JP6638297B2 - Polyarylene sulfide resin composition, molded article and manufacturing method - Google Patents
Polyarylene sulfide resin composition, molded article and manufacturing method Download PDFInfo
- Publication number
- JP6638297B2 JP6638297B2 JP2015196819A JP2015196819A JP6638297B2 JP 6638297 B2 JP6638297 B2 JP 6638297B2 JP 2015196819 A JP2015196819 A JP 2015196819A JP 2015196819 A JP2015196819 A JP 2015196819A JP 6638297 B2 JP6638297 B2 JP 6638297B2
- Authority
- JP
- Japan
- Prior art keywords
- polyarylene sulfide
- resin
- sulfide resin
- parts
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 title claims description 88
- 229920000412 polyarylene Polymers 0.000 title claims description 88
- 239000011342 resin composition Substances 0.000 title claims description 45
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229920005989 resin Polymers 0.000 claims description 110
- 239000011347 resin Substances 0.000 claims description 110
- 239000003822 epoxy resin Substances 0.000 claims description 53
- 229920000647 polyepoxide Polymers 0.000 claims description 53
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 32
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 32
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 32
- 238000002844 melting Methods 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 17
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 15
- 229920006125 amorphous polymer Polymers 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 description 25
- 238000000034 method Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- -1 polytetrafluoroethylene Polymers 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 150000001875 compounds Chemical group 0.000 description 12
- 239000000178 monomer Substances 0.000 description 11
- 239000000945 filler Substances 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 150000001491 aromatic compounds Chemical class 0.000 description 9
- 238000004898 kneading Methods 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 230000001771 impaired effect Effects 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 239000011541 reaction mixture Substances 0.000 description 7
- 238000005406 washing Methods 0.000 description 7
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 125000005968 oxazolinyl group Chemical group 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- BQBSIHIZDSHADD-UHFFFAOYSA-N 2-ethenyl-4,5-dihydro-1,3-oxazole Chemical compound C=CC1=NCCO1 BQBSIHIZDSHADD-UHFFFAOYSA-N 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 229910052783 alkali metal Inorganic materials 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 239000004711 α-olefin Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000007810 chemical reaction solvent Substances 0.000 description 3
- 239000011246 composite particle Substances 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 239000000446 fuel Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 229920006310 Asahi-Kasei Polymers 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229920004482 WACKER® Polymers 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000003495 polar organic solvent Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 description 1
- WBODDOZXDKQEFS-UHFFFAOYSA-N 1,2,3,4-tetramethyl-5-phenylbenzene Chemical group CC1=C(C)C(C)=CC(C=2C=CC=CC=2)=C1C WBODDOZXDKQEFS-UHFFFAOYSA-N 0.000 description 1
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000006039 1-hexenyl group Chemical group 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- GSKNLOOGBYYDHV-UHFFFAOYSA-N 2-methylphenol;naphthalen-1-ol Chemical compound CC1=CC=CC=C1O.C1=CC=C2C(O)=CC=CC2=C1 GSKNLOOGBYYDHV-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- NNTRMVRTACZZIO-UHFFFAOYSA-N 3-isocyanatopropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCN=C=O NNTRMVRTACZZIO-UHFFFAOYSA-N 0.000 description 1
- NMUBRRLYMADSGF-UHFFFAOYSA-N 3-triethoxysilylpropan-1-ol Chemical compound CCO[Si](OCC)(OCC)CCCO NMUBRRLYMADSGF-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- YATIYDNBFHEOFA-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-ol Chemical compound CO[Si](OC)(OC)CCCO YATIYDNBFHEOFA-UHFFFAOYSA-N 0.000 description 1
- VZXOZSQDJJNBRC-UHFFFAOYSA-N 4-chlorobenzenethiol Chemical compound SC1=CC=C(Cl)C=C1 VZXOZSQDJJNBRC-UHFFFAOYSA-N 0.000 description 1
- OSSMYOQKNHMTIP-UHFFFAOYSA-N 5-[dimethoxy(methyl)silyl]pentane-1,3-diamine Chemical compound CO[Si](C)(OC)CCC(N)CCN OSSMYOQKNHMTIP-UHFFFAOYSA-N 0.000 description 1
- KHLRJDNGHBXOSV-UHFFFAOYSA-N 5-trimethoxysilylpentane-1,3-diamine Chemical compound CO[Si](OC)(OC)CCC(N)CCN KHLRJDNGHBXOSV-UHFFFAOYSA-N 0.000 description 1
- MYLBTCQBKAKUTJ-UHFFFAOYSA-N 7-methyl-6,8-bis(methylsulfanyl)pyrrolo[1,2-a]pyrazine Chemical compound C1=CN=CC2=C(SC)C(C)=C(SC)N21 MYLBTCQBKAKUTJ-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004739 DIC.PPS Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910052977 alkali metal sulfide Inorganic materials 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 229960000892 attapulgite Drugs 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- PJIFJEUHCQYNHO-UHFFFAOYSA-N diethoxy-(3-isocyanatopropyl)-methylsilane Chemical compound CCO[Si](C)(OCC)CCCN=C=O PJIFJEUHCQYNHO-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- WYZXIJYWXFEAFG-UHFFFAOYSA-N ethyl-(3-isocyanatopropyl)-dimethoxysilane Chemical compound CC[Si](OC)(OC)CCCN=C=O WYZXIJYWXFEAFG-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010705 motor oil Substances 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- VSWALKINGSNVAR-UHFFFAOYSA-N naphthalen-1-ol;phenol Chemical compound OC1=CC=CC=C1.C1=CC=C2C(O)=CC=CC2=C1 VSWALKINGSNVAR-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910052625 palygorskite Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920006027 ternary co-polymer Polymers 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- DDBUVUBWJVIGFH-UHFFFAOYSA-N trichloro(3-isocyanatopropyl)silane Chemical compound Cl[Si](Cl)(Cl)CCCN=C=O DDBUVUBWJVIGFH-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical group C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、ポリアリーレンスルフィド樹脂組成物、成形品およびそれらの製造方法に関する。 The present invention relates to a polyarylene sulfide resin composition, a molded article, and a method for producing the same.
ポリフェニレンスルフィド（以下ＰＰＳと略すことがある）樹脂に代表されるポリアリーレンスルフィド（以下ＰＡＳと略すことがある）樹脂は、耐熱性に優れつつ、かつ、機械的強度、耐薬品性、成形加工性、寸法安定性にも優れ、これら特性を利用して、電気・電子機器部品、自動車部品材料等として使用されている。 Polyarylene sulfide (hereinafter sometimes abbreviated as PAS) resin represented by polyphenylene sulfide (hereinafter sometimes abbreviated as PPS) resin is excellent in heat resistance, and has mechanical strength, chemical resistance, and moldability. It has excellent dimensional stability, and is used as a material for electric / electronic devices, automobile parts, etc. by utilizing these characteristics.
これらの優れた特徴を活かして、他の熱可塑性樹脂や硬化性樹脂との組成物を、電気・電子部品などとして用いる検討が種々なされている。例えば、ＰＡＳ樹脂組成物でケーシングなどの成形品を射出成形し、その後、エポキシ樹脂やシリコーン樹脂などの硬化性樹脂で封入して得られる電気・電子部品への適用に際して、ＰＡＳ樹脂製ケーシング中に導電体を装着し、エポキシ樹脂やシリコーン樹脂などの硬化性樹脂を流し込み、その後加熱等により該樹脂を硬化させて電気・電子部品とする例が知られている。 Taking advantage of these excellent features, various studies have been made on using a composition with another thermoplastic resin or a curable resin as an electric / electronic component. For example, when a molded article such as a casing is injection-molded with a PAS resin composition, and then applied to an electric or electronic component obtained by encapsulating with a curable resin such as an epoxy resin or a silicone resin, the PAS resin casing is used. There is known an example in which a conductor is mounted, a curable resin such as an epoxy resin or a silicone resin is poured, and the resin is cured by heating or the like to obtain an electric / electronic component.
しかしながら、ポリアリーレンスルフィド樹脂は他の樹脂エンジニアリングプラスチックに比べ、エポキシ樹脂やシリコーン樹脂などの硬化性樹脂との接着性が十分でないため、ＰＡＳ樹脂の欠点を改善するために異種樹脂と混合またはアロイ化する検討がなされている。 However, polyarylene sulfide resin does not have sufficient adhesion to curable resins such as epoxy resin and silicone resin compared to other resin engineering plastics, so it is mixed or alloyed with dissimilar resins to improve the drawbacks of PAS resin. Considerations have been made.
そのなかで、耐熱性が高いポリアリーレンスルフィド樹脂とポリテトラフルオロエチレン樹脂（以下ＰＴＦＥと略す。）を配合する検討がなされている。例えば、特許文献１では、ポリアリーレンスルフィド樹脂にＰＴＦＥと補強材を配合したポリアリーレンスルフィド樹脂組成物が開示されている。該ポリアリーレンスルフィド樹脂組成物およびその成形品は、機械的特性、電気絶縁性および流動性に優れ、さらにエポキシ樹脂との接着性に優れることが記載されている。しかし、当該成形品をシリコーン樹脂で封止すると、シリコーン樹脂の結晶化が過度に進み過ぎ、成形品との界面でシリコーン樹脂が白化する結果、シリコーン樹脂接着強度が低下してしまい、シリコーン樹脂接着性が必ずしも充分なものとは言えなかった。 Among them, studies have been made on compounding a polyarylene sulfide resin having high heat resistance and a polytetrafluoroethylene resin (hereinafter abbreviated as PTFE). For example, Patent Document 1 discloses a polyarylene sulfide resin composition in which PTFE and a reinforcing material are blended in a polyarylene sulfide resin. It is described that the polyarylene sulfide resin composition and a molded article thereof are excellent in mechanical properties, electric insulation and fluidity, and further excellent in adhesion to an epoxy resin. However, when the molded article is sealed with the silicone resin, the crystallization of the silicone resin proceeds excessively, and the silicone resin is whitened at the interface with the molded article. Sex was not always enough.
また、近年、電気・電子装置の高出力・高電圧化がすすんだ結果、高電圧下での使用時、コロナ放電などの部分放電の発生により経時的に劣化し、最終的には絶縁破壊に至るケースが増加しており、耐コロナ性に優れた絶縁部材が望まれていた。しかしながら、前記特許文献１に記載のＰＡＳ樹脂組成物からなる成形品は耐コロナ性が不十分で、改良の余地があった。 In recent years, as the output and voltage of electric and electronic devices have increased, they have deteriorated over time due to the occurrence of partial discharges such as corona discharge when used under high voltage, and eventually caused dielectric breakdown. In many cases, an insulating member having excellent corona resistance has been desired. However, the molded article made of the PAS resin composition described in Patent Document 1 has insufficient corona resistance and has room for improvement.
そこで、本発明が解決しようとする課題は、ポリアリーレンスルフィド樹脂が本来有する機械的特性や耐熱性等の諸特性を維持しつつ、かつ、シリコーン樹脂などの硬化性樹脂との接着性および耐コロナ性に優れた、ポリアリーレンスルフィド樹脂組成物およびその成形品を提供すること、さらに該成形品と、シリコーン樹脂などの硬化性樹脂とが接着して得られる複合成形品を提供することにある。 Accordingly, the problem to be solved by the present invention is to maintain the properties inherent in the polyarylene sulfide resin, such as mechanical properties and heat resistance, as well as the adhesiveness to a curable resin such as a silicone resin and the corona resistance. An object of the present invention is to provide a polyarylene sulfide resin composition having excellent properties and a molded article thereof, and to provide a composite molded article obtained by bonding the molded article to a curable resin such as a silicone resin.
本発明者らは上記課題を解決するために鋭意研究した結果、ポリアリーレンスルフィド樹脂（Ａ）、ジメチルポリシロキサン（Ｂ）、エポキシ樹脂（Ｃ）およびオキサゾリン基含有非晶性ポリマー（Ｄ）を含むポリアリーレンスルフィド樹脂組成物およびその成形品が、エポキシ樹脂やシリコーン樹脂等の硬化性樹脂との接着性に優れつつ、かつ耐コロナ性にも優れることを見出し、本発明を完成するに至った。 The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, the polyarylene sulfide resin (A), the dimethylpolysiloxane (B), the epoxy resin (C), and the oxazoline group-containing amorphous polymer (D) The present inventors have found that a polyarylene sulfide resin composition and a molded product thereof have excellent adhesiveness to a curable resin such as an epoxy resin or a silicone resin and also have excellent corona resistance, and have completed the present invention.
