JP6643613B2 - Capacitor unit - Google Patents

Description

  The technology disclosed in the present application relates to a capacitor unit that is connected to a bus bar that outputs an output signal from a circuit board housed in a metal housing and has a noise capacitor that reduces noise mixed in an output signal transmitted by the bus bar. Things.

  An output voltage or an output signal output from a switching power supply or another electronic device may include noise at an operating frequency of the electronic device or the like or a harmonic frequency thereof. Such noise may have an adverse effect on external electronic devices, and needs to be reduced as necessary. For example, noise generated from a switching power supply mounted on an automobile may be so-called radio noise which is superimposed on an audio signal or the like and adversely affects viewing. On the other hand, for example, in order to remove noise flowing through a conductive bar provided as an output path of an output signal, a noise filter is configured by inserting a conductive bar into a magnetic core (for example, Patent Document 1 and the like). ).

JP 2005-93536 A

  By the way, for example, the circuit design of electric equipment of an automobile including a switching power supply and the like is generally performed by simulation, and the development is advanced while setting how much noise should be suppressed in a signal propagation path. Can be On the other hand, there is a case where a noise value obtained by actually measuring a product completed by repeating the simulation many times does not match a value set in advance by the simulation. This is because, for example, the propagation path of noise in an automobile is complicated and diversified, so that it is conceivable that the predicted value and the measured value obtained by simulation do not match. In this case, the developer may want to change the constant of an LC filter formed of, for example, a choke coil, a capacitor, or the like in accordance with the actually measured value and readjust the noise characteristics of the output path.

  The technology disclosed in the present application has been proposed in view of the above-described problem, and without changing a design in a device with respect to a bus bar that outputs an output signal of a circuit board housed in a metal housing. It is another object of the present invention to provide a capacitor unit that can be additionally mounted to change a noise characteristic.

  A capacitor unit according to the technology disclosed in the present application is a capacitor unit that is connected to a bus bar that outputs an output signal from a circuit board housed in a metal housing and that reduces noise mixed into the output signal. , A capacitor having one terminal connected to the first terminal, a second terminal connected to the other terminal of the capacitor, and a second terminal connected to the second terminal. A contact portion having a pedestal portion and an elastic portion that is pressed against the inner wall of the metal housing and elastically deforms to electrically connect the pedestal portion to the inner wall when the first terminal portion is fixed to the bus bar; It is characterized by.

  The capacitor unit reduces noise mixed in an output signal by connecting a capacitor between the bus bar and the metal housing. The first terminal of the capacitor unit is fixed to the bus bar. On the other hand, the elastic portion of the contact portion elastically deforms and electrically connects the pedestal portion to the inner wall of the metal housing when the first terminal portion is fixed. The capacitor unit can be connected to the metal housing by the contact portion while being fixed to the bus bar. In the capacitor unit, a plurality of types of capacitor units and a plurality of capacitor units can be attached to one bus bar. For this reason, even after the noise is actually measured, a capacitor unit can be additionally connected to the bus bar, and by changing the capacitor unit, etc., the expected value of the noise and the actually measured value are matched or extremely approximated. It is possible to set the value to That is, it is possible to enhance design expandability and to effectively reduce noise by the capacitor unit.

  Further, in the capacitor unit of the present application, the first terminal portion may have an insertion hole for inserting a screw member inserted into the output terminal of the bus bar.

  For example, the bus bar is provided with an output terminal for connecting to an input terminal of an external device that inputs an output signal. This output terminal is fixed to the input terminal by a screw member. At this time, a screw member is inserted into the insertion hole of the first terminal portion of the capacitor unit, and the first terminal portion is fixed to the output terminal or the like by the screw member. In such a configuration, by using an output terminal for outputting the output signal of the bus bar as a connection terminal for connecting the capacitor unit, it is not necessary to separately provide a threaded portion or the like on the bus bar. In addition, by using the output terminal required regardless of the presence or absence of the capacitor unit as a connection portion, it is not necessary to separately provide a portion for connecting the capacitor unit to the bus bar, so that the bus bar can be reduced in size and, consequently, a metal housing. It is possible to reduce the size.

  Further, in the capacitor unit of the present application, the first terminal portion may have a threaded portion that is screwed into a screwing member inserted into the output terminal of the bus bar.

  In the capacitor unit, the first terminal portion can be fixed to the output terminal of the bus bar by the screwing member and the screwed portion. Therefore, even when the threaded portion is not provided at the output terminal of the bus bar, the capacitor unit can be fixed to the output terminal by the threaded member.

  Further, in the capacitor unit of the present application, the first terminal portion may be configured to have a welded portion fixed to the bus bar.

  In the capacitor unit, the first terminal can be firmly fixed to the bus bar by welding, and good conductivity with the bus bar can be secured.

  In the capacitor unit of the present application, the bus bar has a shape extending in one direction, and the first terminal portion, the capacitance portion, and the second terminal portion are sequentially arranged in a direction parallel to the extending direction of the bus bar. May be arranged.

  In the capacitor unit, by arranging the first terminal, the capacitor, and the second terminal in parallel with the bus bar, it is possible to save space in the metal housing.

  The capacitor unit according to the technology disclosed in the present application is a capacitor unit that is connected to a bus bar that outputs an output signal from a circuit board housed in a metal housing and reduces noise mixed in the output signal. A capacitance portion, a capacitance portion is mounted, a wiring board that connects the capacitance portion between the bus bar and the metal housing, and a contact portion that connects the wiring substrate to the metal housing, Having a through hole for inserting the screw member inserted into the output terminal of the bus bar to connect the bus bar to one terminal of the capacitance portion, the contact portion having a pedestal portion connected to the other terminal of the capacitance portion; An elastic portion that is pressed against the inner wall of the metal housing and elastically deforms to electrically connect the pedestal portion to the inner wall in a state where the wiring board is fixed to the bus bar by the screw member.

  In the capacitor unit, the noise mixed into the output signal is reduced by connecting the capacitor between the bus bar and the metal housing. The wiring board of the capacitor unit has a screw member inserted through the insertion hole and is fixed to the output terminal. The wiring board is connected to the bus bar and the capacitor via the insertion hole. The capacitance section is connected to a pedestal section of the contact section. On the other hand, the elastic portion of the contact portion elastically deforms and electrically connects the pedestal portion to the inner wall of the metal housing in a state where the wiring board is fixed to the bus bar. The capacitor unit can be connected to the metal housing by the contact portion while the wiring board is fixed to the bus bar. In the capacitor unit, a plurality of types of capacitor units and a plurality of capacitor units can be attached to one bus bar. For this reason, even after the noise is actually measured, a capacitor unit can be added to or changed from the bus bar.

  According to the capacitor unit according to the technology disclosed in the present application, noise is generated by additionally attaching a busbar that outputs an output signal of a circuit board housed in a metal housing without changing the design in the device. The characteristics can be changed.

