WO2020245920A1 - Method for manufacturing contactor, contactor, and switch - Google Patents

Abstract

The purpose of the present disclosure is to provide a contactor in which the bondability between a contact and a base is improved without the interposition of an oxide film on the bonding surfaces of the base and the contact.　This method for manufacturing a contactor is characterized by comprising: a step for forming, on a surface of the contact, a groove section having a depth, longer than the width threof, from the surface of the contact; a step for placing the base on a stage of an ultrasonic bonding machine; a step for placing the contact on the base on the stage without allowing the base and the surface on which the groove section is formed to come into contact; a step for bringing an ultrasonic horn of the ultrasonic bonding machine into contact with the contact; and a step for applying ultrasonic energy from the ultrasonic horn to bond the contact and the base.

Description

How to make contacts, contacts and switches

The present disclosure relates to a method for manufacturing a contactor including a pedestal and a contact, and the contactor.

A contactor, including a circuit breaker and a switch, comprises a contactor that is a movable contactor and a fixed contactor, which comprises a contact and a pedestal to which the contacts are joined.
Conventionally, a brazing method using a brazing material has been used as a method for joining a pedestal and a contact point. In recent years, the ultrasonic joining method has been used. In the ultrasonic bonding method, contacts are placed on a predetermined position on the upper surface of a pedestal made of a metal plate and an ultrasonic horn is applied, and an oxide film covering the bonding surface between the contacts and the pedestal by ultrasonic vibration. It is a method of temporarily fixing the contact and the pedestal by removing. For example, when the ultrasonic joining method is used to join a contact whose main component is Ag and a pedestal whose main component is Cu, the oxide film covering the joint surface between the contact and the pedestal is removed by ultrasonic vibration. , A metal mixture of Ag and Cu is formed and joined by a metal diffusion reaction. Further, in the pedestal and contact point for ultrasonic bonding, a contact point in which a recess is formed on the bonding surface side with the pedestal is disclosed (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 3-156815

However, when the recess is formed at the contact in this way, the timing of contact with the pedestal differs between the bottom surface of the recess and the top surface of the recess. Since the upper surface of the recess comes into contact with the pedestal before the bottom surface of the recess, the ultrasonic energy due to the vibration of the ultrasonic waves is concentrated and the oxide film is easily removed. On the other hand, since ultrasonic energy is not sufficiently transmitted to the bottom surface of the recess, it is necessary to apply the ultrasonic horn until the top surface of the recess softens and the bottom surface of the recess comes into contact with the pedestal. While the ultrasonic horn is applied until the bottom surface of the recess contacts the pedestal, the frictional heat of the top surface of the recess is transferred to the bottom surface of the recess to oxidize the bottom surface of the recess to form an oxide film, and the contact and the pedestal are connected. An oxide film was present on the joint surface, leading to a decrease in joint strength or a non-adhesive state.

The present disclosure has been made to solve the above-mentioned problems, and provides a contactor which suppresses the intervention of an oxide film on the joint surface between the contact and the pedestal and improves the bondability of the contact and the pedestal. The purpose is to do.

The method for manufacturing a contact of the present disclosure includes a step of forming a groove having a depth from the surface of the contact longer than the width on the surface of the contact, a step of placing a pedestal on a stage of an ultrasonic bonding machine, and a step on the stage. A step of placing contacts on the pedestal of the pedestal so that the pedestal and the surface on which the groove is formed come into contact with each other, a step of bringing the ultrasonic horn of the ultrasonic bonding machine into contact with the contacts, and ultrasonic energy from the ultrasonic horn. In addition, it is characterized by having a step of joining the contact point and the pedestal.

The contacts of the present disclosure are contacts having a pedestal and a contact ultrasonically bonded to the pedestal, in which a groove is formed on the surface of the contact, and the groove is made of at least one of the contact and the pedestal on the surface side. It is characterized in that it is composed of a buried portion and a portion in which a material and an oxide are mixed inside rather than the surface side.

