JP6709034B2 - Light emitting device and lighting equipment - Google Patents

Description

The present invention relates to a light emitting device including a phosphor element including a phosphor member containing a phosphor and laminated on a supporting member, and a light source, and a lighting fixture.

BACKGROUND ART Conventionally, there is known a light emitting device that irradiates a phosphor with excitation light emitted from a light emitting diode, a semiconductor laser or the like to convert the color temperature of the excitation light into the color temperature of fluorescence. The color temperature is a scale (unit) that expresses the color of light emitted by a certain light source with a quantitative numerical value. The unit is K (Kelvin) of thermodynamic temperature. More specifically, assuming an ideal black body, the light emitted from a black body at a certain temperature derives a wavelength distribution of the light according to the temperature of the black body. Therefore, the color temperature corresponds to the color of light to be expressed with the color of light emitted from a black body at a certain temperature (high heat), and the temperature of the black body at that time is used as the color temperature.

The phosphor element included in the light emitting device includes, for example, a substrate and a phosphor light emitting unit formed on the substrate. In such a phosphor element, the shape of the phosphor light emitting portion is usually formed in a plate shape or a flat shape having a constant thickness.

For example, as shown in FIG. 20, a wavelength conversion inorganic molded body 100 as a phosphor element disclosed in Patent Document 1 emits phosphor light containing granular inorganic phosphor 111 on a substrate 101 made of metal. It has a phosphor layer 110 as a part. The surface of the phosphor layer 110 is flat, and the uneven shape due to the particle size of the particles of the inorganic phosphor 111 is formed, thereby improving the light extraction efficiency.

Japanese Patent Laid-Open No. 2013-213131 (Published October 17, 2013)

By the way, when the phosphor light emitting portion is relatively thin, the inventors have found that the color temperature of the light emitted by the phosphor light emitting portion locally irradiated with the excitation light is the same as that of the phosphor light emitting portion at the irradiation position of the excitation light. It was discovered that it changes depending on the thickness.

According to this finding, the conventional wavelength conversion inorganic molded body 100 disclosed in Patent Document 1 has the following problems.

That is, since the thickness of the phosphor layer 110 is substantially uniform, in the wavelength conversion inorganic molded body 100, the color temperature of light emitted by the phosphor layer 110 depends on the type of the inorganic phosphor 111 and the thickness of the phosphor layer 110. Is determined and fixed at that color temperature. For this reason, in the manufacturing process of the wavelength conversion inorganic molded body 100, when the thickness of the phosphor layer 110 is different from the desired thickness, the color temperature of the light emitted by the phosphor layer 110 is the desired color temperature. Will be different from. In that case, it is no longer possible to adjust the color temperature of the light emitted by the phosphor layer 110, and it is necessary to discard the wavelength conversion inorganic molded body 100 and remanufacture it newly. This can lead to lower yields and higher costs.

Further, in order to adjust the color temperature of the light emitted by the phosphor layer 110 according to the color temperature required for a product, the type of the inorganic phosphor 111 is changed or two or more types of inorganic phosphors 111 are used. It is necessary to mix and use. The color temperature of the light emitted by the phosphor layer 110 of the manufactured wavelength conversion inorganic molded body 100 is fixed and cannot be changed after manufacturing.

The present invention has been made in view of the above conventional problems, and an object thereof is to provide a light emitting device including a phosphor element capable of emitting light of a plurality of types of color temperatures by itself, and a lighting fixture. Especially.

In order to solve the above problems, a light emitting device according to one aspect of the present invention is a light emitting device that includes a phosphor element including a phosphor that contains a phosphor and is laminated on a supporting member, and a light source, The fluorescent member has a thickness that increases in order from one end to the other end in plan view, from the end to the center, or from the center to the end. , The irradiation location on the phosphor element in the excitation light emitted from the light source to the phosphor element can be changed, the color temperature of the light emission is controlled based on the irradiation location, the phosphor is internal Is characterized in that it does not include voids, or voids having a width of 0 < void width≦40 nm are formed .

In addition, a lighting device in one embodiment of the present invention is characterized by including the above-described light-emitting device in order to solve the above problems.

In addition, a vehicle headlamp according to an aspect of the present invention is characterized by including the lighting fixture described above in order to solve the above problems.

According to one aspect of the present invention, it is possible to provide a light emitting device including a phosphor element capable of emitting light of a plurality of types of color temperatures by itself, and an illumination fixture.

(A) is a side sectional view showing a schematic configuration of the phosphor element according to Embodiment 1 of the present invention, and (b) is an enlarged view of a main part of (a). In the phosphor element, when the excitation light of the rated output is locally irradiated, it is a graph showing the relationship between the thickness of the phosphor molding at the excitation light irradiation location and the color temperature of the light emitted by the phosphor element. .. (A) is a side sectional view illustrating an optical path of excitation light with which the transmissive phosphor element 1A is irradiated, and (b) illustrates an optical path of excitation light with which the reflective phosphor element 1A is irradiated. It is a side sectional view. (A) (b) (c) is a side sectional view explaining an example of a manufacturing method of the above-mentioned fluorescent substance element. (A) (b) (c) is a side surface sectional view explaining the modification of the manufacturing method of the said fluorescent substance element. (A) is a side sectional view showing a schematic configuration of a phosphor element according to Embodiment 2 of the present invention, and (b) is a side sectional view explaining an example of a method for manufacturing the phosphor element. It is a side sectional view showing composition of a modification of the above-mentioned fluorescent substance element. (A) (b) (c) is a side surface sectional view explaining the manufacturing method of the modification of the said phosphor element. It is a side surface sectional view showing a schematic structure of a fluorescent substance element in Embodiment 3 of the present invention. (A) (b) (c) (d) is side surface sectional drawing explaining an example of the manufacturing method of the said phosphor element. It is a side surface sectional view which shows the schematic structure of the modification of the said phosphor element. It is a side surface sectional view showing a schematic structure of a fluorescent substance element in Embodiment 4 of the present invention. (A)-(f) is a side surface sectional view explaining an example of the manufacturing method of the said phosphor element. (A) is a side sectional view showing a configuration of a modified example 1 of the phosphor element, and (b) is a side sectional view showing a configuration of a modified example 2 of the phosphor element. It is sectional drawing which shows the structure of the transmissive light-emitting device in Embodiment 5 of this invention. It is sectional drawing which shows the structure of the reflection type light-emitting device in Embodiment 5 of this invention. (A) is a top view which shows the structure of the fluorescent substance element in Embodiment 6 of this invention, (b) is a side sectional drawing of (a), (c) is excitation light from an excitation light source. FIG. 3 is a perspective view showing a schematic configuration in which the phosphor element is irradiated, and (d) is a plan view showing a state in which the phosphor element is rotated. (A) is a side sectional view showing a schematic configuration of a phosphor element rotating mechanism according to a sixth embodiment of the present invention, (b) is a plan view of (a), and (c) is ( It is a bottom view of a). (A) is a side sectional view showing a schematic configuration of a modified example of the phosphor element rotating mechanism, and (b) is a plan view showing a gear portion of (a). It is a side surface sectional view which shows the schematic structure of the conventional fluorescent substance element.

[Embodiment 1]
EMBODIMENT OF THE INVENTION It will be as follows if one Embodiment of this invention is described based on FIGS.

In the present embodiment, as an example of the phosphor element of the present invention, a phosphor element having a structure in which a molded body containing a phosphor is placed on a substrate and a method for manufacturing the same will be described.

<Phosphor element>
A phosphor element 1A of the present embodiment will be described based on (a) and (b) of FIG. 1A is a side sectional view showing a schematic configuration of a phosphor element 1A according to the present embodiment, and FIG. 1B is a side sectional view shown in FIG. It is an enlarged view of a part (D1) of FIG.

As shown in FIGS. 1A and 1B, the phosphor element 1A of the present embodiment has a phosphor molded body 2 as a fluorescent member containing the phosphor 2a, and the phosphor molded body 2 placed thereon. And a substrate 3 as a supporting member.

(Phosphor)
The phosphor 2a is, for example, an inorganic compound particle, and emits fluorescence when irradiated with excitation light. The particle size of the particles of the inorganic compound may be designed according to the size of the phosphor element 1A and is not particularly limited, but may be, for example, several hundreds nm to several tens of μm.

When irradiating, for example, blue light having a wavelength of 450 nm as excitation light, the phosphor element 1A uses blue excitation light and yellow fluorescence from the phosphor 2a by using a substance that emits yellow fluorescence as the phosphor 2a. It is possible to emit a pseudo white light mixed with.

The inorganic compound used in the phosphor 2a that emits fluorescence of such yellow, for example, YAG having a garnet structure _{(Yttrium Aluminium Garnet, Y 3 Al} 5 O 12) and _{TAG (Terbium Aluminium Garnet, Tb 3} Al 5 O ₁₂ :Ce) or silicate-based BOS (Barium ortho silicate, (Ba, Sr) ₂ SiO ₄ :Eu). Here, the phosphor 2a may be particles of one kind of inorganic compound, or may be a mixture of particles of plural kinds of inorganic compounds. For example, a combination of β-sialon, α-sialon, or CASN (CaAlSiN ₃ :Eu) inorganic compound may be used as the phosphor 2a, or LuAG (Lutetium Aluminum Garnet, Lu ₃ Al ₅ O) that emits green fluorescence. ₁₂ : Ce) and a combination of CASN may be used as the phosphor 2a. By mixing particles of a plurality of types of inorganic compounds, it is possible to achieve high color rendering of light emitted from the phosphor element 1A.

The phosphor 2a may be an inorganic compound having a shape other than particles, an organic compound, or another fluorescent substance. The light emitted by the phosphor element 1A is not limited to pseudo white. The light emitted by the phosphor element 1A may be variously designed according to its use, and the wavelength of the excitation light with which the phosphor element 1A is irradiated and the type of the phosphor 2a are also variously selected according to the designed color temperature of the light. It should be done.

That is, the wavelength of the excitation light applied to the phosphor element 1A and the type of the phosphor 2a are not limited to the above example. For example, the excitation light may be ultraviolet light, and the phosphor 2a may emit blue or red fluorescence.

(Fluorescent molding)
The fluorescent molded body 2 includes a fluorescent body 2a and is, for example, as follows. The shape of the fluorescent molded body 2 will be described later.

The fluorescent molded body 2 may be, for example, a compacted molded body of particles of the fluorescent body 2a, a molded body obtained by molding the particles of the fluorescent body 2a using a binder, or the like. The space between the particles of the phosphor 2a may be a void or may be filled with a sealing material. By filling the gap, the thermal conductivity of the fluorescent molded body 2 increases. The sealing material can be appropriately selected from glass, silicone, acrylic resin and the like.

Here, in the phosphor element of the present invention, it is assumed that the excitation light is emitted in a small spot. In such a case, since the energy of the excitation light is locally supplied to a small area, heat concentrates. Therefore, it is preferable to use a material having good heat resistance and thermal conductivity as the sealing material. As a result, as a sealing material, an inorganic compound such as silica or TiO ₂ is more suitable than a resin because it has higher heat resistance and higher thermal conductivity. The encapsulant is selected from materials having translucency for excitation light and fluorescence.

Further, the fluorescent molded body 2 may be an object in which molecules of the fluorescent body 2a are dispersed in a base material having a light-transmitting property. As the base material, for example, glass, silicone, acrylic resin or the like can be used.

Alternatively, the fluorescent molded body 2 may be a single-crystal fluorescent body made of a single crystal of the fluorescent body 2a, or a polycrystalline fluorescent body containing crystallites of a plurality of fluorescent bodies 2a.

(substrate)
As the phosphor element 1A, due to the difference in the light emitting method,
(1) A configuration in which fluorescence is taken out from the facing surface opposite to the excitation light irradiation surface on which the excitation light is irradiated (referred to as “transmission type” in the present application)
(2) A configuration in which fluorescence is extracted from the excitation light irradiation surface on which the excitation light is irradiated (referred to as "reflection type" in the present application).
Can be. Therefore, the substrate 3 is made of a material that transmits light when the phosphor element 1A is a transmissive type. On the other hand, when the phosphor element 1A is a reflection type, the substrate 3 is made of a material that reflects light.

