JP6627659B2 - Heating device and method for manufacturing semiconductor device using the heating device - Google Patents

Description

  The present invention relates to a heating device having a space for accommodating a body to be heated which is always open, and a method for manufacturing a semiconductor device using the heating device.

  2. Description of the Related Art Conventionally, as a heating device for heating an object to be heated, a heating device having a box-shaped heating space and a door, and having a structure in which the heating space is closed by a door, has been often used. However, when the door is opened and the object to be heated is carried into the heating space, the outside air enters the heating space and causes a decrease in the temperature in the heating space. . Therefore, in order to improve the temperature raising performance of the heating device, it is an important issue how to suppress the temperature decrease in the heating space.

  In recent years, a heating device having a configuration in which the above-described door is omitted (hereinafter, referred to as a “normally-opening-type heating device”) has been used for reasons such as frequently putting the object to be heated into and out of the heating space. Is coming. In this case, the heating space is always open, and the inside of the heating space is always exposed to the outside air through the opening, so that the temperature inside the heating space due to the invasion of the outside air becomes more remarkable. As such a constantly open type heating device, for example, a heating device of Patent Document 1 is cited.

  The heating device described in Patent Literature 1 has a box-shaped heating space having an opening that is always open, and a heated body in which the heating space is partitioned by a heating wall, a heat transfer wall, and a heat radiation member. A storage space and a plurality of gas flow paths for supplying an inert gas are provided.

  In the heating space, the heating wall and the heat transfer wall are arranged on the left and right, and the heat radiation members are arranged on the top and bottom. Since the heating space is partitioned by the heating wall, the heat transfer wall, and the heat radiating member in this manner, a space for accommodating the object to be heated is provided. Further, the heating wall and the heat transfer wall are provided with a plurality of gas flow paths for supplying an inert gas.

  Thereby, heat transmitted from the heating wall and the heat transfer wall disposed on the left and right of each storage space is uniformly transmitted to each storage space evenly through the heat radiation members disposed above and below each storage space. Is done. In addition, the inert gas in the gas flow path heated through the heating wall and the heat transfer wall is supplied to each storage space, and the circulation of excess hot air without providing a fan or the like does not occur. This is a heating device of the always-open type in which the heat dissipation is small and the uniformity of the temperature distribution is excellent.

Japanese Patent No. 4553637

  However, the heating device of Patent Document 1 has excellent temperature uniformity in a portion of the heating space away from the opening, but does not take measures against outside air entering the accommodation space from the opening. Therefore, the temperature near the opening decreases due to the invasion of the outside air, and the accommodation space near the opening cannot be effectively used.

  Here, such a continuous opening type heating device is used, for example, to increase the efficiency of manufacturing a semiconductor device. In order to increase the efficiency of the manufacture of this semiconductor device, it is effective to heat more semiconductor devices with a single input to the heating device. For example, in order to throw more objects to be heated, such as semiconductor devices, into the accommodation space, it is necessary to secure a wide area in which the influence of the temperature drop due to the invasion of the outside air does not appear. Specifically, for example, it is conceivable to increase the depth of the accommodation space to increase the size of the heating device, or to set the heating temperature of the accommodation space higher. However, although such a heating device can heat more semiconductor devices with a single input, it is not desirable because the cost for introducing and operating the heating device increases. Therefore, there is a need for a less expensive heating device having a high temperature raising performance and a method of manufacturing a semiconductor device using a heating device having a high temperature raising performance.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a heating device having high temperature-raising performance and a method for manufacturing a semiconductor device using the heating device.

In order to achieve the above object, the heating device according to claim 1 is a space defined by a wall body for heating or heat transfer (22, 23, 24, 25), and a heating target (K1) is provided. A plurality of accommodating spaces (21) are arranged, one surface being a front surface, the other surface being a back surface, a front surface being an opening (21a) which is always open, and a back surface being a back heat insulating plate ( A box-shaped heating furnace (20) closed by 26d), a transfer section (10) for charging and recovering the object to be heated into and out of the accommodation space through an opening in the accommodation space, and An air outlet (29) for sending hot air flowing to the opening, a temperature adjusting unit (30) for adjusting the temperature of the hot air sent from the air outlet to the accommodation space, and an air volume adjusting unit (40) for adjusting the air volume of the hot air. ) and it comprises a temperature adjusting unit, heating Or the wall for heat transfer is separate, Ru flows bottom opening of the bottom receiving space (21b) of the hot air is located at the bottom of the receiving space from (21c) to the outside.

  As described above, by providing a mechanism for flowing hot air from the back of the storage space toward the opening and suppressing the invasion of outside air into the storage space from the opening, even if the heating device is always open, even if the heating device is always open, Temperature can be prevented from lowering. In addition, the hot air is supplied to prevent outside air from entering the accommodation space, and is not used to directly increase the temperature in the accommodation space. There is no need to raise it. Therefore, by providing such a mechanism, it is possible to suppress a decrease in the temperature in the storage space by supplying hot air, and to reduce energy consumption for maintaining the temperature in the storage space. It becomes a heating device.

  A method for manufacturing a semiconductor device according to claim 5 is a method for manufacturing a semiconductor device, wherein a part or all of the semiconductor device is put into a heating device according to any one of claims 1 to 4 and heated. including.

  In the always-open heating device having a high temperature-raising performance, the object to be heated can be sufficiently heated using almost all the space in the accommodation space since the temperature decrease due to the invasion of the outside air is suppressed. In addition, since the heating device is of the always-open type, the work efficiency of heating and recovery when frequently charging and recovering the object to be heated is increased. Therefore, by performing heating in the manufacture of a semiconductor device using such a heating device, heat treatment of many semiconductor devices can be performed by a single input, and a semiconductor device can be efficiently manufactured. .