The switch of the present disclosure is a contact having a pedestal and a contact ultrasonically bonded to the pedestal. A groove is formed on the surface of the contact, and the groove is made of at least one of the contact and the pedestal on the surface side. To open and close the contacts, the contact that is composed of the buried part and the part where the material and oxide are mixed inside rather than the surface side, the contact table that contacts the contacts when closed, and the contacts. It is characterized by being equipped with a drive control device for driving the pedestal.

According to the contact manufacturing method of the present disclosure, by forming a groove portion on the surface of the contact whose depth from the surface of the contact is longer than the width, the joint strength between the pedestal and the contact is improved and efficiently. Contactors can be manufactured.

According to the contacts of the present disclosure, a groove is formed on the surface of the contact, and the portion of the contact that is filled with the material portion of the contact on the surface side of the contact and the material and oxide of the contact and the pedestal inside rather than the surface side. The joint strength between the pedestal and the contact can be improved because the portion is composed of the mixed portions.

According to the switch of the present disclosure, a groove is formed on the surface of the contact, and the portion of the contact that is filled with the material portion of the contact on the surface side of the contact, and the material and oxide of the contact and the pedestal inside rather than the surface side. Since it is composed of a mixed portion, the joint strength between the pedestal and the contact point is improved, and it can be made more stable.

An example of a schematic view of a contactor composed of a contact and a pedestal showing the first embodiment before ultrasonic bonding. An example of a flowchart of a contact manufacturing process including a contact and a pedestal showing the first embodiment. An example of a schematic diagram corresponding to the contact manufacturing process shown in FIG. The figure which showed only one groove part in the TT cross-sectional view after ultrasonic bonding seen from the z direction of FIG. FIG. 6 is a cross-sectional view taken along the line SS after ultrasonic bonding as seen from the x direction of FIG. A table showing the measurement results of the bonding strength between the contact point and the pedestal after ultrasonic bonding in each pattern in which the length of the groove and the distance between the grooves are changed. Based on the table shown in FIG. 6, the vertical axis represents the joint strength (MPa) and the horizontal axis represents ta / t. FIG. 2 is a cross-sectional view taken along the line TT after ultrasonic bonding as seen from the direction of the arrow z in FIG. 1 in the case of patterns 1 to 5. FIG. 5 is a sectional view taken along line SS in the case of patterns 1 to 5 after ultrasonic bonding as seen from the direction of the arrow x in FIG. FIG. 2 is a cross-sectional view taken along the line TT after ultrasonic bonding as seen from the direction of the arrow z in FIG. 1 in the case of patterns 6 to 10. FIG. 6 is a sectional view taken along line SS in the case of pattern 6 after ultrasonic bonding as seen from the direction of the arrow x in FIG. FIG. 4 is a sectional view taken along line SS in the case of pattern 10 after ultrasonic bonding as seen from the direction of the arrow x in FIG. FIG. 2 is a cross-sectional view taken along the line TT after ultrasonic bonding as seen from the direction of the arrow z in FIG. 1 in the case of patterns 11 to 15. FIG. 5 is a sectional view taken along line SS in the case of pattern 15 after ultrasonic bonding as seen from the direction of the arrow x in FIG. FIG. 2 is a cross-sectional view taken along the line TT after ultrasonic bonding as seen from the direction of the arrow x in FIG. 1 in the case of patterns 16 to 20. FIG. 2 is a cross-sectional view taken along the line SS in the case of patterns 16 to 20 after ultrasonic bonding as seen from the direction of the arrow z in FIG. FIG. 2 is a cross-sectional view taken along the line TT as seen from the direction of the arrow z in FIG. 1, which is an example different from the shape of the groove portion of patterns 1 to 20. Another example of the shape of the groove portion of the patterns 1 to 20, is a cross-sectional view taken along the line SS in FIG. 1 as seen from the direction of the arrow x in FIG. 1 after ultrasonic bonding. The schematic diagram of the example of the switch equipped with the contact according to this embodiment.

