CN106710756A - Circuit protection assembly with external electrical test points - Google Patents
Circuit protection assembly with external electrical test points Download PDFInfo
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- CN106710756A CN106710756A CN201611183713.1A CN201611183713A CN106710756A CN 106710756 A CN106710756 A CN 106710756A CN 201611183713 A CN201611183713 A CN 201611183713A CN 106710756 A CN106710756 A CN 106710756A
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- Prior art keywords
- copper foil
- copper
- test point
- positive temperature
- protection element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Thermistors And Varistors (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a circuit protection assembly. The circuit protection assembly comprises a copper-foil-coated laminated plate, a protection element with a resistance positive temperature effect, a conducting part and electrical test points. The protection element with the resistance positive temperature effect is arranged in the copper-foil-coated laminated plate and formed by tightly clamping a polymer-based conducting composite layer between two metal electrode slices, the polymer-based conducting composite layer comprises at least one polymer base material and at least one kind of conducting powder with the electrical resistivity smaller than 100 microohm.cm, and the particle size distribution range of the conducting powder is 0.1 microohm to 50 microohms. The protection element with the resistance positive temperature effect and a protected circuit are electrically connected through the conducting part. The electrical characteristics of the protection element with the resistance positive temperature effect can be detected through the electrical test points. The circuit protection assembly can save the installation space of the circuit protection element and has good detectability and environmental reliability.
Description
Technical field
The present invention relates to a kind of circuit protecting assembly with external electrical test point, belong to macromolecule electronic component, especially
It is it is a kind of the protection element with resistance positive temperature degree effect is built in copper-clad laminate, and with external electrical survey
The circuit protecting assembly of pilot.
Background technology
Polymer base conductive composite material can maintain relatively low resistance value at a normal temperature, with reacting temperature change
Sharp characteristic, i.e., when overcurrent occurs in circuit or high temperataure phenomena is crossed, its resistance can increase to a high value moment, make electricity
Road is in off state, to reach the purpose of protection circuit element.Therefore the guarantor that polymer base conductive composite material can be prepared
Protection element is connected in circuit, used as the material of current sensing.Such material has been widely used in electronic circuit protection
On component.
With the development of intelligent mobile terminal, electronic component high current and miniaturization are the trend for developing.However, traditional
The circuit protecting element for being assemblied in PCB surface limited by more and more limited space, such as need further improving performance
When, the limitation in space causes its performance boost and its limited, if circuit protecting element is built in inside copper-clad laminate,
Both the influence that circuit protecting element gauge strips come can significantly have been reduced, but area to circuit protecting element brings larger setting
Meter space.Also, circuit protecting element is sealed in inside copper-clad laminate, external environment is largely reduced to it
Influence, therefore with preferable environmental reliability.But, once broken down in circuit, it is impossible to detect to be built in and cover copper
The electrical characteristic of the circuit protecting element inside foil laminate, causes trouble point to confirm.In addition, in electronic component assembling
During, it is sometimes desirable to carry out electric property sorting.Therefore test point is set on the surface of such built-in device, can confirm that
Whether it is that built-in element occurs in that failure, it is also possible to which the sorting of electron component electric property brings convenience.
Then the applicant's application number 2016109037960 provides a kind of circuit protecting assembly, comprising by two metals
The protection element with resistance positive temperature degree effect that closely clamping polymer base conductive composite material layer is constituted between electrode slice,
There is through hole one copper-clad laminate, centre, and described protection element is located in through hole, and the copper-clad laminate is used as the circuit
The substrate upper and lower surface of component is protected to be provided with adhesive layer, it is gluing with upper and lower that described protection element is coated on into copper-clad laminate
In the space that layer is constituted；The protection element with resistance positive temperature degree effect and electric by protection circuit is made by conductive component
Connection；Wherein, the polymer base conductive composite material layer is low comprising at least one polymeric substrate and at least one resistivity
In the conductive powder of 100 μ Ω .cm, the conductive powder particle size distribution range is between 0.1 μm~50 μm.The invention circuit is protected
Protecting assembly can save the installing space of circuit protecting element, and with good environmental reliability.But cannot immediately understand tool
There is the protection element of resistance positive temperature degree effect.
The content of the invention
Present invention aim at：A kind of circuit protecting assembly with external electrical test point is provided, is protected in adaptive circuit
While shield device miniaturization requirement, the environmental reliability and detectability of circuit brake are improved.
Another object of the present invention is：The manufacturer of the above-mentioned circuit protecting assembly with external electrical test point is provided
Method.
