JP6609655B2 - Circuit parts - Google Patents

Description

  The present invention relates to a circuit component in which a circuit pattern is formed on a resin layer and a mounting component is mounted.

  In recent years, MID (Molded Interconnected Device) has been put into practical use in smartphones and the like, and application expansion in the automobile field is expected in the future. MID is a device in which a circuit is formed with a metal film on the surface of a resin molded body, and can contribute to reducing the weight and thickness of a product and reducing the number of parts.

  A MID on which a light emitting diode (LED) is mounted has also been proposed. Since LEDs generate heat when energized, it is necessary to exhaust heat from the back surface, and it is important to improve the heat dissipation of the MID. In Patent Document 1, a composite part in which MID and a metal heat dissipation material are integrated is proposed. Moreover, in MID of patent document 1, the circuit pattern is formed with a plating film.

Japanese Patent No. 3443872

  However, in recent years, electronic devices have become higher in performance and smaller in size, and MID used in the electronic devices has been increased in density and functionality, and higher heat dissipation is required. The present invention solves these problems and provides a circuit component (MID) having high heat dissipation.

According to the invention, the circuit component is a metal member, a short-circuit prevention layer formed on the metal member, a resin layer formed on the short-circuit prevention layer, and formed on the resin layer. A circuit pattern including a plating film, and a mounting component that is mounted on the resin layer and electrically connected to the circuit pattern, and the thermal conductivity of the short-circuit prevention layer is the metal. lower than the thermal conductivity of the member, and the rather high than the thermal conductivity of the resin layer, the thickness of the short circuit-prevention layer, the smaller the surface roughness Rz of the surface of a short circuit prevention layer is formed of the metal member A circuit component is provided.

The short-circuit prevention layer may include ceramics, and the ceramics may be one selected from the group consisting of aluminum oxide, aluminum nitride, boron nitride, silicon nitride, beryllium oxide, silicon carbide, yttria, and zirconia. Good. Moreover, the said short circuit prevention layer may be formed with the inorganic compound with which an unevenness | corrugation is hard to be formed by laser beam irradiation, or the inorganic compound which permeate | transmits the said laser beam. The thickness of the short circuit-prevention layer may be 1 m to 100 m.

  The resin layer may include a thermoplastic resin, a thermosetting resin, or an ultraviolet curable resin, and the thermosetting resin may be an epoxy resin. The resin layer may include an insulating heat conductive filler. The distance between the surface of the resin layer facing the mounting component and the short-circuit prevention layer may be 10 μm to 500 μm. The plating film constituting the circuit pattern is formed on the surface of the resin layer facing the mounting component, and the plating film formed on the surface of the resin layer facing the mounting component; The distance between the short-circuit prevention layer may be 0 μm to 100 μm.

  A groove is formed on the resin layer, and a plating film that forms the circuit pattern is formed in the groove, and the thickness of the plating film is smaller than the depth of the groove. Solder that is disposed across the groove and electrically connects the plating film and the mounting component may be provided in the groove. On the resin layer, the mounting component may be in contact with the grounding surfaces on both sides of the groove. The groove may extend outside the region from a region facing the mounting component on the resin layer. The surface roughness Rz of the surface of the metal member on which the short-circuit prevention layer is formed may be 10 μm to 500 μm, and may be larger than the maximum particle size of the insulating heat conductive filler.

  The resin layer may have a convex portion arranged adjacent to the mounting component on the surface thereof, and the convex portion may surround the periphery of the mounting component. The mounting component may be an LED.

  A circuit component (MID) having high heat dissipation is provided.

FIG. 1A is a schematic top view of a circuit component according to the embodiment, and FIG. 1B is a schematic cross-sectional view taken along line B1-B1 of FIG. FIG. 2 is a partially enlarged view of the circuit component shown in FIG. FIG. 3A is a schematic cross-sectional view showing the periphery of the mounting component before the solder is melted (before solder reflow) in the circuit component of the embodiment, and FIG. 3B is a diagram after the solder is melted (solder) It is a cross-sectional schematic diagram which shows the mode of the mounting component periphery after reflow. Fig.4 (a) is a cross-sectional schematic diagram of the metal member used for the circuit component of embodiment, FIG.4 (b) is a cross-sectional schematic diagram of the metal member which formed the short circuit prevention layer in the surface. FIG. 5A is a schematic top view showing a structure in the process of manufacturing the circuit component of the embodiment, and FIG. 5B is a schematic cross-sectional view taken along line B5-B5 in FIG. FIG. 6A is another schematic top view showing the structure in the middle of manufacturing the circuit component of the embodiment, and FIG. 6B is a schematic cross-sectional view taken along line B6-B6 in FIG. FIG. 7A is a schematic cross-sectional view showing the periphery of a mounted component before melting of solder (before solder reflow) in the circuit component of the modification of the embodiment, and FIG. 7B is melting of solder. It is a cross-sectional schematic diagram which shows the mode of the mounting component periphery after (after solder reflow). FIG. 8A is a schematic cross-sectional view showing a state of the periphery of the mounting component before melting of the solder (before solder reflow) in the circuit component having no groove in the mounting region of the resin layer, and FIG. These are the cross-sectional schematic diagrams which show the mode of the mounting component periphery after melt | dissolution of solder (after solder reflow).

[Circuit parts]
The circuit component 100 shown in FIGS. 1A and 1B and FIG. 2 will be described. The circuit component 100 includes a metal member 50, a short-circuit prevention layer 60, a resin layer 10, a circuit pattern 20 including a plating film 21, and a mounting component 30. The short-circuit prevention layer 60 and the resin layer 10 are formed on the metal member 50 in this order. The circuit pattern 20 including the plating film 21 is formed on a portion of the resin layer 10 that has been roughened by laser light. The mounting component 30 is mounted on the resin layer 10 and is electrically connected to the circuit pattern 20. A surface on which the mounting component 30 of the resin layer 10 is mounted is referred to as a mounting surface 10a.

  The metal member 50 radiates heat generated by the mounting component 30 mounted on the resin layer 10. Therefore, it is preferable to use a metal having a heat dissipation property for the metal member 50. For example, iron, copper, aluminum, titanium, magnesium, stainless steel (SUS), or the like can be used. Among these, magnesium and aluminum are preferably used from the viewpoints of weight reduction, heat dissipation, and cost. These metals may be used alone or in combination of two or more. The thermal conductivity of the metal member 50 is, for example, 80 to 300 W / m · K. In the present embodiment, heat dissipation fins of aluminum alloy formed by die casting are used.

  It is preferable that the surface 50a of the metal member 50 on which the short-circuit prevention layer 60 is formed is roughened to have unevenness in order to improve heat dissipation efficiency. The surface roughness Rz of the surface 50a is preferably larger than the maximum particle size of the insulating heat conductive filler contained in the resin layer 10, for example, 10 μm to 500 μm, preferably 30 μm to 200 μm, more preferably, 50 μm to 100 μm. The surface roughness Rz is obtained by surface observation, cross-sectional observation, or the like of the surface 50a using a microscope.