Glass, sapphire, or the like can be used as the light-transmitting substrate made of a light-transmitting material. A material having a high thermal conductivity, such as sapphire, can efficiently dissipate the heat generated in the phosphor 2a by the irradiation of the excitation light and is preferable as the translucent substrate.

On the other hand, as the substrate having light reflectivity, which is made of a material that reflects light, metal, ceramic, or the like can be used. By using metal or ceramic, the heat of the phosphor 2a can be efficiently dissipated. As the metal, it is preferable to use Al or Ag, which has a high light reflectance.

The substrate 3 has the same size as or larger than the fluorescent molded body 2.

In the phosphor element 1A of the present embodiment, when the phosphor element 1A is a transmissive type, the substrate 3 also has a light-transmitting property with respect to the excitation light with which the phosphor element 1A is irradiated.

The phosphor molded body 2 is placed on the substrate 3 as described above to form the phosphor element 1A. The phosphor element 1A of the present embodiment can be manufactured by bonding the separately manufactured phosphor molded body 2 and the substrate 3 to each other using a transparent adhesive. Alternatively, the fluorescent molded body 2 may be molded and produced on the substrate 3, and in this case, the transparent adhesive is not necessary. As the transparent adhesive, for example, organic adhesives such as acrylic and silicone adhesives and inorganic adhesives such as silica, alumina and zirconia can be used.

According to the findings of the inventors of the present application, the color temperature of the light emitted from the phosphor element 1A depends on the thickness of the fluorescent molded body 2 when the fluorescent molded body 2 has a property of transmitting excitation light. And change. Here, the phosphor 2a itself may have a property of transmitting excitation light or may not have a property of transmitting excitation light. Therefore, the fluorescent molded body 2 that transmits the excitation light may be the fluorescent molded body 2 that transmits the excitation light when the fluorescent body 2a is very thin, or the fluorescent molded body 2a itself. The fluorescent molded body 2 that has a property of transmitting the excitation light and can transmit the excitation light regardless of the thickness of the phosphor 2a may be used.

The findings discovered by the inventors of the present application are presumed to be due to the following reasons.

In the fluorescent molded body 2 having translucency for excitation light, the excitation light applied to the fluorescent molded body 2 is absorbed by the fluorescent body 2a included in the fluorescent molded body 2. The strength decreases as it enters the.

As a result, when the fluorescent molded body 2 is thick, the ratio of the excitation light reaching the substrate 3 is smaller than when the fluorescent molded body 2 is thin. This causes a difference in color temperature. The relationship between the thickness of the fluorescent molded body 2 and the translucency with respect to excitation light may change depending on the concentration and type of the fluorescent body 2a included in the fluorescent molded body 2, the type of sealing material, and the like.

On the other hand, when the fluorescent molded body 2 is relatively thin, a part of the excitation light that has entered the fluorescent molded body 2 is absorbed by the fluorescent body 2a, and most of the remaining excitation light passes through the fluorescent molded body 2. Reach the substrate 3. Here, all the light other than the light absorbed by the phosphor 2a does not reach the substrate 3, but strictly speaking, there is light that is reflected and exits at the interface between the phosphor molding 2 and the air.

The excitation light that has reached the substrate 3 is transmitted through the substrate 3 when the substrate 3 has a light transmitting property, and is reflected by the substrate 3 when the substrate 3 has a light reflecting property.

As a result, when the fluorescent molded body 2 is relatively thin, the color temperature of the light emitted by the phosphor element 1A that is locally irradiated with the excitation light is the color temperature of the light obtained by mixing the excitation light and the fluorescence emitted by the phosphor 2a. It becomes the color temperature.

The light emitted by the phosphor element 1A is emitted from the substrate 3 side of the phosphor element 1A when the substrate 3 has a light transmitting property, and the light is emitted when the substrate 3 has a light reflecting property. The light is emitted from the fluorescent molded body 2 side of the element 1A.

Here, the ratio of the light absorbed by the phosphor 2 a and the light reaching the substrate 3 of the excitation light that has entered the fluorescent molded body 2 depends on the thickness of the fluorescent molded body 2. That is, when the thickness of the fluorescent molded body 2 is large, the proportion of the excitation light reaching the substrate 3 is smaller than when the thickness of the fluorescent molded body 2 is thin. Further, the ratio of the excitation light absorbed by the phosphor 2a to the excitation light that has entered the fluorescent molded body 2 is large.

Therefore, the ratio of the fluorescence emitted by the phosphor 2a in the light emitted by the phosphor element 1A is high, and the color temperature of the light emitted by the phosphor element 1A approaches the color temperature of the fluorescence of the phosphor 2a. The color temperature of fluorescence of the phosphor 2a is determined by the substance forming the phosphor 2a.

On the other hand, when the thickness of the fluorescent molded body 2 is thin, the proportion of the excitation light reaching the substrate 3 is larger than that in the case where the thickness is large, and the proportion of the excitation light absorbed by the phosphor 2a is larger. Less. Therefore, the proportion of the excitation light in the light emitted by the phosphor element 1A is large. For example, when the blue excitation light and the phosphor 2a that emits yellow fluorescence are used, the light emitted from the phosphor element 1A is a mixture of blue light and yellow light. At this time, when the thickness of the fluorescent molded body 2 is thin, the ratio of the optical component of the blue excitation light becomes large. Therefore, the color temperature of the light emitted from the phosphor element 1A approaches blue, and as a result, the color temperature increases. Therefore, as the thickness of the fluorescent molded body 2 becomes thinner, the color temperature of the light emitted from the phosphor element 1A approaches blue, and the color temperature becomes higher.

In this way, the color temperature of the light emitted from the phosphor element 1A may change depending on the thickness of the phosphor molded body 2.

According to the above knowledge, the following problems may occur when the shape of the fluorescent molded body 2 in the phosphor element 1A of the present embodiment is, for example, a flat plate.

That is, when the surface of the fluorescent molded body 2 is substantially flat and the thickness of the fluorescent molded body 2 does not change on the substrate 3, the color temperature of the light emitted by the fluorescent element 1A is different from that of the type of the fluorescent body 2a. , And the thickness of the fluorescent molded body 2 and fixed.

Therefore, for example, when the manufactured phosphor element 1A is irradiated with excitation light and the color temperature of the light emitted by the phosphor element 1A is different from the color temperature of the desired light, the color temperature is immediately changed. There is no means to adjust. Therefore, in order to obtain a desired color temperature of light, it is necessary to discard the phosphor element 1A and remake it. This can reduce yield and increase manufacturing costs.

Therefore, phosphor element 1A in the present embodiment can change the color temperature of light emitted from phosphor element 1A because phosphor molded body 2 included in phosphor element 1A has the following features. It is like this.

(Shape of Fluorescent Molded Body and Luminous Properties of Phosphor Element)
The shape of the phosphor element 1A and the emission characteristics of the phosphor element 1A of the present embodiment will be described based on FIGS. 1(a) and (b) to FIG. 3(a) and (b). FIG. 2 shows the thickness of the fluorescent molded body 2 at the excitation light irradiation portion and the light emitted by the phosphor element 1A when the excitation light of the rated output is locally irradiated in the phosphor element 1A of the present embodiment. 5 is a graph showing the relationship with the color temperature of. FIG. 3A is a side sectional view illustrating the optical path of the excitation light with which the transmissive phosphor element 1A is irradiated. FIG. 3B is a side sectional view illustrating the optical path of the excitation light with which the reflective phosphor element 1A is irradiated.

As shown in FIGS. 1A and 1B, the fluorescent molded body 2 provided in the phosphor element 1A of the present embodiment is irradiated with the excitation light and the substrate contact surface 4 that contacts the substrate 3. And an excitation light irradiation surface 5.

Here, the phosphor element 1A is irradiated with excitation light having a comparatively narrow irradiation area such as light condensed by a lens or laser to locally excite the phosphor 2a contained in the fluorescent molded body 2. Think about the case. Hereinafter, a portion of the fluorescent molded body 2 where the excitation light is locally irradiated is referred to as an excitation light irradiation portion.

The excitation light irradiation surface 5 is inclined at an acute angle with respect to the substrate contact surface 4. That is, the thickness of the fluorescent molded body 2 increases in order as it goes from one end to the other end when the fluorescent molded body 2 is viewed in a plan view. That is, the excitation light irradiation surface 5 is inclined.

Since the excitation light irradiation surface 5 is inclined, the thickness of the fluorescent molded body 2 continuously changes in the direction from one end to the other end of the substrate contact surface 4 when viewed from the side surface of the phosphor element 1A. .. In other words, on the substrate 3, there are a thick portion 2b having a large thickness and a thin portion 2c having a thin thickness of the fluorescent molded body 2.

In the thick portion 2b, as described above, most of the excitation light with which the phosphor element 1A is irradiated is absorbed by the phosphor 2a and converted into fluorescence and heat energy. Therefore, in the thick portion 2b, the phosphor element 1A emits light having a color temperature close to the fluorescence of the phosphor 2a. The color temperature of fluorescence of the phosphor 2a is determined by the substance forming the phosphor 2a.

On the other hand, in the thin portion 2c, of the excitation light emitted to the phosphor element 1A, part of the excitation light that has penetrated into the fluorescent molded body 2 is absorbed by the phosphor 2a, and some of the remaining excitation light comes into contact with the substrate. Reach surface 4. Here, since the substrate 3 is made of a material that transmits or reflects excitation light and fluorescence, the light that reaches the substrate contact surface 4 either passes through the substrate 3 or is reflected by the substrate 3. Therefore, in either the transmissive type or the reflective type phosphor element 1A, the thin portion 2c emits light in which the excitation light and the fluorescence emitted from the phosphor 2a are mixed.

Therefore, in the phosphor element 1A of the present embodiment, by changing the position of the excitation light irradiation portion, the light emitted by the phosphor element 1A is caused by the thickness of the fluorescent molded body 2 at the excitation light irradiation portion. The color temperature can be changed.

For example, when the reflection type phosphor element 1A including YAG as the phosphor 2a is locally irradiated with excitation light having a wavelength of 445 nm at a rated output of 2 W, the phosphor element 1A emits light as shown in FIG. The color temperature of the emitted light changes depending on the thickness of the fluorescent molded body 2 at the excitation light irradiation site.

Here, as the thickness of the fluorescent molded body 2 becomes thinner, the color temperature of the light emitted by the fluorescent molded body 2 becomes closer to the color temperature of the excitation light, and as the thickness of the fluorescent molded body 2 becomes thicker, the fluorescent light emitted by the fluorescent body 2a becomes fluorescent. It is confirmed that the color temperature converges to the color temperature of.

This results in the same result regardless of whether the phosphor element 1A is a reflection type or a transmission type. However, when the phosphor element 1A is a reflection type or a transmission type, The relationship between the thickness and the color temperature of the light emitted from the phosphor element 1A differs as follows.

As shown in FIGS. 3A and 3B, the phosphor element 1A is different in the optical path length of the excitation light in the fluorescent molded body 2 in the case of the transmissive type or the reflective type. As shown in FIG. 3A, when the thickness of the fluorescent molded body 2 at the excitation light irradiation location is X, the optical path length of the excitation light in the fluorescent molded body 2 in the transmissive phosphor element 1A is about. It is X. On the other hand, as shown in FIG. 3B, in the reflective phosphor element 1A, the optical path length of the excitation light in the phosphor element 2 is about 2X.

As described above, in the reflective type, the optical path length is about twice as long as in the transmissive type. Therefore, the correspondence of the color temperature of the light emitted from the phosphor element 1A to the thickness of the fluorescent molded body 2 is different.

That is, in the reflective and transmissive phosphor elements 1A, the relationship of the color temperature of the light emitted by the phosphor element 1A with respect to the thickness of the phosphor molded body 2 at the excitation light irradiation location is greater in the reflective type than in the transmissive type. However, the influence of the thickness of the fluorescent molded body 2 is large.

