JP6574916B1 - Soldering iron used for sheet metal repair - Google Patents

Soldering iron used for sheet metal repair Download PDF

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JP6574916B1
JP6574916B1 JP2019085463A JP2019085463A JP6574916B1 JP 6574916 B1 JP6574916 B1 JP 6574916B1 JP 2019085463 A JP2019085463 A JP 2019085463A JP 2019085463 A JP2019085463 A JP 2019085463A JP 6574916 B1 JP6574916 B1 JP 6574916B1
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chip plate
sheet metal
recess
solder material
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山本 浩司
浩司 山本
山本 圭吾
圭吾 山本
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株式会社山本自動車
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Abstract

【課題】 自動車のボディパネル等を構成する板金に生じた凹み部を修復する板金修理に用いるはんだごてを提供する。【解決手段】 ヒータ部材2と、把持部材3と、こて先部材4とから構成され、前記こて先部材4のこて先6は、先端面8aに向かって厚みが漸減する扁平チップ板8を備え、前記チップ板8の先端面8aに、チップ板幅方向に沿ってスリット8bが、板金11の凹み部11a表面上の溶融はんだ材22の毛細管現象による内部への吸引、貯留可能に且つ前記内部に貯留された溶融はんだ材22の前記凹み部11a表面への流動供給可能に2個所以上に、チップ板面と直交する方向に穿設されると共に、それによって前記チップ板8の先端面8aに、チップ板幅方向に沿って矩形の歯状体8cが、溶融はんだ材で覆われた中でのチップ板幅方向の往復移動による前記凹み部11a表面上の酸化被膜の擦取、排出可能に3個以上にわたって配列形成されている。【選択図】 図1PROBLEM TO BE SOLVED: To provide a soldering iron used for sheet metal repair for repairing a dent portion generated in a sheet metal constituting an automobile body panel or the like. SOLUTION: A flat chip plate comprising a heater member 2, a gripping member 3, and a tip member 4, and the tip 6 of the tip member 4 gradually decreases in thickness toward a tip surface 8a. 8, and a slit 8 b along the chip plate width direction on the tip surface 8 a of the chip plate 8 is capable of sucking and storing the molten solder material 22 on the surface of the recessed portion 11 a of the sheet metal 11 by capillary action. In addition, the molten solder material 22 stored inside is drilled in two or more locations in a direction perpendicular to the chip plate surface so that the molten solder material 22 can be supplied to the surface of the recess 11a. Scraping of the oxide film on the surface of the recess 11a by reciprocating movement in the chip plate width direction while the rectangular tooth-like body 8c is covered with the molten solder material on the surface 8a along the chip plate width direction; 3 or more arrays to allow discharge It is made. [Selection] Figure 1

Description

本発明は、自動車のボディパネル等を構成する鉄、鋼又はアルミ合金等からなる板金に損傷等により生じた凹み部を修復するための板金修理に用いるはんだごてに関する。   The present invention relates to a soldering iron used for sheet metal repair for repairing a dent portion caused by damage or the like on a sheet metal made of iron, steel, aluminum alloy or the like constituting a body panel of an automobile.

鋼板等の凹み部の板金修理に際して、特開63−71345号公報(特許文献1)及び特開2006−130559号公報(特許文献2)には、前記凹み部表面に引き出し部材をはんだ付けにより接合すると共に前記引き出し部材を外方向に引っ張ることにより、前記凹み部を引き出して修復するようにした板金修理方法が開示されている。   In repairing a sheet metal of a recessed portion such as a steel plate, Japanese Patent Application Laid-Open No. 63-71345 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2006-130559 (Patent Document 2) join a drawer member to the surface of the recessed portion by soldering. In addition, a sheet metal repair method is disclosed in which the recess is pulled out and repaired by pulling the drawer member outward.

