JP6639946B2 - Pressure sensor module and mounting structure of pressure sensor module - Google Patents

Description

  The present invention relates to a pressure sensor module mounted on a portable electronic device having a waterproof function and a mounting structure of the pressure sensor module.

  BACKGROUND ART Conventionally, as a pressure sensor mounted on a portable electronic device having a waterproof function, there is a small semiconductor pressure sensor using MEMS (Micro Electro-Mechanical Systems) technology (for example, see Patent Document 1).

  When such a pressure sensor is incorporated into a housing of a portable electronic device having a waterproof function, the pressure sensor is installed inside the housing having a pressure introduction hole while ensuring waterproofness. Specifically, the structure is such that a packing such as an O-ring attached to the package of the pressure sensor is pressed against the inner wall surface around the pressure introducing hole of the housing. As a result, the pressure receiving portion of the pressure sensor is exposed to the outside through the pressure introducing hole, and the pressure introducing hole is closed with the pressure sensor to secure the hermeticity inside the housing. The outgoing connection conductor can be connected to a circuit inside the housing.

JP-A-7-38122

  In order to press the package of the pressure sensor against the inner wall surface of the housing via the packing and secure a desired sealing property, it is necessary to apply a compressive force corresponding to the sealing property to the packing. For example, when waterproofing of 5 atm is required, it is generally necessary to apply a compressive force of 5 atm or more to the packing. Therefore, the pressure sensor package for pressing the packing needs to have appropriate strength, so that the size of the package increases and the size of the pressure sensor also increases. As a result, miniaturization of the mounted portable electronic device is hindered. On the other hand, if the size is reduced in accordance with the housing of the portable electronic device, the strength is insufficient and it is not possible to cope with high-pressure waterproofing.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a pressure sensor module and a mounting structure of the pressure sensor module that can be downsized while ensuring airtightness of an electronic device to be mounted. I do.

  The pressure sensor module according to the present invention includes a pressure sensor, a wiring board connected to the pressure sensor, a packing disposed to surround the pressure sensor, and a holding unit that holds the packing. A holding portion is formed on the wiring board.

  According to the pressure sensor module according to the present invention, the packing is disposed on the holding portion formed on the wiring board connected to the pressure sensor. For this reason, when the pressure sensor module is airtightly attached to the housing of the electronic device, the holding portion, which is a part of the wiring board, is pressurized, and there is no need to pressurize the pressure sensor itself. Therefore, it is possible to apply a larger pressure in order to increase the airtightness, and it is not necessary to increase the strength of a pressure sensor package or the like. Also, the degree of freedom in designing the package shape is increased. As a result, it is possible to provide a pressure sensor module that can be downsized while ensuring the airtightness of the electronic device to be mounted.

  Further, in the pressure sensor module according to the present invention, the holding portion includes an annular packing holding portion formed along the packing, and a pressure sensor holding portion extending inward from the packing holding portion and holding the pressure sensor. It is preferable to have

  Further, the pressure sensor module mounting structure according to the present invention is a pressure sensor module mounting structure in which the pressure sensor module is airtightly mounted on a housing of an electronic device in which a pressure introducing hole is formed, Is disposed so as to face the pressure introducing hole, and is hermetically attached to the housing via the packing by a pressing means for pressing the holding portion toward the housing.

  According to the pressure sensor module mounting structure of the present invention, the packing is disposed on the holding portion formed on the wiring board connected to the pressure sensor. Therefore, when the pressure sensor module is hermetically attached to the housing of the electronic device by the pressurizing means, the holding portion, which is a part of the wiring board, is pressurized, and there is no need to pressurize the pressure sensor itself. Therefore, the pressure can be increased with a larger pressure in order to improve the airtightness, and it is not necessary to secure a strength to withstand the pressure for a pressure sensor package or the like, so that the package can be made thinner. As a result, it is possible to provide a pressure sensor module mounting structure capable of reducing the size of the pressure sensor while ensuring the airtightness of the electronic device to be mounted.

  Further, in the mounting structure of the pressure sensor module according to the present invention, the pressing member is arranged so as to cover a region corresponding to the packing of the holding portion and a region surrounded by the packing; It is preferable to have a pressing member for pressing the pressing member toward the housing.

  It is possible to provide a pressure sensor module and a mounting structure of the pressure sensor module which can be downsized while ensuring airtightness of an electronic device to be mounted.

