JP2016014710A - Optical filter device, optical module, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical filter device, an optical module, and an electronic apparatus with which it is possible to suppress a reduction in the resolution of an interference filter.SOLUTION: An optical filter device 600 comprises: a wavelength variable interference filter 5 (interference filter) having a pair of reflection coatings facing each other and a movable circuit board 52 on which either of the pair of reflection coatings is provided; a base 620 (base unit); a first fixation member 640 for fixing a portion of the movable circuit board 52 to the base 620; and a second fixation member 641 for fixing the movable circuit board 52 to the base 620 in an area that encloses a facing area S1 in which, in a plan view in thickness direction of the movable circuit board 52, the pair of reflection coatings on the circuit board surface crossing in the thickness direction face each other, the second fixation member 641 having a lower coefficient of elasticity to the movable circuit board 52 than the first fixation member 640.

Description

  The present invention relates to an optical filter device, an optical module, and an electronic apparatus.

2. Description of the Related Art Conventionally, there is known an optical filter device in which an interference filter in which a reflective film is disposed to face each other with a predetermined gap on a pair of substrates facing each other is housed in a casing (see, for example, Patent Document 1).
In the optical filter device described in Patent Document 1, the housing includes a base substrate to which the interference filter is fixed by a fixing member. The substrate of the interference filter is bonded and fixed to the base substrate at one place on the facing surface facing the base substrate.

  In this optical filter device, even when it is bonded and fixed using, for example, an adhesive, the stress received from the adhesive can be reduced as compared with a configuration in which substantially the entire opposing surface of the substrate is bonded. That is, as the adhesion area of the opposing surface of the substrate is smaller, the influence of tensile stress from the adhesive that shrinks at the time of curing and the stress caused by the difference in thermal expansion coefficient between the substrate and the base substrate can be suppressed.

JP2013-167701A

  However, since the substrate of the interference filter is fixed at one location, for example, when a disturbance having a frequency close to the natural frequency of the interference filter is applied to the optical filter device, the interference filter vibrates around the fixed location. There is a case. When such vibrations occur, the substrate is distorted, and the in-plane uniformity along the reflecting surface of the gap size between the reflecting films is lowered, so that there is a problem that the resolution of the interference filter is lowered.

  An object of the present invention is to provide an optical filter device, an optical module, and an electronic apparatus that can suppress a decrease in resolution of an interference filter.

  An optical filter device according to an application example of the present invention includes a pair of reflective films facing each other, an interference filter including a substrate provided with any one of the pair of reflective films, a base portion, and one of the substrates. A first fixing member that fixes a portion to the base portion, and a region surrounding a facing region of the substrate surface that intersects the thickness direction facing the pair of reflective films, in plan view in the thickness direction of the substrate, A substrate is fixed to the base portion, and a second fixing member having a lower elastic modulus to the substrate than the first fixing member is provided.

In this application example, the interference filter is fixed to the base portion by the first fixing member at a part of the substrate. The interference filter is fixed by a second fixing member having a lower elastic modulus than that of the first fixing member in a region surrounding the opposing region of the reflective film on the substrate surface in plan view in the substrate thickness direction.
Here, as described above, when a part of the substrate is fixed, vibration in the substrate thickness direction with the fixed position as the fixed end may occur in the substrate, and the resolution of the interference filter is caused by the distortion of the substrate due to the vibration. May decrease. For example, when the substrate of the interference filter is fixed at one place, vibration (first mode vibration) having a free end with the maximum amplitude at the position farthest from the fixed end (farthest part) may occur in the interference filter. is there.
Further, in order to stably emit light having a desired wavelength from the interference filter, it is necessary to make the distance between the pair of reflection films constant. For example, the reflection film may vibrate due to the spring property of the substrate. In this case, it vibrates at a natural frequency based on, for example, the spring constant of the substrate. At this time, if the natural frequency based on the spring constant of the substrate is close to the natural frequency of the interference filter such as the primary mode vibration, the vibration of the reflecting film increases due to resonance.
Further, in order to avoid the influence of such vibration, it is conceivable to wait until the vibration of the interference filter with respect to the base portion converges and the resolution of the interference filter becomes a desired range. However, in this case, the time (standby time) until the light having the desired wavelength is emitted from the interference filter becomes long.

On the other hand, in this application example, a part of the substrate is firmly fixed to the base portion by the first fixing member. Furthermore, the board | substrate surface which cross | intersects the thickness direction is fixed by the 2nd fixing member whose adhesiveness and elastic modulus are lower than a 1st fixing member. Thereby, the vibration in the substrate thickness direction such as the primary mode vibration can be absorbed by the second fixing member, and the vibration can be suppressed. Therefore, a decrease in resolution due to the influence of vibration can be suppressed, and the standby time can be shortened.
In this application example, the interference filter is fixed to the base portion by the second fixing member in a region surrounding the opposing region of the pair of reflection films in the plan view on the substrate surface. With such a configuration, in a plan view, the stress acting on the substrate from the second fixing member can be made uniform in the radial direction from the center of the opposing region to the outside along the substrate surface. As a result, even when there is a difference in thermal expansion coefficient between the substrate and the base portion, or even when the second fixing member is cured and contracted, the influence of the difference in thermal expansion coefficient and curing contraction can be reduced. The distortion of the substrate can be suppressed.
Furthermore, in this application example, when the elastic modulus of the second fixing member is made larger than that of the first fixing member, the expansion amount (or contraction amount) between the substrate and the base portion differs due to the difference in thermal expansion coefficient. However, the second fixing member can be elastically deformed while the substrate is positioned and fixed by the first fixing member, and distortion of the substrate due to a difference in thermal expansion coefficient can be suppressed.
From the above, according to this application example, the interference filter can be appropriately fixed by the first fixing member, and the influence of the vibration of the interference filter and the difference in thermal expansion coefficient can be reduced by the second fixing member. A reduction in resolution can be suppressed.

In the optical filter device of this application example, it is preferable that the second fixing member has lower adhesion to the substrate than the first fixing member.
Here, the fixing member has a higher fixing force as its adhesion and elastic modulus are higher.
In this application example, by making the adhesion and elastic modulus of the second fixing member lower than those of the first fixing member, the fixing force by the second fixing member can be made smaller than that of the first fixing member. On the other hand, the fixing force by the first fixing member can be larger than that of the second fixing member. As a result, a sufficient fixing force for appropriately fixing the interference filter can be obtained by the first fixing member, and the stress acting on the substrate from the second fixing member can be reduced.

In the optical filter device of this application example, the substrate includes a first substrate on which one of the pair of reflective films is provided, and a second substrate on which the other of the pair of reflective films is provided, and the second substrate The substrate has a drive region including a movable portion provided with the reflective film, and a holding portion that holds the movable portion so as to be movable in the thickness direction. It is preferable that the second substrate is fixed to the base portion in a region surrounding the driving region.
In this application example, the interference filter includes a first substrate and a second substrate, and the second substrate having the drive region can be bent toward the first substrate to change the gap dimension of the pair of reflective films. . Therefore, the interference filter can change the dimension of the gap between the reflective films and emit light having a wavelength corresponding to the dimension. However, since the strength of the second substrate is lower than that of the first substrate, it is easily deformed when stress is applied.
On the other hand, in this application example, the second fixing member fixes the second substrate to the base portion in a region surrounding the drive region in the second substrate in a plan view.
In such a configuration, the stress acting from the second fixing member in the direction from the center of the drive region to the outside can be made uniform outside the drive region in the plan view. Thereby, it can suppress that a 2nd board | substrate is distorted in the drive area | region containing the weak part in a 2nd board | substrate, and can suppress the fall of the control precision of a gap dimension.

In the optical filter device of this application example, the second fixing member has a first edge along the outer periphery of the drive region and a second edge having a constant distance from the first edge in the plan view. It is preferable.
In this application example, the second substrate is fixed by the second fixing member in a region having a first edge along the outer periphery of the drive region and a second edge having a constant distance from the first edge in plan view. The
In such a configuration, the width dimension of the second fixing member in the plan view (the width dimension in the radial direction with respect to the center of the drive region) can be made constant. Thereby, the stress which acts on the second substrate from the second fixing member can be made more uniform, and the distortion of the substrate can be more reliably suppressed.

In the optical filter device of this application example, it is preferable that the second fixing member is annular in the plan view.
In this application example, by making the second fixing member annular, it is possible to further uniform the stress acting on the second substrate from the second fixing member in the radial direction with respect to the center of the drive region. Distortion can be suppressed more reliably.