前記はんだ付けによる引き出し部材の接合工程を含む従来の板金修理方法は、1000℃以上の高温加熱を伴うスポット溶接等の溶接により引き出し部材を前記凹み部表面に接合する旧来の方法に比べて処理温度が400℃以下と格段に低く、従って前記凹み部が高温に曝されることがないため、該凹み部の構成材料の材質劣化や強度の低下が抑制され、また前記凹み部に断熱材その他の可燃材が隣接配置されていても、それらの着火の危険性が小さい等の利点を有している。   The conventional sheet metal repair method including the step of joining the drawer member by soldering is a processing temperature compared to the conventional method of joining the drawer member to the surface of the recess by welding such as spot welding with high temperature heating of 1000 ° C. or higher. Is not much lower than 400 ° C., and therefore, the dent is not exposed to high temperature, so that deterioration of the material and strength of the constituent material of the dent are suppressed. Even if the combustible materials are arranged adjacent to each other, there are advantages such as a low risk of ignition.

本発明者等は、自動車のボディパネル等にその軽量化、引っ張り強さの強度化等のために昨今多用されるようになった素材で、概して400℃以上の加熱で材質の劣化や強度の低下を生じる難点を有する高張力鋼板からなる前記凹み部の修理にも、前記はんだ付けによる引き出し部材の接合工程を含む板金修理方法を適用し得ることを既に確認している。   The inventors of the present invention are materials that have recently been used extensively for automobile body panels and the like for weight reduction, tensile strength enhancement, and the like. It has already been confirmed that a sheet metal repairing method including a joining step of the drawer member by soldering can be applied to repair of the dent portion made of a high-strength steel plate having a difficulty in causing a decrease.

一方、自動車のボディパネル等に、高い強度を保持しつつ更なる軽量化、低燃費化を目指して、比強度及び成形性等に優れた6000系、7000系等のアルミ合金が使用され始めている。   On the other hand, aluminum alloys such as 6000 series and 7000 series, which are excellent in specific strength and formability, have begun to be used for automobile body panels and the like in order to further reduce weight and reduce fuel consumption while maintaining high strength. .

しかしながら、前記アルミ合金板からなるボディパネルの凹み部の板金修理に際しては、はんだ付けによる引き出し部材の接合工程を含む従来の板金修理方法を適用することが極めて困難であった。   However, when repairing the sheet metal of the recessed portion of the body panel made of the aluminum alloy plate, it has been extremely difficult to apply a conventional sheet metal repair method including a joining process of the drawer member by soldering.

即ち、前記アルミ合金板からなるボディパネルの凹み部表面に引き出し部材をはんだ付けにより接合すべく、先ず前記凹み部表面に、研磨等による酸化被膜の除去後にはんだメッキを施そうとしても、アルミニウムの酸素との特異な化学親和性の高さから、前記凹み部表面から酸化被膜を研磨除去すると同時に前記表面に新たな酸化被膜が形成されるので、はんだメッキのために供給された溶融はんだ材は、前記のように新たに形成された酸化被膜に遮断されて、前記凹み部表面における未酸化状態のアルミ合金と安定した金属間化合物や固溶体を形成することができないのである。   That is, in order to join the lead member to the surface of the recessed portion of the body panel made of the aluminum alloy plate by soldering, even if solder plating is first performed on the surface of the recessed portion after removing the oxide film by polishing or the like, Since the oxide film is polished and removed from the surface of the recess due to its high chemical affinity with oxygen, a new oxide film is formed on the surface at the same time, so the molten solder material supplied for solder plating is It is blocked by the newly formed oxide film as described above, and a stable intermetallic compound or solid solution cannot be formed with the unoxidized aluminum alloy on the surface of the recess.

