JP6618501B2 - Method for reducing the volume of PCB contaminants - Google Patents

Description

  The present invention relates to pretreatment of PCB contaminants to be processed in a plasma melting furnace provided in a PCB processing facility.

  Conventionally, as a method for treating PCB (polychlorinated biphenyl) which is a nonflammable insulator, a method is known in which PCB contaminants are introduced into a plasma melting furnace provided in a PCB treatment facility, and the PCB contaminants are melted and decomposed. (For example, refer to Patent Document 1).

  Patent Document 1 discloses a PCB contaminant pretreatment method in which a PCB contaminant contained in a carry-in storage container carried into a PCB treatment facility is refilled into a refill container for input into a plasma melting furnace. . It is described that when refilling into a refill container for input, classification according to the type of PCB contaminants enables batch input in units of refill containers for input and stable operation of the plasma melting furnace. Yes.

JP 2010-179239 A

  In the conventional PCB contaminant pretreatment method, the total amount of PCB contaminants charged into the plasma melting furnace is equal to the total amount of PCB contaminants before being refilled into the refill container for input. That is, the amount of PCB contaminants that can be processed per unit time in the plasma melting furnace is the same as before the refilling container for refilling, and there is room for improvement from the viewpoint of processing efficiency.

  In addition, since the carry-in storage container that is carried into the PCB processing facility includes a member having a low PCB concentration that does not need to be processed in the PCB processing facility, the volume and quantity of the carry-in storage container are increased. The efficiency of loading PCB contaminants into PCB processing facilities is poor. Therefore, there is a demand for a method for reducing the volume of PCB contaminants that can increase the efficiency of carrying PCB contaminants into the plasma processing facility and increase the processing efficiency of plasma processing.

  A method for reducing the volume of PCB contaminants is a method for reducing the volume of a ballast that has been contaminated with PCB stored in a storage container in a storage before bringing it into a PCB processing facility. Cutting the ballast inside a sealed chamber provided at a location different from the PCB processing facility, and separating the ballast into a capacitor area including a capacitor containing PCB and a transformer section area including a transformer section; And a refilling step of refilling the capacitor region separated in the cutting step into a refilling container before carrying it into the PCB processing facility.

  The ballast is filled with a filler such as asphalt between the capacitor including the PCB and the transformer, and the capacitor region and the transformer region can be easily separated. Therefore, in this method, the ballast is separated by cutting the capacitor region having a high PCB concentration and the transformer region having a low PCB concentration in a cutting process. And the capacitor area | region where PCB density | concentration is high is refilled by the refill container. As a result, if this refill container is carried into the plasma processing facility, the total volume of the ballast for plasma processing is reduced, so that the processing efficiency of the plasma processing can be increased.

  Moreover, if the total volume of the ballast for plasma processing is reduced, the weight and quantity of the refill container carried into the PCB processing facility can be reduced, and the carrying-in efficiency can be increased. As described above, a PCB contaminant volume reduction method that can increase the efficiency of carrying PCB contaminants into the plasma processing facility and increase the plasma processing efficiency can be provided.

  Another method is that the sealed chamber is provided in a vehicle disposed outside the storage.

  In this method, the sealed chamber is provided in a vehicle disposed outside the storage. In other words, if the vehicle is moved to a location close to the storage, the storage container can be quickly taken out to the sealed chamber, so that the volume reduction processing efficiency of the ballast taken out from the storage container is increased. Can do. In addition, since the vehicle can be moved to any place as long as the vehicle has a sealed room, it is not necessary to provide a sealed room separately for each storage place scattered throughout the country, which is highly convenient.

  Another characteristic configuration is that the refill container is filled with a basicity adjusting agent and has a shape that can be charged into a plasma melting furnace of the PCB processing facility.

  By the way, although a nonflammable substance is made into slag by plasma treatment, it is known that ferric oxide having a high melting point reduces the fluidity of slag. For this reason, the process which improves the fluidity | liquidity of slag by adding a basicity adjusting agent to PCB contaminant is performed. At this time, since the number of ballasts to be plasma-treated is reduced, the amount of basicity adjusting agent added can be saved. Therefore, since the total amount (stabilizer + basicity adjusting agent) to be melted by plasma is reduced, it is possible to further increase the processing efficiency of the ballast that is rendered harmless by the plasma processing. Moreover, if the refill container is configured in a shape that can be charged into the plasma melting furnace, it is not necessary to refill the plasma processing facility again, and convenience is enhanced.