FIG. 2 is a circuit diagram in which the filter module provided with the capacitor unit according to the first embodiment is connected to a switching power supply. It is a perspective view showing the state where the capacitor unit of a 1st embodiment was connected to an output terminal and an input terminal stored in a connector receiving part. FIG. 3 is an exploded perspective view of FIG. 2. It is the perspective view which looked at the capacitor unit from the lower back. FIG. 5 is a perspective view showing a state in which a mold part of FIG. 4 is removed. It is a bottom view of a capacitor unit. It is a perspective view showing the state where the capacitor unit of a 2nd embodiment was connected to an output terminal and an input terminal stored in a connector receiving part. It is the perspective view which looked at the capacitor unit of a 2nd embodiment from the lower back, and is a figure showing the state where a mold part was removed. It is a perspective view showing the state where a plurality of chip capacitors were connected. It is a perspective view showing the state where the capacitor unit of a 3rd embodiment was connected to an output terminal and an input terminal stored in a connector receiving part. FIG. 11 is an exploded perspective view of FIG. 10. It is a perspective view showing the state where the capacitor unit of a 4th embodiment was connected to the output terminal stored in the connector storage part. It is a perspective view showing the state where the capacitor unit of a 5th embodiment was connected to an output terminal and an input terminal stored in a connector receiving part. It is a top view of the capacitor unit of a 5th embodiment. It is a perspective view showing the state where the capacitor unit of a 6th embodiment was connected to an output terminal and an input terminal stored in a connector receiving part. It is the perspective view which looked at the capacitor unit of a 6th embodiment from the lower back.

(1st Embodiment)
Hereinafter, a capacitor unit 10 of a first embodiment which is an embodiment of the capacitor unit of the present invention will be described with reference to the drawings. FIG. 1 is a circuit diagram when a filter module 13 to which the capacitor unit 10 of the first embodiment is connected is connected to a switching power supply 15. The switching power supply 15 is housed in a metal housing 17 made of aluminum die-cast or the like.

  First, the electrical effects of the filter module 13 will be described with reference to FIG. The switching power supply 15 is, for example, a vehicle-mounted power supply, and steps down a voltage value of a drive system power supply voltage VIN (for example, DC244V or the like) supplied from a main battery (not shown) provided in a hybrid vehicle or an electric vehicle or the like. , A step-down switching power supply for supplying power to the auxiliary battery 19. The auxiliary battery 19 supplies a power supply voltage (for example, 14 VDC) to in-vehicle electrical devices such as audio devices, air conditioners, and lighting devices.

  In the switching power supply 15, a power transistor T and a diode D are connected in series between a power supply voltage VIN and a ground potential GND. The switching power supply 15 supplies power from a connection point X between the power transistor T and the diode D. The switching power supply 15 performs on / off control of the power transistor T at a predetermined switching frequency f based on a switching signal SW applied to the gate terminal of the power transistor T.

  The filter module 13 has a bus bar 20 that connects the connection point X1 and the output terminal VO. The bus bar 20 forms an output voltage path connecting the connection point X1 and the output terminal VO. The bus bar 20 is connected with a choke coil L1. In the bus bar 20, a capacitor C0 is connected between a connection point on the input side and a ground potential GND. The output terminal VO of the bus bar 20 is connected to the capacitor C1 of the capacitor unit 10. Thus, the filter module 13 and the capacitor unit 10 are configured as a π-type filter to which the capacitors C0 and C1 and the choke coil L1 are connected.

  A coil L0 is connected between a connection point X of the switching power supply 15 and a connection point X1 of the filter module 13. During the ON period of the power transistor T, power is supplied from the power supply voltage VIN to the coil L0, and electromagnetic energy is accumulated in the coil L0. The stored energy is released to the output side including the capacitor C0 of the filter module 13 by the current from the diode D during the off period of the power transistor T. In the switching power supply 15, these operations are repeatedly performed at a predetermined switching frequency f.

  In the switching power supply 15, a current corresponding to the load current flows alternately at the switching frequency f toward the connection point X via the power transistor T or the diode D. As a result, in the switching power supply 15, a current corresponding to the load current intermittently flows at the switching frequency f between the power supply voltage VIN and the ground potential GND, and current fluctuation occurs. Further, the potential of the connection point X is alternately switched between the power supply voltage VIN and the ground potential GND according to the switching frequency f. Therefore, in the switching power supply 15, the current fluctuation and the voltage fluctuation due to the switching operation may become a noise source that generates the switching noise of the switching frequency f and its harmonic frequency. Such switching noise may be propagated to the connection point X1 as inductive noise that propagates through a space such as conductive noise or capacitive coupling that goes around via a signal path or a ground wiring, for example.

  As described above, the filter module 13 of the present embodiment is connected to the connection point X via the coil L0. The filter module 13 and the capacitor unit 10 reduce noise at the switching frequency f and its harmonic frequency caused by the operation of the switching power supply 15. Here, the switching frequency f of the switching power supply 15 is determined according to the rating of the output power, the specifications of the elements constituting the circuit, and the like. For example, some switching power supplies for vehicles operate at several hundred kHz. In this case, the switching frequency f and its harmonic frequency may overlap with the frequency band (around 500 to 1700 kHz) of the on-vehicle AM radio. On the other hand, the filter module 13 and the capacitor unit 10 of the present embodiment are connected to the connection point X, and can suppress noise in these bands from propagating to subsequent devices.

  Further, the capacitor unit 10 of the present embodiment has a connection point between two terminals of the output terminal VO of the bus bar 20 of the filter module 13 and the input terminal VI of the bus bar 23 connected directly or indirectly to the auxiliary battery 19. It is connected to the. In the capacitor unit 10, a capacitor C1 is connected between a connection point between the output terminal VO and the input terminal VI and a ground potential GND. The capacitor unit 10 is configured to be additionally connectable to a connection point between the output terminal VO and the input terminal VI as described later.

  Next, the shape and structure of the capacitor unit 10 will be described. FIG. 2 shows a state where the capacitor unit 10 is attached to a connection point between the output terminal VO of the filter module 13 shown in FIG. 1 and the input terminal VI of the bus bar 23 connected to the auxiliary battery 19. FIG. 2 illustrates only a connection portion between the output terminal VO and the input terminal VI.

  As shown in FIG. 2, the metal housing 17 has a connector accommodating portion 21 for accommodating a connection portion between the output terminal VO and the input terminal VI. The connector housing portion 21 is formed in a tubular shape having a rectangular cross section. The connector accommodating portion 21 is configured by, for example, a portion projecting from a part of a box-shaped metal housing 17 that accommodates the filter module 13 and the switching power supply 15.

  The output terminal VO is provided at the tip of a rectangular plate-shaped bus bar 20 that is long in one direction. Similarly, the input terminal VI is provided at the tip of a rectangular plate-shaped bus bar 23 that is long in one direction. The bus bars 20 and 23 are formed of a metal material such as tough pitch copper and aluminum. In the following description, as shown in FIGS. 2 to 6, the direction in which the busbars 20 and 23 extend is the front and rear, and the direction perpendicular to the plane portions of the busbars 20 and 23 is the vertical direction, the front-rear direction, and the vertical direction. The direction perpendicular to the direction will be described as a left-right direction.

