JP6587345B2 - Method for producing resin mold - Google Patents

Description

  The present invention relates to a resin mold and a method for producing a resin mold using the mold.

  In recent years, Micro-Needle Array has been known as a new dosage form that can administer drugs such as insulin, vaccine (Vaccines) and hGH (human growth hormone) into the skin without pain. ing. The microneedle array is an array of biodegradable microneedles (also referred to as microneedles or microneedles) containing a drug. By attaching this microneedle array to the skin, each microneedle is pierced into the skin, the microneedle is absorbed in the skin, and the drug contained in each microneedle can be administered into the skin. The microneedle array is also called a transdermal absorption sheet.

  When the above-described microneedle array is manufactured, an original plate having a protruding pattern having the same shape as the microneedle array to be manufactured is manufactured. The produced original plate is transferred to produce a resin mold having a concave portion that is a reversal type. The microneedle array is manufactured by supplying a polymer solution, which is a raw material of the microneedle array, to the resin mold, drying and curing the polymer solution, and peeling the polymer solution from the resin mold.

  As a method for producing a microneedle array original plate (also referred to as a resin mold for producing a resin mold), Patent Document 1 discloses that an original plate is produced by machining the substrate, such as cutting. Is disclosed.

International Publication No. 2008/013282

  When a drug is administered into the skin using a microneedle array, the shape of the microneedle is important. The shape of the microneedle depends on the shape of the concave portion of the resin mold, and the shape of the concave portion of the resin mold depends on the shape of the protruding pattern of the resin molding die (original plate). Therefore, it is required to accurately produce a resin molding die.

  By the way, in the technique described in Patent Document 1, a portion where the side surface of the protruding portion constituting the protruding pattern and the first surface of the resin molding die (surface on which the protruding portion is formed) has an arc shape. . For this reason, it is not easy to accurately form the shape of the protrusion to be transferred.

  In addition, not only the projection pattern of the resin mold but also the first surface is transferred to the resin mold, so it is necessary to process the first surface of the resin mold with high accuracy. The burden of.

  The present invention has been made in view of such circumstances, and a resin molding die using the resin molding die and the resin molding die having high processing accuracy of the transferred protrusions and easy processing. An object of the present invention is to provide a manufacturing method of the above.

  According to one aspect of the present invention, there is provided a mold for resin molding having a projecting pattern on the first surface, and the projecting portions constituting the projecting pattern include a non-transfer portion and a transfer portion from the first surface side. The non-transfer part and the transfer part have different physical properties.

  Preferably, the physical property is surface roughness, and the surface roughness of the transfer portion is smaller than the surface roughness of the non-transfer portion.

  More preferably, the physical property is surface roughness, the surface roughness of the transfer portion is in the range of 0.01 μm to 1.0 μm, and the surface roughness of the non-transfer portion is 0.1 μm to 10 μm. It is a range.

  Preferably, the physical property is an appearance shape, the non-transfer portion is a frustum shape or a column shape, and the transfer portion is a cone shape.

  Preferably, the transfer portion has a multistage cone shape.

  Preferably, the height of the transfer part is 100 μm or more and 2000 μm or less.

  Preferably, the tip diameter of the transfer portion is 50 μm or less.

  Preferably, the ratio of the height of the transfer portion to the diameter of the bottom surface is 1 or more and 5 or less.

  Preferably, the interval between adjacent protrusions is 300 μm or more and 2000 μm or less.

  Preferably, the height of the non-transfer portion is 10 μm or more.

  According to another aspect of the present invention, a method for producing a resin mold includes an embossing curing step in which a transfer portion of a protruding pattern of the resin molding die is embossed on a resin material, and the resin material is cured. And a peeling step of peeling the resin molding die from the obtained resin material to obtain a resin material having an inverted concave pattern of the transfer portion.

  Preferably, the stamping and curing step, the peeling step, and the movement of the resin molding die or the resin material are repeatedly performed.

  According to the resin molding die of the present invention, the processing accuracy of the transferred protrusion is high, and the processing becomes easy.