  In addition, the code | symbol in parenthesis of the said each means shows an example of the correspondence with the concrete means described in embodiment mentioned later.

It is an outline perspective view of a heating device of a 1st embodiment. FIG. 2 is a schematic cross-sectional view illustrating the vicinity of an air outlet of the heating device according to the first embodiment. It is the schematic perspective view which showed the example of arrangement | positioning of the blowing port in the heating device of 1st Embodiment. It is the schematic sectional drawing which showed the conventional always opening type heating apparatus and the flow of the outside air. FIG. 2 is a schematic cross-sectional view illustrating a heating device and a flow of outside air according to the first embodiment. It is a figure which shows the relationship between the conditions of the temperature of hot air, the quantity of hot air, and the time required to heat a to-be-heated body to a set temperature. FIG. 4 is a diagram showing a comparison between an actual temperature measurement result and a simulation result with respect to a heating process and a time required to reach a set temperature when a heating target is put into the heating device of the first embodiment and heated. It is a figure showing the relation between the temperature of the storage space of a heating device, and the temperature of a body to be heated.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, portions that are the same or equivalent are denoted by the same reference numerals and described.

(1st Embodiment)
The always-open heating device S1 (hereinafter, simply referred to as "heating device S1") of the first embodiment will be described with reference to FIGS. Note that, in FIG. 1, a part of the heating device S <b> 1 of the present embodiment, which is a back heat insulating plate 26 d which is located on the back side of the housing space 21 and a plurality of air vents 29 provided on the back heat insulating plate 26 d, are partially described. Or, all are indicated by broken lines. FIG. 2 shows a cross-sectional view of the lower side of the heating device S1 of the present embodiment, and partially omits the configuration of the upper portion of the heating device S1 and the configuration of a temperature adjusting unit 30 described later. .

  The always-open heating device S1 having a high temperature-raising performance heats an object to be heated K1 which constitutes a part or all of the device when manufacturing a semiconductor device such as a pressure sensor mounted on a vehicle such as an automobile. Used for

  First, the overall configuration of the heating device S1 of the present embodiment will be described. The heating device S <b> 1 includes a heating furnace 20 having a plurality of storage spaces 21, a transport unit 10, a blowing port 29 for sending hot air to the storage space 21, a hot air temperature control unit 30, and a hot air flow control unit 40. It is configured.

  First, the transport unit 10 is loaded into the accommodation space 21 with the object to be heated K1 placed thereon, and is collected together with the object to be heated K1 when heating of the object to be heated K1 is completed. The transporting section 10 is fixed in the accommodation space 21 together with the object to be heated K1 by being hooked on a holding groove 28 to be described later of the accommodation space 21, and is made of a metal plate or the like having excellent heat conductivity such as Al. Become. The arrow shown in FIG. 1 indicates a direction Y1 in which the transport unit 10 is inserted into the storage space 21 (hereinafter, referred to as an “injection direction Y1”). The heating target K1 is not particularly limited, and includes, for example, a semiconductor device such as a pressure sensor.

  Next, the heating furnace 20 will be described. The outer shape of the heating furnace 20 is partitioned by heat insulating plates 26a, 26b, 26c, and 26d. The heat insulating plate includes an upper heat insulating plate 26a, a lower heat insulating plate 26b, a side heat insulating plate 26c, and a rear heat insulating plate 26d, and is formed of a heat insulating material having excellent heat resistance and heat insulating properties. The back heat insulating plate 26d is provided with a plurality of air outlets 29.

  The heating furnace 20 is provided with a plurality of storage spaces 21 for heating the object to be heated K1 which are spaces partitioned by walls 22 to 25 for heating or heat transfer, which will be described later. The heating furnace 20 keeps the whole of the plurality of storage spaces 21 at a desired heating temperature at all times when heating the object to be heated K1.

  Next, the walls 22 to 25 will be described in order. The first wall bodies 22 are installed along the vertical direction in a space surrounded by the heat insulating plates 26a to 26d in the heating furnace 20, and are arranged so as to face each other at a distance. Further, the first wall bodies 22 are arranged at a distance smaller than the width of the transport unit 10. The plurality of second wall bodies 23 are arranged in a horizontal direction in a shelf shape at a distance between the first wall bodies 22. As shown in FIG. 2, the third wall 24 is disposed so as to cover the back side of the heating furnace 20, and the lower side of the heating furnace 20 of the third wall 24, that is, the plurality of storage spaces 21. A plurality of blow holes 29 for blowing hot air, which will be described later, are provided in a portion facing the lowermost one. The fourth wall 25 is disposed so as to cover the upper surface and the lower surface of the heating furnace 20. These wall bodies 22 to 25 are made of a metal such as Al having excellent thermal conductivity and have a plate shape.

  As described above, the individual storage spaces 21 partitioned by the respective wall bodies 22 to 25 each have one surface of the heating furnace 20 as a front surface, an opposite surface to the one surface as a back surface, and the front surface as an opening 21a which is always open, The back surface is closed by a back heat insulating plate 26d except for a blow port 29 described later. That is, the accommodation space 21 is formed as a rectangular parallelepiped box-shaped space that is open on the front side and closed on the back side. As shown in FIG. 1, the plurality of storage spaces 21 are divided into a vertical direction in which the upper heat insulating plate 26a and the lower heat insulating plate 26b of FIG. 1 face each other and two side heat insulating plates 26c of FIG. A grid-like array is arranged along the horizontal direction which is the facing direction. In FIG. 1, the plurality of accommodation spaces 21 form a 4 × 3 lattice arrangement of four in the vertical direction and three in the horizontal direction.