(Effect of phosphor element)
1 A of fluorescent substance elements of this Embodiment can emit light of different color temperature by changing the excitation light irradiation location as mentioned above. Therefore, with only one phosphor element 1A, the user can select a favorite color within the range of the color temperature at which the phosphor element 1A can emit light. Further, when the phosphor molded body 2 is uneven in thickness during the production and mass production of the phosphor element 1A and the color temperature of the light emitted by the phosphor element 1A is different from the desired one, the excitation light irradiation location is changed. A desired color temperature can be obtained by adjusting.

When the phosphor element 1A emits pseudo white light, the tint of pseudo white can be changed. For example, it can be bluish or yellowish.

<Method of manufacturing phosphor element>
The following will describe the method of manufacturing the phosphor element 1A of the present embodiment with reference to FIGS. 4(a), 4(b) and 4(c). 4A, 4B, and 4C are side cross-sectional views illustrating an example of a method for manufacturing phosphor element 1A according to the present embodiment.

In the method for manufacturing the phosphor element 1A according to the present embodiment, as shown in FIG. 4A, first, the spacer 11 is placed on the support base 10, and the spacer 11 has a uniform thickness. The substrate 3 as a supporting member is placed. As a result, one end of the plane of the substrate 3 is raised and the substrate 3 is placed on the support base 10 via the spacer 11 in a state where the substrate 3 is inclined (support member placing step).

Next, the jig 12 as a frame plate having a thickness in consideration of the thickness of the fluorescent molded body 2 is placed around the substrate 3 in advance (frame plate placing step). Further, it is preferable to place a thin plate-shaped mask 16 on the jig 12. The mask 16 is adapted to slightly protrude toward the substrate 3 inside the jig 12. The mask 16 may not be placed.

Next, as shown in FIG. 4B, the phosphor paste 13 is placed on the mask 16 on the jig 12 placed on the side where the substrate 3 is lifted by the spacer 11. The phosphor paste 13 contains a phosphor 2a. The place where the phosphor paste 13 is placed is not limited to the above.

Then, the phosphor paste 13 is printed using, for example, a spatula 14 to form the phosphor molded body 2 as a phosphor member on the substrate 3 (fluorescent member applying step). Here, printing with the spatula 14 means, for example, leveling the surface with the spatula 14 at the surface height of the mask 16. Here, when the mask 16 is placed, it is possible to prevent the spatula 14 from being caught by the substrate 3 or the jig 12 during printing. Therefore, it is possible to reduce the possibility of unevenness in the fluorescent molded body 2 and to stably manufacture the fluorescent molded body 2.

After that, as shown in FIG. 4C, the jig 12 and the mask 16 around the substrate 3 are removed, and the phosphor element 1A including the substrate 3 and the fluorescent molded body 2 is taken out from the support 10.

As a result, it is possible to manufacture the phosphor element 1A including the substrate 3 and the fluorescent molded body 2 containing the phosphor 2a and laminated on the substrate 3. The fluorescent molded body 2 is formed so as to have a thickness that sequentially increases from one end to the other end when viewed in a plan view.

Furthermore, if necessary, the fluorescent molded body 2 may be coated with, for example, SiO ₂ to form a protective film layer (protective film forming step).

By using the phosphor element 1A manufactured as described above, the excitation light source for irradiating the excitation light or the phosphor element 1A is moved, and the excitation light irradiation position is changed, so that one phosphor element 1A is used. The color temperature of the light emitted by 1A can be changed.

For example, when the wavelength of the excitation light is 445 nm, the maximum thickness of the fluorescent molded body 2 containing YAG as the fluorescent body 2a is 30 μm, and the minimum thickness is 10 μm, the excitation light irradiation location is from the thick portion 2b to the thin portion 2c. When moved to, the color temperature of the light emitted by the phosphor element 1A changes from 4900K to 6500K.

As described above, the phosphor element 1A of the present embodiment includes the substrate 3 and the fluorescent molded body 2 containing the phosphor 2a and laminated on the substrate 3. The fluorescent molded body 2 has a thickness that gradually increases from one end to the other end when viewed in plan.

According to the above configuration, when the excitation light is locally irradiated, the thickness of the fluorescent molded body 2 at the excitation light irradiation position is changed by changing the excitation light irradiation position. As a result, the color temperature of the light emitted from the phosphor element 1A changes. As a result, the phosphor element 1A can emit light of different color temperatures by changing the excitation light irradiation location.

Therefore, it is possible to provide a phosphor element capable of emitting light of plural kinds of color temperatures by itself.

Further, in the present embodiment, the irradiation location on the phosphor element 1A in the excitation light emitted from the light source to the phosphor element 1A can be changed, and the color temperature of light emission is controlled based on the irradiation location. ..

Thereby, for example, instead of moving the phosphor element 1A with the light source fixed, it is possible to change the irradiation location of the excitation light from the light source with the phosphor element 1A fixed.

Therefore, the light emitting device can be provided with convenience.

The method for manufacturing the phosphor element 1A of the present embodiment is a method for manufacturing the phosphor element 1A including the substrate 3 and the fluorescent molded body 2 containing the phosphor 2a and laminated on the substrate 3. .. The fluorescent molded body 2 is formed so as to have a thickness that gradually increases from one end to the other end in a plan view.

In the phosphor element 1A formed by the above-described method for manufacturing the phosphor element 1A, the thickness of the phosphor molded body 2 gradually increases as it goes from one end to the other end when the phosphor molded body 2 is viewed in a plan view. There is. Therefore, the thickness of the fluorescent molded body 2 at the excitation light irradiation position changes by changing the excitation light irradiation position. As a result, the color temperature of the light emitted from the phosphor element 1A changes. Therefore, the phosphor element 1A can emit light of different color temperatures by changing the excitation light irradiation location.

Therefore, it is possible to provide a method of manufacturing the phosphor element 1A capable of emitting light of plural kinds of color temperatures by itself.

[Modification]
A modified example of the method for manufacturing the phosphor element 1A of the present embodiment will be described below with reference to (a), (b) and (c) of FIG. For convenience of explanation, members having the same functions as those shown in the drawings of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted. 5A, 5B, and 5C are side cross-sectional views illustrating a modified example of the method for manufacturing phosphor element 1A according to the present embodiment.

In this modification, the tilted substrate 15 as a support member having a tilted surface, that is, the tilted substrate 15 that becomes thicker from one end to the other end in plan view is used.

In the method of manufacturing the phosphor element 1A according to the present modification, as shown in FIG. 5A, first, the tilted substrate 15 is mounted on the support base 10 (support member mounting step). Next, the jig 12 as a frame plate having a thickness considering the thickness of the fluorescent molded body 2 in advance is placed around the inclined substrate 15 (frame plate placing step). Further, it is preferable to place a thin plate-shaped mask 16 on the jig 12. The mask 16 is designed to slightly protrude in the direction of the substrate 3 inside the jig 12. The mask 16 may not be placed.

Next, as shown in FIG. 5B, the phosphor paste 13 is placed on the mask 16. The phosphor paste 13 is printed using, for example, a spatula 14 to form the phosphor molding 2 as a phosphor member on the substrate 3 (phosphor member applying step). When the mask 16 is placed, it is possible to prevent the spatula 14 from being caught by the substrate 3 or the jig 12 during printing. Therefore, it is possible to reduce the possibility of unevenness in the fluorescent molded body 2 and to stably manufacture the fluorescent molded body 2.

After that, as shown in FIG. 5C, the jig 12 and the mask 16 around the tilted substrate 15 are removed, and the phosphor element 1A including the tilted substrate 15 and the fluorescent molded body 2 is taken out from the support 10.

As a result, the phosphor element 1A including the tilted substrate 15 and the fluorescent molded body 2 containing the phosphor 2a and laminated on the tilted substrate 15 can be manufactured. The fluorescent molded body 2 is formed so as to have a thickness that gradually increases from one end toward the other end in a plane.

Furthermore, if necessary, the fluorescent molded body 2 may be coated with, for example, SiO ₂ to form a protective film layer (protective film forming step).

By using the phosphor element 1A manufactured as described above, the excitation light source for irradiating the excitation light or the phosphor element 1A is moved, and the excitation light irradiation position is changed, so that one phosphor element 1A is used. The color temperature of the light emitted by 1A can be changed.

For example, when the wavelength of the excitation light is 445 nm and the maximum thickness of the fluorescent molded body 2 containing YAG as the fluorescent body 2a is 50 μm and the minimum thickness is 20 μm, the excitation light irradiation location is changed from the thick portion 2b to the thin portion 2c. When moved to, the color temperature of the light emitted by the phosphor element 1A changes from 3800K to 5300K.

As described above, the method of manufacturing the phosphor element 1A according to the modified example of the present embodiment is provided with the phosphor substrate including the inclined substrate 15 and the fluorescent molded body 2 containing the phosphor 2a and laminated on the inclined substrate 15. It is a manufacturing method of 1A. The fluorescent molded body 2 is formed so as to have a thickness that increases in order from one end to the other end in a plane.

In the phosphor element 1A formed by the above-described method for manufacturing the phosphor element 1A, the thickness of the phosphor molded body 2 gradually increases as it goes from one end to the other end when the phosphor molded body 2 is viewed in a plan view. There is. Therefore, the thickness of the fluorescent molded body 2 at the excitation light irradiation position changes by changing the excitation light irradiation position. As a result, the color temperature of the light emitted from the phosphor element 1A changes. Therefore, the phosphor element 1A can emit light of different color temperatures by changing the excitation light irradiation location.

This eliminates the need for using the spacer 11, so that it is possible to reduce the number of manufacturing steps.

[Embodiment 2]
Another embodiment of the present invention will be described below with reference to FIG. The configuration other than that described in the present embodiment is the same as that in the first embodiment. Further, for convenience of description, members having the same functions as the members shown in the drawings of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

In the phosphor element 1A of Embodiment 1, the excitation light irradiation surface 5 of the phosphor molding body 2 is inclined at an acute angle with respect to the substrate contact surface 4, and when the phosphor molding body 2 is viewed in plan view. The thickness of the fluorescent molded body 2 was gradually increased from one end to the other end. On the other hand, in the phosphor element 1B of the present embodiment, the excitation light irradiation surface 5 is a convex curved surface, and the phosphor molding body 2 faces from the end to the center when viewed in plan. The difference is that the thickness of the fluorescent molded body 2 increases in order from the center to the end.

<Phosphor element>
First, FIG. 6A shows the configuration of the phosphor element 1B in which the thickness of the fluorescent molded body 2 increases in order from the end portion toward the center when the fluorescent molded body 2 is viewed in plan view. It will be explained based on. FIG. 6A is a side sectional view showing a schematic configuration of the phosphor element 1B according to the second embodiment of the present invention.

As shown in FIG. 6, the phosphor element 1B of the present embodiment is provided with a phosphor molding 22 having an excitation light irradiation surface 5 which is a convex curved surface on the outside.

The excitation light irradiation surface 5 of the fluorescent molded body 22 is a convex gentle curved surface, and the thickness of the fluorescent molded body 22 decreases as the fluorescent molded body 22 moves from the end to the center when viewed in plan. It is getting thicker in order.

Therefore, the thickness of the fluorescent molded body 22 at the exciting light irradiation location differs depending on whether the exciting light irradiation location is the central portion of the fluorescent molded body 22 or near the peripheral edge of the fluorescent molded body 22.

As a result, the color temperature of the light emitted by the phosphor element 1B differs depending on the excitation light irradiation location. Specifically, in the central portion of the fluorescent molded body 22, since the thickness of the fluorescent molded body 22 is large, the color temperature of the light emitted by the phosphor element 1B becomes low, and in the vicinity of the peripheral edge of the fluorescent molded body 22, Since the fluorescent molded body 22 is thin, the color temperature of the light emitted by the phosphor element 1B is high.

Here, in the phosphor element 1A of the first embodiment, the phosphor element 1A emits light because the thickness gradually increases from one end to the other end of the phosphor molded body 2 when viewed in plan view. The change in the color temperature of light is related to the direction in which the excitation light irradiation location is moved. That is, in order to change the thickness of the fluorescent molded body 2 when the excited light irradiated portion is moved, it is necessary to move the excited light irradiated portion in the tilt direction of the fluorescent molded body 2.

