JP6614533B2 - Non-contact type data transmitter / receiver and method of using the same - Google Patents

Non-contact type data transmitter / receiver and method of using the same Download PDF

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JP6614533B2
JP6614533B2 JP2016116091A JP2016116091A JP6614533B2 JP 6614533 B2 JP6614533 B2 JP 6614533B2 JP 2016116091 A JP2016116091 A JP 2016116091A JP 2016116091 A JP2016116091 A JP 2016116091A JP 6614533 B2 JP6614533 B2 JP 6614533B2
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adherend
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JP2017220144A (en
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夏樹 菰田
直樹 磯貝
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Toppan Forms Co Ltd
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Description

本発明は、RFID(Radio Frequency IDentification)用途の情報記録メディアのように、電波を媒体として外部から情報を受信し、また、外部に情報を送信できるようにした非接触型データ受送信体およびその使用方法に関する。   The present invention relates to a non-contact type data receiving / transmitting body capable of receiving information from the outside using radio waves as a medium, such as an information recording medium for RFID (Radio Frequency IDentification), and transmitting information to the outside. Regarding usage.

RFIDを初めとする電磁界で動作する通信機器は、水分や金属の影響を受けやすく、特に、金属面上では全く通信できなくなることがある。
金属の影響を避けるために、RFIDとしては、グランドを有し、立体構造をなすものが知られている。
Communication devices operating in an electromagnetic field such as RFID are easily affected by moisture and metal, and may not be able to communicate at all on a metal surface.
In order to avoid the influence of metal, an RFID having a ground and a three-dimensional structure is known.

例えば、接着層を介して積み重ねられた第一基材および第二基材と、第二基材に設けられたアンテナおよびICチップを備え、第二基材のアンテナが設けられた部分の一部が、第一基材に折り重ねられ、第二基材の折り重ねを解除し、第二基材を第一基材に対して離間して使用される非接触型データ受送信体が知られている(例えば、特許文献1参照)。   For example, the first base material and the second base material stacked via the adhesive layer, the antenna and the IC chip provided on the second base material, and a part of the portion of the second base material provided with the antenna However, there is known a non-contact type data transmitter / receiver that is folded on the first substrate, unfolded on the second substrate, and separated from the first substrate. (For example, refer to Patent Document 1).

また、RFIDがその長尺側をシールの幅方向の縁部と平行となるように配置された配置部を有するスペース形成部を備え、スペース形成部にはシールの幅方向の縁部と平行に複数本の折れ線が形成され、この折れ線の折り曲げ回数により、RFIDのアンテナと被着物との間の間隔が調整可能なRFIDタグが知られている(例えば、特許文献2参照)。   Further, the RFID includes a space forming portion having an arrangement portion arranged so that the long side thereof is parallel to the edge portion in the width direction of the seal, and the space forming portion is parallel to the edge portion in the width direction of the seal. There is known an RFID tag in which a plurality of broken lines are formed, and the interval between the RFID antenna and the adherend can be adjusted by the number of times the bent lines are bent (for example, see Patent Document 2).

RFIDが取り付けられたラベル基体と、ラベル基体の裏面に仮着された台紙とからなり、ラベル基体は、折り返されて台紙に表面が相対している第1領域と、第1領域の裏面が相対している第2領域と、裏面に粘着剤が設けられた第3領域とを備え、RFIDは、第1領域と第2領域との間に介装されて、第1領域および第2領域のいずれか一方に取り付けられ、折り返された第1領域の端部を被着物の表面に当接させ、第1領域と第2領域とで山形を形成するような状態で第3領域を被着物に貼付させ、第1領域および第2領域のいずれか一方に取り付けられたRFIDを被着物から離した状態で保持可能としたRFIDラベルが知られている(例えば、特許文献3参照)。   The label substrate includes a label substrate to which the RFID is attached and a mount temporarily attached to the back surface of the label substrate. The label substrate is folded back so that the surface of the first region is opposed to the mount and the back surface of the first region is relatively The second region, and a third region having an adhesive on the back surface, and the RFID is interposed between the first region and the second region, and the first region and the second region The third region is attached to the adherend in such a state that the end portion of the first region which is attached to either one is brought into contact with the surface of the adherend and a chevron is formed by the first region and the second region. There is known an RFID label that can be attached and held in a state where the RFID attached to either one of the first region and the second region is separated from the adherend (see, for example, Patent Document 3).

特許第4916841号公報Japanese Patent No. 4916841 特開2009−193262号公報JP 2009-193262 A 特許第4799243号公報Japanese Patent No. 4799243

金属の影響を緩和するためには、金属からなる被着物からRFIDのアンテナを離間する必要がある。
上記の従来技術では、被着物の一面(貼付面)に対して、アンテナの電界方向が平行であるため、被着物からアンテナを大きく離間させる必要があり、RFIDタグ(RFIDラベル)の厚み(高さ)が大きくなることがあった。
In order to reduce the influence of metal, it is necessary to separate the RFID antenna from the adherend made of metal.
In the above prior art, since the direction of the electric field of the antenna is parallel to one surface (attachment surface) of the adherend, it is necessary to greatly separate the antenna from the adherend, and the RFID tag (RFID label) thickness (high ) Sometimes increased.

本発明は、上記事情に鑑みてなされたものであって、被着物の一面とアンテナを大きく離間させることなく通信が可能な非接触型データ受送信体およびその使用方法を提供することを目的とする。   The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a non-contact type data receiving / transmitting body capable of communicating without greatly separating one surface of an adherend from an antenna and a method of using the same. To do.

