JP6722931B1 - Thermal welding tip and thermal welding unit - Google Patents

Thermal welding tip and thermal welding unit Download PDF

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JP6722931B1
JP6722931B1 JP2020029486A JP2020029486A JP6722931B1 JP 6722931 B1 JP6722931 B1 JP 6722931B1 JP 2020029486 A JP2020029486 A JP 2020029486A JP 2020029486 A JP2020029486 A JP 2020029486A JP 6722931 B1 JP6722931 B1 JP 6722931B1
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heat
heat generating
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welding
cooling
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JP2021133541A (en
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悠 高瀬
悠 高瀬
久也 生田
久也 生田
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Munekata Industrial Machinery Co Ltd
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Abstract

【課題】樹脂製の部品に設けた被溶融部分を効率よく規定の以上の温度に加熱することができ、その後の部材の冷却を速やかに行うことができる省スペースな熱溶着チップおよび熱溶着ユニットを提供する。【解決手段】本発明の熱溶着チップは、樹脂製の部品に素子を固定する際に、部品の一部を溶融させて熱カシメするための熱溶着チップであって、略平板状の発熱部と、一対の受電部とを有し、発熱部が部品の被溶融部分と対向する部分に、該被溶融部分の形状に対応した凹部を有し、発熱部の中央に素子を冷却するための中央冷却孔を有し、発熱部の中央冷却孔と凹部との間に周辺孔を有し、発熱部を加熱する電流が流れる通電方向に垂直な方向の発熱部の幅は一対の受電部の幅よりも大きく形成されている。【選択図】図2A space-saving heat-welding chip and a heat-welding unit capable of efficiently heating a portion to be melted provided on a resin-made component to a temperature higher than a prescribed temperature and rapidly cooling the member thereafter. I will provide a. SOLUTION: The heat-welding chip of the present invention is a heat-welding chip for melting and thermally crimping a part of a component when fixing the element to the resin-made component, and the heat-generating part having a substantially flat plate shape. And a pair of power receiving portions, the heat generating portion has a recess corresponding to the shape of the melted portion in the portion facing the melted portion of the component, and for cooling the element in the center of the heat generating portion. It has a central cooling hole and a peripheral hole between the central cooling hole of the heat generating part and the recess, and the width of the heat generating part in the direction perpendicular to the energization direction in which the current for heating the heat generating part flows is the width of the pair of power receiving parts. It is formed larger than the width. [Selection diagram] Figure 2

Description

本発明は、樹脂製の部品に素子を熱カシメにより熱溶着するための装置に関し、より詳しくは、樹脂製の部品を加熱する熱溶着チップと、熱溶着チップを搭載した熱溶着ユニットとに関する。 The present invention relates to an apparatus for heat-sealing an element to a resin-made component by thermal caulking, and more particularly to a heat-welding chip for heating a resin-made component and a heat-welding unit equipped with the heat-welding chip.

従来樹脂フィルムや布などのシート状の被固定物を熱可塑性樹脂製品に固定する際に、量産性と耐久性、密閉性が必要な場合にはインパルス方式などの熱溶着(熱融着)工法が用いられる。 When a sheet-shaped object to be fixed such as a resin film or cloth is fixed to a thermoplastic resin product, if the mass productivity, durability, and airtightness are required, the impulse welding method is used. Is used.

ここで、樹脂製の部材と異種材料からなる素子などの部材とを固定する際に、樹脂製の部材に被溶融部分である突起を設け、素子などの部材の突起と対応する位置に孔を設け、突起を素子などの部材の孔に貫通させてから突出した突起の先端に熱と押圧力を加え、軟化した突起の先端近傍を潰すようにして樹脂製の部材と素子などの部材とを固定する熱カシメによる熱融着が知られている(特許文献1)。 Here, when fixing a resin member and a member such as an element made of a different material, a protrusion that is a melted portion is provided on the resin member, and a hole is formed at a position corresponding to the protrusion of the member such as the element. After providing the projection with a hole of a member such as an element, heat and pressing force are applied to the tip of the protruding projection to crush the vicinity of the tip of the softened projection to separate the resin member and the element such as the element. Thermal fusion by fixing by heat crimping is known (Patent Document 1).

特開2007−253481号公報JP, 2007-253481, A

しかし、このような熱融着法では、素子などの部材に孔を設ける必要があるので熱融着できる部材の形状、寸法、材質などに制限が生じる。 However, in such a heat fusion method, since it is necessary to provide holes in a member such as an element, there are restrictions on the shape, size, material, etc. of the heat fusion member.

また、熱溶着工程の生産効率を高めるためには、樹脂製の部材に設けた被溶融部分を効率よく規定の温度以上に加熱するとともに、その後の被溶融部分の冷却を速やかに行うことが望まれる。 Further, in order to increase the production efficiency of the heat welding step, it is desirable to efficiently heat the melted portion provided on the resin member to a temperature equal to or higher than the specified temperature, and then to cool the melted portion promptly. Be done.

