JP6701647B2 - Liquid ejection head, liquid ejection unit, device for ejecting liquid - Google Patents

Description

  The present invention relates to a liquid ejection head, a liquid ejection unit, and a device that ejects a liquid.

  As a liquid ejection head, for example, a holding substrate (also referred to as a protective substrate) that covers the pressure generating elements is bonded to the actuator substrate on which a plurality of pressure generating elements are arranged with an adhesive, and a drive circuit is provided on the actuator substrate. Some drive ICs are mounted.

  Conventionally, in a region where the actuator substrate and the holding substrate are joined together via a plurality of wirings passing through a plurality of pressure generating elements and a driving IC, a part of the plurality of wirings is seen in a plan view. One having a crank-shaped portion is known (Patent Document 1).

JP, 2005-107634, A

  By covering the pressure generating element with the holding substrate, a plurality of wirings passing through the drive IC and the pressure generating element are arranged between the actuator substrate and the holding substrate. Therefore, in the region where the actuator substrate and the holding substrate are joined via the wiring, unevenness (step) is generated in the region between the wiring and the region where the wiring exists in the direction in which the pressure generating elements are arranged.

  Therefore, when the actuator substrate and the holding substrate are joined with an adhesive via a plurality of wirings, it is possible to reliably seal the gap between the actuator substrate and the holding substrate while suppressing the adhesive from flowing out to the pressure generating element side. Is required.

  The present invention has been made in view of the above problems, and an object of the present invention is to secure stable sealing properties with a small amount of adhesive.

To solve the above problems, a liquid ejection head according to the present onset Ming,
An actuator substrate on which a plurality of pressure generating elements are arranged,
A holding substrate formed with a recess for accommodating the pressure generating element,
Part of the holding substrate is connected to the pressure generating element, is bonded to the actuator substrate with an adhesive via a plurality of wirings arranged in the direction in which the pressure generating elements are arranged,
In a joining region where the holding substrate and the actuator substrate are joined via the plurality of wirings, a portion where the spacing between the wirings adjacent to each other in the direction in which the pressure generating elements are arranged is wide and a spacing between the wirings is narrow. Part and
In a plan view, including a crank-shaped portion between the wiring,
The intervals between the wirings are different from each other at the corner of the crank-shaped portion.

  According to the present invention, it is possible to secure a stable sealing property with a small amount of adhesive.

FIG. 3 is a perspective explanatory view of an example of a liquid ejection head according to the present invention. FIG. 5 is a cross-sectional explanatory view of a main part, which is also along a direction orthogonal to the nozzle array direction. FIG. 3 is an enlarged cross-sectional explanatory view of a main part of FIG. 2. FIG. 5 is a cross-sectional explanatory view of a main part, similarly along the nozzle arrangement direction. FIG. 3 is a plan view of a main part of a state before the holding substrate is joined to the actuator substrate, which is used in the description of the first embodiment of the present invention. 6 is a cross-sectional explanatory view of a joint gap portion along the direction in which the pressure generating elements are arranged in FIG. FIG. 9 is an explanatory diagram for explaining a step of joining the holding substrate to the actuator substrate, which is used for explaining the operation of the same embodiment. FIG. 6 is a plan view of a main part of a state where the holding substrate is joined to the actuator substrate. FIG. 11 is an explanatory plan view of a main part of a state before the holding substrate is joined to the actuator substrate, which is used in the description of the second embodiment of the present invention. FIG. 6 is a plan view of relevant parts showing a state where the holding substrate is joined to the actuator substrate, which is used for explaining the operation of the embodiment. FIG. 11 is a plan view of a main part of a state before the holding substrate is joined to the actuator substrate, which is used in the description of the third embodiment of the present invention. FIG. 6 is a plan view of relevant parts showing a state where the holding substrate is joined to the actuator substrate, which is used for explaining the operation of the embodiment. FIG. 14 is a plan view of a main part of a state before the holding substrate is joined to the actuator substrate, which is used in the description of the fourth embodiment of the present invention. FIG. 6 is a plan view of relevant parts showing a state where the holding substrate is joined to the actuator substrate, which is used for explaining the operation of the embodiment. It is a principal part plane explanatory view of the state before joining the holding substrate used for description of 5th Embodiment of this invention to an actuator substrate. It is a principal part plane explanatory view of the state before joining the holding substrate used for description of 6th Embodiment of this invention to an actuator substrate. FIG. 3 is a plan view of a principal part of an example of a device for ejecting a liquid according to the present invention. It is a principal part side explanatory view of the same apparatus. FIG. 8 is a plan view of a principal part of another example of the liquid ejection unit according to the present invention. It is a front explanatory view of the further another example of the liquid discharge unit concerning the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. An example of the liquid ejection head according to the present invention will be described with reference to FIGS. 1 is an exploded perspective view of the liquid ejection head, FIG. 2 is a cross-sectional view along the direction orthogonal to the nozzle array direction, FIG. 3 is an enlarged cross-sectional view of the essential parts of FIG. 2, and FIG. It is a principal part cross-section explanatory drawing which follows.