本発明の非接触型データ受送信体は、金属からなる被着物の一面に貼付される非接触型データ受送信体であって、ICチップと、該ICチップを基端として互いに反対方向に延出するグランドとなる第1導電部およびアンテナとなる第2導電部と、を有し、前記第1導電部は、前記被着物に面で重なるように貼付可能な貼付構造を有し、前記第1導電部は、前記被着物の一面上に、前記被着物と電気的に結合するように配され、前記第2導電部は、前記被着物から離間し、その長手方向が前記被着物の一面に対して離間する方向に延在するように配されることを特徴とする。   The non-contact type data receiving / transmitting body of the present invention is a non-contact type data receiving / transmitting body attached to one surface of an adherend made of metal, and extends in opposite directions with the IC chip as a base end. A first conductive part serving as a ground and a second conductive part serving as an antenna, and the first conductive part has a pasting structure that can be pasted so as to overlap the adherend, The one conductive part is arranged on one surface of the adherend so as to be electrically coupled to the adherend, the second conductive part is separated from the adherend, and a longitudinal direction thereof is one surface of the adherend. It is arranged so that it may extend in the direction away from.

本発明の非接触型データ受送信体において、前記第2導電部は、その長手方向に沿って折り重ねられていてもよい。   In the non-contact type data transmitting / receiving body of the present invention, the second conductive portion may be folded along the longitudinal direction thereof.

本発明の非接触型データ受送信体の使用方法は、本発明の非接触型データ受送信体を使用する方法であって、金属からなる被着物の一面に、前記貼付構造により、前記第1導電部を面で重なるように貼付して、前記第1導電部を、前記被着物の一面上に、前記被着物と電気的に結合するように配し、前記第2導電部を、前記被着物から離間し、その長手方向が前記被着物の一面に対して離間する方向に延在するように配することを特徴とする。   The method of using the non-contact type data receiving / transmitting body of the present invention is a method of using the non-contact type data receiving / transmitting body of the present invention, wherein the first structure is formed on one surface of an adherend made of metal by the pasting structure. The conductive portion is affixed so as to overlap the surface, the first conductive portion is disposed on one surface of the adherend so as to be electrically coupled to the adherend, and the second conductive portion is disposed on the adherend. It is separated from a kimono and it distribute | arranges so that the longitudinal direction may extend in the direction spaced apart with respect to the one surface of the said adherend.

本発明によれば、被着物の一面とアンテナとなる第2導電部の電界方向が異なるため、被着物の一面と第2導電部を大きく離間させることなく、非接触型データ受送信体の通信が可能となる。   According to the present invention, since the electric field direction of the second conductive portion serving as the antenna is different from that of the one surface of the adherend, the communication of the non-contact type data receiving / transmitting body is performed without greatly separating the one surface of the adherend and the second conductive portion. Is possible.

本発明の実施形態に係る非接触型データ受送信体を示す概略平面図である。It is a schematic plan view which shows the non-contact type data transmission / reception body which concerns on embodiment of this invention. 図1のA−A線に沿う断面図であり、非接触型データ受送信体の一例を示す図である。It is sectional drawing which follows the AA line of FIG. 1, and is a figure which shows an example of a non-contact-type data receiving / transmitting body. 図1のA−A線に沿う断面図であり、非接触型データ受送信体の他の例を示す図である。It is sectional drawing which follows the AA line of FIG. 1, and is a figure which shows the other example of a non-contact-type data receiving / transmitting body. 本発明の実施形態に係る非接触型データ受送信体の使用方法の一例を示す概略斜視図である。It is a schematic perspective view which shows an example of the usage method of the non-contact-type data transmission / reception body which concerns on embodiment of this invention. 本発明の実施形態に係る非接触型データ受送信体の使用方法の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the usage method of the non-contact-type data transmission / reception body which concerns on embodiment of this invention. 本発明の実施形態に係る非接触型データ受送信体の使用方法の他の例を示す概略斜視図である。It is a schematic perspective view which shows the other example of the usage method of the non-contact-type data transmission / reception body which concerns on embodiment of this invention. 本発明の実施形態に係る非接触型データ受送信体の使用方法の他の例を示す概略断面図である。It is a schematic sectional drawing which shows the other example of the usage method of the non-contact-type data transmission / reception body which concerns on embodiment of this invention.

本発明の非接触型データ受送信体およびその使用方法の実施の形態について説明する。
なお、本実施の形態は、発明の趣旨をより良く理解させるために具体的に説明するものであり、特に指定のない限り、本発明を限定するものではない。
Embodiments of the contactless data receiving / transmitting body and the method of using the same according to the present invention will be described.
Note that this embodiment is specifically described in order to better understand the gist of the invention, and does not limit the present invention unless otherwise specified.

[非接触型データ受送信体およびその使用方法]
図1は、本発明の実施形態に係る非接触型データ受送信体を示す概略平面図である。図2は、図1のA−A線に沿う断面図であり、非接触型データ受送信体の一例を示す図である。図3は、図1のA−A線に沿う断面図であり、非接触型データ受送信体の他の例を示す図である。
図1に示すように、本実施形態の非接触型データ受送信体10は、平面視長方形状の基材21と、基材21の一方の面21aに設けられたICチップ31と、ICチップ31を基端として互いに反対方向に延出するグランドとなる第1導電部41およびアンテナとなる第2導電部42とから概略構成されている。
本実施形態の非接触型データ受送信体10は、金属からなる被着物の一面に貼付されて用いられる。
[Non-contact data receiving / transmitting body and method of use thereof]
FIG. 1 is a schematic plan view showing a contactless data receiving / transmitting body according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1 and is a diagram illustrating an example of a non-contact type data receiving / transmitting body. FIG. 3 is a cross-sectional view taken along the line AA in FIG. 1 and is a view showing another example of a non-contact type data receiving / transmitting body.
As shown in FIG. 1, the non-contact type data receiving / transmitting body 10 of the present embodiment includes a base material 21 having a rectangular shape in plan view, an IC chip 31 provided on one surface 21a of the base material 21, and an IC chip. A first conductive portion 41 serving as a ground and a second conductive portion 42 serving as an antenna extending in opposite directions with 31 as a base end.
The contactless data receiving / transmitting body 10 of the present embodiment is used by being attached to one surface of an adherend made of metal.