すなわち、本発明は、ポリアリーレンスルフィド樹脂（Ａ）、ジメチルポリシロキサン（Ｂ）、エポキシ樹脂（Ｃ）およびオキサゾリン基含有非晶性ポリマー（Ｄ）を必須成分として配合してなるポリアリーレンスルフィド樹脂組成物、に関する。 That is, the present invention provides a polyarylene sulfide resin composition comprising, as essential components, a polyarylene sulfide resin (A), dimethylpolysiloxane (B), an epoxy resin (C), and an oxazoline group-containing amorphous polymer (D). About things.
さらに本発明は、前記記載のポリアリーレンスルフィド樹脂組成物を成形してなる成形品、に関する。 Furthermore, the present invention relates to a molded article obtained by molding the above-mentioned polyarylene sulfide resin composition.
さらに本発明は前記記載の成形品と、硬化性樹脂からなる硬化物とが接着してなる複合成形品、に関する。 Furthermore, the present invention relates to a composite molded article obtained by bonding the above-mentioned molded article and a cured product made of a curable resin.
さらに本発明はポリアリーレンスルフィド樹脂（Ａ）、ジメチルポリシロキサン（Ｂ）、エポキシ樹脂（Ｃ）およびオキサゾリン基含有非晶性ポリマー（Ｄ）を必須成分として、ポリアリーレンスルフィド樹脂（Ａ）の融点以上で溶融混練することを特徴とするポリアリーレンスルフィド樹脂組成物の製造方法、に関する。 Further, the present invention comprises a polyarylene sulfide resin (A), a dimethylpolysiloxane (B), an epoxy resin (C) and an oxazoline group-containing amorphous polymer (D) as essential components, and the melting point of the polyarylene sulfide resin (A) or more. And a method for producing a polyarylene sulfide resin composition, wherein
さらに本発明は前記記載の製造方法でポリアリーレンスルフィド樹脂組成物を製造する工程、得られた組成物を成形する工程を有する成形品の製造方法、に関する。 Further, the present invention relates to a process for producing a polyarylene sulfide resin composition by the production method described above, and a method for producing a molded article having a step of molding the obtained composition.
本発明により、ポリアリーレンスルフィド樹脂が本来有する機械的特性や耐熱性等の諸特性を維持しつつ、かつ、シリコーン樹脂などの硬化性樹脂との接着性および耐コロナ性に優れた、ポリアリーレンスルフィド樹脂組成物およびその成形品を提供すること、さらに該成形品と、シリコーン樹脂などの硬化性樹脂とが接着して得られる複合成形品を提供することができる。 According to the present invention, a polyarylene sulfide excellent in adhesiveness to a curable resin such as a silicone resin and corona resistance while maintaining various properties such as mechanical properties and heat resistance inherent in the polyarylene sulfide resin. It is possible to provide a resin composition and a molded article thereof, and further provide a composite molded article obtained by bonding the molded article to a curable resin such as a silicone resin.
本発明のポリアリーレンスルフィド樹脂組成物は、ポリアリーレンスルフィド樹脂（Ａ）、ジメチルポリシロキサン（Ｂ）、エポキシ樹脂（Ｃ）およびオキサゾリン基含有非晶性ポリマー（Ｄ）を必須成分として配合してなることを特徴とする。以下、詳述する。 The polyarylene sulfide resin composition of the present invention comprises a polyarylene sulfide resin (A), dimethylpolysiloxane (B), an epoxy resin (C) and an oxazoline group-containing amorphous polymer (D) as essential components. It is characterized by the following. The details will be described below.
本発明のポリアリーレンスルフィド樹脂組成物は、ポリアリーレンスルフィド樹脂（Ａ）を必須成分として配合してなる。本発明で用いるポリアリーレンスルフィド樹脂は、芳香族環と硫黄原子とが結合した構造を繰り返し単位とする樹脂構造を有するものであり、具体的には、下記式（１） The polyarylene sulfide resin composition of the present invention comprises a polyarylene sulfide resin (A) as an essential component. The polyarylene sulfide resin used in the present invention has a resin structure having a structure in which an aromatic ring and a sulfur atom are bonded as a repeating unit, and specifically has the following formula (1)
ここで、前記式（１）で表される構造部位は、特に該式中のＲ１及びＲ２は、前記ポリアリーレンスルフィド樹脂（Ａ）の機械的強度の点から水素原子であることが好ましく、その場合、下記式（３）で表されるパラ位で結合するもの、及び下記式（４）で表されるメタ位で結合するものが挙げられる。 Here, in the structural site represented by the formula (1), particularly, R 1 and R 2 in the formula are preferably hydrogen atoms from the viewpoint of the mechanical strength of the polyarylene sulfide resin (A). In this case, there are a compound bonded at the para position represented by the following formula (3) and a compound bonded at the meta position represented by the following formula (4).
また、前記ポリアリーレンスルフィド樹脂は、前記式（１）や式（２）で表される構造部位のみならず、下記の構造式（５）〜（８） Further, the polyarylene sulfide resin includes not only the structural parts represented by the formulas (1) and (2) but also the following structural formulas (5) to (8).
また、前記ポリアリーレンスルフィド樹脂は、その分子構造中に、ナフチルスルフィド結合などを有していてもよいが、他の構造部位との合計モル数に対して、３モル％以下が好ましく、特に１モル％以下であることが好ましい。 Further, the polyarylene sulfide resin may have a naphthyl sulfide bond or the like in its molecular structure, but is preferably 3 mol% or less, and particularly preferably 1 mol%, based on the total number of moles with other structural parts. It is preferably at most mol%.
また、ポリアリーレンスルフィド樹脂の物性は、本発明の効果を損ねない限り特に限定されないが、以下の通りである。 The physical properties of the polyarylene sulfide resin are not particularly limited as long as the effects of the present invention are not impaired, but are as follows.
（溶融粘度）
本発明に用いるポリアリーレンスルフィド樹脂は、３００℃で測定した溶融粘度（Ｖ６）が２〜１０００〔Ｐａ・ｓ〕の範囲であることが好ましく、さらに流動性および機械的強度のバランスが良好となることから２〜５００〔Ｐａ・ｓ〕の範囲がより好ましく、特に２〜２００〔Ｐａ・ｓ〕の範囲であることが特に好ましい。但し、本発明において、溶融粘度（Ｖ６）は、ポリアリーレンスルフィド樹脂を島津製作所製フローテスター、ＣＦＴ−５００Ｃを用い、３００℃、荷重：１．９６×１０６Ｐａ、Ｌ／Ｄ＝１０／１にて、６分間保持した後に溶融粘度を測定した値とする。
(Melt viscosity)
The polyarylene sulfide resin used in the present invention preferably has a melt viscosity (V6) measured at 300 ° C. in the range of 2 to 1000 [Pa · s], and a good balance between fluidity and mechanical strength. For this reason, the range of 2 to 500 [Pa · s] is more preferable, and the range of 2 to 200 [Pa · s] is particularly preferable. However, in the present invention, the melt viscosity (V6) is determined by measuring the polyarylene sulfide resin using a flow tester manufactured by Shimadzu Corporation, CFT-500C, at 300 ° C., load: 1.96 × 10 6 Pa, L / D = 10/1. , And the melt viscosity is measured after holding for 6 minutes.
（非ニュートン指数）
本発明に用いるポリアリーレンスルフィド樹脂の非ニュートン指数は、本発明の効果を損ねない限り特に限定されないが、０．９０〜２．００の範囲であることが好ましい。リニア型ポリアリーレンスルフィド樹脂を用いる場合には、非ニュートン指数が０．９０〜１．５０の範囲であることが好ましく、さらに０．９５〜１．２０の範囲であることがより好ましい。このようなポリアリーレンスルフィド樹脂は機械的物性、流動性、耐磨耗性に優れる。ただし、非ニュートン指数（Ｎ値）は、キャピログラフを用いて３００℃、オリフィス長（Ｌ）とオリフィス径（Ｄ）の比、Ｌ／Ｄ＝４０の条件下で、剪断速度及び剪断応力を測定し、下記式を用いて算出した値である。
(Non-Newton index)
The non-Newton index of the polyarylene sulfide resin used in the present invention is not particularly limited as long as the effects of the present invention are not impaired, but is preferably in the range of 0.90 to 2.00. When a linear polyarylene sulfide resin is used, the non-Newton index is preferably in the range of 0.90 to 1.50, and more preferably in the range of 0.95 to 1.20. Such a polyarylene sulfide resin has excellent mechanical properties, fluidity and abrasion resistance. However, the non-Newton index (N value) is obtained by measuring the shear rate and the shear stress under the conditions of 300 ° C., the ratio of the orifice length (L) to the orifice diameter (D), and L / D = 40, using a capillograph. , Calculated using the following equation.