  This liquid ejection head includes a nozzle plate 1, a flow path plate 2, a vibration plate 3, a piezoelectric element 11 as a pressure generating element, a holding substrate 50, a wiring member 60, and a frame member that also serves as a common liquid chamber member. 70 and.

  Here, the portion constituted by the flow path plate 2, the vibration plate 3, and the piezoelectric element 11 is referred to as the "actuator substrate 20" in the present invention. However, it does not mean that the independent member is formed as the actuator substrate 20 and then joined to the nozzle plate 1 or the holding substrate 50.

  The nozzle plate 1 has a plurality of nozzles 4 for ejecting liquid. Here, four nozzle rows in which the nozzles 4 are arranged are arranged.

  The flow path plate 2 forms, together with the nozzle plate 1 and the vibrating plate 3, an individual liquid chamber 6 communicating with the nozzle 4, a fluid resistance portion 7 communicating with the individual liquid chamber 6, and a liquid introducing portion (passage) 8 communicating with the fluid resistance portion 7. is doing.

  The liquid introducing portion 8 communicates with a common liquid chamber 10 formed by the frame member 70 through a passage (supply port) 9 of the vibration plate 3 and a flow passage (opening) 51 of the holding substrate 50.

  The vibrating plate 3 forms a deformable vibrating region 30 that forms a part of the wall surface of the individual liquid chamber 6. A piezoelectric element 11 is provided integrally with the vibrating region 30 on the surface of the vibrating plate 3 opposite to the individual liquid chamber 6, and the vibrating region 30 and the piezoelectric element 11 constitute a piezoelectric actuator. There is.

  The piezoelectric element 11 is configured by sequentially stacking a lower electrode 13, a piezoelectric layer (piezoelectric body) 12, and an upper electrode 14 from the vibrating region 30 side. An insulating film 21 is formed on the piezoelectric element 11.

  The lower electrode 13 serving as a common electrode of the plurality of piezoelectric elements 11 is connected to the common electrode power supply wiring pattern 121 via the common wiring 15. The lower electrode 13 is, as shown in FIG. 4, one electrode layer formed across all the piezoelectric elements 11 in the nozzle arrangement direction.

  In addition, the upper electrode 14 that is an individual electrode of the piezoelectric element 11 is connected to a drive IC (hereinafter, referred to as “driver IC”) 500 that is a drive circuit unit via an individual wiring 16.

  The driver IC 500 is mounted on the actuator substrate 20 by a method such as flip chip bonding so as to cover a region between the piezoelectric element columns.

  The driver IC 500 mounted on the actuator substrate 20 is connected to the individual electrode power supply wiring pattern 101 to which the driving waveform (driving signal) is supplied.

