JP6698343B2 - Conductive film - Google Patents

Description

  The present invention relates to a conductive film.

  Conventionally, it is known that a large-sized touch panel has a transparent conductive structure having a blackened metal mesh.

  To obtain such a transparent conductive structure, for example, a laminate in which a metal conductive layer made of copper is formed on the upper surface and the lower surface of a PET transparent substrate, and then an antireflection layer made of black metal is formed is used. After that, the metal conductive layer and the antireflection layer are etched into a mesh shape by a lithography process (see, for example, Patent Document 1).

  In Patent Document 1, the metal includes one selected from the group consisting of nickel, titanium, molybdenum, chromium, copper, zinc, tin and alloys thereof.

JP, 2005-60585, A

  However, the transparent conductive structure may be placed in a high temperature and high humidity atmosphere. However, the antireflection layer having the transparent conductive structure of Patent Document 1 has a problem that the blackness is lowered in such a case. Then, there is a problem that the mesh shape is easily visible on the touch panel.

  An object of the present invention is to provide a conductive film provided with a blackening layer that can suppress a decrease in blackness even in a high temperature and high humidity atmosphere.

  The present invention [1] includes a transparent base material and a conductive layer disposed on the upper side of the transparent base material, and the conductive layer is provided on at least one of a copper layer and an upper surface or a lower surface of the copper layer. A blackened layer that is disposed, the blackened layer containing a metal component and oxygen, and the metal component includes a conductive film containing molybdenum.

  The present invention [2] includes the conductive film according to [1], wherein the molybdenum content in the metal component is 5 atomic% or more and 80 atomic% or less.

  In the present invention [3], the metal component further contains iron of 20 atomic% or more and 95 atomic% or less, and indium of 0.1 atomic% or more and 23 atomic% or less, [1] or [2]. Including a conductive film.

  The present invention [4] includes the conductive film according to any one of [1] to [3], wherein the blackening layer is disposed on the upper surface of the copper layer.

  The present invention [5] includes the conductive film according to [4], wherein the blackened layer has a thickness of 40 nm or more and 60 nm or less.

  The present invention [6] includes the conductive film according to any one of [1] to [3], wherein the blackening layer is disposed on the lower surface of the copper layer.

  The present invention [7] includes the conductive film according to [6], wherein the blackened layer has a thickness of 60 nm or more and 70 nm or less.

  In the conductive film of the present invention, the blackening layer contains a metal component and oxygen, and the metal component contains molybdenum, so that it is possible to suppress the decrease in the blackness of the blackening layer even in a high temperature and high humidity atmosphere. You can Therefore, it is possible to manufacture a conductive film that is excellent in the visibility suppressing property of the conductive layer.

FIG. 1 shows a sectional view of a first conductive film which is a first embodiment of the conductive film of the present invention. FIG. 2 shows a sectional view of a second conductive film which is a second embodiment of the conductive film of the present invention. FIG. 3 shows a sectional view of a third conductive film which is a third embodiment of the conductive film of the present invention. FIG. 4 shows an exploded cross-sectional view of the third conductive film shown in FIG. FIG. 5 shows a cross-sectional view of a fourth conductive film which is a fourth embodiment of the conductive film of the present invention. FIG. 6 shows a sectional view of a fifth conductive film which is a fifth embodiment of the conductive film of the present invention. FIG. 7: shows sectional drawing of the 6th conductive film which is 6th Embodiment of the conductive film of this invention. FIG. 8: shows sectional drawing of the 7th conductive film which is 7th Embodiment of the conductive film of this invention.

<First Embodiment>
In FIG. 1, the vertical direction of the paper is the vertical direction (thickness direction, viewing direction, first direction), and the upper side of the paper is the upper side (one side in the thickness direction, viewing side (upstream side in the viewing direction), one direction Side), the lower side of the drawing is the lower side (the other side in the thickness direction, the side opposite to the viewing side (downstream side in the viewing direction), the other side in the first direction). The left-right direction of the paper is the left-right direction (second direction), the right side of the paper is the right side (one side in the second direction), and the left side of the paper is the left side (the other side in the second direction). The paper thickness direction is the front-back direction (third direction), the front side of the paper is the front side (one side in the third direction), and the back side is the rear side (the other side in the third direction). Hereinafter, unless otherwise stated, the directions follow the directional arrows described in each figure.