On the other hand, in the phosphor element 1B of the present embodiment, the thickness increases from the peripheral portion to the center of the fluorescent molded body 22, and if the excitation light irradiation portion is moved, regardless of the moving direction, The thickness of the phosphor molded body 22 changes, and the color temperature of the light emitted from the phosphor element 1B can be changed accordingly. Therefore, in the phosphor element 1B, the change in the color temperature of the light emitted by the phosphor element 1B does not relate to the direction in which the excitation light irradiation portion is moved.

<Method of manufacturing phosphor element>
The following will describe the method for manufacturing the phosphor element 1B of the present embodiment with reference to FIG. 6(b). FIG. 6B is a side sectional view illustrating an example of a method for manufacturing the phosphor element 1B.

In the method for manufacturing the phosphor element 1B according to the present embodiment, as shown in FIG. 6B, first, the liquid metering device 23 is used to apply the phosphor paste 13 as a paste material to the center of the substrate 3. Discharge. Here, the phosphor paste 13 has a high viscosity to such an extent that the phosphor paste 13 after ejection has a rounded droplet shape or a surface opposite to the substrate 3 has a convex shape. preferable.

Then, the phosphor molded body 22 can be molded on the substrate 3 by drying or baking the phosphor paste 13.

As a result, the phosphor element 1B including the substrate 3 and the fluorescent molded body 22 containing the phosphor 2a and laminated on the substrate 3 can be manufactured. The fluorescent molded body 22 is formed to have a thickness that gradually increases from the peripheral portion to the center.

According to this method, the phosphor element 1B can be easily manufactured with a small number of processes.

Using the phosphor element 1B manufactured as described above, the excitation light source for irradiating the excitation light or the phosphor element 1B is moved, and the excitation light irradiation position is changed, whereby one phosphor element 1B is used for the phosphor element. The color temperature of the light emitted by 1B can be changed.

For example, if the wavelength of the excitation light is 445 nm, and the phosphor molded body 22 containing BOS((Ba,Sr) ₂ SiO ₄ :Eu) as the phosphor 2a has a maximum thickness of 100 μm and a minimum thickness of 40 μm, When the excitation light irradiation location is moved from the thick portion 2b to the thin portion 2c, the color temperature of the light emitted by the phosphor element 1B changes from 3500K to 4200K.

As described above, the phosphor element 1B of the present embodiment includes the substrate 3 and the fluorescent molded body 22 containing the phosphor 2a and laminated on the substrate 3. The fluorescent molded body 22 has a thickness that gradually increases from the end portion toward the center in a plan view.

According to the above configuration, by changing the position irradiated with the excitation light, the thickness of the fluorescent molded body 2 changes regardless of the direction in which the position changes, and the light emitted by the phosphor element 1B is changed accordingly. The color temperature can be changed.

The method for manufacturing the phosphor element 1B according to the present embodiment is a method for manufacturing the phosphor element 1B including the substrate 3 and the fluorescent molded body 22 containing the phosphor 2a and laminated on the substrate 3. .. The fluorescent molded body 22 is formed to have a thickness that gradually increases from the end portion toward the center when seen in a plan view.

In the phosphor element 1B formed by the method for manufacturing the phosphor element 1B described above, the thickness of the phosphor molded body 22 increases in order as the phosphor molded body 22 moves from the end to the center when viewed in plan. There is. Therefore, by changing the excitation light irradiation position, the thickness of the fluorescent molded body 22 changes regardless of the changing direction of the position. Thereby, the color temperature of the light emitted by the phosphor element 1B can be changed. Therefore, the phosphor element 1B can emit light of different color temperatures by changing the excitation light irradiation location.

Further, when the phosphor element 1B is manufactured, the phosphor paste 13 of the phosphor molding 22 is simply discharged onto the center of the substrate 3.

As a result, it is possible to easily manufacture the phosphor element 1</b>B in which the thickness of the fluorescent molded body 22 increases in order from the end portion toward the center when the fluorescent molded body 22 is viewed from above.

[Modification 1]
Modification 1 of phosphor element 1B of the present embodiment will be described below with reference to FIG. 7. For convenience of explanation, members having the same functions as those shown in the drawings of the second embodiment are designated by the same reference numerals, and the description thereof will be omitted. FIG. 7 is a side sectional view showing a configuration of a modified example of phosphor element 1B of the present embodiment.

In the present modified example, the excitation light irradiation surface 5 of the fluorescent molded body 32 is a concave curved surface, and the fluorescent molded body 32 moves from the center toward the end when the fluorescent molded body 32 is viewed in plan. The thickness of 32 is gradually increased.

As shown in FIG. 7, the phosphor element 1B of this modification includes a substrate 3 and a phosphor molding 32 having an excitation light irradiation surface 5 that is a concave curved surface on the outside.

The excitation light irradiation surface 5 of the fluorescent molded body 32 has a concave gentle curved surface, and the thickness of the fluorescent molded body 32 increases from the center to the end when the fluorescent molded body 32 is viewed in plan. It is getting thicker in order. That is, as the fluorescent molded body 32 is viewed from above, the thickness of the fluorescent molded body 32 decreases in order from the end toward the center.

Therefore, the thickness of the fluorescent molded body 32 at the exciting light irradiation portion differs depending on whether the exciting light irradiation portion is located at the central portion of the fluorescent molded body 32 or near the peripheral portion of the fluorescent molded body 32.

As a result, the color temperature of the light emitted from the phosphor element 1B differs depending on the excitation light irradiation location. Specifically, in the central portion of the fluorescent molded body 32, since the thickness of the fluorescent molded body 32 is thin, the color temperature of the light emitted by the phosphor element 1B becomes high, and in the vicinity of the peripheral portion of the fluorescent molded body 32, Since the thickness of the fluorescent molded body 32 is large, the color temperature of the light emitted by the fluorescent element 1B is low.

Therefore, if the excitation light irradiation portion is moved, the thickness of the fluorescent molded body 32 changes regardless of the moving direction, and accordingly, the color temperature of the light emitted by the phosphor element 1B can be changed. Therefore, in the phosphor element 1B, the change in the color temperature of the light emitted by the phosphor element 1B does not relate to the direction in which the excitation light irradiation portion is moved.

The phosphor element 1B of the present modification may have a structure in which a fluorescent molded body 32 formed by processing a single crystal phosphor and a metal film as a supporting member are formed on the surface thereof. The configuration in which the metal film as the supporting member is formed on the surface of the fluorescent molded body 32 will be described later in detail in the third embodiment.

As described above, the phosphor element 1B of the present modified example includes the substrate 3 and the fluorescent molded body 32 containing the phosphor 2a and laminated on the substrate 3. The fluorescent molded body 32 has a thickness that gradually increases from the center toward the end portion in a plan view.

According to the above configuration, by changing the position irradiated by the excitation light, the thickness of the fluorescent molded body 32 changes regardless of the direction in which the position changes, and the light emitted by the phosphor element 1B is changed accordingly. The color temperature can be changed.

[Modification 2]
Modification 2 of phosphor element 1B of the present embodiment will be described below with reference to FIGS. 8A, 8B, and 8C. For convenience of explanation, members having the same functions as those shown in the drawings of the second embodiment are designated by the same reference numerals, and the description thereof will be omitted. 8A, 8B, and 8C are side cross-sectional views illustrating the method for manufacturing the phosphor element 1B of this modification.

In the phosphor element 1</b>B of the present modified example, as in the case of the first modified example, the excitation light irradiation surface 5 of the fluorescent molded body 32 is a concave gentle curved surface, and the fluorescent molded body 32 when viewed in plan The thickness of the fluorescent molded body 32 increases in order from the center toward the end. However, the difference is that the shape of the substrate 33 provided on the back surface of the fluorescent molded body 32 is a gentle convex curved surface.

The phosphor element 1B of this modification can be manufactured as follows.

In the method for manufacturing the phosphor element 1B of this modification, as shown in FIG. 8A, first, a thickness considering the thickness of the phosphor molding 2 in advance is provided around the convex ridge of the substrate 33. The jig 12 is mounted as a frame plate that the user has (frame plate mounting step).

Next, as shown in FIG. 8B, the phosphor paste 13 is placed on the jig 12. The phosphor paste 13 is printed using, for example, a spatula 14 to form a phosphor molded body 32 as a phosphor member on the substrate 33 (phosphor member applying step).

After that, as shown in FIG. 8C, the jig 12 around the convex ridge of the substrate 33 is removed to obtain a phosphor element 1B including the substrate 33 and the fluorescent molded body 32.

As a result, the phosphor element 1B including the substrate 33 and the fluorescent molded body 32 containing the phosphor 2a and laminated on the substrate 33 can be manufactured. The fluorescent molded body 32 is formed such that the thickness of the fluorescent molded body 32 increases in order from the center toward the end when the fluorescent molded body 32 is viewed in a plan view.

Using the phosphor element 1B manufactured as described above, the excitation light source for irradiating the excitation light or the phosphor element 1B is moved, and the excitation light irradiation position is changed, whereby one phosphor element 1B is used for the phosphor element. The color temperature of the light emitted by 1B can be changed.

As described above, the phosphor element 1B of the present modified example is a phosphor including the substrate 33 having convex ridges formed on the surface thereof, and the phosphor molded body 32 containing the phosphor 2a and laminated on the substrate 33. It is the body element 1B. The fluorescent molded body 32 is formed so as to have a thickness that increases in order from the center toward the end when viewed in plan.

In the phosphor element 1B formed by the method for manufacturing the phosphor element 1B described above, the thickness of the phosphor molded body 32 increases in order from the center to the end when the phosphor molded body 32 is viewed in plan. There is. Therefore, by changing the excitation light irradiation position, the thickness of the fluorescent molded body 32 changes regardless of the changing direction of the position. Thereby, the color temperature of the light emitted by the phosphor element 1B can be changed. Therefore, the phosphor element 1B can emit light of different color temperatures by changing the excitation light irradiation location.

[Embodiment 3]
Another embodiment of the present invention will be described below with reference to FIGS. 9 and 10. The configuration other than that described in the present embodiment is the same as in the first and second embodiments. Further, for convenience of explanation, members having the same functions as those shown in the drawings of the first and second embodiments are designated by the same reference numerals, and the description thereof will be omitted.

In the phosphor elements 1A and 1B of the first and second embodiments, the fluorescent molded bodies 2 and 22 as the fluorescent member are formed on the substrate 3 and 33 as the supporting member. In contrast, phosphor element 1C of the present embodiment is different in that metal film 41 as a supporting member is formed on the back surface of single crystal phosphor 40 as a fluorescent member.

<Phosphor element>
The configuration of phosphor element 1C of the present embodiment will be described with reference to FIG. FIG. 9 is a side sectional view showing a schematic configuration of phosphor element 1C in the present embodiment.

As shown in FIG. 9, phosphor element 1C of the present embodiment includes single crystal phosphor 40 and metal film 41 formed on the back surface of single crystal phosphor 40.

The single crystal phosphor 40 is composed only of a phosphor that emits fluorescence upon irradiation with excitation light. That is, the single crystal phosphor 40 does not contain resin or glass.

Since the single crystal phosphor 40 does not include grain boundaries such as voids inside, the single crystal phosphor 40 has improved thermal conductivity. Therefore, the heat generated in the single crystal phosphor 40 by the irradiation of the excitation light can be efficiently dissipated. This lowers the temperature of the single crystal phosphor 40 and improves the output efficiency of the phosphor element 1C. Therefore, the intensity of the light emitted by the single crystal phosphor 40 when irradiated with the excitation light can be improved.

The single crystal phosphor 40 has translucency. That is, when the single-crystal phosphor 40 is irradiated with the excitation light, the excitation light is absorbed by the single-crystal phosphor 40 and its intensity is attenuated. However, when the single-crystal phosphor 40 is thin, a part of the excitation light is emitted. Can pass through the single crystal phosphor 40.

