JP6733712B2 - Optical filter device, optical module, and electronic device - Google Patents

Description

The present invention relates to an optical filter device, an optical module, and electronic equipment.

2. Description of the Related Art Conventionally, there is known an optical filter device in which an interference filter, in which reflective films are arranged to face each other with a predetermined gap, is housed in a housing on the surfaces of a pair of substrates facing each other (for example, see Patent Document 1).
In the optical filter device described in Patent Document 1, the housing includes a base substrate to which the interference filter is fixed with a fixing member. The substrate of the interference filter is bonded and fixed to the base substrate at one location on the facing surface that faces the base substrate.

In this optical filter device, the stress received from the adhesive can be reduced as compared with the configuration in which substantially the entire opposing surface of the substrate is adhered, even when the optical filter device is adhered and fixed using an adhesive. That is, the smaller the adhesive area of the facing surface of the substrate is, the more the influence of the tensile stress from the adhesive that shrinks during curing and the stress caused by the difference in thermal expansion coefficient between the substrate and the base substrate can be suppressed.

JP, 2013-167701, A

However, since the interference filter is fixed to the base substrate at one place while being in contact with the base substrate, when vibration due to disturbance or the like is applied to the optical filter device, it interferes with the interference filter through the base substrate. Vibration may be transmitted and the resolution of the interference filter may be reduced. For example, the interference filter to which the vibration is transmitted vibrates around a fixed portion, which may change the gap size between the reflection films. Further, the vibration of the interference filter may distort the substrate, which may reduce the uniformity of the gap size in the plane along the reflecting surface. As described above, if the gap size changes or the in-plane uniformity decreases, there is a problem that the resolution of the interference filter decreases.

An object of the present invention is to provide an optical filter device, an optical module, and an electronic device that can suppress a decrease in resolution of an interference filter.

An optical filter device according to an application example of the present invention is an interference filter in which a first substrate provided with a first reflective film and a second substrate provided with a second reflective film are arranged to face each other , A base portion to which the first substrate is fixed; and a fixing member that fixes a side surface of the first substrate to the base portion, and the second substrate and the base portion are arranged with a gap therebetween. It is characterized by being present.

In the optical filter device according to the application example of the present invention, one portion of the first substrate of the interference filter is fixed to the base portion by the fixing member. Then, the second substrate and the base portion are arranged with a gap therebetween.
Here, when the first substrate is fixed at one place, for example, the first substrate of the interference filter may vibrate due to the influence of disturbance. Specifically, the natural vibration in the substrate thickness direction can be exemplified in which the fixed position of the fixing member is the fixed end, and the position farthest from the fixed end (the farthest part) is the free end with the maximum amplitude.
In this application example, the first substrate is fixed at one place by the fixing member, but the second substrate is not in contact with the base portion, so that vibration due to disturbance is prevented from being transmitted from the base portion to the first substrate. it can. Therefore, it is possible to suppress the occurrence of vibration such as the above-mentioned natural vibration due to the influence of disturbance. Therefore, the distortion of the substrate due to the vibration can be suppressed, and the deterioration of the resolution of the interference filter due to the distortion of the first substrate and the second substrate can be suppressed.

In the optical filter device of the related art of this application example, it is preferable that the fixing member fixes a side surface along the thickness direction of the substrate.
In this application example, the fixing member fixes the side surface along the thickness direction of the substrate at one location.
Usually, the dimension of the substrate in the thickness direction is sufficiently smaller than the dimension in the plane direction orthogonal to the thickness direction. Therefore, the rigidity of the substrate in the thickness direction (resistance to bending) is lower than the rigidity in the plane direction. Therefore, as described above, by providing the fixing member at one place on the side surface, the direction of the stress from the fixing member can be made the plane direction along the side surface, and the distortion of the substrate due to the stress from the fixing member can be prevented. Can be suppressed. Therefore, it is possible to suppress deterioration of the resolution of the interference filter due to the distortion of the substrate.

In the optical filter device of this application example, the fixing member is preferably provided along one side of the side surface.
In this application example, the fixing member is provided along one side intersecting the thickness direction of the side surface.
In such a configuration, for example, the fixing member can be provided on substantially the entire side surface, and the fixing area can be increased as compared with the case where a part of the side surface of the fixing member is fixed. Thereby, even if a material having a lower elasticity is used as the fixing member, the fixing force by the fixing member can be set to a desired value or more, and the first substrate can be prevented from falling off.

In the optical filter device of this application example, it is preferable that the fixing member is elastically deformed by a stress according to rotation of the first substrate having the side surface as a fixed end.
In this application example, the fixing member is elastically deformed by the stress according to the rotation of the first substrate having the side surface as the fixed end.
Here, in the configuration for fixing the side surface of the first substrate at one place, as described above, there is a case where vibration in the substrate thickness direction of the fixed end of the fixed position on the first substrate occurs. In such a vibration, the substrate is displaced in the rotation direction with the fixed end as a base point at the fixed end, so that the stress according to the rotation of the first substrate acts on the fixing member and the first substrate.
On the other hand, in this application example, the fixing member is formed of a material having a low elasticity that is elastically deformed by receiving the stress. Therefore, even when an external force that induces the vibration due to the influence of disturbance or the like acts on the interference filter, the fixing member is elastically deformed, so that the residual vibration can be suppressed.

In the optical filter device of this application example, the base portion has a fixing surface that faces the side surface and the side surface is fixed, and one of the side surface and the fixing surface projects toward the other, It is preferable to have a protrusion that abuts the other.
In this application example, the projecting portion projects from one of the side surface of the first substrate and the fixing surface of the base portion toward the other and is in contact with the other. A fixing member is provided between the side surface and the fixing surface that are separated by the protrusion.
In such a configuration, the distance between the side surface and the fixed surface can be defined by the dimension of the protruding portion in the protruding direction, and while the side surface and the fixed surface are separated from each other, the first substrate with respect to the base portion is separated. Can be positioned and fixed.
Further, for example, when an adhesive is used as the fixing member, the distance between the side surface and the fixing surface may fluctuate even when the adhesive shrinks and hardens in the direction in which the side surface and the fixing surface approach each other. Can be suppressed, and the positioning accuracy can be improved.

In the optical filter device of this application example, one of the side surface and the fixed surface preferably has a plurality of the protrusions, and the protrusions preferably have a curved surface shape that is convex toward the other. ..
In this application example, the protrusion has a curved surface shape that is convex from one of the side surface and the fixed surface toward the other, and a plurality of such protrusions are provided.
In such a configuration, the projecting portion has a curved surface shape in which the cross-sectional area in the direction along the side surface and the fixed surface decreases toward the projecting direction, and the contact area when contacting the other of the side surface and the fixed surface. Can be made smaller. Thereby, it is possible to more reliably suppress the transmission of the vibration due to the disturbance from the base portion. Further, by abutting with the plurality of protrusions, it is possible to improve the positioning accuracy while reducing the contact area.

In the optical filter device of this application example, it is preferable that the protruding portion is provided on the fixed surface side and has a higher elastic modulus than the fixing member.
In this application example, the protruding portion is provided on the fixed surface of the base portion and is made of a material having a higher elastic modulus than that of the fixing member.
In such a configuration, for example, a material that hardens from a liquid such as a thermosetting resin or a photocurable resin to a solid is applied to the fixing surface and hardened, whereby the protruding portion can be easily formed. In addition, since the stress upon curing and shrinkage does not act on the substrate of the interference filter, there is no distortion of the substrate due to the curing and shrinkage, and it is possible to suppress deterioration of the resolution of the interference filter.

In the optical filter device of this application example, it is preferable that the interference filter further includes a gap changing unit that changes a gap size between the first reflective film and the second reflective film .
Further, in the optical filter device of this application example, the gap changing unit changes the gap dimension by bending the second substrate toward the first substrate side, and the fixing member is the gap changing unit. It is preferable that the elastic deformation is caused by a stress according to the rotation of the first substrate with the fixed position of the fixing member as a fixed end during driving.
In this application example, the gap dimension can be changed by bending the second substrate by changing the gap. With such a configuration, when the gap changing portion bends the second substrate, the above-described vibration may occur in the interference filter due to the stress acting on the interference filter according to the deformation of the second substrate. As described above, even when the vibration occurs in the interference filter, the fixing member is elastically deformed, so that the residual vibration can be appropriately suppressed.

An optical module according to an application example of the present invention is an interference filter in which a first substrate provided with a first reflection film and a second substrate provided with a second reflection film are arranged to face each other , includes a base portion on which the first substrate is fixed, the side surface of the first substrate and the fixing member for fixing to the base portion, and a detector for detecting the light extracted by the interference filter, the second substrate And the base portion are arranged with a gap therebetween .
In this application example, as described above, it is possible to suppress a decrease in resolution of the interference filter in the optical filter device, and it is possible to emit light from the optical filter device while maintaining the resolution. Therefore, in the optical module, the light receiving section can detect the light amount of the light of the desired wavelength with high resolution.

An electronic device according to an application example of the present invention is an interference filter in which a first substrate provided with a first reflection film and a second substrate provided with a second reflection film are arranged to face each other , a base portion on which the first substrate is fixed, with the a fixed member of the first substrate side surface of the fixing to the base portion, and a processing unit that performs processing based on the light from the interference filter, the second It is characterized in that the substrate and the base portion are arranged with a gap therebetween .
In this application example, as described above, it is possible to suppress a decrease in resolution of the interference filter in the optical filter device, and it is possible to emit light from the optical filter device while maintaining the resolution. Therefore, it is possible to provide an electronic device that can perform highly accurate processing based on the high-resolution light output from the optical filter device.