  Another method is that the method further includes a determination step of determining the PCB concentration of the ballast or the transformer section region by odor.

  There is a possibility that PCB contained in the capacitor leaks out even in the ballast before cutting or in the transformer region where the PCB concentration is relatively low. Therefore, in this method, the PCB concentration in the transformer region is determined by odor. As a result, it is possible to quickly determine the PCB concentration in the ballast or transformer region, omitting an unnecessary cutting step of the ballast having a high PCB concentration, or transforming the transformer portion having a high PCB concentration in the transformer region. By performing plasma treatment only on the region, the volume reduction efficiency of the ballast can be increased.

  Another method is that the ballast or the transformer region, which has been determined that the PCB concentration exceeds the reference concentration in the determination step, is charged into the refill container.

  In this method, since the ballast or the transformer section where it is determined that the PCB concentration has exceeded the reference concentration is put into the refill container, the plasma treatment can be appropriately performed without leaking the high-concentration PCB. it can.

  The other method further includes a reanalysis step of reanalyzing the PCB concentration of the transformer region, in which the PCB concentration is determined to be equal to or lower than the reference concentration in the determination step, and the PCB concentration has a reference value in the reanalysis step. It is in the point which throws in the said refilling container the said transformer part area | region which exceeded.

  In this method, the PCB concentration is further reanalyzed for the transformer region determined to have a PCB concentration equal to or lower than the reference concentration, and the transformer region where the PCB concentration exceeds the reference value is put into the refill container. As a result, it is possible to appropriately perform plasma processing without reliably leaking high concentration PCB. In addition, since only the transformer section region in which the PCB concentration is determined to be equal to or lower than the reference concentration due to odor is reanalyzed, it is possible to suppress a reduction in volume reduction processing efficiency.

It is a conceptual diagram explaining the pre-processing method of PCB contaminant. It is the schematic which shows a ballast. It is a figure which shows the volume reduction method of the PCB contaminant which concerns on 1st embodiment. It is a figure which shows the PCB processing method which concerns on another Example 1 of 1st embodiment. It is a figure which shows the PCB processing method which concerns on another Example 2 of 1st embodiment. It is a figure which shows the PCB processing method which concerns on another Example 3 of 1st embodiment. It is a figure which shows the volume reduction method of the PCB contaminant which concerns on 2nd embodiment.

  Hereinafter, embodiments of a method for reducing the volume of PCB contaminants according to the present invention will be described with reference to the drawings. In this embodiment, an example of melting and decomposing the ballast 2 using the plasma melting furnace 1 will be described as an example of a method for reducing the volume of PCB contaminants. However, the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the invention.

[Basic configuration of plasma melting furnace]
The PCB processing facility Z includes a plasma melting furnace 1. The plasma melting furnace 1 contains PCB-contaminated electrical equipment (stabilizer 2, transformer, condenser, etc.), operating waste (work clothes, rubber gloves, waste cloth, etc.), pressure-sensitive copying paper, sludge, insulating oil, etc. It is a detoxifying device.

  As shown in FIG. 1, the plasma melting furnace 1 includes a charging port 11 for charging a refill container C (for example, a drum can or a pail can) containing PCB contaminants, and a plasma treatment of the PCB contaminants for melting and decomposition. And a processing unit 12 that performs processing. The input port 11 is formed with a pressing portion 11b (pusher) for transferring the refill container C horizontally placed in the rolling direction inside the chamber 11a to the processing portion 12, and a time (for example, 30) during which PCB contaminants are melted and decomposed. Minutes) elapses, the next refill container C is put into the processing unit 12.

  The processing unit 12 has a plasma torch 12a, and a plasma arc having a center temperature of 15,000 degrees or more is generated by continuously supplying air or the like to the plasma torch 12a and applying electric energy. At this time, the in-furnace temperature is maintained at about 1,400 degrees, the PCB is decomposed, and incombustible materials such as metals are melted to generate slag S. When the refill container C and the PCB contaminant are melted and decomposed, the processing section 12 is tilted by the tilting section 12b, and the slag S is discharged to the slag storage container 13.