1. First conductive film As shown in FIG. 1, the first conductive film 1 has a film shape (including a sheet shape) having a predetermined thickness, and a predetermined direction (front-back direction and left-right direction) orthogonal to the thickness direction. Direction, that is, the surface direction), and has a flat upper surface and a flat lower surface (two main surfaces). The first conductive film 1 is, for example, one component such as a base material for a touch panel provided in the image display device, that is, not the image display device. That is, the first conductive film 1 is a component for producing an image display device and the like, is a device that does not include an image display element such as an LCD module and is distributed as a component alone and is industrially usable.

  Specifically, as shown in FIG. 1, the first conductive film 1 includes a transparent base material 2 and a conductive layer 3 in order. That is, the first conductive film 1 includes the transparent base material 2 and the conductive layer 3 arranged on the upper side of the transparent base material 2. The first conductive film 1 preferably includes only the transparent substrate 2 and the conductive layer 3.

2. Transparent Base Material The transparent base material 2 has a film shape (including a sheet shape) having a predetermined thickness, extends in the surface direction, and has a flat upper surface and a flat lower surface (two main surfaces). The transparent substrate 2 is the lowermost layer of the first conductive film 1 and is a support material that secures the mechanical strength of the first conductive film 1. The transparent substrate 2 supports the conductive layer 3.

  The transparent substrate 2 is, for example, a polymer film having transparency. Examples of the material for the polymer film include polyester resins such as polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate, and (meth)acrylic resins (acrylic resin and/or methacrylic resin) such as polymethacrylate, for example, Olefin resins such as polyethylene, polypropylene and cycloolefin polymers, for example, polycarbonate resins, polyether sulfone resins, polyarylate resins, melamine resins, polyamide resins, polyimide resins, cellulose resins, polystyrene resins, norbornene resins and the like. These polymer films can be used alone or in combination of two or more kinds. From the viewpoints of transparency, heat resistance, mechanical properties, etc., a polyester resin is preferable, and a PET is more preferable.

  The transparent substrate 2 has a thickness of, for example, 2 μm or more, preferably 20 μm or more, and for example, 200 μm or less, preferably 150 μm or less.

  In addition, a hard coat layer, an antiblocking layer, an easy-adhesion layer, an adhesive layer, a separator and the like can be provided on the lower surface of the transparent substrate 2, if necessary.

3. Conductive Layer The conductive layer 3 has a film shape (including a sheet shape) having a predetermined thickness, extends in the surface direction, and has a flat upper surface and a flat lower surface (two main surfaces). The conductive layer 3 has conductivity and is a layer that is patterned in a later step. The conductive layer 3 includes a copper layer 4 and a blackening layer 5 arranged on the upper surface of the copper layer 4. That is, the conductive layer 3 includes the copper layer 4 and the blackening layer 5 in order. The conductive layer 3 preferably consists only of the copper layer 4 and the blackening layer 5. Therefore, the first conductive film 1 is provided with the transparent substrate 2, the copper layer 4, and the blackening layer 5 in order.

4. Copper Layer The copper layer 4 is arranged on the entire upper surface of the transparent substrate 2. That is, the copper layer 4 is in direct contact with the upper surface of the transparent substrate 2. The copper layer 4 has a film shape (including a sheet shape) having a predetermined thickness, extends in the surface direction, and has a flat upper surface and a flat lower surface (two main surfaces).

  The copper layer 4 contains, for example, copper as a main component, and also allows the inclusion of other trace components (such as impurities). The copper layer 4 preferably consists only of copper.

  The thickness of the copper layer 4 is, for example, 50 nm or more, preferably 100 nm or more, and for example, 2000 nm or less.

5. Blackening Layer The blackening layer 5 is the uppermost layer of the first conductive film 1. The blackening layer 5 is a layer that suppresses the visibility of the conductive layer 3 due to the metallic luster of the copper layer 4 (that is, a visibility suppressing layer that imparts the visibility suppression property to the conductive layer 3). The blackened layer 5 is arranged on the entire upper surface of the copper layer 4. Specifically, the blackening layer 5 is in direct contact with the upper surface of the copper layer 4. The blackening layer 5 has a film shape (including a sheet shape) having a predetermined thickness, extends in the plane direction, and has a flat upper surface and a flat lower surface (two main surfaces).

5-1. Main component (molybdenum)
The blackening layer 5 is made of a blackening component. The blackening component contains a metal component and oxygen.

  The oxygen content ratio is the balance of the metal component in the blackening component.

  The metal component contains molybdenum as a main component.

  The content ratio of molybdenum in the metal component is, for example, 5 atomic% or more, preferably 15 atomic% or more, and more preferably 25 atomic% or more. Further, the content ratio of molybdenum in the metal component is, for example, 80 atomic% or less, preferably 60 atomic% or less, and more preferably 50 atomic% or less.