  Next, as shown in FIG. 1, an electric heater 27 is provided in any of the first to fourth walls 22 to 25, here, in the first wall 22. The electric heater 27 is for maintaining each accommodation space 21 in the heating furnace 20 at a desired heating temperature.

  Next, a holding groove 28 is provided on a surface of the first wall 22 facing the other first wall 22. Specifically, as shown in FIGS. 1 and 2, the holding groove 28 extends along the loading direction Y <b> 1 on the inner surface of the first wall 22, and holds another facing first wall 22. The groove is provided at the same height as the groove 28. In addition, the distance between the first wall bodies 22 in the portion where the holding groove 28 is formed is wider than the width of the transport unit 10, so that the transport unit 10 can be inserted and held.

  Next, the air outlet 29 will be described. A plurality of air outlets 29 are arranged in a horizontal direction so as to penetrate the back heat insulating plate 26d and the third wall 24 of the heating device S1. In the present embodiment, a hot air pipe 31 for feeding hot air, which will be described later, is connected to the blow port 29, and the hot air pipe 31 has a temperature adjusting unit 30 that adjusts the temperature of the hot air and an air flow rate of the hot air. The air volume adjusting unit 40 to be adjusted is connected. The hot air pipe 31 is made of a pipe material having excellent heat resistance and heat insulation.

  Further, an example of the arrangement of the air outlets 29 will be described with reference to FIG. In FIG. 3, the lowermost storage space 21b (hereinafter, referred to as “lowest storage space 21b”) of the plurality of storage spaces 21 arranged on the back of the heating furnace 20 in the vertical direction. An example in which a plurality of air outlets 29 are provided on the back side is shown. FIG. 3 is a perspective view in which the second wall body 23 located on the upper surface side of the housing space 21 is omitted, and shows a state where the transport unit 10 on which the body to be heated K1 is loaded.

  Hot air is blown into the storage space 21 from a plurality of air outlets 29 through a hot air pipe 31 for sending hot air, and the hot air flows from the back side to the opening 21a and flows to the outside. Accordingly, it is possible to prevent the outside air from entering the storage space 21 and suppress a decrease in the temperature of the storage space 21. There is no particular limitation on the arrangement of the air outlets 29, but it is preferable to provide a plurality of air outlets 29 so as to be arranged in a horizontal direction. This is because, by providing the plurality of air outlets 29 so as to be arranged in a horizontal direction, the hot air can easily flow evenly, and the more uniformly the hot air flows, the more easily the outside air can enter the housing space 21.

  Further, it is more preferable that the air outlet 29 is installed at a position adjacent to the lowermost accommodation space 21b. As will be described later, it is the lowermost accommodation space 21b that the outside air is most likely to invade, and the provision of the air outlet 29 at a position adjacent to the lowermost accommodation space 21b makes the heating device S1 with high temperature raising performance. Is considered to be the most effective.

  Note that the flow of the hot air may be circulated in the housing space 21, but the hot air eventually flows into at least the opening 21 c of the lowermost housing space 21 b (hereinafter, referred to as “the lowermost opening 21 c”) of the openings 21 a. ) Does not need to be particularly controlled.

  Next, the temperature adjustment unit 30 will be described. The temperature adjuster 30 adjusts the temperature of the hot air based on the temperature difference between the lowermost opening 21c of the lowermost accommodation space 21b and an arbitrary location on the back side. As the temperature adjustment unit 30, a device for performing heating for increasing the hot air temperature and stopping the heating based on Expressions 3 and 4 described later is used. The device may be any device capable of heating or stopping the heating, and a known heater product or the like may be used.

  Next, the air volume adjusting unit 40 will be described. The air volume adjustment unit 40 adjusts the volume of hot air based on the difference between the temperature of the lowermost opening 21 c of the storage space 21 and the temperature of the first wall 22. As the air volume adjustment unit 40, a device that increases or decreases the air volume of the hot air based on Expressions 5 and 6 described below is used. This device may be any device that can adjust the air volume, and a known fan product or the like can be used.

  Here, the effect of the heating device S1 provided with a mechanism for sending hot air from the back side of the lowermost accommodation space 21b to the lowermost opening 21c will be described with reference to FIGS. 4 and 5. FIG. 4 shows a cross-sectional view of a conventional always-open heating device in which a mechanism for sending hot air to the storage space 21 is not provided. FIG. 5 shows a cross-sectional view of the heating device S1 of the present embodiment including a mechanism for sending hot air from the back to the lowermost opening 21c in the lowermost accommodation space 21b. 4 and 5 are cross-sectional views of one row in the vertical direction of a normally open type heating device having four storage spaces 21 in the vertical direction, and all of the storage spaces 21 are heated. The state where the transport unit 10 on which the body K1 is placed is shown.

  In the conventional always-open heating device, when the warmed air in the four storage spaces 21 flows to the outside, an upward airflow 50 shown in FIG. 4 is generated. Of the four storage spaces 21, three of the four storage spaces other than the lowermost storage space 21 b are in a state in which the outside air 60 is unlikely to enter due to the upward airflow 50 generated from the storage space 21 located on the lower side. On the other hand, in the lowermost accommodation space 21b, there is no flow of the updraft 50 that prevents the intrusion of the outside air 60, so that the outside air 60 is easily invaded. As a result, the outside air 60 enters the lowermost accommodation space 21b, and a temperature drop occurs in a portion near the lowermost opening 21c. As a result, the heating target K1 placed in the lowermost accommodation space 21b and located at a position near the lowermost opening 21c is not sufficiently heated. Therefore, in order to raise the temperature of the lowermost accommodation space 21b, for example, it is necessary to take extra measures such as extra heating, and for the lowermost accommodation space 21b, putting the object to be heated K1 only in a portion near the back side. Therefore, problems such as the heating device consuming extra energy or the number of objects to be heated K1 that can be heated in a single input are reduced.