  Although a constant temperature chamber, a bag filter, a catalytic reaction tower, and an activated carbon tank are provided in this order on the downstream side of the plasma melting furnace 1 of the PCB processing facility Z, illustration is omitted. The constant temperature chamber is for decomposing dioxins contained in processing the gas generated from the plasma melting furnace 1. The bag filter adsorbs or removes trace amounts of harmful organic substances and acidic gases such as HCl contained in exhaust gas. The catalytic reaction tower decomposes dioxins in exhaust gas with a catalyst such as titanium oxide and decomposes NOx by adding ammonia gas. The activated carbon tank adsorbs the harmful organic substance when the harmful organic substance remains in the exhaust gas.

[First embodiment]
Hereinafter, the first embodiment will be described. As shown in FIGS. 1 to 3, the method for reducing the volume of PCB contaminants according to this embodiment is a ballast 2 contaminated with PCB stored in a storage container H at a storage facility X (storage facility). Is a pre-processing method for reducing the volume before carrying the product into the PCB processing facility Z. In this method of reducing the volume of PCB contaminants, the ballast 2 is cut inside a sealed chamber Y provided at a location different from the storage facility X and the PCB processing facility Z, and the capacitor includes the capacitor 22 containing PCB. The cutting process for separating the area 2A and the transformer section 2B (the area other than the capacitor area 2A) including the transformer section 21 and the capacitor area 2A separated in the cutting process before being carried into the PCB processing facility Z, A refilling step of refilling the refilling container C. Moreover, the determination process which determines the PCB density | concentration of the ballast 2 before the cutting | disconnection or the transformation | transformation part area | region 2B with an odor is provided. In the present embodiment, the storage container H and the refill container C are configured as different containers. However, when the storage container H has the same shape as the refill container C, the refill container C in the present embodiment. The capacitor region 2A may be refilled in the storage container H as

  As shown in FIG. 1, a plurality of storage containers H containing PCB contaminants are stored in the storage place X. The storage container H mainly stores electrical equipment such as a ballast 2, a transformer, and a capacitor. In this embodiment, the volume of the ballast 2 stored in the storage container H is reduced before being carried into the PCB processing facility Z. This is because in order to increase the plasma processing efficiency in the plasma melting furnace 1, it is required to reduce the volume of the ballast 2 processed in the PCB processing facility Z.

  As shown in FIGS. 1 and 3, the storage container H is unloaded from the storage place X and moved to the sealed chamber Y. The sealed chamber Y in the present embodiment is composed of a sealed container fixed to a vehicle disposed outside the storage X. As a result, if the vehicle is moved to a place close to the storage place X, the storage container H can be quickly carried out to the sealed chamber Y. Therefore, the volume of the ballast 2 taken out from the storage container H is reduced. The processing efficiency can be increased. Moreover, since it can move to any place if it is a vehicle provided with the sealed room Y, it is not necessary to provide the sealed room Y for every storage place X scattered all over the country, and the convenience is high. In addition, the sealed chamber Y may be configured as a fixed type, and the sealed chamber Y may be provided for each storage facility X scattered throughout the country.

  Next, the ballast 2 is taken out from the storage container H moved to the sealed chamber Y, and the ballast 2 is divided into a capacitor region 2A and a transformer part region 2B and then cut. At this time, in this embodiment, the weight difference determination may be performed in order to specify the cutting position of the ballast 2.

  Below, the cutting process of the ballast 2 will be described.

  As shown in FIG. 2, the ballast 2 includes a transformer unit 21 including an iron core and a coil that are magnetic materials, and a capacitor 22 including PCB as an insulating oil. The ballast 2 is a filling type in which a filling material 23 such as resin or asphalt is filled between the transformer 21 and the capacitor 22. The ballast 2 may be an external type in which a capacitor region 2A including a capacitor 22 is attached to a transformer region 2B including the transformer 21.