It is a top view showing the structure of the pressure sensor module concerning the embodiment of the present invention. FIG. 2 is a sectional view taken along the line II-II in FIG. 1. FIG. 2 is a development view showing a structure of a lead frame used in the pressure sensor of FIG. 1, and is a development view seen from a lower surface side of the lead frame. It is a top view showing the modification of a pressure sensor module. It is sectional drawing which shows the mounting structure of the pressure sensor module which concerns on embodiment of this invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same or corresponding portions will be denoted by the same reference characters, without redundant description.

[Pressure sensor module]
FIG. 1 is a plan view showing the structure of the pressure sensor module according to the embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II-II of FIG.

  As shown in FIGS. 1 and 2, a pressure sensor module 1 includes a pressure sensor 2 for measuring an atmospheric pressure, a water pressure, and the like to be measured, and a signal for transmitting a signal from the pressure sensor 2 and supplying power to the pressure sensor 2. A flexible printed wiring board 3 (hereinafter, referred to as FPC 3) (corresponding to the wiring board of the present invention). Instead of the flexible printed wiring board, a rigid board made of glass epoxy or the like, or a wiring board having a ceramic substrate as a base material may be used.

The pressure sensor 2 includes a base 4, a pressure sensor element 5 provided in the base 4, and a control element 6 built in the base 4.
The base portion 4 has a lead frame 7 and a resin support 8 (package portion) that supports the lead frame 7. The support 8 is made of a resin such as an epoxy resin, a urethane resin, a polyimide resin, or polyphenylene sulfide, and can be formed by resin molding.

  The support 8 includes a base 9 having a circular shape in a plan view, and a mounting portion 11 on which the pressure sensor element 5 is mounted. The base 9 has a base body 12 and a cylindrical annular wall portion 13 protruding upward from an upper surface 12 a of the base body 12. The annular wall portion 13 can be formed integrally with the base body 12.

  The internal space of the annular wall portion 13 is a housing 16 for housing the pressure sensor element 5 and a protective agent 14 for protecting the pressure sensor element 5 from water and the like. The housing 16 is a cylindrical space defined by the annular wall 13. The annular wall portion 13 is formed to protrude upward so as to reach a position higher than the upper surface 5a of the pressure sensor element 5. Thereby, it is possible to prevent external force from being exerted on the pressure sensor element 5.

The base 9 can be formed by integral molding of resin. The constituent resin of the base 9 is, for example, an epoxy resin, and its Young's modulus is preferably 1 GPa to 50 GPa, more preferably 10 GPa to 30 GPa.
In the pressure sensor 2 according to the present embodiment, the base 9 and the annular wall 13 have a circular shape in a plan view. However, the shapes of the base 9 and the annular wall 13 in a plan view are not limited thereto. Any shape, such as a polygonal shape, can be used. The internal space of the annular wall portion 13 has a plan view shape corresponding to the inner surface shape of the annular wall portion 13. For example, when the inner surface of the annular wall portion 13 has a rectangular shape in plan view, the shape of the housing portion 16 in plan view also has a rectangular shape.

  The mounting portion 11 can be formed in a part or the whole area of the bottom surface 16 a of the housing portion 16. The mounting portion 11 in the illustrated example is formed in a partial area of the bottom surface 16a. The mounting portion 11 is made of a resin material having a lower hardness than the resin material forming the base 9. By forming the mounting portion 11, external force applied to the pressure sensor element 5 due to thermal expansion of the base 9 or the like can be reduced, and measurement accuracy of the pressure sensor 2 can be increased. The greater the resin thickness, the higher the effect of reducing external force.

  As shown in FIG. 3, the lead frame 7 is made of a conductor such as a metal, and has a rectangular plate-shaped pedestal 17 in a plan view and a direction parallel to the pedestal 17 in a direction away from the pedestal 17. It has a sensor lead 18 that extends and a terminal lead 19 that extends in a direction away from the pedestal 17.

  The sensor lead section 18 has first to third sensor lead sections (18a to 18c) in plan view. The first to third sensor leads 18a to 18c can be formed perpendicularly to the first to third edges 17a to 17c of the pedestal 17 having a rectangular shape in plan view, respectively. The first to third sensor leads 18a to 18c are formed so as to be inclined at a predetermined angle (an angle exceeding 0 degrees and less than 90 degrees) with respect to the first to third edges 17a to 17c. Is also good.