The object of the invention is realized by following proposal：A kind of circuit protecting assembly with external electrical test point, comprising
By the guarantor with resistance positive temperature degree effect that closely clamping polymer base conductive composite material layer is constituted between two metal electrode films
Protection element, also includes：
A () copper-clad laminate, used as the substrate of the circuit protecting assembly, there is the accommodation space of protection element centre, described
The protection element with resistance positive temperature degree effect be located in accommodation space, be combined through adhesive layer and Copper Foil up and down in substrate；
B () has the protection element of resistance positive temperature degree effect, be built in described copper clad laminate, the polymer-matrix electric conduction
Conductive powder of the composite layer comprising at least one polymeric substrate and at least one resistivity less than 100 μ Ω .cm, it is described
Conductive powder particle size distribution range is between 0.1 μm~50 μm；
C () conductive component, makes the protection element with resistance positive temperature degree effect and is electrically connected by protection circuit；
D () electric test point, is arranged on the surface insulation layer of the circuit protecting assembly, be not by insulating barrier covering part, or
It is and described in the electric test point not formed by plating, spraying, chemical plating last layer conductive material in upper insulating barrier covering part
Protection element electrical connection with resistance positive temperature degree effect.
Be built in circuit protecting element inside copper-clad laminate by the present invention, can both reduce with resistance positive temperature degree effect
Protection element thickness, influence of the external environment to it can be reduced again, with excellent environmental reliability.In addition, by setting
Electric test point on circuit protecting assembly surface can easily detect be placed in inside circuit protecting assembly with just
The electrical characteristic of the protection element of temperature effect.It is by the conductive component that the protection with resistance positive temperature degree effect is first
Part is serially connected with and conductive path is formed in protection circuit.
On the basis of such scheme, the copper-clad plate lamination plate is individual layer, double-deck or multilager base plate, substrate through adhesive layer with
Copper Foil is combined, and described substrate is paper substrate copper-clad laminate, glass fabric base copper-clad laminate, compound base copper-clad
One kind or combination in pressing plate, build-up multilayerboard base copper-clad laminate or ceramic base copper-clad laminate.
On the basis of such scheme, described adhesive layer is using phenolic resin, epoxy resin, polyester resin, span come acyl
Imine modified cyanate resin, polyimide resin, diphenylene ether resin, maleic anhydride imines-styrene resin, polycyanate ester
One kind or its combination in resin, vistanex.
On the basis of such scheme, the conductive powder is selected from:Carbon series conductive powder, metal dust, conductivity ceramics powder
In one kind or secondly plant the above mixture.
On the basis of such scheme, the carbon series conductive powder is：Carbon black, carbon fiber, CNT, graphite, Graphene
And their mixture；
The metal dust is：One kind and its mixture in copper, nickel, cobalt, iron, tungsten, tin, lead, silver, gold, platinum or its alloy；
The conductivity ceramics powder is：Metal nitride, metal carbides, metal boride, metal silicide, layer structure pottery
The mixture of one or more among porcelain powder；
On the basis of such scheme, the metal boride is tantalum boride, tantalum diboride, vanadium boride, vanadium diboride, two boronations
Zirconium, titanium diboride, niobium (Nb) boride, niobium dioxide, the molybdenum of boronation two, the molybdenum of five boronation two, hafnium boride, the tungsten of boronation two, tungsten boride, boronation
One kind among two chromium, chromium boride, two chromium borides or the chromium of three boronation five.
On the basis of such scheme, the metal nitride be tantalum nitride, vanadium nitride, zirconium nitride, titanium nitride, niobium nitride or
One kind in hafnium nitride.
On the basis of such scheme, the metal carbides be ramet, vanadium carbide, zirconium carbide, titanium carbide, niobium carbide,
One kind among dimolybdenum carbide, hafnium carbide, tungsten carbide, ditungsten carbide or Cr3C2.
On the basis of such scheme, the metal silicide is tantalum silicide, the tantalum of three silication five, the vanadium of silication three, two silication
Vanadium, zirconium disilicide, titanium disilicide, the titanium of three silication five, niobium disilicide, molybdenum disilicide, two hafnium suicides, tungsten silicide, the chromium of silication three
Or two one kind among chromium silicide.
On the basis of such scheme, layered structural ceramics powder is Sc2InC、Ti2AlC、Ti2GaC、Ti2InC、
Ti2TlC、V2AlC、V2GaC、Cr2GaC、Ti2AlN、Ti2GaN、Ti2InN、V2GaN、Cr2GaN、Ti2GeC、Ti2SnC、Ti2PbC、
V2GeC、Cr2SiC、Cr2GeC、V2PC、V2AsC、Ti2SC、Zr2InC、Zr2TlC、Nb2AlC、Nb2GaC、Nb2InC、Mo2GaC、
Zr2InN、Zr2TlN、Zr2SnC、Zr2PbC、Nb2SnC、Nb2PC、Nb2AsC、Zr2SC、Nb2SC、Hf2SC、Hf2InC、Hf2TlC、
Ta2AlC、Ta2GaC、Hf2SnC、Hf2PbC、Hf2SnN、Ti3AlC2、V3AlC2、Ta3AlC2、Ti3SiC2、Ti3GeC2、Ti3SnC2、
Ti4AlN3、V4AlC3、Ti4GaC3、Nb4AlN3、Ta4AlC3、Ti4SiC3、Ti4GeC3Among one kind and its mixture.