特許文献1の発明においては、樹脂製の部材に設けた被溶融部分を効率よく規定の温度以上に加熱するために、内部に空間を有する複数の突起部が設けられた板状部材が熱溶着される部材の側にせり出しているので縦方向のスペースをとり、熱溶着装置を大型化させる課題があった。 In the invention of Patent Document 1, in order to efficiently heat the melted portion provided on the resin member to a prescribed temperature or higher, a plate-shaped member provided with a plurality of protrusions having spaces inside is heat-welded. Since it protrudes to the side of the member to be formed, there is a problem in that a space in the vertical direction is taken and the heat welding apparatus is enlarged.

本発明の目的は、かかる従来技術の課題に鑑み、樹脂製の部品に設けた被溶融部分を効率よく規定の以上の温度に加熱することができ、その後の部材の冷却を速やかに行うことができる省スペースな熱溶着チップおよび熱溶着ユニットを提供することにある。 In view of the problems of the prior art, an object of the present invention is to efficiently heat a melted portion provided on a resin component to a temperature above a specified value, and to cool the member thereafter quickly. (EN) It is possible to provide a space-saving heat-welding tip and a heat-welding unit.

上記目的を達成するため、本発明は、
樹脂製の部品に素子を固定する際に、前記部品の一部を溶融させて熱カシメするための熱溶着チップであって、
略平板状の発熱部と、該発熱部の一方の端部及びその反対側の端部に設けられた一対の給電部とを有し、
前記発熱部が前記部品の被溶融部分と対向する部分に、該被溶融部分の形状に対応した凹部を有し、
前記発熱部の中央に前記素子を冷却するための中央冷却孔を有し、
前記発熱部の前記中央冷却孔と前記凹部との間に周辺孔を有し、
前記熱溶着チップの平面視において前記一対の給電部の一方から他方に向かう方向である通電方向に直角な方向の幅を横幅とする場合前記発熱部の幅は前記一対の給電部の幅よりも大きく形成されている
ことを特徴とする。
In order to achieve the above object, the present invention provides
When fixing an element to a resin-made component, a heat-welded chip for melting and thermally caulking a part of the component,
A substantially flat plate-shaped heat generating part, and a pair of power supply parts provided at one end of the heat generating part and the opposite end thereof ,
In the portion where the heat generating portion faces the melted portion of the component, has a recess corresponding to the shape of the melted portion,
A central cooling hole for cooling the element is provided at the center of the heat generating portion,
A peripheral hole is provided between the central cooling hole and the recess of the heat generating portion,
In the case of the lateral width direction perpendicular width energizing direction a direction from one to the other of said pair of power supply portions in a plan view of the heat welding tip, the width of the heat generating portion of said pair of power supply unit characterized in that it is larger than the lateral width.

このような構成とすることで、略平板状の省スペースな形状でありかつ、樹脂製の部品に設けた被溶融部分を効率よく規定以上の温度に加熱することができ、また、通電停止後の発熱部の不均一な冷却を抑えることができるので、熱溶着工程の生産効率を高めることができる。 With such a configuration, it has a substantially flat plate space-saving shape, and the melted portion provided on the resin part can be efficiently heated to a temperature higher than the specified temperature. Since it is possible to suppress the non-uniform cooling of the heat generating part, it is possible to improve the production efficiency in the heat welding step.

また、本発明の熱溶着チップにおいて、
前記発熱部は矩形であり、前記中央冷却孔から該矩形の各角に向かう途中に、それぞれ前記周辺孔を有することが好ましい。
Further, in the heat-welded tip of the present invention,
It is preferable that the heat generating portion has a rectangular shape, and the peripheral hole is provided on the way from the central cooling hole to each corner of the rectangle.

このような構成とすることで、低い印加電流で樹脂製の部品に設けた被溶融部分を規定以上の温度に加熱することができ、部材の冷却も速やかに行うことができる。 With such a structure, the melted portion provided on the resin component can be heated to a temperature higher than the specified temperature with a low applied current, and the member can be cooled promptly.

また、本発明の熱溶着チップにおいて、
前記周辺孔は前記中央冷却孔の端から前記凹部に至るまでの中央よりも前記凹部に近い位置に形成されていることが好ましい。
Further, in the heat-welded tip of the present invention,
It is preferable that the peripheral hole is formed at a position closer to the recess than the center from the end of the central cooling hole to the recess.

このような構成とすることで、より低い印加電流で樹脂製の部品に設けた被溶融部分を規定以上の温度に加熱することができ、部材の冷却も速やかに行うことができる。 With such a configuration, the melted portion provided on the resin component can be heated to a temperature higher than the specified temperature with a lower applied current, and the member can be cooled quickly.

