JP6667778B2 - Connection structure and high power film circuit using the same - Google Patents
Connection structure and high power film circuit using the same Download PDFInfo
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- JP6667778B2 JP6667778B2 JP2016089614A JP2016089614A JP6667778B2 JP 6667778 B2 JP6667778 B2 JP 6667778B2 JP 2016089614 A JP2016089614 A JP 2016089614A JP 2016089614 A JP2016089614 A JP 2016089614A JP 6667778 B2 JP6667778 B2 JP 6667778B2
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- 239000004020 conductor Substances 0.000 claims description 57
- 238000002788 crimping Methods 0.000 claims description 43
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 8
- 239000005001 laminate film Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 54
- 229910052751 metal Inorganic materials 0.000 description 30
- 239000002184 metal Substances 0.000 description 30
- 238000010438 heat treatment Methods 0.000 description 26
- 230000020169 heat generation Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011888 foil Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000004078 waterproofing Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
本発明は、フィルム状回路に電線（コード）等の接続対象導体を接続する接続構造およびこれを用いた大電力フィルム状回路に関する。 The present invention relates to a connection structure for connecting a connection target such as an electric wire (cord) to a film-like circuit, and a high-power film-like circuit using the same.
従来、絶縁性フィルム上に導電インクを用いて導電パターンを印刷したフィルム状回路が知られている。一般に、導電インクを用いて印刷された導電パターンは膜厚が薄く、シート抵抗率が高くなる。このため、導電パターンの抵抗値を低下させるために幅の広いパターンを使用する必要がある。 Conventionally, a film-like circuit in which a conductive pattern is printed on an insulating film using a conductive ink is known. Generally, a conductive pattern printed using a conductive ink has a small thickness and a high sheet resistivity. Therefore, it is necessary to use a wide pattern in order to reduce the resistance value of the conductive pattern.
このような導電性インクを用いたフィルム状回路と電線（コード）を接続する際、フィルム状回路の導電パターンに比較的広い面積の電極パッドを設けておき、この電極パッドに対して、板金端子としての金属板を面接続させ、この金属板に対して、電線を接続した丸型被覆端子を圧着接続することが行われている。この構成により、電線から丸型被覆端子を経由して金属板に電流が流れ、金属板と導電パターンが広い面積で接触することで、導電パターンと金属板の界面に局所的な過電流を防ぎつつ、フィルム状回路へ送電を行うことが可能となる。 When a film circuit using such conductive ink is connected to an electric wire (cord), an electrode pad having a relatively large area is provided in the conductive pattern of the film circuit, and a sheet metal terminal is provided for the electrode pad. A metal plate is connected by surface connection, and a round coated terminal to which an electric wire is connected is crimp-connected to the metal plate. With this configuration, current flows from the electric wire to the metal plate via the round coated terminal, and the metal plate and the conductive pattern come into contact over a large area, preventing local overcurrent at the interface between the conductive pattern and the metal plate. In addition, power can be transmitted to the film-shaped circuit.
上記の従来技術では、柔軟性は低いがシート抵抗率が低い金属板と、柔軟性は高いがシート抵抗率が高い印刷された導電パターンとを直接接続していたので、過度の発熱を低減するため両者の界面の接触面積を増やす必要性があり、結果的に金属板（板金端子）を大きくせざるを得なかった。その結果、大きな板金端子の領域でフィルム状回路の柔軟性が失われるという問題があった。 In the above-mentioned prior art, since the metal plate having low flexibility but low sheet resistivity and the printed conductive pattern having high flexibility but high sheet resistivity were directly connected, excessive heat generation was reduced. Therefore, it is necessary to increase the contact area at the interface between the two, and as a result, the metal plate (sheet metal terminal) must be enlarged. As a result, there is a problem that the flexibility of the film-shaped circuit is lost in the area of the large sheet metal terminal.
本出願人は、フィルム状回路として、絶縁性のフィルム上に、導電性インクを用いて、電熱線および電極パッドを導電パターンとして形成することにより、製作が容易でかつ安価な面状発熱体（薄膜ヒーター）を開発している。この面状発熱体は、その特性として、柔軟性（フレキシブル性）があり、印刷される導電パターンの幅および長さで抵抗値を変更できる利点を有する。 The present applicant has proposed that a heating element and an electrode pad are formed as a conductive pattern on a insulating film by using a conductive ink on a film as a film-like circuit. Thin film heater). This planar heating element has flexibility (flexibility) as its characteristic, and has an advantage that the resistance value can be changed depending on the width and length of the conductive pattern to be printed.
特に、図１に示したような面状発熱体について、本出願人は、絶縁性基材上で、隣接した１対の電極パッド８５の間に複数本の電熱線８７を電気的に並列接続の関係で配置する構成を採用している。その際、絶縁性基材上の要発熱領域を、入れ子状に配置された複数の分割エリアにおいて配置された各電熱線の両端が両電極パッド８５に接続されるようにしている。電線８１，８２は圧着金具８６で板金端子８３とともにフィルム状回路の電極パッド部８５に接続されている。このような大電力フィルム状回路において高電流を流した場合に板金端子８３とフィルム状回路との界面における過度の発熱を防止するために、各電熱線の横幅（蛇行幅）の総和に対して、なるべく板金端子８３の横幅（長手方向）を大きくすることが望ましいが、長尺にするほど柔軟性が失われる範囲が拡大してしまう。 In particular, for the sheet heating element as shown in FIG. 1, the present applicant electrically connects a plurality of heating wires 87 in parallel between a pair of adjacent electrode pads 85 on an insulating base material. Is adopted in the arrangement. At this time, the heating required area on the insulating base material is configured such that both ends of each heating wire arranged in the plurality of divided areas arranged in a nested manner are connected to both electrode pads 85. The electric wires 81 and 82 are connected to the electrode pads 85 of the film circuit together with the sheet metal terminals 83 by crimping fittings 86. In order to prevent excessive heat generation at the interface between the sheet metal terminal 83 and the film-like circuit when a high current flows in such a high-power film-like circuit, the width of each heating wire (the meandering width) must be reduced. It is desirable to increase the width (longitudinal direction) of the sheet metal terminal 83 as much as possible, but the longer the length, the greater the range in which flexibility is lost.
本発明はこのような背景においてなされたものであり、その目的は、板金端子とフィルム状回路との界面における過度の発熱を防止しつつ、柔軟性の失われる範囲を小さくすることができる、フィルム状回路に接続対象導体を接続する接続構造およびこれを用いた大電力フィルム状回路を提供することにある。 The present invention has been made in such a background, an object of the present invention is to prevent excessive heat generation at an interface between a sheet metal terminal and a film-like circuit and reduce a range in which flexibility is lost. An object of the present invention is to provide a connection structure for connecting a connection target conductor to a circuit and a high-power film circuit using the same.