It is a perspective view of the metal mold for resin molding of a first embodiment. It is sectional drawing in a part of metal mold | die for resin molding of 1st embodiment. It is a perspective view of the metal mold | die for resin molding of 2nd embodiment. It is sectional drawing in a part of metal mold | die for resin molding of 2nd embodiment. It is process drawing which shows the procedure of the manufacturing method of the metal mold | die for resin molding. It is process drawing which shows the procedure of the production method of the resin-made molds using the resin mold. It is process drawing which shows the procedure of the production method of another resin mold using the resin mold.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The present invention is illustrated by the following preferred embodiments. Changes can be made by many techniques without departing from the scope of the present invention, and other embodiments than the present embodiment can be utilized. Accordingly, all modifications within the scope of the present invention are included in the claims.

  Here, in the drawing, portions indicated by the same symbols are similar elements having similar functions. In addition, in the present specification, when a numerical range is expressed using “˜”, upper and lower numerical values indicated by “˜” are also included in the numerical range.

(First embodiment)
Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of the resin molding die of the first embodiment, and FIG. 2 is a cross-sectional view of a part of the resin molding die of the first embodiment.

  The resin molding die 10 has a protruding pattern 10A formed on the first surface 10B. The protruding pattern 10A is a state in which the protruding portion 12 protruding in a direction away from the first surface 10B of the resin molding die 10 is disposed on the first surface 10B of the resin molding die 10. Say. The number of the protrusions 12, the position of the protrusions 12, and the like are not limited. The first surface 10B may be a complete flat surface or a flat surface at first glance.

  The projecting portion 12 constituting the projecting pattern 10A includes a non-transfer portion 12B and a transfer portion 12A from the first surface 10B side. The transfer portion 12A means a portion that is transferred as a reverse shape to the resin mold in the production of a resin mold described later, and the non-transfer portion 12B means a portion that is not transferred as a reverse shape to the resin mold. In the present embodiment, the transfer portion 12A and the non-transfer portion 12B have different physical properties. Here, the physical property means the surface roughness of the transfer portion 12A and the non-transfer portion 12B or the external shape of the transfer portion 12A and the non-transfer portion 12B. The surface roughness is an arithmetic average roughness (Ra). The appearance shape means a shape that can be distinguished from the transfer portion 12A and the non-transfer portion 12B at a glance when observed with a microscope, an SEM (Scanning Electron Microscope), or the like.

  The non-transfer portion 12B has a columnar structure. The column shape means a cylinder, an elliptical column, and a prism (including a polygonal column). The columnar shape has two parallel bottom surfaces and side surfaces, and the shape of the bottom surface has a shape such as a circle, an ellipse, or a polygon. An angle θ formed by the side surface of the non-transfer portion 12B and the first surface 10B is in a range of 90 ° to 120 ° in a cross-sectional view. Therefore, the shape of the non-transfer portion 12B may be a frustum shape.

  When the angle θ is slightly larger than 90 °, when the first surface 10B is optically imaged from the front end side of the protrusion 12 (for example, a laser microscope), the side surface of the non-transfer portion 12B itself and the non-transfer portion 12B. It is possible to detect the boundary between the side surface and the first surface 10B. However, if the angle θ becomes too large, the distance between the bottom surfaces of adjacent protrusions becomes small, and the blades used for cutting the non-transfer portion 12B and the first surface 10B are limited to small ones, which makes it difficult or time consuming. Therefore, the angle θ is preferably 120 ° or less. There is no problem even if the R shape (arc shape) of the blade remains at the boundary portion between the non-transfer portion 12B and the first surface 10B.

  The height H2 of the non-transfer portion 12B is preferably 10 μm or more. By setting the height H2 to 10 μm or more, machining such as cutting is facilitated, and the difference in shape between the transfer portion 12A and the non-transfer portion 12B can be recognized. The height H2 is more preferably not less than 50 μm and not more than 200 μm.

