JP6732477B2 - LED light emitting device - Google Patents

Description

The present invention relates to an LED light emitting device using an LED chip.

Patent Document 1 discloses an example of a conventional LED light emitting device. The LED light-emitting device disclosed in the same document has a base material, a wiring pattern formed on the base material (corresponding to various conductor layers in the patent document), an LED, and a conduction between the LED and the wiring pattern. A wire is provided. A recessed portion (corresponding to the first recess and the second recess in the patent document) is provided on the surface of the base material, and the LED and the wire are housed in the recessed portion. ..

Further, Patent Document 2 discloses an LED light emitting device including a protection element for preventing a reverse voltage from being applied to the LED chip. In the LED light emitting device disclosed in the document, an LED chip and a protection element are mounted on one surface of an insulating substrate. Further, a translucent resin that covers the LED chip and the protection element and a reflector (reflection case) that reflects light traveling laterally from the LED chip in a direction in which the one surface faces are provided.

JP, 2011-97011, A Japanese Patent No. 3673621

Since the LED light-emitting device disclosed in Patent Document 1 does not include a protection element for protecting the LED chip from a reverse voltage, a space for incorporating the protection element by using an external circuit different from the LED light-emitting device. And man-hours were required.

In the LED light-emitting device disclosed in Patent Document 2, since the LED chip and the protective element are mounted on one surface of the insulating substrate, the LED light-emitting device projects more than the insulating substrate. Furthermore, the translucent resin and the reflector are unavoidably thicker than the LED chip. For these reasons, it is not easy to reduce the dimension of the LED light emitting device in the thickness direction.

Therefore, the present invention was created in view of the above problems, and an object thereof is to provide an LED light emitting device including an LED chip and a protection element that protects the LED chip from a reverse voltage, in a thickness direction dimension thereof. An object of the present invention is to provide an LED light emitting device that can be reduced in size and can be thinned.

The LED light-emitting device provided by the first aspect of the present invention has a main surface and a back surface facing opposite sides in the thickness direction, and includes a base material including at least an insulating member, and formed on the base material. A substrate having a wiring pattern, an LED chip mounted on the substrate, an LED wire for electrically connecting the LED chip and the wiring pattern, and mounted on the substrate and electrically connected to the LED chip And a protection element for preventing a reverse voltage from being applied to the LED chip, wherein the base material has a main surface opening opening to the main surface, and the main surface opening. A LED housing portion that is connected to the LED housing portion from the main surface opening portion to the LED housing portion, and a LED housing portion that is connected to the LED housing portion from the main surface opening portion, and A back surface housing recess including a back surface opening opening to the back surface and a protection element housing part connected to the main surface side from the back surface opening, wherein the LED chip has the thickness direction and the thickness. In the vertical direction, all of them are accommodated in the LED accommodating portion, and the LED wire is partially accommodated in the LED wire accommodating portion in the thickness direction view and the thickness direction. The protective element is entirely housed in the protective element housing portion as viewed in the thickness direction and in the thickness direction.

In a preferred embodiment of the LED light emitting device, the LED housing portion has an LED-side side surface connected to the main surface opening, and an LED-side bottom surface connected to the LED-side side surface from the back surface side.

In a preferred embodiment of the LED light emitting device, the LED wire accommodating portion has an LED wire side side surface connected to the main surface opening, and an LED wire side bottom surface connected to the LED wire side side surface from the back surface side. And.

In a preferred embodiment of the LED light emitting device, the LED wire-side bottom surface is located closer to the main surface side than the LED-side bottom surface in the thickness direction.

In a preferred embodiment of the LED light-emitting device, the protection element housing portion has a protection element side side surface connected to the back surface opening, and a protection element side bottom surface connected to the protection element side side surface from the main surface side. ..

In a preferred embodiment of the LED light-emitting device, the protective element-side bottom surface is the back surface side with respect to the LED wire-side bottom surface in the thickness direction, and the main surface side with respect to the LED-side bottom surface. Located in.

In a preferred embodiment of the LED light emitting device, the LED-side bottom surface and the protective element-side bottom surface are separated from each other in a direction perpendicular to the thickness direction.

In a preferred embodiment of the LED light-emitting device, the wiring pattern has an LED-side bottom surface portion which covers the LED-side bottom surface and to which the LED chip is joined.

In a preferred embodiment of the LED light-emitting device, the wiring pattern has an LED-side back surface electrode part that covers a part of the back surface of the base material.

In a preferred embodiment of the LED light emitting device, the wiring pattern has an LED side surface portion that covers at least a part of the LED side surface.

In a preferred embodiment of the LED light-emitting device, the base material further includes LED-side leads that are supported by the insulating member and are made of metal, and the LED-side leads include at least the LED-side bottom surface portion. It is in contact with the LED side back surface electrode portion.

In another preferred embodiment of the LED light-emitting device, the wiring pattern passes through the base material in the thickness direction, and the LED-side through portion that electrically connects the LED-side bottom surface portion and the LED-side rear surface electrode portion. It has a hole part.

In another preferred embodiment of the LED light emitting device, the wiring pattern covers a part of the main surface of the base material, and an LED-side main surface electrode portion connected to a part of the LED-side side surface portion. An LED-side side surface electrode part that covers a part of the side surface of the base material and is connected to the LED-side main surface electrode part and the LED-side rear surface electrode part.

In a preferred embodiment of the LED light emitting device, the wiring pattern has a part of the LED wire side bottom surface, and has an LED wire side bottom surface part to which the LED wire is bonded.

In a preferred embodiment of the LED light-emitting device, the wiring pattern has an LED wire-side back surface electrode portion that covers a part of the back surface of the base material.

In a preferred embodiment of the LED light-emitting device, the wiring pattern has a protective-element-side bottom surface portion which covers the protective-element-side bottom surface and to which the protective element is joined.

In a preferred embodiment of the LED light-emitting device, the wiring pattern covers a part of the side surface of the protective element side and is connected to the bottom surface portion of the protective element side and the LED wire side rear surface electrode side surface of the protective element side. Parts.

In a preferred embodiment of the LED light emitting device, the wiring pattern has an LED wire side surface portion that covers at least a part of the LED wire side surface.

In a preferred embodiment of the LED light-emitting device, the base material further includes an LED wire-side lead that is supported by the insulating member and is made of metal, and the LED wire-side lead is at least the LED. The wire-side bottom surface portion and the LED wire-side rear surface electrode portion are in contact with each other.

In a preferred embodiment of the LED light emitting device, the LED wire side lead is further in contact with the protective element side bottom surface portion.

In another preferred embodiment of the LED light emitting device, the wiring pattern is an LED that penetrates the base material in the thickness direction and electrically connects the LED wire side bottom surface portion and the protection element side bottom surface portion. The wire side through hole portion is provided.

In another preferred embodiment of the LED light-emitting device, the wiring pattern covers a part of the main surface of the base material and is connected to a part of the LED wire-side side surface part of the LED wire-side main part. A surface electrode part and an LED wire side surface electrode part that covers a part of the side surface of the base material and is connected to the LED wire side main surface electrode part and the LED wire side back surface electrode part.

