JP6645641B1 - Method of manufacturing contact, contact and switch - Google Patents

Abstract

An object of the present disclosure is to provide a contact element in which an oxide film does not intervene on a joint surface between a pedestal and a contact, and the contact property of the contact and the pedestal is improved. The method of manufacturing a contact according to the present disclosure includes the steps of: forming a groove having a depth from the surface of the contact longer than the width on the surface of the contact; placing the pedestal on the stage of the ultrasonic bonding machine; Placing a contact on the pedestal so that the pedestal and the surface on which the groove is formed are in contact; contacting the ultrasonic horn of the ultrasonic bonding machine with the contact; and ultrasonic energy from the ultrasonic horn. And the step of joining the contact and the pedestal.

Description

  The present disclosure relates to a method for manufacturing a contact including a pedestal and a contact, and a contact.

A contactor including a circuit breaker and a switch includes a contact that is a movable contact and a fixed contact, and the contact includes a contact and a pedestal to which the contact is joined.
Conventionally, as a method of joining a pedestal and a contact, a brazing method using a brazing material has been used. In recent years, an ultrasonic bonding method has been used. The ultrasonic bonding method is an oxide film that covers the joint surface between the contact and the pedestal by ultrasonic vibration by applying an ultrasonic horn by overlapping the contact at a predetermined position on the upper surface of the pedestal made of a metal plate And temporarily fixing the contact and the pedestal. For example, when an ultrasonic bonding method is used to join a contact containing Ag as a main component and a pedestal containing Cu as a main component, an oxide film covering a joint surface between the contact and the pedestal is removed by ultrasonic vibration. Then, a metal alloy of Ag and Cu is formed by the metal diffusion reaction and joined. In addition, in a pedestal and a contact to be ultrasonically bonded, a contact in which a concave portion is formed on a joint surface side with the pedestal has been disclosed (for example, see Patent Document 1).

JP-A-3-156815

  However, when the concave portion is formed in the contact as described above, the timing of contact with the pedestal differs between the bottom surface of the concave portion and the upper surface of the concave portion. Since the upper surface of the concave portion comes into contact with the pedestal before the bottom surface of the concave portion, ultrasonic energy due to ultrasonic vibration is concentrated and the oxide film is easily removed. On the other hand, since ultrasonic energy is not sufficiently transmitted to the bottom surface of the concave portion, it is necessary to apply the ultrasonic horn until the upper surface of the concave portion softens and the bottom surface of the concave portion comes into contact with the pedestal. While the ultrasonic horn is applied until the bottom surface of the recess contacts the pedestal, the frictional heat of the top surface of the recess is transmitted to the bottom surface of the recess, so that the bottom surface of the recess is oxidized to form an oxide film. An oxide film intervened on the bonding surface, leading to a reduction in the bonding strength or a non-bonding state.

  The present disclosure has been made in order to solve the above-described problems, and provides a contact element in which an oxide film is suppressed from intervening on a joint surface between a contact and a pedestal, and the contact property of the contact and the pedestal is improved. The purpose is to do.

  The method of manufacturing a contact according to the present disclosure includes the steps of: forming a groove having a depth from the surface of the contact longer than the width on the surface of the contact; placing the pedestal on the stage of the ultrasonic bonding machine; Placing a contact on the pedestal such that the pedestal and the surface on which the groove is formed are in contact; contacting the ultrasonic horn of the ultrasonic bonding machine with the contact; and ultrasonic energy from the ultrasonic horn. And joining the contact and the pedestal.

The contact of the present disclosure is a contact comprising a pedestal and a contact ultrasonically bonded to the pedestal , a groove is formed on the surface of the contact on the pedestal side, and the groove is at least one of the contact and the pedestal on the surface side. And a portion in which the material and the oxide are mixed more inside than the surface side.

The switch of the present disclosure is a contact comprising a pedestal and a contact ultrasonically bonded to the pedestal , a groove is formed on the surface of the contact on the pedestal side, and the groove is at least one of the contact and the pedestal on the surface side. The contact is composed of a part buried with the material of the above, and a part where the material and the oxide are mixed more inside than the surface side, and a contact base that contacts the contact in the closed state, And a drive control device for driving the pedestal to open and close.

