JP6457012B2 - Ballast refill method - Google Patents

Description

  The present invention relates to a ballast refilling method for refilling a ballast as a PCB contaminant into a container for plasma treatment.

  Conventionally, as a method for treating PCB (polychlorinated biphenyl) which is a non-flammable insulator, a method is known in which PCB contaminants are introduced into a plasma melting furnace and the PCB contaminants are melted and decomposed (for example, Patent Document 1). reference).

  The PCB processing method of Patent Document 1 includes a step of refilling a PCB contaminant contained in a storage container with a container having a size that can be charged into a plasma melting furnace, and crushing an empty storage container or the like with a crusher. A process, and a PCB contaminant refilled in a container, a crushed storage container, and the like are charged into a plasma melting furnace to melt and decompose the PCB. Also, in Patent Document 1, PCB contaminants exceeding the unit weight of supply to the plasma melting furnace among electrical devices such as ballasts are cut by specifying the position of the gap between the capacitor and the transformer using an X-ray inspection device. After that, the container is refilled.

JP 2012-139669 A

  In the conventional PCB processing method, the amount of PCB contaminants introduced into the plasma melting furnace is equivalent to the total amount of PCB contaminants before being refilled or crushed into a container. That is, the amount of PCB contaminants that can be processed per unit time in the plasma melting furnace is the same as that before refilling the container, and there is room for improvement from the viewpoint of processing efficiency.

  Further, when the cutting position of the ballast or the like is specified by the X-ray inspection apparatus, the apparatus cost increases. Therefore, a refilling method for a ballast that can increase the processing efficiency of plasma processing by a simple method is desired.

  The ballast refilling method according to the present invention is characterized in that a ballast having a transformer and a capacitor including a PCB is divided into a capacitor region including the entire capacitor and a transformer region including the transformer. A cutting process for cutting, and a refilling process for refilling the capacitor region and a part of the transformer part region into a container for plasma processing.

  In this configuration, the capacitor region having a high PCB concentration and the transformer region having a low PCB concentration are separated by a cutting process, and the capacitor region and a part of the transformer region are refilled with a container for plasma processing. .

  As a result, the amount of PCB contaminants to be plasma-treated is reduced by the weight of the remaining portion of the transformer that cannot be refilled in the container. For this reason, the processing efficiency of plasma processing can be increased by a simple method such as cutting and refilling.

  By the way, although a nonflammable substance is made into slag by plasma treatment, it is known that ferric oxide having a high melting point reduces the fluidity of slag. For this reason, the process which improves the fluidity | liquidity of slag by adding a basicity adjusting agent to PCB contaminant is performed. At this time, since the number of ballasts to be plasma-treated is reduced, the amount of basicity adjusting agent added can be saved. Therefore, since the total amount (stabilizer + basicity adjusting agent) to be melted by plasma is reduced, it is possible to further increase the processing amount of electrical equipment that is rendered harmless by plasma processing.

  Another characteristic configuration is that the cutting step cuts the ballast with the side having a smaller weight based on the weight difference between the two side regions bordered by the center line with respect to the longitudinal direction of the ballast as the capacitor region. .

  Generally, in an electric device including a PCB such as a ballast, a capacitor and a transformer are arranged in both side regions along the longitudinal direction, and a gap is formed in each region. In addition, the transformer including the iron core has a large weight compared to the capacitor. For this reason, as in this configuration, if the capacitor side is the lighter side based on the weight difference between the two side regions with respect to the center line with respect to the longitudinal direction of the electrical device, the capacitor region remaining in the cutting process can be easily obtained. Can be identified. As a result, the capacitor region can be reliably transferred to the disassembly process. In this way, the capacitor region can be reliably determined by a simple method and plasma processing can be performed.

  Another characteristic configuration is that the cutting step sets the capacitor area and the transformer section area at a predetermined ratio to cut the ballast.

  For example, the ballast has an area occupied by the capacitor region in a plan view that is smaller than that of the transformer, and is disposed so as to be biased to one side of the center line along the longitudinal direction. That is, if the ballast is cut by setting the capacitor region and the region other than the capacitor region to a predetermined ratio such as 2: 3 as in this configuration, the capacitor is not damaged. For this reason, since the process of specifying the cutting position of the ballast by using an X-ray inspection apparatus as in the prior art can be omitted, it is extremely simple.