（製造方法）
前記ポリアリーレンスルフィド樹脂（Ａ）の製造方法としては、特に限定されないが、例えば１）硫黄と炭酸ソーダの存在下でジハロゲノ芳香族化合物を、必要ならばポリハロゲノ芳香族化合物ないしその他の共重合成分を加えて、重合させる方法、２）極性溶媒中でスルフィド化剤等の存在下にジハロゲノ芳香族化合物を、必要ならばポリハロゲノ芳香族化合物ないしその他の共重合成分を加えて、重合させる方法、３）ｐ−クロルチオフェノールを、必要ならばその他の共重合成分を加えて、自己縮合させる方法、等が挙げられる。これらの方法のなかでも、２）の方法が汎用的であり好ましい。反応の際に、重合度を調節するためにカルボン酸やスルホン酸のアルカリ金属塩を添加したり、水酸化アルカリを添加しても良い。上記２）方法のなかでも、加熱した有機極性溶媒とジハロゲノ芳香族化合物とを含む混合物に含水スルフィド化剤を水が反応混合物から除去され得る速度で導入し、有機極性溶媒中でジハロゲノ芳香族化合物とスルフィド化剤とを、必要に応じてポリハロゲノ芳香族化合物と加え、反応させること、及び反応系内の水分量を該有機極性溶媒１モルに対して０．０２〜０．５モルの範囲にコントロールすることによりポリアリーレンスルフィド樹脂を製造する方法（特開平０７−２２８６９９号公報参照。）や、固形のアルカリ金属硫化物及び非プロトン性極性有機溶媒の存在下でジハロゲノ芳香族化合物と必要ならばポリハロゲノ芳香族化合物ないしその他の共重合成分を加え、アルカリ金属水硫化物及び有機酸アルカリ金属塩を、硫黄源１モルに対して０．０１〜０．９モルの範囲の有機酸アルカリ金属塩および反応系内の水分量を非プロトン性極性有機溶媒１モルに対して０．０２モル以下の範囲にコントロールしながら反応させる方法（ＷＯ２０１０／０５８７１３号パンフレット参照。）で得られるものが特に好ましい。ジハロゲノ芳香族化合物の具体的な例としては、ｐ−ジハロベンゼン、ｍ−ジハロベンゼン、ｏ−ジハロベンゼン、２，５−ジハロトルエン、１，４−ジハロナフタレン、１−メトキシ−２，５−ジハロベンゼン、４，４’−ジハロビフェニル、３，５−ジハロ安息香酸、２，４−ジハロ安息香酸、２，５−ジハロニトロベンゼン、２，４−ジハロニトロベンゼン、２，４−ジハロアニソール、ｐ，ｐ’−ジハロジフェニルエーテル、４，４’−ジハロベンゾフェノン、４，４’−ジハロジフェニルスルホン、４，４’−ジハロジフェニルスルホキシド、４，４’−ジハロジフェニルスルフィド、及び、上記各化合物の芳香環に炭素原子数１〜１８の範囲のアルキル基を有する化合物が挙げられ、ポリハロゲノ芳香族化合物としては１，２，３−トリハロベンゼン、１，２，４−トリハロベンゼン、１，３，５−トリハロベンゼン、１，２，３，５−テトラハロベンゼン、１，２，４，５−テトラハロベンゼン、１，４，６−トリハロナフタレンなどが挙げられる。また、上記各化合物中に含まれるハロゲン原子は、塩素原子、臭素原子であることが望ましい。
(Production method)
The method for producing the polyarylene sulfide resin (A) is not particularly limited. For example, 1) a dihalogeno aromatic compound in the presence of sulfur and sodium carbonate, and if necessary, a polyhalogeno aromatic compound or other copolymer component, In addition, a method of polymerizing, 2) a method of adding a dihalogeno aromatic compound in a polar solvent in the presence of a sulfidizing agent or the like and, if necessary, adding a polyhalogeno aromatic compound or other copolymerization components, and polymerizing 3). A method in which p-chlorothiophenol is self-condensed by adding other copolymerization components, if necessary, and the like. Among these methods, the method 2) is versatile and preferable. At the time of the reaction, an alkali metal salt of carboxylic acid or sulfonic acid or alkali hydroxide may be added to adjust the degree of polymerization. In the above 2) method, a water-containing sulfidizing agent is introduced into a mixture containing a heated organic polar solvent and a dihalogeno-aromatic compound at a rate at which water can be removed from the reaction mixture, and the dihalogeno-aromatic compound is introduced in the organic polar solvent. And a sulfidizing agent, if necessary, by adding a polyhalogeno aromatic compound, and reacting, and adjusting the water content in the reaction system to a range of 0.02 to 0.5 mol per 1 mol of the organic polar solvent. A method for producing a polyarylene sulfide resin by controlling (refer to Japanese Patent Application Laid-Open No. 07-228699), and a method for preparing a dihalogeno aromatic compound in the presence of a solid alkali metal sulfide and an aprotic polar organic solvent, if necessary. A polyhalogeno aromatic compound or other copolymer component is added, and an alkali metal hydrosulfide and an organic acid alkali metal salt are added to a sulfur source 1 While controlling the amount of the organic acid alkali metal salt in the range of 0.01 to 0.9 mol per mol and the amount of water in the reaction system to the range of 0.02 mol or less per mol of the aprotic polar organic solvent. Those obtained by a reaction method (see WO 2010/058713) are particularly preferable. Specific examples of the dihalogeno aromatic compound include p-dihalobenzene, m-dihalobenzene, o-dihalobenzene, 2,5-dihalotoluene, 1,4-dihalonaphthalene, 1-methoxy-2,5-dihalobenzene, 4'-dihalobiphenyl, 3,5-dihalobenzoic acid, 2,4-dihalobenzoic acid, 2,5-dihalonitrobenzene, 2,4-dihalonitrobenzene, 2,4-dihaloanisole, p, p '-Dihalodiphenyl ether, 4,4'-dihalobenzophenone, 4,4'-dihalodiphenylsulfone, 4,4'-dihalodiphenylsulfoxide, 4,4'-dihalodiphenylsulfide, and the above compounds And a compound having an alkyl group having 1 to 18 carbon atoms in the aromatic ring. Examples of the polyhalogeno aromatic compound include 1,2,3-tri Lobenzene, 1,2,4-trihalobenzene, 1,3,5-trihalobenzene, 1,2,3,5-tetrahalobenzene, 1,2,4,5-tetrahalobenzene, 1,4,6- And trihalonaphthalene. The halogen atom contained in each of the above compounds is preferably a chlorine atom or a bromine atom.
重合工程により得られたポリアリーレンスルフィド樹脂を含む反応混合物の後処理方法としては、特に制限されるものではないが、例えば、（１）重合反応終了後、先ず反応混合物をそのまま、あるいは酸または塩基を加えた後、減圧下または常圧下で溶媒を留去し、次いで溶媒留去後の固形物を水、反応溶媒（又は低分子ポリマーに対して同等の溶解度を有する有機溶媒）、アセトン、メチルエチルケトン、アルコール類などの溶媒で１回または２回以上洗浄し、更に中和、水洗、濾過および乾燥する方法、或いは、（２）重合反応終了後、反応混合物に水、アセトン、メチルエチルケトン、アルコール類、エーテル類、ハロゲン化炭化水素、芳香族炭化水素、脂肪族炭化水素などの溶媒（使用した重合溶媒に可溶であり、かつ少なくともポリアリーレンスルフィドに対しては貧溶媒である溶媒）を沈降剤として添加して、ポリアリーレンスルフィドや無機塩等の固体状生成物を沈降させ、これらを濾別、洗浄、乾燥する方法、或いは、（３）重合反応終了後、反応混合物に反応溶媒（又は低分子ポリマーに対して同等の溶解度を有する有機溶媒）を加えて撹拌した後、濾過して低分子量重合体を除いた後、水、アセトン、メチルエチルケトン、アルコール類などの溶媒で１回または２回以上洗浄し、その後中和、水洗、濾過および乾燥をする方法、（４）重合反応終了後、反応混合物に水を加えて水洗浄、濾過、必要に応じて水洗浄の時に酸を加えて酸処理し、乾燥をする方法、（５）重合反応終了後、反応混合物を濾過し、必要に応じ、反応溶媒で１回または２回以上洗浄し、更に水洗浄、濾過および乾燥する方法、等が挙げられる。 The post-treatment method of the reaction mixture containing the polyarylene sulfide resin obtained in the polymerization step is not particularly limited, but, for example, (1) After the completion of the polymerization reaction, first, the reaction mixture may be used as it is or as an acid or base. , And then distill off the solvent under reduced pressure or normal pressure. Then, the solid after distilling off the solvent is washed with water, a reaction solvent (or an organic solvent having an equivalent solubility to a low molecular weight polymer), acetone, methyl ethyl ketone. Washing with a solvent such as alcohol once or twice or more, and further neutralizing, washing with water, filtering and drying, or (2) after the polymerization reaction, adding water, acetone, methyl ethyl ketone, alcohols to the reaction mixture. Solvents such as ethers, halogenated hydrocarbons, aromatic hydrocarbons, and aliphatic hydrocarbons (soluble in the polymerization solvent used, and at least A solvent which is a poor solvent for realylene sulfide) is added as a precipitant to precipitate solid products such as polyarylene sulfide and inorganic salts, and these are separated by filtration, washed and dried, or (3) After the completion of the polymerization reaction, a reaction solvent (or an organic solvent having the same solubility with respect to the low molecular weight polymer) is added to the reaction mixture, and the mixture is stirred, and then filtered to remove the low molecular weight polymer. A method of washing once or twice or more with a solvent such as acetone, methyl ethyl ketone or alcohol, followed by neutralization, washing with water, filtration and drying. (4) After the polymerization reaction is completed, water is added to the reaction mixture to wash with water. A method of adding an acid during filtration and, if necessary, washing with water, treating with an acid, followed by drying. (5) After the completion of the polymerization reaction, the reaction mixture is filtered and, if necessary, once or twice or more with a reaction solvent. Wash Further washing with water, a method of filtering and drying, and the like.
尚、上記（１）〜（５）に例示したような後処理方法において、ポリアリーレンスルフィド樹脂の乾燥は真空中で行なってもよいし、空気中あるいは窒素のような不活性ガス雰囲気中で行なってもよい。 In the post-treatment methods exemplified in the above (1) to (5), the drying of the polyarylene sulfide resin may be performed in a vacuum, or may be performed in air or in an inert gas atmosphere such as nitrogen. You may.
本発明のポリアリーレンスルフィド樹脂組成物は、ジメチルポリシロキサン（Ｂ）を必須成分として配合してなる。本発明で用いるジメチルポリシロキサンは、ジメチルシロキサン結合（−Ｓｉ（ＣＨ３）２−Ｏ−）を主鎖とする重合体であり、前記Ｓｉ原子は、メチル基以外に有機基を有していてもよい。このような、有機基としては、ビニル基、アリル基、１−ブテニル基、１−ヘキセニル基などの炭素原子数２〜８の範囲のアルケニル基を例示することができ、好ましくはビニル基、アリル基であり、特に好ましくはビニル基である。かかるアルケニル基は、分子鎖の末端のＳｉ原子に結合していてもよいし、分子鎖の途中のＳｉ原子に結合していてもよい。硬化反応速度の面からは、アルケニル基が分子鎖末端のケイ素原子のみに結合したアルケニル基含有ポリオルガノシロキサンであることが好ましい。前記ジメチルポリシロキサンは、直鎖状のジメチルポリシロキサンであることが好ましい。 The polyarylene sulfide resin composition of the present invention contains dimethylpolysiloxane (B) as an essential component. The dimethylpolysiloxane used in the present invention is a polymer having a dimethylsiloxane bond (—Si (CH 3 ) 2 —O—) as a main chain, and the Si atom has an organic group other than a methyl group. Is also good. Examples of such an organic group include an alkenyl group having 2 to 8 carbon atoms such as a vinyl group, an allyl group, a 1-butenyl group, and a 1-hexenyl group. And particularly preferably a vinyl group. Such an alkenyl group may be bonded to a terminal Si atom in the molecular chain, or may be bonded to a Si atom in the middle of the molecular chain. From the viewpoint of the curing reaction rate, an alkenyl group-containing polyorganosiloxane in which an alkenyl group is bonded only to a silicon atom at a molecular chain terminal is preferable. The dimethylpolysiloxane is preferably a linear dimethylpolysiloxane.
また、前記ジメチルポリシロキサン（Ｂ）は、熱可塑性を有し、常温（１５℃〜３５℃の範囲）で固形ゴム状あるいは固形粉末状であるシリコーンゴムであることが好ましい。
前記（Ｂ）成分を配合すると、成形品の離形性が著しく向上し、その結果、高い表面平滑性、優れたエポキシ樹脂接着性やシリコーン樹脂接着性を兼ね備えることができる点で有利である。
The dimethylpolysiloxane (B) is preferably a silicone rubber having thermoplasticity and being in the form of a solid rubber or a solid powder at room temperature (range of 15 ° C. to 35 ° C.).
When the component (B) is blended, the releasability of a molded article is remarkably improved, and as a result, it is advantageous in that it can have both high surface smoothness, excellent epoxy resin adhesiveness and silicone resin adhesiveness.
前記ジメチルポリシロキサンはシリコーンゴム粒子であってもよく、その場合には平均粒径としては、特に制限はなく、目的に応じて適宜選択することができるが、体積平均粒径が、０．０１μｍ〜３０μｍの範囲が好ましく、０．１μｍ〜１５μｍの範囲がより好ましい。前記体積平均粒径が、０．０１μｍ以上であると、前記ポリアリーレンスルフィド樹脂（Ａ）や前記脂肪酸エステル（Ｃ）や前記シランカップリング剤（Ｄ）の分散性が向上して表面平滑性が良くなることがあり、３０μｍ以下だと、耐衝撃性が向上する傾向にあり好ましく、１５μｍ以下だと更に好ましい。なお、前記体積平均粒径は、例えば、レーザー回折法により測定することができる。 The dimethylpolysiloxane may be silicone rubber particles. In that case, the average particle size is not particularly limited and can be appropriately selected depending on the purpose. The range is preferably from 30 to 30 μm, more preferably from 0.1 to 15 μm. When the volume average particle size is 0.01 μm or more, dispersibility of the polyarylene sulfide resin (A), the fatty acid ester (C), and the silane coupling agent (D) is improved, and surface smoothness is improved. When the thickness is 30 μm or less, the impact resistance tends to be improved, and is preferably 15 μm or less. The volume average particle size can be measured by, for example, a laser diffraction method.
前記ジメチルポリシロキサン（Ｂ）成分の真比重としては、特に制限はなく、目的に応じて適宜選択することができるが、０．９０〜１．５の範囲が好ましく、０．９５〜１．４の範囲がより好ましい。 The true specific gravity of the dimethylpolysiloxane (B) component is not particularly limited and may be appropriately selected depending on the intended purpose. However, the true specific gravity is preferably in the range of 0.90 to 1.5, and more preferably 0.95 to 1.4. Is more preferable.
