JP6639209B2 - Socket for electrical components - Google Patents

Description

  The present invention relates to a socket for an electrical component that accommodates an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”) and electrically connects to a wiring board.

  DESCRIPTION OF RELATED ART Conventionally, as this kind of socket for electric components, what was described in the following patent document 1 is known, for example.

  In the electrical component socket of Patent Literature 1, an electrical component socket is provided on a wiring board, and an IC package is accommodated in an accommodation surface provided on a socket body of the electrical component socket. Then, by using a plurality of contact pins provided in the socket body, the electrodes of the wiring board and the terminals of the IC package are electrically connected.

  Each of these contact pins includes a coil spring and first and second plungers provided at both ends thereof. When the terminal of the IC package is pressed against the first plunger, the first and second plungers contact the electrode of the wiring board and the terminal of the IC package with an appropriate contact pressure due to the urging force of the coil spring. The IC package is electrically connected to the wiring board.

JP 2008-14704 A

  In a socket for an electric component as disclosed in Patent Document 1, the socket body is usually formed of an insulator so that the contact pins do not short-circuit.

  However, the insulator has a characteristic that it is easily charged and, therefore, static electricity is easily generated on its surface. For this reason, the IC package is damaged by static electricity generated on the housing surface of the socket body when the IC package is housed and operated (for example, during a burn-in test) in the conventional electrical component socket. There are inconveniences that dust may easily adhere to the surface of the socket body.

  On the other hand, it is conceivable to prevent and suppress such inconvenience by forming the socket body with an antistatic material.

  However, as a material for forming the socket body, it is necessary to use a material having sufficiently high withstand voltage characteristics in order not to short-circuit the contact pins inserted into the socket body, and further, the strength is sufficiently high, It is necessary to use a material excellent in workability.

  It is currently difficult to obtain a material that satisfies all of these conditions and has sufficient antistatic properties.

  SUMMARY OF THE INVENTION It is an object of the present invention to provide a socket for an electric component having a socket body having excellent antistatic performance and also excellent in withstand voltage characteristics and workability.

In order to achieve the object, the invention according to claim 1 has a socket body arranged on a wiring board and accommodating an electric component, and a telescopic contact pin is arranged on the socket body. An electrical component socket for electrically connecting a terminal of the electrical component housed in the socket body to an electrode of the wiring board via the contact pin, wherein the socket body has a plate shape. An insulating member, comprising a surface antistatic layer formed of an antistatic material and provided on the surface of the insulating member, wherein the insulating member and the surface antistatic layer of the socket body each include: An insertion hole for arranging a contact pin is formed so as to communicate with substantially the same diameter, the insertion hole of the socket body is formed to have a diameter larger than that of the terminal of the electric component, and The end of The electric part is accommodated in the socket body by forming a contact portion which is in contact with the electric part with a smaller diameter than the insertion hole, and the electric part is in a state where the electric part is in contact with the surface antistatic layer. And an electrical component socket configured so that the terminal does not make electrical contact with the surface antistatic layer and the contact portion of the contact pin does not make electrical contact with the surface antistatic layer. It is characterized by having.

According to a second aspect of the present invention, in addition to the configuration of the first aspect, a back surface antistatic layer formed of an antistatic material is provided on a surface of the socket body facing the wiring board. And

According to a third aspect of the present invention, in addition to the configuration of the first or second aspect , the socket body includes at least an upper plate and a lower plate, and the surface antistatic layer is provided on a surface of the upper plate. In addition, an intermediate surface antistatic layer formed of an antistatic material is provided on at least one of the back surface of the upper plate and the surface of the lower plate.