On the basis of such scheme, the shape of described conductive component is point-like, wire, banding, lamellar, column, circle
Shape through hole, half-round cross hole, arc-shaped through-hole, blind hole, other irregular shapes and combinations thereof body.Conductive component base material be nickel,
One kind and their alloy in copper, aluminium, zinc, tin, bismuth, indium, silver, gold.
On the basis of such scheme, the number of the electric test point is 2 or more than 2, is from base material：Nickel, copper,
One kind and their alloy in aluminium, zinc, tin, bismuth, indium, silver, gold.
On the basis of such scheme, described electric test point is located at the same surface or not of the circuit protecting assembly
Same surface.
On the basis of such scheme, the electric test point is shaped as round point shape, wire, banding, triangle, polygon
Shape, other irregular shapes and their assembly.
On the basis of such scheme, the polymeric substrate is：Polyethylene, haloflex, oxidic polyethylene, polychlorostyrene second
It is alkene, hycar, acrylonitrile-butadiene-styrene copolymer, polystyrene, makrolon, polyamide, poly-
Acid imide, polyethylene terephthalate, polybutylene terephthalate (PBT), polyphenylene oxide, polyphenylene sulfide, polyformaldehyde, phenolic aldehyde
Resin, polytetrafluoroethylene (PTFE), tetrafluoraoethylene-hexafluoropropylene copolymer, poly- trifluoro-ethylene, polyvinyl fluoride, maleic anhydride are grafted poly- second
Alkene, polypropylene, Kynoar, epoxy resin, ethylene-vinyl acetate copolymer, polymethyl methacrylate, ethylene-propylene
One kind and its mixture in acid copolymer.
The present invention provides a kind of manufacture method of described circuit protecting assembly, according to following step：
First, using copper-clad laminate as the protective substrate of the protection element with resistance positive temperature degree effect, will be by with electricity
Composite conducting polymer material basic unit, lower metal electrode and the upper metal electrode composition for hindering positive temperature effect have resistance positive temperature degree
The protection element of effect is placed in the base material of copper-clad laminate, by semi-curing glue adhesion coating hot pressing copper-clad laminate base
, then be pressed together on Copper Foil on semi-curing glue adhesion coating by the surface of material, and Copper Foil is performed etching, and at least forms left and right in upper surface
Upper Copper Foil；
Second, the protection element with resistance positive temperature degree effect is built in described copper clad laminate, and above-mentioned polymer matrix is led
Conductive powder of the composite layer comprising at least one polymeric substrate and at least one resistivity less than 100 μ Ω .cm, institute
Conductive powder particle size distribution range is stated between 0.1 μm~50 μm；
3rd, described conductive component has three, and be electrically connected for Copper Foil on upper metal electrode and side by a conductive component, another
With lower Copper Foil be electrically connected lower metal electrode by conductive component；3rd conductive component is by Copper Foil on lower Copper Foil and opposite side by electricity
Gas is connected；
4th, described electric test point has two, is placed in the upper surface of the circuit protecting assembly, by Copper Foil on left and right with
It is described with resistance positive temperature degree effect protection element electrical connection, two described electric test points be respectively upper left Copper Foil and
The part not covered by upper insulating barrier on upper right Copper Foil, be shaped as round point shape, wire, banding, triangle, it is polygon-shaped or
Person their assembly.
Or, described conductive component has two, is electrically connected lower metal electrode with upper left Copper Foil by a conductive component
Connect, be electrically connected upper right metal electrode and upper right Copper Foil by another conductive component, make described with resistance positive temperature degree effect
Protection element and be electrically connected by protection circuit.
Or, described conductive component has three, and upper metal electrode is electric with Copper Foil on side by a conductive component
Connection, lower metal electrode is electrically connected by another conductive component with Copper Foil on opposite side, then lower Copper Foil is led by the 3rd
Electric part is electrically connected with upper metal electrode, makes the protection element with resistance positive temperature degree effect and electric by protection circuit
Connection.
The present invention is advantageous in that：Circuit protecting element is built in inside copper-clad laminate, both can significantly be reduced
The influence that circuit protecting element gauge strips come, but to circuit protecting element area bring it is larger can design space.Also, electricity
Road protection element is sealed in inside copper-clad laminate, influence of the external environment to it is largely reduced, with excellent
Different environmental reliability.In addition, by be arranged on the electric test point on circuit protecting assembly surface can easily detect by
The electrical characteristic of the protection element with positive temperature effect being placed in inside circuit protecting assembly.