The top view which shows schematic structure of the optical filter device of 1st embodiment which concerns on this invention. Sectional drawing which shows schematic structure of the optical filter device of the said 1st embodiment. FIG. 3 is a plan view showing a schematic configuration of the variable wavelength interference filter according to the first embodiment. Sectional drawing which shows schematic structure of the variable wavelength interference filter of the said 1st embodiment. The figure which shows the manufacturing process of the optical filter device of said 1st embodiment. The figure which shows typically a base and a wavelength variable interference filter in a filter fixing process. The figure which shows typically a base and a wavelength variable interference filter in a filter fixing process. The figure which shows typically a base and a wavelength variable interference filter in a filter fixing process. The figure which shows typically a base and a wavelength variable interference filter in a filter fixing process. The figure which shows typically a base and a wavelength variable interference filter in a filter fixing process. The block diagram which shows schematic structure of the colorimetric apparatus in 2nd embodiment which concerns on this invention. FIG. 3 is a schematic view showing a gas detection device which is an example of the electronic apparatus of the invention. The block diagram which shows the structure of the control system of the gas detection apparatus of FIG. The figure which shows schematic structure of the food analyzer which is an example of the electronic device of this invention. The schematic diagram which shows schematic structure of the spectroscopic camera which is an example of the electronic device of this invention.

[First embodiment]
Hereinafter, a first embodiment according to the present invention will be described with reference to the drawings.
[Optical filter device configuration]
FIG. 1 is a plan view showing a schematic configuration of an optical filter device 600, which is a first embodiment of the optical filter device of the present invention. FIG. 2 is a sectional view taken along the line AA of FIG.
The optical filter device 600 is a device that extracts light having a predetermined target wavelength from incident inspection light and emits the light. The optical filter device 600 includes a housing 610 and a wavelength variable interference filter 5 housed inside the housing 610. There is. Such an optical filter device 600 can be incorporated in, for example, an optical module such as a colorimetric sensor or an electronic device such as a colorimeter or a gas analyzer. The configurations of the optical module and the electronic device including the optical filter device 600 will be described in detail later.

[Configuration of variable wavelength interference filter]
FIG. 3 is a plan view showing a schematic configuration of the variable wavelength interference filter 5. FIG. 4 is a sectional view showing a schematic configuration of the variable wavelength interference filter 5 taken along the line BB of FIG.
As shown in FIGS. 3 and 4, the variable wavelength interference filter 5 includes a fixed substrate 51 corresponding to the first substrate of the present invention and a movable substrate 52 corresponding to the second substrate of the present invention. Each of the fixed substrate 51 and the movable substrate 52 is made of, for example, various kinds of glass, crystal, or the like, and is made of quartz glass in this embodiment. Then, as shown in FIG. 4, these substrates 51 and 52 are integrally formed by being bonded by a bonding film 53 (first bonding film 531 and second bonding film 532). Specifically, the first bonding portion 513 of the fixed substrate 51 and the second bonding portion 523 of the movable substrate 52 are bonded by a bonding film 53 made of, for example, a plasma polymerized film containing siloxane as a main component. ..
In the following description, the tunable interference filter 5 is viewed from the plan view of the fixed substrate 51 or the movable substrate 52 viewed from the substrate thickness direction, that is, the stacking direction of the fixed substrate 51, the bonding film 53, and the movable substrate 52. The plan view is referred to as a filter plan view.

As shown in FIG. 4, the fixed substrate 51 is provided with a fixed reflection film 54 that constitutes one of the pair of reflection films of the present invention. In addition, the movable substrate 52 is provided with a movable reflective film 55 that constitutes the other of the pair of reflective films of the present invention. The fixed reflective film 54 and the movable reflective film 55 are opposed to each other with a gap G1 between the reflective films.
The variable wavelength interference filter 5 is provided with an electrostatic actuator 56, which is used to adjust the distance (gap size) of the gap G1 between the reflection films 54 and 55 and corresponds to the gap changing unit of the present invention. There is. The electrostatic actuator 56 includes a fixed electrode 561 provided on the fixed substrate 51 and a movable electrode 562 provided on the movable substrate 52, and the electrodes 561 and 562 are configured to face each other. The fixed electrode 561 and the movable electrode 562 face each other via an inter-electrode gap. Here, these electrodes 561 and 562 may be provided directly on the substrate surfaces of the fixed substrate 51 and the movable substrate 52, respectively, or may be provided via another film member.
In addition, in the present embodiment, the configuration in which the inter-reflection film gap G1 is formed smaller than the inter-electrode gap is illustrated. However, for example, depending on the wavelength range transmitted by the wavelength tunable interference filter 5, the inter-reflection film gap G1 may be formed between the electrodes. It may be formed larger than the gap.

Here, in the filter plan view, one side of the movable substrate 52 (for example, the side C3-C4 in FIG. 3) projects outward from the sides C3′-C4′ of the fixed substrate 51. The projecting portion of the movable substrate 52 is an electrical component portion 525 that is not joined to the fixed substrate 51, and the surface exposed when the wavelength tunable interference filter 5 is viewed from the fixed substrate 51 side is provided with electrode pads 564P and 565P described later. It becomes the electrical equipment surface 524.

(Structure of fixed board)
As shown in FIG. 4, an electrode arrangement groove 511 and a reflection film installation portion 512 are formed on the fixed substrate 51 by etching. The thickness of the fixed substrate 51 is larger than that of the movable substrate 52. The fixed substrate 51 has an electrostatic attraction when a voltage is applied between the fixed electrode 561 and the movable electrode 562 and a fixed substrate due to internal stress of the fixed electrode 561. There is no deflection of 51.

The electrode arrangement groove 511 is formed in an annular shape centered on the filter center point O of the fixed substrate 51 in the filter plan view (see FIG. 3 ). The bottom surface of the electrode placement groove 511 serves as an electrode placement surface 511A on which the fixed electrode 561 is placed.
The reflection film installation portion 512 is formed so as to project from the central portion of the electrode arrangement groove 511 to the movable substrate 52 side in the plan view. The protruding tip surface of the reflection film installation portion 512 becomes a reflection film installation surface 512A.

The fixed electrode 561 forming the electrostatic actuator 56 is provided on the electrode installation surface 511A. The fixed electrode 561 is provided in a region of the electrode installation surface 511A facing the movable electrode 562 of the movable portion 521 described later. In addition, an insulating film for ensuring insulation between the fixed electrode 561 and the movable electrode 562 may be stacked on the fixed electrode 561.
As shown in FIG. 3, the fixed substrate 51 is provided with a fixed extraction electrode 563 connected to the outer peripheral edge of the fixed electrode 561. The fixed extraction electrode 563 is provided along the connection electrode groove 511B (see FIG. 4) formed from the electrode arrangement groove 511 toward the side C3′-C4′ side (electric component 525 side). The connection electrode groove 511B is provided with a bump 565A protruding toward the movable substrate 52 side, and the fixed extraction electrode 563 extends to above the bump 565A. Then, the bumps 565A are brought into contact with the fixed connection electrodes 565 provided on the movable substrate 52 side to be electrically connected. The fixed connection electrode 565 extends from a region facing the connection electrode groove 511B to the electrical component surface 524, and forms a fixed electrode pad 565P on the electrical component surface 524.

In this embodiment, one fixed electrode 561 is provided on the electrode installation surface 511A, but for example, two electrodes that are concentric with the filter center point O as a center (double electrode configuration) are provided. ) Or the like. In addition, a configuration in which a transparent electrode is provided on the fixed reflection film 54, or a conductive fixed reflection film 54 may be used to form a connection electrode from the fixed reflection film 54 to the fixed side electrical component section. In this case, the fixed electrode 561 may have a structure in which a part is cut out depending on the position of the connection electrode.

As described above, the reflection film installation portion 512 is formed in a substantially cylindrical shape coaxial with the electrode arrangement groove 511 and having a diameter smaller than that of the electrode arrangement groove 511, and is formed on the movable substrate 52 of the reflection film installation portion 512. It is provided with a reflection film installation surface 512A facing each other.
As shown in FIG. 4, the fixed reflective film 54 is installed in the reflective film installation portion 512. As the fixed reflection film 54, for example, a metal film such as Ag or an alloy film such as Ag alloy can be used. Alternatively, for example, a dielectric multilayer film in which the high refractive layer is TiO ₂ and the low refractive layer is SiO ₂ may be used. Furthermore, a reflective film in which a metal film (or an alloy film) is laminated on a dielectric multilayer film, a reflective film in which a dielectric multilayer film is laminated on a metal film (or an alloy film), a single refraction layer (TiO ₂ or SiO ₂₎ and a metal film (or alloy film) and the like may be used reflective film formed by laminating a.

Further, an antireflection film may be formed on the light incident surface of the fixed substrate 51 (the surface where the fixed reflection film 54 is not provided) at a position corresponding to the fixed reflection film 54. This antireflection film can be formed by alternately stacking a low refractive index film and a high refractive index film, and reduces the reflectance of visible light on the surface of the fixed substrate 51 and increases the transmittance.

Then, of the surfaces of the fixed substrate 51 facing the movable substrate 52, the surfaces on which the electrode placement groove 511, the reflection film installation portion 512, and the connection electrode groove 511B are not formed by etching form the first bonding portion 513. The first bonding film 531 is provided on the first bonding portion 513, and the first bonding film 531 is bonded to the second bonding film 532 provided on the movable substrate 52, as described above. The fixed substrate 51 and the movable substrate 52 are joined.