  According to another feature of the present invention, an insertion device is provided to be inserted at a plurality of locations along the longitudinal direction of the ballast, and the cutting step is configured such that an area between the transformer unit and the capacitor is inserted into the insertion resistor of the insertion device. The ballast is cut after being identified based on the above.

  In the present configuration, for example, an insertion instrument composed of a needle member or the like is pierced into an electric device, and a portion having a low insertion resistance is specified as a gap between the transformer and the capacitor. Therefore, compared with the conventional case where the cutting position is specified using an X-ray inspection apparatus, it is only necessary to prepare an insertion instrument, so that the apparatus cost can be reduced.

It is the schematic which shows a PCB processing apparatus. It is a figure which shows the PCB processing method which concerns on 1st embodiment. It is explanatory drawing which shows the adjustment method of the addition amount of a basicity adjusting agent. It is a figure which shows the PCB processing method which concerns on another Example 1 of 1st embodiment. It is a figure which shows the PCB processing method which concerns on another Example 2 of 1st embodiment. It is the schematic which shows a ballast. It is a figure which shows the PCB processing method which concerns on 2nd embodiment. It is a figure which shows the PCB processing method which concerns on another Example 1 of 2nd embodiment. It is a figure which shows the PCB processing method which concerns on another Example 2 of 2nd embodiment. It is a schematic explanatory drawing which shows the identification method of a cutting position. It is the schematic which shows the plasma melting furnace which concerns on 3rd embodiment. It is a figure which shows the gas amount curve of generated gas. It is a figure which shows the flowchart of a PCB process.

Embodiments of a PCB processing method according to the present invention will be described below with reference to the drawings.
In the present embodiment, an example of melting and decomposing PCB contaminants using the plasma melting furnace 1 will be described as an example of the PCB processing method. However, the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the invention.

[Basic configuration of PCB processing apparatus]
PCB processing equipment X is harmless for PCB contaminated electrical equipment (stabilizer, transformer, condenser, etc.), operating waste (work clothes, rubber gloves, waste cloth, etc.), pressure-sensitive copying paper, sludge, insulating oil, etc. It is a device to convert. As shown in FIG. 1, the PCB processing apparatus X includes a plasma melting furnace 1, and as an exhaust gas processing facility provided on the downstream side of the plasma melting furnace 1, a constant temperature chamber 3, a temperature reducing tower 4, a bag filter 5, The catalyst reaction tower 6 and the activated carbon tank 7 are provided.

  The plasma melting furnace 1 includes an input port 11 into which a container C (for example, a drum can or a bale can) containing PCB contaminants is charged, and a processing unit 12 that plasma-treats and decomposes PCB contaminants. . The inlet 11 is formed with a pressing part 11b (pusher) for transferring the container C placed in the rolling direction inside the chamber 11a to the processing part 12, and a time (for example, 30 minutes) during which PCB contaminants are melted and decomposed. After the elapse of time, the next container C is charged into the processing unit 12.

  The processing unit 12 has a plasma torch 12a, and a plasma arc having a center temperature of 15,000 degrees or more is generated by continuously supplying air or the like to the plasma torch 12a and applying electric energy. At this time, the in-furnace temperature is maintained at about 1,400 degrees, the PCB is decomposed, and incombustible materials such as metals are melted to generate slag S. The slag S is discharged to the slag storage container 13 by tilting the processing section 12 by the tilting section 12b when the container C or PCB contaminant is melted and decomposed.

  The constant temperature chamber 3 is maintained at about 1,200 degrees, and decomposes the dioxins even if the generated gas from the plasma melting furnace 1 contains dioxins. The temperature reducing tower 4 cools the exhaust gas supplied from the constant temperature chamber 3 with, for example, water or air to prevent resynthesis of dioxins.

  The bag filter 5 removes dust in the exhaust gas and blows in activated carbon or slaked lime to adsorb or react and remove a trace amount of harmful organic substances and acidic gas such as HCl contained in the exhaust gas. The catalytic reaction tower 6 decomposes dioxins in the exhaust gas with a catalyst such as titanium oxide and decomposes NOx by adding ammonia gas. The activated carbon tank 7 functions as a safety net for adsorbing this harmful organic substance by the filled activated carbon even if a harmful organic substance remains in the exhaust gas.

