JP6678502B2 - Soldering equipment and soldering method - Google Patents

Description

  The present invention relates to a soldering apparatus and a soldering method for performing laser soldering using thread solder.

  2. Description of the Related Art In recent years, as electronic circuit boards (hereinafter, referred to as boards) have been reduced in size and required cycle time has been reduced, it has been required to perform soldering in a short time on a minute area. Laser soldering has attracted attention as a technique that meets these requirements.

  In the laser soldering, when the thread solder is used together, it is necessary to finely adjust the mutual position between the laser irradiation spot and the thread solder supply point. Therefore, conventionally, a configuration in which the irradiation spot of the laser beam and the supply point of the thread solder are adjusted using image processing, and a configuration in which the laser light source and the solder supply unit are configured to be hardly displaced mechanically are known. (For example, see Patent Documents 1 and 2).

JP 2007-190576 A JP 2005-238308 A

  The prior art as described above aims at aligning the tip position of the thread solder with the center axis of the laser irradiation spot. On the other hand, in laser soldering using thread solder, a supply position shift occurs due to three-dimensional distortion such as warpage or twist of the thread solder itself. Therefore, in the related art, there is a problem that the influence of the displacement in the height direction caused by the three-dimensional distortion of the thread solder cannot always be canceled.

  For example, as shown in FIG. 8, if the thread solder 21 supplied from the solder supply unit 2 starts to melt in a state of being in contact with the metal pad or the metal pattern as the soldered portion 101 on the substrate 10 (FIG. 8A). ), The thread solder 21 can spread to the soldered portion 101 (FIG. 8B). However, as shown in FIG. 9, for example, even if the nozzle position of the solder supply unit 2 is the same due to distortion of the thread solder 21 itself, the positional relationship between the thread solder 21 and the laser 11 changes. Then, as shown in FIG. 10, for example, when the thread solder 21 enters the laser 11 in the air due to a supply position shift in the height direction caused by three-dimensional distortion of the thread solder 21 (FIG. 10A). However, the thread solder 21 melts in the air before it spreads on the soldered portion 101 and melts due to heat transfer to itself and is rounded (FIG. 10B). Therefore, in this case, solder cannot be supplied to the soldered portion 101.

  SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and a soldering apparatus capable of performing soldering on a portion to be soldered even if the thread solder itself is three-dimensionally distorted. And a soldering method.

The soldering device according to the present invention is a laser light source that irradiates a laser, a solder supply unit that supplies a thread solder, and a laser that is irradiated by the laser light source and a thread solder that is supplied by the solder supply unit. A laser light source is irradiated on the soldered portion by a laser light source on the portion to be soldered on the substrate. By supplying the thread solder by the supply section, a soldering section for performing soldering , a partition member for shielding light and heat, a moving section for moving the partition member, and a moving section for the section to be soldered, A partition insertion portion for inserting a partition member between the laser irradiated by the laser light source and the thread solder supplied by the solder supply portion; Soldering portions are those in the state of being inserted a partition member with respect to portions to be soldered, performs the soldering.

  According to the present invention, since it is configured as described above, even if the thread solder itself is three-dimensionally distorted, it is possible to perform soldering on the portion to be soldered.

FIG. 2 is a schematic diagram illustrating a configuration example of a soldering apparatus according to Embodiment 1 of the present invention. 4 is a flowchart showing an operation example of the soldering apparatus according to Embodiment 1 of the present invention. 3A and 3B are top views showing an operation example of the soldering apparatus according to Embodiment 1 of the present invention. It is a schematic diagram which shows the example of a structure of the soldering apparatus which concerns on Embodiment 2 of this invention. 9 is a flowchart showing an operation example of the soldering apparatus according to Embodiment 2 of the present invention. 6A to 6C are top views showing an operation example of the soldering apparatus according to Embodiment 2 of the present invention. FIG. 13 is a perspective view showing an operation example at the time of soldering by the soldering apparatus according to Embodiment 2 of the present invention. FIGS. 8A and 8B are schematic diagrams illustrating soldering in a case where the thread solder has no distortion. FIG. 9A and FIG. 9B are schematic diagrams illustrating distortion of the thread solder itself. FIGS. 10A and 10B are schematic diagrams illustrating an example of soldering failure (unsoldered) when the thread solder is distorted in the height direction.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
Embodiment 1 FIG.
FIG. 1 is a diagram showing a configuration example of a soldering apparatus according to Embodiment 1 of the present invention.
As shown in FIG. 1, the soldering apparatus includes a laser light source 1, a solder supply unit 2, a camera 3, and a control unit 4.

The laser light source 1 irradiates a laser 11.
The solder supply unit 2 supplies the thread solder 21.

  The camera 3 captures an image of a work area of the soldering device. Data indicating an image captured by the camera 3 is output to the control unit 4.