  According to the method for manufacturing a contact of the present disclosure, by forming a groove whose depth from the surface of the contact is longer than the width on the surface of the contact, the joining strength between the pedestal and the contact is improved, and the contact is efficiently performed. Contacts can be manufactured.

  According to the contactor of the present disclosure, a groove is formed on the surface of the contact, a portion buried in the surface of the contact with a material portion of the contact, and a material and oxide of the contact and the pedestal inside the surface side. , The joint strength between the pedestal and the contact can be improved.

  According to the switch of the present disclosure, a groove is formed on the surface of the contact, a portion buried on the surface side of the contact with a material portion of the contact, and a material and oxide of the contact and the pedestal on the inside more than the surface side. , The joint strength between the pedestal and the contact point is improved, and it can be more stable.

FIG. 2 is an example of a schematic diagram showing a first embodiment of a contact before ultrasonic bonding of a contact constituted by a contact and a pedestal. 3 is an example of a flowchart of a manufacturing process of a contact including a contact and a pedestal according to the first embodiment; FIG. 3 is an example of a schematic view corresponding to the manufacturing process of the contact shown in FIG. 2. FIG. 2 is a diagram showing only one groove portion in a TT cross-sectional view after ultrasonic bonding viewed from the z direction in FIG. 1. FIG. 2 is an SS cross-sectional view after ultrasonic bonding viewed from the x direction in FIG. 1. 9 is a table showing the measurement results of the bonding strength between the contact and the pedestal after ultrasonic bonding in each pattern in which the length of the groove and the distance between the grooves are changed. FIG. 7 is a graph based on the table shown in FIG. 6, in which the vertical axis represents the bonding strength (MPa) and the horizontal axis represents ta / t. FIG. 2 is a TT cross-sectional view after ultrasonic bonding in the case of patterns 1 to 5 as viewed from the direction of the arrow z in FIG. 1. FIG. 2 is an SS cross-sectional view after ultrasonic bonding in a case of patterns 1 to 5 viewed from a direction indicated by an arrow x in FIG. 1. FIG. 2 is a TT cross-sectional view after ultrasonic bonding in the case of patterns 6 to 10 viewed from the direction of the arrow z in FIG. 1. FIG. 2 is an SS cross-sectional view after ultrasonic bonding in the case of a pattern 6 as viewed from a direction indicated by an arrow x in FIG. 1. FIG. 2 is an SS cross-sectional view after ultrasonic bonding in the case of a pattern 10 as viewed from a direction indicated by an arrow x in FIG. 1. FIG. 2 is a TT cross-sectional view after ultrasonic bonding in the case of patterns 11 to 15 viewed from the direction of the arrow z in FIG. 1. FIG. 2 is an SS cross-sectional view after ultrasonic bonding in the case of a pattern 15 viewed from the direction of the arrow x in FIG. 1. FIG. 2 is a cross-sectional view taken along line TT after ultrasonic bonding in the case of patterns 16 to 20, viewed from the direction of the arrow x in FIG. FIG. 2 is an SS cross-sectional view after ultrasonic bonding in the case of patterns 16 to 20, viewed from the direction of the arrow z in FIG. FIG. 2 is a TT cross-sectional view of another example different from the shape of the groove portion of patterns 1 to 20 as viewed from the direction of the arrow z in FIG. 1. FIG. 2 is a cross-sectional view of another example of the groove portions of patterns 1 to 20 after ultrasonic bonding, viewed from the direction of the arrow x in FIG. 1, as another example. The schematic diagram of the example of the switch mounted with the contactor concerning this embodiment.