本発明の接続構造の第１の態様は、フィルム状回路に接続対象導体を接続する接続構造であって、導電パターンおよび電極パッドを導電性インクで表面上に形成したフィルム状回路と、前記フィルム状回路よりシート抵抗率が低い導電面を有する可撓性シート部材と、導電プレートと、接続対象導体が接続される基部および接触端子部を有する対象導体接続具と、圧着手段とを備え、前記フィルム状回路は、前記電極パッドの部分に形成された開口を有し、当該電極パッドにおいて前記可撓性シート部材と面接続されるとともに、前記フィルム状回路の開口を介して前記導電プレートが前記可撓性シート部材の導電面に面接続されたものに対して、前記導電プレートの背面から前記対象導体接続具の接触端子部が重ねられ、前記可撓性シート部材、前記導電プレートおよび前記対象導体接続具が相互に前記圧着手段により圧着されたことを特徴とするものである。
A first aspect of the connection structure of the present invention is a connection structure for connecting a connection target conductor to a film-like circuit, wherein the film-like circuit in which a conductive pattern and an electrode pad are formed on the surface with a conductive ink; A flexible sheet member having a conductive surface having a lower sheet resistivity than the circuit, a conductive plate, a target conductor connector having a base and a contact terminal portion to which the target conductor is connected, and crimping means, The film-shaped circuit has an opening formed in the portion of the electrode pad, and is surface-connected to the flexible sheet member at the electrode pad, and the conductive plate is connected to the conductive plate through the opening of the film-shaped circuit. flexible conductive surface of the sheet member with respect to those surfaces connected to the contact terminal of the target conductor connector is superimposed from the back of the conductive plate, the flexible sheet Wood, before Kishirubeden plate and the target conductor connecting device is characterized in that the crimped by the crimping means to each other.
この第１の態様では、フィルム状回路の導電パッドに対して従来のように板金端子が直接面接続されるのではなく、シート抵抗率が低い導電面を有する可撓性シート部材および導電プレートを介して、対象導体接続具が接続される。これにより、従来技術のような柔軟性の低い長尺の板金端子を用いることによる広範囲の柔軟性の欠如が防止されるとともに、局所的な過度の発熱が防止される。 In the first embodiment, a sheet metal terminal is not directly surface-connected to a conductive pad of a film circuit as in the related art, but a flexible sheet member and a conductive plate having a conductive surface having a low sheet resistivity are used. The target conductor connection tool is connected via the connection. This prevents a lack of flexibility over a wide range due to the use of a long sheet metal terminal having low flexibility as in the related art, and also prevents local excessive heat generation.
本発明の接続構造の第２の態様は、フィルム状回路に接続対象導体を接続する接続構造であって、導電パターンおよび電極パッドを導電性インクで表面上に形成したフィルム状回路と、前記フィルム状回路よりシート抵抗率が低い導電面を有する可撓性シート部材と、接続対象導体が接続される基部および接触端子部を有する対象導体接続具と、圧着手段とを備え、前記フィルム状回路は、前記電極パッドの部分に形成された開口を有し、当該電極パッドにおいて前記可撓性シート部材と面接続されるとともに、前記フィルム状回路の開口を介して前記対象導体接続具の接触端子部が前記可撓性シート部材の導電面に面接続され、前記可撓性シート部材と前記対象導体接続具とが相互に前記圧着手段により圧着されたことを特徴とするものである。
A second aspect of the connection structure of the present invention is a connection structure for connecting a connection target conductor to a film-like circuit, wherein the film-like circuit in which a conductive pattern and an electrode pad are formed on the surface with conductive ink; A flexible sheet member having a conductive surface having a lower sheet resistivity than the shape circuit, a target conductor connection tool having a base and a contact terminal portion to which the connection target conductor is connected, and crimping means; An opening formed in a portion of the electrode pad, the electrode pad being surface-connected to the flexible sheet member, and a contact terminal portion of the target conductor connector through an opening in the film circuit. in but one, wherein the flexible sheet member is connected face to the conductive surface of a front Symbol flexible sheet member and the target conductor connecting device is crimped by the crimping means to each other That.
この第２の態様では、フィルム状回路の導電パッドに対して従来のように板金端子が直接面接続されるのではなく、シート抵抗率が低い導電面を有する可撓性シート部材を介して、対象導体接続具が接続される。これにより、従来技術のような柔軟性の低い長尺の板金端子を用いることによる広範囲の柔軟性の欠如が防止されるとともに、局所的な過度の発熱が防止される。 In the second embodiment, the sheet metal terminal is not directly surface-connected to the conductive pad of the film circuit as in the related art, but via a flexible sheet member having a conductive surface having a low sheet resistivity. The target conductor connector is connected. This prevents a lack of flexibility over a wide range due to the use of a long sheet metal terminal having low flexibility as in the related art, and also prevents local excessive heat generation.
本発明の接続構造の第３の態様は、フィルム状回路に接続対象導体を接続する接続構造であって、導電パターンおよび電極パッドを導電性インクで表面上に形成したフィルム状回路と、前記フィルム状回路よりシート抵抗率が低い導電面を有する可撓性シート部材と、導電プレートと、軸部を有する本体部と前記軸部が係合する受部とからなる圧着具を含む圧着手段とを備え、前記フィルム状回路は、前記電極パッドの部分に形成された開口を有し、当該電極パッドにおいて前記可撓性シート部材と面接続されるとともに、前記フィルム状回路の開口を介して前記導電プレートが前記可撓性シート部材の導電面に面接続されたものに、前記圧着具の軸部が縦挿され、前記軸部に前記接続対象導体が巻きつけられた状態で、前記圧着手段により前記可撓性シート部材、前記導電プレートおよび前記接続対象導体が相互に圧着されたことを特徴とするものである。
A third aspect of the connection structure of the present invention is a connection structure for connecting a connection target conductor to a film-like circuit, wherein the film-like circuit in which a conductive pattern and an electrode pad are formed on the surface with a conductive ink; A flexible sheet member having a conductive surface having a lower sheet resistivity than the circuit, a conductive plate, and a crimping means including a crimping tool including a main body having a shaft and a receiving portion engaged with the shaft. The film-shaped circuit has an opening formed in the electrode pad portion, and is electrically connected to the flexible sheet member at the electrode pad, and the conductive film is formed through the opening of the film-shaped circuit. In a state where the plate is surface-connected to the conductive surface of the flexible sheet member, the shaft of the crimping tool is vertically inserted, and the connection target conductor is wound around the shaft, and Serial flexible sheet member, before Kishirubeden plate and the connection target conductor is characterized in that it has been crimped to each other.
この第３の態様では、フィルム状回路の導電パッドに対して従来のように板金端子が直接面接続されるのではなく、シート抵抗率が低い導電面を有する可撓性シート部材および導電プレートを介して、接続対象導体が接続される。これにより、従来技術のような柔軟性の低い長尺の板金端子を用いることによる広範囲の柔軟性の欠如が防止されるとともに、局所的な過度の発熱が防止される。 According to the third aspect, a sheet metal terminal is not directly connected to a conductive pad of a film circuit as in the related art, but a flexible sheet member and a conductive plate having a conductive surface having a low sheet resistivity are used. The connection target conductor is connected through the connection. This prevents a lack of flexibility over a wide range due to the use of a long sheet metal terminal having low flexibility as in the related art, and also prevents local excessive heat generation.
