mounting devices on the upstream side. In the component mounting apparatus on the side, the static elimination unit controls the static elimination of the substrate. According to this structure, the component mounting apparatus having the longest standby time is used to remove the electric charge of the board from the component mounting apparatuses having the longest standby time. A large waiting time can be effectively used as the static elimination time.

According to the present invention, as described above, it is possible to suppress an increase in working time due to static elimination of the substrate.

1 is a plan view showing the outline of a component mounting apparatus according to a first embodiment of the present invention. It is sectional drawing which followed the 100-100 line of FIG. It is a block diagram showing an outline of a control part of a component mounting device by a 1st embodiment of the present invention. FIG. 3 is a schematic plan view showing the tip portion of the tape feeder of the component mounting apparatus according to the first embodiment of the present invention. It is the figure which showed typically the relationship between the withstand voltage of an electronic component and the 1st parameter. It is the figure which showed typically the relationship between the ease of mounting an electronic component on the substrate, and the second parameter. FIG. 7A is a diagram schematically showing a state in which electronic components resistant to static electricity are arranged based on the second parameter. FIG. 7B is a diagram schematically showing a state in which electronic components having a first parameter of 3 among static-sensitive electronic components are arranged based on the second parameter. FIG. 7C is a diagram schematically showing a state where electronic components vulnerable to static electricity having a first parameter of 4 are arranged. FIG. 7D is a diagram schematically showing a state in which electronic components having a first parameter of 5 among the electronic components weak against static electricity are arranged based on the second parameter. 6 is a flowchart showing a setting process of the component mounting apparatus according to the first embodiment of the present invention. It is a top view showing the outline of a component mounting device by a 2nd embodiment of the present invention. FIG. 11 is a sectional view taken along the line 110-110 in FIG. 10. FIG. 9 is a schematic plan view showing a tip end portion of a tape feeder and a static elimination station portion of a component mounting device according to a second exemplary embodiment of the present invention. 11 is a timing chart showing the static elimination time of an electronic component (second component) weak against static electricity and the static elimination time of a substrate when the static elimination station of the component mounting apparatus according to the second exemplary embodiment of the present invention is used. 8 is a flowchart showing a component mounting process of the component mounting apparatus according to the second embodiment of the present invention. It is a top view showing the outline of the component mounting system by a 3rd embodiment of the present invention. FIG. 15A is a schematic plan view showing the tip portion of the tape feeder of the upstream component mounting apparatus. FIG. 15B is a diagram schematically showing a state in which electronic components resistant to static electricity are arranged based on the second parameter. It is a typical top view showing the tip part of the tape feeder of the downstream side component mounting device by a 3rd embodiment of the present invention. FIG. 11 is a diagram schematically showing a state in which electronic components weak against static electricity are arranged based on a second parameter in the component mounting system according to the third exemplary embodiment of the present invention. FIG. 13 is a diagram schematically showing a state in which electronic components vulnerable to static electricity are arranged based on a first parameter and a second parameter in the component mounting system according to the third exemplary embodiment of the present invention. It is a top view showing an outline of a component mounting system concerning a 4th embodiment of the present invention. It is a timing chart which showed the working time of the 1st component mounting apparatus, the working time of the 2nd component mounting apparatus, and the working time of the 3rd component mounting apparatus in the component mounting system by 4th Embodiment of this invention.

Embodiments embodying the present invention will be described below with reference to the drawings.

[First Embodiment]
The configuration of the component mounting apparatus 1 according to the first embodiment of the present invention will be described with reference to FIGS. In the component mounting apparatus 1 of the first embodiment, the mounting order of the electronic components M by the mounting head 51 is the arrangement order based on the withstand voltage. The electronic component M is an example of the "component" in the claims.

(Structure of component mounting device)
As shown in FIG. 1, the component mounting apparatus 1 is configured to mount an electronic component M on a substrate K by a mounting head 51 that is horizontally movable. Specifically, the component mounting apparatus 1 includes a base 2, a pair of conveyors 3, a plurality of tape feeders 4 arranged side by side in front, rear, left, and right of the component mounting apparatus 1, and a head unit 5. The support unit 6, the pair of rail units 7, the component recognition camera 8, the board recognition camera 9, the charge removal unit 10, and the control unit 11 (see FIG. 3). Here, the direction in which the substrate K is conveyed by the pair of conveyors 3 is the X direction, the direction in the horizontal direction perpendicular to the X direction is the Y direction, and the direction orthogonal to the X direction and the Y direction is the Z direction.

<Conveyor>
The pair of conveyors 3 extends in the transport direction (X direction) of the substrate K and transports the substrate K in the X direction. The pair of conveyors 3 conveys the substrate K loaded from the X2 direction side to a predetermined work position W. After the work, the pair of conveyors 3 carry out the worked substrate K to the X1 direction side. Further, at the time of work, the substrate K is fixed at a predetermined position above the base 2 by the clamp mechanism.

<Tape feeder>
The tape feeder 4 is configured to supply the electronic component M mounted on the substrate K. Specifically, the tape feeder 4 includes the tape 41, and a plurality (two) are arranged side by side in the X direction on the front side (Y2 direction side) and the rear side (Y1 direction side) of the pair of conveyors 3. There is. Each of the plurality (four) of tape feeders 4 includes a tape 41 on which electronic components M such as ICs, transistors, and capacitors mounted on a substrate K are arranged. Then, the tape feeder 4 intermittently supplies the electronic component M to a predetermined component supply position near the pair of conveyors 3.

As shown in FIG. 2, the tape feeder 4 holds a reel 42 around which a tape 41 holding an electronic component M at a predetermined interval is wound. The tape feeder 4 supplies the electronic component M from the tip portion by rotating the reel 42 and sending out the tape 41 on which the electronic component M is arranged. Each tape feeder 4 is electrically connected to the controller 11 (see FIG. 3) via a connector (not shown). As a result, each tape feeder 4 sends the tape 41 from the reel 42 based on the control signal from the control unit 11. The tape feeder 4 is an example of the "component supply unit" in the claims.