  On the other hand, the heating device S1 of the present embodiment includes a mechanism for sending hot air flowing from the back side of the lowermost accommodation space 21b to the lowermost opening 21c. Specifically, the third wall body 24 and the back heat insulating plate 26d located on the back side of the lowermost accommodation space 21b are provided with an air blowing port 29 through which hot air is blown. Then, as shown in FIG. 5, the hot air is sent to the lowermost accommodation space 21 b through the air outlet 29. In this manner, the hot air flows from the back side of the lowermost accommodation space 21b toward the lowermost opening 21c, and flows out from the lowermost opening 21c to the outside, so that the rising airflow 70 due to the hot air is generated. Since the inflow of the outside air 60 into the lowermost accommodation space 21b is prevented by the rising airflow 70 due to the hot air, a decrease in temperature due to the invasion of the outside air 60 into the lowermost accommodation space 21b can be suppressed. Thus, even if the heated object K1 is placed near the lowermost opening 21c of the lowermost accommodation space 21b, the object to be heated K1 can be sufficiently heated, and all the accommodation spaces 21 can be effectively utilized.

  Further, this hot air is for suppressing the intrusion of the outside air 60 into the lowermost storage space 21b among the storage spaces 21, and is not for directly heating the heated body K1. Therefore, the temperature of the hot air may be set to a temperature that does not excessively lower the temperature in the lowermost accommodation space 21b, and may be lower than the set temperature of the lowermost accommodation space 21b. Thereby, the temperature raising performance of the always-open heating device can be improved with more energy saving. Therefore, by providing a mechanism for sending the hot air from the rear side of the lowermost storage space 21b and flowing it from the lowermost opening 21c, the heating device itself can be enlarged or a means for sending an excessively high-temperature hot air can be separately provided. Without providing, it is possible to provide the heating device S1 having high temperature raising performance. In other words, by providing the above-described mechanism for sending hot air to the always-open heating device, the heating device S1 having a high temperature-raising performance can be obtained at lower cost.

  Next, the relationship between the temperature and the amount of hot air in the heating device S1 of the present embodiment and the temperature rise time of the object to be heated K1 installed in the heating device S1 will be described with reference to FIG. In FIG. 6, the transporting unit 10 on which the heating target K1 is placed is placed in the lowermost accommodation space 21b of the heating device S1, and the target temperature of the heating target K1 is indicated by a broken line under each condition of the temperature of the hot air and the amount of the hot air. (140 ° C.) is shown as a relative numerical value. Specifically, in FIG. 6, the time required for the heated body K1 to reach 140 ° C. from room temperature under the condition that the amount of hot air is zero is 100% (hereinafter referred to as “reference time”). The display of the ratio in FIG. 6 is based on the time required for the heated body K1 to reach 140 ° C. from room temperature under the conditions of the hot air temperature and the hot air volume (hereinafter, referred to as “required time”). It is expressed relative to time. That is, when the air volume of the hot air reaches the set temperature in a shorter time than when the air volume of the hot air is zero when it is smaller than 100%, and when the air volume of the hot air is zero when it is larger than 100%. This means that the heated object K1 reaches the set temperature in a longer time than that. Although FIG. 6 shows an example in which the set temperature is set to 140 ° C., another set temperature may be used, and the concept of the reference time and the required time at that time is the same as above.

  Further, since it is not realistic to actually measure the temperature for all the detailed conditions, the results shown in FIG. 6 were obtained by simulation. Note that as the simulation software, for example, “FloTHERM”, a three-dimensional CFD (Computational Fluid Dynamics: abbreviation for Computational Fluid Dynamics) software manufactured by Mentor Graphics Japan, can be used. Further, other general-purpose three-dimensional CFD software may be used. However, it is necessary to confirm the accuracy of the result obtained by the simulation with respect to the result obtained by the actual measurement.

  Therefore, as shown in FIG. 7, the heating target A and the heating target B are put into the heating device S1, and the results of actual temperature measurement when the temperature is raised from room temperature to the set temperature of 140 ° C. are obtained by simulation. The data were compared with 21 points. In FIG. 7, the data shown by the solid line shows the actual temperature measurement results of the heated objects A and B, and the square data (□) of the point data shows the simulation result of the heated object A, and the circle data (○). () Shows the simulation result of the object to be heated B. The calculation of data by the simulation software is performed at intervals of 50 seconds. The objects to be heated A and B are semiconductor devices having different shapes.

  Comparing the actual measurement results with the results of the simulation, although there is a slight difference in the heating process between the heated objects A and B, the time to reach the set temperature was almost the same. Therefore, it can be considered that the values of the temperature and the arrival time obtained as a result of the simulation have little deviation from the actually measured values.

  In the lowermost accommodation space 21b, up to a position at least about 70 to 80 mm away from the lowermost opening 21c, the temperature of the body to be heated K1 lowers with respect to the set temperature of the lowermost accommodation space 21b due to intrusion of outside air. I know that. Therefore, the position of the object to be heated K1 whose temperature is to be measured is set at a position 60 mm away from the lowermost opening 21c to the rear side. The reference time is about 30 minutes. Further, areas are divided according to the numerical values of the required time under each condition in FIG. 6, and each area is designated as A to H, respectively.

