JP6602690B2 - Parts mounting machine - Google Patents

Description

  The present invention captures and captures both the parts held by the suction nozzle or chuck of the mounting head and the reference mark provided on the mounting head within the field of view of one camera, and the position of the reference mark is obtained by image processing. It is an invention related to a component mounting machine having a function of recognizing the position of the component with reference.

  In general, in a component mounting machine, when a component is picked up by a suction nozzle of a mounting head and mounted on a circuit board, the component picked up by the suction nozzle is imaged from below by a camera, the image is processed, and the component The suction position is recognized, and the component is mounted on the circuit board in consideration of the shift amount of the suction position of the component with respect to the suction nozzle (shift amount between the center of the component and the center of the suction nozzle). At this time, since the center of the suction nozzle cannot be seen in the image obtained by capturing the part sucked by the suction nozzle from below, it is described in Patent Document 1 (Japanese Patent Laid-Open No. 2005-11950). In addition, a reference mark is provided on the lower surface side of the mounting head at a predetermined position with respect to the suction nozzle, and both the part sucked by the suction nozzle and the reference mark at the time of imaging the part are stored in the field of view of one camera. The position of the component is recognized with reference to the position of the reference mark by image processing, so that the amount of displacement of the suction position of the component with respect to the suction nozzle can be measured.

  Further, in the component mounting machine disclosed in Patent Document 1, in order to facilitate image recognition of the reference mark on the lower surface side of the mounting head, an LED that illuminates the mounting head from the back side (upper surface side) with respect to the reference mark. The reference mark image recognition accuracy is improved by the backlight illumination.

JP 2005-11950 A

  By the way, there are various types of parts that are attracted to the suction nozzle, such as parts with leads, parts with bumps, square chip parts without leads and bumps, etc. In order to recognize an image, an illumination device that illuminates a component includes a plurality of types of illumination light sources such as a coaxial incident light source and a side-illumination light source, and switches the illumination light source according to the type of the component to be illuminated. For example, in the case of a bumped part, in order to accurately recognize the image of the bump on the lower surface, the side light source is turned on and illuminated from an oblique direction. In order to recognize, all illumination light sources such as a side light source and a coaxial incident light source are turned on to illuminate from all directions.

On the other hand, the reference mark provided on the mounting head is illuminated from all directions by turning on all the illumination light sources.
As a result, for example, when both the reference mark and the bumped part with different illumination conditions are stored in the field of view of one camera, first, either the bumped part or the reference mark is imaged. After imaging with an illumination condition suitable for the image and recognizing the one position by image processing, the image is processed by switching the illumination condition and the other position is recognized by image processing. For this reason, the number of times of imaging and the number of times of image processing become two each, and since it is necessary to perform two times of imaging at the same position, the mounting head must be completely stopped above the camera, It is not possible to perform “on-the-fly imaging” in which an image is taken while moving over the camera. As a result, there is a problem in that the cycle time from component adsorption to mounting after imaging is extended, and productivity is lowered.

There are various types, sizes, shapes, materials, colors, etc. for the parts to be picked up by the suction nozzle, and the optimum shape and size of the reference mark according to the required mounting accuracy of these parts and the lens resolution (resolution) of the camera. However, in the above-mentioned patent document 1, since the reference mark is simply backlit with the LED from the back side, the background around the reference mark only becomes brighter. The mark itself does not change. For this reason, the shape, size, number, etc. of the reference marks cannot be changed according to the required mounting accuracy of the components to be sucked by the suction nozzle, the lens resolution of the camera, and the like.
Accordingly, an object of the present invention is to solve at least one of the above-described problems.