(Structure of movable substrate)
The movable substrate 52 includes a circular movable portion 521 having a filter center point O as a center, and a holding portion 522 that is coaxial with the movable portion 521 and holds the movable portion 521.

The movable portion 521 is formed to have a larger thickness dimension than the holding portion 522. The movable portion 521 is formed to have a diameter dimension that is at least larger than the diameter dimension of the outer peripheral edge of the reflection film installation surface 512A in the filter plan view. The movable electrode 562 and the movable reflective film 55 are provided on the movable portion 521.
As with the fixed substrate 51, an antireflection film may be formed on the surface of the movable portion 521 opposite to the fixed substrate 51. Such an antireflection film can be formed by alternately stacking a low refractive index film and a high refractive index film, reduces the reflectance of visible light on the surface of the movable substrate 52, and increases the transmittance. Can be made.

The movable electrode 562 faces the fixed electrode 561 via a predetermined inter-electrode gap, and is formed in an annular shape having the same shape as the fixed electrode 561. The movable electrode 562 constitutes the electrostatic actuator 56 together with the fixed electrode 561. Further, the movable substrate 52 is provided with a movable connection electrode 564 connected to the outer peripheral edge of the movable electrode 562. The movable connection electrode 564 is provided over the electrical component surface 524 along the position facing the connection electrode groove 511B provided on the fixed substrate 51 from the movable component 521, and on the electrical component surface 524, the inner terminal portion is provided. To form a movable electrode pad 564P electrically connected to.
As described above, the fixed connection electrode 565 is provided on the movable substrate 52, and the fixed connection electrode 565 is connected to the fixed extraction electrode 563 at the position where the bump 565A (see FIG. 3) is formed. ..

The movable reflection film 55 is provided at the center of the movable surface 521A of the movable portion 521 so as to face the fixed reflection film 54 via the gap G1. As the movable reflective film 55, a reflective film having the same structure as the fixed reflective film 54 described above is used.
In the present embodiment, as described above, an example in which the inter-electrode gap is larger than the dimension of the inter-reflection film gap G1 is shown, but the present invention is not limited to this. For example, when infrared rays or far infrared rays are used as the measurement target light, the size of the gap G1 may be larger than the size of the inter-electrode gap depending on the wavelength range of the measurement target light.

The holding portion 522 is a diaphragm that surrounds the periphery of the movable portion 521, and is formed to have a smaller thickness dimension than the movable portion 521. Such a holding portion 522 is more flexible than the movable portion 521, and it is possible to displace the movable portion 521 to the fixed substrate 51 side by a slight electrostatic attractive force. At this time, since the movable portion 521 has a larger thickness dimension and higher rigidity than the holding portion 522, the shape of the movable portion 521 does not change even when the holding portion 522 is pulled toward the fixed substrate 51 by electrostatic attraction. Absent. Therefore, the movable reflection film 55 provided on the movable portion 521 does not bend, and the fixed reflection film 54 and the movable reflection film 55 can be always maintained in parallel.
In addition, although the diaphragm-shaped holding portion 522 is illustrated in the present embodiment, the present invention is not limited to this, and for example, a configuration is provided in which beam-shaped holding portions arranged at equal angular intervals around the filter center point O are provided. It is also possible to

In the movable substrate 52, the region facing the first bonding portion 513 becomes the second bonding portion 523. The second bonding film 532 is provided on the second bonding portion 523, and as described above, the second bonding film 532 is bonded to the first bonding film 531 to bond the fixed substrate 51 and the movable substrate 52. To be done.

[Case configuration]
As shown in FIG. 2, the housing 610 includes a base 620 corresponding to the base portion of the present invention and a lid 630, and houses the variable wavelength interference filter 5 therein.
The base 620 is a ceramic substrate formed by laminating and firing ceramic thin layers. As shown in FIG. 1 and FIG. 2, the base 620 is provided with a side wall portion 621 having a frame shape in a filter plan view on a surface facing the lid 630. Further, the base 620 has a recess 622 formed so as to be surrounded by the side wall portion 621. Further, the lid 630 is joined to the lid joining surface 621A which is the lid 630 side surface of the side wall portion 621.

The tunable interference filter 5 is fixed by a fixing member 624 to a surface 621B facing the side surface 51A including the sides C1′-C2′ of the fixed substrate 51 among the side surfaces inside the side wall portion 621 (hereinafter, fixed surface 621B. Called)). In the variable wavelength interference filter 5, with the movable substrate 52 facing the bottom portion 622A side, as shown in FIG. 2, the side surface 51A of the fixed substrate 51 is fixed to the fixed surface 621B in a state of being separated from the bottom portion 622A. The fixing structure for fixing the variable wavelength interference filter 5 to the base 620 will be described in detail later.

A light passage hole 628 for passing the light emitted from the variable wavelength interference filter 5 (or the light incident on the variable wavelength interference filter) is provided in the bottom portion 622A of the recess 622. A transparent member 629 such as a glass plate is bonded to the light passage hole 628 with a bonding agent such as low melting glass.

A sealing hole 622B penetrating the outside of the housing 610 is provided in the bottom portion 622A of the recess 622. The sealing hole 622B is a hole for sucking gas inside the housing 610 or substituting it with an inert gas when the optical filter device 600 is manufactured, and the inside of the housing 610 is vacuumed or decompressed. In this state, for example, metal can be sealed with a sealing member 622C (see FIG. 2) such as Au.

Further, a bottom portion 622A of the recess 622 is provided with an internal terminal 622D (see FIG. 1) connected to the electrode pads 564P and 565P of the variable wavelength interference filter. A through hole (not shown) penetrating the outside of the housing 610 is provided in a portion where the internal terminal 622D is formed, and a metal member such as Ag electrically connected to the internal terminal 622D is provided in the through hole. Is filled. This metal member is connected to an external terminal (not shown) provided outside the base 620, whereby the internal terminal 622D and the external terminal are electrically connected.

The lid 630 has a rectangular outer shape similar to that of the base 620 in a filter plan view, and is made of glass capable of transmitting light. The lid 630 is joined to the lid joining surface 621A in a state where the variable wavelength interference filter 5 is arranged on the base 620.

[Fixed structure of variable wavelength interference filter]
As shown in FIGS. 1 and 2, a protrusion 623 is provided on the fixed surface 621B to which the side surface 51A of the variable wavelength interference filter 5 is fixed. The protrusion 623 abuts the side surface 51A of the fixed substrate 51 at the tip 623A. The side surface 51A and the fixed surface 621B are separated from each other by a distance defined by the protruding portion 623, and are fixed by a fixing member 624 provided between the side surface 51A and the fixed surface 621B.

The projecting portion 623 projects from the fixed surface 621B toward the side wall portion 621 in a direction orthogonal to the fixed surface 621B. The projecting portion 623 is formed in a shape such that the cross-sectional area in the plane direction parallel to the fixed surface 621B becomes smaller toward the projecting direction, for example, substantially hemispherical. As will be described later, such a protruding portion 623 is formed by using a material such as a thermosetting resin or a photocurable resin that hardens from a liquid to a solid.

As shown in FIG. 1, a plurality of such protrusions 623 (two in the illustrated example) are provided at different positions along the side C1′-C2′. The tunable interference filter 5 is positioned with respect to the fixed surface 621B by abutting the side surface 51A at the tip 623A of each of the plurality of protrusions 623.

Here, the protruding portion 623 is formed of a highly elastic material having a higher elastic modulus than the fixing member 624. As a result, as described later, even if a force from the side surface 51A toward the fixed surface 621B acts on the protrusion 623 due to hardening and shrinkage of the fixing member 624, the deformation of the protrusion 623 can be suppressed. Therefore, it is possible to prevent the position of the variable wavelength interference filter 5 from changing with respect to the fixed surface 621B.

The fixing member 624 fixes the side surface 51A to the fixing surface 621B. As shown in FIG. 1, the fixing member 624 is provided on the entire side surface 51A along the sides C1′-C2′ of the fixed substrate 51. As shown in FIG. 2, the variable wavelength interference filter 5 is fixed to the fixed surface 621B by the fixing member 624 with the movable substrate 52 facing the bottom portion 622A side. In the present embodiment, a gap is provided between the surface of the variable wavelength interference filter 5 other than the side surface 51A and the base 620. For example, as shown in FIG. 2, a gap CL1 is provided between the bottom surface 622A and the lower surface 52B of the movable substrate 52 that faces the bottom portion 622A. A gap is also provided between the fixed substrate 51 and the lid 630.

Here, when a force in the substrate thickness direction acts on the wavelength tunable interference filter 5 due to a disturbance or the like, the side face 51A including the side C1′-C2′ fixed by the fixing member 624 serves as a fixed end, and the substrate thickness direction ( Vibration along the arrow M in FIG. 2 (hereinafter, also referred to as filter vibration) may occur. Among the filter vibrations, in the vibration due to the primary resonance of the wavelength tunable interference filter 5 (primary resonance vibration), the end portion on the side surface 52A side of the movable substrate 52 farthest from the side surface 51A on the fixed end side in the filter plan view (freedom) At the edge), the amplitude becomes maximum. In addition to the disturbance, the filter vibration may be induced by a reaction when the movable portion 521 is moved by driving the electrostatic actuator 56.