  First, for a region A having a hot air temperature of 105 ° C. or more and less than 150 ° C. and a hot air flow rate of 2 L / min or more and less than 8 L / min, the required time is 80%, and the set temperature is shortened by 20% shorter than the reference time. 140 ° C. was reached.

  In the region B where the hot air temperature is 125 ° C. or more and less than 150 ° C. and the hot air flow rate is 8 L / min or more and less than 13 L / min, the required time is 65%, and the set temperature is 140 ° C. in a time 35% shorter than the reference time. Reached.

  In the area C where the hot air temperature is 105 ° C. or more and less than 125 ° C. and the hot air flow rate is 8 L / min or more and less than 13 L / min, the required time is 70%, and the set temperature is 140 ° C. in a time 30% shorter than the reference time. Reached.

  In a region D having a hot air temperature of 135 ° C. or more and less than 150 ° C. and a hot air flow rate of 13 L / min or more, the required time was 60%, and reached the set temperature of 140 ° C. in a time 40% shorter than the reference time.

  In the region E where the hot air temperature is 125 ° C. or more and less than 135 ° C. and the hot air flow rate is 13 L / min or more and less than 20 L / min, the required time is 70%, and the set temperature is 140 ° C. in a time 30% shorter than the reference time. Reached.

  For the region F where the hot air temperature is 105 ° C. or more and less than 125 ° C., and the hot air flow rate is 13 L / min or more and less than 16 L / min, and the hot air temperature is 115 ° C. or more and less than 125 ° C. and the hot air flow rate is 16 L / min or more and less than 18 L / min. And the required time was 90%. Under the conditions in this region, the temperature reached the set temperature of 140 ° C. in a time 10% shorter than the reference time.

  In a region G having a hot air temperature of 125 ° C. or more and less than 135 ° C. and a hot air flow rate of 20 L / min or more, the required time was 80%, and reached the set temperature of 140 ° C. in a time 20% shorter than the reference time.

  Hot air temperature 100 ° C or more and less than 105 ° C, and hot air flow rate 13L / min or more and hot air temperature 105 ° C or more and less than 115 ° C, and hot air flow rate 16L / min or more and less than 18L / min and hot air temperature 105 ° C or more and less than 125 ° C In the area H where the hot air flow rate is 18 L / min or more, the required time exceeds 100%. Under the conditions in this region, the temperature reached the set temperature of 140 ° C. in a time longer than the reference time.

  By flowing the hot air flowing from the lowermost opening 21c from the back of the lowermost accommodation space 21b in this way, it is possible to prevent outside air from entering the lowermost accommodation space 21b. As a result, it was confirmed that the heated object K1 placed in the lowermost accommodation space 21b could reach the set temperature of the lowermost accommodation space 21b in a shorter time than in the condition of zero air flow. However, if the temperature of the hot air is excessively lowered or the air volume of the hot air is excessively increased, the temperature in the lowermost accommodation space 21b is prevented from rising. It is necessary to select appropriate conditions.

  Further, as the temperature of the hot air is set higher, the time required to reach the set temperature of the lowermost accommodation space 21b is shortened, but the energy required for raising the temperature is increased, so that the energy consumption of the heating device S1 is reduced. Increase. Therefore, in the heating device S1 having a high temperature raising performance, in order to further reduce the energy consumption of the device, it is necessary to select the condition of the temperature of the hot air and the amount of the air while taking energy efficiency into consideration.

  Here, the energy efficiency will be described. FIG. 6 shows the relationship between the conditions of the temperature of the hot air and the amount of the hot air and the time required for the heated body K1 to reach the set temperature. However, although the required time is shorter, the energy consumption is easily reduced and the temperature raising performance can be improved, but when energy efficiency is also taken into consideration, any condition can be applied to the hot air as long as the required time is shorter. Do not mean.

  Specifically, the energy consumption tends to decrease as the required time decreases, while the energy consumption tends to increase as the temperature of the hot air and the amount of the hot air increase. That is, of the regions A to H, a mechanism for sending hot air is used for a region where the reduction in energy consumption due to the reduction of the reference time is larger than the increase in consumption energy required for the temperature and the amount of hot air. Higher energy efficiency than non-equipped heating devices. According to this concept, the region A having a hot air temperature of 125 ° C. or lower in the region A, the region B having a hot air temperature of 140 ° C. or lower in the region B, and the region C, particularly the region C are regions having the highest energy efficiency. In other regions, although a result of increasing the temperature raising performance is obtained, the energy efficiency is lower than those regions.

  More specifically, the ratio between the reduction in energy consumption by shortening the reference time (hereinafter referred to as “reduced energy X”) and the increase in energy consumption due to hot air (hereinafter referred to as “increased energy Y”) is expressed as It can be used as an index of energy efficiency. The reduced energy X (unit: Wh) is the energy of the heating furnace that can be reduced by the amount of time required to reach the set temperature, and can be expressed by the following equation.

X = heating furnace power × (reference time−required time) Equation 1
The increased energy Y (unit: Wh) is the heater power required to generate hot air, that is, the energy required to heat a sufficient amount of air to be sent into the heating furnace as hot air from room temperature to hot air temperature. Can be represented.

Y = air volume × density × (hot air temperature−room temperature) × specific heat...
In Equation 2, the product of the air volume and the density indicates the amount of air to be sent, and the value obtained by subtracting the room temperature from the hot air temperature indicates the temperature rise of the air. Then, by multiplying the amount of air, the temperature rise of the air, and the specific heat, the energy required to heat the amount of air sent as hot air to the hot air temperature is obtained. The value of X / Y is calculated from X and Y obtained by the above equation. The larger the value of X / Y, the larger the reduced energy X with respect to the increased energy Y, that is, it indicates that the energy efficiency is higher. Therefore, this can be used as an index of energy efficiency.