前記ジメチルポリシロキサン（Ｂ）成分のシロキサン結合の数としては、特に制限はなく、目的に応じて適宜選択することができるが、１００〜１５，０００の範囲が好ましく、さらに１，５００〜１２，０００の範囲がより好ましく、さらに２，０００〜１０，０００の範囲が特に好ましく、さらに４，０００〜８，０００の範囲が最も好ましい。かかる範囲で樹脂組成物が良好な耐コロナ性および成形性、特に離形性を有しつつ、かつ、成形品がエポキシ樹脂やシリコーン樹脂などの硬化性樹脂と優れた接着性を呈するため好ましい。 The number of siloxane bonds in the dimethylpolysiloxane (B) component is not particularly limited and may be appropriately selected depending on the intended purpose. The number is preferably in the range of 100 to 15,000, and more preferably in the range of 1,500 to 12, 000 is more preferable, 2,000 to 10,000 is particularly preferable, and 4,000 to 8,000 is most preferable. Within this range, the resin composition has good corona resistance and moldability, particularly mold release properties, and the molded article exhibits excellent adhesion to a curable resin such as an epoxy resin or a silicone resin.
前記ジメチルポリシロキサン（Ｂ）成分は、シリカに含浸させたもの（以下、「シリカ含浸（Ｂ）」と称することがある）であってもよく、該ジメチルポリシロキサン（Ｂ）の周囲が３次元架橋構造を有するシリコーン樹脂粉末で被覆されたもの（以下、「シリコーン複合粒子」と称することがある）であってもよい。
ただし、前記ジメチルポリシロキサン（Ｂ）成分が前記シリカ含浸（Ｂ）成分である場合、該シリカ含浸（Ｂ）成分中のジメチルポリシロキサン（Ｂ）成分の含有量は、本発明の効果を損ねなければ特に限定されるものではないが、５０％質量以上９５質量％以下であることが好ましく、さらに６５％質量以上７５質量％以下であることがより好ましい。前記シリコーンゴム粒子（Ｂ）成分の含有量が６５質量％以上７５質量％以下であると、耐衝撃性が向上することや、平滑性が良くなる傾向となり好ましい。
また、前記ジメチルポリシロキサン（Ｂ）が前記シリコーン複合粒子である場合、該ジメチルポリシロキサン（Ｂ）成分に対する該被覆成分（３次元架橋構造を有するシリコーン樹脂粉末）の被覆率が５０％以下であることが好ましい。前記被覆率が５０％以下であると、耐衝撃性が向上することや、平滑性が良くなる傾向にあり好ましい。
The dimethylpolysiloxane (B) component may be one impregnated with silica (hereinafter sometimes referred to as “silica impregnation (B)”), and the periphery of the dimethylpolysiloxane (B) is three-dimensional. It may be coated with a silicone resin powder having a crosslinked structure (hereinafter, may be referred to as “silicone composite particles”).
However, when the dimethylpolysiloxane (B) component is the silica-impregnated (B) component, the content of the dimethylpolysiloxane (B) component in the silica-impregnated (B) component must impair the effects of the present invention. Although not particularly limited, it is preferably 50% by mass or more and 95% by mass or less, and more preferably 65% by mass or more and 75% by mass or less. When the content of the silicone rubber particle (B) component is 65% by mass or more and 75% by mass or less, impact resistance is improved and smoothness is likely to be improved, which is preferable.
When the dimethylpolysiloxane (B) is the silicone composite particles, the coverage of the coating component (silicone resin powder having a three-dimensional crosslinked structure) on the dimethylpolysiloxane (B) component is 50% or less. Is preferred. When the coverage is 50% or less, the impact resistance is improved and the smoothness tends to be improved, which is preferable.
前記ジメチルポリシロキサン（Ｂ）成分は、市販品を用いてもよく、適宜合成したものを用いてもよい。 As the dimethylpolysiloxane (B) component, a commercially available product may be used, or a suitably synthesized product may be used.
前記ジメチルポリシロキサン（Ｂ）成分の市販品の具体例としては、商品名で、ＫＭＰ−５９７、ＫＭＰ−５９８、ＫＭＰ−５９４、Ｘ−５２−８７５（以上、信越化学工業株式会社製）等のシリコーンゴム粒子；ＫＭＰ−６０５、Ｘ−５２−７０３０（以上、信越化学工業株式会社製）等のシリコーン複合粒子；ＧＥＮＩＯＰＬＡＳＴ（登録商標） Ｐｅｌｌｅｔ Ｓ（旭化成ワッカーシリコーン株式会社製）等のシリカ含浸（Ｂ）成分などが挙げられる。 Specific examples of commercial products of the dimethylpolysiloxane (B) component include KMP-597, KMP-598, KMP-594, X-52-875 (all manufactured by Shin-Etsu Chemical Co., Ltd.) under trade names. Silicone rubber particles; silicone composite particles such as KMP-605, X-52-7030 (all manufactured by Shin-Etsu Chemical Co., Ltd.); silica impregnation (B) such as GENIOPLAST (registered trademark) Pellet S (made by Asahi Kasei Wacker Silicone Co., Ltd.) ) Components and the like.
本発明のポリアリーレンスルフィド樹脂組成物においてジメチルポリシロキサン（Ｂ）の配合量は、本発明の効果を損ねなければ特に限定されないが、好ましくはポリアリーレンスルフィド樹脂（Ａ）１００質量部に対して１〜２００質量部の範囲が好ましく、さらに５〜１００質量部の範囲がより好ましい。１質量部以上であれば、耐コロナ性および成形性、特に離形性に優れることとなり、一方、２００質量部以下であれば、機械的特性や、耐熱性や、硬化性樹脂との接着性も優れる傾向となり好ましい。 The amount of dimethylpolysiloxane (B) in the polyarylene sulfide resin composition of the present invention is not particularly limited as long as the effects of the present invention are not impaired, but is preferably 1 to 100 parts by mass of the polyarylene sulfide resin (A). The range is preferably from 200 to 200 parts by mass, more preferably from 5 to 100 parts by mass. When the amount is 1 part by mass or more, corona resistance and moldability, particularly, releasability are excellent. On the other hand, when the amount is 200 parts by mass or less, mechanical properties, heat resistance, and adhesion to a curable resin. Also tend to be excellent.
本発明のポリアリーレンスルフィド樹脂組成物は、エポキシ樹脂（Ｃ）を必須成分として配合してなる。本発明で用いるエポキシ樹脂（Ｃ）は、エポキシ樹脂やシリコーン樹脂などの硬化性樹脂との接着性を向上させる必須の成分であり、また、後述する衝撃性改質樹脂（Ｅ）を併用する場合には、該（Ｅ）成分の分散性を向上することもできる。 The polyarylene sulfide resin composition of the present invention comprises an epoxy resin (C) as an essential component. The epoxy resin (C) used in the present invention is an essential component for improving the adhesiveness with a curable resin such as an epoxy resin or a silicone resin, and when an impact modifying resin (E) described later is used in combination. In addition, the dispersibility of the component (E) can be improved.
この様なエポキシ樹脂（Ｃ）としては、特に制限されるものでなく、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡＦ型エポキシ樹脂及びビスフェノールＡＤ型エポキシ樹脂などのビスフェノール型エポキシ樹脂、ビフェニル型エポキシ樹脂、テトラメチルビフェニル型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールＡノボラック型エポキシ樹脂、トリフェニルメタン型エポキシ樹脂、テトラフェニルエタン型エポキシ樹脂、ジシクロペンタジエン−フェノール付加反応型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、ナフトールノボラック型エポキシ樹脂、ナフトールアラルキル型エポキシ樹脂、ナフトール−フェノール共縮ノボラック型エポキシ樹脂、ナフトール−クレゾール共縮ノボラック型エポキシ樹脂、芳香族炭化水素ホルムアルデヒド樹脂変性フェノール樹脂型エポキシ樹脂、ビフェニルノボラック型エポキシ樹脂等が挙げられ、このうちビスフェノール型エポキシ樹脂、特にビスフェノールＡ型エポキシ樹脂を用いた場合に、エポキシ接着性が飛躍的に向上するため好ましい。これらのエポキシ樹脂（Ｃ）は、単独で用いることも２種以上併用することもできる。 Such epoxy resin (C) is not particularly limited, and bisphenol-type epoxy resins such as bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol AF-type epoxy resin, bisphenol AD-type epoxy resin, and biphenyl Epoxy resin, tetramethylbiphenyl epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, bisphenol A novolak epoxy resin, triphenylmethane epoxy resin, tetraphenylethane epoxy resin, dicyclopentadiene-phenol addition Reactive epoxy resin, phenol aralkyl epoxy resin, naphthol novolak epoxy resin, naphthol aralkyl epoxy resin, naphthol-phenol Novolak type epoxy resin, naphthol-cresol co-condensed novolak type epoxy resin, aromatic hydrocarbon formaldehyde resin modified phenolic resin type epoxy resin, biphenyl novolak type epoxy resin, etc., among which bisphenol type epoxy resin, especially bisphenol A type epoxy It is preferable to use a resin because the epoxy adhesive property is dramatically improved. These epoxy resins (C) can be used alone or in combination of two or more.
このビスフェノールＡ型エポキシ樹脂としては、具体的にはビスフェノールＡのグリシジルエーテル、及び、該グリジシジルエーテルを更にビスフェノールＡで高分子量化した構造のものが挙げられる。 Specific examples of the bisphenol A epoxy resin include a glycidyl ether of bisphenol A and a structure in which the glycidyl ether is further increased in molecular weight with bisphenol A.
このエポキシ樹脂（Ｃ）としては、特に、組成物中の成形加工性、相溶性が良好である点からエポキシ当量１５０〜２１００ｇ／ｅｑの範囲であることが好ましい。とりわけ成形加工性の点から７００〜２１００ｇ／ｅｑの範囲が好ましい。 The epoxy resin (C) preferably has an epoxy equivalent in the range of 150 to 2100 g / eq from the viewpoint of good moldability and compatibility in the composition. In particular, the range of 700 to 2100 g / eq is preferable from the viewpoint of moldability.
本発明のポリアリーレンスルフィド樹脂組成物においてエポキシ樹脂（Ｃ）の配合量は、本発明の効果を損ねなければ特に限定されないが、ポリアリーレンスルフィド樹脂（Ａ）１００質量部に対して、１〜５０質量部の範囲であることが好ましく、さらに２〜２５質量部の範囲であることがより好ましい。かかる範囲において、樹脂組成物が良好な耐コロナ性および成形性、特に離形性を有しつつ、かつ、成形品がエポキシ樹脂やシリコーン樹脂などの硬化性樹脂と優れた接着性を呈するため好ましい。 The blending amount of the epoxy resin (C) in the polyarylene sulfide resin composition of the present invention is not particularly limited as long as the effect of the present invention is not impaired, but is 1 to 50 parts by mass based on 100 parts by mass of the polyarylene sulfide resin (A). It is preferably in the range of parts by mass, more preferably in the range of 2 to 25 parts by mass. In such a range, the resin composition has good corona resistance and moldability, particularly while having mold release properties, and is preferable because the molded article exhibits excellent adhesiveness with a curable resin such as an epoxy resin or a silicone resin. .
本発明のポリアリーレンスルフィド樹脂組成物は、オキサゾリン基含有非晶性ポリマー（Ｄ）を必須成分として配合してなる。本発明に用いるオキサゾリン基含有非晶性ポリマー（Ｄ）は、上記（Ｃ）成分と同様にエポキシ樹脂やシリコーン樹脂などの硬化性樹脂の硬化物との接着性を向上させ、また、耐衝撃性改質樹脂（Ｅ）を用いる場合にはその分散性をも向上させるものである。即ち、本発明においては、（Ｂ）〜（Ｄ）成分を併用することにより従来にない優れたエポキシ樹脂やシリコーン樹脂などの硬化性樹脂との接着性を発現するのである。また、オキサゾリン基含有非晶性ポリマー（Ｄ）は、特にＰＡＳ樹脂中での耐衝撃性改質樹脂（Ｅ）の微細分散化に効果を発現して樹脂組成物全体の冷熱衝撃性を向上させるという効果を奏することもできる。 The polyarylene sulfide resin composition of the present invention comprises an oxazoline group-containing amorphous polymer (D) as an essential component. The oxazoline group-containing amorphous polymer (D) used in the present invention improves the adhesiveness with a cured product of a curable resin such as an epoxy resin or a silicone resin, as in the case of the component (C). When the modified resin (E) is used, its dispersibility is also improved. That is, in the present invention, by using the components (B) to (D) together, excellent adhesiveness with a curable resin such as an epoxy resin or a silicone resin, which has not been achieved conventionally, is exhibited. In addition, the oxazoline group-containing amorphous polymer (D) exhibits an effect particularly in finely dispersing the impact resistance modified resin (E) in the PAS resin and improves the thermal shock resistance of the entire resin composition. It is also possible to achieve the effect.