In the present embodiment, in the substrate thickness direction (direction of arrow M in FIG. 2), the size h1 of the gap CL1 between the lower surface 52B and the bottom portion 622A (when the wavelength tunable interference filter 5 is stationary) indicates that filter vibration occurs. Is also set to be larger than the maximum amplitude (amplitude in primary resonance vibration) at the lower end of the side surface 52A that is the free end (the intersection of the side surface 52A and the lower surface 52B). For example, when the size of the fixed substrate 51 is about 10 mm and the maximum amplitude is several μm, the size h1 of the gap CL1 is set to several tens of μm or more (for example, 20 μm or more). Accordingly, even when the filter vibration occurs, the movable substrate 52 can be prevented from coming into contact with the bottom portion 622A.
The maximum amplitude of the lower surface 52B on the side surface 52A side when the filter vibration occurs is the size of the wavelength tunable interference filter 5, the modulus of elasticity of the substrates 51 and 52, the fixing member 624, and the magnitude of the disturbance vibration. It can be obtained by simulation or experiment.

Further, in the present embodiment, the fixing member 624 is elastically deformable (for example, 500 MPa or less) due to the filter vibration, which receives the stress from the wavelength tunable interference filter 5 which is about to rotate with the side surface 51A as the fixed end. ) Has. In this way, elastic deformation of the fixing member 624 can absorb the filter vibration, and suppress the deterioration of the resolution of the wavelength tunable interference filter 5 due to the size variation of the gap G1 due to the influence of the filter vibration. it can.

Here, the smaller the elastic modulus of the fixing member 624, the smaller the fixing force. That is, by reducing the elastic modulus of the fixing member 624, the filter vibration can be suppressed by elastic deformation, but the fixing force may decrease and the wavelength tunable interference filter 5 may fall off. For this reason, the lower limit value of the elastic modulus is set to a value sufficient to obtain a fixing force capable of suppressing the wavelength tunable interference filter 5 from dropping according to the mass and size of the wavelength tunable interference filter 5. On the other hand, similarly, the upper limit of the elastic modulus is set to a value that allows elastic deformation according to filter vibration.
For example, a silicone adhesive can be used as the fixing member 624. Further, the elastic modulus of the fixing member 624 is, for example, preferably 10 MPa or more and 500 MPa or less, and more preferably 50 MPa or more and 100 MPa or less. Accordingly, it is possible to effectively suppress the filter vibration while suppressing the falling of the variable wavelength interference filter 5.

[Method for manufacturing optical filter device]
Next, a method of manufacturing the optical filter device 600 as described above will be described with reference to the drawings.
FIG. 5 is a process chart showing an example of a manufacturing process of the optical filter device 600.
6 to 10 schematically show members such as the variable wavelength interference filter 5 and the base 620 in the device assembly process shown in FIG. Note that FIG. 6A is a top view of the base 620 when viewed toward the bottom portion 622A, and FIG. 6B is a cross-sectional view showing a cross section taken along line C-C in FIG. 6A. It is a figure, and is the same also about FIGS. 7-9.
Here, in the following description, the direction orthogonal to the bottom portion 622A is the Z direction, the direction orthogonal to the Z direction, and the direction orthogonal to the fixed surface 621B is the X direction, and the direction orthogonal to the X direction and the Z direction is the Y direction. To do. Further, the direction away from the base 620 with the bottom portion 622A as a base point is defined as +Z direction.
6 to 9 show a state in which the base 620 is arranged with the Z direction parallel to the vertical direction and aligned with the direction from the bottom to the top. On the other hand, FIG. 10 shows a state in which the base 620 is arranged with the Z direction aligned with the vertical direction.

In the manufacturing process of the optical filter device 600 shown in FIG. 5, a filter preparation process (S1) for manufacturing the wavelength tunable interference filter 5 constituting the optical filter device 600, a base preparation process (S2) for preparing the base 620, and a lid 630. After performing the lid preparation step (S3) for preparing the optical filter device 600, the device assembly step (S4) of assembling the optical filter device 600 using the variable wavelength interference filter 5, the base 620, and the lid 630 is performed.

(Filter preparation process)
In the filter preparation step S1, first, the fixed substrate 51 and the movable substrate 52 are appropriately formed by etching or the like. Then, the fixed electrode 561 and the fixed extraction electrode 563 are formed on the fixed substrate 51, and then the fixed reflection film 54 is formed. Further, on the movable substrate 52, after forming the movable electrode 562, the movable connection electrode 564, the fixed connection electrode 565, and the electrode pads 564P and 565P, the movable reflection film 55 is formed. Then, the fixed substrate 51 and the movable substrate 52 are bonded to each other via the bonding film 53, whereby the wavelength tunable interference filter 5 is obtained.

(Base substrate preparation process)
In the base preparation step S2, first, the outer shape of the base 620 is formed. Specifically, first, a pre-fired substrate obtained by laminating sheets, which are materials for forming a ceramic substrate, is appropriately subjected to cutting processing, laser processing, or the like to form the shape of the base 620 having the recess 622 and the light passage hole 628. Then, the base 620 is formed by baking the substrate before baking.
After that, although not shown, a through hole (not shown) for electrically connecting the internal terminal 622D and the external terminal (not shown) is formed in the bottom portion 622A, and the formed through hole has a conductive property. Fill the part. Then, the internal terminal 622D and the external terminal are formed.

(Lid preparation process)
In the lid preparation step S3, a glass plate material having a predetermined thickness is divided into rectangular portions similar to the base 620, and a plurality of lids 630 are simultaneously formed.

(Device assembly process)
In the device assembly step S4, the wavelength tunable interference filter 5 is fixed to the base 620, and then the lid 630 is joined to the base 620 to form the optical filter device 600.

In this device assembly step S4, first, a protrusion forming step of forming a protrusion 623 on the fixed surface 621B of the recess 622 of the base 620 is performed (S41).
In the present embodiment, as shown in FIG. 6, fixing is performed by applying a liquid curable material such as a thermosetting resin or a photocurable resin to the fixing position of the wavelength tunable interference filter 5 on the fixing surface 621B and curing the liquid. Form surface 621B. That is, when the liquid curable material is applied to the fixed surface 621B, it becomes substantially hemispherical due to the surface tension. The substantially hemispherical curable material is cured. The protrusion 623 formed in this manner is formed in a substantially hemispherical shape in which the area of the cut surface parallel to the fixed surface 621B becomes smaller as the distance from the fixed surface 621B increases. The shape and size of the protruding portion 623 can be adjusted by the viscosity of the curable material and the coating amount.

Next, a fixing member application step of applying the fixing member 624 to the fixing position of the wavelength tunable interference filter 5 on the fixing surface 621B is performed (S42).
As shown in FIG. 7, the fixing member 624 is applied to the fixing surface 621B with an application amount such that the dimension in the direction orthogonal to the fixing surface 621B is equal to or larger than the dimension of the protrusion 623. As a result, the side surface 51A of the variable wavelength interference filter 5 can be brought into contact with the fixing member 624 before coming into contact with the tip 623A of the protruding portion 623, and a joint failure due to the side surface 51A not coming into contact with the fixing member 624 is suppressed. it can.

Next, a filter fixing step of fixing the variable wavelength interference filter 5 at a fixed position is carried out (S43).
In the filter fixing step S43, the wavelength tunable interference filter 5 is arranged on the bottom portion 622A so as not to come into contact with the fixing member 624 (see FIG. 7), and then the wavelength is varied with the bottom portion 622A and the wavelength tunable interference filter 5 separated. The side surface 51A of the variable interference filter 5 is brought into contact with the tip 623A of the protruding portion 623, and the wavelength variable interference filter 5 is fixed to the base 620.

Specifically, as shown in FIG. 8, a space CL2 between the end surface 5A including the sides C1-C4 of the variable wavelength interference filter 5 and the inner surface 621C of the side wall portion 621 facing the end surface 5A (see FIG. 7). ), the guide member 71 is arranged. Similarly, the guide member 71 is arranged in the space CL3 (see FIG. 7) between the end surface 5B including the sides C2-C3 of the wavelength tunable interference filter 5 and the inner surface 621D of the base 620 facing the end surface 5B. Further, the positioning member 72 is arranged on the surface of the variable wavelength interference filter 5 opposite to the bottom portion 622A, that is, on the upper surface 51B of the fixed substrate 51.

The guide member 71 regulates the moving direction of the variable wavelength interference filter 5 and moves it in the X direction orthogonal to the fixed surface 621B. The guide member 71 is a plate-shaped member whose thickness dimension is substantially the same as the dimension of the space CL2 in the Y direction orthogonal to the end surface 5B, and is made of glass or the like. The variable wavelength interference filter 5 is moved in the X direction along the surface of the guide member 71 with the guide member 71 inserted in the space CL2.

The positioning member 72 is a member for positioning the wavelength tunable interference filter 5 in the Z direction and setting the dimension h1 (see FIG. 2) of the gap CL1 to a desired value, as described later. The positioning member 72 has a flat plate shape and is made of glass or the like. The positioning member 72 has a filter contact surface 72A that contacts the variable wavelength interference filter 5 and an upper surface 72B opposite to the filter contact surface 72A. With the positioning member 72 disposed on the variable wavelength interference filter 5, the filter contact surface 72A and the upper surface 72B are orthogonal to the Z direction.
Here, the thickness dimension h2 of the positioning member 72 in the Z direction is the depth dimension H of the recess 622 and the thickness dimension h3 of the wavelength tunable interference filter 5, and the dimension h1 of the gap CL1 is the above-described desired value. Is set to be. That is, the thickness dimension h2 of the positioning member 72 is set such that the sum of the respective dimensions h1, h2, h3 becomes the depth dimension H of the recess 622.