  In the ballast 2, the transformer part 21 and the capacitor 22 are disposed in both side regions along the longitudinal direction, and a gap 23 between the transformer part 21 and the capacitor 22 is filled with a filler 23. Further, the transformer 21 including the iron core has a larger weight than the capacitor 22, and the capacitor 22 has a smaller occupied area in plan view than the transformer 21, and is one side from the center line T in the longitudinal direction. It is arranged to be biased.

  Therefore, after the ballast 2 is received in the sealed chamber Y, the weight difference determination for dividing the capacitor region 2A is performed based on the weight difference between the two side regions with the center line T of the ballast 2 as the boundary. Specifically, if a support member 31 (for example, a rod-like member) is disposed along the center line T of the ballast 2, the transformer region 2B is lowered by gravity, and the capacitor region 2A is raised accordingly. This increased region (the side with the smaller weight) is determined as the capacitor region 2A. Next, the transformer region 2B and the capacitor region 2A are set to a predetermined ratio (for example, 1: 1 or 3: 2), and the ballast 2 is placed at the center line T or a position between the center line T and the capacitor 22. The capacitor region 2A and the transformer part region 2B are sorted by cutting. As a result, the capacitor 22 is not accidentally cut, and thus PCB leakage can be reliably prevented. Note that the weight difference determination and the cutting step may be performed manually or automatically. The weight difference determination is not particularly limited, and the weight of the capacitor region 2A and the transformer region 2B may be measured after cutting along the center line T, and the lighter weight may be identified as the capacitor region 2A.

Returning to FIGS. 1 and 3, the capacitor region 2 </ b> A of the ballast 2 is refilled with a refill container C having a shape (size) that can be charged into the plasma melting furnace 1, and is loaded into the PCB processing facility Z. . At this time, it is preferable to add basicity adjusting agents such as silica sand (SiO ₂ ), quicklime (CaO), calcium carbonate (CaCO ₃ ) to the refill container C. Thereby, the fluidity | liquidity of the slag S produced | generated with the plasma melting furnace 1 can be improved. Moreover, since the weight of the ballast 2 plasma-processed by the cutting process is reduced, the amount of basicity adjusting agent added can be saved. Accordingly, since the total amount to be melted by plasma (stabilizer 2 + basicity adjusting agent) is reduced, it is possible to further increase the treatment amount of the stabilizer 2 that is rendered harmless by the plasma treatment. In addition, the basicity adjusting agent may be added to the refilling container C in the PCB processing facility Z without adding the basicity adjusting agent to the refilling container C in the sealed chamber Y, and is not particularly limited.

  Next, in the PCB processing facility Z, the refill container C in which the capacitor region 2 </ b> A is packed together with the basicity adjusting agent is subjected to plasma processing in the plasma melting furnace 1. At this time, since the refill container C is configured in a shape that can be charged into the plasma melting furnace 1, it is not necessary to refill the PCB processing facility Z again, which is highly convenient. The slag S generated by the plasma processing is subjected to graduation judgment whether the PCB concentration is below the reference value, and those judged to be harmless are subjected to appropriate disposal such as landfill disposal or reuse as resources. Conversely, if the PCB concentration does not clear the reference value in the graduation determination, the plasma processing is performed again. The vehicle that carries the refill container C into the PCB processing facility Z may be a vehicle having the sealed chamber Y, or the refill container C is moved to another transport vehicle and then carried into the PCB processing facility Z. You may do it.

  On the other hand, the transformer region 2B cut in the cutting process has a low PCB concentration, and it is not necessary to process it at the PCB processing facility Z if it is originally, but it may contain PCB leaked out from the capacitor 22. In the determination step, odor determination processing is executed. As mentioned above, PCB is an insulating oil and has a sweet and characteristic odor. Therefore, in this embodiment, the odor determination process is performed using an oil odor sensor that expresses the odor intensity with a numerical value in response to the odor component of the oil. This oil odor sensor is described in Tomoaki Kamiyama et al., “River Oil Contamination Monitoring by Quartz Crystal Sensor Sensitive Oil Odor Sensor”, Journal of EICA, Vol. 8, No. 3, 2003, p16-20. In addition, it has a sensitive membrane that specifically adsorbs to the target substance. Here, the PCB concentration in the transformer part region 2B in the odor determination is determined by comparing a reference value (5,000 mg / kg or less) that can be incinerated at a detoxification treatment certified facility with a reference concentration converted to odor intensity.