In the optical filter device of this application example, it is preferable that the second fixing member has a slit.
In this application example, for example, even when an adhesive is used for the second fixing member and a release gas is generated from the adhesive, the filter is viewed from the space inside the second fixing member through the slit in the plan view. Can be discharged. Moreover, in the filter plan view, it is possible to suppress a difference in internal pressure between the space inside the second fixing member and the space outside, and control accuracy of the gap between the reflection films due to the internal pressure difference. Can be suppressed.

In the optical filter device according to this application example, it is preferable that the second fixing member has a plurality of the slits and has a shape that is rotationally symmetric with respect to the center of the driving region in the plan view.
In this application example, the plurality of slits divide the second fixing member into a plurality of parts, and each part has a shape that is rotationally symmetric with each other. Therefore, even when a slit is provided in the second fixing member, it is possible to equalize the stress acting on the driving region of the substrate from the second fixing member, and to suppress distortion in the driving region of the substrate.

An optical module according to an application example of the invention includes a pair of reflective films facing each other, an interference filter including a substrate provided with any one of the pair of reflective films, a base portion, and a part of the substrate A first fixing member that fixes the substrate to the base portion, and a region of the substrate surface that intersects the thickness direction in a plan view in the thickness direction of the substrate and that surrounds a facing region where the pair of reflective films face each other. A second fixing member that has lower adhesion and elastic modulus to the substrate than the first fixing member, and a detection unit that detects light extracted by the interference filter. It is characterized by that.
In this application example, as described above, it is possible to suppress a decrease in resolution of the interference filter in the optical filter device, and it is possible to emit light from the optical filter device while maintaining the resolution. Therefore, in the optical module, it is possible to detect the amount of light having a desired wavelength with high resolution at the light receiving unit.

An electronic apparatus according to an application example of the invention includes a pair of reflective films facing each other, an interference filter including a substrate provided with any one of the pair of reflective films, a base portion, and a part of the substrate A first fixing member that fixes the substrate to the base portion, and a region of the substrate surface that intersects the thickness direction in a plan view in the thickness direction of the substrate and that surrounds a facing region where the pair of reflective films face each other. A second fixing member that has lower adhesion and elastic modulus to the substrate than the first fixing member, and a control unit that controls the interference filter. To do.
In this application example, as described above, it is possible to suppress a decrease in resolution of the interference filter in the optical filter device, and it is possible to emit light from the optical filter device while maintaining the resolution. Therefore, it is possible to provide an electronic apparatus capable of performing high-precision processing based on high-resolution light output from the optical filter device.

The top view which shows schematic structure of the optical filter device of 1st embodiment which concerns on this invention. Sectional drawing which shows schematic structure of the optical filter device of 1st embodiment. The top view which shows schematic structure of the wavelength variable interference filter of 1st embodiment. 1 is a cross-sectional view showing a schematic configuration of a variable wavelength interference filter according to a first embodiment. The figure which shows typically the primary mode vibration in a wavelength variable interference filter. The figure which shows typically the secondary mode vibration in a wavelength variable interference filter. The graph which shows the stabilization time of a wavelength variable interference filter. The block diagram which shows schematic structure of the color measuring apparatus of 2nd embodiment. Schematic which shows the gas detection apparatus which is an example of the electronic device of this invention. The block diagram which shows the structure of the control system of the gas detection apparatus of FIG. The figure which shows schematic structure of the food analyzer which is an example of the electronic device of this invention. FIG. 3 is a schematic diagram illustrating a schematic configuration of a spectroscopic camera that is an example of the electronic apparatus of the invention.

Hereinafter, a first embodiment according to the present invention will be described with reference to the drawings.
[Configuration of optical filter device]
FIG. 1 is a plan view showing a schematic configuration of an optical filter device 600 which is a first embodiment of the optical filter device of the present invention. 2 is a cross-sectional view taken along line AA in FIG. In FIG. 2, the structure of the wavelength variable interference filter described later is schematically shown in a simplified manner.
The optical filter device 600 is a device that extracts and emits light having a predetermined target wavelength from incident light to be inspected, and includes a housing 610 and a wavelength variable interference filter 5 housed in the housing 610. Yes. Such an optical filter device 600 can be incorporated into an optical module such as a colorimetric sensor, or an electronic device such as a colorimetric device or a gas analyzer. Note that the configuration of an optical module or electronic device including the optical filter device 600 will be described in detail later.

[Configuration of wavelength tunable interference filter]
FIG. 3 is a plan view showing a schematic configuration of the variable wavelength interference filter 5. FIG. 4 is a cross-sectional view showing a schematic configuration of the variable wavelength interference filter 5 cut along the line BB in FIG.
As shown in FIGS. 3 and 4, the variable wavelength interference filter 5 includes a fixed substrate 51 corresponding to the first substrate of the present invention and a movable substrate 52 corresponding to the second substrate of the present invention. The fixed substrate 51 and the movable substrate 52 are each formed of, for example, various types of glass, quartz, or the like. In the present embodiment, the fixed substrate 51 and the movable substrate 52 are configured of quartz glass. Then, as shown in FIG. 4, these substrates 51 and 52 are integrally formed by being bonded by a bonding film 53 (first bonding film 531 and second bonding film 532). Specifically, the first bonding portion 513 of the fixed substrate 51 and the second bonding portion 523 of the movable substrate 52 are bonded by a bonding film 53 made of, for example, a plasma polymerized film mainly containing siloxane. .
In the following description, the wavelength tunable interference filter 5 was seen from a plan view seen from the thickness direction of the fixed substrate 51 or the movable substrate 52, that is, from the stacking direction of the fixed substrate 51, the bonding film 53, and the movable substrate 52. The plan view is referred to as a filter plan view.

As shown in FIG. 4, the fixed substrate 51 is provided with a fixed reflective film 54 constituting one of the pair of reflective films of the present invention. The movable substrate 52 is provided with a movable reflective film 55 that constitutes the other of the pair of reflective films of the present invention. The fixed reflection film 54 and the movable reflection film 55 are disposed to face each other via the inter-reflection film gap G1.
The wavelength variable interference filter 5 is provided with an electrostatic actuator 56 corresponding to the gap changing portion of the present invention, which is used to adjust the distance (gap size) of the gap G1 between the reflective films 54 and 55. Yes. The electrostatic actuator 56 includes a fixed electrode 561 provided on the fixed substrate 51 and a movable electrode 562 provided on the movable substrate 52, and each electrode 561 and 562 are opposed to each other. These fixed electrode 561 and movable electrode 562 are opposed to each other through an interelectrode gap. Here, the electrodes 561 and 562 may be provided directly on the substrate surfaces of the fixed substrate 51 and the movable substrate 52, respectively, or may be provided via other film members.
In the present embodiment, the configuration in which the gap G1 between the reflection films is formed smaller than the gap between the electrodes is exemplified. However, depending on the wavelength range transmitted by the wavelength variable interference filter 5, for example, the gap G1 between the reflection films is formed between the electrodes. You may form larger than a gap.
Further, in the filter plan view, one side of the movable substrate 52 (for example, the side C <b> 3-C <b> 4 in FIG. 3) protrudes outside the side C <b> 3 ′ -C <b> 4 ′ of the fixed substrate 51. The protruding portion of the movable substrate 52 is an electrical component 525 that is not bonded to the fixed substrate 51, and the surface exposed when the wavelength tunable interference filter 5 is viewed from the fixed substrate 51 side is provided with electrode pads 564P and 565P described later. The electrical surface 524 is obtained.
Similarly, in the filter plan view, one side of the fixed substrate 51 (the side opposite to the electrical component 525) protrudes outside the movable substrate 52.

(Configuration of fixed substrate)
As shown in FIG. 4, the fixed substrate 51 is formed with an electrode placement groove 511 and a reflection film installation portion 512 by etching. The fixed substrate 51 is formed to have a thickness larger than that of the movable substrate 52, and the fixed substrate is caused by electrostatic attraction when a voltage is applied between the fixed electrode 561 and the movable electrode 562 or internal stress of the fixed electrode 561. There is no 51 deflection.

The electrode arrangement groove 511 is formed in an annular shape centering on the plane center point O of the fixed substrate 51 in the filter plan view (see FIG. 3). The groove bottom surface of the electrode arrangement groove 511 is an electrode installation surface 511A on which the fixed electrode 561 is arranged.
The reflection film installation part 512 is formed so as to protrude from the center part of the electrode arrangement groove 511 toward the movable substrate 52 in the plan view. The protruding front end surface of the reflection film installation portion 512 is a reflection film installation surface 512A.