  As shown in FIG. 2, the width in the left-right direction and the thickness in the up-down direction of the bus bars 20, 23 are substantially the same. Further, the capacitor unit 10 is disposed on the right rear side of the connection point between the output terminal VO and the input terminal VI and on the right side of the bus bar 20.

  FIG. 3 is an exploded perspective view of FIG. 2, in which the upper side wall 21A and the right side wall 21B (see FIG. 2) of the connector housing 21 are removed, and only the lower side wall 21C and the left side wall 21D are shown. . As shown in FIG. 2 and FIG. 3, an annular terminal portion 31 is formed at the front end of the output terminal VO on the front side when viewed from above and below. A circular insertion hole 33 through which the screw portion 53 of the fastening bolt 51 is inserted is formed in the terminal portion 31 so as to penetrate vertically. In the insertion hole 33, for example, a female screw (threaded portion) for screwing the male screw of the screwing portion 53 is formed.

  An annular terminal portion 41 is formed at the rear end of the input terminal VI when viewed from above and below. The outer diameter of the ring-shaped terminal portion 41 is the same as the outer diameter of the terminal portion 31 of the output terminal VO. The terminal portion 41 is formed with a circular insertion hole 43 through which the screw portion 53 of the fastening bolt 51 is inserted in the vertical direction.

  The capacitor unit 10 has a connection part 61, a mold part 63, and the like. The connecting portion 61 is a metal plate material, and has an annular portion 61A and an extending portion 61B. The connection portion 61 is formed of a metal material having good conductivity (for example, brass, copper, or the like). The annular portion 61A is formed in an annular shape having an outer diameter substantially the same size as the terminal portions 31 and 41. A circular insertion hole 61C through which the fastening bolt 51 is inserted is formed in the annular portion 61A so as to penetrate vertically. The annular portion 61A is fastened by fastening bolts 51 while being sandwiched between the upper terminal portion 41 and the lower terminal portion 31 in the vertical direction (see FIG. 2). The extending portion 61B has a substantially rectangular plate shape formed to protrude rightward (outward in the radial direction) from the right side edge of the annular portion 61A. A part on the rear side of the extending portion 61B is molded by the molding portion 63.

  The mold part 63 is formed in a plate shape that is long in the front-rear direction and thin in the vertical direction. The rear end face 63A on the rear side of the mold portion 63 has a long rectangular shape along the left-right direction. As shown in FIG. 2, the mold portion 63 is attached in a state substantially parallel to the bus bars 20 and 23 along the front-rear direction. The attached mold portion 63 is attached with the left side portion 63B (see FIG. 4) in contact with the right side surface 20A of the bus bar 20.

  FIG. 4 is a perspective view of the capacitor unit 10 as viewed from the lower rear side. FIG. 5 shows a state where the mold part 63 in FIG. 4 is removed. As shown in FIGS. 4 and 5, the capacitor unit 10 includes a first metal plate 65, a second metal plate 67, chip capacitors 69 and 71, And a portion 73. An opening 63C is formed in the molded portion 63 in accordance with the positions of the chip capacitors 69 and 71 and the contact portion 73 and has an opening on the lower surface.

  The first metal plate 65 and the second metal plate 67 are formed of a metal material having good conductivity (for example, brass, copper, or the like). As shown in FIG. 5, the extending portion 61B is formed continuously to the right side edge of the annular portion 61A, and has a plate shape parallel to the front-rear direction and the left-right direction. The first metal plate 65 is disposed on the rear side of the extending portion 61B, and has a substantially square plate shape parallel to the front-rear direction and the left-right direction. The first metal plate 65 and the extending portion 61B are molded by the molding portion 63 in a state where a slit 75 having a predetermined width is provided in the front-rear direction and separated.

  The chip capacitor 69 is disposed below the slit 75 so as to straddle the slit 75, and is connected to the extending portion 61 </ b> B and the first metal plate 65. The chip capacitor 69 is configured such that one terminal is connected to the rear end of the extending portion 61B and is connected to the center in the left-right direction, and the other terminal is connected to the front end of the first metal plate 65. I have. The chip capacitor 69 is surface-mounted on the extending portion 61B and the first metal plate 65, thereby omitting a lead and shortening a connection distance to reduce ESL (equivalent series inductance) and ESR (equivalent series resistance). Reduction has been achieved.

  The second metal plate 67 is disposed on the rear side of the first metal plate 65, and has a substantially rectangular plate shape that is long in the front-rear direction. The second metal plate 67 and the first metal plate 65 are molded by the molding unit 63 in a state where a slit 77 having a predetermined width is provided in the front-rear direction and separated. The chip capacitor 71 is disposed below the slit 77 so as to straddle the slit 77, and is connected to the first metal plate 65 and the second metal plate 67. One terminal of the chip capacitor 71 is connected to the rear end of the first metal plate 65, and the other terminal is connected to the front end of the second metal plate 67 and to the center in the left-right direction. ing. The chip capacitor 71 is surface-mounted on the first metal plate 65 and the second metal plate 67.

  The chip capacitors 69 and 71 are exposed from the opening 63C of the mold 63 (see FIG. 4). The inner wall of the opening 63C is separated from the chip capacitor 69 and the like by a predetermined distance (see FIG. 6). This allows the chip capacitors 69 and 71 to radiate heat generated by energization from the opening 63C to reduce a rise in temperature.

  The contact portion 73 is, for example, an on-board contact (registered trademark), and is formed by bending a thin metal member, and has a pedestal portion 81, an elastic portion 83, and a contact portion 85. As the material of the contact portion 73, for example, titanium copper (Hyper Titanium Copper, manufactured by JX Nippon Oil & Metals Co., Ltd.), stainless steel, beryllium copper or phosphor bronze surface-treated by tin plating or metal plating can be used.

  The pedestal portion 81 has a bottom portion 81A and a pair of side wall portions 81B facing each other in the left-right direction. The bottom portion 81A has a plate shape, is fixed to the upper surface of the second metal plate 67, and is electrically connected. The side wall portion 81B is formed continuously to the left-right end of the bottom portion 81A, and extends upward from the end.

  The elastic portion 83 is formed continuously from the rear end of the bottom portion 81A, curves upward toward the front side, further upwards from the rear end, and further curves upward toward the rear side. The elastic portion 83 has a substantially S-shape when viewed from the left and right directions. Further, the elastic portion 83 is disposed between the side wall portions 81B in the left-right direction. As shown in FIG. 4, a part of the side wall 81 </ b> B and a part of the elastic part 83 project downward from the opening 63 </ b> C of the mold 63.

  As shown in FIGS. 4 and 5, the contact portion 85 has a flat portion 85A and a pair of engaging portions 85B facing each other in the left-right direction. The flat portion 85A is arranged above the elastic portion 83. The flat portion 85A is formed continuously to the curved upper end portion of the elastic portion 83, and has a plate shape parallel to the front-rear direction and the left-right direction. Each of the pair of engaging portions 85B is formed continuously with the left and right ends of the flat portion 85A, and extends downward from the ends.