As shown in FIG. 8, with the guide member 71 and the positioning member 72 arranged, the wavelength tunable interference filter 5 is moved toward the protrusion 623 in the X direction. The wavelength tunable interference filter 5 is moved in the X direction, and the side surface 51A is brought into contact with the tip 623A of the protrusion 623 as shown in FIG. At this time, the fixing member 624 is in close contact with the entire surface of the side surface 51A.
Here, the guide member 71 is arranged so as to abut on each of the pair of end faces 5A and 5B of the variable wavelength interference filter 5 which intersect in the Y direction. This can prevent the position in the Y direction from changing when moving the variable wavelength interference filter 5 in the X direction.

Next, as shown in FIG. 10, a first holding member 73 that contacts the lid joint surface 621A and a second holding member 74 that contacts the base 620 from the side opposite to the first holding member 73 in the Z direction. , The base 620 is sandwiched from both sides in the Z direction, and the +Z direction is turned upside down so that the vertical direction is from the top to the bottom, and the tunable interference filter 5 is positioned in the Z direction.
That is, when the base 620 is turned upside down, the variable wavelength interference filter 5 and the positioning member 72 move in the +Z direction (downward). Then, the upper surface 72B of the positioning member 72 contacts the contact plane 73A (the surface orthogonal to the Z direction) that contacts the lid joint surface 621A of the first holding member 73, and the wavelength tunable interference filter 5 is positioned in the Z direction. It
As described above, the depth dimension H of the recess 622, the dimension h1 of the gap CL1, the thickness dimension h2 of the positioning member 72, and the thickness dimension h3 of the wavelength tunable interference filter 5 are set so that the dimension h1 becomes a desired value. Therefore, a gap CL1 having a desired dimension h1 is provided between the lower surface 52B of the movable substrate 52 and the bottom portion 622A.

Then, the tunable interference filter 5 cures the fixing member 624 in the positioned state, and fixes the side surface 51A of the tunable interference filter 5 and the fixing surface 621B of the base 620 with the fixing member 624. After the fixing member 624 is hardened, the guide member 71 and the positioning member 72 are removed. In this way, the wavelength tunable interference filter 5 is fixed to the base 620 at one location on substantially the entire side surface 51A. Then, except for the side surface 51A, a gap is provided between the surface of the variable wavelength interference filter 5 and the base 620 (see FIGS. 1 and 2). That is, the regions of the surfaces of the fixed substrate 51 and the movable substrate 52 exposed to the outside and the base 620 are arranged with a gap therebetween.

The distance between the upper surface 51B of the fixed substrate 51 and the lid 630 is the dimension h2 or more (strictly speaking, the dimension h2 and the thickness dimension of the joining member). Therefore, the minimum value of the distance between the upper surface 51B and the lid 630 can be defined by the dimension h2. For example, like the dimension h1, by setting the dimension h2 so that it is larger than the maximum amplitude of the upper end on the free end side opposite to the side surface 51A that is the fixed end of the fixed substrate 51, the upper surface 51B is set to the lid 51B. It is possible to suppress contact with the 630.

Next, a wiring connection process is performed (S44). In S44, the electrode pads 564P and 565P of the variable wavelength interference filter 5 and the internal terminals 622D are connected by wires by wire bonding.
After that, a lid joining step of joining the base 620 and the lid 630 is performed (S45). Along with joining the lid 630, a translucent member 629 is joined to a position covering the light passage hole 628. In S45, the base 620 is joined to the translucent member 629 and the lid 630 under an environment set in a vacuum atmosphere, for example, in a vacuum chamber device or the like.
Through the above steps, the optical filter device 600 is manufactured.

[Operation and effect of the embodiment]
In this embodiment, one portion of the fixed substrate 51 of the variable wavelength interference filter 5 is fixed to the base 620 by the fixing member 624. Then, the portion of the wavelength tunable interference filter 5 other than the portion fixed by the fixing member 624 and the base 620 are arranged with a gap (gap CL1) therebetween.
Here, when the fixed substrate 51 is fixed at one place, the filter vibration may occur as described above due to the influence of disturbance, for example.
In the present embodiment, the wavelength tunable interference filter 5 is fixed by the fixing member 624 at one place on the side surface 51A, but a gap CL1 is provided between the fixed member 624 and the base 620 at a portion other than the fixing portion. And does not contact the base 620. Therefore, it is possible to suppress the vibration due to the disturbance from being transmitted from the base 620 to the substrates 51 and 52, and it is possible to suppress the occurrence of the filter vibration due to the influence of the disturbance. Therefore, it is possible to suppress the distortion of each of the substrates 51 and 52 of the substrate due to the filter vibration, and it is possible to prevent the resolution of the variable wavelength interference filter 5 from being lowered.

In this embodiment, the fixing member fixes the side surface along the thickness direction of the substrate at one place.
Generally, the rigidity of the fixed substrate 51 in the thickness direction (resistance to bending) is lower than the rigidity in the plane direction. Therefore, as described above, by providing the fixing member 624 at one place on the side surface 51A, the direction of the stress from the fixing member 624 can be set to the planar direction along the side surface 51A, and the stress from the fixing member 624 can be reduced. It is possible to suppress the distortion of the fixed substrate 51 due to, and to suppress the deterioration of the resolution of the variable wavelength interference filter 5.

In the present embodiment, the fixing member 624 is provided along the side C1′-C2′ that intersects the side surface 51A in the thickness direction. In such a configuration, for example, the fixing member 624 can be provided on the substantially entire surface of the side surface 51A, and the fixing area can be increased as compared with the case where a part of the side surface 51A of the fixing member 624 is fixed. Thereby, even if the elastic modulus of the fixing member 624 is reduced, the fixing force of the fixing member 624 can be set to a desired value or more, and the fixing substrate 51 can be prevented from falling off.

In this embodiment, the fixing member 624 is elastically deformed by the stress according to the rotation of the substrate having the side surface 51A as the fixed end.
Here, in the configuration in which the side surface 51A of the fixed substrate 51 is fixed at one place, as described above, filter vibration may occur due to the influence of disturbance. In this case, the stress that attempts to rotate with the fixed position as the fixed end (base point) acts on the fixed member 624 and the fixed substrate 51.
On the other hand, in the present embodiment, the fixing member 624 is formed of a low elastic material that is elastically deformed by receiving the stress. Therefore, even when the force that induces the filter vibration acts on the optical filter device 600 and the variable wavelength interference filter 5, it is possible to suppress the residual filter vibration due to the elastic deformation of the fixing member 624.

Further, in this embodiment, the movable portion 521 is driven by the electrostatic actuator 56 serving as the gap changing portion. As described above, the filter vibration may be induced in the variable wavelength interference filter 5 in response to the driving of the movable portion 521.
On the other hand, in the present embodiment, even when the filter vibration occurs, the fixing member 624 elastically deforms, so that the residual filter vibration can be preferably suppressed. Further, by providing the gap CL1, it is possible to suppress contact between the wavelength tunable interference filter 5 and the base 620, and it is possible to suppress deterioration and dropout of the wavelength tunable interference filter 5 due to impact of contact.

In the present embodiment, the projecting portion 623 projects from the fixed surface 621B of the base 620 toward the side surface 51A and is in contact with the side surface 51A.
In such a configuration, the distance between the side surface 51A and the fixed surface 621B can be defined by the dimension of the protruding portion 623 in the protruding direction, and the side surface 51A and the fixed surface 621B can be spaced apart from the base 620. The fixed substrate 51 can be positioned and fixed.

In the present embodiment, a plurality of protrusions 623 are provided, and have a curved surface shape in which the cross-sectional area in the direction along the fixed surface 621B decreases in the protrusion direction.
With such a configuration, the contact area between the side surface 51A and the protruding portion 623 can be reduced, so that vibration due to disturbance can be more reliably suppressed from being transmitted from the base 620 to the fixed substrate 51. Further, by abutting with the plurality of protrusions 623, it is possible to improve the positioning accuracy while reducing the contact area.

In this embodiment, the protruding portion 623 is provided on the fixed surface 621B of the base 620 and is made of a material having a higher elastic modulus than the fixing member 624.
In such a configuration, for example, the protrusion 623 can be easily formed by applying a material, such as a thermosetting resin or a photocurable resin, that hardens from a liquid to a solid to the fixing surface 621B and hardening the material. .. Further, since the stress when the forming material of the protrusion 623 is cured and contracted does not act on the wavelength tunable interference filter 5, there is no distortion due to the curing and contraction, and the wavelength tunable interference filter 5 provided by the protrusion 623 is provided. It is possible to suppress the deterioration of the resolution of. Further, even if the protruding portion 623 is formed using a highly elastic material (for example, epoxy resin or the like), it is possible to suppress the distortion of the wavelength tunable interference filter 5 due to curing contraction.

Here, in this embodiment, the variable wavelength interference filter 5 is fixed to the base 620 by using a low elastic material such as a silicone adhesive as the fixing member 624. Accordingly, even if the expansion amount (or the contraction amount) is different due to the difference in the thermal expansion coefficient between the substrates 51 and 52 of the variable wavelength interference filter 5 and the base 620, the fixing member 624 is deformed. Therefore, it is possible to prevent the fixed substrate 51 from bending due to the stress acting on the fixed substrate 51 due to the difference in thermal expansion coefficient.

Further, as the fixing member 624, a low elastic material whose elastic modulus is lower than that of the protruding portion 623 is used. For example, when a silicone adhesive is used as the fixing member 624, an epoxy resin can be used as the protruding portion 623. As a result, when the fixing member 624 is cured and shrunk, a stress in the +X direction acts on the variable wavelength interference filter 5, and even if the protruding portion 623 is pressed in the X direction, the deformation of the protruding portion 623 can be suppressed, and the variable wavelength can be changed. The position shift of the interference filter 5 can be suppressed.
In addition, assuming that the fixing member 624 undergoes curing shrinkage in a state where the position of the wavelength tunable interference filter 5 in the X direction is regulated by the protruding portion 623, the fixing member 624 is fixed by using a low-elasticity material. It can be elastically deformed, and the variable wavelength interference filter 5 can be prevented from falling off.