Embodiment 1 FIG.
The contact according to the present embodiment will be described. FIG. 1 shows an example of a schematic diagram before ultrasonic bonding of the contact 6 according to the present embodiment.
As shown in FIG. 1, the contact 6 includes a contact 1 and a pedestal 2.
The material of the contact 1 is, for example, composed mainly of Ag and containing W and C. The material of the pedestal 2 has, for example, Cu as a main component and Sn, Zn, Cr, Fe, W and C.
On the surface of the contact 1, a groove 1a whose depth from the surface of the contact 1 is longer than the width is formed. FIG. 1 shows a state in which a plurality of grooves 1a are formed at intervals in the width direction of the grooves 1a. The surface of the contact 1 in which the groove 1a is formed is a joint surface 5 where the contact 1 and the pedestal 2 are joined.

  In the present embodiment, the length of the contact 1 in the x direction which is the width direction of the groove 1a is wa, the length of the contact 1 in the y direction which is the depth direction of the groove 1a is ta, the depth direction of the groove 1a, and The length of the contact 1 in the z direction, which is the depth direction of the groove 1a, which is a direction perpendicular to the width direction of the groove 1a, is represented by ha. The depth of the groove 1a is represented by t. The distance between the grooves 1a in the width direction of the grooves 1a is represented by w. The length of the pedestal 2 in the x direction is represented by wb, the length of the pedestal 2 in the y direction is represented by tb, and the length of the pedestal 2 in the z direction is represented by hb.

The manufacturing process of the contact 6 according to the present embodiment using the ultrasonic bonding machine will be described with reference to FIGS. 2 and 3.
FIG. 2 is an example of a flowchart illustrating a manufacturing process of the contact 6 according to the present embodiment using an ultrasonic bonding machine. FIG. 3 is an example of a schematic diagram corresponding to the manufacturing process of the contact 6 shown in FIG. When the manufacturing process of FIG. 2 is completed, the contact 6 shown in FIG. 1 is manufactured.
The ultrasonic bonding machine used in the manufacturing process has a stage 3 and an ultrasonic horn 4. The stage 3 and the ultrasonic horn 4 are made of, for example, a SUS material. Further, the stage 3 and the ultrasonic horn 4 are coated with a high melting point material including carbon, DLC (Diamond Like Coating), Ti, W, and Mo so that the stage 3 and the ultrasonic horn 4 do not adhere to the contact 6 by a metal diffusion reaction during ultrasonic bonding. You may.

In step S101 of FIG. 2, as shown in FIG. 3A, a groove 1a whose depth from the surface of the contact 1 is longer than the width is formed on the surface of the contact 1.
In step S102 in FIG. 2, the pedestal 2 is placed and fixed on the stage 3 of the ultrasonic bonding machine as shown in FIG. 3b.
In step S103 of FIG. 2, as shown by c in FIG. 3, on the pedestal 2 on the stage 3 of the ultrasonic bonding machine, the pedestal 2 is brought into contact with the surface of the contact 1 in which the groove 1a is formed. Place contact 1.
In step S104 of FIG. 2, the ultrasonic horn 4 of the ultrasonic bonding machine is brought into contact with the contact 1 as shown in FIG.

In step S105 of FIG. 2, as shown by e in FIG. 3, an arbitrary load and an ultrasonic energy are applied from the ultrasonic horn 4 for an arbitrary time to join the contact 1 and the pedestal 2. An arrow Y in FIG. 3E indicates how the ultrasonic horn 4 is operated. By operating the ultrasonic horn 4 in contact, a joint surface 5 is formed between the contact 1 and the pedestal 2.
In step S106 in FIG. 2, as shown by f in FIG. 3, the ultrasonic horn 4 is lifted, and the contact 6 in which the contact 1 and the pedestal 2 are joined via the joint surface 5 is moved to the stage of the ultrasonic joining machine. 3 to complete.