本発明の接続構造の第４の態様は、第１から第３の態様のいずれかにおいて、前記圧着手段は、ハトメまたはカシメまたはボルト・ナットのいずれかを含む圧着具で構成されたものである。このような圧着手段により、堅固かつ確実な圧着が行われる。 According to a fourth aspect of the connection structure of the present invention, in any one of the first to third aspects, the crimping means is configured by a crimping tool including any of eyelets, caulking, and bolts and nuts. . By such a crimping means, firm and reliable crimping is performed.
本発明の接続構造の第５の態様は、第１から第４の態様のいずれかにおいて、前記圧着手段の外部へ露出した部分を被覆するシーリング樹脂をさらに有するようにしたものである。これにより、圧着具が導電性である場合にその保護および絶縁（感電防止）が図れる。
According to a fifth aspect of the connection structure of the present invention, in any one of the first to fourth aspects, a sealing resin for covering a portion exposed to the outside of the crimping means is further provided. Thereby, when the crimping tool is conductive, protection and insulation (prevention of electric shock) can be achieved.
本発明の接続構造の第６の態様は、第１から第５の態様のいずれかにおいて、前記フィルム状回路に対して、前記可撓性シート部材の存在する面全体を被覆するラミネートフィルムをさらに備えたものである。これにより、フィルム回路の外部からの絶縁、防水、導電パターンの物理的保護が図れる。 According to a sixth aspect of the connection structure of the present invention, in any one of the first to fifth aspects, the laminate circuit covering the entire surface of the flexible sheet member on the film-like circuit is further provided. It is provided. Thereby, insulation, waterproofing, and physical protection of the conductive pattern from the outside of the film circuit can be achieved.
本発明による大電力フィルム状回路は、上記第１から第７の態様による接続構造を用いたものである。 The high power film-like circuit according to the present invention uses the connection structure according to the first to seventh aspects.
本発明によれば、従来技術における板金端子とフィルム状回路との界面における過度の発熱を防止しつつ、柔軟性の失われる範囲を小さくすることができる、フィルム状回路に接続対象導体を接続する接続構造およびこれを用いた大電力フィルム状回路を提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the range which loses flexibility can be reduced, preventing the excessive heat generation at the interface of a sheet metal terminal and a film-shaped circuit in the prior art. A connection structure and a high-power film-shaped circuit using the same can be provided.
以下、本発明の実施の形態について詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail.
（第１の実施形態）
図２に、第１の実施形態による、フィルム状回路４０に接続対象導体を接続する接続構造の概略構成を説明するための分解側面図を示す。本実施形態では接続対象導体として電線６５を例とするが、電線に限るものではない。
(First embodiment)
FIG. 2 is an exploded side view for explaining a schematic configuration of a connection structure for connecting a connection target conductor to the film circuit 40 according to the first embodiment. In the present embodiment, the electric wire 65 is taken as an example of the connection target conductor, but the conductor is not limited to the electric wire.
フィルム状回路４０は、導電パターン４２および電極パッド４４を導電性インクで表面上に形成したものである。この例では、可撓性を有する絶縁性フィルム（絶縁性基材）４１の一面に、導電インクのパターンを印刷した印刷フィルムである。フィルム状回路４０には、導電パターンの一部として、接続対象導体と接続される位置に電極パッド４４が形成されている。 The film-like circuit 40 is formed by forming conductive patterns 42 and electrode pads 44 on the surface with conductive ink. In this example, the printed film is formed by printing a pattern of conductive ink on one surface of a flexible insulating film (insulating base material) 41. In the film-like circuit 40, an electrode pad 44 is formed as a part of the conductive pattern at a position connected to the connection target conductor.
電極パッド４４は、外部の電源等につながる電線６５の端部が接続される比較的広い面積の導電領域である。この電極パッド４４の部分（その内部または隣接箇所）に開口４３が形成される。開口４３の形状は典型的には円形であるが、その形状は円形に限るものではない。また、開口４３は必ずしもその周縁が閉鎖状態にある必要はなく、開放状態であってもよい。 The electrode pad 44 is a conductive region having a relatively large area to which an end of an electric wire 65 connected to an external power supply or the like is connected. An opening 43 is formed in the portion of the electrode pad 44 (inside or adjacent thereto). The shape of the opening 43 is typically circular, but the shape is not limited to a circle. Further, the periphery of the opening 43 does not necessarily have to be in a closed state, and may be in an open state.
フィルム状回路４０の電極パッド４４に対向して、フィルム状回路４０の導電パターンよりシート抵抗率が低い導電面（すなわち導体層３３）を有する可撓性シート部材３０が対向配置される。この例では、可撓性の絶縁体層（例えばＰＥＴ、ポリイミド等の樹脂フィルム）３１の一面に可撓性の導体層（例えば金属箔）３３が形成された二重構造フィルムを用いている。この導体層３３は、フィルム状回路４０の導電パターン４２（電極パッド４４）よりシート抵抗率が低い「導電面」を構成する。導体層３３は、典型的には銅、アルミ等の金属箔で構成される。その製造には、電気的な膜生成、圧延等が利用できる。この可撓性シート部材３０は、その導電面である導体層３３がフィルム状回路４０の電極パッド４４に面接続（面において導電接続）されるように、フィルム状回路４０に重ね合わされる。好ましくは、電極パッド４４と可撓性シート部材３０の導体層３３は導電性接着剤または導電性両面テープで電気的および機械的に接続される。 The flexible sheet member 30 having a conductive surface (that is, the conductive layer 33) having a lower sheet resistivity than the conductive pattern of the film circuit 40 is disposed to face the electrode pad 44 of the film circuit 40. In this example, a double-layered film in which a flexible conductor layer (eg, a metal foil) 33 is formed on one surface of a flexible insulator layer (eg, a resin film such as PET or polyimide) 31 is used. The conductive layer 33 forms a “conductive surface” having a lower sheet resistivity than the conductive pattern 42 (electrode pad 44) of the film circuit 40. The conductor layer 33 is typically made of a metal foil such as copper or aluminum. Electric film formation, rolling and the like can be used for the production. The flexible sheet member 30 is superimposed on the film circuit 40 so that the conductive layer 33 as the conductive surface is surface-connected (conductively connected on the surface) to the electrode pad 44 of the film circuit 40. Preferably, the electrode pad 44 and the conductor layer 33 of the flexible sheet member 30 are electrically and mechanically connected by a conductive adhesive or a conductive double-sided tape.
可撓性シート部材３０のほぼ中央には、後述する圧着具の軸部が貫通する透孔３２が設けられている。 At the approximate center of the flexible sheet member 30, there is provided a through hole 32 through which a shaft portion of a crimping tool described later penetrates.