  An engaging hole 81C is formed in the side wall portion 81B of the pedestal portion 81. The engagement hole 81C is formed to penetrate the side wall portion 81B in the left-right direction, and has a substantially rectangular shape elongated in the up-down direction. The lower end of the engaging portion 85B is engaged with the engaging hole 81C. The elastic portion 83 urges the flat portion 85A downward. The downward movement of the contact portion 85 is regulated by engaging the engaging portion 85B with the upper end of the engaging hole 81C.

  Here, as shown in FIG. 2, the capacitor unit 10 attached to the bus bars 20 and 23 has a state where the flat portion 85A of the contact portion 73 is in contact with the upper surface of the lower side wall portion 21C of the connector housing portion 21. Has become. The capacitor unit 10 is electrically connected to the metal housing 17 by bringing the flat portion 85A into contact with the lower wall portion 21C. The capacitor unit 10 is supplied with the ground potential GND from the metal housing 17. In the mounting operation, the capacitor unit 10 moves downward as the fastening bolt 51 is screwed into the terminal portion 31. When the flat portion 85A is pressed upward by the lower wall portion 21C, the elastic portion 83 is elastically deformed to generate a repulsive force. Thereby, the contact portion 73 generates a repulsive force by the elastic portion 83 and strongly presses the flat portion 85A against the lower side wall portion 21C, so that good conductivity can be secured.

  In the capacitor unit 10 having the above-described configuration, two chip capacitors 69 and 71 are mounted between the output terminal VO and the like and the ground potential GND (the lower wall 21C of the connector housing 21). These two chip capacitors 69 and 71 constitute the capacitor C1 shown in FIG.

  FIG. 6 is a bottom view of the capacitor unit 10. As shown in FIGS. 4 and 6, an arc portion 63 </ b> D is formed on the front side portion of the left side surface portion 63 </ b> B of the molded portion 63 along the outer periphery of the annular portion 61 </ b> A of the connection portion 61. The arc portion 63D is formed to be curved in an arc shape from the left side surface portion 63B to the right side, and is connected to the left end portion of the front end surface 63E of the mold portion 63.

  The opening 63C is formed to surround the chip capacitors 69 and 71 and the contact portion 73. In the opening 63C, a first connecting portion 63F is formed between the chip capacitor 69 and the chip capacitor 71 in the front-rear direction along a direction parallel to the left-right direction. The first connecting portion 63F has a rectangular shape that is long in the left-right direction when viewed from below. The first connecting portion 63F is formed by molding a substantially central portion of the lower surface of the first metal plate 65 in the front-rear direction. Both left and right ends of the first connecting portion 63F are formed integrally with the inner wall of the opening 63C. The first connecting portion 63F supports the first metal plate 65 from below. The first connecting portion 63F is separated from each of the chip capacitors 69 and 71 by providing a predetermined space therebetween in the front-rear direction. The vertical height of the first connecting portion 63F is lower than the chip capacitors 69 and 71 (see FIG. 4).

  In the opening 63C, a second connecting portion 63G is formed between the chip capacitor 71 and the contact portion 73 in the front-rear direction along a direction parallel to the left-right direction. The width of the opening 63C in the left-right direction is formed such that the width of the opening surrounding the contact portion 73 is larger than the width of the opening surrounding the chip capacitors 69 and 71. The second connecting portion 63G is formed at the boundary between the openings having different sizes, and has a trapezoidal shape that, when viewed from below, increases in the width in the left-right direction from the front to the rear. The second connecting portion 63G molds the lower surface of the second metal plate 67 and supports the second metal plate 67 from below. Both left and right ends of the second connecting portion 63G are formed integrally with the inner wall of the opening 63C.

  The second connecting portion 63G is separated from each of the chip capacitor 71 and the contact portion 73 by providing a predetermined space therebetween in the front-rear direction. The vertical height of the second connecting portion 63G is lower than that of the chip capacitor 71 (see FIG. 4). As described above, the first connecting portion 63F and the second connecting portion 63G are separated from the chip capacitor 69 and the like in the front-rear direction, so that the transfer of heat from the chip capacitor 69 and the like is reduced, and the first metal is suppressed while suppressing deformation and the like. The plate 65 and the like can be stably supported from below.

  Further, a concave portion 63J is formed in the right side surface portion 63H of the mold portion 63. The concave portion 63J is formed at a position closer to the front side than the central portion in the front-rear direction of the right side portion 63H, and has a shape recessed toward the left side from the right side portion 63H when viewed from the up and down direction. .

  As shown in FIGS. 5 and 6, a metal piece 61D of the connection portion 61 is provided through the inner wall on the front side of the concave portion 63J. The metal piece 61D is formed at the right end of the extension 61B and at the rear end, and is formed to protrude rearward. A metal piece 65A of the first metal plate 65 is provided to penetrate the inner wall on the left side of the concave portion 63J. The metal piece 65A is formed at the right end of the first metal plate 65 and at the center in the front-rear direction, and is formed to protrude rightward. A metal piece 67A of the second metal plate 67 is provided to penetrate the inner wall on the rear side of the concave portion 63J. The metal piece 67A is formed at the right end of the second metal plate 67 and at the front end, and is formed to protrude forward. Each of these metal pieces 61D, 65A, 67A is, for example, connected in advance by a substantially T-shaped cut piece 87 shown by a broken line in FIG. 6, and is a portion formed by cutting the cut piece 87 in a manufacturing process. is there.

  The manufacture of the capacitor unit 10 having the above-described configuration can be performed, for example, by the following steps. (1) First, a flat metal plate is punched by a punching process or the like, and a member in which the connecting portion 61, the first metal plate 65, and the second metal plate 67 are connected to each other by cutting pieces 87 (see FIG. 6) is manufactured. (2) Next, a part of the connection part 61, the first metal plate 65, and the second metal plate 67 connected by the cut piece 87 is molded with an insulating material such as a resin material to form a molded part 63. . As a material of the mold portion 63, for example, a thermosetting resin such as a phenol resin, an epoxy resin, or an unsaturated polyester, or a thermoplastic resin such as PBT or PPS can be used. An opening 63 </ b> C is formed in the mold part 63 in accordance with the positions of the chip capacitors 69 and 71 and the contact part 73. The relative position of the connection portion 61 and the like is fixed by molding with the molding portion 63. In addition, since the connection portions 61 and the like are connected to each other by the cut pieces 87, a relative displacement between before and after the molding is suppressed.

  (3) Next, the chip capacitors 69 and 71 and the contact part 73 are inserted from the opening 63C of the mold part 63 and mounted on the connection part 61 and the like by soldering or the like. (4) Thereafter, by cutting the cut piece 87, the capacitor unit 10 having the metal pieces 61D, 65A, and 67A shown in FIG. 2 can be manufactured. The above-described manufacturing process is an example, and can be appropriately changed. For example, the mold portion 63 may be formed after mounting the chip capacitors 69 and 71 on the connection portion 61 and the like.