<Rail part>
As shown in FIG. 1, the rail portion 7 is configured to be able to move the support portion 6 in a direction (Y direction) perpendicular to the transport direction. Specifically, each of the pair of rail portions 7 is formed so as to extend in the Y direction. The pair of rail portions 7 are fixed to both ends of the base 2 in the X direction. Each of the pair of rail portions 7 includes a ball screw shaft 7a extending in the Y direction, a Y-axis motor 7b provided on the ball screw shaft 7a, and a guide rail 7c. The Y-axis motor 7b rotates the corresponding ball screw shaft 7a. The support portion 6 is attached to the ball screw shaft 7a via a ball nut, and when each ball screw shaft 7a is rotated by each Y-axis motor 7b, the support portion 6 extends along the pair of rail portions 7 in a direction perpendicular to the transport direction (Y direction). ) To move.

<Supporting part>
As shown in FIG. 1, the support portion 6 is configured to move the head unit 5 in the transport direction (X direction). Specifically, the support portion 6 includes a ball screw shaft 6a extending in the X direction, an X-axis motor 6b rotating the ball screw shaft 6a, and a guide rail (not shown) extending in the X direction. The head unit 5 is attached to the ball screw shaft 6a via a ball nut, and moves in the transport direction (X direction) along the support portion 6 when the ball screw shaft 6a is rotated by the X-axis motor 6b.

With such a configuration, the head unit 5 is configured to be movable above the base 2 in the horizontal direction (X direction and Y direction). As a result, the head unit 5 can move above the tape feeder 4 and suck the electronic component M supplied from the tape feeder 4. Further, the head unit 5 can move above the substrate K on the pair of conveyors 3 to mount the sucked electronic component M on the substrate K, for example.

<head unit>
As shown in FIG. 2, the head unit 5 is configured to perform the mounting work of the electronic component M on the substrate K on the pair of conveyors 3. The head unit 5 is attached to the base 2 via the support 6 and the pair of rails 7. The head unit 5 is arranged above the pair of conveyors 3 and the tape feeder 4 (Z1 direction).

As shown in FIGS. 1 and 2, the head unit 5 has a mounting head 51, a ball screw shaft 5a, a Z-axis motor 5b, and an R-axis motor 5c (see FIG. 3). The plurality of mounting heads 51 are linearly arranged in a line along the transport direction (X direction). The ball screw shaft 5a and the Z-axis motor 5b are provided in each of the plurality of mounting heads 51.

The mounting head 51 is configured to adsorb the electronic component M arranged on the tape 41 and mount the electronic component M on the substrate K. Specifically, as shown in FIG. 2, the mounting head 51 has a nozzle 52 attached to the tip (lower end) thereof. The mounting head 51 is configured to be able to adsorb and hold the electronic component M supplied from the tape feeder 4 by the negative pressure generated at the tip of the nozzle 52 by a negative pressure generator (not shown). Further, the mounting head 51 is configured to be able to mount the sucked electronic component M on the mounting surface of the substrate K by the positive pressure generated at the tip of the nozzle 52 by a positive pressure generator (not shown). The R-axis motor 5c is configured to rotate the mounting head 51 around the central axis of the nozzle 52 (around the Z-axis).

The ball screw shaft 5a extends vertically as shown in FIG. The Z-axis motors 5b rotate the corresponding ball screw shafts 5a. The mounting head 51 is attached to the ball screw shaft 5a via a ball nut, and when the ball screw shaft 5a is rotated by the Z-axis motor 5b, the mounting head 51 can move vertically along the ball screw shaft 5a.

<Parts recognition camera>
As shown in FIGS. 1 and 2, the component recognition camera 8 is configured to image the electronic component M adsorbed by the nozzle 52 of the mounting head 51 from below (Z2 direction) before mounting the electronic component M. ing. Specifically, the component recognition camera 8 is provided on the base 2 in the vicinity of the tape feeder 4.

<Board recognition camera>
As shown in FIG. 2, the board recognition camera 9 is configured to take an image of the position recognition mark on the board K prior to mounting the electronic component M from above (Z1 direction). The position recognition mark is a mark for recognizing the position of the substrate K. Specifically, the board recognition camera 9 is provided at the lower end (Z2 direction) of the back surface (Y1 direction) of the head unit 5. The board recognition camera 9 is movable in the horizontal direction (X direction and Y direction) above the base 2 together with the head unit 5.

<Static elimination unit>
As shown in FIG. 2, the neutralization unit 10 is configured to neutralize the electronic component M to be neutralized by emitting positive and negative ions. Specifically, the static eliminator 10 has a pipe-shaped electrode casing 10a having an ion emission port 10c, an electrode needle 10b to which a high voltage current is supplied from an amplifier (not shown), and a wind inside the electrode casing 10a. It has a blowing means 10d. In the static eliminator 10, a high-voltage current is passed through the electrode needle 10b, and positive and negative ions generated by ionizing air are emitted from the ion emission port 10c by the blower unit 10d and applied to the substrate K and the electronic component M.

<Control part>
As shown in FIG. 3, the control unit 11 includes a CPU 11a (Central Processing Unit), a ROM 11b (Read Only Memory), a RAM 11c (Random Access Memory), and the like, and is configured to control the operation of the component mounting apparatus 1. ing. Specifically, the control unit 11 includes the pair of conveyors 3, the head unit 5, the support unit 6, the pair of rail units 7, the component recognition camera 8, the board recognition camera 9, the tape feeder 4, the static elimination unit 10, and the like. , Control according to a program stored in advance. Further, the RAM 11c of the control unit 11 stores a program for executing a setting process 13 described later and a component mounting process 12 having a buffer process 213.

(Setting process)
In the component mounting apparatus 1, as shown in FIG. 8, the mounting order of the plurality of types of electronic components M on the substrate K is set by the setting process 13 based on the strength of each of the plurality of types of electronic components M against static electricity. To be done. The setting process 13 sets the mounting order of the plurality of types of electronic components M on the substrate K so that electrostatic damage of the electronic components M when mounted on the substrate K of the plurality of types of electronic components M can be suppressed. Further, the setting process 13 is set so that the mounting work time of the plurality of types of electronic components M is minimized. Here, the setting process 13 is performed in advance before the component mounting process 12.