  In order to solve the above problem, the invention according to claim 1 is configured such that both the component held by the suction nozzle or chuck of the mounting head and the reference mark provided on the mounting head are accommodated within the field of view of one camera. In a component mounting machine having a function of capturing and recognizing the position of the component on the basis of the position of the reference mark by image processing, a mark display for displaying the reference mark is provided on the mounting head, and the mark The display is provided with a display adjustment unit that manually or automatically adjusts at least one of the shape, size, number, brightness, contrast, and color of the reference mark displayed on the display. In this configuration, since the reference mark is displayed on the mark display provided on the mounting head, for example, the type of parts imaged by the camera, the lens resolution (resolution) of the camera, the imaging conditions (shutter speed, aperture value, etc.) and illumination The reference mark itself can be changed according to conditions (illumination direction, illumination intensity, etc.).

  In the present invention, the reference mark displayed on the mark display may be adjusted either manually or automatically. In the case of automatic adjustment, for example, a component to be imaged by the camera as in claim 2 A storage unit that stores adjustment values of adjustment items among the shape, size, number, brightness, contrast, and color of the reference mark displayed on the mark display for each type of display, and the display adjustment unit includes the storage It is also possible to retrieve the adjustment data of the adjustment item according to the type of the part to be imaged by the camera by searching the stored data of the part and automatically adjust the adjustment item.

  Alternatively, the adjustment value of the adjustment item among the shape, size, number, brightness, contrast, and color of the reference mark displayed on the mark display unit is stored for each lens resolution of the camera. The display adjustment unit may include a storage unit, and search the stored data in the storage unit, read the adjustment value of the adjustment item according to the lens resolution of the camera, and automatically adjust the adjustment item. .

  Alternatively, as in claim 4, an imaging adjustment unit that manually or automatically adjusts the imaging conditions of the camera and / or the illumination conditions for illuminating the components imaged by the camera according to the type of the parts imaged by the camera A storage unit that stores adjustment values of adjustment items among the shape, size, number, brightness, contrast, and color of the reference mark displayed on the mark display unit for each imaging condition and / or for each illumination condition; The display adjustment unit reads the adjustment value of the adjustment item according to the imaging condition and / or the illumination condition, which is stored in the storage unit and is adjusted by the imaging adjustment unit. May be automatically adjusted.

  Alternatively, as in claim 5, the adjustment value of the adjustment item among the shape, size, number, brightness, contrast, and color of the reference mark displayed on the mark display controls the production of the component mounting board. It may be set in a program (production job), and the display adjustment unit may read the adjustment value of the adjustment item set in the production program and automatically adjust the adjustment item. In the production program, the type of parts to be imaged by the camera, imaging conditions, lighting conditions, etc. are set, so the adjustment values of the adjustment items among the shape, size, number, etc. of the reference marks displayed on the mark display If it is also set in the production program, it is possible to automatically adjust the adjustment item by reading the adjustment value of the adjustment item according to the type of the part imaged by the camera, the imaging condition, the illumination condition, and the like from the production program.

  According to the present invention described above, the shape, size, and number of reference marks displayed on the mark display according to changes in the type of parts to be imaged by the camera, the lens resolution of the camera, imaging conditions, and illumination conditions. Etc., it is possible to recognize the image of both the component and the reference mark with high accuracy by one imaging. Thereby, compared with the case where the conventional imaging is performed twice, the cycle time from picking up a part to mounting after imaging can be shortened, and productivity can be improved. In addition, the shape, size, number, etc. of the reference marks can be changed according to the required mounting accuracy of the components, the lens resolution of the camera, etc., and the accuracy of component misalignment measurement by image recognition can be improved. It can also contribute to improvement.

FIG. 1 is a perspective view of a mounting head showing an embodiment of the present invention. FIG. 2 is a bottom view of the mounting head. FIG. 3 is a perspective view showing the positional relationship between the mounting head and the component imaging camera during component imaging. FIG. 4 is a block diagram showing the configuration of the control system of the component mounting machine.