  When the content ratio of molybdenum is at least the above lower limit, the moist heat resistance of the blackening layer 5 can be improved. Specifically, it is possible to prevent the blackness of the blackening layer 5 from decreasing even after a long time in a high temperature and high humidity atmosphere.

  The content ratio (atomic percentage) of molybdenum is determined by X-ray photoelectron spectroscopy (XPS) (ESCA).

5-2. Secondary components (iron, indium)
The metal component preferably further contains iron and/or indium as a sub-component. Preferably, the metal component consists only of molybdenum, iron and indium.

  The content ratio of iron in the metal component is, for example, 20 atomic% or more, preferably 30 atomic% or more, and more preferably 40 atomic% or more. The content ratio of iron in the metal component is, for example, 95 atomic% or less, preferably 85 atomic% or less, and more preferably 75 atomic% or less.

  The atomic ratio of iron to molybdenum (iron/molybdenum) is, for example, 0.25 or more, preferably 1.0 or more, and, for example, 19 or less, preferably 2.0 or less.

  The content ratio of indium in the metal component is, for example, 0.1 atomic% or more, preferably 0.5 atomic% or more, and more preferably 1 atomic% or more. The content ratio of indium in the metal component is, for example, 23 atomic% or less, preferably 15 atomic% or less, more preferably 10 atomic% or less.

  The atomic ratio of indium to molybdenum (indium atom/molybdenum atom) is, for example, 0.01 or more, preferably 0.015 or more, and for example, 4.0 or less, preferably 0.5 or less. ..

  When the above-mentioned ratio of iron and indium is at least the above lower limit, the moist-heat resistance of the blackening layer 5 can be further improved. When the content ratio of iron and indium is equal to or less than the above upper limit, it is possible to suppress the decrease in blackness in the initial state.

  When the metal component contains both iron and indium, the atomic ratio of iron to indium (iron/indium) is, for example, 4.0 or more, preferably 10 or more, and, for example, 75 or less, It is preferably 30 or less. When the atomic ratio of iron to indium is at least the above lower limit, the heat and humidity resistance can be further improved by the addition of the subcomponent. When the atomic ratio of iron to indium is equal to or less than the above upper limit, the etching rate of the blackened film can be increased.

  The content ratio (atomic percentage) of each of iron and indium is determined by X-ray photoelectron spectroscopy (XPS) (ESCA).

5-3. Other physical properties of the blackening layer The surface roughness of the blackening layer 5 is, for example, 0.1 nm or more, preferably 0.2 nm or more, and for example, 2.0 nm or less, preferably 0. It is 7 nm or less. When the surface roughness of the blackened layer 5 is equal to or higher than the above lower limit and equal to or lower than the above upper limit, the blackness of the blackened layer 5 can be improved. The surface roughness of the blackened layer 5 is obtained by atomic force microscopy (AFM).

  Total light reflectance of the blackening layer 5 (specifically, total light rays of the blackening layer 5 within 1 hour at room temperature (25° C.) and normal humidity (20 to 90% RH) after the blackening layer 5 is formed. Reflectance. The following optical properties of the blackening layer 5 are the same as the above.) is, for example, 30% or less, preferably 25% or less, more preferably 20% or less, further preferably 17% or less, and especially It is preferably 15% or less, most preferably 10% or less, and for example 0% or more.

  The a* of the blackening layer 5 is, for example, 1 or less, preferably 0 or less, more preferably -1 or less, still more preferably -5 or less, particularly preferably -6 or less, and most preferably -7. It is 0.5 or less, and for example, is -25 or more, preferably -15 or more. When a* of the blackening layer 5 is equal to or more than the above lower limit, it is possible to suppress red color development of the conductive layer 3 and improve the blackness of the conductive layer 3. When a* of the blackening layer 5 is equal to or less than the above upper limit, it is possible to suppress the green color development of the conductive layer 3 and improve the blackness of the conductive layer 3.

  B* of the blackening layer 5 is, for example, 0 or less, preferably -5 or less, more preferably -10 or less, still more preferably -15 or less, and, for example, -40 or more, preferably, -30 or more, more preferably -20 or more. When b* of the blackening layer 5 is equal to or lower than the above upper limit, it is possible to suppress the yellow coloration of the conductive layer 3 and improve the blackness of the conductive layer 3. When b* of the blackening layer 5 is equal to or more than the above lower limit, it is possible to suppress blue color development of the conductive layer 3 and improve the blackness of the conductive layer 3.