  The wiring provided on the wiring member 60 is electrically connected to the driver IC 500, and the other end side of the wiring member 60 is connected to the control unit on the apparatus main body side.

  Then, on the actuator substrate 20, there is provided the holding substrate 50 in which the above-mentioned flow path 51, the recessed portion 52 for housing the piezoelectric element 11, and the opening portion 53 for housing the driver IC 500 are formed.

  This holding substrate 50 is bonded to the vibration plate 3 side of the actuator substrate 20 with an adhesive.

  The frame member 70 forms the common liquid chamber 10 that supplies liquid to each individual liquid chamber 6. The common liquid chamber 10 is provided corresponding to each of the four nozzle rows. Further, a liquid of a desired color is supplied to the common liquid chamber 10 from the outside through the liquid supply port 71 (FIG. 1).

  The damper member 90 is joined to the frame member 70. The damper member 90 includes a deformable damper 91 that forms a wall surface of a part of the common liquid chamber 10, and a damper plate 92 that reinforces the damper 91.

  The frame member 70 is joined to the outer peripheral portion of the nozzle plate 1, accommodates the actuator substrate 20 and the holding substrate 50, and constitutes a frame of this head.

  A nozzle cover member 45 is provided to cover the peripheral edge of the nozzle plate 1 and a part of the outer peripheral surface of the frame member 70.

  In this liquid ejection head, by applying a voltage from the driver IC 500 between the upper electrode 14 and the lower electrode 13 of the piezoelectric element 11, the piezoelectric layer 12 extends in the electrode stacking direction, that is, the electric field direction, and is parallel to the vibration region 30. Contract in any direction.

  At this time, since the lower electrode 13 side is constrained by the vibrating region 30, tensile stress is generated on the lower electrode 13 side of the vibrating region 30, the vibrating region 30 bends toward the individual liquid chamber 6 side, and the internal liquid is added. By applying pressure, the liquid is ejected from the nozzle 4.

  Next, a first embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a plan view for explaining a main part of a state before the holding substrate is joined to the actuator substrate, and FIG. 6 is a cross-sectional explanatory diagram for the joint gap portion along the pressure generating element arrangement direction in FIG. is there.

  The individual wirings 16 connected to the upper electrodes 14 of the plurality of piezoelectric elements 11 arranged on the actuator substrate 20 by the contact portions 16A are drawn out and communicate with the driver IC 500 (FIG. 2).

  Therefore, the holding substrate 50 is bonded to the actuator substrate 20 with the adhesive via the plurality of individual wirings 16.

  As shown in FIG. 6, since the insulating film 22 is formed on the surface of the actuator substrate 20 including the individual wirings 16, the spacing between the individual wirings 16 is the spacing in plan view. As shown in FIG. 5, the insulating film 22 is included in the portion shown as the individual wiring 16 in the plan view.

  Here, a region where the holding substrate 50 and the actuator substrate 20 are joined via the plurality of individual wirings 16 is referred to as a joining region 55.

  In the bonding region 55, on the surface of the actuator substrate 20, a region in which the individual wirings 16 exist and a region between the individual wirings 16 (this is referred to as a “gap 17” ").

  In the present embodiment, in the joint region 55, the gap 17 includes a portion 17a having a wide interval having a width La that is an interval between the individual wirings 16 adjacent to each other in the direction in which the pressure generating elements are arranged, and an interval between the individual wirings 16. There is a portion 17b that has a narrow width Lb (Lb<La). Here, the width of the gap is the width of the gap 17 in the in-plane direction of the actuator substrate 20.

  In this case, in the bonding region 55, the portion 17b having a narrow gap is arranged on the pressure generating element (piezoelectric element 11) side, and the portion 17a having a wide gap is arranged on the driver IC 500 side opposite to the pressure generating element side. Has been done.

  Next, the operation of this embodiment will be described with reference to FIGS. 7 and 8. FIG. 7 is an explanatory diagram for explaining the step of joining the holding substrate to the actuator substrate for explaining the same operation, and FIG. 8 is a plan view for explaining a main part of the state where the holding substrate is joined to the actuator substrate.