The short-circuit prevention layer 60 is formed on the surface 50 a of the metal member 50. The short-circuit prevention layer 60 has a property that it is less likely to be cut by laser light than the resin layer 10. Thereby, the short circuit with the metal film 50 and the plating film 21 formed in the part roughened with the laser beam can be prevented. In order to reduce damage (deterioration) due to heat generated by laser light, the short-circuit prevention layer 60 is a dense layer having heat resistance, or has low laser light absorption (high laser light transmittance). Is preferred. Here, the laser light in order to improve adhesion strength of the plating film 21, a laser beam used for roughening of the resin layer 10, for example, a YV0 ₄ laser or a fiber laser with a wavelength 1064～1094Nm.

  The short-circuit prevention layer 60 has an insulating property in order to insulate the circuit pattern 20 and the metal member 50 together with the resin layer 10 to prevent a short circuit. The degree of insulation depends on the application (application) of the circuit component 100, but preferably has a resistance of 5000 MΩ or more when a voltage of 500 V is applied, for example.

  Moreover, in order to improve the heat dissipation of the circuit component 100, the short-circuit prevention layer 60 preferably has a high thermal conductivity. Thus, it is preferable that the short circuit prevention layer 60 is an insulating heat conductive layer (insulating heat dissipation layer) having both insulating properties and high thermal conductivity. The thermal conductivity of the short-circuit prevention layer 60 is, for example, 5 to 150 W / m · K. Further, in order to efficiently release the heat generated by the mounting component 30 on the resin layer 10 to the metal member 50, the thermal conductivity of the short-circuit prevention layer 60 is lower than the thermal conductivity of the metal member 50, and the heat conduction of the resin layer 10. Preferably higher than the rate.

  The short-circuit prevention layer 60 is preferably formed of an inorganic compound in which unevenness is difficult to be formed by laser light irradiation, or an inorganic compound that transmits (does not absorb) laser light. Examples of such an inorganic compound include ceramics or carbon materials such as diamond-like carbon (DLC) and graphene oxide. Examples of ceramics include aluminum oxide (alumina), aluminum nitride, boron nitride, silicon nitride, beryllium oxide, silicon carbide, yttria, zirconia, titanium dioxide, silicon dioxide, clay minerals, etc. Among them, low-cost and dense thin films It is preferable to use yttria or alumina, which can easily form. These ceramics may be used alone or in combination of two or more.

  The film thickness of the short-circuit prevention layer 60 is, for example, 1 μm to 100 μm, preferably 5 μm to 20 μm, and more preferably 5 μm to 10 μm. Moreover, it is preferable that the short-circuit prevention layer 60 has a thickness that does not fill the unevenness of the surface 50a of the metal member 50. Moreover, it is preferable that the surface 60a on which the resin layer 10 of the short-circuit preventing layer 60 is formed has a surface roughness Rz equivalent to the surface 50a, reflecting the unevenness of the surface 50a of the metal member 50. Therefore, the film thickness of the short-circuit prevention layer 60 is preferably smaller than the surface roughness Rz of the surface 50a. Thereby, the adhesive strength between the short-circuit prevention layer 60 and the resin layer 10 can be increased.

  In addition, even if the thermal conductivity of the short circuit prevention layer 60 is about 1 W / mK, which is relatively low, if the laser light absorption is low (the laser light transmittance is high), it is difficult to be cut by the laser light. Therefore, a short circuit between the plating film 21 and the metal member 50 can be sufficiently prevented. An example of such a material is silicon dioxide. However, when the thermal conductivity of the short-circuit prevention layer 60 is relatively low, it is preferable to reduce the thickness of the short-circuit prevention layer 60 to about 0.5 to 10 μm in order to improve heat dissipation.

  The resin layer 10 is formed on the surface 60 a of the short-circuit prevention layer 60. The resin layer 10 has an insulating property in order to insulate the circuit pattern 20 and the metal member 50 together with the short-circuit prevention layer 60 to prevent a short circuit. The degree of insulation depends on the application of the circuit component 100, but it is desirable to have a resistance of 5000 MΩ or more when a voltage of 500 V is applied. Moreover, in order to improve the heat dissipation of the circuit component 100, it has a certain amount of thermal conductivity. Thus, the resin layer 10 is an insulating heat-dissipating resin layer having both insulating properties and a certain degree of thermal conductivity. The thermal conductivity of the resin layer 10 is, for example, 1 to 5 W / m · K.

  The resin layer 10 contains a resin. In the present embodiment, the mounting component 30 is mounted on the resin layer 10 by soldering. For this reason, the resin used for the resin layer 10 is preferably a heat-resistant, high-melting resin having solder reflow resistance. The melting point of the resin used for the resin layer 10 is preferably 260 ° C. or higher, and more preferably 290 ° C. or higher. Note that this is not the case when low-temperature solder is used for mounting the mounting component 30.

  As the resin used for the resin layer 10, for example, a thermosetting resin, a thermoplastic resin, or an ultraviolet curable resin can be used. Among these, a thermosetting resin that is easy to mold thinly, has high molding accuracy, and has high heat resistance and high density after curing is preferable. As the thermosetting resin, for example, a heat-resistant resin such as an epoxy resin, a silicone resin, or a polyimide resin can be used, and an epoxy resin is particularly preferable. As the photocurable resin, for example, a polyimide resin, an epoxy resin, or the like can be used. Examples of the thermoplastic resin include aromatic polyamides such as 6T nylon (6TPA), 9T nylon (9TPA), 10T nylon (10TPA), 12T nylon (12TPA), MXD6 nylon (MXDPA), and alloy materials thereof, polyphenylene sulfide. (PPS), liquid crystal polymer (LCP), polyetheretherketone (PEEK), polyetherimide (PEI), polyphenylsulfone (PPSU), and the like can be used. These thermosetting resins, ultraviolet curable resins and thermoplastic resins may be used alone or in combination of two or more.

  The resin layer 10 of the present embodiment may include an insulating heat conductive filler. Here, the insulating heat conductive filler is a filler having a thermal conductivity of 1 W / m · K or more, and excludes a conductive heat dissipation material such as carbon. Examples of the insulating heat conductive filler include ceramic powders such as aluminum oxide, silicon oxide, magnesium oxide, magnesium hydroxide, boron nitride, and aluminum nitride, which are inorganic powders having high thermal conductivity. In order to increase the contact rate between the fillers and increase the heat transfer property, a rod-like filler such as wollastonite or a plate-like filler such as talc or boron nitride may be mixed. These insulating heat conductive fillers may be used alone or in combination of two or more.

  For example, when relatively inexpensive ceramic particles are used, the particle size (particle size) of the insulating heat conductive filler is preferably 30 μm to 100 μm. Moreover, when making thickness d1 of the resin layer 10 thin, the particle size of an insulating heat conductive filler has preferable 30 micrometers-50 micrometers. Further, in order to improve heat dissipation, the particle size of the insulating heat conductive filler is preferably smaller than the surface roughness Rz of the surface 50a of the metal member 50. When the particle size of the insulating heat conductive filler is smaller than the surface roughness Rz of the surface 50a, more insulating heat conductive filler is in the recesses of the surface 60a of the short-circuit prevention layer 60 having the same surface roughness as the surface 50a. Can exist. Thereby, the heat generated by the mounting component 30 can be easily released to the metal member 50 through the insulating heat conductive filler and the short-circuit prevention layer 60, and the heat dissipation of the circuit component 100 is improved.

