JP6661393B2 - レーザ加工装置 - Google Patents
レーザ加工装置 Download PDFInfo
- Publication number
- JP6661393B2 JP6661393B2 JP2016014504A JP2016014504A JP6661393B2 JP 6661393 B2 JP6661393 B2 JP 6661393B2 JP 2016014504 A JP2016014504 A JP 2016014504A JP 2016014504 A JP2016014504 A JP 2016014504A JP 6661393 B2 JP6661393 B2 JP 6661393B2
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- laser
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- 238000006073 displacement reaction Methods 0.000 description 9
- 238000012937 correction Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
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- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
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- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- -1 LiTaO 3 Chemical compound 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
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- 239000000835 fiber Substances 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
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- 230000003595 spectral effect Effects 0.000 description 1
Images
Landscapes
- Laser Beam Processing (AREA)
- Optical Elements Other Than Lenses (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016014504A JP6661393B2 (ja) | 2016-01-28 | 2016-01-28 | レーザ加工装置 |
US16/072,626 US20190030644A1 (en) | 2016-01-28 | 2017-01-24 | Laser machining device and laser output device |
CN201780008410.2A CN108602159B (zh) | 2016-01-28 | 2017-01-24 | 激光加工装置及激光输出装置 |
DE112017000576.0T DE112017000576T5 (de) | 2016-01-28 | 2017-01-24 | Laserbearbeitungsvorrichtung und laserausgabevorrichtung |
KR1020187022486A KR20180104643A (ko) | 2016-01-28 | 2017-01-24 | 레이저 가공 장치 및 레이저 출력 장치 |
PCT/JP2017/002315 WO2017130953A1 (ja) | 2016-01-28 | 2017-01-24 | レーザ加工装置及びレーザ出力装置 |
CN201720101992.6U CN206598016U (zh) | 2016-01-28 | 2017-01-26 | 激光加工装置 |
TW106103322A TWI723127B (zh) | 2016-01-28 | 2017-01-26 | 雷射加工裝置及雷射輸出裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016014504A JP6661393B2 (ja) | 2016-01-28 | 2016-01-28 | レーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017131943A JP2017131943A (ja) | 2017-08-03 |
JP6661393B2 true JP6661393B2 (ja) | 2020-03-11 |
Family
ID=59504116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016014504A Active JP6661393B2 (ja) | 2016-01-28 | 2016-01-28 | レーザ加工装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6661393B2 (zh) |
CN (1) | CN206598016U (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7278178B2 (ja) * | 2019-09-05 | 2023-05-19 | 株式会社ディスコ | レーザー加工装置の光軸確認方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010155258A (ja) * | 2008-12-26 | 2010-07-15 | Toray Eng Co Ltd | 基板処理装置 |
JP4651731B2 (ja) * | 2009-07-29 | 2011-03-16 | 西進商事株式会社 | レーザースクライブ加工方法 |
JP6121733B2 (ja) * | 2013-01-31 | 2017-04-26 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
JP6258787B2 (ja) * | 2014-05-29 | 2018-01-10 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
-
2016
- 2016-01-28 JP JP2016014504A patent/JP6661393B2/ja active Active
-
2017
- 2017-01-26 CN CN201720101992.6U patent/CN206598016U/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017131943A (ja) | 2017-08-03 |
CN206598016U (zh) | 2017-10-31 |
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