According to the invention of claim 1, a plate-shaped insulating member is provided on the socket body, a surface antistatic layer is provided on the surface of the insulating member, and an electric component is accommodated on the surface antistatic layer. I made it. For this reason, according to the first aspect of the present invention, if the insulating member is made sufficiently excellent in insulation properties, workability, and the like, it is not essential that the surface antistatic layer has these properties. For this reason, according to the first aspect of the invention, it is easy to select a surface antistatic material having excellent antistatic properties, and as a result, it has excellent antistatic performance and also has excellent withstand voltage characteristics, workability, and the like. It becomes easy to obtain a socket body.
Further, according to the first aspect of the present invention, since the contact pins and the surface antistatic layer of the socket body do not make electrical contact with each other, it is possible to use a surface antistatic layer having a low insulating property, and therefore, it is possible to use an excellent surface antistatic layer. It becomes even easier to obtain a socket body that has antistatic performance and is also excellent in withstand voltage characteristics and workability.
Further, according to the first aspect of the present invention, when the electric component is in contact with the surface antistatic layer, the terminal of the electric component and the surface antistatic layer are configured not to make electrical contact. Can be formed from a material having a low withstand voltage characteristic, whereby the degree of freedom in selecting a material for forming the surface antistatic layer can be increased.

According to the second aspect of the present invention, since the back surface antistatic layer is provided, the back surface of the socket body can be prevented from being charged.

According to the third aspect of the present invention, the intermediate surface antistatic layer is provided, so that the intermediate surface of the socket body can be prevented from being charged.

FIG. 1 is a perspective view conceptually showing an overall configuration of an electrical component socket according to Embodiment 1 of the present invention. 3A and 3B are cross-sectional views conceptually showing a configuration of a main part of the socket body according to Embodiment 1 of the present invention, wherein FIG. 3A is a state in which no electric component is accommodated, and FIG. It is. It is sectional drawing which shows notionally the principal part structure of the socket main body which concerns on Embodiment 2 of this invention, (a) is the state which does not accommodate an electric component, (b) is the state which accommodates an electric component. It is. It is sectional drawing which shows notionally the principal part structure of the socket main body which concerns on Embodiment 3 of this invention, (a) is the state which does not accommodate an electric component, (b) is the state which accommodates an electric component. It is. It is sectional drawing which shows notionally the principal part structure of the socket main body which concerns on Embodiment 4 of this invention, (a) is the state which does not accommodate an electric component, (b) is the state which accommodates an electric component. It is.

[First Embodiment of the Invention]
1 and 2 show a first embodiment of the present invention.

  As shown in FIG. 2, the IC socket 10 as the “electric component socket” according to the first embodiment is arranged on the wiring board 20, and the IC package 30 as the “electric component” is housed on the upper surface. You. The IC socket 10 is used, for example, as a test device for a burn-in test on the IC package 30.

  In the IC package 30 according to the first embodiment, a plurality of terminals 32 are arranged in a matrix in a substantially rectangular predetermined area on the lower surface of a substantially rectangular package body 31. In FIG. 2, only one terminal 32 is shown.

  As shown in FIG. 1, the IC socket 10 includes a socket main body 11 arranged on a wiring board 20. The socket body 11 includes a substantially square outer frame member 12 and a contact module 13 in plan view. A plurality of contact pins 40 are arranged in a matrix in the contact module 13, and the upper surface thereof is a housing surface 13 a for housing the IC package 30.

  The contact module 13 includes an upper fixing plate 14 and a lower fixing plate 15, as shown in FIGS. The upper fixed plate 14 and the lower fixed plate 15 are fixed and held by the outer frame member 12.

  Here, the upper fixed plate 14 includes a plate-shaped insulating member 16 and a surface antistatic layer 17.

  The insulating member 16 is formed of, for example, glass epoxy resin. By using a glass epoxy resin, an insulating member having very high withstand voltage characteristics (thus, it is very unlikely that a short circuit occurs between adjacent contact pins 40) and having excellent strength, workability, heat resistance, and the like. 16 can be obtained.