  Incidentally, in the above embodiment, the switching power supply 15 is an example of a circuit board. The bus bar 20 is an example of a bus bar. The lower wall 21C is an example of an inner wall. The fastening bolt 51 is an example of a screw member. The connection part 61 is an example of a first terminal part. The first metal plate 65 and the second metal plate 67 are examples of a second terminal portion. The chip capacitors 69 and 71 are examples of a capacitance unit.

  As described above in detail, the connection portion 61 of the capacitor unit 10 according to the first embodiment disclosed in the present application is fixed to the bus bars 20 and 23 by inserting the fastening bolt 51 into the insertion hole 61C. The capacitor unit 10 moves downward as the fastening bolt 51 is screwed into the terminal portion 31. The elastic portion 83 is elastically deformed when the flat portion 85A is pressed upward by the lower wall portion 21C. The capacitor unit 10 is supplied with the ground potential GND from the metal housing 17 via the contact portion 73. In such a configuration, a plurality of types of capacitor units 10 and a plurality of capacitor units 10 can be attached to the output terminal VO of one bus bar 20. For this reason, for example, even after actually manufacturing the switching power supply 15 and the filter module 13 and actually measuring the noise, the chip capacitors 69 and 71 can be additionally connected to the bus bar 20, and the capacitor unit 10 , Etc., it is possible to make the expected value of the noise and the actually measured value coincide with each other or to obtain a very similar value.

  In addition, by using the output terminal VO required regardless of the presence or absence of the capacitor unit 10 as a connection portion, it is not necessary to separately provide a portion for connecting the capacitor unit 10 to the bus bar 20, so that the bus bar 20 can be downsized, and The size of the metal housing 17 can be reduced. In the automotive field, a reduction in the size of the metal housing 17 is particularly required from the viewpoint of securing a living space in the vehicle and reducing the weight of the vehicle for improving fuel efficiency. Therefore, it is extremely effective to apply the capacitor unit 10 of the present embodiment, which can be additionally connected and does not involve the deformation of the bus bar 20, to an automobile or the like.

  In addition, the bus bar 20 of the present embodiment has a plate shape extending along a direction parallel to the front-rear direction. As shown in FIG. 5, the capacitor unit 10 includes a connecting portion 61, a chip capacitor 69, a first metal plate 65, a chip capacitor 71, and a second metal plate 67 arranged in this order along a direction parallel to the front-rear direction. It is configured. Thereby, in the capacitor unit 10 of the present embodiment, it is possible to reduce the space in the metal housing 17 by arranging the connecting portion 61 and the like in parallel with the bus bar 20 and suppressing the width in the vertical direction. Has become.

(2nd Embodiment)
Next, a second embodiment of the capacitor unit of the present invention will be described. FIG. 7 shows a state where the capacitor unit 10A of the second embodiment is attached to the output terminal VO and the input terminal VI. FIG. 7 shows only the lower side wall 21C and the left side wall 21D by removing the upper side wall 21A and the right side wall 21B (see FIG. 2) of the connector housing 21. In the capacitor unit 10 of the above-described first embodiment, the contact portion 73 is configured to be connected to the lower wall portion 21C of the connector housing portion 21. On the other hand, the capacitor unit 10A of the second embodiment is different from the above-described first embodiment in that the contact portion 91 is connected to the left side wall 21D of the connector housing 21. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  More specifically, the capacitor unit 10A of the second embodiment is disposed on the left rear side of the connection point between the output terminal VO and the input terminal VI and on the left side of the bus bar 20. FIG. 8 is a perspective view of the capacitor unit 10A as viewed from the upper rear side, and shows a state where the mold unit 63 is removed.

  As shown in FIGS. 7 and 8, the capacitor unit 10 </ b> A includes an extending portion 61 </ b> B, a chip capacitor 69, a first metal plate 65, a chip capacitor 71, and a second metal plate 93 along a direction parallel to the front-rear direction. They are arranged in order. The second metal plate 93 of the second embodiment is shorter in the front-rear direction than the second metal plate 67 of the first embodiment, and is formed in a substantially rectangular plate shape longer in the left-right direction. . The contact portion 91 is provided on the upper surface of the left end of the second metal plate 93. In the capacitor unit 10A of the second embodiment, portions other than the contact portion 91 and the second metal plate 93 are parallel to the front-rear direction by passing the capacitor unit 10 of the first embodiment through the center of the bus bar 20 in the left-right direction. The structure is rotated 180 degrees around a straight line.

  The contact portion 91 is formed, for example, by processing a thin plate-shaped metal member, and has a pedestal portion 95 and a contact portion 97. An opening 63 </ b> K is formed in the mold part 63 according to the position and shape of the contact part 91 (see FIG. 7). The base 95 has a substantially box-like shape. The lower end surface of the pedestal portion 95 is fixed to the upper surface of the second metal plate 93 by soldering or the like, and is electrically connected. The pedestal 95 has a structure in which when it is pressed from the left to the right, it is elastically deformed to generate a repulsive force.

  The contact portion 97 is provided on the left end surface of the base 95. The contact portion 97 has a plate shape, is formed with a certain inclination from the lower side to the upper left side of the left end surface of the pedestal portion 95, and is folded at the left end portion and bent toward the right side. An engaged portion 95A (see FIG. 9) having a through hole vertically penetrated is provided on the left end surface of the pedestal portion 95. The folded front end of the contact portion 97 is inserted into and engaged with the engaged portion 95A from above.

  Here, when attaching the capacitor unit 10A to the output terminal VO or the like, for example, the contact part 91 is arranged in a state where the left end of the contact part 97 is in contact with the left wall part 21D of the connector housing part 21. . When the contact portion 97 is pressed to the right by the left side wall 21D, the pedestal 95 generates a repulsive force, and firmly presses the contact portion 97 against the left side wall 21D, thereby ensuring good conductivity. The capacitor unit 10A moves downward as the fastening bolt 51 is screwed into the terminal portion 31. The contact portion 97 bends upward due to friction with the left side wall portion 21D, while the folded tip portion is inserted deeper into the engaged portion 95A to be strongly engaged. Also in the capacitor unit 10A of the second embodiment having such a configuration, it is possible to save space in the metal housing 17 as in the capacitor unit 10 of the first embodiment.

  In the first and second embodiments described above, each of the capacitor units 10 and 10A is connected to only one connection point between the output terminal VO and the input terminal VI. However, the present invention is not limited to this. The units 10 and 10A may be connected. For example, FIG. 9 shows a state in which four capacitor units 10, 10A, 10B, and 10C are connected to an output terminal VO and the like.

  The capacitor unit 10 shown in FIG. 9 has the same configuration as the capacitor unit 10 of the first embodiment, and the contact portion 73 is connected to the lower wall 21C of the connector housing 21. The capacitor unit 10A has the same configuration as the capacitor unit 10A of the second embodiment, and the contact unit 91 is connected to the left wall 21D.

