JP2012047451A - Physical quantity sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem that stress is applied to a physical quantity sensor since a package is fixed by holding notches onto an upper surface and a lower surface of the package between a lid member and a housing of an electronic apparatus, and measurement precision is deteriorated.SOLUTION: The lid member having a hole is water-tightly adhered to a recessed package having an opening, and the physical quantity sensor device is made to have a structure equipped with an outer edge part extending from the package. The physical quantity sensor device is provided which measures the physical quantity with high definition by fixing the physical quantity sensor device to the electronic apparatus into a waterproof structure by the outer edge part.

Description

  The present invention relates to a physical quantity sensor device that can be attached to an electronic device with a waterproof structure.

Pressure sensors for electronic devices are used for pressure and water pressure measurement of outdoor and diver watches, and for color correction and water depth detection during underwater shooting of digital cameras and digital video cameras. In particular, an electronic device used in water has a waterproof structure, and a pressure sensor has a structure that can withstand water pressure, and is attached to the electronic device with a waterproof structure.

  As an electronic apparatus having such a waterproof structure, for example, a camera for underwater photography in which a pressure sensor described in Patent Document 1 is mounted with a waterproof structure is known.

JP 2008-180898 A

  In the prior art, as described in Patent Document 1 or as shown in the cross-sectional explanatory views of the prior art shown in FIGS. 14 and 15, cut into the outer peripheral portion of the upper surface and the lower surface of the package 2 of the physical quantity sensor device. 18, a notch 18 between the upper surface and the lower surface of the package 2 is sandwiched between the lid member 6 and the housing 15 of the electronic device and tightened with a screw 16, and the sealing material 14 is provided on the notch 18 on the upper surface. The physical quantity sensor device was attached to the electronic device with a waterproof structure.

  When the notch 18 between the upper surface and the lower surface of the package 2 is sandwiched and fixed between the lid member 6 and the housing 15 of the electronic device as in the prior art, stress is applied to the package 2 to deform its shape, and the bottom surface of the package 2 is deformed. The physical quantity sensor 3 installed in is deformed.

The output changes due to the deformation of the physical quantity sensor 3, and the relationship between the output and the physical quantity changes. Although this change can be adjusted, there is a problem that the measurement accuracy of the physical quantity sensor device is deteriorated due to an error caused by the adjustment.

  An object of the present invention is to provide a physical quantity sensor device that can be mounted on an electronic device with a waterproof structure by adopting a package structure having a simple shape and that can measure with high accuracy.

A concave package having an opening that is open to the outside; a lid member that covers the opening and is water-tightly bonded to the package; and a physical quantity sensor fixed in the package, the lid member including the opening A first hole that passes through the inside and outside of the package in cooperation with a portion, and an outer edge portion that protrudes from the package, and the outer edge portion includes means for watertightly fixing the lid member to the electronic device. It is characterized by.

According to this aspect, the physical quantity can be measured by the physical quantity sensor opened to the outside through the opening and the first hole, and the package and the lid member are bonded in a watertight manner. The lid member can be fixed to the electronic device with a waterproof structure by the means for fixing the lid member to the electronic device in a watertight manner. Accordingly, a physical quantity sensor device having a simple package structure including the lid member having the outer edge portion can be mounted on the electronic apparatus with a waterproof structure.

If it is such an aspect, in this invention, since the said outer edge part and the housing | casing of the said electronic device are fixed, the notch | incision of the upper surface and lower surface of a package is carried out like the prior art, the said cover member and the housing | casing of the said electronic device. The stress applied to the package and the stress applied from the package to the physical quantity sensor can be reduced while being fixed between the body and the body.

When a physical quantity sensor device is fixed to a housing of an electronic device, when stress is applied to the physical quantity sensor, the shape thereof is deformed. This deformation changes the output and changes the relationship between the output and the physical quantity. Although this change can be adjusted, the measurement accuracy of the physical quantity sensor device deteriorates due to an error caused by the adjustment.

When the applied stress is reduced, the deformation is reduced, the change in the relationship between the output and the physical quantity is reduced, the error associated with the adjustment is also reduced, and the measurement accuracy of the physical quantity sensor device is improved.

Therefore, according to the present invention, by adopting a package structure having a simple shape, it is possible to provide a physical quantity sensor device that can be mounted on an electronic device with a waterproof structure and that performs measurement with high accuracy.