  If the PCB concentration in the transformer region 2B exceeds the reference concentration by the odor determination, the transformer region 2B is refilled into the refill container C together with the capacitor region 2A. Subsequent steps are the same as those of the capacitor region 2A described above, and thus detailed description thereof is omitted. On the other hand, if the PCB concentration in the transformer region 2B is equal to or lower than the reference concentration, the transformer region 2B is incinerated. As a result, it is possible to determine the transformer part region 2B where the PCB has leaked out, so that there is no risk of accidentally incinerating the transformer part region 2B containing the high-concentration PCB. be able to. Moreover, since the area | region which should be processed in the PCB processing plant | facility Z among the ballasts 2 is determined rapidly by odor determination, the volume reduction process efficiency of the ballast 2 can be improved.

[Variation 1 of the first embodiment]
As shown in FIG. 4, a reanalyzing step for reanalyzing the PCB concentration in the transformer region 2 </ b> B determined by the odor determination that the PCB concentration is not more than a reference value (5,000 mg / kg) may be further provided. Specifically, in the above-described odor determination process, the transformer part region 2B, in which the PCB concentration is determined to be equal to or lower than the reference concentration, is carried out to an analysis place different from the sealed chamber Y. Next, in the reanalysis step, it is determined whether or not the analysis value of the transformer part region 2B is equal to or lower than the reference concentration. Here, the reanalysis process was described in “Measurement Method for Waste Containing Low Concentration PCB (2nd Edition)” (Ministry of the Environment Minister's Secretariat Waste and Recycling Countermeasures Department, Industrial Waste Division, September 2014) It is performed by any one of a content test, a surface wiping test, and a surface extraction test, or in combination.

  If the analysis value of the transformer part region 2B is equal to or less than the reference value, incineration is performed. On the other hand, if the analysis value of the transformer part region 2B exceeds the reference value, the refill container C is refilled. The refill container C may be the same container as the refill container C in which the capacitor region 2A described above is refilled, or the transformer unit region 2B may be combined with a basicity adjusting agent or transformed into a different refill container C. Only the partial area 2B may be refilled. Next, the refill container C in which the transformer part region 2 </ b> B having a high PCB concentration is packed together with the basicity adjusting agent is carried into the PCB processing facility Z and subjected to plasma processing in the plasma melting furnace 1. In this modification, by providing the reanalysis step, there is no risk of leaking high-concentration PCBs, and plasma processing can be performed appropriately. Moreover, since only the transformer section region 2B determined to be below the reference concentration due to odor is reanalyzed, it is possible to suppress a decrease in volume reduction processing efficiency. Since other operations and effects are the same as those of the first embodiment, detailed description thereof is omitted.

[Modification 2 of the first embodiment]
As shown in FIG. 5, the method further includes a crushing step of crushing the transformer part region 2B determined by the odor determination to have a PCB concentration equal to or lower than a reference concentration, and a magnetic separation step of magnetically selecting the transformer part region 2B after crushing. May be. Specifically, the transformer part region in which the PCB concentration is determined to be equal to or lower than the reference concentration is transported and crushed using a crusher (not shown). Subsequently, a magnetic separator (not shown) that separates the magnetic material by magnetic force separates the magnetic material (iron, etc.) and the non-magnetic material (resin, aluminum, asphalt, etc.). The selected magnetic material is washed with a hydrocarbon solvent or the like. Since the magnetic substance has a relatively low PCB concentration, it can be rendered harmless by a cleaning process. Next, a graduation judgment is made as to whether or not the PCB concentration is below a reference value, and appropriate disposal is performed such that what is judged harmless is reused as a resource. On the contrary, if the PCB concentration does not clear the reference value in the graduation determination, the cleaning process is performed again. At this time, the solvent used in the washing step is reused by distillation in the system. As the cleaning method, ultrasonic cleaning, immersion cleaning, stirring cleaning, vacuum heating separation, or the like is performed alone or in combination as appropriate.