The single crystal phosphor 40 has the excitation light irradiation surface 5 and the surface on which the metal film 41 is formed. The excitation light irradiation surface 5 is inclined at an acute angle with respect to the surface on which the metal film 41 is formed. That is, as the single crystal phosphor 40 is viewed from above, the thickness of the single crystal phosphor 40 sequentially increases from one end to the other end.

Since the metal film 41 is formed on the back surface of the single crystal phosphor 40, the excitation light and the fluorescence transmitted through the single crystal phosphor 40 are reflected by the metal film 41.

Therefore, in the phosphor element 1C of the present embodiment, by changing the position of the excitation light irradiation portion, the phosphor element 1C emits light due to the change in the thickness of the single crystal phosphor 40 at the excitation light irradiation portion. The color temperature of the emitted light can be changed.

<Method of manufacturing phosphor element>
The manufacturing method of phosphor element 1C of the present embodiment will be described below with reference to FIG. 10(a), (b), (c), and (d) are side cross-sectional views illustrating an example of a method for manufacturing phosphor element 1C of the present embodiment.

As shown in (a) of FIG. 10, the manufacturing method of the phosphor element 1C of the present embodiment is as follows: First, single-crystal fluorescence having a thickness that gradually increases from one end to the other end in plan view. The body 40 is produced (fluorescent member forming step).

Then, as shown in FIG. 10B, the single crystal phosphor 40 is placed on the support 10, and as shown in FIG. 10C, a metal is sputtered on the surface of the single crystal phosphor 40 or The metal film 41 is formed by vapor deposition (support member forming step). Next, as shown in FIG. 10D, the phosphor element 1C is removed from the support 10 and inverted, whereby the phosphor element 1C can be obtained. Here, in the single crystal phosphor 40 on which the metal film 41 is formed, the surface in contact with the support 10 becomes the excitation light irradiation surface 5.

By using the phosphor element 1C manufactured as described above, by moving the excitation light source or the phosphor element 1C for irradiating the excitation light, the color of the light emitted by the phosphor element 1C by one phosphor element 1C You can change the temperature.

Further, the metal film 41 can be easily formed by sputtering or vapor depositing a metal.

Furthermore, since the metal film 41 as the support member is formed by sputtering or vapor depositing a metal, it is possible to form a support film having high reflection performance.

In the above description, the phosphor element 1C of the present embodiment has described that the single crystal phosphor 40 is used as the fluorescent member. Since the single crystal phosphor 40 does not include grain boundaries such as voids inside, it is possible to improve the thermal conductivity.

However, the present embodiment is not limited to the single crystal phosphor 40, that is, the void is not completely 0, and the void may be a small void phosphor having an internal void.

This small void phosphor specifically includes a polycrystalline phosphor or a phosphor in which voids are formed by processing. Here, the void means a gap between crystals in the phosphor plate (in other words, a grain boundary), and includes one that can be unintentionally formed. As an example, the voids are voids or cracks in which only air is present. However, some kind of foreign matter (eg, alumina, which is a raw material for the phosphor plate, etc.) may enter the inside of the void. Here, the width of the polycrystal phosphor or the phosphor having a gap formed therein by processing is, for example, 0≦gap width≦40 nm.

The above-mentioned “gap width” means the maximum value of the distance between adjacent crystals (crystal grains) in the phosphor plate.

The length of the gap width of 40 nm is about one-tenth or less of the wavelength of excitation light (for blue light: 420 to 490 nm) and the wavelength of fluorescence (longer than excitation light). ..

As a result of the study by the inventors of the present application, in the small void phosphor, when the void width is 40 nm or less, the scattering (internal scattering) effect on the laser light and the fluorescence does not occur at all or is very unlikely to occur. confirmed.

The results of the above studies are in agreement with the general view that when the scatterer is irradiated with light and the size of the scatterer is about 1/10 or less of the light, Mie scattering does not occur. As described above, in the small-gap phosphor, the above scattering effect does not occur at all or very hardly occurs.

As described above, when the void width is completely 0 as in the single crystal phosphor 40 and when 0≦void width≦40 nm as in the small void phosphor, light passage is not significantly affected. .. Therefore, by using the small void phosphor as the fluorescent member, the thermal conductivity is improved in the same manner as the single crystal phosphor 40.

In order to measure the above-mentioned void width, after cutting out the cross section of the phosphor plate, measurement with an optical microscope, SEM (Scanning Electron Microscope: scanning electron microscope), TEM (Transmission Electron Microscope: transmission electron microscope), or the like An observation image of the cross section may be obtained with a device. The void width can be measured by analyzing the observed image.

[Modification]
A modified example of the present embodiment will be described below with reference to FIG. For convenience of explanation, members having the same functions as those shown in the drawings of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 11 is a side sectional view showing a schematic configuration of a modification of phosphor element 1C of the present embodiment.

In the present modification, the single crystal phosphor 40 has a thickness that becomes thicker from one end to the other end in a plan view, and then the thickness decreases.

As shown in FIG. 11, the phosphor element 1C of the present modification has a planar excitation light irradiation surface 5 and a first metal film formation surface 42a that is inclined at an acute angle with respect to the excitation light irradiation surface 5, It has a second metal film formation surface 42b that is inclined at an acute angle with respect to the excitation light irradiation surface 5.

With this configuration, in the phosphor element 1C of the present embodiment, by changing the position of the excitation light irradiation portion, the phosphor element 1C is changed due to the change in the thickness of the single crystal phosphor 40 at the excitation light irradiation portion. The color temperature of the light emitted by can be changed. For example, when the film thickness of the single crystal phosphor 40 made of YAG is, for example, 5 μm to 200 μm, when the single crystal phosphor 40 is irradiated with excitation light having a wavelength of 445 nm from a point light source, the change in the thickness of the single crystal phosphor 40 is caused. Accordingly, the color temperature changes, for example, from 7700K to 3200K.

Further, the fluorescence emitted from the excitation light irradiation portion is reflected by the first metal film formation surface 42a and the second metal film formation surface 42b and emitted from the excitation light irradiation surface 5. Thereby, the fluorescence can be efficiently extracted from the phosphor element 1C.

[Embodiment 4]
Another embodiment of the present invention will be described below with reference to FIGS. 12 and 13. The configuration other than that described in the present embodiment is the same as in the first to third embodiments. Further, for convenience of explanation, members having the same functions as the members shown in the drawings of the first to third embodiments are designated by the same reference numerals, and the description thereof will be omitted.

In the phosphor elements 1A to 1C of the first to third embodiments, the thickness of the fluorescent molded body 2 continuously changes from one end to the other end when viewed in a plan view. On the other hand, the phosphor element 1D of the present embodiment is different in that the thickness of the phosphor molded body 50 is changed stepwise from one end to the other end when seen in a plan view. ..

<Phosphor element>
The configuration of phosphor element 1D of the present embodiment will be described based on FIG. FIG. 12 is a side sectional view showing a schematic configuration of phosphor element 1D in the present embodiment.

As shown in FIG. 12, the phosphor element 1D of the present embodiment includes a stepwise fluorescent molded body 50 and a metal film 51 formed on the back surface of the fluorescent molded body 50.

The fluorescent molded body 50 may be a single-crystal fluorescent body or may include a fluorescent body as a base material.

The fluorescent molded body 50 has translucency. Therefore, when the fluorescent molded body 50 is thin when irradiated with the excitation light, part of the excitation light can be transmitted through the fluorescent molded body 50.

The fluorescent molded body 50 has an excitation light irradiation surface 5 and a surface on which the metal film 51 is formed. Here, the excitation light irradiation surface 5 is planar. On the other hand, a part of the surface on which the metal film 51 is formed is a metal film formation surface 52 formed in a step shape.

The phosphor element 1D of the present embodiment has the metal film forming surface 52, so that the thickness of the fluorescent molded body 50 sequentially increases in a stepwise manner from one end to the other end in plan view. There is.

Therefore, the change in color temperature of the light emitted by the phosphor element 1D is stepwise.

Accordingly, if the excitation light irradiation portion is set to, for example, the central portion of one step of the stepwise metal film formation surface 52, the phosphor element 1D emits light even if the excitation light irradiation portion is slightly displaced. The color temperature of light does not change. Therefore, the stability of the color temperature of the light emitted from the phosphor element 1D is improved.

Since the color temperature of the light emitted from the phosphor element 1D can be adjusted stepwise, it is easy to adjust the color temperature to a desired color temperature.

<Method of manufacturing phosphor element>
The manufacturing method of the phosphor element 1D of the present embodiment will be described below with reference to FIG. 13A to 13F are side cross-sectional views illustrating an example of the method for manufacturing the phosphor element 1D according to the present embodiment.

The method for manufacturing the phosphor element 1D of the present embodiment is an application of the nanoimprint technique. As shown in FIG. 13(a), first, as a preliminary step, on a flat plate which is a base of the phosphor molded body 50. A photocurable resist 61 is placed on the fluorescent base material 60, and a photomask 62 is prepared above the resist 61.

The fluorescent base material 60 may be a single crystal phosphor, or may include a phosphor as a base material.

The resist 61 is, for example, a material that cures when irradiated with ultraviolet light in a later step, and can be appropriately selected by those skilled in the art.

The photomask 62 has a stepped surface facing the fluorescent substrate 60 and the resist 61.

Then, as shown in FIG. 13B, by bringing the photomask 62 into contact with the flexible resist 61, the resist 61 is deformed in conformity with the stepped surface of the photomask 62, and the resist 61 is stepped. A surface is formed.

Next, as shown in FIG. 13C, ultraviolet ray excitation light is irradiated from above the photomask 62 to cure the resist 61.

Then, as shown in FIG. 13D, the photomask 62 is removed. Then, as shown in (e) of FIG. 13, by etching the resist 61 and the fluorescent base material 60 by sputtering or the like, the fluorescent molded body 50 having a stepped surface is formed.

Next, as shown in (f) of FIG. 13, metal is sputtered or vapor-deposited on the surface of the fluorescent molded body 50 to form a metal film 51. Thereby, the phosphor element 1D can be manufactured by reversing the top and bottom. The phosphor element 1D has a stepwise metal film formation surface 52. Therefore, in the phosphor element 1D, the thickness of the fluorescent molded body 50 sequentially increases in a stepwise manner from one end to the other end in a plan view.

By using the phosphor element 1D manufactured as described above and moving the excitation light source or the phosphor element 1D for irradiating the excitation light, the color of the light emitted by the phosphor element 1D by one phosphor element 1D You can change the temperature.

In the above description, the phosphor element 1D is described in which the thickness of the phosphor molded body 50 increases stepwise in order from one end to the other end when viewed in a plan view. However, 1D of the present embodiment is not necessarily limited to this, and also for the phosphor element 1D in which the thickness of the fluorescent molded body 50 increases stepwise from the end portion toward the center when seen in a plan view. It can be applied.

According to the method to which the UV nanoimprint technique is applied, the stepped surface can be formed on the resist 61 by using the photomask 62 having the stepped surface. Then, by etching the resist 61 and the fluorescent base material 60, the fluorescent molded body 50 having the same shape as the shape of the resist 61 can be manufactured.

According to this method, even if the fluorescent base material 60 is made of a very thin single crystal fluorescent material, it is possible to form the fluorescent molded body 50 having a step-like surface (nano pattern).

[Modification 1]
Modification 1 of phosphor element 1D of the present embodiment will be described below with reference to FIG. For convenience of explanation, members having the same functions as those shown in the drawings of the first to fourth embodiments are designated by the same reference numerals, and the description thereof will be omitted. FIG. 14A is a side sectional view showing the configuration of Modification 1 of phosphor element 1D of the present embodiment.

As shown in FIG. 14A, the phosphor element 1D of the present modification includes a phosphor molded body 50 having an excitation light irradiation surface 5 formed with a step.

The excitation light irradiation surface 5 of the fluorescent molded body 50 has a stepped shape in which the center is recessed, and the thickness of the fluorescent molded body 50 increases from the center toward the end when the fluorescent molded body 50 is viewed in a plan view. It becomes thicker step by step.