  When the holding substrate 50 and the actuator substrate 20 are bonded, as shown in FIG. 7, the holding substrate 50 is coated with the adhesive 200 (printing), and the holding substrate 50 and the actuator substrate 20 are aligned to each other with a weak pressure. Temporarily join. Then, alignment is performed again, and as shown by the arrow, the holding substrate 50 and the actuator substrate 20 are pressed against each other for main bonding, and the adhesive 200 is thermally cured by heating while maintaining the pressed state. To join.

  Here, if an incompletely sealed portion is generated in the bonding region 55 where the holding substrate 50 and the actuator substrate 20 are bonded via the plurality of individual wirings 16, a sealing agent (underfill) for mounting the driver IC 500 is formed. The agent) may enter the piezoelectric element 11 side. If the sealant enters the piezoelectric element 11 side, the displacement efficiency of the vibrating region 30 is reduced, the ejection characteristics are degraded, and the ejection characteristics vary among nozzles. In addition, when the liquid enters the piezoelectric element 11 side, defective driving of the piezoelectric element 11 may occur.

  Therefore, it is necessary to reliably seal the driver IC 500 side and the piezoelectric element 11 side, that is, the recess 52 and the opening 53 of the holding substrate 50, in the joint region 55 where the steps are formed in the plurality of individual wirings 16. ..

  In this case, if the amount of the adhesive agent 200 used for joining is increased to secure the sealing property, the adhesive agent 200 flows out to the piezoelectric element 11 side, and the vibration region 30 of the vibrating region 30 is penetrated as in the case where the sealing agent enters. Displacement efficiency is reduced, and discharge characteristics are degraded or vary.

  Therefore, the amount of the adhesive 200 that cannot completely fill the gaps 17 between the individual wirings 16 cannot be supplied, and the film thickness of the adhesive 200 applied to the holding substrate 50 is greater than the height of the gaps 17 in the stacking direction. Also thin.

  As a result, the adhesive 200 and a bubble 201 described later are mixed in the gap 17, so it is necessary to prevent the bubble 201 from communicating between the piezoelectric element 11 side and the driver IC 500 side of the gap 17.

  Therefore, as in the present embodiment, in the joint region 55, the gap 17 between the adjacent individual wirings 16 is provided with the portion 17a having a wide space between the wirings and the portion 17b having a narrow space between the wirings, whereby the joint region 55 is formed. A capillary force difference will occur within the inner clearance 17.

  As a result, when joining with the adhesive 200, the adhesive 200 positively flows out to the portion 17b with a narrow space between the wirings, so that the adhesive 17 reliably fills the portion 17b with a narrow space between the wirings. In addition, since there is a portion 17a where the distance between the wirings is wide, even if the amount of the adhesive agent 200 is increased, the adhesive agent 200 can be accommodated in the gap 17 and flow out to the piezoelectric element side can be suppressed.

  Further, since the bubble 201 is disconnected by the action of the surface tension at the position where the width of the gap 17 changes, the gap 17 is not communicated with the bubble 201.

  As a result, even if the film thickness of the adhesive 200 on the holding substrate 50 side is smaller than the height (step) of the gap 17, the sealability of the gap 17 can be improved, and a margin for variations in the adhesive supply amount can be secured. can do.

  In this way, it is possible to secure a stable sealing property with a small amount of adhesive.

  Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 9 is a plan view of a main part of the state before the holding substrate is joined to the actuator substrate, which is used in the description of the embodiment.

  In the present embodiment, in the bonding region 55, there is a region in which portions 17b and 17b having a narrow space between the wirings are arranged on both sides of the portion 17a having a wide space between the wirings. That is, there is a region in which the interval between the adjacent individual wirings 16 changes in the order of a narrow portion, a wide portion, and a narrow portion.