Embodiment 1.
The contactor according to the present embodiment will be described. FIG. 1 shows an example of a schematic view of the contactor 6 according to the present embodiment before ultrasonic bonding.
As shown in FIG. 1, the contact 6 includes a contact 1 and a pedestal 2.
The material of the contact 1 is assumed to contain, for example, Ag as a main component and W and C as a main component. The material of the pedestal 2 is, for example, Cu as a main component and Sn, Zn, Cr, Fe, W and C.
A groove portion 1a having a depth from the surface of the contact 1 longer than the width is formed on the surface of the contact 1. FIG. 1 shows a state in which a plurality of groove portions 1a are formed at intervals in the width direction of the groove portions 1a. The surface of the contact 1 on which the groove 1a is formed is a joint surface 5 which is a surface where the contact 1 and the pedestal 2 are joined.

In the present embodiment, the length of the contact 1 in the x direction, which is the width direction of the groove 1a, is wa, the length of the contact 1 in the y direction, which is the depth direction of the groove 1a, is ta, the depth direction of the groove 1a, and The length of the contact 1 in the z direction, which is the depth direction of the groove portion 1a, which is the direction perpendicular to the width direction of the groove portion 1a, is represented by ha. Further, the depth of the groove portion 1a is represented by t. The distance between the groove portions 1a in the width direction of the groove portions 1a is represented by w. The length of the pedestal 2 in the x direction is represented by wb, the length of the pedestal 2 in the y direction is represented by tb, and the length of the pedestal 2 in the z direction is represented by hb.

A manufacturing process of the contactor 6 according to the present embodiment using an ultrasonic bonding machine will be described with reference to FIGS. 2 and 3.
FIG. 2 is an example of a flowchart showing a manufacturing process of the contactor 6 according to the present embodiment using an ultrasonic bonding machine. FIG. 3 is an example of a schematic diagram corresponding to the manufacturing process of the contact 6 shown in FIG. When the manufacturing process of FIG. 2 is completed, the contact 6 shown in FIG. 1 will be manufactured.
The ultrasonic bonding machine used in the manufacturing process has a stage 3 and an ultrasonic horn 4. The stage 3 and the ultrasonic horn 4 are made of, for example, SUS material. Further, the stage 3 and the ultrasonic horn 4 are coated with a high melting point material containing carbon, DLC (Diamond Like Coating), Ti, W, and Mo so as not to be fixed to the contact 6 by a metal diffusion reaction at the time of ultrasonic bonding. You may.

In step S101 of FIG. 2, as shown by a in FIG. 3, a groove portion 1a having a depth from the surface of the contact 1 longer than the width is formed on the surface of the contact 1.
In step S102 of FIG. 2, as shown by b of FIG. 3, the pedestal 2 is placed and fixed on the stage 3 of the ultrasonic bonding machine.
In step S103 of FIG. 2, as shown by c of FIG. 3, the pedestal 2 and the surface of the contact 1 on which the groove 1a is formed come into contact with each other on the pedestal 2 on the stage 3 of the ultrasonic bonding machine. Place contact 1.
In step S104 of FIG. 2, as shown by d of FIG. 3, the ultrasonic horn 4 of the ultrasonic bonding machine is brought into contact with the contact 1.

In step S105 of FIG. 2, as shown by e of FIG. 3, an arbitrary load and an arbitrary time ultrasonic energy are applied from the ultrasonic horn 4 to join the contact 1 and the pedestal 2. The arrow Y of e in FIG. 3 shows how the ultrasonic horn 4 is operated. By contacting and operating the ultrasonic horn 4, a joint surface 5 is formed between the contact 1 and the pedestal 2.
In step S106 of FIG. 2, as shown by f in FIG. 3, the ultrasonic horn 4 is lifted and the contact 6 to which the contact 1 and the pedestal 2 are bonded via the bonding surface 5 is placed on the stage of the ultrasonic bonding machine. Take out from 3 and complete.

Next, the groove portion 1a after ultrasonic bonding will be described.
FIG. 4 shows only one groove portion 1a in the TT cross-sectional view after ultrasonic bonding as seen from the z direction of FIG. FIG. 5 is a cross-sectional view taken along the line SS as seen from the x direction of FIG. 1 after ultrasonic bonding.
The t1 portion on the surface side of the contact 1 shown in FIGS. 4 and 5 is seamlessly filled with the material of the metal component contained in the material of the contact 1 due to the plastic flow of the contact 1. On the other hand, in the t2 portion inside the surface side, the metal component material contained in the materials of the contact 1 and the pedestal 2 and the oxide 7 are mixed.
That is, the groove 1a after ultrasonic bonding is a mixture of the t1 portion filled with the metal component material contained in the contact 1 material, the metal component material contained in the contact 1 and the pedestal 2, and the oxide 7. It is composed of the t2 part.