In a preferred embodiment of the LED light emitting device, a protective element wire for electrically connecting the protective element and the wiring pattern is further provided.

In a preferred embodiment of the LED light-emitting device, the back surface accommodating recess further includes a protection element wire accommodating portion that is connected to the main surface side from the back surface opening and that is connected to the protection element accommodating portion. A part of the protective element wire is accommodated in the protective element wire accommodating portion as viewed in the thickness direction and in the thickness direction.

In a preferred embodiment of the LED light-emitting device, the protective element wire accommodating portion has a protective element wire side surface connected to the back opening, and a protective element connected to the protective element wire side surface from the main surface side. And a wire-side bottom surface.

In a preferred embodiment of the LED light emitting device, the wiring pattern covers a part of a bottom surface of the protection element wire side, and a bottom surface portion of the protection element wire side to which the protection element wire is bonded, And a side surface portion of the protection element wire side that covers at least a part of the side surface of the protection element wire side.

In a preferred embodiment of the LED light emitting device, the wire side surface portion for the protection element and the LED side back surface electrode portion are connected.

In a preferred embodiment of the LED light emitting device, the protection element is a Zener diode.

In a preferred embodiment of the LED light-emitting device, the anode of the LED chip and the cathode of the Zener diode are electrically connected via the wiring pattern, and the cathode of the LED chip and the anode of the Zener diode are connected. Are electrically connected via the wiring pattern.

In a preferred embodiment of the LED light-emitting device, a light-transmitting resin that covers the LED chip and transmits light from the LED chip is further provided.

In a preferred embodiment of the LED light emitting device, a lens for irradiating light from the LED chip in a predetermined direction is further provided.

According to the present invention, the LED chip is housed in the LED housing portion, and the LED wire is housed in the LED wire housing portion. The LED chip and the LED wire are entirely housed in the main surface housing recess. Further, the protective element is housed in the protective element housing portion, and the entire protective element is housed in the back surface housing recess. Accordingly, the LED chip, the LED wire, and the protection element do not protrude from the substrate in the thickness direction. Therefore, it is possible to reduce the thickness of the LED light emitting device.

Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a principal part top view which shows the LED light-emitting device which concerns on 1st embodiment. It is a principal part bottom view which shows the LED light-emitting device of FIG. It is sectional drawing which follows the III-III line of FIG. FIG. 4 is a sectional view taken along line IV-IV in FIG. 1. It is sectional drawing which follows the VV line of FIG. It is a circuit block diagram of the LED light-emitting device which concerns on 1st embodiment. It is sectional drawing which shows the LED light-emitting device which concerns on 2nd embodiment. It is another sectional view showing the LED light-emitting device concerning a second embodiment. It is another sectional view showing the LED light-emitting device concerning a second embodiment. It is sectional drawing which shows the LED light-emitting device which concerns on 3rd embodiment. It is a principal part top view which shows the LED light-emitting device which concerns on 4th embodiment. It is a principal part bottom view which shows the LED light-emitting device of FIG. It is a principal part bottom view which shows the LED light-emitting device which concerns on a modification. It is a principal part bottom view which shows the LED light-emitting device which concerns on a modification. It is sectional drawing which shows the LED light-emitting device which concerns on a modification.

Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

1 to 5 show an LED light emitting device A1 according to the first embodiment of the present invention. The LED light emitting device A1 of this embodiment includes a substrate 1, an LED chip 4, an LED wire 41, a protection element 5, a protection element wire 51, a sealing resin 6, and a lens 7.

FIG. 1 is a main part plan view showing the LED light emitting device A1. FIG. 2 is a bottom view of an essential part showing the LED light emitting device A1. FIG. 3 is a sectional view taken along the line III-III in FIG. FIG. 4 is a sectional view taken along the line IV-IV in FIG. FIG. 5 is a sectional view taken along the line VV of FIG. In these figures, the thickness direction of the substrate 1 (base material 2 described later) is the z direction, and the directions perpendicular to the z direction are the x direction and the y direction. In the following description, in each of the x, y, and z directions, the direction indicated by the arrow is expressed as a + (plus) direction, and the opposite direction is expressed as a − (minus) direction, if necessary. For example, in FIG. 1, the left direction of the drawing is expressed as −x direction, and the right direction of the drawing is expressed as +x direction. Further, for convenience of understanding, the wiring pattern 3 is hatched in each of FIGS. 1 and 2. The lens 7 is not shown in FIG. 1, and the sealing resin 6 is not shown in FIG.

The substrate 1 includes a base material 2 and a wiring pattern 3. In the present embodiment, the substrate 1 has a rectangular shape in plan view. In addition, in the present description, the “rectangle” means a quadrangle in which all the corners are right angles, and includes two in which two sides forming one corner have the same length or different lengths.

The base material 2 has a main surface 21, a back surface 22, and a side surface 23. The main surface 21 and the back surface 22 are separated from each other in the z direction and face each other. In the present embodiment, the base material 2 has a rectangular shape as viewed in the z direction (plan view). The side surface 23 is a surface perpendicular to the main surface 21 and the back surface 22, and the base material 2 has a total of four side surfaces 23 including two side surfaces 23 separated in the x direction and two side surfaces 23 separated in the y direction. Have The two side surfaces 23 that are separated in the x direction and the two side surfaces 23 that are separated in the y direction respectively face the opposite sides.

The base material 2 includes an insulating member 201, an LED side lead 202, and an LED wire side lead 203.

The insulating member 201 is a member whose surface is at least an insulating surface. The material of the insulating member 201 is not particularly limited as long as it is a material that can realize the shape described below. Examples of such materials include resins such as epoxy resin.

The LED side lead 202 and the LED wire side lead 203 are made of a metal such as Cu (copper). The conductive metal is not limited to this as long as it is a conductive metal. The LED side lead 202 and the LED wire side lead 203 are supported by the insulating member 201. In the present embodiment, the LED side lead 202 has a plate shape. The LED side lead 202 is disposed on the side surface 23 side in the −x direction and on the back surface 22 side. Further, the LED wire side lead 203 is formed by bending and molding one flat metal plate in the z direction, and a part thereof is arranged on the side face 23 side in the +x direction and on the back face 22 side. ing. The LED-side lead 202 and the LED wire-side lead 203 are arranged apart from each other and are insulated.

For the base material 2, for example, the LED side lead 202 and the LED wire side lead 203 are inserted into a mold, and the insulating member 201 is injected around the LED side lead 202 and the LED wire side lead 203. It is integrally formed by so-called insert molding. It should be noted that the method of molding the base material 2 is not particularly limited as long as the shape and the like described below can be realized.

The base material 2 has a main surface accommodation recess 24 and a back surface accommodation recess 27.

The main surface accommodation recess 24 is a portion recessed from the main surface 21 to the back surface 22 side. In the present embodiment, the base material 2 has one main surface accommodation recess 24. The main surface accommodation recess 24 has a main surface opening 241, an LED accommodation portion 25, and an LED wire accommodation portion 26. Although the main surface accommodation recess 24 and the LED chip 4 do not appear on the back surface 22, they are indicated by dotted lines in the bottom view of the main part shown in FIG.