[Second embodiment]
Next, a second embodiment according to the present invention will be described based on the drawings.
In the second embodiment, a colorimetric sensor 3 which is an optical module in which the optical filter device 600 of the first embodiment is incorporated, and a colorimetric device 1 which is an electronic device in which the optical filter device 600 is incorporated will be described.

[Schematic configuration of color measuring device]
FIG. 11 is a block diagram showing a schematic configuration of the color measuring device 1.
The color measuring device 1 is the electronic device of the present invention. As shown in FIG. 11, the color measurement device 1 includes a light source device 2 that emits light to the inspection target X, a color measurement sensor 3, and a control device 4 that controls the overall operation of the color measurement device 1. .. Then, in the color measurement device 1, the inspection target light emitted from the light source device 2 and reflected by the inspection target X is received by the color measurement sensor 3. The color measurement device 1 is a device that analyzes and measures the chromaticity of the inspection target light, that is, the color of the inspection target X, based on the detection signal output from the received color measurement sensor 3.

[Configuration of light source device]
The light source device 2 includes a light source 21 and a plurality of lenses 22 (only one is shown in FIG. 11), and emits white light to the inspection target X. Further, the plurality of lenses 22 may include a collimator lens. In this case, the light source device 2 collimates the white light emitted from the light source 21 by the collimator lens and inspects it from a projection lens (not shown). Eject toward the target X. In the present embodiment, the colorimetric device 1 including the light source device 2 is illustrated, but when the inspection target X is a light emitting member such as a liquid crystal panel, the light source device 2 may not be provided.

[Configuration of colorimetric sensor]
The colorimetric sensor 3 constitutes the optical module of the present invention and includes the optical filter device 600 of the first embodiment. As shown in FIG. 11, the colorimetric sensor 3 includes an optical filter device 600, a detection unit 31 that receives light transmitted through the optical filter device 600, and a voltage that changes the wavelength of the transmitted light of the variable wavelength interference filter 5. And a control unit 32.
Further, the colorimetric sensor 3 is provided with an incident optical lens (not shown) that guides the reflected light (inspection target light) reflected by the inspection target X to the inside at a position facing the variable wavelength interference filter 5. Then, the colorimetric sensor 3 uses the variable wavelength interference filter 5 in the optical filter device 600 to disperse the light having a predetermined wavelength out of the inspection object light incident from the incident optical lens, and disperse the separated light to the detection unit 31. To receive light.

The detection unit 31 includes a plurality of photoelectric conversion elements, and generates an electric signal according to the amount of received light. Here, the detection unit 31 is connected to the control device 4 via, for example, the circuit board 311, and outputs the generated electric signal to the control device 4 as a light reception signal.
Further, an outer terminal formed on the outer surface of the housing 610 is connected to the circuit board 311, and is connected to the voltage control unit 32 via a circuit formed on the circuit board 311.
With such a configuration, the optical filter device 600 and the detection unit 31 can be integrally configured via the circuit board 311, and the configuration of the colorimetric sensor 3 can be simplified.

The voltage control unit 32 is connected to the outer terminal of the optical filter device 600 via the circuit board 311. Then, the voltage controller 32 drives the electrostatic actuator 56 by applying a predetermined step voltage to the electrode pads 564P and 565P based on a control signal input from the control device 4. As a result, electrostatic attraction is generated in the inter-electrode gap, and the holding part 522 bends, whereby the movable part 521 is displaced toward the fixed substrate 51 side, and the inter-reflective film gap G1 can be set to a desired dimension. Becomes

[Configuration of control device]
The control device 4 corresponds to the processing unit of the present invention and controls the overall operation of the colorimetric device 1.
As the control device 4, for example, a general-purpose personal computer, a mobile information terminal, or a computer dedicated to color measurement can be used.
As shown in FIG. 11, the control device 4 includes a light source control unit 41, a color measurement sensor control unit 42, a color measurement processing unit 43, and the like.
The light source control unit 41 is connected to the light source device 2. Then, the light source control unit 41 outputs a predetermined control signal to the light source device 2 based on, for example, a user's setting input, and causes the light source device 2 to emit white light with a predetermined brightness.
The colorimetric sensor control unit 42 is connected to the colorimetric sensor 3. Then, the colorimetric sensor control unit 42 sets the wavelength of the light to be received by the colorimetric sensor 3 based on, for example, the user's setting input, and outputs a control signal for detecting the amount of received light of this wavelength. Output to the colorimetric sensor 3. Accordingly, the voltage control unit 32 of the colorimetric sensor 3 sets the voltage applied to the electrostatic actuator 56 based on the control signal so that only the wavelength of the light desired by the user is transmitted.
The colorimetric processing unit 43 analyzes the chromaticity of the inspection target X based on the amount of received light detected by the detection unit 31.

[Operation and Effect of Second Embodiment]
The colorimetric device 1 of this embodiment includes the optical filter device 600 as in the first embodiment. As described above, the optical filter device 600 can reduce the bending and warpage of the movable substrate 52 at the time of joining, and can accurately emit the light of the desired wavelength from the variable wavelength interference filter 5.
Therefore, the colorimetric sensor 3, which is an optical module, can detect the light amount of the desired wavelength with high accuracy by the detection unit 31. As a result, the colorimetric device 1, which is an electronic device, can control the wavelength variable interference filter 5 of the optical filter device 600 to perform highly accurate colorimetric processing on the inspection target X.

[Modification of Embodiment]
It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, etc. within the scope of achieving the object of the present invention are included in the present invention.
In each of the above-described embodiments, the configuration in which the entire side surface 51A of the fixed substrate 51 of the variable wavelength interference filter 5 is fixed is illustrated, but the present invention is not limited to this. For example, the side surface 51A of the fixed substrate 51 may be partly fixed at one place. In this case, the fixing area can be reduced, and the distortion of the fixed substrate 51 due to the stress from the fixing member 624 can be suppressed more reliably.
In addition to the side surface 51A, one side surface of the fixed substrate 51 including the sides C1′-C4′ and one side surface including the sides C2′-C3′ may be fixed. Moreover, not only the side surface but also a part of the lower surface 52B of the movable substrate facing the bottom portion 622A may be fixed at one place.
Further, the corner portion including one of the four vertices C1 to C4 of the fixed substrate 51 may be fixed at one place, and similarly, one of the four vertices C1′ to C4′ of the movable substrate 52 may be fixed. You may fix the corner part containing one in one place.
In any of the above cases, the protrusion 623 is provided between the fixed position of the fixing member 624 in the variable wavelength interference filter 5 and the inner surface of the recess 622 facing the fixed position.
For example, in the case of fixing a corner portion including the apex C1′, that is, a side surface 51A including the side C1′-C2′ across the apex C1′ and a side surface including the side C1′-C4′, the inner surface of the recess 622 is fixed The protrusion 623 is provided at a position facing the fixed position of each side face fixed to the member 624.

In each of the above embodiments, the fixed substrate 51 of the variable wavelength interference filter 5 is fixed, but the present invention is not limited to this, and the movable substrate 52 may be fixed to the base 620. For example, there is a configuration in which the variable wavelength interference filter 5 is arranged with the fixed substrate 51 facing the base 620 side, and the movable substrate 52 is fixed to the base 620.
Note that both the fixed substrate 51 and the movable substrate 52 may be fixed by the fixing member 624. For example, when fixing the side surface of the wavelength tunable interference filter 5 on the side C1′-C4′ side of the fixed substrate 51 or the side surface of the wavelength tunable interference filter 5 on the side C2′-C3′ side with the fixing member 624, the movable substrate The side surfaces of 52 may be fixed together.

In each of the above-described embodiments, the configuration in which the protrusion 623 is provided on the base 620 is illustrated, but the present invention is not limited to this. For example, the protrusion 623 may be formed on at least one of the fixed substrate 51 and the movable substrate 52, that is, on the variable wavelength interference filter 5 side, and the protrusions 623 may be formed on both sides of the variable wavelength interference filter 5 and the base 620. Good.

In each of the above embodiments, the protrusion 623 has a hemispherical configuration in which the cross-sectional area in the plane direction parallel to the fixed surface 621B decreases toward the protrusion direction, but the present invention is not limited thereto. For example, it may be in the shape of a cone or a trapezoid.
Further, the projecting portion 623 is not limited to the shape in which the cross-sectional area decreases as it goes in the projecting direction as described above, and may have a columnar shape in which the cross-sectional area does not substantially change. In addition, by making the cross-sectional area small, for example, hemispherical, it is possible to reduce the contact area between the wavelength tunable interference filter 5 and the base 620 while ensuring the rigidity of the protrusion 623.

In each of the above-described embodiments, the gap changing unit includes the electrostatic actuator 56 that changes the size of the inter-reflective film gap G1 by electrostatic attraction by applying a voltage to the fixed electrode 561 and the movable electrode 562. Although illustrated, it is not limited thereto.
For example, an induction actuator may be used as the gap changing unit. In this case, a configuration in which the first induction coil is arranged instead of the fixed electrode 561 and the second induction coil or the permanent magnet is arranged instead of the movable electrode 562 can be exemplified.
Furthermore, a piezoelectric actuator may be used as the gap changing unit. In this case, the lower electrode layer, the piezoelectric film, and the upper electrode layer are stacked and arranged on the holding portion 522, and the voltage applied between the lower electrode layer and the upper electrode layer is changed as an input value to expand and contract the piezoelectric film. A configuration in which the holding portion 522 is bent can be exemplified.
Further, in each of the above-described embodiments, the configuration in which the electrostatic actuator 56 as the gap changing unit is provided on only one of the pair of substrates is illustrated, but the present invention is not limited to this, and the gap changing unit is provided on both substrates. It may be provided.