The oxide 7 in the t2 portion is formed on the bonding surface 5 by the frictional heat of the contact 1 and the pedestal 2 before ultrasonic bonding and the frictional heat at the time of ultrasonic bonding, and is formed by fine sliding by ultrasonic energy. It is formed by an oxide film in which the bonding surface 5 is plastically flowed and excluded.

In order to measure the bonding strength according to the groove 1a formed before ultrasonic bonding, the experiments of patterns 1 to 20 were carried out by changing the number of the grooves 1a, the depth t and the distance w between the grooves 1a.
In the experiments in patterns 1 to 20, the shape of the groove 1a formed in the contact 1 before ultrasonic bonding is a slit shape that is linear in the depth direction of the groove 1a. Further, the length of the groove portion 1a in the depth direction is equal to the length ha of the contact point 1 in the z direction, which is the depth direction of the groove portion 1a.

In the experiments in patterns 1 to 20, the contact point 1 had a length wa in the x direction of 10 mm, a length ta in the y direction of 1 mm, and a length ha in the z direction of 5 mm. The pedestal 2 has a length wb in the x direction of 15 mm, a length tb in the y direction of 5 mm, and a length hb in the z direction of 10 mm.
The width of the groove 1a is, for example, about 10 μm.
The bonding strength is measured by ultrasonically bonding the contact 1 and the pedestal 2 and then pressing a load meter tool with a load cell against the side surface of the contact 1. After breaking, the joint strength (N) is divided by the area of the joint surface 5 to calculate the joint strength (MPa) per unit area.
In the experiments with patterns 1 to 20, the area of the joint surface 5 is wa × ha = 5 mm × 10 mm = 50 mm ² .
The contact point 1 and the pedestal 2 are joined in the atmosphere. Further, the ultrasonic bonding machine used is, for example, one having a frequency of 50 KHz or more and 200 KHz or less in the experiments with patterns 1 to 20. The joining time can be arbitrarily changed depending on the frequency and output.

In the present embodiment, the surface roughness Ra of the joint surface 5 is 5 μm ≦ Ra <20 μm. The surface roughness Ra is an index of the surface roughness standardized in JIS B 0601-2001 (ISO 4287-1997) and means the arithmetic mean roughness.

The criterion for determining the quality of the joint strength is 50 MPa. If the measured joint strength is less than 50 MPa, it is judged to be insufficient strength, and if it is 50 MPa or more, it is determined to have sufficient strength. The criterion of 50 MPa is the average bonding strength when bonded with a conventional brazing material.
Further, if the bonding strength is 70 MPa or more, it is determined that the bonding strength is excellent. 70 MPa, which is a criterion for determining the excellent bonding strength, is a value obtained by an experiment in which patterns 1 to 20 are performed.

FIG. 6 shows the measurement results of the bonding strength between the contact 1 and the pedestal 2 after ultrasonic bonding in each pattern in which the depth t of the groove 1a before ultrasonic bonding and the distance w between the groove 1a are changed. It is a table. In the table of FIG. 6, when the bonding strength is less than 50 MPa, which is the criterion for judging good or bad, it is indicated by ×, when it is 50 MPa or more and less than 70 MPa, it is indicated by 〇, and when it is 70 MPa or more, which is the criterion for determining the excellent bonding strength, it is indicated by ⊚. ..
FIG. 7 shows a graph in which the vertical axis represents the joint strength (MPa) and the horizontal axis represents ta / t, based on the table shown in FIG. The range A in FIG. 7 shows the range of ta / t showing an excellent bonding strength of 70 MPa or more. Boundary B in FIG. 7 shows a criterion for excellent joint strength.
For comparison, the result when the number of groove portions 1a is 0, that is, when there is no groove portion 1a is shown in the table of FIG. 6 as Comparative Example 1. The joint strength without the groove 1a was 31 MPa, which was lower than the quality judgment standard of 50 MPa.
Each pattern will be described with reference to FIGS. 8 to 14 with reference to the table of FIG. 6 for easy understanding.