  The transfer portion 12A has a cone-shaped structure that tapers in a direction away from the first surface 10B. The term “pyramidal shape” means a conical shape, an elliptical cone shape, and a pyramid shape (including a polygonal pyramid shape). The cone shape is composed of a bottom surface and a side surface directed to one point away from the bottom surface. As shown in FIG. 2, since the protrusion 12 is manufactured by cutting or the like, the tip of the transfer portion 12A is curved, and the tip diameter D1 is preferably 50 μm or less, more preferably 30 μm or less. It is.

  The height H1 of the transfer portion 12A is preferably 100 μm or more and 2000 μm or less, more preferably 300 μm or more and 1500 μm or less, and further preferably 500 μm or more and 1000 μm or less. The shape of the transfer portion 12A is transferred as a fine shape of a molded product through a resin mold having a concave pattern. When the molded product manufactured using the resin molding die 10 is a microneedle array, the microneedle is formed with a height of 100 μm or more and 2000 μm or less. By setting the height of the microneedle within the above-described range, the microneedle can be easily pierced into the skin, and the drug can be administered into the skin without causing pain.

  When the transfer portion 12A has a conical shape, the ratio of the height H1 to the bottom surface diameter D2 (so-called aspect ratio: H1 / D2) is preferably 1 or more and 5 or less. When the molded product is a microneedle array, by setting the aspect ratio of the microneedles within the above range, the microneedles can be easily pierced into the skin and can be prevented from being broken.

  The transfer portion 12A is continuous from the non-transfer portion 12B. Therefore, the bottom surface (upper bottom) of the non-transfer portion 12B and the bottom surface of the transfer portion 12A are continuous. In this embodiment. The shape and size of the bottom surface (upper bottom) of the non-transfer portion 12B and the bottom surface of the transfer portion 12A are the same. However, there is no particular limitation as long as the bottom surface of the transfer portion 12A is formed in the bottom surface (upper bottom) of the non-transfer portion 12B.

  The distance L between adjacent protrusions 12 of the resin molding die 10 is preferably 300 μm or more and 2000 μm or less, more preferably 500 μm or more and 1500 μm or less, and further preferably 700 μm or more and 1250 μm or less. By making the distance L between the protrusions 12 within the above range, machining such as cutting is facilitated. Further, when the molded product is a microneedle array, by setting the interval L between adjacent microneedles within the above range, the microneedles can be easily pierced into the skin and can be prevented from being broken. An interval L between adjacent protrusions 12 is a distance to another protrusion 12 that is closest to a certain protrusion 12, and as shown in FIG. 2, between the tips of the two protrusions 12. Measured by distance.

  The resin molding die 10 including the protruding pattern 10A and the first surface 10B preferably has an integral structure as a whole. Here, the integral structure means a structure made from one material. In FIGS. 1 and 2, the appearance of the transfer portion 12A and the non-transfer portion 12B is different as physical properties, the transfer portion 12A has a cone shape, and the non-transfer portion 12B has a frustum shape or a column shape. .

(Second embodiment)
Embodiments of the present invention will be described with reference to the drawings. FIG. 3 is a perspective view of the resin molding die of the second embodiment, and FIG. 4 is a cross-sectional view of a part of the resin molding die of the second embodiment. In addition, the same code | symbol may be attached | subjected to the structure similar to the structure of 1st embodiment, and description may be abbreviate | omitted.

  The resin molding die 10 has a protruding pattern 10A formed on the first surface 10B. The protruding pattern 10A is a state in which the protruding portion 12 protruding in a direction away from the first surface 10B of the resin molding die 10 is disposed on the first surface 10B of the resin molding die 10. Say.

  The projecting portion 12 constituting the projecting pattern 10A includes a non-transfer portion 12B and a transfer portion 12A from the first surface 10B side. The non-transfer portion 12B has a columnar structure as in the first embodiment. The column shape means a cylinder, an elliptical column, and a prism (including a polygonal column).