[First embodiment]
Hereinafter, the first embodiment will be described. As shown in FIG. 2, the PCB processing method according to the present embodiment sorts the electric device including the PCB into a crushing step and crushing the electric device into a magnetic material and a non-magnetic material. A magnetic separation step and a decomposition step of melting and decomposing the non-magnetic material by plasma treatment.

Here, a ballast 2 having a transformer part 21 including an iron core and a coil, which are magnetic materials, and a capacitor 22 including PCB as an insulating oil as shown in FIG. 6 is assumed as an electric device.
The ballast 2 is filled with a filler 23 such as resin or asphalt between the transformer 21 and the capacitor 22. The electrical device may be a transformer or a capacitor including a magnetic material and a non-magnetic material, and the electrical device and the operating waste may be accommodated in the container C and may be plasma-treated, and is not particularly limited. .

As shown in FIG. 2, the ballast 2 is first received and crushed using a crusher (not shown). Subsequently, a magnetic separator (not shown) that separates magnetic materials by magnetic force separates magnetic materials (iron, etc.) and non-magnetic materials (resin, aluminum, asphalt, etc.). The selected magnetic material is cleaned with a hydrocarbon solvent or the like (cleaning step). Since the magnetic substance has a relatively low PCB concentration, it can be easily rendered harmless by a cleaning process. Next, a graduation determination is made as to whether or not the PCB concentration is equal to or lower than a reference value, and appropriate disposal is performed such that what is determined to be harmless is reused as a resource. On the contrary, if the PCB concentration does not clear the reference value in the graduation determination, the cleaning process is performed again. At this time, the solvent used in the washing step is reused by distillation or the like in the system.
As the cleaning method, ultrasonic cleaning, immersion cleaning, stirring cleaning, vacuum heating separation, or the like is performed alone or in combination as appropriate.

  On the other hand, since the selected non-magnetic material has a relatively high PCB concentration, it is packed in the container C together with a basicity adjusting agent such as silica sand (SiO 2), quicklime (CaO), calcium carbonate (CaCO 3), and the plasma melting furnace. In step 1, plasma processing is executed. The slag S generated by the plasma processing is subjected to graduation judgment whether the PCB concentration is below the reference value, and those judged to be harmless are subjected to appropriate disposal such as landfill disposal or reuse as resources. Conversely, if the PCB concentration does not clear the reference value in the graduation determination, the plasma processing is performed again.

  By the way, since iron is contained in the container C, or iron is not completely removed by crushing and magnetic separation in a non-magnetic material, it is oxidized with a melting point higher than the furnace temperature when plasma-treated. Ferric iron (Fe 2 O 3) is generated, and the slag S may be fixed in the furnace. In order to prevent this, in the present embodiment, a predetermined amount of the basicity adjusting agent to be added is determined according to the amount of iron mixed in the non-magnetic material, and the ferric oxide contained in the slag S is determined. An adjustment step for adjusting the amount of the basicity adjusting agent added according to the amount is provided.

As shown in FIG. 3, first, the iron content of the PCB contaminant contained in the container C is measured.
Next, the addition amount of the basicity adjusting agent is determined according to the iron content. In determining the addition amount of the basicity adjusting agent, the input amount of the basicity adjusting agent with respect to the iron content may be mapped, or the total weight of the slag S is predicted, and ferric oxide with respect to the total weight of the slag S The weight may be calculated to be a predetermined value (for example, 60% or a value of 60% or less). Next, the PCB contaminant to which the basicity adjusting agent is added is subjected to plasma treatment, and the weight ratio of ferric oxide contained in the slag S generated at this time is measured. Next, the addition amount of the basicity adjusting agent is adjusted (feedback control) so that the measured weight ratio of ferric oxide becomes a predetermined value.

  By this adjustment step, the amount of basicity adjusting agent added can be corrected to an appropriate value, and excessive addition of basicity adjusting agent can be prevented. Therefore, the PCB contamination accommodated in the container C can be increased by the reduced amount of the basicity adjusting agent, so that the processing efficiency is improved. Further, as described above, the iron component selected as a magnetic material in the magnetic separation process is not plasma-treated. In the case of the ballast 2, since the iron contained in the case and the transformer 21 is 60 to 80% in weight ratio, the basicity adjuster is reduced by the amount of iron reduced compared to the case where the ballast 2 is not magnetically selected. Therefore, the total amount of plasma melting (stabilizer + basicity adjusting agent) is reduced, and the processing efficiency of plasma processing is greatly improved.