第1導電部41と第2導電部42は、ICチップ31を中心として互いに対向し、その対向する側にそれぞれ給電点(ICチップ31と接続する部分)41a,42aを有する一対の導電部である。本実施形態では、第1導電部41と第2導電部42は、基材21の長手方向に延在するボウタイ形状をなしている。   The first conductive portion 41 and the second conductive portion 42 are a pair of conductive portions that face each other with the IC chip 31 as a center, and that have feeding points (portions that connect to the IC chip 31) 41a and 42a on the opposite sides. is there. In the present embodiment, the first conductive portion 41 and the second conductive portion 42 have a bow tie shape extending in the longitudinal direction of the base material 21.

本実施形態では、第1導電部41と第2導電部42がICチップ31を通る中心線を基準として線対称な形状をなしている場合を例示したが、本発明はこれに限定されない。本発明にあっては、第1導電部と第2導電部は非対称な形状をなしていてもよい。   In the present embodiment, the case where the first conductive portion 41 and the second conductive portion 42 have a line-symmetric shape with respect to the center line passing through the IC chip 31 is exemplified, but the present invention is not limited to this. In the present invention, the first conductive portion and the second conductive portion may have an asymmetric shape.

グランドとなる第1導電部41の長さは特に限定されず、ICチップ31の特性や、アンテナとなる第2導電部42の長さ等に応じて適宜調整される。
第1導電部41の形状は、図1に示す形状に限定されず、被着物の一面(被着面)の形状に応じて適宜調整される。
The length of the first conductive portion 41 serving as the ground is not particularly limited, and is appropriately adjusted according to the characteristics of the IC chip 31 and the length of the second conductive portion 42 serving as the antenna.
The shape of the 1st electroconductive part 41 is not limited to the shape shown in FIG. 1, It adjusts suitably according to the shape of the one surface (attachment surface) of a to-be-adhered body.

アンテナとなる第2導電部42の長さは、非接触ICカードなどの非接触ICモジュールに利用できる極超短波帯〈UHF〉やマイクロ波帯の電波帯の周波数(300MHz〜30GHz)の1/2波長に相当する長さとなっている。
第2導電部42の形状は、図1に示す形状に限定されず、メアンダ状等であってもよい。
The length of the second conductive portion 42 serving as an antenna is 1/2 of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> or microwave band that can be used for a non-contact IC module such as a non-contact IC card. The length corresponds to the wavelength.
The shape of the second conductive portion 42 is not limited to the shape shown in FIG. 1, and may be a meander shape.

第1導電部41と第2導電部42は、それぞれから分岐して、給電点41a,42aを跨ぐように設けられたインダクタンス部43によって電気的に接続されている。   The first conductive part 41 and the second conductive part 42 branch from each other and are electrically connected by an inductance part 43 provided so as to straddle the feeding points 41a and 42a.

第1導電部41は、非接触型データ受送信体10を貼付する被着物の一面に面で重なるように貼付可能な貼付構造を有している。
このような貼付構造としては、例えば、図2に示すように、第1導電部41における基材21と接する面とは反対側の面(上面)41bに設けられた粘着層51が挙げられる。また、貼付構造としては、例えば、図3に示すように、基材21における第1導電部41と接する面とは反対側の面(基材21の他方の面)21bに設けられた粘着層52が挙げられる。
The 1st electroconductive part 41 has the sticking structure which can be stuck so that it may overlap with the surface of the adherend which sticks the non-contact-type data transmission / reception body 10 on the surface.
As such a pasting structure, for example, as shown in FIG. 2, there is an adhesive layer 51 provided on a surface (upper surface) 41 b opposite to the surface in contact with the base material 21 in the first conductive portion 41. Moreover, as a sticking structure, for example, as shown in FIG. 3, an adhesive layer provided on a surface (the other surface of the base material 21) 21 b opposite to the surface in contact with the first conductive portion 41 of the base material 21. 52.

なお、粘着層51は、必ずしも第1導電部41の上面41bに設けられる必要はない。第1導電部41が被着物の一面に面で重なり、かつ、第1導電部41が被着物の一面に、被着物と電気的に結合するように配されるように、粘着層51が設けられていればよい。例えば、粘着層51は、基材21の一方の面21aにおいて、第1導電部41の周辺に設けられていてもよい。   Note that the adhesive layer 51 is not necessarily provided on the upper surface 41 b of the first conductive portion 41. An adhesive layer 51 is provided so that the first conductive portion 41 overlaps with one surface of the adherend, and the first conductive portion 41 is disposed on one surface of the adherend so as to be electrically coupled to the adherend. It only has to be done. For example, the adhesive layer 51 may be provided around the first conductive portion 41 on the one surface 21 a of the base material 21.

粘着層52は、基材21の他方の面21bにおいて、第1導電部41と対向する部分に設けられていることが好ましい。また、粘着層52は、基材21の他方の面21bにおいて、第1導電部41と対向する部分の周辺に設けられていてもよい。   It is preferable that the adhesive layer 52 is provided in a portion facing the first conductive portion 41 on the other surface 21 b of the base material 21. In addition, the adhesive layer 52 may be provided in the vicinity of a portion facing the first conductive portion 41 on the other surface 21 b of the base material 21.