  The control section 4 controls the operation of each section of the soldering apparatus. The control section 4 has a positioning section 41 and a soldering section 42. The control unit 4 is realized by a processing circuit such as a system LSI, a CPU that executes a program stored in a memory or the like, and the like.

  The positioning unit 41 applies an irradiation spot of the laser 11 to the soldering target 101 on the substrate 10 so as to separate the laser 11 irradiated by the laser light source 1 from the thread solder 21 supplied by the solder supply unit 2. 12 and the supply point 22 of the thread solder 21. At this time, for example, the positioning unit 41 specifies the positional relationship between the soldered portion 101, the laser light source 1, and the solder supply unit 2 from an image captured by the camera 3, and moves the laser light source 1 and the solder supply unit 2. By doing so, the irradiation spot 12 and the supply point 22 are adjusted to the soldered portion 101.

  The soldering section 42 performs the soldering by irradiating the laser 11 from the laser light source 1 to the soldered section 101 and supplying the thread solder 21 from the solder supply section 2 after the processing by the positioning section 41. It is. The soldering unit 42 also controls the irradiation intensity of the laser 11 and the supply speed of the thread solder 21.

  Next, an operation example of the soldering apparatus according to the first embodiment will be described with reference to FIGS. In addition, in order to provide a space between the laser 11 irradiated by the laser light source 1 and the thread solder 21 supplied by the solder supply unit 2, the spot diameter of the laser 11 and the thread solder The diameter of 21 is appropriately set.

  In the operation example of the soldering apparatus according to the first embodiment, first, as shown in FIG. 2, the positioning unit 41 firstly connects the laser 11 irradiated by the laser light source 1 and the thread solder 21 supplied by the solder supply unit 2. The irradiation spot 12 of the laser 11 and the supply point 22 of the thread solder 21 are aligned with the soldered portion 101 on the substrate 10 so as to separate them (step ST201). FIG. 3A shows the relationship between the position of the irradiation spot 12 of the laser 11 on the part to be soldered 101 and the position of the supply point 22 of the thread solder 21. Here, the distance between the laser 11 irradiated by the laser light source 1 and the thread solder 21 supplied by the solder supply unit 2 is so large that the thread solder 21 is not affected by heat and light by the laser 11. Is desirable. The positioning unit 41 determines the positional relationship between the soldered part 101, the laser light source 1, and the solder supply unit 2 from an image captured by the camera 3, and thereby the laser 11 radiated by the laser light source 1 and the solder A space between the wire solder 21 supplied by the supply unit 2 can be secured.

  Next, the soldering section 42 performs the soldering by irradiating the laser 11 to the soldered section 101 by the laser light source 1 and supplying the thread solder 21 by the solder supply section 2 (step ST202). FIG. 3B shows a state of soldering by the soldering section 42.

  Here, as described above, in the soldering apparatus according to the first embodiment, the laser 11 irradiated by the laser light source 1 and the thread solder 21 supplied by the solder supply unit 2 are separated, and then the soldering is performed. Is going. Therefore, even if the thread solder 21 itself is distorted, the thread solder 21 does not enter the laser 11 in the air, and the thread solder 21 does not start melting at an unintended location. Since the soldered portion 101 is heated by the laser 11, the thread solder 21 starts to melt at the moment of contact with the soldered portion 101 and spreads over the entire surface. Therefore, the soldering can be completed without being affected by the distortion of the thread solder 21.

As described above, according to the first embodiment, the laser 11 irradiated by the laser light source 1 and the thread solder 21 supplied by the solder supply unit 2 are separated from the soldered portion 101 so as to be separated. After the irradiation spot 12 of the laser 11 and the supply point 22 of the thread solder 21 were aligned with respect to the soldering portion 101, the soldering was performed, so that the thread solder 21 itself was three-dimensionally distorted. In this case, it is possible to prevent a defective supply of solder to the soldered portion 101, and to perform soldering to the soldered portion 101.
When positioning the irradiation spot 12 and the supply point 22, the positional relationship among the soldered part 101, the laser light source 1, and the solder supply part 2 is specified from the image captured by the camera 3, so that the laser light source 1 can be positioned. Thus, a space between the laser 11 irradiated by the laser beam and the thread solder 21 supplied by the solder supply unit 2 can be secured.

Embodiment 2 FIG.
FIG. 4 is a diagram showing a configuration example of a soldering apparatus according to Embodiment 2 of the present invention. The soldering apparatus according to the second embodiment shown in FIG. 4 adds a partition member 5 and a moving section 6 to the soldering apparatus according to the first embodiment shown in FIG. It has been added. Other configurations are the same, and the same reference numerals are given and the description is omitted.

The partition member 5 is a plate-like member that shields heat and light, and is made of SUS or the like.
The moving section 6 moves the partition member 5.

The partitioning insertion part 43 causes the moving part 6 to insert the partitioning member 5 between the laser 11 radiated by the laser light source 1 and the thread solder 21 supplied by the solder supply part 2 to the soldered part 101. Things.
The soldering portion 42 performs soldering in a state where the partition member 5 is inserted into the portion 101 to be soldered.