  The surface antistatic layer 17 can be produced, for example, by filling a glass epoxy resin with a conductive filler such as carbon or metal. The material for forming the surface antistatic layer 17 may be a material having a sufficient antistatic property, but may be a material having an insulating property, a strength and the like within a range not impairing the antistatic performance. .

  In the upper fixing plate 14 of the first embodiment, for example, after forming an insulating member 16 by laminating a layer of glass epoxy resin, the last layer (layer exposed on the surface) is filled with a conductive filler. It can be manufactured by forming the surface antistatic layer 17. However, the surface antistatic layer 17 may be formed by coating or plating on the surface of the insulating member 16, and may be attached to the insulating member 16 after forming a plate material for the surface antistatic layer 17. Alternatively, it may be formed by another method.

  On the other hand, the lower fixed plate 15 can be formed of, for example, the same material as the insulating member 16 of the upper fixed plate 14, but may be formed of another material. However, it is desirable to use a forming material having sufficient withstand voltage characteristics, strength, workability, heat resistance, and the like.

  The upper fixing plate 14 and the lower fixing plate 15 are provided with insertion holes 14a and 15a. As shown in FIG. 2A, the insertion hole 14a of the upper fixed plate 14 has a small-diameter upper insertion hole 14b and a large-diameter lower insertion hole 14c. In the first embodiment, the upper insertion hole 14b is formed to have a diameter sufficiently larger than the terminal 32 so that the terminal 32 of the IC package 30 does not come into contact with the peripheral edge thereof (described later). On the other hand, the insertion hole 15a of the lower fixed plate 15 includes an upper insertion hole 15b slightly smaller in diameter than the lower insertion hole 14c of the upper fixed plate 14, and a lower insertion hole 15c smaller in diameter than the upper insertion hole 15b. ing.

  Here, after the surface antistatic layer 17 is formed (or pasted) on the insulating member 16, the through hole 14 a of the upper fixing plate 14 is formed with a through hole in the insulating member 16 and the surface antistatic layer 17. Are obtained by forming Therefore, the insertion hole 14a has substantially the same diameter at the portion formed on the insulating member 16 and the portion formed on the surface antistatic layer 17. By forming the insertion hole 14a simultaneously with the insulating member 16 and the surface antistatic layer 17, the manufacturing process can be simplified and the manufacturing cost can be reduced. The upper end of the upper through-hole 14b may be chamfered to increase the diameter so that the terminal 32 of the IC package 30 does not come into contact with the peripheral edge of the upper through-hole 14b (not shown). .

  As shown in FIGS. 2A and 2B, the contact pin 40 includes a conductive stepped cylindrical first plunger 41 and a conductive round bar-shaped second plunger 42. Inside the contact pin 40, a coil spring (not shown) is provided for urging the first plunger 41 and the second plunger 42 in a direction away from each other.

  The first plunger 41 has an outer cylindrical portion 41a and an upper contact portion 41b having a smaller diameter than the outer cylindrical portion 41a. The outer cylinder 41a is provided with a protruding part 41c. The upward movement of the contact pin 40 is regulated by the contact of the projecting portion 41c with the step 14d between the upper insertion hole 14b and the lower insertion hole 14c of the upper fixed plate 14. Further, the projecting portion 41c abuts on a step 15d between the lower insertion hole 14c of the upper fixed plate 14 and the upper insertion hole 15b of the lower fixed plate 15, whereby the contact pin 40 moves downward. Is regulated.

  In the first embodiment, the outer cylindrical portion 41a of the first plunger 41 is formed to have substantially the same diameter as the upper insertion hole 14b of the insertion hole 14a. The outer cylindrical portion 41a of the one plunger 41 is guided by the upper insertion hole 14b, so that the first plunger 41 does not tilt from the vertical direction.

  In the first embodiment, the upper contact portion 41b is formed to have a diameter sufficiently smaller than the upper insertion hole 14b. Thus, when the first plunger 41 is lowered, it is possible to prevent the upper contact portion 41b from contacting the peripheral portion of the upper insertion hole 14b of the upper fixing plate 14 (described later).