  As shown in FIG. 2, the sensor lead 18 is connected to the pressure sensor element 5 by a bonding wire 21 (bonding wire for a pressure sensor chip) and is controlled by a bonding wire 22 (bonding wire for a control element). Connected to element 6.

  As shown in FIG. 3, the terminal lead portion 19 can be formed perpendicular to the fourth side 17 d of the pedestal portion 17 in plan view. The terminal lead portion 19 may be formed to be inclined at a predetermined angle (an angle exceeding 0 degrees and less than 90 degrees) with respect to the fourth side edge portion 17d.

As shown in FIG. 2, the terminal lead portion 19 in the illustrated example includes a base extension portion 19 a extending in a direction away from the pedestal portion 17 and an intermediate extension portion extending downward from the extension end of the base extension portion 19 a. It has an extension 19b and an external extension 19c extending from the extension end of the intermediate extension 19b in a direction opposite to the extension direction of the base extension 19a.
As shown in FIG. 2, the base extension portion 19a and the intermediate extension portion 19b can be formed by being buried inside the support body 8. The base extension 19a is connected to the control element 6 by a bonding wire 23 (bonding wire for a control element). The external extension 19c is exposed on the lower surface 9b of the base 9 and is formed along the lower surface 9b. The bonding wires 22 and 23 are buried in the base 9 except for the outer extension 19c.
In the illustrated example, since the bonding wires 21 and 22 are embedded in the resin of the base 9, it is possible to prevent the bonding wires 21 and 22 from being damaged.

As the pressure sensor element 5, for example, a diaphragm, a sealed space as a reference pressure chamber, and a plurality of strains for measuring a change in strain resistance of the diaphragm due to pressure are provided on one surface side of a semiconductor substrate made of silicon or the like. Anything with a gauge can be used.
In the pressure sensor element 5 of this example, when the diaphragm section bends under pressure, a stress corresponding to the strain amount of the diaphragm section is generated in each strain gauge, and the resistance value of the strain gauge changes according to the stress, A sensor signal corresponding to the change in the resistance value is output. The pressure sensor element 5 is an element using MEMS (Micro Electro-Mechanical Systems) technology.

The pressure sensor element 5 is housed in the housing section 16, mounted on the mounting section 11, and fixed to the mounting section 11.
The pressure sensor element 5 is provided on the upper surface side of the lead frame 7. Specifically, the pressure sensor element 5 is provided on the upper surface 17e side of the pedestal portion 17 along the upper surface 17e.

As long as the pressure sensor element 5 is installed at the same position or higher than the upper surface of the lead frame 7, a part or all of the pressure sensor element 5 may be located off the lead frame 7 in plan view.
The pressure sensor element 5 in the illustrated example is provided on the pedestal section 17 via the mounting section 11.

  Since the pressure sensor element 5 has a circuit formed on the upper surface 5 a, the bonding wire 21 is connected to the upper surface 5 a of the pressure sensor element 5.

  The pressure sensor element 5 is covered with a protective agent 14 filled in the housing 16. The protective agent 14 can prevent intrusion of water and outside air, and can prevent adverse effects on the pressure sensor element 5.

  As the protective agent 14, for example, a silicon-based resin (for example, a silicone resin) or a fluorine-based resin can be used. The protective agent 14 can be in a liquid or gel state. The protective agent 14 preferably has a high viscosity. As the protective agent 14, for example, it is desirable to use a soft gel agent having a hardness of 1 or less (Shore A hardness, based on JIS K 6253). The protective agent 14 can transmit the pressure applied from the measurement target to the pressure sensor element 5 as it is. For this reason, the accuracy of pressure detection by the pressure sensor element 5 does not decrease.

  It is desirable that the protective agent 14 has low light transmittance. This can block visible light and ultraviolet light, which is advantageous for preventing the pressure sensor element 5 from deteriorating. The protective agent 14 can lower the light transmittance by including a pigment or the like.

  When a sensor signal from the pressure sensor element 5 is input through the bonding wire 21, the lead frame 7, and the bonding wires 22, 23, the control element 6 can process the signal and output it as a pressure detection signal. The control element 6 has, for example, functions of ON / OFF control of the pressure sensor element 5, correction of a detection value by a built-in temperature sensor, A / D conversion of detection data, correction of linearity, shaping of a signal waveform, and the like.