The fluorescent molded body 50 has an excitation light irradiation surface 5 and a metal film formation surface 52 on which the metal film 51 is formed. Here, the metal film formation surface 52 of this modification is flat.

Therefore, the thickness of the fluorescent molded body 50 at the exciting light irradiation location differs depending on whether the exciting light irradiation location is the central portion of the fluorescent molded body 50 or near the peripheral edge of the fluorescent molded body 50.

As a result, the color temperature of the light emitted from the phosphor element 1D differs depending on the excitation light irradiation location. In addition, the change in color temperature of the light emitted by the phosphor element 1D becomes stepwise.

Therefore, the stability of the color temperature of the light emitted from the phosphor element 1D is improved. Since the color temperature of the light emitted from the phosphor element 1D can be adjusted stepwise, it is easy to adjust the color temperature to a desired color temperature.

[Modification 2]
Modification 2 of phosphor element 1D of the present embodiment will be described below with reference to FIG. 14(b). For convenience of explanation, members having the same functions as those shown in the drawings of the first to fourth embodiments are designated by the same reference numerals, and the description thereof will be omitted. FIG. 14B is a side sectional view showing the configuration of Modification 2 of phosphor element 1D of the present embodiment.

As shown in FIG. 14B, the phosphor element 1D according to the present modification has a substrate 53 on which a protrusion having a convex step is formed on the surface, and a fluorescent molded body 50 laminated on the substrate 53. It has and.

The substrate 53 is formed with ridges such that the thickness of the substrate 53 increases stepwise in order from the end portion toward the center when seen in a plan view.

By stacking the fluorescent molded body 50 on the substrate 53, the substrate 53 and the substrate contact surface 54 that contacts the fluorescent molded body 50 are formed in a step shape. The excitation light irradiation surface 5 of the fluorescent molded body 50 is formed on a flat surface.

For this reason, the thickness of the fluorescent molded body 50 gradually decreases in a stepwise manner from the end portion toward the center when the fluorescent molded body 50 is viewed in a plan view.

As a result, the thickness of the fluorescent molded body 50 at the excitation light irradiation location differs depending on whether the excitation light irradiation location is the central portion of the fluorescent molding 50 or near the peripheral edge of the fluorescent molding 50.

As a result, the color temperature of the light emitted from the phosphor element 1D differs depending on the excitation light irradiation location. In addition, the change in color temperature of the light emitted by the phosphor element 1D becomes stepwise.

Therefore, the stability of the color temperature of the light emitted from the phosphor element 1D is improved. Since the color temperature of the light emitted from the phosphor element 1D can be adjusted stepwise, it is easy to adjust the color temperature to a desired color temperature.

[Fifth Embodiment]
Another embodiment of the present invention will be described below with reference to FIGS. 15 and 16. The configuration other than that described in the present embodiment is the same as in the first to fourth embodiments. Further, for convenience of explanation, members having the same functions as the members shown in the drawings of the first to fourth embodiments are designated by the same reference numerals, and the description thereof will be omitted.

In the first to fourth embodiments, the phosphor elements 1A to 1D have been described as an example of the phosphor element of the present invention. On the other hand, in the present embodiment, a light emitting device including a phosphor element will be described. Here, the light emitting device of the present embodiment can be applied to ceiling lighting and other lighting equipment including the light emitting device, and the lighting equipment is a vehicle front lamp such as a headlamp whose color temperature can be controlled. Can be applied to.

(Transmission type light emitting device)
First, the configuration of the transmissive light emitting device 70 will be described with reference to FIG. FIG. 15 is a cross-sectional view showing the structure of the transmissive light emitting device 70 in the present embodiment.

As shown in FIG. 15, the transmissive light-emitting device 70 according to the present embodiment includes a laser element 71, an optical fiber 72 for guiding light from the laser element 71 to the phosphor element 1E, and a phosphor element 1E. And a lens 73 on which the light emitted from the phosphor element 1E is irradiated by the laser light irradiation.

The laser element 71 is a light emitting element that functions as an excitation light source that emits excitation light. One laser element 71 may be provided, or a plurality of laser elements 71 may be provided. In order to obtain a high-power laser beam, it is preferable to use a plurality of laser elements 71.

The laser element 71 may have one light emitting point on one chip, or may have a plurality of light emitting points on one chip. The wavelength of the laser light of the laser element 71 is, for example, 405 nm (blue violet) or 450 nm (blue). However, the present invention is not limited to these and may be appropriately selected according to the type of the phosphor 2a contained in the phosphor element 1E. That is, the excitation light is preferably blue visible light of 440 nm to 480 nm, and is preferably laser light.

Further, as the excitation light source (light emitting element), a light emitting diode (LED) can be used instead of the laser element 71.

When there are a plurality of laser elements 71, one optical fiber 72 is connected to each laser element 71. Then, it can be used as a bundle fiber in which a plurality of optical fibers 72 are bundled.

The optical fiber 72 is connected to a ferrule 74 which is an optical connector part. One or more optical fibers 72 connected to one end of the ferrule 74 are fixed by the ferrule 74.

The ferrule 74 is fixed by the ferrule fixing portion 75. The ferrule fixing portion 75 is capable of fixing the ferrule 74 and adjusting the position of the ferrule 74. This makes it possible to change the laser light irradiation position on the phosphor element 1E.

The ferrule fixing portion 75 and the phosphor element 1E are installed in the heat dissipation portion 76. The ferrule fixing portion 75 is installed below the heat dissipation portion 76, the phosphor element 1E is installed above the heat dissipation portion 76, and a hollow portion 77 is formed in the central portion of the heat dissipation portion 76.

Laser light is applied to the phosphor element 1E through the cavity 77.

Both the heat dissipation portion 76 and the lens 73 are fixed to the lens fixing portion 78. The lens 73 can diffuse and emit the light emitted by the phosphor element 1E.

Here, it is preferable that the light emitting device 70 includes a position adjusting mechanism that adjusts the position of the phosphor element 1</b>E installed in the heat dissipation portion 76. This makes it possible to change the laser light irradiation position on the phosphor element 1E.

The phosphor element 1E included in the transmissive light emitting device 70 of the present embodiment has a thickness of the fluorescent molded body 2 at the excitation light irradiation position when the excitation light such as a laser is locally irradiated. It changes depending on the excitation light irradiation position.

Thereby, the color temperature of the light emitted from the phosphor element 1E can be changed depending on the excitation light irradiation position, and the color temperature of the light emitted from the transmissive light emitting device 70 can be changed. Furthermore, even after the phosphor element 1E is incorporated as the transmissive light emitting device 70 and the device is completed, the transmissive light emitting device 70 is disassembled by changing the excitation light irradiation position, and the phosphor element 1E is changed. It is possible to change the color temperature of the light emitted from the transmissive light emitting device 70 without replacing the above.

(Reflective light emitting device)
Next, the configuration of the reflective light emitting device 80 will be described with reference to FIG. FIG. 16 is a cross-sectional view showing the configuration of the reflective light emitting device 80 according to the present embodiment.

As shown in FIG. 16, the reflection-type light emitting device 80 in the present embodiment includes an excitation light source 81, a phosphor element 1E, and a mirror 82 and a lens that irradiate the excitation light from the excitation light source 81 onto the phosphor element 1E. 83 and a light projecting lens 84 for diffusing and projecting the light emitted by the phosphor element 1E.

The excitation light source 81 may be a laser element or an LED. The excitation light emitted from the excitation light source 81 is sent to the optical fiber 86 through the condenser lens 85. The condenser lens 85 may not be provided, and the means for guiding the excitation light to the phosphor element 1E is not limited to the optical fiber 86.

The excitation light emitted from the optical fiber 86 is applied to the mirror 82. The excitation light reflected by the mirror 82 is applied to the phosphor element 1E.

Here, the excitation light reflected by the mirror 82 and applied to the phosphor element 1E is condensed and locally applied to the excitation light irradiation surface 5 of the phosphor element 1E.

The mirror 82 can be adjusted in angle, or the installation position of the phosphor element 1E can be moved, and the excitation light irradiation position on the excitation light irradiation surface 5 can be changed. It is like this.

In the phosphor element 1E provided in the reflective light emitting device 80 of the present embodiment, when the excitation light such as a laser is locally irradiated, the thickness of the fluorescent molded body 2 at the excitation light irradiation position is It changes depending on the excitation light irradiation position.

As a result, the color temperature of the light emitted by the phosphor element 1E can be changed depending on the excitation light irradiation position, and the color temperature of the light emitted from the reflective light emitting device 80 can be changed. Furthermore, even after the phosphor element 1E is incorporated as the reflection type light emitting device 80 and the device is completed, the reflection type light emitting device 80 is disassembled by changing the excitation light irradiation position. It is possible to change the color temperature of the light emitted from the reflection type light emitting device 80 without replacing the above.

In the transmissive light emitting device 70 or the reflective light emitting device 80 in the present embodiment, the laser element 71 or the excitation light source 81 can change the irradiation position to the phosphor elements 1A and 1D.

Thereby, instead of moving the phosphor elements 1A and 1D with the laser element 71 or the excitation light source 81 fixed, the irradiation position of the laser element 71 or the excitation light source 81 with the phosphor elements 1A and 1D fixed. Can be changed.

Therefore, the transmissive light emitting device 70 or the reflective light emitting device 80 can be provided with convenience.

[Sixth Embodiment]
Another embodiment of the present invention will be described below with reference to FIGS. The configuration other than that described in the present embodiment is the same as in the first to fifth embodiments. Further, for convenience of explanation, members having the same functions as the members shown in the drawings of the first to fifth embodiments are designated by the same reference numerals, and the description thereof will be omitted.

In the fifth embodiment, as an example of the light emitting device of the present invention, a transmissive or reflective light emitting device that includes the phosphor element 1E and is capable of slidingly adjusting the laser light irradiation position or the position of the phosphor element 1E has been described. .. On the other hand, in the present embodiment, a light emitting device including a mechanism for rotating the phosphor element will be described.

(Regarding change in thickness due to rotation of phosphor element)
First, a change in the thickness of the excitation light irradiation portion P due to the rotation of the phosphor element 1F and a change in the color temperature due to the change will be described with reference to FIG. 17A is a plan view showing the configuration of the phosphor element 1F in the present embodiment, FIG. 17B is a side sectional view of the phosphor element 1F, and FIG. 17A is a perspective view showing a schematic configuration in which the excitation light from the excitation light source 92 is applied to the phosphor element 1F, and FIG. 17D shows a state when the phosphor element 1F is rotated. It is a top view shown.

As shown in FIGS. 17A and 17B, the phosphor element 1F in the present embodiment has a rectangular parallelepiped substrate 90 on a flat plate as a supporting member, and a phosphor member mounted on the substrate 90. And a fluorescent molded body 91. The fluorescent molded body 91 may be a molded body containing the phosphor 2a as described in the first to fourth embodiments, or may be made of a single crystal of the phosphor 2a. The substrate 90 may be the substrate 3 or the metal film 41 as described in the first to fourth embodiments.

The substrate 90 has a rectangular parallelepiped shape in a plan view, and in the following, the four sides thereof will be referred to as side A, side B, side C, and side D in the clockwise direction.

The fluorescent molded body 91 of the present embodiment is circular in a plan view, and the thickness of the fluorescent molded body 91 increases in order from one end to the other end when viewed from the side. That is, the fluorescent molded body 91 has a shape like one of a cylinder that is diagonally sliced.

Here, the side of the fluorescent molded body 91 close to the side A of the substrate 90 is a position P1, the side close to the side C is a position P3, and the midpoint between the positions P1 and P3, that is, the vicinity of the center of the fluorescent molded body 91. Is a position P2. For example, the film thickness at the position P1 of the fluorescent molded body 91 of the present embodiment is 100 μm, the film thickness at the position P2 is 50 μm, and the film thickness at the position P3 is 10 μm. In the fluorescent molded body 91, the thickness of the fluorescent molded body 91 increases in order from the position P3 toward the position P1.

Consider a case where such a fluorescent molded body 91 is irradiated with excitation light, for example, at a position moved from the position P2 in the side D direction. A portion irradiated with the excitation light is referred to as an excitation light irradiation portion P.