A fixed electrode 561 constituting the electrostatic actuator 56 is provided on the electrode installation surface 511A. The fixed electrode 561 is provided in a region of the electrode installation surface 511 </ b> A that faces a movable electrode 562 of the movable portion 521 described later. In addition, an insulating film for ensuring insulation between the fixed electrode 561 and the movable electrode 562 may be stacked over the fixed electrode 561.
As shown in FIG. 3, the fixed substrate 51 is provided with a fixed extraction electrode 563 connected to the outer peripheral edge of the fixed electrode 561. The fixed extraction electrode 563 is provided along a connection electrode groove 511B (see FIG. 4) formed from the electrode placement groove 511 toward the side C3′-C4 ′ (electrical component 525 side). The connection electrode groove 511B is provided with a bump 565A projecting toward the movable substrate 52, and the fixed extraction electrode 563 extends to the bump 565A. Then, the bump 565A comes into contact with the fixed connection electrode 565 provided on the movable substrate 52 side to be electrically connected. The fixed connection electrode 565 extends from a region facing the connection electrode groove 511B to the electrical surface 524, and forms a fixed electrode pad 565P on the electrical surface 524.

  In the present embodiment, a configuration in which one fixed electrode 561 is provided on the electrode installation surface 511A is shown. For example, a configuration in which two concentric circles centered on the plane center point O are provided (double electrode configuration). ) Etc. In addition, a configuration in which a transparent electrode is provided on the fixed reflective film 54 or a conductive fixed reflective film 54 may be used to form a connection electrode from the fixed reflective film 54 to the fixed-side electrical component. In this case, the fixed electrode 561 may have a structure in which a part thereof is cut off in accordance with the position of the connection electrode.

As described above, the reflective film installation portion 512 is formed in a substantially cylindrical shape that is coaxial with the electrode arrangement groove 511 and has a smaller diameter than the electrode arrangement groove 511, and is formed on the movable substrate 52 of the reflection film installation portion 512. An opposing reflection film installation surface 512A is provided.
As shown in FIG. 4, a fixed reflection film 54 is installed in the reflection film installation portion 512. As the fixed reflective film 54, for example, a metal film such as Ag or an alloy film such as an Ag alloy can be used. For example, a dielectric multilayer film in which the high refractive layer is TiO ₂ and the low refractive layer is SiO ₂ may be used. Further, a reflective film in which a metal film (or alloy film) is laminated on a dielectric multilayer film, a reflective film in which a dielectric multilayer film is laminated on a metal film (or alloy film), a single refractive layer (TiO ₂ or SiO ₂₎ and a metal film (or alloy film) and the like may be used reflective film formed by laminating a.

  Further, an antireflection film may be formed at a position corresponding to the fixed reflection film 54 on the light incident surface of the fixed substrate 51 (the surface on which the fixed reflection film 54 is not provided). This antireflection film can be formed by alternately laminating a low refractive index film and a high refractive index film, and reduces the reflectance of visible light on the surface of the fixed substrate 51 and increases the transmittance.

  Of the surfaces of the fixed substrate 51 facing the movable substrate 52, the surfaces on which the electrode placement groove 511, the reflective film installation portion 512, and the connection electrode groove 511 </ b> B are not formed by etching constitute the first bonding portion 513. The first bonding portion 513 is provided with a first bonding film 531. By bonding the first bonding film 531 to the second bonding film 532 provided on the movable substrate 52, as described above, The fixed substrate 51 and the movable substrate 52 are joined.

(Configuration of movable substrate)
The movable substrate 52 includes a circular movable portion 521 centered on the plane center point O, and a holding portion 522 that is coaxial with the movable portion 521 and holds the movable portion 521.

The movable part 521 is formed with a thickness dimension larger than that of the holding part 522. The movable portion 521 is formed to have a diameter larger than at least the diameter of the outer peripheral edge of the reflection film installation surface 512A in the filter plan view. The movable part 521 is provided with a movable electrode 562 and a movable reflective film 55.
Similar to the fixed substrate 51, an antireflection film may be formed on the surface of the movable portion 521 opposite to the fixed substrate 51. Such an antireflection film can be formed by alternately laminating a low refractive index film and a high refractive index film, reducing the reflectance of visible light on the surface of the movable substrate 52 and increasing the transmittance. Can be made.

The movable electrode 562 is opposed to the fixed electrode 561 with a predetermined inter-electrode gap, and is formed in an annular shape having the same shape as the fixed electrode 561. The movable electrode 562 forms an electrostatic actuator 56 together with the fixed electrode 561. The movable substrate 52 is provided with a movable connection electrode 564 connected to the outer peripheral edge of the movable electrode 562. The movable connection electrode 564 is provided over the electrical surface 524 along a position facing the connection electrode groove 511 </ b> B provided in the fixed substrate 51 from the movable portion 521, and the inner terminal portion is provided on the electrical surface 524. A movable electrode pad 564P that is electrically connected to is configured.
Further, as described above, the fixed connection electrode 565 is provided on the movable substrate 52, and this fixed connection electrode 565 is connected to the fixed extraction electrode 563 at the formation position of the bump 565A (see FIG. 3). .

The movable reflective film 55 is provided in the central part of the movable surface 521A of the movable part 521 so as to face the fixed reflective film 54 via the gap G1. As the movable reflective film 55, a reflective film having the same configuration as that of the fixed reflective film 54 described above is used.
In the present embodiment, as described above, an example in which the interelectrode gap is larger than the dimension of the inter-reflection film gap G1 is shown, but the present invention is not limited to this. For example, when infrared rays or far infrared rays are used as the measurement target light, the gap G1 may be larger than the gap between the electrodes depending on the wavelength range of the measurement target light.

The holding part 522 is a diaphragm that surrounds the periphery of the movable part 521, and has a thickness dimension smaller than that of the movable part 521. Such a holding part 522 is easier to bend than the movable part 521, and the movable part 521 can be displaced toward the fixed substrate 51 by a slight electrostatic attraction. At this time, since the movable portion 521 has a thickness dimension larger than that of the holding portion 522 and becomes rigid, even when the holding portion 522 is pulled toward the fixed substrate 51 by electrostatic attraction, the shape of the movable portion 521 changes. Absent. Therefore, the movable reflective film 55 provided on the movable portion 521 is not bent, and the fixed reflective film 54 and the movable reflective film 55 can be always maintained in a parallel state.
In this embodiment, the diaphragm-like holding part 522 is illustrated, but the present invention is not limited to this. For example, a configuration in which beam-like holding parts arranged at equiangular intervals around the plane center point O are provided. And so on.

  In the movable substrate 52, a region facing the first joint portion 513 is a second joint portion 523. The second bonding portion 523 is provided with the second bonding film 532. As described above, the second bonding film 532 is bonded to the first bonding film 531, so that the fixed substrate 51 and the movable substrate 52 are bonded. Is done.

[Case configuration]
As shown in FIG. 2, the housing 610 includes a base 620 corresponding to the base portion of the present invention and a lid 630, and houses the variable wavelength interference filter 5 therein.
The base 620 is a ceramic substrate formed by laminating and firing ceramic thin layers. The base 620 is provided with a side wall portion 621 having a frame shape in a plan view of the filter on a surface facing the lid 630. In addition, the base 620 has a concave portion 622 formed so as to be surrounded by the side wall portion 621. Further, the lid 630 is joined to the lid joining surface 621A that is the surface of the side wall portion 621 on the lid 630 side.
The variable wavelength interference filter 5 is placed on the bottom 622A of the recess 622 with the movable substrate 52 facing the bottom 622A. The variable wavelength interference filter 5 is fixed to the base 620 at two locations by the first fixing member 640 and the second fixing member 641.

As shown in FIG. 1, the first fixed member 640 is provided at a corner including the vertex C <b> 4 of the movable substrate 52. As shown in FIG. 2, the first fixed member 640 is in contact with the substrate side surface 52 </ b> A that is a surface along the substrate thickness direction of the movable substrate 52 and the bottom portion 622 </ b> A of the base 620.
The first fixing member 640 is formed of a fixing material having higher elastic modulus (rigidity) and adhesion than the second fixing member 641. The higher the elastic modulus and adhesion of the fixing member, the higher the fixing force. Therefore, the first fixing member 640 has a higher fixing force than the second fixing member 641.
As such a first fixing member 640, for example, a polyimide adhesive having an elastic modulus of 1 GPa or more can be used.

  As shown in FIG. 1, the second fixing member 641 is a region surrounding the driving region S2 including the facing region S1 where the reflecting films 54 and 55 face each other in the filter plan view. 2) and the base 620 are fixed. The drive region S2 is a region including the movable portion 521 and the holding portion 522 in the filter plan view, and the outer peripheral edge thereof overlaps with the outer peripheral edge of the holding portion 522. The second fixing member 641 is provided along the outer periphery of the drive region S2 outside the drive region S2 in the filter plan view. In the illustrated example, the second fixing member 641 is provided in a substantially annular shape with the plane center point O as the center (that is, the center of gravity of the facing region S1) and a constant width dimension. That is, in the second fixing member 641, the distance between the inner edge (first edge of the present invention) and the outer edge (second edge of the present invention) along the outer periphery of the drive region S2 is constant in the filter plan view.