  The capacitor unit 10B disposed on the front side of the capacitor unit 10A has the same configuration as the capacitor unit 10, and has a contact portion (not shown) connected to the lower wall portion 21C. The capacitor unit 10C disposed on the front side of the capacitor unit 10 has the same configuration as the capacitor unit 10A, and has the contact portion 91 connected to the right wall portion 21B (see FIG. 2). The annular portions 61A of the four capacitor units 10, 10A, 10B, 10C are sandwiched between the terminal portions 41 and 31 (see FIG. 3) in the vertical direction. Therefore, four annular portions 61A are sandwiched between the terminal portion 41 and the terminal portion 31 in the vertical direction. In such a configuration, four capacitor units 10, 10A, 10B, and 10C are connected in parallel between the output terminal VO and the input terminal VI and the ground potential GND. In other words, each of the four sets of chip capacitors 69 and 71 (total of eight chip capacitors) is connected in parallel between the output terminal VO or the like and the ground potential GND.

  As described above, the capacitor unit 10 and the like can attach a plurality of types of capacitor units 10 and a plurality of capacitor units 10 to the output terminal VO of one bus bar 20. For this reason, using the capacitor units 10 and 10A, it is possible to make the expected value of the noise and the actually measured value coincide with each other or make the value very similar.

(Third embodiment)
Next, a third embodiment of the capacitor unit of the present invention will be described. FIG. 10 shows a state where the capacitor unit 10D of the third embodiment is attached to the output terminal VO and the input terminal VI. FIG. 11 is an exploded perspective view of FIG. The capacitor units 10 and 10A of the first and second embodiments described above have a configuration in which the annular portion 61A is sandwiched between the terminal portion 31 and the terminal portion 41 in the vertical direction. On the other hand, the capacitor unit 10 </ b> D of the third embodiment is different from the above embodiments in that the capacitor unit 10 </ b> D has a caulking nut 101 which is arranged below the terminal portion 31 and is screwed to the fastening bolt 51. In the following description, the same components as those in the second embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  As shown in FIGS. 10 and 11, the caulking nut 101 is provided below the annular portion 61 </ b> A, and has a nut main body 103 and a press-fit portion 105. The nut body 103 is formed with a threaded portion 103A (for example, a female screw) for screwing the screwing portion 53 of the fastening bolt 51. The press-fit portion 105 is formed on the upper surface of the nut main body 103. The press-fit portion 105 has an annular step portion slightly larger than the inner diameter of the insertion hole 61C of the annular portion 61A. The caulking nut 101 is fixed to the connection portion 61 by, for example, press-fitting a step portion of the press-fit portion 105 from below the annular portion 61A into the insertion hole 61C. The capacitor unit 10D is in a state where the position of the insertion hole 61C is aligned with the positions of the insertion hole 33 of the terminal portion 31 and the insertion hole 43 of the terminal portion 41, and the contact portion 91 is in contact with the left wall portion 21D. Then, the fastening bolt 51 is fixed to the terminal portion 31 or the like by being screwed into the screwed portion 103A.

  As described above, in the capacitor unit 10D of the third embodiment, the annular portion 61A of the connecting portion 61 and the bus bars 20, 23 can be fixed to each other by being clamped from above and below by the fastening bolt 51 and the caulking nut 101. It becomes possible. Therefore, even when the output terminal VO or the input terminal VI is not provided with a threaded portion, the capacitor unit 10D can be fixed to the output terminal VO or the like by the fastening bolt 51.

(Fourth embodiment)
Next, a fourth embodiment of the capacitor unit of the present invention will be described. FIG. 12 shows a state where the capacitor unit 10E of the fourth embodiment is attached to the output terminal VO and the input terminal VI. The above-described capacitor unit 10 and the like are configured to be screwed together with the fastening bolts 51 and connected to the terminal portions 31 and 41. On the other hand, the capacitor unit 10E of the fourth embodiment is different from the above embodiments in that the capacitor unit 10E is fixed to the flat portion of the bus bar 20 of the filter module 13 (see FIG. 1) by welding. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  As shown in FIG. 12, in the capacitor unit 10E of the fourth embodiment, the connection part 121 is connected to the upper surface 20B of the bus bar 20. The connection part 121 has an extension part 121A and a welding part 121B connected to the bus bar 20.

  The extension portion 121A has a substantially rectangular plate shape when viewed from the up-down direction, similarly to the extension portion 61B of the first embodiment. The extension portion 121A is connected to the chip capacitor 69 (see FIG. 4), and a part thereof is molded by the molding portion 63. The welded portion 121B has a disk shape formed continuously at the left end of the extension 121A. That is, unlike the annular portion 61A of each of the above embodiments, the through-hole 61C is not formed in the welded portion 121B of the connection portion 121. Further, a projection 121C projecting downward is formed at the center of the lower surface of the welded portion 121B. The welding portion 121B is fixed to the bus bar 20 by, for example, being energized in a state where the projection 121C is pressed against the upper surface 20B of the bus bar 20, thereby melting the projection 121C.

  The method of welding the connecting portion 121 to the bus bar 20 is not limited to the above-described projection welding, and another welding method such as spot welding may be used. Also, not limited to resistance welding, ultrasonic welding or the like may be used. The method of fixing the connection portion 121 to the bus bar 20 is not limited to welding, but may be a method of fixing using soldering or a conductive adhesive.

  In the capacitor unit 10E of this embodiment, a plurality of types of capacitor units 10E and a plurality of capacitor units 10E can be attached to one bus bar 20, as in the above embodiments. Therefore, even after the noise is actually measured, the capacitor unit 10E can be added to or changed from the bus bar 20.

(Fifth embodiment)
Next, a fifth embodiment of the capacitor unit of the present invention will be described. FIG. 13 shows a state where the capacitor unit 10F of the fifth embodiment is attached to the output terminal VO and the input terminal VI. FIG. 14 is a top view of the capacitor unit 10F. The capacitor unit 10F of the fifth embodiment has a configuration in which a metal foil 131 (an example of a “flexible conductive flat plate”) on which chip capacitors 69 and 71 are mounted is covered with a heat-shrinkable tube 133. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate. Further, in the state shown in FIG. 13, the capacitor unit 10 </ b> F is shown curved in accordance with the vertical difference in height, but is shown in the state shown in FIG. ing.

  The capacitor unit 10F has a flat plate shape, is disposed rightward from a connection point between the output terminal VO and the input terminal VI, and is connected to the lower wall 21C of the connector housing 21. The capacitor unit 10F is arranged downward from the connection point, then curved rightward, arranged in a direction parallel to the left-right direction, and then curved downward. For this reason, in the state shown in FIG. 13, the capacitor unit 10F is curved in a substantially S-shape when viewed from the front-back direction.

  As shown in FIGS. 13 and 14, the capacitor unit 10F has, in addition to the metal foil 131, two chip capacitors 69, two chip capacitors 71, and a mold part 143 (an example of a “protection member”). . In addition, the metal foil 131 has a first connection portion 135, a second connection portion 137, and two metal plates 139. The metal foil 131 is, for example, a thin metal member such as tough pitch copper having a thickness of 0.1 mm.