  L* of the blackening layer 5 is, for example, 50 or less, preferably 45 or less, more preferably 40 or less, most preferably 35 or less, and, for example, 30 or more. When L* of the blackening layer 5 is equal to or lower than the above upper limit, the brightness of the conductive layer 3 can be suppressed and the blackness of the conductive layer 3 can be improved.

5-4. Thickness of Blackened Layer The thickness of the blackened layer 5 is, for example, 10 nm or more, preferably 40 nm or more, and for example, 90 nm or less, preferably 60 nm or less. If the thickness of the blackening layer 5 is equal to or more than the above lower limit or equal to or less than the upper limit, the absolute values of L, a* and/or b* obtained by reflected light measurement (described later) can be reduced. Therefore, the blackness of the blackening layer 5 can be improved.

6. Method for Manufacturing Conductive Film Next, a method for manufacturing the first conductive film 1 will be described.

  In the first conductive film 1, the following layers are manufactured by, for example, a roll-to-roll method.

  In this method, first, the transparent base material 2 is prepared.

  After that, the conductive layer 3 is arranged on the upper side of the transparent substrate 2.

  To arrange the conductive layer 3 on the upper side of the transparent base material 2, for example, first, the copper layer 4 is arranged on the entire upper surface of the transparent base material 2.

  In order to arrange the copper layer 4 on the entire upper surface of the transparent base material 2, for example, the copper layer 4 is arranged on the upper surface of the transparent base material 2 by a dry method or a wet method. Preferably, the copper layer 4 is formed by a dry method.

  Examples of the dry method include a vacuum vapor deposition method, a sputtering method, an ion plating method and the like. A sputtering method is preferable.

  Then, the blackening layer 5 is arranged on the entire upper surface of the copper layer 4.

  To arrange the blackening layer 5 on the entire upper surface of the copper layer 4, the blackening layer 5 is arranged on the upper surface of the copper layer 4 by, for example, a dry method.

  Examples of the dry method include a vacuum vapor deposition method, a sputtering method, an ion plating method and the like. A sputtering method is preferable. Specifically, a magnetron sputtering method can be used.

  When the sputtering method is adopted, the sputtering target may be a compound containing the above-mentioned main component and sub-components in the above-mentioned proportions. A commercial item can be used as such a compound.

  Examples of the gas used in the sputtering method include an inert gas such as argon. Further, if necessary, a reactive gas such as oxygen may be used together in an appropriate ratio. Preferably, an inert gas is used as the gas.

  Thereby, the conductive layer 3 including the copper layer 4 and the blackening layer 5 is arranged on the upper side of the transparent substrate 2.

  Thereby, the first conductive film 1 including the transparent substrate 2, the copper layer 4, and the blackening layer 5 in order is obtained.

  Thereafter, in the first conductive film 1, although not shown, the conductive layer 3 is formed in a pattern by etching. Examples of the pattern of the conductive layer 3 include a wiring-shaped pattern that is spaced from each other in the left-right direction and extends in the front-rear direction.

  After that, the first conductive film 1 is included in an image display device including an input device such as a touch panel. Examples of the image display device include a liquid crystal display device, an organic EL (electroluminescence) display device, an inorganic EL display device, a PDP (plasma display panel), electronic paper, a CRT, an LD display, a field emission display and the like.

  As an example of a liquid crystal display device including the first conductive film 1, the liquid crystal display device includes, for example, a liquid crystal display module, a polarizing plate, a first conductive film 1, and a protective glass in order toward the viewing side. I have it. In the first conductive film 1, the blackening layer 5 is located on the viewing side (upper side) with respect to the copper layer 4. Thereby, the blackening layer 5 can be interposed between the viewer and the copper layer 4.

7. In this first conductive film 1, the blackening layer 5 contains a metal component and oxygen, and the metal component contains molybdenum, so that the blackening layer 5 is black even in a high temperature and high humidity atmosphere. It is possible to suppress a decrease in degree. Therefore, it is possible to manufacture the first conductive film 1 that is excellent in the visibility suppressing property of the conductive layer 3.

  In addition, in the first conductive film 1, if the content ratio of molybdenum in the metal component is equal to or more than the above lower limit, the moist heat resistance can be improved. Specifically, it is possible to prevent the blackness of the blackening layer 5 from decreasing even after a long time in a high temperature and high humidity atmosphere.

  In addition, in the first conductive film 1, if the metal component further contains iron and indium, respectively, which are equal to or more than the above lower limits, the moist heat resistance can be improved.