[Another example 1 of the first embodiment]
As described above, resin or the like is used for the ballast 2 as a filler. For this reason, impurities such as resin contaminated with PCB often adhere to the surface of the magnetic material selected in the crushing and magnetic separation processes. When this magnetic material is cleaned with a solvent, the cleaning efficiency is lowered by a resin having a higher PCB concentration than an iron core or the like. Further, when the cleaning solvent is reused, the resin precipitated from the solvent may adhere to the circulation line of the cleaning solvent and become clogged.

Therefore, as shown in FIG. 4, the PCB processing method may further include a removal step of removing impurities attached to the magnetic material magnetically selected in the magnetic separation step. As a result, it is possible to improve the cleaning efficiency and appropriately reuse the cleaning solvent. Further, it is preferable that the removed impurities are subjected to plasma treatment in the plasma melting furnace 1. This ensures that the impurities are harmless.
When introducing impurities into the plasma melting furnace 1, the impurities may be packed in a different container from the container C containing the non-magnetic material, or the impurities may be packed in the same container C. When the impurities are packed in another container, it is only necessary to manage the generation amount of impurities regardless of the generation amount of non-magnetic substances, so that the work efficiency is high.

In this removal process, washing, sieving, wind sorting, specific gravity sorting, optical sorting, etc. can be considered.
It is also conceivable to remove impurities by bringing silica sand into contact with the magnetic material. Specifically, the magnetic substance and the silica sand are accommodated in a predetermined container, and the container is vibrated or the silica substance is sprayed on the magnetic substance to peel off the impurities adhering to the magnetic substance. At this time, washing, sieving, wind sorting, specific gravity sorting, optical sorting, etc. may be used in combination. Moreover, it is preferable to reuse the silica sand used in the removal step as a basicity adjuster in the decomposition step.

[Another example 2 of the first embodiment]
As shown in FIG. 5, a large electric device such as a transformer is separated from a small electric device such as a ballast 2, and the large electric device is crushed after being cut into a predetermined size by a cutting machine. May be. Thereby, crushing efficiency can be improved.

[Second Embodiment]
Hereinafter, the second embodiment will be described. As shown in FIGS. 6 and 7, the PCB processing method according to the present embodiment includes a ballast 2 (an example of an electrical device) having a transformer 21 and a capacitor 22 including PCB, and the entire capacitor 22 is A cutting process that cuts the capacitor area remaining, a crushing process that crushes the transformer part area (an area other than the capacitor area), and a crushed material that is crushed in the crushing process, And a decomposition step of melting and decomposing the capacitor region and the selected non-magnetic material by plasma treatment.

  As shown in FIG. 6, the ballast 2 is configured such that the transformer part 21 and the capacitor 22 are arranged in both side regions along the longitudinal direction, and the gap between the transformer part 21 and the capacitor 22 is filled with resin, asphalt, or the like. ing. Further, the transformer part 21 including the iron core has a larger weight than the capacitor 22, and the capacitor 22 occupies a smaller area in plan view than the transformer part 21 and is larger than the center line T in the longitudinal direction. It is biased to one side.

Therefore, as shown in FIG. 7, after receiving the ballast 2, the weight difference determination for dividing the capacitor region is performed based on the weight difference between the two side regions with the center line T of the ballast 2 as a boundary. Specifically, as shown in FIG. 6, if a support member 31 (for example, a rod-shaped member) is disposed along the center line T of the ballast 2, the transformer region is lowered by gravity, and the capacitor region is associated therewith. Rises.
This increased area (the side with the smaller weight) is determined as the capacitor area. Next, the transformer region and the capacitor region are set to a predetermined ratio (for example, 1: 1 or 3: 2), and the ballast 2 is disconnected at the center line T or a position between the center line T and the capacitor 22. To do. And the area | region determined as a capacitor | condenser area | region by weight difference determination is conveyed to the plasma melting furnace 1, and a transformation part area | region is made to transfer to a crushing process. As a result, the capacitor region can be reliably transferred to the disassembly process. Further, since the step of specifying the cutting position is omitted, it is extremely simple. Note that the weight difference determination and the cutting step may be performed manually or automatically. Further, the weight difference determination is not particularly limited, and may be performed by measuring the weight of the transformer region and the capacitor region after cutting along the center line T, and specifying the lighter weight as the capacitor region.