  The insulating heat conductive filler is contained in the resin layer 10 by, for example, 10 wt% to 90 wt%, and preferably 30 wt% to 80 wt%. When the blending amount of the insulating heat conductive filler is within the above range, the circuit component 100 of the present embodiment can obtain sufficient heat dissipation.

  The resin layer 10 may further include a rod-like or needle-like filler such as glass fiber or calcium titanate in order to control the strength. Moreover, the resin layer 10 may contain the general purpose various additives added to a resin molding as needed. Hereinafter, a material including all of the resin constituting the resin layer 10 and the insulating heat conductive filler may be referred to as “resin material”.

  As shown in FIG. 2, the distance between the surface (mounting region 12) of the resin layer 10 facing the bottom surface 30b of the mounting component 30 and the short-circuit prevention layer 60 is a distance d1. A distance between the plating film 21 formed on the surface (mounting region 12) of the resin layer 10 facing the mounting component 30 and the short-circuit prevention layer 60 is a distance d2. In the circuit component 100, the thickness of the resin layer 10 can be appropriately determined according to the application of the circuit component 100, but the heat dissipation of the circuit component 100 tends to improve as the thickness of the resin layer 10 decreases. In particular, if the thickness of the portion where the mounting component 30 serving as a heat source is mounted, that is, the distance d1 shown in FIG. 2 is small, the distance d2 is small as a result, and the heat dissipation of the circuit component 100 is improved. On the other hand, if the distance d1 is too small, the resin becomes difficult to flow in the molding of the resin layer 10 and the productivity is lowered. From these viewpoints, the distance d1 is, for example, 10 μm to 500 μm, preferably 30 μm to 300 μm, and more preferably 50 to 150 μm. Moreover, if the distance d2 is small, the heat dissipation of the circuit component 100 is improved, but if the distance d2 is too small, the plating film 21 and the metal member 50 may be short-circuited. However, when the short-circuit prevention layer 60 has a property of not absorbing laser light, for example, and is hardly deteriorated by laser light irradiation, the distance d2 = 0, that is, the plating film 21 and the short-circuit prevention layer 60 May contact. Since the short-circuit prevention layer 60 is insulative, the plating film 21 and the metal member 50 are not short-circuited even when d2 = 0. From these viewpoints, the distance d2 is, for example, 0 μm to 100 μm, preferably 5 μm to 50 μm, and more preferably 5 μm to 30 μm.

  Here, the distances d1 and d2 are distances in the direction of the perpendicular m (see FIG. 1B) of the surface (mounting surface 10a) of the resin layer 10. In addition, as shown in FIG. 2, when the surface 60a of the short-circuit prevention layer 60 and the lower surface of the plating film 21 (bottom of the groove 13) are not flat and have irregularities, the distance between the mounting surface 10a and the surface 60a, the groove The distance between the bottom of 13 and the surface 60a varies. In such a case, the distances d1 and d2 mean an average value of these distances. In the present embodiment, since the thickness of the resin layer 10 is substantially constant, the distance d1 is also the thickness d1 of the resin layer 10 (see FIG. 1).

  The circuit pattern 20 is formed by a plating film 21 on the mounting surface 10 a of the resin layer 10. Since the circuit pattern 20 is formed on the resin layer 10 which is an insulator, it is preferably formed by electroless plating. Therefore, the circuit pattern 20 may include, for example, an electroless plating film such as an electroless nickel phosphorus plating film, an electroless copper plating film, and an electroless nickel plating film, and among them, may include an electroless nickel phosphorus plating film. preferable. Another type of electroless plating film or electrolytic plating film may be further laminated on the electroless plating film on the resin layer 10 to form the circuit pattern 20. By increasing the total thickness of the plating film 21, the electrical resistance of the circuit pattern 20 can be reduced. From the viewpoint of reducing electrical resistance, the circuit pattern 20 preferably includes an electroless copper plating film, an electrolytic copper plating film, an electrolytic nickel plating film, and the like. Further, in order to improve the solder wettability of the plating film, a plating film of gold, silver, tin or the like may be formed on the outermost surface of the circuit pattern 20.

  If a gold plating film is provided on the outermost surface of the circuit pattern 20, solder wettability is improved and corrosion of the circuit pattern 20 can be prevented. However, if a gold plating film is provided on the entire outermost surface of the circuit pattern 20, the cost increases. In order to prevent corrosion of the circuit pattern 20 while suppressing an increase in cost, a circuit pattern formed in the mounting region 12 is covered with a resist on the mounting surface 10a other than the region where the mounting component 30 is soldered (the mounting region 12). A gold plating film may be formed only on the outermost surface of 20. In the mounting region 12, the wettability of the solder is improved by the gold plating film and the corrosion of the circuit pattern 20 is suppressed, and in the portion other than the mounting region 12, the corrosion of the circuit pattern 20 is suppressed by an inexpensive resist.

  In the present embodiment, the circuit pattern 20 is formed on a roughened portion (laser drawing portion) roughened by laser light irradiation or the like. Thereby, the adhesive strength between the plating film 21 constituting the circuit pattern 20 and the resin layer 10 is improved.

  The mounting component 30 is mounted with the bottom surface 30b facing the mounting surface 10a. In the mounting surface 10 a, the region where the bottom surface 30 b faces is the mounting region 12. The mounting component 30 and the circuit pattern 20 are electrically connected by solder 40. The solder 40 is not particularly limited, and a general-purpose one can be used. The mounted component 30 generates heat by energization and becomes a heat source.

  Any component can be used as the mounting component 30, and examples thereof include an LED (light emitting diode), a power module, an IC (integrated circuit), and a thermal resistance. In the present embodiment, a plurality of (four) LEDs connected in series are used as the mounting component 30 (FIGS. 1A and 1B). In the present embodiment, the electrode 31 of the mounting component (LED) 30 and the circuit pattern 20 are connected via the solder 40. Note that the number of mounting components 30 to be mounted on the mounting surface 10a is arbitrary, and can be appropriately determined according to the application of the circuit component 100.

  As shown in FIG. 2, a groove 13 is formed at least in the mounting region 12 on the mounting surface 10a. The mounting component 30 is disposed across the groove 13 and contacts the ground planes 14 on both sides of the groove 13 in the mounting region 12. The mounting surface 30 is positioned in the height direction by the ground plane 14. In other words, the position of the mounting component 30 in the vertical direction of the mounting surface 10 a is determined by the ground plane 14. The number of the grooves 13 is arbitrary, and may be one or plural, and can be appropriately determined according to the size of the mounting component 30 or the like. In the present embodiment, two grooves 13 a and 13 b are provided in the mounting region 12. As a result, three ground planes 14a, 14b, and 14c are formed. The wall 16 having the grounding surface 14b sandwiched between the two grooves 13a and 13b also has an effect of preventing a short circuit of the plating film 21 formed in the grooves 13a and 13b, respectively.