  The transfer portion 12A has a multi-stage cone-shaped structure that tapers in a direction away from the first surface 10B. The multi-stage pyramid shape has at least one frustum shape and a frustum shape from the first surface 10B side, and an angle θ2 formed between the frustum-shaped side surface and the first surface 10B, The shape in which the magnitude | size with the angle (theta) 1 which the side surface of a body shape and the 1st surface 10B comprise differs is said. In this embodiment, since it has one frustum shape and one frustum shape, it has two side surfaces with different angles formed with the first surface 10B, so that it has a two-stage frustum shape. In order to obtain a three-stage cone shape, it can be produced by providing a two-stage cone shape with a frustum shape having a different angle with the first surface 10B.

  When the molded product is a microneedle array, the microneedles are formed in a multistage cone shape. By making the microneedle into a multi-stage cone shape, it becomes possible to supply the drug only to the tip portion of the microneedle.

  The height H1 of the transfer portion 12A, the tip diameter D1 of the transfer portion 12A, the height H2 of the non-transfer portion 12B, the aspect ratio (H1 / D2) of the transfer portion 12A, and the interval L between adjacent protrusions 12 are as follows. It can be the same as that of one embodiment.

  As in the first embodiment, the resin molding die 10 including the protruding pattern 10A and the first surface 10B preferably has an integral structure as a whole. 3 and 4, as physical properties, the appearance of the transfer portion 12A and the non-transfer portion 12B is different, the transfer portion 12A has a multi-stage cone shape, and the non-transfer portion 12B has a frustum shape or a column shape. It is.

(Production method of resin mold)
Next, a method for producing the resin molding die 10 will be described with reference to FIG. 5 taking the resin molding die 10 of the first embodiment as an example. FIG. 5 is a process diagram showing the procedure of a method for producing a resin mold.

  As shown in FIG. 5A, a metal base 20 for preparing the resin molding die 10 is prepared. As a raw material of the base material 20, metals, such as stainless steel, aluminum alloy, Ni, high-speed steel, a cemented carbide, etc. can be used.

  Next, as illustrated in FIG. 5B, the base 20 is cut using the first cutting blade 30, thereby producing a transfer portion 12 </ b> A that constitutes the protruding portion 12 of the resin molding die 10. The transfer part 12A is transferred to the resin mold as a recess having an inverted shape. The concave portion of the resin mold becomes a protrusion of the molded product. Accordingly, the surface property of the transfer portion 12A affects the surface property of the protrusion of the molded product. Therefore, the surface roughness of the transfer portion 12A is preferably small, and is preferably 0.01 μm or more and 1.0 μm or less. The surface roughness of the transfer portion 12A is an arithmetic average roughness (Ra), and can be measured simultaneously with the shape by a Keyence laser microscope VKX-250.

  When cutting the base material 20, various conditions (the type of the first cutting blade 30, the cutting speed, etc.) are appropriately selected to set the surface roughness of the transfer portion 12 </ b> A in the range of 0.01 μm to 1.0 μm. In order to reduce the surface roughness, it is necessary to reduce the feed pitch of the cutting blade, but this reduces the cutting speed, that is, increases the processing cost.

  Next, as shown in FIG. 5C, by cutting the base material 20 using the second cutting blade 32, the non-transfer portion 12B constituting the protruding portion 12 of the resin molding die 10, and the first One side 10B is produced. The non-transfer portion 12B and the first surface 10B are not transferred to the resin mold. Therefore, the surface roughness of the non-transfer portion 12B and the first surface 10B can be made larger than the surface roughness of the transfer portion 12A. For example, the surface roughness of the non-transfer portion 12B and the first surface 10B can be set to 0.1 μm or more and 10 μm or less. That is, since the processing accuracy as high as the transfer portion 12A is not required, the cutting speed of the non-transfer portion 12B and the first surface 10B can be increased. When cutting the substrate 20, the surface roughness of the non-transfer portion 12B and the first surface 10B is in the range of 0.1 μm to 10 μm, so various conditions (type of the second cutting blade 32, cutting speed, etc.) It is selected appropriately. However, the non-transfer portion 12B and the first surface 10B can be manufactured with the same surface roughness as the transfer portion 12A.