The fixing means is a second hole through which a screw to be fixed is passed. In this aspect, the physical quantity sensor device is connected to the electronic device through the screw from the second hole formed in the outer edge portion. Can be fixed.

The fixing means is a male screw formed on an outer peripheral side surface of the outer edge portion.
If it is this aspect, a physical quantity sensor apparatus can be fixed to the said electronic device with the external thread formed in the outer peripheral side surface of the said outer edge part.

The means for fixing is an engagement stopper projecting from the outer edge portion.
According to this aspect, the physical quantity sensor device can be fixed to the electronic device by the engaging stopper protruding from the outer edge portion.

A groove for receiving a sealing material is formed in the outer edge portion.
If it is such an aspect, the said sealing material will be compressed and the said physical quantity sensor apparatus will be fixed to the said electronic device watertightly by storing the said sealing material in the said groove | channel and fastening the said outer edge part to the said electronic device. .

The package is made of ceramics.
If the material is ceramic, in the present invention, the package has a simple shape with no cuts. A package can be produced.

In the case of a complicated structure with a notch in the outer periphery of the upper and lower surfaces of the package as in the prior art, it is difficult to manufacture with the LTCC or HTCC technology, and precise processing is required to ensure waterproofness. Since it is necessary, the prior art package is made of a resin molded body, which causes an increase in cost.

The physical quantity sensor is any one of a pressure sensor, a humidity sensor, a gas sensor, and an optical sensor.
With such an aspect, it is possible to provide an electronic apparatus having a waterproof structure that detects pressure, humidity, gas, and light in an environment that requires a waterproof structure such as outdoors or underwater.

According to the present invention, comprising: a concave package having an opening opened to the outside; a lid member that covers the opening and is watertightly bonded to the package; and a physical quantity sensor fixed in the package, The lid member cooperates with the opening to have a first hole that passes through the inside and outside of the package and has an outer edge portion that protrudes from the package, and the outer edge portion watertightly attaches the lid member to the electronic device. Since the fixing means is provided, the physical quantity sensor device can be attached to the electronic device in a waterproof structure.

  According to the present invention, the measurement accuracy of the physical quantity sensor device can be improved by a package structure having a simple shape that includes the lid member having the outer edge.

Therefore, according to the present invention, by adopting a package structure with a simple shape, it is possible to provide the physical quantity sensor device that can be mounted on the electronic device with a waterproof structure and that measures with high accuracy. it can.

1 is a schematic cross-sectional view of a physical quantity sensor device 1 according to a first embodiment. 1 is a schematic plan view showing a physical quantity sensor device 1 as viewed from the upper surface side. It is a section schematic diagram of physical quantity sensor device 2 which is the 1st modification. It is a plane schematic diagram seen from the upper surface of the physical quantity sensor device 2 which is the 1st modification. It is a section schematic diagram of physical quantity sensor device 3 which is the 2nd modification. It is a section schematic diagram of physical quantity sensor device 4 which is the 3rd modification. (A)-(f) It is explanatory drawing of the manufacturing method of the physical quantity sensor apparatus 1 which is 1st embodiment. (A)-(f) It is explanatory drawing of the 1st modification of the manufacturing method of the physical quantity sensor apparatus 1. FIG. It is the cross-sectional schematic which connected the physical quantity sensor apparatus 1 which is 1st embodiment to the flexible substrate. It is the cross-sectional schematic which mounted | wore the electronic device with the physical quantity sensor apparatus 1 which is 1st embodiment. It is the cross-sectional schematic which mounted | wore the electronic device with the physical quantity sensor apparatus 2 which is a 1st modification. It is the cross-sectional schematic which mounted | wore the electronic device with the physical quantity sensor apparatus 3 which is a 2nd modification. It is the cross-sectional schematic which mounted | wore the electronic device with the physical quantity sensor apparatus 4 which is a 3rd modification. It is sectional explanatory drawing of the physical quantity sensor apparatus of a prior art. It is sectional explanatory drawing which mounted | wore the electronic device with the physical quantity sensor apparatus of the prior art. It is explanatory drawing explaining that the relationship between an output and a physical quantity changes with the stress at the time of mounting | wearing. It is explanatory drawing explaining that the relationship between an output and a physical quantity changes with thermal stress.

  FIG. 1 is a schematic cross-sectional view of a physical quantity sensor device 1 according to a first embodiment of the present invention. FIG. 2 is a schematic plan view showing the physical quantity sensor device 1 as viewed from the upper surface side.