  Next, the operation of this embodiment will be described with reference to FIG. FIG. 10 is a plan view of a main part of the state where the holding substrate is joined to the actuator substrate for explaining the same operation.

  As in the present embodiment, by arranging the portions 17b, 17b having a narrow gap between the wirings on both sides with the portion 17a having a wide gap between the wirings interposed therebetween, the portion 17a having a wide gap between the wirings is separated by the capillary force difference. Then, the adhesive 200 tries to flow in different directions as shown by the arrow 202. Therefore, the adhesive 200 is easily filled in the portions 17b and 17b in which the distance between the wirings is narrow.

  As a result, air bubbles tend to remain in the portion 17a where the distance between the wirings is wide, and the air bubbles are cut off, so that the sealing property of the gap 17 is improved.

  Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 11 is an explanatory plan view of relevant parts of a state before the holding substrate is joined to the actuator substrate, which is used in the description of the embodiment.

  In the present embodiment, there is a region in the joining region 55 in which portions 17a, 17a having a wide gap between the wirings are arranged on both sides of the portion 17b having a narrow gap between the wirings. That is, there is a region in which the interval between the adjacent individual wirings 16 changes in the order of the wide portion, the narrow portion, and the wide portion.

  Next, the operation of this embodiment will be described with reference to FIG. FIG. 12 is an explanatory plan view of relevant parts showing a state in which the holding substrate is joined to the actuator substrate for explaining the same operation.

  As in the present embodiment, by arranging the portions 17a, 17a having a wide space between the wirings on both sides with the portion 17b having a narrow space between the wirings interposed therebetween, as shown by an arrow 202, due to the capillary force difference, The adhesive 200 flows from the portion 17a where the spacing between the wirings is wide to the portion 17b where the spacing between the wirings is narrow.

  As a result, the adhesive 200 is likely to stay in the portion 17b where the space between the wirings is narrow, and the sealing property of the gap 17 is improved.

  Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 13 is an essential part plan view of the state before the holding substrate is joined to the actuator substrate, which is used in the description of the embodiment.

  In the present embodiment, the space 17 between the adjacent individual wirings 16 includes two crank-shaped portions 18 and has four bends in a plan view shape. Then, the intervals change with the bend angle of the crank-shaped part 18 as a boundary, and the parts 17a having a wide interval between the wires, the parts 17b and 17b having a narrow interval between the wires, and the part 17a having a wide width and the part 17b having a narrow width. And a portion 17c having the narrowest space between the wirings that connect the and.

  Next, the operation of this embodiment will be described with reference to FIG. FIG. 14 is an explanatory plan view of relevant parts showing a state where the holding substrate is joined to the actuator substrate, which is used for explaining the same operation.

  When the gap 17 has a bend, the phenomenon that the bubbles 201 communicate with each other across the bend of the crank-shaped portion 18 due to the effect of the surface tension is unlikely to occur, so that the bubble 201 is easily disconnected at the bend of the crank-shaped portion 18.

  Thereby, the sealing property of the gap 17 is improved.

  Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 15 is an explanatory plan view of relevant parts of a state before the holding substrate is joined to the actuator substrate, which is used in the description of the embodiment.

  In the present embodiment, it has a flat rice shape, and the gap 17 includes four crank-shaped portions 18 and has eight bends. Then, as in the case of the fourth embodiment, the interval changes at the bending angle of the crank-shaped portion 18, and the part 17a in which the interval between the wires is wide and the parts 17b and 17b in which the interval between the wires is narrow are separated from each other. A portion 17c having the narrowest space between the wirings connecting the wide portion 17a and the narrow portion 17b is arranged.

  As the number of bends included in the gap 17 increases, it becomes more difficult for bubbles to pass through the bends due to the effect of surface tension, so that the bubbles are more likely to be disconnected and the sealing property is higher than that in the fourth embodiment. Improve more reliably.

  Next, a sixth embodiment of the present invention will be described with reference to FIG. FIG. 16 is an explanatory plan view of relevant parts of a state before the holding substrate is joined to the actuator substrate, which is used in the description of the embodiment.

