JP6716608B2 - 熱硬化性複合チップから直接製造された予備成形物 - Google Patents
熱硬化性複合チップから直接製造された予備成形物 Download PDFInfo
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- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
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- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
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- NBMQGZICMNFIGL-UHFFFAOYSA-N 3,4-bis(oxiran-2-ylmethyl)naphthalene-1,2-diol Chemical compound C1OC1CC=1C(O)=C(O)C2=CC=CC=C2C=1CC1CO1 NBMQGZICMNFIGL-UHFFFAOYSA-N 0.000 description 1
- MDWCEEQVTZURSU-UHFFFAOYSA-N 3-(2,4,8,10-tetraoxaspiro[5.5]undecan-5-yl)propan-1-amine Chemical compound NCCCC1OCOCC11COCOC1 MDWCEEQVTZURSU-UHFFFAOYSA-N 0.000 description 1
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- FGQUIQAGZLBOGL-UHFFFAOYSA-N 3-non-1-enyloxolane-2,5-dione Chemical compound CCCCCCCC=CC1CC(=O)OC1=O FGQUIQAGZLBOGL-UHFFFAOYSA-N 0.000 description 1
- FAUAZXVRLVIARB-UHFFFAOYSA-N 4-[[4-[bis(oxiran-2-ylmethyl)amino]phenyl]methyl]-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC(CC=2C=CC(=CC=2)N(CC2OC2)CC2OC2)=CC=1)CC1CO1 FAUAZXVRLVIARB-UHFFFAOYSA-N 0.000 description 1
- DUZLHGMYNVZMCO-UHFFFAOYSA-N 6-[2-[3-[2-(4,6-diamino-1,3,5-triazin-2-yl)ethyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]ethyl]-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(CCC2OCC3(CO2)COC(CCC=2N=C(N)N=C(N)N=2)OC3)=N1 DUZLHGMYNVZMCO-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
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- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000000843 anti-fungal effect Effects 0.000 description 1
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- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
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- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
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- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
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- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B11/00—Making preforms
- B29B11/14—Making preforms characterised by structure or composition
- B29B11/16—Making preforms characterised by structure or composition comprising fillers or reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Description
Claims (12)
- 結合力のある複合材チップの固結群を含む予備成形物の製造方法であって、前記予備成形物は、前記予備成形物の成形時に複合材部品の表面を形成する外面を含み、
非凝集性複合材チップを提供するステップであって、前記非凝集性複合材チップのそれぞれは、繊維及び未硬化の熱硬化性樹脂を含み、前記非凝集性複合材チップは、前記未硬化の熱硬化性樹脂の粘着性が前記非凝集性複合材チップの凝集を防止する充分な低さであるような温度にある、ステップと、
前記非凝集性複合材チップを含む流れを形成するステップと、
前記非凝集性複合材チップの流れを受け入れるための空洞を形成する壁を含む予備成形物工具を提供するステップであって、前記壁の少なくとも1つは、前記予備成形物の前記外面を画定する、ステップと、
前記空洞を結合力のない複合材チップの群で充填するために、前記非凝集性複合材チップの流れを前記予備成形物工具に導くステップであって、前記予備成形物工具は、前記結合力のない複合材チップの群で前記空洞を充填している間に振動している、ステップと、
結合力のある複合材チップの固結群を含む前記予備成形物を形成するために、前記結合力のない複合材チップの群の温度を上昇させるステップであって、前記結合力のある複合材チップのそれぞれは、前記繊維及び前記未硬化の熱硬化性樹脂を含み、前記結合力のある複合材チップは、前記未硬化の熱硬化性樹脂の粘着性が前記予備成形物を形成するために前記結合力のある複合材チップの結合力を生じさせる充分な高さであるような温度にある、ステップと
前記予備成形物を前記予備成形物工具から取り除くステップと
を含む、予備成形物の製造方法。 - 前記非凝集性複合材チップ中の前記繊維は一方向性である、請求項1に記載の予備成形物の製造方法。
- 前記非凝集性複合材チップは、1cm〜10cmの長さ、2mm〜2cmの幅、及び0.02mm〜0.50mmの厚さを有する、請求項1に記載の予備成形物の製造方法。
- 前記非凝集性複合材チップは長方形の形状である、請求項1に記載の予備成形物の製造方法。
- 前記未硬化の熱硬化性樹脂はエポキシ樹脂を含む、請求項1に記載の予備成形物の製造方法。
- 前記非凝集性複合材チップは0℃〜25℃の温度にある、請求項5に記載の予備成形物の製造方法。
- 前記非凝集性複合材チップは10℃〜20℃の温度にある、請求項1に記載の予備成形物の製造方法。
- 前記結合力のない複合材チップの群は、前記空洞を充填している間に計量されている、請求項1に記載の予備成形物の製造方法。
- 前記結合力のない複合材チップの群を形成するために、前記非凝集性複合材チップで前記空洞を充填している間に、真空が前記予備成形物工具中の前記空洞に適用されている、請求項1に記載の予備成形物の製造方法。
- 前記予備成形物を形成するステップの間に、真空が前記予備成形物工具中の前記空洞に適用されている、請求項1に記載の予備成形物の製造方法。
- 前記予備成形物の前記外面は、前記予備成形物が前記予備成形物の第2の部分より厚い第1の部分を有するように形作られている、請求項1に記載の予備成形物の製造方法。
- 請求項1に従って製造された予備成形物を提供するステップと、前記複合材部品を形成するために前記未硬化の熱硬化性樹脂を硬化するステップとを含む、複合材部品の製造方法。
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US14/711,087 US9724854B2 (en) | 2015-05-13 | 2015-05-13 | Preforms made directly from thermosetting composite chips |
US14/711,087 | 2015-05-13 | ||