  Next, an operation example of the soldering apparatus according to the second embodiment will be described with reference to FIGS. In the operation example of the soldering apparatus according to the second embodiment shown in FIG. 5, step ST501 is added to the previous stage of step ST202 of the operation example of the soldering apparatus according to the first embodiment shown in FIG. Other operations are the same, and description thereof is omitted. In order to insert the partition member 5 with a space provided between the laser 11 radiated by the laser light source 1 and the thread solder 21 supplied by the solder supply unit 2 with respect to the soldered portion 101, a laser The spot diameter of 11 and the diameter of the thread solder 21 are appropriately set. FIG. 6A is the same as FIG. 3A.

  In the operation example of the soldering apparatus according to the second embodiment, in step ST501, the partition insertion portion 43 causes the moving portion 6 to irradiate the laser 11 radiated by the laser light source 1 and the solder supply portion to the soldered portion 101. The partition member 5 is inserted between the wire solder 21 and the thread solder 21 supplied by the second member 2. Thereby, as shown in FIG. 6B, the physical partition member 5 is inserted between the laser 11 irradiated by the laser light source 1 and the thread solder 21 supplied by the solder supply unit 2, and the light by the laser 11 Heat can be shielded from reaching the thread solder 21.

  Thereafter, the soldering section 42 irradiates the laser to the soldered section 101 with the laser 11 from the laser light source 1 and supplies the thread solder 21 from the solder supply section 2 in the same manner as in the first embodiment. Perform (step ST202). FIGS. 6C and 7 show a state of soldering by the soldering section 42. FIG.

  Here, in the soldering apparatus according to the second embodiment, the laser 11 irradiated by the laser light source 1 is separated from the thread solder 21 supplied by the solder supply unit 2 and the physical partition member 5 is inserted. , Soldering. Therefore, even when the thread solder 21 itself is distorted, the thread solder 21 does not enter the laser 11 in the air, so that the thread solder 21 does not start melting at an unintended location. Since the soldered portion 101 is heated by the laser 11, the thread solder 21 starts to melt at the moment of contact with the soldered portion 101 and spreads over the entire surface. Therefore, the soldering can be completed without being affected by the distortion of the thread solder 21.

  As described above, according to the second embodiment, the partition member 5 is provided between the laser 11 radiated by the laser light source 1 and the thread solder 21 supplied by the solder supply unit 2 to the soldered portion 101. Since the soldering is performed in a state in which the solder is inserted, even if the thread solder 21 itself is three-dimensionally distorted as compared with the first embodiment, it is possible to more reliably prevent defective solder supply to the soldered portion 101. And soldering can be performed on the soldered portion 101.

  In the present invention, any combination of the embodiments, a modification of an arbitrary component of each embodiment, or an omission of any component in each embodiment is possible within the scope of the invention. .

DESCRIPTION OF SYMBOLS 1 Laser light source 2 Solder supply part 3 Camera 4 Control part 5 Partition member 6 Moving part 10 Substrate 11 Laser 12 Irradiation spot 21 Thread solder 22 Supply point 41 Positioning part 42 Soldering part 43 Partition insertion part 101 Soldering part

Claims (2)

A laser light source for irradiating a laser,
A solder supply unit for supplying thread solder;
Positioning the laser irradiation spot and the supply point of the thread solder with respect to the soldered portion on the substrate so as to separate the laser irradiated by the laser light source and the thread solder supplied by the solder supply section. Department and
After the processing by the positioning unit, by irradiating the laser to the soldered portion by the laser light source, by supplying the thread solder by the solder supply unit, a soldering unit to perform soldering,
A partition member for shielding light and heat,
A moving unit for moving the partition member,
For the portion to be soldered, by the moving portion, comprising a partition insertion portion to insert the partition member between the laser irradiated by the laser light source and the thread solder supplied by the solder supply unit,
The soldering portion, the in a state where the partition member relative to the soldering portion is inserted, the soldering with'm device you and performs.   A laser light source that irradiates a laser, and a soldering method using a soldering device including a solder supply unit that supplies thread solder,
  The positioning section supplies the laser irradiation spot and the thread solder to the soldered portion on the substrate so as to separate the laser irradiated by the laser light source from the thread solder supplied by the solder supply section. Match the points,
  The soldering section, after processing by the positioning section, irradiates the laser by the laser light source to the soldered section, and supplies the thread solder by the solder supply section, thereby performing soldering.
  The moving unit moves a partition member that blocks light and heat,
  The partition insertion portion, for the soldered portion, by the moving portion, to cause the partition member to be inserted between the laser irradiated by the laser light source and the thread solder supplied by the solder supply unit,
  The soldering portion performs the soldering in a state where the partition member is inserted into the soldered portion.
  A soldering method characterized in that:

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