The main surface opening 241 is a portion where the main surface accommodation recess 24 is opened to the main surface 21.

The LED housing portion 25 is connected to the rear surface 22 side from the main surface opening 241 and has an LED side surface 251 and an LED side bottom surface 252 in the present embodiment.

The LED side surface 251 is connected to the main surface opening 241. In the present embodiment, the LED side surface 251 is inclined such that the cross section perpendicular to the thickness direction (z direction) becomes larger toward the main surface 21 in the z direction.

The LED-side bottom surface 252 is connected to the LED-side side surface 251 from the back surface 22 side. The LED side bottom surface 252 is a surface which is separated from the back surface 22 and faces the back surface 22 in the z direction. In the present embodiment, the LED side bottom surface 252 is formed by a part of the +z direction surface of the LED side lead 202.

In the present embodiment, the portion of the main surface opening 241 that is connected to the LED-side side surface 251 and the LED-side bottom surface 252 are circular when viewed in the thickness direction.

The LED wire accommodating portion 26 is connected to the rear surface 22 side from the main surface opening 241 and has an LED wire side surface 261 and an LED wire side bottom surface 262 in the present embodiment.

The LED wire side surface 261 is connected to the main surface opening 241. In the present embodiment, the LED wire side surface 261 is inclined such that the cross section perpendicular to the thickness (z direction) becomes larger toward the main surface 21 in the z direction.

The LED wire side bottom surface 262 is connected to the LED wire side side surface 261 from the back surface 22 side. The LED wire side bottom surface 262 is a surface which is separated from the back surface 22 and faces the opposite side in the z direction to the back surface 22. Further, the LED wire side bottom surface 262 is located closer to the main surface 21 side in the thickness direction than the LED side bottom surface 252.

In the present embodiment, the portion of the main surface opening 241 that is connected to the LED wire side surface 261 and the LED wire side bottom surface 262 have a rectangular shape when viewed in the thickness direction.

As shown in FIG. 1, in the main surface accommodation recess 24, the LED accommodation portion 25 and the LED wire accommodation portion 26 are connected side by side in the x direction. In the present embodiment, the LED wire housing portion 26 is arranged in the +x direction with respect to the LED housing portion 25.

The back surface accommodation recess 27 is a portion recessed from the back surface 22 to the main surface 21 side. In this embodiment, there is one back surface accommodation recess 27. A part of the back surface accommodation recess 27 is located in the −z direction of a part of the main surface accommodation recess 24. The back surface housing recess 27 has a back surface opening 271, a protective element housing portion 28, and a protective element wire housing portion 29. The back surface accommodating recess 27 and the protective element 5 are not shown on the main surface 21, but are shown by a dotted line in the plan view of the main part shown in FIG.

The back surface opening 271 is a portion where the back surface housing recess 27 opens to the back surface 22.

The protective element housing portion 28 is connected to the main surface 21 side from the rear surface opening 271 and has a protective element side surface 281 and a protective element bottom surface 282 in the present embodiment.

The protection element side surface 281 is connected to the back surface opening 271. In the present embodiment, the protective element side surface 281 is inclined so that the cross section perpendicular to the thickness direction (z direction) becomes larger toward the back surface 22 in the z direction. Note that it may not be inclined.

The protection element side bottom surface 282 is connected to the protection element side side surface 281 from the back surface 22 side. The protective element side bottom surface 282 is a surface which is separated from the main surface 21 and faces the opposite side in the z direction from the main surface 21. The protective element side bottom surface 282 is a surface facing the LED side bottom surface 252 and the LED wire side bottom surface 262 in the z direction. In the present embodiment, the protective element side bottom surface 282 is located closer to the main surface 21 side than the LED side bottom surface 252 in the z direction, and is located closer to the back surface 22 side than the LED wire side bottom surface 262. The protective element side bottom surface 282 is separated from the LED side bottom surface 252 in both the x direction and the y direction.

In the present embodiment, the portion of the back surface opening 271 that is connected to the protective element side surface 281 and the protective element side bottom surface 282 are circular when viewed in the thickness direction. The shape is not limited to the circular shape, and may be, for example, a rectangular shape (see FIG. 13 described later).

The protection element wire housing portion 29 is connected to the main surface 21 side from the back surface opening 271 and has a protection element wire side surface 291 and a protection element wire side bottom surface 292 in the present embodiment.

The wire side surface 291 for the protection element is connected to the back surface opening 271. In the present embodiment, the protection element wire side surface 291 is inclined so that the cross section perpendicular to the thickness direction (z direction) becomes larger toward the back surface 22 in the z direction. Note that it may not be inclined.

The protection element wire-side bottom surface 292 is connected to the protection element wire-side side surface 291 from the back surface 22 side. The wire bottom surface 292 for the protection element is a surface that is separated from the main surface 21 and faces the side opposite to the main surface 21 in the z direction. In the present embodiment, the protective element wire side bottom surface 292 is located closer to the back surface 22 side in the z direction than the protective element side bottom surface 282. In addition, the protective element wire-side bottom surface 292 is located closer to the back surface 22 side than the LED-side bottom surface 252 and the LED wire-side bottom surface 262 in the z direction.

In the present embodiment, a portion of the back surface opening 271 that is connected to the protective element wire-side side surface 291 and the protective element wire-side bottom surface 292 have a rectangular shape when viewed in the thickness direction. The shape is not limited to the rectangular shape.

As shown in FIG. 2, in the back surface accommodation recess 27, the protection element accommodation portion 28 and the protection element wire accommodation portion 29 are connected side by side in the x direction. In the present embodiment, the protective element wire accommodating portion 29 is arranged in the −x direction with respect to the protective element accommodating portion 28. That is, the position of the protective element wire accommodating portion 29 with respect to the protective element accommodating portion 28 is opposite to the position of the LED wire accommodating portion 26 with respect to the LED accommodating portion 25.

The wiring pattern 3 is formed on the base material 2. The wiring pattern 3 is made of, for example, a single type or a plurality of types of metals such as Cu, Ni, Ti, and Au. The wiring pattern 3 is formed, for example, by plating, and an unnecessary portion is shaved by a laser or the like to be formed into a configuration and a shape described below.

The wiring pattern 3 includes an LED side surface portion 311, an LED side bottom surface portion 312, an LED side main surface electrode portion 313, an LED side back surface electrode portion 315, an LED wire side surface portion 321, an LED wire side bottom surface portion 322, and an LED. Wire side main surface electrode portion 323, LED wire side back surface electrode portion 325, protection element side side surface portion 331, protection element side bottom surface portion 332, protection element wire side surface portion 341, and protection element wire side bottom surface portion 342. Have.

The LED side surface part 311 covers at least a part of the LED side surface 251. In the present embodiment, the LED side surface part 311 covers the entire LED side surface 251. The LED side surface portion 311 functions as a reflector that reflects light traveling laterally from the LED chip 4 in the +z direction.

The LED-side bottom surface portion 312 is connected to the LED-side side surface portion 311. The LED side bottom surface portion 312 covers the entire LED side bottom surface 252. The LED side bottom surface portion 312 may cover a part of the LED side bottom surface 252. The LED side bottom surface portion 312 is in contact with the LED side lead 202 and is electrically connected to the LED side lead 202.