  A physical quantity sensor 3 is installed on the bottom surface 2b of the concave package 2 having the side wall 2a around the outer periphery, and an outer edge portion 6a protruding from the outer edge of the side wall 2a of the package 2 via the adhesive layer 5 on the upper surface 2c of the side wall. The provided lid member 6 is bonded, and the physical quantity sensor 3 is covered with a soft gel-like substance 7 and is opened to the outside through a first hole 9 provided in the center of the lid member 6.

The soft gel-like substance 7 is preferably a compound mainly composed of any one of an epoxy resin, a melamine resin, a polyimide resin, a silicon resin, a urethane resin, a polyester resin, and a fluorine resin.

  As the physical quantity sensor 3, a pressure sensor, a humidity sensor, a gas sensor, or an optical sensor can be selected. One to a plurality of these physical quantity sensors 3 are mounted on the physical quantity sensor device 1.

The soft gel-like substance 7 is intended to protect the physical quantity sensor 3, but may not be provided depending on the physical quantity sensor 3, and the thickness thereof needs to be set appropriately. For example, in the case of a pressure sensor mounted on an underwater camera, it is preferable to embed a soft gel material 7 up to the first hole 9 in order to make it difficult for underwater dust to adhere.

  By using the soft gel-like substance 7, no mechanical stress is applied to the physical quantity sensor 3, and no thermal stress accompanying a temperature change is applied to the physical quantity sensor 3. Will not change the output.

The manufacturing method of the physical quantity sensor device 1 according to the first embodiment of the present invention will be described with reference to FIG.
By the LTCC technology, the concave package 2 having the hollow portion 10 that accommodates the physical quantity sensor 3 in the center and having the electric wiring pattern printed on the bottom surface 2b of the hollow portion 10 is manufactured. However, the electric wiring pattern is not shown in FIG.

A physical quantity sensor 3 is bonded to the bottom surface 2 b of the concave package 2 and is electrically connected to the electric wiring pattern by a bonding wire 4.

The liquid thermosetting resin 5a is applied to the upper surface 2c of the side wall of the concave package 2 by the dispenser 11 of the coating device. Next, a lid member 6 provided with an outer edge portion 6a protruding from the outer edge of the side wall 2a via a liquid thermosetting resin 5a on the side wall 2a and having a first hole 9 in the center is installed, The liquid thermosetting resin 5a is cured by heating at a temperature of 250 ° C. for about 30 minutes to 2 hours, and the lid member 6 is adhered to the side wall 2a in a watertight manner. In this way, the lid member 6 cooperates with the opening 8 of the package 2 and is configured to communicate with the inside and outside of the package 2 through the first hole 9.

A liquid resin is dropped on the physical quantity sensor 3 from the first hole 9 by the dispenser 11, and heated at a temperature of 100 ° C. to 250 ° C. for about 30 minutes to 2 hours to convert the liquid resin into a gel-like resin. By changing, the hollow portion 10 of the concave package 2 is filled with the soft gel material 7.

Next, as shown in FIG. 9, it is electrically connected to the electrical wiring pattern printed on the bottom surface 2b of the concave package 2, and is drawn out to the outer surface 2d of the bottom wall facing the bottom surface 2b of the concave package 2. The lead electrode 12 is formed by the LTCC technique. A flexible substrate 13 is electrically connected to the extraction electrode 12.

  As shown in FIG. 10, the physical quantity sensor device 1 manufactured by the above-described procedure is projected from the side wall 2a of the lid member 6 after the flexible substrate 13 is electrically connected to the electronic device (not shown in FIG. 10). The outer edge portion 6a is fixed to the housing 15 of the electronic device with a screw 16 via the sealing material 14.

  In FIG. 10, the groove for storing the sealing material is formed only in the lid member 6. However, the present invention is not limited thereto, and when the groove is formed only in the casing 15 of the electronic device, the lid member 6 and the electronic device It may be formed in both the housing 15 or may not be formed in both the lid member 6 and the housing 15 of the electronic device.

  In FIG. 2, the number of the second holes 17 is eight, but the position and the number of the second holes 17 may be arbitrary as long as the lid member 6 and the housing 15 of the electronic device can be fixed in a watertight manner. Further, since the lid member 6 and the housing 15 of the electronic device may be fixed by a method other than a screw, the second hole 17 may not be provided.

  As the sealing material 14, it is preferable to select a ring having a square or circular cross section made of nitrile rubber, styrene rubber, silicone rubber, or fluororubber.