Hereinafter, an embodiment in which a mode for carrying out the present invention is applied to a rotary head type component mounting machine will be described.
As shown in FIG. 4, the rotary head type component mounting machine sucks a conveyor 12 for conveying a circuit board, a component feeder 13 such as a tape feeder and a tray feeder, and a component supplied by the component feeder 13. A rotary mounting head 15 (rotary head) that is sucked by the nozzle 14 (see FIGS. 1 to 3) and mounted on the circuit board, and a component imaging camera 16 that picks up the component sucked by the suction nozzle 14 from below. The circuit board includes a mark imaging camera 17 for imaging a reference mark on the circuit board from above.

  Further, the component placement machine includes a component suction area for performing a component suction operation, a component imaging area for capturing the component sucked by the suction nozzle 14 by the component imaging camera 16, and a component mounting area for performing the component mounting operation. A head moving mechanism 20 that moves the mounting head 15 in the XY directions is provided. The component imaging camera 16 is fixed upward near the component supply device 13, and the mark imaging camera 17 is moved integrally with the mounting head 15 by the head moving mechanism 20 to image the reference mark on the circuit board. Is provided downward.

  As shown in FIGS. 1 and 2, the mounting head 15 can be replaced with a predetermined number of suction nozzles 14 for sucking components sent to the component suction position by the component supply device 13 at a predetermined nozzle pitch in the circumferential direction. Is held in. Further, as shown in FIG. 4, the mounting head 15 is rotated (rotated) around the axis (R axis) of the mounting head 15 so that a plurality of suction nozzles 14 are arranged in a circle of the mounting head 15. A head rotation mechanism 21 that rotates in the circumferential direction, and a Z-axis drive that lowers the suction nozzle 14 at a predetermined stop position (above the component suction position) of the swing path of the suction nozzle 14 and sucks the component onto the suction nozzle 14 A mechanism 22 and a nozzle rotation mechanism 23 that rotates (spins) the suction nozzle 14 around its axis to correct the orientation of the parts sucked by the suction nozzle 14 are provided.

  As shown in FIGS. 1 and 2, a mark indicator 26 for displaying the reference mark 25 is fixed to the center of the lower surface side of the mounting head 15 with its screen facing downward. The mark display 26 includes a liquid crystal display that displays a monochrome image or a color image, an organic EL, an inorganic EL, and the like. A display with a resolution higher than the lens resolution (resolution) of the component imaging camera 16 is used. ing. As will be described later, the reference to be displayed on the mark display 26 in accordance with the type of the component imaged by the component imaging camera 16, the lens resolution of the component imaging camera 16, the imaging condition of the component imaging camera 16, the illumination condition, and the like. At least one of the shape, size, number, brightness, contrast, and color of the mark 25 can be adjusted (changed) manually or automatically. In the display example of the mark indicator 26 shown in FIGS. 1 and 2, four small circular reference marks 25 are displayed at a 90 ° pitch on the same circumference around the rotation center of the mounting head 15. By recognizing the position of the reference mark 25, the rotation angle of the mounting head 15 (the position of each suction nozzle 14) and the position of the rotation center of the mounting head 15 can be calculated.

  As shown in FIG. 3, a lens 27 is assembled on the upper side of the component imaging camera 16 fixed upward, and an illumination device 28 is assembled on the upper side of the lens 27. The illumination device 28 includes a plurality of types of illumination light sources such as a coaxial incident light source and a side illumination light source, and the illumination light source is switched according to the type of component to be illuminated. For example, in the case of a bumped part, in order to accurately recognize the image of the bump on the lower surface, the side light source is turned on and illuminated from an oblique direction. In order to recognize, all illumination light sources such as a side light source and a coaxial incident light source are turned on to illuminate from all directions.

  As shown in FIG. 4, the control device 31 that controls the component picking operation, the component imaging operation, the component mounting operation, and the like of the component mounting machine includes an input device 32 such as a keyboard, a mouse, and a touch panel, and various programs and data. Are connected to a storage device 33 (storage unit) such as a hard disk, flash memory, RAM, and ROM, and a display device 34 such as a liquid crystal display and a CRT.