Next, the groove 1a after the ultrasonic bonding will be described.
FIG. 4 shows only one groove 1a in the TT cross-sectional view after ultrasonic bonding as viewed from the z direction in FIG. FIG. 5 is an SS cross-sectional view after the ultrasonic bonding as viewed from the x direction in FIG. 1.
4 and 5, the portion t1 on the surface side of the contact 1 is continuously filled with a metal component material included in the material of the contact 1 due to the plastic flow of the contact 1. On the other hand, at the portion t2 inside the surface side, the material of the metal component contained in the material of the contact 1 and the pedestal 2 and the oxide 7 are mixed.
That is, the groove portion 1a after the ultrasonic bonding is a mixture of the t1 portion filled with the metal component material included in the material of the contact 1 and the metal component material and the oxide 7 included in the material of the contact 1 and the base 2. It is composed of the t2 portion.

  The oxide 7 in the portion t2 is formed on the bonding surface 5 by the frictional heat generated during the ultrasonic bonding with the natural oxide film of the contact 1 and the pedestal 2 before the ultrasonic bonding, and by the fine sliding by the ultrasonic energy. The bonding surface 5 is formed by the plastic flow and the rejected oxide film.

In order to measure the bonding strength according to the grooves 1a formed before the ultrasonic bonding, the experiments of patterns 1 to 20 were performed by changing the number of the grooves 1a, the depth t, and the interval w between the grooves 1a.
In the experiments with patterns 1 to 20, the shape of the groove 1a formed in the contact 1 before ultrasonic bonding is a slit shape that is linear in the depth direction of the groove 1a. The length of the groove 1a in the depth direction is equal to the length ha of the contact 1 in the z direction, which is the depth direction of the groove 1a.

In the experiments with patterns 1 to 20, the contact 1 had a length wa in the x direction of 10 mm, a length ta in the y direction of 1 mm, and a length ha in the z direction of 5 mm. The pedestal 2 had a length wb in the x direction of 15 mm, a length tb in the y direction of 5 mm, and a length hb in the z direction of 10 mm.
The width of the groove 1a is, for example, about 10 μm.
The joining strength is measured by ultrasonically joining the contact 1 and the pedestal 2 and then pressing a tool of a load cell with a load cell against the side surface of the contact 1. After the fracture, the bonding strength (N) is divided by the area of the bonding surface 5 to calculate the bonding strength per unit area (MPa).
In the experiment with the patterns 1 to 20, the area of the bonding surface 5 is wa × ha = 5 mm × 10 mm = 50 mm ² .
The connection between the contact 1 and the pedestal 2 is performed in the atmosphere. In the experiments using the patterns 1 to 20, the used ultrasonic bonding machine has, for example, a frequency of 50 kHz or more and 200 kHz or less. The joining time can be arbitrarily changed depending on the frequency and the output.

  In the present embodiment, the surface roughness Ra of the bonding surface 5 is 5 μm ≦ Ra <20 μm. The surface roughness Ra is an index of the surface roughness specified in JIS B 0601-2001 (ISO 4287-1997), and means an arithmetic average roughness.

The criterion for determining the bonding strength is 50 MPa. If the measured bonding strength is less than 50 MPa, the strength is insufficient, and if it is 50 MPa or more, it is determined to have sufficient strength. The criterion of 50 MPa is the average joining strength when joining with a brazing material conventionally performed.
Furthermore, if the joining strength is 70 MPa or more, it is determined that the joint has excellent joining strength. 70 MPa, which is a criterion for judging excellent bonding strength, is a value obtained by an experiment performed on patterns 1 to 20.

FIG. 6 shows the measurement results of the bonding strength between the contact 1 and the pedestal 2 after ultrasonic bonding in each pattern in which the depth t of the grooves 1a and the distance w between the grooves 1a before the ultrasonic bonding are changed. It is a table. In the table of FIG. 6, when the bonding strength is less than 50 MPa as a criterion of quality, it is represented by x, when it is 50 MPa or more and less than 70 MPa, and when it is 70 MPa or more, which is a criterion of excellent bonding strength, it is represented by ◎. .
FIG. 7 is a graph based on the table shown in FIG. 6, in which the vertical axis represents the bonding strength (MPa) and the horizontal axis represents ta / t. A range A in FIG. 7 indicates a range of ta / t indicating 70 MPa or more, which is excellent bonding strength. A boundary B in FIG. 7 indicates a criterion for determining excellent bonding strength.
For comparison, the result when the number of the grooves 1a is 0, that is, when there is no groove 1a is shown in the table of FIG. 6 as Comparative Example 1. The bonding strength without the groove 1a was 31 MPa, which was lower than the quality judgment standard of 50 MPa.
Each pattern will be described with reference to FIGS. 8 to 14 for easy understanding.