The procedure of the manufacturing method in FIG. 7 can be modified, and a first modification is shown in FIG. In FIG. 8, the physical quantity sensor 3 is joined to the bottom surface 2 b of the hollow portion 10, and electrically connected to the electric wiring pattern printed on the bottom surface 2 b by the LTCC technique with the bonding wire 4, and then the hollow portion 10 of the concave package 2. Is filled with a soft gel substance 7.

Next, the liquid thermosetting resin 5a is applied to the upper surface 2c of the side wall of the concave package 2 by the dispenser 11 of the coating device. A lid member 6 having an outer edge portion 6a protruding from the outer edge of the side wall 2a through a liquid thermosetting resin 5a is installed on the side wall 2a, and heated at a temperature of 100 ° C. to 250 ° C. for about 30 minutes to 2 hours. The liquid thermosetting resin 5a is cured to adhere the lid member 6 on the side wall 2a in a watertight manner.

  In the manufacturing method of FIGS. 7 and 8, a concave package 2 having a hollow portion 10 that accommodates the physical quantity sensor 3 in the center and having an electric wiring pattern printed on the bottom surface 2 b of the hollow portion 10 is manufactured by LTCC technology. However, it may be manufactured by HTCC technology.

As the material of the lid member 6, ceramics, metal, or resin can be selected. In the above description, the concave package 2 and the lid member 6 are bonded by the thermosetting resin 5a. However, when the lid member 6 is transparent, a UV curable resin is used instead of the thermosetting resin 5a. You can also.

As the thermosetting resin 5a, an epoxy resin or a melamine resin excellent in water resistance is preferable.

Although the thermosetting resin or the UV curable resin is used for watertight adhesion between the lid member 6 and the package 2, other methods such as soldering may be used as long as watertight adhesion is possible.

The physical quantity sensor device 1 shown in FIG. 1 can be modified, and a first modification is shown in FIG. FIG. 4 shows a schematic plan view of the physical quantity sensor device 2 that is the first modification as viewed from the upper surface. In this modification, the lid member 6, the first hole 9, the seal material groove 19, and the male screw 20 at the outer edge portion have a flat circular shape. The package 2 has a planar rectangle, but may be a planar circle.

In this modification, the outer edge male screw 20 formed on the outer peripheral side surface of the outer edge 6a is provided. FIG. 11 shows a schematic cross-sectional view of this modification mounted on an electronic device. By tightening the male screw 20 of the outer edge to the female screw of the electronic device located at the screw joint 22, the sealing material 14 is compressed and the casing 15 of the electronic device and the outer edge 6 a are fixed in a watertight manner. The

As shown in FIG. 11, the lead electrode 12 electrically connected to the physical quantity sensor 3 via the bonding wire 4 is electrically connected to the electronic device by a spring electrode 21 of the electronic device.

A second modification of the physical quantity sensor device 1 shown in FIG. 1 is also possible, and this modification is shown in FIGS. 5 and 12. In this modification, the groove 19 of the sealing material is formed on both the outer edge portion 6a and the casing 15 of the electronic device, and is formed on the outer periphery of the joint portion 22 of the screw. According to this aspect, since the area of the water | moisture content which is located in the outer periphery rather than the sealing material 14 can be made small, it is preferable.

A third modification of the physical quantity sensor device 1 shown in FIG. 1 is also possible, and this modification is shown in FIGS. 6 and 13. In this modified example, the engaging portion 23 having a notch is formed on the casing 15 of the electronic device, and the engaging stopper 24 is formed on the outer edge portion 6a. The electronic device and the outer edge portion are fixed in a watertight manner.

The engaging portion 23 having a notch is a hole formed in the casing 15 of the electronic device located within the dotted ellipse shown in FIG. 13, and the engaging stopper 24 has a protrusion on the lower surface and is cracked in the longitudinal direction. It was formed by inserting a rod-shaped jig into a hole formed in the outer edge 6a.

Other shapes for the engagement portion 23 and the engagement stop 24 having notches are possible. For example, the engagement portion 23 having a cutout may be a closed hole shape. The engagement stopper 24 may be formed by bonding the engagement stopper 24 protruding from the outer edge portion 6a by an adhesive, welding, pressure bonding, or the like, or may be formed by cutting or molding.

In the prior art, as described in Patent Document 1 or as shown in the cross-sectional explanatory views of the prior art shown in FIGS. 14 and 15, the physical quantity sensor device is attached to the electronic device of the physical quantity sensor device package 2. The notch 18 between the upper surface and the lower surface is sandwiched between the lid member 6 and the housing 15 of the electronic device and fixed with screws 16.