ここでオキサゾリン基含有非晶性ポリマー（Ｄ）とは、ガラス転移点又は融点以上の温度条件で液化した状態から冷却により固化させた状態であって、かつ、２００℃以下の温度領域内で非晶領域を８０重量％以上含有するポリマーをいう。具体的にはオキサゾリニル基含有重合性不飽和モノマーの単独重合体、及び該モノマーとその他の重合性不飽和モノマーとの共重合体が挙げられる。 Here, the oxazoline group-containing amorphous polymer (D) refers to a state in which it is solidified by cooling from a state of liquefaction under a temperature condition of a glass transition point or a melting point or higher and in a temperature range of 200 ° C. or lower. A polymer containing a crystalline region of 80% by weight or more. Specific examples include a homopolymer of an oxazolinyl group-containing polymerizable unsaturated monomer and a copolymer of the monomer and another polymerizable unsaturated monomer.
ここで、オキサゾリニル基含有重合性不飽和モノマーとしては、 Here, as the oxazolinyl group-containing polymerizable unsaturated monomer,
（式中、Ｒ１は水素原子、炭素原子数１〜６の範囲のアルキル基またはアルコキシ基で、好ましくはメチル基、ｉ−またはｎ−プロピル基、ブチル基である。）。
(In the formula, R 1 is a hydrogen atom, an alkyl group or an alkoxy group having 1 to 6 carbon atoms, preferably a methyl group, an i- or n-propyl group, or a butyl group.)
本発明に用いるオキサゾリニル基含有重合性不飽和モノマーとしては、ビニルオキサゾリンが好ましい。ここで、ビニルオキサゾリンとしては、例えば As the oxazolinyl group-containing polymerizable unsaturated monomer used in the present invention, vinyl oxazoline is preferable. Here, as the vinyl oxazoline, for example,
また、該オキサゾリニル基含有重合性不飽和モノマーと共重合し得るその他の重合性不飽和モノマーとしては、例えば、スチレン等の芳香族ビニル、アクリロニトリル等のシアン化ビニルや酢酸ビニル、（メタ）アクリル酸、（メタ）アクリル酸エステル、無水マレイン酸等の不飽和カルボン酸またはその誘導体成分、さらにエチレンプロピレン等のα−オレフィンやブタジエン、イソプレン等のジエン成分が挙げられる。これらの中でも特に、相溶性の点からスチレン、アクリロニトリルが好ましい。 Other polymerizable unsaturated monomers copolymerizable with the oxazolinyl group-containing polymerizable unsaturated monomer include, for example, aromatic vinyl such as styrene, vinyl cyanide such as acrylonitrile, vinyl acetate, and (meth) acrylic acid. And unsaturated carboxylic acids such as (meth) acrylic acid ester and maleic anhydride or derivatives thereof, and α-olefins such as ethylene propylene and diene components such as butadiene and isoprene. Among these, styrene and acrylonitrile are particularly preferable from the viewpoint of compatibility.
また、オキサゾリニル基含有重合性不飽和モノマーとその他の重合性不飽和モノマーとの共重合体としては、上記単量体成分から選択される二元共重合体又は三元共重合体であることが好ましく、具体的には、ビニルオキサゾリンと、スチレン及び／又はアクリロニトリルであることが好ましい。 Further, the copolymer of the oxazolinyl group-containing polymerizable unsaturated monomer and the other polymerizable unsaturated monomer may be a binary copolymer or a ternary copolymer selected from the above monomer components. Preferably, specifically, vinyl oxazoline and styrene and / or acrylonitrile are preferable.
本発明のポリアリーレンスルフィド樹脂組成物においてオキサゾリン基含有非晶性ポリマー（Ｄ）の配合量は、本発明の効果を損ねなければ特に限定されないが、ポリアリーレンスルフィド樹脂（Ａ）１００質量部に対して、１〜５０質量部の範囲であることが好ましく、さらに２〜２５質量部の範囲であることがより好ましい。かかる範囲において、樹脂組成物が良好な耐コロナ性と成形性、特に離形性を有しつつ、成形品がエポキシ樹脂やシリコーン樹脂などの硬化性樹脂と優れた接着性を呈するため好ましい。 The amount of the oxazoline group-containing amorphous polymer (D) in the polyarylene sulfide resin composition of the present invention is not particularly limited as long as the effects of the present invention are not impaired, but is preferably 100 parts by mass of the polyarylene sulfide resin (A). It is preferably in the range of 1 to 50 parts by mass, and more preferably in the range of 2 to 25 parts by mass. Within this range, the resin composition has good corona resistance and moldability, particularly mold release properties, and the molded article exhibits excellent adhesion to a curable resin such as an epoxy resin or a silicone resin.
本発明のポリアリーレンスルフィド樹脂組成物は、必要に応じ、耐衝撃性付与剤（Ｅ）を任意成分として配合してなる。耐衝撃性付与剤（Ｅ）としては、本発明の効果を損ねなければ特に限定されないが、例えばα−オレフィン類とビニル重合性化合物とを共重合して得られる前記熱可塑性エラストマなどが挙げられる。前記α−オレフィン類としては、例えば、エチレン、プロピレン、ブテン−１等の炭素原子数２〜８の範囲のα−オレフィン類などが挙げられる。前記ビニル重合性化合物としては、例えば、（メタ）アクリル酸、（メタ）アクリル酸エステル等のα、β−不飽和カルボン酸類及びそのアルキルエステル類、マレイン酸、フマル酸、イタコン酸、その他の炭素原子数４〜１０の範囲の不飽和ジカルボン酸類とそのモノ及びジエステル類、その酸無水物等のα，β−不飽和ジカルボン酸及びその誘導体、グリシジル（メタ）アクリレート等が挙げられる。なお、本発明において耐衝撃性付与剤は必須成分ではないが、添加する場合、その配合量は、ポリアリーレンスルフィド樹脂１００質量部に対して１〜４０質量部の範囲であることが好ましく、５〜２０質量部の範囲であることがより好ましい。かかる範囲において、樹脂組成物が良好な耐コロナ性と成形性、特に離形性を有し、かつ成形品がエポキシ樹脂やシリコーン樹脂などの硬化性樹脂と優れた接着性を呈しつつ、さらに機械的強度、特に耐衝撃性や靱性が向上するため好ましい。 The polyarylene sulfide resin composition of the present invention may optionally contain an impact resistance imparting agent (E) as an optional component. The impact resistance imparting agent (E) is not particularly limited as long as the effects of the present invention are not impaired, and examples thereof include the thermoplastic elastomer obtained by copolymerizing an α-olefin and a vinyl polymerizable compound. . Examples of the α-olefins include α-olefins having 2 to 8 carbon atoms, such as ethylene, propylene, and butene-1. Examples of the vinyl polymerizable compound include α, β-unsaturated carboxylic acids such as (meth) acrylic acid and (meth) acrylate and alkyl esters thereof, maleic acid, fumaric acid, itaconic acid, and other carbon-containing compounds. Examples thereof include unsaturated dicarboxylic acids having 4 to 10 atoms and mono- and diesters thereof, α, β-unsaturated dicarboxylic acids such as acid anhydrides and derivatives thereof, and glycidyl (meth) acrylate. In the present invention, the impact resistance imparting agent is not an essential component, but when added, the amount thereof is preferably in the range of 1 to 40 parts by mass with respect to 100 parts by mass of the polyarylene sulfide resin. More preferably, it is in the range of 20 to 20 parts by mass. Within this range, the resin composition has good corona resistance and moldability, especially mold release properties, and the molded product exhibits excellent adhesiveness with a curable resin such as an epoxy resin or a silicone resin. This is preferable since the mechanical strength, particularly the impact resistance and toughness are improved.
本発明のポリアリーレンスルフィド樹脂組成物は、必要に応じ、シランカップリング剤（Ｆ）を任意成分として配合してなる。シランカップリング剤（Ｆ）としては、本発明の効果を損ねなければ特に限定されないが、カルボキシ基と反応する官能基、例えば、エポキシ基、イソシアナト基、アミノ基または水酸基を有するシランカップリング剤が好ましいものとして挙げられる。このようなシランカップリング剤としては、例えば、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルトリエトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン等のエポキシ基含有アルコキシシラン化合物、γ−イソシアナトプロピルトリメトキシシラン、γ−イソシアナトプロピルトリエトキシシラン、γ−イソシアナトプロピルメチルジメトキシシラン、γ−イソシアナトプロピルメチルジエトキシシラン、γ−イソシアナトプロピルエチルジメトキシシラン、γ−イソシアナトプロピルエチルジエトキシシラン、γ−イソシアナトプロピルトリクロロシラン等のイソシアナト基含有アルコキシシラン化合物、γ−（２−アミノエチル）アミノプロピルメチルジメトキシシラン、γ−（２−アミノエチル）アミノプロピルトリメトキシシラン、γ−アミノプロピルトリメトキシシラン等のアミノ基含有アルコキシシラン化合物、γ−ヒドロキシプロピルトリメトキシシラン、γ−ヒドロキシプロピルトリエトキシシラン等の水酸基含有アルコキシシラン化合物が挙げられる。本発明においてシランカップリング剤は必須成分ではないが、添加する場合、その配合量は、本発明の効果を損ねなければ特に限定されないが、ポリアリーレンスルフィド樹脂（Ａ）１００質量部に対して、０．０１〜１０質量部の範囲であることが好ましく、さらに０．１〜５質量部の範囲であることがより好ましい。かかる範囲において、樹脂組成物が良好な耐コロナ性と成形性、特に離形性を有し、かつ成形品がエポキシ樹脂やシリコーン樹脂などの硬化性樹脂と優れた接着性を呈しつつ、さらに機械的強度が向上するため好ましい。 The polyarylene sulfide resin composition of the present invention comprises a silane coupling agent (F) as an optional component, if necessary. The silane coupling agent (F) is not particularly limited as long as the effects of the present invention are not impaired, but a silane coupling agent having a functional group that reacts with a carboxy group, for example, an epoxy group, an isocyanato group, an amino group, or a hydroxyl group may be used. Preferred are mentioned. Examples of such a silane coupling agent include epoxy groups such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. Containing alkoxysilane compound, γ-isocyanatopropyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, γ-isocyanatopropylmethyldiethoxysilane, γ-isocyanatopropylethyldimethoxysilane , Γ-isocyanatopropylethyldiethoxysilane, isocyanato group-containing alkoxysilane compounds such as γ-isocyanatopropyltrichlorosilane, γ- (2-aminoethyl) aminopropylmethyldimethoxysilane, γ- ( -Aminoethyl) aminopropyltrimethoxysilane, amino group-containing alkoxysilane compounds such as γ-aminopropyltrimethoxysilane, and hydroxyl group-containing alkoxysilane compounds such as γ-hydroxypropyltrimethoxysilane and γ-hydroxypropyltriethoxysilane. Can be In the present invention, the silane coupling agent is not an essential component, but when added, the amount thereof is not particularly limited as long as the effects of the present invention are not impaired, but based on 100 parts by mass of the polyarylene sulfide resin (A). It is preferably in the range of 0.01 to 10 parts by mass, and more preferably in the range of 0.1 to 5 parts by mass. Within this range, the resin composition has good corona resistance and moldability, especially mold release properties, and the molded product exhibits excellent adhesiveness with a curable resin such as an epoxy resin or a silicone resin. It is preferable because the target strength is improved.