  The second plunger 42 is inserted into the outer cylindrical portion 41a of the first plunger 41, and a lower contact portion 42a is provided at a tip thereof.

  Next, the operation of the IC socket 10 according to the first embodiment will be described with reference to FIGS.

  When accommodating the IC package 30 in the IC socket 10, first, the IC package 30 is accommodated in the accommodating surface 13a of the socket body 11 (see FIG. 2A). Press from Then, the coil spring (not shown) of the contact pin 40 contracts, and the IC package 30 descends. Thus, the upper contact portion 41b of the first plunger 41 of the contact pin 40 is pressed against the terminal 32 of the IC package 30 with an appropriate contact pressure, and the lower contact portion 42a of the second plunger 42 is connected to the wiring board. The electrodes 20 are brought into pressure contact with an appropriate contact pressure (see FIG. 2B). As a result, the IC package 30 and the wiring board 20 can be electrically connected with a sufficiently low and stable electric resistance.

  Here, in the first embodiment, the terminal 32 of the IC package 30 and the upper contact portion 41b of the first plunger 41 are formed to have a smaller diameter than the upper insertion hole 14b of the upper fixing plate 14 (described above). Therefore, when the IC package 30 is accommodated in the IC socket 10, the terminal 32 and the upper contact portion 41b do not come into contact with the vicinity of the outer edge of the upper insertion hole 14b. 41b is electrically connected to the surface antistatic layer 17, so that adjacent contact pins 40 are not short-circuited.

  When a material having a sufficiently high withstand voltage property is used as the material for forming the surface antistatic layer 17, the terminal 32 of the IC package 30 and the upper contact portion 41b of the first plunger 41 are attached to the surface antistatic layer 17. Even if they make contact, the adjacent contact pins 40 do not short-circuit. However, by adopting a structure in which the terminal 32 and the upper contact portion 41b do not contact the surface antistatic layer 17, it is possible to form the surface antistatic layer 17 with a material having a low withstand voltage characteristic. The degree of freedom in selecting a material for forming the antistatic layer 17 can be increased.

  As described above, according to the first embodiment, the plate-shaped insulating member 16 and the surface antistatic layer 17 are provided on the socket body 11, so that the surface antistatic layer 17 has a withstand voltage characteristic and strength. Even if a material having insufficient workability or the like is used, a socket body 11 having sufficiently excellent properties can be obtained. For this reason, the degree of freedom in selecting a material for forming the surface antistatic layer 17 is increased, and it becomes easy to obtain the socket body 11 having various characteristics such as antistatic properties, strength, and workability.

  In addition, by configuring the terminal 32 of the IC package 30 and the upper contact portion 41b of the contact pin 40 so as not to contact the surface antistatic layer 17, the use of the surface antistatic layer having low withstand voltage characteristics can be further facilitated. Thereby, it is possible to more easily obtain the socket body 11 having excellent antistatic performance and also excellent in withstand voltage characteristics and workability.

[Embodiment 2]
FIG. 3 shows a second embodiment of the present invention.

  The second embodiment is different from the first embodiment in that the lower stationary plate is provided with a back surface antistatic layer. Note that, in FIG. 3, components denoted by the same reference numerals as those in FIGS. 1 and 2 indicate the same components as those in these drawings.

  That is, the lower fixed plate 50 according to the second embodiment includes the insulating member 51 and the back surface antistatic layer 52.

  The structure and material of the insulating member 51 may be the same as, for example, the insulating member 16 according to the first embodiment.

  The back surface antistatic layer 52 can be produced, for example, by filling a glass epoxy resin with a conductive filler such as carbon or metal, similarly to the surface antistatic layer 17 in the first embodiment. Further, as the material for forming the back surface antistatic layer 52, as with the front surface antistatic layer 17, a material having insulation properties, strength, and the like may be used as long as the antistatic performance is not impaired.