As shown in FIG. 4, each tape feeder 4 arranged side by side has a tape 41, and a plurality of electronic components M of the same type are arranged on the tape 41. A plurality of types (five types) of electronic components M are arranged in the plurality of tape feeders 4. As an example, the plurality of types of electronic components M include a first component S1 having a withstand voltage of 300V, a second component C1 having a withstand voltage of 200V, a third component A1 having a withstand voltage of 100V, and a withstand voltage in order from the electronic component M at one end. A fourth part S2 having a voltage of 300V, a fifth part T1 having a withstand voltage of 400V, a sixth part B1 having a withstand voltage of 150V, a seventh part C2 having a withstand voltage of 200V, and an eighth part A2 having a withstand voltage of 100V. Here, as shown in FIG. 5, reference numerals A, B, C, S and T attached to the respective electronic components M represent withstand voltages 100V, 150V, 200V, 300V and 400V, respectively.

Further, in the following description, for convenience of explanation, as shown in FIG. 5, the first parameter corresponding to each withstand voltage is assigned to the plurality of types of electronic components M. Here, the first parameter has a smaller value as the withstand voltage increases. Here, with 200V as the threshold value D, the electronic component M having a withstand voltage of 200V or less is defined as an electronic component M which is weak against static electricity. The first parameter is 1 for the fifth component T1 having a withstand voltage of 400V, 2 for the first component S1 having a withstand voltage of 300V, 2 for the fourth component S2, 3 for the second component C1 having a withstand voltage of 200V, and 7th component C2. The sixth component B1 having a withstand voltage of 150V has a value of 4, the third component A1 having a withstand voltage of 100V has a value of 5, and the eighth component A2 has a value of 5.

In addition, in the following description, for convenience of description, as illustrated in FIG. 6, it is assumed that the plurality of types of electronic components M are assigned the second parameters corresponding to the short mounting work times. To do. Here, as an example, it is assumed that the second parameter has a smaller value as the mounting work time becomes shorter. The second parameter is 1 for the first part S1, 2 for the second part C1, 3 for the third part A1, 4 for the fourth part S2, 5 for the fifth part T1, and 5 for the sixth part B1. 6, the seventh component C2 is 7, and the eighth component A2 is 8.

As shown in FIG. 7, the control unit 11 executes the setting process 13 to remove the static electricity on the substrate K by the static elimination unit 10, and the electronic component M, which is more vulnerable to static electricity, out of the plurality of types of electronic components M, the later the substrate. It is configured to perform control implemented in K. Specifically, the control unit 11 is a countermeasure group including the electronic component M that is stronger against static electricity than the electronic component M that is weak against static electricity, and that follows the non-countermeasure group NC that does not take countermeasures against static electricity, and then performs the countermeasure against static electricity. The C is mounted on the substrate K. Since the electronic component M weak against static electricity is an electronic component M having a withstand voltage of 200 V (threshold value D) or less, the second component C1, the third component A1, the sixth component B1, and the seventh component C2 included in the countermeasure group C are included. And the eighth part A2. Since the electronic component M resistant to static electricity is the electronic component M having a withstand voltage of more than 200 V (threshold value D), the electronic component M includes the first component S1, the fourth component S2, and the fifth component T1 included in the non-countermeasure group NC. Has become. Here, among the plurality of electronic components M included in the non-countermeasure group NC, the mounting order of the electronic components M determined using the second parameter is the mounting order of the electronic components M determined using the first parameter. Used in preference to order. Further, among the electronic components M included in the countermeasure group C, the mounting order of the electronic components M determined using the first parameter has priority over the mounting order of the electronic components M determined using the second parameter. Used.

As shown in FIG. 7A, the control unit 11 is configured to set the mounting order of the plurality of types of electronic components M in the non-countermeasure group NC so that the mounting work time is the shortest. Specifically, the control unit 11 arranges the plurality of types of electronic components M in the non-countermeasure group NC, based on the second parameter, from the electronic component M having a smaller second parameter, in the ascending order of mounting. .. Since the values of the second parameter are 1 for the first part S1, 4 for the fourth part S2, and 5 for the fifth part T1, respectively, the values of the first part S1, the fourth part S2, and the fifth part T1 are, respectively. Arranged in order.

As shown in FIGS. 7(B) to 7(D), the control unit 11 controls, by the setting process 13, to mount the electronic components M, which are weak in static electricity, on the substrate K in order from the electronic component M having the highest withstand voltage. Is configured to do. Specifically, the setting process 13 sets the mounting order of each of the plurality of types of electronic components M in the countermeasure group C based on the first parameter. Furthermore, the setting processing 13 sets the mounting order of the plurality of types of electronic components M in the countermeasure group C within the same type based on the second parameter.

As shown in FIG. 7B, the first parameter is 3 for the second component C1 and the seventh component C2, and the mounting order is the earliest in the countermeasure group C. Since the second parameter is 2 for the second component C1 and 7 for the seventh component C2, the mounting order is such that the second component C1 comes first, and then the seventh component C2.

As shown in FIG. 7C, the first parameter is 4 for the sixth component B1, and the mounting order is second fastest in the countermeasure group C. Since the second parameter is 6 for the sixth component B1, the mounting order is next to the seventh component C2.

As shown in FIG. 7D, the first parameter is 5 for the third component A1 and the eighth component A2, and the mounting order is the latest in the countermeasure group C. Since the second parameter is 3 for the third component A1 and 8 for the eighth component A2, the mounting order is such that the third component A1 comes first, and then the eighth component A2.

<Flow chart of setting process>
Next, with reference to FIG. 8, the setting process 13 that determines the mounting order of the plurality of types of electronic components M will be described. The setting process 13 is performed by the control unit 11.

In step S1, the control unit 11 acquires the first parameter based on the withstand voltage for each type of the electronic component M. In step S2, the control unit 11 acquires the second parameter based on the short mounting work time of the electronic component M. In step S3, the control unit 11 acquires the electronic component M in which the first parameter exceeds the threshold value D. In the example shown in FIG. 5, the electronic components M in which the first parameter exceeds the threshold value D are the first component S1, the fourth component S2, and the fifth component T1. In step S4, the control unit 11 arranges the electronic components M whose first parameter exceeds the threshold value D based on the second parameter. In the example shown in FIG. 6, as shown in FIG. 7A, the mounting order is set in the order of the first component S1, the fourth component S2, and the fifth component T1.