  Assuming that X / Y when the heating furnace power is 2 kWh is calculated, for example, in the area A of the hot air temperature of 105 ° C. to 140 ° C. and the air flow of 7 L / min, X = 400, Y = 13 to 18, X / Y = 22-31. X = 700, Y = 21, 23, and X / Y = 34, 31 for the hot air temperature of 130 ° C. and 140 ° C. and the air volume of 1010 L / min in the region B. X = 600, Y = 16, 18, and X / Y = 38, 34 for hot air temperatures of 105 ° C. and 115 ° C. and a flow rate of 10 L / min in the area C. X = 600, Y = 29 and X / Y = 21 for the hot air temperature of 130 ° C. and the air volume of 14 L / min in the region E. By performing such calculations and comparing the energy efficiencies of the respective regions in FIG. 6, the energy efficiencies of the region A of the hot air temperature of 140 ° C. or lower in the region A, the region B of the hot air temperature of 140 ° C. or lower of the region B, and the region C are obtained. Was high. In each of the regions, the lower the hot air temperature was, the larger X / Y tended to be. Further, the tendency regarding the value of X / Y in each region was the same even when the heating furnace power was changed, and the energy efficiency of the regions A, B, and C was high, and particularly the energy efficiency of the region C was high.

  Therefore, in the region shown in FIG. 6, it is preferable to select the condition of the region A having a hot air temperature of 125 ° C. or lower in the region A, the region B having a hot air temperature of 140 ° C. or lower in the region B, and the region C. In particular, the region C is selected. Is more preferable. The amount of energy consumption reduction by shortening the temperature rise time is greater than the amount of energy consumption increase by sending hot air separately to the storage space 21, and the heating device S1 with high temperature rise performance can be obtained at low cost as a whole. Because.

  Next, the temperature adjustment of the hot air in the temperature adjustment unit 30 will be described. When the following expression 1 is satisfied, the temperature adjustment unit 30 performs adjustment for increasing the temperature of the hot air.

A + 40 <C ... Equation 3
A in Expression 3 is a temperature (° C.) near the lowermost opening 21 c in the lowermost accommodation space 21 b, and C is a temperature (° C.) at an arbitrary position of the first heating wall 22. . These temperatures are measured by, for example, a thermocouple. Specifically, for example, when the temperature is measured by a thermocouple, for A, a thermocouple is installed near the lowermost opening 21c of the second wall 23 located on the lower surface of the lowermost accommodation space 21b. , And the temperature measured thereby is denoted by A. As for C, for example, a thermocouple is installed at a position on the back side of the first wall 22 located on the side surface of the lowermost accommodation space 21b, and the temperature measured by this is C. When a thermocouple or the like for temperature adjustment is provided in the first wall 22, the temperature measured by this may be set to C.

  C is almost the same numerical value as the set temperature in the lowermost accommodation space 21b. When the difference between A and C is less than 40 ° C., for example, when the set temperature is 140 ° C., the difference between the temperature of the heated body K1 near the lowermost opening 21c and the set temperature is less than 5 ° C. is there. However, when the difference between A and C is equal to or more than 40 ° C., that is, when Expression 3 is satisfied, for example, when the set temperature is 140 ° C., the temperature of the heated object K1 close to the lowermost opening 21c and the set temperature Is 5 ° C. or more. In this state, as described later, the time until the temperature of the object to be heated K1 is raised to the set temperature becomes long. Therefore, in order to sufficiently heat the object to be heated K1, the object to be heated K1 must be added to the accommodation space 21 for the time required for the temperature increase, and the working efficiency of the heating step is reduced. descend. Therefore, in order to prevent this, adjustment is performed to increase the temperature of the hot air in order to help increase the temperature of the lowermost accommodation space 21b and increase the temperature of the heated body K1.

  Here, the relationship between the temperature of the heated body K1 and the temperature of the storage space 21 will be described with reference to FIG. FIG. 8 is a graph showing a relationship between the temperature of the housing space 21 and the temperature of the heated body K1 when the heated body K1 is put into the housing space 21. In FIG. 8, the time region is conveniently divided into X, Y, and Z according to the degree of increase in the temperature of the storage space 21. Note that the set temperature in FIG. 8 indicates the set temperature of the storage space 21.

  In the X region where the temperature of the storage space 21 is low, the temperature is increased so as to reach the set temperature, and the degree of the temperature increase of the storage space 21 is high. In the area Y where the temperature of the storage space 21 approaches the set temperature, the degree of the temperature rise of the storage space 21 tends to gradually decrease as the temperature of the storage space 21 approaches the set temperature. After that, the temperature of the storage space 21 reaches the set temperature, and becomes a Z region in which a steady state is reached.

  On the other hand, the temperature of the heated body K1 starts increasing with a delay from the temperature increase of the accommodation space 21. However, the tendency of the temperature of the heated body K1 to rise is the same as the tendency of the temperature of the storage space 21 to rise. Therefore, in the X region and the Y region, the temperature of the heated body K1 rises in the same tendency as the temperature rise of the storage space 21. Thereafter, in the Z region in which the temperature of the housing space 21 has reached the set temperature, the temperature of the heated body K1 reaches the set temperature with a slight delay as shown in FIG.