フィルム状回路４０に対して上記のように可撓性シート部材３０を重ね合わせた状態で、導電パターン４２の面側に、絶縁性フィルム４１とほぼ同形状・同サイズのラミネートフィルム２０が被着される。ラミネートフィルム２０はフィルム状回路４０の保護および外部に対する電気的絶縁のための可撓性の絶縁性シートで構成され、通常透明または半透明である。この被着の方法は、特に問わないが、例えば接着剤、または熱圧着により行うことができる。ラミネートフィルム２０には、圧着具１１の軸部が貫通する透孔２２が設けられる。透孔２２は前もって形成してもよいし、圧着具１１の軸部による穿孔によって事後的に形成してもよい。 With the flexible sheet member 30 superimposed on the film circuit 40 as described above, the laminate film 20 having substantially the same shape and size as the insulating film 41 is adhered to the surface side of the conductive pattern 42. Is done. The laminate film 20 is formed of a flexible insulating sheet for protecting the film circuit 40 and electrically insulating the circuit 40 from the outside, and is usually transparent or translucent. The method of this attachment is not particularly limited, but can be performed by, for example, an adhesive or thermocompression bonding. The laminated film 20 is provided with a through hole 22 through which the shaft of the crimping tool 11 passes. The through-hole 22 may be formed in advance, or may be formed later by drilling the shaft of the crimping tool 11.
フィルム状回路４０の背面（図の下側）には、その開口４３を通過可能なサイズの導電プレート５０が配置される。この導電プレート５０は典型的には金属板で構成され、そのほぼ中央には、圧着具１１の軸部が貫通する透孔５２が設けられている。金属板の材質は導電性の高いものであれば、特にその種類は問わないが、典型的には、銅、アルミ、リン青銅、等である。但し、導電プレート５０の材質は、金属に限らず、シート抵抗率の低い（高導電性の）材料であれば金属に限るものではない。最終形として、導電プレート５０は、その一面全体が、フィルム状回路４０の開口４３を介して、可撓性シート部材３０の導体層３３に面接続される。「面接続」は単に接触するだけでもよいし、導電性接着剤や導電性両面テープを介在した接続であってもよい。 On the back surface (lower side in the figure) of the film circuit 40, a conductive plate 50 sized to be able to pass through the opening 43 is arranged. The conductive plate 50 is typically made of a metal plate, and has a through hole 52 at the approximate center thereof, through which the shaft of the crimping tool 11 passes. The material of the metal plate is not particularly limited as long as it has high conductivity, but typically, copper, aluminum, phosphor bronze, or the like is used. However, the material of the conductive plate 50 is not limited to metal, and is not limited to metal as long as the material has a low sheet resistivity (high conductivity). As a final form, the entire surface of the conductive plate 50 is surface-connected to the conductive layer 33 of the flexible sheet member 30 via the opening 43 of the film-shaped circuit 40. “Surface connection” may be simply contacting, or may be a connection via a conductive adhesive or a conductive double-sided tape.
導電プレート５０の背面（図の下側）に対象導体接続具としての裸圧着端子６０が配置される。この裸圧着端子６０は、丸型または先開形の接触端子部６３と接続対象導体としての電線６５が圧着接続される基部６４とを有する導電性の対象導体接続具である。この図では開口６２を有する丸型の裸圧着端子を示している。この接触端子部６３が導電プレート５０と面接触する。 A bare crimp terminal 60 as a target conductor connection tool is arranged on the back surface (lower side in the figure) of the conductive plate 50. The bare crimp terminal 60 is a conductive target conductor connector having a round or open-ended contact terminal portion 63 and a base 64 to which an electric wire 65 as a connection target conductor is crimp-connected. In this figure, a round bare crimp terminal having an opening 62 is shown. The contact terminal portion 63 makes surface contact with the conductive plate 50.
これらのすべての部品を重ね合わせた状態で、圧着手段としての圧着具１１により上下方向から圧力を掛けて全体を圧着結合させる。すなわち、フィルム状回路４０の開口４３に合わせて可撓性シート部材３０の導電面（導体層３３）を対向させるとともに、フィルム状回路４０の開口４３を介して導電プレート５０が可撓性シート部材３０の導電面に面接続された接続体に対して、導電プレート５０の背面から裸圧着端子６０の接触端子部６３が重ねられ、可撓性シート部材３０、導電プレート５０および裸圧着端子６０が相互に圧着手段により圧着される。これにより、フィルム状回路４０と電線６５の堅固かつ確実な電気的・機械的な接続が実現する。
In a state where all these components are overlapped, pressure is applied from above and below by a crimping tool 11 as a crimping means, and the whole is crimped and joined. That is, the conductive surface (conductor layer 33) of the flexible sheet member 30 is opposed to the opening 43 of the film circuit 40, and the conductive plate 50 is connected to the flexible sheet member via the opening 43 of the film circuit 40. The contact terminal portion 63 of the bare crimp terminal 60 is superimposed on the connection body surface-connected to the conductive surface of the conductive plate 30 from the back surface of the conductive plate 50, and the flexible sheet member 30 , the conductive plate 50 and the bare crimp terminal 60 Are crimped to each other by crimping means. Thus, a firm and reliable electrical and mechanical connection between the film circuit 40 and the electric wire 65 is realized.
圧着具１１は、重ね合わせた複数の部品を互いに押圧して結合するための圧着手段の一種であり、典型的にはハトメ、カシメ、ボルト・ナット等の圧着金具である。圧着具１１は、図示の例では、本体部１１ａと受部（座金等）１１ｂとからなる両面ハトメである。本体部１１ａはその軸方向に中空であってもよい。 The crimping tool 11 is a type of crimping means for pressing a plurality of superimposed components together and joining them, and is typically a crimping tool such as an eyelet, a caulking, a bolt and a nut. In the illustrated example, the crimping tool 11 is a double-sided eyelet including a main body 11a and a receiving portion (washer or the like) 11b. The main body 11a may be hollow in the axial direction.
この圧着後に、圧着具１１の本体部１１ａと受部１１ｂの外部露出部分全体をシーリング樹脂７０で被覆する。これは、圧着具１１が導電性である場合に、その保護および絶縁（感電防止）のためである。圧着具１１が絶縁性の材料で形成されている場合にはシーリング樹脂７０は不要である。ただし、防水の目的のためには、圧着具１１が絶縁性の材料で形成されている場合にもシーリング樹脂７０を設けることが好ましい。 After this crimping, the entire outer exposed portion of the main body portion 11a and the receiving portion 11b of the crimping tool 11 is covered with the sealing resin 70. This is for protection and insulation (prevention of electric shock) when the crimping tool 11 is conductive. When the crimping tool 11 is formed of an insulating material, the sealing resin 70 is unnecessary. However, for the purpose of waterproofing, it is preferable to provide the sealing resin 70 even when the crimping tool 11 is formed of an insulating material.
図３に、第１の実施形態における完成形の接続構造の側面断面図を示す。 FIG. 3 shows a side sectional view of the completed connection structure in the first embodiment.