そして、本発明の熱溶着ユニットは、上述の熱溶着チップを備えた熱溶着ユニットであって、
下端部には、前記熱溶着チップと、前記熱溶着チップの給電部に給電するための一対の給電部材とを備え、
上部には前記熱溶着ユニットを熱溶着装置本体に固定するための固定部材を有し、該固定部材には前記熱溶着チップの前記発熱部に向かう方向に設けた貫通孔があり、
前記固定部材と前記一対の給電部材との間には前記貫通孔と繋がった気体流通部を備えたスペース部材を有し、
前記貫通孔の上端部には前記素子を冷却するための気体が流通する冷却配管を有し、
前記気体流通部の前記発熱部側には前記素子を冷却するための複数の冷却穴を有することを特徴とする。
And the heat welding unit of the present invention is a heat welding unit including the above-mentioned heat welding tip,
The lower end portion is provided with the heat-welding tip and a pair of power feeding members for feeding power to the power feeding portion of the heat-welding tip,
The upper part has a fixing member for fixing the heat welding unit to the heat welding apparatus body, and the fixing member has a through hole provided in a direction toward the heat generating portion of the heat welding chip,
Between the fixed member and the pair of power supply members, a space member having a gas flow portion connected to the through hole,
The upper end of the through hole has a cooling pipe through which a gas for cooling the element flows,
A plurality of cooling holes for cooling the element may be provided on the heat generating portion side of the gas circulation portion.

熱溶着チップを備えた熱溶着ユニットの構成をこのようにすることで、省スペースでありかつ、樹脂製の部品に設けた被溶融部分の加熱、冷却を効率よく行うことができ、熱溶着工程の生産効率を高めることができる。 By configuring the structure of the heat-welding unit having the heat-welding tip in this way, it is possible to save space and efficiently heat and cool the melted portion provided on the resin-made component. Can improve the production efficiency.

本発明における熱溶着ユニットの一例を示す斜視分解図である。It is a perspective exploded view showing an example of a heat welding unit in the present invention. 本発明における熱溶着する部品および素子の一例を示す図である。It is a figure which shows an example of the components and elements to which the present invention is heat-welded. 本発明におけるスペース部材の一例を示す縦断面図である。It is a longitudinal section showing an example of a space member in the present invention. 本発明における熱溶着チップの一例を示す平面図である。It is a top view which shows an example of the heat welding tip in this invention. 熱溶着チップの昇温試験結果(実施例)を示す図である。It is a figure which shows the temperature rising test result (example) of a heat welding tip. 熱溶着チップの昇温試験結果(比較例1)を示す図である。It is a figure which shows the temperature rising test result (comparative example 1) of a heat welding tip. 熱溶着チップの昇温試験結果(比較例2)を示す図である。It is a figure which shows the temperature rising test result (comparative example 2) of a heat welding tip. 熱溶着チップの昇温試験結果(比較例3)を示す図である。It is a figure which shows the temperature rising test result (comparative example 3) of a heat welding tip.

以下、添付図面を参照して本発明の実施形態を詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

図1Aは本発明の一実施形態の熱溶着ユニット全体を示す分解斜視図である。熱溶着ユニット1は後で詳述する熱溶着チップ10を下端部に有しており、熱溶着装置の要部を成すものである。 FIG. 1A is an exploded perspective view showing an entire heat welding unit according to an embodiment of the present invention. The heat-welding unit 1 has a heat-welding tip 10, which will be described in detail later, at the lower end portion thereof, and constitutes the main part of the heat-welding device.

熱溶着ユニット1はその上部に固定部材3を有しており、固定部材3は不図示の熱溶着装置本体に固定するための立設した固定化部を有している。また固定部材3の中央には、後述する熱溶着チップ10の発熱部11に向かう方向に設けた貫通孔3aを有している。その貫通孔3aの上端部には部品6と素子8を冷却するための気体が流通する冷却配管5がはめ込まれており、冷却配管5は熱溶着装置本体の冷却エアー供給装置(不図示)につながっている。 The thermal welding unit 1 has a fixing member 3 on its upper portion, and the fixing member 3 has an upright fixing portion for fixing to a main body of the thermal welding apparatus (not shown). Further, the fixing member 3 has a through hole 3a formed in the center thereof in a direction toward the heat generating portion 11 of the heat-welding tip 10 described later. A cooling pipe 5 through which a gas for cooling the component 6 and the element 8 flows is fitted in the upper end portion of the through hole 3a, and the cooling pipe 5 is connected to a cooling air supply device (not shown) of the heat welding device body. linked.

固定部材3にはスペース部材4を介して2つの給電部材2が固定され、そして、2つの給電部材2の中央部の間に熱溶着チップ10が固定される。2つの給電部材2はそれぞれ熱溶着装置本体の電源装置(不図示)につながっており、その電源装置からの給電を受けて、熱溶着チップ10が発熱する。よって、給電部材2は導体、スペース部材4は絶縁体である必要がある。なお、熱溶着チップ10は消耗する可能性があるので、熱溶着工程の間も一定の生産量毎に交換可能で、交換後の位置再現性も確保される設計となっている。 The two power feeding members 2 are fixed to the fixing member 3 via the space member 4, and the heat-welded chip 10 is fixed between the central portions of the two power feeding members 2. Each of the two power supply members 2 is connected to a power supply device (not shown) of the main body of the heat welding device, and the heat welding chip 10 generates heat when receiving power from the power supply device. Therefore, the feeding member 2 needs to be a conductor and the space member 4 needs to be an insulator. Since the heat-welded chip 10 may be consumed, it can be replaced during the heat-welding process for each constant production amount, and the position reproducibility after replacement can be ensured.