First, patterns 1 to 5 will be described with reference to FIGS. 8 and 9.
FIG. 8 shows T after ultrasonic bonding as viewed from the arrow direction of z in FIG. 1, assuming that the groove portions 1a of patterns 1 to 5 were formed before ultrasonic bonding as in the schematic view of the contacts shown in FIG. -T sectional view. FIG. 9 shows S after ultrasonic bonding as seen from the arrow direction of x in FIG. 1, assuming that the groove portions 1a of patterns 1 to 5 are formed before ultrasonic bonding as in the schematic view of the contacts shown in FIG. -S sectional view. In the explanation of the experimental results of the pattern described later, a cross-sectional view will be similarly described.
In patterns 1 to 5, w = 1.7 mm and wa / w = 5.9 before ultrasonic bonding. The ta / t is 21.3 for pattern 1, 20.0 for pattern 2, 12.5 for pattern 3, 8.5 for pattern 4, and 8.0 for pattern 5.

The measurement results of the joint strengths of patterns 1 to 5 will be described in order.
All of the patterns 1 to 5 were 50 MPa or more and less than 70 MPa, and had sufficient strength.
Although it is 50 MPa or more and less than 70 MPa, the reason why it is not 70 MPa or more is that the number of groove portions 1a is larger than that of other patterns, and the groove portions 1a are not filled with the oxide 7, and a part of the space is formed. It is considered that this is because the unjoined portion P increases.

Patterns 6 to 10 will be described with reference to FIGS. 10 to 12.
FIG. 10 is a cross-sectional view taken along the line TT after ultrasonic bonding as seen from the direction of the arrow z in FIG.
Patterns 6 to 10 are w = 2.0 mm and wa / w = 5.0 before ultrasonic bonding. The ta / t is 21.3 for pattern 6, 20.0 for pattern 7, 12.5 for pattern 8, 8.5 for pattern 9, and 8.0 for pattern 10.
The measurement results of the joint strengths of patterns 6 to 10 will be described in order.
In patterns 7 to 9, the bonding strength was as high as 70 MPa or more. It is considered that this is because the inside of the groove 1a is filled with the oxide 7, so that the oxide 7 does not remain on the joint surface 5.

In pattern 6, the bonding strength was 50 MPa or more and less than 70 MPa, which was sufficient strength but not 70 MPa or more. FIG. 11 is a cross-sectional view taken along the line SS in the case of pattern 6 after ultrasonic bonding as seen from the direction of the arrow x in FIG.
If the depth t of the groove 1a formed before ultrasonic bonding is too small, the oxide 7 is filled in the groove 1a after ultrasonic bonding, and more oxide 7 remains on the bonding surface 5. Therefore, it is considered that the bonding strength is not 70 MPa or more, but 50 MPa or more but less than 70 MPa.
In pattern 10, the bonding strength was 50 MPa or more and less than 70 MPa, which was sufficient strength. FIG. 12 is a cross-sectional view taken along the line SS in the case of pattern 10 after ultrasonic bonding as seen from the direction of the arrow x in FIG.
If the depth t of the groove 1a formed before ultrasonic bonding is too large as compared with other patterns, the inside of the groove 1a will not be filled with oxide 7 after ultrasonic bonding, resulting in a partial space. Since the unbonded portion P with the pedestal 2 increases, it is considered that the bonding strength is not 70 MPa or more but 50 MPa or more and less than 70 MPa.