このような粘着層52,53により、第1導電部41が、被着物の一面に面で重なるように貼付され、被着物の一面に電気的に結合される。ここで、第1導電部41と被着物が電気的に結合するとは、第1導電部41と被着物が静電結合するか、または、第1導電部41と被着物が直接結合することを言う。
また、第1導電部41が被着物の一面に貼付される一方、第2導電部42は、被着物から離間し、その長手方向が被着物の一面に対して離間する方向に延在するように配される。
By such adhesive layers 52 and 53, the 1st electroconductive part 41 is affixed so that it may overlap with one surface of an adherend, and it electrically couple | bonds with one surface of an adherend. Here, the first conductive portion 41 and the adherend are electrically coupled means that the first conductive portion 41 and the adherend are electrostatically coupled, or the first conductive portion 41 and the adherend are directly coupled. say.
Further, the first conductive portion 41 is affixed to one surface of the adherend, while the second conductive portion 42 is separated from the adherend and its longitudinal direction extends in a direction away from the one surface of the adherend. Arranged.

非接触型データ受送信体10は、基材21の長手方向に沿って、第1導電部41を含む第1領域61と、ICチップ31および第2導電部42の一部を含む第2領域62と、第2導電部42の一部を含む第3領域63と、第2導電部42の一部を含む第4領域64と、を有する。第1領域61と、第2領域62と、第3領域63と、第4領域64とはこの順に連接している。   The non-contact type data transmitting / receiving body 10 includes a first region 61 including the first conductive portion 41 and a second region including a part of the IC chip 31 and the second conductive portion 42 along the longitudinal direction of the base material 21. 62, a third region 63 including a part of the second conductive part 42, and a fourth region 64 including a part of the second conductive part 42. The first region 61, the second region 62, the third region 63, and the fourth region 64 are connected in this order.

非接触型データ受送信体10は、基材21の長手方向と垂直な方向に沿い、第1領域61と第2領域62を区画する折線71、第2領域62と第3領域63を区画する折線72、および、第3領域63と第4領域64を区画する折線73において、その長手方向と垂直な方向に山折りまたは谷折り可能である。   The non-contact type data transmitting / receiving body 10 divides the first region 61 and the second region 62 along the direction perpendicular to the longitudinal direction of the base material 21, and the second region 62 and the third region 63. The fold line 72 and the fold line 73 that divides the third region 63 and the fourth region 64 can be mountain-folded or valley-folded in a direction perpendicular to the longitudinal direction.

このような折線71,72,73を設け、それらを山折りまたは谷折りにすることにより、第2導電部42は、その長手方向に沿って折り重ねることができる(図4、図6参照)。また、第1領域61と第2領域62の間隔、第2領域62の間隔と第3領域63の間隔、および、第3領域63と第4領域64の間隔を調節することにより、被着物の一面に対して第2導電部42が離間する距離を調整させることができる。   By providing such folding lines 71, 72, 73 and making them fold or valley fold, the second conductive portion 42 can be folded along the longitudinal direction thereof (see FIGS. 4 and 6). . Further, by adjusting the distance between the first area 61 and the second area 62, the distance between the second area 62 and the third area 63, and the distance between the third area 63 and the fourth area 64, The distance at which the second conductive portion 42 is separated from the one surface can be adjusted.

なお、非接触型データ受送信体10を折り重ねる形態は、上記の形態に限定されず、第2導電部42を含む領域の数は、第2導電部42(アンテナ)の長さ等に応じて適宜調整される。例えば、非接触型データ受送信体10は、基材21の長手方向に沿って、第1導電部41を含む第1領域と、ICチップ31および第2導電部42の一部を含む第2領域と、第2導電部42の一部を含む第3領域と、を有していてもよい。また、非接触型データ受送信体10は、基材21の長手方向に沿って、第1導電部41を含む第1領域と、ICチップ31および第2導電部42の一部を含む第2領域と、第2導電部42の一部を含む第3領域と、第2導電部42の一部を含む第4領域と、第2導電部42の一部を含む第5領域と、を有していてもよい。   In addition, the form which folds the non-contact-type data transmission / reception body 10 is not limited to said form, The number of the area | regions including the 2nd electroconductive part 42 is according to the length etc. of the 2nd electroconductive part 42 (antenna). Are adjusted accordingly. For example, the non-contact type data transmitting / receiving body 10 includes a first region including the first conductive part 41 and a second part including the IC chip 31 and a part of the second conductive part 42 along the longitudinal direction of the base material 21. A region and a third region including a part of the second conductive portion 42 may be included. Further, the non-contact type data transmitting / receiving body 10 includes a first region including the first conductive part 41 and a second part including the IC chip 31 and a part of the second conductive part 42 along the longitudinal direction of the base material 21. A region, a third region including a part of the second conductive part, a fourth region including a part of the second conductive part, and a fifth region including a part of the second conductive part. You may do it.

基材21としては、特に限定されず、種々の樹脂からなる基材、上質紙、薄葉紙、グラシン紙、硫酸紙などの紙からなる基材等が挙げられる。   The base material 21 is not particularly limited, and examples thereof include a base material made of various resins, a base material made of paper such as fine paper, thin paper, glassine paper, and sulfuric acid paper.