また、本実施形態では、2つの給電部材2の間に位置し、スペース部材4に固定された絶縁体からなる略矩形板状の絶縁部材7が設けられている。絶縁部材7は耐熱性、断熱性、絶縁性を有する素材からなり、中央に円形の孔を有しており、熱溶着チップ10を裏から抑えて変形を防止する作用を有する。 Further, in the present embodiment, a substantially rectangular plate-shaped insulating member 7 made of an insulating material and fixed to the space member 4 is provided between the two power feeding members 2. The insulating member 7 is made of a material having heat resistance, heat insulation, and insulation, has a circular hole in the center, and has a function of suppressing the heat-welded chip 10 from the back side to prevent deformation.

図1Bは、熱溶着前の部品6に素子8がはめ込まれている状態の一例を示す図である。本実施形態においては、素子8の上面よりも所定程度上方にせり出して、素子8の縁部の一部を囲むように被溶融部分6aが設けられている。これにより、素子8に孔を設ける必要がないので、熱溶着できる部材の形状、寸法、材質などの自由度が高まる。なお被溶融部分6aは、素子8の形状に合わせて任意の位置に設けられてよい。 FIG. 1B is a diagram showing an example of a state in which the element 8 is fitted in the component 6 before heat welding. In the present embodiment, the melted portion 6a is provided so as to protrude a certain amount above the upper surface of the element 8 and surround a part of the edge portion of the element 8. As a result, it is not necessary to provide a hole in the element 8, so that the degree of freedom of the shape, size, material, etc. of the heat-weldable member is increased. The melted portion 6a may be provided at any position according to the shape of the element 8.

図1Cはスペース部材4の縦断面図である。スペース部材4には貫通孔3aと繋がった気体流通部4aが設けられており、気体流通部4aの発熱部11側には素子8を熱溶着した部品6を冷却するための複数の冷却穴4bを有している。また、スペース部材4の下部には、部品6を熱溶着する際に素子8を押さえるための中央ロッド4cが固定されている。この中央ロッド4cは、熱溶着する部品6および素子8の形状などに合わせて精密に位置調整される。 FIG. 1C is a vertical sectional view of the space member 4. The space member 4 is provided with a gas circulation portion 4a connected to the through hole 3a, and a plurality of cooling holes 4b for cooling the component 6 to which the element 8 is heat-welded is provided on the heat generation portion 11 side of the gas circulation portion 4a. have. A central rod 4c for fixing the element 8 when the component 6 is heat-welded is fixed to the lower portion of the space member 4. The position of the central rod 4c is precisely adjusted according to the shapes of the parts 6 and the element 8 to be heat-welded.

熱カシメ工程においては、熱溶着チップ10に給電部材2を介して電流を印加して素子8を乗せた部品6の被溶融部分6aを加熱し、熱溶着チップ10の凹部13で被溶融部分6aを押圧して素子8を部品6に熱カシメしたのち、冷却配管5、貫通孔3a、気体流通部4a、冷却穴4bを通過してきた冷却エアーによって熱溶着チップ10を冷却し、熱溶着チップ10の冷却により部品6および素子8を冷却する。熱溶着チップ10への印加電圧は通常10V以下である。ここで、冷却穴4bの個数、穴形状、レイアウト、断面形状については特に規定はなく、冷却エアーの効率やスペース部材4の強度を勘案して適宜選択すればよい。 In the heat crimping step, the melted portion 6a of the component 6 on which the element 8 is placed is heated by applying an electric current to the heat welded chip 10 through the power feeding member 2, and the melted portion 6a is formed in the recess 13 of the heat weldable chip 10. After pressing the element 8 to the component 6 by heat caulking, the heat welding tip 10 is cooled by the cooling air that has passed through the cooling pipe 5, the through hole 3a, the gas circulation portion 4a, and the cooling hole 4b. The component 6 and the element 8 are cooled by the cooling. The voltage applied to the heat welding tip 10 is usually 10 V or less. Here, the number, hole shape, layout, and cross-sectional shape of the cooling holes 4b are not particularly specified, and may be appropriately selected in consideration of the efficiency of the cooling air and the strength of the space member 4.

