JP6671393B2 - 光電子部品を作成する方法、および表面実装可能な光電子部品 - Google Patents
光電子部品を作成する方法、および表面実装可能な光電子部品 Download PDFInfo
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- 230000005693 optoelectronics Effects 0.000 title claims description 67
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 236
- 238000004382 potting Methods 0.000 claims description 96
- 238000000034 method Methods 0.000 claims description 68
- 239000000463 material Substances 0.000 claims description 66
- 230000005855 radiation Effects 0.000 claims description 49
- 150000001875 compounds Chemical class 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 34
- 238000005538 encapsulation Methods 0.000 claims description 26
- 239000002245 particle Substances 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 15
- 229920001296 polysiloxane Polymers 0.000 claims description 12
- 150000003839 salts Chemical class 0.000 claims description 11
- 239000004033 plastic Substances 0.000 claims description 9
- 229920003023 plastic Polymers 0.000 claims description 9
- 230000000087 stabilizing effect Effects 0.000 claims description 8
- 229910052594 sapphire Inorganic materials 0.000 claims description 7
- 239000010980 sapphire Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 238000007704 wet chemistry method Methods 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000012815 thermoplastic material Substances 0.000 claims description 4
- 238000000149 argon plasma sintering Methods 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000004040 coloring Methods 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 255
- 229910052791 calcium Inorganic materials 0.000 description 8
- 229910052712 strontium Inorganic materials 0.000 description 8
- 239000008393 encapsulating agent Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000001962 electrophoresis Methods 0.000 description 5
- 230000005670 electromagnetic radiation Effects 0.000 description 4
- 238000000231 atomic layer deposition Methods 0.000 description 3
- 229910052788 barium Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001652 electrophoretic deposition Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 102100032047 Alsin Human genes 0.000 description 2
- 101710187109 Alsin Proteins 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- NCMAYWHYXSWFGB-UHFFFAOYSA-N [Si].[N+][O-] Chemical compound [Si].[N+][O-] NCMAYWHYXSWFGB-UHFFFAOYSA-N 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229940125773 compound 10 Drugs 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical compound C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
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Description
2 キャリア
4 導電性層
5 変換体層
6 封止部層
7 ポッティング化合物
10 接点要素
11 接点要素
12 半導体チップ1の接触面
13 基板
14 半導体積層体
15 半導体チップ1の側面
16 半導体チップ1の放射面
20 ボンディング層
21 保護フレーム
22 ポッティング材料
25 穴
100 光電子デバイス
200 接続領域
201 接続領域
1001 覆われない領域
1002 長方形
1003 斜角縁部
1004 レンズ
I 放射強度(任意単位)
A mm単位のチップ範囲
L lm単位の光束
W 度数単位の角度
F W/sr単位の放射強度
Cx 色座標
Claims (17)
- A)各半導体チップ(1)が、半導体チップ(1)の接触面(12)に配置される、外部電気接続のための接点要素(10、11)を備える、キャリア(2)および複数の光電子半導体チップ(1)を提供するステップと、
B)適用の際に前記接触面(12)が前記キャリア(2)に面し、前記接点要素(10、11)が保護要素(7、20、21)によって横方向で取り囲まれる、前記半導体チップ(1)を横方向で互いに隣接して前記キャリア(2)上に適用するステップと、
C)前記保護要素が前記接点要素(10、11)と導電性層(4)との直接接触を防ぐ、前記半導体チップ(1)の前記キャリア(2)によって覆われていない面の少なくとも部分領域上に導電性層(4)を適用するステップと、
D)正常動作では、前記半導体チップ(1)によって放出される放射の少なくとも一部を別の波長範囲の放射へと変換するように、変換体層(5)が設計される、変換体層(5)を前記導電性層(4)上に電気泳動で蒸着するステップと、