ICチップ31としては、特に限定されず、第2導電部42を介して非接触状態にて情報の書き込みおよび読み出しが可能なものであればよい。ICチップ31としては、非接触型ICタグや非接触型ICラベル、あるいは、非接触型ICカード等のRFIDメディアに適用可能なものであればいかなるものでも用いられる。   The IC chip 31 is not particularly limited as long as it can write and read information in a non-contact state via the second conductive portion 42. Any IC chip 31 can be used as long as it can be applied to RFID media such as a non-contact type IC tag, a non-contact type IC label, or a non-contact type IC card.

第1導電部41および第2導電部42を構成する材料としては、例えば、公知のポリマー型導電インク、銀インク組成物等の導電性のインク、金属箔、電気メッキや静電メッキにより形成された金属薄膜、金属蒸着等の各種薄膜形成法により形成された金属薄膜、金属板等が挙げられる。   The material constituting the first conductive part 41 and the second conductive part 42 is formed by, for example, a known polymer type conductive ink, conductive ink such as a silver ink composition, metal foil, electroplating or electrostatic plating. Examples thereof include metal thin films, metal thin films formed by various thin film forming methods such as metal vapor deposition, and metal plates.

粘着層51,52は、粘着ラベルの分野で公知のものから適宜選択すればよく、特に限定されない。
粘着層51,52は、粘着剤または粘着剤を含有する粘着層形成用組成物を目的とする箇所に塗工し、必要に応じて乾燥させることで形成できる。
The adhesive layers 51 and 52 may be appropriately selected from those known in the field of adhesive labels, and are not particularly limited.
The pressure-sensitive adhesive layers 51 and 52 can be formed by applying a pressure-sensitive adhesive or a pressure-sensitive adhesive-containing composition containing a pressure-sensitive adhesive to a target location and drying it as necessary.

次に、本実施形態の非接触型データ受送信体10の使用方法を説明する。
図2に示すように、第1導電部41の上面41bに粘着層51が設けられた非接触型データ受送信体10の使用方法を説明する。
まず、図4に示すように、第1導電部41および第2導電部42が表側にある場合を基準として、折線71を山折り、折線72を谷折り、折線73を山折りにする。
次いで、非接触型データ受送信体10の第1領域61において、基材21の一方の面21aを、金属からなる被着物100の一面(上面)100aに対向させて配する。そして、図4および図5に示すように、被着物100の一面100aに、粘着層51により、第1導電部41を面で重なるように貼付する。これにより、被着物100の一面100a面側に第1導電部41を配するとともに、第1導電部41を、被着物100の一面100a上に、被着物100と電気的に結合するように配する。
Next, a method of using the non-contact type data receiving / transmitting body 10 of the present embodiment will be described.
As shown in FIG. 2, a method of using the non-contact type data receiving / transmitting body 10 in which the adhesive layer 51 is provided on the upper surface 41 b of the first conductive portion 41 will be described.
First, as shown in FIG. 4, with reference to the case where the first conductive portion 41 and the second conductive portion 42 are on the front side, the folding line 71 is folded in a mountain, the folding line 72 is folded in a valley, and the folding line 73 is folded in a mountain.
Next, in the first region 61 of the non-contact type data receiving / transmitting body 10, one surface 21a of the base material 21 is disposed so as to face one surface (upper surface) 100a of the adherend 100 made of metal. Then, as shown in FIGS. 4 and 5, the first conductive portion 41 is pasted on the surface 100 a of the adherend 100 with the adhesive layer 51 so as to overlap the surface. Thus, the first conductive portion 41 is disposed on the surface 100a side of the adherend 100, and the first conductive portion 41 is disposed on the surface 100a of the adherend 100 so as to be electrically coupled to the adherend 100. To do.

次いで、第1領域61と第2領域62の間隔、第2領域62の間隔と第3領域63の間隔、および、第3領域63と第4領域64の間隔を調節することにより、第2導電部42を、被着物100から離間する。すなわち、図4に示すように、第1領域61と第2領域62が接する(重なる)ことなく、互いに離間するように配する。このとき、ICチップ31が被着物100に貼付された第1領域61から十分に離間するようにする。同様に、第2領域62と第3領域63が接する(重なる)ことなく、互いに離間するように配するとともに、第3領域63と第4領域64が接する(重なる)ことなく、互いに離間するように配する。
これにより、第2導電部42を、被着物100から離間し、その長手方向が被着物100の一面100aに対して離間する方向に延在するように配する。
Next, by adjusting the interval between the first region 61 and the second region 62, the interval between the second region 62 and the third region 63, and the interval between the third region 63 and the fourth region 64, the second conductive The part 42 is separated from the adherend 100. That is, as shown in FIG. 4, the first region 61 and the second region 62 are arranged so as to be separated from each other without contacting (overlapping). At this time, the IC chip 31 is sufficiently separated from the first region 61 attached to the adherend 100. Similarly, the second region 62 and the third region 63 are arranged so as to be separated from each other without contacting (overlapping), and the third region 63 and the fourth region 64 are separated from each other without contacting (overlapping). To arrange.
Thereby, the 2nd electroconductive part 42 is spaced apart from the to-be-adhered object 100, and it distribute | arranges so that the longitudinal direction may extend in the direction spaced apart with respect to the one surface 100a of the to-be-adhered object 100. FIG.