特開昭63−71345号公報JP-A-63-71345 特開2006−130559号公報JP 2006-130559 A 特開2002−239719号公報JP 2002-239719 A 特開2005−161336号公報JP 2005-161336 A

本発明の課題は、前記先行技術の問題点に鑑み、自動車のボディパネル等を構成する板金、特にアルミ合金からなる板金に生じた凹み部を修復するに際して、前記凹み部表面への引き出し部材のはんだ付けによる接合を容易に可能にするはんだごてを提供することにある。   In view of the problems of the prior art, an object of the present invention is to restore a dent portion generated in a sheet metal constituting an automobile body panel or the like, particularly a sheet metal made of an aluminum alloy, to the surface of the dent portion. An object of the present invention is to provide a soldering iron that can be easily joined by soldering.

本発明に係るはんだごては、請求項1に記載のように、板金修理における凹み部表面への引き出し部材のはんだ付けによる接合のために、前記凹み部表面にはんだメッキを施すはんだごてであって、ヒータ部材と、ヒータ部材に断熱的に連結された把持部材と、ヒータ部材に伝熱的に連結されると共にこて先を前方に突出させたこて先部材とからなり、前記こて先が、先端面に向かって厚みが漸減する扁平チップ板を備え、前記チップ板の先端面に、チップ板幅方向に沿ってスリットが、はんだメッキのために前記凹み部表面に供給された溶融はんだ材の毛細管現象による内部への吸引、貯留可能に且つ前記内部に貯留された溶融はんだ材の前記凹み部表面への流動供給可能に2個所以上にチップ板面と交差する方向に穿設されると共に、それによって前記チップ板の先端面に、チップ板幅方向に沿って歯状体が、溶融はんだ材で覆われた中でのチップ板幅方向の往復移動による前記凹み部表面上の酸化被膜の擦取、排出可能に3個以上に形成されたことを特徴としている。   As described in claim 1, the soldering iron according to the present invention is a soldering iron that applies solder plating to the surface of the recess for soldering joining of the drawer member to the surface of the recess in sheet metal repair. A heater member, a gripping member that is adiabatically connected to the heater member, and a tip member that is thermally connected to the heater member and has a tip protruding forward. The tip is provided with a flat chip plate whose thickness gradually decreases toward the tip surface, and a slit is provided on the tip surface of the chip plate along the chip plate width direction so as to be supplied to the surface of the recess for solder plating. Perforated in the direction intersecting the chip plate surface at two or more locations so that the solder material can be sucked into and stored by capillary action and can be supplied to the surface of the recessed portion of the molten solder material stored therein. And By scraping the oxide film on the surface of the recess by reciprocating movement in the chip plate width direction while the tooth-like body is covered with the molten solder material on the tip surface of the chip plate along the chip plate width direction. It is characterized in that it is formed into three or more so that it can be discharged.

前記こて先のチップ板は、請求項2に記載のように、前記ヒータ部材からの伝熱距離が調節可能であることが好ましい。   As for the tip plate of the tip, it is preferable that the heat transfer distance from the heater member is adjustable.

本発明に係る前記はんだごては、自動車のボディパネル等を構成する鉄、鋼又はアルミ合金等からなる板金に損傷等により生じた凹み部を修復するための板金修理に用いられる。前記板金修理方法は、板金のはんだメッキが施された凹み部表面に、はんだメッキが施された又は施されていない引き出し部材をはんだ付けにより接合すると共に前記引き出し部材を引っ張り具により外方向に引っ張ることにより、前記凹み部を引き出して修復するようにした板金修理方法であって、前記凹み部表面にはんだメッキを施すに際して前記構成のはんだごてを使用し、前記凹み部表面に、酸化被膜の除去を含む前処理の後に、はんだ材を前記こて先のチップ板で加熱、溶融させつつ供給し、前記溶融されたはんだ材を前記チップ板の各スリット内に毛細管現象で吸引、貯留させた状態の下に、前記チップ板の一連の歯状体を、溶融はんだ材で覆われた中でチップ板幅方向に往復移動させつつ前記凹み部表面に擦り付けて酸化被膜を擦取すると共に、前記酸化被膜が擦取された直後の前記凹み部表面に、酸素の遮断下に、従って新たな酸化被膜の形成の抑制下に、前記スリットから溶融はんだ材を流動供給させるようにしている。   The soldering iron according to the present invention is used for sheet metal repair for repairing a dent portion caused by damage or the like in a sheet metal made of iron, steel, aluminum alloy or the like constituting a body panel of an automobile. In the sheet metal repairing method, a drawer member with or without solder plating is joined to the surface of the recessed portion of the sheet metal with solder plating by soldering, and the drawer member is pulled outward by a pulling tool. A method of repairing a sheet metal by pulling out and repairing the recessed portion, wherein a soldering iron having the above-described configuration is used when solder plating is performed on the surface of the recessed portion, and an oxide film is formed on the surface of the recessed portion. After pretreatment including removal, the solder material was supplied while being heated and melted by the tip chip plate, and the melted solder material was sucked and stored in each slit of the chip plate by capillary action. Under the condition, a series of teeth on the chip plate are rubbed against the surface of the dent portion while reciprocating in the chip plate width direction while being covered with the molten solder material. In addition to scraping, the molten solder material is flow-supplied from the slit to the surface of the recess immediately after the oxide film is scraped, while blocking oxygen and thus suppressing the formation of a new oxide film. I have to.