Brief description of the drawings
Fig. 1 protection element schematic diagrames with resistance positive temperature degree effect of the invention；
The cross-sectional view of Fig. 2 the 1st embodiments of the present invention；
The cross-sectional view of Fig. 3 the 2nd embodiments of the present invention；
The cross-sectional view of Fig. 4 the 3rd embodiments of the present invention；
Label declaration in figure：
In Fig. 1：
110a --- lower metal electrode film；110b --- upper metal electrode film；
120 --- conducing composite material basic unit；
In Fig. 2：
210a --- lower metal electrode；210b --- upper metal electrode；
220 --- conducing composite material basic unit；
231a --- lower insulating lacquer layer；231b --- upper insulating lacquer layer；
232 --- the base material of copper-clad laminate；
233a --- lower semi-curing glue adhesion coating；233b --- upper semi-curing glue adhesion coating；
240a, 240b, 240c --- conductive component one, two, three；
250a, 250b, 250c --- Copper Foil one, two, three；
260a, 260b --- electric test point one, two；
In Fig. 3：
320 --- conducing composite material basic unit；
310a --- lower metal electrode；310b --- upper metal electrode；
331b --- upper insulating lacquer layer；331a --- lower insulating lacquer layer；
332 --- copper-clad laminate base material；
333a --- lower semi-curing glue adhesion coating；333b --- upper semi-curing glue adhesion coating；
340a, 340b --- conductive component one, two；
350a, 350b --- Copper Foil one, two；
360a, 360b --- electric test point one, two；
In Fig. 4：
420 --- conducing composite material basic unit；
410a --- lower metal electrode；410b --- upper metal electrode；
431b --- upper insulating lacquer layer；431a --- lower insulating lacquer layer；
432 --- copper-clad laminate base material；
433a --- lower semi-curing glue adhesion coating；433b --- upper semi-curing glue adhesion coating；
440a, 440b, --- conductive component one, two, three；
450a, 450b, 450c --- Copper Foil one, two, three；
460a, 460b --- electric test point one, two.
Specific embodiment
For circuit protecting assembly of the invention, its specific embodiment is as follows：
The making of the protection element the, with resistance positive temperature degree effect
By between two metal electrode films closely clamping polymer base conductive composite material layer constitute with resistance positive temperature degree effect
Protection element, wherein, polymer base conductive composite material layer includes at least one polymeric substrate and at least one electricity
Conductive powder of the resistance rate less than 100 μ Ω .cm, the conductive powder particle size distribution range is between 0.1 μm~50 μm.
The polymeric substrate is：Polyethylene, haloflex, oxidic polyethylene, polyvinyl chloride, butadiene-acrylonitrile
It is copolymer, acrylonitrile-butadiene-styrene copolymer, polystyrene, makrolon, polyamide, polyimides, poly- to benzene two
Formic acid glycol ester, polybutylene terephthalate (PBT), polyphenylene oxide, polyphenylene sulfide, polyformaldehyde, phenolic resin, polytetrafluoroethylene (PTFE),
Tetrafluoraoethylene-hexafluoropropylene copolymer, poly- trifluoro-ethylene, polyvinyl fluoride, maleic anhydride grafted polyethylene, polypropylene, poly- inclined fluorine
One kind in ethene, epoxy resin, ethylene-vinyl acetate copolymer, polymethyl methacrylate, ethylene-acrylic acid copolymer
And its mixture.
The conductive powder is selected from:One kind in carbon series conductive powder, metal dust, conductivity ceramics powder or secondly plant with
On mixture, the conductive powder meets resistivity less than 100 μ Ω .cm, and particle size distribution range is between 0.1 μm~50 μm.
By the formula dispensing of polymer, conductive powder PTC base materials general at present.Banbury temperature is set as 180 degree,
Rotating speed is 30 revs/min, after first adding polymer banburying 3 minutes, is subsequently adding conductive filler, is gone out after continuing banburying 15 minutes
Material, obtains the conducing composite material with resistance positive temperature degree effect.
The good conducing composite material with resistance positive temperature degree effect of above-mentioned melting mixing is rolled by mill, is obtained
Thickness is 0.20-0.25 millimeters of the conducing composite material basic unit 120 with resistance positive temperature degree effect, such as Fig. 1.
By the conducing composite material basic unit 120 with resistance positive temperature degree effect, double layer of metal electrode slice is placed in as shown in Figure 1
Between 110a and 110b, the mat surface of metal electrode film 110a and 110b with have resistance positive temperature degree effect conducing composite material
Basic unit 120 combines closely.Above-mentioned three are laminated by the method for hot pressing are closely linked.The temperature of hot pressing is
180 degrees Celsius, pressure be 12 MPas, the time be 10 minutes, finally colded pressing on cold press 10 minutes, obtain by with resistance just
The chip of temperature effect.
By the chip with resistance positive temperature degree effect by punching press or scribing, having shown in Fig. 1 of suitable size is made
The protection element of resistance positive temperature degree effect.
2nd, the circuit protecting assembly being produced as follows.