  The state in which the temperature of the heated object K1 has decreased by about 5 ° C., that is, the state in which the temperature of the accommodation space 21 has decreased due to the invasion of the outside air, corresponds to the Y region in FIG. It takes an extra long time for the temperature to reach the set temperature. Therefore, in order to solve this problem, it is necessary to increase the temperature of the hot air to suppress a decrease in the temperature of the housing space 21 due to the invasion of the outside air, and to assist in raising the temperature of the housing space 21.

  The upper limit of the temperature of the hot air is not particularly limited, but it is sufficient that the temperature does not exceed the set temperature of the storage space 21, but it is preferable that the temperature is as low as possible. This is because, even when the temperature of the hot air is increased, the heating device S1 having a high temperature raising performance is obtained, but the energy efficiency is reduced as described above. For example, when the set temperature of the storage space 21 is 140 ° C., the upper limit of the temperature of the hot air may be about 135 ° C.

  The above adjustment may be performed even when Expression 3 is satisfied and the difference is very small, for example, when C− (A + 40) ≦ 1, but C− (A + 40)> 5. It is preferable to adjust the temperature of the hot air when satisfying the conditions. This is because the more strictly the temperature of the hot air is managed, the higher the energy consumption of the heating device S1 becomes, and the higher the operating cost becomes.

  On the other hand, when the following expression 4 is satisfied, adjustment for lowering the temperature of the hot air is performed.

A + 40 ° C ... Equation 4
When Equation 4 is satisfied, the temperature of the heated body K1 near the lowermost opening 21c does not excessively decrease, so that it is not necessary to increase the temperature of the hot air. Therefore, when Equation 4 is satisfied, the temperature of the hot air is adjusted to lower so that energy for maintaining the temperature of the lowermost accommodation space 21b is not consumed more than necessary.

  The lower limit of the temperature of the hot air is not particularly limited, but it is sufficient that the temperature of the storage space 21 is not lowered. For example, when the set temperature of the storage space 21 is 140 ° C., The lower limit may be about 105 ° C. In addition, for almost the same (≒) in the expression 4, for the same reason as described in the description of the expression 1, when C- (A + 40) ≦ 5, the temperature of the hot air is adjusted to be lowered. Is preferred.

  Further, the number of measurements of A and C may be one each, or may be plural as necessary.

  Next, the adjustment of the amount of hot air in the air amount adjusting unit 40 will be described. When the following expression 5 is satisfied, the air volume adjustment unit 40 performs adjustment to increase the air volume of the hot air.

A <B ... Equation 5
A in Equation 5 is the temperature (° C.) of the lowermost opening 21c of the lowermost accommodation space 21b, as in Equation 1, and B in Equation 5 is the temperature near the rear side of the lowermost accommodation space 21b. Temperature (° C.) at an arbitrary position. These temperatures are measured with, for example, a thermocouple. Specifically, A is as described in the description of the temperature adjustment unit 30, and B is a thermocouple at a position near the back of the second wall 23 located on the lower surface of the lowermost accommodation space 21b. The temperature is measured as B. When Expression 5 is satisfied, the temperature near the lowermost opening 21c is reduced due to the outside air having entered the lowermost accommodation space 21b. Therefore, the adjustment to increase the flow rate of the hot air for preventing the entry of the outside air is performed. Do.

  The upper limit of the amount of hot air is not particularly limited, but it is sufficient that the hot air for heating the lowermost accommodation space 21b is not expelled to the outside, but a smaller amount is preferable. If the air volume is too high, even the hot air for heating the heated body K1 will be pushed out from the lowermost opening 21c, and the required time will be rather long. For example, when the set temperature of the accommodation space 21 is 140 ° C., the upper limit of the amount of hot air may be about 20 L / min.

  On the other hand, when the following Expression 6 is satisfied, an adjustment to reduce the amount of hot air is performed.

A ≒ B ... Equation 6
When Expression 6 is satisfied, there is almost no temperature difference between the lowermost opening 21c and the back side of the lowermost accommodation space 21b, which means that the temperature does not decrease due to invasion of outside air. Therefore, in order to reduce energy consumption, adjustment is made to reduce the amount of hot air.

  Note that the lower limit of the amount of hot air is not particularly limited, and may be temporarily set to zero. This is because, by preventing unnecessary consumption of energy, the heating device S1 has a higher temperature raising performance.

  Regarding the temperature difference between A and B in the determination as to whether or not Expressions 5 and 6 are satisfied, the flow rate of hot air may be adjusted even if the temperature difference is small, but will be described in Expressions 3 and 4. For the same reason as described above, it may be performed at about 5 ° C. as a guide. Further, the number of measurements of A and B may be one each, or may be plural if necessary.

  The temperature adjustment and the air volume adjustment are performed, for example, by computer control, but may be performed continuously or intermittently.

  As described above, by providing the mechanism for sending hot air that prevents the intrusion of outside air into the lowermost accommodation space 21b, the temperature adjustment unit 30 and the air volume adjustment unit 40 for the hot air, the temperature in the lowermost accommodation space 21b due to the invasion of outside air is provided. The heating device S1 having a high temperature raising performance can be prevented from lowering.

(Other embodiments)
In addition, the heating device S1 shown in each embodiment described above is an example of the heating device S1 of the present invention, and is not limited to each embodiment described above, and is described in the claims. It can be changed appropriately within the range.

  For example, as for the heating device S1 of the first embodiment, an example in which the position of the air outlet 29, the temperature measurement location used for adjusting the temperature of the hot air, and the temperature used for air volume adjustment, and the like are limited to the lowermost accommodation space 21 has been described. However, the installation position, the measurement place, and the like may be not only the lowermost storage space 21b but also the storage space 21 other than the lowermost storage space 21b.