また、図3に示すように、基材21の他方の面21bに粘着層52が設けられた非接触型データ受送信体10の使用方法を説明する。
まず、図6に示すように、第1導電部41および第2導電部42が表側にある場合を基準として、折線71を谷折り、折線72を山折り、折線73を谷折りにする。
次いで、非接触型データ受送信体10の第1領域61において、基材21の他方の面21bを、金属からなる被着物100の一面100aに対向させて配する。そして、図6および図7に示すように、被着物100の一面100aに、粘着層52により、第1導電部41を面で重なるように貼付する。これにより、被着物100の一面100a面とは反対側に第1導電部41を配するとともに、第1導電部41を、被着物100の一面100a上に、被着物100と電気的に結合するように配する。
Moreover, as shown in FIG. 3, the usage method of the non-contact-type data transmission / reception body 10 by which the adhesion layer 52 was provided in the other surface 21b of the base material 21 is demonstrated.
First, as shown in FIG. 6, with reference to the case where the first conductive portion 41 and the second conductive portion 42 are on the front side, the folding line 71 is valley-folded, the folding line 72 is mountain-folded, and the folding line 73 is valley-folded.
Next, in the first region 61 of the non-contact type data receiving / transmitting body 10, the other surface 21 b of the base material 21 is disposed to face the one surface 100 a of the adherend 100 made of metal. Then, as shown in FIGS. 6 and 7, the first conductive portion 41 is pasted on one surface 100 a of the adherend 100 by the adhesive layer 52 so as to overlap the surface. Accordingly, the first conductive portion 41 is disposed on the opposite side of the surface 100a of the adherend 100, and the first conductive portion 41 is electrically coupled to the adherend 100 on the surface 100a of the adherend 100. Arrange as follows.

次いで、第1領域61と第2領域62の間隔、第2領域62の間隔と第3領域63の間隔、および、第3領域63と第4領域64の間隔を調節することにより、第2導電部42を、被着物100から離間する。すなわち、図6に示すように、第1領域61と第2領域62が接する(重なる)ことなく、互いに離間するように配する。このとき、ICチップ31が被着物100に貼付された第1領域61から十分に離間するようにする。同様に、第2領域62と第3領域63が接する(重なる)ことなく、互いに離間するように配するとともに、第3領域63と第4領域64が接する(重なる)ことなく、互いに離間するように配する。
これにより、第2導電部42を、被着物100から離間し、その長手方向が被着物100の一面100aに対して離間する方向に延在するように配する。
Next, by adjusting the interval between the first region 61 and the second region 62, the interval between the second region 62 and the third region 63, and the interval between the third region 63 and the fourth region 64, the second conductive The part 42 is separated from the adherend 100. That is, as shown in FIG. 6, the first region 61 and the second region 62 are arranged so as to be separated from each other without contacting (overlapping). At this time, the IC chip 31 is sufficiently separated from the first region 61 attached to the adherend 100. Similarly, the second region 62 and the third region 63 are arranged so as to be separated from each other without contacting (overlapping), and the third region 63 and the fourth region 64 are separated from each other without contacting (overlapping). To arrange.
Thereby, the 2nd electroconductive part 42 is spaced apart from the to-be-adhered object 100, and it distribute | arranges so that the longitudinal direction may extend in the direction spaced apart with respect to the one surface 100a of the to-be-adhered object 100. FIG.

第2導電部42が、被着物100の一面100aから離間する距離は、非接触型データ受送信体10に必要とされる通信距離に応じて適宜調整される。しかしながら、非接触型データ受送信体10全体の厚み(被着物100の一面100aからの高さ)を出来る限り小さくするためには、所望の通信距離を達成することが可能な離間距離(被着物100の一面100aに対する第2導電部42の離間距離)とすることが好ましい。
なお、被着物100の一面100aに対する第2導電部42の離間距離とは、被着物100の一面100aに対する、第2導電部42の長手方向の末端の距離のことである。
The distance at which the second conductive portion 42 is separated from the one surface 100 a of the adherend 100 is appropriately adjusted according to the communication distance required for the non-contact type data receiving / transmitting body 10. However, in order to reduce the overall thickness of the non-contact type data receiving / transmitting body 10 (height from the one surface 100a of the adherend 100) as much as possible, a separation distance (adherend that can achieve a desired communication distance) It is preferable that the second conductive portion 42 be separated from the one surface 100a by a distance of 100.
The separation distance of the second conductive portion 42 from the one surface 100a of the adherend 100 is the distance of the end in the longitudinal direction of the second conductive portion 42 relative to the one surface 100a of the adherend 100.

また、本実施形態では、非接触型データ受送信体10を折り曲げてから、被着物100の一面100aに第1領域61を貼付する場合を例示したが、本発明はこれに限定されない。本発明にあっては、被着物100の一面100aに第1領域61を貼付した後、上述のように非接触型データ受送信体10を折り曲げてもよい。   In the present embodiment, the case where the first region 61 is pasted on the one surface 100a of the adherend 100 after the non-contact type data receiving / transmitting body 10 is bent is illustrated, but the present invention is not limited to this. In the present invention, after attaching the first region 61 to the one surface 100a of the adherend 100, the non-contact type data receiving / transmitting body 10 may be bent as described above.

本実施形態の非接触型データ受送信体10によれば、被着物100の一面100aとアンテナとなる第2導電部42の電界方向が異なるように非接触型データ受送信体10を配置することができるため、被着物100の一面100aと第2導電部42を大きく離間させることなく、非接触型データ受送信体10の通信を可能とすることができる。   According to the non-contact type data transmitting / receiving body 10 of the present embodiment, the non-contact type data receiving / transmitting body 10 is arranged so that the electric field direction of the second conductive portion 42 serving as the antenna differs from the one surface 100a of the adherend 100. Therefore, communication of the non-contact type data receiving / transmitting body 10 can be performed without greatly separating the one surface 100a of the adherend 100 from the second conductive portion 42.