なお、図２および図３において、図示の都合上、各部品の厚さは誇張して示してあり、必ずしも実際を反映させたものではない。導電プレートおよびフィルム状回路の厚さは１ｍｍ以下を想定しており、好適には、導電プレートの厚さは０．２ｍｍ程度、フィルム状回路４０の厚さは０．１ｍｍないし０．１２５ｍｍ程度である。 In FIGS. 2 and 3, the thickness of each component is exaggerated for convenience of illustration, and does not necessarily reflect the actual situation. The thickness of the conductive plate and the film-like circuit is assumed to be 1 mm or less. Preferably, the thickness of the conductive plate is about 0.2 mm, and the thickness of the film-like circuit 40 is about 0.1 mm to 0.125 mm. is there.
電線６５を通過する電流は、電線６５と接続された裸圧着端子６０、導電プレート５０、可撓性シート部材３０の導体層３３、フィルム状回路４０の導電パターン４２、の順に流れる（またはこの逆向きに流れる）。 The current passing through the electric wire 65 flows in the order of the bare crimp terminal 60 connected to the electric wire 65, the conductive plate 50, the conductive layer 33 of the flexible sheet member 30, and the conductive pattern 42 of the film circuit 40 (or vice versa). Flows in the direction).
なお、電線６５の他端が何に接続されるかは問わないが、例えば、外部の電源、コントローラ、コネクタ等（いずれも図示せず）へ接続されうる。 It does not matter what the other end of the electric wire 65 is connected to, but for example, it can be connected to an external power supply, controller, connector, or the like (neither is shown).
このような第１の実施形態によれば、シート抵抗率が低い（すなわち電気伝導率が高い）が柔軟性が低い導電プレート５０は、柔軟性が低くても比較的小さい面積で、可撓性シート部材３０のシート抵抗率が低い導電面（導電層３３）に面接続され、かつ、可撓性シート部材３０のシート抵抗率が低い導電面が比較的広い面積で電極パッド４４に面接続される。したがって、電極パッド４４のシート抵抗率が比較的高くても、従来の接続構造のような界面での過度の発熱を抑えつつ、かつ比較的狭い面積の導電プレート５０の使用で足りることから柔軟性を失う領域を最小限に抑えることができる接続構造が実現される。 According to the first embodiment, the conductive plate 50 having a low sheet resistivity (that is, a high electrical conductivity) but a low flexibility has a relatively small area even if the flexibility is low. The conductive surface of the sheet member 30 having a low sheet resistivity (conductive layer 33) is surface-connected, and the conductive surface of the flexible sheet member 30 having a low sheet resistivity is surface-connected to the electrode pad 44 with a relatively large area. You. Therefore, even if the sheet resistivity of the electrode pad 44 is relatively high, it is sufficient to suppress excessive heat generation at the interface as in the conventional connection structure and to use the conductive plate 50 having a relatively small area. A connection structure capable of minimizing the area where the loss occurs is realized.
（応用例）
図４に、実施形態の接続構造の応用例を示す。図４（ａ）（ｂ）（ｃ）は、本実施形態の接続構造を利用した大電力フィルム状回路の一例としての面状発熱体（薄膜ヒーター）の平面図、背面図、および一部の部品（電線６５、裸圧着端子６０、導電プレート５０）を省略した背面図である。図１で説明したと同等の面状発熱体の具体例を示している。この面状発熱体は、絶縁性フィルム（絶縁性基材）７９上で、第１の電極パッド７１および第２の電極パッド７３（いずれも電極パッド４４に対応）の間に複数本の電熱線７２を電気的に並列接続の関係で配置する構成を採用している。
(Application example)
FIG. 4 shows an application example of the connection structure of the embodiment. FIGS. 4A, 4B, and 4C are a plan view, a rear view, and a part of a planar heating element (thin film heater) as an example of a high-power film-shaped circuit using the connection structure of the present embodiment. FIG. 4 is a rear view in which components (the electric wire 65, the bare crimp terminal 60, and the conductive plate 50) are omitted. 2 shows a specific example of a planar heating element equivalent to that described in FIG. 1. This planar heating element is formed by a plurality of heating wires on an insulating film (insulating base material) 79 between a first electrode pad 71 and a second electrode pad 73 (both corresponding to the electrode pad 44). A configuration is adopted in which the elements 72 are electrically connected in parallel.
このように、電熱線を細い並列パスで実現するとともに、各電熱線の長さを均一化することにより、発熱分布を均一に保ちつつ電熱線全体のトータルの抵抗値を下げることが可能となる。また、１対の電極を隣接配置する場合にも、比較的簡単な構成で、要発熱領域の全体に亘ってほぼ均一な発熱分布を得ることができるようにするものである。 In this way, the heating wires are realized by thin parallel paths, and the length of each heating wire is made uniform, so that it is possible to lower the total resistance value of the entire heating wire while maintaining a uniform heat generation distribution. . Further, even when a pair of electrodes are arranged adjacent to each other, it is possible to obtain a substantially uniform heat distribution over the entire heat required area with a relatively simple configuration.
すなわち、１対の電極パッド７１，７３を隣接配置することに伴って、複数本の電熱線７２は入れ子状の複数の分割エリア内に配置される。この入れ子の内側の電熱線ほどその蛇行幅（図では矩形波の振幅）が大きくなるようにすることで、各電熱線の長さを均一化することができる。 That is, with the pair of electrode pads 71 and 73 being arranged adjacent to each other, the plurality of heating wires 72 are arranged in a plurality of nested divided areas. The length of each heating wire can be made uniform by making the meandering width (the amplitude of the rectangular wave in the figure) larger as the heating wire is inside the nest.
より具体的には、ＰＥＴやポリイミドのような絶縁性フィルム７９に電熱線７２としての導電パターンを形成したものがフィルム状回路に相当する。その際、絶縁性基材７９上の要発熱領域を、入れ子状に配置されたＫ個（Ｋは２以上の整数、この例ではＫ＝１０）のエリアに分割し、入れ子の外側の分割エリアは内側の分割エリアを取り囲むように設定され、各分割エリアにおいて配置された各電熱線の両端がそれぞれ第１および第２の電極パッド７１，７３に接続されるようにしている。 More specifically, a circuit in which a conductive pattern as the heating wire 72 is formed on an insulating film 79 such as PET or polyimide corresponds to a film circuit. At this time, the heat generation required area on the insulating base material 79 is divided into K (K is an integer of 2 or more, K = 10 in this example) areas arranged in a nested manner, Is set so as to surround the inner divided area, and both ends of each heating wire arranged in each divided area are connected to the first and second electrode pads 71 and 73, respectively.
第１および第２の電極パッド７１，７３はそれぞれＫ本の電熱線７２の配置幅に対応する長手方向のサイズを有する。図４では黒色の矩形領域で示してある。両電極パッド７１，７３の接続構造は同じなので、以下では電極パッド７１について説明する。 Each of the first and second electrode pads 71 and 73 has a size in the longitudinal direction corresponding to the arrangement width of the K heating wires 72. In FIG. 4, it is indicated by a black rectangular area. Since the connection structure between the two electrode pads 71 and 73 is the same, the electrode pad 71 will be described below.