First, patterns 1 to 5 will be described with reference to FIGS.
FIG. 8 shows that the grooves 1a of the patterns 1 to 5 are formed before the ultrasonic bonding as shown in the schematic diagram of the contact shown in FIG. -It is T sectional drawing. FIG. 9 shows that the grooves 1a of the patterns 1 to 5 are formed before the ultrasonic bonding as shown in the schematic diagram of the contact shown in FIG. It is -S sectional drawing. In the description of the experimental result of the pattern described later, the description will be made with reference to the cross-sectional views.
In Patterns 1 to 5, w = 1.7 mm and wa / w = 5.9 before ultrasonic bonding. ta / t is 21.3 in pattern 1, 20.0 in pattern 2, 12.5 in pattern 3, 8.5 in pattern 4, and 8.0 in pattern 5.

The measurement results of the bonding strength of patterns 1 to 5 will be described in order.
Each of the patterns 1 to 5 was 50 MPa or more and less than 70 MPa, and had sufficient strength.
Although it is 50 MPa or more and less than 70 MPa, it is not 70 MPa or more because the number of the grooves 1 a is larger than other patterns, the grooves 1 a are not filled with the oxide 7, and a partial space is formed. It is considered that the unjoined portion P increases.

Patterns 6 to 10 will be described with reference to FIGS.
FIG. 10 is a TT cross-sectional view after ultrasonic bonding as viewed from the direction of the arrow z in FIG.
Patterns 6 to 10 have w = 2.0 mm and wa / w = 5.0 before ultrasonic bonding. The value of ta / t is 21.3 for pattern 6, 20.0 for pattern 7, 12.5 for pattern 8, 8.5 for pattern 9, and 8.0 for pattern 10.
The measurement results of the bonding strength of patterns 6 to 10 will be described in order.
In patterns 7 to 9, the bonding strength was as high as 70 MPa or more. It is considered that this is because the oxide 7 does not remain on the bonding surface 5 when the inside of the groove 1a is filled with the oxide 7.

In Pattern 6, the bonding strength was 50 MPa or more and less than 70 MPa, and although the strength was sufficient, it was not 70 MPa or more. FIG. 11 is an SS cross-sectional view of the pattern 6 after ultrasonic bonding, as viewed from the direction of the arrow x in FIG. 1.
If the depth t of the groove 1a formed before the ultrasonic bonding is too small, the oxide 7 is filled in the groove 1a after the ultrasonic bonding, and more oxide 7 remains on the bonding surface 5 after the ultrasonic bonding. Therefore, it is considered that the bonding strength was not less than 70 MPa, but was not less than 70 MPa but was not less than 50 MPa.
In the pattern 10, the bonding strength was 50 MPa or more and less than 70 MPa, which was sufficient strength. FIG. 12 is an SS cross-sectional view of the pattern 10 after ultrasonic bonding, as viewed from the direction of the arrow x in FIG.
If the depth t of the groove 1a formed before the ultrasonic bonding is too large compared to other patterns, the oxide 1 does not fill the groove 1a after the ultrasonic bonding, so that the groove 1a becomes a partial space. Since the unjoined portion P with the pedestal 2 increases, it is considered that the joining strength is not less than 70 MPa, but is not less than 50 MPa and less than 70 MPa.