前記板金修理方法におけるはんだメッキ工程では、はんだごてにおける前記チップ板の歯状体を、溶融はんだ材で覆われた中でチップ板幅方向に往復移動させつつ前記凹み部表面に擦り付ける操作を繰り返すことにより、前記凹み部表面上の酸化被膜の擦取及び排出と、前記酸化被膜が擦取された直後の表面部分への前記スリットからの溶融はんだ材の流動供給が交互に繰り返され、それによって、前記凹み部表面のはんだメッキ面積が徐々に増大すると共に、最終的に、前記凹み部表面に、所要面積にわたって酸化被膜が完全に除去された状態で確実にはんだメッキが施された、前記引き出し部材とのはんだ付けのための接合面が得られる。   In the solder plating process of the sheet metal repair method, the operation of rubbing the chip-like teeth of the chip plate on the soldering iron against the surface of the indented portion while reciprocating in the chip plate width direction while being covered with the molten solder material is repeated. Thus, the scraping and discharging of the oxide film on the surface of the recess and the flow supply of the molten solder material from the slit to the surface portion immediately after the oxide film is scraped are alternately repeated, thereby In addition, the solder plating area on the surface of the recess gradually increases, and finally the solder plating is reliably applied to the surface of the recess with the oxide film completely removed over the required area. A joint surface for soldering with the member is obtained.

前記はんだごてでは、先端面に向かって厚みが漸減するチップ板の先端面に、チップ板幅方向に沿って2個所以上のスリットが穿設され、それによって前記チップ板の先端面に、歯状体がチップ板幅方向に3個以上に形成され、それらの構成によって、前記凹み部表面上の酸化被膜を、厚みが漸減するチップ板の先端面による強い押圧力の下における3個以上の一連の歯状体による擦り付けにより、効果的に擦り取ることができる。   In the soldering iron, two or more slits are drilled along the chip plate width direction on the tip surface of the chip plate, the thickness of which gradually decreases toward the tip surface. The shape is formed into three or more in the chip plate width direction, and by these structures, the oxide film on the surface of the recess is formed into three or more under strong pressing force by the tip surface of the chip plate whose thickness is gradually reduced. By rubbing with a series of teeth, it can be effectively scraped off.

また、前記はんだごてでは、前記のように、前記チップ板の3個以上の歯状体により凹み部表面上の酸化被膜の擦り取りが前記のように効果的に行われると共に、それら歯状体の各間に存する各スリットにより、前記歯状体による酸化被膜の擦取の直後に、前記酸化被膜の擦取後の凹み部表面に対して、前記スリットに貯留された溶融はんだ材の供給が円滑に行われる。   Further, in the soldering iron, as described above, the oxide film on the surface of the recessed portion is effectively scraped off by the three or more teeth of the chip plate as described above, and these teeth Supply of the molten solder material stored in the slit to the surface of the recess after scraping of the oxide film immediately after scraping of the oxide film by the tooth-like body by each slit existing between the bodies Is done smoothly.