As shown in FIG. 7, the cut transformer region is transported and crushed using a crusher (not shown). Subsequently, a magnetic separator (not shown) that separates magnetic materials by magnetic force separates magnetic materials (iron, etc.) and non-magnetic materials (resin, aluminum, asphalt, etc.). The selected magnetic material is cleaned with a hydrocarbon solvent or the like (cleaning step). Since the magnetic substance has a relatively low PCB concentration, it can be rendered harmless by a cleaning process. Next, a graduation determination is made as to whether or not the PCB concentration is equal to or lower than a reference value, and appropriate disposal is performed such that what is determined to be harmless is reused as a resource. On the contrary, if the PCB concentration does not clear the reference value in the graduation determination, the cleaning process is performed again. At this time, the solvent used in the washing step is reused by distillation in the system.
As the cleaning method, ultrasonic cleaning, immersion cleaning, stirring cleaning, vacuum heating separation, or the like is performed alone or in combination as appropriate.

  On the other hand, the selected non-magnetic material and the cut capacitor region are packed in a container C together with a basicity adjusting agent such as silica sand (SiO 2), quicklime (CaO), calcium carbonate (CaCO 3), and the like in the plasma melting furnace 1. Perform plasma treatment. The slag S generated by the plasma processing is subjected to graduation judgment whether the PCB concentration is below the reference value, and those judged to be harmless are subjected to appropriate disposal such as landfill disposal or reuse as resources. Conversely, if the PCB concentration does not clear the reference value in the graduation determination, the plasma processing is performed again.

  In the present embodiment, as in the first embodiment described above, as shown in FIG. 3, a predetermined amount of the basicity adjusting agent to be added is determined according to the amount of iron mixed in the non-magnetic material. In addition, an adjustment step of adjusting the amount of the basicity adjusting agent added according to the amount of ferric oxide contained in the slag S may be provided.

  According to the present embodiment, PCB contamination that is plasma-treated by the amount of magnetic material contained in the transformer 21 is reduced by the cutting process. Since the capacity ratio of the magnetic substance contained in the transformer 21 is more than half of the ballast 2, the processing efficiency of the ballast 2 that is rendered harmless by one plasma process is approximately doubled. Moreover, since the amount of iron to be plasma-treated is reduced by the magnetic separation process, the amount of basicity adjusting agent added can be saved. That is, since the total amount (stabilizer + basicity adjusting agent) to be melted by plasma is reduced by the reduced amount of the basicity adjusting agent, the processing efficiency of the plasma processing can be further improved.

[Another example 1 of the second embodiment]
As shown in FIG. 8, the PCB processing method may further include a removal step of removing impurities such as resin and asphalt attached to the magnetic material magnetically selected in the magnetic separation step. In this case, it is preferable to pack the impurities in the container C and perform plasma treatment in the plasma melting furnace 1 in the decomposition step. As a result, it is possible to improve the cleaning efficiency and appropriately reuse the cleaning solvent. Moreover, the impurities are surely rendered harmless by being plasma treated. In addition, the method similar to the another Example 1 of 1st embodiment can be considered as the method of removing an impurity.

[Another example 2 of the second embodiment]
In the above-described embodiment, the ballast 2 is cut at the center line T or at a position between the center line T and the capacitor 22 in the cutting step. Instead of this, as shown in FIG. 9, a cutting step may be provided in the cutting step.

  Specifically, as shown in FIG. 10, a needle member 32 (an example of an insertion instrument) to be inserted at a plurality of locations along the longitudinal direction of the ballast 2 is provided, and a region between the transformer unit 21 and the capacitor 22 is provided. Is specified based on the insertion resistance of the needle member 32. In this case, it is preferable that each needle member 32 is configured to be movable independently. The region where the transformer unit 21 and the capacitor 22 are present has a higher insertion resistance of the needle member 32 than the region where the transformer unit 21 and the capacitor 22 are not present. That is, the position where the insertion resistance is relatively low is a gap between the transformer unit 21 and the capacitor 22. If this gap is specified as the cutting position, it is possible to reliably prevent the disadvantage that the capacitor 22 is cut by mistake and the PCB is diffused.