The LED-side main surface electrode portion 313 is formed on a part of the main surface 21 of the base material 2. The LED-side main surface electrode portion 313 is connected to the LED-side side surface portion 311. In addition, in this embodiment, the LED-side main surface electrode portion 313 may not be provided.

The LED-side back surface electrode portion 315 is formed on a part of the back surface 22 of the base material 2 and is used as a bonding portion when mounting the LED light emitting device A1 on a circuit board or the like. The LED side back surface electrode portion 315 is in contact with the LED side lead 202 and is electrically connected to the LED side lead 202. Therefore, the LED side back surface electrode portion 315 is electrically connected to the LED side bottom surface portion 312 via the LED side lead 202.

The LED wire side surface part 321 covers a part of the LED wire side surface 261. As shown in FIG. 1, the LED wire side surface part 321 is separated from the LED side surface part 311 in the x direction and is insulated from the LED side surface part 311.

The LED wire-side bottom surface portion 322 covers a part of the LED wire-side bottom surface 262. As shown in FIG. 1, the LED wire side bottom surface portion 322 is separated from the LED side surface portion 311 in the x direction and is insulated from the LED side surface portion 311. In the present embodiment, the x-direction edge of the LED wire-side bottom surface portion 322 and the x-direction edge of the LED wire-side side surface portion 321 form a straight line when viewed in the z direction. The LED wire side bottom surface portion 322 is in contact with the LED wire side lead 203 and is electrically connected to the LED wire side lead 203.

The LED wire-side main surface electrode portion 323 is formed on a part of the main surface 21 of the base material 2. The LED wire-side main surface electrode portion 323 is connected to the LED wire-side side surface portion 321. The LED wire-side principal surface electrode portion 323 is separated from the LED-side principal surface electrode portion 313 in the x direction and is insulated from the LED-side principal surface electrode portion 313. In the present embodiment, the LED wire side main surface electrode portion 323 may not be provided.

The LED wire side back surface electrode portion 325 is formed on a part of the back surface 22 of the base material 2 and is used as a bonding portion when the LED light emitting device A1 is mounted on a circuit board or the like. The LED wire side back surface electrode portion 325 is in contact with the LED wire side lead 203 and is electrically connected to the LED wire side lead 203. The LED wire side back surface electrode portion 325 is separated from the LED side back surface electrode portion 315 in the x direction when viewed in the z direction, and is insulated from the LED side back surface electrode portion 315.

The protective element side surface portion 331 covers at least a part of the protective element side surface 281. In the present embodiment, the side surface portion 331 on the protective element side covers the entire side surface 281 on the protective element side.

The protective element side bottom surface portion 332 covers the entire protective element side bottom surface 282. Note that it may cover a part. The protective element-side bottom surface portion 332 is connected to the protective element-side side surface portion 331. The protective element side bottom surface portion 332 is in contact with the LED wire side lead 203 and is electrically connected to the LED wire side lead 203.

The protection element wire-side side surface portion 341 covers a part of the protection element wire-side side surface 291. As shown in FIG. 2, the protective element wire side surface portion 341 is separated from the protective element side surface portion 331 in the x direction and is insulated from the protective element side surface portion 331. The wire-side side surface portion 341 for the protection element is connected to the LED-side rear surface electrode portion 315.

The protection element wire-side bottom surface portion 342 partially covers the protection element wire-side bottom surface 292. As shown in FIG. 2, the protective element wire side bottom surface portion 342 is separated from the protective element side surface portion 331 in the x direction and is insulated from the protective element side surface portion 331. The protection element wire-side bottom surface portion 342 is connected to the protection element wire-side side surface portion 341.

In the present embodiment, the LED side bottom surface portion 312 and the LED side back surface electrode portion 315 are electrically connected via the LED side lead 202. Therefore, the LED side surface part 311, the LED side bottom surface part 312, the LED side main surface electrode part 313, the LED side lead 202, the LED side back surface electrode part 315, the protection element wire side surface part 341, and the protection element wire side. The bottom surface portion 342 is electrically connected and their potentials are all the same.

The LED wire side bottom surface portion 322, the protection element side bottom surface portion 332, and the LED wire side back surface electrode portion 325 are electrically connected via the LED wire side lead 203. Therefore, the LED wire side surface portion 321, the LED wire side bottom surface portion 322, the LED wire side main surface electrode portion 323, the LED wire side lead 203, the protection element side surface portion 331, and the protection element side bottom surface portion 332. Are electrically connected, and these potentials are all the same.

The LED chip 4 is a light source of the LED light emitting device A1, and emits visible light, infrared light, ultraviolet light, or the like, for example. As shown in FIG. 1, the LED chips 4 are all housed in the LED housing portion 25 when viewed in the z direction. Further, as shown in FIGS. 3 and 4, all the LED chips 4 are housed in the LED housing portion 25 in the z direction. That is, in FIGS. 3 and 4, the edge in the +z direction of the LED chip 4 is located in the −z direction from the main surface opening 241, and the edge in the −z direction of the LED chip 4 is on the LED side. It is located in the +z direction with respect to the side surface 251. The LED chip 4 is bonded to the LED-side bottom surface portion 312 with a conductive bonding material (not shown) such as Ag paste, for example. In this embodiment, the LED chip 4 is mounted on the substrate 1 such that the +z direction surface serves as an anode and the −z direction surface serves as a cathode. That is, the cathode of the LED chip 4 is bonded to the LED side bottom surface portion 312. The LED chip 4 emits light by the current flowing from the anode to the cathode.

The LED wire 41 is for electrically connecting the LED chip 4 and a part of the wiring pattern 3 (specifically, the LED wire side bottom surface portion 322), and is made of a metal such as Au. One end of the LED wire 41 is bonded to the +z direction surface of the LED chip 4, and the other end of the LED wire 41 is bonded to the LED wire side bottom surface portion 322. A part of the LED wire 41 bonded to the LED wire side bottom surface portion 322 is housed in the LED wire housing portion 26 when viewed in the z direction. Further, in the z-direction, part of the LED wire 41 bonded to the LED wire-side bottom surface part 322 is housed in the LED wire housing part 26. That is, in FIGS. 3 to 5, the +z-direction end edge of the portion of the LED wire 41 bonded to the LED wire-side bottom surface portion 322 is located in the −z direction with respect to the main surface opening 241. The edge of the portion bonded to the LED wire side bottom surface portion 322 in the −z direction is located in the +z direction with respect to the LED wire side bottom surface 262.

The protection element 5 is for preventing a reverse voltage from being applied to the LED chip 4. Various diodes are used as the protection element 5, and in the present embodiment, a Zener diode is used as the protection element 5. FIG. 6 shows a circuit configuration diagram of the LED light emitting device A1. The protection element 5 is connected in antiparallel with the LED chip 4. Specifically, the anode of the LED chip 4 and the cathode of the protection element 5 are connected, and the cathode of the LED chip 4 and the anode of the protection element 5 are connected. In the present embodiment, the terminal A shown in FIG. 6 corresponds to the LED wire side back surface electrode portion 325, and the terminal B corresponds to the LED side back surface electrode portion 315.