  Further, in this first conductive film 1, since the blackening layer 5 is arranged on the upper surface of the copper layer 4, the visibility of the conductive layer 3 from above can be suppressed.

  In the first conductive film 1, if the thickness of the blackening layer 5 is equal to or more than the above lower limit or equal to or less than the upper limit, L, a* and/or b* obtained by reflected light measurement. Can be reduced, and the blackness of the blackening layer 5 can be improved. Therefore, it is possible to have excellent visibility suppressing property from above the conductive layer 3.

<Second Embodiment>
In the second embodiment, the same members and steps as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

  In FIG. 2, the lower side of the drawing is the viewing side (upstream in the viewing direction), and the upper side of the drawing is the side opposite to the viewing (downstream in the viewing direction).

  In the first conductive film 1 of the first embodiment, as shown in FIG. 1, the blackening layer 5 is arranged on the upper surface of the copper layer 4. However, in the second conductive film 11 of the second embodiment, as shown in FIG. 2, the blackening layer 5 is arranged on the lower surface of the copper layer 4.

  That is, the second conductive film 11 includes the transparent base material 2, the blackening layer 5, and the copper layer 4 in order.

  The blackening layer 5 is arranged on the entire upper surface of the transparent substrate 2 and the entire lower surface of the copper layer 4. That is, the blackening layer 5 is in direct contact with the upper surface of the transparent substrate 2 and the lower surface of the copper layer 4.

  The thickness of the blackening layer 5 is, for example, 10 nm or more, preferably 60 nm or more, and for example, 90 nm or less, preferably 70 nm or less. If the thickness of the blackening layer 5 is equal to or more than the above lower limit or equal to or less than the above upper limit, the absolute values of L, a* and/or b* obtained by reflected light measurement can be reduced, and the black The blackness of the chemical conversion layer 5 can be improved. Therefore, it is possible to have excellent visibility suppressing property from above the conductive layer 3.

  The copper layer 4 is the uppermost layer of the second conductive film 11 and is arranged on the entire upper surface of the blackening layer 5. As a result, the blackened layer 5 is sandwiched between the transparent base material 2 and the copper layer 4. That is, the blackening layer 5 is interposed between the transparent substrate 2 and the copper layer 4.

  In order to manufacture the second conductive film 11, first, the transparent base material 2 is prepared, then the blackening layer 5 is arranged on the upper surface of the transparent base material 2, and then the copper layer 4 is placed on the blackening layer. 5 is placed on the upper surface.

  In the first conductive film 1 of the liquid crystal display device including the second conductive film 11, the blackening layer 5 is located on the visible side (lower side) of the copper layer 4. Thereby, the blackening layer 5 can be interposed between the viewer and the copper layer 4.

  The second conductive film 11 of the second embodiment can achieve the same operational effect as the first conductive film 1 of the first embodiment.

  In particular, in the second conductive film 11, since the blackening layer 5 is arranged on the lower surface of the copper layer 4, the visibility of the conductive layer 3 from below can be suppressed.

  Further, in the second conductive film 11, if the thickness of the blackening layer 5 is equal to or more than the above lower limit or equal to or less than the upper limit, L, a* and/or b* obtained by reflected light measurement. Can be reduced, and the blackness of the blackening layer 5 can be improved. Therefore, it is possible to have excellent visibility suppressing property from below the conductive layer 3.

<Third Embodiment>
In the third embodiment, the same members and steps as those in the first and second embodiments are designated by the same reference numerals, and detailed description thereof will be omitted.

  In the first conductive film 1 of the first embodiment and the second conductive film 11 of the second embodiment, one conductive layer 3 is arranged only on the upper side of the transparent substrate 2. However, as shown in FIG. 3, in the third conductive film 21 of the third embodiment, each of the two conductive layers 3 is located above the one transparent base material 2 and below the other transparent base material 2. Located on each side of the side.

  The third conductive film 21 is obtained, for example, by bonding the first conductive film 1 and the second conductive film 11 via the adhesive layer 6 as shown in FIG. Specifically, the transparent base material 2 (first transparent base material 12) of the first conductive film 1 and the transparent base material 2 (second transparent base material 22) of the second conductive film 11 are bonded to each other with an adhesive layer. The third conductive film 21 is obtained by bonding via 6.

  The adhesive layer 6 is formed in a sheet shape from an adhesive composition such as an acrylic adhesive composition. The adhesive layer 6 has a thickness of, for example, 5 μm or more and, for example, 250 μm or less.

  As shown in FIG. 3, the third conductive film 21 includes a conductive layer 3 (first conductive layer 13), a first transparent base material 12, an adhesive layer 6, a second transparent base material 22, and a conductive layer 3 (second conductive layer). The conductive layer 23) is sequentially provided. Specifically, the third conductive film 21 includes a copper layer 4 (first copper layer 14), a blackening layer 5 (first blackening layer 15), a first transparent base material 12, an adhesive layer 6, and a second layer. The transparent substrate 22, the copper layer 4 (second copper layer 24) and the blackened layer 5 (second blackened layer 25) are provided in this order.

  Further, the two conductive layers 3 of the third conductive film 21 are formed in mesh patterns having different shapes. That is, for example, the first conductive layers 13 are spaced from each other in the left-right direction and have wiring-shaped patterns extending in the front-rear direction, while the second conductive layers 23 are spaced from each other in the front-rear direction and in the left-right direction. It has an extending wiring shape pattern.

  Then, the third conductive film 21 includes two conductive layers 3. Specifically, since the third conductive film 21 can include two types of conductive layers 3 having different pattern shapes, the first conductive film 1 and the second conductive film 11 including one conductive layer 3 are provided. The position and movement of the operator's (viewer's) finger can be detected with higher accuracy than in (1).

<Fourth Embodiment>
In the fourth embodiment, the same members and steps as those in the first to third embodiments are designated by the same reference numerals, and detailed description thereof will be omitted.

  The third conductive film 21 of the third embodiment includes two transparent base materials 2 (first transparent base material 12 and second transparent base material 22) as shown in FIG. However, as shown in FIG. 5, the fourth conductive film 31 includes one transparent base material 2. The fourth conductive film 31 preferably includes only one transparent base material 2.

  As shown in FIG. 5, the fourth conductive film 31 includes a first conductive layer 13, a transparent base material 2 and a second conductive layer 23 in order. Specifically, the fourth conductive film 31 includes a first copper layer 14, a first blackened layer 15, a transparent base material 2, a second copper layer 24, and a second blackened layer 25 in order.

  To obtain the fourth conductive film 31, the transparent substrate 2 is first prepared, then the first blackening layer 15 is arranged, and then the first copper layer 14 and the second copper layer 24 (simultaneously ), and then the second blackening layer 25 is arranged. Alternatively, the order of the arrangement of the first blackened layer 15 and the arrangement of the first copper layer 14 and the second copper layer 24 can be exchanged.

  The fourth conductive film 31 includes one transparent base material 2 as shown in FIG. 5, and therefore, compared to the third conductive film 21 including two transparent base materials 2 shown in FIG. Therefore, it is possible to reduce the thickness.

<Fifth Embodiment>
In the fifth embodiment, the same members and steps as those in the first to fourth embodiments are designated by the same reference numerals, and detailed description thereof will be omitted.

  In the third embodiment, the third conductive film 21 shown in FIG. 3 includes two types of conductive films having different layer configurations (specifically, the first conductive film 1 shown in FIG. It is obtained by superimposing the second conductive film 11) shown in 2. On the other hand, in the fifth embodiment, as shown in FIG. 6, two kinds of conductive films of the same layer structure (specifically, the first conductive film 1 shown in FIG. 1) are overlapped. Is obtained by

  In the fifth conductive film 41, the two first conductive films 1 are superposed in the thickness direction. Specifically, the blackened layer 5 of the one (lower side) first conductive film 1 and the transparent substrate 2 of the other (upper side) first conductive film 1 are interposed via an adhesive layer 6. To glue.

  The fifth conductive film 41 includes a transparent base material 2, a copper layer 4, a blackening layer 5, an adhesive layer 6, a transparent base material 2, a copper layer 4 and a blackening layer 5 in order.

  Since the fifth conductive film 41 of the fifth embodiment is manufactured from one kind of conductive film having the same layer structure, it is manufactured from two kinds of conductive films 1 having different layer structures as shown in FIG. It can be obtained at a lower cost than the third conductive film 21.

<Sixth Embodiment>
In the sixth embodiment, the same members and steps as those in the first to fifth embodiments are designated by the same reference numerals, and detailed description thereof will be omitted.

  In the first conductive film 1 of the first embodiment and the second conductive film 11 of the second embodiment, one blackening layer 5 is arranged only on one of the upper surface and the lower surface of the copper layer 4. ing. However, as shown in FIG. 7, in the sixth conductive film 51 of the sixth embodiment, each of the two blackening layers 5 is arranged on each of the upper surface and the lower surface of the conductive layer 3.

  As shown in FIG. 7, in the sixth conductive film 51, the two blackening layers 5 are arranged so as to sandwich the copper layer 4. The blackened layer 5 includes a second blackened layer 25 and a first blackened layer 15.

  The second blackened layer 25 is arranged on the entire upper surface of the copper layer 4. Specifically, the second blackening layer 25 is in direct contact with the upper surface of the copper layer 4. The second blackening layer 25 is the uppermost layer of the sixth conductive film 51. The second blackening layer 25 shown in FIG. 7 has the same structure as the blackening layer 5 shown in FIG.

  As shown in FIG. 7, the first blackening layer 15 is arranged on the entire upper surface of the transparent substrate 2 and the entire lower surface of the copper layer 4. Specifically, the first blackening layer 15 is in direct contact with the upper surface of the transparent substrate 2 and the lower surface of the copper layer 4. The first blackening layer 15 shown in FIG. 7 has the same structure as the blackening layer 51 shown in FIG.

  Therefore, the conductive layer 3 is provided with the first blackened layer 15, the copper layer 4, and the second blackened layer 25 in this order toward the upper side. The sixth conductive film 51 includes the transparent substrate 2, the first blackening layer 15, the copper layer 4, and the second blackening layer 25 in order.

<Seventh Embodiment>
In the seventh embodiment, the same members and steps as those in the first to sixth embodiments are designated by the same reference numerals, and detailed description thereof will be omitted.

  In the sixth embodiment, as shown in FIG. 7, one conductive layer 3 is arranged only on the upper side of the transparent base material 2. However, as shown in FIG. 8, in the seventh conductive film 61 of the seventh embodiment, each of the two conductive layers 3 is arranged on each of the upper side and the lower side of the transparent substrate 2.

  Each of the two conductive layers 3 comprises a copper layer 4 and two blackened layers 5.

  Therefore, the seventh conductive film 61 includes the blackening layer 5, the copper layer 4, the blackening layer 5, the transparent substrate 2, the blackening layer 5, the copper layer 4, and the blackening layer 5 in this order. Specifically, the seventh conductive film 61 includes the second blackening layer 25, the copper layer 4, the first blackening layer 15, the transparent substrate 2, the first blackening layer 15, the copper layer 4 and the second blackening layer. 25 are provided in order.

  Further, one of the two conductive layers 3 has a wiring shape pattern which is spaced from each other in the left-right direction and extends in the front-rear direction, and one of which is spaced from each other in the front-rear direction and extends in the left-right direction. Has a shape pattern.

  Then, the seventh conductive film 61 includes two conductive layers 3. Specifically, since the seventh conductive film 61 can include two types of conductive layers 3 having different pattern shapes, the operator (compared to the sixth conductive film 51 including one conductive layer 3) The position and movement of the finger of a viewer can be detected with higher accuracy.

  Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples. The present invention is not limited to the examples and comparative examples. Further, specific numerical values such as a mixing ratio (content ratio), a physical property value, and a parameter used in the following description are described in the above-mentioned "Description of Embodiments", and a corresponding mixing ratio ( Content ratio), physical property values, parameters, etc. may be replaced by the upper limit (values defined as “below” or “less than”) or the lower limit (value defined as “greater than or equal to” or “exceeded”). it can.

Example 1
First, a transparent base material 2 made of a PET film (manufactured by Mitsubishi Plastics, Inc., product name “LC-50ABN”) having a thickness of 50 μm was prepared.

  Subsequently, the copper layer 4 having a thickness of 230 nm was formed on the upper surface of the transparent substrate 2 by the DC magnetron sputtering method. The sputtering conditions were as follows.

Target material: Copper gas: Argon Decompression degree: 400×10 ⁻³ Pa
Then, the blackened layer 5 having a thickness of 60 nm was formed on the upper surface of the copper layer 4 by the DC magnetron sputtering method. The sputtering conditions were as follows.

Target material: Metal component (metal component containing molybdenum as a main component and iron and indium as a subcomponent), and oxygen-containing blackening component (product name "MMCB10", manufactured by Mitsubishi Materials Corporation)
Gas: Argon Decompression degree: 400×10 ⁻³ Pa
Thereby, the conductive layer 3 including the copper layer 4 and the blackened layer 5 was formed.

  Thereby, as shown in FIG. 1, the 1st electroconductive film 1 provided with the transparent base material 2 and the electroconductive layer 3 in order was manufactured.

Comparative Example 1
In forming the blackening layer 5, a NiZn plating solution was used to perform a NiZn film formation process by electrolytic plating to obtain a first conductive film 1 (conductive film).