なお、こて先部材におけるチップ板の先端面へのスリットの穿設に関しては、特開2002−239719号公報(特許文献3)に、こて先部材の先端部に種々の態様でスリットを設け、はんだ付け後の余剰な溶融はんだ材を毛細管現象で前記スリット内に吸い上げて除去し、或いは前記スリット内に吸い上げられた溶融はんだ材を次のはんだ付けに使用するようにしたはんだごてが開示され、また特開2005−161336号公報(特許文献4)には、こて先部材の先端部にスリットを設け、前記スリット内に予め溶かし込み、溜めておいた溶融はんだ材をはんだ付けに使用するようにしたはんだごてが開示されている。   In addition, regarding the drilling of the slit on the tip surface of the tip plate in the tip member, Japanese Patent Laid-Open No. 2002-239719 (Patent Document 3) provides a slit in various manners at the tip portion of the tip member. Disclosed is a soldering iron in which excess molten solder material after soldering is sucked into the slit by capillary action, or the molten solder material sucked into the slit is used for the next soldering. In JP 2005-161336 A (Patent Document 4), a slit is provided at the tip of the tip member, and the molten solder material previously melted and stored in the slit is used for soldering. A soldering iron is disclosed.

しかしながら、前記従来技術のはんだごては、本発明に係るはんだごてにおけるこて先のチップ板のように前記板金の凹み部表面上の酸化被膜を効果的に擦取することが可能な一連の歯状体を構成せず、また前記こて先の先端部を仮に前記凹み部表面に擦り付けて往復移動させても、前記凹み部表面上の酸化被膜の擦取及び排出と、前記酸化被膜が擦取された直後の表面部分への前記スリットからの溶融はんだ材の流動供給が交互に繰り返されることはなく、従ってアルミ合金等からなる板金の前記凹み部表面に、酸化被膜が完全に除去された状態で確実にはんだメッキが施された、前記引き出し部材とのはんだ付けのための接合面は得られない。   However, the prior art soldering iron is a series capable of effectively scraping the oxide film on the surface of the recessed portion of the sheet metal like the tip plate of the tip in the soldering iron according to the present invention. Even if the tip of the tip is rubbed against the surface of the dent and reciprocated, the oxide film is scraped and discharged on the surface of the dent, and the oxide film. The flow of molten solder material from the slit to the surface portion immediately after scraping is not repeated alternately. Therefore, the oxide film is completely removed from the surface of the recess of the sheet metal made of aluminum alloy or the like. It is not possible to obtain a joint surface for soldering with the lead-out member, which is surely subjected to solder plating in this state.

請求項1に係る発明のはんだごてによれば、自動車のボディパネル等を構成する板金、特にアルミ合金からなる板金に生じた凹み部を修復するに際して、前記凹み部表面への引き出し部材のはんだ付けによる接合を容易に可能にする。   According to the soldering iron of the invention according to claim 1, when repairing a recess formed in a sheet metal constituting an automobile body panel or the like, in particular, a sheet metal made of an aluminum alloy, the solder of the lead member to the surface of the recess It enables easy joining by attaching.

請求項2に係る発明のはんだごてによれば、前記作用効果に加えて、前記凹み部の修理の対象となる板金の材質等に応じて、こて先のチップ板の温度を微調節することができる。   According to the soldering iron of the invention according to claim 2, in addition to the above-mentioned effects, the temperature of the tip chip plate is finely adjusted according to the material of the sheet metal to be repaired of the recess. be able to.