  During operation of the component mounting machine, the mounting head 15 is moved to the component suction area by the head moving mechanism 20 to suck the components to all the suction nozzles 14, and then the mounting head 15 is moved to the component imaging area. Both the component sucked by the suction nozzle 14 and the reference mark 25 displayed on the mark display 26 are captured in the field of view of the component imaging camera 16, and the positions of the four reference marks 25 are determined by image processing. After recognizing the position of the component sucked by each suction nozzle 14 and measuring the shift amount of the suction position of the component with respect to each suction nozzle 14 (shift amount between the center of the component and the center of the suction nozzle 14), The operation of moving the mounting head 15 to the component mounting area, correcting the shift amount of the suction position of each component, and performing the component mounting operation for mounting each component on the circuit board 11 is repeated. In the component suction area, the suction nozzle 14 located above the component suction position is lowered to cause the suction nozzle 14 to suck the component, and then the suction nozzle 14 is raised to the original height position to mount the mounting head 15. By repeating the operation of rotating by the nozzle pitch, the components are sequentially sucked by all the suction nozzles 14 held by the mounting head 15. In the component imaging area, “on-the-fly imaging” in which the mounting head 15 is moved may be performed, or the mounting head 15 may be temporarily stopped for imaging. In short, if on-the-fly imaging can ensure the image recognition accuracy of both the component sucked by the suction nozzle 14 and the reference mark 25, on-the-fly imaging may be performed to shorten the cycle time.

  The control device 31 of the component mounting machine includes an imaging condition (shutter speed, aperture value, etc.) of the component imaging camera 16 and / or an illumination condition (illumination direction, illumination) of the illumination device 28 that illuminates the component imaged by the component imaging camera 16. It also functions as an imaging adjustment unit that manually or automatically adjusts the illumination intensity etc. according to the type of component imaged by the component imaging camera 16. When the operator manually adjusts the imaging conditions and illumination conditions of the component imaging camera 16, the operator operates the input device 32 and inputs adjustment values of the imaging conditions and illumination conditions to the control device 31. Adjust imaging conditions and lighting conditions. Further, when automatically adjusting the imaging conditions and illumination conditions of the component imaging camera 16, the adjustment values of the imaging conditions and illumination conditions are stored in advance in the storage device 33 for each type of component imaged by the component imaging camera 16. The control device 31 of the component mounting machine searches the storage data in the storage device 33, reads the adjustment values of the imaging conditions and the illumination conditions according to the type of components imaged by the component imaging camera 16, and captures the imaging conditions. And automatically adjust lighting conditions. Alternatively, adjustment values of imaging conditions and illumination conditions are set in a production program (production job) for managing the production of the component mounting board, and the imaging device and illumination conditions set in the production program by the control device 31 of the component mounting machine are set. It is also possible to read the adjustment value of the condition and automatically adjust the imaging condition and the illumination condition.

  Further, the control device 31 of the component mounting machine serves as a display adjustment unit that manually or automatically adjusts at least one of the shape, size, number, brightness, contrast, and color of the reference mark 25 displayed on the mark display 26. Also works. When the operator manually adjusts the shape or the like of the reference mark 25 displayed on the mark display 26, the operator operates the input device 32 to form the shape, size, number, brightness, contrast, and color of the reference mark 25. The adjustment value of the adjustment item is input to the control device 31, and the adjustment item of the reference mark 25 displayed on the mark display 26 is adjusted.

  On the other hand, when the control device 31 of the component mounting machine automatically adjusts at least one of the shape, size, number, brightness, contrast, and color of the reference mark 25 displayed on the mark display 26, the following automatic adjustment is performed. Any one of methods (1) to (4) or a combination of two or more methods may be used.