In step S5, the control unit 11 acquires the electronic component M whose first parameter is equal to or less than the threshold value D. In the example shown in FIG. 5, the electronic components M having the first parameter equal to or less than the threshold value D are the second component C1, the third component A1, the sixth component B1, the seventh component C2, and the eighth component A2. In step S6, the electronic components M having the first parameter equal to or less than the threshold value D are arranged based on the first parameter. In step S7, the control unit 11 arranges the electronic components M having the first parameter arranged based on the first parameter and having the threshold value D or less based on the second parameter. In the example shown in FIG. 6, as shown in FIGS. 7B to 7D, the second component C1, the seventh component C2, the sixth component B1, the third component A1, and the eighth component A2 are mounted in this order. The order is set. Then, the setting process 13 is ended.

[Effects of First Embodiment]
In the first embodiment, as described above, since the electronic component M that is more susceptible to static electricity is mounted later on the substrate K, the electronic component M that is less sensitive to static electricity is applied to the substrate K in a state in which the substrate K is discharged for a long time. Can be implemented. As a result, it is possible to reduce the charge amount of the board K when the electronic component M, which is weak against static electricity, is mounted on the board K without adjusting the transfer speed of the board K. An increase in working time can be suppressed.

In addition, in the first embodiment, the static electricity is weakened on the substrate K, and as the static elimination time increases and the amount of charge on the substrate K decreases, the electronic components M, which are weak against static electricity, are mounted on the substrate K in descending order of withstand voltage. be able to. As a result, during a short period of static elimination of the substrate K, the electronic component M having a high withstand voltage among the electronic components M weak against static electricity is mounted on the substrate K, and when the static elimination time of the substrate K becomes long, the electronic components weak against static electricity. Of the Ms, the electronic component M having a low withstand voltage can be mounted on the substrate K. As a result, the size of the withstand voltage of the electronic component M to be mounted is changed according to the length of the static elimination time of the substrate K, so that the discharge current is high at a high voltage between the substrate K and the electronic component M susceptible to static electricity. It is possible to suppress electrostatic breakdown of the electronic component M, which is vulnerable to static electricity, which is caused by flowing of electricity.

In addition, in the first embodiment, the board K is further separated by the amount of time for mounting the electronic component M of the non-countermeasure group NC that does not take countermeasures against static electricity until the electronic component M vulnerable to static electricity is mounted on the substrate K. It can be removed. Accordingly, when the electronic component M that is weak against static electricity is mounted on the substrate K, it is possible to suppress an increase in the potential difference between the amount of charge of the substrate K and the amount of charge of the electronic component M that is weak against static electricity. It is possible to further suppress the electrostatic breakdown.

Further, in the first embodiment, the control unit 11 sets the mounting order of the plurality of types of electronic components M in the non-countermeasure group NC so that the mounting work time is the shortest, and the lower the withstand voltage is, the later. As described above, the mounting order of the electronic components M susceptible to static electricity in the countermeasure group C is set. As a result, the electrostatic breakdown of the electronic component M in the countermeasure group C, which is susceptible to static electricity, is suppressed while minimizing the working time when the plurality of types of electronic components M in the non-countermeasure group NC are mounted on the substrate K. be able to.

[Second Embodiment]
Next, a component mounting apparatus 201 according to a second exemplary embodiment of the present invention will be described with reference to FIGS. 9 to 13. In the component mounting apparatus 201 of the second embodiment, the static elimination station unit 202 is arranged on the base 2.

(Structure of component mounting device)
As shown in FIG. 9, the component mounting apparatus 201 includes a static elimination station section 202 arranged at a position where the ions emitted from the static elimination section 10 are more likely to hit than the tape feeder 4. A plurality of (two) static elimination stations 202 are arranged on the base 2 between one side (Y1 side) of the pair of conveyors 3 and one side (Y1 side) of the tape feeder 4. 202a is included. In addition, a plurality of (two) static elimination station units 202 are arranged on the base 2 between the other side (Y2 side) of the pair of conveyors 3 and the other side (Y2 side) tape feeder 4. The static elimination station 202b is included. Here, the first static elimination station 202a and the second static elimination station 202b have the same configuration, but the first static elimination station 202a and the second static elimination station 202b may have different configurations.

<Static elimination station>
As shown in FIG. 10, the static elimination station 202 is configured such that the electronic component M taken out from the tape 41 can be placed on the upper surface. Specifically, the static elimination station unit 202 includes a tray 200a and a semiconductor sheet 200b laid on the tray 200a. The plurality of electronic components M taken out from the tape 41 are arranged on the semiconductor sheet 200b.

Here, the first static elimination station 202a is arranged in the emission area A1 shown by the chain line where the ions emitted from the first ionizer 14 are likely to hit. The ejection area A1 indicates an area of the ions emitted from the ion emission port 10c at the opening angle θ1 of the first ionizer 14 by the wind of the blower 10d. In the emission area A1, the ions are concentrated in the vicinity of the central portion G1 of the opening angle θ1 of the ion emission port 10c, and the ions are likely to hit, and the position H1 is high in the static elimination ability by the ions. Here, the first static elimination station 202a is arranged closer to the central portion G1 of the discharge area A1 than the tip end portion of the first tape feeder 4a. This makes it easier for more ions to hit the first static elimination station 202a than the first tape feeder 4a.

Further, the second charge eliminating station 202b is arranged in the emission area A2 indicated by the chain line where the ions emitted from the second ionizer 15 are likely to hit. The ejection area A2 indicates an area of the ions emitted from the ion emission port 10c of the second ionizer 15 at the opening angle θ2 by the wind of the blowing unit 10d. In the ejection area A2, the ions are concentrated near the central portion G2 of the opening angle θ2 of the ion ejection port 10c, and the ions are easily hit by the ions. Further, the second static elimination station 202b is arranged closer to the central portion G2 of the discharge area A2 than the tip of the second tape feeder 4b. As a result, more ions are more likely to hit the second static elimination station 202b than the second tape feeder 4b.