前記はんだごてを用いて、自動車のボディパネル等を構成する板金、特にアルミ合金からなる板金に生じた凹み部を修復するに際して、前記凹み部表面への引き出し部材のはんだ付けによる接合を容易に可能にするべく、前記凹み部表面に、所要面積にわたって、酸化被膜が完全に除去された状態で確実にはんだメッキが施された、前記引き出し部材とのはんだ付けのための接合面を得ることができる。   When using the soldering iron to repair a recess formed in a sheet metal constituting an automobile body panel or the like, particularly a sheet metal made of an aluminum alloy, it is easy to join the lead member to the surface of the recess by soldering. In order to make it possible to obtain a bonding surface for soldering to the lead-out member, which is reliably plated with solder on the surface of the recess over the required area with the oxide film completely removed. it can.

図1は、本発明の実施例に係るはんだごての要部側面図である。FIG. 1 is a side view of a main part of a soldering iron according to an embodiment of the present invention. 図2(A)、(B)及び(C)は、本発明の実施例に係るはんだごてにおけるこて先の各々正面図、側面図及び底面図である。2A, 2B, and 2C are a front view, a side view, and a bottom view, respectively, of the tip in the soldering iron according to the embodiment of the present invention. 図3は、本発明の実施例に係るはんだごてを用いた板金修理方法におけるはんだメッキ状況を模式的に示す説明図である。FIG. 3 is an explanatory view schematically showing a solder plating state in the sheet metal repair method using the soldering iron according to the embodiment of the present invention. 図4(A)及び(B)は、本発明に係るはんだごてを用いた板金修理方法における、板金のはんだメッキが施された凹み部表面への引き出し部材の接合及びそれに続く前記凹み部の引き出し完了時の各状態を示す断面図である。4 (A) and 4 (B) are diagrams illustrating a method of repairing a sheet metal using a soldering iron according to the present invention, joining a drawer member to the surface of a recessed portion on which a sheet metal is plated with solder, and subsequent steps of the recessed portion. It is sectional drawing which shows each state at the time of completion of drawing-out.

本発明の実施例に係るはんだごて1は、図1に示すように、ヒータ部材2と、ヒータ部材2に断熱的に連結された把持部材3と、ヒータ部材2に伝熱的に連結されたこて先部材4とから構成され、前記こて先部材4は、本体5に銅又は銅合金製等のこて先6が交換可能且つ軸方向に位置調節可能に止めネジ7で固定されてなり、前記こて先6の先端部を本体5から所要長さだけ前方に突出させている。   As shown in FIG. 1, a soldering iron 1 according to an embodiment of the present invention is connected to a heater member 2, a gripping member 3 adiabatically connected to the heater member 2, and a heat transfer to the heater member 2. The tip member 4 is fixed to the main body 5 with a set screw 7 such that a tip 6 made of copper or copper alloy can be replaced and adjusted in the axial direction. Thus, the tip of the tip 6 protrudes forward from the main body 5 by a required length.

なお、本発明に係るはんだごて1は、前記実施例に記載される形態に限定されるものではない。   In addition, the soldering iron 1 which concerns on this invention is not limited to the form described in the said Example.

前記こて先6は、図2(A)〜(C)に示すように、先端部に扁平チップ板8を備え、該扁平チップ板8はその先端面8aに向かって厚みが漸減する形態を呈し、前記チップ板8の先端面8aに、チップ板幅方向に沿ってスリット8bが2個所に、チップ板面と直交する方向に穿設されると共に、それによって前記チップ板8の先端面8aに、チップ板幅方向に沿って矩形の歯状体8cが3個にわたって配列形成されている。   As shown in FIGS. 2A to 2C, the tip 6 includes a flat tip plate 8 at the tip, and the flat tip plate 8 has a form in which the thickness gradually decreases toward the tip surface 8a. Present, the front end surface 8a of the chip plate 8 is provided with two slits 8b in the direction perpendicular to the chip plate surface along the width direction of the chip plate, and thereby the front end surface 8a of the chip plate 8 is formed. In addition, three rectangular teeth 8c are arrayed along the chip plate width direction.