  In addition, as a method of specifying the cutting position, for example, a configuration may be adopted in which one needle member 32 is sequentially inserted into a plurality of locations while being moved. Further, the boundary between the position of the capacitor 22 and the region of the filler 23 where the capacitor 22 does not exist may be specified by measuring the reflected wave of the ultrasonic wave. In this case, it is preferable to immerse the ballast 2 in a contact medium such as glycerin to facilitate the propagation of ultrasonic waves. Further, the position of the transformer 21 and the capacitor 22 may be specified visually by peeling the bottom plate 24 of the ballast 2 or peeling the outer surface.

[Third embodiment]
The third embodiment will be described below.

  As shown in FIG. 11, the plasma melting furnace 1 according to the present embodiment includes a first charging port 14 for loading a container C containing a noncombustible contaminant (processing target) containing PCB, and a PCB. A second inlet 15 for injecting combustible contaminants, a processing unit 12 for plasma processing of incombustible contaminants and combustible contaminants, and a control unit 16 for controlling the introduction of incombustible contaminants and combustible contaminants. It has. Further, the plasma melting furnace 1 includes a measurement unit 17 that measures the pressure, oxygen concentration, displacement, or temperature in the furnace of the processing unit 12 so that the measurement value from the measurement unit 17 is output to the control unit 16. It is configured. In addition, the 1st insertion port 14 is comprised similarly to the insertion port 11 in 1st embodiment.

Here, the classification of non-combustible contaminants and combustible contaminants is classified by ease of combustion. In the present embodiment, non-combustible contaminants are assumed to be electrical equipment (ballast, transformer, condenser, etc.) having a weight ratio of incombustibles of approximately 50% or more, pressure-sensitive copying paper that burns relatively slowly, sludge, and the like. .
On the other hand, combustible contaminants are assumed to be pressure-sensitive copying paper that burns rapidly, operating waste (work clothes, rubber gloves, waste, etc.), resin, insulating oil, and the like. These flammable contaminants are stored as they are, or after being cut, crushed, etc., and then accommodated in the small container Ca and introduced from the second inlet 15. In addition, although there exists an advantage which becomes easy to control an injection | throwing-in interval by accommodating in the small container Ca, you may throw in directly, without accommodating in the small container Ca, or pressurize after crushed or the like, There is no particular limitation, and the material may be solidified by at least one of heating, solidifying material addition, and kneading, and stored in the small container Ca or directly charged. If combustible contaminants are accommodated in the small container Ca or solidified, the injected combustible contaminants (generally very light) can be reliably decomposed without scattering in the furnace. As a result, it is possible to minimize the risk that the ignitable combustible contaminants are scattered to the subsequent exhaust gas treatment facility and a fire is generated. In particular, since the combustible contaminants that have been solidified have a small specific surface area, the combustion becomes slow and rapid exhaust gas generation can be suppressed.

  As shown by the solid line in FIG. 12, when the nonflammable contaminants are subjected to plasma treatment in the plasma melting furnace 1, the generated gas amount curve gradually increases with the combustion of the combustible substances contained in the nonflammable contaminants and peaks. It reaches the value and gradually decreases from the peak value. On the other hand, as shown by a one-dot chain line in FIG. 12, when combustible contaminants are subjected to plasma processing in the plasma melting furnace 1, the generated gas amount curve rises steeply and reaches a peak value, and then steeply slopes from the peak value. To descend. For this reason, for example, when the incombustible contaminant and the combustible contaminant are mixed and put into the first inlet 14, it is necessary to set the mixing ratio so that the peak value becomes the reference value as the furnace pressure. Yes, it is complicated. In addition, if the next container C is introduced before the container C containing the non-combustible contaminants is completely melted, the amount of generated gas becomes uncontrollable, or the containers C interfere with each other and the plasma processing efficiency decreases. Or For this reason, the container C is plasma-treated at a long charging interval (for example, 30 minutes), and the amount of combustible contaminants is limited.

  Therefore, the control unit 16 in the present embodiment throws in combustible contaminants into the second inlet 15 after a predetermined time (for example, 10 minutes) has passed since the incombustible contaminants are put into the first inlet 14. It is configured. This predetermined time is set when the combustible material contained in the noncombustible pollutant burns and the amount of generated gas falls below a predetermined value (for example, the same value as the amount of generated gas before charging). Thereby, the trouble of adjusting the mixing ratio of the incombustible contaminants and the combustible contaminants accommodated in one container C can be omitted. Further, since the combustible contaminants that are burned in a short time can be frequently introduced while the non-combustible contaminants are being plasma-treated, the processing efficiency is improved.