Embodiment 1
A kind of circuit protecting assembly, comprising above-mentioned by tight clamping polymer base conductive composite material layer between two metal electrode films
The protection element with resistance positive temperature degree effect for constituting, also includes：As shown in Fig. 2
First, copper-clad laminate, used as the substrate of the circuit protecting assembly, there is the accommodation space of protection element centre, on
State by the conducing composite material basic unit 220 with resistance positive temperature degree effect, lower metal electrode 210a and upper metal electrode 210b
The protection element with resistance positive temperature degree effect of composition, is placed in the base material 232 of copper-clad laminate in accommodation space, will be partly
Then be pressed together on for Copper Foil by solidification adhesive layer 233a and 233b hot pressing in the upper and lower surface of the base material 232 of copper-clad laminate
On semi-solid preparation layer, Copper Foil is performed etching, form upper left Copper Foil 250c, upper right Copper Foil 250b and lower Copper Foil 250a；
Second, the protection element with resistance positive temperature degree effect is built in described copper clad laminate, and above-mentioned polymer matrix is led
Conductive powder of the composite layer comprising at least one polymeric substrate and at least one resistivity less than 100 μ Ω .cm, institute
Conductive powder particle size distribution range is stated between 0.1 μm~50 μm；
3rd, conductive component makes the above-mentioned protection element with resistance positive temperature degree effect and is electrically connected by protection circuit, will be upper
Metal electrode 210b is electrically connected by the 240b of conductive component two and upper right Copper Foil 250b, and lower metal electrode 210a passes through conductive part
The 240a of part one is electrically connected with lower Copper Foil 250a, and lower Copper Foil 250a is electric by the 240c of conductive component three with upper left Copper Foil 250c
Connection, in addition, lower Copper Foil 250a and upper right Copper Foil 250b can also be processed into variously-shaped outside line, described conductive part
The shape of part be manhole, or point-like, wire, banding, lamellar, column, half-round cross hole, arc-shaped through-hole, blind hole,
Other irregular shapes and combinations thereof body；
4th, electric test point number is 2, the upper surface of the circuit protecting assembly is placed in, with described with resistance positive temperature
The protection element electrical connection of effect is spent, electric test point is from base material：In nickel, copper, aluminium, zinc, tin, bismuth, indium, silver, gold
A kind of and their alloy.Electric test point preparation method：
Insulating lacquer layer 231b and lower insulating lacquer layer 231a on one layer is covered each by the upper and lower surface of circuit protecting assembly, it is prevented
Its element and outside line electrical contact, electric test point one, two 260a, 260b are located at the upper surface of circuit protecting assembly, point
It is not the part not covered by upper insulating lacquer layer 231b on upper left Copper Foil 250c and upper right Copper Foil 250b, the electric test point
First, two be shaped as round point shape, or wire, banding, triangle, polygon-shaped, other irregular shapes and they
Assembly.The 260a of electric test point one and upper left Copper Foil 250c electrical connections, the 260b of electric test point two and upper right Copper Foil 250b
Electrical connection.The electrical characteristic of the protection element with resistance positive temperature degree effect can be detected by this electric test point.
Printing mark can be accorded with insulating lacquer layer.
Copper-clad plate lamination plate described in the present embodiment is individual layer, double-deck or multilager base plate, and substrate is answered through adhesive layer and Copper Foil
Close, described substrate is paper substrate copper-clad laminate, glass fabric base copper-clad laminate, composite base laminated board covered with copper foil,
One kind or combination in build-up multilayerboard base copper-clad laminate or ceramic base copper-clad laminate.
Semi-curing glue adhesion coating using phenolic resin, epoxy resin, polyester resin, bi-maleimide modified cyanate resin,
In polyimide resin, diphenylene ether resin, maleic anhydride imines-styrene resin, poly-cyanate ester resin, vistanex
One kind or its combination.
The conductive powder is selected from:One kind in carbon series conductive powder, metal dust, conductivity ceramics powder or secondly plant with
On mixture.
The carbon series conductive powder is：Carbon black, carbon fiber, CNT, graphite, Graphene and their mixture.
The metal dust is：One kind and its mixing in copper, nickel, cobalt, iron, tungsten, tin, lead, silver, gold, platinum or its alloy
Thing.
The conductivity ceramics powder is：Metal nitride, metal carbides, metal boride, metal silicide, stratiform knot
The mixture of one or more among structure ceramic powder.Wherein,
The metal boride be tantalum boride, tantalum diboride, vanadium boride, vanadium diboride, zirconium diboride, titanium diboride, niobium (Nb) boride,
Niobium dioxide, the molybdenum of boronation two, the molybdenum of five boronation two, hafnium boride, the tungsten of boronation two, tungsten boride, the chromium of boronation two, chromium boride, two boronations
One kind among chromium or the chromium of three boronation five.
The metal nitride is the one kind in tantalum nitride, vanadium nitride, zirconium nitride, titanium nitride, niobium nitride or hafnium nitride.
The metal carbides are ramet, vanadium carbide, zirconium carbide, titanium carbide, niobium carbide, dimolybdenum carbide, hafnium carbide, carbon
Change the one kind among tungsten, ditungsten carbide or Cr3C2.
The metal silicide is tantalum silicide, the tantalum of three silication five, the vanadium of silication three, two vanadium silicides, zirconium disilicide, two silication
Among titanium, the titanium of three silication five, niobium disilicide, molybdenum disilicide, two hafnium suicides, tungsten silicide, the chromium of silication three or two chromium silicides one
Kind.