本発明のポリアリーレンスルフィド樹脂組成物は、更に機械的強度、特に冷熱衝撃強度、耐熱性、寸法安定性等の性能を改善するために、充填剤を任意成分として配合してなる。本発明において充填剤は必須成分ではないが、添加する場合、その配合量は前記ポリアリーレンスルフィド樹脂１００質量部に対して０質量部より多く、通常は１質量部以上、より好ましくは１０質量部以上、かつ６００質量部以下の範囲とすることによって、強度、剛性、耐熱性、放熱性および寸法安定性など、加える充填剤の目的に応じて各種性能を向上させることができる。 The polyarylene sulfide resin composition of the present invention further contains a filler as an optional component in order to further improve the mechanical strength, particularly the performance such as thermal shock strength, heat resistance and dimensional stability. In the present invention, the filler is not an essential component, but when added, its amount is more than 0 parts by mass, usually 1 part by mass or more, more preferably 10 parts by mass, based on 100 parts by mass of the polyarylene sulfide resin. When the content is in the range of 600 parts by mass or less, various performances such as strength, rigidity, heat resistance, heat dissipation, and dimensional stability can be improved according to the purpose of the filler to be added.
該充填剤としては、本発明の効果を損なうものでなければ公知慣用の材料を用いることもでき、例えば、繊維状のものや、粒状や板状などの非繊維状のものなど、さまざまな形状の充填材等が挙げられる。具体的には、ガラス繊維、炭素繊維、シランガラス繊維、セラミック繊維、アラミド繊維、金属繊維、チタン酸カリウム、炭化珪素、硫酸カルシウム、珪酸カルシウム等の繊維、ウォラストナイト等の天然繊維等の繊維状充填材が使用でき、またガラスビーズ、ガラスフレーク、硫酸バリウム、硫酸カルシウム、クレー、パイロフィライト、ベントナイト、セリサイト、ゼオライト、マイカ、雲母、タルク、アタパルジャイト、フェライト、珪酸カルシウム、炭酸カルシウム、炭酸マグネシウム、ガラスビーズ等の非繊維状充填剤も使用できる。 As the filler, known materials can also be used as long as they do not impair the effects of the present invention.For example, various fillers such as fibrous ones and non-fibrous ones such as granules and plates can be used. And the like. Specifically, fibers such as glass fiber, carbon fiber, silane glass fiber, ceramic fiber, aramid fiber, metal fiber, potassium titanate, silicon carbide, calcium sulfate, calcium silicate, and natural fibers such as wollastonite Fillers can be used, and glass beads, glass flakes, barium sulfate, calcium sulfate, clay, pyrophyllite, bentonite, sericite, zeolite, mica, mica, talc, attapulgite, ferrite, calcium silicate, calcium carbonate, carbonate Non-fibrous fillers such as magnesium and glass beads can also be used.
更に、本発明のポリアリーレンスルフィド樹脂組成物は、上記成分に加えて、さらに用途に応じて、適宜、ポリエステル樹脂、ポリアミド樹脂、ポリイミド樹脂、ポリエーテルイミド樹脂、ポリカーボネート樹脂、ポリフェニレンエーテル樹脂、ポリスルフォン樹脂、ポリエーテルスルフォン樹脂、ポリエーテルエーテルケトン樹脂、ポリエーテルケトン樹脂、ポリアリーレン樹脂、ポリエチレン樹脂、ポリプロピレン樹脂、ポリ四弗化エチレン樹脂、ポリ二弗化エチレン樹脂、ポリスチレン樹脂、ＡＢＳ樹脂、フェノール樹脂、ウレタン樹脂、液晶ポリマー等の合成樹脂、或いは、弗素ゴム等のエラストマーなどを任意成分として配合してなる。また、これらの樹脂は必須成分ではないが、添加する場合、その配合量は、それぞれの目的に応じて異なり、一概に規定することはできないが、ポリアリーレンスルフィド樹脂（Ａ）１００質量部に対して０．０１〜１０００質量部の範囲で、本発明の効果を損なわないよう目的や用途に応じて適宜調整して用いればよい。 Further, the polyarylene sulfide resin composition of the present invention may further comprise, in addition to the above components, a polyester resin, a polyamide resin, a polyimide resin, a polyetherimide resin, a polycarbonate resin, a polyphenylene ether resin, and a polysulfone. Resin, polyether sulfone resin, polyether ether ketone resin, polyether ketone resin, polyarylene resin, polyethylene resin, polypropylene resin, polytetrafluoroethylene resin, polydifluoroethylene resin, polystyrene resin, ABS resin, phenol resin , A synthetic resin such as a urethane resin or a liquid crystal polymer, or an elastomer such as a fluororubber as an optional component. These resins are not essential components, but when they are added, their amounts vary depending on the respective purposes and cannot be specified unconditionally. However, based on 100 parts by mass of the polyarylene sulfide resin (A) In the range of 0.01 to 1000 parts by mass, it may be appropriately adjusted and used according to the purpose and application so as not to impair the effects of the present invention.
また本発明のポリアリーレンスルフィド樹脂組成物は、その他にも離型剤、着色剤、帯電防止剤、酸化防止剤、耐熱安定剤、紫外線安定剤、紫外線吸収剤、発泡剤、難燃剤、難燃助剤、防錆剤、カップリング剤等の公知慣用の添加剤を必要に応じ、任意成分として配合してなる。これらの添加剤は必須成分ではないが、添加する場合、その配合量は、それぞれの目的に応じて異なり、一概に規定することはできないが、ポリアリーレンスルフィド樹脂（Ａ）１００質量部に対して０．０１〜１０００質量部の範囲で、本発明の効果を損なわないよう目的や用途に応じて適宜調整して用いればよい。 In addition, the polyarylene sulfide resin composition of the present invention further includes a release agent, a colorant, an antistatic agent, an antioxidant, a heat stabilizer, an ultraviolet stabilizer, an ultraviolet absorber, a foaming agent, a flame retardant, and a flame retardant. Known and commonly used additives such as auxiliaries, rust preventives, and coupling agents are blended as optional components as necessary. These additives are not indispensable components, but when added, the amounts of the additives vary depending on the respective purposes and cannot be specified unconditionally. However, based on 100 parts by mass of the polyarylene sulfide resin (A) In the range of 0.01 to 1000 parts by mass, it may be appropriately adjusted and used depending on the purpose and application so as not to impair the effects of the present invention.
本発明のポリアリーレンスルフィド樹脂組成物の製造方法は特に制限なく、ポリアリーレンスルフィド樹脂（Ａ）、ジメチルポリシロキサン（Ｂ）、エポキシ樹脂（Ｃ）およびオキサゾリン基含有非晶性ポリマー（Ｄ）を必須成分として、ポリアリーレンスルフィド樹脂（Ａ）の融点以上で溶融混練する。より具体的には、原料としてポリアリーレンスルフィド樹脂（Ａ）、ジメチルポリシロキサン（Ｂ）、エポキシ樹脂（Ｃ）およびオキサゾリン基含有非晶性ポリマー（Ｄ）の各必須成分と、必要に応じて、充填剤等のその他の任意成分を、粉末、ベレット、細片など様々な形態でリボンブレンター、ヘンシェルミキサー、Ｖブレンターなどに投入してドライブレンドした後、バンバリーミキサー、ミキシングロール、単軸または２軸の押出機およびニーターなどの公知の溶融混練機に投入し、樹脂温度がポリアリーレンスルフィド樹脂の融点以上となる温度範囲、好ましくは該融点＋１０℃以上となる温度範囲、より好ましくは融点＋１０℃〜融点＋１００℃となる温度範囲、さらに好ましくは融点＋２０〜融点＋５０℃となる温度範囲で溶融混練する工程を経て製造することができる。溶融混練機への各成分の添加、混合は同時に行ってもよいし、分割して行っても良い。 The method for producing the polyarylene sulfide resin composition of the present invention is not particularly limited, and the polyarylene sulfide resin (A), dimethylpolysiloxane (B), epoxy resin (C) and oxazoline group-containing amorphous polymer (D) are essential. As a component, it is melt-kneaded at a temperature equal to or higher than the melting point of the polyarylene sulfide resin (A). More specifically, each essential component of a polyarylene sulfide resin (A), a dimethylpolysiloxane (B), an epoxy resin (C) and an oxazoline group-containing amorphous polymer (D) as raw materials, Other optional components such as fillers are put into ribbon blenders, Henschel mixers, V blenders, etc. in various forms such as powders, berets, and strips, and dry blended. It is charged into a known melt kneader such as a shaft extruder and a kneader, and a temperature range in which the resin temperature is equal to or higher than the melting point of the polyarylene sulfide resin, preferably a temperature range in which the melting point is equal to or higher than + 10 ° C, more preferably a melting point + 10 ° C Melting point + 100 ° C, more preferably melting point +20 to melting point + 50 ° C. It can be manufactured through a step of kneading. The addition and mixing of each component to the melt kneader may be performed simultaneously or may be performed separately.
前記溶融混練機としては分散性や生産性の観点から二軸混練押出機が好ましく、例えば、樹脂成分の吐出量５〜５００（ｋｇ／ｈｒ）の範囲と、スクリュー回転数５０〜５００（ｒｐｍ）の範囲とを適宜調整しながら溶融混練することが好ましく、それらの比率（吐出量／スクリュー回転数）が０．０２〜５（ｋｇ／ｈｒ／ｒｐｍ）なる条件下に溶融混練することがさらに好ましい。また、前記成分のうち、充填剤や添加剤を添加する場合は、前記二軸混練押出機のサイドフィーダーから該押出機内に投入することが分散性の観点から好ましい。かかるサイドフィーダーの位置は、前記二軸混練押出機のスクリュー全長に対する、該押出機樹脂投入部から該サイドフィーダーまでの距離の比率が、０．１〜０．９であることが好ましい。中でも０．３〜０．７であることが特に好ましい。 As the melt kneading machine, a twin-screw kneading extruder is preferable from the viewpoint of dispersibility and productivity. For example, the discharge amount of the resin component is in the range of 5 to 500 (kg / hr), and the screw rotation speed is 50 to 500 (rpm). It is preferable to perform melt kneading while appropriately adjusting the range, and it is more preferable to perform melt kneading under the condition that the ratio (discharge amount / screw rotation speed) is 0.02 to 5 (kg / hr / rpm). . In addition, when a filler or an additive is added among the above components, it is preferable from the viewpoint of dispersibility that the filler and the additive are introduced into the extruder from a side feeder of the twin-screw kneading extruder. As for the position of the side feeder, the ratio of the distance from the resin feeding section of the extruder to the side feeder to the total length of the screw of the twin-screw kneading extruder is preferably 0.1 to 0.9. Especially, it is especially preferable that it is 0.3-0.7.
このように溶融混練して得られる本発明のポリアリーレンスルフィド樹脂組成物は、必須成分であるポリアリーレンスルフィド樹脂（Ａ）、ジメチルポリシロキサン（Ｂ）、エポキシ樹脂（Ｃ）、オキサゾリン基含有非晶性ポリマー（Ｄ）、必要に応じて加える任意成分およびそれらの由来成分を含む溶融混練物であり、該溶融混練後に、公知の方法でペレット、チップ、顆粒、粉末等の形態に加工してから、必要に応じて１００〜１５０℃の温度で予備乾燥を施して、各種成形に供することが好ましい。 The polyarylene sulfide resin composition of the present invention obtained by melt-kneading in this manner comprises a polyarylene sulfide resin (A), a dimethylpolysiloxane (B), an epoxy resin (C), an oxazoline group-containing amorphous Is a melt-kneaded product containing the water-soluble polymer (D), optional components to be added as necessary, and components derived therefrom. After the melt-kneading, the mixture is processed into pellets, chips, granules, powders, and the like by a known method. If necessary, it is preferable to perform preliminary drying at a temperature of 100 to 150 ° C. and provide it for various moldings.