また、本実施形態の非接触型データ受送信体10によれば、第2導電部42が、その長手方向に沿って折り重ねられることにより、非接触型データ受送信体全体10の厚み(高さ)が大きすぎることなく、被着物100の一面100と第2導電部42を、非接触型データ受送信体10が通信可能となる距離に離間させることができる。   Further, according to the non-contact type data receiving / transmitting body 10 of the present embodiment, the second conductive portion 42 is folded along the longitudinal direction thereof, so that the thickness (high) of the entire non-contact type data receiving / transmitting body 10 is increased. The surface 100 of the adherend 100 and the second conductive portion 42 can be separated by a distance that allows the non-contact type data receiving / transmitting body 10 to communicate with each other.

以下、実施例により本発明をさらに具体的に説明するが、本発明は以下の実施例に限定されるものではない。   EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited to a following example.

[実施例1]
図1に示すような、第1導電部41および第2導電部42からなるボウタイアンテナと、そのボウタイアンテナに電気的に接続されたICチップ31とを有する非接触型データ受送信体10を作製した。また、この非接触型データ受送信体10では、図2に示すように、第1導電部41の上面41bに粘着層51を設けた。
ICチップ31としては、Impinj社製のMonza−4チップを用いた。
ボウタイアンテナの長手方向の長さを80mmとした。
この非接触型データ受送信体10を、図4に示すように、第1導電部41および第2導電部42が表側にある場合を基準として、折線71を山折り、折線72を谷折り、折線73を山折りにして、第1領域61において、基材21の一方の面21aを、金属からなる被着物100の一面(上面)100aに対向させて配した。そして、図4および図5に示すように、被着物100の一面100aに、粘着層51により、第1導電部41を面で重なるように貼付した。
この状態で、被着物100の一面100aに対する第2導電部42の離間距離を変化させて、Voyanticタグテスターにより、非接触型データ受送信体10の通信距離を測定した。
結果を表1に示す。
[Example 1]
As shown in FIG. 1, a non-contact type data transmitter / receiver 10 having a bow tie antenna composed of a first conductive part 41 and a second conductive part 42 and an IC chip 31 electrically connected to the bow tie antenna is produced. did. Further, in this non-contact type data receiving / transmitting body 10, as shown in FIG. 2, an adhesive layer 51 is provided on the upper surface 41 b of the first conductive portion 41.
As the IC chip 31, a Monza-4 chip manufactured by Impinj was used.
The length of the bow tie antenna in the longitudinal direction was 80 mm.
As shown in FIG. 4, the non-contact type data receiving / transmitting body 10 is formed by folding the folding line 71 and folding the folding line 72 on the basis of the case where the first conductive part 41 and the second conductive part 42 are on the front side. The fold line 73 was folded in a mountain, and in the first region 61, one surface 21a of the base material 21 was arranged to face one surface (upper surface) 100a of the adherend 100 made of metal. Then, as shown in FIGS. 4 and 5, the first conductive portion 41 was stuck on one surface 100 a of the adherend 100 with the adhesive layer 51 so as to overlap the surface.
In this state, the separation distance of the second conductive portion 42 with respect to the one surface 100a of the adherend 100 was changed, and the communication distance of the non-contact type data receiving / transmitting body 10 was measured with a Voyant tag tester.
The results are shown in Table 1.

[実施例2]
図1に示すような、第1導電部41および第2導電部42からなるボウタイアンテナと、そのボウタイアンテナに電気的に接続されたICチップ31とを有する非接触型データ受送信体10を作製した。また、この非接触型データ受送信体10では、図3に示すように、基材21の他方の面21bに粘着層52を設けた。
ICチップ31としては、Impinj社製のMonza−4チップを用いた。
ボウタイアンテナの長手方向の長さを80mmとした。
この非接触型データ受送信体10を、図6に示すように、第1導電部41および第2導電部42が表側にある場合を基準として、折線71を谷折り、折線72を山折り、折線73を谷折りにして、第1領域61において、基材21の他方の面21bを、金属からなる被着物100の一面(上面)100aに対向させて配した。そして、図6および図7に示すように、被着物100の一面100aに、粘着層52により、第1導電部41を面で重なるように貼付した。
この状態で、被着物100の一面100aに対する第2導電部42の離間距離を変化させて、Voyanticタグテスターにより、非接触型データ受送信体10の通信距離を測定した。
結果を表1に示す。
[Example 2]
As shown in FIG. 1, a non-contact type data transmitter / receiver 10 having a bow tie antenna composed of a first conductive part 41 and a second conductive part 42 and an IC chip 31 electrically connected to the bow tie antenna is produced. did. Further, in the non-contact type data receiving / transmitting body 10, as shown in FIG. 3, an adhesive layer 52 is provided on the other surface 21 b of the base material 21.
As the IC chip 31, a Monza-4 chip manufactured by Impinj was used.
The length of the bow tie antenna in the longitudinal direction was 80 mm.
As shown in FIG. 6, the non-contact type data receiving / transmitting body 10 is folded on the fold line 71 and the fold line 72 in a mountain fold with reference to the case where the first conductive portion 41 and the second conductive portion 42 are on the front side. The folding line 73 was valley-folded, and in the first region 61, the other surface 21b of the base material 21 was arranged to face one surface (upper surface) 100a of the adherend 100 made of metal. Then, as shown in FIGS. 6 and 7, the first conductive portion 41 was stuck on one surface 100 a of the adherend 100 with the adhesive layer 52 so as to overlap the surface.
In this state, the separation distance of the second conductive portion 42 with respect to the one surface 100a of the adherend 100 was changed, and the communication distance of the non-contact type data receiving / transmitting body 10 was measured with a Voyant tag tester.
The results are shown in Table 1.