Layered structural ceramics powder is Sc2InC、Ti2AlC、Ti2GaC、Ti2InC、Ti2TlC、V2AlC、V2GaC、
Cr2GaC、Ti2AlN、Ti2GaN、Ti2InN、V2GaN、Cr2GaN、Ti2GeC、Ti2SnC、Ti2PbC、V2GeC、Cr2SiC、
Cr2GeC、V2PC、V2AsC、Ti2SC、Zr2InC、Zr2TlC、Nb2AlC、Nb2GaC、Nb2InC、Mo2GaC、Zr2InN、Zr2TlN、
Zr2SnC、Zr2PbC、Nb2SnC、Nb2PC、Nb2AsC、Zr2SC、Nb2SC、Hf2SC、Hf2InC、Hf2TlC、Ta2AlC、Ta2GaC、
Hf2SnC、Hf2PbC、Hf2SnN、Ti3AlC2、V3AlC2、Ta3AlC2、Ti3SiC2、Ti3GeC2、Ti3SnC2、Ti4AlN3、V4AlC3、
Ti4GaC3、Nb4AlN3、Ta4AlC3、Ti4SiC3、Ti4GeC3Among one kind and its mixture.
The polymeric substrate is：Polyethylene, haloflex, oxidic polyethylene, polyvinyl chloride, butadiene-acrylonitrile
It is copolymer, acrylonitrile-butadiene-styrene copolymer, polystyrene, makrolon, polyamide, polyimides, poly- to benzene two
Formic acid glycol ester, polybutylene terephthalate (PBT), polyphenylene oxide, polyphenylene sulfide, polyformaldehyde, phenolic resin, polytetrafluoroethylene (PTFE),
Tetrafluoraoethylene-hexafluoropropylene copolymer, poly- trifluoro-ethylene, polyvinyl fluoride, maleic anhydride grafted polyethylene, polypropylene, poly- inclined fluorine
One kind in ethene, epoxy resin, ethylene-vinyl acetate copolymer, polymethyl methacrylate, ethylene-acrylic acid copolymer
And its mixture.
Embodiment 2
A kind of circuit protecting assembly with external electrical test point, it is approximate with embodiment 1, comprising by by with resistance positive temperature degree
The conducing composite material basic unit 320 of effect, lower metal electrode 310a and upper metal electrode 310b composition with resistance positive temperature degree
The protection element of effect, as shown in Figure 3：
First, copper-clad laminate, used as the substrate of the circuit protecting assembly, there is the accommodation space of protection element centre, on
The protection element with resistance positive temperature degree effect stated is placed in the accommodation space of base material 332 of copper-clad laminate, and lower half is consolidated
Change adhesive layer 333a and upper semi-curing glue adhesion coating 333b hot pressings on the surface of the base material 332 of copper-clad laminate, then, by copper
Paper tinsel is pressed together on lower semi-curing glue adhesion coating 333a and lower semi-curing glue adhesion coating 333b, is answered through adhesive layer and Copper Foil up and down in substrate
Close, Copper Foil is performed etching, form upper left Copper Foil 350a, upper right Copper Foil 350b, left and right upper Copper Foil 350a, 350b can be processed
Into variously-shaped outside line；
Second, the protection element with resistance positive temperature degree effect is built in the base material 332 of copper-clad laminate, the polymerization
Conducting powder of the thing based conductive composite material layer comprising at least one polymeric substrate and at least one resistivity less than 100 μ Ω .cm
End, the conductive powder particle size distribution range is between 0.1 μm~50 μm；
3rd, by the 340a of conductive component one be electrically connected lower metal electrode 310a with upper left Copper Foil 350a by conductive component, will
Upper right metal electrode 310b is electrically connected by the 340b of conductive component two and upper right Copper Foil 350b, is made described with resistance positive temperature degree
The protection element of effect and it is electrically connected by protection circuit；
4th, electric test point is arranged on the surface insulation layer of the circuit protecting assembly, in the upper and lower of circuit protecting assembly
Surface is covered each by upper and lower insulated paint 331b, 331a, prevents other elements and outside line electrical contact, and can print thereon
Brush identifier, electric test point one, two 360a, 360b expose insulating lacquer layer 331b surfaces, are respectively left and right upper Copper Foils
The column electricity that plating, spraying, chemical plating last layer conductive material are formed on the part not covered by insulating lacquer layer on 350a, 350b
Gas test point, wherein, the 360a of electric test point one and upper left Copper Foil 350a electrical connections, the 360b of electric test point two and upper right copper
Paper tinsel 350b is electrically connected, and is electrically connected with the protection element with resistance positive temperature degree effect.