Next, patterns 11 to 15 will be described with reference to FIGS. 13 and 14.
FIG. 13 is a cross-sectional view taken along the line TT after ultrasonic bonding as viewed from the direction of the arrow z in FIG.
Patterns 11 to 15 are w = 4.5 mm and wa / w = 2.2 before ultrasonic bonding. The ta / t is 21.3 for the pattern 11, 20.0 for the pattern 12, 12.5 for the pattern 13, 8.5 for the pattern 14, and 8.0 for the pattern 15.
The measurement results of the joint strengths of patterns 11 to 15 will be described in order.
In patterns 12 to 14, the bonding strength was excellent at 70 MPa or more.
In pattern 11, the bonding strength was 50 MPa or more and less than 70 MPa. FIG. 14 is a cross-sectional view taken along the line SS in the case of pattern 11 after ultrasonic bonding as seen from the direction of the arrow x in FIG.
If the depth t of the groove 1a formed before ultrasonic bonding is too small as compared with other patterns, the oxide 7 is filled in the groove 1a, and more oxide 7 is formed on the bonding surface 5. It is considered that the bonding strength is 50 MPa or more and less than 70 MPa because it remains in.
In pattern 15, it was 50 MPa or more and less than 70 MPa. If the depth t of the groove 1a formed before ultrasonic bonding is too large as compared with other patterns, the inside of the groove 1a is not filled with the oxide 7, and a part of the space is formed. It is considered that the bonding strength is 50 MPa or more and less than 70 MPa because the number of unbonded portions increases.

Next, patterns 16 to 20 will be described with reference to FIGS. 15 and 16.
FIG. 15 is a cross-sectional view taken along the line TT after ultrasonic bonding as seen from the direction of the arrow z in FIG. FIG. 16 is a sectional view taken along line SS of FIG. 1 after ultrasonic bonding as seen from the direction of the arrow x in FIG.
Patterns 16 to 20 have w = 5.0 mm and wa / w = 2.0 before ultrasonic bonding. The ta / t is 21.3 for the pattern 16, 20.0 for the pattern 17, 12.5 for the pattern 18, 8.5 for the pattern 19, and 8.0 for the pattern 20.
The measurement results of the joint strengths of patterns 16 to 20 will be described in order.
In all of the patterns 16 to 20, the strength was 50 MPa or more and less than 70 MPa, which was sufficient strength. When the number of groove portions 1a is smaller than that of other patterns, the amount of oxide 7 that is filled in the groove portions 1a is larger than that filled in the groove portions 1a on the surface of the joint surface 5, so that the oxides that are not filled in the groove portions 1a are present. It is considered that this is because 7 remains on the joint surface 5.

From the above experiments of patterns 1 to 20, in order for the bonding strength to be 50 MPa or more, the depth t of the groove 1a formed before ultrasonic bonding is ta / 20 ≦ t <ta / 8. As a result, the interval w of the plurality of formed groove portions 1a is preferably wa / 5 ≦ w <wa / 2. Further, after ultrasonic bonding, the t1 portion filled with the metal component material which is the material of the contact 1 by plastic flow was 0.1 × t ≦ t1 <0.5 × t.

After ultrasonic bonding, the t1 portion of the groove 1a on the surface side of the contact 1 is filled with a metal component material contained in the material of the contact 1 by plastic flow, and the oxide film formed on the bonding surface 5 is an oxide 7. As a result, it is efficiently excluded by being included in the t2 portion of the groove portion 1a, which is inside the contact point 1 on the surface side.
Therefore, in the contact 6 according to the present embodiment, the oxide film does not remain on the bonding surface 5, and the bonding strength is improved.
Further, when the contact 1 and the pedestal 2 are joined, the time required to apply the ultrasonic horn 4 until the bottom surface of the concave portion of the contact, which is necessary for the contact having the concave portion, comes into contact with the pedestal can be reduced, which is efficient. Can be manufactured.

In the experiments with patterns 1 to 20, in the present embodiment, the groove portion 1a formed in the contact 1 before ultrasonic bonding has a slit shape. Since the slit-shaped groove portion 1a is easily manufactured on the contact point 1 and the slit shape is linear in the depth direction of the groove portion 1a before ultrasonic bonding, the oxide 7 can be easily taken into the groove portion 1a. Therefore, the groove portion 1a preferably has a slit shape, but is not limited thereto. The groove portion 1a may be formed as long as it follows a predetermined pattern, and can be arbitrarily changed. For example, FIGS. 17 and 18 show the shape of another example of the groove 1a after ultrasonic bonding.
For example, FIG. 17 is a cross-sectional view of SS after ultrasonic bonding seen from the x direction of FIG. 1, and FIG. 18 is a cross-sectional view of TT after ultrasonic bonding viewed from the z direction. As shown in FIG. 17, the groove portion 1a before ultrasonic bonding may not be linear but may be curved in the width direction of the groove portion 1a. As shown in FIG. 18, the length of the groove portion 1a before ultrasonic bonding in the z direction, which is the depth direction, may be less than the length of the contact point 1 in the depth direction of the groove portion 1a.