  Each of the ground planes 14a, 14b, and 14c is horizontal, and the heights (positions in the direction perpendicular to the mounting surface 10a) of the three ground planes 14a, 14b, and 14c are the same. In the present embodiment, the ground planes 14a, 14b, and 14c are regions in the mounting surface 10a and exist in the same horizontal plane as the mounting surface 10a. The groove 13 may be formed only in the mounting region 12 or may extend from the mounting region 12 to the outside of the mounting region. In the present embodiment, as shown in FIG. 1A, in the mounting surface 10a, the groove 13 extends from the mounting region 12 to the outside of the mounting region 12, that is, the region not facing the bottom surface 30b of the mounting component 30. Yes.

  As shown in FIG. 2, a plating film 21 constituting a part of the circuit pattern 20 is formed in the grooves 13a and 13b, and the thickness of the plating film 21 in the grooves 13a and 13b is the grooves 13a and 13b. Less than the depth of. That is, the plating film 21 is accommodated in the grooves 13a and 13b, and the surface 21a of the plating film 21 does not protrude from the grooves 13a and 13b. The plated film 21 in the grooves 13a and 13b is not in direct contact with the mounting component 30 disposed on the grooves 13a and 13b so as to straddle the grooves 13a and 13b. The plating film 21 in the grooves 13 a and 13 b and the mounting component 30 are electrically connected by solder 40.

  The size of the groove 13 is not particularly limited, and can be appropriately set according to the size of the mounting component 30 and the like. The depth of the groove 13 is, for example, 30 μm to 300 μm, 50 μm to 200 μm, and the width of the groove 13 is, for example, 0.1 mm to 5.0 mm, 0.5 mm to 1.0 mm. The thickness of the plating film 21 formed in the groove 13 is, for example, 5 μm to 100 μm, 10 μm to 80 μm. The distance between the surface 21a of the plating film and the ground plane 14 is, for example, 5 μm to 50 μm, 10 μm to 30 μm. If the depth and width of the groove 13, the thickness of the plating film 21, and the distance between the surface 21 a of the plating film and the ground plane 14 are not constant (if they fluctuate), the average value of these is preferably within the above range. . In this embodiment, although details will be described later, the groove 13 is formed on the mounting surface 10a simultaneously with the molding of the resin layer 10 (see FIG. 5), and then the bottom of the groove 13 where the plating film 21 is formed is laser-shaped. Roughening by light irradiation. Since it is cut by the laser beam, the depth of the groove 13 becomes deeper by the amount roughened than at the time of molding. Therefore, in this embodiment, the depth of the groove 13 is the sum of the depth at the time of forming the groove 13 and the cutting depth of the laser beam.

  In the circuit component 100 of the present embodiment described above, the heat dissipation of the circuit component 100 can be improved by providing the short-circuit prevention layer 60 on the metal member 50 as described below.

  In the present embodiment, the heat dissipation of the circuit component 100 is improved as the distance d2 between the plating film 21 and the short-circuit prevention layer 60 shown in FIG. On the other hand, the plating film 21 is formed on a portion of the resin layer 10 roughened by laser light or the like. In the roughened portion, there is a possibility that the circuit pattern 20 (plated film 21) and the metal member 50 are short-circuited due to the bond between the void in the resin layer 10 and the roughened portion, the lack of filler in the resin layer 10, and the like. As the distance d2 is smaller, the plating film 21 and the metal member 50 are more likely to be short-circuited. In order to solve these problems, in the present embodiment, a short-circuit prevention layer 60 is provided on the metal member 50. Since the short-circuit prevention layer 60 is less likely to be cut by laser light than the resin layer 10, even if d2 is reduced, a short circuit between the plating film 21 and the metal member 50 can be prevented. Thereby, the heat dissipation of the circuit component 100 can be improved.

  Further, the thermal conductivity of the short-circuit prevention layer 60 is preferably lower than the thermal conductivity of the metal member 50 and higher than the thermal conductivity of the resin layer 10. Thereby, the heat generated by the mounting component 30 on the resin layer 10 can be efficiently released to the metal member 50 via the short-circuit prevention layer 60, and the heat dissipation of the circuit component 100 is improved.

  Further, in the circuit component 100 of the present embodiment, the cost of the circuit component 100 can be reduced by providing the short-circuit prevention layer 60 on the metal member 50. In order to improve the heat dissipation of the circuit component 100, in the present embodiment, even if the thermal conductivity of the resin layer 10 is somewhat low, for example, even if it is about 1 to 5 W / m · K, the circuit component 100 as a whole is sufficient. Good heat dissipation. In general, a resin material having a high thermal conductivity is expensive. By forming the resin layer 10 with a resin material having a relatively low thermal conductivity, the cost of the circuit component 100 can be reduced.

  In the circuit component 100 of the present embodiment, the productivity of the resin layer 10 is also improved by providing the short-circuit prevention layer 60 on the metal member 50. In general, since a resin material having a high thermal conductivity has a high content of an insulating thermal conductive filler, the curing rate is low and the fluidity during molding is low. For this reason, if a resin material having a high thermal conductivity is used, the productivity of the resin layer 10 is lowered. Furthermore, when the surface roughness of the surface 50a of the metal member 50 is large, the transfer area on the metal member 50 side of the resin layer 10 increases, and the high-temperature resin material is rapidly cooled during molding. Thereby, the fluidity | liquidity of the resin material at the time of shaping | molding further falls. However, in the present embodiment, since a resin material having a relatively low thermal conductivity, that is, a resin material having a relatively low content of the insulating heat conductive filler can be used, the fluidity during molding can be improved and cured. You can speed up. Furthermore, by providing the short-circuit preventing layer 60 on the metal member 50, the resin material can avoid direct contact with the metal member 50 having high thermal conductivity. Thereby, rapid cooling of the resin material is eased, and the productivity of the resin layer 10 is further improved.

  Furthermore, in the circuit component 100 of this embodiment, the inclination with respect to the mounting surface 10a (reference surface) of the mounting component 30 mounted in the resin layer 10 can be suppressed. When mounting a plurality of mounting components 30 on the mounting surface 10a, variation in position in the height direction (a direction perpendicular to the mounting surface 10a) between the mounting components can be suppressed. Therefore, in the circuit component 100 of the present embodiment, it is used adjacent to a mounting component in which tilting with respect to the mounting surface 10a and a positional deviation in the height direction (direction perpendicular to the mounting surface 10a) are difficult to tolerate, or where interference is likely to occur. A plurality of mounted components can be suitably used. Below, in this embodiment, the mechanism which can suppress the inclination with respect to the mounting surface 10a (reference surface) of the mounting component 30 is demonstrated.

  Depending on the application of the circuit component, high positioning accuracy in the height direction of the mounting component 30 (direction perpendicular to the mounting surface 10a) is required. For example, in an automobile headlight module including a plurality of LEDs, light distribution control becomes difficult if the LEDs are inclined with respect to the reference plane. However, when the circuit pattern 20 is formed by the plating film 21 on the resin layer 10, it is difficult to control the roughening depth by the laser beam and the thickness of the plating film with high accuracy. Furthermore, when electrolytic plating is used to form the circuit pattern 20, unevenness occurs in the thickness of the plating film 21 depending on the position from the electrode used for electrolytic plating. Thus, when forming the circuit pattern 20 which consists of the plating film 21 on the resin layer 10, the height of the surface 21a of the plating film 21 becomes non-uniform | heterogenous.