  Further, by producing the non-transfer portion 12B, there is no portion where the transfer portion 12A and the first surface 10B intersect. Therefore, the portion where the transfer portion 12A and the first surface 10B intersect does not have an arc shape. Therefore, the processing accuracy of the transfer portion 12A of the protrusion 12 can be increased. Even if the portion where the non-transfer portion 12B and the first surface 10B intersect with each other has an arc shape, the portion is not transferred to the resin mold, so there is almost no influence on the shape of the protrusion of the molded product.

  As shown in FIG. 5D, when a necessary number of protrusions 12 including a transfer portion 12A and a non-transfer portion 12B are formed on the substrate 20, the resin molding die 10 is completed. In FIG. 5, as physical properties, the external shapes of the transfer portion 12A and the non-transfer portion 12B are different, and the surface roughness of the transfer portion 12A and the non-transfer portion 12B is different.

  However, for example, even when the transfer portion 12A and the non-transfer portion 12B have a cone shape as a whole, and the transfer portion 12A and the non-transfer portion 12B cannot be distinguished at a glance, the transfer portion 12A and the non-transfer portion 12B. The surface roughness of can also be made different.

(Production method of resin mold)
Next, taking the resin molding die 10 of the first embodiment as an example, a method for producing a resin mold will be described with reference to FIGS. 6 and 7 are process diagrams showing a procedure of a method for producing a resin mold.

  As shown in FIG. 6A, a resin molding die 10 is prepared. The resin mold 10 has a protruding pattern 10A on the first surface 10B. The protruding portion 12 constituting the protruding pattern 10A has a non-transfer portion 12B and a transfer portion 12A from the first surface 10B side.

  FIG. 6B shows an embossing curing process. As shown in FIG. 6B, a resin material 40 is prepared. The transfer portion 12A of the protruding pattern 10A of the resin molding die 10 is embossed on the resin material 40. Here, embossing means bringing the transfer material 12A of the protruding pattern 10A of the resin molding die 10 into contact with the resin material 40. Depending on the state of the resin material 40, when the pressure is applied to the resin molding die 10 to bring the transfer portion 12A into contact with the resin material 40, the transfer portion 12A of the resin molding die 10 is immersed in the resin material 40. A mode in which the transfer portion 12A and the resin material 40 are brought into contact with each other is included.

  In the present embodiment, the non-transfer portion 12B has a column shape, and the transfer portion 12A has a cone shape. Since the physical properties (appearance shape) of the transfer portion 12A and the non-transfer portion 12B are different, the boundary between the transfer portion 12A and the non-transfer portion 12B can be easily recognized. Therefore, when the resin molding die 10 is embossed on the resin material 40, the position adjustment in which only the transfer portion 12A is brought into contact with the resin material 40 becomes easy.

  The resin material 40 is cured in a state where the transfer portion 12A of the protruding pattern 10A of the resin molding die 10 and the resin material 40 are in contact with each other. By curing the resin material 40, the inverted concave portion 44 of the transfer portion 12A is formed in the resin material 40.

  FIG. 6C shows a peeling process. As shown in FIG. 6C, the resin molding die 10 is peeled from the resin material 40. A resin mold 42 having a concave pattern 42A composed of the inverted concave portion 44 of the transfer portion 12A of the protruding pattern 10A is obtained.

  The concave pattern 42 </ b> A refers to a state in which a concave portion 44 extending from one surface of the resin mold 42 toward the other surface is disposed on one surface of the resin mold 42. The number of the concave portions, the arrangement of the concave portions, and the shape of the concave portions are the same as those of the transfer portion 12A of the protruding pattern 10A of the resin molding die 10.

  Examples of a method for producing the resin mold 42 using the resin molding die 10 having the protruding pattern 10A include the following methods.