  The first connection portion 135 has an insertion hole 135A through which the fastening bolt 51 screwed to the terminal portion 31 (see FIG. 3) is inserted. Further, the first connection portion 135 is formed with an extended portion 135B extending radially outward from the outer peripheral portion of the annular portion formed at the center with the insertion hole 135A. The extending portion 135B has a rectangular shape extending vertically in FIG. Two chip capacitors 69 are mounted on the end (lower end in FIG. 14) of the extending portion 135B along a direction parallel to a direction orthogonal to the extending direction (left-right direction in FIG. 14).

  The metal plate 139 is arranged at a predetermined interval between the metal plate 139 and the extending portion 135B, and has two chip capacitors 69 mounted thereon. Each of the two chip capacitors 69 has one terminal connected to the extending portion 135B and the other terminal connected to the metal plate 139.

  The second connection part 137 has the same configuration as the first connection part 135, and has an insertion hole 137A for inserting the fastening bolt 141. The second connection part 137 is fixed to the lower wall part 21C of the connector housing part 21 by a fastening bolt 141 inserted from above into the insertion hole 137A (see FIG. 13). Further, the extending portion 137B of the second connecting portion 137 has a rectangular shape extending vertically in FIG. 14 from the outer peripheral portion of the annular portion formed at the center with the insertion hole 137A. Two chip capacitors 71 are mounted on an end portion (upper end portion in FIG. 14) of the extension portion 137B along a direction parallel to a direction orthogonal to the extension direction (left-right direction in FIG. 14).

  The metal plate 139 is disposed at a predetermined interval between the metal plate 139 and the extending portion 137B, and the two chip capacitors 71 are mounted. Each of the two chip capacitors 71 has one terminal connected to the extending portion 137B and the other terminal connected to the metal plate 139. Thus, in the capacitor unit 10F, the four chip capacitors 69 and 71 are mounted between the output terminal VO and the ground potential GND by being fixed by the fastening bolts 51 and 141. . The four chip capacitors 69 and 71 are two sets of chip capacitors 69 and 71 connected in series, and two sets of chip capacitors 69 and 71 are mounted in parallel.

  The molded portion 143 is formed by molding the end of the extension 135B on which the chip capacitor 69 is mounted and the end of the extension 137B on which the chip capacitor 71 is mounted. Further, the mold part 143 is formed so as to surround the chip capacitors 69 and 71 from the vertical and horizontal directions in FIG. Therefore, the upper surfaces of the chip capacitors 69 and 71 are not covered with the mold part 143 but are covered with a heat-shrinkable tube 133 described later. As a material of the mold portion 143, for example, a thermosetting resin such as a phenol resin, an epoxy resin, or an unsaturated polyester, or a thermoplastic resin such as PBT or PPS can be used.

  The heat-shrinkable tube 133 covers the extending part 135B, the chip capacitors 69 and 71, the metal plate 139, the mold part 143, and the extending part 137B. The capacitor unit 10F covers the chip capacitor 69 and the like by rotating the heat-shrinkable tube 133 and then heat-shrinking the heat-shrinkable tube 133. The chip capacitor 69 and the like are insulated from external elements by being covered with the heat-shrinkable tube 133. As a material of the heat-shrinkable tube 133, for example, polyvinyl chloride or silicone rubber can be used.

  Also in the capacitor unit 10F of the fifth embodiment described above, it is possible to add or change the capacitor unit 10F to the bus bar 20, similarly to the capacitor unit 10 of the first embodiment. In addition, the metal foil 131 can be bent in accordance with the shape of the metal housing 17 and the position of the ground terminal to connect the bus bars 20 and 23 and the metal housing 17.

  Further, the molding part 143 molds the extended parts 135B and 137B and a part of the chip capacitors 69 and 71. Here, when the metal foil 131 is bent, a bending stress or the like may be applied to the connection between the chip capacitors 69 and 71 and the extending portions 135B and 137B and the chip capacitors 69 and 71. . On the other hand, in the capacitor unit 10F of the present embodiment, the load caused by bending can be reduced by the mold portion 143. The method for protecting the chip capacitors 69, 71 and the like is not limited to resin molding. For example, the chip capacitors 69 and 71 are mounted on a glass epoxy board, and the wiring of the mounted glass epoxy board is connected to the extending portions 135B and 137B by soldering or the like, thereby protecting the chip capacitors 69 and 71 from external force. Is also good.

(Sixth embodiment)
Next, a sixth embodiment of the capacitor unit of the present invention will be described. FIG. 15 shows a state where the capacitor unit 10G of the sixth embodiment is attached to the output terminal VO and the input terminal VI. FIG. 16 is a perspective view of the capacitor unit 10G as viewed from the lower rear side. The capacitor unit 10G according to the sixth embodiment includes a wiring board 151 on which chip capacitors 69 and 71 and a contact portion 73 are mounted. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  The capacitor unit 10G has an insertion hole 151A at the center in the left-right direction for inserting the fastening bolt 51 (see FIG. 16). In the state shown in FIG. 15, the capacitor unit 10G has the center in the left-right direction fixed to the output terminal VO with the fastening bolt 51 inserted into the insertion hole 151A from above, and extends along the direction parallel to the left-right direction. It is arranged.

  On the lower surface of the wiring board 151, a wiring pattern 151B is provided at the center in the left-right direction. The wiring pattern 151B is formed in an annular shape surrounding the opening of the insertion hole 151A. The wiring pattern 151B is pressed against the upper surface of the input terminal VI in a state where the capacitor unit 10G is fixed to the output terminal VO or the like by the fastening bolt 51. Thus, the wiring pattern 151B is electrically connected to the output terminal VO and the input terminal VI.

  The wiring board 151 has a rectangular plate shape that is long in the left-right direction. The wiring board 151 is, for example, a glass epoxy board. A contact portion 73 is provided at each of the left and right ends of the wiring board 151. Each of the contact portions 73 is connected to a wiring pattern 151C provided on the surface of the wiring board 151. The contact portion 73 has the bottom portion 81A connected to the wiring pattern 151C by soldering or the like, and is fixed to the wiring board 151 in a state of standing downward. As shown in FIG. 15, the capacitor unit 10G attached to the output terminal VO is in a state where the flat portion 85A of each contact portion 73 is in contact with the lower wall portion 21C of the connector housing 21.

  The capacitor unit 10G is supplied with the ground potential GND from the metal housing 17 by bringing the flat portion 85A into contact with the lower wall portion 21C. Also, in the mounting operation, the capacitor unit 10G moves downward as the fastening bolt 51 is screwed into the terminal portion 31 (see FIG. 3). When the flat portion 85A is pressed upward by the lower wall portion 21C, the elastic portion 83 is elastically deformed to generate a repulsive force. Thereby, the contact portion 73 generates a repulsive force by the elastic portion 83 and strongly presses the flat portion 85A against the lower side wall portion 21C, so that good conductivity can be secured.