  3A and 3B schematically show the surroundings of the mounting component 30 before and after the solder 40 is melted. 3A and 3B emphasize that the height of the surface 21a of the plating film 21 is not uniform. Before the solder 40 is melted (before solder reflow) shown in FIG. 3A, the mounting component 30 is installed on the plating film 21 with the surface 21a having a non-uniform height via the solder 40 at room temperature. For this reason, the mounting component 30 is inclined with respect to the mounting surface 10a. At this time, the solder 40 and the mounting component 30 are brought into contact with each other by using a normal temperature solder 40 protruding from the groove 13.

  The mounting component 30 shown in FIG. 3A is passed through a reflow furnace to perform solder reflow. At this time, the solder 40 is melted, and the melted solder 40 spreads on the surface 21 a of the plating film 21 in the length direction of the groove 13. At the same time, due to the surface tension of the melted solder 40, a force for pulling the mounting component 30 in the direction toward the resin layer 10 (the direction of the arrow shown in FIG. 3A) is generated. The electrode 31 of the mounting component 30 pulled by the solder 40 contacts the horizontal ground planes 14a, 14b, 14c on both sides of the grooves 13a, 13b. Thus, the mounting component 30 is accurately positioned in the height direction, and then the solder 40 is solidified and the mounting component 30 is fixed (FIG. 3B). Further, even when a plurality of mounting components 30 are mounted on the mounting surface 10a, the height of each grounding surface 40 for positioning each mounting component 30 (the position in the direction perpendicular to the mounting surface 10a) is the same. Thereby, the variation in the height direction between the plurality of mounting components 30 can also be suppressed.

  Since the solder 40 spreads on the surface 21a of the plating film 21 when the solder 40 is melted, the groove 13 is preferably formed longer or wider than the region where the solder 40 is installed. The groove 13 may extend from the mounting region 12 to a region outside the mounting region 12. In this case, the solder 40 may extend to the outside of the mounting area 12.

  For comparison with the present embodiment, FIGS. 8A and 8B show a mounting component 30 mounted on a resin layer 80 that does not have the groove 13 and the ground plane 14 in the mounting region 12. Before the solder reflow shown in FIG. 8A, the height of the surface 21a of the plating film is not uniform, so that the mounting component 30 is inclined with respect to the mounting surface 80a. However, even if the solder reflow is performed, since the resin layer 80 does not have the groove 13 and the grounding surface 14, the inclination of the mounted component 30 is solidified without being corrected (FIG. 8B).

  In the embodiment described above, the circuit pattern 20 is formed only on the mounting surface 10a of the plate-like resin layer 10 as shown in FIGS. 1A and 1B. Is not limited to this. The resin layer 10 is not limited to a plate shape, and may have an arbitrary shape according to the application of the circuit component 100. The circuit pattern 20 may be three-dimensionally formed over a plurality of surfaces of the resin layer 10 or along a three-dimensional surface including a spherical surface. When the circuit pattern 20 is three-dimensionally formed over a plurality of surfaces of the resin layer 10 or along a three-dimensional surface including a spherical surface, the circuit component 100 functions as a three-dimensional molded circuit component.

[Method for manufacturing circuit components]
A method for manufacturing the circuit component 100 will be described. First, the metal member 50 is prepared (FIG. 4A). The metal member 50 may be a commercially available metal plate, a heat radiating fin, or the like, or may be formed into an arbitrary shape by die casting. The surface roughness Rz of the surface 50a connected to the resin layer 10 of the metal member 50 is preferably, for example, 10 μm to 500 μm. The surface 50a may be roughened to form irregularities so as to have a desired surface roughness, for example, by laser light irradiation or the like.

  Next, the short-circuit prevention layer 60 is formed on the surface 50a of the metal member 50 (FIG. 4B). The method for forming the short-circuit prevention layer 60 is not particularly limited. For example, physical vapor deposition (PVD) such as vacuum vapor deposition and ion plating, chemical vapor deposition (CVD) such as plasma CVD, and aerosol deposition (AD) method. Sputtering, thermal spraying, cold spraying, warm spraying, etc. can be used. Among them, PVD, AD method, and the like that can form a dense thin film on the surface 50a having a rough and complicated shape at low cost are suitable.

  Next, the resin layer 10 is formed on the surface 60 a of the short-circuit prevention layer 60. For example, the resin layer 10 may be formed by insert molding (integral molding). Specifically, the metal member 50 on which the short-circuit prevention layer 60 is formed is first placed in a mold, and a resin material is injected and filled into an empty portion of the mold. Thereby, the metal member 50 in which the short circuit prevention layer 60 is formed and the resin layer 10 are integrally molded. As the insert molding, injection molding, transfer molding, or the like can be used. As described above, the resin layer 10 and the metal member 50 having the short-circuit preventing layer 60 formed on the surface thereof may be an integrally molded body integrally molded. Here, the integrally formed body is not bonded or bonded (secondary bonding or mechanical bonding) between the separately produced metal member 50 and the resin layer 10, but when the resin layer 10 is molded, It means what was manufactured by the process to join (typically insert molding). In addition, it is preferable that a convex portion corresponding to the groove 13 is provided on the mold, and the groove 13 is formed simultaneously with the formation of the resin layer 10 (FIGS. 5A and 5B).

  Next, the circuit pattern 20 is formed on the surface of the resin layer 10 including the mounting surface 10a. A part of the circuit pattern 20 is formed in the groove 13. The method for forming the circuit pattern 20 is not particularly limited, and a general-purpose method can be used. For example, a method of forming a plating film on the entire mounting surface 10a, patterning the plating film with a photoresist, removing the plating film other than the circuit pattern by etching, and irradiating the part where the circuit pattern is to be formed with laser light For example, a method of roughening the resin layer and forming a plating film only on the portion irradiated with the laser beam may be used.

  In the present embodiment, the circuit pattern 20 is formed by the method described below. First, a catalytic activity blocking layer (not shown) is formed on the surface of the resin layer 10. Next, the portion where the electroless plating film of the mounting surface 10a of the resin layer 10 on which the catalytic activity interference layer is formed, that is, the portion where the circuit pattern 20 is formed is laser-drawn. As a result, a laser drawing portion is formed on the mounting surface 10a. At this time, laser drawing is also performed in the groove 13 where the circuit pattern 20 is formed. Next, an electroless plating catalyst is applied to the surface of the resin layer 10 drawn by laser, and an electroless plating solution is brought into contact therewith. The catalytic activity blocking layer prevents (blocks) the catalytic activity of the electroless plating catalyst applied thereon. For this reason, formation of an electroless plating film is suppressed on the catalytic activity interference layer. On the other hand, in the laser drawing portion, the electroactive plating film is generated because the catalytic activity interference layer is removed. Thereby, the circuit pattern 20 by the electroless plating film 21 is formed in the laser drawing portion (FIGS. 6A and 6B).