Embodiment 3
A kind of circuit protecting assembly with external electrical test point, it is approximate with embodiment 1, comprising by with resistance positive temperature degree effect
What conducing composite material basic unit 420, lower metal electrode 410a and the upper metal electrode 410b for answering were constituted imitates with resistance positive temperature degree
The protection element answered, as shown in Figure 4：
First, copper-clad laminate, used as the substrate of the circuit protecting assembly, there is the accommodation space of protection element centre, on
The protection element with resistance positive temperature degree effect stated is located in the accommodation space of copper-clad laminate base material 432, by lower semi-solid preparation
Then adhesive layer 433a and upper semi-curing glue adhesion coating 433b hot pressings answer on the surface of copper-clad laminate base material 432 with Copper Foil
Close, Copper Foil is performed etching, form Copper Foil one, two, three 450a, 450b, 450c；
Second, the protection element with resistance positive temperature degree effect is built in described copper clad laminate base material, the polymer
Conducting powder of the based conductive composite material layer comprising at least one polymeric substrate and at least one resistivity less than 100 μ Ω .cm
End, the conductive powder particle size distribution range is between 0.1 μm~50 μm；
3rd, conductive component one, two 440a, 440b, by upper metal electrode 410b by the 440b of conductive component two and Copper Foil two
450b is electrically connected, and lower metal electrode 410a is electrically connected by the 440a of conductive component one and the 450a of Copper Foil one, then by Copper Foil
The two 450b and 450c of Copper Foil three are electrically connected by the 440c of conductive component three, make the protection unit with resistance positive temperature degree effect
Part and it is electrically connected by protection circuit；
4th, electric test point one, two 460a and 460b are arranged on the surface insulation layer of the circuit protecting assembly, in electricity
The surface of road protection component is covered each by insulating lacquer layer 431b and lower insulating lacquer layer 431a, prevents other elements and outside line
Electrical contact, and printing mark can accord with thereon, electric test point one, two 460a, 460b are exposed in upper insulating lacquer layer 431b surfaces,
It is conductive not by plating, spraying, chemical plating last layer in upper insulating lacquer layer 431b covering parts in Copper Foil one, two 450a, 450b
The electric test point that material is formed, is electrically connected with the protection element with resistance positive temperature degree effect.
Copper Foil one, two, three 450a, 450b, 450c can be processed into variously-shaped outside line.
The wherein 460a of the electric test point one and 450a of Copper Foil one is electrically connected, the 460b of the electric test point two and 450b of Copper Foil two
Electrical connection.
Electric test point one, two 460a, 460b can also be respectively Copper Foils one, not covered by insulated paint on two 450a, 450b
The part of lid.
Present disclosure and feature have revealed that as above, but the present invention for above describing only briefly or pertains only to this
The specific part of invention, feature of the invention may be more more than what content disclosed herein was related to.Therefore, protection model of the invention
Enclose the content that should be not limited to disclosed in embodiment, and the combination of all the elements embodied in different piece should be included in, with
And it is various without departing substantially from replacement of the invention and modification, and covered by claims of the present invention.
Claims (12)
1. a kind of circuit protecting assembly with external electrical test point, comprising by tight clamping polymerization between two metal electrode films
The protection element with resistance positive temperature degree effect that thing based conductive composite material layer is constituted, it is characterised in that：Also include：
（a）Copper-clad laminate, used as the substrate of the circuit protecting assembly, there is the accommodation space of protection element centre, described
The protection element with resistance positive temperature degree effect be located in accommodation space, be combined through adhesive layer and Copper Foil up and down in substrate；
（b）Protection element with resistance positive temperature degree effect, is built in described copper clad laminate, the polymer-matrix electric conduction
Conductive powder of the composite layer comprising at least one polymeric substrate and at least one resistivity less than 100 μ Ω .cm, it is described
Conductive powder particle size distribution range is between 0.1 μm~50 μm；
（c）Conductive component, makes the protection element with resistance positive temperature degree effect and is electrically connected by protection circuit；
（d）Electric test point, is arranged on the surface insulation layer of the circuit protecting assembly, be not by insulating barrier covering part, or
It is and described in the electric test point not formed by plating, spraying, chemical plating last layer conductive material in upper insulating barrier covering part
Protection element electrical connection with resistance positive temperature degree effect.
2. the circuit protecting assembly with external electrical test point according to claim 1, it is characterised in that：It is described to cover copper
Board laminate is individual layer, double-deck or multilager base plate, and substrate is combined through adhesive layer and Copper Foil, and described substrate is that paper substrate is copper foil covered
Pressing plate, glass fabric base copper-clad laminate, composite base laminated board covered with copper foil, build-up multilayerboard base copper-clad laminate or pottery
One kind or combination in porcelain base copper-clad laminate.
3. the circuit protecting assembly with external electrical test point according to claim 1 and 2, it is characterised in that：It is described
Adhesive layer using phenolic resin, epoxy resin, polyester resin, bi-maleimide modified cyanate resin, polyimide resin,
One kind or its group in diphenylene ether resin, maleic anhydride imines-styrene resin, poly-cyanate ester resin, vistanex
Close.
4. the circuit protecting assembly with external electrical test point according to claim 1, it is characterised in that：The conduction
Powder is selected from:One kind or secondly the mixture of the kind above in carbon series conductive powder, metal dust, conductivity ceramics powder.
5. the circuit protecting assembly with external electrical test point according to claim 4, it is characterised in that：
The carbon series conductive powder is：Carbon black, carbon fiber, CNT, graphite, Graphene and their mixture；
The metal dust is：One kind and its mixture in copper, nickel, cobalt, iron, tungsten, tin, lead, silver, gold, platinum or its alloy；
The conductivity ceramics powder is：Metal nitride, metal carbides, metal boride, metal silicide, layer structure pottery
The mixture of one or more among porcelain powder.