  In the lower fixing plate 50 of the second embodiment, for example, after the insulating member 51 is formed by laminating layers of glass epoxy resin, the last layer (layer exposed on the back surface) is filled with a conductive filler. By forming the back surface antistatic layer 52 in this way, it can be manufactured. However, the back surface antistatic layer 52 may be formed by coating or plating on the back surface of the insulating member 51, and may be attached to the insulating member 51 after forming a plate material for the back surface antistatic layer 52. Alternatively, it may be formed by another method.

  The through holes 50a of the lower fixing plate 50 are formed by forming (or attaching) the back surface antistatic layer 52 on the insulating member 51 and then forming through holes in the insulating member 51 and the back surface antistatic layer 52. By doing, it is obtained.

  When a material having a sufficiently high withstand voltage characteristic is used as a material for forming the back surface antistatic layer 52, the lower contact portion provided on the second plunger 42 of the contact pin 40 is attached to the back surface antistatic layer 52. Even if 42a comes into contact, there is no short circuit between adjacent contact pins 40. However, in order to increase the degree of freedom in selecting a material for forming the back surface antistatic layer 52, it is desirable to adopt a structure in which these materials do not contact each other.

  As described above, according to the second embodiment, in addition to the effect similar to that of the first embodiment, since the back surface antistatic layer 52 is provided, the back surface of the socket body 11 can be suppressed from being charged. For example, it is possible to avoid the problem that dust adheres to the rear surface of the socket body 11 due to the generation of static electricity, and the dust contaminates the electrodes 21 of the wiring board 20.

Third Embodiment of the Invention
FIG. 4 shows a third embodiment of the present invention.

  The third embodiment differs from the first and second embodiments in that an intermediate surface antistatic layer is provided on the surface of the lower fixed plate. The intermediate surface antistatic layer may be provided on the back surface of the upper fixed plate, or may be provided on both the front surface of the lower fixed plate and the back surface of the upper fixed plate. In FIG. 4, components denoted by the same reference numerals as those in FIGS. 1 to 3 indicate the same components as those in these drawings.

  As shown in FIG. 4, the lower fixed plate 60 according to the third embodiment includes an insulating member 61, an intermediate surface antistatic layer 62, and a back surface antistatic layer 63.

  The structure and forming material of the insulating member 61 may be the same as, for example, the insulating members 16 and 51 according to the first and second embodiments.

  The intermediate surface antistatic layer 62 and the back surface antistatic layer 63 are produced by filling a glass epoxy resin with a conductive filler such as carbon or a metal, similarly to the surface antistatic layer 17 in the first embodiment. it can. As the material for forming the intermediate surface antistatic layer 62 and the back surface antistatic layer 63, a material having insulating properties and strength within a range that does not impair the antistatic performance, like the surface antistatic layer 17, is used. Is also good.

  The lower fixing plate 60 according to the third embodiment is formed, for example, by first forming the back surface antistatic layer 63 using a glass epoxy resin filled with a conductive filler, and then using a glass epoxy resin not filled with a conductive filler. The insulating member 61 is formed by stacking the above layers, and then the intermediate surface antistatic layer 62 is formed by using a glass epoxy resin filled with a conductive filler. However, the intermediate surface antistatic layer 62 and the back surface antistatic layer 63 may be formed by coating or plating on both the front and back surfaces of the insulating member 61, and may be used for the intermediate surface antistatic layer 62 and the back surface antistatic layer 63. After the plate material is formed, it may be attached to the insulating member 61, or may be formed by another method.

  The insertion holes 60a of the lower fixing plate 60 are formed in the lower fixing plate 60 after the intermediate antistatic layer 62 and the back antistatic layer 63 are formed (or attached) on both front and back surfaces of the insulating member 61. It is obtained by forming a through hole.