  Moreover, it is preferable that the control part 16 has the insertion space | interval control part 16a which controls the space | interval which throws in a combustible contaminant to the 2nd insertion port 15. FIG. The charging interval control unit 16a specifies the treatment status of combustible contaminants based on at least one of the pressure, oxygen concentration, displacement and temperature of the processing unit 12 measured by the measuring unit 17, and combustible contaminants. Is inserted into the second insertion port 15. Since combustible pollutants burn in a short time, the gas amount curve has a generally similar curve shape if the input amount of combustible contaminants is made constant. For this reason, if the interval at which combustible contaminants are introduced into the second inlet 15 is controlled, it is possible to prevent the peak value of the gas amount curve of the incombustible contaminants and the synthesized gas amount curve from becoming excessive. Further, if the charging interval is controlled based on the furnace pressure or the like having a correlation with the gas amount of the processing unit 12, even if a large amount of flammable contaminants is charged, the charging interval is increased to increase the charging interval. Inconveniences such as a sudden rise in pressure can be avoided.

  In the present embodiment, the PCB processing methods in the first embodiment or the second embodiment described above may be appropriately combined. For example, after the ballast 2 is crushed, a resin or the like (combustible material) selected in the magnetic separation process may be input to the second input port 15. The combustible material may be an impurity removed in the removal process. In this case, it is possible to increase the number of ballasts 2 that can be accommodated in the container C to be charged into the first charging port 14. Further, the combustible contaminants may be crushed and accommodated in the small container Ca. In this case, since the amount of one charge can be made small, the peak value of the gas amount curve can be suppressed. Furthermore, instead of adding the basicity adjusting agent to the container C as in the above-described embodiment, the basicity adjusting agent may be supplied from the second input port 15. In this case, it is preferable to add the basicity adjusting agent until a predetermined time elapses after the nonflammable contaminant is introduced into the first inlet 14. If it is this period, since combustible contaminants are not injected from the 2nd inlet 15, it is efficient. In addition, a charging port for the basicity adjusting agent may be provided separately, and the charging method is not particularly limited, such as charging the basicity adjusting agent in a container.

  Then, the control method of the plasma melting furnace 1 is demonstrated using FIGS.

  As shown in FIG. 13, first, nonflammable contaminants are introduced into the first inlet 14 (# 51). Next, it is determined whether or not a predetermined time (for example, 10 minutes) has elapsed since the incombustible contaminant was introduced (# 52). If the predetermined time has not elapsed (# 52 No determination), the system continues to wait. If the predetermined time has elapsed (# 52 Yes determination), it is determined whether the pressure in the furnace has dropped below a predetermined value (for example, a pressure corresponding to half of the peak gas amount of non-combustible contaminants) ( # 53). Instead of the furnace pressure, it may be determined whether the oxygen concentration in the furnace is equal to or higher than a predetermined value, or whether the temperature in the furnace is equal to or lower than a predetermined value, and is not particularly limited.

  If the furnace pressure is greater than the predetermined value (# 53 No determination), the process continues to stand by. When the furnace pressure is equal to or lower than the predetermined value (# 53 Yes determination), flammable contaminants are charged into the second charging port 15 (# 54). Next, when the preset charging interval T1 has elapsed, it is determined whether the furnace pressure has dropped below a predetermined value (# 55). When the furnace pressure has dropped below a predetermined value (# 55 Yes determination), flammable contaminants are introduced into the second inlet 15 (# 56). This throwing interval T1 is a throwing interval at a stage immediately after a predetermined time has passed after throwing incombustible contaminants, and is set larger than the throwing interval Ti (i ≧ 2) at the subsequent stage.