  As shown in FIG. 1, the second fixing member 641 has a plurality of slits 641A along the radial direction at positions that are rotationally symmetric with respect to the plane center point O in the filter plan view. The second fixing member 641 is divided into a plurality of portions (two in the illustrated example) that are rotationally symmetric with respect to the plane center point O by the slits 641A. By providing the slit 641A, for example, even when a released gas is generated from the second fixing member 641 or an adhesive that adheres the translucent member 629 described later, the second fixing member 641 is inserted through the slit 641A. It is possible to discharge to the outside from the inner space.

  The second fixing member 641 is a member having a lower elastic modulus and adhesion to the movable substrate than the first fixing member 640. The second fixing member 641 preferably has an elastic modulus of 1/100 or less with respect to the fixed substrate 51 and the base 620. Accordingly, when a difference in expansion (or contraction) occurs due to a difference in thermal expansion coefficient between the fixed substrate 51 and the base 620, the second fixing member 641 that joins the fixed substrate 51 and the base 620 to each other. And the stress acting on the fixed substrate 51 due to the difference in thermal expansion coefficient can be suppressed.

As such a second fixing member 641, for example, a silicone-based adhesive having an elastic modulus of 0.01 GPa or more and less than 10 GPa can be used.
Further, for example, as the second fixing member 641, a low elastic adhesive film in which a low elastic adhesive such as the above-mentioned silicone adhesive is applied to a film-like substrate may be used. By using such an adhesive film, it is easy to form the second fixing member 641 in a predetermined installation area.

A groove 623 in which the second fixing member 641 is disposed is provided in the bottom 622A of the recess 622. The above-described second fixing member 641 is disposed on the groove bottom portion 623A of the groove portion 623.
The groove 623 is provided in a region at least overlapping the movable substrate 52 in the filter plan view. The dimension of the groove part 623 in the substrate thickness direction is equal to or smaller than the dimension of the second fixing member 641, and preferably is substantially the same dimension.

By providing the groove portion 623 and accommodating the second fixing member 641 therein, the optical filter in the substrate thickness direction is compared with the case where the groove portion 623 is not provided and the second fixing member 641 is provided directly on the bottom portion 622A. The size of the device 600 can be reduced.
Further, the groove portion 623 is provided at a position at least overlapping with the movable substrate 52 of the wavelength tunable interference filter 5 in the filter plan view, whereby the fixing position of the first fixing member 640 is used as the fixed end. Even if this vibration occurs in the movable substrate 52. Interference between the wavelength variable interference filter 5 and the base 620 can be suppressed.

  The bottom 622A is provided with a light passage hole 628 for allowing light emitted from the wavelength variable interference filter 5 (or light incident on the wavelength variable interference filter) to pass therethrough. A translucent member 629 such as a glass plate is bonded to the light passage hole 628 by a bonding agent such as low melting point glass.

  In addition, a sealing hole 622 </ b> B that penetrates to the outside of the housing 610 is provided in the bottom 622 </ b> A of the recess 622. The sealing hole 622B is, for example, a hole for sucking the gas inside the housing 610 or replacing it with an inert gas when the optical filter device 600 is manufactured. The inside of the housing 610 is vacuumed or decompressed. In this state, metal sealing can be performed with a sealing member 622C (see FIG. 2) such as Au.

  Furthermore, an internal terminal 622D (see FIG. 1) connected to the electrode pads 564P and 565P of the wavelength variable interference filter is provided on the bottom 622A of the recess 622. In a portion where the internal terminal 622D is formed, for example, a through hole (not shown) that penetrates to the outside of the housing 610 is provided, and a metal member such as Ag that is electrically connected to the internal terminal 622D is provided in the through hole. Is filled. This metal member is connected to an external terminal (not shown) provided outside the base 620, whereby the internal terminal 622D and the external terminal are electrically connected.

  The lid 630 has a rectangular outer shape similar to that of the base 620 in the filter plan view, and is formed of glass that can transmit light. The lid 630 is bonded to the lid bonding surface 621A in a state where the wavelength variable interference filter 5 is disposed on the base 620.

[Method of manufacturing optical filter device]
First, the second fixing member 641 is disposed at a predetermined position of the groove bottom portion 623A of the groove portion 623. Then, the wavelength tunable interference filter 5 is positioned and positioned at the groove bottom 623A where the second fixing member 641 is positioned. Thereafter, the second fixing member 641 is cured.
Thereafter, the first fixing member 640 is applied and the first fixing member 640 is cured.
In this way, the second fixing member 641 can be disposed at a predetermined position with respect to the wavelength variable interference filter 5.

  In the present embodiment, the wavelength variable interference filter 5 is disposed with the movable substrate 52 facing the base 620 side. For this reason, the distance between the movable substrate 52 and the groove bottom portion 623A is larger at the formation position of the holding portion 522 than the outer position of the holding portion 522 in the filter plan view. Therefore, even when the second fixing member 641 disposed on the groove bottom 623A is deformed along the substrate surface 52B when the wavelength tunable interference filter 5 is disposed, the movable substrate 52 is located on the inner side of the outer peripheral edge of the holding unit 522. It can suppress that the 2nd fixing member 641 contacts.

Thereafter, the electrode pads 564P and 565P of the variable wavelength interference filter 5 and the internal terminal 622D are electrically connected by wire bonding or the like.
Then, the base 620 and the lid 630 are joined using, for example, low melting glass.
Thereafter, the gas inside the housing 610 is sucked from the sealing hole 622B, and the housing internal space is brought into a vacuum or a reduced pressure state. While maintaining this state, a sealing member 622C such as Au is inserted into the sealing hole 622B and melted to close the sealing hole 622B.
As described above, the optical filter device 600 of this embodiment is manufactured.

[Relationship between vibration of tunable interference filter and second fixing member]
Hereinafter, each mode vibration in the vibration generated when the wavelength variable interference filter 5 is fixed at one place of the first fixing member 640 will be described.
FIG. 5 is a diagram schematically showing a vibration state in the primary mode vibration in the wavelength tunable interference filter 5.
In the tunable interference filter 5 fixed at one place on the vertex C4 side, vibration due to primary mode vibration may occur as shown in FIG. That is, in the wavelength tunable interference filter 5, there may be a primary mode vibration that is a vibration in the substrate thickness direction in which the vertex C <b> 4 is a fixed end and the vertex C <b> 2 ′ that is the diagonal of the vertex C <b> 4 is a free end. In the primary mode vibration, as shown in FIG. 5, the amplitude increases from the vertex C4 which is the fixed end toward the vertex C2 ′ side.

FIG. 6 is a diagram schematically showing a vibration state in the secondary mode vibration in the wavelength variable interference filter 5.
In the wavelength variable interference filter 5 fixed at one place on the vertex C4 side or at two places on the vertex C4 and vertex C2 ′ side, vibration due to secondary mode vibration may occur as shown in FIG. That is, in the filter plan view, vibration due to torsion with the imaginary line V passing through the vertex C4 and the vertex C2 ′ as an axis and the vertex C4 as a fixed end may occur. In the secondary mode vibration, as shown in FIG. 6, the amplitude increases as the distance from the imaginary line V increases along the plane orthogonal to the thickness direction of each of the substrates 51 and 52.

As described above, when bending vibration in the substrate thickness direction such as primary mode vibration or secondary mode vibration occurs in the wavelength variable interference filter 5, each of the reflective films 54 and 55 is distorted or the size of the gap G1 between the reflective films is reduced. The in-plane uniformity may be reduced, and the resolution of the wavelength variable interference filter 5 may be reduced. Further, when the natural frequency of each mode is close to the natural frequency (hereinafter also referred to as mirror frequency) in the vibration of the reflection film of the wavelength variable interference filter 5, there is a possibility that the dimension of the gap G1 varies due to resonance. . The mirror frequency is a value that mainly depends on the configuration of the movable substrate 52, such as the mass of the movable portion 521 and the spring coefficient of the holding portion 522.
In the present embodiment, the wavelength variable interference filter 5 is fixed to the base 620 by a second fixing member 641 provided on the substrate surface 52B. With such a configuration, the second fixing member 641 can absorb vibrations of the movable substrate 52 that are deformed in the substrate thickness direction, such as the above-described mode vibrations, and residual vibrations can be suppressed.