  When a material having a sufficiently high withstand voltage characteristic is used as a material for forming the intermediate surface antistatic layer 62 and the back surface antistatic layer 63, the contact pin Even if the lower contact portion 42a provided on the second plunger 42 of the 40 contacts, the adjacent contact pins 40 do not short-circuit. However, in order to increase the degree of freedom in selecting a material for forming the back surface antistatic layer 52, it is desirable to adopt a structure in which these materials do not contact each other.

  As described above, according to the third embodiment, in addition to the same effects as those of the first embodiment, the intermediate surface antistatic layer 62 and the back surface antistatic layer 63 are provided. The charging on the back surface can also be suppressed. For example, it is possible to avoid inconvenience that dust adheres to the intermediate surface and the back surface of the socket body 11 due to generation of static electricity, and the dust contaminates the electrodes 21 of the wiring board 20.

  In the third embodiment, the case where both the intermediate surface antistatic layer 62 and the back surface antistatic layer 63 are provided on the lower fixed plate 60 has been described. However, only the intermediate surface antistatic layer 62 is provided and the back surface antistatic layer is provided. A structure without the layer 63 may be employed. Further, as described above, the intermediate surface antistatic layer 62 may be provided on the back surface of the upper fixed plate 14.

[Embodiment 4]
FIG. 5 shows a fourth embodiment of the present invention.

  The fourth embodiment differs from the first embodiment in that a floating plate is provided on the socket body 11 and a surface antistatic layer is provided on the floating plate. Note that, in FIG. 5, components denoted by the same reference numerals as those in FIGS. 1 to 4 indicate the same components as those in these drawings.

  In the fourth embodiment, the upper fixing plate 70 is formed of an insulating member. The material for forming the insulating member may be the same as, for example, the insulating member 16 of the upper fixed plate 14 according to the first embodiment.

  The floating plate 80 is disposed on the upper fixed plate 70 and includes a plate-shaped insulating member 81 and a surface antistatic layer 82.

  The insulating member 81 is formed of, for example, a glass epoxy resin or the like, like the insulating member 16 in the first embodiment.

  The surface antistatic layer 82 can be produced by filling a glass epoxy resin with a conductive filler such as carbon or metal, similarly to the surface antistatic layer 17 in the first embodiment. Further, as the material for forming the surface antistatic layer 82, similarly to the surface antistatic layer 17, a material having insulation properties, strength, and the like may be used as long as the antistatic performance is not impaired.

  In the floating plate 80 of the fourth embodiment, for example, after forming an insulating member 81 by laminating a layer of glass epoxy resin, the last layer (layer exposed on the surface) is filled with a conductive filler. It can be manufactured by forming the surface antistatic layer 82. However, the surface antistatic layer 82 may be formed by coating or plating on the surface of the insulating member 81, and may be attached to the insulating member 81 after forming a plate material for the surface antistatic layer 82. Alternatively, it may be formed by another method.

  The insertion hole 80a of the floating plate 80 is formed by forming (or attaching) a surface antistatic layer 82 on the insulating member 81 and then forming a through hole in the insulating member 51 and the surface antistatic layer 82. And is obtained.

  In the fourth embodiment, similarly to the first embodiment, the terminals of the IC package 30 (the solder balls 33 are used in the fourth embodiment) and the upper contact portion 41b of the first plunger 41 are connected to a floating plate. The hole 80 was formed to have a smaller diameter than the insertion hole 80a (described later). Therefore, when the IC package 30 is accommodated in the IC socket 10 and the floating plate 80 is lowered, the terminals 33 and the upper contact portion 41b do not come into contact with the vicinity of the outer edge of the insertion hole 80a (see FIG. Therefore, the terminal 32 and the upper contact portion 41b are electrically connected to the surface antistatic layer 82, and the adjacent contact pins 40 are not short-circuited.