  Also in the present embodiment, the shape is flat rice, the gap 17 includes four crank-shaped portions 18, and has eight bends. Then, similar to the fourth embodiment, the interval changes at the bend angle, and the portion 17a having a wide spacing between the wirings, the portions 17b and 17b having a narrow spacing between the wirings, and the portion 17a having a wide width are formed. The portion 17c having the narrowest space between the wirings connecting the narrow portion 17b and the portion 17b is arranged.

  Further, in this embodiment, the length of the portion 17c having the narrowest space between the wirings connecting the wide portion 17a and the narrow portion 17b is made longer than that in the fifth embodiment.

  As a result, the bubbles are more likely to be broken at the corners of the bend than in the fourth embodiment, and the sealing performance is more reliably improved.

  Next, an example of an apparatus for ejecting a liquid according to the present invention will be described with reference to FIGS. 17 and 18. FIG. 17 is a plan view of the main part of the apparatus, and FIG. 18 is a side view of the main part of the apparatus.

  This device is a serial type device, and the carriage 403 reciprocates in the main scanning direction by a main scanning moving mechanism 493. The main scanning moving mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408 and the like. The guide member 401 is bridged between the left and right side plates 491A and 491B and movably holds the carriage 403. Then, the carriage 403 is reciprocated in the main scanning direction by the main scanning motor 405 via the timing belt 408 spanning between the driving pulley 406 and the driven pulley 407.

  The carriage 403 is equipped with a liquid ejection unit 440 in which the liquid ejection head 404 and the head tank 441 according to the present invention are integrated. The liquid ejection head 404 of the liquid ejection unit 440 ejects liquids of yellow (Y), cyan (C), magenta (M), and black (K), for example. Further, the liquid ejection head 404 is arranged such that a nozzle row composed of a plurality of nozzles is arranged in the sub-scanning direction orthogonal to the main scanning direction and the ejection direction is directed downward.

  The liquid stored in the liquid cartridge 450 is supplied to the head tank 441 by the supply mechanism 494 for supplying the liquid stored outside the liquid discharge head 404 to the liquid discharge head 404.

  The supply mechanism 494 includes a cartridge holder 451, which is a filling unit for mounting the liquid cartridge 450, a tube 456, a liquid sending unit 452 including a liquid sending pump, and the like. The liquid cartridge 450 is detachably attached to the cartridge holder 451. The liquid is sent from the liquid cartridge 450 to the head tank 441 by the liquid sending unit 452 via the tube 456.

  This apparatus includes a transport mechanism 495 for transporting the sheet 410. The transport mechanism 495 includes a transport belt 412, which is a transport unit, and a sub-scanning motor 416 for driving the transport belt 412.

  The conveyance belt 412 adsorbs the sheet 410 and conveys it at a position facing the liquid ejection head 404. The conveyor belt 412 is an endless belt, and is stretched between a conveyor roller 413 and a tension roller 414. The adsorption can be performed by electrostatic adsorption or air suction.

  Then, the transport belt 412 is rotated in the sub-scanning direction by the sub-scanning motor 416 rotatably driving the transport roller 413 via the timing belt 417 and the timing pulley 418.

  Further, on one side of the carriage 403 in the main scanning direction, a maintenance/recovery mechanism 420 for maintenance/recovery of the liquid ejection head 404 is arranged beside the transport belt 412.

  The maintenance/recovery mechanism 420 is composed of, for example, a cap member 421 that caps the nozzle surface (surface on which the nozzles are formed) of the liquid ejection head 404, a wiper member 422 that wipes the nozzle surface, and the like.

  The main-scanning moving mechanism 493, the supply mechanism 494, the maintenance/recovery mechanism 420, and the transport mechanism 495 are attached to a housing including side plates 491A and 491B and a back plate 491C.