  The control element 6 is provided on the lower surface side of the lead frame 7. Specifically, the control element 6 is provided on the lower surface 17f side of the pedestal portion 17 along the lower surface 17f. As long as control element 6 is installed at the same or lower position as the lower surface of lead frame 7, a part or all of the area may be located off lead frame 7 in plan view.

  The control element 6 may be one having a built-in temperature sensor. The control element 6 having a built-in temperature sensor can correct the pressure detection signal according to the temperature in the system. For this reason, highly accurate pressure measurement is possible.

  As shown in FIG. 2, the control element 6 is embedded in the support 8 (base 9) and is integrated with the support 8. Since the outer surface of the control element 6 is covered, the control element 6 can be shielded from outside air and moisture, and the control element 6 can be protected. Since the control element 6 has a circuit formed on the lower surface 6a, the bonding wires 22 and 23 are connected to the lower surface 6a.

  The pressure sensor 2 is connected to the FPC 3. The lead frame 7 of the pressure sensor 2 and the wiring of the FPC 3 are electrically connected by solder 24. Further, a gap between the pressure sensor 2 and the FPC 3 is filled with a mold resin 26 and the pressure sensor 2 is joined to the FPC 3. The FPC 3 is formed by forming a wiring layer made of a metal such as copper on one or both surfaces of a flexible insulating film. As the insulating film, a polyimide resin, a polyester resin, a liquid crystal polymer, or the like can be used.

  As shown in FIGS. 1 and 2, the FPC 3 includes an extending portion 27 and a holding portion 28. The extension portion 27 has a band shape with a constant width extending from the holding portion 28, and a terminal portion (not shown) is formed on a tip side of the extension portion 27. The extension portion 27 is provided with a wiring, and is electrically connected to another element or the like via a terminal portion.

The holding portion 28 has a packing holding portion 29 that is annular in plan view, and a pressure sensor holding portion 31 that extends inward from the packing holding portion 29.
On the packing holding portion 29, an annular packing 32 is formed along the shape of the packing holding portion 29. The packing 32 includes a first packing 33 formed on the inner side in the annular radial direction and a second packing 34 formed on the outer side, and has a double structure. The packing 32 is formed of, for example, an elastic material such as an acrylate resin, a silicone resin, or rubber. Although the packing 32 according to the present embodiment has a double structure, the packing 32 may have a multiplex structure of more than this, or may have a single structure instead of the multiplex structure.

  The pressure sensor holding portion 31 has a rectangular shape in a plan view, and is formed to extend inward from the annular packing holding portion 29. Further, the wiring extends from the terminal portion to the pressure sensor holding portion 31 through the extension portion 27 and the packing holding portion 29, and is electrically connected to the lead frame 7 of the pressure sensor 2.

According to the pressure sensor module 1 according to the present embodiment, the packing 32 is disposed on the holding portion 28 formed on the FPC 3 connected to the pressure sensor 2. For this reason, when the pressure sensor module 1 is airtightly attached to the housing of the electronic device, the holding portion 28 which is a part of the FPC 3 is pressurized, and there is no need to pressurize the pressure sensor 2 itself. Therefore, the pressure can be increased with a higher pressure in order to enhance the airtightness, and the package of the pressure sensor 2 does not need to have the strength to withstand the pressure, so that the package can be made thinner. Also, the degree of freedom in designing the package shape is increased. For example, it is not necessary to make the package cylindrical, and dead space can be reduced. As a result, it is possible to provide the pressure sensor module 1 that can be downsized while ensuring the airtightness of the electronic device to be mounted.
Conventionally, if the package is broken, the waterproof function is impaired. However, in the present invention, the waterproof function is not impaired, which is advantageous in terms of safety design.
Further, since there is no need to pressurize the pressure sensor 2 itself, it is possible to avoid that the pressure due to the pressurization affects the sensor characteristics of the pressure sensor 2.

  Further, in the pressure sensor module 1 according to the present embodiment, the holding portion 28 includes an annular packing holding portion 29 formed along the packing 32 and the pressure sensor 2 extending from the packing holding portion 29 to the inside, that is, to the opening. And a pressure sensor holding unit 31 for holding the pressure sensor. Since the holding portion 28 is divided into the packing holding portion 29 and the pressure sensor holding portion 31 through the opening, even if the packing holding portion 29 is pressurized to fix it to the housing of the electronic device in an airtight manner, the external force is not increased. It is difficult to transmit to the sensor 2. Therefore, the detection accuracy of the pressure sensor 20 and the like are hardly affected.