  In the above-described mode, since stress is applied to the package 2 in which the physical quantity sensor 3 is installed, stress is also applied to the physical quantity sensor 3 installed in the package 2 and the shape of the physical quantity sensor 3 is deformed. As a result, the output changed due to this deformation, and the relationship between the output and the physical quantity changed.

  For example, in the case of a pressure sensor, a bridge circuit is formed by a plurality of piezoresistive elements, and the pressure is measured by the output of the bridge circuit. This piezoresistive element is very sensitive to pressure, and it is necessary to suppress mechanical and thermal stresses other than external pressure. Therefore, if a mechanical stress is generated when the physical quantity sensor device is mounted on an electronic device, the zero point output changes.

The relationship between the output of the physical quantity sensor device and the physical quantity is adjusted at the time of shipment. However, in the prior art, the output changes when the physical quantity sensor device is attached to an electronic device, so that readjustment is necessary after the attachment. In addition, after the readjustment, an error associated with the readjustment occurs, so that the measurement accuracy of the physical quantity sensor device is deteriorated.

  The above will be described with reference to FIG. The horizontal axis represents physical quantity, and the vertical axis represents output. Before the physical quantity sensor 3 is mounted on the casing 15 of the electronic device, the relationship between the output and the physical quantity is adjusted so as to pass through the origin as shown in the graph 1. When stress is applied to the physical quantity sensor 3 when the physical quantity sensor 3 is attached to the housing 15 of the electronic device, the physical quantity sensor 3 changes as shown in the graph 2 according to the stress.

  Therefore, readjustment is necessary so that the graph 2 passes through the origin. In the prior art, since the readjustment is necessary for the physical quantity sensor device shipped to the market, an error caused by the readjustment has occurred. Therefore, the guaranteed value of the measurement accuracy of the physical quantity sensor device is deteriorated due to this error.

  According to the present invention, as shown in FIG. 10, the lid member 6 and the casing 15 of the electronic device are fixed in a watertight manner with the sealing material 14 interposed therebetween, and the package 2 is the casing 15 of the electronic device. Not used for fixing to. In this mode, the mechanical stress applied to the package 2 in which the physical quantity sensor 3 is installed is very small, the deformation of the physical quantity sensor 3 is very small, and the output hardly changes.

  Therefore, according to the present invention, it is not necessary to readjust the relationship between the output and the physical quantity after mounting the physical quantity sensor device 1 on the electronic device, and the measurement accuracy of the physical quantity sensor device is improved as compared with the prior art.

  The sensor unit of the physical quantity sensor 3 is generally composed of silicon, metal, metal oxide, or compound semiconductor. While the thermal expansion coefficient of these materials is almost the same as that of ceramics, the thermal expansion coefficient of resins is generally several times as large.

It is known that thermal stress is generated between members having different thermal expansion coefficients as the temperature changes. When this thermal stress is applied to the physical quantity sensor, its shape is deformed and an output resulting from this deformation is generated, so that the output changes.

  The above will be described with reference to FIG. The horizontal axis represents physical quantity, and the vertical axis represents output. When there is no thermal stress, the relationship between the output and the physical quantity is adjusted to pass through the origin as shown in graph 1. When the temperature changes and thermal stress is generated in accordance with the difference in thermal expansion coefficient, and thermal stress is applied to the physical quantity sensor 3, it changes as shown in the graph 2 according to the thermal stress.

If the material of the package 2 of the physical quantity sensor device is ceramic, it is possible to suppress the thermal stress applied to the physical quantity sensor accompanying a temperature change, and therefore it is possible to reduce the output change accompanying the temperature change.

The ceramic package 2 is generally manufactured by LTCC technology or HTCC technology. In these techniques, a package 2 is manufactured by punching, printing, laminating, sintering, and cutting a ceramic sheet.

The package 2 is manufactured by laminating ceramic sheets with holes corresponding to the hollow portion 10 that accommodates the physical quantity sensor 3. The reason why this is possible is that the portion corresponding to the unnecessary hollow portion 10 is dropped off. This is because the necessary side walls 2a and the like can be left on the ceramic sheet.

  However, if the cut 18 is to be formed in the outer peripheral portion of the package 2, it is necessary to make a hole in a portion corresponding to the outer peripheral portion of the package 2, but in this case, the portion corresponding to the side wall 2a is formed from the ceramic sheet. It will drop off. Therefore, the package 2 including the notch 18 in the outer peripheral portion as in the conventional technique cannot be manufactured only by the LTCC technique or the HTCC technique.