  In this apparatus configured as described above, the sheet 410 is fed onto the transport belt 412 and adsorbed, and the sheet 410 is transported in the sub-scanning direction by the orbital movement of the transport belt 412.

  Therefore, by moving the carriage 403 in the main scanning direction and driving the liquid ejection head 404 in accordance with the image signal, the liquid is ejected onto the stopped paper 410 to form an image.

  As described above, since this apparatus includes the liquid ejection head according to the present invention, it is possible to stably form a high quality image.

  Next, another example of the liquid ejection unit according to the present invention will be described with reference to FIG. FIG. 19 is an explanatory plan view of relevant parts of the unit.

  The liquid ejection unit includes a housing portion including side plates 491A and 491B and a back plate 491C, a main scanning movement mechanism 493, a carriage 403, and a liquid among the members forming the device that ejects the liquid. It is composed of the ejection head 404.

  It is also possible to configure a liquid discharge unit in which at least one of the maintenance/recovery mechanism 420 and the supply mechanism 494 described above is further attached to, for example, the side plate 491B of this liquid discharge unit.

  Next, still another example of the liquid ejection unit according to the present invention will be described with reference to FIG. FIG. 19 is a front explanatory view of the unit.

  This liquid ejection unit is composed of a liquid ejection head 404 to which a flow path component 444 is attached and a tube 456 connected to the flow path component 444.

  The flow path component 444 is arranged inside the cover 442. A head tank 441 may be included instead of the flow path component 444. Further, a connector 443 for electrically connecting with the liquid ejection head 404 is provided on the flow path component 444.

  In the present application, the “device for ejecting liquid” is a device that includes a liquid ejection head or a liquid ejection unit, and drives the liquid ejection head to eject the liquid. The device for ejecting liquid includes not only a device capable of ejecting a liquid to which a liquid can be attached, but also a device ejecting the liquid toward the air or into the liquid.

  This "device for ejecting liquid" can include a means for feeding, carrying, and discharging paper to which liquid can be attached, as well as a pretreatment device, a posttreatment device, and the like.

  For example, as an “apparatus for ejecting a liquid”, an image forming apparatus that is an apparatus for ejecting a liquid to form an image on a medium, and for forming a three-dimensional object (three-dimensional object), powder is formed in layers. There is a three-dimensional modeling device (three-dimensional modeling device) that discharges the modeling liquid to the powder layer.

  Further, the “device for ejecting liquid” is not limited to a device in which a significant image such as characters and figures is visualized by the ejected liquid. For example, it also includes ones that form a pattern or the like that has no meaning per se, and ones that form a three-dimensional image.

  The above-mentioned "liquid can be adhered" means a liquid that can be temporarily adhered. The material to which "liquid adheres" may be paper, thread, fiber, cloth, leather, metal, plastic, glass, wood, ceramics, etc., as long as the liquid can adhere to it even temporarily.

  The "liquid" also includes ink, treatment liquid, DNA sample, resist, pattern material, binder, modeling liquid and the like.

  Further, the “apparatus for ejecting liquid” includes both a serial type apparatus that moves the liquid ejecting head and a line type apparatus that does not move the liquid ejecting head unless otherwise limited.

  In addition, as the "apparatus for ejecting liquid", a treatment liquid application device for ejecting the treatment liquid onto the paper in order to apply the treatment liquid to the surface of the paper for the purpose of modifying the surface of the paper, raw materials, etc. There is an injection granulation device that granulates the fine particles of the raw material by injecting a composition liquid in which is dispersed in a solution through a nozzle.

  The “liquid ejection unit” is a unit in which functional components and mechanisms are integrated with a liquid ejection head, and is a collection of components related to liquid ejection. For example, the “liquid ejection unit” includes a combination of a liquid ejection head with at least one of the configurations of a head tank, a carriage, a supply mechanism, a maintenance/recovery mechanism, and a main scanning movement mechanism.