[Modification]
FIG. 4 is a plan view showing a modified example of the pressure sensor module. As shown in FIG. 4, in the pressure sensor module 10 according to the present modification, the pressure sensor holding unit 36 is formed along the direction in which the extension 37 extends with respect to the pressure sensor module 1 according to the embodiment shown in FIG. 1. However, it extends so as to cross the inside of the annular packing holding portion 38 along a direction intersecting the direction in which the extension portion 37 extends. As a result, the extending direction of the pressure sensor holding portion 36 is formed so as to intersect with the extending direction of the extending portion 37. Therefore, even if an external force such as a pull is applied to the extending portion 37, the pressure sensor holding portion 36 is directly applied to the pressure sensor holding portion 36. And no external force is transmitted to the pressure sensor 20. Therefore, the influence on the detection accuracy and the like of the pressure sensor 20 is less likely to be affected.
Further, in the pressure sensor module 10 according to this modification, four fixing portions 38a are integrally formed from the outer periphery of the packing holding portion 38. A hole 38b is formed at the center of the fixing portion 38a, and the fixing portion 38a can be fixed by a bolt (that is, pressurizing means) via the fixing portion 38a when fixing to the housing. The positioning of the pressure sensor module 10 becomes easy. The packing 32 of the present modification has a single structure.

[Mounting structure of pressure sensor module]
FIG. 5 is a sectional view showing a mounting structure of the pressure sensor module according to the embodiment of the present invention.
The electronic device 51 to which the pressure sensor module 1 according to the present embodiment is attached includes a housing 52.
The housing 52 includes a main body 53 and a lid 54. The housing 52 is provided with a lid 54 and a main body 53 via a packing 56 for the housing, and tightened with bolts 57 so that a sealed space 58 for hermetically accommodating the mechanical and circuit parts of the device inside the main body 53. To secure.
The main body 53 has a container shape including a bottom wall 59 and a peripheral side wall 61 erected on a peripheral edge thereof. The peripheral side wall 61 can be formed in a cylindrical shape such as a cylindrical shape or a square tubular shape.

The sealed space 58 is a space surrounded by the bottom wall 59, the peripheral side wall 61, and the lid 54. The lid 54 is, for example, formed in a substantially flat plate shape.
A sensor housing 62 is provided on a peripheral side wall 61 of a main body 53 of the housing 52 that forms the sealed space 58. The sensor accommodating portion 62 is constituted by a concave portion 63 formed on the peripheral side wall 61 of the housing 52.

  The recess 63 forms a housing space corresponding to the outer shape of the pressure sensor 2 to be housed. A plurality of pressure introducing holes 66 are formed in the peripheral side wall 61 of the housing 52 in the housing space.

  A plurality of small hemispherical projections 67 are provided on the inner wall surface of the sensor housing 62, that is, on the inner wall surface of the concave portion 63 and the inner wall surface of the peripheral side wall 61. The small protrusion 67 supports the pressure sensor 2 at a position away from the inner wall surface of the sensor housing 62.

  The pressure sensor 2 is housed inside the sensor housing 62 with the pressure receiving portion facing the pressure introduction hole 66. A plate-shaped pressing member 68 is disposed on the FPC 3 side of the pressure sensor module 1 which is connected to a side opposite to the pressure receiving portion of the pressure sensor 2, and a pressing member for pressing the pressing member 68 toward the housing 52. The pressure sensor module 1 is attached to the housing 52 by providing 69 (the pressing means 71 with the pressing member 68 and the pressing member 69 described above).

  More specifically, the pressing member is formed so as to cover a region of the packing holding portion 29 of the FPC 3 corresponding to the packing 32 and a region surrounded by the packing 32, that is, to cover the entire packing holding portion 29 of the FPC 3. 68 are arranged. The pressure sensor module 1 is attached to the housing 52 by tightening the pressing member 68 with a bolt (a pressing member 69) so as to press the pressing member 68 from the side opposite to the surface on which the packing 32 is arranged toward the housing 52. ing.

  In this embodiment, an annular third packing 72 is provided between the pressing member 68 and the packing holding portion 29 and at a position corresponding to the packing 32. The provision of the third packing 72 prevents air and water introduced from the opening of the annular packing holding portion 29 through the pressure introduction hole 66 from entering the inside of the housing 52, and makes the inside of the housing 52 airtight. Can be kept.