本発明のポリアリーレンスルフィド樹脂組成物は、射出成形、圧縮成形、コンポジット、シート、パイプなどの押出成形、引抜成形、ブロー成形、トランスファー成形など各種成形に供することが可能であるが、特に離形性にも優れるため射出成形用途に適している。射出成形にて成形する場合、各種成形条件は特に限定されず、通常一般的な方法にて成形することができる。例えば、射出成形機内で、樹脂温度がポリアリーレンスルフィド樹脂の融点以上の温度範囲、好ましくは該融点＋１０℃以上の温度範囲、より好ましくは融点＋１０℃〜融点＋１００℃の温度範囲、さらに好ましくは融点＋２０〜融点＋５０℃の温度範囲で前記ポリアリーレンスルフィド樹脂組成物を溶融する工程を経た後、樹脂吐出口よりを金型内に注入して成形すればよい。その際、金型温度も公知の温度範囲、例えば、室温（２３℃）〜３００℃の範囲、好ましくは１２０〜１８０℃に設定すればよい。 The polyarylene sulfide resin composition of the present invention can be subjected to various types of molding such as injection molding, compression molding, extrusion molding of composites, sheets, pipes, etc., pultrusion molding, blow molding, transfer molding, and particularly mold release. It is suitable for injection molding because of its excellent properties. When molding by injection molding, various molding conditions are not particularly limited, and molding can be usually performed by a general method. For example, in an injection molding machine, the resin temperature is in the temperature range of the melting point of the polyarylene sulfide resin or higher, preferably in the temperature range of the melting point + 10 ° C. or higher, more preferably in the temperature range of the melting point + 10 ° C. to the melting point + 100 ° C., further preferably in the melting point range. After the step of melting the polyarylene sulfide resin composition in a temperature range of +20 to melting point + 50 ° C., it may be molded by injecting the resin from a resin discharge port into a mold. At that time, the mold temperature may be set to a known temperature range, for example, a range of room temperature (23 ° C.) to 300 ° C., preferably 120 to 180 ° C.
本発明のポリアリーレンスルフィド樹脂組成物を成形してなる成形品は、耐コロナ性に優れるだけでなく、ポリアリーレンスルフィド樹脂以外の樹脂、たとえば、エポキシ樹脂やシリコーン樹脂等の硬化性樹脂との接着性に優れる。このことから、ポリアリーレンスルフィド樹脂とそれ以外の樹脂との複合成形品として好適に用いることができる。 The molded article obtained by molding the polyarylene sulfide resin composition of the present invention not only has excellent corona resistance, but also has an adhesive property with a resin other than the polyarylene sulfide resin, for example, a curable resin such as an epoxy resin or a silicone resin. Excellent in nature. For this reason, it can be suitably used as a composite molded article of a polyarylene sulfide resin and another resin.
当該複合体の主な用途例として箱型の電気・電子部品集積モジュール用保護・支持部材・複数の個別半導体またはモジュール、センサ、ＬＥＤランプ、コネクタ、ソケット、抵抗器、リレーケース、スイッチ、コイルボビン、コンデンサ、バリコンケース、光ピックアップ、発振子、各種端子板、変成器、プラグ、プリント基板、チューナ、スピーカ、マイクロフォン、ヘッドフォン、小型モータ、磁気ヘッドベース、パワーモジュール、端子台、半導体、液晶、ＦＤＤキャリッジ、ＦＤＤシャーシ、モーターブラッシュホルダ、パラボラアンテナ、コンピュータ関連部品等に代表される電気・電子部品；ＶＴＲ部品、テレビ部品、アイロン、ヘアードライヤ、炊飯器部品、電子レンジ部品、音響部品、オーディオ・レーザディスク・コンパクトディスク・ＤＶＤディスク・ブルーレイディスク等の音声・映像機器部品、照明部品、冷蔵庫部品、エアコン部品、タイプライタ部品、ワードプロセッサ部品、あるいは給湯機や風呂の湯量、温度センサなどの水回り機器部品等に代表される家庭、事務電気製品部品；オフィスコンピュータ関連部品、電話器関連部品、ファクシミリ関連部品、複写機関連部品、洗浄用治具、モーター部品、ライタ、タイプライタなどに代表される機械関連部品：顕微鏡、双眼鏡、カメラ、時計等に代表される光学機器、精密機械関連部品；オルタネーターターミナル、オルタネーターコネクタ、ＩＣレギュレータ、ライトディヤ用ポテンシオメーターベース、リレーブロック、インヒビタースイッチ、排気ガスバルブ等の各種バルブ、燃料関係・排気系・吸気系各種パイプ、エアーインテークノズルスノーケル、インテークマニホールド、燃料ポンプ、エンジン冷却水ジョイント、キャブレターメインボディ、キャブレタースペーサ、排気ガスセンサ、冷却水センサ、油温センサ、ブレーキパットウェアーセンサ、スロットルポジションセンサ、クランクシャフトポジションセンサ、エアーフローメータ、ブレーキパッド摩耗センサ、エアコン用サーモスタットベース、暖房温風フローコントロールバルブ、ラジエーターモーター用ブラッシュホルダ、ウォーターポンプインペラ、タービンベイン、ワイパーモーター関係部品、デュストリビュータ、スタータースイッチ、イグニッションコイルおよびそのボビン、モーターインシュレータ、モーターロータ、モーターコア、スターターリレ、トランスミッション用ワイヤーハーネス、ウィンドウォッシャーノズル、エアコンパネルスイッチ基板、燃料関係電磁気弁用コイル、ヒューズ用コネクタ、ホーンターミナル、電装部品絶縁板、ステップモーターロータ、ランプソケット、ランプリフレクタ、ランプハウジング、ブレーキピストン、ソレノイドボビン、エンジンオイルフィルタ、点火装置ケース等の自動車・車両関連部品、その他各種用途にも適用可能である。 Examples of main applications of the composite include box-shaped protection / support members for electric / electronic component integrated modules, multiple individual semiconductors or modules, sensors, LED lamps, connectors, sockets, resistors, relay cases, switches, coil bobbins, Capacitors, variable condenser cases, optical pickups, oscillators, various terminal boards, transformers, plugs, printed boards, tuners, speakers, microphones, headphones, small motors, magnetic head bases, power modules, terminal blocks, semiconductors, liquid crystals, FDD carriages , FDD chassis, motor brush holder, parabolic antenna, electrical and electronic parts such as computer-related parts; VTR parts, TV parts, irons, hair dryers, rice cooker parts, microwave oven parts, acoustic parts, audio / laser disks・ Comparator For audio / video equipment parts such as discs, DVD discs, and Blu-ray discs, lighting parts, refrigerator parts, air conditioner parts, typewriter parts, word processor parts, and water supply equipment parts such as water heaters and bath water and temperature sensors. Representative household and office electrical product parts; office computer-related parts, telephone-related parts, facsimile-related parts, copier-related parts, washing jigs, motor parts, motor parts, lighters, typewriters, and other machine-related parts: Optical equipment represented by microscopes, binoculars, cameras, watches, etc., precision machinery related parts; alternator terminals, alternator connectors, IC regulators, potentiometer bases for light deia, relay blocks, inhibitor switches, exhaust valves, etc. Fuel related / exhaust system Various intake system pipes, air intake nozzle snorkel, intake manifold, fuel pump, engine cooling water joint, carburetor main body, carburetor spacer, exhaust gas sensor, cooling water sensor, oil temperature sensor, brake patware sensor, throttle position sensor, crankshaft Position sensor, air flow meter, brake pad wear sensor, thermostat base for air conditioner, heating and hot air flow control valve, brush holder for radiator motor, water pump impeller, turbine vane, wiper motor related parts, distributor, starter switch, ignition Coil and its bobbin, motor insulator, motor rotor, motor core, starter reel, Wire harness for transmission, window washer nozzle, air conditioner panel switch board, coil for fuel related electromagnetic valve, connector for fuse, horn terminal, electrical component insulation board, step motor rotor, lamp socket, lamp reflector, lamp housing, brake piston, The present invention is also applicable to automobile / vehicle-related parts such as a solenoid bobbin, an engine oil filter, an ignition device case, and other various uses.
＜実施例１〜８及び比較例１〜４＞
表１〜２に記載する組成成分および配合量にしたがい、各材料をタンブラーで均一に混合した。その後、東芝機械株式会社製ベント付き２軸押出機「ＴＥＭ−３５Ｂ」に前記配合材料を投入し、樹脂成分吐出量２５ｋｇ／ｈｒ、スクリュー回転数２５０ｒｐｍ、樹脂成分の吐出量（ｋｇ／ｈｒ）とスクリュー回転数（ｒｐｍ）との比率（吐出量／スクリュー回転数）＝０．１（ｋｇ／ｈｒ・ｒｐｍ）、設定樹脂温度３３０℃で溶融混練して樹脂組成物のペレットを得た。
<Examples 1 to 8 and Comparative Examples 1 to 4>
Each of the materials was uniformly mixed with a tumbler according to the composition components and the amounts described in Tables 1 and 2. Thereafter, the compounded material was charged into a vented twin screw extruder “TEM-35B” manufactured by Toshiba Machine Co., Ltd., and the resin component discharge rate was 25 kg / hr, the screw rotation speed was 250 rpm, and the resin component discharge rate (kg / hr). The mixture was melt-kneaded at a ratio of screw rotation speed (rpm) (discharge amount / screw rotation speed) = 0.1 (kg / hr · rpm) at a set resin temperature of 330 ° C. to obtain a resin composition pellet.
このペレットを用いて、シリンダー温度３２０℃に設定した住友−ネスタール社製射出成形機（ＳＧ７５−ＨＩＰＲＯ・ＭIII）に供給し、金型温度１３０℃に温調した成形用金型を用いて射出成形を行い、試験片を成形した。以下の各種評価試験を行った。試験及び評価の結果は、表１〜表２に示した。 The pellets are supplied to a Sumitomo-Nestal injection molding machine (SG75-HIPRO MIII) set at a cylinder temperature of 320 ° C., and injection-molded using a molding die temperature-controlled to 130 ° C. Was performed to form a test piece. The following various evaluation tests were performed. The test and evaluation results are shown in Tables 1 and 2.
＜耐コロナ性；貫通（厚み）方向の絶縁寿命性の測定＞
上記試験片の成形において、成形用金型を用い、縦１００ｍｍ×横１００ｍｍ×厚み１ｍｍの試験片を得た。
<Corona resistance; measurement of insulation life in the penetration (thickness) direction>
In forming the test piece, a test piece having a length of 100 mm × a width of 100 mm × a thickness of 1 mm was obtained using a molding die.
ＪＩＳ−Ｃ２１１０−１９９４の絶縁破壊強さの測定方法（７．１（１））に準拠し、２５〔ＫＶ〕／５０〔Ｈｚ〕の交流電圧を印加して導通するまでの時間（ｈ）を測定し、材料の厚み方向の絶縁寿命を評価した。但し、厚み方向の絶縁寿命はベースとなる添加剤（Ｅ１）および充填剤（Ｆ１）が同じ組成同士で対比することとし、表１においては、前記成分（Ｄ１〜Ｇ１）を含む実施例１〜５と比較例１との対比を、比較例１の寿命を１（基準値）としたときの倍率で表し、表２においては、前記成分（Ｅ１〜Ｆ１）を含まない実施例６と比較例２との対比を、比較例１の寿命を１（基準値）としたときの倍率で表した。 According to JIS-C2110-1994, the method for measuring the dielectric strength (7.1 (1)), the time (h) required to apply an AC voltage of 25 [KV] / 50 [Hz] until conduction is obtained. The insulation lifetime in the thickness direction of the material was evaluated. However, the insulation life in the thickness direction is based on the comparison between the same composition of the base additive (E1) and the filler (F1). In Table 1, Examples 1 to 3 including the components (D1 to G1) were used. The comparison between Comparative Example 5 and Comparative Example 1 is represented by a magnification when the life of Comparative Example 1 is 1 (reference value). In Table 2, Examples 6 and Comparative Examples not including the components (E1 to F1) were used. The comparison with No. 2 was expressed by a magnification when the life of Comparative Example 1 was 1 (reference value).