On the other hand, since the selected non-magnetic material has a relatively high PCB concentration, it is packed together with a basicity adjusting agent such as silica sand (SiO ₂ ), quicklime (CaO), calcium carbonate (CaCO ₃ ), or only non-magnetic material. The refill container C is refilled, and the refill container C is subjected to plasma processing in the plasma melting furnace 1. According to the second modification, the amount of PCB contaminants that are plasma-treated is reduced by the amount of the magnetic material contained in the transformer region 2B separated by the cutting process. Since the ballast 2 has a magnetic material capacity ratio of more than half, the treatment efficiency of the ballast 2 that is rendered harmless by one plasma treatment is approximately doubled. Moreover, since the amount of iron to be plasma-treated is reduced by the magnetic separation process, the amount of basicity adjusting agent added can be saved. Since other operations and effects are the same as those of the first embodiment, detailed description thereof is omitted. In addition, you may perform the reanalysis process of the modification 1 before a crushing process, and it does not specifically limit.

  Although not shown, the method for reducing the volume of PCB contaminants may further include a removal step of removing impurities such as resin and asphalt attached to the magnetic material magnetically selected in the magnetic separation step. In this removal process, washing, sieving, wind sorting, specific gravity sorting, optical sorting, etc. can be considered. It is also conceivable to remove impurities by bringing silica sand into contact with the magnetic material. Specifically, the magnetic substance and the silica sand are accommodated in a predetermined container, and the container is vibrated or the silica substance is sprayed on the magnetic substance to peel off the impurities adhering to the magnetic substance. At this time, washing, sieving, wind sorting, specific gravity sorting, optical sorting, etc. may be used in combination. Moreover, you may reuse the silica sand used at the removal process as a basicity adjusting agent. The removing step is not particularly limited, and the magnetic substance may be sandblasted with other particles without using silica sand, or impurities may be removed by chemical treatment.

[Modification 3 of the first embodiment]
As shown in FIG. 6, before cutting the ballast 2, a pre-determination step of determining the PCB concentration of the ballast 2 by odor may be further provided. This pre-determination step is a step of performing odor determination on the ballast 2 taken out from the storage container H, and classifying the ballast 2 into a ballast 2 having a high possibility of PCB leakage and a ballast 2 having a low possibility of PCB leakage. is there. Specifically, the above-described oil odor sensor is used to determine the PCB concentration of the ballast 2 by comparing it with a prior determination reference concentration (an example of a reference concentration). This pre-judgment reference concentration may be a reference concentration obtained by converting a reference value (5,000 mg / kg or less) that can be incinerated as described above into an odor intensity, or a safety factor (eg, 1.2). It is good also as a value which multiplied.

  If the PCB concentration of the ballast 2 exceeds the pre-judgment reference concentration by the pre-judgment step, there is a high possibility that the contamination has spread to the transformer region 2B, so the ballast 2 is refilled with the refill container C. To the PCB processing facility Z. As a result, an unnecessary cutting process can be omitted, and a cutting process that causes an increase in PCB contamination can be avoided. On the other hand, if the PCB concentration of the ballast 2 is less than or equal to the prior determination reference concentration, the process proceeds to the cutting step described above. Since the subsequent steps and operational effects are the same as those of the first embodiment, detailed description thereof is omitted.

[Second Embodiment]
As shown in FIG. 7, the method for reducing the volume of PCB contaminants in the present embodiment is a ballast inside a sealed chamber Y provided at a location different from the storage facility X (storage facility) and the PCB processing facility Z. 2 is cut and separated into a capacitor area 2A including a capacitor 22 containing PCB and a transformer section area 2B (an area other than the capacitor area 2A) including a transformer section 21, and is loaded into a PCB processing facility Z A refilling step of refilling the refill container C with the capacitor region 2A separated in the cutting step. Further, a cleaning process for cleaning the transformer part region 2B and an analysis process for analyzing the PCB concentration in the transformer part region 2B are provided. Since the cutting process and the refilling process are the same as those in the first embodiment described above, detailed description thereof is omitted.