  When a material having a sufficiently high withstand voltage characteristic is used as a material for forming the surface antistatic layer 82, the upper contact portion 41 b provided on the first plunger 41 of the contact pin 40 is attached to the surface antistatic layer 82. Contact, there is no short circuit between adjacent contact pins 40. However, in order to increase the degree of freedom in selecting a material for forming the surface antistatic layer 82, it is desirable to adopt a structure in which these are not in contact.

  As described above, according to the fourth embodiment, since the surface antistatic layer 82 is provided on the floating plate 80, as in the first embodiment, the surface antistatic layer 82 has the withstand voltage characteristics, strength, and workability. Even if a material having insufficient properties is used, it is possible to obtain a socket body 11 having sufficiently excellent properties. For this reason, the degree of freedom in selecting a material for forming the surface antistatic layer 82 is increased, and it becomes easy to obtain the socket body 11 having various characteristics such as antistatic properties, strength, and workability.

  In addition, by configuring the terminal 32 of the IC package 30 and the upper contact portion 41b of the contact pin 40 so as not to contact the surface antistatic layer 82, the use of the surface antistatic layer having low withstand voltage characteristics is further facilitated, As a result, it is possible to more easily obtain the socket body 11 having excellent antistatic performance and also excellent in withstand voltage characteristics and workability.

  In each of the above embodiments, the outer frame member 12 of the socket body 11 is formed by mixing the antistatic materials used for the antistatic layers 17, 52, 62, 63, and 82 as the forming material. By disposing the outer frame member 12 on the wiring board 20, the static electricity generated on the housing surface 13 a of the socket body 11 passes through the respective antistatic layers 17, 52, 62, 63, 82 from the outer frame member 12 to the wiring board 20. May be allowed to escape to the ground portion.

DESCRIPTION OF SYMBOLS 10 Socket 11 Socket main body 12 Outer frame member 13 Contact module 13a Housing surface 14, 70 Upper fixed plate 14a, 15a, 50a, 60a, 80a Insertion hole 14b Upper insertion hole 14c Lower insertion hole 15, 50, 60 Lower fixed plate 15b Upper insertion hole 15c Lower insertion hole 16, 51, 61, 71, 81 Insulating member 17, 82 Surface antistatic layer 20 Wiring board 21 Electrode 30 Package 31 Package body 32 Terminal 40 Contact pin 41 First plunger 41a Outer cylinder 41b Upper contact portion 41c Projecting portion 42 Second plunger 42a Lower contact portion 52, 63 Back antistatic layer 62 Intermediate surface antistatic layer 80 Floating plate

Claims (3)

Placed on the wiring board,
Having a socket body in which electrical components are housed,
An extendable contact pin is disposed on the socket body,
An electrical component socket for electrically connecting a terminal of the electrical component housed in the socket body to an electrode of the wiring board via the contact pin,
The socket body includes a plate-shaped insulating member, and a surface antistatic layer formed of an antistatic material and provided on a surface of the insulating member,
In each of the insulating member and the surface antistatic layer of the socket body, an insertion hole for disposing the contact pin is formed so as to communicate with substantially the same diameter,
The insertion hole of the socket body is formed with a larger diameter than the terminal of the electric component,
By forming the contact portion of the contact pin, which is in contact with the terminal of the electric component, with a smaller diameter than the insertion hole,
The electric component is housed in the socket body, and in a state where the electric component is in contact with the surface antistatic layer, the terminal of the electric component and the surface antistatic layer are configured not to make electrical contact with each other. ,
The contact portion of the contact pin and the surface antistatic layer were configured not to make electrical contact,
A socket for an electrical component, characterized in that: The electrical component socket according to claim 1 , wherein a back surface antistatic layer made of an antistatic material is provided on a surface of the socket body facing the wiring board . The socket body includes at least an upper plate and a lower plate,
The surface antistatic layer is provided on the surface of the upper plate, and an intermediate surface antistatic layer formed of an antistatic material is provided on at least one of the back surface of the upper plate or the surface of the lower plate,
The electrical component socket according to claim 1 or 2, wherein

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