［ＰＡＳ樹脂組成物のシリコーン樹脂との接着強度］
上記試験片の成形において、成形用金型としてＡＳＴＭ１号ダンベル片成形用金型を用い、ＡＳＴＭ１号ダンベル片を得た。
[Adhesive strength of PAS resin composition to silicone resin]
In molding the test piece, an ASTM No. 1 dumbbell piece was used as a molding die to obtain an ASTM No. 1 dumbbell piece.
得られたＡＳＴＭ１号ダンベル片を中央から２等分し、シリコーン接着剤との接触面積が１６６ｍｍ２となるように、２等分したＡＳＴＭ１号ダンベル片２枚をクリップを用いて固定した後、開口部にシリコーン樹脂（東レ・ダウコーニング株式会社製「ＳＥ−１７１４」）で注入して、１５０℃、３０分保持して硬化・接着させた。２３℃下で１日冷却後スペーサーを外し、試験片を得た。得られた試験片を−３０℃雰囲気下で５分保持した後、接着面に対しせん断方向の試験力をかけ、接着面がはがれたときの試験力を評価した。 The obtained ASTM No. 1 dumbbell piece was bisected from the center, and the two ASTM No. 1 dumbbell pieces were fixed using a clip so that the contact area with the silicone adhesive was 166 mm 2. A silicone resin (“SE-1714” manufactured by Dow Corning Toray Co., Ltd.) was injected into the portion, and the mixture was cured and bonded at 150 ° C. for 30 minutes. After cooling at 23 ° C. for 1 day, the spacer was removed to obtain a test piece. After holding the obtained test piece in an atmosphere of -30 ° C for 5 minutes, a test force in the shear direction was applied to the bonded surface, and the test force when the bonded surface was peeled was evaluated.
なお、表１〜２中の配合樹脂、材料の配合比率の数値は質量部を表し、下記のものを用いた。
ＰＰＳ
Ａ１ ＤＩＣ株式会社製ポリアリーレンスルフィド樹脂「ＤＩＣ．ＰＰＳ（Ｖ６溶融粘度５０Ｐａ・ｓ）」
In addition, the numerical value of the compounding ratio of the compounding resin and the material in Tables 1 and 2 represents parts by mass, and the following was used.
PPS
A1 DIC Corporation polyarylene sulfide resin “DIC.PPS (V6 melt viscosity 50 Pa · s)”
ジメチルポリシロキサン
Ｂ１ ジメチルポリシロキサン（ビニル基含有ジメチルポリシロキサン（分子量Ｍｗ＝５３０，０００、シロキサン結合数（分子量Ｍｗ／７４）＝７，１６２）をヒュームドシリカに含浸。ビニル基含有ジメチルポリシロキサン／ヒュームドシリカ＝６５／３５（質量比））旭化成ワッカーシリコーン株式会社製「ＧＥＮＩＯＰＬＡＳＴ ＰＥＬＬＥＴ Ｓ」
Ｂ２ ジメチルポリシロキサン 東レ・ダウコーニング社製「トレフィルＦ２０２」（ジメチルシロキサン（分子量Ｍｗ＝１３０，０００、シロキサン結合数（分子量Ｍｗ／７４）＝１，７５６）をシリカに担持させて粉末化したもの。ジメチルシロキサン／シリカ＝６０／４０（質量比））
Dimethylpolysiloxane B1 Impregnated fumed silica with dimethylpolysiloxane (vinyl group-containing dimethylpolysiloxane (molecular weight Mw = 530,000, siloxane bond number (molecular weight Mw / 74) = 7,162). Fumed silica = 65/35 (mass ratio) "GENIOPLAST PELLET S" manufactured by Asahi Kasei Wacker Silicone Co., Ltd.
B2 Dimethylpolysiloxane "Torayfil F202" manufactured by Dow Corning Toray Co., Ltd. (dimethylsiloxane (molecular weight Mw = 130,000, siloxane bond number (molecular weight Mw / 74) = 1,756) supported on silica and powdered. Dimethylsiloxane / silica = 60/40 (mass ratio)
ＧＰＣ：ジメチルポリシロキサンの分子量Ｍｗは、以下の条件により測定した。
測定装置 ：東ソー株式会社製「ＨＬＣ−８３２０ ＧＰＣ」
カラム ：東ソー株式会社製ガードカラム「ＨＸＬ−Ｌ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ１０００ＨＸＬ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ２０００ＨＸＬ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ３０００ＨＸＬ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ４０００ＨＸＬ」
検出器 ：ＲＩ（示差屈折径）
データ処理：東ソー株式会社製「ＧＰＣ−８０２０モデルIIバージョン４．１０」
カラム温度：４０℃
展開溶媒 ：テトラヒドロフラン
流速 ：１．０ｍｌ／分
標準試料 ：前記「ＧＰＣ−８０２０モデルIIバージョン４．１０」の測定マニュアルに準拠して、分子量が既知の下記の単分散ポリスチレンを用いた。
単分散ポリスチレン：
東ソー株式会社製「Ａ−５００」
東ソー株式会社製「Ａ−２５００」
東ソー株式会社製「Ｆ−１」
東ソー株式会社製「Ｆ−４」
東ソー株式会社製「Ｆ−２０」
東ソー株式会社製「Ｆ−１２８」
東ソー株式会社製「Ｆ−３８０」
測定試料 ：樹脂１ｍｇ（溶剤可溶分）をテトラヒドロフラン１ｍｌに溶解させた後、マイクロフィルター（ポアサイズ０．４５μｍ）でろ過したもの（５０μｌ）。
GPC: The molecular weight Mw of dimethylpolysiloxane was measured under the following conditions.
Measuring device: "HLC-8320 GPC" manufactured by Tosoh Corporation
Column: Guard column “HXL-L” manufactured by Tosoh Corporation
+ "TSK-GEL G1000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G3000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G4000HXL" manufactured by Tosoh Corporation
Detector: RI (differential refraction diameter)
Data processing: "GPC-8020 model II version 4.10" manufactured by Tosoh Corporation
Column temperature: 40 ° C
Developing solvent: Tetrahydrofuran flow rate: 1.0 ml / min Standard sample: The following monodisperse polystyrene having a known molecular weight was used in accordance with the measurement manual of "GPC-8020 Model II Version 4.10".
Monodisperse polystyrene:
"A-500" manufactured by Tosoh Corporation
"A-2500" manufactured by Tosoh Corporation
"F-1" manufactured by Tosoh Corporation
"F-4" manufactured by Tosoh Corporation
"F-20" manufactured by Tosoh Corporation
"F-128" manufactured by Tosoh Corporation
"F-380" manufactured by Tosoh Corporation
Measurement sample: 1 mg of resin (solvent soluble) was dissolved in 1 ml of tetrahydrofuran, and then filtered through a microfilter (pore size: 0.45 μm) (50 μl).
Ｃ１ ビスフェノールＡ型エポキシ樹脂、エポキシ当量２０００
Ｄ１ ビニルオキサゾリン５ｗｔ％含有オキサゾリン／スチレン共重合体
Ｅ１ 耐衝撃性付与剤（エチレン（Ｅｔ）／エチルアクリレート（ＥＡ）／無水マレイン酸（Ｍａａｈ）三元共重合体、Ｅｔ／ＥＡ／Ｍａａｈ＝６６／３２／２（質量比））
Ｆ１ ガラス繊維チョップドストランド（Ｅガラス、繊維直径１０μｍ、繊維長３ｍｍ、エポキシ系収束剤）
C1 bisphenol A type epoxy resin, epoxy equivalent 2000
D1 Oxazoline / styrene copolymer containing 5% by weight of vinyl oxazoline E1 Impact modifier (terpolymer of ethylene (Et) / ethyl acrylate (EA) / maleic anhydride (Maah), Et / EA / Maah = 66 / 32/2 (mass ratio)
F1 Glass fiber chopped strand (E glass, fiber diameter 10 μm, fiber length 3 mm, epoxy sizing agent)
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015196819A JP6638297B2 (en) | 2015-10-02 | 2015-10-02 | Polyarylene sulfide resin composition, molded article and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015196819A JP6638297B2 (en) | 2015-10-02 | 2015-10-02 | Polyarylene sulfide resin composition, molded article and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017066344A JP2017066344A (en) | 2017-04-06 |
| JP6638297B2 true JP6638297B2 (en) | 2020-01-29 |
Family
ID=58491747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015196819A Active JP6638297B2 (en) | 2015-10-02 | 2015-10-02 | Polyarylene sulfide resin composition, molded article and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6638297B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3292172B1 (en) | 2015-12-11 | 2023-05-24 | Ticona LLC | Crosslinkable polyarylene sulfide composition |
| CN108368339A (en) | 2015-12-11 | 2018-08-03 | 提克纳有限责任公司 | Polyarylene sulfide composition |
| CN108883600B (en) | 2016-03-24 | 2021-08-06 | 提克纳有限责任公司 | Composite structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3799746B2 (en) * | 1997-06-03 | 2006-07-19 | Ｊｓｒ株式会社 | Thermoplastic resin composition |
| JP5023682B2 (en) * | 2006-12-08 | 2012-09-12 | 東ソー株式会社 | Polyarylene sulfide composition |
| JP5780422B2 (en) * | 2011-07-21 | 2015-09-16 | Dic株式会社 | Polyarylene sulfide resin composition |
| JP6180075B2 (en) * | 2011-09-30 | 2017-08-16 | Dic株式会社 | Polyarylene sulfide resin composition |
-
2015
- 2015-10-02 JP JP2015196819A patent/JP6638297B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017066344A (en) | 2017-04-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6939871B2 (en) | Polyarylene sulfide resin composition, molded article, composite molded article and method for producing composite molded article | |
| JP5618025B2 (en) | Polyarylene sulfide resin composition and molded article | |
| JP6624204B2 (en) | Polyarylene sulfide resin composition, molded article and manufacturing method | |
| JP6797350B2 (en) | Polyarylene sulfide resin composition, molded article and manufacturing method | |
| JP5510624B2 (en) | Polyarylene sulfide resin composition and molded article | |
| JP6536684B2 (en) | Polyarylene sulfide resin composition and manufacturing method | |
| JP6638297B2 (en) | Polyarylene sulfide resin composition, molded article and manufacturing method | |
| JP6809083B2 (en) | Polyarylene sulfide resin compositions, molded articles and methods for producing them | |
| JP6797360B2 (en) | Polyarylene sulfide resin composition, molded article and manufacturing method | |
| JP6886584B2 (en) | Composite molded product and its manufacturing method | |
| JP6753470B2 (en) | Polyarylene sulfide resin composition, molded product and manufacturing method | |
| JP2021080363A (en) | Polyarylene sulfide resin composition, molding, composite molding and method for producing them | |
| JP6886583B2 (en) | Polyarylene sulfide resin composition, molded article and manufacturing method | |
| JP7136381B1 (en) | Polyarylene sulfide resin composition, method for producing polyarylene sulfide resin composition, molded article, method for producing molded article | |
| JP7311051B2 (en) | Polyarylene sulfide resin composition, molded article and method for producing the same | |
| JP7136394B1 (en) | Polyarylene sulfide resin composition, molded article and method for producing the same | |
| JP6315255B2 (en) | Polyarylene sulfide resin composition and molded article thereof | |
| JP7136372B2 (en) | Polyarylene sulfide resin composition, molded article and method for producing the same | |
| JP7070811B1 (en) | Polyarylene sulfide resin compositions, molded articles and methods for producing them | |
| JP2017125215A (en) | Polyarylene sulfide resin composition and molded body thereof | |
| WO2023218850A1 (en) | Polyarylene sulfide resin composition, molded article, and methods for producing said polyarylene sulfide resin composition and molded article | |
| JP6919178B2 (en) | Polyarylene sulfide resin composition and molded article | |
| WO2017033279A1 (en) | Poly(arylene sulfide) resin composition and molded object thereof | |
| WO2022215395A1 (en) | Polyarylene sulfide resin composition, molded article, and methods for producing said polyarylene sulfide resin composition and molded article | |
| JP2024040672A (en) | Polyarylene sulfide resin composition, molded article, and production methods of these |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20180220 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180822 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190516 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190611 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190613 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20190620 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191126 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191209 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 6638297 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |