JP6683816B2 - 挿入板を用いた移動コイル構造の容量感知 - Google Patents
挿入板を用いた移動コイル構造の容量感知 Download PDFInfo
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Description
Claims (20)
- スピーカアセンブリであって、
マグネットアセンブリの上方に吊るされた放音面と、
前記マグネットアセンブリの上方に前記放音面を吊るすためのサスペンション部材と、
前記放音面の底側から延びる音声コイルと、
前記放音面の動きを感知するための容量変位センサと、を備え、前記容量変位センサは、前記放音面の上方に固定して位置決めされた第1の伝導板と、前記放音面に結合され、前記第1の伝導板と垂直に揃えられた第2の伝導板と、を含み、前記第2の伝導板は、全体が前記音声コイルの半径方向内側にある前記放音面の第1のエリアであって、前記音声コイルの内面から半径方向内側に所定の距離だけ離れている前記放音面の第1のエリアに閉じ込められおり、前記音声コイルに重なる前記放音面の第2のエリアに伝導板がない、スピーカアセンブリ。 - 前記放音面は、フレキシブルプリント回路板を含み、前記第2の伝導板は、全体が前記音声コイルの半径方向内側にある前記フレキシブルプリント回路板の一部内に形成されている、請求項1に記載のスピーカアセンブリ。
- 前記放音面は、複数の材料層を含み、前記第2の伝導板は、前記複数の材料層のうちの少なくとも1つによって形成されている、請求項1に記載のスピーカアセンブリ。
- 前記所定の距離は、前記第2の伝導板と前記音声コイルとの間の寄生容量を低減するために十分な距離である、請求項1に記載のスピーカアセンブリ。
- 前記所定の距離は、少なくとも0.1ミリメートルの距離である、請求項1に記載のスピーカアセンブリ。
- 前記第2の伝導板の表面積は、前記音声コイルの前記内面の半径方向内側の、前記放音面の表面積未満である、請求項1に記載のスピーカアセンブリ。
- 前記放音面は、前記音声コイルに対して半径方向内側にある面外領域であって、前記放音面の平面から前記マグネットアセンブリの方向に延びる面外領域を含み、前記第2の伝導板は、前記面外領域のエリアに閉じ込められる、請求項1に記載のスピーカアセンブリ。
- 容量変位感知のために、前記第2の伝導板へ電気的に結合された特定用途向け集積回路(ASIC)を更に備える、請求項1に記載のスピーカアセンブリ。
- 前記第2の伝導板を前記ASICへ電気的に接続するためのワイヤを更に備える、請求項8に記載のスピーカアセンブリ。
- スピーカアセンブリであって、
第1のフレーム部材と第2のフレーム部材とを有するフレームであって、前記第1のフレーム部材と前記第2のフレーム部材との間にキャビティが形成され、前記第1のフレーム部材は、前記第2のフレーム部材に対して固定された位置にあり、第1の電極を含む、フレームと、
サスペンション部材によって、前記キャビティ内に、マグネットアセンブリの上方に吊るされた放音面であって、前記放音面は、音響入力に応じて移動するように動作し、前記放音面の中に第2の電極が形成される、放音面と、
前記放音面の底面から延びる音声コイルであって、前記第2の電極は、前記音声コイルの内面へ向かう半径方向内側にある前記放音面のエリアであって、前記音声コイルの内面から半径方向内側に所定の距離だけ離れている前記放音面のエリアに閉じ込められる、音声コイルと、
前記第1の電極と前記第2の電極との間の容量における変化に基づいて、前記放音面の変位を検出するための回路と、
を備えるスピーカアセンブリ。 - 前記第1の電極と前記第2の電極は、互いに垂直に揃えられる、請求項10に記載のスピーカアセンブリ。
- 前記第1の電極は、前記マグネットアセンブリの反対側の前記放音面の側に沿って位置決めされる、請求項10に記載のスピーカアセンブリ。
- 前記放音面は、フレキシブルプリント回路板を含み、前記第2の電極は、前記フレキシブルプリント回路板内に埋め込まれる、請求項10に記載のスピーカアセンブリ。
- 前記第2の電極は、銅板を含む、請求項10に記載のスピーカアセンブリ。
- 前記所定の距離は、0.1ミリメートル〜1.0ミリメートルの距離である、請求項10に記載のスピーカアセンブリ。
- 前記所定の距離は、前記第2の電極と前記音声コイルとの間の寄生容量を低減するために十分な距離である、請求項10に記載のスピーカアセンブリ。
- 前記放音面は、平坦領域を有する面外領域を含み、前記第2の電極は、前記平坦領域内にある、請求項10に記載のスピーカアセンブリ。
- 前記第2の電極は、前記放音面の前記面外領域と同じ外形を含む、請求項17に記載のスピーカアセンブリ。
- 前記第2の電極を前記回路へ電気的に結合するワイヤを更に備える、請求項10に記載のスピーカアセンブリ。
- 前記回路は、特定用途向け集積回路(ASIC)である、請求項10に記載のスピーカアセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/398,483 US10149078B2 (en) | 2017-01-04 | 2017-01-04 | Capacitive sensing of a moving-coil structure with an inset plate |
US15/398,483 | 2017-01-04 | ||
PCT/US2017/069050 WO2018128936A1 (en) | 2017-01-04 | 2017-12-29 | Capacitive sensing of a moving-coil structure with an inset plate |
Publications (2)
Publication Number | Publication Date |
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JP2019508933A JP2019508933A (ja) | 2019-03-28 |
JP6683816B2 true JP6683816B2 (ja) | 2020-04-22 |
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Application Number | Title | Priority Date | Filing Date |
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JP2018536806A Active JP6683816B2 (ja) | 2017-01-04 | 2017-12-29 | 挿入板を用いた移動コイル構造の容量感知 |
Country Status (7)
Country | Link |
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US (1) | US10149078B2 (ja) |
EP (1) | EP3566467A1 (ja) |
JP (1) | JP6683816B2 (ja) |
KR (1) | KR102043899B1 (ja) |
CN (2) | CN207820221U (ja) |
AU (1) | AU2017390082B2 (ja) |
WO (1) | WO2018128936A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN105611463B (zh) * | 2016-03-21 | 2019-11-15 | 歌尔股份有限公司 | 一种振膜和振膜的制造方法 |
US10149078B2 (en) * | 2017-01-04 | 2018-12-04 | Apple Inc. | Capacitive sensing of a moving-coil structure with an inset plate |
CN207531068U (zh) * | 2017-11-02 | 2018-06-22 | 瑞声科技(新加坡)有限公司 | 扬声器箱 |
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CN108271105A (zh) | 2018-07-10 |
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KR102043899B1 (ko) | 2019-12-02 |
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AU2017390082A1 (en) | 2018-08-02 |
CN207820221U (zh) | 2018-09-04 |
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