6. the circuit protecting assembly with external electrical test point according to claim 1, it is characterised in that：Described leads
The shape of electric part be point-like, wire, banding, lamellar, column, manhole, half-round cross hole, arc-shaped through-hole, blind hole, other
Irregular shape and combinations thereof body.
7. the circuit protecting assembly with external electrical test point according to claim 1, it is characterised in that it is described electrically
The number of test point is 2 or more than 2, is from base material：Nickel, copper, aluminium, zinc, tin, bismuth, indium, silver, gold in one kind and it
Alloy.
8. the circuit protecting assembly with external electrical test point according to claim 1 or 7, it is characterised in that described
Electric test point be located at the circuit protecting assembly same surface or different surfaces.
9. the circuit protecting assembly with external electrical test point according to claim 8, it is characterised in that it is described electrically
Test point is shaped as round point shape, wire, banding, triangle, polygon-shaped, other irregular shapes and their assembly.
10. the manufacturer of the circuit protecting assembly with external electrical test point according to any one of claim 1 to 9
Method, it is characterised in that according to following step：
First, using copper-clad laminate as the protective substrate of the protection element with resistance positive temperature degree effect, will be by with electricity
Composite conducting polymer material basic unit, lower metal electrode and the upper metal electrode composition for hindering positive temperature effect have resistance positive temperature degree
The protection element of effect is placed in the base material of copper-clad laminate, by semi-curing glue adhesion coating hot pressing copper-clad laminate base
, then be pressed together on Copper Foil on semi-curing glue adhesion coating by the surface of material, and Copper Foil is performed etching, and at least forms left and right in upper surface
Upper Copper Foil；
Second, the protection element with resistance positive temperature degree effect is built in described copper clad laminate, and above-mentioned polymer matrix is led
Conductive powder of the composite layer comprising at least one polymeric substrate and at least one resistivity less than 100 μ Ω .cm, institute
Conductive powder particle size distribution range is stated between 0.1 μm~50 μm；
3rd, described conductive component has three, and be electrically connected for Copper Foil on upper metal electrode and side by a conductive component, another
With lower Copper Foil be electrically connected lower metal electrode by conductive component；3rd conductive component is by Copper Foil on lower Copper Foil and opposite side by electricity
Gas is connected；
4th, described electric test point has two, is placed in the upper surface of the circuit protecting assembly, by Copper Foil on left and right with
It is described with resistance positive temperature degree effect protection element electrical connection, two described electric test points be respectively upper left Copper Foil and
The part not covered by upper insulating barrier on upper right Copper Foil, be shaped as round point shape, wire, banding, triangle, it is polygon-shaped or
Person their assembly.
The manufacture method of 11. circuit protecting assemblies with external electrical test point according to claim 10, its feature
It is that described conductive component there are two, is electrically connected lower metal electrode and upper left Copper Foil by a conductive component, by another
Be electrically connected for upper right metal electrode and upper right Copper Foil by one conductive component, makes the protection element with resistance positive temperature degree effect
It is electrically connected with by protection circuit.
The manufacture method of 12. circuit protecting assemblies with external electrical test point according to claim 10, its feature
It is that described conductive component there are three, upper metal electrode is electrically connected by a conductive component with Copper Foil on side, by under
Metal electrode is electrically connected by Copper Foil on another conductive component and opposite side, then by lower Copper Foil by the 3rd conductive component with it is upper
Metal electrode is electrically connected, and makes the protection element with resistance positive temperature degree effect and is electrically connected by protection circuit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183713.1A CN106710756A (en) | 2016-12-20 | 2016-12-20 | Circuit protection assembly with external electrical test points |
| PCT/CN2017/071220 WO2018113059A1 (en) | 2016-12-20 | 2017-01-16 | Circuit protection component with external electrical test point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183713.1A CN106710756A (en) | 2016-12-20 | 2016-12-20 | Circuit protection assembly with external electrical test points |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106710756A true CN106710756A (en) | 2017-05-24 |
Family
ID=58939314
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611183713.1A Pending CN106710756A (en) | 2016-12-20 | 2016-12-20 | Circuit protection assembly with external electrical test points |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106710756A (en) |
| WO (1) | WO2018113059A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109243667A (en) * | 2018-08-17 | 2019-01-18 | 上海长园维安电子线路保护有限公司 | Polymer-based conducing composite material and overflow protecting element |
| CN115244631A (en) * | 2020-02-25 | 2022-10-25 | 力特保险丝公司 | PPTC heaters and materials with stable power and self-limiting characteristics |
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| WO2018113059A1 (en) | 2018-06-28 |
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Address after: 200083 806, floor 8, No. 125, Liuying Road, Hongkou District, Shanghai Applicant after: Shanghai Wei'an Electronic Co.,Ltd. Address before: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Applicant before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
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Address after: Room 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Applicant after: Shanghai Weian Electronics Co.,Ltd. Address before: 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Applicant before: Shanghai Wei'an Electronic Co.,Ltd. |
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