なお、本発明に係るはんだごて1のこて先6は、前記実施例に記載される形態に限定されるものではなく、例えば前記スリット8bは2個所を越えて穿設されてもよく、従って前記歯状体8cが3個を越えて配列形成されもよい。さらに前記チップ板8の両側の側面は、平面のみならず曲面で構成されていてもよい。   The tip 6 of the soldering iron 1 according to the present invention is not limited to the form described in the above embodiment. For example, the slit 8b may be drilled beyond two locations. Therefore, more than three tooth-like bodies 8c may be arranged. Furthermore, the side surfaces on both sides of the chip plate 8 may be formed of curved surfaces as well as flat surfaces.

本発明の実施例に係るはんだごてを用いた板金修理方法は、図4(A)〜(B)に示すように、アルミ合金等からなる板金11のはんだメッキ21が施された凹み部11a表面に、はんだメッキ21が施された又は施されていない引き出し部材31をはんだ付けにより接合すると共に前記引き出し部材31を引っ張り具32により外方向に引っ張ることにより、前記凹み部11aを引き出して修復するようにした板金修理方法であって、既述のようなはんだごて1を使用して、以下のように前記凹み部11a表面にはんだメッキ21が施される。   As shown in FIGS. 4A to 4B, the sheet metal repair method using the soldering iron according to the embodiment of the present invention has a recess 11a provided with a solder plating 21 of a sheet metal 11 made of an aluminum alloy or the like. The pull-out member 31 with or without the solder plating 21 is joined to the surface by soldering, and the pull-out member 31 is pulled outward by the pulling tool 32 to pull out the dent 11a and repair it. In the above-described sheet metal repair method, solder plating 21 is applied to the surface of the recess 11a as described below using the soldering iron 1 as described above.

即ち、前記凹み部11a表面に、酸化被膜の除去を含む前処理の後に、図3に模式的に示すように、はんだ材を前記こて先6のチップ板8で加熱、溶融させつつ供給し、前記溶融はんだ材22を前記チップ板8の各スリット8b内に毛細管現象で吸引、貯留させた状態の下に、前記チップ板8の一連の歯状体8cを、溶融はんだ材22で覆われた中でチップ板幅方向に往復移動させつつ前記凹み部11a表面に擦り付けて酸化被膜を擦取すると共に、前記酸化被膜が擦取された直後の前記凹み部11a表面に、酸素の遮断下に、従って新たな酸化被膜の形成の抑制下に、前記スリット8bから溶融はんだ材22を流動供給させるようにしている。なお、前記処理工程を通じて、前記凹み部11aの加熱温度は、好ましくは400℃以下に保持される。   That is, after pretreatment including removal of the oxide film on the surface of the recess 11a, a solder material is supplied while being heated and melted by the chip plate 8 of the tip 6 as shown schematically in FIG. The series of teeth 8c of the chip plate 8 are covered with the molten solder material 22 in a state where the molten solder material 22 is sucked and stored in each slit 8b of the chip plate 8 by capillary action. While scrubbing against the surface of the recess 11a while reciprocating in the chip plate width direction, the oxide film is scraped off, and the surface of the recess 11a immediately after the oxide film is scraped is subjected to oxygen blocking. Therefore, the molten solder material 22 is fluidly supplied from the slit 8b while suppressing the formation of a new oxide film. In addition, through the said process process, the heating temperature of the said recessed part 11a is preferably hold | maintained at 400 degrees C or less.

前記チップ板8の一連の歯状体8c自体の温度は、前記凹み部の修理の対象となる板金の材質等に応じて、例えばチップ板8の突出長さ、スリット8bの深さ、ヒータ部材2の出力等の選択や調節により適度に調整される。前記歯状体8cの温度の実測によれば、中央側の歯状体がその両側の歯状体よりも若干高温を呈する。   The temperature of the series of teeth 8c itself of the chip plate 8 depends on, for example, the material of the sheet metal to be repaired of the recess, for example, the protruding length of the chip plate 8, the depth of the slit 8b, the heater member It is adjusted appropriately by selecting and adjusting the output of No. 2. According to the actual measurement of the temperature of the tooth-like body 8c, the tooth-like body on the center side exhibits a slightly higher temperature than the tooth-like bodies on both sides thereof.