  First, the first method will be described. As the resin material 40, an ultraviolet curable resin that is cured by being irradiated with ultraviolet rays is prepared. The transfer portion 12A of the protruding pattern 10A of the resin molding die 10 is embossed with an ultraviolet curable resin. In a state in which the resin molding die 10 is pressed onto the ultraviolet curable resin, the ultraviolet curable resin is irradiated with ultraviolet rays from the lower side of the resin material 40 (the side opposite to the resin molding die 10) to cure the ultraviolet curable resin. . The resin molding die 10 is peeled from the cured ultraviolet curable resin. A resin mold 42 having a concave pattern 42A constituted by a concave portion 44 that is the inverted shape of the transfer portion 12A of the protruding pattern 10A can be obtained.

  The ultraviolet curable resin refers to a resin that is cured through a crosslinking reaction and a polymerization reaction when irradiated with ultraviolet rays. Examples of the ultraviolet polymerizable functional group include unsaturated polymerizable functional groups such as a (meth) acryloyl group, a vinyl group, a styryl group, and an allyl group.

  The second method will be described. A thermoplastic resin is prepared as the resin material 40. The resin molding die 10 having the protruding pattern 10A is heated. The transfer portion 12A of the heated protruding pattern 10A is embossed on the surface of the thermoplastic resin. Since the surface of the thermoplastic resin is softened, the transfer portion 12A of the protruding pattern 10A can be brought into contact with the thermoplastic resin. The resin material 40 may be heated instead of the resin molding die 10, or both the resin molding die 10 and the resin material 40 may be heated.

  In a state where the resin molding die 10 is pressed into the thermoplastic resin, the resin molding die 10 is cooled. The thermoplastic resin is cured by cooling the resin molding die 10. Thereafter, the resin molding die 10 is peeled from the thermoplastic resin to which the transfer portion 12A of the protruding pattern 10A is transferred. A resin mold 42 having a concave pattern 42A constituted by a concave portion 44 that is the inverted shape of the transfer portion 12A of the protruding pattern 10A of the resin molding die 10 can be obtained.

  The thermoplastic resin is not particularly limited. For example, LDPE (Low Density Polyethylene), HDPE (High Density Polyethylene), PP (polypropylene), PC (polycarbonate) Etc.

  Next, the third method will be described. A silicone resin in which a curing agent is added to PDMS (polydimethylsiloxane, for example, Sylgard 184 manufactured by Dow Corning) is prepared. The mold is pressed into the silicone resin of the transfer portion 12A of the protruding pattern 10A of the resin molding die 10. With the resin molding die 10 being pressed into the silicone resin, the silicone resin is heated and cured at 150 ° C. for 10 minutes. The resin molding die 10 is peeled from the cured silicone resin. A resin mold 42 having a concave pattern 42A constituted by a concave portion 44 that is the inverted shape of the transfer portion 12A of the protruding pattern 10A of the resin molding die 10 can be obtained.

  FIG. 7 is a process diagram showing the procedure of another method for producing a resin mold 42 using the resin molding die 10.

  As shown in FIG. 7A, a resin molding die 10 is prepared. The resin mold 10 has a protruding pattern 10A on the first surface 10B. The protruding portion 12 constituting the protruding pattern 10A has a non-transfer portion 12B and a transfer portion 12A from the first surface 10B side.

  FIGS. 7B and 7C show a process of repeatedly performing the press-curing and curing process, the peeling process, and the movement of the resin molding die 10 or the resin material 40. As shown in FIG. 7B, a resin material 50 is prepared. The transfer portion 12A of the protruding pattern 10A of the resin molding die 10 is embossed on the resin material 50. The resin material 50 is cured in a state where the transfer portion 12A of the protruding pattern 10A of the resin molding die 10 and the resin material 50 are in contact with each other. By curing the resin material 50, the inverted concave portion 54 of the transfer portion 12A is formed in the resin material 50.

  By peeling the resin molding die 10 from the resin material 50, the resin material 50 constituted by the inverted concave portion 54 of the transfer portion 12A is obtained.