However, it is possible to manufacture the package 2 having the notches 18 in the outer peripheral portion as in the prior art by forming the notches 18 by cutting the packages 2 manufactured by the LTCC technology or the HTCC technology one by one. Yes, but manufacturing costs are high and not practical.

Therefore, in the prior art, the package 2 has a complicated structure with notches 18 on the outer peripheral portion of the upper surface and the lower surface of the package 2, and therefore the package 2 is made of a precision processing resin in consideration of ensuring waterproofness. It was manufactured with a molded body.

For this reason, the conventional technique has a problem that the material of the package 2 is a resin and the output changes due to thermal stress. Further, the amount of this change depends on the temperature and has temperature characteristics.

According to the present invention, as shown in FIG. 1, a lid member 6 having an outer edge portion 6a protruding from the side wall 2a is water-tightly bonded to the concave package 2, and as shown in FIG. 10, the protruding outer edge portion 6a. It is possible to attach to the casing 15 of the electronic device using a waterproof structure.

As described above, according to the present invention, the notch 18 in the outer peripheral portion of the upper surface and the lower surface of the package 2 of the physical quantity sensor device as in the prior art is not required, so the package 2 is made of ceramics by the LTCC technology or the HTCC technology. Can be produced.

Therefore, according to the present invention, it is possible to provide an inexpensive physical quantity sensor device 1 that can reduce a change in output accompanying a temperature change.

  In the present invention, there is an adhesive layer 5 that is a resin between the package 2 and the lid member 6. However, in the prior art, the entire package 2 is a resin, and the amount of resin and the distance between the resin and the physical quantity sensor 3 are considered. And the influence of the thermal stress which the direction of this invention gives to the physical quantity sensor 3 is small.

When this value increases, the output change accompanying the temperature change needs to be compensated by an IC (Integrated Circuit) mounted in the physical quantity sensor device 1, and the price of the IC increases due to the addition of this compensation function. . Therefore, it is preferable that the change of the output accompanying the temperature change is small.

The change in the output accompanying the temperature change can be compensated by the IC mounted on the physical quantity sensor device 1, but the measurement accuracy of the physical quantity sensor device 1 deteriorates due to the error accompanying this compensation. The guaranteed value was worse. Therefore, it is preferable that the change of the output accompanying the temperature change is small.

DESCRIPTION OF SYMBOLS 1 Physical quantity sensor apparatus 2 Package 2a Side wall 2b Bottom surface 2c Top surface of side wall 2d Outer surface of bottom wall 3 Physical quantity sensor 4 Bonding wire 5 Adhesive layer 5a Liquid thermosetting resin 6 Lid member 6a Outer edge part 7 Soft gel substance 8 Opening Part 9 First hole 10 Hollow part 11 Dispenser 12 Lead electrode 13 Flexible substrate 14 Sealing material 15 Case of electronic device 16 Screw 17 Second hole 18 Notch
DESCRIPTION OF SYMBOLS 19 Groove of sealing material 20 Male screw of outer edge part 21 Spring electrode of electronic equipment 22 Joint part of screw 23 Engagement part which has a notch 24 Engagement stop

Claims (7)

A concave package having an opening open to the outside;
A lid member that covers the opening and is watertightly bonded to the package; and a physical quantity sensor fixed in the package;
With
The lid member has a first hole that passes through the inside and outside of the package in cooperation with the opening, and has an outer edge portion that protrudes from the package,
The physical quantity sensor device according to claim 1, wherein the outer edge portion has means for watertightly fixing the lid member to an electronic device. The physical quantity sensor device according to claim 1, wherein the fixing means is a second hole through which a fixing screw is passed. The physical quantity sensor device according to claim 1, wherein the fixing means is a male screw formed on an outer peripheral side surface of the outer edge portion. The physical quantity sensor device according to claim 1, wherein the fixing means is an engagement stopper projecting from the outer edge portion. The physical quantity sensor device according to any one of claims 1 to 4, wherein a groove for receiving a sealing material is formed in the outer edge portion. The physical quantity sensor device according to claim 1, wherein a material of the package is ceramics. The physical quantity sensor device according to any one of claims 1 to 6, wherein the physical quantity sensor is any one of a pressure sensor, a humidity sensor, a gas sensor, and an optical sensor.