[Automatic adjustment method (1)]
In advance, adjustment values of adjustment items of the shape, size, number, brightness, contrast, and color of the reference mark 25 displayed on the mark display 26 for each type of component imaged by the component imaging camera 16 are stored in the storage device 33. Remember. The control device 31 of the component mounting machine retrieves the storage data related to the adjustment item in the storage device 33, reads the adjustment value of the adjustment item according to the type of the component imaged by the component imaging camera 16, and stores the adjustment item. Adjust automatically. For example, when imaging a bumped component, in order to recognize the bump on the lower surface with high accuracy, the side light source of the illuminating device 28 is turned on and the side illumination is used for imaging. The reference mark 25 is also automatically adjusted so that the image can be recognized with high accuracy by side illumination. In addition, when imaging a square chip component, in order to accurately recognize the electrode on the lower surface thereof, all the illumination light sources such as the side light source and the coaxial incident light source of the illumination device 28 are turned on and imaged. The reference mark 25 displayed on the display 26 is also automatically adjusted so that the image can be recognized with high accuracy by all lighting. In addition, with respect to the parts to be imaged by the coaxial epi-illumination of the illuminating device 28, the reference mark 25 displayed on the mark display 26 is automatically adjusted so that the image can be accurately recognized by the coaxial epi-illumination.

  Further, when imaging a small-sized component, the size of the reference mark 25 displayed on the mark display 26 is also reduced to increase the position recognition accuracy. Further, the brightness, contrast, color, etc. of the reference mark 25 displayed on the mark display 26 are adjusted according to the color, brightness, material, etc. of the body of the component to be imaged.

[Automatic adjustment method (2)]
The storage device 33 previously stores adjustment values of adjustment items among the shape, size, number, brightness, contrast, and color of the reference mark 25 displayed on the mark display 26 for each lens resolution (for each resolution) of the component imaging camera 16. Remember it. The control device 31 of the component mounting machine searches the storage data related to the adjustment item in the storage device 33, reads the adjustment value of the adjustment item according to the lens resolution of the component imaging camera 16 to be used, and automatically sets the adjustment item. adjust. The higher the lens resolution of the component imaging camera 16 is, the more the image recognition accuracy of the reference mark 25 is improved. Therefore, the size of the reference mark 25 is reduced or the shape is sharpened to increase the position recognition accuracy of the reference mark 25. Therefore, it is possible to increase the accuracy of measuring the positional deviation of the parts.

[Automatic adjustment method (3)]
Adjustment items of the shape, size, number, brightness, contrast, and color of the reference mark 25 displayed on the mark display 26 for each imaging condition of the component imaging camera 16 and / or for each illumination condition of the illumination device 28 are set in advance. The adjustment value is stored in the storage device 33. The control device 31 of the component mounting machine searches the storage data related to the adjustment item in the storage device 33 and reads the adjustment value of the adjustment item according to the imaging condition of the component imaging camera 16 and the illumination condition of the illumination device 28. The adjustment item is automatically adjusted. For example, when imaging with side illumination, the reference mark 25 displayed on the mark display 26 is automatically adjusted so that the image can be recognized with high accuracy by side illumination. Further, when imaging with coaxial epi-illumination, the reference mark 25 displayed on the mark display 26 is automatically adjusted so that the image can be recognized with high accuracy by the coaxial epi-illumination. Further, when imaging is performed with all lighting, the reference mark 25 displayed on the mark display 26 is automatically adjusted so that the image can be recognized with high accuracy with all lighting.

[Automatic adjustment method (4)]
In advance, adjustment values of adjustment items among the shape, size, number, brightness, contrast, and color of the reference mark 25 displayed on the mark display 26 are set in the production program. The control device 31 of the component mounting machine reads the adjustment value of the adjustment item set in the production program and automatically adjusts the adjustment item. In the production program, the type of parts to be imaged by the part imaging camera 16, imaging conditions, illumination conditions, and the like are set. Therefore, among the shape, size, number, etc. of the reference mark 25 displayed on the mark display 26. If the adjustment value of the adjustment item is also set in the production program, the adjustment value of the adjustment item is read from the production program in accordance with the type of the component imaged by the component imaging camera 16, the imaging condition, the illumination condition, etc. Items can be adjusted automatically.