[Operational effects of the first embodiment]
In the present embodiment, the variable wavelength interference filter 5 is fixed to the base 620 by a first fixing member 640 at one location of the movable substrate 52. The wavelength variable interference filter 5 is fixed by a second fixing member 641 having lower adhesion and elastic modulus than the first fixing member 640 in a region surrounding the facing region S1 of the substrate surface 52B in the filter plan view. Yes.
Here, when the wavelength tunable interference filter 5 is fixed at one place, the first-order mode vibration (see FIG. 5), the second-order mode vibration (see FIG. 6) or the like may occur as described above. There is a risk that the resolution will be reduced. In order to avoid the influence of such a decrease in resolution, when waiting until the vibration of the wavelength tunable interference filter 5 converges, the waiting time until the light having the desired wavelength is emitted becomes longer.
On the other hand, in this embodiment, the substrate surface 52B of the movable substrate 52 is fixed by the second fixing member 641 having a lower elastic modulus than the first fixing member 640. Thereby, the residual vibration in the wavelength variable interference filter 5 can be suppressed as described above. Therefore, a decrease in resolution of the wavelength variable interference filter 5 can be suppressed, and the waiting time can be shortened.
In addition, by making the elastic modulus of the second fixing member 641 larger than that of the first fixing member 640, even when the expansion amount (or contraction amount) between the movable substrate 52 and the base 620 differs due to the difference in thermal expansion coefficient. While the movable substrate 52 is positioned and fixed by the first fixing member 640, the second fixing member 641 can be elastically deformed, and distortion of the substrates 51 and 52 due to the difference in thermal expansion coefficient can be suppressed.

  Further, by making the adhesion and elastic modulus of the second fixing member 641 lower than those of the first fixing member 640, the fixing force by the second fixing member 641 can be made smaller than that of the first fixing member 640. On the other hand, the fixing force by the first fixing member 640 can be larger than that of the second fixing member 641. As a result, a sufficient fixing force for appropriately fixing the variable wavelength interference filter 5 can be obtained by the first fixing member 640, and the stress acting on the movable substrate 52 from the second fixing member 641 can be reduced.

The wavelength variable interference filter 5 is fixed to the base 620 by a second fixing member 641 in a region surrounding the facing region S1 in the filter plan view of the substrate surface 52B.
In such a configuration, in plan view, the second fixed member 641 faces the opposing region S1 of the movable substrate 52 in the radial direction from the planar center point O that is the center of the opposing region S1 along the substrate surface 52B. The stress acting can be made uniform. Thereby, even when the thermal expansion coefficient difference exists between the movable substrate 52 and the base 620, or even when the second fixing member 641 is cured and contracted, the influence of the thermal expansion coefficient difference and the curing contraction can be reduced. Distortion of each substrate 51, 52 in the facing region S1 can be suppressed.

FIG. 7 shows a case where the second fixing member 641 is provided along the four sides of the movable substrate 52 so as to surround the facing region S1 in plan view (each measurement point is indicated by a circle in FIG. 7). It is a graph which shows the stabilization time (ms) in each measurement object wavelength (nm) about each when it fixes at one place (in FIG. 7, each measurement point is shown with a square). The stabilization time is a time required until the dimension of the gap G1 converges to an allowable range for a desired measurement accuracy. Moreover, the upper limit (measurement limit) of the allowable value of the stabilization time is indicated by a dotted line, and the target value is indicated by a one-dot chain line.
As shown in FIG. 7, when fixed at one corner, the stabilization time is equal to or greater than the target value at a plurality of measurement wavelengths, although the stabilization time is equal to or less than the measurement limit at all measurement wavelengths. On the other hand, when it is fixed so as to surround the facing region S1 in a plan view, the stabilization time is equal to or less than the target value at all measurement wavelengths. As described above, the stabilization time can be shortened by fixing the movable substrate 52 to the base 620 so as to surround the facing region S1.

Here, in this embodiment, the movable portion 521 on which the movable reflective film 55 is formed is movably held by the holding portion 522 on the movable substrate 52 of the pair of substrates 51 and 52.
In such a wavelength tunable interference filter 5, resonance of the movable portion 521 is likely to occur with respect to vibrations generated in the wavelength tunable interference filter 5 due to disturbance or the like (for example, primary mode vibration or secondary mode vibration has occurred), and the resolution is high. It tends to decline. Further, when the movable portion 521 is moved by the electrostatic actuator 56, vibration may occur in the wavelength variable interference filter 5 due to the reaction. When the wavelength variable interference filter 5 vibrates, the spectral accuracy is also lowered due to the resonance described above.
On the other hand, in the present embodiment, the second fixing member 641 is provided along the outer peripheral edge of the drive region S2 outside the drive region S2 in the movable substrate 52. As described above, the vibration and resonance of the wavelength variable interference filter 5 can be suppressed. Therefore, the residual vibration of the movable substrate 52 can be suitably suppressed, and a decrease in resolution can be suppressed.
The second fixing member 641 is provided along the outer peripheral edge of the drive region S2 outside the drive region S2 in the movable substrate 52. In such a configuration, the stress acting on the region of the movable substrate 52 outside the holding portion 522 can be made uniform in the radial direction from the plane center point O toward the outside along the substrate surface 52B. Thereby, it can suppress that the holding | maintenance part 522 provided in the movable substrate 52 is distorted, and can suppress the fall of the control precision of the dimension of the gap G1.

  Moreover, in this embodiment, the 2nd fixing member 641 is a substantially annular shape, and the width dimension is constant. Thereby, the stress acting on the movable substrate 52 from the second fixed member 641 can be made more uniform from the plane center point O toward the outside in the radial direction, and the distortion of each of the substrates 51 and 52 can be more reliably performed. Can be suppressed.

  In the present embodiment, the second fixing member 641 has a slit 641A. Thereby, for example, even when a release gas is generated from the adhesive such as the second fixing member 641, the gas is discharged to the outside through the slit 641 </ b> A from the space inside the second fixing member 641 in the filter plan view. Can do. Moreover, in the filter plan view, it is possible to suppress the difference in internal pressure between the space inside the second fixing member 641 and the space outside, and control of the inter-reflective film gap G1 due to the internal pressure difference occurring. A decrease in accuracy can be suppressed.

  Further, in the present embodiment, the second fixing member 641 is provided with slits 641A at positions that are rotationally symmetric with respect to the plane center point O in the filter plan view, and is divided into a plurality of portions that are rotationally symmetric with respect to each other. Yes. Therefore, even when the slit 641A is provided in the second fixing member 641, the stress acting on the movable substrate 52 from the second fixing member 641 can be made uniform.

In the present embodiment, the first fixing member 640 fixes the movable substrate 52 at one place. In such a configuration, a material having a higher elastic modulus and higher adhesion to the movable substrate 52 can be used as the first fixing member 640, and the fixing force by the first fixing member 640 can be further increased. it can.
For example, when the movable substrate 52 is fixed at a plurality of locations by the first fixing member 640, stress in a direction in which the movable substrate 52 is compressed or pulled acts between the plurality of fixed locations according to the difference in thermal expansion coefficient. Each substrate 51, 52 may be distorted.
On the other hand, in this embodiment, since it fixes at one place, even if it uses a highly elastic member as the 1st fixing member 640, the said stress can be suppressed and distortion of each board | substrate 51,52 is suppressed. it can.
Moreover, since the fixing force by the first fixing member 640 can be increased, the fixing force of the second fixing member 641 can be decreased. Therefore, a material having a lower elastic modulus and adhesion can be used as the second fixing member 641, and the stress acting on the movable substrate 52 from the second fixing member 641 can be further suppressed.

  In the present embodiment, the first fixing member 640 fixes the wavelength variable interference filter 5 at one corner including the vertex C4 of the rectangular movable substrate 52. In such a configuration, as described above, vibration with the vertex C4 as the fixed end and the vertex C2 ′ as the free end occurs as the primary mode vibration (see FIG. 5). In such a configuration, in the primary mode vibration generated in the wavelength variable interference filter 5, the distance between the fixed end and the free end can be maximized, and the natural frequency of the primary mode vibration generated in the wavelength variable interference filter 5. (Primary frequency) can be reduced. In the variable wavelength interference filter 5 including the pair of substrates 51 and 52 and configured to move the movable portion 521 of the movable substrate 52 as in the present embodiment, the natural frequency (mirror frequency) of the movable portion 521 is provided. Is greater than the primary frequency. Therefore, by reducing the primary frequency, the primary frequency can be kept away from the mirror frequency, and resonance due to the primary mode vibration can be suppressed.

  In the present embodiment, the first fixing member 640 fixes the movable substrate 52 on the side surface along the thickness direction of the movable substrate 52. In such a configuration, it is possible to suppress the stress in the direction along the substrate surface 52 </ b> B from acting on the movable substrate 52 from the first fixed member 640. Therefore, it is possible to further uniform the radial stress with respect to the plane center point O along the substrate surface 52B, which acts on the facing region S1 of the movable substrate 52.