図2は本発明の一実施形態の熱溶着チップを示す平面図であり、図1の下面側(部品6側)から見た図である。熱溶着チップ10はその中央に略平板状の発熱部11を、その両端に一対の給電部12を有している。本実施形態では給電部12も略平板状であり、発熱部11と給電部12とは同一の厚さを有する一体のものである。 FIG. 2 is a plan view showing a heat-welded chip according to an embodiment of the present invention, and is a view seen from the lower surface side (part 6 side) of FIG. The heat-welding chip 10 has a substantially flat plate-shaped heat generating portion 11 at the center thereof and a pair of power feeding portions 12 at both ends thereof. In the present embodiment, the power feeding portion 12 is also substantially flat, and the heat generating portion 11 and the power feeding portion 12 are integrated and have the same thickness.

この発熱部11には部品6の被溶融部分6aと対向する部分に、該被溶融部分6aの形状に対応した凹部13を有しており、発熱部11の中央には、長円形の中央冷却孔14を有している。発熱部11の部品6と対向しない面は凹凸のない平面形状としている。中央冷却孔14は、冷却配管5、貫通孔3a、気体流通部4a、冷却穴4bを通過してきた冷却エアーによって熱溶着チップ10、更には部品6および素子8を効率よく冷却するためのものである。 The heat generating portion 11 has a concave portion 13 corresponding to the shape of the melted portion 6a at a portion facing the melted portion 6a of the component 6, and the heat generating portion 11 has an oval central cooling at the center thereof. It has a hole 14. The surface of the heat generating portion 11 that does not face the component 6 has a planar shape with no unevenness. The central cooling hole 14 is for efficiently cooling the heat-welded chip 10, and further the component 6 and the element 8 by the cooling air that has passed through the cooling pipe 5, the through hole 3a, the gas flow portion 4a, and the cooling hole 4b. is there.

凹部13は部品6の被溶融部分6aの形状に対応して形成され、基本的に溶融する部分の全域(全周)に形成されるが、必要に応じて溶融する部分の形状に合わせて一部繋いで形成することもある。凹部13の断面形状に特に規定はなく、矩形、台形、半円形など適宜選択すればよい。 The recessed portion 13 is formed corresponding to the shape of the melted portion 6a of the component 6, and is basically formed over the entire area (entire circumference) of the melted portion, but if necessary, it should be formed according to the shape of the melted portion. It may be formed by connecting parts. The cross-sectional shape of the recess 13 is not particularly limited, and may be appropriately selected from rectangular, trapezoidal, semicircular, and the like.

また、矩形である発熱部11の中央冷却孔14からこの矩形の各角に向かう途中に、それぞれ周辺孔15を有している。ここで、周辺孔15は中央冷却孔14の端から凹部13に至るまでの中央よりも凹部13に近い位置に形成されている。周辺孔15は熱溶着チップ10の発熱部11を流れる電流をコントロールして発熱部11の昇温を均一化すると共に、部品6および素子8の冷却にも寄与している。 Further, peripheral holes 15 are provided on the way from the central cooling hole 14 of the rectangular heat generating portion 11 to each corner of the rectangle. Here, the peripheral hole 15 is formed at a position closer to the recess 13 than the center from the end of the central cooling hole 14 to the recess 13. The peripheral hole 15 controls the current flowing through the heat-generating portion 11 of the heat-welded chip 10 to make the temperature of the heat-generating portion 11 uniform, and also contributes to the cooling of the component 6 and the element 8.

中央冷却孔14は円形、楕円形あるいは長円形であることが好ましく、中央冷却孔14の直径(長径)は通電方向に垂直な方向の発熱部の幅の20%以上、40%以下であることが好ましい。ここで、中央冷却孔14を楕円形あるいは長円形とする場合には、その長径を通電方向とすることが好ましく、また、周辺孔15は加工性や耐熱性などの点で円形が好ましい。 The central cooling hole 14 is preferably circular, elliptical, or oval, and the diameter (major axis) of the central cooling hole 14 is 20% or more and 40% or less of the width of the heat generating portion in the direction perpendicular to the energization direction. Is preferred. Here, when the central cooling hole 14 is formed into an elliptical shape or an elliptical shape, it is preferable that the major axis thereof be in the energizing direction, and the peripheral hole 15 is preferably circular in terms of workability and heat resistance.

本実施形態では、通電方向に垂直な方向の発熱部11の幅は給電部12の幅よりも大きく形成しており、このことも熱溶着チップ10の発熱部11の昇温、降温の均一化に寄与している。このような発熱部11の均一な昇温、降温を得るためには、通電方向に垂直な方向の発熱部11の幅を給電部12の幅よりも10%以上大きくすることが好ましい。本実施形態では、通電方向に垂直な方向の発熱部11の幅を12mm、給電部12の幅を7mmと、発熱部11の幅を給電部12の幅よりも約70%大きくしている。 In the present embodiment, the width of the heat generating portion 11 in the direction perpendicular to the energization direction is formed larger than the width of the power feeding portion 12, which also makes the heat generating portion 11 of the heat-welded chip 10 uniform in temperature rise and decrease. Contribute to. In order to obtain such uniform heating and cooling of the heat generating portion 11, it is preferable to make the width of the heat generating portion 11 in the direction perpendicular to the energization direction larger than the width of the power feeding portion 12 by 10% or more. In the present embodiment, the width of the heat generating portion 11 in the direction perpendicular to the energization direction is 12 mm, and the width of the power feeding portion 12 is 7 mm, so that the width of the heat generating portion 11 is about 70% larger than the width of the power feeding portion 12.