  Four chip capacitors 69, 71 are mounted between the insertion hole 151A and the right contact portion 73 in the left-right direction. Similarly, four chip capacitors 69 and 71 are mounted between the insertion hole 151A and the left contact portion 73 in the left-right direction. The wiring pattern 151B, the chip capacitors 69 and 71, and the wiring pattern 151C provided in the insertion hole 151A are electrically connected by a wiring pattern provided in the wiring board 151.

  Thus, the wiring board 151 is fixed by the fastening bolts 51, so that a total of eight chip capacitors 69 and 71 are mounted between the output terminal VO and the ground potential GND. The eight chip capacitors 69 and 71 have two chip capacitors 69 and 71 connected in series as one set, and four sets of chip capacitors 69 and 71 are mounted in parallel. In the capacitor unit 10G of the sixth embodiment having such a configuration, the capacitor unit 10G can be added to or changed from the bus bar 20, similarly to the capacitor unit 10 of the first embodiment.

The technology disclosed in the present application is not limited to the above embodiments, and it goes without saying that various improvements and modifications can be made without departing from the spirit of the invention.
For example, in each of the above embodiments, the capacitor unit 10 and the like include the plurality of chip capacitors 69 and 71, but may have a configuration including one chip capacitor 69.
In the first embodiment, the filter module 13 and the π-type filter are configured by connecting the capacitor unit 10 to the subsequent stage of the filter module 13 provided separately from the switching power supply 15, but the configuration is not limited thereto. For example, the capacitor unit 10 may be directly connected to the switching power supply 15 and used for the purpose of adding capacitance to a filter circuit mounted on the substrate of the switching power supply 15.
Further, in the first embodiment and the like, the configuration is such that the fastening bolt 51 is screwed into the terminal portion 31 to clamp the terminal portion 41 in the up-down direction. However, the present invention is not limited to this. For example, the terminal portion 41 is arranged below the terminal portion 31, the fastening bolt 51 is fastened to a female screw (threaded portion) provided in the insertion hole 43, and the terminal portion 31 is held between the fastening bolt 51 and the terminal portion 41. May be. In this case, the female screw (threaded portion) provided in the insertion hole 33 may be omitted.

Further, although the mold section 63 has the opening 63C for exposing a part of the chip capacitors 69 and 71, the present invention is not limited to this, and the entire chip capacitors 69 and 71 may be molded.
Further, in the third embodiment, the capacitor unit 10D may not be caulked to the annular portion 61A, that is, may include a normal nut.
Further, in the third embodiment, the capacitor unit 10D includes the caulked nut 101 as the threaded portion, but is not limited thereto. For example, the capacitor unit 10D may be provided with a threaded portion (such as a female screw) in the insertion hole 61C with the connection portion 61 having a thickness.
In the fifth embodiment, the capacitor unit 10F may be fixed to the flat portion of the bus bar 20 by welding.
In addition, the shape, number, and the like of each member in the above embodiment are merely examples, and can be changed as appropriate. For example, the bus bars 20 and 23 are not limited to a plate shape, and may be, for example, a column shape.
Next, technical ideas derived from the contents of the above embodiments will be described.
(1) A capacitor unit according to the technology disclosed in the present application is a capacitor unit that is connected to a bus bar that outputs an output signal from a circuit board housed in a metal housing and that reduces noise mixed in the output signal. And a conductive plate having flexibility connecting the capacitor between the bus bar and the metal housing.
In the capacitor unit, a capacitance portion is provided on a flexible conductive plate. The capacitance portion connected between the bus bar and the metal housing by the conductive flat plate reduces noise mixed in the output signal. The capacitor unit can be connected to a metal housing by bending a flexible conductive plate while being fixed to the bus bar.
For example, the bus bar and the metal housing can be connected by bending the conductive flat plate according to the shape of the metal housing, the position of the ground terminal provided on the metal housing, and the like. Alternatively, the bus bar and the metal housing can be connected while bending the conductive flat plate to avoid interference with each element in the metal housing. In addition, in the capacitor unit, a plurality of types of capacitor units or a plurality of capacitor units can be attached to one output terminal of the bus bar, and the expected value and the measured value of the noise are matched or extremely approximated. It is possible to set the value to
(2) The capacitor unit of the present application may be configured to include a heat-shrinkable tube that covers at least a part of the surface of the conductive flat plate and the capacitance part.
In the capacitor unit, the conductive plate and the capacitor unit are covered with the heat-shrinkable tube, so that it is possible to insulate the capacitor unit from other members.
(3) Further, the capacitor unit of the present application may be configured to include a protection member for protecting the capacitance portion.
When attaching the capacitor unit to the bus bar, the conductive plate can be freely bent. On the other hand, when the conductive plate is bent, a bending stress or the like may be applied to the connection portion between the capacitor and the conductive plate or the capacitor. On the other hand, in the capacitor unit, the load applied to the capacitor due to the bending can be reduced by the protection member.

  10A to 10G capacitor unit, 15 switching power supply, 17 metal housing, 20 bus bar, 51 fastening bolt, 61 connection portion, 61C insertion hole, 65 first metal plate, 67 second metal plate, 69, 71 chip capacitor, 73 Contact part, 81 pedestal part, 83 elastic part.

Claims (6)

A capacitor unit that is connected to a bus bar that outputs an output signal from a circuit board housed in a metal housing and reduces noise mixed into the output signal,
A first terminal portion fixed to the bus bar;
A capacitor portion having one terminal connected to the first terminal portion;
A second terminal unit to which the other terminal of the capacitance unit is connected;
A pedestal portion connected to the second terminal portion, and in a state where the first terminal portion is fixed to the bus bar, the pedestal portion is electrically deformed by being pressed against an inner wall of the metal housing and electrically connected to the inner wall. And a contact part having an elastic part to be connected.   2. The capacitor unit according to claim 1, wherein the first terminal portion has an insertion hole for inserting a screw member inserted into an output terminal of the bus bar. 3.   2. The capacitor unit according to claim 1, wherein the first terminal portion has a threaded portion that is screwed into a screw member inserted into the output terminal of the bus bar. 3.   The capacitor unit according to claim 1, wherein the first terminal portion has a welded portion fixed to the bus bar. The bus bar has a shape extending in one direction,
The said 1st terminal part, the said capacitance part, and the said 2nd terminal part are arrange | positioned in order toward the direction parallel to the extending direction of the said bus bar, The Claims 1 thru | or 4 characterized by the above-mentioned. The capacitor unit according to any one of the above.   A capacitor unit that is connected to a bus bar that outputs an output signal from a circuit board housed in a metal housing and reduces noise mixed into the output signal,
Capacity part,
  A wiring board on which the capacitance unit is mounted and which connects the capacitance unit between the bus bar and the metal housing;
  A contact portion for connecting the wiring board to the metal housing,
  The wiring board has an insertion hole that inserts a screw member inserted into an output terminal of the bus bar and connects the bus bar to one terminal of the capacitance unit.
  The contact portion is elastically deformed by being pressed against the inner wall of the metal housing in a state where the wiring board is fixed to the bus bar by the screw member and the pedestal portion connected to the other terminal of the capacitance portion. And a resilient portion for electrically connecting the pedestal portion to the inner wall.

Images