  Next, the resin molding die 10 is moved to another position on the resin material 50. The transfer portion 12A of the resin molding die 10 is embossed on the resin material 50, the resin material 50 is cured, and the resin molding die 10 is peeled off from the resin material 50, so that a concave shape is formed at another position of the resin material 50. A pattern 52A is formed. In the present embodiment, the resin molding die 10 is moved, but the resin material 50 may be moved. Since the physical properties (appearance shape) of the transfer portion 12A and the non-transfer portion 12B are different, the boundary between the transfer portion 12A and the non-transfer portion 12B can be easily recognized. Accordingly, when the resin molding die 10 is pressed onto the resin material 50, the position adjustment in which only the transfer portion 12A is brought into contact with the resin material 50 is facilitated.

  As shown in FIG. 7C, the resin mold 52 having a plurality of concave patterns 52A can be obtained by repeatedly executing the stamping and curing step, the peeling step, and the movement of the resin molding die 10. According to the method for producing the resin mold 52 shown in FIG. 7, the large resin mold 52 can be produced from the small resin molding die 10.

  According to the resin molding die 10 of the present embodiment, it is easy to process the protruding pattern 10A. In addition, although the microneedle array was illustrated as a molded article manufactured using the mold 10 for resin molding, it is not limited to this, As a biosensor, a polymer film, an optical / electronic material use as another medical use Examples thereof include a microlens array, a sensor, and an optical element.

  DESCRIPTION OF SYMBOLS 10 ... Mold for resin molding, 10A ... Projection pattern, 10B ... First surface, 12 ... Projection part, 12A ... Transfer part, 12B ... Non-transfer part, 20 ... Base material, 30 ... First cutting blade, 32 ... Second cutting blade, 40 ... resin material, 42 ... resin mold, 42A ... concave pattern, 44 ... concave, 50 ... resin material, 52 ... resin mold, 52A ... concave pattern, 54 ... concave

Claims (11)

A mold for resin molding having a projecting pattern on a first surface, wherein the projecting portion constituting the projecting pattern has a non-transfer portion and a transfer portion from the first surface side, and A step of preparing a resin molding die having different physical properties between the transfer portion and the transfer portion ;
An embossing curing step of embossing only the transfer portion of the protruding pattern of the resin molding die onto the resin material and curing the resin material;
A peeling step of peeling the resin molding die from the cured resin material to obtain the resin material having a concave pattern of the inverted shape of the transfer portion;
A method for producing a resin mold having: The method for producing a resin mold according to claim 1, wherein the physical property is surface roughness, and the surface roughness of the transfer portion is smaller than the surface roughness of the non-transfer portion. The physical property is surface roughness, the surface roughness of the transfer portion is in the range of 0.01 μm to 1.0 μm, and the surface roughness of the non-transfer portion is in the range of 0.1 μm to 10 μm. The method for producing a resin mold according to claim 2. 4. The resin mold according to claim 1, wherein the physical property is an appearance shape, the non-transfer portion is a frustum shape or a column shape, and the transfer portion is a cone shape. 5. Manufacturing method . The method for producing a resin mold according to claim 1, wherein the transfer portion has a multistage cone shape. The method for producing a resin mold according to any one of claims 1 to 5, wherein a height of the transfer portion is 100 µm or more and 2000 µm or less. The method for producing a resin mold according to claim 1, wherein a tip diameter of the transfer portion is 50 μm or less. 8. The method for producing a resin mold according to claim 1, wherein the transfer portion has a ratio of a height to a diameter of a bottom surface of 1 to 5. The method for producing a resin mold according to any one of claims 1 to 7, wherein an interval between the adjacent protrusions is 300 µm or more and 2000 µm or less. The method for producing a resin mold according to claim 1, wherein a height of the non-transfer portion is 10 μm or more. The method for producing a resin mold according to any one of claims 1 to 10 , wherein the stamping and curing step, the peeling step, and the movement of the resin molding die or the resin material are repeatedly executed.

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