図3A〜Dは熱溶着チップの加熱試験結果を示す説明図である。 3A to 3D are explanatory views showing the heating test results of the heat-welded tip.

(実施例)
図3Aは本発明の実施例であって、図2に示した熱溶着チップ10ついて、図1Aの下面側(部品6側)から見た図において、下記の条件で通電試験をした際の発熱部11の温度上昇を示すものである。
(Example)
FIG. 3A is an embodiment of the present invention, in which the heat-welded tip 10 shown in FIG. 2 is viewed from the lower surface side (part 6 side) of FIG. It shows the temperature rise of the part 11.

ここでは、発熱部11の平面形状は凡そ12mm×12mm、厚さは0.3mmである。中央冷却孔14は長円であって、通電方向の長さが6mm、同垂直方向の幅が3mm、長円のアスペクト比は2:1である。また、4つの周辺孔15はそれぞれ直径が1.5mmの円形である。この熱溶着チップ10に給電部材2を介して交流電流を80A、3Vで10秒印加した際の発熱部11面内の最高温度は230℃(A点)、最低温度は220℃(B点)と、均一かつ十分な昇温が見られた。 Here, the heat generating portion 11 has a planar shape of about 12 mm×12 mm and a thickness of 0.3 mm. The central cooling hole 14 is an oval, and the length in the energization direction is 6 mm, the width in the same vertical direction is 3 mm, and the aspect ratio of the oval is 2:1. The four peripheral holes 15 are each circular with a diameter of 1.5 mm. When an alternating current is applied to the heat-welded chip 10 via the power supply member 2 at 80 A and 3 V for 10 seconds, the maximum temperature in the surface of the heat generating portion 11 is 230° C. (point A) and the minimum temperature is 220° C. (point B). Then, a uniform and sufficient temperature rise was observed.

(比較例1)
図3Bは本発明の比較例であって、実施例と同様に通電試験をした際の発熱部の温度上昇を示すものである。この比較例では、通電方向に垂直な方向の発熱部の幅と給電部の幅とを同じ幅に形成している。
(Comparative Example 1)
FIG. 3B is a comparative example of the present invention, and shows the temperature rise of the heat generating part when an energization test is performed as in the example. In this comparative example, the width of the heat generating portion and the width of the power feeding portion in the direction perpendicular to the energization direction are formed to be the same width.

ここでは、発熱部の平面形状は凡そ12mm×12mm、厚さは0.3mmである。中央の冷却孔は長円であって、通電方向の長さが6mm、同垂直方向の幅が3mm、長円のアスペクト比は2:1である。また、4つの周辺孔はそれぞれ直径が1.5mmの円形である。この熱溶着チップに給電部材を介して交流電流を80A、3Vで10秒印加した際の発熱部面内の最高温度は230℃(C点)、最低温度は140℃(D点)と、均一な昇温は見られなかった。 Here, the planar shape of the heat generating portion is approximately 12 mm×12 mm, and the thickness is 0.3 mm. The cooling hole in the center is an ellipse, and the length in the energizing direction is 6 mm, the width in the same vertical direction is 3 mm, and the aspect ratio of the ellipse is 2:1. Each of the four peripheral holes has a circular shape with a diameter of 1.5 mm. When an alternating current was applied to this heat-welded chip via a power supply member at 80 A, 3 V for 10 seconds, the maximum temperature in the surface of the heat generating part was 230° C. (point C) and the minimum temperature was 140° C. (point D), which were uniform. No significant temperature rise was observed.

(比較例2)
図3Cは本発明の他の比較例であって、同様に通電試験をした際の発熱部の温度上昇を示すものである。
(Comparative example 2)
FIG. 3C is another comparative example of the present invention, and shows the temperature rise of the heat generating portion when the same energization test is performed.