E)前記導電性層(4)を、前記変換体層(5)と前記半導体チップ(1)との間の領域から除去するステップとを含み、
ステップC)の前または後に、ポッティング化合物(7)が前記半導体チップ(1)の間の前記キャリア(2)の上に導入され、
前記ポッティング化合物(7)が、前記接触面(12)を横断して延在する前記半導体チップ(1)の側面(15)を部分的にまたは完全に覆い、
前記接触面(12)とは反対側の放射面(16)には、前記ポッティング化合物(7)が部分的にまたは完全に存在しないままである、光電子デバイス(100)を作成する方法。 - ステップA)からE)が、前記順序で連続して相互に独立して実施され、
ボンディング層(20)が前記キャリア(2)に適用され、
ステップB)の適用中、前記接点要素(10、11)が、前記ボンディング層(20)に深く圧入されて、ステップC)において前記接点要素(10、11)が前記導電性層(4)で覆われないように保護され、
前記ボンディング層(20)が熱可塑性材料を含むかまたは熱可塑性材料から成り、
ステップE)の後、前記半導体チップ(1)が前記キャリア(2)から分離され、個別化される、請求項1に記載の方法。 - ステップC)で、前記導電性層(4)が、前記半導体チップ(1)の間に位置する前記ポッティング化合物(7)に適用され、
ステップE)で、前記導電性層(4)が、前記変換体層(5)と前記ポッティング化合物(7)との間の領域から除去される、請求項1または2に記載の方法。 - ステップE)で、前記導電性層(4)が湿式化学プロセスを用いて除去され、
前記導電性層(4)が、少なくとも1つの金属を含むか、または少なくとも1つの金属から形成され、
ステップE)で、前記金属が、化学反応によって、前記金属の塩へと部分的にまたは完全に変換され、
ステップE)の後、前記変換体層(5)中の前記塩のモル分率が、0.001%から2%となる、請求項1〜3のいずれか一項に記載の方法。 - 前記変換体層(5)が、前記半導体チップ(1)上における範囲全体に沿って均一な層厚を有し、厚さの変動が最大で平均層厚の5%であり、
ステップE)の後、前記変換体層(5)の層厚が最大70μmとなり、
ステップE)の後、前記変換体層(5)が前記半導体チップ(1)上で連続し、隣接し、また中断されずに延在する、請求項1〜4のいずれか一項に記載の方法。 - 前記変換体層(5)が変換体粒子の粉末から形成され、
ステップE)の後、前記変換体層(5)が封止部層(6)で取り囲まれることによって、前記半導体チップ(1)からの前記変換体層(5)の分離または破砕または剥落を防ぐ、請求項1〜5のいずれか一項に記載の方法。 - 前記封止部層(6)が、前記半導体チップ(1)および/または前記変換体層(5)によって放出される放射に対して少なくとも90%透過性である、透明材料を含むかまたは透明材料から成り、
ステップE)の後、前記封止部層(6)が、完成した前記デバイス(100)において、パターニングされた前記封止部層(6)が、それぞれの前記半導体チップ(1)によって放出される放射に対するレンズとして作用するようにしてパターニングされる、請求項6に記載の方法。 - 前記キャリア(2)が、ステップB)で前記半導体チップ(1)が電気的に接続され機械的に締結される、プリント回路基板である、請求項1〜7のいずれか一項に記載の方法。
- 各半導体チップ(1)に対する保護フレーム(21)が前記キャリア(2)に適用され、
ステップB)における適用の間、前記半導体チップ(1)が、前記接点要素(10、11)が対応する前記保護フレーム(21)によって少なくとも部分的に取り囲まれるようにして、前記キャリア(2)上に配置され、
前記保護フレーム(21)が、ステップC)で、前記接点要素(10、11)が前記導電性層(4)で覆われるのを防ぐ、請求項1〜8のいずれか一項に記載の方法。 - 前記保護フレーム(21)が、ステップB)の前に前記キャリア(2)に適用される、請求項9に記載の方法。
- 前記半導体チップ(1)の前記放射面(16)が、最初に前記導電性層(4)で覆われ、その後に、前記半導体チップ(1)が前記ポッティング化合物(7)に取り囲まれる、請求項1〜10のいずれか一項に記載の方法。
- 前記半導体チップ(1)が、それぞれの場合において、前記半導体チップ(1)を安定化するサファイア成長基板(13)と前記サファイア成長基板(13)上に成長させられる半導体積層体(14)とを備える、サファイアフリップチップであり、
前記接点要素(10、11)が、前記半導体積層体(14)の前記サファイア成長基板(13)から遠い面に配置される、請求項1〜11のいずれか一項に記載の方法。 - 前記半導体チップ(1)が、それぞれの場合において、前記半導体チップ(1)を安定化する基板(13)と前記基板(13)に適用される半導体積層体(14)とを備える、薄膜半導体チップであり、
前記基板(13)が、前記半導体積層体(14)の成長基板とは異なり、前記成長基板が前記半導体チップ(1)から除去され、
前記接点要素(10、11)が、前記基板(13)の前記半導体積層体(14)から遠い面に適用される、請求項1〜11のいずれか一項に記載の方法。 - 光散乱および/または着色色素材料を、変換体層(5)を蒸着させた後または変換体層(5)と一緒に、電気泳動法で蒸着させる、請求項1〜13のいずれか一項に記載の方法。
- 表面実装可能な光電子デバイス(100)であって、
デバイス(100)の外部電気接触のために覆われていない接点要素(10、11)を含み、前記接点要素(10、11)が、半導体チップ(1)の共通の接触面(12)上に配置される、光電子半導体チップ(1)と、
前記接触面(12)とは反対側の前記半導体チップ(1)の放射面(16)を少なくとも90%隠す、連続し、隣接し、また中断されない変換体層(5)と、
前記変換体層(5)に適用され、前記変換体層(5)を完全に隠し封入する封止部層(6)とを備え、
前記変換体層(5)が、前記デバイス(100)の正常動作では、前記半導体チップ(1)によって放出される放射の少なくとも一部を別の波長範囲の放射へと変換するように設計され、
前記変換体層(5)が、前記半導体チップ(1)上における範囲全体に沿って均一な層厚を有し、厚さの変動が最大で平均層厚の5%であり、
前記変換体層の前記層厚が最大70μmとなり、
前記変換体層(5)が、前記封止部層(6)によって前記半導体チップ(1)上で保持される変換体粒子の粉末であり、
前記半導体チップ(1)がポッティング材料(22)に埋め込まれ、
前記ポッティング材料(22)が、前記接触面(12)を横断して延在する前記半導体チップ(1)の側面(15)全てを完全に覆い、
前記側面(15)が前記変換体層(5)によって隠されず、
前記接触面(12)に対して平行な横方向で、前記変換体層(5)が前記ポッティング材料(22)によって取り囲まれ、
前記放射面(16)から離れる方向で、前記ポッティング材料(22)および前記変換体層(5)が互いに同一面で終端し、
前記変換体層(5)が金属の塩を含み、前記変換体層(5)中における前記金属の塩のモル分率が0.001%〜2%となる、光電子デバイス(100)。 - 前記封止部層(6)が透明シリコーンのポッティング化合物であり、
前記接触面(12)とは反対側の前記デバイス(100)の面上で、前記シリコーンポッティング化合物が斜角縁部を有する、請求項15に記載の光電子デバイス(100)。 - 前記ポッティング材料(22)が白色プラスチックを含む、請求項15または16に記載の光電子デバイス(100)。
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