Next, patterns 11 to 15 will be described with reference to FIGS.
FIG. 13 is a TT cross-sectional view after ultrasonic bonding, as viewed from the direction of the arrow z in FIG.
Patterns 11 to 15 have w = 4.5 mm and wa / w = 2.2 before ultrasonic bonding. The value of ta / t is 21.3 for pattern 11, 20.0 for pattern 12, 12.5 for pattern 13, 8.5 for pattern 14, and 8.0 for pattern 15.
The measurement results of the bonding strength of the patterns 11 to 15 will be described in order.
In patterns 12 to 14, the bonding strength was 70 MPa or more.
The pattern 11 had a sufficient bonding strength of 50 MPa or more and less than 70 MPa. FIG. 14 is an SS cross-sectional view of the pattern 11 after ultrasonic bonding, viewed from the direction of the arrow x in FIG. 1.
If the depth t of the groove 1a formed before the ultrasonic bonding is too small compared to other patterns, the oxide 7 is filled in the groove 1a, and further more oxide 7 is formed on the bonding surface 5. Therefore, the bonding strength is considered to be 50 MPa or more and less than 70 MPa.
In Pattern 15, it was 50 MPa or more and less than 70 MPa. If the depth t of the groove 1a formed before the ultrasonic bonding is too large compared to other patterns, the oxide 1 does not fill the groove 1a and forms a partial space. It is thought that the joining strength is 50 MPa or more and less than 70 MPa because unjoined portions increase.

Next, patterns 16 to 20 will be described with reference to FIGS.
FIG. 15 is a TT cross-sectional view after ultrasonic bonding, as viewed from the direction of the arrow z in FIG. FIG. 16 is an SS cross-sectional view after ultrasonic bonding, as viewed from the direction of the arrow x in FIG. 1.
Patterns 16 to 20 had w = 5.0 mm and wa / w = 2.0 before ultrasonic bonding. The value of ta / t is 21.3 for pattern 16, 20.0 for pattern 17, 12.5 for pattern 18, 8.5 for pattern 19, and 8.0 for pattern 20.
The measurement results of the bonding strength of the patterns 16 to 20 will be described in order.
All of the patterns 16 to 20 had a sufficient strength of 50 MPa or more and less than 70 MPa. If the number of the grooves 1a is smaller than that of the other patterns, the amount of the oxide 7 that is not filled in the grooves 1a is larger than the amount of the oxide 7 that is filled in the grooves 1a on the surface of the bonding surface 5. It is considered that this is because 7 remained on the bonding surface 5.

  According to the experiments of the above patterns 1 to 20, in order for the bonding strength to be 50 MPa or more, the depth t of the groove 1a formed before the ultrasonic bonding is ta / 20 ≦ t <ta / 8, As a result, it is preferable that the interval w between the plurality of grooves 1a is preferably wa / 5 ≦ w <wa / 2. After the ultrasonic bonding, the portion t1 filled with the material of the metal component as the material of the contact 1 by plastic flow was 0.1 × t ≦ t1 <0.5 × t.

After the ultrasonic bonding, the t1 portion of the groove 1a on the surface side of the contact 1 is filled with the material of the metal component contained in the material of the contact 1 by plastic flow, and the oxide film formed on the bonding surface 5 is changed to the oxide 7 Is effectively excluded by being included in the t2 portion of the groove 1a which is inside the surface side of the contact 1.
Therefore, in the contact 6 according to the present embodiment, the oxide film does not remain on the bonding surface 5 and the bonding strength is improved.
In addition, when the contact 1 and the pedestal 2 are joined, the time for applying the ultrasonic horn 4 until the bottom surface of the concave portion of the contact required for the contact having the concave portion comes into contact with the pedestal can be reduced. Can be manufactured.

In the present embodiment, in the experiments with patterns 1 to 20, the groove 1a formed in the contact 1 before ultrasonic bonding was formed in a slit shape. The slit-shaped groove 1a is easy to manufacture on the contact 1, and the slit 7 is straight in the depth direction of the groove 1a before ultrasonic bonding, so that the oxide 7 is easily taken into the groove 1a. Therefore, it is preferable that the groove 1a has a slit shape, but it is not limited. The groove 1a may be formed in accordance with a predetermined pattern, and can be arbitrarily changed. For example, FIGS. 17 and 18 show the shape of another example of the groove 1a after the ultrasonic bonding.
For example, FIG. 17 is an SS cross-sectional view after ultrasonic bonding as viewed from the x direction in FIG. 1, and FIG. 18 is a TT cross-sectional view after ultrasonic bonding as viewed from the z direction. As shown in FIG. 17, the groove 1a before ultrasonic bonding may not be straight but may be bent in the width direction of the groove 1a. As shown in FIG. 18, the length of the groove 1a in the depth direction of the groove 1a before ultrasonic bonding may be smaller than the length of the contact 1 in the depth direction of the groove 1a.