As shown in FIG. 2, the protective element 5 is entirely accommodated in the protective element accommodating portion 28 when viewed in the z direction. Further, as shown in FIGS. 3 and 5, the protective element 5 is entirely accommodated in the protective element accommodating portion 28 in the z direction. That is, in FIGS. 3 and 5, the edge in the −z direction of the protective element 5 is located in the +z direction with respect to the back surface opening 271, and the edge in the +z direction of the protective element 5 is the bottom surface on the protective element side. It is located in the −z direction with respect to 282. The protective element 5 is bonded to the protective element side bottom surface portion 332 by a conductive bonding material (not shown) such as Ag pace. In the present embodiment, the protective element 5 is mounted on the substrate 1 such that the surface in the +z direction serves as the cathode and the surface in the −z direction serves as the anode. That is, the cathode of the protection element 5 is joined to the LED side bottom surface portion 312.

The protection element wire 51 is for electrically connecting the protection element 5 and a part of the wiring pattern 3 (specifically, the protection element wire side bottom surface portion 342), and is made of a metal such as Au. .. One end of the protection element wire 51 is bonded to the −z direction surface of the protection element 5, and the other end of the protection element wire 51 is bonded to the protection element wire-side bottom surface portion 342. A part of the protective element wire 51, which is bonded to the protective element wire side bottom surface portion 342, is housed in the protective element wire housing portion 29 when viewed in the z direction. Further, the protection element wire 51 is accommodated in the protection element wire accommodating portion 29 at a part of the side bonded to the protection element wire side bottom surface portion 342 in the z direction. That is, in FIG. 3 and FIG. 5, the edge in the −z direction of the portion of the protective element wire 51 that is bonded to the protective element wire side bottom surface portion 342 is located in the +z direction with respect to the back surface opening 271. The edge of the portion bonded to the protection element wire-side bottom surface portion 342 in the +z direction is located in the −z direction with respect to the protection element wire-side bottom surface 292.

The sealing resin 6 is filled in the back surface accommodation recess 27 and covers the protective element 5 and the protective element wire 51. The sealing resin 6 is made of, for example, silicone resin or epoxy resin.

The lens 7 is for improving the front irradiation intensity of the light emitted from the LED chip 4. The lens 7 refracts the light emitted from the LED chip 4 and the light reflected by the LED side surface portion 311 (reflector) and focuses the light in the +z direction. Thereby, the directivity of light of the LED light emitting device A1 is increased. The lens 7 is arranged on the substrate 1 (+z direction of the substrate 1). A space 61 is formed between the lens 7 and the substrate 1. Further, the +z direction surface of the lens 7 is a flat surface, and the convex portion 71 is provided on the −z direction surface of the lens 7.

As shown in FIGS. 3 and 4, the convex portion 71 is a portion projecting in the −z direction from a part of the −z direction surface of the lens 7. The convex portion 71 is located in the +z direction of the LED chip 4, and has a circular shape when viewed in the z direction. In the present embodiment, the center of the LED-side bottom surface 252 and the center of the convex portion 71 are aligned when viewed in the z direction.

In this embodiment, the LED light emitting device A1 includes the lens 7, but it does not have to include the lens 7. However, in the case where the lens 7 is not provided, it is preferable that the principal surface housing recess 24 is filled with a translucent resin to cover the LED chip 4 and the LED wire 41. The translucent resin is made of a material that transmits light from the LED chip 4, and is made of, for example, transparent or semitransparent silicone resin or epoxy resin. The translucent resin may include a fluorescent material that emits light of different wavelengths when excited by the light from the LED chip 4. Further, the LED light emitting device A1 may include both the translucent resin and the lens 7. Further, the shape of the lens 7 is not limited to the above as long as the light emitted from the LED chip 4 can be condensed in a desired direction. For example, the shape and position of the convex portion 71 can be freely modified in design.

Next, the operation of the LED light emitting device A1 thus configured will be described.

According to this embodiment, the LED chip 4 is housed in the LED housing portion 25, and the LED wire 41 is housed in the LED wire housing portion 26. The LED chip 4 and the LED wire 41 are entirely housed in the main surface housing recess 24. The protective element 5 is housed in the protective element housing portion 28, and the protective element wire 51 is housed in the protective element wire housing portion 29. The entire protective element 5 and protective element wire 51 are housed in the back surface housing recess 27. As a result, the LED chip 4, the LED wire 41, the protection element 5, and the protection element wire 51 do not protrude from the substrate 1 in the z direction. Therefore, the dimension of the LED light emitting device A1 in the thickness direction (z direction) can be reduced, and the LED light emitting device A1 can be thinned. Further, since the protective element 5 and the protective element wire 51 do not project from the substrate 1 in the −z direction, the bottom surface of the LED light emitting device A1 is a flat surface, and is protected when the LED light emitting device A1 is mounted on a circuit board or the like. The element 5 or the protective element wire 51 does not become an obstacle.

According to this embodiment, the protective element side bottom surface 282 is located closer to the main surface 21 side than the LED side bottom surface 252 and is located closer to the back surface 22 side than the LED wire side bottom surface 262 in the z direction. .. As a result, the LED chip 4 and the protection element 5 are arranged so as to partially overlap each other in the z direction. Therefore, it is preferable to reduce the thickness of the LED light emitting device A1.

According to this embodiment, the back surface accommodation recess 27 is provided from the back surface 22 of the base material 2 toward the main surface 21 side, and the protection element 5 is accommodated in the back surface accommodation recess 27 (specifically, the protection element housing portion 28 ). I decided to do it. Thereby, a part of the back surface accommodating recess 27 can be located in a part of the main surface accommodating recess 24 in the −z direction. Therefore, as compared with the case where the protective element housing portion 28 is arranged from the main surface 21 toward the back surface 22 side (that is, the main surface 21 is provided with a recess different from the main surface housing recess 24 ), the LED chip 4 and the LED chip 4 are protected. The separation distance from the element 5 in a plan view can be reduced. That is, the size of the LED light emitting device A1 in plan view can be reduced, and an increase in size in plan view can be suppressed.

According to the present embodiment, the base material 2 includes the insulating member 201, the LED side lead 202 and the LED wire side lead 203, and the −z direction surface of the LED chip 4 is bonded to the LED side lead 202. ing. As a result, the heat generated by the LED chip 4 can be dissipated through the LED side leads 202. Therefore, the heat dissipation performance of the LED light emitting device A1 is improved.

According to the present embodiment, the LED side surface portion 311 functions as a reflector. Therefore, since it is not necessary to separately attach the reflector to the substrate with an adhesive or the like, it is possible to prevent the reflector from peeling off.