この熱溶着チップは発熱部の中央に円形の中央冷却孔のみを有しており、通電方向に垂直な方向の給電部の幅は発熱部の幅よりも小さく形成している。発熱部の平面形状は実施例と同様に凡そ12mm×12mm、厚さは1.0mm、給電部の幅は7mm、中央冷却孔の直径は5mmである。この熱溶着チップに給電部材を介して交流電流を180A、3Vで10秒印加した際の発熱部面内の最高温度は240℃(E点)、最低温度は200℃(F点)と、均一な昇温は見られなかった。ここで、発熱部の厚さを実施例や比較例1のように減少させ、加熱時間を20秒まで延長しても昇温の均一化は図れず、必要な印加電流値は180Aと実施例に比べて大きかった。 This heat-welded chip has only a circular central cooling hole in the center of the heat generating portion, and the width of the power feeding portion in the direction perpendicular to the energizing direction is smaller than the width of the heat generating portion. Similar to the embodiment, the planar shape of the heat generating portion is approximately 12 mm×12 mm, the thickness is 1.0 mm, the width of the power feeding portion is 7 mm, and the diameter of the central cooling hole is 5 mm. When an alternating current of 180 A and 3 V was applied for 10 seconds to this heat-welded chip through a power supply member, the maximum temperature in the surface of the heat generating part was 240°C (point E) and the minimum temperature was 200°C (point F), which was uniform. No significant temperature rise was observed. Here, even if the thickness of the heat generating portion is reduced as in Example and Comparative Example 1 and the heating time is extended to 20 seconds, the temperature rise cannot be made uniform, and the required applied current value is 180A. It was bigger than

(比較例3)
図3Eは本発明の更に他の比較例であって、同様に通電試験をした際の発熱部の温度上昇を示すものである。
(Comparative example 3)
FIG. 3E shows still another comparative example of the present invention, and shows the temperature rise of the heat generating portion when the same electric current test is performed.

この熱溶着チップは発熱部の四隅に円形の周辺孔のみを有しており、通電方向に垂直な方向の発熱部の幅と給電部の幅とを同じ幅に形成している。発熱部の平面形状は実施例と同様に凡そ12mm×12mm、厚さは2.0mm、周辺孔の直径は2mmである。この熱溶着チップに給電部材を介して交流電流を200A、3Vで10秒印加した際の発熱部面内の最高温度は240℃(G点)、最低温度は180℃(H点)と、均一な昇温は見られなかった。ここでも、発熱部の厚さを実施例や比較例1のように減少させても、昇温の均一化は図れず、必要な印加電流値は実施例に比べて大きかった。 This heat-welded chip has only circular peripheral holes at the four corners of the heat generating portion, and the width of the heat generating portion and the width of the power feeding portion in the direction perpendicular to the current-carrying direction are formed to be the same width. Similar to the embodiment, the plane shape of the heat generating portion is approximately 12 mm×12 mm, the thickness is 2.0 mm, and the diameter of the peripheral hole is 2 mm. When an alternating current of 200 A and 3 V was applied for 10 seconds to the heat-welded chip via a power supply member, the maximum temperature in the surface of the heat generating part was 240° C. (point G) and the minimum temperature was 180° C. (point H), which was uniform. No significant temperature rise was observed. Also in this case, even if the thickness of the heat generating portion was reduced as in Example and Comparative Example 1, uniform heating could not be achieved, and the required applied current value was larger than in Examples.

このように、発熱部11の中央に素子8を冷却するための中央冷却孔14を有し、発熱部11の中央冷却孔14と凹部13との間に周辺孔15を有し、発熱部11を加熱する電流が流れる通電方向に垂直な方向の発熱部11の幅は一対の給電部12の幅よりも大きく形成されている熱溶着チップ10を用いて樹脂製の部品6に素子8を固定する熱カシメを行うことで、より低い印加電流で均一な発熱部11の昇温が得られ、通電停止後に発熱部11が速やかに降温する。そのため、熱溶着工程の生産効率の向上、省エネ化が図れ、またこの略平板状の熱溶着チップ10を熱溶着ユニット1に搭載すれば、熱溶着チップ10が縦方向のスペースをとらないので熱溶着装置の小型化も図ることができる。 As described above, the central cooling hole 14 for cooling the element 8 is provided at the center of the heat generating portion 11, and the peripheral hole 15 is provided between the central cooling hole 14 of the heat generating portion 11 and the concave portion 13. The element 8 is fixed to the resin-made component 6 by using the heat-welding chip 10 in which the width of the heat generating portion 11 in the direction perpendicular to the energizing direction in which the current for heating the is flowing is larger than the width of the pair of power feeding portions 12. By performing the heat crimping, the temperature of the heat generating part 11 can be uniformly increased with a lower applied current, and the temperature of the heat generating part 11 can be quickly lowered after the energization is stopped. Therefore, the production efficiency in the heat welding step can be improved and energy saving can be achieved, and if the heat welding chip 10 having a substantially flat plate shape is mounted on the heat welding unit 1, the heat welding chip 10 does not take a space in the vertical direction, so The welding device can be downsized.

以上、本発明の実施形態を説明したが、それらに限定されるものではない。例えば、本実施形態では発熱部11は両面を平面形状としたが、熱溶着する部品6および素子8の形状に対応させて、発熱部11の中央冷却孔14周辺になだらかな凹部を設けることも可能である。 Although the embodiments of the present invention have been described above, the present invention is not limited thereto. For example, in the present embodiment, the heat generating portion 11 has a flat surface on both sides, but a gentle concave portion may be provided around the central cooling hole 14 of the heat generating portion 11 in accordance with the shapes of the parts 6 and the elements 8 to be heat-welded. It is possible.