At this time, as shown in FIG. 17C, the phosphor element 1F is irradiated with the excitation light from the excitation light source 92 at the excitation light irradiation point P of the phosphor element 1F. The film thickness of the excitation light irradiation portion P is 50 μm, as in the position P2. The excitation light from the excitation light source 92 may be directly applied to the excitation light irradiation point P, or may be applied via an optical fiber or a mirror. Further, in the following, a case where the direction of the excitation light from the excitation light source, that is, the irradiation angle or the position is not changed is described for simplicity, but the configuration in which the direction of the excitation light changes is not excluded.

When the phosphor element 1F is rotated about a rotation axis that is a direction that penetrates the fluorescent molded body 91 and the substrate 90 and is perpendicular or substantially perpendicular to the substrate 90, for example, The film thickness of the excitation light irradiation spot P changes. For example, when the phosphor element 1F is rotated in the clockwise direction when viewed from the direction of the fluorescent molded body 91, the film thickness of the excitation light irradiation portion P first becomes thin, then becomes thicker, and then becomes thinner at a certain point. Go

The state will be described in detail with reference to FIG. First, when the excitation light irradiation site P was located near the side D, the film thickness of the excitation light irradiation site P was 50 μm, and the color temperature at that time was 3900K. When the phosphor element 1F was rotated 90 degrees clockwise, the excitation light irradiation spot P was located at a position P3 near the side C, the film thickness was 10 μm, and the color temperature was 6500K. Further, when the phosphor element 1F was rotated clockwise by 90 degrees, the excitation light irradiation spot P became closer to the side B, the film thickness was 50 μm, and the color temperature was 3900K. Subsequently, when the phosphor element 1F was rotated clockwise by 90 degrees, the excitation light irradiation spot P became a position P1 near the side A, the film thickness became 100 μm, and the color temperature became 3300K. Further, when the phosphor element 1F is rotated clockwise by 90 degrees, the phosphor element 1F makes one revolution and returns to the initial state, the excitation light irradiation point P is located near the side D, the film thickness is 50 μm, and the color is The temperature reached 3900K.

As described above, the color temperature of the light emitted from the phosphor element 1F can be adjusted by rotating the phosphor element 1F.

(Rotating mechanism of light emitting device)
Next, a phosphor element rotating mechanism in a transmissive or reflective light emitting device including the phosphor element 1F will be described with reference to FIGS. 18(a), 18(b) and 18(c). 18A is a side sectional view showing a schematic configuration of the phosphor element rotating mechanism according to the present embodiment, and FIG. 18B is a plan view of the phosphor element rotating mechanism. 18C is a bottom view of the phosphor element rotating mechanism.

In the phosphor element rotating mechanism according to the present embodiment, as shown in FIGS. 18A to 18C, the substrate holder 93 in which the phosphor element 1F is stored, and the support base 95 screwed to the substrate holder 93. And consists of.

The substrate holder 93 has a thick disk-like shape, and has a hole into which the phosphor element 1F is fitted on one plane and a screw hole 94a on the other surface. The support base 95 includes a disc-shaped base body and a screw 94b protruding from one plane of the base body.

The screw 94b can be screwed into the screw hole 94a. The board holder 93 is rotated by engaging the screw holes 94a of the board holder 93 with the screws 94b and rotating them. As a result, the phosphor element 1F stored in the substrate holder 93 can also rotate together with the substrate holder 93. Thereby, the film thickness of the excitation light irradiation location P on the phosphor element 1F can be changed. As a result, the color temperature of the light emitted by the phosphor element 1F changes. After adjusting the color temperature, it is preferable that the substrate holder 93 and the support base 95 can be fixed so as not to rotate randomly.

Here, the rotation direction of the substrate holder 93 and the phosphor element 1F can also be expressed as the direction in which the phosphor element 1F rotates in a state where the surface of the phosphor molding 91 is irradiated with the excitation light from the excitation light source 92. The phosphor element rotation mechanism allows the phosphor element 1F to continue to irradiate the surface of the phosphor element 1F with the excitation light with respect to the excitation light emitted directly or by being guided from the excitation light source 92. It only needs to rotate in any direction.

Further, since the phosphor element 1F is stored in the substrate holder 93, the phosphor element 1F can be easily replaced by attaching and detaching the phosphor element 1F. Therefore, the type of the phosphor element 1F can be easily changed.

The screw hole 94a may be provided in the substrate 90 instead of the substrate holder 93. In that case, the number of parts can be reduced and a compact structure can be achieved.

As described above, in the light emitting device of the present embodiment, the phosphor element 1F is rotatably provided with the irradiation direction from the excitation light source 92 fixed to the surface of the phosphor molding 91. The phosphor element rotation mechanism of the light emitting device includes a support base 95 and a substrate holder 93, and the screw 94b of the support base 95 and a screw hole 94a of the substrate holder 93 are screwed together, whereby the substrate holder 93 can be rotated. Has become.

According to the above configuration, by rotating the substrate holder 93, the phosphor element 1F is rotated, and thereby the film thickness of the excitation light irradiation portion P is changed. As a result, the color temperature of the light emitted by the phosphor element 1F can be changed.

Therefore, it is possible to provide a light emitting device capable of emitting light of a plurality of types of color temperatures with the single phosphor element 1F.

[Modification]
A modification of the light emitting device of the present embodiment will be described below with reference to FIG. For convenience of explanation, members having the same functions as those shown in the drawings of the sixth embodiment are designated by the same reference numerals, and the description thereof will be omitted. 19A is a side sectional view showing a schematic configuration of a modified example of the phosphor element rotating mechanism of the present embodiment, and FIG. 19B is a gear of FIG. 19A. FIG. 96 is a plan view showing 96.

In this modification, the phosphor element rotating mechanism is composed of a substrate holder 93 and a gear 96.

As shown in (a) of FIG. 19, the substrate holder 93 of the present modification has a thick disk-like shape, and one surface is provided with a hole into which the phosphor element 1F is fitted, and the other is A gear hole 93b is provided on the surface. A recess 93a is further provided at the center of the gear hole 93b.

As shown in FIG. 19B, the gear 96 includes a first gear 96a, a protrusion 96b protruding from one plane of the first gear 96a, and the other plane of the first gear 96a. And a second gear 96c which is connected to and is rotatable integrally. The second gear 96c advantageously has a larger diameter than the first gear 96a. However, the present invention is not limited to this, and the second gear 96c may be the same as or smaller than the first gear 96a.

The protrusion 96b and the recess 93a are fitted to each other, and the first gear 96a and the gear hole 93b are meshed with each other. Thereby, the substrate holder 93 can be fixed to the gear 96. Therefore, the substrate holder 93 can be rotated by rotating the second gear 96c. As a result, the phosphor element 1F can be rotated together with the substrate holder 93.

Here, the second gear 96c is preferably meshed with the external gear 97 rotatable by an external drive engine. In this case, by rotating the external gear 97 by an external drive engine, the second gear 96c rotates, and the substrate holder 93 also rotates accordingly. As a result, the phosphor element 1F can be rotated.

In this case, the rotation of the phosphor element 1F can be precisely controlled by making the gear teeth fine. Further, by increasing the number of gears connected, it is possible to control the rotation of the phosphor element 1F from a position away from the phosphor element 1F. Thereby, when the phosphor element 1F is rotated while irradiating excitation light such as a laser to adjust the color temperature of the light emitted by the phosphor element 1F, the distance from the laser can be reduced as much as possible. Since it can be adjusted, it can be adjusted safely when manually adjusted by a person.

Therefore, if the excitation light irradiation spot P can be irradiated to a place other than the central axis position of rotation of the substrate holder 93, the phosphor element 1F can be rotated and the color temperature of the emitted light can be changed.

As described above, the light emitting device of this modification includes the phosphor element 1F and the phosphor element rotating mechanism that rotatably fixes the phosphor element 1F. The phosphor element rotating mechanism includes a substrate holder 93 and a gear 96, and the first gear 96a of the gear 96 and the gear hole 93b of the substrate holder 93 are meshed with each other, whereby the rotation of the gear 96 causes the substrate holder to rotate. 93 is rotatable.

According to the above configuration, the phosphor element 1F can be rotated by rotating the gear 96 regardless of the direction and angle of rotation and the number of rotations. Therefore, the phosphor element 1F can be rotated to change the film thickness of the excitation light irradiation site P. As a result, the color temperature of the light emitted by the phosphor element 1F can be changed, and the color temperature can be easily adjusted.

Therefore, it is possible to provide a light emitting device capable of emitting light of a plurality of types of color temperatures with the single phosphor element 1F.

The second gear 96c included in the gear 96 preferably meshes with an external gear 97 that is rotatable by an external drive engine.

According to the above configuration, the second gear 96c can be rotated by the external drive mechanism, and the substrate holder 93 can be rotated. Thereby, the color temperature can be safely adjusted from a distant place while irradiating the phosphor element 1F with the excitation light.

[Summary]
The light emitting device (transmissive light emitting device 70, reflective light emitting device 80) according to the first aspect of the present invention includes a fluorescent member (fluorescent molded body 2) containing a fluorescent body 2a and laminated on a supporting member (substrate 3). In a light emitting device including the provided phosphor elements 1A to 1D and a light source, the above-mentioned fluorescent member (fluorescent molded body 2) is centered from one end to the other end in plan view or from the end. The phosphor elements 1A to 1D are irradiated with light from the light source (laser element 71/excitation light source 81) while having a thickness that gradually increases toward the end or from the center toward the end. It is characterized in that the irradiation position of the excitation light to the phosphor elements 1A to 1D can be changed, and the color temperature of light emission is controlled based on the irradiation position. The excitation light is preferably blue visible light of 440 nm to 480 nm, and is preferably laser light.

According to the above configuration, in the fluorescent member of the phosphor element, the thickness of the fluorescent member increases in order from one end to the other end in a plan view.

Therefore, the thickness of the fluorescent member at the position where the excitation light is irradiated is changed by changing the position where the fluorescent member is irradiated with the excitation light in one phosphor element. Here, when the thickness of the fluorescent member at the position irradiated with the excitation light changes, the color temperature of the light emitted by the fluorescent member changes.

As a result, by providing a phosphor element capable of changing the color temperature of the light emitted by the fluorescent member by changing the position irradiated with the excitation light in the direction from one end to the other end when the fluorescent member is viewed in plan view. It is possible to provide a light emitting device.

Further, according to the above configuration, the thickness of the fluorescent member increases in order from the end portion toward the center of the fluorescent member when viewed in plan or from the center toward the end portion.

Therefore, in the direction from the end to the center or in the direction from the center to the end when the fluorescent member is viewed in a plan view, by changing the position irradiated by the excitation light, the fluorescent light is irrespective of the direction in which the position changes. The thickness of the member changes, and the color temperature of the light emitted by the fluorescent member can be changed accordingly.

Therefore, it is possible to provide a light emitting device including a phosphor element capable of emitting light of plural kinds of color temperatures by itself.

Further, this means that the user can select a desired color temperature by using the light emitting device of the present invention.

Further, by having the light emitting surface of the fluorescent member that is inclined, the color temperature can be changed by one kind of fluorescent material. As a result, since a plurality of phosphors are not used, the structure of the phosphor element is simplified.

Further, in the present invention, the irradiation position of the excitation light emitted from the light source to the phosphor element can be changed, and the color temperature of light emission is controlled based on the irradiation position.

Thereby, for example, instead of moving the phosphor element with the light source fixed, the irradiation location of the excitation light from the light source can be changed with the phosphor element fixed.

Therefore, the light emitting device can be provided with convenience.

A light emitting device (transmissive light emitting device 70, reflective light emitting device 80) according to Aspect 2 of the present invention is the light emitting device according to Aspect 1, wherein the fluorescent member (fluorescent molded body 50) of the phosphor element 1D is a flat surface. When viewed from one end to the other end, or from the end to the center, or from the center to the end, the thickness gradually increases stepwise. You can

According to the above configuration, the color temperature of the light emitted from the phosphor element changes in steps.