  In the present embodiment described above, even if the type of component imaged by the component imaging camera 16, the lens resolution of the component imaging camera 16, the imaging condition, or the illumination condition changes, the mark display 26 displays it accordingly. By changing the shape, size, number, and the like of the reference marks 25, it is possible to accurately recognize both the component and the reference marks 25 by one imaging. Thereby, compared with the case where the conventional imaging is performed twice, the cycle time from picking up a part to mounting after imaging can be shortened, and productivity can be improved. In addition, the shape, size, number, etc. of the reference mark 25 can be changed according to the required mounting accuracy of the component, the lens resolution of the component imaging camera 16, and the like, and the positional deviation measurement accuracy by image recognition can be improved. This can also contribute to improved component mounting accuracy.

  The present invention is not limited to the rotary head type component mounting machine as in the above embodiment, but can also be applied to a component mounting machine in which the mounting head does not rotate, and the number of suction nozzles held by the mounting head is also limited. The number may be one or two or more. The present invention can also be applied to a component mounting machine in which a chuck is assembled to a mounting head and the component is held by the chuck.

  In addition, it goes without saying that the present invention can be implemented with various modifications within a range not departing from the gist, such as appropriately changing the configuration of the mounting head 15 and the configuration of the component imaging camera 16.

  DESCRIPTION OF SYMBOLS 13 ... Component supply apparatus, 14 ... Adsorption nozzle, 15 ... Mounting head, 16 ... Component imaging camera, 20 ... Head moving mechanism, 25 ... Reference mark, 26 ... Mark indicator, 27 ... Lens, 28 ... Illumination device, 31 ... Control device (display adjustment unit, imaging adjustment unit), 33 ... Storage device (storage unit)

Claims (5)

Both the component held by the suction nozzle or chuck of the mounting head and the reference mark provided on the mounting head are captured in the field of view of one camera, and the image is processed with reference to the position of the reference mark. In a component mounting machine with a function to recognize the position of a component,
A mark indicator provided on the mounting head and displaying the reference mark;
And a display adjustment unit that manually or automatically adjusts at least one of the shape, size, number, luminance, contrast, and color of the reference mark displayed on the mark display. Machine. A storage unit that stores adjustment values of adjustment items among the shape, size, number, brightness, contrast, and color of the reference mark displayed on the mark display unit for each type of component imaged by the camera;
The display adjustment unit searches the stored data in the storage unit, reads the adjustment value of the adjustment item according to the type of component imaged by the camera, and automatically adjusts the adjustment item. The component mounting machine according to 1. A storage unit for storing adjustment values of adjustment items among the shape, size, number, brightness, contrast, and color of the reference mark displayed on the mark display for each lens resolution of the camera;
The said display adjustment part searches the memory | storage data of the said memory | storage part, reads the adjustment value of the said adjustment item according to the lens resolution of the said camera, and adjusts the said adjustment item automatically, The said adjustment item is characterized by the above-mentioned. Parts mounting machine. An imaging adjustment unit that manually or automatically adjusts the imaging condition of the camera and / or the illumination condition for illuminating the component imaged by the camera according to the type of the component imaged by the camera;
A storage unit that stores adjustment values of adjustment items among the shape, size, number, brightness, contrast, and color of the reference mark displayed on the mark display unit for each imaging condition and / or for each illumination condition. ,
The display adjusting unit reads the adjustment value of the adjustment item according to the imaging condition and / or the illumination condition adjusted by the imaging adjustment unit by searching the storage data of the storage unit, and automatically adjusts the adjustment item The component mounting machine according to claim 1, wherein: The adjustment values of the adjustment items among the shape, size, number, brightness, contrast, and color of the reference mark displayed on the mark display are set in a production program for managing the production of the component mounting board,
2. The component mounting machine according to claim 1, wherein the display adjustment unit automatically adjusts the adjustment item by reading the adjustment value of the adjustment item set in the production program.

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