  Here, the term "integral" means, for example, a liquid discharge head, a functional component, and a mechanism that are fixed to each other by fastening, bonding, engaging, or the like, or one that is movably held with respect to the other. Including. Further, the liquid ejection head, the functional component, and the mechanism may be configured to be detachable from each other.

  For example, as a liquid ejection unit, there is one in which a liquid ejection head and a head tank are integrated, like the liquid ejection unit 440 shown in FIG. In addition, there is one in which the liquid ejection head and the head tank are integrated by being connected to each other by a tube or the like. Here, a unit including a filter may be added between the head tank and the liquid ejection head of these liquid ejection units.

  Further, as a liquid ejection unit, there is one in which a liquid ejection head and a carriage are integrated.

  Further, as a liquid ejection unit, there is a unit in which a liquid ejection head and a scanning movement mechanism are integrated so that a liquid ejection head is movably held by a guide member forming a part of the scanning movement mechanism. Further, as shown in FIG. 19, there is a liquid ejection unit in which a liquid ejection head, a carriage, and a main scanning movement mechanism are integrated.

  Further, as a liquid ejection unit, there is a unit in which a cap member that is a part of a maintenance/recovery mechanism is fixed to a carriage to which a liquid ejection head is attached, and the liquid ejection head, the carriage, and the maintenance/recovery mechanism are integrated. ..

  Further, as a liquid ejection unit, as shown in FIG. 20, there is one in which a tube is connected to a liquid ejection head to which a head tank or a flow path component is attached, and the liquid ejection head and the supply mechanism are integrated. ..

  The main scanning movement mechanism includes a single guide member. The supply mechanism also includes a tube unit and a loading unit unit.

  Further, the “liquid ejection head” is not limited to the pressure generating means used. For example, in addition to the piezoelectric actuator (which may use a laminated piezoelectric element) described in the above embodiment, a thermal actuator using an electrothermal conversion element such as a heating resistor, a vibration plate and a counter electrode are used. An electrostatic actuator or the like may be used.

  Further, in the terms of the present application, image formation, recording, printing, printing, printing, modeling, etc. are synonymous.

1 Nozzle Plate 2 Channel Plate 3 Vibration Plate 4 Nozzle 6 Individual Liquid Chamber 10 Common Liquid Chamber 11 Piezoelectric Element 14 Upper Electrode (Individual Electrode)
16 Individual wiring 20 Actuator substrate 50 Holding substrate 60 Wiring member 70 Frame member 200 Adhesive 403 Carriage 404 Liquid ejection head 440 Liquid ejection unit 500 Driver IC (driving circuit section)

Claims (4)

An actuator substrate on which a plurality of pressure generating elements are arranged,
A holding substrate formed with a recess for accommodating the pressure generating element,
Part of the holding substrate is connected to the pressure generating element, is bonded to the actuator substrate with an adhesive via a plurality of wirings arranged in the direction in which the pressure generating elements are arranged,
In a joining region where the holding substrate and the actuator substrate are joined via the plurality of wirings, a portion where the spacing between the wirings adjacent to each other in the direction in which the pressure generating elements are arranged is wide and a spacing between the wirings is narrow. Part and
In a plan view, including a crank-shaped portion between the wiring,
A liquid ejection head, wherein the intervals between the wirings are different from each other with a bending angle of the crank-shaped portion as a boundary. A liquid ejection unit comprising the liquid ejection head according to claim 1 . A head tank that stores the liquid to be supplied to the liquid ejection head, a carriage that mounts the liquid ejection head, a supply mechanism that supplies the liquid to the liquid ejection head, a maintenance and recovery mechanism that performs maintenance and recovery of the liquid ejection head, and the liquid The liquid ejection unit according to claim 2 , wherein at least one of the main scanning movement mechanisms for moving the ejection head in the main scanning direction is integrated with the liquid ejection head. An apparatus for ejecting a liquid , comprising the liquid ejection head according to claim 1 or the liquid ejection unit according to claim 2 or 3 .

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