According to the present embodiment, a Zener diode is used as the protection element 5, and the LED chip 4 is connected in antiparallel. Thereby, when a surge voltage is applied from the terminal B shown in FIG. 6 to the terminal A direction (the opposite direction of the LED chip 4) due to static electricity or the like, the current is bypassed by the Zener diode. Therefore, the LED chip 4 can be protected from the reverse surge voltage due to static electricity or the like. On the other hand, when a surge voltage is applied from the terminal A to the terminal B (forward direction of the LED chip 4) shown in FIG. 6 due to static electricity or the like, the surge voltage is also applied to the Zener diode. The voltage applied to the circuit holds a Zener voltage smaller than the surge voltage. Therefore, the Zener voltage lower than the surge voltage is also applied to the LED chip 4. Therefore, the LED chip 4 can be protected from a forward surge voltage due to static electricity or the like.

In the first embodiment, the wiring pattern 3 has been described as having the LED-side bottom surface portion 312 and the LED-side rear surface electrode portion 315, but it is not necessary to have these. In this case, the LED chip 4 is bonded to the LED side lead 202. Then, the LED side lead 202 is used as a bonding portion when mounted on a circuit board or the like. Similarly, the case where the wiring pattern 3 has the LED wire side bottom surface portion 322, the protection element side bottom surface portion 332, and the LED wire side back surface electrode portion 325 has been described, but it is not necessary to have these. .. In this case, the LED wire 41 is joined (bonded) to the LED wire side lead 203, and the protection element 5 is joined to the LED wire side lead 203. The LED wire-side lead 203 is used as a bonding portion when mounting on the circuit board or the like.

7 to 9 show an LED light emitting device A2 according to the second embodiment of the present invention. FIG. 7 is a cross-sectional view of the LED light emitting device A2 corresponding to FIG. 3 of the first embodiment. FIG. 8 is a cross-sectional view of the LED light emitting device A2 corresponding to FIG. 4 of the first embodiment. FIG. 9 is a cross-sectional view of the LED light emitting device A2 corresponding to FIG. 5 of the first embodiment. The same or similar elements as those in the first embodiment are designated by the same reference numerals as those in the first embodiment, and the description thereof will be omitted.

The LED light emitting device A2 of the second embodiment is different from the above-described LED light emitting device A1 in the configuration of the base material 2 and the configuration of the wiring pattern 3. The main part plan view and the main part bottom view of the LED light emitting device A2 are respectively the same as the main part plan view (FIG. 1) and the main part bottom view (FIG. 2) shown in the above-described first embodiment.

The base material 2 has an insulating member 201. Therefore, as compared with the LED light emitting device A1 according to the first embodiment, the LED side lead 202 and the LED wire side lead 203 are not provided, and the LED side lead 202 and the LED wire side lead 203 are also insulating members. It is formed of 201. In the present embodiment, the insulating member 201 can be formed of a semiconductor material such as Si in addition to the resin and the like exemplified in the first embodiment. The base material 2 is formed by, for example, die molding, compression molding, cutting, etching, or the like.

The wiring pattern 3 includes the LED side surface part 311, the LED side bottom surface part 312, the LED side main surface electrode part 313, the LED side surface electrode part 314, the LED side back surface electrode part 315, the LED wire side surface part 321, and the LED wire. Side bottom surface portion 322, LED wire side main surface electrode portion 323, LED wire side side surface electrode portion 324, LED wire side back surface electrode portion 325, protection element side surface portion 331, protection element side bottom surface portion 332, protection element It has a wire-side side surface portion 341 and a protection element wire-side bottom surface portion 342. Therefore, as compared with the LED light emitting device A1 according to the first embodiment, the LED side surface electrode portion 314 and the LED wire side surface side electrode portion 324 are further included.

The LED side surface electrode portion 314 is formed on a part of the side surface 23 in the −x direction. The LED side surface electrode section 314 is connected to the LED side main surface electrode section 313 and the LED side back surface electrode section 315.

The LED wire side surface electrode portion 324 is formed on a part of the side surface 23 in the +x direction. The LED wire-side side surface electrode portion 324 is connected to the LED wire-side main surface electrode portion 323 and the LED wire-side rear surface electrode portion 325.

In the present embodiment, the LED-side bottom surface portion 312 includes the LED-side side surface portion 311, the LED-side main surface electrode portion 313, the LED-side side surface electrode portion 314, the LED-side rear surface electrode portion 315, and the protection element wire-side side surface portion. It is electrically connected to the wire-side bottom surface portion 342 for the protection element via the capacitor 341. The LED wire side bottom surface portion 322 includes the LED wire side surface portion 321, the LED wire side main surface electrode portion 323, the LED wire side surface electrode portion 324, the LED wire side back surface electrode portion 325, and protection. It is electrically connected to the protective element-side bottom surface portion 332 via the element-side side surface portion 331. Therefore, the cathode of the LED chip 4 and the anode of the protection element 5 are electrically connected, and the anode of the LED chip 4 and the cathode of the protection element 5 are electrically connected. That is, the circuit configuration shown in FIG. 6 is also provided in this embodiment.

Next, the operation of the LED light emitting device A2 thus configured will be described.

According to this embodiment, as in the first embodiment, it is possible to reduce the thickness of the LED light emitting device A2 and suppress an increase in the size in plan view. Further, since it is not necessary to attach the reflector, it is possible to prevent the reflector from peeling off. Further, the protection element 5 can protect the LED chip 4 from surge voltage due to static electricity or the like.

According to this embodiment, since the base material 2 is formed of the insulating member 201, the base material 2 can be easily molded as compared with the first embodiment.

FIG. 10 shows an LED light emitting device A3 according to the third embodiment of the present invention. FIG. 10 is a cross-sectional view of the LED light emitting device A3 corresponding to FIG. 7 of the second embodiment (that is, FIG. 3 of the first embodiment). The same or similar elements as those in the second embodiment are designated by the same reference numerals as those in the second embodiment, and the description thereof will be omitted.

The LED light emitting device A3 of the third embodiment differs from the LED light emitting device A2 described above in the configuration of the wiring pattern 3. The principal part plan view and the principal part bottom view of the LED light emitting device A3 are respectively the same as the principal part plan view (FIG. 1) and the principal part bottom view (FIG. 2) shown in the first embodiment. The sectional views of the LED light emitting device A3 corresponding to FIGS. 4 and 5 of the first embodiment are the same as FIGS. 8 and 9 of the second embodiment.

The wiring pattern 3 includes an LED side surface portion 311, an LED side bottom surface portion 312, an LED side main surface electrode portion 313, an LED side rear surface electrode portion 315, an LED side through hole portion 316, an LED wire side surface portion 321, an LED wire. Side bottom surface portion 322, LED wire side main surface electrode portion 323, LED wire side back surface electrode portion 325, LED wire side through hole portion 326, protection element side surface portion 331, protection element side bottom surface portion 332, protection element It has a wire-side side surface portion 341 and a protection element wire-side bottom surface portion 342. Therefore, as compared with the LED light emitting device A2 according to the second embodiment, instead of the LED side surface electrode section 314 and the LED wire side surface electrode section 324, the LED side through hole section 316 and the LED wire side through hole section 326 are provided. have.

The LED side through hole portion 316 penetrates the base material 2 in the z direction, and electrically connects the LED side bottom surface portion 312 and the LED side back surface electrode portion 315.

The LED wire side through hole portion 326 penetrates the base material 2 in the z direction, and electrically connects the LED wire side bottom surface portion 322 and the protection element side bottom surface portion 332.