  In the cleaning process, the transformer section region 2B is cleaned with a hydrocarbon solvent or the like. As the cleaning method, ultrasonic cleaning, immersion cleaning, stirring cleaning, vacuum heating separation, or the like is performed alone or in combination as appropriate. Note that the solvent used in the cleaning step may be reused by distillation in the system. Next, the cleaned transformer region 2B is carried out to an analysis place different from the sealed chamber Y. Then, in the analysis step, it is determined whether or not the analysis value of the transformer part region 2B is equal to or less than a reference value (5,000 mg / kg). Since this analysis process is the same method as the reanalysis process of the modification 1 of 1st embodiment mentioned above, detailed description is abbreviate | omitted. In this embodiment, since the determination process by odor is omitted, it is not quick, but it is advantageous in that the volume of the ballast 2 can be reduced at a low cost.

[Other Embodiments]
(1) Each process in the above-described embodiment may be appropriately combined or omitted. For example, a determination step (including a preliminary determination step) and a reanalysis step by odor may be omitted, or a crushing step and a magnetic separation step may be provided after the analysis step in the second embodiment.
(2) In the embodiment described above, the storage container H is carried out from the storage place X and moved to the sealed chamber Y. However, the ballast 2 is taken out from the storage container H at the storage place X, and predetermined safety measures are taken. In addition, the ballast 2 itself may be moved to the sealed chamber Y.
(3) In the determination process by odor and the preliminary determination process, the odor of the transformer section 2B is determined using the oil odor sensor. However, the odor may be determined using another device, and a predetermined safety measure is taken. In addition, the odor determination may be performed visually or by smell, and the method of odor determination is not particularly limited.
(4) Instead of the cutting step, the ballast 2 may be separated into the capacitor 22 and other regions by disassembling with a tool or the like.

  The method for reducing the volume of PCB contaminants according to the present invention can be used as a pretreatment method for plasma treatment of a ballast.

2 Ballast 2A Capacitor area 2B Transformer area 21 Transformer 22 Capacitor C Refill container H Storage container X Storage room Y Sealed room Z PCB processing facility

Claims (6)

To plasma treatment, a volume reduction how to reduce the total volume of ballast contaminated with PCB,
A determination step of determining the PCB concentration of the ballast by odor;
Cutting the ballast inside the sealed chamber, and separating the capacitor into a capacitor region including a capacitor containing PCB and a transformer unit region including a transformer unit;
A refilling step of reducing the total volume of the ballast refilled in the refilling container by refilling the capacitor region separated in the cutting step with the refilling container to be plasma-treated. ,
A method for reducing the volume of PCB contaminants, wherein the ballast, in which the PCB concentration is determined to be lower than the reference concentration in the determination step, is cut in the cutting step and separated into the capacitor region and the transformer region. To plasma treatment, a volume reduction how to reduce the total volume of ballast contaminated with PCB,
Cutting the ballast inside the sealed chamber, and separating the capacitor into a capacitor region including a capacitor containing PCB and a transformer unit region including a transformer unit;
A determination step of determining by odor the PCB concentration of the transformer section separated in the cutting step;
A refilling step of reducing the total volume of the ballast refilled in the refilling container by refilling the capacitor region separated in the cutting step with the refilling container to be plasma-treated. ,
Wherein said transformer region determined to PCB concentration exceeds the reference concentration determination step, volume reduction method of the refill Refill is that PCB contaminants together with the capacitor region in the refill container in the process.   The method for reducing the volume of PCB contaminants according to claim 1 or 2, wherein the sealed chamber is provided in a vehicle disposed outside a storage where the ballast is stored.   The PCB refill container according to any one of claims 1 to 3, wherein the refill container is filled with a basicity adjusting agent and is configured to be put into a plasma melting furnace of a PCB processing facility. Volume reduction method. Volume reduction of the determining step the ballast PCB concentration is determined to exceed the reference density in, PCB contamination of claim 1, which is instead packed together with the capacitor region in the refill container in the refill process Method. A reanalyzing step of reanalyzing the PCB concentration of the transformer part area determined in the determining step that the PCB concentration is equal to or lower than the reference concentration;
Wherein said transformer region of PCB concentration exceeds the reference value in the re-analysis process, volume reduction method of PCB contaminants, wherein said in claim 2, are re-packed with the capacitor region in the refill container in the refill process .

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