Comparative example 2
By the same DC magnetron sputtering method as in Example 1, the conductive layer 3 was formed only on the copper layer 4 having a thickness of 230 nm on the upper surface of the transparent substrate 2 to obtain the first conductive film 1. That is, the first conductive film 1 did not include the blackening layer 5.

Examples 2-5
A first conductive film 1 was obtained by the same process as in Example 1 except that the time in the DC magnetron sputtering method was changed and the thickness of the blackening layer 5 was set as shown in Table 2.

Examples 6 and 7
The same procedure as in Example 1 was performed except that the order of forming the copper layer 4 and the blackening layer 5 was reversed and the thickness of the blackening layer 5 was set as shown in Table 2, and the second conductivity shown in FIG. A film 11 (conductive film) was obtained.

Comparative Example 3
By the same DC magnetron sputtering method as in Example 1, the conductive layer 3 was formed on the lower surface of the transparent substrate 2 only from the copper layer 4 having a thickness of 230 nm to obtain the second conductive film 11. That is, the second conductive film 11 did not have the blackening layer 5.

(Evaluation)
The following physical properties of the above conductive film were evaluated.

[X-ray photoelectron spectroscopy]
The blackening layer 5 of each Example and each Comparative Example was subjected to X-ray photoelectron spectroscopy, and the blackening component was qualitatively and quantitatively analyzed. The results are shown in Table 1.

[Reflected light characteristics]
A spectrophotometer was used to measure L, a*, and b* of the reflected light of the conductive layer 3 in each of the examples and the comparative examples.

Examples 1-7
In Examples 1 to 5 and Comparative Example 1, the first conductive film 1 was irradiated with light from above. That is, the reflected light was measured with the blackened layer 5 facing the light source.

  On the other hand, in Examples 6 and 7, the second conductive film 11 was irradiated with light from below. The reflected light was measured with the transparent substrate 2 facing the light source.

Comparative Examples 2 and 3
In Comparative Example 2, the first conductive film 1 was irradiated with light from above. The reflected light was measured with the conductive layer 3 facing the light source.

  On the other hand, in Comparative Example 3, the second conductive film 11 was irradiated with light from below. The reflected light was measured with the conductive layer 3 facing the light source.

  The results are shown in Table 2.

[Moisture and heat resistance]
The electroconductive films of Example 1 and Comparative Example 1 were placed in a thermo-hygrostat at 60° C. and a relative humidity of 95% for 500 hours, and then Y, a*, and b* of the electroconductive film were measured. Then, the amount of change in Y, a*, and b* before and after the introduction of the constant temperature and high humidity was determined.

  Separately, the conductive films of Example 1 and Comparative Example 1 were placed in a thermo-hygrostat at 85° C. and a relative humidity of 85% for 500 hours, and then Y, a*, and b* of the conductive film were measured. did. Then, the amount of change in Y, a*, and b* before and after the introduction of the constant temperature and high humidity was determined.

  The results are shown in Table 3.

1 1st conductive film 2 Transparent base material 3 Conductive layer 4 Copper layer 5 Blackening layer 11 2nd conductive film 12 1st transparent base material 13 1st conductive layer 14 1st copper layer 15 1st blackening layer 21 3 conductive film 22 2nd transparent base material 23 2nd conductive layer 24 2nd copper layer 25 2nd blackening layer 31 4th conductive film 41 5th conductive film 51 6th conductive film 61 7th conductive film

Claims (6)

A transparent substrate,
A conductive layer disposed on the upper side of the transparent substrate,
The conductive layer is
A copper layer,
A blackening layer disposed on at least one of the upper surface and the lower surface of the copper layer,
The blackened layer contains a metal component and oxygen,
The metal component contains molybdenum ,
The metal component further comprises
Contains iron of 20 atomic% or more and 95 atomic% or less,
A conductive film containing indium in an amount of 0.1 atomic% or more and 23 atomic% or less .   The conductive film according to claim 1, wherein the content ratio of molybdenum in the metal component is 5 atomic% or more and 80 atomic% or less. The said blackening layer is arrange|positioned on the upper surface of the said copper layer, The electroconductive film of Claim 1 or 2 characterized by the above-mentioned. The conductive film according to claim 3 , wherein the blackened layer has a thickness of 40 nm or more and 60 nm or less. The said blackening layer is arrange|positioned at the lower surface of the said copper layer, The electroconductive film of Claim 1 or 2 characterized by the above-mentioned. The conductive film according to claim 5 , wherein the blackened layer has a thickness of 60 nm or more and 70 nm or less.

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