  The catalyst activity blocking layer can be formed using a resin (catalyst deactivator) that blocks the catalyst activity. The catalyst deactivator is preferably a polymer having an amide group and a dithiocarbamate group in the side chain. It is presumed that the amide group and dithiocarbamate group in the side chain act on the metal ion serving as the electroless plating catalyst and prevent the catalytic ability from being exerted. The catalyst deactivator is preferably a dendritic polymer such as a dendrimer or a hyperbranched polymer. As the catalyst deactivator, for example, a polymer disclosed in Japanese Patent Application Laid-Open No. 2017-160518 can be used, and a blocking layer is formed on the surface of the resin layer 10 by a method disclosed in the same patent publication. it can.

  A laser beam and a laser drawing method used for laser drawing are not particularly limited, and a general-purpose laser beam and a laser drawing method can be appropriately selected and used. In the laser drawing portion, the catalyst activity blocking layer (not shown) is removed and the surface of the resin layer 10 is roughened. Thereby, the electroless plating catalyst is easily adsorbed to the laser drawing portion. Further, the inside of the groove 13 is cut by laser drawing, and the depth of the groove 13 becomes deeper than that at the time of molding.

  The electroless plating catalyst is not particularly limited, and a general-purpose catalyst can be appropriately selected and used. Further, as the electroless plating catalyst, for example, a plating catalyst solution containing a metal salt such as palladium chloride disclosed in Japanese Patent Application Laid-Open No. 2017-036486 may be used. When a plating catalyst solution containing a metal salt is used as the electroless plating catalyst, a pretreatment solution that promotes adsorption of the electroless plating catalyst may be applied to the resin layer 10 before applying the plating catalyst solution to the resin layer 10. Good. As the pretreatment liquid, for example, an aqueous solution containing a nitrogen-containing polymer such as polyethyleneimine can be used.

  The electroless plating solution and the electroless plating method are not particularly limited, and general-purpose electroless plating solutions and electroless plating methods can be appropriately selected and used. The electroless plating solution contains a reducing agent such as sodium hypophosphite and formalin. As an electroless plating solution, an electroless nickel plating solution, an electroless nickel phosphorous plating solution, an electroless copper plating solution, an electroless palladium plating solution, or the like can be used. Among them, the reduction effect of an electroless plating catalyst (metal ion) An electroless nickel plating solution (electroless nickel phosphorus plating solution) containing high sodium hypophosphite as a reducing agent and having a stable plating solution is preferable. In forming the circuit pattern 20, another type of electroless plating film or electrolytic plating film may be further laminated on the electroless plating film. In the groove 13, the thickness of the plating film 21 is controlled to be smaller than the depth of the groove 13. That is, the surface 21a of the plating film 21 is controlled so as not to reach the ground plane 14 (FIG. 6B).

  As described above, in order to prevent the circuit pattern 20 from being corroded while suppressing an increase in cost, the mounting surface 10a is covered with a resist other than the mounting region 12 where the mounting component 30 is soldered and formed in the mounting region 12. A gold plating film may be formed only on the outermost surface of the circuit pattern 20 to be formed. Such a circuit pattern can be formed, for example, by the following method. First, a solder resist (for example, manufactured by Taiyo Ink Co., Ltd.) is applied to the mounting surface 10a of the resin layer 10 on which the circuit pattern 20 excluding the outermost gold plating film is formed to form a resist layer. Next, the resist layer on the mounting region 12 is removed using laser light to form an opening, and the circuit pattern 20 is exposed in the opening. Then, a gold plating film is formed only on the outermost surface of the circuit pattern 20 exposed in the opening.

  After the circuit pattern 20 is formed on the resin layer 10, the mounting component 30 is mounted on the mounting region 12 of the resin layer 10 with the solder 40. Thereby, the circuit component 100 of this embodiment is obtained. The mounted component 30 contacts the plating film 21 in the groove 13 via the solder 40. As described above, when the mounting component 30 is mounted, the mounting component 30 is pulled in the direction toward the resin layer 10 (the arrow direction shown in FIG. 3A) by the melted solder 40, and the mounting component 30 is grounded. 14a, 14b, 14c abuts. Thereby, even if the height of the surface 21a of the plating film 21 is not uniform, the mounting component 30 is accurately positioned in the height direction (FIG. 3B).

  The mounting method of the mounting component 30 is not particularly limited, and a general-purpose method can be used. For example, solder reflow in which the solder 40 and the mounting component 30 are placed on the plating film 21 and passed through a high-temperature reflow furnace. Alternatively, the mounting component 30 may be soldered to the resin layer 10 by a laser soldering method (spot mounting) in which soldering is performed by irradiating the interface between the resin layer 10 and the mounting component 30 with a laser beam.

[Modification]
A modification of the present embodiment shown in FIGS. 7A and 7B will be described. The circuit component 100 of the present embodiment may have a restricting portion (convex portion) 17 disposed adjacent to the mounting component 30 on the mounting surface 10a. In the present modification, the restricting portion 17 surrounds the mounting component 30. That is, the resin layer 10 has a restricting portion (convex portion) 17 disposed on the mounting surface 10 a near the boundary of the mounting region 12 and outside the mounting region 12, and the restricting portion 17 surrounds the mounting region 12. Surrounding. The mounting component 30 is disposed in the mounting region 12 surrounded by the restriction portion 17, and at least a part of the restriction portion 17 is in contact with the mounting component 30.

  In the present modification, the configuration other than the resin layer 10 having the convex portions 17 is the same as that of the circuit component 100 shown in FIG. Therefore, in this modification, the heat dissipation of the circuit component 100 can be improved by the short-circuit prevention layer 60 as in the embodiment described above. Further, when the mounting component 30 is in contact with the ground plane 14, the inclination of the mounting component 30 with respect to the mounting surface 10 a (reference surface) can be suppressed. Furthermore, this modification has the following effects by providing the restricting portion 17.

  First, positioning the mounting component 30 on the mounting surface 10a (positioning in the horizontal direction) can be performed accurately and easily by placing the mounting component 30 in contact with the restricting portion 17. Further, the restricting unit 17 can prevent a phenomenon (Manhattan phenomenon) that the mounting component 30 rises with respect to the mounting surface 10a, which occurs when the mounting component 30 is passed through the reflow furnace. This phenomenon is caused by a difference in surface tension that pulls the mounting component 30 between the plurality of solders 40 when the mounting component 30 is brought into contact with the plurality of solders 40. The difference in surface tension is caused by variations in the height of the solder surface 40a among the plurality of solders 40, the amount of solder 40, the temperature during solder reflow, and the like. In this modification, by providing the restricting portion 17 adjacent to the mounting component 30, the position and movement of the mounting component 30 can be restricted, and the mounting component 30 can be prevented from rising during solder reflow.