フィルム状回路４０の表面（電熱線および電極パッドのある面）に、可撓性シート部材３０がその導体層３３を電極パッド７１に向けて面接続される。可撓性シート部材３０の上からラミネートフィルム２０が被着される。図４（ａ）に示した構成では最上層に位置するが、ラミネートフィルム２０は透明の材質を想定しているので、図４（ａ）では見えない。可撓性シート部材３０は図では灰色の矩形領域で示し、電極パッド７１とほぼ同等のサイズを有するものとして示してある。図４（ｃ）に表れるように、フィルム状回路の電極パッド７１の端子位置には、導電プレート５０のサイズより大きい開口４３が設けられている。図４（ｃ）では開口４３から可撓性シート部材３０の導電層３３が見えている。組み立て時には、この開口４３に対して、導電プレート５０および（電線６５を接続した）裸圧着端子６０が位置合わせされ、ラミネートフィルム２０から裸圧着端子６０までの全部品が圧着具１１（１１ａ，１１ｂ）で圧着される。図４においてシーリング樹脂７０は図示省略してある。 The flexible sheet member 30 is surface-connected to the surface of the film circuit 40 (the surface on which the heating wires and the electrode pads are provided) with the conductor layer 33 facing the electrode pads 71. The laminate film 20 is applied from above the flexible sheet member 30. In the configuration shown in FIG. 4A, it is located on the uppermost layer, but cannot be seen in FIG. 4A because the laminate film 20 is assumed to be a transparent material. The flexible sheet member 30 is indicated by a gray rectangular area in the drawing, and has a size substantially equal to that of the electrode pad 71. As shown in FIG. 4C, an opening 43 that is larger than the size of the conductive plate 50 is provided at a terminal position of the electrode pad 71 of the film circuit. In FIG. 4C, the conductive layer 33 of the flexible sheet member 30 can be seen from the opening 43. At the time of assembly, the conductive plate 50 and the bare crimp terminal 60 (to which the electric wire 65 is connected) are aligned with the opening 43, and all the components from the laminate film 20 to the bare crimp terminal 60 are attached to the crimping tool 11 (11a, 11b). ). In FIG. 4, the sealing resin 70 is not shown.
このような構成により、シート抵抗率が低い（すなわち電気伝導率が高い）が柔軟性が低い導電プレート５０は、柔軟性が低くても比較的小さい面積で、可撓性シート部材３０のシート抵抗率が低い導電面（導電層３３）に面接続され、かつ、可撓性シート部材３０のシート抵抗率が低い導電面が比較的広い面積で電極パッド７１に面接続される。したがって、電極パッド７１のシート抵抗率が比較的高くても、従来の接続構造のような界面での過度の発熱を抑えつつ、かつ比較的狭い面積の導電プレート５０の使用で足りることから柔軟性を失う領域を最小限に抑えることができる接続構造が実現される。 With such a configuration, the conductive plate 50 having low sheet resistivity (that is, high electric conductivity) but low flexibility has a relatively small area even if flexibility is low, and the sheet resistance of the flexible sheet member 30 is small. The conductive surface of the flexible sheet member 30 having low sheet resistivity is surface-connected to the electrode pad 71 with a relatively large area. Therefore, even if the sheet resistivity of the electrode pad 71 is relatively high, it is sufficient to use the conductive plate 50 having a relatively small area while suppressing excessive heat generation at the interface as in the conventional connection structure. A connection structure capable of minimizing the area where the loss occurs is realized.
また、このように絶縁性基材（絶縁性のフィルム）７９上に、銀インクなどの導電性インクを用いて、電熱線および電極パッドを導電パターンとして印刷することにより、製作が容易でかつ安価な面状発熱体が提供される。この面状発熱体は、その特性として、フレキシブル性があり、印刷される導電パターンの幅および長さで抵抗値を変更できる利点を有する。このような面状発熱体は、産業用、業務用、家庭用に種々の用途に利用されることが期待される。 In addition, by printing the heating wires and the electrode pads as conductive patterns on the insulating base material (insulating film) 79 using a conductive ink such as a silver ink, the manufacturing is easy and inexpensive. A flat sheet heating element is provided. This sheet heating element has flexibility as a characteristic, and has an advantage that the resistance value can be changed by the width and length of the conductive pattern to be printed. Such a planar heating element is expected to be used for various purposes such as industrial use, business use, and home use.
また、ヒーター以外の大電力フィルム状回路の用途例としては、太陽光発電パネルの送電用電線や従来の商用電源の電気コードの代替(壁裏に埋め込む等)が考えられる。 Examples of applications of the high-power film circuit other than the heater include a power transmission wire for a photovoltaic power generation panel and a conventional electric power cord for commercial power supply (embedding in the back of a wall, etc.).
（第２の実施形態）
図５に、本発明の第２の実施形態による、フィルム状回路４０に接続対象導体を接続する接続構造の概略構成を説明するための分解側面図を示す。本実施形態では接続対象導体として電線６５を例とするが、電線に限るものではない。
(Second embodiment)
FIG. 5 is an exploded side view for explaining a schematic configuration of a connection structure for connecting a connection target conductor to the film-shaped circuit 40 according to the second embodiment of the present invention. In the present embodiment, the electric wire 65 is taken as an example of the connection target conductor, but the conductor is not limited to the electric wire.
第１の実施形態と同様の要素には同じ参照符号を付して、重複した説明は省略する。第２の実施形態が第１の実施形態と異なる点は、第１の実施形態の接続構造における導電プレート５０を省略したことである。すなわち、高導電性の裸圧着端子６０の例えば丸型の接触端子部６３が直接、可撓性シート部材３０の導体層３３に面接触して十分な電気的接続ができれば、導電プレート５０はなくてもよい。フィルム状回路４０の開口４３は必要に応じて拡大等、修正を行う。 Elements that are the same as in the first embodiment are given the same reference numerals, and duplicate descriptions are omitted. The second embodiment differs from the first embodiment in that the conductive plate 50 in the connection structure of the first embodiment is omitted. That is, if the round contact terminal portion 63 of the highly conductive bare crimp terminal 60 directly contacts the conductor layer 33 of the flexible sheet member 30 to make a sufficient electrical connection, the conductive plate 50 is not provided. You may. The opening 43 of the film-like circuit 40 is modified or enlarged as necessary.
図６に、本実施形態における完成形の接続構造の側面断面図を示す。この図から分るように、裸圧着端子６０は開口４３を介して可撓性シート部材３０の導体層３３に直接面接触した状態で圧着される。 FIG. 6 shows a side sectional view of the completed connection structure in the present embodiment. As can be seen from this figure, the bare crimp terminal 60 is crimped in direct contact with the conductor layer 33 of the flexible sheet member 30 via the opening 43.