本発明は、自動車のボディパネルを構成する特にアルミ合金からなる板金に損傷等により生じた凹み部を、該凹み部の構成材料の材質劣化や強度の低下、及び該凹み部に隣接配置された断熱材その他の可燃材の着火等の発生なしに修復するための板金修理に適用できる。   According to the present invention, a dent generated due to damage or the like in a sheet metal made of an aluminum alloy, which constitutes a body panel of an automobile, is disposed adjacent to the dent and the material deterioration or the strength of the constituent material of the dent is reduced. It can be applied to sheet metal repair for repairing without the occurrence of ignition of heat insulating materials and other combustible materials.

1 はんだごて
2 ヒータ部材
3 把持部材
4 こて先部材
5 本体
6 こて先
7 止めネジ
8 チップ板
8a 先端面
8b スリット
8c 歯状体
11 板金
11a 凹み部
21 はんだメッキ
22 溶融はんだ材
31 引き出し部材
32 引っ張り具
DESCRIPTION OF SYMBOLS 1 Soldering iron 2 Heater member 3 Holding member 4 Iron tip member 5 Main body 6 Iron tip 7 Set screw 8 Chip board 8a Tip surface 8b Slit 8c Tooth body 11 Sheet metal 11a Recessed part 21 Solder plating 22 Molten solder material 31 Drawer Member 32 Tensioner

Claims (2)

板金修理における凹み部表面への引き出し部材のはんだ付けによる接合のために、前記凹み部表面にはんだメッキを施すはんだごてであって、ヒータ部材と、ヒータ部材に断熱的に連結された把持部材と、ヒータ部材に伝熱的に連結されると共にこて先を前方に突出させたこて先部材とからなり、前記こて先が、先端面に向かって厚みが漸減する扁平チップ板を備え、前記チップ板の先端面に、チップ板幅方向に沿ってスリットが、はんだメッキのために前記凹み部表面に供給された溶融はんだ材の毛細管現象による内部への吸引、貯留可能に且つ前記内部に貯留された溶融はんだ材の前記凹み部表面への流動供給可能に2個所以上にチップ板面と交差する方向に穿設されると共に、それによって前記チップ板の先端面に、チップ板幅方向に沿って歯状体が、溶融はんだ材で覆われた中でのチップ板幅方向の往復移動による前記凹み部表面上の酸化被膜の擦取、排出可能に3個以上に形成されたことを特徴とするはんだごて。 A soldering iron that applies solder plating to the surface of the recess for soldering joining of the drawer member to the surface of the recess in sheet metal repair, and includes a heater member and a gripping member that is adiabatically connected to the heater member And a tip member that is connected to the heater member in a heat transfer manner and projects the tip forward, and the tip includes a flat tip plate whose thickness gradually decreases toward the tip surface, A slit is formed in the tip surface of the chip plate along the width direction of the chip plate so that the molten solder material supplied to the surface of the recess for solder plating can be sucked into and stored in the inside by capillary action. The stored molten solder material is drilled in a direction intersecting the chip plate surface at two or more locations so as to be able to supply the flow of the molten solder material to the surface of the dent, and thereby, on the tip surface of the chip plate in the chip plate width direction. The tooth-like body is formed in three or more so as to be able to scrape and discharge the oxide film on the surface of the recess by reciprocating in the chip plate width direction while being covered with the molten solder material. A soldering iron. 前記こて先のチップ板は、前記ヒータ部材からの伝熱距離が調節可能である請求項1に記載のはんだごて。 2. The soldering iron according to claim 1, wherein a heat transfer distance from the heater member is adjustable in the tip plate of the tip. 3.
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