In each of the above-described embodiments, the variable wavelength interference filter 5 configured to be able to change the inter-reflection film gap G1 has been exemplified, but the present invention is not limited to this, and the size of the inter-reflection film gap G1 is fixed. May be.
In addition, in each of the above-described embodiments, the wavelength variable interference filter 5 has a configuration including a pair of substrates 51 and 52 and a pair of reflection films 54 and 55 provided on the substrates 51 and 52, respectively. Not limited to. For example, the movable substrate 52 may not be provided, and the fixed substrate 51 may be fixed to the housing 610. In this case, for example, the first reflection film, the gap spacer, and the second reflection film are laminated on one surface of the substrate (fixed substrate), and the first reflection film and the second reflection film face each other with a gap interposed therebetween. To do. With this configuration, the configuration is made of one substrate, and the spectroscopic element can be made thinner.

Further, as the electronic device of the present invention, the colorimetric device 1 is exemplified in the second embodiment, but the optical filter device, the optical module, and the electronic device of the present invention can be used in various other fields.
Hereinafter, modified examples of electronic equipment using the optical filter device of the present invention will be described. The electronic equipment illustrated below includes the optical filter device 600, and the variable wavelength interference filter 5 is housed in the housing 610.

The electronic device of the present invention can be used, for example, as a light-based system for detecting the presence of a specific substance. As such a system, for example, a vehicle-mounted gas leak detector that detects a specific gas with high sensitivity by adopting a spectroscopic measurement method using a variable wavelength interference filter included in the optical filter device of the present invention, or for a breath test A gas detection device such as a photoacoustic rare gas detector can be exemplified.
An example of such a gas detection device will be described below with reference to the drawings.

FIG. 12 is a schematic diagram showing an example of a gas detection device including a variable wavelength interference filter.
FIG. 13 is a block diagram showing the configuration of the control system of the gas detection device of FIG.
As shown in FIG. 12, the gas detection device 100 includes a sensor chip 110, a flow path 120 including a suction port 120A, a suction flow channel 120B, a discharge flow channel 120C, and a discharge port 120D, and a main body 130. Is configured.
The main body part 130 includes a sensor part cover 131 having an opening to which the flow path 120 can be attached and detached, a discharging means 133, a housing 134, an optical part 135, a filter 136, an optical filter device 600, a light receiving element 137 (detection part), and the like. It includes a detection device including the same, a control unit 138 that processes the detected signal and controls the detection unit, a power supply unit 139 that supplies electric power, and the like. In addition, the optical unit 135 emits a light source 135A and a beam splitter 135B that reflects the light incident from the light source 135A to the sensor chip 110 side and transmits the light incident from the sensor chip side to the light receiving element 137 side. And a lens 135C, a lens 135D, and a lens 135E.
Further, as shown in FIG. 13, an operation panel 140, a display unit 141, a connection unit 142 for an interface with the outside, and a power supply unit 139 are provided on the surface of the gas detection device 100. When the power supply unit 139 is a secondary battery, the connection unit 143 for charging may be provided.
Further, as shown in FIG. 13, the control unit 138 of the gas detection apparatus 100 includes a signal processing unit 144 configured by a CPU and the like, a light source driver circuit 145 for controlling the light source 135A, and wavelength tunable interference of the optical filter device 600. A signal from a voltage control unit 146 for controlling the filter 5, a light receiving circuit 147 that receives a signal from the light receiving element 137, a code from the sensor chip 110, and a signal from a sensor chip detector 148 that detects the presence or absence of the sensor chip 110 is output. The sensor chip detection circuit 149 for receiving and the ejection driver circuit 150 for controlling the ejection means 133 are provided.

Next, the operation of the gas detection device 100 as described above will be described below.
A sensor chip detector 148 is provided inside the sensor unit cover 131 above the main body unit 130, and the presence or absence of the sensor chip 110 is detected by this sensor chip detector 148. When the signal processing unit 144 detects the detection signal from the sensor chip detector 148, the signal processing unit 144 determines that the sensor chip 110 is mounted, and displays a display signal indicating that the detection operation can be performed on the display unit 141. put out.

Then, for example, when the user operates the operation panel 140 and an instruction signal to the effect that the detection process is started is output from the operation panel 140 to the signal processing unit 144, the signal processing unit 144 first causes the light source driver circuit 145 to operate. A light source activation signal is output to activate the light source 135A. When the light source 135A is driven, a stable linearly polarized laser beam having a single wavelength is emitted from the light source 135A. Further, the light source 135A includes a temperature sensor and a light amount sensor, and the information thereof is output to the signal processing unit 144. When the signal processing unit 144 determines that the light source 135A is operating stably based on the temperature and the amount of light input from the light source 135A, the signal processing unit 144 controls the ejection driver circuit 150 to operate the ejection unit 133. As a result, the gas sample containing the target substance (gas molecule) to be detected is guided from the suction port 120A to the suction channel 120B, the inside of the sensor chip 110, the discharge channel 120C, and the discharge port 120D. A dust removal filter 120A1 is provided at the suction port 120A to remove relatively large dust and some water vapor.

The sensor chip 110 is a sensor that incorporates a plurality of metal nanostructures and uses localized surface plasmon resonance. In such a sensor chip 110, an enhanced electric field is formed between the metal nanostructures by the laser light, and when gas molecules enter the enhanced electric field, Raman scattered light and Rayleigh scattered light containing information on molecular vibration are generated. To do.
These Rayleigh scattered light and Raman scattered light enter the filter 136 through the optical section 135, the filter 136 separates the Rayleigh scattered light, and the Raman scattered light enters the optical filter device 600. Then, the signal processing unit 144 controls the voltage control unit 146, adjusts the voltage applied to the wavelength tunable interference filter 5 of the optical filter device 600, and the Raman scattered light corresponding to the gas molecule to be detected is the optical filter device. The wavelength tunable interference filter 5 of 600 is used for spectral separation. After that, when the dispersed light is received by the light receiving element 137, a light receiving signal corresponding to the amount of received light is output to the signal processing unit 144 via the light receiving circuit 147.
The signal processing unit 144 compares the spectrum data of the Raman scattered light corresponding to the gas molecule to be detected obtained as described above with the data stored in the ROM, and determines whether the gas molecule is the target gas molecule. And determine the substance. In addition, the signal processing unit 144 causes the display unit 141 to display the result information and outputs the result information from the connection unit 142 to the outside.

In addition, in FIG. 12 and FIG. 13, the gas detection apparatus 100 which performs gas detection from the Raman scattered light obtained by dispersing the Raman scattered light by the wavelength variable interference filter 5 of the optical filter device 600 is illustrated. In addition, the gas detection device may be used as a gas detection device that identifies the gas type by detecting the absorbance specific to the gas. In this case, a gas sensor is used as the optical module of the present invention, in which gas is introduced into the sensor and the light absorbed by the gas among the incident light is detected. A gas detection device that analyzes and discriminates the gas flowing into the sensor by such a gas sensor is the electronic device of the present invention. Even with such a configuration, the gas component can be detected using the variable wavelength interference filter.

Further, the system for detecting the presence of a specific substance is not limited to the detection of gas as described above, a non-invasive measuring device for sugars by near-infrared spectroscopy, and non-invasive information for food, living organisms, minerals, etc. A substance component analyzer such as a measuring device can be exemplified.
Hereinafter, a food analyzer will be described as an example of the substance component analyzer.

FIG. 14 is a diagram showing a schematic configuration of a food analyzer which is an example of an electronic apparatus using the optical filter device 600.
As shown in FIG. 14, the food analysis device 200 includes a detector 210 (optical module), a control unit 220, and a display unit 230. The detector 210 emits light, a light source 211, an image pickup lens 212 into which light from a measurement object is introduced, an optical filter device 600 that separates the light introduced from the image pickup lens 212, and the separated light. And an image pickup unit 213 (detection unit) for detecting.
Further, the control unit 220 includes a light source control unit 221 that performs lighting/extinction control of the light source 211 and brightness control at the time of lighting, a voltage control unit 222 that controls the wavelength tunable interference filter 5 of the optical filter device 600, and an imaging function. A detection control unit 223 that controls the unit 213 and acquires the spectral image captured by the image capturing unit 213, a signal processing unit 224, and a storage unit 225 are provided.

When the food analyzer 200 drives the system, the light source controller 221 controls the light source 211, and the light source 211 irradiates the measurement object with light. Then, the light reflected by the measurement object passes through the imaging lens 212 and enters the optical filter device 600. The wavelength variable interference filter 5 of the optical filter device 600 is applied with a voltage capable of dispersing a desired wavelength under the control of the voltage control unit 222, and the dispersed light is imaged by the image pickup unit 213 including, for example, a CCD camera. The image is taken. The captured light is stored in the storage unit 225 as a spectral image. Further, the signal processing unit 224 controls the voltage control unit 222 to change the voltage value applied to the variable wavelength interference filter 5, and acquires the spectral image for each wavelength.