[比較例]
比較例として、図1に示す非接触型データ受送信体10を金属からなる被着物100に対向するように配置し、被着物100の一面100aと、第1導電部41の給電点41a若しくは第2導電部42の給電点42aとの間の距離が離間距離となるように、非接触型データ受送信体10と被着物100の間に発泡スチロール製のスペーサーを設置した。
この状態で実施例1と同様に、被着物100の一面100aに対する第2導電部42の離間距離を変化させて、Voyanticタグテスターにより、非接触型データ受送信体10の通信距離を測定した。
[Comparative example]
As a comparative example, the non-contact type data receiving / transmitting body 10 shown in FIG. 1 is arranged so as to face the adherend 100 made of metal, the one surface 100a of the adherend 100, the feeding point 41a of the first conductive portion 41, or the first A styrofoam spacer was installed between the non-contact type data receiving / transmitting body 10 and the adherend 100 so that the distance between the power supply point 42a of the two conductive portions 42 was a separation distance.
In this state, similarly to Example 1, the separation distance of the second conductive portion 42 with respect to the one surface 100a of the adherend 100 was changed, and the communication distance of the non-contact type data receiving / transmitting body 10 was measured with a VOANTIC tag tester.

Figure 0006614533
Figure 0006614533

表1の結果から、実施例1および2の非接触型データ受送信体は、ほぼ同等の通信距離が得られ、比較例の非接触型データ受送信体よりも通信距離が長くなった。例えば、非接触型データ受送信体の通信距離を0.9mとしようとした場合、比較例の非接触型データ受送信体は第2導電部の離間距離が5.0mmであるのに対して、実施例1および2の非接触型データ受送信体は第2導電部の離間距離が1.0mmであった。すなわち、実施例1および2の非接触型データ受送信体は、比較例の非接触型データ受送信体よりも小型化しても、比較例の非接触型データ受送信体と同等の通信距離を達成することができることが確認された。   From the results in Table 1, the non-contact type data receiving / transmitting bodies of Examples 1 and 2 obtained substantially the same communication distance, and the communication distance was longer than that of the non-contact type data receiving / transmitting body of the comparative example. For example, when the communication distance of the non-contact type data receiving / transmitting body is set to 0.9 m, the non-contact type data receiving / transmitting body of the comparative example has a separation distance of the second conductive portion of 5.0 mm. In the non-contact type data receiving / transmitting bodies of Examples 1 and 2, the separation distance of the second conductive portion was 1.0 mm. That is, even if the non-contact type data receiving / transmitting body of Examples 1 and 2 is made smaller than the non-contact type data receiving / transmitting body of the comparative example, the communication distance equivalent to that of the non-contact type data receiving / transmitting body of the comparative example is obtained. It has been confirmed that this can be achieved.

10・・・非接触型データ受送信体、21・・・基材、31・・・ICチップ、41・・・第1導電部、42・・・第2導電部、51,52・・・粘着層、61・・・第1領域、62・・・第2領域、63・・・第3領域、64・・・第4領域、71,72,73・・・折線。 DESCRIPTION OF SYMBOLS 10 ... Non-contact type data transmission / reception body, 21 ... Base material, 31 ... IC chip, 41 ... 1st electroconductive part, 42 ... 2nd electroconductive part, 51, 52 ... Adhesive layer, 61 ... 1st area, 62 ... 2nd area, 63 ... 3rd area, 64 ... 4th area, 71, 72, 73 ... fold line.

Claims (3)

金属からなる被着物の一面に貼付される非接触型データ受送信体であって、
ICチップと、該ICチップを基端として互いに反対方向に延出するグランドとなる第1導電部およびアンテナとなる第2導電部と、を有し、
前記第1導電部は、前記被着物に面で重なるように貼付可能な貼付構造を有し、
前記第1導電部は、前記被着物の一面上に、前記被着物と電気的に結合するように配され、
前記第2導電部は、前記被着物から離間し、その長手方向が前記被着物の一面に対して離間する方向に延在するように配されることを特徴とする非接触型データ受送信体。
A non-contact type data receiving / transmitting body to be attached to one surface of an adherend made of metal,
An IC chip, and a first conductive portion serving as a ground extending in opposite directions with the IC chip as a base end, and a second conductive portion serving as an antenna,
The first conductive portion has a pasting structure that can be pasted so as to overlap the adherend on the surface,
The first conductive part is disposed on one surface of the adherend so as to be electrically coupled to the adherend,
The non-contact type data transmitter / receiver characterized in that the second conductive portion is disposed so as to be separated from the adherend and the longitudinal direction thereof extends in a direction away from one surface of the adherend. .
前記第2導電部は、その長手方向に沿って折り重ねられることを特徴とする請求項1に記載の非接触型データ受送信体。   The contactless data receiving / transmitting body according to claim 1, wherein the second conductive portion is folded along a longitudinal direction thereof. 請求項1または2に記載の非接触型データ受送信体を使用する方法であって、
金属からなる被着物の一面に、前記貼付構造により、前記第1導電部を面で重なるように貼付して、前記第1導電部を、前記被着物の一面上に、前記被着物と電気的に結合するように配し、
前記第2導電部を、前記被着物から離間し、その長手方向が前記被着物の一面に対して離間する方向に延在するように配することを特徴とする非接触型データ受送信体の使用方法。
A method of using the contactless data receiving / transmitting body according to claim 1 or 2,
The first conductive part is pasted on one surface of the adherend made of metal by the pasting structure so as to overlap the surface, and the first conductive portion is electrically connected to the adherend on the one surface of the adherend. Arrange to bond to
A non-contact type data receiving / transmitting body characterized in that the second conductive portion is arranged so as to be separated from the adherend and the longitudinal direction thereof extends in a direction away from one surface of the adherend. how to use.
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