[Second Embodiment]
Next, 2nd embodiment which concerns on this invention is described based on drawing.
In the second embodiment, a colorimetric sensor 3 that is an optical module in which the optical filter device 600 of the first embodiment is incorporated, and a colorimetric apparatus 1 that is an electronic apparatus in which the optical filter device 600 is incorporated will be described.

[Schematic configuration of color measuring device]
FIG. 8 is a block diagram illustrating a schematic configuration of the colorimetric apparatus 1.
The color measuring device 1 is an electronic device of the present invention. As shown in FIG. 8, the color measurement device 1 includes a light source device 2 that emits light to the inspection target X, a color measurement sensor 3, and a control device 4 that controls the overall operation of the color measurement device 1. . In this color measurement device 1, the color measurement sensor 3 receives the inspection target light emitted from the light source device 2 and reflected by the inspection target X. The color measurement device 1 is a device that analyzes and measures the chromaticity of the inspection target light, that is, the color of the inspection target X, based on the detection signal output from the received color measurement sensor 3.

[Configuration of light source device]
The light source device 2 includes a light source 21 and a plurality of lenses 22 (only one is shown in FIG. 8), and emits white light to the inspection target X. The plurality of lenses 22 may include a collimator lens. In this case, the light source device 2 converts the white light emitted from the light source 21 into parallel light by the collimator lens and inspects from a projection lens (not shown). Inject toward the target X. In the present embodiment, the colorimetric device 1 including the light source device 2 is illustrated. However, for example, when the inspection target X is a light emitting member such as a liquid crystal panel, the light source device 2 may not be provided.

[Configuration of colorimetric sensor]
The colorimetric sensor 3 constitutes the optical module of the present invention, and includes the optical filter device 600 of the first embodiment. As shown in FIG. 8, the colorimetric sensor 3 includes an optical filter device 600, a detection unit 31 that receives light transmitted through the optical filter device 600, and a voltage that changes the wavelength of light transmitted through the wavelength variable interference filter 5. And a control unit 32.
Further, the colorimetric sensor 3 includes an incident optical lens (not shown) that guides reflected light (inspection light) reflected by the inspection target X to a position facing the wavelength variable interference filter 5. Then, the colorimetric sensor 3 uses the wavelength variable interference filter 5 in the optical filter device 600 to split the light having a predetermined wavelength out of the inspection target light incident from the incident optical lens. Receive light.

The detection unit 31 is a light receiving unit according to the present invention, and includes a plurality of photoelectric exchange elements, and generates an electric signal corresponding to the amount of received light. Here, the detection unit 31 is connected to the control device 4 via, for example, the circuit board 311, and outputs the generated electric signal to the control device 4 as a light reception signal.
The circuit board 311 is connected to an outer terminal formed on the outer surface of the housing 610, and is connected to the voltage control unit 32 through a circuit formed on the circuit board 311.
In such a configuration, the optical filter device 600 and the detection unit 31 can be integrally configured via the circuit board 311, and the configuration of the colorimetric sensor 3 can be simplified.

  The voltage control unit 32 is connected to the outer terminal of the optical filter device 600 via the circuit board 311. The voltage control unit 32 drives the electrostatic actuator 56 by applying a predetermined step voltage to the electrode pads 564P and 565P based on a control signal input from the control device 4. As a result, an electrostatic attractive force is generated in the gap between the electrodes, and the holding portion 522 is bent, so that the movable portion 521 is displaced toward the fixed substrate 51, and the gap G1 between the reflection films can be set to a desired dimension. It becomes.

[Configuration of control device]
The control device 4 controls the overall operation of the color measurement device 1.
As this control device 4, for example, a general-purpose personal computer, a portable information terminal, a color measurement dedicated computer, or the like can be used.
And the control apparatus 4 is provided with the light source control part 41, the colorimetric sensor control part 42, the colorimetric processing part 43 grade | etc., As shown in FIG.
The light source control unit 41 is connected to the light source device 2. Then, the light source control unit 41 outputs a predetermined control signal to the light source device 2 based on, for example, a user setting input, and causes the light source device 2 to emit white light with a predetermined brightness.
The colorimetric sensor control unit 42 is connected to the colorimetric sensor 3. The colorimetric sensor control unit 42 sets a wavelength of light received by the colorimetric sensor 3 based on, for example, a user's setting input, and outputs a control signal for detecting the amount of light received at this wavelength. Output to the colorimetric sensor 3. Thereby, the voltage control unit 32 of the colorimetric sensor 3 sets the voltage applied to the electrostatic actuator 56 so as to transmit only the wavelength of light desired by the user based on the control signal.
The colorimetric processing unit 43 analyzes the chromaticity of the inspection target X from the amount of received light detected by the detection unit 31.

[Operational effects of the second embodiment]
The color measurement device 1 of this embodiment includes an optical filter device 600 as in the first embodiment. As described above, the optical filter device 600 can reduce bending and warping of the movable substrate 52 at the time of bonding, and can emit light having a desired wavelength from the wavelength variable interference filter 5 with high accuracy.
Therefore, the colorimetric sensor 3 which is an optical module can detect the light amount of the desired wavelength with high accuracy by the detection unit 31. Thereby, the colorimetric apparatus 1 which is an electronic apparatus can perform highly accurate colorimetric processing on the inspection target X by controlling the wavelength variable interference filter 5 of the optical filter device 600.

[Modification of Embodiment]
In addition, this invention is not limited to the above-mentioned embodiment, The deformation | transformation in the range which can achieve the objective of this invention, improvement, etc. are included in this invention.
For example, in each of the above embodiments, the configuration in which the first fixing member 640 is provided at one corner in the filter plan view is illustrated, but the present invention is not limited to this. For example, the first fixing member 640 may be provided in a place other than the corner. Moreover, it is good also as a structure which provides the 1st fixing member 640 in multiple places.
Further, in each of the above embodiments, the configuration in which the first fixing member 640 is provided on the substrate side surface 52A of the movable substrate 52 is exemplified, but the present invention is not limited thereto, and may be provided on the substrate surface 52B.
In addition, by providing the first fixing member 640 at one location on the substrate side surface 52A and fixing the wavelength variable interference filter 5, it is possible to suppress the stress in the direction along the substrate surface 52B from acting on the wavelength variable interference filter 5. It is possible to suppress the decrease in the resolution of the wavelength variable interference filter 5 more reliably.

  In each of the above embodiments, the second fixing member 641 has an annular configuration in the filter plan view, but the present invention is not limited to this, and has rotational symmetry with respect to the plane center point O. The configuration may be a rectangular shape or a polygonal shape. Further, the second fixing member 641 is not limited to the configuration having rotational symmetry, and may be provided in a substantially annular shape at a position surrounding the facing region S1 in the filter plan view. Specifically, the second fixing member 641 may be provided along the outer peripheral edge of the overlapping region where the pair of substrates 51 and 52 overlap in the filter plan view.

  In each of the embodiments described above, the configuration in which the two fixing members 641 are provided with the two slits 641A is illustrated, but the present invention is not limited to this, and the three or more slits 641A are positioned at rotationally symmetrical positions. A plurality of slits may be provided at any position other than the rotationally symmetric position. Alternatively, one slit 641A may be provided. In addition, the slit 641A may not be provided if the above-described problem such as the generation of the released gas does not occur.

In each of the above embodiments, the movable substrate 52 of the variable wavelength interference filter 5 is fixed. However, the present invention is not limited to this, and the fixed substrate 51 may be fixed to the base 620. For example, the wavelength variable interference filter 5 is disposed with the fixed substrate 51 facing the base 620 side, and the fixed substrate 51 is fixed to the base 620.
One of the substrates 51 and 52 may be fixed by the first fixing member 640 and the other may be fixed by the second fixing member 641.

In each of the above-described embodiments, the gap change unit includes the electrostatic actuator 56 that changes the size of the gap G1 between the reflection films by applying electrostatic voltage to the fixed electrode 561 and the movable electrode 562. Although illustrated, it is not limited to this.
For example, an induction actuator may be used as the gap changing unit. In this case, a configuration in which the first induction coil is arranged instead of the fixed electrode 561 and the second induction coil or permanent magnet is arranged instead of the movable electrode 562 can be exemplified.
Furthermore, a piezoelectric actuator may be used as the gap changing unit. In this case, the lower electrode layer, the piezoelectric film, and the upper electrode layer are stacked on the holding unit 522, and the voltage applied between the lower electrode layer and the upper electrode layer is varied as an input value, so that the piezoelectric film can be expanded and contracted. A configuration in which the holding portion 522 is bent can be exemplified.
Moreover, in each said embodiment, although the structure which provided the electrostatic actuator 56 as a gap change part only in one side of a pair of board | substrate was illustrated, this invention is not limited to this, A gap change part is provided in both board | substrates. It may be provided.