In the present embodiment, the LED side bottom surface portion 312 is electrically connected to the protection element wire side bottom surface portion 342 via the LED side through hole portion 316, the LED side back surface electrode portion 315, and the protection element wire side side surface portion 341. Are connected together. Further, the LED wire side bottom surface portion 322 is electrically connected to the protection element side bottom surface portion 332 via the LED wire side through hole portion 326. Therefore, the cathode of the LED chip 4 and the anode of the protection element 5 are electrically connected, and the anode of the LED chip 4 and the cathode of the protection element 5 are electrically connected. That is, the circuit configuration shown in FIG. 6 is also provided in this embodiment.

Next, the operation of the LED light emitting device A3 thus configured will be described.

According to this embodiment, as in the first embodiment, it is possible to reduce the thickness of the LED light emitting device A2 and suppress an increase in the size in plan view. Further, since it is not necessary to attach the reflector, it is possible to prevent the reflector from peeling off. Further, the protection element 5 can protect the LED chip 4 from surge voltage due to static electricity or the like.

11 to 12 are views showing an LED light emitting device A4 according to the fourth embodiment of the present invention. FIG. 11 is a plan view of an essential part showing the LED light emitting device A4. FIG. 12 is a bottom view of an essential part showing the LED light emitting device A4. For ease of understanding, the wiring pattern 3 is hatched in FIGS. 11 and 12. The lens 7 is not shown in FIG. 11, and the sealing resin 6 is not shown in FIG. The same or similar elements as those in the first to third embodiments are designated by the same reference numerals as those in the first to third embodiments, and the description thereof will be omitted.

The LED light emitting device A4 according to the fourth embodiment of the present invention is different from the above-described LED light emitting devices A1 to A3 in the position of the protective element housing portion 28 with respect to the LED wire housing portion 26 when viewed in the z direction. Specifically, in the LED light emitting devices A1 to A3, a part of the protection element housing portion 28 is arranged in the −z direction of a part of the LED wire housing portion 26, but in the present embodiment, protection is performed. The element housing portion 28 is separated from the LED wire housing portion 26 when viewed in the z direction (plan view).

Next, the operation of the LED light emitting device A4 thus configured will be described.

According to the present embodiment, similarly to the first embodiment, it is possible to reduce the thickness of the LED light emitting device A4 and suppress an increase in the size in plan view. Further, since it is not necessary to attach the reflector, it is possible to prevent the reflector from peeling off. Further, the protection element 5 can protect the LED chip 4 from surge voltage due to static electricity or the like. Therefore, in the LED light-emitting device according to the present invention, if the back surface housing recess 27 that houses the protection element 5 and the protection element wire 51 is not connected to the main surface housing recess 24 formed on the main surface 21 side, the back surface 22 side. The above effect can be obtained at any position.

Various other modified examples will be described below.

In the LED light emitting device of the present invention, the protective element housing portion 28 is not limited to the one having a circular shape when viewed in the z direction. For example, as shown in FIG. 13 or 14, the protective element housing portion 28 may have a rectangular shape when viewed in the z direction. FIG. 13 shows a modification of the first to third embodiments, and FIG. 14 shows a modification of the fourth embodiment.

The LED light emitting device of the present invention is not limited to the one having the protective element wire accommodating portion 29 in the rear accommodating recess 27. For example, as shown in FIG. 15, all of the protection element 5 and the protection element wire 51 may be housed in the back surface housing recess 27 (protection element housing 28). In this case, the protective-element-side side surface portion 331 and the protective-element-side bottom surface portion 332 are insulated in the x direction to form one to two sets of the protective-element-side side surface portion 331 and the protective-element-side bottom surface portion 332. Then, in the protection element side side surface portion 331 and the protection element side bottom surface portion 332 of the pair in the −x direction, the protection element side side surface portion 331 in the −x direction and the LED side back surface electrode portion 315 are connected to each other, and the protection element in the −x direction is connected. The protection element wire 51 is bonded to the side bottom surface portion 332. Further, in the protection element side side surface portion 331 and the protection element side bottom surface portion 332 of the pair in the +x direction, the protection element side side surface portion 331 in the +x direction and the LED wire side back surface electrode portion 325 are connected to each other, and the protection element side in the +x direction is connected. The protection element 5 is bonded to the bottom surface portion 332.

In the LED light emitting device of the present invention, as a method for electrically connecting the LED side bottom surface section 312 and the LED side back surface electrode section 315, a method using the LED side lead 202 shown in the first embodiment, a second embodiment. Any one or more methods of using the LED side surface electrode portion 314 shown in the embodiment or using the LED side through hole portion 316 shown in the third embodiment may be used. Similarly, as a method for electrically connecting the LED wire side bottom surface section 322 and the LED wire side back surface electrode section 325, a method using the LED wire side lead 203 shown in the first embodiment, Any one or more of the method using the LED wire side electrode portion 324 shown in the second embodiment and the method using the LED wire side through hole portion 326 shown in the third embodiment may be used. That is, in order to electrically connect the LED side bottom surface section 312 and the LED side back surface electrode section 315, and to electrically connect the LED wire side bottom surface section 322 and the LED wire side back surface electrode section 325. The combination with the above method is not limited to the various embodiments described above. Also, these methods may be combined.

In the LED light emitting device of the present invention, the wiring pattern 3, the PN junction bonding direction of the LED chip 4, and the PN junction bonding direction of the protection element 5 are the circuit shown in FIG. The structure can be modified in any way. For example, in the LED chip 4, the surface to which the LED wire 41 is bonded may be the cathode and the surface to which the LED side bottom surface portion 312 is bonded may be the anode, opposite to the direction of the PN junction in the above-described various embodiments. Similarly, also in the protective element 5, the surface to which the protective element wire 51 is bonded may be the cathode, and the surface to which the protective element side bottom surface portion 332 is bonded may be the anode. Note that, with these changes, the wiring pattern 3 may be formed so that the circuit configuration of the LED light emitting device becomes the circuit configuration shown in FIG.

In the LED light-emitting device of the present invention, the protection element 5 (zener diode) is not limited to what is called a one-wire type. For example, it may be a surface mount type diode in which two terminals are arranged on one side, or a lead type diode such as an axial component or a radial component. In this case, the wiring pattern 3 may be formed according to the shape of the terminals of the protection element 5.

The LED light emitting device according to the present invention is not limited to the above embodiment. The specific configuration of each part of the LED light-emitting device according to the present invention can be modified in various ways.