  Therefore, by forming the packing holding portion 29 into a plate shape that does not have an opening without being formed in a ring shape, it is possible to maintain the airtightness without providing the third packing 72 described above.

According to the mounting structure of the pressure sensor module according to the present embodiment, the packing 32 is disposed on the holding portion 28 formed on the FPC 3 connected to the pressure sensor 2. For this reason, when the pressure sensor module 1 is airtightly attached to the housing 52 of the electronic device 51 by the pressing member 68 and the pressing member 69 (the pressing means described above), the holding portion 28 that is a part of the FPC 3 is pressed. That is, there is no need to pressurize the pressure sensor 2 itself. Therefore, the pressure can be increased with a higher pressure in order to enhance the airtightness, and the package of the pressure sensor 2 does not need to have the strength to withstand the pressure, so that the package can be made thinner. Also, the degree of freedom in designing the package shape is increased. For example, it is not necessary to make the package cylindrical, and dead space can be reduced. As a result, it is possible to provide a mounting structure of the pressure sensor module 1 that can reduce the size of the pressure sensor 2 while ensuring airtightness of the electronic device 51 to be mounted.
Conventionally, if the package is broken, the waterproof function is impaired. However, in the present invention, the waterproof function is not impaired, which is advantageous in terms of safety design.
Further, since there is no need to pressurize the pressure sensor 2 itself, it is possible to avoid that the pressure due to the pressurization affects the sensor characteristics of the pressure sensor 2.

  In the mounting structure of the pressure sensor module according to the present invention, the pressing means includes a pressing member 68 disposed so as to cover a region corresponding to the packing 32 of the holding portion 28 and a region surrounded by the packing 32, And a pressing member 69 for pressing the member 68 toward the housing 52. By pressing with the pressing member 68, the strength against the pressure difference between the inside and the outside of the sealed space 58 can be increased.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the gist of the present invention.

1, 10 pressure sensor module, 2, 20 pressure sensor, 3 flexible printed wiring board, 4 base member, 5 pressure sensor element, 6 control element, 7 lead frame, 8 support, 9 Base, 11: mounting portion, 12: base body, 13: annular wall portion, 14: protective agent, 16: housing portion, 17: pedestal portion, 17a to 17d: peripheral portion, 18: sensor lead portion , 18a to 18c: first to third sensor leads, 19: terminal lead, 19a: base extension, 19b: middle extension, 19c: external extension, 21, 22, 23 ... bonding wire , 24 ... solder, 26 ... mold resin, 27, 37 ... extension part, 28 ... holding part, 29, 38 ... packing holding part, 31, 36 ... pressure sensor holding part, 32 ... packing, 33 ... first packing, 34: second packing, 51: electronic equipment 52 ... housing, 53 ... body, 54 ... lid, 56 ... housing packing, 57 ... bolt, 58 ... sealed space, 59 ... bottom wall, 61 ... peripheral side wall, 62 ... sensor accommodating part, 63 ... concave part, Reference numeral 66 denotes a pressure introducing hole, 67 denotes a small projection, 68 denotes a pressing member, 69 denotes a pressing member, 71 denotes a pressing unit, and 72 denotes a third packing.

Claims (4)

A pressure sensor,
A wiring board connected to the pressure sensor,
A packing arranged to surround the pressure sensor;
A holding portion for holding the packing,
The holding portion is formed on the wiring board ,
The holding portion includes an annular packing holding portion formed along the packing and the packing.
A pressure sensor holding portion that extends inward from the holding portion and holds the pressure sensor,
The pressure sensor module, wherein the holding portion is divided into the packing holding portion and the pressure sensor holding portion via an opening . It has a band-shaped extending portion of a constant width extending from the holding portion,
The pressure sensor module according to claim 1, wherein the pressure sensor holding portion is formed along a direction in which the extension portion extends. It has a band-shaped extending portion of a constant width extending from the holding portion,
2. The pressure sensor module according to claim 1, wherein the pressure sensor holding portion extends so as to cross the inside of the annular packing holding portion along a direction intersecting with a direction in which the extension portion extends. 3. A pressure sensor module mounting structure in which the pressure sensor module according to any one of claims 1 to 3 is hermetically mounted on a housing of an electronic device in which a pressure introducing hole is formed,
A pressure sensor, wherein the pressure sensor is disposed so as to face the pressure introduction hole, and the pressure sensor is hermetically attached to the housing via the packing by a pressing unit that presses the holding portion toward the housing. Module mounting structure.

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