In each of the above embodiments, the wavelength variable interference filter 5 configured to be able to change the inter-reflective film gap G1 is exemplified, but the present invention is not limited to this, and the interference filter is an interference filter in which the size of the inter-reflective film gap G1 is fixed. May be.
In each of the above-described embodiments, the wavelength variable interference filter 5 includes a pair of substrates 51 and 52 and a pair of reflective films 54 and 55 provided on the substrates 51 and 52, respectively. It is not limited to. For example, the movable substrate 52 may not be provided, and the fixed substrate 51 may be fixed to the housing 610. In this case, for example, the first reflective film, the gap spacer, and the second reflective film are stacked on one surface of the substrate (fixed substrate), and the first reflective film and the second reflective film are opposed to each other through the gap. To do. In this configuration, a single substrate is used, and the spectral element can be made thinner.

Moreover, although the colorimetric apparatus 1 was illustrated in the second embodiment as the electronic apparatus of the present invention, the optical filter device, optical module, and electronic apparatus of the present invention can be used in various other fields.
Hereinafter, modified examples of the electronic apparatus using the optical filter device of the present invention will be described. Note that an electronic apparatus exemplified below includes the optical filter device 600, and the wavelength variable interference filter 5 is housed in a housing 610.

The electronic device of the present invention can be used, for example, as a light-based system for detecting the presence of a specific substance. As such a system, for example, an in-vehicle gas leak detector that detects a specific gas with high sensitivity by adopting a spectroscopic measurement method using a variable wavelength interference filter provided in the optical filter device of the present invention, or a breath test A gas detection device such as a photoacoustic rare gas detector can be exemplified.
An example of such a gas detection device will be described below with reference to the drawings.

FIG. 9 is a schematic diagram illustrating an example of a gas detection apparatus including a wavelength variable interference filter.
FIG. 10 is a block diagram showing a configuration of a control system of the gas detection device of FIG.
As illustrated in FIG. 9, the gas detection device 100 includes a sensor chip 110, a flow path 120 including a suction port 120A, a suction flow path 120B, a discharge flow path 120C, and a discharge port 120D, a main body 130, It is configured with.
The main body unit 130 includes a sensor unit cover 131 having an opening through which the flow channel 120 can be attached, a discharge unit 133, a housing 134, an optical unit 135, a filter 136, an optical filter device 600, a light receiving element 137 (detection unit), and the like. And a control unit 138 that processes a detected signal and controls the detection unit, a power supply unit 139 that supplies power, and the like. The optical unit 135 emits light, and a beam splitter 135B that reflects light incident from the light source 135A toward the sensor chip 110 and transmits light incident from the sensor chip toward the light receiving element 137. And a lens 135C, a lens 135D, and a lens 135E.
Further, as shown in FIG. 9, an operation panel 140, a display unit 141, a connection unit 142 for interface with the outside, and a power supply unit 139 are provided on the surface of the gas detection device 100. When the power supply unit 139 is a secondary battery, a connection unit 143 for charging may be provided.
Further, as shown in FIG. 10, the control unit 138 of the gas detection apparatus 100 includes a signal processing unit 144 configured by a CPU, a light source driver circuit 145 for controlling the light source 135A, and a wavelength variable interference of the optical filter device 600. A voltage control unit 146 for controlling the filter 5, a light receiving circuit 147 that receives a signal from the light receiving element 137, a code of the sensor chip 110 is read, and a signal from the sensor chip detector 148 that detects the presence or absence of the sensor chip 110 is obtained. A sensor chip detection circuit 149 for receiving and a discharge driver circuit 150 for controlling the discharge means 133 are provided.

Next, operation | movement of the above gas detection apparatuses 100 is demonstrated below.
A sensor chip detector 148 is provided inside the sensor unit cover 131 at the upper part of the main body unit 130, and the sensor chip detector 148 detects the presence or absence of the sensor chip 110. When the signal processing unit 144 detects the detection signal from the sensor chip detector 148, the signal processing unit 144 determines that the sensor chip 110 is attached, and displays a display signal for displaying on the display unit 141 that the detection operation can be performed. put out.

  For example, when the operation panel 140 is operated by the user and an instruction signal to start the detection process is output from the operation panel 140 to the signal processing unit 144, the signal processing unit 144 first sends the signal processing unit 144 to the light source driver circuit 145. A light source activation signal is output to activate the light source 135A. When the light source 135A is driven, laser light having a single wavelength and stable linear polarization is emitted from the light source 135A. The light source 135A includes a temperature sensor and a light amount sensor, and the information is output to the signal processing unit 144. When the signal processing unit 144 determines that the light source 135A is stably operating based on the temperature and light quantity input from the light source 135A, the signal processing unit 144 controls the discharge driver circuit 150 to operate the discharge unit 133. Thereby, the gas sample containing the target substance (gas molecule) to be detected is guided from the suction port 120A to the suction channel 120B, the sensor chip 110, the discharge channel 120C, and the discharge port 120D. The suction port 120A is provided with a dust removal filter 120A1, and relatively large dust, a part of water vapor, and the like are removed.

The sensor chip 110 is a sensor that incorporates a plurality of metal nanostructures and uses localized surface plasmon resonance. In such a sensor chip 110, an enhanced electric field is formed between the metal nanostructures by laser light, and when gas molecules enter the enhanced electric field, Raman scattered light and Rayleigh scattered light including information on molecular vibrations are generated. To do.
These Rayleigh scattered light and Raman scattered light enter the filter 136 through the optical unit 135, and the Rayleigh scattered light is separated by the filter 136, and the Raman scattered light enters the optical filter device 600. Then, the signal processing unit 144 controls the voltage control unit 146 to adjust the voltage applied to the wavelength variable interference filter 5 of the optical filter device 600, and the Raman scattered light corresponding to the gas molecule to be detected is converted into the optical filter device. The light is dispersed by 600 wavelength variable interference filter 5. Thereafter, when the dispersed light is received by the light receiving element 137, a light reception signal corresponding to the amount of received light is output to the signal processing unit 144 via the light receiving circuit 147.
The signal processing unit 144 compares the spectrum data of the Raman scattered light corresponding to the gas molecule to be detected obtained as described above and the data stored in the ROM, and determines whether or not the target gas molecule is the target gas molecule. To determine the substance. Further, the signal processing unit 144 displays the result information on the display unit 141 or outputs the result information from the connection unit 142 to the outside.

  9 and 10 exemplify the gas detection device 100 that performs gas detection from the Raman scattered light obtained by spectrally dividing the Raman scattered light by the wavelength variable interference filter 5 of the optical filter device 600. In addition, as a gas detection apparatus, you may use as a gas detection apparatus which specifies gas classification by detecting the intrinsic absorbance of gas. In this case, a gas sensor that allows gas to flow into the sensor and detects light absorbed by the gas in the incident light is used as the optical module of the present invention. A gas detection device that analyzes and discriminates the gas flowing into the sensor by such a gas sensor is an electronic apparatus of the present invention. Even in such a configuration, it is possible to detect a gas component using the wavelength variable interference filter.

In addition, the system for detecting the presence of a specific substance is not limited to the detection of the gas as described above, but a non-invasive measuring device for saccharides by near-infrared spectroscopy, and non-invasive information on food, living body, minerals, etc. A substance component analyzer such as a measuring device can be exemplified.
Hereinafter, a food analyzer will be described as an example of the substance component analyzer.

FIG. 11 is a diagram illustrating a schematic configuration of a food analysis apparatus that is an example of an electronic apparatus using the optical filter device 600.
As shown in FIG. 11, the food analysis apparatus 200 includes a detector 210 (optical module), a control unit 220, and a display unit 230. The detector 210 includes a light source 211 that emits light, an imaging lens 212 into which light from a measurement object is introduced, an optical filter device 600 that splits light introduced from the imaging lens 212, and the dispersed light. And an imaging unit 213 (detection unit) for detection.
The control unit 220 also turns on and off the light source 211 and controls the brightness at the time of lighting, a voltage control unit 222 that controls the wavelength variable interference filter 5 of the optical filter device 600, and imaging. A detection control unit 223 that controls the unit 213 to acquire a spectral image captured by the imaging unit 213, a signal processing unit 224, and a storage unit 225.

  In the food analyzer 200, when the system is driven, the light source 211 is controlled by the light source control unit 221, and light is irradiated from the light source 211 to the measurement object. Then, the light reflected by the measurement object enters the optical filter device 600 through the imaging lens 212. The wavelength variable interference filter 5 of the optical filter device 600 is applied with a voltage capable of dispersing a desired wavelength under the control of the voltage control unit 222, and the dispersed light is captured by an imaging unit 213 configured by, for example, a CCD camera or the like. Imaged. The captured light is accumulated in the storage unit 225 as a spectral image. In addition, the signal processing unit 224 controls the voltage control unit 222 to change the voltage value applied to the wavelength tunable interference filter 5, and acquires a spectral image for each wavelength.