Then, the signal processing unit 224 performs arithmetic processing on the data of each pixel in each image accumulated in the storage unit 225 to obtain the spectrum of each pixel. Further, the storage unit 225 stores, for example, information about food components with respect to the spectrum, and the signal processing unit 224 analyzes the obtained spectrum data based on the food information stored in the storage unit 225. , Food components contained in the detection target, and their contents are obtained. Moreover, food calories, freshness, etc. can also be calculated from the obtained food components and contents. Furthermore, by analyzing the spectral distribution in the image, it is possible to extract parts of the food to be inspected whose freshness has decreased, and to detect foreign substances contained in food. Can also be implemented.
Then, the signal processing unit 224 performs a process of causing the display unit 230 to display the information such as the component and content of the food to be inspected, the calorie, and the freshness obtained as described above.

In addition, although an example of the food analysis device 200 is shown in FIG. 14, it can be used as a non-invasive measurement device for other information as described above with a substantially similar configuration. For example, it can be used as a bioanalyzer for analyzing biological components such as measurement and analysis of body fluid components such as blood. As such a bioanalyzer, for example, a device for measuring a body fluid component such as blood and a device for detecting ethyl alcohol can be used as a drunk driving preventive device for detecting a drinking state of a driver. Further, it can be used as an electronic endoscope system including such a bioanalyzer.
Furthermore, it can also be used as a mineral analyzer for carrying out component analysis of minerals.

Furthermore, the variable wavelength interference filter, the optical module, and the electronic device of the present invention can be applied to the following devices.
For example, by changing the intensity of light of each wavelength over time, it is also possible to transmit data by light of each wavelength. In this case, a variable wavelength interference filter provided in the optical module is used to transmit light of a specific wavelength. The data transmitted by the light of the specific wavelength can be extracted by separating the light into the light receiving section, and the data of the light of each wavelength can be extracted by the electronic device equipped with such an optical module for data extraction. Optical communication can also be performed by processing.

Further, the electronic device can be applied to a spectroscopic camera, a spectroscopic analyzer, or the like that takes a spectroscopic image by dispersing light with a variable wavelength interference filter included in the optical filter device of the present invention. An example of such a spectroscopic camera is an infrared camera incorporating a variable wavelength interference filter.
FIG. 15 is a schematic diagram showing a schematic configuration of the spectroscopic camera. As shown in FIG. 15, the spectroscopic camera 300 includes a camera body 310, an imaging lens unit 320, and an imaging section 330 (detection section).
The camera body 310 is a portion that is gripped and operated by the user.
The imaging lens unit 320 is provided in the camera body 310 and guides the incident image light to the imaging unit 330. Further, as shown in FIG. 15, the image pickup lens unit 320 includes an objective lens 321, an imaging lens 322, and an optical filter device 600 provided between these lenses.
The image capturing section 330 is configured by a light receiving element and captures the image light guided by the image capturing lens unit 320.
In such a spectroscopic camera 300, the wavelength variable interference filter 5 of the optical filter device 600 allows light of a wavelength to be imaged to pass therethrough, and thus a spectroscopic image of light of a desired wavelength can be imaged.

Furthermore, the wavelength tunable interference filter provided in the optical filter device of the present invention may be used as a bandpass filter. For example, in the light of a predetermined wavelength range emitted from the light emitting element, a narrow band centered around a predetermined wavelength It can also be used as an optical laser device that separates and transmits only light with a variable wavelength interference filter.
Further, the variable wavelength interference filter provided in the optical filter device of the present invention may be used as a biometric authentication device, for example, an authentication device for blood vessels, fingerprints, retinas, iris, etc., using light in the near infrared region or visible region. Can also be applied to.

Furthermore, the optical module and the electronic device can be used as a concentration detection device. In this case, the infrared energy (infrared light) emitted from the substance is dispersed and analyzed by the variable wavelength interference filter, and the concentration of the analyte in the sample is measured.

As described above, the optical filter device and the electronic equipment of the present invention can be applied to any device that disperses a predetermined light from incident light. Since the optical filter device can disperse a plurality of wavelengths with one device as described above, it is possible to accurately measure spectra of a plurality of wavelengths and detect a plurality of components with high accuracy. Therefore, it is possible to promote miniaturization of the optical module and the electronic device as compared with a conventional device that extracts a desired wavelength by using a plurality of devices, and for example, it can be suitably used for a portable or in-vehicle electronic device.

In the above description of the color measurement device 1, the gas detection device 100, the food analysis device 200, and the spectroscopic camera 300, an example in which the optical filter device 600 of the first embodiment is applied has been shown, but the invention is not limited to this. Of course, the optical filter devices of other embodiments can be similarly applied to the color measuring device 1 and the like.

In addition, the specific structure for carrying out the present invention may be configured by appropriately combining the above-described embodiments and modifications within a range in which the object of the present invention can be achieved, and is appropriately changed to another structure or the like. You may.

1... Colorimetric device (electronic device), 3... Colorimetric sensor (optical module), 4... Control device (control unit), 5... Wavelength variable interference filter (interference filter), 31... Detection unit (light receiving unit), 51 ... Fixed substrate, 51A... Side surface, 52... Movable substrate, 52B... Substrate surface, 54... Fixed reflective film, 55... Movable reflective film, 56... Electrostatic actuator (gap changing unit), 100... Gas detection device (electronic device) Reference numeral 137... Light receiving element (light receiving section), 138... Control section, 200... Food analysis device (electronic device), 213... Imaging section (light receiving section), 220... Control section, 300... Spectroscopic camera (electronic apparatus), 330... Image pickup part (light receiving part), 521... Movable part, 522... Holding part, 600... Optical filter device, 620... Base (base part), 621B... Fixing surface, 623... Projection part, 624... Fixing member, CL1.

Claims (11)

An interference filter in which a first substrate provided with a first reflection film and a second substrate provided with a second reflection film are arranged to face each other,
A base portion to which the first substrate is fixed,
A fixing member for fixing the side surface of the first substrate to the base portion,
The base portion includes a concave portion formed of a bottom portion and a side wall portion,
The interference filter is disposed in the recess, the second substrate is located between the bottom portion and the first substrate, the side surface of the first substrate is opposed to the side wall portion,
The first substrate includes a facing surface facing the second substrate and a non-facing surface that is the same surface as the facing surface and does not face the second substrate, as a surface intersecting the side surface.
The non-opposing surface and the bottom portion are arranged with a gap,
An optical filter device, wherein a surface of the second substrate arranged so as to intersect the side surface and the bottom portion are arranged with a gap therebetween. The optical filter device according to claim 1,
The optical filter device, wherein the fixing member is provided along one side of the side surface. The optical filter device according to claim 1 or 2,
The optical filter device, wherein the fixing member is elastically deformed by a stress according to the rotation of the first substrate having the side surface as a fixed end. The optical filter device according to any one of claims 1 to 3,
The side wall portion has a fixing surface facing the side surface and fixed to the side surface,
One of the side surface and the fixing surface has a protruding portion that protrudes toward the other of the side surface and the fixing surface and that abuts on the other side. The optical filter device according to claim 4,
Any one of the side surface and the fixed surface has a plurality of the protrusions,
The optical filter device, wherein the protruding portion has a curved surface shape that is convex toward the other side. The optical filter device according to claim 4 or 5,
The optical filter device, wherein the protruding portion is provided on the fixed surface side and has a higher elastic modulus than the fixing member. The optical filter device according to any one of claims 1 to 6 ,
The optical filter device, wherein the interference filter further includes a gap changing unit that changes a gap size between the first reflective film and the second reflective film. The optical filter device according to any one of claims 1 to 6 ,
The interference filter further includes a gap changing unit that changes a gap size between the first reflective film and the second reflective film,
The gap changing unit changes the gap size by bending the second substrate toward the first substrate,
The optical filter device, wherein the fixing member is elastically deformed by a stress according to rotation of the first substrate with a fixed position of the fixing member as a fixed end when the gap changing unit is driven. The optical filter device according to any one of claims 1 to 8 ,
The second substrate comprises a surface facing the first substrate and a plurality of second side surfaces intersecting with the surface facing the first substrate,
An optical filter device, wherein all the second side surfaces of the second substrate are not in contact with the base portion. An interference filter in which a first substrate provided with a first reflection film and a second substrate provided with a second reflection film are arranged to face each other,
A base portion to which the first substrate is fixed,
A fixing member for fixing the side surface of the first substrate to the base portion,
A detection unit for detecting the light extracted by the interference filter,
The base portion includes a concave portion formed of a bottom portion and a side wall portion,
The interference filter is disposed in the recess, the second substrate is located between the bottom portion and the first substrate, the side surface of the first substrate is opposed to the side wall portion,
The first substrate includes a facing surface facing the second substrate and a non-facing surface that is the same surface as the facing surface and does not face the second substrate, as a surface intersecting the side surface.
The non-opposing surface and the bottom portion are arranged with a gap,
The optical module, wherein a surface of the second substrate arranged so as to intersect the side surface and the bottom portion are arranged with a gap therebetween. An interference filter in which a first substrate provided with a first reflection film and a second substrate provided with a second reflection film are arranged to face each other,
A base portion to which the first substrate is fixed,
A fixing member for fixing the side surface of the first substrate to the base portion,
A processing unit that performs processing based on light from the interference filter,
The base portion includes a concave portion formed of a bottom portion and a side wall portion,
The interference filter is disposed in the recess, the second substrate is located between the bottom portion and the first substrate, the side surface of the first substrate is opposed to the side wall portion,
The first substrate includes a facing surface facing the second substrate and a non-facing surface that is the same surface as the facing surface and does not face the second substrate, as a surface intersecting the side surface.
The non-opposing surface and the bottom portion are arranged with a gap,
An electronic device, wherein a surface of the second substrate arranged so as to intersect the side surface and the bottom portion are arranged with a gap therebetween.

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