また、本発明の実施形態では熱溶着チップ10の発熱部11と給電部12とを同一の厚さとしたが、例えば発熱部11の厚さを給電部12よりも薄い態様としても同様の効果を奏することは言うまでもない。 Further, in the embodiment of the present invention, the heat generating portion 11 and the power feeding portion 12 of the heat-welded chip 10 have the same thickness, but the same effect can be obtained even if the thickness of the heat generating portion 11 is thinner than that of the power feeding portion 12. Not to mention playing.

1 熱溶着ユニット
2 給電部材
3 固定部材
3a 貫通孔
4 スペース部材
4a 気体流通部
4b 冷却穴
5 冷却配管
10 熱溶着チップ
11 発熱部
12 給電部
13 凹部
14 中央冷却孔
15 周辺孔
DESCRIPTION OF SYMBOLS 1 Thermal welding unit 2 Power feeding member 3 Fixing member 3a Through hole 4 Space member 4a Gas distribution part 4b Cooling hole 5 Cooling pipe 10 Thermal welding chip 11 Heat generating part 12 Power feeding part 13 Recess 14 Central cooling hole 15 Peripheral hole

Claims (4)

樹脂製の部品に素子を固定する際に、前記部品の一部を溶融させて熱カシメするための熱溶着チップであって、
略平板状の発熱部と、該発熱部の一方の端部及びその反対側の端部に設けられた一対の給電部とを有し、
前記発熱部が前記部品の被溶融部分と対向する部分に、該被溶融部分の形状に対応した凹部を有し、
前記発熱部の中央に前記素子を冷却するための中央冷却孔を有し、
前記発熱部の前記中央冷却孔と前記凹部との間に周辺孔を有し、
前記熱溶着チップの平面視において前記一対の給電部の一方から他方に向かう方向である通電方向に直角な方向の幅を横幅とする場合前記発熱部の幅は前記一対の給電部の幅よりも大きく形成されている
ことを特徴とする熱溶着チップ。
When fixing an element to a resin-made component, a heat-welded chip for melting and thermally caulking a part of the component,
A substantially flat plate-shaped heat generating part, and a pair of power supply parts provided at one end of the heat generating part and the opposite end thereof ,
In the portion where the heat generating portion faces the melted portion of the component, has a recess corresponding to the shape of the melted portion,
A central cooling hole for cooling the element is provided at the center of the heat generating portion,
A peripheral hole is provided between the central cooling hole and the recess of the heat generating portion,
In the case of the lateral width direction perpendicular width energizing direction a direction from one to the other of said pair of power supply portions in a plan view of the heat welding tip, the width of the heat generating portion of said pair of power supply unit heat welding tip, characterized in that it is formed larger than the width.
請求項1に記載の熱溶着チップであって、
前記発熱部は矩形であり、前記中央冷却孔から該矩形の各角に向かう途中に、それぞれ前記周辺孔を有することを特徴とする熱溶着チップ。
The heat-welded chip according to claim 1,
The heat-welding chip is characterized in that the heat generating portion has a rectangular shape, and has the peripheral holes in the middle of the central cooling hole toward each corner of the rectangle.
請求項2に記載の熱溶着チップであって、
前記周辺孔は前記中央冷却孔の端から前記凹部に至るまでの中央よりも前記凹部に近い位置に形成されていることを特徴とする熱溶着チップ。
The heat-welded chip according to claim 2,
The thermal welding chip, wherein the peripheral hole is formed at a position closer to the recess than the center from the end of the central cooling hole to the recess.
請求項1乃至3に記載のいずれか1項に記載の熱溶着チップを備えた熱溶着ユニットであって、
下端部には、前記熱溶着チップと、前記熱溶着チップの給電部に給電するための一対の給電部材とを備え、
上部には前記熱溶着ユニットを熱溶着装置本体に固定するための固定部材を有し、該固定部材には前記熱溶着チップの前記発熱部に向かう方向に設けた貫通孔があり、
前記固定部材と前記一対の給電部材との間には前記貫通孔と繋がった気体流通部を備えたスペース部材を有し、
前記貫通孔の上端部には前記素子を冷却するための気体が流通する冷却配管を有し、
前記気体流通部の前記発熱部側には前記素子を冷却するための複数の冷却穴を有することを特徴とする熱溶着ユニット。
A thermal welding unit comprising the thermal welding tip according to any one of claims 1 to 3,
The lower end portion is provided with the heat-welding tip and a pair of power feeding members for feeding power to a power feeding portion of the heat-welding tip,
The upper part has a fixing member for fixing the heat welding unit to the heat welding apparatus body, and the fixing member has a through hole provided in a direction toward the heat generating portion of the heat welding chip,
Between the fixing member and the pair of power supply members, a space member having a gas flow portion connected to the through hole,
The upper end of the through hole has a cooling pipe through which a gas for cooling the element flows,
A heat welding unit comprising a plurality of cooling holes for cooling the element on the heat generating portion side of the gas circulation portion.
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