  FIG. 19 shows an example of a schematic diagram of a switch mounted with the contact 6 according to the present embodiment. The switch shown in FIG. 19 is provided with a contact table 8 that contacts the contact 1 in the closed state, and a drive control device 9 that drives the pedestal 2 joined to the contact 1. Note that the contact 1 may be joined to the contact base 8.

Further, the range in which the current flowing through the switch is concentrated changes depending on the parallelism and flatness between the contact base 8 and the contact 1. As a result, the amount of heat generated and the amount of impact applied to the contact 1 change depending on the range in which the current is concentrated. Therefore, the depth t of the groove 1a before ultrasonic bonding may be arbitrarily changed according to the contact surface with the contact base 8 that contacts the contact 1 during operation of the switch.
In the switch using the contact 6 according to the present embodiment, the bonding strength between the contact 1 and the pedestal 2 is improved by taking the oxide 7 into the groove 1a formed on the surface of the contact 1 before ultrasonic bonding. Since the contact 6 is improved, the switch is more stable.

DESCRIPTION OF SYMBOLS 1 Contact 1a Groove part 2 Pedestal 5 Joining surface 6 Contact 8 Contact stand 9 Drive control device

Claims (12)

Forming a groove in the surface of the contact, the groove having a depth from the surface of the contact longer than the width;
Placing the pedestal on the stage of the ultrasonic welding machine;
Placing the contact points on the stage on the stage so that the surface and the surface on which the groove is formed are in contact;
Contacting the ultrasonic horn of the ultrasonic bonding machine with the contact,
Applying ultrasonic energy from the ultrasonic horn to join the contact and the pedestal;
A method for manufacturing a contact comprising: The method for manufacturing a contact according to claim 1, wherein a length of the width of the groove is 5 μm to 15 μm. The method for manufacturing a contact according to claim 1, wherein a plurality of the grooves are formed on the surface of the contact at intervals from each other in a width direction of the groove. Assuming that the depth of the groove is t and the length of the contact point in the depth direction of the groove is ta, ta / 20 ≦ t <ta / 8, and
4. The manufacturing of the contact according to claim 3, wherein wa / 5 ≦ w <wa / 2, where wa is a length of the contact in a width direction of the groove and w is an interval between the grooves. 5. Method. The method according to any one of claims 1 to 4, wherein a material of the pedestal includes Cu and W as main components. The method for manufacturing a contact according to claim 1, wherein, when the surface roughness of the surface of the contact is Ra, 5 μm ≦ Ra <20 μm. The method for manufacturing a contact according to any one of claims 1 to 6, wherein the shape of the groove is a slit shape. The length in the depth direction of the groove, which is a direction perpendicular to the depth direction of the groove and the width direction of the groove, is equal to the length of the contact in the depth direction of the groove. The method for producing a contact according to any one of the above. The method for manufacturing a contact according to claim 1, wherein a length of the groove in the depth direction is smaller than a length of the contact in the depth direction of the groove. In a contact comprising a pedestal and a contact ultrasonically bonded to the pedestal,
A groove is formed on the surface of the contact on the pedestal side, and the groove is filled with the material of the contact on the surface, and the contact and the material of the pedestal inside the surface. A contact comprising a portion mixed with an oxide. The contact according to claim 10, wherein 0.1 × t ≦ t1 <0.5 × t, where t is a depth of the groove and t1 is a portion of the groove filled with the material. Child. A contact according to claim 10,
A contact table that contacts the contact when in a closed state;
A drive control device that drives the pedestal to open and close the contact,
Switchgear with.

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