A1, A2, A3, A4: LED light emitting device 1: Substrate 2: Base material 201: Insulating member 202: LED side lead 203: LED wire side lead 21: Main surface 22: Back surface 23: Side surface 24: Main surface accommodation recess 241: Main surface opening 25: LED housing 251: LED side surface 252: LED side bottom 26: LED wire housing 261: LED wire side 262: LED wire bottom 27: Back housing recess 271: Back surface Opening 28: Protective element accommodation part 281: Protective element side side surface 282: Protective element side bottom surface 29: Protective element wire accommodation part 291: Protective element wire side surface 292: Protective element wire side bottom surface 3: Wiring pattern 311: LED side surface part 312: LED side bottom surface part 313: LED side main surface electrode part 314: LED side side surface electrode part 315: LED side back surface electrode part 316: LED side through hole part 321: LED wire side surface part 322: LED Wire side bottom surface part 323: LED wire side main surface electrode part 324: LED wire side side surface electrode part 325: LED wire side back surface electrode part 326: LED wire side through hole part 331: Protection element side surface part 332 : Protective element side bottom part 341: Protective element wire side side part 342: Protective element wire side bottom part 4: LED chip 41: LED wire 5: Protective element 51: Protective element wire 6: Sealing resin 61: Void 7: Lens 71: Convex part

Claims (26)

A substrate having a main surface and a back surface facing opposite sides in the thickness direction, including at least an insulating member, and a substrate having a wiring pattern formed on the base material;
An LED chip mounted on the substrate,
An LED wire for electrically connecting the LED chip and the wiring pattern,
A protection element mounted on the substrate and electrically connected to the LED chip, for preventing a reverse voltage from being applied to the LED chip;
An LED light emitting device comprising:
The base material includes a main surface opening portion that opens to the main surface, an LED housing portion that connects from the main surface opening portion to the back surface side, and a LED housing portion that connects from the main surface opening portion to the back surface side. An LED wire accommodating portion connected to the portion, a main surface accommodating concave portion including the LED wire accommodating portion, and a protective element accommodating portion that is connected to the main surface side from the rear surface opening portion. Has a back surface containing recess including
In the thickness direction view and the thickness direction, the LED chips are all accommodated in the LED accommodating portion,
In the thickness direction and the thickness direction, the LED wire has a part accommodated in the LED wire accommodating portion,
The protective element, in the thickness direction view and the thickness direction, all are accommodated in the protective element accommodating portion ,
The LED housing portion has an LED-side side surface connected to the main surface opening, and an LED-side bottom surface connected to the LED-side side surface from the back surface side,
The LED wire housing has an LED wire side surface connected to the main surface opening, and an LED wire side bottom surface connected to the LED wire side surface from the back surface side,
The LED wire side bottom surface is located closer to the main surface side than the LED side bottom surface in the thickness direction,
The protective element accommodating portion has a protective element side side surface connected to the back surface opening, and a protective element side bottom surface connected to the protective element side side surface from the main surface side,
The protective element side bottom surface is located on the back surface side with respect to the LED wire side bottom surface in the thickness direction, and is located on the main surface side with respect to the LED side bottom surface,
An LED light-emitting device characterized by the above. The LED-side bottom surface and the protective element-side bottom surface are separated from each other in a direction perpendicular to the thickness direction,
The LED light-emitting device according to claim 1 . The wiring pattern covers an LED-side bottom surface and has an LED-side bottom surface portion to which the LED chip is joined.
The LED light-emitting device according to claim 2 . The LED light emitting device according to claim 3 , wherein the wiring pattern has an LED-side back surface electrode portion that covers a part of the back surface of the base material. The wiring pattern has an LED side surface portion that covers at least a part of the LED side surface,
The LED light-emitting device according to claim 4 . The base material is further supported by the insulating member and includes LED-side leads made of metal,
The LED-side lead is in contact with at least the LED-side bottom surface portion and the LED-side rear surface electrode portion,
The LED light-emitting device according to claim 4 or 5 . The wiring pattern has an LED-side through hole portion that penetrates the base material in the thickness direction and that conducts the LED-side bottom surface portion and the LED-side back surface electrode portion.
The LED light-emitting device according to claim 4 or 5 . The wiring pattern covers a part of the main surface of the base material, and covers a part of the side surface of the base material, and an LED side main surface electrode portion that is connected to a part of the LED side surface part, and A LED side surface electrode section connected to the LED side main surface electrode section and the LED side back surface electrode section,
The LED light emitting device according to claim 5 . The wiring pattern covers a part of the LED wire side bottom surface, and has an LED wire side bottom surface part to which the LED wire is bonded.
The LED light emitting device according to any one of claims 6 to 8 . The wiring pattern has an LED wire side back surface electrode part that covers a part of the back surface of the base material,
The LED light-emitting device according to claim 9 . The wiring pattern covers the protective element side bottom surface, and has a protective element side bottom surface portion to which the protective element is joined,
The LED light-emitting device according to claim 10 . The wiring pattern covers a part of the side surface on the protective element side, and has a protective element side surface portion connected to the protective element side bottom surface portion and the LED wire side rear surface electrode portion,
The LED light emitting device according to claim 11 . The wiring pattern has an LED wire side surface portion that covers at least a part of the LED wire side surface,
The LED light-emitting device according to claim 12 . The base material is further supported by the insulating member, and includes an LED wire side lead made of metal,
The LED wire side lead is in contact with at least the LED wire side bottom surface portion and the LED wire side back surface electrode portion,
LED light-emitting device according to any one of claims 11 to claim 13. The LED wire side lead is further in contact with the protective element side bottom surface portion,
The LED light emitting device according to claim 14 . The wiring pattern penetrates said substrate in thickness direction, and the LED wire side through hole for conduction between said LED wire side bottom portion and the protective element side bottom portion has, claim 12 Alternatively, the LED light emitting device according to claim 13 . The wiring pattern covers a part of the main surface of the base material and is connected to a part of the LED wire side side surface part, and an LED wire side main surface electrode part and a part of the side surface of the base material. And an LED wire-side side surface electrode part connected to the LED wire-side main surface electrode part and the LED wire-side rear surface electrode part,
The LED light-emitting device according to claim 13 . The LED light emitting device according to claim 14 , further comprising a protective element wire that electrically connects the protective element and the wiring pattern. The back surface accommodating concave portion further includes a protection element wire accommodating portion that is connected to the main surface side from the back surface opening portion and that is connected to the protection element accommodating portion,
The protection element wire, in the thickness direction view and the thickness direction, a portion thereof is accommodated in the protection element wire accommodating portion,
The LED light-emitting device according to claim 18 . The protection element wire accommodating portion has a protection element wire side side surface connected to the back surface opening, and a protection element wire side bottom surface connected to the protection element wire side side surface from the main surface side,
The LED light-emitting device according to claim 19 . The wiring pattern covers a part of the bottom surface of the protection element wire side, and a bottom surface part of the protection element wire side to which the protection element wire is bonded, and at least a part of the protection element wire side surface. A protective element wire-side side surface that covers,
The LED light emitting device according to claim 20 . The wire side surface portion for the protection element and the LED side back surface electrode portion are connected,
The LED light-emitting device according to claim 21 . The protection element is a Zener diode,
The LED light emitting device according to any one of claims 1 to 22 . The anode of the LED chip and the cathode of the Zener diode are electrically connected via the wiring pattern,
The cathode of the LED chip and the anode of the Zener diode are electrically connected via the wiring pattern,
The LED light-emitting device according to claim 23 . Further comprising a translucent resin that covers the LED chip and transmits light from the LED chip.
The LED light emitting device according to any one of claims 1 to 24 . A lens for irradiating light from the LED chip in a predetermined direction,
The LED light emitting device according to any one of claims 1 to 25 .

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