PCT/US2016/028035 WO2016182694A1 (en) | 2015-05-13 | 2016-04-18 | Preforms made directly from thermosetting composite chips |
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JP2018514424A JP2018514424A (ja) | 2018-06-07 |
JP2018514424A5 JP2018514424A5 (ja) | 2019-05-30 |
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JP (1) | JP6716608B2 (ja) |
CN (1) | CN107635736B (ja) |
AU (1) | AU2016261053B2 (ja) |
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KR102503026B1 (ko) * | 2017-06-07 | 2023-02-23 | 다우 글로벌 테크놀로지스 엘엘씨 | 무작위적으로 배향된 필라멘트를 갖는 성형 화합물 및 이의 제조 및 사용 방법 |
DE102017120523A1 (de) * | 2017-09-06 | 2019-03-07 | Technische Universität Darmstadt | Spindel und ein Verfahren zur Herstellung einer Spindel |
US11628632B2 (en) * | 2019-03-25 | 2023-04-18 | The Boeing Company | Pre-consolidated charges of chopped fiber for composite part fabrication |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3389427A (en) * | 1965-10-23 | 1968-06-25 | Owens Illinois Inc | Apparatus for molding preforms of thermosetting plastics |
IL95489A0 (en) | 1989-08-31 | 1991-06-30 | Du Pont | Nonwoven preform sheets of fiber reinforced resin |
JPH09109310A (ja) | 1995-10-20 | 1997-04-28 | Ykk Corp | 成形シート材料の製造方法、その方法によって製造される繊維強化成形シート材料およびそれを用いた安全靴の先芯 |
US6139942A (en) * | 1997-02-06 | 2000-10-31 | Cytec Technology, Inc. | Resin composition, a fiber reinforced material having a partially impregnated resin and composites made therefrom |
FR2770802B1 (fr) | 1997-11-13 | 2000-02-11 | Duqueine | Procede de moulage d'une piece composite, structure composite employee dans ce procede et manivelle obtenue selon ce procede |
FR2806425B1 (fr) | 2000-03-16 | 2002-07-12 | Hexcel Composites | Produit intermediaire composite, procede de production d'un tel produit et utilisation a titre de materiau de moulage |
US7960674B2 (en) | 2005-06-28 | 2011-06-14 | Hexcel Corporation | Aerospace articles made from quasi-isotropic chopped prepreg |
US8212194B2 (en) | 2006-06-27 | 2012-07-03 | Hexcel Corporation | Aerospace articles made from quasi-isotropic chopped prepreg |
US7510390B2 (en) | 2005-07-13 | 2009-03-31 | Hexcel Corporation | Machinable composite mold |
TWI414543B (zh) | 2006-02-24 | 2013-11-11 | Toray Industries | 纖維強化熱可塑性樹脂成形體、成形材料及其製法 |
JP2009012441A (ja) * | 2007-06-06 | 2009-01-22 | Almighty:Kk | 再生可能な繊維強化樹脂成形品の製造方法 |
US8298359B2 (en) | 2008-07-24 | 2012-10-30 | Alenia Aeronautica S.P.A. | Method for recycling scraps of prepreg materials |
EP2179838B1 (en) | 2008-10-23 | 2017-12-06 | Campagnolo S.r.l. | Sheet moulding compound |
WO2010092081A1 (en) * | 2009-02-12 | 2010-08-19 | Kringlan Composites Ag | Method and apparatus for producing parts of fiber reinforced plastics |
EP2479217B1 (en) * | 2009-09-16 | 2019-08-28 | Toray Industries, Inc. | Binder composition, reinforcing-fiber base material, preform, fiber-reinforced composite material, and manufacturing method therefor |
US8709319B2 (en) | 2009-11-06 | 2014-04-29 | The Boeing Company | Compression molding method and reinforced thermoplastic parts molded thereby |
CN103068568B (zh) | 2010-08-13 | 2015-08-12 | 赫克赛尔公司 | 可机制复合材料 |
US9180631B2 (en) | 2011-07-22 | 2015-11-10 | The Boeing Company | Molded-in insert and method for fiber reinforced thermoplastic composite structure |
US8734925B2 (en) * | 2011-10-19 | 2014-05-27 | Hexcel Corporation | High pressure molding of composite parts |
US20130126073A1 (en) | 2011-11-18 | 2013-05-23 | Apple Inc. | Internal mold release |
US9393745B2 (en) * | 2012-05-15 | 2016-07-19 | Hexcel Corporation | Over-molding of load-bearing composite structures |
GB201509294D0 (en) * | 2015-05-29 | 2015-07-15 | Cytec Ind Inc | Process for preparing moulded articles from fibre-reinforced composite materials - I |
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BR112017024315A2 (pt) | 2018-07-24 |
AU2016261053B2 (en) | 2021-06-10 |
US20160332339A1 (en) | 2016-11-17 |
WO2016182694A1 (en) | 2016-11-17 |
CA2982993A1 (en) | 2016-11-17 |
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