Further, FIG. 19 shows an example of a schematic view of a switch equipped with the contactor 6 according to the present embodiment. The switch shown in FIG. 19 is provided with a contact base 8 that contacts the contact 1 in the closed state and a drive control device 9 that drives the pedestal 2 that is joined to the contact 1. The contact 1 may be joined on the contact table 8.

Further, the range in which the current flowing through the switch is concentrated changes depending on the parallelism and flatness of the contact table 8 and the contact 1. As a result, the amount of heat generated and the amount of impact applied to the contact 1 change depending on the range in which the current is concentrated. Therefore, the depth t of the groove 1a before ultrasonic bonding may be arbitrarily changed according to the contact surface with the contact table 8 which comes into contact with the contact 1 when the switch is operated.
In the switch using the contactor 6 according to the present embodiment, the bonding strength between the contact 1 and the pedestal 2 is increased by incorporating the oxide 7 into the groove 1a formed on the surface of the contact 1 before ultrasonic bonding. Since the contactor 6 is improved, the switch becomes more stable.

1 Contact 1a Groove 2 Pedestal 5 Joint surface 6 Contact 8 Contact base 9 Drive control device

Claims (12)

1. A step of forming a groove having a depth from the surface of the contact longer than the width on the surface of the contact.
   Steps to place the pedestal on the stage of an ultrasonic bonding machine,
   A step of placing the contact on the pedestal on the stage so that the pedestal and the surface on which the groove is formed come into contact with each other.
   The step of bringing the ultrasonic horn of the ultrasonic bonding machine into contact with the contact,
   A step of applying ultrasonic energy from the ultrasonic horn to join the contact point and the pedestal,
   A method of manufacturing a contact with.
2. The method for manufacturing a contact according to claim 1, wherein the width of the groove is 5 μm to 15 μm.
3. The method for manufacturing a contact according to claim 1 or 2, wherein a plurality of the grooves are formed on the surface of the contacts at intervals in the width direction of the grooves.
4. Assuming that the depth of the groove is t and the length of the contact in the depth direction of the groove is ta, ta / 20≤t <ta / 8
   The manufacture of the contact according to claim 3, wherein when the length of the contact in the width direction of the groove is wa and the distance between the grooves is w, wa / 5 ≦ w <wa / 2. Method.
5. The method for producing a contact according to any one of claims 1 to 4, wherein the material of the pedestal contains Cu as a main component and W and C.
6. The method for producing a contact according to any one of claims 1 to 5, wherein the surface roughness of the surface of the contact is Ra, and 5 μm ≦ Ra <20 μm.
7. The method for manufacturing a contact according to any one of claims 1 to 6, wherein the shape of the groove is a slit shape.
8. Claims 1 to 7 are characterized in that the length in the depth direction of the groove portion, which is the direction perpendicular to the depth direction of the groove portion and the width direction of the groove portion, is equal to the length of the contact point in the depth direction of the groove portion. The method for producing a contact according to any one of the above items.
9. The method for manufacturing a contact according to any one of claims 1 to 7, wherein the length of the groove portion in the depth direction is less than the length of the contact point in the depth direction of the groove portion.
10. In a contact with a pedestal and a contact ultrasonically bonded to the pedestal
    A groove is formed on the surface of the contact, and the groove is formed by a portion of the surface side filled with the material of the contact, and a portion of the contact, the material of the pedestal, and an oxide inside the surface side. A contact that is characterized by being composed of mixed parts.
11. The contact according to claim 10, wherein if the depth of the groove is t and the portion of the groove filled with the material is t1, 0.1 × t ≦ t1 <0.5 × t. Child.
12. The contact according to claim 10 and
    A contact table that contacts the contacts when closed,
    A drive control device that drives the pedestal so as to open and close the contacts,
    Switch equipped with.

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