  Next, it is determined whether or not the furnace pressure has decreased to a predetermined value or less (# 57). If it has decreased (# 57 Yes determination), the next charging interval Ti (i = 2) is set to the furnace pressure or the like. Based on this setting (# 58), flammable contaminants are charged into the second charging port 15 at the charging interval T2 (# 59). Then, it is determined whether the pressure in the furnace has decreased to a predetermined value or less (# 60), and if it has decreased (# 60 Yes determination), the charging interval Ti is a predetermined threshold (for example, combustible contaminants are burned). It is determined whether or not it has reached 10 seconds) (# 61). When there is room for shortening the insertion interval Ti (# 61 No determination), the insertion interval Ti is updated and set (# 58), and the same processing is repeated (# 59 to # 61). On the other hand, when the charging interval Ti is the limit value (# 61 Yes determination), the charging of the combustible contaminants is continued at the charging interval Ti (# 62). Next, it is confirmed that the incombustible waste is completely melted by, for example, an image of a photographing apparatus installed in the furnace of the processing unit 12, and the next timing when the container C containing the noncombustible contaminant is introduced (for example, , 30 minutes have passed) (# 63 Yes determination), the process returns to the beginning and a series of processes (# 51 to # 63) are repeated.

  As shown in FIG. 12, the combustible contaminants are treated while suppressing the peak value of the generated gas amount by introducing the combustible contaminants into the second inlet 15 in the latter half of the treatment time of the incombustible contaminants. The amount can be increased dramatically. Moreover, in the initial stage where the amount of gas generated from the flammable contaminants remains to a certain extent, the interval between the flammable contaminants is set large, so that a load is applied to the processing unit 12 due to a rapid pressure increase. There is no. As a result, it is possible to prevent the PCB from leaking out and damaging the exhaust gas treatment facility on the downstream side.

[Other Embodiments] (1) In the above-described embodiment, the predetermined amount of the basicity adjusting agent added according to the iron content is determined, and according to the amount of ferric oxide contained in the slag S, The addition amount of the basicity adjusting agent was adjusted. Instead of this, the predetermined amount of the basicity adjusting agent added according to the amount of aluminum is determined, and the addition amount of the basicity adjusting agent is adjusted according to the amount of aluminum oxide contained in the slag S. Also good. In this case, for example, the aluminum oxide contained in the slag S is adjusted to 20% or less. Moreover, it is good also considering any larger value as a predetermined amount among the basicity regulators calculated according to the quantity of the ferric oxide or aluminum oxide contained in slag S.
(2) The removal step may be performed by sandblasting the magnetic material with other particles without using silica sand, or by removing impurities by chemical treatment, and is not particularly limited.
(3) The charging interval control unit 16a of the embodiment described above removes combustible contaminants based on at least one of the pressure, oxygen concentration, displacement, and temperature of the processing unit 12 measured by the measurement unit 17. The interval at which the charging port 15 is charged was determined. Instead of this, it is also possible to determine the interval at which combustible contaminants are introduced based on the image of a photographing device installed in the furnace of the processing unit 12. Further, an input amount control unit that determines the input amount of combustible contaminants based on at least one of the pressure, oxygen concentration, exhaust amount, and temperature of the processing unit 12 may be provided. Further, the interval and amount of combustible contaminants may be determined based on a predetermined map. It should be noted that the same effect can be obtained not only in the processing unit 12 but also in the constant temperature chamber 3 at the subsequent stage for measuring the pressure, oxygen concentration, displacement, and temperature.
(4) Although FIGS. 1 and 11 show an example in which the processing unit 12 has one plasma torch 12a, a plurality of plasma torches 12a may be installed. Further, a position control unit that changes the position of the plasma torch 12a according to the position of the container C may be provided.

  The present invention can be used in a PCB processing method for plasma processing an electrical device such as a ballast including PCB.

2 Ballast (electric equipment)
21 Transformer 22 Capacitor 32 Needle member (insertion tool)
T Chuo Line

Claims (4)

A cutting step of cutting a ballast having a transformer section and a capacitor including PCB into a capacitor area including the entire capacitor and a transformer section area including the transformer section;
A refilling method for a ballast, comprising: a refilling step of refilling the capacitor region and a part of the transformer region with a container for plasma processing.   2. The ballast according to claim 1, wherein in the cutting step, the ballast is cut by using a side having a small weight based on a weight difference between both side regions with a center line with respect to a longitudinal direction of the ballast as a boundary as the capacitor region. Refill method.   The ballast refilling method according to claim 2, wherein the cutting step sets the capacitor region and the transformer region to a predetermined ratio to cut the ballast. Providing an insertion instrument to be inserted at a plurality of locations along the longitudinal direction of the ballast;
The cutting step, a region between the transformer and the condenser, repacking method of ballast according to claim 1 for cutting the ballast after identifying, based on the insertion resistance of the insertion instrument.

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