Thus, if the position irradiated with the excitation light is set to, for example, the central portion of one step of the fluorescent member, even if the position irradiated with the excitation light is slightly shifted, the phosphor element emits light. The color temperature of the emitted light does not change. Therefore, the stability of the color temperature of the light emitted from the phosphor element can be improved.

The light emitting device (transmissive light emitting device 70, reflective light emitting device 80) according to Aspect 3 of the present invention is the same as the light emitting device according to Aspect 1, except that the support member (substrate 3) of the phosphor element 1A is a fluorescent member (fluorescent member). It is preferably made of a material that transmits or reflects the light incident on the supporting member (substrate 3) from the molded body 2).

According to the above configuration, when the support member is made of a material that transmits the light incident on the support member from the fluorescent member, the excitation light irradiated on the fluorescent member corresponds to the irradiation position of the fluorescent member. The light having a color temperature corresponding to the thickness is emitted from the support member.

On the other hand, when the supporting member is made of a material that reflects the light incident on the supporting member from the fluorescent member, the excitation light emitted to the fluorescent member passes through the inside of the fluorescent member and is reflected by the supporting member. After passing through the inside of the fluorescent member again, the light is emitted to the outside of the fluorescent member. As a result, when the support member is made of a material that reflects light, it is possible to cause the fluorescent member to emit light having a color temperature corresponding to twice the thickness of the fluorescent member.

Therefore, it is possible to change the color temperature of the light emitted from the phosphor element depending on whether the support member is a material that transmits or reflects light that enters the support member from the fluorescent member.

A light emitting device (transmissive light emitting device 70, reflective light emitting device 80) according to Aspect 4 of the present invention is the light emitting device according to any one of Aspects 1 to 3, wherein the light source (laser element 71/excitation light source 81) is The excitation light is made incident from a part of the plane of the phosphor elements 1A to 1D. Incidentally, the part of the plane of the phosphor element means a part of a dot-like part when the excitation light composed of, for example, a beam is irradiated from the light source onto the plane of the phosphor element, or, for example, a horizontal sectional shape. Is a part of the linear member in the case where linear excitation light is applied to a linear member having a constant thickness, such as a linear member having a right-angled triangular prism.

According to the above configuration, in the phosphor element included in the light emitting device, the thickness of the fluorescent member increases in order from one end to the other end or the end of the fluorescent member toward the center in a plan view.

Thus, by irradiating the fluorescent member with excitation light from the light source, the color temperature of the light emitted from the phosphor element can be changed depending on the excitation light irradiation position. As a result, the color temperature of the light emitted from the light emitting device can be changed.

In addition, even after the phosphor element is incorporated as a light emitting device and the light emitting device is completed, the position irradiated by the excitation light is changed, so that the light emitting device is not disassembled and the phosphor element is replaced. The color temperature of the light emitted from can be changed.

Furthermore, since the light source makes the excitation light incident from a part of the plane of the phosphor element, the excitation light of the light source can be made incident locally.

Therefore, it is possible to provide a light emitting device including a phosphor element capable of emitting light of plural kinds of color temperatures by itself.

A light emitting device (transmissive light emitting device 70, reflective light emitting device 80) according to Aspect 5 of the present invention is the light emitting device according to any one of Aspects 1 to 4, wherein the light source (laser element 71, excitation light source 81, 92) is used. ), the phosphor elements 1A to 1D are rotatably provided in a state in which the surface of the fluorescent member (fluorescent molded body 91) is irradiated with the excitation light.

Accordingly, by rotating the phosphor element, the film thickness at the excitation light irradiation portion can be easily changed. Thereby, the color temperature of the light emitted from the phosphor element can be changed.

Therefore, it is possible to provide a light emitting device that can easily emit light of a plurality of types of color temperatures with a single phosphor element.

A lighting fixture according to aspect 6 of the present invention includes the light emitting device according to any one of aspects 1 to 5.

According to the above invention, it is possible to provide a lighting fixture including a light emitting device capable of easily emitting light of a plurality of types of color temperatures with a single phosphor element.

A vehicle headlamp according to a seventh aspect of the present invention is characterized by including the lighting fixture of the sixth aspect.

According to the above invention, it is possible to provide a vehicle headlamp including a light emitting device capable of easily emitting light of a plurality of types of color temperatures with a single phosphor element.

The method for manufacturing a phosphor element according to aspect 8 of the present invention includes a support member (substrate 3) and a phosphor member (fluorescent molded body 2) containing a phosphor 2a and laminated on the support member (substrate 3). In the method for manufacturing a phosphor element, the phosphor member (fluorescent molded body 2) is formed such that the thickness gradually increases from one end to the other end when viewed in plan or from the end toward the center. It has a feature.

Phosphor element formed by the above manufacturing method, from one end to the other end of the phosphor member in plan view, or from the end to the center, or from the center to the end. Along with this, the thickness of the fluorescent member is gradually increased.

Therefore, the thickness of the fluorescent member at the position irradiated with the excitation light changes by changing the position irradiated with the excitation light.

Therefore, it is possible to provide a method of manufacturing a phosphor element capable of emitting light of plural kinds of color temperatures by itself.

A method for manufacturing a phosphor element according to aspect 9 of the present invention is the method for manufacturing a phosphor element according to aspect 8, wherein the phosphor member has a thickness that sequentially increases from one end toward the other end in plan view. A fluorescent member forming step of forming (single crystal phosphor 40), and a supporting member forming step of forming a supporting member (metal film 41) by sputtering or vapor depositing a metal on the fluorescent member (single crystal phosphor 40). including.

According to the present invention, in the fluorescent member forming step, the fluorescent member having a thickness that sequentially increases from one end to the other end in plan view is formed. Next, in a supporting member forming step, a metal is sputtered or vapor-deposited on the fluorescent member to form a supporting member.

As a result, the supporting member can be easily formed by sputtering or vapor-depositing a metal on the fluorescent member having a thickness that gradually increases from one end to the other end in a plan view.

Further, since the supporting member is formed by sputtering or vapor depositing a metal, it becomes possible to form a supporting film having high reflection performance.

A phosphor element manufacturing method according to aspect 10 of the present invention is the phosphor element manufacturing method according to aspect 8, wherein a spacer is provided on the support base 10 such that one end of the support member (the substrate 3) in plan view is higher. A support member mounting step of mounting the support member (substrate 3) having a uniform thickness via 11 and a fluorescent member (fluorescent molded body 2) around the support member (substrate 3) on the support base 10. Frame plate placing step of placing a frame plate (jig 12) having a thickness in consideration of the thickness of the plate, and a fluorescent member from the upper side of the support member (substrate 3) existing inside the frame plate (jig 12). And the step of injecting the paste material (phosphor paste 13) and smoothing the surface with a spatula are included in this order. When using a spatula to smooth the surface, it is preferable to smooth the surface with a spatula at the surface height of the frame plate. Alternatively, when the mask is placed on the frame plate, it is preferable to smooth the surface with a spatula at the surface height of the mask.

In the present invention, in the supporting member mounting step, the supporting member having a uniform thickness is mounted on the supporting base. At this time, the support member is inclined by interposing a spacer at one end of the support member.

Next, in the frame plate mounting step, a frame plate having a thickness in consideration of the thickness of the fluorescent member is mounted around this. Next, in the fluorescent member applying step, the paste material of the fluorescent member is injected from the upper side of the supporting member existing inside the frame plate to smooth the surface using, for example, a spatula at the surface height of the frame plate.

As a result, a fluorescent member whose upper surface is leveled with a horizontal surface is formed on the inclined support member, so that the phosphor element formed by this manufacturing method has one end to the other end when the fluorescent member is viewed in plan. The thickness of the fluorescent member is gradually increased as it goes to.

As a result, it is possible to easily manufacture the fluorescent member whose thickness increases from one end to the other end only by inclining the support member having a uniform thickness using the spacer.

A method of manufacturing a phosphor element according to aspect 11 of the present invention is the method of manufacturing the phosphor element according to aspect 8, wherein the support base 10 has a thickness that increases from one end to the other end in plan view. A supporting member mounting step of mounting the supporting member (inclined substrate 15) that is provided, and a thickness in consideration of the thickness of the fluorescent member (fluorescent molded body 2) is provided around the supporting member (inclined substrate 15) in the support base 10. A frame plate placing step of placing the frame plate (jig 12), and a paste material (phosphor paste) for the fluorescent member from the upper side of the support member (slanted substrate 15) existing inside the frame plate (jig 12). 13) Injecting 13) and smoothing the surface with a spatula are included in this order. When using a spatula to smooth the surface, it is preferable to use a spatula to smooth the surface, for example, at the surface height of the frame plate. Alternatively, when the mask is placed on the frame plate, it is preferable to smooth the surface with a spatula at the surface height of the mask.

In the present invention, in the supporting member mounting step, the supporting member whose thickness increases from one end to the other end is mounted on the support base.

Next, in the frame plate mounting step, a frame plate having a thickness in consideration of the thickness of the fluorescent member is mounted around this. Next, in the fluorescent member applying step, the paste material of the fluorescent member is injected from the upper side of the supporting member existing inside the frame plate to smooth the surface using, for example, a spatula at the surface height of the frame plate.

As a result, a fluorescent member whose upper surface is leveled with a horizontal surface is formed on the inclined support member, so that the phosphor element formed by this manufacturing method has one end to the other end when the fluorescent member is viewed in plan. The thickness of the fluorescent member is gradually increased as it goes to.

As a result, since it is not necessary to use the spacer, it is possible to reduce the number of manufacturing steps.

A method for manufacturing a phosphor element according to aspect 12 of the present invention is the method for manufacturing a phosphor element according to aspect 8, wherein a paste material for the phosphor member (in the center of the support member (substrate 3) is used by using a liquid dispensing device 23. The phosphor paste 13) is discharged.

In the present invention, when the phosphor element is manufactured, the paste material of the phosphor member is simply discharged to the center of the support member.

As a result, in the phosphor element formed by the above-described manufacturing method, the thickness of the fluorescent member gradually increases from the end portion toward the center when the fluorescent member is viewed in plan.

As a result, it is possible to easily manufacture a phosphor element in which the thickness of the fluorescent member increases in order from the end toward the center when the fluorescent member is viewed in a plan view.

The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Is also included in the technical scope of the present invention. Furthermore, new technical features can be formed by combining the technical means disclosed in each of the embodiments.

1A to 1E Phosphor element 2.22/32 Phosphor molding (fluorescent member)
2a phosphor 2b thick part 2c thin part 3.33.53 substrate (support member)
4 Substrate contact surface 5 Excitation light irradiation surface 10 Support stand 11 Spacer 12 Jig (frame plate)
13 Phosphor paste (paste material)
14 spatula 15 inclined substrate (support member)
22 Fluorescent molded body (fluorescent member)
23 Liquid Dispensing Device 40 Single Crystal Phosphor (Fluorescent Member)
41 Metal film (supporting member)
50 Fluorescent molded body (fluorescent member)
51 Metal film (support member)
60 Fluorescent Substrate 61 Resist 70/80 Light Emitting Device

Claims (5)

In a light emitting device including a phosphor element including a phosphor member containing a phosphor and laminated on a supporting member, and a light source,
The fluorescent member has a thickness that increases in order from one end to the other end in plan view, from the end to the center, or from the center to the end. With
It is possible to change the irradiation position to the phosphor element in the excitation light irradiated from the light source to the phosphor element, the color temperature of light emission is controlled based on the irradiation position,
The light emitting device, wherein the phosphor does not include a void therein, or forms a void having a width of 0 < void width≦40 nm. The phosphor member of the phosphor element is thickened in a stepwise manner from one end to the other end in plan view, from the end to the center, or from the center to the end. The light emitting device according to claim 1, wherein the light emitting device has the following thickness. The light emitting device according to claim 1, wherein the support member of the phosphor element is made of a material that transmits or reflects light incident from the phosphor member to the support member. The light source according to any one of claims 1 to 3, wherein the light source causes excitation light to enter from a part of a plane of the phosphor element. A lighting fixture comprising the light emitting device according to claim 1.

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