  7A and 7B schematically show the surroundings of the mounting component 30 before and after melting of the solder 40 of the present modification. Before the solder 40 is melted (before solder reflow) shown in FIG. 7A, the height of the surface 21a of the plating film 21 is not uniform. For this reason, the height of the surface 40a of the solder 40 disposed thereon is different between the groove 13a and the groove 13b. The surface 40a of the solder 40 in the groove 13a is at a position higher than that in the groove 13b (position farther from the mounting surface 10a). The mounting component 30 disposed in the mounting region 12 is disposed substantially parallel to the mounting surface 10a without being largely inclined by the restriction portion 17 disposed around the mounting region 12. At this time, the mounting component 30 contacts only the surface 21a of the plating film 21 in the groove 13a, and does not contact the surface 21a of the plating film 21 in the groove 13b.

  The mounting component 30 shown in FIG. 7A is passed through a reflow furnace to perform solder reflow. At this time, due to the surface tension of only the solder 40 in the groove 13a with which the mounting component 30 is in contact, the left side of the mounting component 30 (the left side in FIG. 7A) faces the resin layer 10 (FIG. 7). It is pulled in the direction of the arrow shown in (a). However, the movement of the mounting component 30 rising on the right side is restricted by the restricting portion 17, and the entire mounting component 30 is pulled in the direction of the mounting surface 10a while being kept parallel to the mounting surface 10a. The mounting component 30 pulled by the solder 40 abuts against the ground planes 14a, 14b, and 14c, and the mounting component 30 is accurately positioned in the height direction (FIG. 7B).

  It is preferable that the regulating surface 17a facing the mounting component 30 of the regulating portion 17 is inclined in a direction away from the mounting component 30 as it is separated from the mounting surface 10a. Thereby, it becomes easy to arrange the mounting component 30 in the mounting region 12 surrounded by the restriction portion 17. In the present modification, the mounting region 12 is surrounded by the restricting portion 17, but the present embodiment is not limited to this. For example, the restriction part 17 divided into a plurality of parts may be arranged adjacent to the mounting component 30.

  The size of the restricting portion 17 can be appropriately determined according to the size of the mounting component 30 and the like. The restricting portion (convex portion) 17 may be formed simultaneously with the molding of the resin layer 10 using a mold in which a corresponding concave portion is formed.

  EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention concretely, this invention is not restrict | limited by the following Example and comparative example.

[Example]
In this example, the circuit component 100 shown in FIG. 1 was manufactured. An LED (light emitting diode) was used as the mounting component 30.

(1) Molding of metal member and surface roughening Radiating fins (metal member 50) of an aluminum alloy (ADC12, thermal conductivity: 92 W / m · K) were molded by die casting. The surface 50a of the radiation fin 50 was roughened by laser light irradiation (laser processing). The surface roughness Rz of the surface 50a was 65 μm (FIG. 4A).

(2) Formation of short circuit prevention layer On the surface 50a of the radiation fin 50, a 10 μm-thick yttria layer (Y ₂ O ₃ , thermal conductivity: 11 W / m · k) (short circuit prevention layer 60) was formed by PVD. (FIG. 4B).

(3) Molding of resin layer On the surface 60a of the yttria layer 60, a resin material (thermal conductivity: 1 W / m · K) which is an epoxy resin containing alumina particles (aluminum oxide) having a maximum particle size of 60 μm is insert molded. (Transfer molding) to form the resin layer 10. The thickness d1 of the resin layer 10 was 120 μm. Further, the mold used for insert molding was provided with a convex portion corresponding to the groove 13, and the groove 13 was formed simultaneously with the formation of the resin layer 10. The depth of the groove 13 during molding of the resin layer 10 was 20 μm, and the narrowest width was 0.5 mm (FIGS. 5A and 5B). Hereinafter, the metal member 50 on which the short-circuit prevention layer 60 and the resin layer 10 are formed is referred to as a “base material”.

  In this embodiment, a radiation film having a film thickness of 20 μm is formed on the surface of the radiating fin 50 where the short-circuit prevention layer 60 and the resin layer 10 are not formed by using a commercially available electrodeposition coating liquid (Shimizu, Elecoat). Formed. The radiation film suppresses corrosion of the radiation fins 50 and growth of the electroless plating film on the radiation fins 50 in an electroless plating process described later. Further, the radiation film improves the heat dissipation of the heat dissipation fin 50.

(4) Formation of Circuit Pattern In this example, the circuit pattern 20 formed of the plating film 21 was formed on the resin layer 10 by the method described below.

(A) Formation of catalytic activity interference layer A catalytic activity interference layer containing a hyperbranched polymer represented by the following formula (1) as a catalyst deactivator was formed on the surface of the resin layer 10. The hyperbranched polymer represented by the following formula (1) was synthesized by the method disclosed in Japanese Patent Application Laid-Open No. 2017-160518.

  The synthesized polymer represented by the formula (1) was dissolved in methyl ethyl ketone to prepare a polymer solution having a polymer concentration of 0.5% by weight. The substrate was immersed in a polymer solution at room temperature for 5 seconds, and then dried in an 85 ° C. dryer for 5 minutes. As a result, a catalytic activity blocking layer having a film thickness of about 70 nm was formed on the surface of the resin layer 10.

(B) Laser drawing A circuit including the inside of the groove 13 at a processing speed of 1200 mm / s on the surface of the resin layer 10 on which the catalytic activity blocking layer is formed using a 3D laser marker (manufactured by Keyence, fiber laser, output 50 W). A portion corresponding to the pattern 20 was laser-drawn. The line width of the drawing pattern was 0.3 mm, and the minimum distance between adjacent drawing lines was 0.5 mm. By laser drawing, the catalytic activity interference layer in the laser drawing portion could be removed. Further, the surface of the laser drawing portion was roughened, and the filler contained in the resin layer 10 was exposed.

  The depth of the groove 13 was further increased from 20 μm at the time of molding to about 100 μm (average value) by cutting the bottom of the groove 13 by laser light irradiation. The groove depth was measured with a laser microscope. The surface roughness Rz at the bottom of the groove 13 was about 80 μm. Therefore, the distance d2 between the plating film 21 formed in the groove 13 and the short-circuit prevention layer 60 is about 20 μm.

(C) Application of electroless plating catalyst The substrate was immersed for 5 minutes in a commercially available palladium chloride (PdCl ₂ ) aqueous solution (Okuno Pharmaceutical Co., Ltd., activator, palladium chloride concentration: 150 ppm) adjusted to 30 ° C. Thereafter, the substrate was taken out from the palladium chloride aqueous solution and washed with water.

(D) Electroless plating The substrate was immersed for 10 minutes in an electroless nickel phosphorus plating solution (Okuno Pharmaceutical Co., Ltd., Top Nicolo LPH-L, pH 6.5) adjusted to 60 ° C. About 1 μm of a nickel phosphorus film (electroless nickel phosphorus plating film) was grown on the laser drawing portion on the resin layer 10. At the same time, about 1 μm of nickel phosphorous film was formed on the surface of the metal member 50.

  On the nickel phosphorous film, a circuit pattern 20 was formed by laminating an electrolytic copper plating film of 80 μm, an electrolytic nickel plating film of 1 μm, and an electrolytic gold plating film of 0.1 μm in this order by a general method. The circuit pattern 20 was similarly formed in the groove 13.