(Component mounting process)
In the component mounting apparatus 201 of the second embodiment, as shown in FIGS. 9 and 13, the control unit 11 executes the component mounting process 212 to cause the static elimination unit 10 to eliminate static electricity from the board K and the electronic component M. While doing so, the mounting head 51 mounts a plurality of types of electronic components M on the substrate K. Here, as shown in FIG. 11, by using the buffer process 213, the electronic component M, which is weak against static electricity, in which the first parameter based on the withstand voltage of the plurality of types of electronic components M has a threshold value D (withstand voltage of 200 V) or less, It is placed on the static elimination station 202 in advance. As described above, in the component mounting apparatus 201, the control unit 11 executes the component mounting process 212, whereby the electronic components M vulnerable to static electricity on the substrate K and the static elimination station unit 202 can be neutralized.

Further, in the component mounting apparatus 201, the mounting sequence of the plurality of types of electronic components M on the board K is set by the setting process 13 based on the strength of each of the plurality of types of electronic components M against static electricity. As a result, a plurality of types of electronic components M are mounted on the substrate K based on the strength against static electricity in a state where both the substrate K and the electronic components M have been subjected to static elimination. It is possible to suppress electrostatic breakdown that is likely to occur when doing. The buffer processing 213 will be described below.

<Buffer processing>
As shown in FIGS. 11 to 13, the buffering process 213 executed by the control unit 11 removes electricity from the substrate K by the electricity removal unit 10 and eliminates electricity from a plurality of types of electronic components M before being mounted on the substrate K. It is configured to perform control. Specifically, as shown in FIG. 11, the control unit 11 controls to move the static electricity-sensitive electronic component M to the static elimination station unit 202 in advance before mounting the static electricity-sensitive electronic component M on the substrate K. Is configured to do.

As shown in FIG. 13, the buffer process 213 executed by the control unit 11 uses the second component C1, the third component A2, the sixth component B1, and the sixth component B1 as the information of the electronic component M whose first parameter is equal to or less than the threshold value D. It is acquired that the seventh component C2 and the eighth component A2 are included in the countermeasure group C (step S12). The buffer process 213 executed by the control unit 11 includes the second parameter (step S2) associated with each of the second component C1, the third component A2, the sixth component B1, the seventh component C2, and the eighth component A2. S13) is acquired. As shown in FIG. 11, the buffer process 213 executed by the control unit 11 is vulnerable to static electricity before the substrate K is carried in, as long as the static elimination station unit 202 has a free space in order from the smallest second parameter value. The electronic components M are arranged on the static elimination station 202. The work of arranging the electronic components M, which are sensitive to static electricity, on the static elimination station 202 may be performed in parallel with the loading of the substrate K or may be performed in parallel with the unloading of the worked substrate K.

As shown in FIG. 12, in the conventional component mounting apparatus, the second component C1 was able to perform static elimination by the static elimination unit only for the conventional static elimination time S1 (indicated by a one-dot chain line). In the apparatus 201, it is possible to perform static elimination by the static elimination unit 10 for a first predetermined time N1 of mounting the second component C1 on the substrate K before the substrate K is loaded. The same applies to the third component A2, the sixth component B1, the seventh component C2, and the eighth component A2.

<Flow chart of component mounting processing>
Next, the component mounting process 212 of the electronic component M on the substrate K will be described with reference to FIG. The component mounting process 212 is performed by the control unit 11.

In step S10, the control unit 11 acquires the first parameter used in the setting process 13. In step S11, the control unit 11 acquires the second parameter used in the setting process 13. In step S12, the control unit 11 acquires the information of the electronic component M in which the first parameter is the threshold D or less. The control part 11 acquires each 2nd parameter of the electronic component M whose 1st parameter is below the threshold value D in step S13. In step S14, the control unit 11 moves the components whose first parameter is equal to or less than the threshold value D to the static elimination station unit 202 in the ascending order of the value of the second parameter. In step S15, the control unit 11 confirms whether or not a space is available in the static elimination station unit 202, and if there is a space, the process proceeds to step S16, and if there is no space, the process proceeds to step S14. In step S16, the control unit 11 confirms whether the substrate K has been loaded. If the substrate K has not been carried in, the process returns to step S16, and if the substrate K has been carried in, the process proceeds to step S17. In step S17, the control unit 11 mounts the electronic component M. In step S18, the control unit 11 confirms whether or not mounting of all electronic components M is completed. If the substrate K has not been loaded, the process returns to step S17, and if the substrate K has been loaded, the process ends thereafter. The rest of the configuration of the second embodiment is similar to that of the first embodiment.

(Effects of Second Embodiment)
In the second embodiment, the following effects can be obtained.

In the second embodiment, the charge removing unit 10 not only neutralizes the charge of the substrate K to reduce the charge amount of the substrate K, but also the charge removing unit 10 neutralizes the charge of the plurality of types of electronic components M. It is possible to reduce the charge amount of the plurality of types of electronic components M. As a result, it is possible to prevent the potential difference between the charge amount of the substrate K and the charge amounts of the plurality of types of electronic components M from increasing, so that when the plurality of types of electronic components M are mounted on the substrate K, the discharge current at a high voltage is high. It is possible to suppress electrostatic breakdown of a plurality of types of electronic components M due to flowing.

Further, in the second embodiment, since the electronic components M that are weak against static electricity can be eliminated in advance in the static elimination station unit 202 where the static elimination unit 10 is more likely to perform static elimination than the tape feeder 4, the electronic components M that are weak against static electricity can be eliminated. The charge can be further neutralized. As a result, the charge amount of the electronic component M, which is weak against static electricity, can be further reduced. Further, since the static electricity-sensitive electronic component M on the static elimination station 202 is started before the substrate K is transported, the static elimination time for the static-sensitive electronic component M can be secured for a long time. As a result, it is possible to further accelerate the static elimination of the electronic component M which is weak against static electricity. The other effects of the second embodiment are similar to those of the first embodiment.