電線６５を通過する電流は、電線６５と接続された裸圧着端子６０、可撓性シート部材３０の導体層３３、フィルム状回路４０の導電パターン４２、の順に流れる（またはこの逆の向きに流れる）。 The current passing through the electric wire 65 flows in the order of the bare crimp terminal 60 connected to the electric wire 65, the conductor layer 33 of the flexible sheet member 30, and the conductive pattern 42 of the film-like circuit 40 (or the reverse direction). ).
なお、図５および図６において、図示の都合上、各部品の厚さは誇張して示してあり、必ずしも実際を反映させたものではない。応用例については第１の実施形態と同様、図４に示した大電力フィルム状回路等に応用可能である。 In FIGS. 5 and 6, the thickness of each component is exaggerated for convenience of illustration, and does not necessarily reflect the actual situation. As in the first embodiment, application examples are applicable to the high-power film-shaped circuit shown in FIG.
このような第２の実施形態によれば、シート抵抗率が低い（すなわち電気伝導率が高い）が柔軟性が低い裸圧着端子６０は、柔軟性が低くても比較的小さい面積で、可撓性シート部材３０のシート抵抗率が低い導電面（導電層３３）に面接続され、かつ、可撓性シート部材３０のシート抵抗率が低い導電面が比較的広い面積で電極パッド４４に面接続される。したがって、電極パッド４４のシート抵抗率が比較的高くても、従来の接続構造のような界面での過度の発熱を抑えつつ、かつ比較的狭い面積の裸圧着端子６０の使用で足りることから柔軟性を失う領域を最小限に抑えることができる接続構造が実現される。 According to the second embodiment, the bare crimp terminal 60 having a low sheet resistivity (that is, a high electrical conductivity) but a low flexibility has a relatively small area even if the flexibility is low. The conductive surface of the flexible sheet member 30 having a low sheet resistivity (conductive layer 33) is surface-connected, and the conductive surface of the flexible sheet member 30 having a low sheet resistivity is surface-connected to the electrode pad 44 with a relatively large area. Is done. Therefore, even if the sheet resistance of the electrode pad 44 is relatively high, it is sufficient to use the bare crimp terminal 60 having a relatively small area while suppressing excessive heat generation at the interface as in the conventional connection structure. A connection structure that can minimize the area that loses the connection is realized.
（第３の実施形態）
図７に、本発明の第３の実施形態による、フィルム状回路４０に接続対象導体を接続する接続構造の概略構成を説明するための分解側面図を示す。本実施形態では接続対象導体として電線６５を例とするが、電線に限るものではない。
(Third embodiment)
FIG. 7 is an exploded side view for explaining a schematic configuration of a connection structure for connecting a connection target conductor to the film circuit 40 according to the third embodiment of the present invention. In the present embodiment, the electric wire 65 is taken as an example of the connection target conductor, but the conductor is not limited to the electric wire.
第１の実施形態と同様の要素には同じ参照符号を付して、重複した説明は省略する。第３の実施形態が第１の実施形態と異なる点は、第１の実施形態の接続構造における裸圧着端子６０を省略したことである。すなわち、接続対象導体としての電線６５の銅線６６を圧着具１１の本体部１１ａの軸部に巻きつける形で、銅線６６を導電プレート５０の背面に接触させる。 Elements that are the same as in the first embodiment are given the same reference numerals, and duplicate descriptions are omitted. The third embodiment differs from the first embodiment in that the bare crimp terminal 60 in the connection structure of the first embodiment is omitted. That is, the copper wire 66 is brought into contact with the back surface of the conductive plate 50 in such a manner that the copper wire 66 of the electric wire 65 as the conductor to be connected is wound around the shaft of the main body 11 a of the crimping tool 11.
図８に、本実施形態における完成形の接続構造の側面断面図を示す。この図から分るように、電線６５の銅線６６は導電プレート５０の背面に直接面接触した状態で、圧着される。電線６５を通過する電流は、導電プレート５０、可撓性シート部材３０の導体層３３、フィルム状回路４０の導電パターン４２、の順に流れる（またはこの逆向きに流れる）。 FIG. 8 shows a side sectional view of the completed connection structure in the present embodiment. As can be seen from this figure, the copper wire 66 of the electric wire 65 is crimped in direct contact with the back surface of the conductive plate 50. The current passing through the electric wire 65 flows in the order of the conductive plate 50, the conductive layer 33 of the flexible sheet member 30, and the conductive pattern 42 of the film circuit 40 (or flows in the reverse direction).
なお、図７および図８において、図示の都合上、各部品の厚さは誇張して示してあり、必ずしも実際を反映させたものではない。応用例については第１の実施形態と同様、図４に示した大電力フィルム状回路等に応用可能である。 7 and 8, the thickness of each component is exaggerated for the sake of illustration, and does not necessarily reflect the actual situation. As in the first embodiment, application examples are applicable to the high-power film-shaped circuit shown in FIG.
このような第３の実施形態によれば、シート抵抗率が低い（すなわち電気伝導率が高い）が柔軟性が低い導電プレート３０は、柔軟性が低くても比較的小さい面積で、可撓性シート部材３０のシート抵抗率が低い導電面（導電層３３）に面接続され、かつ、可撓性シート部材３０のシート抵抗率が低い導電面が比較的広い面積で電極パッド４４に面接続される。したがって、電極パッド４４のシート抵抗率が比較的高くても、従来の接続構造のような界面での過度の発熱を抑えつつ、かつ比較的狭い面積の導電プレート５０の使用で足りることから柔軟性を失う領域を最小限に抑えることができる接続構造が実現される。 According to such a third embodiment, the conductive plate 30 having low sheet resistivity (that is, high electrical conductivity) but low flexibility has a relatively small area even if flexibility is low, and is flexible. The conductive surface of the sheet member 30 having a low sheet resistivity (conductive layer 33) is surface-connected, and the conductive surface of the flexible sheet member 30 having a low sheet resistivity is surface-connected to the electrode pad 44 with a relatively large area. You. Therefore, even if the sheet resistivity of the electrode pad 44 is relatively high, it is sufficient to suppress excessive heat generation at the interface as in the conventional connection structure and to use the conductive plate 50 having a relatively small area. A connection structure capable of minimizing the area where the loss occurs is realized.
（変形例）
以上、本発明の好適な実施の形態について説明したが、本発明は上記の構成以外にも種々の変形、変更を行うことができる。
(Modification)
As described above, the preferred embodiments of the present invention have been described. However, the present invention can be variously modified and changed in addition to the above-described configuration.
例えば、可撓性シート部材３０は、可撓性の絶縁体層（例えば樹脂フィルム）３１の一面に導体層（例えば金属箔）３３が形成された二重構造フィルムとしたが、低シート抵抗の可撓性の金属箔単独であってもよい。但し、二層構造フィルムの方が、現状市販されている金属箔に比べて、コシの強さ、しわが発生しにくさの点で有利である。 For example, the flexible sheet member 30 has a double structure film in which a conductor layer (for example, a metal foil) 33 is formed on one surface of a flexible insulator layer (for example, a resin film) 31, but has a low sheet resistance. The flexible metal foil alone may be used. However, the two-layer structure film is more advantageous in terms of stiffness and less occurrence of wrinkles than currently available metal foils.