(5) Mounting of mounting component As mounting component 30, surface mounting type high brightness LED (the product made from Nichia, NS2W123BT, 3.0mmx2.0mmx height 0.7mm) was used. Four mounting components (LEDs) 30 were disposed on the plating film 21 formed in the groove 13 of the mounting region 12 of the resin layer 10 via the solder 40 at room temperature. As shown in FIG. 1A, the four mounting components 30 were connected in series. Next, the substrate on which the LEDs were arranged was passed through a reflow furnace (solder reflow). The substrate was heated in the reflow furnace, the maximum temperature reached by the substrate was about 240 ° C., and the time during which the substrate was heated at the maximum temperature was about 1 minute. The mounting component 15 was mounted on the resin layer 10 by the solder 40, and the circuit component 100 of this example was obtained. The average film thickness of the solder 40 was about 20 μm.

  When a power source was connected to the circuit pattern 20 of the obtained circuit component 100 and a DC current of 400 mA was passed, all the LEDs (mounting components) 30 were lit. In this example, the distance d2 between the plating film 21 formed in the groove 13 and the short-circuit prevention layer 60 was shortened to about 20 μm, but the plating film 21 and the metal member 50 were not short-circuited. Further, 30 minutes after the LED temperature was sufficiently stabilized, a thermocouple was fixed between the electrodes 31 on the back surface of the LED 30, and the temperature of the LED 30 was measured. As a result, the temperature of the LED 30 was 55 ° C. The temperature of the LED 30 was sufficiently lower than the target 100 ° C., and it was confirmed that the circuit component 100 of this example was excellent in heat dissipation.

  Moreover, the inclination with respect to the mounting surface 10a of the mounting component 30 in the circuit component 100 of a present Example was measured. In all four mounted components 30, the inclination was 0.2 °, which was within the target of 0.5 °.

[Comparative example]
In this comparative example, the circuit component 100 shown in FIG. 1 was manufactured by the same method as the example except that the short-circuit prevention layer 60 was not formed. However, under the same laser drawing conditions as in the example, the plating film 21 and the metal member 50 were short-circuited when the plating film 21 was formed. Therefore, in this comparative example, the laser processing speed was increased to 2000 mm / s. As a result, the amount of cutting at the bottom of the groove 13 was smaller than in the example, and the depth of the groove 13 was about 70 μm (average value), which was shallower than the example (about 100 μm). Therefore, the distance between the plating film 21 formed in the groove 13 and the metal member 50 was about 50 μm, which was larger than d2 (about 20 μm) of the example. Moreover, when the surface roughness Rz of the bottom of the groove | channel 13 was measured with the microscope, it was about 50 micrometers.

  When a power source was connected to the circuit pattern 20 of the circuit component 100 of this comparative example and a 400 mA direct current was passed, all the LEDs (mounting components) 30 were lit. 30 minutes after the LED temperature was sufficiently stabilized, a thermocouple was fixed between the electrodes 31 on the back surface of the LED 30, and the temperature of the LED 30 was measured. As a result, the temperature of the LED 30 was 75 ° C., which was higher than that of the example (55 ° C.). This is because the distance between the plating film 21 and the metal member 50 is larger than that of the first embodiment, and the short-circuit prevention layer 60 is not provided. It is presumed that the heat conduction efficiency was low.

  The circuit component (MID) of the present invention can further improve heat dissipation. For this reason, the circuit component of this invention is suitable for the component which mounted mounting components, such as LED, and can be applied to the components of a smart phone or a motor vehicle.

DESCRIPTION OF SYMBOLS 10 Resin layer 12 Mounting area 13 Groove 14 Grounding surface 20 Circuit pattern 21 Plating film 30 Mounting component (LED)
40 Solder 50 Metal member 100 Circuit component

Claims (19)

Circuit components,
A metal member;
A short-circuit prevention layer formed on the metal member;
A resin layer formed on the short-circuit prevention layer;
A circuit pattern formed on the resin layer and including a plating film;
It is mounted on the resin layer, and has a mounting component that is electrically connected to the circuit pattern,
The thermal conductivity of the short circuit-prevention layer, the lower than the thermal conductivity of the metal member, rather, high than the thermal conductivity of the resin layer,
A circuit component, wherein the film thickness of the short-circuit prevention layer is smaller than the surface roughness Rz of the surface of the metal member on which the short-circuit prevention layer is formed .   The circuit component according to claim 1, wherein the short-circuit prevention layer includes ceramics.   The circuit component according to claim 2, wherein the ceramic is one selected from the group consisting of aluminum oxide, aluminum nitride, boron nitride, silicon nitride, beryllium oxide, silicon carbide, yttria, and zirconia.   The said short-circuit prevention layer is formed from the inorganic compound in which an unevenness | corrugation is hard to be formed by laser beam irradiation, or the inorganic compound which permeate | transmits the said laser beam, The Claim 1 characterized by the above-mentioned. Circuit components.   5. The circuit component according to claim 1, wherein a film thickness of the short-circuit prevention layer is 1 μm to 100 μm. The resin layer is a thermoplastic resin, the circuit component according to any one of claim 1 to 5, characterized in that it includes a thermosetting resin or ultraviolet curable resin. The circuit component according to claim 6 , wherein the resin layer includes a thermosetting resin. The circuit component according to claim 7 , wherein the thermosetting resin is an epoxy resin. The resin layer is, the circuit component according to any of claims 1-8, characterized in that it comprises an insulating thermally conductive filler. And the mounting part facing the surface of the resin layer, the distance between the short-circuit preventing layer is, the circuit component according to any one of claims 1 to 9, characterized in that it is 10 m to 500 m. The plated film constituting the circuit pattern is formed on the surface of the resin layer facing the mounting component,
And the plating film formed on a surface of the mounting part facing to the resin layer, the distance between the short-circuit preventing layer, any one of claims 1-10, characterized in that the 0μm~100μm The circuit component according to one item. Grooves are formed on the resin layer,
A plating film constituting the circuit pattern is formed in the groove, and the thickness of the plating film is smaller than the depth of the groove,
The mounting component is disposed across the groove,
In the groove, the circuit component according to any one of claims 1 to 11, wherein a solder for electrically connecting the mounting component and the plated film. The circuit component according to claim 12 , wherein the mounting component is in contact with grounding surfaces on both sides of the groove on the resin layer. The groove on the resin layer, the circuit component according to claim 12 or 13 from the mounting part facing the region, characterized in that it extends out of the region. The surface roughness Rz of the surface on which the short-circuit preventing layer is formed of a metal member, the circuit component according to any one of claims 1 to 14, characterized in that it is 10 m to 500 m. The resin layer includes an insulating heat conductive filler,
Surface roughness Rz of the surface on which the short-circuit preventing layer is formed of the metal member, according to any one of claims 1 to 15, characterized in that greater than a maximum particle diameter of the insulating thermally conductive filler Circuit parts. The circuit component according to any one of claims 1 to 16 , wherein the resin layer has a convex portion disposed adjacent to the mounting component on a surface thereof. The circuit component according to claim 17 , wherein the convex portion surrounds the periphery of the mounting component. The circuit component according to any one of claims 1 to 18 , wherein the mounting component is an LED.

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