  Specifically, FIG. 5 shows an example in which the air outlet 29 is provided only in the lowermost accommodation space 21b. However, it is sufficient that the hot air flows to the outside from the lowermost opening 21c of the lowermost accommodation space 21b. . For this reason, the air outlet 29 may be provided at any part of the back side of the heating furnace 20, but may be provided not only at the back side but also at another location within the heating furnace 20.

  Further, FIG. 5 shows an example in which the air outlet 29 is provided in the lowermost accommodation space 21b, and the accommodation spaces 21 are separated from each other by the first wall 22 and the second wall 23. However, the first wall body 22 and the second wall body 23 may be arranged such that the hot air flows out of the lowermost opening 21c as well as the other openings 21a to the outside. For example, the first wall 22 that divides the storage spaces 21 arranged in the horizontal direction may be arranged so as not to touch the third wall 24. In addition, the second wall 23 that partitions the storage spaces 21 arranged in the vertical direction may be arranged so as not to touch the third wall 24. In addition, the arrangement of the first wall body 22 and the second wall body 23 may be appropriately changed so that the hot air flows partially into the upper accommodation space 21 including the lowermost accommodation space 21b.

  In addition, the number of the air outlets 29 is not necessarily plural, and may be only one as long as the hot air can be easily dispersed in the housing space 21 evenly. Specifically, one rectangular ventilation port 29 may be provided. Further, the shape of the air outlet 29 is not limited to a square shape, but may be various shapes such as a circular shape, an elliptical shape, and a triangular shape.

  FIG. 1 shows an example in which, of the temperature adjustment unit 30 and the air volume adjustment unit 40 connected to the hot air pipe 31, the temperature adjustment unit 30 is disposed near the accommodation space 21. Then, these arrangements may be reversed. Further, in a case where the temperature adjustment unit 30 or the air volume adjustment unit 40 is directly connected to the air outlet 29 and the temperature adjustment unit 30 and the air volume adjustment unit 40 are connected, the hot air piping 31 is not required. Good.

  In addition, FIG. 1 shows an example in which the temperature adjustment unit 30 and the air volume adjustment unit 40 are separately provided, but they may be configured integrally.

  The locations for measuring the temperatures A, B, and C used for the determination of the hot air temperature adjustment and the air volume adjustment are not limited to one location, but may be a plurality of locations. Further, if necessary, the temperature of a place other than the lowermost accommodation space 21b may be measured, and the temperature and amount of hot air may be adjusted for the temperature of the other accommodation space 21.

  In addition, for example, the semiconductor device is efficiently manufactured by using such a normally open heating device S1 having a high temperature-raising performance for heating in the manufacture of a semiconductor device such as a pressure sensor mounted on a vehicle such as an automobile. be able to. More specifically, the constant opening type structure increases the work efficiency of charging and collecting the heated body K1. In addition, since the temperature decrease of the housing space 21 due to the invasion of the outside air is suppressed, it is possible to sufficiently heat the object to be heated K1 in almost all spaces of the housing space 21 in a shorter time. As a result, the efficiency of heating and collecting more objects to be heated K1 can be increased. Therefore, by including the heating of the object to be heated K1 which constitutes a part or the whole of the semiconductor device by the heating device S1 in the manufacture of the semiconductor device, an efficient method of manufacturing the semiconductor device can be obtained.

Reference Signs List 10 Conveying section K1 Heated body 21 Housing space 22-25 Wall 26 Insulating plate 27 Electric heater 28 Holding groove 30 Temperature adjusting section 40 Air volume adjusting section S1 Heating device

Claims (5)

A plurality of housing spaces (21) for housing a body to be heated (K1), which are partitioned by walls for heating or heat transfer (22, 23, 24, 25), are arranged. A box-shaped heating furnace (20) having a front surface, a surface opposite to the one surface as a back surface, an opening (21a) with the front surface always open, and a back surface closed by a back heat insulating plate (26d). When,
A transfer unit (10) that inputs and recovers the object to be heated into and from the storage space through an opening of the storage space;
An air outlet (29) for sending hot air flowing to the opening through the housing space;
A temperature adjustment unit (30) that adjusts the temperature of the hot air sent from the air outlet to the storage space;
An air volume adjusting unit (40) for adjusting the air volume of the hot air ,
The temperature adjustment unit is separate from the wall for heating or heat transfer,
The hot air flows out Ru heating apparatus to the outside from the bottom opening (21c) of the lowermost accommodation space (21b) located at the bottom of the accommodating space. In the temperature adjusting section, when the temperature at the lowermost opening of the housing space is A (° C.) and the temperature of the heating or heat transfer wall is C (° C.),
When A + 40 <C is satisfied, the temperature of the hot air is adjusted so as to increase the temperature of the wall for heating as an upper limit,
The heating device according to claim 1, wherein when A + 40 ≧ C is satisfied, the heating device is adjusted to lower the temperature of the hot air. In the air volume adjusting unit, when the temperature at the lowermost opening of the accommodation space is A (° C.), and the temperature of the back surface of the lowermost accommodation space of the accommodation space is B (° C.) ,
When A <B holds, adjust to increase the air volume,
3. The heating device according to claim 1, wherein when A ≧ B is satisfied, the air volume is adjusted so as to decrease. The heating device according to claim 1, wherein a temperature of the hot air is lower than a temperature of the heating wall .   A method for manufacturing a semiconductor device, comprising: supplying a part or all of the semiconductor device to a heating device according to any one of claims 1 to 4, and heating the semiconductor device.

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