[Third Embodiment]
Next, a component mounting system 300 according to the third embodiment of the present invention will be described with reference to FIGS. In the component mounting system 300 of the third embodiment, a plurality of the component mounting apparatuses 301 of the first embodiment described above are arranged and connected to each other. In the following description, as an example, two component mounting apparatuses 301 are arranged. Of the respective component mounting apparatuses 301, the upstream side (X2 side) component mounting apparatus 301 is referred to as the upstream side component mounting apparatus 302, and the downstream side. The component mounting apparatus 301 on the side (X1 side) is referred to as a downstream component mounting apparatus 303.

(Structure of component mounting system)
The component mounting system 300 shares a plurality of types of electronic components M on the substrate K and mounts them on the substrate K. The upstream component mounting device 302 and the downstream component mounting device including the static eliminator 10 that neutralizes the substrate K by discharging ions. 303, and a control device 311 that controls each of the upstream component mounting apparatus 302 and the downstream component mounting apparatus 303. Here, the upstream component mounting apparatus 302, the downstream component mounting apparatus 303, and the control device 311 are connected via a network. As shown in FIG. 14, the upstream component mounting apparatus 302 and the downstream component mounting apparatus 303 each have the same configuration as the component mounting apparatus 301 of the first embodiment. Further, the control device 311 has the same configuration as the control unit 11 of the first embodiment.

The component mounting system 300 of the third embodiment is configured such that the substrate K is sufficiently neutralized by the neutralization unit 10 before the electronic component M, which is weak against static electricity, is mounted on the substrate K. Specifically, the control device 311 is configured to perform control of mounting the electronic component M, which is resistant to static electricity, on the board K in the upstream side component mounting apparatus 302 while discharging the board K by the charge removing unit 10. .. In the upstream component mounting apparatus 302, as shown in FIG. 15A, an electronic component M whose first parameter exceeds the threshold value D is arranged in the tape feeder 4. Further, the control device 311 controls the downstream component mounting device 303 to mount the electronic component M, which has the first parameter equal to or less than the threshold value D, on the substrate K in the downstream component mounting device 303 while neutralizing the substrate K by the static eliminator 10. Is configured. In the downstream component mounting apparatus 303, as shown in FIG. 16, the electronic component M having the first parameter equal to or less than the threshold value D is arranged in the tape feeder 4 of the downstream component mounting apparatus 303.

<Upstream component mounting device>
In the upstream component mounting apparatus 302, as shown in FIG. 15A, a plurality of types (two types) of electronic components M are arranged in the plurality of tape feeders 4. As an example, the plurality of types of electronic components M are, in order from one side, a first component S1 having a withstand voltage of 300V, a second component S2 having a withstand voltage of 300V, a third component S3 having a withstand voltage of 300V, and a fourth component having a withstand voltage of 300V. S4, a fifth component T1 having a withstand voltage of 400V, a sixth component T2 having a withstand voltage of 400V, a seventh component T3 having a withstand voltage of 400V, and an eighth component T4 having a withstand voltage of 400V.

Further, as shown in FIG. 15B, as an example, a plurality of types of electronic components M include a first parameter corresponding to each withstand voltage and a second parameter having a short mounting work time of the electronic component M. Allocated The first parameter is 1 for the fifth component T1 to the eighth component T4 having a withstand voltage of 400V and 2 for the first component S1 to the fourth component S4 having a withstand voltage of 300V. As described above, in the upstream component mounting apparatus 302, the electronic component M that is resistant to static electricity and has the first parameter exceeding the threshold value D is arranged. Here, the threshold value D has a withstand voltage of 200V. The second parameter is 1 for the first component S1, 2 for the second component S2, 3 for the third component S3, 4 for the fourth component S4, 5 for the fifth component T1, and 5 for the sixth component T2. Is 6, the seventh component T3 is 7, and the eighth component T4 is 8. Thus, the upstream component mounting apparatus 302 mounts the electronic component M that is resistant to static electricity, and does not mount the electronic component M that is weak against static electricity.

<Setting process>
As illustrated in FIG. 15B, the control device 311 determines that the plurality of types of electronic components M in the non-countermeasure group NC including the electronic component M resistant to static electricity have the second parameter based on the second parameter. The electronic components M having a smaller value are arranged in ascending order of mounting. As a result, the mounting order is the first part S1, the second part S2, the third part S3, the fourth part S4, the fifth part T1, the sixth part T2, the seventh part T3, and the eighth part T4. In the upstream component mounting apparatus 302, the static electricity resistant electronic component M is mounted on the substrate K while the substrate K is discharged in this mounting sequence.

<Downstream component mounting device>
In the downstream component mounting apparatus 303, as shown in FIG. 16, a plurality of types (three types) of electronic components M are arranged in the plurality of tape feeders 4. As an example, the plurality of types of electronic components M are, in order from one side, a first component A1 having a withstand voltage of 100V, a second component C1 having a withstand voltage of 200V, a third component A2 having a withstand voltage of 100V, and a fourth component having a withstand voltage of 150V. B1, a fifth part C2 having a withstand voltage of 200V, a sixth part B2 having a withstand voltage of 150V, a seventh part C3 having a withstand voltage of 200V, and an eighth part A3 having a withstand voltage of 100V.

In addition, as shown in FIG. 17, as an example, for a plurality of types of electronic components M, a first parameter corresponding to each withstand voltage and a second parameter corresponding to a short mounting work time of the electronic component M are provided. Has been allocated. The first parameter is 5 for the first component A1, the third component A2 and the eighth component A3 having a withstand voltage of 100V, 4 for the fourth component B1 and the sixth component B2 having a withstand voltage of 150V, and the second for the withstand voltage of 200V. The number of components C1, the fifth component C2, and the seventh component C3 is 3. As described above, in the downstream component mounting apparatus 303, the electronic component M, which is weak against static electricity and has the first parameter equal to or less than the threshold value D, is arranged. The second parameter is 1 for the first part A1, 2 for the second part C1, 3 for the third part A2, 4 for the fourth part B1, 5 for the fifth part C2, 5 for the sixth part B2. Is 6, the seventh component C3 is 7, and the eighth component A3 is 8. In this way, the downstream component mounting apparatus 303 mounts all electronic components M that are weak against static electricity.

<Setting process>
As shown in FIG. 18, the first parameter is 3 for the second component C1, the fifth component C2, and the seventh component C3, and the mounting order is the earliest in the countermeasure group C. Also, the second parameter is 2 for the second component C1, 5 for the fifth component C2, and 7 for the seventh component C3, so the mounting order is the second component C1, the fifth component C2, and the seventh component. It becomes C3.

As shown in FIG. 18, the first parameter is 4 for the fourth component B1 and the sixth component B2, and the mounting order is the second in the countermeasure group C. Further, the second parameter is 4 for the fourth component B1 and 6 for the sixth component B2, so the mounting order is the fourth component B1 and the sixth component B2.

As shown in FIG. 18, the first parameter is 5 for the first component A1, the third component A2, and the eighth component A3, and the mounting sequence is the latest in the countermeasure group C. Further, the second parameter is 1 for the first component A1, 3 for the third component A2, and 8 for the eighth component A3, so that the mounting order is as follows: the first component A1, the third component A2, and the eighth component. It becomes A3. The downstream component mounting apparatus 303 mounts the electronic component M, which is vulnerable to static electricity, on the substrate K while discharging the substrate K in this mounting sequence. The rest of the configuration of the third embodiment is similar to that of the first embodiment.

(Effect of the third embodiment)
In the third embodiment, the following effects can be obtained.

In the third embodiment, it is possible to mount the electronic component M, which is weak against static electricity, on the substrate K from which the charge is removed by the charge removing unit 10 before being transported to the component mounting apparatus 301 on the downstream side. This makes it possible to reduce the charge amount of the board K when the electronic component M, which is weak against static electricity, is mounted on the board K without adjusting the transfer speed of the board K, and to perform work due to static elimination of the board K. It is possible to suppress an increase in time.

Further, in the third embodiment, in the upstream component mounting apparatus 302 in which the static elimination of the board K has not progressed, the electronic component M resistant to static electricity is mounted, and in the downstream component mounting apparatus 303 in which the static elimination of the board K has progressed, Since the electronic component M vulnerable to static electricity can be mounted, it is possible to suppress an increase in working time and to prevent the electronic component M vulnerable to static electricity from being electrostatically destroyed. The other effects of the third embodiment are similar to those of the first embodiment.

[Fourth Embodiment]
Next, a component mounting system 400 according to the fourth embodiment of the present invention will be described with reference to FIGS. 19 and 20. Unlike the component mounting system 300 of the third embodiment described above, the component mounting system 400 of the fourth exemplary embodiment uses a plurality of component mounting apparatuses 1 having different working times to share a plurality of types of electronic components M. It is mounted on the board K. In the following description, as an example, it is assumed that three component mounting apparatuses 1 are arranged, and the respective component mounting apparatuses 1 are located on the most upstream side first component mounting apparatus 401 and downstream of the first component mounting apparatus 401. The second component mounting apparatus 402 and the third component mounting apparatus 403 located downstream of the second component mounting apparatus 402.

(Structure of component mounting system)
In the component mounting system 400 of the fourth embodiment, the control device 411 of the upstream component mounting device 1 has the largest waiting time until the substrate K is carried out to the next component mounting device 1 on the upstream side. In the component mounting apparatus 1, the static elimination unit 10 is configured to control the static elimination of the substrate K. Specifically, the number of components in the plurality of component mounting apparatuses 1 is determined based on the work time of each of the plurality of component mounting apparatuses 1. An example thereof will be described below. The controller 411 has the same configuration as the controller 11 of the first embodiment.

As shown in FIG. 19, in the component mounting system 400, the first component mounting device 401, the second component mounting device 402 including the static eliminator 10, and the third component mounting device 403 are arranged in order from the upstream side. Further, the devices for mounting the electronic component M resistant to static electricity are the first component mounting device 401 and the second component mounting device 402, and the device for mounting the electronic component M weak against static electricity is the third component mounting device 403.

As shown in FIG. 20, the work time from the loading and unloading of the board K of the first component mounting apparatus 401 is the working time L1, and the working time of the loading and unloading of the board K of the second component mounting apparatus 402 is the working time L2. The working time from the loading of the board K of the third component mounting apparatus 403 to the unloading thereof is the working time L3. Here, regarding the work time of the plurality of component mounting apparatuses 1, the work time L3 of the third component mounting apparatus 403 is the largest, the work time L1 of the first component mounting apparatus 401 is the second largest, and the second component mounting apparatus is the second. The working time L2 of 402 is the shortest.

As shown in FIG. 20, the standby times generated in the component mounting system 400 are compared. The standby time between the first component mounting apparatus 401 and the second component mounting apparatus 402 is the standby time W1 which is the difference between the working time L1 of the first component mounting apparatus 401 and the working time L2 of the second component mounting apparatus 402. Has become. The waiting time between the second component mounting apparatus 402 and the third component mounting apparatus 403 is the difference between the working time L2 of the second component mounting apparatus 402 and the working time L3 of the third component mounting apparatus 403. It is time W2. Here, since the standby time W2 is the longest, as shown in FIG. 19, the second component mounting apparatus 402 has the static eliminator 10, and the third component mounting apparatus 403 is placed on the downstream side of the second component mounting apparatus 402. The first component mounting apparatus 401 is disposed upstream of the second component mounting apparatus 402.

(Effects of Fourth Embodiment)
In the fourth embodiment, the following effects can be obtained.

In the fourth embodiment, among the first component mounting apparatus 401, the second component mounting apparatus 402, and the third component mounting apparatus 403 in which the standby time has occurred, the third component mounting in which the longest standby time W3 has occurred. Since the board K is destaticized in the apparatus 403, the largest waiting time W3 occurring in the third component mounting apparatus 403 can be effectively utilized as the destaticizing time. The other effects of the fourth embodiment are the same as those of the third embodiment.

(Modification)
It should be understood that the embodiments disclosed this time are exemplifications in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes meanings equivalent to the scope of claims for patent and all modifications (modifications) within the scope.

For example, in the above-described first to fourth embodiments, the mounting order of the plurality of types of electronic components M is determined using the first parameter and the second parameter, but the present invention is not limited to this. In the present invention, the mounting order may be determined without using the first parameter and the second parameter.