ラミネートフィルム２０は、上述したように、絶縁、防水、導電パターンの物理的保護のためには実際上必要となる要素であるが、機能的には本発明の接続構造に必須の要素ではない。 As described above, the laminate film 20 is an element that is actually necessary for insulation, waterproofing, and physical protection of the conductive pattern, but is not functionally essential for the connection structure of the present invention.
シーリング樹脂７０も同様に実際上必要となる要素であるが、機能的には本発明の接続構造に必須の要素ではない。 Similarly, the sealing resin 70 is a necessary element in practice, but is not a functionally essential element in the connection structure of the present invention.
電線はワイヤーに限るものではなくフレキシブルケーブルのようなものであってもよい。 The electric wire is not limited to a wire, but may be a flexible cable.
１１：圧着具
１１ａ：本体部
１１ｂ：受部
２０：ラミネートフィルム
２２：透孔
３０：可撓性シート部材
３１：可撓性の絶縁体層（樹脂フィルム）
３２：透孔
３３：導体層
４０：フィルム状回路（印刷フィルム）
４１：絶縁性フィルム
４２：導電パターン
４３：開口
４４：電極パッド
５０：導電プレート
５２：透孔
６０：裸圧着端子（対象導体接続具）
６２：開口
６３：接触端子部
６４：基部
６５：電線
６６：銅線
７０：シーリング樹脂
７１：電極パッド
７２：電熱線
７３：電極パッド
７９：絶縁性基材（絶縁性のフィルム）
11: crimping tool 11a: body part 11b: receiving part 20: laminated film 22: through hole 30: flexible sheet member 31: flexible insulator layer (resin film)
32: Through hole 33: Conductive layer 40: Film circuit (printed film)
41: insulating film 42: conductive pattern 43: opening 44: electrode pad 50: conductive plate 52: through hole 60: bare crimp terminal (target conductor connector)
62: Opening 63: Contact terminal 64: Base 65: Electric wire 66: Copper wire 70: Sealing resin 71: Electrode pad 72: Heating wire 73: Electrode pad 79: Insulating base material (insulating film)
Claims (7)
導電パターンおよび電極パッドを導電性インクで表面上に形成したフィルム状回路と、
前記フィルム状回路よりシート抵抗率が低い導電面を有する可撓性シート部材と、
導電プレートと、
接続対象導体が接続される基部および接触端子部を有する対象導体接続具と、
圧着手段とを備え、
前記フィルム状回路は、前記電極パッドの部分に形成された開口を有し、当該電極パッドにおいて前記可撓性シート部材と面接続されるとともに、
前記フィルム状回路の開口を介して前記導電プレートが前記可撓性シート部材の導電面に面接続されたものに対して、前記導電プレートの背面から前記対象導体接続具の接触端子部が重ねられ、前記可撓性シート部材、前記導電プレートおよび前記対象導体接続具が相互に前記圧着手段により圧着されたことを特徴とする
接続構造。 A connection structure for connecting a connection target conductor to a film-like circuit,
A film-like circuit in which a conductive pattern and an electrode pad are formed on the surface with conductive ink,
A flexible sheet member having a conductive surface having a lower sheet resistivity than the film circuit,
A conductive plate;
A target conductor connection tool having a base and a contact terminal to which the connection target conductor is connected,
With crimping means,
The film-shaped circuit has an opening formed in the portion of the electrode pad, and is surface-connected to the flexible sheet member at the electrode pad,
For what said conductive plate through the opening of the film-like circuit is surface connected to the conductive surface of the flexible sheet member, the contact terminal portion of the target conductor connecting device from the rear of the conductive plate is superimposed the flexible sheet member, before connecting structure Kishirubeden plate and the target conductor connecting device is characterized in that it is crimped by the crimping means to each other.
導電パターンおよび電極パッドを導電性インクで表面上に形成したフィルム状回路と、
前記フィルム状回路よりシート抵抗率が低い導電面を有する可撓性シート部材と、
接続対象導体が接続される基部および接触端子部を有する対象導体接続具と、
圧着手段とを備え、
前記フィルム状回路は、前記電極パッドの部分に形成された開口を有し、当該電極パッドにおいて前記可撓性シート部材と面接続されるとともに、
前記フィルム状回路の開口を介して前記対象導体接続具の接触端子部が前記可撓性シート部材の導電面に面接続され、前記可撓性シート部材と前記対象導体接続具とが相互に前記圧着手段により圧着されたことを特徴とする
接続構造。 A connection structure for connecting a connection target conductor to a film-like circuit,
A film-like circuit in which a conductive pattern and an electrode pad are formed on the surface with conductive ink,
A flexible sheet member having a conductive surface having a lower sheet resistivity than the film circuit,
A target conductor connection tool having a base and a contact terminal to which the connection target conductor is connected,
With crimping means,
The film-shaped circuit has an opening formed in a portion of the electrode pad, and is surface-connected to the flexible sheet member at the electrode pad,
The film contact terminal of the target conductor connecting device through the opening in the shaped circuit is surface connected to the conductive surface of the flexible sheet member, before Symbol flexible sheet member and said target conductor connecting device to one another A connection structure characterized by being crimped by the crimping means.
導電パターンおよび電極パッドを導電性インクで表面上に形成したフィルム状回路と、
前記フィルム状回路よりシート抵抗率が低い導電面を有する可撓性シート部材と、
導電プレートと、
軸部を有する本体部と前記軸部が係合する受部とからなる圧着具を含む圧着手段とを備え、
前記フィルム状回路は、前記電極パッドの部分に形成された開口を有し、当該電極パッドにおいて前記可撓性シート部材と面接続されるとともに、
前記フィルム状回路の開口を介して前記導電プレートが前記可撓性シート部材の導電面に面接続されたものに、前記圧着具の軸部が縦挿され、前記軸部に前記接続対象導体が巻きつけられた状態で、前記圧着手段により前記可撓性シート部材、前記導電プレートおよび前記接続対象導体が相互に圧着されたことを特徴とする
接続構造。 A connection structure for connecting a connection target conductor to a film-like circuit,
A film-like circuit in which a conductive pattern and an electrode pad are formed on the surface with conductive ink,
A flexible sheet member having a conductive surface having a lower sheet resistivity than the film circuit,
A conductive plate;
Crimping means including a crimping tool comprising a main body having a shaft and a receiving portion with which the shaft is engaged,
The film-shaped circuit has an opening formed in the portion of the electrode pad, and is surface-connected to the flexible sheet member at the electrode pad,
A shaft portion of the crimping tool is vertically inserted into a surface of the conductive plate that is surface-connected to the conductive surface of the flexible sheet member through an opening of the film circuit, and the conductor to be connected is inserted into the shaft portion. connection structure wound state, the flexible sheet member by said pressing means, the front Kishirubeden plate and the connection target conductor is characterized in that it is crimped to each other.
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