Then, the signal processing unit 224 performs arithmetic processing on the data of each pixel in each image accumulated in the storage unit 225, and obtains a spectrum at each pixel. In addition, the storage unit 225 stores, for example, information related to food components with respect to the spectrum, and the signal processing unit 224 analyzes the obtained spectrum data based on the information related to food stored in the storage unit 225. The food component contained in the detection target and its content are obtained. Moreover, a food calorie, a freshness, etc. are computable from the obtained food component and content. Furthermore, by analyzing the spectral distribution in the image, it is possible to extract a portion of the food to be inspected that has reduced freshness, and to detect foreign substances contained in the food. Can also be implemented.
Then, the signal processing unit 224 performs processing for causing the display unit 230 to display information such as the components and contents of the food to be examined, the calories, and the freshness obtained as described above.

Moreover, although the example of the food analysis apparatus 200 is shown in FIG. 11, it can utilize also as a noninvasive measurement apparatus of the other information as mentioned above by the substantially same structure. For example, it can be used as a biological analyzer for analyzing biological components such as measurement and analysis of body fluid components such as blood. As such a bioanalytical device, for example, a device that detects ethyl alcohol as a device that measures a body fluid component such as blood, it can be used as a drunk driving prevention device that detects the drunk state of the driver. Further, it can also be used as an electronic endoscope system provided with such a biological analyzer.
Furthermore, it can also be used as a mineral analyzer for performing component analysis of minerals.

Furthermore, the variable wavelength interference filter, the optical module, and the electronic apparatus of the present invention can be applied to the following apparatuses.
For example, it is possible to transmit data using light of each wavelength by changing the intensity of light of each wavelength over time. In this case, light of a specific wavelength is transmitted by a wavelength variable interference filter provided in the optical module. The data transmitted by the light of the specific wavelength can be extracted by separating the light and receiving the light at the light receiving unit, and the electronic data having such a data extraction optical module can be used to extract the light data of each wavelength. By processing, optical communication can be performed.

The electronic apparatus can also be applied to a spectroscopic camera, a spectroscopic analyzer, or the like that captures a spectroscopic image by dispersing light with a wavelength variable interference filter included in the optical filter device of the present invention. An example of such a spectroscopic camera is an infrared camera incorporating a wavelength variable interference filter.
FIG. 12 is a schematic diagram showing a schematic configuration of the spectroscopic camera. As shown in FIG. 12, the spectroscopic camera 300 includes a camera body 310, an imaging lens unit 320, and an imaging unit 330 (detection unit).
The camera body 310 is a part that is gripped and operated by a user.
The imaging lens unit 320 is provided in the camera body 310 and guides incident image light to the imaging unit 330. In addition, as shown in FIG. 12, the imaging lens unit 320 includes an objective lens 321, an imaging lens 322, and an optical filter device 600 provided between these lenses.
The imaging unit 330 includes a light receiving element, and images the image light guided by the imaging lens unit 320.
In such a spectroscopic camera 300, a spectral image of light having a desired wavelength can be captured by transmitting light having a wavelength to be imaged by the variable wavelength interference filter 5 of the optical filter device 600.

Furthermore, the tunable interference filter provided in the optical filter device of the present invention may be used as a bandpass filter. For example, among the light in a predetermined wavelength range emitted from the light emitting element, a narrow band centering on a predetermined wavelength is used. It can also be used as an optical laser device that transmits only light by spectrally splitting it with a variable wavelength interference filter.
In addition, the wavelength variable interference filter provided in the optical filter device of the present invention may be used as a biometric authentication device, for example, an authentication device for blood vessels, fingerprints, retinas, irises, etc. using light in the near infrared region or visible region. It can also be applied to.

  Furthermore, an optical module and an electronic device can be used as a concentration detection device. In this case, the infrared energy (infrared light) emitted from the substance is spectrally analyzed by the variable wavelength interference filter, and the analyte concentration in the sample is measured.

  As described above, the optical filter device and the electronic apparatus of the present invention can be applied to any apparatus that separates predetermined light from incident light. And since the said optical filter device can disperse | distribute a some wavelength with one device as mentioned above, the measurement of the spectrum of a some wavelength and the detection with respect to a some component can be implemented accurately. Therefore, compared with the conventional apparatus which takes out a desired wavelength with a plurality of devices, it is possible to promote downsizing of the optical module and the electronic device, and for example, it can be suitably used for a portable or in-vehicle electronic device.

  In the description of the colorimetric device 1, the gas detection device 100, the food analysis device 200, and the spectroscopic camera 300 described above, an example in which the optical filter device 600 of the first embodiment is applied is shown, but the present invention is not limited to this. Of course, optical filter devices of other embodiments can be similarly applied to the colorimetric apparatus 1 and the like.

  In addition, the specific structure for carrying out the present invention may be configured by appropriately combining the above-described embodiments and modification examples within the scope in which the object of the present invention can be achieved, and may be appropriately changed to other structures and the like. May be.

  DESCRIPTION OF SYMBOLS 1 ... Color measuring apparatus (electronic device), 3 ... Color measuring sensor (optical module), 4 ... Control apparatus (control part), 5 ... Variable wavelength interference filter (interference filter), 31 ... Detection part (light-receiving part), 51 DESCRIPTION OF SYMBOLS ... Fixed substrate, 52 ... Movable substrate, 52B ... Substrate surface, 54 ... Fixed reflection film, 55 ... Movable reflection film, 100 ... Gas detection apparatus (electronic device), 137 ... Light receiving element (light receiving part), 138 ... Control part, DESCRIPTION OF SYMBOLS 200 ... Food analyzer (electronic device), 213 ... Imaging part (light receiving part), 220 ... Control part, 300 ... Spectral camera (electronic device), 330 ... Imaging part (light receiving part), 521 ... Movable part, 522 ... Holding Part, 600 ... optical filter device, 620 ... base (base part), 640 ... first fixing member, 641 ... second fixing member.

Claims (9)

An interference filter having a pair of reflective films facing each other and a substrate provided with any one of the pair of reflective films;
A base part;
A first fixing member for fixing a part of the substrate to the base portion;
In a plan view of the substrate in the thickness direction, the substrate is fixed to the base portion in a region surrounding a facing region of the substrate surface that intersects the thickness direction, where the pair of reflective films face each other, and the first fixing member And a second fixing member having a lower elastic modulus to the substrate. The optical filter device of claim 1.
The optical filter device, wherein the second fixing member has lower adhesion to the substrate than the first fixing member. The optical filter device according to claim 1 or 2,
The substrate includes a first substrate on which one of the pair of reflective films is provided, and a second substrate on which the other of the pair of reflective films is provided,
The second substrate has a drive region including a movable portion provided with the reflective film, and a holding portion that holds the movable portion movably in the thickness direction,
The optical filter device, wherein the second fixing member fixes the second substrate to the base portion in an area surrounding the driving area in the plan view. The optical filter device according to any one of claims 1 to 3,
The optical filter device, wherein the second fixing member has a first edge along an outer periphery of the drive region and a second edge having a constant distance from the first edge in the plan view. The optical filter device according to claim 4.
Said 2nd fixing member is cyclic | annular in the said planar view. The optical filter device characterized by the above-mentioned. The optical filter device according to claim 5, wherein
The optical filter device, wherein the second fixing member has a slit. The optical filter device according to claim 6.
The second fixing member includes a plurality of the slits, and has a shape that is rotationally symmetric with respect to the center of the driving region in the plan view. An interference filter having a pair of reflective films facing each other and a substrate provided with any one of the pair of reflective films;
A base part;
A first fixing member for fixing a part of the substrate to the base portion;
In a plan view of the substrate in the thickness direction, the substrate is fixed to the base portion in a region surrounding a facing region of the substrate surface that intersects the thickness direction, where the pair of reflective films face each other, and the first fixing member Than the second fixing member having a low elastic modulus to the substrate,
An optical module comprising: a detection unit that detects light extracted by the interference filter. An interference filter having a pair of reflective films facing each other and a substrate provided with any one of the pair of reflective films;
A base part;
A first fixing member for fixing a part of the substrate to the base portion;
In a plan view of the substrate in the thickness direction, the substrate is fixed to the base portion in a region surrounding a facing region of the substrate surface that intersects the thickness direction, where the pair of reflective films face each other, and the first fixing member Than the second fixing member having a low elastic modulus to the substrate,
An electronic device comprising: a control unit that controls the interference filter.

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