In the first to fourth embodiments, the first parameter is used to separate the electronic component M resistant to static electricity and the electronic component M weak to static electricity, but the present invention is not limited to this. In the present invention, an electronic component that is strong against static electricity and an electronic component that is weak against static electricity may be directly divided based on the value of the withstand voltage.

Further, in the above-described first to fourth embodiments, the first parameter is based on the withstand voltage, but the present invention is not limited to this. In the present invention, the first parameter may be set based on a value other than the withstand voltage.

Further, in the above-described first to fourth embodiments, the ease of mounting the electronic component M on the substrate K is represented using the second parameter, but the present invention is not limited to this. For example, the distance between the electronic component and the work position of the substrate may be directly used.

Further, in the first to fourth embodiments, the second parameter is set based on the short mounting work time, but the present invention is not limited to this. For example, the second parameter may be set based on the height of the electronic component.

Further, in the first to fourth embodiments, the withstand voltage of the electronic components M included in the non-countermeasure group NC is set to 400V and 300V, but the present invention is not limited to this. In the present invention, the withstand voltage of the electronic components included in the non-countermeasure group may be set according to the usage environment of the component mounting apparatus.

Moreover, in the said 1st-4th embodiment, although the withstand voltage of the electronic component M contained in the countermeasure group C was 200V, 150V, 100V, this invention is not limited to this. In the present invention, the withstand voltage of the electronic components included in the countermeasure group may be set according to the usage environment of the component mounting apparatus 1.

Further, in the first to fourth embodiments, the threshold D for dividing the countermeasure group C and the non-countermeasure group NC is set to 200V, but the present invention is not limited to this. In the present invention, the threshold value D may be set according to the usage environment of the component mounting apparatus.

Further, in the first to fourth embodiments, the withstand voltage is manually input by the user, but the present invention is not limited to this. For example, the withstand voltage may be automatically acquired by reading a bar code or the like provided on the electronic component.

Further, in the first to fourth embodiments, the mounting order of the electronic components M that are resistant to static electricity of the non-countermeasure group NC on the substrate K is optimized, but the present invention is not limited to this. In the present invention, the order of mounting the electronic components of the non-countermeasure group on the substrate may be not optimized.

In addition, in the third embodiment, the upstream component mounting apparatus 302 and the downstream component mounting apparatus 303 each include the static elimination unit 10, but the present invention is not limited to this. In the present invention, only the upstream side component mounting device arranged upstream of the downstream side component mounting device may be provided with the static eliminator.

Further, in the fourth embodiment, only the third component mounting apparatus 403 is provided with the static elimination unit 10, but the present invention is not limited to this. In the present invention, both the first component mounting apparatus and the second component mounting apparatus may be provided with the static elimination section, or the first component mounting apparatus may be provided with the static elimination section.

In the above-described embodiment, for convenience of description, the processing operation of the control unit 11 (control devices 311 and 411) has been described using the flow-driven flowchart that sequentially performs processing along the processing flow, but the present invention is not limited to this. Not limited. In the present invention, the processing operation of the control device may be performed by an event driven type (event driven type) process that executes a process for each event. In this case, the event driving may be performed completely, or the event driving and the flow driving may be combined.

1, 201, 301 Component mounting device 4 Tape feeder (component supply unit)
5 head unit 10 static eliminator 11 control unit 12, 212 component mounting process 13 setting process 202 static eliminator station unit 213 buffer process 300, 400 component mounting system 311, 411 controller C countermeasure group K board M electronic component (component)
NC non-measure group

Claims (9)

A component supply unit that supplies multiple types of components to be mounted on the board,
A head unit for mounting the plurality of types of components on the substrate from the component supply unit;
A static eliminator that neutralizes the substrate by releasing ions,
A configuration for performing control to mount the component of the plurality of types of components, which is vulnerable to static electricity, on the substrate after the component of another type is mounted on the substrate while removing the static electricity of the substrate by the static eliminator Component mounting apparatus, which includes a control unit. The component according to claim 1, wherein the control unit is configured to perform control for mounting the component that is weak to static electricity on the substrate in order from the component that has the highest withstand voltage among the components that are weak to static electricity. Mounting device. The control unit is more resistant to static electricity than the component that is weak against static electricity, and after mounting the component of the non-countermeasure group that does not take countermeasures against static electricity first, measures the static electricity of the countermeasure group including the above-mentioned component that is weak against static electricity. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is configured to control to mount the component. The control unit sets the mounting order of the plurality of types of components in the non-countermeasure group so that the mounting work time is the shortest, and the static electricity in the countermeasure group is set later as the withstand voltage decreases. The component mounting apparatus according to claim 3, wherein the component mounting apparatus is configured to set a mounting order of the components that are weak to the touch. 5. The control unit is configured to perform static elimination of the substrate by the static elimination unit, and control to eliminate static electricity of the plurality of types of components before mounting on the substrate. The component mounting apparatus according to item 1. Further comprising a static elimination station unit arranged at a position where ions emitted from the static elimination unit are more likely to hit than the component supply unit,
6. The control unit is configured to perform control so as to move the static electricity weak component to the static elimination station unit in advance before mounting the static electricity weak component on the substrate. Component mounting equipment. A plurality of component mounting apparatuses that share at least one of a plurality of types of components and are mounted on the substrate, and that include at least one component mounting apparatus that has a static eliminator that neutralizes the substrate by discharging ions.
A control device for controlling each of the plurality of component mounting devices,
The component mounting system is configured such that the control device controls the component mounting device on the downstream side to mount the component vulnerable to static electricity on the substrate while the static eliminator removes electricity from the substrate. The control device, while removing the static electricity from the substrate by the static elimination unit, in the component mounting device upstream of the component mounting device that mounts the component weak against static electricity, is stronger against static electricity than the component weak against static electricity. The component mounting system according to claim 7, which is configured to perform control of mounting a component on the board. Among the plurality of component mounting apparatuses on the upstream side, the controller waits until the substrate is carried out to the next component mounting apparatus, and the standby time is the longest in the component mounting apparatus on the upstream side. 9. The component mounting system according to claim 7, wherein the component mounting system is configured to control the charge removal of the substrate by.

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